U.S. patent application number 15/251374 was filed with the patent office on 2018-03-01 for three-dimensional memory device with angled word lines and method of making thereof.
The applicant listed for this patent is SANDISK TECHNOLOGIES LLC. Invention is credited to Shogo MADA, Akira TAKAHASHI, Motoki UMEYAMA.
Application Number | 20180061850 15/251374 |
Document ID | / |
Family ID | 61225979 |
Filed Date | 2018-03-01 |
United States Patent
Application |
20180061850 |
Kind Code |
A1 |
MADA; Shogo ; et
al. |
March 1, 2018 |
THREE-DIMENSIONAL MEMORY DEVICE WITH ANGLED WORD LINES AND METHOD
OF MAKING THEREOF
Abstract
A mesa structure is formed over peripheral devices on a
substrate. An alternating stack of insulating layers and spacer
material layers is formed over the substrate and the mesa
structure. A region of the alternating stack overlying the mesa
structure is removed to provide a region in which the layers in the
alternating stack extend along a non-horizontal direction that is
parallel to the dielectric sidewall of the mesa structure. Memory
stack structures and backside contact via structures are formed
through another region of the alternating stack that includes
horizontally-extending portions of the layers within the
alternating stack. The spacer material layers are provided as, or
are replaced with, electrically conductive layers. Top surfaces of
portions of the electrically conductive layers that extend parallel
to the dielectric sidewall of the mesa structure can be contacted
by word line contact via structures.
Inventors: |
MADA; Shogo; (Yokkaichi,
JP) ; TAKAHASHI; Akira; (Yokkaichi, JP) ;
UMEYAMA; Motoki; (Yokkaichi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SANDISK TECHNOLOGIES LLC |
PLANO |
TX |
US |
|
|
Family ID: |
61225979 |
Appl. No.: |
15/251374 |
Filed: |
August 30, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/11582 20130101;
H01L 27/11573 20130101; H01L 27/1157 20130101 |
International
Class: |
H01L 27/115 20060101
H01L027/115; H01L 23/535 20060101 H01L023/535 |
Claims
1. A three-dimensional memory device comprising: a mesa structure
located over a substrate and having a top surface and at least one
dielectric sidewall; an alternating stack of insulating layers and
electrically conductive layers located over the substrate and on
the at least one dielectric sidewall of the mesa structure, wherein
each of the electrically conductive layers comprises a respective
continuously-extending conductive material portion of a homogeneous
composition that includes a respective horizontal sub-portion that
extends parallel to a top surface of the substrate and a respective
non-horizontal sub-portion that extends parallel to the at least
one dielectric sidewall of the mesa structure; memory stack
structures extending through a region of the alternating stack that
includes the horizontal sub-portions of the electrically conductive
layers, wherein each of the memory stack structures comprises a
memory film and a vertical semiconductor channel; word line contact
via structures that contact top surfaces of non-horizontal
sub-portions of the electrically conductive layers and embedded in
a contact level dielectric layer overlying the alternating stack;
and support pillar structures extending through a first region of
the alternating stack that includes the non-horizontal sub-portions
of the electrically conductive lavers and laterally separating
vertical sub-portions of at least one of the electrically
conductive layers, wherein the mesa structure comprises a
dielectric mesa structure.
2. (canceled)
3. The three-dimensional memory device of claim 1, wherein: each of
the continuously-extending conductive material portions is free of
any physical interface therein; and a top surface of the dielectric
mesa structure and a top surface of a first region of the
alternating stack that includes the non-horizontal sub-portions of
the electrically conductive layers are located within a first
horizontal plane that is parallel to the top surface of the
substrate.
4. The three-dimensional memory device of claim 3, wherein a
topmost surface of a second region of the alternating stack that
includes the horizontal sub-portions of the electrically conductive
layers is located within a second horizontal plane that is located
below the first horizontal plane.
5. The three-dimensional memory device of claim 4, further
comprising: a dielectric cap layer overlying the second region of
the alternating stack; and drain contact via structures extending
through the dielectric cap layer, overlying the memory stack
structures, and having a bottom top surface located within the
first horizontal plane.
6. The three-dimensional memory device of claim 1, wherein each
electrically conductive layer has a respective uniform thickness
throughout a respective horizontal sub-portion and a region of a
respective non-horizontal sub-portion.
7. The three-dimensional memory device of claim 1, further
comprising: a semiconductor device located on the substrate; a
device contact via structure extending through the dielectric mesa
structure and contacting the semiconductor device; and an
interconnect line structure contacting a top surface of the device
contact via structure and one of the word line contact via
structures.
8. (canceled)
9. The three-dimensional memory device of claim 1, wherein: the
electrically conductive layers comprise word lines; each of the
support pillar structures comprises a semiconductor fill structure
that is not electrically active, a dielectric fill structure, and
the memory film; the support pillar structures have substantially
rectangular horizontal cross-sectional areas having a length which
is greater than the width by at least two times.
10. The three-dimensional memory device of claim 1, wherein the at
least one dielectric sidewall of the dielectric mesa structure has
a taper angle in a range from 30 degrees to 75 degrees with respect
to a vertical direction that is perpendicular to the top surface of
the substrate.
11. The three-dimensional memory device of claim 1, wherein: the at
least one dielectric sidewall of the dielectric mesa structure
comprises multiple sets of sidewalls; each set of sidewalls forms a
respective lateral indentation having a respective indentation
width; and the electrically conductive layers have respective
elongated portions that protrude into respective lateral
indentations.
12. The three-dimensional memory device of claim 11, wherein one of
the electrically conductive layers has a top surface including a
first region located outside of the lateral indentations and having
a first width and a second region extending into one of the lateral
indentations and having a second width that is greater than the
first width.
13. The three-dimensional memory device of claim 1, wherein: the
three-dimensional memory device comprises a vertical NAND device
located over the substrate; the electrically conductive layers
comprise, or are electrically connected to, a respective word line
of the NAND device; the substrate comprises a silicon substrate;
the vertical NAND device comprises an array of monolithic
three-dimensional NAND strings over the silicon substrate; at least
one memory cell in a first device level of the array of monolithic
three-dimensional NAND strings is located over another memory cell
in a second device level of the array of monolithic
three-dimensional NAND strings; the silicon substrate contains an
integrated circuit comprising a driver circuit for the memory
device located thereon; the electrically conductive layers comprise
a plurality of control gate electrodes having a strip shape
extending substantially parallel to the top surface of the
substrate, the plurality of control gate electrodes comprise at
least a first control gate electrode located in a first device
level and a second control gate electrode located in a second
device level; and the array of monolithic three-dimensional NAND
strings comprises: a plurality of semiconductor channels, wherein
at least one end portion of each of the plurality of semiconductor
channels extends substantially perpendicular to a top surface of
the substrate, and a plurality of charge storage elements, each
charge storage element located adjacent to a respective one of the
plurality of semiconductor channels.
14-27. (canceled)
28. A three-dimensional memory device comprising: a mesa structure
located over a substrate and having a top surface and at least one
dielectric sidewall; an alternating stack of insulating layers and
electrically conductive layers located over the substrate and on
the at least one dielectric sidewall of the mesa structure, wherein
each of the electrically conductive layers comprises a respective
continuously-extending conductive material portion of a homogeneous
composition that includes a respective horizontal sub-portion that
extends parallel to a top surface of the substrate and a respective
non-horizontal sub-portion that extends parallel to the at least
one dielectric sidewall of the mesa structure; memory stack
structures extending through a region of the alternating stack that
includes the horizontal sub-portions of the electrically conductive
layers, wherein each of the memory stack structures comprises a
memory film and a vertical semiconductor channel; and word line
contact via structures that contact top surfaces of non-horizontal
sub-portions of the electrically conductive layers and embedded in
a contact level dielectric layer overlying the alternating stack,
wherein: the mesa structure comprises a dielectric mesa structure;
the at least one dielectric sidewall of the dielectric mesa
structure comprises multiple sets of sidewalls; each set of
sidewalls forms a respective lateral indentation having a
respective indentation width; and the electrically conductive
layers have respective elongated portions that protrude into
respective lateral indentations.
29. The three-dimensional memory device of claim 28, wherein: each
of the continuously-extending conductive material portions is free
of any physical interface therein; and a top surface of the
dielectric mesa structure and a top surface of a first region of
the alternating stack that includes the non-horizontal sub-portions
of the electrically conductive layers are located within a first
horizontal plane that is parallel to the top surface of the
substrate.
30. The three-dimensional memory device of claim 29, wherein a
topmost surface of a second region of the alternating stack that
includes the horizontal sub-portions of the electrically conductive
layers is located within a second horizontal plane that is located
below the first horizontal plane.
31. The three-dimensional memory device of claim 30, further
comprising: a dielectric cap layer overlying the second region of
the alternating stack; and drain contact via structures extending
through the dielectric cap layer, overlying the memory stack
structures, and having a top surface located within the first
horizontal plane.
32. The three-dimensional memory device of claim 28, wherein each
electrically conductive layer has a respective uniform thickness
throughout a respective horizontal sub-portion and a region of a
respective non-horizontal sub-portion.
33. The three-dimensional memory device of claim 28, further
comprising: a semiconductor device located on the substrate; a
device contact via structure extending through the dielectric mesa
structure and contacting the semiconductor device; and an
interconnect line structure contacting a top surface of the device
contact via structure and one of the word line contact via
structures.
34. The three-dimensional memory device of claim 28, further
comprising support pillar structures extending through a first
region of the alternating stack that includes the non-horizontal
sub-portions of the electrically conductive layers and laterally
separating vertical sub-portions of at least one of the
electrically conductive layers.
35. The three-dimensional memory device of claim 34, wherein: the
electrically conductive layers comprise word lines; each of the
support pillar structures comprises a semiconductor fill structure
that is not electrically active, a dielectric fill structure, and
the memory film; the support pillar structures have substantially
rectangular horizontal cross-sectional areas having a length which
is greater than the width by at least two times.
36. The three-dimensional memory device of claim 28, wherein the at
least one dielectric sidewall of the dielectric mesa structure has
a taper angle in a range from 30 degrees to 75 degrees with respect
to a vertical direction that is perpendicular to the top surface of
the substrate.
37. The three-dimensional memory device of claim 28, wherein one of
the electrically conductive layers has a top surface including a
first region located outside of the lateral indentations and having
a first width and a second region extending into one of the lateral
indentations and having a second width that is greater than the
first width.
38. The three-dimensional memory device of claim 28, wherein: the
three-dimensional memory device comprises a vertical NAND device
located over the substrate; the electrically conductive layers
comprise, or are electrically connected to, a respective word line
of the NAND device; the substrate comprises a silicon substrate;
the vertical NAND device comprises an array of monolithic
three-dimensional NAND strings over the silicon substrate; at least
one memory cell in a first device level of the array of monolithic
three-dimensional NAND strings is located over another memory cell
in a second device level of the array of monolithic
three-dimensional NAND strings; the silicon substrate contains an
integrated circuit comprising a driver circuit for the memory
device located thereon; the electrically conductive layers comprise
a plurality of control gate electrodes having a strip shape
extending substantially parallel to the top surface of the
substrate, the plurality of control gate electrodes comprise at
least a first control gate electrode located in a first device
level and a second control gate electrode located in a second
device level; and the array of monolithic three-dimensional NAND
strings comprises: a plurality of semiconductor channels, wherein
at least one end portion of each of the plurality of semiconductor
channels extends substantially perpendicular to a top surface of
the substrate, and a plurality of charge storage elements, each
charge storage element located adjacent to a respective one of the
plurality of semiconductor channels.
Description
FIELD
[0001] The present disclosure relates generally to the field of
semiconductor devices, and particular to a three-dimensional memory
device employing angled word lines and methods of manufacturing the
same.
BACKGROUND
[0002] Three-dimensional vertical NAND strings having one bit per
cell are disclosed in an article by T. Endoh et al., titled "Novel
Ultra High Density Memory With A Stacked-Surrounding Gate
Transistor (S-SGT) Structured Cell", IEDM Proc. (2001) 33-36.
SUMMARY
[0003] According to an aspect of the present disclosure, a
three-dimensional memory device is provided, which comprises: a
mesa structure located over a substrate and having a top surface
and at least one dielectric sidewall; an alternating stack of
insulating layers and electrically conductive layers located over
the substrate and on the at least one dielectric sidewall of the
mesa structure, wherein each of the electrically conductive layers
comprises a respective continuously-extending conductive material
portion of a homogeneous composition that includes a respective
horizontal sub-portion that extends parallel to a top surface of
the substrate and a respective non-horizontal sub-portion that
extends parallel to the at least one dielectric sidewall of the
mesa structure; memory stack structures extending through a region
of the alternating stack that includes the horizontal sub-portions
of the electrically conductive layers, wherein each of the memory
stack structures comprises a memory film and a vertical
semiconductor channel; and word line contact via structures that
contact top surfaces of non-horizontal sub-portions of the
electrically conductive layers and embedded in a contact level
dielectric layer overlying the alternating stack.
