U.S. patent application number 15/462933 was filed with the patent office on 2018-02-08 for vertical-type memory device.
The applicant listed for this patent is Jae-young AHN, Ji-hoon CHOI, Hong-suk KIM, SeuI-ye KIM, Sung-gil KIM, Phil-ouk Nam. Invention is credited to Jae-young AHN, Ji-hoon CHOI, Hong-suk KIM, SeuI-ye KIM, Sung-gil KIM, Phil-ouk Nam.
Application Number | 20180040628 15/462933 |
Document ID | / |
Family ID | 60935070 |
Filed Date | 2018-02-08 |
United States Patent
Application |
20180040628 |
Kind Code |
A1 |
Nam; Phil-ouk ; et
al. |
February 8, 2018 |
VERTICAL-TYPE MEMORY DEVICE
Abstract
A vertical-type memory device may include a channel layer
vertically extending on a substrate, a ground selection transistor
at a side of the channel layer on the substrate, the ground
selection transistor including a first gate insulation portion and
a first replacement gate electrode, an etch control layer on the
first replacement gate electrode, and a memory cell on the etch
control layer, the memory cell including a second gate insulation
portion and a second replacement gate electrode. The etch control
layer may include a polysilicon layer doped with carbon, N-type
impurities, or P-type impurities, or may include a polysilicon
oxide layer comprising carbon, N-type impurities, or P-type
impurities. A thickness of the first replacement gate electrode may
be the same as a thickness of the second replacement gate
electrode, or the first replacement gate electrode may be thicker
than the second.
Inventors: |
Nam; Phil-ouk; (Osan-si,
KR) ; KIM; Sung-gil; (Yongin-si, KR) ; CHOI;
Ji-hoon; (Seongnam-si, KR) ; KIM; SeuI-ye;
(Seoul, KR) ; AHN; Jae-young; (Seongnam-si,
KR) ; KIM; Hong-suk; (Yongin-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Nam; Phil-ouk
KIM; Sung-gil
CHOI; Ji-hoon
KIM; SeuI-ye
AHN; Jae-young
KIM; Hong-suk |
Osan-si
Yongin-si
Seongnam-si
Seoul
Seongnam-si
Yongin-si |
|
KR
KR
KR
KR
KR
KR |
|
|
Family ID: |
60935070 |
Appl. No.: |
15/462933 |
Filed: |
March 20, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/11582 20130101;
H01L 27/11556 20130101; H01L 27/1157 20130101; H01L 29/7827
20130101 |
International
Class: |
H01L 27/11582 20060101
H01L027/11582; H01L 29/78 20060101 H01L029/78; H01L 27/11556
20060101 H01L027/11556 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 5, 2016 |
KR |
10-2016-0100125 |
Claims
1. A vertical-type memory device comprising: a channel layer
vertically extending on a substrate; a ground selection transistor
at a side of the channel layer on the substrate, the ground
selection transistor comprising a first gate insulation portion and
a first replacement gate electrode; an etch control layer on the
first replacement gate electrode; and a memory cell on the etch
control layer, the memory cell comprising a second gate insulation
portion and a second replacement gate electrode.
2. The vertical-type memory device of claim 1, wherein the etch
control layer comprises a polysilicon layer doped with carbon,
N-type impurities, or P-type impurities.
3. The vertical-type memory device of claim 1, wherein the etch
control layer comprises a polysilicon oxide layer comprising
carbon, N-type impurities, or P-type impurities.
4. The vertical-type memory device of claim 1, wherein a thickness
of the first replacement gate electrode is the same as a thickness
of the second replacement gate electrode.
5. The vertical-type memory device of claim 1, wherein a recess
side groove in the first replacement gate electrode is under the
etch control layer, and the first gate insulation portion is in the
recess side groove.
6. The vertical-type memory device of claim 1, wherein a thickness
of the first replacement gate electrode is greater than a thickness
of the second replacement gate electrode.
7. The vertical-type memory device of claim 6, wherein a recess
side groove in the first replacement gate electrode is under the
etch control layer, and the channel layer and the first gate
insulation portion are in the recess side groove.
8. The vertical-type memory device of claim 1, wherein the first
replacement gate electrode is adjacent to a sidewall of a laterally
extending portion of the first gate insulation portion.
9. The vertical-type memory device of claim 1, wherein the channel
layer has an internal opening portion filled with a filling
insulation layer.
10. The vertical-type memory device of claim 1, wherein the
substrate comprises a recess, and wherein the channel layer
vertically extends into the recess and contacts the substrate.
11. A vertical-type memory device comprising: a channel layer
vertically extending on a substrate; a gate insulation layer at a
side of the channel layer, the gate insulation layer vertically
extending on the substrate; an etch control layer at a side of the
gate insulation layer, the etch control layer extending
horizontally with respect to the substrate and separated vertically
with respect to the substrate by a first opening; a first
replacement gate electrode in the first opening under the etch
control layer; a plurality of interlayer insulation layers stacked
on the etch control layer vertically with respect to the substrate,
and separate from each other due to a plurality of second openings;
and a second replacement gate electrode in each of the plurality of
second openings.
12. The vertical-type memory device of claim 11, wherein the etch
control layer comprises a polysilicon layer doped with impurities
or a polysilicon oxide layer.
13. The vertical-type memory device of claim 11, wherein a
thickness of the first replacement gate electrode is the same as a
thickness of the second replacement gate electrode.
14. The vertical-type memory device of claim 11, wherein a recess
side groove that faces the channel layer is under the etch control
layer, and the gate insulation layer is in the recess side
groove.
15. The vertical-type memory device of claim 11, wherein a
thickness of the first replacement gate electrode is greater than a
thickness of the second replacement gate electrode, a recess side
groove that faces the channel layer is under the etch control
layer, and the channel layer and the gate insulation layer are in
the recess side groove.
