U.S. patent application number 15/358568 was filed with the patent office on 2018-03-01 for heat exchanger puck.
The applicant listed for this patent is Intel Corporation. Invention is credited to AARON P. ANDERSON, JOSEPH A. BRODERICK, JUAN G. CEVALLOS, BARRETT M. FANEUF, EMERY E. FREY, BRIAN S. JARRETT, ERIC D. MCAFEE, PEI-FANG SUNG.
Application Number | 20180058777 15/358568 |
Document ID | / |
Family ID | 61240404 |
Filed Date | 2018-03-01 |
United States Patent
Application |
20180058777 |
Kind Code |
A1 |
ANDERSON; AARON P. ; et
al. |
March 1, 2018 |
HEAT EXCHANGER PUCK
Abstract
Apparatuses and methods associated with heat exchanger puck
design are disclosed herein. In embodiments, a heat exchanger puck
may include a first plate with a cavity that extends into the first
plate from a side of the first plate and a second plate. The second
plate may be coupled to the side of the first plate, with the
cavity located between the first plate and the second plate. The
heat exchanger puck may further include a tube of a liquid coolant
system located, at least partially, within the cavity, the tube
formed to fit the cavity created by the first plate and the second
plate. Other embodiments may be described and/or claimed.
Inventors: |
ANDERSON; AARON P.;
(Beaverton, OR) ; BRODERICK; JOSEPH A.; (Portland,
OR) ; FANEUF; BARRETT M.; (Beaverton, OR) ;
MCAFEE; ERIC D.; (Portland, OR) ; JARRETT; BRIAN
S.; (Hillsboro, OR) ; CEVALLOS; JUAN G.;
(Hillsboro, OR) ; SUNG; PEI-FANG; (Hillsboro,
OR) ; FREY; EMERY E.; (Portland, OR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Intel Corporation |
Santa Clara |
CA |
US |
|
|
Family ID: |
61240404 |
Appl. No.: |
15/358568 |
Filed: |
November 22, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62380167 |
Aug 26, 2016 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28F 3/12 20130101; H01L
21/4882 20130101; F28D 2021/0028 20130101; F28F 9/26 20130101; F28F
2275/12 20130101; F28F 2255/10 20130101; H01L 23/473 20130101; F28F
2275/025 20130101; F28D 15/00 20130101; F28F 1/025 20130101; F28F
2275/125 20130101 |
International
Class: |
F28F 9/26 20060101
F28F009/26; F28F 3/12 20060101 F28F003/12; F28F 1/02 20060101
F28F001/02; F28D 15/00 20060101 F28D015/00 |
Claims
1. A heat exchanger puck, comprising: a first plate of the heat
exchanger puck with a cavity that extends into the first plate from
a side of the first plate; a second plate of the heat exchanger
puck coupled to the side of the first plate with the cavity located
between the first plate and the second plate; and a tube of a
liquid coolant system located, at least partially, within the
cavity, the tube formed to fit the cavity created by the first
plate and the second plate.
2. The heat exchanger puck of claim 1, wherein the first plate is
to contact the tube around a first portion of a circumference of
the tube and the second plate is to contact the tube around a
second portion of the circumference.
3. The heat exchanger puck of claim 2, wherein the first portion of
the circumference and the second portion of the circumference
together are an entirety of the circumference of the tube.
4. The heat exchanger puck of claim 1, wherein the cavity is a
first cavity, and wherein the second plate comprises a second
cavity that extends into the second plate from a side of the second
plate coupled to the first plate, wherein the second cavity is
aligned with the first cavity, to at least partially receive the
tube.
5. The heat exchanger puck of claim 1, wherein a width of the
cavity increases as the cavity extends into the first plate from
the side of the first plate, and wherein a side wall of the first
plate contacts the tube where the width of the cavity has increased
from the side of the first plate.
6. The heat exchanger puck of claim 1, wherein the first plate and
the second plate are cold plates.
7. The heat exchanger puck of claim 1, wherein the tube is formed
to a pentagon shape.
8. The heat exchanger puck of claim 1, wherein the tube is formed
to fit the cavity created by the first plate and the second plate
while the tube resides within the cavity created by the first plate
and the second plate.
9. A liquid coolant system, comprising: a tube to carry liquid
coolant within the liquid coolant system; a pump coupled to the
tube to provide pressure to move the liquid coolant within the
tube; and a heat exchanger puck coupled to a portion of the tube,
the portion of the tube located within a cavity of the heat
exchanger puck and formed to fit the cavity by the heat exchanger
puck, wherein the heat exchanger puck is to be attached to an
electronic component.
10. The liquid coolant system of claim 9, wherein the portion of
the tube is formed to a shape based on a predetermined pressure
drop associated with the portion of the tube.
11. The liquid coolant system of claim 9, wherein the heat
exchanger puck includes a first plate and a second plate, the
cavity of the heat exchanger puck formed between the first plate
and the second plate, and wherein the portion of the tube is formed
to fit the cavity by the first plate and the second plate as the
first plate is affixed to the second plate.
12. The liquid coolant system of claim 9, wherein the heat
exchanger puck includes a first plate and a second plate, the
cavity of the heat exchanger puck formed between the first plate
and the second plate, and wherein the first plate and the second
plate are constructed of thermal conductive material to transfer
heat to the liquid coolant carried within the tube.
13. A method of manufacturing a heat exchanger puck, comprising:
compressing a first plate of the heat exchanger puck and a second
plate of the heat exchanger puck together, the first plate and the
second plate forming a cavity between the first plate and the
second plate, wherein a portion of a tube of a liquid coolant
system is located within the cavity and the compression causes the
portion of the tube to deform; affixing the second plate to the
side of the first plate.
14. The method of claim 13, further comprising: applying epoxy to
the side of the first plate, wherein affixing the second plate to
the side of the first plate includes curing the epoxy while the
first plate and the second plate are compressed together.
15. The method of claim 13, further comprising: reducing a
thickness of the first plate by a flycut process applied to the
first plate after affixing of the second plate to the side of the
first plate.
16. The method of claim 13, further comprising: hydroforming the
portion of the tube to the first plate and the second plate after
affixing the second plate to the side of the first plate.
17. The method of claim 16, wherein the hydroforming of the portion
of the tube causes a circumference of the portion of the tube to
expand.
18. The method of claim 17, wherein the circumference of the
portion of the tube expands to fill the cavity.
19. The method of claim 16, wherein the hydroforming of the portion
of the tube causes a reduction in tube wall thickness of the
portion of the tube.
20. The method of claim 13, further comprising attaching the heat
exchanger puck to an electronic component to be cooled by the heat
exchanger puck.
21. A method of manufacturing a heat exchanger puck, comprising:
affixing a first portion of the heat exchanger puck to a second
portion of the heat exchanger puck with a portion of a tube of a
liquid coolant system located in a cavity formed between the first
portion and the second portion of the heat exchanger puck; and
hydroforming the portion of the tube within the cavity.
22. The method of claim 21, further comprising: applying a thermal
epoxy to the first portion of the heat exchanger puck; and
compressing the first portion and the second portion of the heat
exchanger puck together, wherein affixing the first portion of the
heat exchanger puck to the second portion of the heat exchanger
puck includes curing the thermal epoxy while the first portion and
the second portion of the heat exchanger puck are compressed
together.
23. The method of claim 21, further comprising: machining the first
portion of the heat exchanger puck with a first portion of the
cavity extending into the first portion of the heat exchanger puck;
and machining the second portion of the heat exchanger puck with a
second portion of the cavity extending into the second portion of
the heat exchanger puck, wherein affixing the first portion of the
heat exchanger puck to the second portion of the heat exchanger
puck includes aligning the first portion of the cavity with the
second portion of the cavity while affixing the first portion of
the heat exchanger puck to the second portion of the heat exchanger
puck.
24. The method of claim 21, further comprising: applying a force to
one or both of the first portion of the heat exchanger puck and the
second portion of the heat exchanger puck to maintain affixation of
the first portion of the heat exchanger puck to the second portion
of the heat exchanger puck while hydroforming the portion of the
tube; and removing the force after hydroforming the portion of the
tube.
25. The method of claim 21, wherein hydroforming the portion of the
tube includes expanding the tube to fill the cavity.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims priority to U.S. Provisional
Patent Application No. 62/380,167, filed Aug. 26, 2016 and titled
"HEAT EXCHANGER PUCK," the entire disclosure which is hereby
incorporated by reference.
TECHNICAL FIELD
[0002] The present disclosure relates to the field of electronic
circuits. More particularly, the present disclosure relates to heat
exchanger puck with hydroformed tubing for a liquid coolant
system.
BACKGROUND
[0003] The background description provided herein is for the
purpose of generally presenting the context of the disclosure.
Unless otherwise indicated herein, the materials described in this
section are not prior art to the claims in this application and are
not admitted to be prior art by inclusion in this section.
[0004] Manufacture of legacy heat exchanger pucks involve use of
dies to form tubes of a liquid coolant system prior to affixation
of the tubes within the heat exchanger pucks. After the tubes are
formed into a predetermined shape for affixation within the heat
exchanger puck, an upper plate and a lower plate of the heat
exchanger puck are affixed around the tube, with the upper plate
and the lower plate forming a cavity with the predetermined shape
in which the tube is located.
[0005] In addition to additional time required to complete this
two-step process, often the tube does not mate cleanly with one or
both of the plates of the heat exchanger puck. When the tube does
not mate cleanly, air is introduced between the tube and one or
both of the plates, resulting in a lower amount of heat transfer
between the plates and the tube. The inefficiency in heat transfer
causes compensation to be performed in designs utilizing the heat
exchanger puck, such as requiring reduced operation of the computer
system to produce less heat.
[0006] Further, by forming the tube prior to placement within the
heat exchanger puck, the predetermined shapes that the tube could
be formed to are limited. As the plates are affixed around the tube
after the tube is formed, the cavity or cavities formed in one or
both of the plates either need to remain the same width or decrease
in width as the cavity extends into the corresponding plate such
that the tube does not conflict with the walls of the cavity as the
tube is inserted. Correspondingly, the shape of the tube must
either remain the same width or decrease in width towards the edge
of the tube being inserted into the cavity to avoid conflicts with
the walls of the cavity.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Embodiments will be readily understood by the following
detailed description in conjunction with the accompanying drawings.
To facilitate this description, like reference numerals designate
like structural elements. Embodiments are illustrated by way of
example, and not by way of limitation, in the figures of the
accompanying drawings.
[0008] FIG. 1 illustrates an example heat exchanger puck, according
to various embodiments.
[0009] FIG. 2 illustrates an example assembly of the heat exchanger
puck of FIG. 1, according to various embodiments.
[0010] FIG. 3 illustrates a cross-sectional view of example heat
exchanger puck components, according to various embodiments.
[0011] FIG. 4 illustrates a cross-sectional view of an example heat
exchanger puck, according to various embodiments.
[0012] FIG. 5 illustrates a cross-sectional view of an example heat
exchanger puck resulting from a thinning process applied to the
heat exchanger puck of FIG. 4, according to various
embodiments.
[0013] FIG. 6 illustrates the example heat exchanger puck of FIG. 5
coupled to a component to be cooled, according to various
embodiments.
[0014] FIG. 7 illustrates an example process of manufacturing a
heat exchanger puck, according to various embodiments.
[0015] FIG. 8 illustrates a cross-sectional view of an example heat
exchanger puck prior to hydroformation, according to various
embodiments.
[0016] FIG. 9 illustrates a cross-sectional view of the example
heat exchanger puck of FIG. 8 after hydroformation, according to
various embodiments.
[0017] FIG. 10 illustrates an example process of manufacturing a
heat exchanger puck with hydroformed tube, according to various
embodiments.
[0018] FIG. 11 illustrates a cross-sectional view of an example
heat exchanger puck with hydroform tooling mold before
hydroforming, according to various embodiments.
[0019] FIG. 12 illustrates a cross-sectional view of the example
heat exchanger puck of FIG. 11 with the hydroform tooling mold
after hydroforming, according to various embodiments.
[0020] FIG. 13 illustrates a cross-sectional of the example heat
exchanger puck of FIG. 11 without the hydroform tooling mold after
hydroforming, according to various embodiments.
[0021] FIG. 14 illustrates an example process of hydroforming a
tube with hydroform tooling mold, according to various
embodiments.
[0022] FIG. 15 illustrates a cross-sectional view of an example
heat exchanger puck with butterfly cavity, according to various
embodiments.
[0023] FIG. 16 illustrates example tube shapes that may be produced
by the hydroforming process, according to various embodiments.
[0024] FIG. 17 illustrates a cross-sectional view of an example
portion of a heat exchanger puck with ridged cavity, according to
various embodiments.
[0025] FIG. 18 illustrates example ridged, hydroformed tube shapes,
according to various embodiments.
[0026] FIG. 19 illustrates a cross-sectional view of an example
heat exchanger puck with an affixing hydroformed tube, according to
various embodiments.
[0027] FIG. 20 illustrates a cross-sectional view of an example
heat exchanger puck prior to compression of an upper plate and a
lower plate, according to various embodiments.
[0028] FIG. 21 illustrates a cross-sectional view of the example
heat exchanger puck of FIG. 20 after compression of the upper plate
and the lower plate, according to various embodiments.
[0029] FIG. 22 illustrates a cross-sectional view of the example
heat exchanger puck of FIG. 20 after hydroforming process,
according to various embodiments.
[0030] FIG. 23 illustrates a cross-sectional view of the example
heat exchanger puck of FIG. 20 after removal of the lower plate,
according to various embodiments.
[0031] FIG. 24 illustrates a cross-sectional view of the example
heat exchanger puck of FIG. 20 coupled to a component, according to
various embodiments.
[0032] FIG. 25 illustrates an example process of producing the heat
exchanger puck of FIG. 20, according to various embodiments.
[0033] FIG. 26 illustrates an example liquid coolant system that
may employ a heat exchanger puck, according to various
embodiments.
[0034] FIG. 27 illustrates an example liquid coolant system,
according to various embodiments.
[0035] FIG. 28 illustrates an example unassembled electronic
environment with liquid coolant system, according to various
embodiments.
[0036] FIG. 29 illustrates the example assembled electronic
environment with liquid coolant system of FIG. 28, according to
various embodiments.
[0037] FIG. 30 illustrates an example liquid coolant system applied
to electronic components extending varying distances from a printed
circuit board, according to various embodiments.
[0038] FIG. 31 illustrates an example apparatus for a liquid
coolant system, according to various embodiments.
[0039] FIG. 32 illustrates an example tube assembly for a liquid
coolant system, according to various embodiments.
[0040] FIG. 33 illustrates an example tube union, according to
various embodiments.
[0041] FIG. 34 illustrates an example computer device that may
employ the apparatuses and/or methods described herein.
DETAILED DESCRIPTION
[0042] Apparatuses and methods associated with heat exchanger puck
design are disclosed herein. In embodiments, a heat exchanger puck
may include a first plate with a cavity that extends into the first
plate from a side of the first plate and a second plate. The second
plate may be coupled to the side of the first plate, with the
cavity located between the first plate and the second plate to
receive a tube of a liquid coolant system, with the tube located,
at least partially, within the cavity and hydroformed with the
second plate coupled to the first plate.
[0043] In the following detailed description, reference is made to
the accompanying drawings which form a part hereof wherein like
numerals designate like parts throughout, and in which is shown by
way of illustration embodiments that may be practiced. It is to be
understood that other embodiments may be utilized and structural or
logical changes may be made without departing from the scope of the
present disclosure. Therefore, the following detailed description
is not to be taken in a limiting sense, and the scope of
embodiments is defined by the appended claims and their
equivalents.
[0044] Aspects of the disclosure are disclosed in the accompanying
description. Alternate embodiments of the present disclosure and
their equivalents may be devised without parting from the spirit or
scope of the present disclosure. It should be noted that like
elements disclosed below are indicated by like reference numbers in
the drawings.
[0045] Various operations may be described as multiple discrete
actions or operations in turn, in a manner that is most helpful in
understanding the claimed subject matter. However, the order of
description should not be construed as to imply that these
operations are necessarily order dependent. In particular, these
operations may not be performed in the order of presentation.
Operations described may be performed in a different order than the
described embodiment. Various additional operations may be
performed and/or described operations may be omitted in additional
embodiments.
[0046] For the purposes of the present disclosure, the phrase "A
and/or B" means (A), (B), or (A and B). For the purposes of the
present disclosure, the phrase "A, B, and/or C" means (A), (B),
(C), (A and B), (A and C), (B and C), or (A, B and C).
[0047] The description may use the phrases "in an embodiment," or
"in embodiments," which may each refer to one or more of the same
or different embodiments. Furthermore, the terms "comprising,"
"including," "having," and the like, as used with respect to
embodiments of the present disclosure, are synonymous.
[0048] As used herein, the term "circuitry" may refer to, be part
of, or include an Application Specific Integrated Circuit (ASIC),
an electronic circuit, a processor (shared, dedicated, or group)
and/or memory (shared, dedicated, or group) that execute one or
more software or firmware programs, a combinational logic circuit,
and/or other suitable components that provide the described
functionality.
[0049] The terms "upper plate" and "lower plate" are used herein to
refer to plates of heat exchanger pucks. The terms "upper plate"
and "lower plate" are used for differentiating the plates and do
not necessarily imply or explicitly state an orientation of the
plates and/or the heat exchanger pucks disclosed herein.
[0050] The terms "upper mold" and "lower mold" are used herein to
refer to portions of a hydroform tooling mold. The terms "upper
mold" and "lower mold" are used for differentiating the molds and
do not necessarily imply or explicitly state an orientation of the
molds and/or the hydroform tooling mold disclosed herein.
[0051] FIG. 1 illustrates an example heat exchanger puck 100,
according to various embodiments. The heat exchanger puck 100 may
include a body 102 to receive a tube 104 of a liquid coolant system
routed within the body 102. The tube 104 may enter a cavity and/or
cavities formed within the body 102 and may be routed within the
cavity to a point where the tube 104 exits the body 102.
[0052] The heat exchanger puck 100 may be utilized for cooling a
component (such as, an electronic component) within a computer
environment, an electrical environment, an electro-optical
environment, or some combination thereof (which may be generically
referred to as `electronic environment`). The body 102 of the heat
exchanger puck 100 may be affixed to the component to be cooled and
may provide heat transfer between the component and the tube 104.