[0004] According to another aspect of the present disclosure, a
method of forming a three-dimensional memory device is provided. A
mesa structure is formed over a substrate. The mesa structure has a
top surface and at least one dielectric sidewall. An alternating
stack of insulating layers and spacer material layers is formed
over a top surface of the substrate, the top surface of the mesa
structure, and the at least one dielectric sidewall of the mesa
structure. A peripheral portion of the alternating stack is removed
from above a horizontal plane including the top surface of the mesa
structure, while not removing an array portion of the alternating
stack underneath the horizontal plane. Memory stack structures are
formed through the array portion of the alternating stack. Each of
the memory stack structures comprises a memory film and a vertical
semiconductor channel, wherein the spacer material layers are
replaced with, or formed as, electrically conductive layers, and
top surfaces of the electrically conductive layers are physically
exposed at or below the horizontal plane. Word line contact via
structures are formed directly on the top surfaces of the
electrically conductive layers.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] FIG. 1 is a schematic vertical cross-sectional view of a
first exemplary structure after formation of at least one
peripheral device and a planarization dielectric layer according to
a first embodiment of the present disclosure.
[0006] FIG. 2 is a schematic vertical cross-sectional view of the
first exemplary structure after formation of a dielectric mesa
structure according to the first embodiment of the present
disclosure.
[0007] FIG. 3 is a schematic vertical cross-sectional view of the
first exemplary structure after formation of an alternating stack
of insulating layers and sacrificial material layers and a
planarization stopping layer according to the first embodiment of
the present disclosure.
[0008] FIG. 4A is a schematic vertical cross-sectional view of the
first exemplary structure after a planarization process according
to the first embodiment of the present disclosure.
[0009] FIG. 4B is a top-down view of the first exemplary structure
of FIG. 4A. The plane A-A' is the plane of the cross-section of
FIG. 4A.
[0010] FIG. 5A is a schematic vertical cross-sectional view of the
first exemplary structure after formation of memory openings and
support openings according to the first embodiment of the present
disclosure.
[0011] FIG. 5B is a top-down view of the first exemplary structure
of FIG. 5A. The plane A-A' is the plane of the cross-section of
FIG. 5A.
[0012] FIG. 5C is a schematic vertical cross-sectional view of the
first exemplary structure of FIG. 5B along the plane C-C'.
[0013] FIG. 6A is a schematic vertical cross-sectional view of the
first exemplary structure after formation of memory stack
structures and support pillar structures according to the first
embodiment of the present disclosure.
[0014] FIG. 6B is a top-down view of the first exemplary structure
of FIG. 6A. The plane A-A' is the plane of the cross-section of
FIG. 6A.
[0015] FIG. 7A is a schematic vertical cross-sectional view of an
alternative embodiment of the first exemplary structure after
formation of memory stack structures and support pillar structures
according to the first embodiment of the present disclosure.
[0016] FIG. 7B is a top-down view of the alternative embodiment of
the first exemplary structure of FIG. 7A. The plane A-A' is the
plane of the cross-section of FIG. 7A.
[0017] FIG. 8A is a schematic vertical cross-sectional view of the
first exemplary structure after formation of backside trenches
according to the first embodiment of the present disclosure.
[0018] FIG. 8B is a top-down view of the first exemplary structure
of FIG. 8A. The plane A-A' is the plane of the cross-section of
FIG. 8A.
[0019] FIG. 9 is a schematic vertical cross-sectional view of the
first exemplary structure after formation of backside recesses
according to the first embodiment of the present disclosure.
[0020] FIG. 10 is a schematic vertical cross-sectional view of the
first exemplary structure after deposition of at least one
conductive material in the backside recesses according to the first
embodiment of the present disclosure.
[0021] FIG. 11 is a schematic vertical cross-sectional view of the
first exemplary structure after removal of the at least one
conductive material from the backside trenches and from above the
dielectric cap layer according to the first embodiment of the
present disclosure.
[0022] FIG. 12A is a schematic vertical cross-sectional view of the
first exemplary structure after formation of backside contact via
structures according to the first embodiment of the present
disclosure.
[0023] FIG. 12B is a top-down view of the first exemplary structure
of FIG. 12A. The plane A-A' is the plane of the cross-section of
FIG. 12A.
[0024] FIG. 12C is a schematic vertical cross-sectional view of the
first exemplary structure of FIG. 12B along the plane C-C'.
[0025] FIG. 13A is a schematic vertical cross-sectional view of the
first exemplary structure after formation of various contact via
structures according to the first embodiment of the present
disclosure.
[0026] FIG. 13B is a top-down view of the first exemplary structure
of FIG. 13A. The plane A-A' is the plane of the cross-section of
FIG. 13A.
[0027] FIG. 14A is a schematic vertical cross-sectional view of the
first exemplary structure after formation of various interconnect
line structures according to the first embodiment of the present
disclosure.
[0028] FIG. 14B is a top-down view of the first exemplary structure
of FIG. 14A. The plane A-A' is the plane of the cross-section of
FIG. 14A.
[0029] FIG. 15 is a vertical cross-sectional view of a second
exemplary structure after formation of a tapered dielectric mesa
structure according to a second embodiment of the present
disclosure.
[0030] FIG. 16 is a schematic vertical cross-sectional view of the
second exemplary structure after formation of an alternating stack
of insulating layers and sacrificial material layers and a
planarization stopping layer according to the second embodiment of
the present disclosure.
[0031] FIG. 17 is a schematic vertical cross-sectional view of the
second exemplary structure after formation of various interconnect
line structures according to the second embodiment of the present
disclosure.
[0032] FIG. 18A is a vertical cross-sectional view of a third
exemplary structure after planarization of an alternating stack of
insulating layers and sacrificial material layers according to a
third embodiment of the present disclosure.
[0033] FIG. 18B is a top-down view of the third exemplary structure
of FIG. 18A.
[0034] FIG. 19A is a vertical cross-sectional view of the third
exemplary structure after formation of backside contact via
structures according to the third embodiment of the present
disclosure.
[0035] FIG. 19B is a top-down view of the third exemplary structure
of FIG. 19A.
[0036] FIG. 20A is a vertical cross-sectional view of the third
exemplary structure after formation of various contact via
structures according to the third embodiment of the present
disclosure.
[0037] FIG. 20B is a top-down view of the third exemplary structure
of FIG. 20A.
[0038] FIG. 21 is a top-down view of an alternate embodiment of the
third exemplary structure after formation of backside contact via
structures according to the third embodiment of the present
disclosure.
[0039] FIG. 22 is a vertical cross-sectional view of a fourth
exemplary structure after formation of a dielectric mesa structure
and an alternating stack of insulating layers and electrically
conductive layers according to a fourth embodiment of the present
disclosure.
[0040] FIG. 23 is a vertical cross-sectional view of the fourth
exemplary structure after formation of a backside contact via
structure according to the fourth embodiment of the present
disclosure.
[0041] FIG. 24 is a vertical cross-sectional view of the fourth
exemplary structure after formation of a select gate conductive
layer and an insulating layer according to the fourth embodiment of
the present disclosure.
[0042] FIG. 25 is a vertical cross-sectional view of the fourth
exemplary structure after formation of memory stack structures
according to the fourth embodiment of the present disclosure.
[0043] FIG. 26 is a vertical cross-sectional view of the fourth
exemplary structure after a planarization process according to the
fourth embodiment of the present disclosure.
[0044] FIG. 27 is a vertical cross-sectional view of the fourth
exemplary structure after formation of interconnect line structures
according to the fourth embodiment of the present disclosure.
[0045] FIG. 28 is a vertical cross-sectional view of an exemplary
structure incorporating features of the first, second, and third
embodiments of the present disclosure.
DETAILED DESCRIPTION
[0046] As discussed above, the present disclosure is directed to
three-dimensional memory devices including a vertical stack of
multilevel memory arrays and methods of making thereof, the various
aspects of which are described below. The embodiments of the
disclosure can be employed to form various structures including a
multilevel memory structure, non-limiting examples of which include
semiconductor devices such as three-dimensional monolithic memory
array devices comprising a plurality of NAND memory strings. The
drawings are not drawn to scale. Multiple instances of an element
may be duplicated where a single instance of the element is
illustrated, unless absence of duplication of elements is expressly
described or clearly indicated otherwise. Ordinals such as "first,"
"second," and "third" are employed merely to identify similar
elements, and different ordinals may be employed across the
specification and the claims of the instant disclosure. As used
herein, a first element located "on" a second element can be
located on the exterior side of a surface of the second element or
on the interior side of the second element. As used herein, a first
element is located "directly on" a second element if there exist a
physical contact between a surface of the first element and a
surface of the second element.
[0047] As used herein, a "layer" refers to a material portion
including a region having a thickness. A layer may extend over the
entirety of an underlying or overlying structure, or may have an
extent less than the extent of an underlying or overlying
structure. Further, a layer may be a region of a homogeneous or
inhomogeneous continuous structure that has a thickness less than
the thickness of the continuous structure. For example, a layer may
be located between any pair of horizontal planes between, or at, a
top surface and a bottom surface of the continuous structure. A
layer may extend horizontally, vertically, and/or along a tapered
surface. A substrate may be a layer, may include one or more layers
therein, or may have one or more layer thereupon, thereabove,
and/or therebelow.
[0048] A monolithic three-dimensional memory array is one in which
multiple memory levels are formed above a single substrate, such as
a semiconductor wafer, with no intervening substrates. The term
"monolithic" means that layers of each level of the array are
directly deposited on the layers of each underlying level of the
array. In contrast, two dimensional arrays may be formed separately
and then packaged together to form a non-monolithic memory device.
For example, non-monolithic stacked memories have been constructed
by forming memory levels on separate substrates and vertically
stacking the memory levels, as described in U.S. Pat. No. 5,915,167
titled "Three-dimensional Structure Memory." The substrates may be
thinned or removed from the memory levels before bonding, but as
the memory levels are initially formed over separate substrates,
such memories are not true monolithic three-dimensional memory
arrays. The various three-dimensional memory devices of the present
disclosure include a monolithic three-dimensional NAND string
memory device, and can be fabricated employing the various
embodiments described herein.
[0049] Referring to FIG. 1, an exemplary structure according to an
embodiment of the present disclosure is illustrated, which can be
employed, for example, to fabricate a device structure containing
vertical NAND memory devices. The exemplary structure includes a
substrate, which can be a semiconductor substrate (9, 10). The
substrate can include a substrate semiconductor layer 9. The
substrate semiconductor layer 9 maybe a semiconductor wafer or a
semiconductor material layer, and can include at least one
elemental semiconductor material (e.g., single crystal silicon
wafer or layer), at least one III-V compound semiconductor
material, at least one II-VI compound semiconductor material, at
least one organic semiconductor material, or other semiconductor
materials known in the art. The substrate can have a major surface
7, which can be, for example, a topmost surface of the substrate
semiconductor layer 9. The major surface 7 can be a semiconductor
surface. In one embodiment, the major surface 7 can be a single
crystalline semiconductor surface, such as a single crystalline
semiconductor surface. An optional doped semiconductor well 10 can
be formed by implanting electrical dopants into an upper portion of
the substrate semiconductor layer 9. In one embodiment, the doped
semiconductor well 10 can have a doping of the same conductivity
type (e.g., p-type) as the substrate semiconductor layer 9. In
another embodiment, the doped semiconductor well 10 can have a
doping of the opposite conductivity type than the substrate
semiconductor layer 9. For example, the substrate semiconductor
layer 9 can be n-doped and the doped semiconductor well 10 can be
p-doped, or vice versa. In one embodiment, the doped semiconductor
well 10 can be formed within a memory array region 100.
[0050] As used herein, a "semiconducting material" refers to a
material having electrical conductivity in the range from
1.0.times.10.sup.-6 S/cm to 1.0.times.10.sup.5 S/cm. As used
herein, a "semiconductor material" refers to a material having
electrical conductivity in the range from 1.0.times.10.sup.-6 S/cm
to 1.0.times.10.sup.5 S/cm in the absence of electrical dopants
therein, and is capable of producing a doped material having
electrical conductivity in a range from 1.0 S/cm to
1.0.times.10.sup.5 S/cm upon suitable doping with an electrical
dopant. As used herein, an "electrical dopant" refers to a p-type
dopant that adds a hole to a valance band within a band structure,
or an n-type dopant that adds an electron to a conduction band
within a band structure. As used herein, a "conductive material"
refers to a material having electrical conductivity greater than
1.0.times.10.sup.5 S/cm. As used herein, an "insulator material" or
a "dielectric material" refers to a material having electrical
conductivity less than 1.0.times.10.sup.-6 S/cm. As used herein, a
"heavily doped semiconductor material" refers to a semiconductor
material that is doped with electrical dopant at a sufficiently
high atomic concentration to become a conductive material, i.e., to
have electrical conductivity greater than 1.0.times.10.sup.5 S/cm.
