U.S. patent application number 15/786809 was filed with the patent office on 2018-02-08 for endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure.
The applicant listed for this patent is Guardian Europe S.a.r.l.. Invention is credited to Guy COMANS, Gilbert GALAN, Marcel SCHLOREMBERG, Jean-Philippe USELDING.
Application Number | 20180037984 15/786809 |
Document ID | / |
Family ID | 52355266 |
Filed Date | 2018-02-08 |
United States Patent
Application |
20180037984 |
Kind Code |
A1 |
GALAN; Gilbert ; et
al. |
February 8, 2018 |
ENDBLOCK FOR ROTATABLE TARGET WITH ELECTRICAL CONNECTION BETWEEN
COLLECTOR AND ROTOR AT PRESSURE LESS THAN ATMOSPHERIC PRESSURE
Abstract
An endblock for a rotatable sputtering target, such as a
rotatable magnetron sputtering target, is provided. A sputtering
apparatus, including one or more such endblock(s), includes
locating the electrical contact(s) (e.g., brush(es)) between the
collector and rotor in the endblock(s) in an area under vacuum (as
opposed to in an area at atmospheric pressure).
Inventors: |
GALAN; Gilbert; (Aubange,
BE) ; USELDING; Jean-Philippe; (Habay-la-Neuve,
BE) ; COMANS; Guy; (Neufchateau, BE) ;
SCHLOREMBERG; Marcel; (Habay-la-Neuve, BE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Guardian Europe S.a.r.l. |
Bertrange |
|
LU |
|
|
Family ID: |
52355266 |
Appl. No.: |
15/786809 |
Filed: |
October 18, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14153658 |
Jan 13, 2014 |
9809876 |
|
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15786809 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01J 37/3405 20130101;
H01J 37/32816 20130101; H01J 37/3417 20130101; C23C 14/34 20130101;
H01J 2237/332 20130101; H01J 37/3411 20130101; H01J 37/3497
20130101; H01J 37/3435 20130101; H01J 37/342 20130101 |
International
Class: |
C23C 14/34 20060101
C23C014/34; H01J 37/32 20060101 H01J037/32; H01J 37/34 20060101
H01J037/34 |
Claims
1-18. (canceled)
19. A method of making a coated article, the method comprising:
sputtering a rotating target in a chamber at pressure less than
atmospheric pressure to sputter-deposit a layer on a substrate,
wherein the target is supported by an endblock, the endblock
including a fixed conductive collector, a rotatable conductive
rotor rotating with the sputtering target during said sputtering,
an electrical power transfer structure located between the fixed
conductive collector and the rotatable rotor for transferring
electrical power from the collector to the rotor, providing the
endblock in a position, so that during said sputtering the
electrical power transfer structure, the rotor, and the collector
are each located in the area under vacuum having pressure less than
atmospheric pressure.
Description
[0001] Example embodiments of this invention relate to an endblock
for a rotatable sputtering target such as a rotatable magnetron
sputtering target. A sputtering apparatus design, including an
endblock design, includes locating the electrical contact(s) (e.g.,
brush(es)) between the collector and rotor in an area under vacuum
(as opposed to in an area at atmospheric pressure) which has been
found to provide for significant advantages.
BACKGROUND AND SUMMARY OF THE INVENTION
[0002] Sputtering is known in the art as a technique for depositing
layers or coatings onto substrates such as glass substrates. For
example, a low-emissivity (low-E) coating can be deposited onto a
glass substrate by successively sputter-depositing a plurality of
different layers onto the substrate. As an example, a low-E coating
may include the following layers in this order: glass
substrate/SnO.sub.2/ZnO/Ag/ZnO, where the Ag layer is an IR
reflecting layer and the metal oxide layers are dielectric layers.
In this example, one or more tin (Sn) targets may be used to
sputter-deposit the base layer of SnO.sub.2, one or more zinc (Zn)
inclusive targets may be used to sputter-deposit the next layer of
ZnO, an Ag target may be used to sputter-deposit the Ag layer, and
so forth. The sputtering of each target is performed in a chamber
housing a gaseous atmosphere (e.g., a mixture of Ar and O gases in
the Sn and/or Zn target atmosphere(s)). Example references
discussing sputtering and devices used therefore include U.S. Pat.
Nos. 8,192,598, 6,736,948, 5,427,665, 5,725,746 and 2004/0163943,
the entire disclosures of which are all hereby incorporated herein
by reference.