In some embodiments, a thermal transfer compound and/or thermal
transfer apparatus may be located intermediate to the component and
the body 102 to facilitate heat transfer between the component and
the body 102.
[0053] As will described further throughout this disclosure, the
body 102 of the heat exchanger puck 102 may be made of a material
with relatively high heat transfer characteristics, such as carbon
steel, stainless steel, copper, bronze, brass, titanium, aluminum,
thermally conductive polymers, heat conducting plastics, various
alloys, or some combination thereof. In some embodiments, the body
102 may include an outer shell made of a durable, high strength
metal, such as carbon steel, stainless steel, aluminum, thermally
conductive polymers, heat conducting plastics, or some combination
thereof. The type of material used for the body 102 may be selected
based on desired heat transfer characteristics of the heat
exchanger puck 100.
[0054] The tube 104 may be made of a material with relatively high
heat transfer characteristics and that is resistive to corrosion,
such as copper, stainless steel, a copper/nickel alloy, or some
combination thereof. The tube 104 may carry liquid from the liquid
coolant system within the tube 104. Heat received by the tube 104
from the body 102 may be transferred to the liquid within the tube
104 and the liquid coolant system may circulate the liquid in the
tube 104 away from the body 102, the liquid carrying the heat with
it away from the body 102. In some embodiments, the tube 104 may be
hydroformed within the cavity and/or cavities of the body 102
increasing an amount of contact between the tube 104 and the body
102, which may facilitate the transfer of heat from the body 102 to
the tube 104. The process of hydroforming is described in more
detail throughout this disclosure.
[0055] FIG. 2 illustrates an example assembly 200 of the heat
exchanger puck 100 of FIG. 1, according to various embodiments. The
assembly 200 may include components 202. Components 202 may include
an upper plate 204, a lower plate 206, a tube 208, or some
combination thereof. In some embodiments, the components 202 may
further include one or more fasteners and/or fastener assemblies
212 to affix the upper plate 204 to the lower plate and/or to mount
the heat exchanger puck 100 in the computer environment and/or
electrical environment. The reference of plate 204 and 206 as upper
and lower plates are merely for ease of understanding, and shall
not be construed as limiting on the present disclosure.
[0056] The upper plate 204 may include one or more of the features
of the body 102 (FIG. 1), including being made of a material with
relatively high heat transfer characteristics. The upper plate 204
may have a larger footprint than, or a same size footprints as, the
lower plate 206, such that the edges of the upper plate 204 are
parallel to or overhang the edges of the lower plate 206 when
affixed to each other. In some embodiments, the upper plate 204 may
include one or more apertures 214 to receive fasteners and/or
fastener assemblies 212 for affixing the upper plate 204 to the
lower plate 206 and/or mounting the heat exchanger puck 100 to the
component to be cooled within the computer environment, and/or
within the electrical environment.
[0057] The lower plate 206 may include one or more of the features
of the body 102 (FIG. 1), including being made of a material with
relatively high heat transfer characteristics. The lower plate 206
may include one or more cavities 210. The cavities 210 may extend
into the lower plate 206 from a side of the lower plate 206. In
some embodiments, the upper plate 204 may also include one or more
cavities that, when the upper plate 204 and the lower plate 206 are
affixed to each other, align with the one or more cavities 210 of
the lower plate 206. Further, in some embodiments, the lower plate
206 may include one or more apertures 216 to receive fasteners
and/or fastener assemblies 212 for affixing the lower plate 206 to
the upper plate 204 and/or mounting the heat exchanger puck 100 to
the component to be cooled within the computer environment, and/or
within the electrical environment.
[0058] The tube 208 may be relatively rigid, although may flex when
force is applied without breaking or allowing liquid within the
tube 208 to leak. The amount of compliance of the tube 208 may
depend on the material the tube 208 is made of and/or the shape of
the tube 208.
[0059] During assembly of the heat exchanger puck 100, portions of
the tube 208 may be positioned within the cavities 210 of the lower
plate 206. The portions of the tube 208 may become affixed in the
cavities 210 through frictional force when the upper plate 204 is
affixed to the lower plate 206. In some embodiments, epoxy (such as
thermal transfer epoxy) may be applied to one or more of the upper
plate 204, the lower plate 206, and the tube 208 and the epoxy may
affix two or more of the upper plate 204, the lower plate 206, and
the tube 208 together. The epoxy may be cured (such as by heat,
light, chemically, or some combination thereof) while the upper
plate 204 is compressed to the lower plate 206 with the tube 208
positioned in the cavities 210 of the lower plate 206. The tube 208
may flex and/or deform without breaking when the upper plate 204 is
compressed to and/or affixed to the lower plate 206. In some
embodiments, a thermal interface material, brazing parts, or some
combination thereof may be applied to and/or added to the one or
more of the upper plate 204, the lower plate 206, and the tube 208
in lieu of or in addition to the epoxy.
[0060] In the example illustrated, straight portions of the tube
208 may be positioned within the cavities 210 when the upper plate
204 is affixed to the lower plate 206. Curved portions of the tube
208 may extend outside the cavities 210 when the upper plate 204 is
affixed to the lower plate 206. The example illustrated includes
straight cavities 210 for simplicity of machining the lower plate
206, although it is to be understood that in other embodiments, the
cavities 210 may include curved portions and the curved portions of
the tube 208 may be positioned within the cavities 210 when the
upper plate 204 is affixed to the lower plate 206.
[0061] As the upper plate 204 and the lower plate 206 may both be
made of materials with relatively high heat transfer
characteristics, heat may be transferred to the tube 208 from
either side of the heat exchanger puck 100, resulting in
bidirectional heat transfer. Legacy heat exchanger pucks provide
unidirectional heat transfer with heat being transferred from one
of the sides to the tube. Accordingly, the embodiments described
herein may provide for greater heat transfer to the tube 208 from
the heat exchanger puck 100 and/or greater flexibility in placement
of the heat exchanger puck 100 while maintaining heat transfer to
the tube 208.
[0062] FIG. 3 illustrates a cross-sectional view of example heat
exchanger puck components 300, according to various embodiments.
The heat exchanger puck components 300 may include an upper plate
302, a lower plate 304, and a tube 306 of a liquid coolant system.
The upper plate 302, the lower plate 304, and the tube 306 may
include one or more of the features of the upper plate 204 (FIG.
2), the lower plate 206 (FIG. 2), the tube 104 (FIG. 1), and the
tube 208 (FIG. 2), respectively.
[0063] The upper plate 302 may include an aperture 308 to receive a
fastener and/or a fastener assembly, such as fasteners and/or
fastener assemblies 212 (FIG. 2). The lower plate 304 may include a
recess 310 to receive the fastener and/or the fastener assembly.
The aperture 308 and the recess 310 may be aligned when affixing
the upper plate 302 and the lower plate 304. The fastener and/or
fastener assembly may be installed in the aperture 308 and the
recess 310 when aligned and may affix the upper plate 302 to the
lower plate 304. In some embodiments, the upper plate 302 may be
affixed to the lower plate 304 by other means (such as by epoxy)
and the fastener and/or fastener assembly may be utilized for
mounting the heat exchanger puck formed from the heat exchanger
puck components 300 to a component to be cooled, within a computer
environment, within an electrical environment, or some combination
thereof. In some embodiments, the upper plate 302 may not have the
aperture 308 and the lower plate 304 may not have the recess 310,
and the upper plate 302 may be affixed to the lower plate 304 by
means other than the fastener and/or the fastener assembly, such as
by epoxy.
[0064] The lower plate 304 may include one or more cavities 312.
Portions of the tube 306 may be aligned with the cavities 312 when
forming a heat exchanger puck from the heat exchanger puck
components 300. The portions of the tube 306 may become affixed
within the cavities 312, between the upper plate 302 and the lower
plate 304, when the upper plate 302 is affixed to the lower plate
304. The portions of the tube 304 may be held in position within
the cavity by friction among the inner walls 314 of the lower plate
304, the upper plate 302, the tube 306, or some combination
generated by the affixation of the upper plate 302 to the lower
plate 304. In some embodiments, epoxy (such as thermal transfer
epoxy) may be applied to the portions of the tube 306 and/or the
inner walls 314 and the epoxy may hold the tube 304 in position
when the upper plate 302 is affixed to the lower plate 304. In some
embodiments, a thermal interface material, brazing parts, or some
combination thereof may be applied to and/or added to the tube
and/or inner walls 314 in lieu of or in addition to the epoxy.
[0065] FIG. 4 illustrates a cross-sectional view of an example heat
exchanger puck 400, according to various embodiments. The heat
exchanger puck 400 may be formed using the heat exchanger puck
components 300 (FIG. 3), including the upper plate 302, the lower
plate 304, the tube 306, or some combination thereof.
[0066] In the example illustrated in FIG. 4, the upper plate 302
may be affixed to the lower plate 304 with the portions of the tube
306 positioned within the cavities 312 of the lower plate 304. The
upper plate 302 may be affixed to the lower plate 304 by epoxy 402,
which may include thermal transfer epoxy. Prior to affixation of
the upper plate 302 to the lower plate 304, the epoxy 402 may be
applied to one or more of the upper plate 302, the lower plate 304
and the tube 306. The epoxy 402 may undergo a curing process to
affix the upper plate 302 to the lower plate 304. The curing
process may include applying heat, light, chemicals, or some
combination thereof to the epoxy 402 while the upper plate 302 is
maintained in contact with the lower plate 304. In some
embodiments, a thermal interface material, brazing parts, or some
combination thereof may be applied to and/or added to the one or
more of the upper plate 302, the lower plate 304, and the tube 306
in lieu of or in addition to the epoxy.
[0067] In some embodiments, a hydroforming process may be applied
to the portions of the tube 306 when affixed within the cavities
and prior to the curing process being applied to the epoxy 402. The
hydroforming process may include pressurizing liquid (such as
water, oil, or some combination thereof) within the portions of the
tube 306, wherein the pressurized liquid causes a circumference of
the portions of the tube 306 to expand within the cavity. The
process of hydroforming is described in more detail throughout this
disclosure.
[0068] FIG. 5 illustrates a cross-sectional view of an example heat
exchanger puck 500 generated by applying a thinning process to the
heat exchanger puck 400 of FIG. 4, according to various
embodiments. The heat exchanger puck 500 may be generated by
applying the thinning process to a side of the lower plate 304
opposite to the side of the lower plate 304 affixed to the upper
plate 302. The thinning process may be applied to the lower plate
304 to reduce the amount of lower plate material between the tube
306 and a component to be cooled, the component to be coupled the
side of the lower plate 304 to which the thinning process is
applied.
[0069] In some embodiments, the thinning process may further be
applied to achieve a desired flatness and/or creating a
predetermined geometry on the side of the lower plate 304 in lieu
of or in addition to thinning the heat exchanger puck 400. For
example, it may be desired to have the side of the lower plate 304
as being concave or convex and the thinning process may be applied
to achieve this predetermined geometry.
[0070] In the example illustrated, the upper plate 302 may be
affixed to the lower plate 304. The thinning process may be applied
to the side of the lower plate 304 while the upper plate 302 is
affixed to the lower plate 304. The thinning process may include
removing a portion 502 of the lower plate via a fly cutter, a
grinder, a blade, or some combination thereof. The thinning process
may leave a remaining portion of the lower plate 504. The remaining
portion of the lower plate 504 may provide a thin layer of the
material of the lower plate 304 between the side of the lower plate
304 and the tube 306.
[0071] FIG. 6 illustrates the example heat exchanger puck 500 of
FIG. 5 coupled to a component 602 to be cooled, according to
various embodiments. The component 602 may be part of a computer
environment, such as computer environment 2104 (FIG. 21). The
computer environment may be a computer device. In some embodiments,
the component 602 may be part of an electrical environment, such as
a power system, a mechanical switch, or some combination
thereof.
[0072] The component 602 may be mounted to a printed circuit board
(PCB) 604 within the computer environment. The component 602 may
include one or more leads and/or solder balls to mount the
component 602 to the PCB 604 and electrically couple the component
602 to the PCB 604. The component 602 may be computer processor
unit, a memory device, a system-on-chip, or some combination
thereof. When power is provided to the component 602, the component
602 may produce heat.
[0073] A side of the heat exchanger puck 500 may be coupled to a
surface of the component 602. The side of the heat exchanger puck
500 may be coupled to the surface of the component 602 by heat
transfer epoxy, heat transfer grease, heat transfer adhesive, or
some combination thereof. In some embodiments, the side of the heat
exchanger puck 500 may be coupled to the component 602 by a
fastener, such as a screw. Further, in some embodiments, the heat
exchanger puck 500 may be attached to the PCB 604 by a fastener and
the side of the heat exchanger puck 500 may be positioned against
the component 602 by the heat exchanger puck 500 being attached to
the PCB 604.
[0074] The heat exchanger puck 500 may be thermally coupled to the
component 602 by attachment to the surface of the component 602,
such that the heat produced by the component 602 may be transferred
to the heat exchanger puck 500 cooling the component 602. The heat
exchanger puck 500 may further transfer the heat to liquid coolant
flowing within the tube 306.
[0075] In some embodiments, the heat exchanger puck 500 may be
inverted such that the opposite side of the heat exchanger puck 500
is coupled to the component 602. The opposite side of the heat
exchanger puck 500 may be coupled to the component 602 by any of
the means of attachment described above for attachment of the side
of the heat exchanger puck 500 to the component 602.
[0076] In some embodiments, a second component to be cooled may be
coupled to a second side of the heat exchanger puck 500 opposite to
the side to which the component 602 is coupled. The second side of
the heat exchanger puck 500 may be coupled to the second component
by any of the means for attachment described above for attachment
of the side of the heat exchanger puck 500 to the component 602. In
these embodiments, the heat exchanger puck 500 may transfer heat
from the component 602 and the second component to the tube 306 to
cool both the component 602 and the second component.
[0077] FIG. 7 illustrates an example process 700 of manufacturing a
heat exchanger puck, according to various embodiments. In 702, an
upper plate for a heat exchanger puck may be formed. The upper
plate may include one or more of the features of the upper plate
204 (FIG. 2) and/or the upper plate 302 (FIG. 3). The upper plate
may be formed by a process of forming and/or machining a plate for
a heat exchanger puck known by one having ordinary skill in the
art.
[0078] In 704, a lower plate for the heat exchanger puck may be
formed. The lower plate may include one or more of the features of
the lower plate 206 (FIG. 2) and/or the lower plate 304 (FIG. 3).
The lower plate may be formed by a process of forming and/or
machining a plate for a heat exchanger puck known by one having
ordinary skill in the art.
[0079] In 706, the upper plate, the lower plate, and a tube of a
liquid coolant system may be aligned, as illustrated in FIG. 3. The
tube may include one or more of the features of the tube 104 (FIG.
1), the tube 208 (FIG. 2), and/or the tube 306 (FIG. 3). The tube
may be aligned with cavities (such as cavities 210 (FIG. 2) and/or
cavities 312 (FIG. 3)) formed in the lower plate. The upper plate
and the lower plate may be aligned with each other by aligning an
aperture (such as the apertures 214 (FIG. 2) and/or the aperture
308 (FIG. 3)) formed in the upper plate with an aperture (such as
the apertures 216 (FIG. 2)) and/or a recess (such as recess 310
(FIG. 3)) formed in the lower plate. In some embodiments, the upper
plate and the lower plate may be aligned based on marks and/or
specific features formed on one or both of the upper plate and the
lower plate.
[0080] In 708, epoxy (such as epoxy 402) may be applied. The epoxy
may be applied to one or more of the upper plate, the lower plate,
and the tube. In some embodiments, the epoxy may be applied to
inner walls (such as the inner walls 314) of the cavities. In some
embodiments, a thermal interface material, brazing parts, or some
combination thereof may be applied to and/or added to the one or
more of the upper plate, the lower plate, and the tube in lieu of
or in addition to the epoxy. Further, in some embodiments, 708 may
be omitted and, accordingly, the epoxy may not be applied and the
thermal interface material, the brazing parts, or combination
thereof, may not be applied and/or added.
[0081] In 710, the upper plate and the lower plate of the heat
exchanger puck may be compressed together. The side of the lower
plate with the cavities formed in it may be compressed to one of
the sides of the upper plate. The upper plate and the lower plate
may be compressed by applying force/s to one or both of the upper
plate and the lower plate. In some embodiments, one or more
fasteners and/or fastener assemblies (such as fasteners and/or
fastener assemblies 212 (FIG. 2)) may be installed within the upper
plate and the lower plate and may provide the compression force.
The tube, located in the cavities formed in the lower plate, may be
compressed between the upper plate and the lower plate and may be
deformed in response to the compression. The deformation of the
tube may result in a greater portion of the circumference of the
tube contacting either or both of the upper plate and the lower
plate than prior to the deformation of the tube.
[0082] In 712, the epoxy may be cured. The epoxy may be cured by
applying heat, light, chemicals, or some combination thereof, to
the epoxy. The epoxy may be cured while the upper plate and the
lower plate are compressed together. The cured epoxy may affix the
upper plate and the lower plate to each other. The cured epoxy may
fill any remaining gaps in the cavities of the lower plate about
the tube and may help facilitate heat transfer among the upper
plate, the lower plate, and the tube. The force/s compressing the
upper plate and the lower plate together may be removed after
curing of the epoxy. The resultant heat exchanger puck from 710 and
712 may be as illustrated in FIG. 4.
[0083] In some embodiments, the upper plate and the lower plate may
be affixed to each other by one or more fasteners and/or fastener
assemblies (such as fasteners and/or fastener assemblies 212 (FIG.
2)). In these embodiments, the epoxy may be cured either prior to
or after the fasteners and/or the fastener assemblies are installed
into the upper plate and the lower plate. In embodiments where the
fasteners and/or the fastener assemblies are installed prior to the
epoxy being cured, the force/s compressing the upper plate and the
lower plate together may be provided by the fasteners and/or the
fastener assemblies without additional, external forces being
applied to either of the upper plate and the lower plate.