A "doped semiconductor material" may be a heavily doped
semiconductor material, or may be a semiconductor material that
includes electrical dopants (i.e., p-type dopants and/or n-type
dopants) at a concentration that provides electrical conductivity
in the range from 1.0.times.10.sup.-6 S/cm to 1.0.times.10.sup.5
S/cm. An "intrinsic semiconductor material" refers to a
semiconductor material that is not doped with electrical dopants.
Thus, a semiconductor material may be semiconducting or conductive,
and may be an intrinsic semiconductor material or a doped
semiconductor material. A doped semiconductor material can be
semiconducting or conductive depending on the atomic concentration
of electrical dopants therein. As used herein, a "metallic
material" refers to a conductive material including at least one
metallic element therein. All measurements for electrical
conductivities are made at the standard condition.
[0051] At least one semiconductor device 700 for a peripheral
circuitry can be formed on a portion of the substrate semiconductor
layer 9. The at least one semiconductor device can include, for
example, field effect transistors. For example, at least one
shallow trench isolation structure 120 can be formed by etching
portions of the substrate semiconductor layer 9 and depositing a
dielectric material therein. A gate dielectric layer, at least one
gate conductor layer, and a gate cap dielectric layer can be formed
over the substrate semiconductor layer 9, and can be subsequently
patterned to form at least one gate structure (150, 152, 154, 158),
each of which can include a gate dielectric 150, a gate electrode
(152, 154), and a gate cap dielectric 158. The gate electrode (152,
154) may include a stack of a first gate electrode portion 152 and
a second gate electrode portion 154. At least one gate spacer 156
can be formed around the at least one gate structure (150, 152,
154, 158) by depositing and anisotropically etching a dielectric
liner. Active regions 130 can be formed in upper portions of the
substrate semiconductor layer 9, for example, by introducing
electrical dopants employing the at least one gate structure (150,
152, 154, 158) as masking structures. Additional masks may be
employed as needed. The active region 130 can include source
regions and drain regions of field effect transistors. A first
dielectric liner 161 and a second dielectric liner 162 can be
optionally formed. Each of the first and second dielectric liners
(161, 162) can comprise a silicon oxide layer, a silicon nitride
layer, and/or a dielectric metal oxide layer. As used herein,
silicon oxide includes silicon dioxide as well as
non-stoichiometric silicon oxides having more or less than two
oxygen atoms for each silicon atoms. Silicon dioxide is preferred.
In an illustrative example, the first dielectric liner 161 can be a
silicon oxide layer, and the second dielectric liner 162 can be a
silicon nitride layer. The least one semiconductor device for the
peripheral circuitry can contain a driver circuit for memory
devices to be subsequently formed, which can include at least one
NAND device.
[0052] The region (i.e., area) of the at least one semiconductor
device 700 is herein referred to as a peripheral device region 200.
The region in which a memory array is subsequently formed is herein
referred to as a memory array region 100. A contact region 300 for
subsequently forming stepped terraces of electrically conductive
layers can be provided between the memory array region 100 and the
peripheral device region 200.
[0053] A dielectric material can be deposited over the at least one
semiconductor device 700, and can be subsequently planarized to
form a planarization dielectric layer 270L. The planarization
dielectric layer 270L includes a dielectric material that is
self-planarizing, or is conducive to planarization. For example,
the dielectric material of the planarization dielectric layer 270L
can include a spin-on glass (SOG) that can be formed by spin
coating and provides a planar top surface upon curing.
Alternatively or additionally, the dielectric material of the
planarization dielectric layer 270L can include a doped silicate
glass such as borophosphosilicate glass or fluorosilicate glass, or
undoped silicate glass (e.g., silicon oxide deposited using a TEOS
source). In this case, the planarization dielectric layer 270L can
be planarized, for example, by chemical mechanical planarization
(CMP), to provide a planar to surface. The thickness of the
planarization dielectric layer 270L, as measured between the top
surface 7 of the substrate (9, 10) and the top surface of the
planarization dielectric layer 270L in the memory array region 100,
can be greater than the total thickness of an alternating stack of
first material layers (such as insulating layers) and second
material layers (such as sacrificial material layers) to be
subsequently formed. For example, the thickness of the
planarization dielectric layer 270L can be in a range from 800 nm
to 20,000 nm, although lesser and greater thicknesses can also be
employed.
[0054] Referring to FIG. 2, a masking layer 277 such as a patterned
photoresist layer can be formed over the planarization dielectric
layer 270L. The masking layer 277 covers the peripheral device
region 300 and does not cover the memory array region 100 or the
contact region 200. At least one anisotropic etch and/or at least
one isotropic etch can be performed employing the masking layer as
an etch mask to remove physically exposed portions of the
planarization dielectric layer 270L. As used herein, a "physically
exposed portion" refers to a portion that adjoins vacuum or a fluid
phase environment (i.e., a gas phase environment or a liquid phase
environment) or a plasma phase environment. The material of the
planarization dielectric layer 270L is removed from the memory
array region 100 and the contact region 200. Portions of the
dielectric liners (161, 162) can be removed from the memory array
region 100 and the contact region 200. The remaining portion of the
planarization dielectric layer 270L in the peripheral device region
300 constitutes a mesa structure 270, which has a top surface and
at least one dielectric sidewall. If the entire mesa structure 270
is formed of a dielectric (i.e., insulating) material, then it
comprises a dielectric mesa structure 270. While layer 270L is
preferably a dielectric (i.e., insulating layer), in another
embodiment, layer 270L may be a semiconductor or conductive layer
which is etched to form the mesa structure followed by forming a
dielectric (i.e., insulating) layer over the top and side of the
mesa structure to form the dielectric sidewall of the mesa
structure 270. Depending on the degree of lateral etching during
the patterning of the dielectric mesa structure 270, the at least
one sidewall of the dielectric mesa structure 270 can be
substantially vertical, or can be tapered. As used herein, a
sidewall is substantially vertical if the angle between the
sidewall and a vertical line which is perpendicular to the top
surface 7 of the substrate (9, 10) is not greater than 5 degrees,
and is tapered if the angle between the sidewall and the vertical
line is greater than 5 degrees.
[0055] Referring to FIG. 3, a gate dielectric layer 12 can be
formed on the top surface of the substrate (9, 10) by deposition of
a gate dielectric material and/or conversion of a surface portion
of the substrate (9, 10) into a dielectric material layer. The gate
dielectric layer 12 can include at least one dielectric
semiconductor compound such as silicon oxide and/or silicon
oxynitride, and/or at least one dielectric metal oxide such as
aluminum oxide and/or hafnium oxide. If a dielectric material layer
within the gate dielectric layer 12 is formed by deposition, a
conformal deposition method can be employed to deposit such a
dielectric material layer. The thickness of the gate dielectric
layer 12 can be in a range from 1 nm to 6 nm, although lesser and
greater thicknesses can also be employed. Alternatively, an
insulating layer 32 can be deposited in lieu of the gate dielectric
layer 12.
[0056] A stack of an alternating plurality of first material layers
(which can be insulating layers 32) and second material layers
(which can be sacrificial material layer 42) is formed over the top
surface of the substrate (9, 10), the top surface of the dielectric
mesa structure 270, and the at least one sidewall of the dielectric
mesa structure 270. Each first material layer and each second
material layer can be deposited by a conformal deposition method
such as low pressure chemical vapor deposition (LPCVD) or atomic
layer deposition (ALD). The alternating plurality of the first
material layers and the second material layers can be formed on the
top surface of the gate dielectric layer 12.
[0057] As used herein, a "material layer" refers to a layer
including a material throughout the entirety thereof. As used
herein, an alternating plurality of first elements and second
elements refers to a structure in which instances of the first
elements and instances of the second elements alternate. Each
instance of the first elements that is not an end element of the
alternating plurality is adjoined by two instances of the second
elements on both sides, and each instance of the second elements
that is not an end element of the alternating plurality is adjoined
by two instances of the first elements on both ends. The first
elements may have the same thickness thereamongst, or may have
different thicknesses. The second elements may have the same
thickness thereamongst, or may have different thicknesses. The
alternating plurality of first material layers and second material
layers may begin with an instance of the first material layers or
with an instance of the second material layers, and may end with an
instance of the first material layers or with an instance of the
second material layers. In one embodiment, an instance of the first
elements and an instance of the second elements may form a unit
that is repeated with periodicity within the alternating
plurality.
[0058] Each first material layer includes a first material, and
each second material layer includes a second material that is
different from the first material. In one embodiment, each first
material layer can be an insulating layer 32, and each second
material layer can be a sacrificial material layer. In this case,
the stack can include an alternating plurality of insulating layers
32 and sacrificial material layers 42, and constitutes a prototype
stack of alternating layers comprising insulating layers 32 and
sacrificial material layers 42. As used herein, a "prototype"
structure or an "in-process" structure refers to a transient
structure that is subsequently modified in the shape or composition
of at least one component therein.
[0059] The stack of the alternating plurality is herein referred to
as an alternating stack (32, 42). In one embodiment, the
alternating stack (32, 42) can include insulating layers 32
composed of the first material, and sacrificial material layers 42
composed of a second material different from that of insulating
layers 32. The first material of the insulating layers 32 can be at
least one insulating material. As such, each insulating layer 32
can be an insulating material layer. Insulating materials that can
be employed for the insulating layers 32 include, but are not
limited to, silicon oxide (including doped or undoped silicate
glass), silicon nitride, silicon oxynitride, organosilicate glass
(OSG), dielectric metal oxides that are commonly known as high
dielectric constant (high-k) dielectric oxides (e.g., aluminum
oxide, hafnium oxide, etc.) and silicates thereof, dielectric metal
oxynitrides and silicates thereof, and organic insulating
materials. In one embodiment, the first material of the insulating
layers 32 can be silicon oxide.
[0060] The second material of the sacrificial material layers 42 is
a sacrificial material that can be removed selective to the first
material of the insulating layers 32. As used herein, a removal of
a first material is "selective to" a second material if the removal
process removes the first material at a rate that is at least twice
the rate of removal of the second material. The ratio of the rate
of removal of the first material to the rate of removal of the
second material is herein referred to as a "selectivity" of the
removal process for the first material with respect to the second
material.
[0061] The sacrificial material layers 42 may comprise an
insulating material, a semiconductor material, or a conductive
material. The second material of the sacrificial material layers 42
can be subsequently replaced with electrically conductive
electrodes which can function, for example, as control gate
electrodes of a vertical NAND device. Non-limiting examples of the
second material include silicon nitride, an amorphous semiconductor
material (such as amorphous silicon), and a polycrystalline
semiconductor material (such as polysilicon). In one embodiment,
the sacrificial material layers 42 can be spacer material layers
that comprise silicon nitride or a semiconductor material including
at least one of silicon and germanium. As used herein, a "spacer
material layer" refers to a material layer that provides vertical
separation between two layers, such as a pair of insulating layers
32. Thus, an alternating stack of insulating layers 32 and spacer
material layers (as embodied as the sacrificial material layers 42)
can be formed. In this case, the spacer material layers are formed
as sacrificial material layers 42, and are subsequently replaced
with the electrically conductive layers after formation of the
memory stack structures.
[0062] In one embodiment, the insulating layers 32 can include
silicon oxide, and sacrificial material layers can include silicon
nitride sacrificial material layers. The first material of the
insulating layers 32 can be deposited, for example, by chemical
vapor deposition (CVD). For example, if silicon oxide is employed
for the insulating layers 32, tetraethyl orthosilicate (TEOS) can
be employed as the precursor material for the CVD process. The
second material of the sacrificial material layers 42 can be
formed, for example, CVD or atomic layer deposition (ALD).
[0063] The thicknesses of the insulating layers 32 and the
sacrificial material layers 42 can be in a range from 20 nm to 50
nm, although lesser and greater thicknesses can be employed for
each insulating layer 32 and for each sacrificial material layer
42. The number of repetitions of the pairs of an insulating layer
32 and a sacrificial material layer (e.g., a control gate electrode
or a sacrificial material layer) 42 can be in a range from 2 to
1,024, and typically from 8 to 256, although a greater number of
repetitions can also be employed. The top and bottom gate
electrodes in the stack may function as the select gate electrodes.