[0003] A sputtering target (e.g., cylindrical rotatable magnetron
sputtering target) typically includes a cathode tube within which
is a magnet array. The cathode tube is often made of stainless
steel. The target material is typically formed on the tube by
spraying, casting or pressing it onto the outer surface of the
stainless steel cathode tube. Often, a bonding or backing layer is
provided between the tube and the target to improve bonding of the
target material to the tube. Each sputtering chamber includes one
or more targets, and thus includes one or more of these cathode
tubes. The cathode tube(s) may be held at a negative potential
(e.g., -200 to -1500 V), and may be sputtered when rotating. When a
target is rotating, ions from the sputtering gas discharge are
accelerated into the target and dislodge, or sputter off, atoms of
the target material. These atoms, in turn, together with the gas
form the appropriate compound (e.g., tin oxide) that is directed to
the substrate in order to form a thin film or layer of the same on
the substrate.
[0004] In addition to the quality of the coating the magnetron
deposits upon the substrate, dependability and serviceability of
the magnetron is an issue. This is not an easy task taking into
account the constraints of the process that is involved. A
cylindrical magnetron sputters material from a rotating target tube
onto the substrate as it is transported past the target. In order
to coat such a large piece of glass or the like the target tube can
be up to 15 feet in length and up to 6 inches or more in diameter
and can weigh up to 1700 pounds for example. Another complication
is that the sputtering actually erodes the target tube during the
sputtering process, so the target tube is constantly changing shape
during its serviceable lifetime. And the sputtering process can
require that an extremely high AC or DC power (e.g., 800 Amps DC,
150 kW AC) be supplied to the target in certain instances. This
power transfer creates significant heat in the target tube and the
surrounding components, which must be cooled in order to assure
proper performance and to avoid failure of the magnetron. Thus, it
is known to pump water through the center of the rotating target
tube at high pressure and flow rate to cool the target.
[0005] FIG. 1 is a side plan view of a rotating sputtering target
and conventional endblock. FIG. 1 illustrates that the rotating
target 1 is supported on one end by an endblock 3. The endblock 3
may be supported by and/or attached to a wall or ceiling 5 of a
sputtering chamber 8 in a sputtering apparatus 7. Outside of the
sputtering chamber(s) 8, the sputtering apparatus is at atmospheric
pressure 9. In FIG. 1, reference numeral 9 indicates areas at
atmospheric pressure. Efficient and effective sputtering requires
that the sputtering process take place in a vacuum or a reduced
pressure relative to atmosphere--in FIG. 1 the chamber 8 (other
than the endblock 3) is under vacuum and thus is at pressure less
than atmospheric pressure. The rotating target system is designed
to have a robust sealing system, including seals 11 and 12 to
prevent pressure or vacuum leaks between the low pressure areas 8
and the atmospheric pressure areas 9.
[0006] Electrically conductive brushes 15 provide for electrical
contact and thus a power connection between the collector and the
rotor. In the conventional system of FIG. 1, the brushes 15 that
provide the electrical power connection between the collector and
rotor are located in an area 9 at atmospheric pressure.
[0007] It has surprisingly been found that a new design that
includes locating the electrical contact(s) (e.g., brushes) between
the collector and rotor in an area under vacuum (as opposed to in
an area at atmospheric pressure as in conventional FIG. 1) provides
for significant advantages over the conventional design. Moving the
power connection between the rotor and collector to an area under
vacuum (an area at a pressure less than atmospheric pressure), for
example, allows for a structure where both the rotor and collector
can be efficiently cooled (e.g., water cooled) which has
surprisingly been found to allow the sputtering rate to be improved
(e.g., up to a 20% improvement in sputtering rate has surprisingly
been found compared to the conventional FIG. 1 design). A rotating
sputtering target, such as a magnetron sputtering target, is often
supported by two endblocks--one at each end of the target. One or
both of the endblocks for supporting a rotating target may be
designed in accordance with example embodiments of this
invention.