16. A vertical-type memory device, comprising: a channel layer
vertically extending on a substrate; a pad insulation material
layer on the substrate; an etch control layer above the pad
insulation material layer; a gate insulation layer at a side of the
channel layer, the gate insulation layer vertically extending on a
wall of the etch control layer and horizontally extending into a
recess between the etch control layer and the pad insulation
material layer; and a first replacement gate electrode on a wall of
the gate insulation layer between the etch control layer and the
pad insulation material layer.
17. The vertical-type memory device of claim 16, further
comprising: a plurality of interlayer insulation layers stacked on
the etch control layer vertically with respect to the substrate,
and separated from each other by one of a plurality of second
replacement gate electrodes.
18. The vertical-type memory device of claim 17, wherein a
thickness of the first replacement gate electrode is smaller than a
common thickness of the plurality of second replacement gate
electrodes.
19. The vertical-type memory device of claim 16, wherein the etch
control layer comprises a polysilicon layer doped with impurities
or a polysilicon oxide layer.
20. The vertical-type memory device of claim 16, wherein the
vertical-type memory device is free from a silicon epi-layer from
under the channel layer.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of Korean Patent
Application No. 10-2016-0100125, filed on Aug. 5, 2016, in the
Korean Intellectual Property Office, the disclosure of which is
incorporated herein in its entirety by reference.
BACKGROUND
1. Technical Field
[0002] The present disclosure relates to a memory device, and more
particularly, to a vertical-type memory device.
2. Description of Related Art
[0003] Electronic products have gradually decreased in size, but
are still expected to perform high-capacity data processing.
Accordingly, it may be desirable to increase the degree of
integration of memory devices that are used in such electronic
products. One possible method of improving the degree of
integration of memory devices, where vertical-type memory devices
having a vertical transistor structure instead of a planar
transistor structure are used, has been proposed.
SUMMARY
[0004] The present disclosure may provide a vertical-type memory
device that may be more reliable and may be easier to
manufacture.
[0005] According to an aspect of the present disclosure, there is
provided a vertical-type memory device including a channel layer
vertically extending on a substrate, a ground selection transistor
at a side of the channel layer on the substrate, the ground
selection transistor including a first gate insulation portion and
a first replacement gate electrode, an etch control layer on the
first replacement gate electrode, and a memory cell on the etch
control layer, the memory cell including a second gate insulation
portion and a second replacement gate electrode.
[0006] According to another aspect of the present disclosure, there
is provided a vertical-type memory device including a channel layer
vertically extending on a substrate, a gate insulation layer at a
side of the channel layer, the gate insulation layer vertically
extending on the substrate, an etch control layer at a side of the
gate insulation layer, the etch control layer extending
horizontally with respect to the substrate and separated vertically
with respect to the substrate by a first opening, a first
replacement gate electrode in the first opening under the etch
control layer, a plurality of interlayer insulation layers stacked
on the etch control layer vertically with respect to the substrate,
and separate from each other due to a plurality of second openings,
and a second replacement gate electrode in each of the plurality of
second openings.
[0007] According to another aspect of the present disclosure, there
is provided a vertical-type memory device. The vertical-type memory
device may include a channel layer vertically extending on a
substrate and a pad insulation material layer on the substrate. An
etch control layer may be above the pad insulation material layer.
The vertical-type memory device may include a gate insulation layer
at a side of the channel layer, which may vertically extend on a
wall of the etch control layer and horizontally extend into a
recess between the etch control layer and the pad insulation
material layer. The vertical-type memory device may include a first
replacement gate electrode on a wall of the gate insulation layer
between the etch control layer and the pad insulation material
layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Aspects of the present disclosure will be more clearly
understood from the following detailed description taken in
conjunction with the accompanying drawings in which:
[0009] FIG. 1 is a circuit diagram for describing a vertical-type
memory device according to aspects of the present disclosure;
[0010] FIGS. 2A and 2B are cross-sectional views of main portions
of vertical-type memory devices according to aspects of the present
disclosure;
[0011] FIGS. 3A and 3B are cross-sectional views of main portions
of vertical-type memory devices according to aspects of the present
disclosure;
[0012] FIGS. 4 to 19 are diagrams for describing a vertical-type
memory device and a manufacturing method thereof, according to
aspects of the present disclosure;
[0013] FIGS. 20 and 21 are cross-sectional views for describing a
vertical-type memory device and a manufacturing method thereof,
according to aspects of the present disclosure;
[0014] FIG. 22 is a cross-sectional view for describing a
vertical-type memory device and a manufacturing method thereof,
according to aspects of the present disclosure;
[0015] FIG. 23 is a cross-sectional view for describing a
vertical-type memory device and a manufacturing method thereof,
according to aspects of the present disclosure; and
[0016] FIG. 24 is a schematic block diagram for describing a
vertical-type memory device according to aspects of the present
disclosure.
DETAILED DESCRIPTION
[0017] Hereinafter, exemplary embodiments of the present disclosure
will be described in detail with reference to the accompanying
drawings. The singular forms "a," "an," and "the" used herein are
intended to include the plural forms as well, unless the context
clearly indicates otherwise.
[0018] FIG. 1 is a circuit diagram for describing a vertical-type
memory device 1100 according to aspects of the present
disclosure.
[0019] In detail, FIG. 1 illustrates a memory cell array 820 of the
vertical-type memory device 1100. The vertical-type memory device
1100 may include unit cell strings S each including n memory cells
MC1 to MCn connected to each other in series, a ground selection
transistor GST connected to one of the two ends of the memory cells
MC1 to MCn in series, and a string selection transistor SST
connected to the other end of the memory cells MC1 to MCn. The unit
cell strings S are connected in parallel between n bit lines BL1 to
BLn and a ground selection line GSL.