In one embodiment, each sacrificial material layer 42 in the
alternating stack (32, 42) can have a uniform thickness that is
substantially invariant within each respective sacrificial material
layer 42.
[0064] Each of the insulating layers 32 and the sacrificial
material layers 42 include a first horizontal sub-portion having a
respective uniform thickness and horizontally extending within the
memory array region 100 and the contact region 200, a
non-horizontal sub-portion having the respective uniform thickness
and extending within the contact region 200 along a non-horizontal
direction (such as the vertical direction), and a second horizontal
sub-portion having the respective uniform thickness and
horizontally extending over the dielectric mesa structure 270 and
within the peripheral device region and the contact region 300. The
portion of the alternating stack (32, 42) that includes the first
horizontal sub-portions of the insulating layers 32 and the
sacrificial material layers 42 is herein referred to as an array
portion AP of the alternating stack (32, 42), and the portion of
the alternating stack (32, 42) that includes the second horizontal
sub-portions of the alternating stack (32, 42) is herein referred
to as a peripheral portion PP of the alternating stack (32, 42). A
non-horizontally extending portion NHP of the alternating stack
(32, 42) includes the vertical sub-portions of the insulating
layers 32 and the sacrificial material layers 42. In one
embodiment, the non-horizontal sub-portions of the insulating
layers 32 and the sacrificial material layers 42 can extend along
the vertical direction or a substantially vertical direction. As
used herein, a "sub-portion" refers to a subset of a portion that
is less than the entirety of the portion.
[0065] A dielectric cap layer 80 can be formed over the first
horizontal sub-portions of the insulating layers 32 and the
sacrificial material layers 42 in the memory array region 100. The
dielectric cap layer 80 can be deposited by a self-planarizing
process such as spin coating. For example, the dielectric cap layer
80 can include spin-on glass (SOG). The thickness of the dielectric
cap layer 80 can be selected such that the top surface of the
dielectric cap layer 80 is formed at, or below, the horizontal
plane including the top surface of the dielectric mesa structure
270. Thus, the dielectric cap layer 80 is formed over a region of
the alternating stack (32, 42) that is laterally offset from the
dielectric mesa structure 270. Alternatively, the dielectric cap
layer 80 may comprise a silicon nitride or silicon oxynitride etch
stop layer deposited over the peripheral portion PP, the
non-horizontally extending portion NHP and the array portion AP of
the alternating stack (32, 42).
[0066] Referring to FIGS. 4A and 4B, the peripheral portion PP of
the alternating stack (32, 42) is removed by a planarization
process that employs the dielectric cap layer 80 as a stopping
structure. For example, the peripheral portion PP of the
alternating stack (32, 42) can be removed from above the horizontal
plane including the top surface of the dielectric mesa structure
270, while the array portion AP of the alternating stack (32, 42)
underneath the horizontal plane is not removed. In one embodiment,
a patterned recess etch may be employed. In this case, a
photoresist layer may be applied and to cover the area overlying
the dielectric cap layer 80 and not to cover the peripheral portion
PP of the alternating stack (32, 42), and an isotropic etch or an
anisotropic etch may be performed to remove the peripheral portion
PP of the alternating stack (32, 42) while the photoresist layer
protects the array portion AP of the alternating stack (32, 42).
The photoresist layer can be subsequently removed, for example, by
ashing. Additionally or alternatively, chemical mechanical
planarization (CMP) can be employed to remove all, or a residual
portion, of the peripheral portion PP of the alternating stack (32,
42).
[0067] Use of the dielectric cap layer 80 as a stopping structure
during the planarization process can provide a planarized structure
in which top surfaces of the various layers in the non-horizontally
extending portion NHP of the alternating stack (32, 42) are within
the same horizontal plane as a top surface of the dielectric cap
layer 80, which may be recessed with respect to the top surface of
the dielectric cap layer 80 as formed at the processing step of
FIG. 3. Optionally, the dielectric mesa structure 270 may be
employed as an additional stopping structure during the
planarization process. In one embodiment, the top surfaces of the
remaining portions of the dielectric cap layer 80, the
non-horizontally extending portion NHP of the alternating stack
(32, 42), and the dielectric mesa structure 270 can be located
within a same horizontal plane after the planarization process.
[0068] Referring to FIGS. 5A-5C, a lithographic material stack (not
shown) including at least a photoresist layer can be formed over
the dielectric cap layer 80, and can be lithographically patterned
to form openings within the memory array region 100 and the contact
region 200. The pattern in the lithographic material stack can be
transferred through the dielectric cap layer 80 and through
entirety of the alternating stack (32, 42) by at least one
anisotropic etch that employs the patterned lithographic material
stack as an etch mask. Portions of the alternating stack (32, 42)
underlying the openings in the patterned lithographic material
stack are etched to form memory openings 49 and support openings
19. In other words, the transfer of the pattern in the patterned
lithographic material stack through the alternating stack (32, 42)
forms the memory openings 49 and the support openings 19 that
extend through the alternating stack (32, 42). The chemistry of the
anisotropic etch process employed to etch through the materials of
the alternating stack (32, 42) can alternate to optimize etching of
the first and second materials in the alternating stack (32, 42).
The anisotropic etch can be, for example, a series of reactive ion
etches. The sidewalls of the memory openings 49 can be
substantially vertical, or can be tapered. The patterned
lithographic material stack can be subsequently removed, for
example, by ashing.
[0069] The memory openings 49 are formed through the array portion
AP of the alternating stack (32, 42), which is located within the
memory array region 100. The support openings 19 are formed through
the non-horizontally extending portion NHP of the alternating stack
(32, 42), which is located within the contact region 200. In one
embodiment, the memory openings 49 can be formed with substantially
elliptical or substantially circular horizontal cross-sectional
areas. In one embodiment, the support openings 19 can be formed
with substantially rectangular horizontal cross-sectional
areas.
[0070] The memory openings 49 are formed through the gate
dielectric layer 12 so that the memory openings 49 extend from the
top surface of the alternating stack (32, 42) to at least the top
surface of the doped semiconductor well 10. A top surface of the
substrate (9, 10) is physically exposed at a bottom of each of the
memory openings 49. In one embodiment, an overetch into the doped
semiconductor well 10 may be optionally performed after the top
surface of the doped semiconductor well 10 is physically exposed at
a bottom of each memory opening 49. The overetch may be performed
prior to, or after, removal of the lithographic material stack. In
other words, the recessed surfaces of the doped semiconductor well
10 may be vertically offset from the undressed top surfaces of the
doped semiconductor well 10 by a recess depth. The recess depth can
be, for example, in a range from 1 nm to 50 nm, although lesser and
greater recess depths can also be employed. The overetch is
optional, and may be omitted. If the overetch is not performed, the
bottom surface of each memory opening 49 can be coplanar with the
topmost surface of the doped semiconductor well 10. Each of the
memory openings 49 can include a sidewall (or a plurality of
sidewalls) that extends substantially perpendicular to the topmost
surface of the substrate. The array of memory openings 49 is formed
in the memory array region 100. The substrate semiconductor layer 9
and the doped semiconductor well 10 collectively constitutes a
substrate (9, 10), which can be a semiconductor substrate.
Alternatively, the doped semiconductor well 10 may be omitted, and
the memory openings 49 can be extend to a top surface of the
substrate semiconductor layer 9.
[0071] The support openings 19 can be formed through the
non-horizontally extending portion NHP of the alternating stack
(32, 42) and a peripheral sub-portion of the array portion AP of
the alternating stack (32, 42). In an illustrative example, a
sidewall of the dielectric mesa structure 270 can be substantially
perpendicular to a first horizontal direction HD1 (i.e., word line
direction), and can be parallel to a second horizontal direction
HD2 (i.e., bit line direction). The support openings can extend
through the non-horizontally extending portion NHP of the
alternating stack (32, 42) and an underlying peripheral sub-portion
of the array portion AP of the alternating stack (32, 42). In one
embodiment, the support openings 19 can be formed with the
substantially rectangular horizontal cross-sectional areas having a
length which is greater than the width by at least two times, such
as by three to one hundred times. The length extends in the first
horizontal direction HD1, and the width extends in the second
horizontal direction HD2. Thus, the support openings 19 cut through
plural pairs of insulating layers 32 and sacrificial layers 42, as
shown in FIG. 5B.
[0072] Referring to FIGS. 6A and 6B, memory stack structures 55 and
support pillar structures 20 are formed in the memory openings 49
and in the support openings 19, respectively. Specifically, a stack
of layers including a blocking dielectric layer 52, a charge
storage layer 54, and a tunneling dielectric layer 56 can be
sequentially deposited in each of the memory openings 49 and the
support openings 19.
[0073] The blocking dielectric layer 52 can include a single
dielectric material layer or a stack of a plurality of dielectric
material layers. In one embodiment, the blocking dielectric layer
can include a dielectric metal oxide layer consisting essentially
of a dielectric metal oxide. As used herein, a dielectric metal
oxide refers to a dielectric material that includes at least one
metallic element and at least oxygen. The dielectric metal oxide
may consist essentially of the at least one metallic element and
oxygen, or may consist essentially of the at least one metallic
element, oxygen, and at least one non-metallic element such as
nitrogen. In one embodiment, the blocking dielectric layer 52 can
include a dielectric metal oxide having a dielectric constant
greater than 7.9, i.e., having a dielectric constant greater than
the dielectric constant of silicon nitride.
[0074] Non-limiting examples of dielectric metal oxides include
aluminum oxide (Al.sub.2O.sub.3), hafnium oxide (HfO.sub.2),
lanthanum oxide (LaO.sub.2), yttrium oxide (Y.sub.2O.sub.3),
tantalum oxide (Ta.sub.2O.sub.5), silicates thereof, nitrogen-doped
compounds thereof, alloys thereof, and stacks thereof. The
dielectric metal oxide layer can be deposited, for example, by
chemical vapor deposition (CVD), atomic layer deposition (ALD),
pulsed laser deposition (PLD), liquid source misted chemical
deposition, or a combination thereof. The thickness of the
dielectric metal oxide layer can be in a range from 1 nm to 20 nm,
although lesser and greater thicknesses can also be employed. The
dielectric metal oxide layer can subsequently function as a
dielectric material portion that blocks leakage of stored
electrical charges to control gate electrodes. In one embodiment,
the blocking dielectric layer 52 includes aluminum oxide. In one
embodiment, the blocking dielectric layer 52 can include multiple
dielectric metal oxide layers having different material
compositions.
[0075] Alternatively or additionally, the blocking dielectric layer
52 can include a dielectric semiconductor compound such as silicon
oxide, silicon oxynitride, silicon nitride, or a combination
thereof. In one embodiment, the blocking dielectric layer 52 can
include silicon oxide. In this case, the dielectric semiconductor
compound of the blocking dielectric layer 52 can be formed by a
conformal deposition method such as low pressure chemical vapor
deposition, atomic layer deposition, or a combination thereof. The
thickness of the dielectric semiconductor compound can be in a
range from 1 nm to 20 nm, although lesser and greater thicknesses
can also be employed. Alternatively, the blocking dielectric layer
52 can be omitted, and a backside blocking dielectric layer can be
formed after formation of backside recesses on surfaces of memory
films to be subsequently formed.
[0076] Subsequently, the charge storage layer 54 can be formed. In
one embodiment, the charge storage layer 54 can be a continuous
layer or patterned discrete portions of a charge trapping material
including a dielectric charge trapping material, which can be, for
example, silicon nitride. Alternatively, the charge storage layer
54 can include a continuous layer or patterned discrete portions of
a conductive material such as doped polysilicon or a metallic
material that is patterned into multiple electrically isolated
portions (e.g., floating gates), for example, by being formed
within backside recesses into sacrificial material layers 42. In
one embodiment, the charge storage layer 54 includes a silicon
nitride layer. In one embodiment, the sacrificial material layers
42 and the insulating layers 32 can have vertically coincident
sidewalls, and the charge storage layer 54 can be formed as a
single continuous layer.
[0077] In another embodiment, the sacrificial material layers 42
can be laterally recessed with respect to the sidewalls of the
insulating layers 32, and a combination of a deposition process and
an anisotropic etch process can be employed to form the charge
storage layer 54 as a plurality of memory material portions that
are vertically spaced apart. While the present disclosure is
described employing an embodiment in which the charge storage layer
54 is a single continuous layer, embodiments are expressly
contemplated herein in which the charge storage layer 54 is
replaced with a plurality of memory material portions (which can be
charge trapping material portions or electrically isolated
conductive material portions) that are vertically spaced apart.