[0084] In 714, a thinning process may be applied to the heat
exchanger puck, as illustrated in FIG. 5. The thinning process may
be applied to the lower plate on a side of the lower plate that
opposes the side of the lower plate abutting the upper plate. The
thinning process may include removing a portion of the lower plate
via a fly cutter, a grinder, a blade, or some combination thereof.
The thinning process may remove material of the lower plate leaving
a thin layer of the lower plate between the tube and the side of
the lower plate from which the material was removed.
[0085] In some embodiments, the thinning process may further be
applied to achieve a desired flatness and/or creating a
predetermined geometry on the side of the lower plate in lieu of or
in addition to thinning the heat exchanger. For example, it may be
desired to have the side of the lower plate as being concave or
convex and the thinning process may be applied to achieve this
predetermined geometry.
[0086] In 716, the heat exchanger puck may be coupled to a
component to be cooled. The side of the lower plate of the heat
exchanger puck to which the thinning process was applied may be
coupled to the component to be cooled. The heat exchanger puck may
be coupled to the component to be cooled via thermal epoxy, thermal
grease, thermal adhesive, one or more fasteners, or some
combination thereof. The heat exchanger puck may become thermally
coupled to the component to be cooled via the attachment of the
heat exchanger puck to the component to be cooled and may cool the
component.
[0087] In some embodiments, the heat exchanger puck may be coupled
to the component to be cooled by one of the other sides of the heat
exchanger puck to which the thinning process was not applied.
Further, in some embodiments, the heat exchanger puck may also be
coupled to a second component to be cooled on an opposite side of
the heat exchanger puck from which the component to be cooled is
coupled. In these embodiments, the heat exchanger puck may cool
both the component to be cooled and the second component to be
cooled.
[0088] In alternate embodiments, some of the operations of process
700 may be combined, divided, omitted, or performed in different
orders. For example, but not limited to, lower plate may be formed
704 before upper plate is formed 702.
[0089] FIG. 8 illustrates a cross-sectional view of an example heat
exchanger puck 800 prior to hydroformation, according to various
embodiments. The heat exchanger puck 800 may include one or more of
the features of the heat exchanger puck 100 (FIG. 1) and/or the
heat exchanger puck 400 (FIG. 4). Manufacture of the heat exchanger
puck may include one or more of procedures described in process 700
(FIG. 7).
[0090] The heat exchanger puck 800 may include an upper plate 802
and a lower plate 804. The heat exchanger puck 800 may receive a
tube 806 of a liquid coolant system. The upper plate 802 may
include one or more of the features of the upper plate 204 (FIG. 2)
and/or the upper plate 302 (FIG. 3). Cavities 808 may be formed in
the upper plate 802. The cavities 808 may extend into the upper
plate 802 from a side of the upper plate 802 coupled to the lower
plate 804.
[0091] The lower plate 804 may include one or more of the features
of the lower plate 204 (FIG. 2) and/or the lower plate 304 (FIG.
3). Cavities 810 may be formed in the lower plate 804. The cavities
810 may extend into the lower plate 804 from a side of the lower
plate 804 coupled to the upper plate 802. The cavities 810 of the
lower plate 804 and the cavities 808 of the upper plate 802 may be
aligned when the upper plate 802 and the lower plate 804 are
coupled/affixed together generating larger cavities, comprising the
cavities 810 and the cavities 808, between the upper plate 802 and
the lower plate 804.
[0092] The tube 806 may include one or more of the features of the
tube 104 (FIG. 1), the tube 208 (FIG. 2), and/or the tube 306 (FIG.
3). Portions of the tube 806 may be located within the larger
cavities formed by the aligned cavities 810 and cavities 808. Gaps
812 may be located between the portions of the tube 806 and the
upper plate 802 and/or the lower plate 804, with the portions of
the tube 806 positioned loosely within the larger cavities. In some
embodiments, the portions of the tube 806 may be compressed between
the upper plate 802 and the lower plate 804, with portions of the
circumference of the tube 806 contacting the upper plate 802 and
the lower plate 804. In these embodiments, the tube 806 may be
deformed in response to the upper plate 802 and the lower plate 804
being compressed/affixed to each other.
[0093] FIG. 9 illustrates a cross-sectional view of the example
heat exchanger puck 800 of FIG. 8 after hydroformation, according
to various embodiments. The process of hydroforming may include any
process of hydroforming materials known to one having ordinary
skill in the art. The process of hydroforming may be applied to the
portions of the tube 806 located within the larger cavities formed
by the aligned cavities 808 and cavities 810. The process of
hydroforming may include pressurizing a liquid (such as water, oil,
or some combination thereof) within the portions of tube 806. The
pressurized liquid may cause the tube 806 to deform in response to
force/s applied to the tube 806 via the pressurized liquid. In some
embodiments, gas may be pressurized with the portions of the tube
806 rather than, or in addition to, the liquid, the tube 806
deforming in response to the pressurized gas and/or liquid.
[0094] A circumference of the tube 806 may expand in response to
the pressurized liquid within the tube 806. As the tube 806
expands, the tube 806 may fill in the gaps 812, or some portion
thereof, and a greater portion of the circumference of the tube 806
may contact the upper plate 802 and/or the lower plate 804. In some
embodiments (such as the embodiment illustrated), an entirety of
the circumference of the tube 806 may contact either the upper
plate 802 or the lower plate 804. A rate and/or amount of heat
transfer between the tube 806 and the upper plate 802 and/or the
lower plate 804 may increase based on the increased contact between
the circumference of the tube 806 and the upper plate 802 and/or
the lower plate 804.
[0095] Further, as the tube 806 expands, a thickness of the tube
walls 902 of the tube 806 may be reduced. The thickness of the tube
walls 902 may be reduced around an entirety of the portions of the
tube 806 within the larger cavities or in certain locations (such
as locations where the circumference of the tube expanded) of the
portions of the tube 806. A rate and/or amount of heat transfer
between the tube 806 and/or liquid within the tube 806 and the
upper plate 802 and/or the lower plate 804 may increase based on
the reduced thickness of the tube walls 902.
[0096] FIG. 10 illustrates an example process 1000 of manufacturing
a heat exchanger puck with hydroformed tube, according to various
embodiments. In 1002, an upper plate for a heat exchanger puck may
be formed. The upper plate may include one or more of the features
of the upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3),
and/or the upper plate 802 (FIG. 8). The upper plate may be formed
by a process of forming and/or machining a plate for a heat
exchanger puck known by one having ordinary skill in the art.
[0097] In 1004, a lower plate for the heat exchanger puck may be
formed. The lower plate may include one or more of the features of
the lower plate 206 (FIG. 2), the lower plate 304 (FIG. 3), and/or
the lower plate 804 (FIG. 8). The lower plate may be formed by a
process of forming and/or machining a plate for a heat exchanger
puck known by one having ordinary skill in the art.
[0098] In 1006, the upper plate, the lower plate, and a tube of a
liquid coolant system may be aligned, as illustrated in FIG. 3. The
tube may include one or more of the features of the tube 104 (FIG.
1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), and/or the tube
806 (FIG. 8). The tube may be aligned with cavities (such as
cavities 210 (FIG. 2) and/or cavities 312 (FIG. 3)) formed in the
lower plate and/or the larger cavities formed by the cavities 808
and 810 (FIG. 8). The upper plate and the lower plate may be
aligned with each other by aligning an aperture (such as the
apertures 214 (FIG. 2) and/or the aperture 308 (FIG. 3)) formed in
the upper plate with an aperture (such as the apertures 216 (FIG.
2)) and/or recess (such as recess 310 (FIG. 3)) formed in the lower
plate. In some embodiments, the upper plate and the lower plate may
be aligned based on marks and/or specific features formed on one or
both of the upper plate and the lower plate.
[0099] In 1008, epoxy (such as epoxy 402) may be applied. The epoxy
may be applied to one or more of the upper plate, the lower plate,
and the tube. In some embodiments, the epoxy may be applied to
inner walls (such as the inner walls 314) of the cavities. In some
embodiments, a thermal interface material, brazing parts, or some
combination thereof may be applied to and/or added to the one or
more of the upper plate, the lower plate, and the tube in lieu of
or in addition to the epoxy. Further, in some embodiments, 1008 may
be omitted and, accordingly, the epoxy may not be applied and the
thermal interface material, the brazing parts, or combination
thereof, may not be applied and/or added.
[0100] In 1010, the upper plate and the lower plate of the heat
exchanger puck may be compressed together, as illustrated by heat
exchanger puck 800 of FIG. 8. The side of the lower plate with the
cavities formed in it may be compressed to one of the sides of the
upper plate and/or the side of the upper plate with the cavities
formed in it. The upper plate and the lower plate may be compressed
by applying force/s to one or both of the upper plate and the lower
plate.
[0101] In some embodiments, one or more fasteners and/or fastener
assemblies (such as fasteners and/or fastener assemblies 212 (FIG.
2)) may be installed within the upper plate and the lower plate and
may provide the compression force. The tube, located in the
cavities formed in the lower plate, may be compressed between the
upper plate and the lower plate and may be deformed in response to
the compression. The deformation of the tube may result in a
greater portion of the circumference of the tube contacting either
or both of the upper plate and the lower plate than when the tube
was not deformed.
[0102] In 1012, the tube may be hydroformed within the cavities.
The tube may be hydroformed by applying a hydroforming process to
the portions of the tube within the cavity while the upper plate
and the lower plate are compressed together. The process of
hydroforming may include one or more of the features of the process
of hydroforming described in relation to the heat exchanger puck
800 of FIG. 9.
[0103] In 1014, the epoxy may be cured. The epoxy may be cured by
applying heat, light, chemicals, or some combination thereof, to
the epoxy. The epoxy may be cured while the upper plate and the
lower plate are compressed together. The cured epoxy may affix the
upper plate and the lower plate to each other. The cured epoxy may
fill any remaining gaps in the cavities around the tube and may
help facilitate heat transfer among the upper plate, the lower
plate, and the tube. The force/s compressing the upper plate and
the lower plate together may be removed after curing of the
epoxy.
[0104] In some embodiments, the upper plate and the lower plate may
be affixed to each other by one or more fasteners and/or fastener
assemblies (such as fasteners and/or fastener assemblies 212 (FIG.
2)). In these embodiments, the epoxy may be cured either prior to
or after the fasteners and/or the fastener assemblies are installed
into the upper plate and the lower plate. In embodiments where the
fasteners and/or the fastener assemblies are installed prior to the
epoxy being cured, the force/s compressing the upper plate and the
lower plate together may be provided by the fasteners and/or the
fastener assemblies without additional, external forces being
applied to either of the upper plate and the lower plate.
[0105] In 1016, a thinning process may be applied to the heat
exchanger puck. The thinning process may be applied to the lower
plate on a side of the lower plate that opposes the side of the
lower plate abutting the upper plate. The thinning process may
include removing a portion of the lower plate via a fly cutter, a
grinder, a blade, or some combination thereof. The thinning process
may remove material of the lower plate leaving a thin layer of the
lower plate between the tube and the side of the lower plate from
which the material was removed.
[0106] In some embodiments, the thinning process may further be
applied to achieve a desired flatness and/or creating a
predetermined geometry on the side of the lower plate in lieu of or
in addition to thinning the heat exchanger puck. For example, it
may be desired to have the side of the lower plate as being concave
or convex and the thinning process may be applied to achieve this
predetermined geometry.
[0107] In 1018, the heat exchanger puck may be coupled to a
component to be cooled. The side of the lower plate of the heat
exchanger puck to which the thinning process was applied may be
coupled to the component to be cooled. The heat exchanger puck may
be coupled to the component to be cooled via thermal epoxy, thermal
grease, thermal adhesive, one or more fasteners, or some
combination thereof. The heat exchanger puck may become thermally
coupled to the component to be cooled via the attachment of the
heat exchanger puck to the component to be cooled and may cool the
component.
[0108] In some embodiments, the heat exchanger puck may be coupled
to the component to be cooled by one of the other sides of the heat
exchanger puck to which the thinning process was not applied.
Further, in some embodiments, the heat exchanger puck may also be
coupled to a second component to be cooled on an opposite side of
the heat exchanger puck from which the component to be cooled is
coupled. In these embodiments, the heat exchanger puck may cool
both the component to be cooled and the second component to be
cooled.
[0109] In alternate embodiments, some of the operations of process
1000 may be combined, divided, omitted, or performed in different
orders. For example, but not limited to, lower plate may be formed
1004 before upper plate is formed 1002.
[0110] FIG. 11 illustrates a cross-sectional view of a heat
exchanger puck 1100 with hydroform tooling mold 1108 before
hydroforming, according to various embodiments. A heat exchanger
puck 1100 may include pre-hydroformed tube 1102. The
pre-hydroformed tube 1102 may include a first portion 1104 routed
within the heat exchanger puck 1100 and a second portion 1106 that
extends from heat exchanger puck 1100.
[0111] A hydroform tooling mold 1108 may be positioned around the
second portion 1106 of the pre-hydroformed tube 1102 that extends
from the heat exchanger puck 1100. The hydroform tooling mold 1108
may include an upper mold 1410 and a lower mold 1112. The upper
mold 1110 and the lower mold 1112 may be positioned on opposing
sides of the second portion 1106 of the pre-hydroformed tube 1102
and may form one or more cavities 1114 into which the second
portion 1106 of the pre-hydroformed tube 1102 may extend. The upper
mold 1110 and the lower mold 1112 may be temporarily affixed to
each other around the second portion 1106 of the pre-hydroformed
tube 1102.
[0112] The upper mold 1110 may have a first plurality of ridges
1116 formed in the upper mold 1110. The lower mold 1112 may include
a corresponding second plurality of ridges 1118. When positioned on
the opposing sides of the second portion 1106 of the
pre-hydroformed tube 1102, the first plurality of ridges 1116 and
the second plurality of ridges 1118 may align with each other
around at least a portion of the one or more cavities 1114. In some
embodiments, the first plurality of the ridges 1116 and the second
plurality of ridges 1118, together, may extend around
circumferences of the one or more cavities 1114. At least a portion
of the second portion 1106 of the pre-hydroformed tube 1102 may
extend into the part of the one or more cavities 1114 encompassed
by the first plurality of ridges 1116 and the second plurality of
ridges 1118.
[0113] A hydroforming process may be applied to the first portion
1104 and the second portion 1106 of the pre-hydroformed tube 1102
within the heat exchanger puck 1100 and the one or more cavities
1114, respectively. In the hydroforming process, the first portion
1104 and the second portion 1106 of the pre-hydroformed tube 1102
may expand within the heat exchanger puck 1100 and the one or more
cavities 1114, respectively.
[0114] FIG. 12 illustrates a cross-sectional view of the heat
exchanger puck 1100 of FIG. 11 with hydroform tooling mold 1108
after hydroforming, according to various embodiments. The heat
exchanger puck 1100 after hydroforming illustrated in FIG. 11 may
be the result of applying a hydroforming process to the
pre-hydroformed tube 1102 (FIG. 11) illustrated in FIG. 11.
[0115] The heat exchanger puck 1100 after hydroforming may include
post-hydroformed tube 1202, produced through application of the
hydroforming process to the pre-hydroformed tube 1102. A first
portion 1204 of the post-hydroformed tube 1202, which may
correspond to the first portion 1104 of the pre-hydroformed tube
1102, may extend within the heat exchanger puck 1100 and may have
expanded to fit one or more cavities 1220 formed within the heat
exchanger puck 1100 through which the first portion 1204 is routed.
A shape of the first portion 1204 may be formed by the heat
exchanger puck 1100 as the hydroforming process was applied to the
first portion 1104 of the pre-hydroformed tube 1102 while the first
portion was located within the one or more cavities 1220.
[0116] A second portion 1206 of the post-hydroformed tube 1202,
which may correspond to the second portion 1106 of the
pre-hydroformed tube 1102, may extend out of the heat exchanger
puck 1100 and be routed within the one or more cavities 1114 of the
hydroform tooling mold 1108. The second portion 1206 may have
expanded to fill the one or more cavities 1114 in response to the
hydroforming process. In some embodiments, the second portion 1206
may have expanded in circumference and may not fill the entirety of
the one or more cavities 1114. At least part of the second portion
1206 may expand in circumference to fill the first plurality of
ridges 1116 and/or the second plurality of ridges 1118. The part of
the second portion 1206 that expanded to fill the first plurality
of ridges 1116 and/or the second plurality of ridges 1118 may have
a ridged profile, with a ridged portion 1222 formed in the second
portion 1206 of the post-hydroformed tube 1202.
[0117] FIG. 13 illustrates a cross-sectional of the example heat
exchanger puck 1100 of FIG. 11 without the hydroform tooling mold
1108 (FIG. 11) after hydroforming, according to various
embodiments. The hydroform tooling mold 1108 may have been removed
from the second portion 1206 of the post-hydroformed tube 1202 by
uncoupling the upper mold 1110 (FIG. 11) from the lower mold 1112
(FIG. 11) and removing the upper mold 1110 and the lower mold 1112
from the second portion 1206 of the post-hydroformed tube 1202.
[0118] The second portion 1206 of the post-hydroformed tube 1202
may retain the ridged portion 1222 after removal of the hydroform
tooling mold 1108. The ridged portion 1222 may have an increased
flexibility as compared to the circular shape of the
pre-hydroformed tube 1102 (FIG. 11). Accordingly, the ridged
portion 1222 of the post-hydroformed tube 1202 may be flexed
allowing for placement of the heat exchanger puck 1100 to
compensate for inconsistencies in a location of a component to be
cooled onto which the heat exchanger puck 1100 is to be placed.
[0119] FIG. 14 illustrates an example process 1400 of hydroforming
a tube with hydroform tooling mold, according to various
embodiments. In 1402, a hydroform tooling mold (such as hydroform
tooling mold 1108 (FIG. 11)) may be positioned around a portion of
a pre-hydroformed tube (such as pre-hydroformed tube 1102 (FIG.
11)) that extends from a heat exchanger puck (such as heat
exchanger puck 1100 (FIG. 11)). The portion of the pre-hydroformed
tube may extend into one or more cavities formed by the hydroform
tooling mold.