[0020] The n memory cells MC1 to MCn connected to each other in
series may be respectively connected to word lines WL1 to WLn for
selecting at least some of the memory cells MC1 to MCn. A gate
terminal (gate electrode) of the ground selection transistor GST
may be connected to the ground selection line GSL, and a source
terminal of the ground selection transistor GST may be connected to
a common source line CSL.
[0021] A gate terminal (gate electrode) of the string selection
transistor SST may be connected to a string selection line SSL, and
a source terminal of the string selection transistor SST may be
connected to a drain terminal of a memory cell MCn. Although FIG. 1
illustrates a structure where one ground selection transistor GST
and one string selection transistor SST are connected to the n
memory cells MC1 to MCn connected to each other in series, if
necessary, a plurality of ground selection transistors GST or a
plurality of string selection transistors SST may be connected
thereto.
[0022] A drain terminal of the string selection transistor SST may
be connected to the bit lines BL1 to BLn. When a signal is applied
to the gate terminal of the string selection transistor SST via the
string selection line SSL, the signal that is applied via the bit
lines BL1 to BLn may be transmitted to the n memory cells MC1 to
MCn connected to each other in series, and thus, an operation of
reading or writing data may be performed.
[0023] In addition, the source terminal of the string selection
transistor SST may apply a signal to the gate terminal of the
ground selection transistor GST connected to the common source line
CSL via the ground selection line GSL, thereby performing an erase
operation in which charges stored in the n memory cells MC1 to MCn
are all removed.
[0024] FIGS. 2A and 2B are cross-sectional views of main portions
of vertical-type memory devices 1100a and 1100b according to
aspects of the present disclosure.
[0025] In detail, the vertical-type memory devices 1100a and 1100b
of FIGS. 2A and 2B are illustrated for explaining reference numeral
10 of FIG. 1. Particularly, FIGS. 2A and 2B may be diagrams for
describing the ground selection transistor GST and a memory cell
MC1 of FIG. 1. FIGS. 2A and 2B may be the same as, or similar to,
each other except for composition materials of etch control layers
406x and 406.
[0026] Each of the vertical-type memory devices 1100a and 1100b of
FIGS. 2A and 2B may include a channel layer 454, which may extend
vertically (e.g., in direction z) on a substrate 400. The substrate
400 may extend orthogonally to the channel layer 454 (e.g., in
direction x or in direction y). As illustrated in FIGS. 2A and 2B,
the channel layer 454 may be a pillar-type channel layer filled
with a filling insulation layer 456. The channel layer 454 may be a
hollow cylinder-type channel layer. A recess 400r may be in the
substrate 400. The channel layer 454 may be in the recess 400r and
may contact the substrate 400.
[0027] A gate insulation layer 448 may be disposed vertically on
the substrate 400 and at a side of the channel layer 454. The gate
insulation layer 448 may include a blocking insulation layer 447a,
a charge storage layer 447b, and a tunnel insulation layer 447c. A
ground selection transistor (e.g., the GST illustrated in FIG. 1)
including a first gate insulation portion 448a and a first
replacement gate electrode 464 may be at a side of the channel
layer 454. The first replacement gate electrode 464 may have a
recess facing the channel layer 454.
[0028] An etch control layer (406x in FIG. 2A, 406 in FIG. 2B) may
be provided. Each of the etch control layers 406x and 406 may be on
the first replacement gate electrode 464. At a side of the first
gate insulation portion 448a, each of the etch control layers 406x
and 406 may extend horizontally (e.g., parallel) with respect to
the substrate 400 (e.g., in direction x or in direction y). Each of
the etch control layers 406x and 406 may be separated vertically
with respect to the substrate 400 by a first opening 460, which may
be referred to herein in some embodiments as a first rib groove
460. The first replacement gate electrode 464 may fill in the first
rib groove 460 under each of the etch control layers 406x and 406.
The first replacement gate electrode 464 may include a metal layer,
for example, tungsten (W).
[0029] The etch control layer 406x of FIG. 2A may be a polysilicon
oxide layer including N-type impurities or P-type impurities. The
etch control layer 406 of FIG. 2B may be a polysilicon layer doped
with carbon, N-type impurities, or P-type impurities. A recess side
groove 446 may be under each of the etch control layers 406x and
406. The first gate insulation portion 448a may be in the recess
side groove 446.
[0030] A memory cell (MC1 of FIG. 1), which may be separated by
interlayer insulation layers 420 and may include a second gate
insulation portion 448b and a second replacement gate electrode
466, may be on each of the etch control layers 406x and 406.
[0031] On each of the etch control layers 406x and 406, the
interlayer insulation layers 420 may be stacked vertically with
respect to the substrate 400. The interlayer insulation layers 420
may be separate from each other due to a second opening 462, which
may be referred to herein in some embodiments as a second rib
groove 462. Each of FIGS. 2A and 2B shows only one memory cell, and
accordingly, shows only two interlayer insulation layers 420 and
only one second rib groove 462. The second replacement gate
electrode 466 may fill in the second rib groove 462. The second
replacement gate electrode 466 may include a metal layer, for
example, tungsten (W). A thickness T2 of the second replacement
gate electrode 466 may be the same as a thickness T1 of the first
replacement gate electrode 464. The thicknesses T1 and T2 of the
first replacement gate electrode 464 and the second replacement
gate electrode 466 may correspond to a channel length.
