U.S. patent application number 15/280942 was filed with the patent office on 2018-01-11 for method for packaging thermoelectric module.
This patent application is currently assigned to Hyundai Motor Company. The applicant listed for this patent is Hyundai Motor Company. Invention is credited to Byung Wook KIM, Gyung Bok KIM, Jin Woo KWAK, Han Saem LEE, In Woong LYO, Kyong Hwa SONG.
Application Number | 20180013050 15/280942 |
Document ID | / |
Family ID | 60676265 |
Filed Date | 2018-01-11 |
United States Patent
Application |
20180013050 |
Kind Code |
A1 |
KIM; Byung Wook ; et
al. |
January 11, 2018 |
METHOD FOR PACKAGING THERMOELECTRIC MODULE
Abstract
A method for packaging a thermoelectric module may include
thermoelectric module accommodation, of accommodating at least one
thermoelectric module in a housing having a base and a sidewall,
electric wire sealing, of sealing an electric wire of the
thermoelectric module with a sealing tube, bonding member
interposing, of placing a cover having a top portion and a sidewall
on top of the housing and interposing a bonding member between the
sidewall of the housing and the sidewall of the cover, and bonding,
of bonding the sidewall of the housing and the sidewall of the
cover that are hermetically sealed by the bonding member, in which
the bonding member may be formed of a resin material.
Inventors: |
KIM; Byung Wook;
(Seongnam-si, KR) ; SONG; Kyong Hwa; (Seoul,
KR) ; KWAK; Jin Woo; (Gyeongsan-si, KR) ; KIM;
Gyung Bok; (Yongin-si, KR) ; LYO; In Woong;
(Suwon-si, KR) ; LEE; Han Saem; (Seoul,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Hyundai Motor Company |
Seoul |
|
KR |
|
|
Assignee: |
Hyundai Motor Company
Seoul
KR
|
Family ID: |
60676265 |
Appl. No.: |
15/280942 |
Filed: |
September 29, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 35/32 20130101;
H01L 35/34 20130101; H01L 35/04 20130101 |
International
Class: |
H01L 35/34 20060101
H01L035/34; H01L 35/32 20060101 H01L035/32; H01L 35/04 20060101
H01L035/04 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 11, 2016 |
KR |
10-2016-0087513 |
Claims
1. A method for packaging a thermoelectric module, the method
comprising: thermoelectric module accommodation step, of
accommodating at least one thermoelectric module in a housing
having a base and a sidewall; electric wire sealing step, of
sealing an electric wire of the thermoelectric module with a
sealing tube; bonding member interposing step, of placing a cover
having a top portion and a sidewall on top of the housing and
interposing a bonding member between the sidewall of the housing
and the sidewall of the cover; and bonding step, of bonding the
sidewall of the housing and the sidewall of the cover that are
hermetically sealed by the bonding member, wherein the bonding
member comprises a resin material.
2. The method according to claim 1, wherein the bonding member
interposing step includes passing the sealing tube through a
portion of the bonding member.
3. The method according to claim 1, wherein the bonding member
interposing step includes inserting a first portion of the bonding
member into a top of the sidewall of the housing and inserting a
second portion of the bonding member into a bottom of the sidewall
of the cover.
4. The method according to claim 1, wherein the bonding step
includes applying heat to the bonding member in a vacuum or inert
atmosphere for the bonding member to be melted and cured between a
top of the sidewall of the housing and a bottom of the sidewall of
the cover to hermetically seal a top of the sidewall of the housing
and a bottom of the sidewall of the cover.
5. The method according to claim 1, wherein the sealing tube
comprises a heat shrinkable tube, and the electric wire is sealed
by applying heat to the heat shrinkable tube.
6. The method according to claim 1, wherein the bonding member
comprises a heat shrinkable film.
7. The method according to claim 1, further comprising forming a
thermal resistance increasing part in at least one of the sidewall
of the housing and the sidewall of the cover, before the
thermoelectric module accommodation step or after the bonding
step.
8. The method according to claim 1, wherein a portion of the
sidewall of the housing is pressurized to form a thin wall portion
that is thinner than the sidewall of the housing, before the
thermoelectric module accommodation.
9. The method according to claim 1, wherein a portion of the
sidewall of the housing is processed to form a non-straight
portion, before the thermoelectric module accommodation step or
after the bonding step.
10. A method for packaging a thermoelectric module, the method
comprising: thermoelectric module accommodation step, of
accommodating at least one thermoelectric module in a housing
having a base and a sidewall; tube installation step, of providing
a tube having an inner diameter greater than an outer diameter of
an electric wire of the thermoelectric module on a periphery of the
electric wire to form a gap between the electric wire and the tube;
bonding member interposing step, of placing a cover having a top
portion and a sidewall on top of the housing and interposing a
bonding member between the sidewall of the housing and the sidewall
of the cover; bonding step, of bonding the sidewall of the housing
and the sidewall of the cover that are hermetically sealed by the
bonding member; vacuumizing step, of vacuumizing an internal space
of the housing and the cover through the gap between the electric
wire and the tube; and tube sealing step, of sealing the tube after
the vacuumizing, wherein the bonding member is formed of a resin
material.