[0078] The charge storage layer 54 can be formed as a single charge
storage layer of homogeneous composition, or can include a stack of
multiple charge storage layers. The multiple charge storage layers,
if employed, can comprise a plurality of spaced-apart floating gate
material layers that contain conductive materials (e.g., metal such
as tungsten, molybdenum, tantalum, titanium, platinum, ruthenium,
and alloys thereof, or a metal silicide such as tungsten silicide,
molybdenum silicide, tantalum silicide, titanium silicide, nickel
silicide, cobalt silicide, or a combination thereof) and/or
semiconductor materials (e.g., polycrystalline or amorphous
semiconductor material including at least one elemental
semiconductor element or at least one compound semiconductor
material). Alternatively or additionally, the charge storage layer
54 may comprise an insulating charge trapping material, such as one
or more silicon nitride segments. Alternatively, the charge storage
layer 54 may comprise conductive nanoparticles such as metal
nanoparticles, which can be, for example, ruthenium nanoparticles.
The charge storage layer 54 can be formed, for example, by chemical
vapor deposition (CVD), atomic layer deposition (ALD), physical
vapor deposition (PVD), or any suitable deposition technique for
storing electrical charges therein. The thickness of the charge
storage layer 54 can be in a range from 2 nm to 20 nm, although
lesser and greater thicknesses can also be employed.
[0079] The tunneling dielectric layer 56 includes a dielectric
material through which charge tunneling can be performed under
suitable electrical bias conditions. The charge tunneling may be
performed through hot-carrier injection or by Fowler-Nordheim
tunneling induced charge transfer depending on the mode of
operation of the monolithic three-dimensional NAND string memory
device to be formed. The tunneling dielectric layer 56 can include
silicon oxide, silicon nitride, silicon oxynitride, dielectric
metal oxides (such as aluminum oxide and hafnium oxide), dielectric
metal oxynitride, dielectric metal silicates, alloys thereof,
and/or combinations thereof. In one embodiment, the tunneling
dielectric layer 56 can include a stack of a first silicon oxide
layer, a silicon oxynitride layer, and a second silicon oxide
layer, which is commonly known as an ONO stack. In one embodiment,
the tunneling dielectric layer 56 can include a silicon oxide layer
that is substantially free of carbon or a silicon oxynitride layer
that is substantially free of carbon. The thickness of the
tunneling dielectric layer 56 can be in a range from 2 nm to 20 nm,
although lesser and greater thicknesses can also be employed.
[0080] An optional first semiconductor channel layer may be
deposited on the tunneling dielectric. The optional first
semiconductor channel layer, the tunneling dielectric layer 56, the
charge storage layer 54, and the blocking dielectric layer 52 are
sequentially anisotropically etched employing at least one
anisotropic etch process. The portions of the optional first
semiconductor channel layer, the tunneling dielectric layer 56, the
charge storage layer 54, and the blocking dielectric layer 52
located above the top surface of the dielectric cap layer 80 can be
removed by the at least one anisotropic etch process or a chemical
mechanical planarization (CMP) process. Further, the horizontal
portions of the optional first semiconductor channel layer, the
tunneling dielectric layer 56, the charge storage layer 54, and the
blocking dielectric layer 52 at a bottom of each memory opening 49
can be removed to form openings in remaining portions thereof. A
semiconductor surface of the substrate (9, 10) (such as a top
surface of the doped semiconductor well 10) can be physically
exposed at the bottom of each memory opening 49.
[0081] A semiconductor channel material layer can be deposited
directly on the semiconductor surface of the substrate (9, 10). If
the optional first semiconductor channel layer is present, then the
semiconductor channel material layer comprises a second
semiconductor channel layer formed on a surface of the optional
first semiconductor channel layer. If the optional first
semiconductor channel layer is not present, then the semiconductor
channel material layer is formed directly on the tunneling
dielectric layer 56. The semiconductor channel material layer
includes a semiconductor material such as at least one elemental
semiconductor material, at least one III-V compound semiconductor
material, at least one II-VI compound semiconductor material, at
least one organic semiconductor material, or other semiconductor
materials known in the art. In one embodiment, the semiconductor
channel material layer includes amorphous silicon or polysilicon.
The semiconductor channel material layer can be formed by a
conformal deposition method such as low pressure chemical vapor
deposition (LPCVD). The thickness of the semiconductor channel
material layer can be in a range from 2 nm to 10 nm, although
lesser and greater thicknesses can also be employed. The
semiconductor channel material layer may partially fill cavities in
the memory opening 49 and/or the support openings 19, or may fully
fill the cavities in the memory opening 49 and/or the support
openings 19. The material of the semiconductor channel material
layer is referred to as a semiconductor channel material. The
semiconductor channel material layer can include a single
semiconductor layer, or can include a stack of multiple
semiconductor layers. Any remaining semiconductor material of the
semiconductor channel material layer located above the top surface
of the dielectric cap layer 80 can be removed by a planarization
process, which can employ a recess etch or chemical mechanical
planarization (CMP). Each remaining portion of the semiconductor
channel material layer in the memory openings 49 constitutes a
vertical semiconductor channel 60. Each remaining portion of the
semiconductor channel material layer in the support openings 19
constitutes a semiconductor fill structure 60'.
[0082] In case the cavities in each memory opening 49 and/or the
support openings 19 are not completely filled by the vertical
semiconductor channel 60 and/or the semiconductor fill structure
60', respectively, a dielectric core layer can be deposited in the
cavity to fill any remaining portion of the cavity within each
memory opening. The dielectric core layer includes a dielectric
material such as silicon oxide or organosilicate glass. The
dielectric core layer can be deposited by a conformal deposition
method such as low pressure chemical vapor deposition (LPCVD), or
by a self-planarizing deposition process such as spin coating.
Subsequently, the horizontal portion of the dielectric core layer
can be removed, for example, by a recess etch from above the top
surface of the dielectric cap layer 80. Each remaining portion of
the dielectric core layer in the memory openings 49 constitutes a
dielectric core 62. Each remaining portion of the dielectric core
layer in the support openings constitutes a dielectric fill
structure 62'.
[0083] Each vertical semiconductor channel 60 formed in the memory
openings 49 is a channel of a vertical field effect transistor
through which electrical current can flow when a vertical NAND
device including the vertical semiconductor channel 60 is turned
on. A tunneling dielectric layer 56 is surrounded by a charge
storage layer 54, and laterally surrounds a portion of the vertical
semiconductor channel 60. Each adjoining set of a blocking
dielectric layer 52, a charge storage layer 54, and a tunneling
dielectric layer 56 within a memory opening 49 or within a support
opening 19 collectively constitutes a memory film 50, which can
store electrical charges with a macroscopic retention time. Each
memory film 50 within the memory openings 49 is employed to store
electrical charges, while each memory film 50 within the support
openings 19 is employed as dielectric fill material layers, and is
not employed to store electrical charges in the memory device of
the present disclosure.
[0084] In some embodiments, a blocking dielectric layer 52 may not
be present in the memory film 50 at this step, and a blocking
dielectric layer may be subsequently formed after formation of
backside recesses. As used herein, a macroscopic retention time
refers to a retention time suitable for operation of a memory
device as a permanent memory device such as a retention time in
excess of 24 hours. Each combination of a memory film 50 and a
vertical semiconductor channel 60 located within a same memory
opening 49 constitutes a memory stack structure 55. Each
semiconductor fill structure 60' is a dummy structures that is not
electrically active, i.e., does not function as a portion of an
active semiconductor device.
[0085] The top surface of each dielectric core 62 and each
dielectric fill structure 62' can be further recessed within each
memory opening, for example, by a recess etch to a depth that is
located between the top surface of the dielectric cap layer 80 and
the bottom surface of the dielectric cap layer 80. Drain regions 63
can be formed by depositing a doped semiconductor material within
each recessed region above the dielectric cores 62. Dummy drain
regions 63' can be formed within each recessed region above the
dielectric fill structure 62' concurrent with formation of the
drain regions 63. The doped semiconductor material can be, for
example, doped polysilicon. Excess portions of the deposited
semiconductor material can be removed from above the top surface of
the dielectric cap layer 80, for example, by chemical mechanical
planarization (CMP) or a recess etch to form the drain regions 63.
In one embodiment, the dummy drain region 63' is a dummy structure
that is not electrically active, and thus, is not contacted by any
electrically active component from above in the semiconductor
device of the present disclosure.
[0086] Each combination of a memory film 50 and a vertical
semiconductor channel 60 within a memory opening 49 constitutes a
memory stack structure 55. Each combination of a memory film 50, a
semiconductor fill structure 60', a dielectric fill structure 62',
and a dummy drain region 63' constitutes a support pillar structure
20. The support pillar structures 20 can laterally extend along the
first horizontal direction HD1 through less than the entire set of
sacrificial material layers 42, and can be laterally staggered
along the first horizontal direction to provide mechanical support
to each insulating layer 32 within the alternating stack. The
support pillar structures 20 can be laterally spaced along the
second horizontal direction HD2. The support pillar structures 20
provide mechanical support during subsequent processing steps
employed to replace the sacrificial material layers 42 with
electrically conductive layers. In one embodiment, the support
pillar structure 20 can be formed with the substantially
rectangular horizontal cross-sectional areas having a length which
is greater than the width by at least two times, such as by three
to one hundred times. The length extends in the first horizontal
direction HD1, and the width extends in the second horizontal
direction HD2. Thus, the support pillar structures 20 can have a
rail shape that cuts through plural pairs of insulating layers 32
and sacrificial layers 42 in the length direction, as shown in FIG.
6B.
[0087] Referring to FIGS. 7A and 7B, an alternate embodiment of the
first exemplary structure is illustrated at the processing steps of
FIGS. 6A and 6B. In the alternate embodiment of the first exemplary
structure, the support pillar structures 20 can laterally extend
along the first horizontal direction HD1 through each sacrificial
material layer 42 within the alternating stack (32, 42).
[0088] While the present disclosure is described employing
particular configurations for the support pillar structures 20,
support pillar structures 20 of any shape can be employed in the
contact region 200 provided that each of the sacrificial material
layers 42 continuously extends from the array portion AP of the
alternating stack (32, 42) to a physically exposed surface that is
within the same plane as the top surface of the dielectric cap
layer 80.
[0089] Referring to FIGS. 8A and 8B, a photoresist layer (not
shown) can be applied over the alternating stack (32, 42) and the
dielectric mesa structure 270 of FIGS. 6A and 6B (or of FIGS. 7A
and 7B), and is lithographically patterned to form elongated
openings in between clusters of memory stack structures 55 within
the memory array region 100. The pattern in the photoresist layer
can be transferred through the dielectric cap layer 80 and the
alternating stack (32, 42) employing an anisotropic etch to form
backside trenches 79, which extends at least to the top surface of
the substrate (9, 10). In one embodiment, the backside trenches 79
can be adjoined to the dielectric mesa structure 270. In one
embodiment, the at least one backside trench 79 can include a
source contact opening in which a source contact via structure can
be subsequently formed.
[0090] Referring to FIG. 9, in case the spacer material layers are
formed as sacrificial material layers 42, the spacer material
layers can be replaced with the electrically conductive layers 46.
For example, an etchant that selectively etches the second material
of the sacrificial material layers 42 with respect to the first
material of the insulating layers 32 can be introduced into the at
least one backside trench 79, for example, employing an etch
process. Backside recesses 43 are formed in volumes from which the
sacrificial material layers 42 are removed. The removal of the
second material of the sacrificial material layers 42 can be
selective to the first material of the insulating layers 32, the
semiconductor material of the doped semiconductor well 10, and the
material of the outermost layer of the memory films 50. In one
embodiment, the sacrificial material layers 42 can include silicon
nitride, and the materials of the insulating layers 32 can be
selected from silicon oxide and dielectric metal oxides.
[0091] The etch process that removes the second material selective
to the first material and the outermost layer of the memory films
50 can be a wet etch process employing a wet etch solution, or can
be a gas phase (dry) etch process in which the etchant is
introduced in a vapor phase into the at least one backside trench
79. For example, if the sacrificial material layers 42 include
silicon nitride, the etch process can be a wet etch process in
which the exemplary structure is immersed within a wet etch tank
including phosphoric acid, which etches silicon nitride selective
to silicon oxide, silicon, and various other materials employed in
the art. The support pillar structures 20 and the memory stack
structures 55 provide structural support to prevent collapse of the
insulating layers 32 while the backside recesses 43 are present
within volumes previously occupied by the sacrificial material
layers 42.