[0032] As will be described later, the vertical-type memory devices
1100a and 1100b having the above-described structure may
respectively include the etch control layers 406x and 406 and thus
may allow the channel layer 454 to easily contact the substrate
400. Accordingly, in the vertical-type memory devices 1100a and
1100b, a silicon epi-layer under the channel layer 454 may be
omitted.
[0033] As will be described later, the vertical-type memory devices
1100a and 1100b according to the present disclosure may have a
thickness of the first replacement gate electrode 464 (a channel
length) adjusted during manufacturing processes and thus may have
thicknesses of the first replacement gate electrode 464 and the
second replacement gate electrode 466 that are the same as each
other.
[0034] As a result, as will be described later, the first
replacement gate electrode 464 and the second replacement gate
electrode 466 of the vertical-type memory devices 1100a and 1100b
according to the present disclosure may be formed simultaneously,
and thus, manufacturing processes may be simplified, and device
manufacturing costs may be decreased.
[0035] FIGS. 3A and 3B are cross-sectional views of main portions
of vertical-type memory devices 1100c and 1100d according to
aspects of the present disclosure.
[0036] In detail, the vertical-type memory devices 1100c and 1100d
of FIGS. 3A and 3B are illustrated for explaining reference numeral
10 of FIG. 1. Particularly, FIGS. 3A and 3B may be diagrams for
describing the ground selection transistor GST and the memory cell
MC1 of FIG. 1. FIGS. 3A and 3B may be the same as each other except
for composition materials of the etch control layers 406x and
406.
[0037] Compared to the vertical-type memory devices 1100a and 1100b
of FIGS. 2A and 2B, the vertical-type memory devices 1100c and
1100d of FIGS. 3A and 3B may be the same as the vertical-type
memory devices 1100a and 1100b except that a thickness T3 of a
first replacement gate electrode 464T is greater than the thickness
T2 of the second replacement gate electrode 466. When the thickness
T3 of the first replacement gate electrode 464T is greater than the
thickness T2 of the second replacement gate electrode 466, the
channel layer 454 and the first gate insulation portion 448a may be
formed in the recess side groove 446 under the etch control layer
406. When the channel layer 454 is formed in the recess side groove
446, characteristics of the ground selection transistor GST may
improve.
[0038] If necessary, the thickness T3 of the first replacement gate
electrode 464T may be less than the thickness T2 of the second
replacement gate electrode 466. As a result, in the vertical-type
memory devices 1100c and 1100d according to the present disclosure,
the thickness T3 of the first replacement gate electrode 464T may
differ from the thickness T2 of the second replacement gate
electrode 466.
[0039] FIGS. 4 to 19 are diagrams for describing a vertical-type
memory device and a manufacturing method thereof, according to
aspects of the present disclosure.
[0040] In detail, FIGS. 10, 11, 12, and 15 are cross-sectional
views including cross-sections taken along line b-b of FIGS. 16-19,
respectively. Also, FIGS. 16-19 are plan views taken along line a-a
of FIGS. 10, 11, 12, and 15, respectively.
[0041] Referring to FIG. 4, the substrate 400, which may include a
single crystal semiconductor material, is prepared. The substrate
400 may be, for example, a single crystal silicon substrate. The
single crystal silicon substrate may refer to a single crystal
silicon wafer, for example, a P-type single crystal silicon
wafer.
[0042] If necessary, an impurity region (not shown), for example,
an N-type impurity region, that is used as the common source line
CSL may be formed by doping a surface region of the substrate 400
with N-type impurities. The impurity region may be formed by doping
under a surface of the substrate 400 with N-type impurities. If
necessary, an impurity region that is formed as the common source
line CSL may be formed by selectively doping a substrate surface
that is under an isolating insulation layer with N-type impurities
in a subsequent process.
[0043] A pad insulation material layer 402a may be formed on the
substrate 400. The pad insulation material layer 402a may include
an oxide layer. The substrate 400 may be thermally oxidized, or an
oxide film may be deposited by a chemical vapor deposition method
to form the pad insulation material layer 402a. The pad insulation
material layer 402a may be provided to suppress stress that occurs
when a material layer that is formed subsequently directly contacts
the substrate 400.
[0044] A first etch control material layer 404a and a second etch
control material layer 406a may be sequentially formed on the pad
insulation material layer 402a. Each of the first etch control
material layer 404a and the second etch control material layer 406a
may include a material layer, for example, a polysilicon layer,
that may be etched by one etchant. The first etch control material
layer 404a and the second etch control material layer 406a may
include material layers having etch selectivity with respect to
each other.
[0045] In detail, the first etch control material layer 404a may be
formed on the pad insulation material layer 402a. The first etch
control material layer 404a may include a polysilicon layer not
doped with impurities or a polysilicon layer doped with N-type
impurities or P-type impurities. The N-type impurities may be
phosphorus (P) or arsenic (As). The P-type impurities may be boron
(B).
[0046] The second etch control material layer 406a may be formed on
the first etch control material layer 404a. The second etch control
material layer 406a may be formed of a material having etch
selectivity with respect to the first etch control material layer
404a. The second etch control material layer 406a may include a
polysilicon layer doped with carbon, P-type impurities, or N-type
impurities.
[0047] For example, when the first etch control material layer 404a
includes a polysilicon layer not doped with impurities, the second
etch control material layer 406a may include a polysilicon layer
doped with carbon, P-type impurities, or N-type impurities. When
the first etch control material layer 404a includes a polysilicon
layer doped with N-type impurities, the second etch control
material layer 406a may include a polysilicon layer doped with
carbon or P-type impurities.
[0048] The first etch control material layer 404a may be formed
thicker than the second etch control material layer 406a. The first
etch control material layer 404a may be removed in a subsequent
process. A thickness of the first etch control material layer 404a
may correspond to a thickness of a replacement gate electrode in a
subsequent process.