11. The method according to claim 10, wherein the vacuumizing step
includes injecting an inert gas through the gap between the
electric wire and the tube.
12. The method according to claim 10, wherein a heat resistant cap
is provided on an outer end portion of the tube, between the
bonding member interposing step and the bonding step.
13. The method according to claim 10, wherein the tube sealing step
includes providing a sealing cap on an outer end portion of the
tube and applying heat thereto to seal the outer end portion of the
tube through melting and curing of the sealing cap.
14. The method according to claim 10, wherein the bonding member
interposing step includes passing the tube through a portion of the
bonding member.
15. The method according to claim 10, wherein the bonding member
interposing step includes inserting a first portion of the bonding
member into a top of the sidewall of the housing and inserting a
second portion of the bonding member into a bottom of the sidewall
of the cover.
16. The method according to claim 10, wherein the bonding member is
formed of a heat shrinkable film.
17. The method according to claim 10, further comprising forming a
thermal resistance increasing part in the sidewall of the housing
or the sidewall of the cover, before the thermoelectric module
accommodation step or after the bonding step.
18. The method according to claim 10, wherein a portion of the
sidewall of the housing is pressurized to form a thin wall portion
that is thinner than the sidewall of the housing, before the
thermoelectric module accommodation step.
19. The method according to claim 10, wherein a portion of the
sidewall of the housing is processed to form a non-straight
portion, before the thermoelectric module accommodation step or
after the bonding step.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application claims priority to Korean Patent
Application No. 10-2016-0087513, filed Jul. 11, 2016, the entire
contents of which is incorporated herein for all purposes by this
reference.
BACKGROUND OF THE INVENTION
Field of the Invention
[0002] The present invention relates to a method for packaging at
least one thermoelectric module and, more particularly, to a method
for packaging a thermoelectric module, which can stably protect
individual elements of the thermoelectric module such as
thermoelectric elements, electrodes, and insulating boards, while
maintaining the power generation performance of the thermoelectric
module.
Description of Related Art
[0003] A thermoelectric module is used in a thermoelectric power
generation system utilizing the Seebeck effect in which a
difference in temperatures of both surfaces of the thermoelectric
module is used to generate an electromotive force.
[0004] During the thermoelectric power generation by such a
thermoelectric module, the output of the thermoelectric power
generation may be increased by maintaining a large temperature
difference between the high temperature side and the low
temperature side. Here, a heat transfer rate from a heat source to
the thermoelectric module may significantly affect the output.
[0005] The thermoelectric module includes a plurality of
thermoelectric elements (N-type and P-type semiconductors) having
opposite polarities and arranged in an alternating manner. The
plurality of thermoelectric elements may be electrically connected
in series through electrodes thereof, and insulating boards may be
attached to respective electrodes.
[0006] Meanwhile, when the thermoelectric elements and/or the
electrodes of the thermoelectric module come into contact with the
outside air under a high temperature environment, they may be
oxidized or chemically changed, which may degrade thermoelectric
power generation performance.
[0007] When moist or conducting liquid (water or the like) contacts
the thermoelectric elements and/or the electrodes, it may cause
electrical shorting.
[0008] In addition, when impacts or shocks may occur due to
external physical factors, stress, strain, shear force or the like
may cause damages to the thermoelectric module.
[0009] In order to protect the thermoelectric module from external
chemical and/or physical factors, a technique of packaging the
thermoelectric elements, the electrodes, and the like with a
metallic housing has been proposed.
[0010] In a conventional packaging technique, however, heat
transfer may easily occur along sidewalls of the metallic housing,
resulting in severe heat loss. Accordingly, it is difficult to
secure a temperature difference between the high temperature side
and the low temperature side, which may degrade thermoelectric
power generation performance.
[0011] In addition, when the thermoelectric module is exposed to a
heat source for a long time or is subjected to repeated temperature
changes, thermal stress or thermal shock may occur due to a
difference in thermal expansion coefficients between the
thermoelectric elements and the electrodes, resulting in damages to
the thermoelectric module and malfunction of the thermoelectric
module.
[0012] Furthermore, an electric wire connected to the electrode of
the thermoelectric module may be sealed through hermetic sealing,
which may cause severe leakage current due to insulation
resistance. The strain of the electric wire may change the
electrode resistance, which may degrade thermoelectric power
generation performance.