[0092] Each backside recess 43 can include a horizontally extending
portion and a non-horizontally extending portion, which may extend
vertically or substantially vertically. Each backside recess 43
extends to the horizontal plane including the top surface of the
dielectric cap layer 80, the top surface of the dielectric mesa
structure 270, and the top surfaces of the support pillar
structures 20. A plurality of backside recesses 43 can be formed in
the volumes from which the second material of the sacrificial
material layers 42 is removed. The memory openings in which the
memory stack structures 55 are formed are herein referred to as
front side openings or front side cavities in contrast with the
backside recesses 43. In one embodiment, the memory array region
100 comprises an array of monolithic three-dimensional NAND strings
having a plurality of device levels disposed above the substrate
(9, 10). In this case, each backside recess 43 can define a space
for receiving a respective word line of the array of monolithic
three-dimensional NAND strings.
[0093] Each horizontally extending portion of the backside recesses
43 can extend substantially parallel to the top surface of the
substrate (9, 10). Each horizontally extending portion of the
backside recesses 43 can be vertically bounded by a top surface of
an underlying insulating layer 32 and a bottom surface of an
overlying insulating layer 32. In one embodiment, each horizontally
extending portion of the backside recesses 43 can have a uniform
height throughout.
[0094] Each non-horizontally extending portion of the backside
recesses 43 can extend vertically or substantially vertically. Each
non-horizontally extending portion of the backside recesses 43 can
be laterally bounded by sidewalls of a neighboring pair of
insulating layers 32. In one embodiment, each non-horizontally
extending portion of the backside recesses 43 can have a uniform
width throughout, which can be the same as the uniform height of an
adjoining horizontally-extending portion of the same backside
recess 43.
[0095] Referring to FIG. 10, a backside blocking dielectric layer
(not shown) can be optionally formed. The backside blocking
dielectric layer, if present, comprises a dielectric material that
functions as a control gate dielectric for the control gates to be
subsequently formed in the backside recesses 43. In case the
blocking dielectric layer 52 is present within each memory opening,
the backside blocking dielectric layer is optional. In case the
blocking dielectric layer 52 is omitted, the backside blocking
dielectric layer is present. The backside blocking dielectric layer
can be formed in the backside recesses 43 and on a sidewall of the
backside trench 79. The backside blocking dielectric layer can be
formed directly on horizontal surfaces of the insulating layers 32
and sidewalls of the memory stack structures 55 within the backside
recesses 43. In one embodiment, the backside blocking dielectric
layer can be formed by a conformal deposition process such as
atomic layer deposition (ALD). The backside blocking dielectric
layer can consist essentially of aluminum oxide. The thickness of
the backside blocking dielectric layer can be in a range from 1 nm
to 15 nm, such as 2 to 6 nm, although lesser and greater
thicknesses can also be employed.
[0096] The dielectric material of the backside blocking dielectric
layer can be a dielectric metal oxide such as aluminum oxide, a
dielectric oxide of at least one transition metal element, a
dielectric oxide of at least one Lanthanide element, a dielectric
oxide of a combination of aluminum, at least one transition metal
element, and/or at least one Lanthanide element. Alternatively or
additionally, the backside blocking dielectric layer can include a
silicon oxide layer. The backside blocking dielectric layer can be
deposited by a conformal deposition method such as chemical vapor
deposition or atomic layer deposition. The thickness of the
backside blocking dielectric layer can be in a range from 1 nm to
10 nm, although lesser and greater thicknesses can also be
employed. A backside cavity is present within the portion of each
backside trench 79 that is not filled with the backside blocking
dielectric layer.
[0097] At least one conductive material is deposited within the
backside recesses 43 to form electrically conductive layers 46. The
at least one conductive material deposited in the backside trenches
79 and over the dielectric cap layer 80 constitutes a continuous
conductive material layer 46L. A backside cavity 79' is present
within each backside trench 79. The at least one conductive
material can include, for example, a metallic liner material such
as a conductive metal nitride (e.g., TiN, TaN, or WN) and a
metallic fill material that consists essentially of at least one
metal. The metallic fill material can consist essentially of a
single elemental metal (such as Cu, Co, W, or Al) or an
intermetallic alloy of at least two elemental metals. In one
embodiment, the at least one conductive material can include a
titanium nitride liner and a tungsten fill material. The at least
one conductive material can be deposited by a conductive deposition
process such as chemical vapor deposition (CVD) and/or atomic layer
deposition (ALD). The at least one conductive material fills each
of the backside recesses 43. Each continuous portion of the
deposited at least one conductive material located within a
backside recess 43 constitutes an electrically conductive layer 46.
Each electrically conductive layer 46 can include a metallic liner
portion 46A that include the metallic liner material and a metallic
fill portion 46B that includes the metallic fill material.
[0098] Referring to FIG. 11, the continuous conductive material
layer 46L (i.e., the continuous portion of the at least one
conductive material deposited in the backside trenches 79 or over
the horizontal plane including the top surfaces of the dielectric
cap layer 80 and the dielectric mesa structure 270) can be removed
by an etch process, which may be an isotropic etch process. Each of
the electrically conductive layers 46 comprises a respective
continuously-extending conductive material portion of a homogeneous
composition that includes a respective horizontal sub-portion that
extend parallel to the top surface of the substrate (9, 10) and a
respective non-horizontal sub-portion that extend parallel to the
at least one sidewall of the dielectric mesa structure 270. As used
herein, a "continuously-extending" element or an "integral" refers
to an element that consists of a single continuous structure such
that each point within the structure can be connected to any other
point within the structure by a line that is contained entirely
within the volume of the structure. As used herein, a "homogeneous
composition" refers to a composition that is the same throughout
the entirety of an element.
[0099] Specifically, each metallic liner portion 46A within the
electrically conductive layers 46 is a continuously-extending
conductive material portion of a homogeneous composition that
includes a respective horizontal sub-portion that extend parallel
to the top surface of the substrate (9, 10) (and located within a
horizontal sub-portion 46H of the respective electrically
conductive layer 46) and a respective non-horizontal sub-portion
that extend parallel to the at least one sidewall of the dielectric
mesa structure 270 (and located within a non-horizontal sub-portion
46V of the respective electrically conductive layer 46). Further,
each metallic fill portion 46B within the electrically conductive
layers 46 is a continuously-extending conductive material portion
of a homogeneous composition that includes a respective horizontal
sub-portion that extend parallel to the top surface of the
substrate (9, 10) (and located within a horizontal sub-portion 46H
of the respective electrically conductive layer 46) and a
respective non-horizontal sub-portion that extend parallel to the
at least one sidewall of the dielectric mesa structure 270 (and
located within a non-horizontal sub-portion 46V of the respective
electrically conductive layer 46). Each of the
continuously-extending conductive material portions, as embodied as
a metallic liner portion 46A or as a metallic fill portion 46B, is
free of any physical interface therein. As used herein, a "physical
interface" in an element refers to a region including at least one
physically observable inhomogeneity therein such as an interfacial
compositional change or an interfacial microstructural change.
[0100] Each electrically conductive layer 46 can function as a
combination of a plurality of control gate electrodes located at a
same level and a word line electrically interconnecting, i.e.,
electrically shorting, the plurality of control gate electrodes
located at the same level. The plurality of control gate electrodes
within each electrically conductive layer 46 are the control gate
electrodes for the vertical memory devices including the memory
stack structures 55. In other words, each electrically conductive
layer 46 can be a word line that functions as a common control gate
electrode for the plurality of vertical memory devices.
[0101] Referring to FIGS. 12A-12C, an insulating material layer can
be formed in the at least one backside trench 79 and over the
dielectric cap layer 80 by a conformal deposition process.
Exemplary conformal deposition processes include, but are not
limited to, chemical vapor deposition and atomic layer deposition.
The insulating material layer includes an insulating material such
as silicon oxide, silicon nitride, a dielectric metal oxide, an
organosilicate glass, or a combination thereof. In one embodiment,
the insulating material layer can include silicon oxide. The
insulating material layer can be formed, for example, by low
pressure chemical vapor deposition (LPCVD) or atomic layer
deposition (ALD). The thickness of the insulating material layer
can be in a range from 1.5 nm to 60 nm, although lesser and greater
thicknesses can also be employed. An anisotropic etch is performed
to remove horizontal portions of the insulating material layer from
above the dielectric cap layer 80 and at the bottom of each
backside trench 79. Each remaining portion of the insulating
material layer constitutes an insulating spacer 74. Thus, an
insulating spacer 74 is formed in each backside trench 79 directly
on physically exposed sidewalls of the electrically conductive
layers 46.
[0102] A source region 61 can be formed underneath each backside
trench 79 by implantation of electrical dopants into physically
exposed surface portions of the doped semiconductor well 10. Each
source region 61 is formed in a surface portion of the substrate
(9, 10) that underlies a respective opening through the insulating
spacer 74. Due to the straggle of the implanted dopant atoms during
the implantation process and lateral diffusion of the implanted
dopant atoms during a subsequent activation anneal process, each
source region 61 can contact a bottom surface of the insulating
spacer 74. Each surface portion of the doped semiconductor well 10
that is located between each source region 60 and vertical
semiconductor channels 60 within adjacent memory stack structures
55 constitutes a horizontal semiconductor channel 59.
[0103] A backside contact via structure 76 can be formed within
each backside cavity, which is the unfilled volume of a respective
backside trench 79. Each contact via structure 76 can fill a
respective backside cavity. The backside contact via structures 76
can be formed by depositing at least one conductive material in the
remaining unfilled volume (i.e., the backside cavity) of the
backside trench 79. For example, the at least one conductive
material can include a conductive liner and a conductive fill
material portion. The conductive liner can include a metallic liner
such as TiN, TaN, WN, TiC, TaC, WC, an alloy thereof, or a stack
thereof. The thickness of the conductive liner can be in a range
from 3 nm to 30 nm, although lesser and greater thicknesses can
also be employed. The conductive fill material portion can include
a metal or a metallic alloy. For example, the conductive fill
material portion can include W, Cu, Al, Co, Ru, Ni, an alloy
thereof, or a stack thereof.
[0104] The at least one conductive material can be planarized
employing the dielectric cap layer 80 overlying the alternating
stack (32, 46) and the dielectric mesa structures 270 as stopping
structures. If chemical mechanical planarization (CMP) process is
employed, the dielectric cap layer 80 and the dielectric mesa
structure 270 can be employed as CMP stopping structures. Each
remaining continuous portion of the at least one conductive
material in the backside trenches 79 constitutes a backside contact
via structure 76. Each backside contact via structure 76 can be
formed directly on a top surface of a source region 61. Each
backside contact via structure 76 can contact a respective source
region 61, and can be laterally surrounded by a respective
insulating spacer 74. The support pillar structures 20 extend
through a first region of the alternating stack (32, 46) that
includes the non-horizontal sub-portions 46V of the electrically
conductive layers 46 and laterally separating each of the
electrically conductive layers 46 in the word line direction (i.e.,
in horizontal direction HD1).
[0105] Referring to FIGS. 13A and 13B, a contact level dielectric
layer 90 can be formed over the dielectric cap layer 80 and the
dielectric mesa structure 270. The contact level dielectric layer
90 can include a dielectric material such as undoped silicate
glass, doped silicate glass, organosilicate glass, silicon nitride,
and/or a dielectric metal oxide. In one embodiment, the contact
level dielectric layer 90 can be a layer stack of multiple
dielectric layers including a silicon oxide layer and a diffusion
barrier layer such as a silicon nitride layer.
[0106] Additional contact via structures (88, 86, 8P) can be formed
through the contact level dielectric layer 90, and optionally
through the dielectric mesa structure 270. For example, drain
contact via structures 88 can be formed through the contact level
dielectric layer 90 on each drain region 63. Word line contact via
structures 86 can be formed through the contact level dielectric
layer 90 on the electrically conductive layers 46. Device contact
via structures 8P can be formed through the contact level
dielectric layer 90 and the dielectric mesa structure 270 directly
on respective nodes of the peripheral devices, which are
semiconductor devices and may include the driver circuit for the
NAND devices including the memory stack structures 55. The bottom
surfaces of the word line contact via structures 88 can be within
the same horizontal plane, i.e., within the horizontal plane
including the interface. No electrical contacts are formed to the
dummy drain structures 63' in the support pillar structures 20.
[0107] Referring to FIGS. 14A and 14B, a line level dielectric
layer 100 can be deposited over the contact level dielectric layer
90. The line level dielectric layer 100 includes a dielectric
material such as silicon oxide, organosilicate glass, silicon
nitride, and/or a dielectric metal oxide. For example, the contact
level dielectric layer 90 and the line level dielectric layer 100
can be composed primarily of silicon oxide or organosilicate glass
or a porous derivative thereof. Various interconnect line
structures (96, 98) can be formed in the line level dielectric
layer 100. The interconnect line structures (96, 98) can include
word line interconnect lines 96 that connect the word line contact
via structures 86 and the device contact via structures 8P and
extend along the first horizontal direction HD1. Further, the
interconnect line structures (96, 98) can include bit lines 98 that
extend along the second horizontal direction HD2 and contacting a
respective drain contact via structure 88. In one embodiment, each
drain contact via structure 88 is contacted by a single bit line 98
to enable unique access of each drain region 63 connected to a
respective vertical semiconductor channel 60.