[0008] In example embodiments of this invention, there is provided
a sputtering apparatus comprising: at least one endblock for
supporting an end of a cylindrical rotatable sputtering target, the
endblock including a fixed conductive collector, and a rotatable
conductive rotor for rotating with the cylindrical sputtering
target during sputtering operations; the endblock further including
an electrical power transfer structure (e.g., conductive brush(es))
located between the fixed conductive collector and the rotatable
rotor for allowing electrical power to be transferred from the
collector to the rotor; a first cooling area through which liquid
flows for cooling the fixed conductive collector, the first cooling
area being located around at least a portion of the fixed
conductive collector and being substantially concentric with the
fixed conductive collector; a second cooling area, separate from
the first cooling area, through which liquid flows for cooling the
rotor and target, the second cooling area being at least partially
surrounded by the rotor, and wherein the liquid in the second
cooling area flows in at least a direction that is substantially
parallel to an axis about which the target and rotor are to rotate;
wherein the liquid in the first cooling area flows around the axis
about which the target and rotor are to rotate; and wherein the
electrical power transfer structure, the rotor, and the collector
are each located (partially or fully) in an area under vacuum
having pressure less than atmospheric pressure (e.g., so that there
is no significant difference in pressure therebetween).
[0009] Unless otherwise stated or indicated, "fixed" as used herein
when referring to an element being "fixed" means that the element
at issue does not rotate together with the rotor or target tube
during sputtering operations.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a side plan view of a rotating sputtering target
and conventional endblock.
[0011] FIG. 2 is a side plan view of a rotating sputtering target
and endblock according to an example embodiment of this
invention.
[0012] FIG. 3 is a cross sectional view of the endblock of FIG. 2
according to an example embodiment of this invention.
DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS OF THE INVENTION
[0013] Referring now more particularly to the accompanying drawings
in which like reference numerals indicate like parts throughout the
figures.
[0014] FIG. 2 is a side plan view of a rotating sputtering target
and endblock. The endblock 4 is for a cathode revolver that is to
be placed in a sputtering apparatus prior to sputtering operations,
and then utilized in the sputtering apparatus during sputtering
operation. FIG. 2 illustrates that the rotating cylindrical
magnetron target 1 is supported at one end by an endblock 4
designed according to an example embodiment of this invention. And
FIG. 3 is a cross sectional view of the endblock 4 of FIG. 2. The
endblock 4 may be supported by and/or attached to a wall and/or
ceiling 5 of a sputtering chamber 8 in a sputtering apparatus 10
via an endblock support 16. In other preferred embodiments, the
endblock 4 may be mounted on and supported by a cathode revolver
via support 16 for selective use in sputtering apparatus such as
the cathode revolver disclosed in U.S. application Ser. No.
12/461,130, the disclosure of which is hereby incorporated herein
by reference. Outside of the sputtering chamber(s) 8, the
sputtering apparatus is at atmospheric pressure 9. In FIGS. 2-3,
reference numeral 9 indicates areas at atmospheric pressure which
are generally areas above the ceiling 5 and/or outside of the
chamber 8. Efficient and effective sputtering requires that the
sputtering process take place in a vacuum or a reduced pressure
relative to atmosphere--in FIGS. 2-3 the sputtering chamber 8
(including the endblock 4) is under vacuum and thus is at pressure
less than atmospheric pressure. The rotating target system is
designed to have a robust sealing system, including seals to
prevent pressure or vacuum leaks between the low pressure areas 8
and the atmospheric pressure areas 9.
[0015] Electrically conductive brushes/contacts 18 provide for
electrical contact and thus a power connection between the fixed
conductive collector 20 and the rotating conductive rotor 22 in
order to transfer large amounts of energy from the collector 20 to
the rotor 22 and target tube/cathode 1 needed for the sputtering
process. Power (current and/or voltage) is applied to or through
the conductive endblock support 16 and travels through the
conductive collector 20 which is in electrical communication
(directly or indirectly) with the conductive support 16. Thus, the
fixed endblock support 16 is in electrical communication with the
fixed collector 20 and power is provided to the collector 20 from
exterior the chamber 8 via fixed endblock support 16. The power is
then transferred form the fixed conductive collector 20 to the
rotating conductive rotor 22 via contact(s) such as contact brushes
18 or the like, with the power then being provided from the rotor
22 to the target tube assembly.