[0049] Material layers 411 to 415 and 431 to 434 respectively
constituting an interlayer insulation material layer 420a and a
sacrificial material layer 430a are alternately repeatedly stacked
on the second etch control material layer 406a a plurality of
times. The sacrificial material layer 430a and the interlayer
insulation material layer 420a may be formed by chemical vapor
deposition processes. A thickness T11 of the first etch control
material layer 404a may be the same as a thickness T12 of the
sacrificial material layer 430a.
[0050] The sacrificial material layer 430a may be formed of a
material having etch selectivity with respect to each of the
interlayer insulation material layer 420a and single crystal
silicon. Also, the sacrificial material layer 430a may be formed of
a material that may be easily removed by a wet etching process. In
the present embodiment, the sacrificial material layer 430a may
include a silicon nitride layer. The interlayer insulation material
layer 420a may include a silicon oxide layer.
[0051] In some embodiments according to FIG. 4, the interlayer
insulation material layers 411 and 415 may be formed on the top and
the bottom of the structure including repeatedly stacked layers.
The sacrificial material layer 430a may be removed in a subsequent
process, and may define, for each layer, a portion where a
replacement gate electrode is to be formed.
[0052] The number of individual material layers constituting the
sacrificial material layer 430a and the interlayer insulation
material layer 420a may be equal to or greater than the number of
memory cells and string selection transistors included in a unit
cell string. In some embodiments according to FIG. 4, the first to
fourth sacrificial material layers 431 to 434 and the first to
fifth interlayer insulation material layers 411 to 415 that are
alternately stacked on each other are illustrated for
convenience.
[0053] When the number of memory cells or string selection
transistors included in one unit cell string is greater than the
number of individual material layers constituting the sacrificial
material layer 430a and the interlayer insulation material layer
420a, more individual material layers constituting the sacrificial
material layer 430a and the interlayer insulation material layer
420a may be additionally stacked.
[0054] Referring to FIG. 5, a photoresist pattern (not shown) may
be formed on an uppermost interlayer insulation material layer (415
of FIG. 4). Next, a sacrificial material layer (430a of FIG. 4), an
interlayer insulation material layer (420a of FIG. 4), a second
etch control material layer (406a of FIG. 4), and a first etch
control material layer (404a of FIG. 4) may be sequentially etched
using the photoresist pattern as an etching mask.
[0055] Thus, stack structures 440 including a plurality of first
opening portions 442 may be formed as illustrated in FIG. 5. In
FIG. 5 and the following drawings, only a region denoted by
reference numeral 12 of FIG. 4 is illustrated for convenience in
order to describe the technical spirit of the present disclosure
more easily.
[0056] A stack structure 440 may include a sacrificial layer 430,
an interlayer insulation layer 420, the second etch control layer
406, and the first etch control layer 404. The plurality of first
opening portions 442 may be formed to zigzag in a second direction
(direction y). When a first opening portion 442 is formed, the
second etch control material layer (406a of FIG. 4) and the first
etch control material layer (404a of FIG. 4) may be etched using a
polysilicon etchant. Thus, the first opening portions 442 may be
uniformly formed. If necessary, the bottom of the first opening
portion 442 may be formed such that a surface of the pad insulation
material layer 402a is not exposed, and a portion of the first etch
control layer 404 may remain.
[0057] In order to form a vertical-type memory device that is
highly integrated, the first opening portion 442 may be configured
to have a minimum width that may be formed by a photo process. A
pillar-type channel layer or a hollow cylinder-type channel layer
may be formed in the first opening portion 442 by a subsequent
process. Accordingly, the first opening portion 442 may be referred
to as a channel hole. The first opening portion 442 may be easily
formed due to the second etch control material layer (406a of FIG.
4) and the first etch control material layer (404a of FIG. 4).
[0058] Referring to FIG. 6, a first etch control layer (404 of FIG.
5) is further etched to form an extended first opening portion
442e. The first etch control layer (404 of FIG. 5) that contacts
the first opening portion 442 is further etched via the first
opening portion 442 by a polysilicon etchant to form the extended
first opening portion 442e.
[0059] Since a second etch control layer (406 of FIG. 5) has etch
selectivity with respect to the first etch control layer (404 of
FIG. 5), the extended first opening portion 442e may be formed by
easily etching the first etch control layer (404 of FIG. 5). As the
extended first opening portion 442e is formed, a recess side groove
446 (recess side surface groove) may be formed under the second
etch control layer 406 and on a side of the first etch control
layer 404. As the recess side groove 446 is formed, the first etch
control layer 404 may be changed into a first etch control layer
404r having a recessed side at the extended first opening portion
442e.
[0060] The first opening portion 442 and the extended first opening
portion 442e may be easily formed due to the second etch control
material layer (406a of FIG. 4) and the first etch control material
layer 404a. Thus, according to the present disclosure, a silicon
epi-layer that contacts the substrate 400 may be omitted from under
the first opening portion 442 and the extended first opening
portion 442e in a subsequent process.
[0061] Referring to FIG. 7, the gate insulation layer 448 and a
spacer layer 450 may be formed in the first opening portion 442 and
the extended first opening portion 442e. The gate insulation 448
may include the first gate insulation portion 448a on an inner wall
of the extended first opening portion 442e and a second gate
insulation portion 448b on an inner wall of the first opening
portion 442. In other words, as illustrated in FIG. 7, the second
gate insulation portion 448b may be formed on inner walls of the
second etch control material layer 406, the interlayer insulation
layer 420, and the sacrificial layer 430.
[0062] The first gate insulation portion 448a may be formed in the
recess side groove 446. The first gate insulation portion 448a may
be included in a ground selection transistor. The second gate
insulation portion 448b may be included in a memory cell or a
string cell transistor.