[0120] The hydroform tooling mold may include an upper mold (such
as upper mold 1110 (FIG. 11)) and a lower mold (such as lower mold
1112 (FIG. 11)). Positioning the hydroform tooling mold around the
portion of the pre-hydroformed tube may include positioning the
upper mold around a first portion of the pre-hydroformed tube,
positioning the lower mold around a second portion of the
pre-hydroformed tube, and temporarily affixing the upper mold and
the lower mold together. The upper mold and the lower mold may be
temporarily affixed together via one or more fasteners, such as
screws, bolts, hinges, similar other fasteners, or some combination
thereof.
[0121] In 1404, a hydroforming process is applied to the portion of
the pre-hydroformed tube. The hydroforming process may include
pressurizing liquid within the pre-hydroformed tube, thereby
causing the tube to expand. In response to the hydroforming
process, the circumference of the pre-hydroformed tube may expand
to fill the one or more cavities formed by the hydroform tooling
mold, or some portion thereof.
[0122] In 1406, the hydroform tooling mold may be removed from the
post-hydroformed tube. Removing the hydroform tooling mold may
include uncoupling the upper mold from the lower mold, and removing
the upper mold and the lower mold from around the post-hydroformed
tube. The upper mold and the lower mold may be uncoupled by
removing and/or unhooking the fasteners that temporarily affixed
the upper mold and the lower mold together in 1402.
[0123] While the process 1400 has been described separately, it is
to be understood that the process 1400 may be performed in
conjunction with, or adjacent in time to, one or more processes of
hydroforming a pre-hydroformed tube within a heat exchanger puck.
Accordingly, the process 1400 may be performed in conjunction with,
or adjacent in time to, process 700 (FIG. 7), process 1000 (FIG.
10), or some combination thereof.
[0124] FIG. 15 illustrates a cross-sectional view of an example
heat exchanger puck with butterfly cavity, according to various
embodiments. Pre-hydroformed heat exchanger puck 1500 may include
an upper plate 1502 and a lower plate 1504 with a tube 1506 of a
liquid coolant system located within a cavity 1508 formed between
the upper plate 1502 and the lower plate 1504. The upper plate 1502
may include one or more of the features of the upper plate 204
(FIG. 2), the upper plate 302 (FIG. 3), and/or the upper plate 802
(FIG. 8). The lower plate 1504 may include one or more of the
features of the lower plate 206 (FIG. 2), the lower plate 302 (FIG.
3), and/or the lower plate 804 (FIG. 8). The tube 1506 may include
one or more of the features of the tube 104 (FIG. 1), the tube 208
(FIG. 2), the tube 306 (FIG. 3), and/or the tube 806 (FIG. 8).
[0125] The tube 1506 may contact portions of the upper plate 1502
and the lower plate 1504. Prior to hydroforming, the tube 1506 may
have a narrow middle portion, where the tube 1506 contacts the
upper plate 1502 and the lower plate 1504, and rounded outer
portions that extend into the wing portion of the butterfly shaped
cavity 1508. The shape of the tube 1506 may be formed via
deformation of the tube 1506 during compression of the upper plate
1502 and the lower plate 1504 together. Tube walls 1512 of the tube
1506 may be a starting thickness in response to the deformation of
the tube 1506 during the compression. Gaps 1510 may be located
between the tube 1506 and the upper plate 1502 and the lower plate
1504, where the tube 1506 did not naturally deform to in response
to the compression of the upper plate 1502 and the lower plate.
[0126] Post-hydroformed heat exchanger puck 1550 may occur from
applying a hydroforming process to the pre-hydroformed heat
exchanger puck 1500. The circumference of the tube 1506 may have
expanded to substantially fill the cavity 1508 in response to
liquid 1552 being pressurized (in accordance with the hydroforming
process) within the tube 1506, such that a greater portion of the
circumference of the tube 1506 contacts either the upper plate 1502
or the lower plate 1504. The tube walls 1512 may decrease in
thickness from the starting thickness in response to the expansion
of the circumference of the tube 1506. Further, the size of the
gaps 1510 may decrease in response to the expansion of the
circumference of the tube 1506. In some embodiments, an entirety of
the circumference of the tube 1506 may contact either the upper
plate 1502 or the lower plate 1504 and there may be no gaps 1510.
In some embodiments, the gaps 1510 may be filled with epoxy (such
as epoxy 402 (FIG. 4)), which may be cured after completion of the
hydroforming process. In some embodiments, a thermal interface
material, brazing parts, or some combination thereof may be used to
fill the gaps 1510 in lieu of or in addition to the epoxy.
[0127] FIG. 16 illustrates example tube shapes that may be produced
by the hydroforming process, according to various embodiments. Tube
1600 may be substantially triangular in shape with three
substantially flat sides. The tube 1600 may have curved corners of
the triangle as a result of the hydroforming process. The tube 1600
may include one or more of the features of the tube 104 (FIG. 1),
the tube 208 (FIG. 2), the tube 306 (FIG. 3), and/or the tube 806
(FIG. 8).
[0128] An example heat exchanger puck 1602 with triangular cavity
1608 may include the tube 1600. The heat exchanger puck 1602 may
further include an upper plate 1604 and a lower plate 1606. The
upper plate 1604 may include one or more of the features of the
upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the
upper plate 802 (FIG. 8). The lower plate 1606 may include one or
more of the features of the lower plate 206 (FIG. 2), the lower
plate 304 (FIG. 3), and/or the lower plate 804 (FIG. 8).
[0129] The triangular cavity 1608 may be formed between the upper
plate 1604 and the lower plate 1606. The tube 1600 may be located
within the triangular cavity 1608 and the shape of the tube 1600
may have been formed via hydroforming while positioned between the
upper plate 1604 and the lower plate 1606. Gaps 1610 may be located
between the tube 1600 and the upper plate 1604 and/or the lower
plate 1606. The gaps 1610 may be filled with epoxy (such as epoxy
402 (FIG. 4)) to facilitate heat transfer among the tube 1600, the
upper plate 1604, and the lower plate 1606. In some embodiments, a
thermal interface material, brazing parts, or some combination
thereof may be used to fill the gaps 1610 in lieu of or in addition
to the epoxy.
[0130] Tube 1630 may have a substantially quadrilateral shape with
four substantially flat sides. The tube 1630 may have curved
corners of the quadrilateral shape as a result of the hydroforming
process. The tube 1630 may include one or more of the features of
the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG.
3), and/or the tube 806 (FIG. 8).
[0131] An example heat exchanger puck 1632 with quadrilateral
cavity 1638 may include the tube 1630. The heat exchanger puck 1632
may further include an upper plate 1634 and a lower plate 1636. The
upper plate 1634 may include one or more of the features of the
upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the
upper plate 802 (FIG. 8). The lower plate 1636 may include one or
more of the features of the lower plate 206 (FIG. 2), the lower
plate 304 (FIG. 3), and/or the lower plate 804 (FIG. 8).
[0132] The quadrilateral cavity 1638 may be formed between the
upper plate 1634 and the lower plate 1636. The tube 1630 may be
located within the quadrilateral cavity 1638 and the shape of the
tube 1630 may have been formed via hydroforming while positioned
between the upper plate 1034 and the lower plate 1636. Gaps 1640
may be located between the tube 1630 and the upper plate 1634
and/or the lower plate 1636. The gaps 1640 may be filled with epoxy
(such as epoxy 402 (FIG. 4)) to facilitate heat transfer among the
tube 1630, the upper plate 1634, and the lower plate 1636. In some
embodiments, a thermal interface material, brazing parts, or some
combination thereof may be used to fill the gaps 1640 in lieu of or
in addition to the epoxy.
[0133] Tube 1660 may have a substantially pentagonal shape with
four substantially flat sides. The tube 1660 may have curved
corners of the pentagonal shape as a result of the hydroforming
process. The tube 1660 may include one or more of the features of
the tube 104 (FIG. 1), the tube 208 (FIG. 2), the tube 306 (FIG.
3), and/or the tube 806 (FIG. 8).
[0134] An example heat exchanger puck 1662 with pentagonal cavity
1668 may include the tube 1660. The heat exchanger puck 1662 may
further include an upper plate 1664 and a lower plate 1666. The
upper plate 1664 may include one or more of the features of the
upper plate 204 (FIG. 2), the upper plate 302 (FIG. 3), and/or the
upper plate 802 (FIG. 8). The lower plate 1666 may include one or
more of the features of the lower plate 206 (FIG. 2), the lower
plate 304 (FIG. 3), and/or the lower plate 804 (FIG. 8).
[0135] The pentagonal cavity 1668 may be formed between the upper
plate 1664 and the lower plate 1666. The tube 1660 may be located
within the pentagonal cavity 1668 and the shape of the tube 1660
may have been formed via hydroforming while positioned between the
upper plate 1064 and the lower plate 1666. Gaps 1170 may be located
between the tube 1660 and the upper plate 1664 and/or the lower
plate 1666. The gaps 1170 may be filled with epoxy (such as epoxy
402 (FIG. 4)) to facilitate heat transfer among the tube 1660, the
upper plate 1664, and the lower plate 1666. In some embodiments, a
thermal interface material, brazing parts, or some combination
thereof may be used to fill the gaps 1610 in lieu of or in addition
to the epoxy.
[0136] It is to be understood that the shapes illustrated in FIG.
16 are examples of some the shapes that may be generated via the
hydroforming process and that the shapes that hydroformed tubes may
be is not limited to these example shapes. Shapes of hydroformed
tubes may include two or more sides, may include curved sides, or
some combination thereof, and should not be interpreted to be
limited to the shapes illustrated in FIG. 16.
[0137] FIG. 17 illustrates a cross-sectional view of an example
portion of a heat exchanger puck with ridged cavity, according to
various embodiments. A portion of a pre-hydroformed heat exchanger
puck 1700 may have a ridged cavity 1702 formed between an upper
plate 1704 and a lower plate 1706. The upper plate 1704 may include
one or more of the features of the upper plate 204 (FIG. 2), the
upper plate 302 (FIG. 3), and/or the upper plate 802 (FIG. 8). The
lower plate 1706 may include one or more of the features of the
lower plate 206 (FIG. 2), the lower plate 304 (FIG. 3), and/or the
lower plate 804 (FIG. 8).
[0138] The ridged cavity 1702 may include ridges 1710. A tube 1708
may be positioned within the ridged cavity 1702. The tube 1708 may
include one or more of the features of the tube 104 (FIG. 1), the
tube 208 (FIG. 2), the tube 306 (FIG. 3), and/or the tube 806 (FIG.
8). The tube 1708 may be compressed between the upper plate 1704
and the lower plate 1706 and may be substantially straight along
the length of the tube 1708 prior to being hydroformed.
[0139] A portion of a post-hydroformed heat exchanger puck 1750
with ridged cavity 1702 may be formed by applying a hydroforming
process to the tube 1708 in the portion of the pre-hydroformed heat
exchange puck 1700. The hydroforming process, for hydroforming the
tube 1708, may include one or more of the procedures described in
relation the hydroforming process described in relation to the heat
exchanger puck 800 of FIG. 9 and/or the hydroforming of the tube in
1012. The circumference of the tube 1708 may expand into the ridges
1710, the tube 1708 filling the ridges 1710. The tube 1708 filling
the ridges 1710 may operate to maintain a position of the tube 1708
within the ridged cavity 1702 and prevent sliding of the tube 1708
along a length of the cavity.
[0140] Maintaining the position of the tube 1708 within the ridged
cavity 1702 may act as a strain relief that can protect the
integrity of the thermal contact between the tube 1708 and the
portion of the post-hydroformed heat exchanger puck 1750. Further,
maintaining the position of the tube 1708 within the ridged cavity
1702 may reduce or prevent any stresses applied to portions of the
tube outside the portion of the post-hydroformed heat exchanger
puck 1750 from translating to the portion of the tube 1708 within
the portion of the post-hydroformed heat exchanger puck 1750
preventing or reducing the possibility of damage to the portion of
the tube 1708 within the portion of the post-hydroformed heat
exchanger puck 1750.
[0141] FIG. 18 illustrates example ridged, hydroformed tube shapes,
according to various embodiments. As can be observed, tubes may be
hydroformed with one or more ridges along a length of the tube.
Further, a circumference of the tubes may vary along the length of
the tube.
[0142] It is to be understood that the shapes illustrated in FIG.
18 are examples of some the shapes that may be generated via the
hydroforming process and that the shapes that hydroformed tubes may
be is not limited to these example shapes. Shapes of hydroformed
tubes may include two or more sides, may include curved sides, may
include one or more ridges, or some combination thereof, and should
not be interpreted to be limited to the shapes illustrated in FIG.
18.
[0143] FIG. 19 illustrates a cross-sectional view of an example
heat exchanger puck 1900 with an affixing hydroformed tube 1906,
according to various embodiments. The heat exchanger puck 1900 may
include an upper plate 1902 and a lower plate 1904. The upper plate
1902 may include one or more of the features of the upper plate 204
(FIG. 2), the upper plate 302 (FIG. 3), and/or the upper plate 802
(FIG. 8). The lower plate 1904 may include one or more of the
features of the lower plate 206 (FIG. 2), the lower plate 304 (FIG.
3), and/or the lower plate 804 (FIG. 8).
[0144] A cavity 1908 may be formed between the upper plate 1902 and
the lower plate 1904. The cavity 1908 may include a first portion
where a width of the cavity 1908 increases as the cavity 1908
extends into the upper plate 1902 from the side of the upper plate
1902 abutting the lower plate 1904 and may include a second portion
where a width of the cavity 1908 increases as the cavity 1908
extends into the lower plate 1904 from the side of the lower plate
1904 abutting the upper plate 1902. The cavity 1908 illustrated may
be substantially hourglass-shaped, however it is to be understood
that the affixing characteristic of the tube 1906 may be present in
any cavity where the width of the cavity increases as the cavity
extends into both the upper plate and the lower plate, where one or
more reflex angles of the cavity are produced as the cavity extends
into both the upper plate and the lower plate, or some combination
thereof.
[0145] The tube 1906 may be positioned within the cavity 1908. The
tube 1906 may be hydroformed while the upper plate 1902 and the
lower plate 1904 are compressed together. The tube may be
hydroformed via the hydroforming process described in relation to
the heat exchanger puck 800 of FIG. 9 and/or the hydroforming of
the tube in 1012. The tube 1906 may expand to fill, or
substantially fill, the cavity 1908. After hydroforming, the tube
1906 may become rigid and may affix the upper plate 1902 and/or the
lower plate 1904 together, preventing separation of the upper plate
1902 and/or the lower plate 1904.
[0146] FIG. 20 illustrates a cross-sectional view of an example
heat exchanger puck 2900 prior to compression of an upper plate
2902 and a lower plate 2904, according to various embodiments. The
heat exchanger puck 2900 may include the upper plate 2902 and the
lower plate 2904. The upper plate 2902 may include one or more of
the features of the upper plate 204 (FIG. 2), the upper plate 302
(FIG. 3), the upper plate 802 (FIG. 8), and/or the upper plate 1902
(FIG. 19). The lower plate 1904 may include one or more of the
features of the lower plate 206 (FIG. 2), the lower plate 304 (FIG.
3), the lower plate 804 (FIG. 8), and/or the lower plate 1904 (FIG.
19).
[0147] The upper plate 2902 may include a cavity 2906 formed within
the upper plate 2902, the cavity 2906 extending into the upper
plate 2902 from one of the sides of the upper plate 2902. A portion
of a tube 2908 may be positioned within the cavity 2906. The tube
2908 may include one or more of the features of the tube 104 (FIG.
1), the tube 208 (FIG. 2), the tube 306 (FIG. 3), the tube 806
(FIG. 8), and/or the tube 1708 (FIG. 17). The tube 2908 may be
pre-formed (via press-forming and hydroforming) to a shape that is
similar to the shape of the cavity 2906 (as illustrated), or may be
a circular tube.
[0148] The lower plate 2904 may include a flat surface without any
cavities. The flat surface of the lower plate 2904 may be aligned
with the side of the upper plate 2902 with the cavity 2906 formed
in it. The portion of the tube 2908 may extend out of the cavity
2906 toward the lower plate 2904 when the lower plate 2904 is
aligned with the side of the upper plate 2902. In some embodiments,
the entirety of the tube 2908 may be located within the cavity
2906, such that the portion of the tube 2908 does not extend
outside of the cavity.
[0149] FIG. 21 illustrates a cross-sectional view of the example
heat exchanger puck 2900 of FIG. 20 after compression of the upper
plate 2902 and the lower plate 2904, according to various
embodiments. The upper plate 2902 and the lower plate 2904 may be
compressed together by applying a compression force to one or both
of the upper plate 2902 and the lower plate 2904 urging the upper
plate 2902 and the lower plate 2904 toward each other when the
upper plate 2902 and the lower plate 2904 are aligned. In response
to the compression force being applied, the side of the upper plate
2902 with the cavity 2906 may be pressed against the flat side of
the lower plate 2904. The compression force may be maintained while
the side of the upper plate 2902 is located against the flat side
of the lower plate 2904.
[0150] In embodiments where the portion of the tube 2908 extends
out of the cavity 2906 toward the lower plate 2904, the lower plate
2904 may contact the tube 2908 as the upper plate 2902 and the
lower plate 2904 are being compressed together and may cause the
tube 2908 to be deformed as the upper plate 2902 and the lower
plate 2904 are compressed together. The tube 2908 may be deformed
based on a force being applied to the tube 2908 as the upper plate
2902 and the lower plate 2904 are moved together. When the side of
the upper plate 2902 is pressed against the lower plate 2904, the
entirety of the tube 2908 may be located within the cavity 2906
based on the deformation of the tube 2908. In embodiments, where
the portion of the tube 2908 was within the cavity 2906 prior to
the upper plate 2902 and the lower plate 2904 being compressed
together, the lower plate 2904 may not contact the tube 2908 when
the upper plate 2902 and the lower plate 2904 are being compressed
together and the portion of the tube 2908 may not be deformed in
response to the upper plate 2902 and the lower plate 2904 being
compressed together.
[0151] FIG. 22 illustrates a cross-sectional view of the example
heat exchanger puck 2900 of FIG. 20 after hydroforming process,
according to various embodiments. A hydroforming process may be
applied to the tube 2908 while located between the upper plate 2902
and the lower plate 2904. The compression force applied to one or
both of the upper plate 2902 and the lower plate 2904 that causes
the upper plate 2902 and the lower plate 2904 to be pressed
together may be maintained throughout the hydroforming process.