[0016] In contrast with FIG. 1, in FIGS. 2-3 the contact brushes 18
that provide the electrical power connection between the collector
20 and rotor 22 are located in an area 8 under vacuum (in an area
at pressure less than atmospheric pressure). The entire illustrated
area 8 shown in FIG. 3, under the ceiling 5, is under vacuum and is
thus at pressure less than atmospheric pressure. The rotor 22
rotates along with the sputtering target 1 about longitudinal axis
24 which extends through the target 1 and the endblock 4, whereas
the collector 20 is fixed in place and does not rotate with the
target 1. The rotor 22 may be of a single piece design, or may be
made up of multiple pieces. Inner bearings 52 and outer bearings
54, each concentric with the rotor 22 and spindle tube 56 so as to
all have a common axis 24, allow the rotor 22 to rotate about axis
24 relative to fixed spindle tube 56 and fixed support 58 which at
least partially surrounds the rotor 22. The spindle tube 56 is
fixed in place relative to the rotor, and the spindle tube 56 is
preferably fixed (directly or indirectly) to the magnet bar
structure (not shown) in the target tube. The target 1 is connected
to and located at the inboard side 4a of the endblock 4. Another
similar or different endblock (not shown) may support the other end
of the rotatable target 1. In certain example embodiments, the
endblock 4 shown in FIGS. 2-3 may be considered the driving
endblock for supporting one end of the rotatable target 1, whereas
a different endblock (e.g., without a collector) such as a cooling
endblock supporting the opposite end of the target 1. In certain
example embodiment, the cooling liquid (e.g., water) input 30 and
output 32 for the collector cooling area are located in the driving
endblock 4 shown in FIGS. 2-3, whereas the cooling liquid (e.g.,
water) input and output for the cooling area 40 are located in the
other endblock (not shown) at the opposite end of the target 1.
[0017] It has surprisingly been found that the design of FIGS. 2-3
that includes locating the electrical contact(s) (e.g., brushes) 18
between the collector 20 and rotor 22 in an area 8 entirely under
vacuum (as opposed to in an area 9 at atmospheric pressure as in
conventional FIG. 1) provides for significant advantages over the
conventional design of FIG. 1. Moving the power connection between
the rotor 22 and collector 22 to an area 8 under vacuum (an area at
a pressure less than atmospheric pressure), for example, allows for
a structure where both the rotor 22 and collector 20 can be
efficiently cooled (e.g., water cooled) which has surprisingly been
found to allow the sputtering rate to be improved (e.g., up to a
20% improvement in sputtering rate has surprisingly been found
compared to the conventional FIG. 1 design).
[0018] A water inlet 30 and water outlet 32 are provided for
allowing water to be input and output from an area for cooling the
collector 20. The cooling area 36 through which the cooling water
flows and is circulated for cooling the collector 20 surrounds axis
24 and at least part of the rotor 22, and is located within the
collector and/or so as to surround the collector 20 as shown in
FIGS. 2-3. The inlet 30, outlet 32, and cooling area 36 are fixed
and do not rotate with the rotor. A separate cooling area 40
surrounded by the rotor 22 is provided for allowing water to flow
in order to cool the rotor 22 and target 1, this cooling area 40
including an inner portion 40a and an outer portion 40b that
surrounds the inner portion 40a. Cooling water flows in one
direction in inner portion 40a and in the opposite direction in
outer portion 40b, as shown by arrows in FIG. 3. As shown in FIG.
3, a portion of the rotor 22 may be located between the cooling
area 36 and the rotor cooling area 40. The water in collector
cooling area 36 generally flows in different directions than does
the water in rotor cooling area 40 (40a, 40b). The target 1 is
typically horizontally aligned relative to the ground and rotates
about axis 24, and the liquid in areas 40a and 40b preferably flows
in respective directions that are substantially parallel to axis
24.
[0019] In example embodiments of this invention, there is provided
a sputtering apparatus comprising: at least one endblock 4 for
supporting an end of a cylindrical rotatable sputtering target 1,
the endblock 4 including a fixed conductive collector 20, and a
rotatable conductive rotor 22 for rotating with the cylindrical
sputtering target during sputtering operations; the endblock 4
further including an electrical power transfer structure (e.g.,
conductive brush(es)) 18 located between the fixed conductive
collector 20 and the rotatable rotor 22 for allowing electrical
power to be transferred from the collector 20 to the rotor 22; a
first cooling area 36 through which liquid flows for cooling the
fixed conductive collector 20, the first cooling area 36 being
located around at least a portion of the fixed conductive collector
20 and being substantially concentric with the fixed conductive
collector 20; a second cooling area 40, separate from the first
cooling area 36, through which liquid flows for cooling the rotor
22 and target 1, the second cooling area 40 being at least
partially surrounded by the rotor 22, and wherein the liquid in the
second cooling area 40 flows in at least a direction(s) that is
substantially parallel to an axis 24 about which the target 1 and
rotor 22 are to rotate; wherein the liquid in the first cooling
area 36 flows around the axis 24 about which the target 1 and rotor
22 are to rotate; and wherein the electrical power transfer
structure 18, the rotor 22, and the collector 20 are each located
(partially or fully) in an area 8 under vacuum having pressure less
than atmospheric pressure (e.g., so that there is no significant
difference in pressure therebetween) during sputtering
operations.