[0108] Each of the insulating layers 32 and the electrically
conductive layers 46 include a horizontal sub-portion having a
respective uniform thickness and horizontally extending within the
memory array region 100 and the contact region 200, a
non-horizontal sub-portion having the respective uniform thickness
and extending within the contact region 200 along a non-horizontal
direction (such as the vertical direction). For example, each
electrically conductive layer 46 can include a horizontal
electrically conductive sub-portion 46H having a uniform thickness
t, and a non-horizontal electrically conductive sub-portion 46V
having the uniform thickness t.
[0109] While the present disclosure is described employing a
particular configuration for the support pillar structures 20, the
shapes of the support pillar structures 20 can be modified into
various shapes to provide suitable structural support during
replacement of the sacrificial material layers 42 with electrically
conductive layers 46. Further, while the present disclosure is
described employing an embodiment in which the support pillar
structures are formed concurrently with formation of memory stack
structures 55, and had the same set of material layers and material
portions as the combination of a memory stack structure 55, a
dielectric core 62, and a drain region 63, embodiments are
expressly contemplated herein in which the support pillar
structures are formed prior to or after formation of memory stack
structures. In this case, each of the support pillar structures may
consist of a dielectric pillar structure.
[0110] Referring to FIG. 15, a second exemplary structure according
to a second embodiment of the present disclosure can be derived
from the first exemplary structure of FIG. 1. Specifically, a
masking layer 277 such as a patterned photoresist layer can be
formed over the planarization dielectric layer 270L. The masking
layer 277 covers the peripheral device region 300 and does not
cover the memory array region 100 or the contact region 200. An
etch process that includes a lateral etch component can be employed
to etch the planarization dielectric layer 270L with a tapered
sidewall. At least one anisotropic etch and/or at least one
isotropic etch can be performed employing the masking layer 277 as
an etch mask to remove physically exposed portions of the
planarization dielectric layer 270L with a lateral etch component.
A mesa structure 270 having at least one tapered dielectric
sidewall is formed over the substrate (9, 10).
[0111] In one embodiment, the tapered sidewalls of the dielectric
mesa structure 270 can have a taper angle .alpha. in a range from
30 degrees to 75 degrees with respect to the vertical direction,
which is a direction that is perpendicular to the top surface 7 of
the substrate (9, 10). The physically exposed portions of the
dielectric liners (161, 162) can be removed from the memory array
region 100. Subsequently, the masking layer 277 can be removed, for
example, by ashing.
[0112] Referring to FIG. 16, the processing steps of FIG. 3 can be
performed to form a gate dielectric layer 12 and an alternating
stack of insulating layers 32 and sacrificial material layers 42
over the top surface of the substrate (9, 10), the top surface of
the dielectric mesa structure 270, and the at least one sidewall of
the dielectric mesa structure 270. In case the at least one
sidewall of the dielectric mesa structure 270 has a taper angle
.alpha. in a range from 30 degrees to 75 degrees with respect to
the vertical direction, each non-horizontal sub-portion of the
layers within the alternating stack (32, 42) can extend along a
direction that is the same taper angle as the at least one sidewall
of the dielectric mesa structure 270.
[0113] Subsequently, the processing steps of FIGS. 4A, 4B, 5A-5C,
6, 7A, 7B, 8A, 8B, 9, 10, 11, 12A-12C, 13A, 13B, 14A, and 14B can
be sequentially performed to form the structure illustrated in FIG.
17. The width w of each top surface of an electrically conductive
layer 46 is 1/(cos .alpha.) times the uniform thickness t of the
electrically conductive layer 46. Thus, the width w of each top
surface of each electrically conductive layer 46 can be greater
than the uniform thickness t of the respective electrically
conductive layer 46. By increasing the width w of the top surface
of the electrically conductive layers 46 above the thickness of the
electrically conductive layers 46, the overlay requirement during
formation of the word line contact via structures 86 can be
relaxed. Correspondingly, yield and reliability of the contact
between the electrically conductive layers 46 and the word line
contact via structures 86 can be enhanced by employing a non-zero
taper angle .alpha..
[0114] Referring to FIGS. 18A and 18B, a third exemplary structure
according to a third embodiment of the present disclosure can be
derived by modifying the first or second exemplary structure of the
present disclosure such that the dielectric mesa structure 270
includes a plurality of sidewalls that forms a plurality of lateral
indentations. The pattern of the lateral indentations on the
dielectric mesa structure 270 can be formed, for example, by
patterning the masking layer 277 (illustrated in FIGS. 2 and 15)
with indentations, and by transferring the pattern of the masking
layer 277 through the planarization dielectric layer 270 employing
an etch process with, or without, a taper angle. The patterned
portion of the planarization dielectric layer 270L constitutes the
dielectric mesa structure 270. The pattern of the lateral
indentations can be formed inward from the outer sidewalls of the
dielectric mesa structure 270. A gate dielectric layer 12 and an
alternating stack of insulating layers 32 and sacrificial material
layers 42 can be formed over the top surface of the substrate (9,
10), the top surface of the dielectric mesa structure 270, and the
sidewalls of the dielectric mesa structure 270 as in the first and
second embodiments.
[0115] A dielectric cap layer 80 can be formed over a region of the
alternating stack (32, 42) that is laterally offset from the
dielectric mesa structure 270, i.e., within the memory array region
100 as in the first and second embodiments. A peripheral portion of
the alternating stack (32, 42) is removed from above the horizontal
plane including the top surface of the dielectric mesa structure
270, while not removing an array portion of the alternating stack
(32, 42) underneath the horizontal plane that includes the top
surface of dielectric cap layer 80. In one embodiment, the
peripheral portion of the alternating stack (32, 42) can be removed
by a planarization process that employs the dielectric cap layer 80
as a stopping structure as in the first and second embodiments.
Optionally, the planarization process can employ the dielectric
mesa structure 270 as an additional stopping structure.
[0116] The dielectric mesa structure 270 has multiple sets of
sidewalls such that each set of sidewalls forms a respective
lateral indentation having a respective indentation width (IW1,
IW2, IW3). The plurality of lateral indentations can have different
widths so that the innermost material layer that laterally
protrudes into each lateral indentation can be different material
layers within the alternating stack (32, 42). In one embodiment,
the widths of the lateral indentations on the dielectric mesa
structure 270 and the thicknesses of the layers in the alternating
stack (32, 42) can be selected such that each innermost material
layer within the lateral indentations can be sacrificial material
layers 42. Further, the widths of the lateral indentations on the
dielectric mesa structure 270 and the thicknesses of the layers in
the alternating stack (32, 42) can be selected such that each
sacrificial material layer 42 that forms an innermost material
portion within a lateral indentation has a width that is greater
than the width of the top surface of a portion of the respective
sacrificial material layer 42 that extends parallel to the
lengthwise direction of the non-horizontal sub-portions of the
sacrificial material layers 42 within the contact region 20, which
is the second horizontal direction HD2. The first horizontal
direction HD1 is perpendicular to the second horizontal direction
HD2.
[0117] Thus, each spacer material layer (i.e., each sacrificial
material layer 42) can have respective elongated portions that
protrude into respective lateral indentations. The areas of the
innermost material portions can be employed to form word line
contact via structures thereupon, and are herein referred to as
word line contact regions (CA1, CA2, CA3). The word line contact
regions (CA1, CA2, CA3) can have rectangular shapes. In one
embodiment, each innermost material region (which is a portion of a
respective sacrificial material layer 42) within the lateral
indentations can have a width that in a range from 101% to 200%
(such as from 120% to 180%) of the width of the top surface of the
non-horizontal sub-portion of the respective sacrificial material
layer 42 that extends along the second horizontal direction HD2
within the contact region 20.
[0118] Support pillar structures 20 can be formed employing the
same methods as in the first and second embodiments.
[0119] Subsequently, the processing steps of FIGS. 6, 7A, 7B, 8A,
8B, 9, 10, 11, and 12A-12C can be sequentially performed to provide
the structure illustrated in FIGS. 19A and 19B.
[0120] The top surface of a non-horizontal sub-portion of each
electrically conductive layer 46 that extends along the second
horizontal direction HD2 within the contact region 20 can have a
first width w1. The innermost material portion of same electrically
conductive layer 46 within a respective lateral indentation can
have a second width w2, which can be a range from 101% to 200%
(such as from 120% to 180%) of the first width w1. Thus, each word
line contact region (CA1, CA2, CA3) can provide a greater width
than the top surface of the non-horizontal sub-portion of each
electrically conductive layer 46 that extends parallel to at least
one sidewall of the dielectric pillar structure 270 that is most
proximal to the memory stack structures 55. Generally speaking, at
least one of the electrically conductive layers 46 can have a top
surface including a first region located outside of the lateral
indentations and having a first width w1 and a second region
extending into one of the lateral indentations and having a second
width w2 that is greater than the first width w1.
[0121] Referring to FIGS. 20A and 20B, the processing steps of
FIGS. 13A and 13B can be performed to form a contact level
dielectric layer 90, drain contact via structures 88, word line
contact via structures 86, and the device contact via structures
8P. The word line contact via structures 88 can be formed within
the word line contact regions (CA1, CA2, CA3) with a greater overly
tolerance during lithographic patterning of via cavities for the
word line contact via structures 88. Subsequently, the processing
steps of FIGS. 14A and 14B can be performed.
[0122] Referring to FIG. 21, an alternate embodiment of the third
exemplary structure is illustrated at the processing steps of FIGS.
19A and 19B. In the alternate embodiment, the lateral indentations
can be formed with different lateral indentation depths (LID1,
LID2, LID3). Further, the support pillar structures 20 may be
omitted if collapse of the non-horizontal sub-portions of the
insulating layers 32 can be prevented during replacement of the
sacrificial material layers 42 with electrically conductive layers
46.
[0123] Referring to FIG. 22, a fourth exemplary structure according
to a fourth embodiment of the present disclosure can be derived
from any of the first, second, and third exemplary structure by
employing electrically conductive layers 46 as the spacer material
layers at the processing steps of formation of an alternating stack
of insulating layers and spacer material layers, i.e., at the
processing steps of FIG. 3, FIG. 16, or FIGS. 18A and 18B. In other
words, an alternating stack of insulating layers 32 and spacer
material layers as embodied as the electrically conductive layers
46 can be formed over a top surface of the substrate (9, 10), the
top surface of the dielectric mesa structure 270, and the at least
one sidewall of the dielectric mesa structure 270. The alternating
stack of insulating layers 32 and electrically conductive layers
include an array portion AP, a non-horizontally extending portion
NHP, and a peripheral portion PP.
[0124] Each of the electrically conductive layers 46 comprises a
respective continuously-extending conductive material portion of a
homogeneous composition that includes a respective horizontal
sub-portion that extends parallel to the top surface of the
substrate (9, 10) and a respective non-horizontal sub-portion that
extends parallel to the at least one sidewall of the dielectric
mesa structure 270. In one embodiment, each electrically conductive
layer 46 can include a metallic liner layer 146A that include the
metallic liner material (such as a conductive metal nitride) and a
metallic material layer 146B that includes a metallic material
(such as an elemental metal or an intermetallic alloy). In this
case, each metallic material layer 146B within the electrically
conductive layers 46 is a continuously-extending conductive
material portion of a homogeneous composition that includes a
respective horizontal sub-portion that extends parallel to the top
surface of the substrate (9, 10) (and located within a first
horizontal sub-portion 46H of the respective electrically
conductive layer 46) and a respective non-horizontal sub-portion
that extends parallel to the at least one sidewall of the
dielectric mesa structure 270 (and located within a non-horizontal
sub-portion 46V of the respective electrically conductive layer
46). Further, each metallic liner layer 146A within the
electrically conductive layers 46 is a continuously-extending
conductive material portion of a homogeneous composition that
includes a respective horizontal sub-portion that extends parallel
to the top surface of the substrate (9, 10) (and located within a
first horizontal sub-portion 46H of the respective electrically
conductive layer 46) and a respective non-horizontal sub-portion
that extends parallel to the at least one sidewall of the
dielectric mesa structure 270 (and located within a non-horizontal
sub-portion 46V of the respective electrically conductive layer
46). Each of the continuously-extending conductive material
portions, as embodied as a metallic liner layer 146A or as a
metallic material layer 146B, is free of any physical interface
therein.