[0063] The gate insulation layer 448 may include a blocking
insulation layer 447a, a charge storage layer 447b, and a tunnel
insulation layer 447c. The blocking insulation layer 447a may be
formed on the inner walls of the first opening portion 442 and the
extended first opening portion 442e. The blocking insulation layer
447a may include a silicon oxide layer. The blocking insulation
layer 447a may be formed by a chemical vapor deposition
process.
[0064] The charge storage layer 447b is formed along a surface of
the blocking insulation layer 447a. The charge storage layer 447b
may be formed by a chemical vapor deposition method. The charge
storage layer 447b may be formed by depositing silicon nitride or
metal oxide. The tunnel insulation layer 447c is formed on a
surface of the charge storage layer 447b. The tunnel insulation
layer 447c may be formed by depositing silicon oxide or metal
oxide.
[0065] Next, the spacer layer 450 may be formed on the tunnel
insulation layer 447c over the length of the first opening portion
442 and the extended first opening portion 442e. The spacer layer
450 may be formed of a material having etch selectivity with
respect to the gate insulation layer 448. The spacer layer 450 may
include a polysilicon layer. The spacer layer 450 may protect the
gate insulation layer 448 in a subsequent process.
[0066] Referring to FIG. 8, a gate insulation layer (448 of FIG. 7)
and a pad insulation material layer (402a of FIG. 7) at the bottom
of the first opening portion 442 and the extended first opening
portion 442e are etched by using the spacer layer 450 as an etching
mask.
[0067] Thus, the first opening portion 442 and the extended first
opening portion 442e may expose a surface of the substrate 400. In
addition, the recess 400r may be formed in the substrate 400 by
sufficiently etching the pad insulation material layer 402a, and
the pad insulation material layer 402a may be a pad insulation
layer 402 that exposes the substrate 400.
[0068] Referring to FIG. 9, a spacer layer (450 of FIG. 8) on side
walls of the first opening portion 442 and the extended first
opening portion 442e may be removed. The spacer 450 may be removed
with a polysilicon etchant.
[0069] A preliminary channel layer 452 may be formed on the gate
insulation layer 448 in the first opening portion 442 and the
extended first opening portion 442e. The preliminary channel layer
452 may contact the substrate 400. The preliminary channel layer
452 may be formed in the recess 400r of the substrate 400 as well.
The preliminary channel layer 452 may include a silicon layer. The
preliminary channel layer 452 may include a single crystal silicon
layer or a polysilicon layer.
[0070] Referring to FIGS. 10 and 16, the channel layer 454 may be
formed by trimming the preliminary channel layer 452. The channel
layer 454 may be an active region of a vertical-type memory device.
The trimming process may be a process of etching a portion of the
preliminary channel layer 452. Through the trimming process, the
channel layer 454 may be uniformly formed on the gate insulation
layer 448 on the inner walls of the first opening portion 442 and
the extended first opening portion 442e and the bottom of the
substrate 400. The trimming process is an optional process and may
not be performed if necessary.
[0071] Next, the filling insulation layer 456 may be formed on the
channel layer 454 in the first opening portion 442. The filling
insulation layer 456 may form an oxide layer. The filling
insulation layer 456 may be formed to insulate ground selection
transistors, memory cells, and the like from each other. Thus, the
channel layer 454 may be a cylindrical column that has the internal
first opening portion 442 filled with the filling insulation layer
456.
[0072] Referring to FIGS. 11 and 17, the sacrificial layer 430, the
interlayer insulation layer 420, the second etch control layer 406,
the recessed first etch control layer 404r, and the pad insulation
layer 402 may be sequentially etched by a photolithography process
to form a second opening portion 458. As the second opening portion
458 is formed, the recessed first etch control layer 404r, the
sacrificial layer 430, the interlayer insulation layer 420, and the
second etch control layer 406 may be divided for each region on the
substrate 400.
[0073] The second opening portion 458 may be filled with an
insulation layer later and thus may be a separation region. As the
second opening portion 458 is formed, the recessed first etch
control layer 404r and the sacrificial layer 430 may be removed by
a subsequent process to form a replacement gate electrode. Although
FIGS. 11 and 17 illustrate the second opening portion 458 formed
between two channel layers 454 for convenience, the second opening
portion 458 may be formed between more than two channel layers 454
if necessary.
[0074] Referring to FIGS. 12 and 18, the first rib groove 460 that
is connected to flanks of the second opening portion 458 may be
formed by removing the recessed first etch control layer 404r
exposed by the second opening portion 458 through a wet etching
process. The recessed first etch control layer 404r may be etched
with a polysilicon etchant.
[0075] Since the recessed first etch control layer 404r has etch
selectivity compared with the second etch control layer 406, the
recessed first etch control layer 404r may be easily removed by
using a polysilicon etchant.
[0076] Referring to FIGS. 13 and 14, as illustrated in FIG. 13, an
oxidized second etch control layer 406x is formed by oxidizing the
second etch control layer 406 exposed by the second opening portion
458 and the first rib groove 460. The oxidized second etch control
layer 406x may be formed of a polysilicon oxide layer including
carbon, N-type impurities, or P-type impurities.
[0077] Next, as illustrated in FIG. 14, the second rib groove 462
that is connected to flanks of the second opening portion 458 is
formed on an upper surface of the interlayer insulation layer 420
by removing the sacrificial layer 430 exposed by the second opening
portion 458 through a wet etching process. As discussed above, the
cross-sectional view of FIG. 14 illustrates a portion 12 of FIG. 4,
and above the removed sacrificial layer 430 may be a second
interlayer insulation layer 420. When such a removal process is
performed, the interlayer insulation layer 420 that extends in a
first direction, e.g., z direction is formed on the gate insulation
layer 448 on the channel layer 454. By a subsequent process, a
ground selection transistor and a memory cell may be respectively
formed in the first rib groove 460 and the second rib groove
462.