[0013] The information disclosed in this Background of the
Invention section is only for enhancement of understanding of the
general background of the invention and should not be taken as an
acknowledgement or any form of suggestion that this information
forms the prior art already known to a person skilled in the
art.
BRIEF SUMMARY
[0014] Various aspects of the present invention are directed to
providing a method for packaging a thermoelectric module, which can
effectively prevent an oxidation reaction, chemical changes, and
the like that may be caused by external factors, avoid electrical
shorting that may be caused by moist, conducting liquid, or the
like, and protect individual elements of the thermoelectric module
from stress, strain, shear force, and the like, due to external
physical factors.
[0015] According to various aspects of the present invention, a
method for packaging a thermoelectric module may include
thermoelectric module accommodation, of accommodating at least one
thermoelectric module in a housing having a base and a sidewall,
electric wire sealing, of sealing an electric wire of the
thermoelectric module with a sealing tube, bonding member
interposing, of placing a cover having a top portion and a sidewall
on top of the housing and interposing a bonding member between the
sidewall of the housing and the sidewall of the cover, and bonding,
of bonding the sidewall of the housing and the sidewall of the
cover that are hermetically sealed by the bonding member, in which
the bonding member may be a resin material.
[0016] The bonding member interposing may include passing the
sealing tube through a portion of the bonding member.
[0017] The bonding member interposing may include inserting a first
portion of the bonding member into a top of the sidewall of the
housing and inserting a second portion of the bonding member into a
bottom of the sidewall of the cover.
[0018] The bonding may include applying heat to the bonding member
in a vacuum or inert atmosphere for the bonding member to be melted
and cured between a top of the sidewall of the housing and a bottom
of the sidewall of the cover to hermetically seal the top of the
sidewall of the housing and the bottom of the sidewall of the
cover.
[0019] The sealing tube may be a heat shrinkable tube, and the
electric wire may be sealed by applying heat to the heat shrinkable
tube.
[0020] The bonding member may be a heat shrinkable film.
[0021] The method may further include forming a thermal resistance
increasing part in at least one of the sidewall of the housing and
the sidewall of the cover, before the thermoelectric module
accommodation or after the bonding.
[0022] A portion of the sidewall of the housing may be pressurized
to form a thin wall portion that is thinner than the sidewall of
the housing, before the thermoelectric module accommodation.
[0023] A portion of the sidewall of the housing may be processed to
form a non-straight portion, before the thermoelectric module
accommodation or after the bonding.
[0024] According to various aspects of the present invention, a
method for packaging a thermoelectric module may include
thermoelectric module accommodation, of accommodating at least one
thermoelectric module in a housing having a base and a sidewall,
tube installation, of providing a tube having an inner diameter
greater than an outer diameter of an electric wire of the
thermoelectric module on a periphery of the electric wire to form a
gap between the electric wire and the tube, bonding member
interposing, of placing a cover having a top portion and a sidewall
on top of the housing and interposing a bonding member between the
sidewall of the housing and the sidewall of the cover, bonding, of
bonding the sidewall of the housing and the sidewall of the cover
that are hermetically sealed by the bonding member, vacuumizing, of
vacuumizing an internal space of the housing and the cover through
the gap between the electric wire and the tube, and tube sealing,
of sealing the tube after the vacuumizing, in which the bonding
member may be formed of a resin material.
[0025] The vacuumizing may include injecting an inert gas through
the gap between the electric wire and the tube.
[0026] A heat resistant cap may be provided on an outer end portion
of the tube, between the bonding member interposing and the
bonding.
[0027] The tube sealing may include providing a sealing cap on an
outer end portion of the tube and applying heat thereto to seal the
outer end portion of the tube through melting and curing of the
sealing cap.
[0028] A top of the sidewall of the housing and a bottom of the
sidewall of the housing may be provided with first and second
fitting parts, respectively, to which the bonding member is fitted.
By applying heat to the bonding member, the bonding member may be
melted and cured between the first and second fitting parts to
hermetically seal the first and second fitting parts.
[0029] Each of the first and second fitting parts may include a
horizontal portion extending in a horizontal direction and a bent
portion bent with respect to the horizontal portion at a
predetermined angle.
[0030] The first and second fitting parts may be disposed to be
adjacent to the inside of the sidewall of the housing and the
inside of the sidewall of the cover.
[0031] The first and second fitting parts may be disposed in
opposite positions in relation to the sidewall of the housing and
the sidewall of the cover.
[0032] It is understood that the term "vehicle" or "vehicular" or
other similar terms as used herein is inclusive of motor vehicles
in general such as passenger automobiles including sports utility
vehicles (SUV), buses, trucks, various commercial vehicles,
watercraft including a variety of boats and ships, aircraft, and
the like, and includes hybrid vehicles, electric vehicles, plug-in
hybrid electric vehicles, hydrogen-powered vehicles and other
alternative fuel vehicles (e.g., fuel derived from resources other
than petroleum). As referred to herein, a hybrid vehicle is a
vehicle that has two or more sources of power, for example, both
gasoline-powered and electric-powered vehicles.