[0020] In the sputtering apparatus of the immediately preceding
paragraph, the electrical power transfer structure 18 may be made
up of one or more conductive brush(es) or any other suitable
conductive structure/material.
[0021] In the sputtering apparatus of any of the preceding two
paragraphs, the entirety of the electrical power transfer structure
18 and the entirety of the rotor 22 may each be located in the area
under vacuum having pressure less than atmospheric pressure.
[0022] In the sputtering apparatus of any of the preceding three
paragraphs, the target 1 may be located entirely in the area under
vacuum having pressure less than atmospheric pressure.
[0023] In the sputtering apparatus of any of the preceding four
paragraphs, the entirety of the collector 20 may be located in the
area under vacuum having pressure less than atmospheric
pressure.
[0024] In the sputtering apparatus of any of the preceding five
paragraphs, a cooling liquid inlet and a cooling liquid outlet for
the first cooling area may be provided in or proximate said (first)
endblock, and wherein a cooling liquid inlet and a cooling liquid
outlet for the second cooling area may be provided in or proximate
another (second) endblock that is provided at an end of the target
opposite the end at which said (first) endblock including the
collector is located.
[0025] In the sputtering apparatus of any of the preceding six
paragraphs, the liquid in the first cooling area need not mix with
the liquid in the second cooling area (the first and second cooling
areas are not in fluid communication with each other).
Alternatively, in other example embodiments, the liquid in the
first and second cooling areas may mix and the first and second
cooling areas may be in fluid communication with each other.
[0026] In the sputtering apparatus of any of the preceding seven
paragraphs, the liquid in the first cooling area and/or the liquid
in the second cooling area may comprise water.
[0027] In the sputtering apparatus of any of the preceding eight
paragraphs, the endblock and target may be mounted on a cathode
revolver for selective movement and use in sputtering operations in
the sputtering apparatus. Alternatively, the endblock and target
need not be mounted on such a cathode revolver, and may instead for
example be mounted from a ceiling of a sputtering chamber without
any intervening revolver.
[0028] In certain example embodiments of this invention, there is
provided an endblock for supporting a rotatable sputtering target
in a sputtering apparatus, the endblock comprising: a fixed
conductive collector; a rotatable conductive rotor for rotating
with the rotatable sputtering target during sputtering operations;
an electrical power transfer structure located between the fixed
conductive collector and the rotatable rotor at least for allowing
electrical power to be transferred from the collector to the rotor;
and wherein the electrical power transfer structure, the rotor, and
the collector are each adapted to be located in an area under
vacuum having pressure less than atmospheric pressure during
sputtering operations.
[0029] The endblock of the immediately preceding paragraph may
further include a first cooling area through which liquid flows for
cooling the fixed conductive collector, the first cooling area
being located around at least a portion of the fixed conductive
collector and being substantially concentric with the fixed
conductive collector.
[0030] The endblock of any of the immediately preceding two
paragraphs may further include a second cooling area through which
liquid flows for cooling the rotor and target, the second cooling
area being at least partially surrounded by the rotor, and wherein
the liquid in the second cooling area flows in at least a direction
that is substantially parallel to an axis about which the target
and rotor are to rotate.
[0031] In the endblock of any of the immediately preceding three
paragraphs, the liquid in the first cooling area may flow around
the axis about which the target and rotor are to rotate.
[0032] In the endblock of any of the preceding four paragraphs, the
electrical power transfer structure may include or be made up of
one or more conductive brush(es).
[0033] In the endblock of any of the preceding five paragraphs, the
entirety of the electrical power transfer structure and the
entirety of the rotor may be adapted to be located in the area
under vacuum having pressure less than atmospheric pressure during
sputtering operations.
[0034] In the endblock of any of the preceding six paragraphs,
first and second cooling areas need not be in fluid communication
with each other.
[0035] While the invention has been described in connection with
what is presently considered to be the most practical and preferred
embodiment, it is to be understood that the invention is not to be
limited to the disclosed embodiment, but on the contrary, is
intended to cover various modifications and equivalent arrangements
included within the spirit and scope of the appended claims.
* * * * *