[0078] Referring to FIGS. 15 and 19, the first replacement gate
electrode 464 and the second replacement gate electrode 466 are
formed on sides of the blocking insulation layer 447a to
respectively fill the first rib groove 460 and the second rib
groove 462. In order for the first replacement gate electrode 464
and the second replacement gate electrode 466 to fill the first rib
groove 460 and the second rib groove 462 without a void, a
conductive material having good step coverage characteristics may
be used to form the first replacement gate electrode 464 and the
second replacement gate electrode 466. Each of the first
replacement gate electrode 464 and the second replacement gate
electrode 466 may include a metal layer, for example, tungsten
(W).
[0079] As described above, in some embodiments according to FIGS.
15 and 19, replacement gate electrodes 464 and 466 may be formed by
a gate replacement process in which the first rib groove 460 and
the second rib groove 462 that define regions where gate electrodes
are to be formed are filled with a conductive material. Since the
thickness T11 of the first etch control material layer 404a is
formed to be the same as the thickness T12 of the sacrificial
material layer 430a during the aforementioned manufacturing
process, the thickness T1 of the first replacement gate electrode
464 may be the same as the thickness T2 of the second replacement
gate electrode 466.
[0080] When the thickness T1 of the first replacement gate
electrode 464 is configured to be the same as the thickness T2 of
the second replacement gate electrode 466, the first replacement
gate electrode 464 and the second replacement gate electrode 466
may be simultaneously formed by one process. Thus, manufacturing
processes may be simplified, and device manufacturing costs may be
decreased.
[0081] If necessary, an impurity region (not shown) that is used as
the common source line CSL may be formed in the substrate 400
exposed by the second opening portion 458. The impurity region may
be formed by doping under a surface of the substrate 400 with
N-type impurities. Next, an isolating insulation layer 470 may be
formed by forming an insulating material in the second opening
portion 458.
[0082] FIGS. 20 and 21 are cross-sectional views for describing a
vertical-type memory device and a manufacturing method thereof,
according to aspects of the present disclosure.
[0083] In detail, when compared with FIGS. 4 to 19, FIGS. 20 and 21
may be the same as FIGS. 4 to 19 except that the second etch
control layer 406 is not oxidized. Thus, the second etch control
layer 406 may include a polysilicon layer doped with carbon, P-type
impurities, or N-type impurities.
[0084] First, the manufacturing processes of FIGS. 4 to 12 may be
performed. Thus, as illustrated in FIG. 20, the first rib groove
460 that is connected to flanks of the second opening portion 458
may be formed under the second etch control layer 406 at a side of
the channel layer 454 formed on the substrate 400. The first rib
groove 460 is obtained by removing the recessed first etch control
layer 404r with a polysilicon etchant.
[0085] Next, the sacrificial layer 430 exposed by the second
opening portion 458 is removed by a wet etching process, and thus,
the second rib groove 462 that is connected to flanks of the second
opening portion 458 is formed on the interlayer insulation layer
420. When such a process is performed, the interlayer insulation
layer 420 that extends in the first direction is formed on the gate
insulation layer 448 on the channel layer 454.
[0086] As illustrated in FIG. 21, the first replacement gate
electrode 464 and the second replacement gate electrode 466 are
formed on sides of the blocking insulation layer 447a to
respectively fill the first rib groove 460 and the second rib
groove 462. Next, the isolating insulation layer 470 may be formed
by forming an insulating material in the second opening portion
458.
[0087] FIG. 22 is a cross-sectional view for describing a
vertical-type memory device and a manufacturing method thereof,
according to aspects of the present disclosure.
[0088] In detail, when compared with FIGS. 4 to 19, FIG. 22 may be
the same as FIGS. 4 to 19 except that the thickness T3 of the first
replacement gate electrode 464T is formed to be greater than the
thickness T2 of the second replacement gate electrode 466.
[0089] First, as illustrated in FIG. 4, the pad insulation material
layer 402a, the first etch control material layer 404a, and the
second etch control material layer 406a are formed on the substrate
400. The material layers 411 to 415 and 431 to 434 respectively
constituting the interlayer insulation material layer 420a and the
sacrificial material layer 430a are alternately repeatedly stacked
on the second etch control material layer 406a a plurality of
times. In such a manufacturing process, the thickness T11 of the
first etch control material layer 404a may be formed to be greater
than the thickness T12 of the sacrificial material layer 430a.
[0090] Next, the manufacturing processes of FIGS. 5 to 15 are
performed. Thus, as illustrated in FIG. 22, the thickness T3 of the
first replacement gate electrode 464T may be formed to be greater
than the thickness T2 of the second replacement gate electrode 466.
In addition, the channel layer 454 may be formed to extend to a
portion under the second etch control layer 406x.
[0091] FIG. 23 is a cross-sectional view for describing a
vertical-type memory device and a manufacturing method thereof,
according to aspects of the present disclosure.
[0092] In detail, when compared with FIGS. 4 to 19, FIG. 23 may be
the same as FIGS. 4 to 19 except that the thickness T3 of the first
replacement gate electrode 464T is formed to be greater than the
thickness T2 of the second replacement gate electrode 466, and the
second etch control layer 464 is not oxidized. Also, when compared
with FIG. 22, FIG. 23 may be the same as FIG. 22 except that the
second etch control layer 406 is not oxidized.