[0033] The methods and apparatuses of the present invention have
other features and advantages which will be apparent from or are
set forth in more detail in the accompanying drawings, which are
incorporated herein, and the following Detailed Description, which
together serve to explain certain principles of the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0034] FIG. 1 illustrates a flowchart of a method for packaging a
thermoelectric module, according to various embodiments of the
present invention.
[0035] FIG. 2 illustrates a thermoelectric module accommodation
step and an electric wire sealing step in a method for packaging a
thermoelectric module, according to various embodiments of the
present invention.
[0036] FIG. 3 illustrates a step for allowing a sealing tube to
pass through a bonding member in a method for packaging a
thermoelectric module, according to various embodiments of the
present invention.
[0037] FIG. 4 illustrates a bonding member interposing step in a
method for packaging a thermoelectric module, according to various
embodiments of the present invention.
[0038] FIG. 5 illustrates a bonding step in a method for packaging
a thermoelectric module, according to various embodiments of the
present invention.
[0039] FIG. 6 illustrates a state in which a thermoelectric module
is packaged by a housing, using a method for packaging a
thermoelectric module, according to various embodiments of the
present invention.
[0040] FIG. 7 illustrates a flowchart of a method for packaging a
thermoelectric module, according to various embodiments of the
present invention.
[0041] FIG. 8 illustrates a thermoelectric module accommodation
step and a tube installation step in a method for packaging a
thermoelectric module, according to various embodiments of the
present invention.
[0042] FIG. 9 illustrates a bonding member interposing step and a
bonding step in a method for packaging a thermoelectric module,
according to various embodiments of the present invention.
[0043] FIG. 10 illustrates a vacuumizing step in a method for
packaging a thermoelectric module, according to various embodiments
of the present invention.
[0044] FIG. 11 illustrates a tube sealing step in a method for
packaging a thermoelectric module, according to various embodiments
of the present invention.
[0045] FIG. 12 illustrates a state in which a thermoelectric module
is packaged by a housing, using a method for packaging a
thermoelectric module, according to various embodiments of the
present invention.
[0046] FIG. 13 illustrates a step for forming a thin wall portion
in a method for packaging a thermoelectric module, according to
various embodiments of the present invention.
[0047] FIG. 14 illustrates a step for forming a non-straight
portion in a method for packaging a thermoelectric module,
according to various embodiments of the present invention.
[0048] FIG. 15 illustrates a cooling unit installation step after a
thermoelectric module is packaged in a method for packaging a
thermoelectric module, according to various embodiments of the
present invention.
[0049] FIG. 16 illustrates a cooling unit installation step after a
thermoelectric module is packaged in a method for packaging a
thermoelectric module, according to various embodiments of the
present invention.
[0050] It should be understood that the appended drawings are not
necessarily to scale, presenting a somewhat simplified
representation of various features illustrative of the basic
principles of the invention. The specific design features of the
present invention as disclosed herein, including, for example,
specific dimensions, orientations, locations, and shapes will be
determined in part by the particular intended application and use
environment.
DETAILED DESCRIPTION
[0051] Reference will now be made in detail to various embodiments
of the present invention(s), examples of which are illustrated in
the accompanying drawings and described below. While the
invention(s) will be described in conjunction with exemplary
embodiments, it will be understood that the present description is
not intended to limit the invention(s) to those exemplary
embodiments. On the contrary, the invention(s) is/are intended to
cover not only the exemplary embodiments, but also various
alternatives, modifications, equivalents and other embodiments,
which may be included within the spirit and scope of the invention
as defined by the appended claims.
[0052] According to various embodiments of the present invention, a
method for packaging a thermoelectric module may be implemented by
packaging at least one thermoelectric module 10 in a housing 41 and
a cover 42 as illustrated in FIG. 6. At least one thermoelectric
module 10 may be stably protected by the housing 41 and the cover
42 that are bonded and hermetically sealed using the bonding member
61.
[0053] As illustrated in FIG. 2, the thermoelectric module 10
includes one or more first thermoelectric elements 11 and one or
more second thermoelectric elements 12 that are arranged in an
alternating manner, and a plurality of electrodes 21 and 22
electrically connecting the first and second thermoelectric
elements 11 and 12 in series.
[0054] The first and second thermoelectric elements 11 and 12 that
are semiconductors having opposite polarities may be paired while
alternating with each other. Adjacent first and second
thermoelectric elements 11 and 12 may form a semiconductor pair.
For example, when the first thermoelectric element 11 is an N-type
semiconductor, the second thermoelectric element 12 is a P-type
semiconductor. On the contrary, when the first thermoelectric
element 11 is a P-type semiconductor, the second thermoelectric
element 12 is an N-type semiconductor.