[0152] The process of hydroforming may include one or more of the
features of the process of hydroforming described in relation to
the heat exchanger puck 800 of FIG. 9. In response to the
hydroforming process, the walls of the tube 2908 may expand to abut
the inner walls of the cavity 2906 or the portion of the flat side
of the lower plate 2904 that abuts the cavity 2906 when the upper
plate 2902 and the lower plate 2904 are pressed together. In some
embodiments, the entirety of the walls of the tube 2908 may abut
the inner walls of the cavity 2906 or the portion of the flat side
of the lower plate 2904. In other embodiment, a portion of the
walls of the tube 2908 may be separated from the inner walls of the
cavity 2906 and the flat side of the lower plate 2904, such that
less than the entirety of the walls of the tube 2908 abut the inner
walls of the cavity 2906 or the portion of the flat side of the
lower plate 2904.
[0153] FIG. 23 illustrates a cross-sectional view of the example
heat exchanger puck 2900 of FIG. 20 after removal of the lower
plate 2904 (FIG. 22), according to various embodiments. The lower
plate 2904 may be removed from abutting the side of the upper plate
2902 after completion of the hydroforming process. The lower plate
2904 may be removed by removing and/or seizing the compression
force being applied to one or both of the upper plate 2902 and the
lower plate 2904.
[0154] In response to the lower plate 2904 being removed, a portion
of the tube 2908 that was in contact with the lower plate 2904
after the hydroforming process may be exposed to the external
environment. The portion of the tube 2908 that abutted the upper
plate 2902 after the hydroforming process may still abut the upper
plate 2902 after removal of the lower plate 2904. The position of
the tube 2908 may be maintained after the removal of the lower
plate 2904 based on the contact between the tube 2908 and the upper
plate 2902.
[0155] FIG. 24 illustrates a cross-sectional view of the example
heat exchanger puck 2900 of FIG. 20 coupled to a component 3302,
according to various embodiments. The component 3302 may include
one or more of the features of the component 602 (FIG. 6). The
component 3302 may be a component that produces heat and is to be
cooled by the heat exchanger puck 2900. The component 3302 may be
mounted to a PCB within an electronic environment. The component
3302 may produce heat in response to power being supplied to the
component 3302 and/or the electronic environment.
[0156] The heat exchanger puck 2900 may be positioned against the
component 3302, with the exposed portion of the tube 2908 abutting
the surface of the component 3302. With the heat exchanger puck
2900 positioned against the component 3302, the exposed portion of
the tube 2908 may be in direct contact with the surface of the
component 3302 or thermal transfer material (such as thermal
grease, thermally-conductive tape, and/or thermal epoxy) applied to
the surface of the component 3302. Further, the side of the upper
plate 2902, or some portion thereof, into which the cavity extends
2906 may be in direct contact with the surface of the component
3302. The heat exchanger puck 2900 may be coupled to the component
3302 via fasteners, thermally-conductive adhesives (such as thermal
epoxy or thermally-conductive tape), force applied to the heat
exchanger puck 2900 in the direction of the component 3302, or some
combination thereof.
[0157] When the heat exchanger puck 2900 is positioned against the
component 3302, heat from the component 3302 may be transferred
from the component 3302 to the heat exchanger puck 2900. The heat
transferred may be transferred to the tube 2908, which, in turn,
may transfer the heat to liquid within the tube 2908. The liquid
may be circulated through the tube 2908, with the liquid carrying
the heat away from the heat exchanger puck 2900 and the component
3302 as the liquid is circulated.
[0158] FIG. 25 illustrates an example process 3400 of producing the
heat exchanger puck 2900 of FIG. 20, according to various
embodiments. In 3402, the upper plate 2902 (FIG. 20) may be formed.
The upper plate 2902 may be formed of a material with relatively
high heat transfer characteristics, such as carbon steel, stainless
steel, copper, bronze, brass, titanium, aluminum, thermally
conductive polymers, heat conducting plastics, various alloys, or
some combination thereof. Forming the upper plate 2902 may include
forming the cavity 2906 (FIG. 20) within the upper plate 2902. The
cavity 2906 may be formed by drilling, cutting, grinding, etching,
or some combination thereof, into a surface of the upper plate
2902.
[0159] In 3404, the lower plate 2904 (FIG. 20) may be formed. The
lower plate 2902 may be formed of any rigid material. In some
embodiments, the lower plate 2902 may not have relatively high heat
transfer characteristics. Forming the lower plate 2902 may include
shaping one of the surfaces of the lower plate 2904 to be
substantially flat (allowing for any roughness or variances of the
surface that may be presented through forming of the surface or
inherent within the material).
[0160] In 3406, the upper plate 2902, the lower plate 2904, and the
tube 2908 (FIG. 20) may be aligned. The tube 2908, or some portion
thereof, may be positioned within the cavity 2906 (FIG. 20) of the
upper plate 2902 during alignment. The lower plate 2904 may be
aligned with the upper plate 2902, with the flat surface of the
lower plate 2904 facing the side of the upper plate 2902 into which
the cavity 2906 extends.
[0161] In 3408, the upper plate 2902 and the lower plate 2904 may
be compressed together. Compressing the upper plate 2902 and the
lower plate 2904 together may include applying a compression force
to one or both of the upper plate 2902 and the lower plate 2904,
urging the upper plate 2902 and the lower plate 2904 together. When
compressed together, the flat surface of the lower plate 2094 may
be pressed against the side of the upper plate 2902 into which the
cavity 2906 extends.
[0162] In response to the upper plate 2902 and the lower plate
2904, the tube 2908 may be deformed to fit within the cavity 2906.
In other embodiments, the tube 2908 may fit within the cavity 2906
prior to the upper plate 2902 and the lower plate 2904 being
compressed together, and the tube 2908 may not be deformed in
response to the upper plate 2902 and the lower plate 2904 being
compressed together.
[0163] In 3410, a hydroform process may be performed with respect
to the tube. The hydroform process may include one or more of the
features of the hydroform process described in relation to the heat
exchanger puck 2900 of FIG. 22. In response to the hydroform
process, the walls of the tube 2908 may expand to abut the inner
walls of the cavity 2906 and/or the lower plate 2904. The entirety
of the walls of the tube 2908 may abut either the inner walls of
the cavity 2906 or the lower plate 2904 after completion of the
hydroform process. In other embodiments, a portion of the walls of
the tube 2908 may be separate from the inner walls of the cavity
2906 and the lower plate 2908 after completion of the hydroform
process.
[0164] In 3412, the lower plate 2904 is removed from the heat
exchanger puck 2900. The lower plate 2904 may be removed by
removing and/or seizing the compression force being applied to one
or both of the lower plate 2904 and the upper plate 2902. In
response to the lower plate 2904 being removed, the portion of the
tube 2908 that abutted the lower plate 2904 after completion of the
hydroform process may be exposed to the external environment.
[0165] In 3414, the heat exchanger puck 2900 may be coupled to the
component 3302 (FIG. 24). The heat exchanger puck 2900 may be
positioned against the component 3302 with the portion of the tube
2908 that was exposed to the external environment abutting the
surface of the component 3302. With the heat exchanger puck 2900
positioned against the component 3302, the exposed portion of the
tube 2908 may be in direct contact with the surface of the
component 3302 or thermal transfer material (such as thermal
grease, thermally-conductive tape, and/or thermal epoxy) applied to
the surface of the component 3302. Further, the side of the upper
plate 2902, or some portion thereof, into which the cavity extends
2906 may be in direct contact with the surface of the component
3302. The heat exchanger puck 2900 may be coupled to the component
3302 via fasteners, thermally-conductive adhesives (such as thermal
epoxy or thermally-conductive tape), force applied to the heat
exchanger puck 2900 in the direction of the component 3302, or some
combination thereof.
[0166] In alternate embodiments, some of the operations of process
3400 may be combined, divided, omitted, or performed in different
orders.
[0167] FIG. 26 illustrates an example liquid coolant system 2000
that may employ a heat exchanger puck 2002, according to various
embodiments. The liquid coolant system 2000 may be located within a
computer environment 2004, such as a computer device. In some
embodiments, the liquid coolant system 2000 may be located within
an electrical environment, such as power systems, mechanical
switches, or some combination thereof.
[0168] The liquid coolant system 2000 may include a pump 2006. The
pump 2006 may be coupled to a tube 2008 of the liquid coolant
system 2000 and may circulate liquid (such as water, oil, or some
combination thereof) within the tube 2008. In some embodiments, the
pump 2006 may circulate vapor within the tube in lieu of, or in
addition to, the liquid. In some embodiments, the pump 2006 may
include a coolant system (such as an air conditioner, fans to blow
and/or draw air across the tube 2008, or some combination
thereof).
[0169] The tube 2008 may carry the liquid from an output of the
pump 2006 in a path within the computer environment back to an
input of the pump 2006. The tube 2008 may include one or more of
the features of the tube 104 (FIG. 1), the tube 208 (FIG. 2), the
tube 306 (FIG. 3), and the tube 806 (FIG. 8). The tube 2008 may
receive heat from the computer environment 2004 and may transfer
heat to the liquid circulating within the tube 2008.
[0170] The heat exchanger puck 2002 may be coupled to the tube
2008, such as in accordance with the embodiments of the heat
exchanger described herein. The heat exchanger puck 2002 may
include one or more features of the heat exchanger puck 100 (FIG.
1), the heat exchanger puck 400 (FIG. 4), the heat exchanger puck
800 (FIG. 8), the heat exchanger puck 1550 (FIG. 15), the heat
exchanger puck 1750 (FIG. 17), and/or the heat exchanger puck 1900
(FIG. 19). The heat exchanger puck 2002 may be mounted to a
component within the computer environment 2004 to be cooled, such
as the integrated circuit package 2010. The integrated circuit
package 2010 may be a computer processor unit, a memory device, a
system-on-chip, or some combination thereof. Heat from the
integrated circuit package 2010 may be transferred to the tube 2008
via the heat exchanger puck 2002, which in turn may transfer the
heat to the liquid within the tube 2008. The liquid within the tube
2008 may be circulated back to the pump 2006, where the liquid may
be cooled and pumped back into the tube 2008.
[0171] The heat exchanger puck 2002 may include one or more
cavities, such as the one or more cavities 210 (FIG. 2), the one or
more cavities 312 (FIG. 3), the one or more cavities 810 (FIG. 8),
the cavity 1508 (FIG. 15), the triangular cavity 1608 (FIG. 16),
the quadrilateral cavity 1638 (FIG. 16), the pentagonal cavity 1668
(FIG. 16), the ridged cavity 1702 (FIG. 17), and/or the cavity 1908
(FIG. 19). A portion of the tube 2008 may be located within the one
or more cavities of the heat exchanger puck 2002 and may enter the
one or more cavities through one or more openings formed in a side
of the heat exchanger puck 2002.
[0172] A shape of the one or more cavities may affect a flexibility
of the tube at the one or more openings where the tube 2008 enters
the one or more cavities. The shape of the one or more cavities may
include shapes with a width of the cavity being less than a length
of the cavity. In these embodiments, the tube 2008 located within
the one or more cavities may be more flexible in directions
corresponding to the width of the cavity and/or less flexible in
directions corresponding to the length of the cavity at the one or
more openings and/or outside the one or more cavities. Such shapes
with a width of the cavity being less than a length of the cavity
may include an ellipse, a butterfly shape (as illustrated in FIG.
15), and/or an hour-glass shape (as illustrated in FIG. 19). In
embodiments that have the ellipse-shaped cavities, the flexibility
of the tube 2008 located within the one or more cavities may
present increased flexibility in directions corresponding to the
smallest diameter of the ellipse shape and/or decreased flexibility
in directions corresponding to the largest diameter of the ellipse
shape at the one or more openings and/or outside of the one or more
cavities.
[0173] The portion of the tube 2008 may be formed to fit the shape
of the one or more cavities by the heat exchanger puck 2002. In
some embodiments, the heat exchanger puck 2002 may include a first
plate, where the one or more cavities extend into the first plate
from a side of the first plate, and a second plate that may be
coupled to the side of the first plate. The portion of the tube
2008 located within the one or more cavities may be press-formed to
fit the shape of the one or more cavities as the second plate is
coupled to the side of the first plate.
[0174] In some embodiments, a hydroforming process may be applied
to the portion of the tube 2008 as the portion of the tube 2008 is
located within the one or more cavities to fit the portion of the
tube 2008 to the shape of the one or more cavities. The
hydroforming process may result in tube wall thickness of the
portion of the tube 2008 to be decreased. The decreased tube wall
thickness of the portion of the tube 2008 may increase the
flexibility of the tube 2008 at the one or more openings.
[0175] A flexibility of the tube 2008 may further be affected by a
length of the tube 2008 between the pump 2006 and the heat
exchanger puck 2002. Increasing the length of the tube 2008 between
the pump 2006 and the heat exchanger puck 2002 may increase the
flexibility of the tube 2008, whereas decreasing the length of the
tube 2008 between the pump 2006 and the heat exchanger puck 2002
may decrease the flexibility of the tube 2008. The length of the
tube between the pump 2006 and the heat exchanger puck 2002 may be
selected based on a predetermined flexibility of the tube 2008
between the pump 2006 and the heat exchanger puck 2002.
[0176] Further, in some embodiments, a profile of the tube 2008
outside of the heat exchanger puck 2002 may be modified to affect
the flexibility of the tube 2008. The profile of the tube 2008 may
be selected based on a predetermined flexibility for the portions
of the tube that extend outside of the heat exchanger puck 2002. In
some embodiments, the profile of the tube 2008 may be formed to an
elliptical shape along a length, or a portion of the length, of the
tube 2008 that extends outside of the heat exchanger puck 2002. In
these embodiments, the portion of the tube 2008 that extends
outside of the heat exchanger puck 2002 may present increased
flexibility in directions corresponding to the smallest diameter of
the elliptical shape and/or decreased flexibility in directions
corresponding to the largest diameter of the elliptical shape.
[0177] In some embodiments, a second heat exchanger puck 2012 may
be coupled to the tube, such as in accordance with the embodiments
of the heat exchanger described herein. The second heat exchanger
puck 2012 may include one or more features of the heat exchanger
puck 2002. The second heat exchanger puck 2012 may be mounted to a
second component within the computer environment 2004 to be cooled,
such as the second integrated circuit package 2014. The second
integrated circuit package 2014 may be a second computer processor
unit, a second memory device, a second system-on-chip, or some
combination thereof. Heat from the second integrated circuit
package 2014 may be transferred to the tube 2008 via the second
heat exchanger puck 2012, which in turn may transfer the heat to
the liquid within the tube 2008. The liquid within the tube 2008
may be circulated back to the pump 2006, where the liquid may be
cooled and pumped back into the tube 2008.
[0178] In embodiments with the second heat exchanger puck 2012, a
distance between the portion of the tube 2008 located within the
heat exchanger puck 2002 and the portion of the tube 2008 located
within the second heat exchanger puck 2012 may be selected based on
a predetermined flexibility for the portion of the tube 2008 that
extends between the heat exchanger puck 2002 and the second heat
exchanger puck 2012. Further, a profile of the portion of the tube
2008 may be selected based on the predetermined flexibility of the
portion of the tube 2008 that extends between the heat exchanger
puck 2002 and the second heat exchanger puck 2012.
[0179] FIG. 27 illustrates an example liquid coolant system 2100,
according to various embodiments. The liquid coolant system 2100,
or a portion thereof, may be disposed within an electronic
environment and may cool one or more components within the
electronic environment.
[0180] The example liquid coolant system 2100 may include a rigid
support plate 2102. The rigid support plate 2102 may be formed of a
rigid, or substantially rigid, material, such as sheet metal,
aluminum, copper, iron, stainless steel, rigid plastic, rigid
rubber, metal alloys, or some combination thereof. The rigid
support plate 2102 may be substantially flat and may omit expensive
machining processes employed for producing legacy support plates,
which may save manufacturing time and cost. The rigid support plate
2102 may act as a backbone for the liquid coolant system 2100 and
may be used for maintaining a position of the liquid coolant system
2100 (or portions thereof), mounting the liquid coolant system 2100
to a component within the electronic environment (such as a printed
circuit board within the electronic environment), providing rigid
support for portions of the liquid coolant system 2100, receiving
and dissipating heat, or some combination thereof.
[0181] One or more apertures 2104 may be formed in the rigid
support plate 2102. When the rigid support plate 2102 is disposed
within the electronic environment, the apertures 2104 may align
with one or more components within the electronic environment. The
apertures 2104 may allow for access to the components through the
rigid support plate 2102. Sizes of the apertures 2104 may be
dependent on the components with which the apertures 2104 align.
The apertures 2104 may be formed to be larger than or the same size
as the components to which each of the apertures 2104 aligns. In
some embodiments, the apertures 2104 may be smaller than the
components to which each of the apertures 2104 aligns, but larger
than or the same size as a portion of the electronic component to
be cooled.
[0182] The liquid coolant system 2000 may include a pump 2106. The
pump 2106 may be coupled to a tube 2108 of the liquid coolant
system 2000 and may provide pressure to move liquid within the tube
2108. The pump 2106 may cause the liquid to be circulated through
the tube 2108 from a first end of the tube 2108 coupled to the pump
2106 to a second end of the tube 2108 coupled to the pump 2106. As
the liquid is circulated through the tube 2108, heat may be
captured within the liquid (from the one or more components) and
transferred back to the pump 2106. In some embodiments, the pump
2106 may further include a cooling system to cool the liquid, such
as a fan, an air conditioner, a heat exchanger, or some combination
thereof.
[0183] The tube 2108 may be coupled to the pump 2106 and may carry
the liquid throughout the liquid coolant system 2000. The tube 2108
may receive the liquid from the pump 2106 at a first end of the
tube 2108 and may circulate the liquid through the liquid coolant
system 2000 to a second end of the tube 2108 where the liquid is
delivered back to the pump 2106.