[0125] Referring to FIG. 23, backside trenches can be formed in
regions of the backside trenches 79 of the first through third
embodiments by application of a photoresist layer, patterning of
the photoresist layer, transfer of the pattern of openings in the
photoresist layer through the alternating stack (32, 46), and
removal of the photoresist layer. An insulating spacer 74 can be
formed within each backside trench by deposition and anisotropic
etching of a conformal dielectric material layer. Source regions 61
can be formed by implantation of electrical dopants. Each surface
portion of the doped semiconductor well 10 that is located between
each source region 61 and vertical semiconductor channels 60 within
adjacent memory stack structures 55 constitutes a horizontal
semiconductor channel 59. A backside contact via structure 76 can
be formed within each backside trench by deposition of a conductive
material and removal of the excess conductive material from above
the alternating stack (32, 42).
[0126] Referring to FIG. 24, at least one select gate level
conductive layer 146 and at least one additional insulating layer
32 can be optionally formed over the alternating stack (32, 42) by
conformal deposition processes. In one embodiment, the select gate
level conductive layer 146 can be formed from a different material
than the electrically conductive layers 46. For example, layer 146
may comprise heavily doped polysilicon. The select gate level
conductive layer 146 functions as a drain side select gate
electrode of the NAND device.
[0127] Referring to FIG. 25, the processing steps of FIG. 6 can be
performed to form memory openings. A top surface of the substrate
(9, 10) is physically exposed at a bottom of each of the memory
openings. Subsequently, the processing steps of FIGS. 7A and 7B can
be performed to form memory stack structures 55, dielectric cores
62, and drain regions 63. Each of the memory stack structures 55
comprises a memory film 50 and a vertical semiconductor channel
60.
[0128] Referring to FIG. 26, a dielectric cap layer 80 can be
formed over the first horizontal sub-portions of the insulating
layers 32 and the electrically conductive layers 46 in the memory
array region 100. The dielectric cap layer 80 can be deposited by a
self-planarizing process such as spin coating. For example, the
dielectric cap layer 80 can include spin-on glass (SOG). The
thickness of the dielectric cap layer 80 can be selected such that
the top surface of the dielectric cap layer 80 is formed at, or
below, the horizontal plane including the top surface of the
dielectric mesa structure 270. Thus, the dielectric cap layer 80 is
formed over a region of the alternating stack (32, 46) that is
laterally offset from the dielectric mesa structure 270.
Alternatively, the dielectric cap layer 80 may comprise a silicon
nitride or silicon oxynitride etch stop layer deposited over the
peripheral portion PP, the non-horizontally extending portion NHP
and the array portion AP of the alternating stack (32, 42).
[0129] The peripheral portion PP of the alternating stack (32, 46)
is removed by a planarization process that employs the dielectric
cap layer 80 as a stopping structure. For example, the peripheral
portion PP of the alternating stack (32, 46) can be removed from
above the horizontal plane including the top surface of the
dielectric mesa structure 270, while the array portion AP of the
alternating stack (32, 46) underneath the horizontal plane is not
removed. In one embodiment, a patterned recess etch may be
employed. In this case, a photoresist layer may be applied and to
cover the area overlying the dielectric cap layer 80 and not to
cover the peripheral portion PP of the alternating stack (32, 46),
and an isotropic etch or an anisotropic etch may be performed to
remove the peripheral portion PP of the alternating stack (32, 46)
while the photoresist layer protects the array portion AP of the
alternating stack (32, 46). The photoresist layer can be
subsequently removed, for example, by ashing. Additionally or
alternatively, chemical mechanical planarization (CMP) can be
employed to remove all, or a residual portion, of the peripheral
portion PP of the alternating stack (32, 46).
[0130] Use of the dielectric cap layer 80 as a stopping structure
during the planarization process can provide a planarized structure
in which top surfaces of the various layers in the non-horizontally
extending portion NHP of the alternating stack (32, 46) are within
the same horizontal plane as a top surface of the dielectric cap
layer 80, which may be recessed with respect to the top surface of
the dielectric cap layer 80 as formed at the processing step of
FIG. 3. Optionally, the dielectric mesa structure 270 may be
employed as an additional stopping structure during the
planarization process. In one embodiment, the top surfaces of the
remaining portions of the dielectric cap layer 80, the
non-horizontally extending portion NHP of the alternating stack
(32, 46), and the dielectric mesa structure 270 can be located
within a same horizontal plane after the planarization process.
However, the non-horizontally extending portion NHP of the
alternating stack (32, 46) can be recessed below the horizontal
plane of the top of the mesa structure 270 during the etching
and/or planarization step(s). Top surfaces of the electrically
conductive layers 46 are physically exposed at the horizontal plane
including the top surface of the dielectric cap layer 80.
[0131] Referring to FIG. 27, the processing steps of FIGS. 13A,
13B, 14A, and 14B can be performed with a modification that extends
the drain contact via structures 88 through the contact level
dielectric layer 90 and the dielectric cap layer 80.
[0132] The features of the various embodiments of the present
disclosure can be combined into a same structure. For example, the
features of the first, second, and third exemplary structures can
be combined to provide an exemplary structure illustrated in FIG.
28, which includes dielectric pillar structures 20 from the first
and second embodiment, at least one tapered sidewall of a
dielectric mesa structure 270 from the second embodiment, and
lateral indentations formed on the dielectric mesa structure and at
least one electrically conductive layers 46 having a top surface
including a first region located outside of the lateral
indentations (and off the plane of the vertical cross-sectional
view of FIG. 28) and having a first width and a second region R2
extending into one of the lateral indentations and having a second
width that is greater than the first width.
[0133] Each of the various embodiments of the present disclosure
provides a three-dimensional memory device comprising: a mesa
structure 270 located over a substrate (9, 10) and having a top
surface and at least one dielectric sidewall; an alternating stack
(32, 46) of insulating layers 32 and electrically conductive layers
46 located over the substrate (9, 10) and on the at least one
sidewall of the dielectric mesa structure 270, wherein each of the
electrically conductive layers 46 comprises a respective
continuously-extending conductive material portion (46A, 46B, 146A,
or 146B) of a homogeneous composition that includes a respective
horizontal sub-portion that extends parallel to a top surface of
the substrate (9, 10) and a respective non-horizontal sub-portion
that extends parallel to the at least one sidewall of the
dielectric mesa structure 270; memory stack structures 55 extending
through a region of the alternating stack (32, 42) that includes
the horizontal sub-portions of the electrically conductive layers
46, wherein each of the memory stack structures 55 comprises a
memory film 50 and a vertical semiconductor channel 60; and word
line contact via structures 86 that contact top surfaces of
non-horizontal sub-portions of the electrically conductive layers
46 and embedded in a contact level dielectric layer 90 overlying
the alternating stack (32, 46).
[0134] In one embodiment, the mesa structure 270 comprises a
dielectric mesa structure, and each of the continuously-extending
conductive material portions (46A, 46B, 146A, or 146B) is free of
any physical interface therein. In one embodiment, a top surface of
the dielectric mesa structure 270 and a top surface of a first
region of the alternating stack (32, 46) that includes the
non-horizontal sub-portions 46V of the electrically conductive
layers 46 (i.e., the portion of the alternating stack (32, 46)
within the contact region 200) are located within a first
horizontal plane that is parallel to the top surface of the
substrate (9, 10). In one embodiment, a topmost surface of a second
region of the alternating stack (32, 46) that includes the
horizontal sub-portions 46H of the electrically conductive layers
46 (i.e., the portion of the alternating stack (32, 46) in the
memory array region 100) is located within a second horizontal
plane that is located below the first horizontal plane, i.e., at
the horizontal plane including the bottom surface of the dielectric
cap layer 80. In one embodiment, a dielectric cap layer 80 can
overlie the second region of the alternating stack (32, 46). Drain
contact via structures 88 extend through the dielectric cap layer,
overly the memory stack structures 55, and can have a top surface
located within the first horizontal plane.
[0135] In one embodiment, each electrically conductive layer has a
respective uniform thickness throughout a respective horizontal
sub-portion and a region of a respective non-horizontal
sub-portion. The three-dimensional memory device can further
include a semiconductor device 700 located on the substrate (9,
10); a device contact via structure 8P extending through the
dielectric mesa structure 270 and contacting the semiconductor
device 700; and an interconnect line structure 96 contacting a top
surface of the device contact via structure 8P and one of the word
line contact via structures 86.
[0136] In one embodiment, each layer within the alternating stack
(32, 46) includes as many openings therethrough as a total number
of the memory stack structures 55 that the layer laterally
surrounds, and each of the memory stack structures 55 is laterally
surrounded by each layer within the alternating stack (32, 46).
[0137] In one embodiment, the three-dimensional memory device can
include support pillar structures 20 extending through a first
region of the alternating stack (32, 46) that includes the
non-horizontal sub-portions of the electrically conductive layers
46 and laterally separating a subset of the electrically conductive
layers 46.
[0138] In one embodiment, the at least one sidewall of the
dielectric mesa structure 270 can have a taper angle in a range
from 30 degrees to 75 degrees with respect to a vertical direction
that is perpendicular to the top surface of the substrate (9,
10).
[0139] In one embodiment, the at least one sidewall of the
dielectric mesa structure 270 comprises multiple sets of sidewalls;
each set of sidewalls forms a respective lateral indentation having
a respective indentation width; and the electrically conductive
layers 46 have respective elongated portions that protrude into
respective lateral indentations. In one embodiment, one of the
electrically conductive layers 46 has a top surface including a
first region located outside of the lateral indentations and having
a first width and a second region extending into one of the lateral
indentations and having a second width that is greater than the
first width.
[0140] In one embodiment, the three-dimensional memory structure
comprises a vertical NAND memory device. The electrically
conductive layers 46 can comprise, or can be electrically connected
to, a respective word line of the monolithic three-dimensional NAND
memory device. The substrate (9, 10) can comprise a silicon
substrate. The vertical NAND memory device can comprise an array of
monolithic three-dimensional NAND strings over the silicon
substrate. At least one memory cell (as embodied as a portion of a
charge storage layer 54 at a level of an electrically conductive
layer 46) in a first device level of the array of monolithic
three-dimensional NAND strings can be located over another memory
cell (as embodied as another portion of a charge storage layer 54
at a level of another electrically conductive layer 46) in a second
device level of the array of monolithic three-dimensional NAND
strings. The silicon substrate can contain an integrated circuit
comprising a driver circuit for the memory device located thereon.
The electrically conductive layers 46 can comprise a plurality of
control gate electrodes having a strip shape extending
substantially parallel to the top surface of the substrate (9, 10),
e.g., along the first horizontal direction HD1 between a pair of
backside trenches 79. The plurality of control gate electrodes
comprises at least a first control gate electrode located in a
first device level and a second control gate electrode located in a
second device level. The array of monolithic three-dimensional NAND
strings can comprise: a plurality of semiconductor channels (59,
60), wherein at least one end portion 60 of each of the plurality
of semiconductor channels (59, 60) extends substantially
perpendicular to a top surface of the substrate (9, 10); and a
plurality of charge storage elements (as embodied as portions of
the charge storage layer 54 that are located at each level of the
electrically conductive layers 46). Each charge storage element can
be located adjacent to a respective one of the plurality of
semiconductor channels (59, 60).
[0141] The various embodiments of the present disclosure provide
schemes for formatting an alternating stack of insulating layers 32
and electrically conductive layers 42 such that end portions of the
electrically conductive layers 42 extend along a non-horizontal
direction and provide top surfaces within a same horizontal plane
that is elevated at least to the height of the top surfaces of
drain regions 63 that are formed in memory openings 49. The
electrically conductive layers 46 including non-horizontal
sub-portions function as angled word lines that facilitate
formation of word line contact via structures 88 thereupon. Thus,
formation of staircases or a terrace region in which electrically
conductive layers 46 extent to different lateral extents is not
necessary. By eliminating the need to form a terrace region, the
various embodiments of the present disclosure can simplify the
process flow for manufacture of word line contact via structures,
and thus, reduce the manufacturing cost and/or enhance the yield
and/or reliability of the word line contact via structures 86 of a
three-dimensional memory device.
[0142] Although the foregoing refers to particular preferred
embodiments, it will be understood that the disclosure is not so
limited. It will occur to those of ordinary skill in the art that
various modifications may be made to the disclosed embodiments and
that such modifications are intended to be within the scope of the
disclosure. Where an embodiment employing a particular structure
and/or configuration is illustrated in the present disclosure, it
is understood that the present disclosure may be practiced with any
other compatible structures and/or configurations that are
functionally equivalent provided that such substitutions are not
explicitly forbidden or otherwise known to be impossible to one of
ordinary skill in the art. All of the publications, patent
applications and patents cited herein are incorporated herein by
reference in their entirety.
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