[0055] As illustrated in FIG. 2, the plurality of electrodes 21 and
22 include at least one first electrode 21 connecting the top of
the first thermoelectric element 11 to the top of the second
thermoelectric element 12, and at least one second electrode 22
connecting the bottom of the first thermoelectric element 11 to the
bottom of the second thermoelectric element 12. The first and
second electrodes 21 and 22 may be disposed on the tops and bottoms
of the first and second thermoelectric elements 11 and 12 in a
zigzag arrangement, thereby electrically connecting the first and
second thermoelectric elements 11 and 12 in series.
[0056] The thermoelectric module 10 according to various
embodiments of the present invention further includes a first
insulating board 31 provided with respect to one or more first
electrodes 21, and a second insulating board 32 provided with
respect to one or more second electrodes 22.
[0057] The plurality of first electrodes 21 and the plurality of
second electrodes 22 may be provided on facing surfaces of the
first insulating board 31 and the second insulating board 32,
respectively.
[0058] As illustrated in FIG. 2, the plurality of first electrodes
21 may be formed to be integrated on a bottom surface of the first
insulating board 31 through a patterning process or the like.
Alternatively, the plurality of first electrodes 21 may be attached
to the bottom surface of the first insulating board 31 through an
adhesive or soldering.
[0059] As illustrated in FIG. 2, the plurality of second electrodes
22 may be formed to be integrated on a top surface of the second
insulating board 32 through a patterning process or the like.
Alternatively, the plurality of second electrodes 22 may be
attached to the top surface of the second insulating board 32
through an adhesive or soldering.
[0060] The first insulating board 31 and the second insulating
board 32 may be spaced apart from each other in a vertical
direction, such that the first and second thermoelectric elements
11 and 12 having opposite polarities may be arranged to alternate
with each other in a horizontal direction between the first
insulating board 31 and the second insulating board 32.
[0061] By arranging the plurality of thermoelectric elements 11 and
the plurality of second thermoelectric elements 12 in an
alternating manner between the first insulating board 31 and the
second insulating board 32, the plurality of paired semiconductors
may be disposed between the first insulating board 31 and the
second insulating board 32.
[0062] Meanwhile, the first insulating board 31 and the second
insulating board 32 may form a low temperature part and a high
temperature part, respectively, in order to make an appropriate
temperature difference. For example, a cooling unit may be
integrally provided in the inside of the first insulating board 31
or may be attached to an external surface of the first insulating
board 31, such that the first insulating board 31 may be configured
as the lower temperature part (a heat dissipation part), and a heat
source may be integrated with the second insulating board 32 or may
be attached to the second insulating board 32, such that the second
insulating board 32 may be configured as the high temperature part
(a heat absorption part). On the contrary, a heat source may be
provided with the first insulating board 31, such that the first
insulating board 31 may be configured as the high temperature part
(the heat absorption part); and a cooling unit may be provided with
the second insulating board 32, such that the second insulating
board 32 may be configured as the lower temperature part (the heat
dissipation part).
[0063] An electric wire or a lead may be connected to the first
electrode 21 or the second electrode 22 of the thermoelectric
module 10. The electric wire or the lead may be led to the outside
of the housing 41 and the cover 42 to output electrical energy
generated by the thermoelectric elements 11 and 12 and the
electrodes 21 and 22 externally. Hereinafter, the electric wire or
the lead for outputting electrical energy will be referred to as
the "electric wire 71", and the electric wire 71 described herein
includes all types of output units for outputting the electrical
energy generated by the thermoelectric elements 11 and 12 and the
electrodes 21 and 22 externally. For example, the electric wire 71
of the thermoelectric module 10 may be connected to the first
electrode 21 to be led to the outside of the housing 41 and the
cover 42.
[0064] FIG. 1 illustrates a flowchart of a method for packaging a
thermoelectric module, according to various embodiments of the
present invention. In various embodiments, the method for packaging
a thermoelectric module includes a thermoelectric module
accommodation steps S1 for accommodating at least one
thermoelectric module 10 in the housing 41, an electric wire
sealing step S2 for sealing the electric wire 71 of the
thermoelectric module 10 with a sealing tube 63, a bonding member
interposing step S3 for placing the cover 42 on the top of the
housing 41 and interposing the bonding member 61 between a sidewall
45 of the housing 41 and a sidewall 46 of the cover 42, and a
bonding step S4 for bonding the bonding member 61 to the sidewall
45 of the housing 41 and the sidewall 46 of the cover 42.
Thermoelectric Module Accommodation Step (S1)
[0065] As illustrated in FIG. 2, the housing 41 includes a base 43
supporting a bottom surface of the second insulating board 32 of
the thermoelectric module 10, and the sidewall 45 provided on edges
of the base 43. The sidewall 45 may extend along the edges of the
base 43.