[0184] The tube 2108 may be made of a material with relatively high
heat transfer characteristics and that is resistive to corrosion,
such as copper, stainless steel, a copper/nickel alloy, or some
combination thereof. The tube 2108 may have a threshold
flexibility, where the tube 2108 may flex a certain amount without
the integrity of the tube 2108 being compromised, allowing the
liquid to leak from the tube 2108. The threshold flexibility of the
tube 2108 may be affected by a profile of the tube 2108, or a
portion thereof. The profile of the tube 2108 may be any of the
shapes described throughout this disclosure and may vary along the
length of the tube 2108. The profile of the tube 2108 may be formed
via press-forming, hydroforming, similar operations of forming
tubes within a liquid coolant system known by one having ordinary
skill in the art, or some combination thereof.
[0185] Further, the threshold flexibility may vary depending on the
direction of flex of the tube 2108. For example, a profile of the
tube 2108 may be narrower along a first axis than along a second
axis. The tube 2108 may have an increased threshold flexibility to
flex in the direction of the first axis than if the tube 2108 was
round and a decreased threshold flexibility to flex in the
direction of the second axis than if the tube 2108 was round based
on the profile being narrower along the first axis than along the
second axis. Further, the threshold flexibility to flex in the
direction of the first axis may be greater than the threshold
flexibility to flex in the direction of the second axis based on
the profile being narrower along the first axis than along the
second axis.
[0186] The liquid coolant system may further include one or more
heat exchanger pucks 2110. The heat exchanger pucks 2110 may
include one or more of the features of the heat exchanger puck 100
(FIG. 1), the heat exchanger puck 400 (FIG. 4), the heat exchanger
puck 500 (FIG. 5), the heat exchanger puck 800 (FIG. 8), the heat
exchanger puck 1100 (FIG. 11), the heat exchanger puck 1602 (FIG.
16), the heat exchanger puck 1632 (FIG. 16), the heat exchanger
puck 1662 (FIG. 16), the heat exchanger puck 1900 (FIG. 19), the
heat exchanger puck 2002 (FIG. 20), the post-hydroformed heat
exchanger puck 1550 (FIG. 15), the post-hydroformed heat exchanger
puck 1750 (FIG. 17), any other heat exchanger puck known to one
having ordinary skill in the art, or some combination thereof.
Further, the heat exchanger pucks 2110 may differ, with different
ones of the heat exchanger pucks 2110 having different sizes,
different shapes, different features, or some combination
thereof.
[0187] The heat exchanger pucks 2110 may be coupled to the tube
2108 along different portions of the tube 2108. The tube 2108 may
extend within cavities formed within the heat exchanger pucks 2110
and may be fixed within the cavities formed within the heat
exchanger pucks 2110. In some embodiments, the tube 2108 may be
affixed to or contact a surface of the heat exchanger pucks 2110,
or a portion of the heat exchanger pucks 2110, rather than
extending within the cavities formed within the heat exchanger
pucks 2110. The coupling of the heat exchanger pucks 2110 to the
tube 2108 may allow for transferring of heat from the heat
exchanger pucks 2110 to the tube 2108, which may, in turn, transfer
heat to the liquid circulating within the tube 2108.
[0188] When the liquid coolant system 2100 is disposed within the
electronic environment, the heat exchanger pucks 2110 may align
with the apertures 2104 formed within the rigid support plate 2102.
The heat exchanger pucks 2110 may extend into the apertures 2104
and may contact the components of the electronic environment that
are aligned with the apertures 2104. The heat exchanger pucks 2110
may be thermally coupled with the components, allowing heat from,
or generated by, the components to be transferred to the heat
exchanger pucks 2110 for transfer to the liquid circulating within
the tube 2108. In some embodiments, the heat exchanger pucks 2110
may be affixed to the corresponding components within the
electronic environment via fasteners, thermally-conductive
adhesives (such as thermal epoxy or thermally-conductive tape), or
some combination thereof.
[0189] The liquid coolant system 2100 may further include one or
more fasteners (or fastener assemblies) 2112 that may attach the
tube 2108, one or more of the heat exchanger pucks 2110, or some
combination thereof, to the rigid support plate 2102. The fasteners
2112 may include screws, bolts, rivets, similar types of fasteners,
or some combination thereof. In some embodiments, the fasteners
2112 may further include a fixture (such as a formed piece of
metal, plastic, or other rigid material), a spring, or some
combination thereof that may contact the tube 2108 or heat
exchanger puck 2110, or some portion thereof, and maintain the tube
2108 or heat exchanger puck 2110, or the portion thereof, against
the rigid support plate 2102.
[0190] The fasteners 2112, when installed, may affix a portion of
the tube 2108 and/or the heat exchanger pucks 2110 to the rigid
support plate 2102. The affixation of the portion of the tube 2108
and/or the heat exchanger pucks 2110 may limit a distance to which
the tube 2108 and/or the heat exchanger pucks 2110 may be flexed
without compromising the integrity of the tube 2108. For example,
without the fastener 2112a, the heat exchanger puck 2110a may be
translated two centimeters in any direction without compromising
the integrity of the tube 2108, whereas with the fastener 2112a
installed, the heat exchanger puck 2110a may be limited to a
translation of five millimeters in any direction without
compromising the integrity of the tube 2108.
[0191] When disposed within an electronic environment, portions of
the liquid coolant system 2100 may be located within the electronic
environment while other portions may be located outside of the
electronic environment. For example, the pump 2106 and a portion of
the tube 2108 may extend outside of the electronic environment,
while the rigid support plate 2102, the heat exchanger pucks 2110
and another portion of the tube 2108 may be disposed within the
electronic environment.
[0192] Further, when disposed within the electronic environment,
portions of the liquid coolant system 2100 may be affixed to a
component (such as a printed circuit board, an electronic
component, a case, or some combination thereof) within the
electronic environment, while other portions may be detached from
the components in the electronic environment. For example, the
rigid support plate 2102 may be affixed to a printed circuit board
within the electronic environment, while the tube 2108 and the heat
exchanger pucks 2110 are detached from the components in the
electronic environment. In some embodiments, portions of the tube
2108 may be affixed to the rigid support plate (such as via
fasteners 2112) with translation and flexibility of the portions of
the tubes impeded by the affixation, whereas other portions of the
tube 2108 may be detached from the rigid support plate 2102
allowing the other portions to be freely translated and flexed.
[0193] FIG. 28 illustrates an example unassembled electronic
environment 2200 with liquid coolant system 2202, according to
various embodiments. The liquid coolant system 2202 may include one
or more of the features of the liquid coolant system 2100 (FIG.
21). The illustrated unassembled electronic environment 2200 with
liquid coolant system 2202 may illustrate an arrangement of the
electronic environment 2200 and the liquid coolant system 2202
prior to the liquid coolant system 2202 being disposed within the
electronic environment 2200.
[0194] The electronic environment 2200 may include a printed
circuit board (PCB) 2204. The PCB 2204 may include one or more
components 2206 mounted to the PCB 2204. The components 2206 may be
mounted to a surface of the PCB 2204 and may extend from the
surface. While the components 2206 illustrated in the electronic
environment 2200 are shown as extending a same distance from the
surface of the PCB 2204, it is to be understood that, in other
embodiments, the components 2206 may extend different distances
from the surface of the PCB 2204.
[0195] The liquid coolant system 2202 may include a rigid support
plate 2208. The rigid support plate 2208 may include one or more of
the features of the rigid support plate 2102 (FIG. 21), including
the apertures 2104. The rigid support plate 2208 may include one or
more apertures 2222 (illustrated in dotted lines to indicate formed
within a center of the rigid support plate) formed in the rigid
support plate 2208. The apertures 2222 may include one or more of
the features of the apertures 2104 (FIG. 21). The apertures 2222
may be formed in locations in the rigid support plate 2208 with a
same layout as the components 2206. Accordingly, when disposed
within the electronic environment 2200, the apertures 2222 may
align with the components 2206 such that the components 2206 may
extend into the apertures 2222 when the rigid support plate 2208 is
mounted to the PCB 2204.
[0196] The liquid coolant system 2202 may include a tube assembly
2210. The tube assembly 2210 may include a tube 2212. The tube 2212
may include one or more of the features of the tube 2108 (FIG. 21),
including being flexible up to a threshold flexibility and carrying
liquid of the liquid coolant system 2202.
[0197] The tube 2210 may include an inlet 2214 and an outlet 2216.
The inlet 2214 and the outlet 2216 may be coupled to a pump (not
shown), such as the pump 2106 (FIG. 21). The inlet 2214 may receive
liquid exiting from the pump that is circulated through the tube
2212 and to the outlet 2216 that directs the liquid back into the
pump. In some embodiments, the inlet 2214 and the outlet 2216 or
tubes extending from the pump may include tube unions that allow
the inlet 2214 and the outlet 2216 to be separated from the pump.
Accordingly, the tube assembly 2210 may be separable from the pump,
allowing for the tube assembly 2210 and/or the pump to be
interchanged as desired.
[0198] The tube assembly 2210 may include one or more heat
exchanger pucks 2218. The heat exchanger pucks 2218 may include one
or more of the features of the heat exchanger pucks 2110 (FIG. 21).
The heat exchanger pucks 2218 may be coupled to the tube 2212. The
tube 2212 may extend through cavities formed in the heat exchanger
pucks 2218 and portions of the tube 2212 may be affixed within the
cavities of each of the heat exchanger pucks 2218. The heat
exchanger pucks 2218 may be located along a plane located parallel
to the PCB 2204 when the tube assembly 2210 is oriented as to be
disposed within the electronic environment 2200. In particular,
when the tube assembly 2210 is oriented as to be disposed within
the electronic environment 2220, the heat exchanger pucks 2218 may
be a uniform distance from the PCB 2204 of the electronic
environment 2220.
[0199] In some embodiments (such as illustrated in FIG. 29), the
heat exchanger pucks 2218 may be located along different planes
located parallel to the PCB 2204 when the tube assembly is oriented
as to be disposed within the electronic environment 2200, such that
the heat exchanger pucks 2218 are different distances from the PCB
2204. The heat exchanger pucks 2218 may be designed to be located
on different planes based on the components 2206 extending
different distances from the PCB 2204, differences in desired
compression force between the different heat exchanger pucks 2218
and the corresponding components 2206, or some combination
thereof.
[0200] FIG. 29 illustrates the example assembled electronic
environment 2200 with liquid coolant system 2202 of FIG. 28,
according to various embodiments. The illustrated electronic
environment 2200 with the liquid coolant system 2202 may illustrate
the electronic environment 2200 with the liquid coolant system 2202
disposed within the electronic environment 2200.
[0201] When the liquid coolant system 2202 is disposed in the
electronic environment 2200, the rigid support plate 2208 may be
attached to the PCB 2204 by one or more fasteners 2302. The
fasteners 2302 may include one or more of the features of the
fasteners 2112 (FIG. 21). The fasteners 2302 may extend through
apertures formed in the PCB 2204 and apertures formed in the rigid
support plate 2208 and may use heads of the fasteners 2302, bolts
attached to the fasteners 2302, threading formed within the
apertures, or some combination thereof to attach the rigid support
plate 2208 to the PCB 2204. In some embodiments, the fasteners 2302
may be surface mount-type fasteners and may attach the rigid
support plate 2208 to the PCB 2204 by attachment means attached to
the rigid support plate 2208 and/or the PCB 2204.
[0202] The fasteners 2302 may include standoffs to maintain a
distance between the rigid support plate 2208 and the PCB 2204. In
some embodiments, the rigid support plate 2208 may be positioned
against the PCB 2204 and/or one or more components mounted to the
PCB 2204 (such as the components 2206), and the fasteners 2302 may
maintain the rigid support plate 2208 against the PCB 2204 and/or
the components. Further, in some embodiments, the rigid support
plate 2208 may be affixed to the PCB 2204 and/or another portion of
the electronic environment 2200 (such as a case of the electronic
environment 2200) via epoxy.
[0203] Further, when the liquid coolant system 2202 is disposed in
the electronic environment 2200, portions of the tube 2212 may be
attached to the rigid support plate 2208 by fasteners 2304. The
fasteners 2304 may include one or more of the features of the
fasteners 2112 (FIG. 21).
[0204] The fasteners 2304 may attach a portion of the tube 2212 to
the rigid support 2208, such as a first fastener 2304a may attach a
first portion of the tube 2306a to the rigid support 2208 and a
second fastener 2304b may attach a second portion of the tube 2306b
to the rigid support. The first fastener 2304a and the second
fastener 2304b may maintain a distance of the first portion of the
tube 2306a and the second portion of the tube 2306b, respectively,
from the rigid support plate 2208, may limit the first portion of
the tube 2306a and the second portion of the tube 2306b to a
maximum distance from the rigid support plate 2208 while allowing
the first portion of the tube 2306a and the second portion of the
tube 2306b to move closer to the rigid support plate 2208, or some
combination thereof. In some embodiments, the first fastener 2304a
and the second fastener 2304b may prevent, or limit the ability of,
the first portion of the tube 2306a and the second portion of the
tube 2306b, respectively, from flexing.
[0205] The remainder of the tube 2212 (referring to the portions of
the tube not including the first portion of the tube 2306a and the
second portion of the tube 2306b) may be detached from the rigid
support plate 2208. The remainder of the tube 2212 may flex and
translate in response to force being applied to the remainder of
the tube 2212. An amount of translation of the remainder of the
tube 2212 may be limited by the attached first portion of the tube
2306a and the attached second portion of the tube 2306b. The amount
of translation of the remainder of the tube 2212 may be dependent
on the flexibility of material that the tube is formed of, the
profile of the tube (or portions thereof), the distance/s of the
portion of the remainder of the tube 2212 from the attached
portions (such as the attached first portion of the tube 2306a and
the attached second portion of the tube 2306b), or some combination
thereof. Generally, portions of the remainder of the tube 2212 that
are farther from the attached portions may translate a greater
distance than portions of the remainder of the tube 2212 that are
closer to the attached portions.
[0206] In some embodiments, the fasteners 2304 may be used to
generate a compression force between the heat exchanger pucks 2218
and the components 2206. In a default state, absent forces being
applied to the heat exchanger pucks 2218, the heat exchanger pucks
2218 may be located a certain distance from a main body 2220 of the
tube 2212. The fasteners 2304, when installed, may force the main
body 2220 to a distance from the components 2206 that is less than
the certain distance between the heat exchanger pucks 2218 and the
main body 2220 when in the default state. In these embodiments, the
unattached remainder of the tube 2212, or some portion thereof, may
flex as the surface of the heat exchanger pucks 2218 are compressed
against the components 2206. The unattached remainder of the tube
2212 may present a resistance force to flexing, which may be
translated to the heat exchanger pucks 2218 and generate a
compression force between the heat exchanger pucks 2218 and the
components 2206. The amount of resistance force to flexing for the
unattached remainder of the tube 2212 may be dependent on the
flexibility of material that the tube is formed of, the profile of
the tube (or portions thereof), the distance/s of the portion of
the remainder of the tube 2212 from the attached portions (such as
the attached first portion of the tube 2306a and the attached
second portion of the tube 2306b), or some combination thereof.
[0207] In some embodiments, the fasteners 2304 may include springs
located between a head of each of the fasteners 2304 and the main
body 2220 of the tube 2212. The springs may be coil springs, volute
springs, leaf springs, Belleville washers/springs, or some
combination thereof. When the liquid coolant system 2202 is
disposed within the electronic environment 2200, the springs may
become compressed between the heads of the fasteners 2304 and the
main body 2220 of the tube 2212 and may apply a force to the main
body 2220 tube 2212 urging the main body 2220 toward the rigid
support plate 2208. The force generated by the springs may be
transferred to the heat exchanger pucks 2218 via the tube 2218,
causing the heat exchanger pucks 2218 to be compressed to the
components 2206. The spring may be selected based on a desired
compression between the heat exchanger pucks 2218 and the
components 2206, a distance between the spring and the heat
exchanger pucks 2218, a profile of the tube 2212, or some
combination thereof.
[0208] In some embodiments, the amount of compression force between
the heat exchanger pucks 2218 and the component 2206 may vary among
the different heat exchanger pucks 2218. The compression force for
each of the heat exchanger pucks 2218 may be dependent on the
location of the fasteners 2304 relative to the heat exchanger pucks
2218, the distance that the fasteners 2304 maintain the main body
2220 of the tube 2212 from the rigid support plate 2208, the
spring/s of each of the fasteners 2304, the flexibility of the tube
2212, or some combination thereof. For example, one of the heat
exchanger pucks 2218 may exhibit a first amount of compression
force between the heat exchanger puck 2218 and the corresponding
component 2206 when the liquid coolant system 2202 is disposed
within the electronic environment 2200, while a second one of the
heat exchanger pucks 2218 may exhibit a second amount of
compression force, greater than the first amount, between the
second one of the heat exchanger pucks 2218 and the corresponding
component 2206.
[0209] FIG. 30 illustrates an example liquid coolant system 2402
applied to electronic components 2404 extending varying distances
from a PCB 2408, according to various embodiments. The liquid
coolant system 2402 may include one or more of the features of the
liquid coolant system 2100 (FIG. 21), the liquid coolant system
2202 (FIG. 22), or some combination thereof. The liquid coolant
system 2402 is illustrated without the rigid support plate and
fasteners to clearly illustrate the relationship between heat
exchanger pucks 2406 and the electronic components 2404. However,
it is to be understood that the rigid support plate and fasteners
are generally included in the liquid coolant system 2402 and may be
oriented within the liquid coolant system 2402 in the same
orientation, or similar orientation, to the rigid support plate
2208 (FIG. 23), the fasteners 2302 (FIG. 23), and the fasteners
2304 (FIG. 23) when the liquid coolant system 2402 is disposed
within electronic environment 2400.
[0210] The liquid coolant system 2402 may include a tube 2410 for
carrying liquid of the liquid coolant system 2402. The tube 2410
may include one or more of the features of the tube 2108 (FIG. 21),
the tube 2212 (FIG. 22), or some combination thereof. The liquid
coolant system 2402 may further include one or more heat exchanger
pucks 2406. The heat exchanger pucks 2406 may include one or more
features of the heat exchanger pucks 2110 (FIG. 21), the heat
exchanger pucks 2218 (FIG. 22), or some combination thereof.