[0093] First, as illustrated in FIG. 4, the pad insulation material
layer 402a, the first etch control material layer 404a, and the
second etch control material layer 406a are formed on the substrate
400. The material layers 411 to 415 and 431 to 434 respectively
constituting the interlayer insulation material layer 420a and the
sacrificial material layer 430a are alternately repeatedly stacked
on the second etch control material layer 406a a plurality of
times. In such a manufacturing process, the thickness T11 of the
first etch control material layer 404a is formed to be greater than
the thickness T12 of the sacrificial material layer 430a.
[0094] Next, the manufacturing processes of FIGS. 5 to 19 are
performed. However, the process of oxidizing the second etch
control material layer 406a illustrated in FIG. 13 is not
performed. Thus, as illustrated in FIG. 23, the thickness T3 of the
first replacement gate electrode 464T may be formed to be greater
than the thickness T2 of the second replacement gate electrode 466.
The channel layer 454 may be formed to extend to a portion under
the second etch control layer 406. Also, since the second etch
control layer 406 is not oxidized, the second etch control layer
406 may include a polysilicon layer doped with carbon, P-type
impurities, or N-type impurities.
[0095] FIG. 24 is a schematic block diagram for describing the
vertical-type memory device 1100 according to aspects of the
present disclosure.
[0096] In detail, the vertical-type memory device 1100 according to
an embodiment may include the memory cell array 820, a driving
circuit 830, a read/write circuit 840, and a control circuit
850.
[0097] The above-described memory cell array 820 may include a
plurality of memory cells, and the plurality of memory cells may be
arranged in a plurality of rows and columns. The memory cells
included in the memory cell array 820 may be connected to the
driving circuit 830 via a word line WL, the common source line CSL,
the string selection line SSL, the ground selection line GSL, etc.
and may be connected to the read/write circuit 840 via a bit line
BL.
[0098] In an embodiment, a plurality of memory cells arranged in
the same row may be connected to the same word line WL, and a
plurality of memory cells arranged in the same column may be
connected to the same bit line BL.
[0099] In an embodiment, a plurality of memory cells included in
the memory cell array 820 may be divided as a plurality of memory
blocks. Each memory block may include a plurality of word lines WL,
a plurality of string selection lines SSL, a plurality of ground
selection lines GSL, a plurality of bit lines BL, and at least one
common source line CSL. The driving circuit 830 and the read/write
circuit 840 may be operated by the control circuit 850.
[0100] In an embodiment, the driving circuit 830 may receive
address information from the outside and may select at least some
of the word line WL, the common source line CSL, the string
selection line SSL, and the ground selection line GSL that are
connected to the memory cell array 820 by decoding the received
address information. The driving circuit 830 may include a driving
circuit for each of the word line WL, the string selection line
SSL, and the common source line CSL.
[0101] According to a command received from the control circuit
850, the read/write circuit 840 may select at least some of bit
lines BL connected to the memory cell array 820. The read/write
circuit 840 may read data stored in a memory cell connected to the
selected at least some bit lines BL or may write data to a memory
cell connected to the selected at least some bit lines BL. The
read/write circuit 840 may include circuits such as a page buffer,
an input/output buffer, and a data latch in order to perform the
above-described operation.
[0102] The control circuit 850 may control operations of the
driving circuit 830 and the read/write circuit 840 in response to a
control signal CTRL transmitted from the outside. When data stored
in the memory cell array 820 is read, the control circuit 850 may
control an operation of the driving circuit 830 to supply a voltage
for performing a read operation to a word line WL where data to be
read is stored. When the voltage for performing a read operation is
supplied to the particular word line WL, the control circuit 850
may control the read/write circuit 840 to read data stored in a
memory cell connected to the word line WL supplied with the voltage
for performing a read operation.
[0103] When data is written to the memory cell array 820, the
control circuit 850 may control an operation of the driving circuit
830 to supply a voltage for performing a write operation to a word
line WL where data is to be written. When the voltage for
performing a write operation is supplied to the particular word
line WL, the control circuit 850 may control the read/write circuit
840 to record data onto a memory cell connected to the word line WL
supplied with the voltage for performing a write operation.
[0104] A vertical-type memory device according to the present
disclosure has an opening portion that is used as a channel hole,
formed by sequentially etching two etch control material layers
formed on a substrate and having etch selectivity, an interlayer
insulation material layer, and a sacrificial material layer. The
vertical-type memory device according to the present disclosure may
have an opening portion that exposes the substrate formed reliably
due to the etch control material layers and thus may not have a
silicon epi-layer formed in the opening portion at a lower portion
of the substrate by a selective epitaxial growth method.
[0105] Also, a vertical-type memory device according to the present
disclosure may have a thickness (channel length) of a first
replacement gate electrode that is used in a ground transistor
adjusted by adjusting a thickness of an etch control material layer
that is formed on a substrate and thus may have thicknesses of the
first replacement gate electrode and a second replacement gate
electrode that is used in a memory cell differed from each
other.
[0106] In addition, when thickness of a first replacement gate
electrode and a second replacement gate electrode that is used in a
memory cell are the same as each other, a vertical-type memory
device according to the present disclosure may have the first
replacement gate electrode and the second replacement gate
electrode formed simultaneously and thus may have manufacturing
processes simplified and device manufacturing costs decreased.
[0107] While aspects of the present disclosure have been
particularly shown and described with reference to embodiments
thereof, they are provided for purposes of illustration, and it
will be understood by one of ordinary skill in the art that various
changes in form and details may be made therein. The aforementioned
embodiments may be implemented as only one or may be implemented by
combining one or more.
[0108] Thus, the technical scope of the present disclosure is not
construed as limited to one or more embodiments illustrated herein.
The embodiments described above should be considered in a
descriptive sense in every aspect and not for purposes of
limitation. The true technical scope of the present disclosure is
to be defined with reference to the appended claims.
* * * * *