[0066] At least one thermoelectric module 10 may be accommodated in
the inside of the housing 41 in step S1. The base 43 of the housing
41 may support the bottom surface of the second insulating board 32
of the thermoelectric module 10, and the sidewall 45 of the housing
41 may envelop the second insulating board 32 of the thermoelectric
module 10 and parts adjacent to the second insulating board 32.
[0067] The housing 41 may be formed of a material having high
thermal resistance and high rigidity so as to protect the
thermoelectric elements 11 and 12, the electrodes 21 and 22, and
the insulating boards 31 and 32 of the thermoelectric module 10.
For example, the housing 41 may be formed of a metal such as
stainless or a base metal such as ceramic.
Electric Wire Sealing Step (S2)
[0068] As illustrated in FIG. 2, the sealing tube 63 may be
provided to seal the electric wire 71 of the thermoelectric module
10 in step S2.
[0069] The sealing tube 63 may be formed of an insulating resin
material. By allowing the sealing tube 63 to be hermetically
attached to the periphery of the electric wire 71, sealability and
insulating properties with respect to the electric wire 71 may be
secured.
[0070] According to various embodiments, the sealing tube 63 may be
a heat shrinkable tube. As illustrated in FIG. 2, by applying heat
H to an external surface of the sealing tube 63, the sealing tube
63, which is a heat shrinkable tube, may be thermally shrunk and
attached to an external surface of the electric wire 71, thereby
securing sealability and insulating properties with respect to the
electric wire 71.
[0071] Meanwhile, the sealing tube 63 may be extended in a
direction perpendicular to the sidewall 45 of the housing 41, i.e.,
in a horizontal direction, such that the electric wire 71 sealed by
the sealing tube 63 may conveniently be provided in the horizontal
direction. By allowing the electric wire 71 to pass through the
sealing tube 63 and be led out in the horizontal direction, the
insulation resistance of the electric wire 71 may be minimized,
whereby leakage may be prevented during the thermoelectric power
generation, and the strain of the electric wire 71 may be prevented
such that variations in resistance of the electrodes 21 and 22 may
be minimized.
Bonding Member Interposing Step (S3)
[0072] After the electric wire 71 of the thermoelectric module 10
is sealed by the sealing tube 63, the sealing tube 63 may pass
through a through hole 61a of the bonding member 61 as illustrated
in FIG. 3, and then, a portion 61c (a bottom portion) of the
bonding member 61 may be inserted into the top of the sidewall 45
of the housing 41 as illustrated in FIG. 4.
[0073] Then, the housing 41 in which the thermoelectric module 10
is accommodated may be positioned within a vacuum chamber 100 or a
chamber filled with inert gas as illustrated in FIG. 5. After the
cover 42 is positioned on the top of the housing 41, a portion 61b
(a top portion) of the bonding member 61 may be inserted into the
bottom of the sidewall 46 of the cover 42, and thus, the bonding
member 61 may be interposed between the top of the sidewall 45 of
the housing 41 and the bottom of the sidewall 46 of the cover 42 in
step S3.
[0074] The housing 41 and the cover 42 in which at least one
thermoelectric module 10 is accommodated may be placed within the
vacuum chamber 100 such that an internal space of the housing 41
and the cover 42 may be vacuumized. Thus, when the thermoelectric
module 10 is packaged by the housing 41 and the cover 42,
sealability and insulating properties may be significantly
improved.
[0075] As illustrated in FIG. 5, the cover 42 includes a top
portion 44 supporting a top surface of the first insulating board
31 of the thermoelectric module 10, and the sidewall 46 provided on
edges of the top portion 44. The sidewall 46 may extend along the
edges of the top portion 44. By allowing the sidewall 46 of the
cover 42 and the sidewall 45 of the housing 41 to correspond to
each other, the cover 42 may be placed on the top of the housing
41. The cover 42 may envelop the first insulating board 31 of the
thermoelectric module 10 and parts adjacent to the first insulating
board 31.
[0076] The cover 42 may be formed of a material having high thermal
resistance and high rigidity so as to protect the thermoelectric
elements 11 and 12, the electrodes 21 and 22, and the insulating
boards 31 and 32 of the thermoelectric module 10. For example, the
cover 42 may be formed of a metal such as stainless or a base metal
such as ceramic.
[0077] The bonding member 61 may be formed of a film or sheet made
of a material capable of being melted by heat. For example, the
bonding member 61 may be formed of a resin material capable of
being melted by heat such that it may hermetically seal the housing
41 and the cover 42.
[0078] According to various embodiments, the bonding member 61 may
be formed of a heat shrinkable film or a heat shrinkable sheet.