[0211] The heat exchanger pucks 2406 may include a first heat
exchanger puck 2406a, a second heat exchanger puck 2406b, and a
third heat exchanger puck 2406c. In default state where no forces
are being applied to the heat exchanger pucks 2406, the heat
exchanger pucks 2406 may all be located along a plane located
parallel to the PCB 2408 when the liquid coolant system 2402 is
oriented to be disposed within the electronic environment 2400.
Accordingly, when in the default state, the first heat exchanger
puck 2406a, the second heat exchanger puck 2406b, and the third
heat exchanger puck 2406c may be a same distance from the PCB 2408
when the liquid coolant system 2402 is oriented to be disposed in
the electronic environment 2400 and without forces being applied to
the heat exchanger pucks 2406.
[0212] The electronic environment 2400 may include one or more
electronic components 2404, such as first electronic component
2404a, second electronic component 2404b, and third electronic
component 2404c. The electronic components 2404 may include one or
more of the features of the components 2206 (FIG. 22). The
electronic components 2404 may be affixed to a PCB 2408 of the
electronic environment 2400 and may extend from a surface of the
PCB 2408. The electronic components 2404 may extend different
distances from the PCB 2408. For example, in the illustrated
embodiment, the second electronic component 2404b may extend a
shorter distance from the surface of the PCB 2408 than the first
electronic component 2404a and the third electronic component
2404c.
[0213] When the liquid coolant system 2402 is disposed within the
electronic environment 2400, a first heat exchanger puck 2406a may
be thermally coupled to the first electronic component 2404a, a
second heat exchanger puck 2406b may be thermally coupled to the
second electronic component 2404b, and a third heat exchanger puck
2406c may be thermally coupled to the third electronic component
2404c. The heat exchanger pucks 2406 may be thermally coupled to
the electronic components 2404 by positioning the heat exchanger
pucks 2406 against the surfaces of the electronic components 2404
opposite to the PCB 2408. Due to the differences in the distance
that the electronic components 2404 extend from the PCB 2408, one
or more of the heat exchanger pucks 2406 may be displaced or
translated from the position of the heat exchanger pucks 2406 in
the default state. The tube 2410 may flex in response from the heat
exchanger pucks 2406 being displaced or translated from the default
state. In the example illustrated, the first heat exchanger puck
2406a and the third heat exchanger puck 2406c may displace or
translate from their positions in the default state due to the
first electronic component 2404a and the third electronic component
2404c extending further from the PCB 2408 than the second
electronic component 2404b. Accordingly, the liquid coolant system
2402 may compensate for differences in the extension of the
electronic components 2404 from the PCB 2408, which legacy liquid
coolant systems cannot. This may allow for cheaper production costs
due to less rigid standards for placement of the electronic
components 2404.
[0214] While the tube 2410 may flex as the heat exchanger pucks
2406 are displaced or translated from the positions of the heat
exchanger pucks 2406 in the default state, the tube 2410 may resist
flexing. The resistance to flexing of the tube 2410 may cause the
portion of the tube 2410 that is flexing to generate an increased
compression force between the heat exchanger pucks 2406 being
displaced or translated and the corresponding electronic components
2404. In the example illustrated, the compression force between the
first heat exchanger puck 2406a and the first electronic component
2404a, and the third heat exchanger puck 2406c and the third
electronic component 2404c may be greater than the compression
force between the second heat exchanger puck 2406b and the second
electronic component 2404b due to the flexing of the tube 2410 in
response to the first heat exchanger puck 2406a and the third heat
exchanger puck 2406c being displaced from their locations in the
default state.
[0215] In some embodiments, the positions of the heat exchanger
pucks 2406 in the default state may be designed to generate greater
compression force between some of the heat exchanger pucks 2406
than others. Accordingly, the liquid coolant system 2402 may
present different compression forces for different heat exchanger
pucks 2406. This may allow the liquid coolant system 2402 to be
designed for electronic components 2404 that can withstand
different compression forces without damage, for different thermal
compounds located between the heat exchanger pucks 2406 and the
electronic components 2404 that may operate properly or better with
different compression forces, or some combination thereof.
[0216] FIG. 31 illustrates an example apparatus 2500 for a liquid
coolant system, according to various embodiments. The apparatus
2500 may include a rigid support plate 2510. The rigid support
plate 2510 may include one or more of the features of the rigid
support plate 2102 (FIG. 21), the rigid support plate 2208 (FIG.
22), or some combination thereof. The rigid support plate 2510 may
be mounted within an electronic environment via fasteners, solder,
welding, adhesives (such as epoxy), similar attachment means, or
some combination thereof. In some embodiments, the rigid support
plate 2510 may be formed as part of the electronic environment,
such as the rigid support plate 2510 being formed as part of an
enclosure, case, or structure of the electronic environment.
[0217] The rigid support plate 2510 may include one or more
apertures 2512. The apertures 2512 may include one or more of the
features of the apertures 2104 (FIG. 21). When the rigid support
plate 2510 is mounted within the electronic environment, the
apertures 2512 may align with electronic components within the
electronic environment.
[0218] The apparatus 2500 may include a tube assembly 2502 with one
or more heat exchanger pucks 2504. The heat exchanger pucks 2504
may include one or more features of the heat exchanger pucks 2110
(FIG. 21), the heat exchanger pucks 2218 (FIG. 22), the heat
exchanger pucks 2406 (FIG. 24), or some combination thereof. When
the apparatus 2500 is disposed within an electrical environment,
the heat exchanger pucks 2504 may be thermally coupled to one or
more electronic components (such as the components 2206 (FIG. 22),
the electronic components 2404 (FIG. 24), or some combination
thereof). The heat exchanger pucks 2504 may be located within the
apertures 2512 aligned with the electronic components and may be
thermally coupled with the electronic components via contact with
surfaces of the electronic components. The heat exchanger pucks
2504 may be positioned against a surface of the electronic
components to provide the thermal coupling. In some embodiments, a
thermal transfer material (such as thermal grease,
thermally-conductive tape, and/or thermal epoxy) may be located
between the heat exchanger pucks 2504 and the surface of the
electronic components.
[0219] The tube assembly 2502 may include a tube 2506 to carry
liquid of the liquid coolant system. The tube 2506 may include one
or more of the features of the tube 2108 (FIG. 21), the tube 2212
(FIG. 22), the tube 2410 (FIG. 24), or some combination thereof.
The tube 2506 may be thermally coupled to the heat exchanger pucks
2504, and liquid circulating within the tube 2506 may receive heat
from the heat exchanger pucks 2504 and transfer the heat away from
the heat exchanger pucks 2504.
[0220] The tube assembly 2502 may further include one or more
fasteners 2508. The fasteners 2508 may include one or more of the
features of the fasteners 2112 (FIG. 21), the fasteners 2304 (FIG.
23), or some combination thereof. The fasteners 2508 may affix
portions of the tube 2506, the heat exchanger pucks 2504, or some
combination thereof, to the rigid support plate 2510, elements or
features within the electronic environment, or some combination
thereof.
[0221] The fasteners 2508 may include springs 2504 located between
a head of the fasteners and the portions of the tube 2506 and/or
the heat exchanger pucks 2504 that the fasteners 2508 are affixing
to the rigid support plate 2510 and/or the elements or features
within the electronic environment. The springs 2504 may be coil
springs, volute springs, leaf springs, Belleville washers/springs,
or some combination thereof. The springs 2504 may be compressed
when the fasteners 2508 affix the portions of the tube 2506 and/or
the heat exchanger pucks 2504 and may apply a force to the portions
of the tube 2506 and/or the heat exchanger pucks 2504 urging the
tube 2506 and/or the heat exchanger pucks 2504 toward rigid support
plate 2510 and/or the part of the electronic environment to which
the rigid support plate 2510 is mounted. The force applied by the
springs 2504 may be translated via the tube 2506, or directly
applied, to the heat exchanger pucks 2504 and may generate a
compression force between the heat exchanger pucks 2504 and the
electronic components.
[0222] In some embodiments, the fasteners 2508 may include spacers
2518 and/or interface members 2520 located between the springs 2514
and the portions of the tube 2506 and/or the heat exchanger pucks
2504 that the fasteners 2508 affix to the rigid support plate 2510
and/or the elements or features within the electronic environment.
The spacers 2518 and/or the interface members 2520 may contact the
portions of the tube 2506 and/or the heat exchanger pucks 2504 and
may transfer the force from the springs 2514 to the portions of the
tube 2506 and/or the heat exchanger pucks 2504. Further, in some
embodiments, one or more of the spacers 2518 and/or the interface
members 2520 may contact the portions of the tube 2506 and/or the
heat exchanger pucks 2504 in more than one location and may spread
the force applied by the springs 2514 between the contact
locations.
[0223] Further, in some embodiments, the tube assembly 2502 may
include one or more mounting plates 2516. The mounting plates 2516
may be attached to portions of the tube 2506. When the apparatus
2500 is disposed within the electronic environment, the mounting
plates 2516 may be affixed to the rigid support plate 2510, one or
more elements or features within the electronic environment, or
some combination thereof. When affixed, the mounting plates 2516
may further affix the portions of the tube 2506 attached to the
mounting plates 2516 to the rigid support plate 2510, the elements
or features within the electronic environment, or some combination
thereof.
[0224] The tube 2506 may include an inlet 2522 and an outlet 2524.
The inlet 2522 and the outlet 2524 may be coupled to a pump (such
as the pump 2106) that may provide pressure to circulate liquid
within the tube 2506. It is to be understood that the titles of the
inlet 2522 and the outlet 2524 do not imply a direction of the
circulation of the liquid within the tube 2506, and the liquid may
enter the tube either through the inlet 2522 or the outlet 2524 and
exit through the outlet 2524 or the inlet 2522, respectively.
[0225] FIG. 32 illustrates an example tube assembly 2600 for a
liquid coolant system, according to various embodiments. The tube
assembly 2600 may include a tube 2602 for carrying liquid of the
liquid coolant system. The tube 2602 may include one or more of the
features of the tube 2108 (FIG. 21), the tube 2212 (FIG. 22), the
tube 2410 (FIG. 24), the tube 2506 (FIG. 25), or some combination
thereof.
[0226] The tube 2602 may include one or more tube unions 2604. The
tube unions 2604 may provide for separation of portions of the tube
2602. For example, tube union 2604a and tube union 2604b may allow
a first portion of the tube 2602a to be separated from the rest of
the tube 2602a. The first portion of the tube 2602a may be
interchanged when separated, such that a different shaped portion
of a tube may replace the first portion of the tube 2602a. In some
embodiments, the first portion of the tube 2602a may be affixed to
a heat exchanger puck (such as the heat exchanger pucks 2110, the
heat exchanger pucks 2218, the heat exchanger pucks 2406, the heat
exchanger pucks 2504, or some combination thereof) and
interchanging the first portion of the tube 2602a may allow for
interchanging of the heat exchanger puck with a different heat
exchanger puck. For example, a heat exchanger puck without a heat
sink may be interchanged for a heat exchanger puck with a heat sink
via separation of the portions of the tubes attached to the tube
unions 2604.
[0227] FIG. 33 illustrates an example tube union 2700, according to
various embodiments. The tube union 2700 may be an example of the
tube unions 2604 (FIG. 26). The tube union 2700 may be attached to
a first tube on a first end of the tube union 2700. A circumference
of the tube union 2700 may be greater than a circumference of the
first tube 2702. The tube union 2700 may be formed of the same
material as the first tube 2702.
[0228] The tube union 2700 may include a cavity 2704 formed in a
second end of the tube union 2700. The cavity 2704 may attach to a
hollow center of the tube 2702 that may carry liquid within a
liquid coolant system. The cavity 2704 may have a circumference
equal to, or larger than, the circumference of the first tube 2702.
In some embodiments, the circumference of the cavity 2704 may
decrease from the second end of tube union 2700 to the first end of
the tube union 2700.
[0229] The cavity 2704 may receive a second tube 2706. When
inserted within the cavity 2704, the second tube 2706 may become
affixed to the tube union 2700. The second tube 2706 may be affixed
to the tube union 2700 via friction force between the second tube
2700 and the tube union 2700, an adhesive (such as epoxy), or some
combination thereof. In some embodiments, the walls of the cavity
2704 and a portion of the second tube 2706 may be threaded and the
second tube 2706 may be screwed into the tube union 2700.
[0230] FIG. 34 illustrates an example computer device 2800 that may
employ the apparatuses and/or methods described herein (e.g., the
heat exchanger puck 100, the heat exchanger puck 300, the heat
exchanger puck 800, the heat exchanger puck 1500, the heat
exchanger puck 1700, the heat exchanger puck 1900, the liquid
coolant system 2100, the electronic environment 2200, the liquid
coolant system 2202, the electronic environment 2400, the liquid
coolant system 2402, the apparatus 2500, and/or the tube assembly
2600), in accordance with various embodiments. As shown, computer
device 2800 may include a number of components, such as one or more
processor(s) 2804 (one shown) and at least one communication chip
2806. In various embodiments, the one or more processor(s) 2804
each may include one or more processor cores. In various
embodiments, the at least one communication chip 2806 may be
physically and electrically coupled to the one or more processor(s)
2804. In further implementations, the communication chip 2806 may
be part of the one or more processor(s) 2804. In various
embodiments, computing device 2800 may include printed circuit
board (PCB) 2802. For these embodiments, the one or more
processor(s) 2804 and communication chip 2806 may be disposed
thereon. In alternate embodiments, the various components may be
coupled without the employment of PCB 2802.
[0231] Depending on its applications, computer device 2800 may
include other components that may or may not be physically and
electrically coupled to the PCB 2802. These other components
include, but are not limited to, memory controller 2826, volatile
memory (e.g., dynamic random access memory (DRAM) 2820),
non-volatile memory such as read only memory (ROM) 2824, flash
memory 2822, storage device 2854 (e.g., a hard-disk drive (HDD)),
an I/O controller 2841, a digital signal processor (not shown), a
crypto processor (not shown), a graphics processor 2830, one or
more antenna 2828, a display (not shown), a touch screen display
2832, a touch screen controller 2846, a battery 2836, an audio
codec (not shown), a video codec (not shown), a global positioning
system (GPS) device 2840, a compass 2842, an accelerometer (not
shown), a gyroscope (not shown), a speaker 2850, a camera 2852, and
a mass storage device (such as hard disk drive, a solid state
drive, compact disk (CD), digital versatile disk (DVD)) (not
shown), and so forth.
[0232] In various embodiments, one or more components of the
computer device 2800 may include the heat exchanger puck 100, the
heat exchanger puck 300, the heat exchanger puck 800, the heat
exchanger puck 1500, the heat exchanger puck 1700, the heat
exchanger puck 1900, the heat exchanger pucks 2110, the heat
exchanger pucks 2218, the heat exchanger pucks 2406, and/or the
heat exchanger pucks 2504 described herein. For example, the heat
exchanger puck 100, the heat exchanger puck 300, the heat exchanger
puck 800, the heat exchanger puck 1500, the heat exchanger puck
1700, the heat exchanger puck 1900, the heat exchanger pucks 2110,
the heat exchanger pucks 2218, the heat exchanger pucks 2406,
and/or the heat exchanger pucks 2504 may be coupled and/or mounted
to I/O controller 2841, processor 2804, memory controller 2826,
and/or another component of computer device 2800.
[0233] In various implementations, the computer device 2800 may be
a laptop, a netbook, a notebook, an ultrabook, a smartphone, a
computing tablet, a personal digital assistant (PDA), an
ultra-mobile PC, a mobile phone, a desktop computer, a server, a
printer, a scanner, a monitor, a set-top box, an entertainment
control unit (e.g., a gaming console or automotive entertainment
unit), a digital camera, an appliance, a portable music player, or
a digital video recorder. In further implementations, the computer
device 2800 may be any other electronic device that processes
data.
[0234] Example 1 may include a heat exchanger puck, comprising a
first plate of the heat exchanger puck with a cavity that extends
into the first plate from a side of the first plate, a second plate
of the heat exchanger puck coupled to the side of the first plate
with the cavity located between the first plate and the second
plate, and a tube of a liquid coolant system located, at least
partially, within the cavity, the tube formed to fit the cavity
created by the first plate and the second plate.
[0235] Example 2 may include the heat exchanger puck of example 1,
wherein the first plate is to contact the tube around a first
portion of a circumference of the tube and the second plate is to
contact the tube around a second portion of the circumference.
[0236] Example 3 may include the heat exchanger puck of example 2,
wherein the first portion of the circumference and the second
portion of the circumference together are an entirety of the
circumference of the tube.
[0237] Example 4 may include the heat exchanger puck of any of the
examples 1-3, wherein the cavity is a first cavity, and wherein the
second plate comprises a second cavity that extends into the second
plate from a side of the second plate coupled to the first plate,
wherein the second cavity is aligned with the first cavity, to at
least partially receive the tube.
[0238] Example 5 may include the heat exchanger puck of any of the
examples 1-3, wherein a width of the cavity increases as the cavity
extends into the first plate from the side of the first plate, and
wherein a side wall of the first plate contacts the tube where the
width of the cavity has increased from the side of the first
plate.
[0239] Example 6 may include the heat exchanger puck of any of the
examples 1-3, wherein the first plate and the second plate are cold
plates.
[0240] Example 7 may include the heat exchanger puck of any of the
examples 1-3, wherein the hydroformed tube is pentagon shaped.
[0241] Example 8 may include the heat exchanger puck of example 1,
wherein the hydroformed tube is butterfly shaped.
[0242] Example 9 may include the heat exchanger puck of any of the
examples 1-3, wherein the tube is formed to fit the cavity created
by the first plate and the second plate while the tube resides
within the cavity created by the first plate and the second
plate.
[0243] Example 10 may include a liquid coolant system, comprising a
tube to carry liquid coolant within the liquid coolant system, a
pump coupled to the tube to provide pressure to move the liquid
coolant within the tube, and a heat exchanger puck coupled to a
portion of the tube, the portion of the tube located within a
cavity of the heat exchanger puck and formed to fit the cavity by
the heat exchanger puck, wherein the heat exchanger puck is to be
attached to an electronic device.
[0244] Example 11 may include the liquid coolant system of example
10, wherein the portion of the tube is formed to a shape based on a
predetermined pressure drop associated with the portion of the
tube.