[0079] According to various embodiments, fitting parts 51 and 52
may be provided with the sidewall 45 of the housing 41 and the
sidewall 46 of the cover 42, respectively, and the bonding member
61 may be bonded to the fitting parts 51 and 52. By allowing the
bonding member 61 to be bonded to the fitting parts 51 and 52, the
sealability and bonding properties of the housing 41 and the cover
42 through the bonding member 61 may be further stabilized and
secured.
[0080] The fitting parts 51 and 52 include a first fitting part 51
provided at the top of the sidewall 45 of the housing 41, and a
second fitting part 52 provided at the bottom of the sidewall 46 of
the cover 42.
[0081] The first fitting part 51 includes a first horizontal
portion 53 extending from the top of the sidewall 45 of the housing
41 in a horizontal direction, and a first bent portion 55 bent from
an end of the first horizontal portion 53 at a predetermined
angle.
[0082] The first horizontal portion 53 may be extended from the
sidewall 45 of the housing 41 toward the internal space of the
housing 41 in the horizontal direction.
[0083] FIG. 5 illustrates the first bent portion 55 being bent at
approximately 90 degrees with respect to the first horizontal
portion 53 by way of example. However, the first bent portion 55
may be bent at an angle smaller than 90 degrees or at an angle
larger than 90 degrees. Corners of the first horizontal portion 53
and the first bent portion 55 may be rounded, such that the bottom
of the bonding member 61 may conveniently be fitted to the first
fitting part 51
[0084] The second fitting part 52 includes a second horizontal
portion 54 extending from the bottom of the sidewall 46 of the
cover 42 in a horizontal direction, and a second bent portion 56
bent from an end of the second horizontal portion 54 at a
predetermined angle.
[0085] The second horizontal portion 54 may be extended from the
sidewall 46 of the cover 42 toward the outside of the cover 42 in
the horizontal direction.
[0086] FIG. 5 illustrates the second bent portion 56 being bent at
approximately 90 degrees with respect to the second horizontal
portion 54 by way of example. However, the second bent portion 56
may be bent at an angle smaller than 90 degrees or at an angle
larger than 90 degrees. Corners of the second horizontal portion 54
and the second bent portion 56 may be rounded, such that the top of
the bonding member 61 may conveniently be fitted to the second
fitting part 52.
[0087] The first fitting part 51 and the second fitting part 52 may
be formed in opposite positions in relation to the sidewall 45 of
the housing 41 and the sidewall 46 of the cover 42. Accordingly,
the bonding member 61 may be conveniently inserted into the first
and second fitting parts 51 and 52, and the first and second
fitting parts 51 and 52 may be hermetically sealed by the bonding
member 61, whereby a stable sealing bonding structure may be
effectively obtained.
[0088] As illustrated in FIG. 5, the first horizontal portion 53
and the first bent portion 55 of the first fitting part 51 may be
disposed inwardly of the sidewall 45 of the housing 41, and the
second horizontal portion 54 and the second bent portion 56 of the
second fitting part 52 may be disposed outwardly of the sidewall 46
of the cover 42. However, the directions of the first and second
fitting parts are not limited thereto. Alternatively, the first
horizontal portion 53 and the first bent portion 55 of the first
fitting part 51 may be disposed outwardly of the sidewall 45 of the
housing 41, and the second horizontal portion 54 and the second
bent portion 56 of the second fitting part 52 may be disposed
inwardly of the sidewall 46 of the cover 42.
[0089] Alternatively, the first horizontal portion 53 and the first
bent portion 55 of the first fitting part 51 may be disposed
inwardly of the sidewall 45 of the housing 41 and the second
horizontal portion 54 and the second bent portion 56 of the second
fitting part 52 may be disposed inwardly of the sidewall 46 of the
cover 42, and thus, when heat is applied to the bonding member 61
formed of the heat shrinkable tube, the overheat of the bonding
member 61 may be prevented and stable thermal shrinkage of the
bonding member 61 may be induced. In addition, the bonding member
61 may be positioned in the internal space of the housing 41 and
the cover 42, such that it may be concealed from the outside, and
thus, damage possibilities thereof may be minimized.
Bonding Step (S4)
[0090] As illustrated in FIG. 5, after the housing 41 and the cover
42 in which at least one thermoelectric module 10 is accommodated
may be placed within the vacuum chamber 100 or the chamber filled
with the inert gas, heat may be applied to the bonding member 61
interposed between the sidewall 45 of the housing 41 and the
sidewall 46 of the cover 42 by a heat application unit 68 such as
an electron-beam or a laser, and thus, the bonding member 61 may be
melted onto the first fitting part 51 of the housing 41 and the
second fitting part 52 of the cover 42 and be then cured. Through
the melting and curing of the bonding member 61, the sidewall 45 of
the housing 41 and the sidewall 46 of the cover 42 may be firmly
bonded to each other and be hermetically sealed.