[0245] Example 12 may include the liquid coolant system of any of
the examples 10 and 12, wherein the heat exchanger puck includes a
first plate and a second plate, the cavity of the heat exchanger
puck formed between the first plate and the second plate, and
wherein the portion of the tube is formed to fit the cavity by the
first plate and the second plate as the first plate is affixed to
the second plate.
[0246] Example 13 may include the liquid coolant system of any of
the examples 10 and 11, wherein the heat exchanger puck includes a
first plate and a second plate, the cavity of the heat exchanger
puck formed between the first plate and the second plate, and
wherein the first plate and the second plate are constructed of
thermal conductive material to transfer heat to the liquid carried
within the tube.
[0247] Example 14 may include a method of manufacturing a heat
exchanger puck, comprising compressing a first plate of the heat
exchanger puck and a second plate of the heat exchanger puck
together, the first plate and the second plate forming a cavity
between the first plate and the second plate, wherein a portion of
a tube of a liquid coolant system is located within the cavity and
the compression causes the portion of the tube to deform, and
affixing the second plate to the side of the first plate.
[0248] Example 15 may include the method of example 14, further
comprising applying epoxy to the side of the first plate, wherein
affixing the second plate to the side of the first plate includes
curing the epoxy while the first plate and the second plate are
compressed together.
[0249] Example 16 may include the method of any of the examples 14
and 15, further comprising reducing a thickness of the first plate
by a flycut process applied to the first plate after affixing of
the second plate to the side of the first plate.
[0250] Example 17 may include the method of any of the examples 14
and 15, further comprising hydroforming the portion of the tube to
the first plate and the second plate after affixing the second
plate to the side of the first plate.
[0251] Example 18 may include the method of example 17, wherein the
hydroforming of the portion of the tube causes a circumference of
the portion of the tube to expand.
[0252] Example 19 may include the method of example 18, wherein the
circumference of the portion of the tube expands to fill the
cavity.
[0253] Example 20 may include the method of example 17, wherein the
hydroforming of the portion of the tube causes a reduction in tube
wall thickness of the portion of the tube.
[0254] Example 21 may include the method of any of the examples 14
and 15, further comprising attaching the heat exchanger puck to an
electronic component to be cooled by the heat exchanger puck.
[0255] Example 22 may include a method of manufacturing a heat
exchanger puck, comprising affixing a first portion of the heat
exchanger puck to a second portion of the heat exchanger puck with
a portion of a tube of a liquid coolant system located in a cavity
formed between the first portion and the second portion of the heat
exchanger puck, and hydroforming the portion of the tube within the
cavity.
[0256] Example 23 may include the method of example 22, further
comprising applying a thermal epoxy to the first portion of the
heat exchanger puck, and compressing the first portion and the
second portion of the heat exchanger puck together, wherein
affixing the first portion of the heat exchanger puck to the second
portion of the heat exchanger puck includes curing the thermal
epoxy while the first portion and the second portion of the heat
exchanger puck are compressed together.
[0257] Example 24 may include the method of any of the examples 22
and 23, further comprising machining the first portion of the heat
exchanger puck with a first portion of the cavity extending into
the first portion of the heat exchanger puck, and machining the
second portion of the heat exchanger puck with a second portion of
the cavity extending into the second portion of the heat exchanger
puck, wherein affixing the first portion of the heat exchanger puck
to the second portion of the heat exchanger puck includes aligning
the first portion of the cavity with the second portion of the
cavity while affixing the first portion of the heat exchanger puck
to the second portion of the heat exchanger puck.
[0258] Example 25 may include the method of any of the examples 22
and 23, further comprising applying a force to one or both of the
first portion of the heat exchanger puck and the second portion of
the heat exchanger puck to maintain affixation of the first portion
of the heat exchanger puck to the second portion of the heat
exchanger puck while hydroforming the portion of the tube, and
removing the force after hydroforming the portion of the tube.
[0259] Example 26 may include the method of any of the examples 22
and 23, wherein hydroforming the portion of the tube includes
expanding the tube to fill the cavity.
[0260] Example 27 may include the method of example 26, wherein at
least a portion of an exterior of the portion of the tube avoids
contact with the first portion of the heat exchanger puck and the
second portion of the heat exchanger puck prior to hydroforming the
portion of the tube, and wherein an entirety of the exterior of the
portion of the tube contacts one or both of the first portion of
the heat exchanger puck and the second portion of the heat
exchanger puck after hydroforming the portion of the tube.
[0261] Example 28 may include a liquid coolant system, comprising a
heat exchanger puck with a cavity formed in the heat exchanger
puck, a tube to carry liquid coolant within the liquid coolant
system, a portion of the tube located within the cavity and that
enters the cavity through an opening at a side of the heat
exchanger puck, a shape of the cavity to affect flexibility of the
tube at the opening, the portion of the tube formed to fit the
shape of the cavity by the heat exchanger puck, and a pump coupled
to the tube to provide pressure to move the liquid coolant within
the tube.
[0262] Example 29 may include the liquid coolant system of example
28, wherein the heat exchanger puck includes a first plate with a
cavity that extends into the first plate from a side of the first
plate, a second plate coupled to the side of the first plate with
the cavity located between the first plate and the second plate,
wherein the portion of the tube is formed to fit the shape of the
cavity as the second plate is coupled to the first plate.
[0263] Example 30 may include the liquid coolant system of example
28, wherein the portion of the tube is formed to fit the shape of
the cavity via a hydroformation process applied to the portion of
the tube as the portion of the tube is located within the
cavity.
[0264] Example 31 may include the liquid coolant system of example
30, wherein the hydroformation process causes tube wall thickness
of the portion of the tube to be decreased, the flexibility of the
tube at the opening is increased based on the decreased tube wall
thickness.
[0265] Example 32 may include the liquid coolant system of any of
the examples 28-31, wherein the shape of the cavity is an ellipse,
the flexibility of the tube to be increased at the opening in
directions corresponding to the smallest diameter of the
ellipse.
[0266] Example 33 may include the liquid coolant system of any of
the examples 28-31, wherein a width of the cavity is less than a
length of the cavity, the flexibility of the tube to be increased
at the opening in directions corresponding to the width of the
cavity.
[0267] Example 34 may include the liquid coolant system of any of
the examples 28-31, wherein a length of a second portion of the
tube located between the heat exchanger puck and the pump is
selected based on a predetermined flexibility for the second
portion of the tube.
[0268] Example 35 may include the liquid coolant system of example
34, wherein a profile of the second portion of the tube is selected
based on the predetermined flexibility for the second portion of
the tube.
[0269] Example 36 may include the liquid coolant system of example
35, wherein the profile of the second portion of the tube includes
a ridged portion to promote flexibility of the second portion.
[0270] Example 37 may include the liquid coolant system of any of
the examples 28-31, further comprising a second heat exchanger puck
with a cavity formed in the second heat exchanger puck, a second
portion of the tube located within the cavity of the second heat
exchanger puck, wherein a distance between the portion of the tube
located within the cavity of the heat exchanger puck and the second
portion of the tube located within the cavity of the second heat
exchanger puck is selected based on a predetermined flexibility for
a third portion of the tube located between the heat exchanger puck
and the second heat exchanger puck.
[0271] Example 38 may include the liquid coolant system of example
37, wherein a profile of the third portion of the tube is selected
based on the predetermined flexibility for the third portion of the
tube.
[0272] Example 39 may include a method of hydroforming a tube of a
liquid coolant system, comprising affixing a hydroform tooling mold
around the tube, the tube extending within a cavity formed by the
hydroform tooling mold, applying a hydroforming process to the
tube, the hydroforming process to causing the tube to expand to
fill at least a portion of the cavity, and removing the hydroform
tooling mold from around the tube.
[0273] Example 40 may include the method of example 39, wherein
affixing the hydroform tooling mold includes affixing a upper mold
of the hydroform tooling mold and a lower mold of the hydroform
tooling mold together, the upper mold extending around a first
portion of the tube and the second mold extending around a
remaining portion of the tube, and wherein removing the hydroform
tooling mold includes uncoupling the upper mold from the lower
mold, removing the upper mold from around the first portion of the
tube, and removing the lower mold from around the remaining portion
of the tube.
[0274] Example 41 may include the method of any of the examples 39
and 40, wherein the cavity includes a plurality of ridges, and
wherein applying the hydroforming process to the tube causes to the
tube to expand into the plurality of ridges and develop a ridged
portion.
[0275] Example 42 may include an apparatus of a liquid coolant
system, comprising a rigid support plate to be disposed in an
electronic environment, the rigid support plate includes an
aperture that aligns with an electronic component of the electronic
environment when the rigid support plate is disposed in the
electronic environment, a heat exchanger puck to be positioned
within the aperture and to be thermally coupled to the electronic
component, and a tube to carry liquid coolant of the liquid coolant
system to cool the heat exchange puck, a first portion of the tube
affixed to the heat exchanger puck, a second portion of the tube
affixed to the rigid support plate, and a third portion of the
tube, located between the first portion and the second portion,
detached from the heat exchanger puck and the rigid support
plate.
[0276] Example 43 may include the apparatus of example 42, wherein
the third portion extends, at least partially, along a surface of
the rigid support plate, the surface of the rigid support plate
being on an opposite side of the rigid support plate from the
electronic component when the rigid support plate is disposed in
the electronic environment.
[0277] Example 44 may include the apparatus of any of the examples
42 and 43, wherein the heat exchanger puck is translatable to be
positioned against a surface of the electronic component, an amount
of available translation of the heat exchanger puck based, at least
in part, on a length of the third portion.
[0278] Example 45 may include the apparatus of any of the examples
42 and 43, wherein the heat exchanger puck is translatable to be
positioned against a surface of the electronic component, an amount
of available translation of the heat exchanger puck based, at least
in part, on a profile of the third portion.
[0279] Example 46 may include the apparatus of any of the examples
42 and 43, wherein the third portion is to generate a compression
force between the heat exchanger puck and the electronic component
when thermally coupled, the compression force being based, at least
in part, on a length of the third portion.
[0280] Example 47 may include the apparatus of any of the examples
42 and 43, wherein the third portion is to generate a compression
force between the heat exchanger puck and the electronic component
when thermally coupled, the compression force being based, at least
in part, on a profile of the third portion.
[0281] Example 48 may include the apparatus of example 45, wherein
the profile of the third portion is narrower along a first axis
than a second axis.
[0282] Example 49 may include the apparatus of example 45, wherein
the third portion is corrugated.
[0283] Example 50 may include the apparatus of any of the examples
42 and 43, wherein the second portion is affixed to the rigid
support plate via fasteners, and wherein the second portion is
separable from the rigid support plate via removal of the
fasteners.
[0284] Example 51 may include the apparatus of any of the examples
42 and 43, wherein the third portion includes tube unions that
allow for separation of the first portion from the second portion
to allow interchange of the heat exchanger puck.
[0285] Example 52 may include the apparatus of any of the examples
42 and 43, further comprising an attachment mechanism to attach the
heat exchanger puck to the rigid support plate, the attachment
mechanism to provide a compression force between the heat exchanger
puck and the electronic component.
[0286] Example 53 may include the apparatus of example 52, wherein
the attachment mechanism comprises a fastener to attach the heat
exchanger puck to the rigid support plate, and a spring located
between a head of the fastener and the heat exchanger puck when the
fastener attaches the heat exchanger puck to the rigid support
plate, the spring to provide the compression force between the heat
exchanger puck and the electronic component.
[0287] Example 54 may include the apparatus of any of the examples
42 and 43, wherein the electronic component is a first electronic
component of the electronic environment, the heat exchanger puck is
a first heat exchanger puck, the rigid support plate includes a
second aperture that aligns with a second electronic component of
the electronic environment when the rigid support plate is disposed
in the electronic environment, and wherein the apparatus further
comprises a second heat exchanger puck to be positioned within the
second aperture and to be thermally coupled to the second
electronic component, wherein a fourth portion of the tube is
affixed to the second heat exchanger puck and a fifth portion of
the tube, located between the second portion and the fourth
portion, is detached from the second heat exchanger puck and the
rigid support plate.
[0288] Example 55 may include the apparatus of example 54, wherein
a first compression force, generated by the third portion of the
tube, between the first heat exchanger puck and the first
electronic component is different than a second compression force,
generated by the fifth portion of the tube, between the second heat
exchanger puck and the second electronic component.
[0289] Example 56 may include the apparatus of example 55, wherein
the first compression force, generated by the third portion of the
tube, is based, at least in part, on a length of the third portion
of the tube, and wherein the second compression force, generated by
the fifth portion of the tube, is based, at least in part, on a
length or a profile of the fifth portion of the tube.
[0290] Example 57 may include the apparatus of example 55, wherein
the first compression force, generated by the third portion of the
tube, is based, at least in part, on a profile of the third portion
of the tube, and wherein the second compression force, generated by
the fifth portion of the tube, is based, at least in part, on a
length or profile of the fifth portion of the tube.
[0291] Example 58 may include the apparatus of example 54, further
comprising a first attachment mechanism to attach the first heat
exchanger puck to the rigid support plate, and to generate a first
compression force between the first heat exchanger puck and the
first electronic component when the first attachment mechanism
attaches the first heat exchanger puck to the rigid support plate,
and a second attachment mechanism to attach the second heat
exchanger puck to the rigid support plate, and to generate a second
compression force between the second heat exchanger puck and the
second electronic component when the second attachment mechanism
attaches the second heat exchanger puck to the rigid support plate,
the second compression force being different than the first
compression force.
[0292] Example 59 may include an electronic environment, comprising
a printed circuit board (PCB), a rigid support plate mounted to the
PCB, the rigid support plate includes an aperture aligned with an
electronic component mounted on the PCB, and a liquid coolant
system coupled to the rigid support plate, the liquid coolant
system comprising a heat exchanger puck positioned within the
aperture and thermally coupled to the electronic component, a tube
with a first portion of the tube affixed to the heat exchanger
puck, a second portion of the tube affixed to the rigid support
plate, and a third portion of the tube, located between the first
portion and the second portion, detached from the heat exchanger
puck and the rigid support plate, and a pump coupled to the tube to
provide pressure to move liquid coolant within the tube.
[0293] Example 60 may include the electronic environment of example
59, wherein the third portion extends, at least partially, along a
surface of the rigid support plate, the surface of the rigid
support plate on an opposite side of the rigid support plate from
the PCB.
[0294] Example 61 may include the electronic environment of any of
the examples 59 and 60, wherein the third portion is to generate a
compression force between the heat exchanger puck and the
electronic component, the compression force based, at least in
part, on a length of the third portion.
[0295] Example 62 may include the electronic environment of any of
the examples 59 and 60, wherein the third portion is to generate a
compression force between the heat exchanger puck and the
electronic component, the compression force based, at least in
part, on a profile of the third portion.
[0296] Example 63 may include the electronic environment of example
62, wherein the profile of the third portion is narrower along a
first axis than a second axis.
[0297] Example 64 may include the electronic environment of example
62, wherein the third portion is corrugated.
[0298] Example 65 may include the electronic environment of example
62, wherein the second portion is affixed to the rigid support
plate via fasteners, the second portion separable from the rigid
support plate via removal of the fasteners.
[0299] Example 66 may include the electronic environment of example
62, wherein the third portion includes tube unions that allow for
separation of the first portion from the second portion to allow
interchange of the heat exchanger puck.
[0300] Example 67 may include the electronic environment of example
62, wherein the liquid coolant system further comprises an
attachment mechanism that attaches the heat exchanger puck to the
rigid support plate, wherein the attachment mechanism is to provide
a compression force between the heat exchanger puck and the
electronic component.
[0301] Example 68 may include the electronic environment of example
67, wherein the attachment mechanism comprises a fastener that
attaches the heat exchanger puck to the rigid support plate, and a
spring located between a head of the fastener and the heat
exchanger puck, wherein the spring is to provide the compression
force.
[0302] Example 69 may include the electronic environment of any of
the examples 59 and 60, wherein the heat exchanger puck is a first
heat exchanger puck and the electronic component is a first
electronic component, wherein the rigid support plate includes a
second aperture aligned with a second electronic component mounted
on the PCB, and wherein the liquid coolant system further comprises
a second heat exchanger puck positioned within the second aperture
and thermally coupled to the second electronic component, wherein a
fourth portion of the tube is affixed to the second heat exchanger
puck and a fifth portion of the tube, located between the second
portion and the fourth portion, is detached from the second heat
exchanger puck and the rigid support plate.
[0303] Example 70 may include the electronic environment of example
69, wherein a first compression force, to be generated by the third
portion of the tube, between the first heat exchanger puck and the
first electronic component is different than a second compression
force, to be generated by the fifth portion of the tube, between
the second heat exchanger puck and the second electronic
component.
[0304] Example 71 may include the electronic environment of example
70, wherein the first compression force, to be generated by the
third portion of the tube, is based, at least in part, on a length
of the third portion of the tube, and wherein the second
compression force, to be generated by the fifth portion of the
tube, is based, at least in part, on a length or a profile of the
fifth portion of the tube.
[0305] Example 72 may include the electronic environment of example
70, wherein the first compression force, to be generated by the
third portion of the tube, is based, at least in part, on a profile
of the third portion of the tube, and wherein the second
compression force, to be generated by the fifth portion of the
tube, is based, at least in part, on a length or a profile of the
fifth portion of the tube.
[0306] Example 73 may include the electronic environment of example
69, wherein the liquid coolant system further comprises a first
attachment mechanism that attaches the first heat exchanger puck to
the rigid support plate, wherein the first attachment mechanism
generates a first compression force between the first heat
exchanger puck and the first electronic component, and a second
attachment mechanism that attaches the second heat exchanger puck
to the rigid support plate, wherein the second attachment mechanism
generates a second compression force between the second heat
exchanger puck and the second electronic component, the second
compression force different than the first compression force.
[0307] It will be apparent to those skilled in the art that various
modifications and variations can be made in the disclosed
embodiments of the disclosed device and associated methods without
departing from the spirit or scope of the disclosure. Thus, it is
intended that the present disclosure covers the modifications and
variations of the embodiments disclosed above provided that the
modifications and variations come within the scope of any claims
and their equivalents.
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