[0091] The sidewall 45 of the housing 41 and the sidewall 46 of the
cover 42 may be bonded to each other by applying the heat to the
bonding member 61 within the vacuum chamber 100 or the chamber
filled with the inert gas, whereby the sealability and insulating
properties through the housing 41 and the cover 42 may be
significantly improved.
[0092] In particular, when the heat is applied to the bonding
member 61 that is formed of a heat shrinkable film or a heat
shrinkable sheet and, the bonding member 61 may be thermally shrunk
and attached to the first fitting part 51 of the housing 41 and the
second fitting part 52 of the cover 42. The sidewall 45 of the
housing 41 and the sidewall 46 of the cover 42 may be firmly bonded
by thermal shrinkage of the bonding member 61 and be hermetically
sealed.
[0093] As stated above, since the sidewall 45 of the housing 41 and
the sidewall 46 of the cover 42 are hermetically bonded by the
bonding member 61, at least one thermoelectric module 10 may be
hermetically packaged by the housing 41 and the cover 42 as
illustrated in FIG. 6. Thus, the sidewall 45 of the housing 41 and
the sidewall 46 of the cover 42 may be firmly bonded and be
hermetically sealed.
[0094] In addition, the bonding member 61 may be bonded to the
sidewall 45 of the housing 41 and the sidewall 46 of the cover 42
in a state of being interposed therebetween, thereby preventing or
reducing the flow of heat transferred through the sidewall 45 of
the housing 41 and the sidewall 46 of the cover 42.
[0095] In particular, the bonding member 61 may be formed of a
material having thermal conductivity lower than that of the housing
41 and the cover 42. For example, the bonding member 61 may be
formed of a material having low thermal conductivity such as resin
such that it may prevent or reduce the flow of heat transferred
through the sidewall 45 of the housing 41 and the sidewall 46 of
the cover 42 formed of a metallic material.
[0096] According to various embodiments, the sealing tube 63 may
pass through the bonding member 61 such that the electric wire 71
may pass through side surfaces of the housing 41 and the cover 42
to be provided in the horizontal direction. Accordingly, electrical
connections with respect to adjacent electrical components may
easily be made, and a lead-out length of the electric wire 71 in
the sealing tube 63 may be optimized such that insulation
resistance may be minimized. Therefore, leakage may be prevented
during the thermoelectric power generation, and the strain of the
electric wire 71 may be prevented such that variations in
resistance of the electrodes 21 and 22 may be minimized.
[0097] Meanwhile, the bonding member 61 may be disposed to be
adjacent to the low temperature part so as to effectively prevent
strain due to heat of the high temperature part and prevent
dielectric breakdown or shorting of the electric wire 71.
[0098] According to various embodiments, when the first insulating
board 31 and the first electrode 21 are configured to form the low
temperature part, the bonding member 61 may be disposed to be
adjacent to the first insulating board 31 and the first electrode
21. To this end, as illustrated in FIG. 6, the sidewall 46 of the
cover 42 may be shorter than the sidewall 45 of the housing 41, and
thus, the bonding member 61 may be disposed to be adjacent to the
first electrode 21 and the first insulating board 31 forming the
low temperature part.
[0099] Alternatively, according to various embodiments, when the
second insulating board 32 and the second electrode 22 are
configured to form the low temperature part, the bonding member 61
may be disposed to be adjacent to the second insulating board 32
and the second electrode 22. To this end, the sidewall 45 of the
housing 41 may be shorter than the sidewall 46 of the cover 42, and
thus, the bonding member 61 may be disposed to be adjacent to the
second electrode 22 and the second insulating board 32 forming the
low temperature part.
[0100] According to various embodiments, the bonding member 61 may
be formed to have a shape corresponding to the aforementioned
structure of the first and second fitting parts 51 and 52, and the
bonding member 61 may be forcibly fitted to the first and second
fitting parts 51 and 52. Thus, the bonding force and sealability of
the housing 41 and the cover 42 through the bonding member 61 may
be stably secured, and the assembly of the housing 41 and the cover
42 may be convenient and easy.
[0101] FIG. 7 illustrates a flowchart of a method for packaging a
thermoelectric module, according to various embodiments of the
present invention. In the various embodiments of FIG. 7, the method
for packaging a thermoelectric module includes a thermoelectric
module accommodation step S11 for accommodating at least one
thermoelectric module 10 in the housing 41, a tube installation
step S12 for providing a tube 64 on the periphery of the electric
wire 71 of the thermoelectric module 10, a bonding member
interposing step S13 for placing the cover 42 on the top of the
housing 41 and interposing the bonding member 61 between the
sidewall 45 of the housing 41 and the sidewall 46 of the cover 42,
a bonding step S14 for bonding the bonding member 61 to the
sidewall 45 of the housing 41 and the sidewall 46 of the cover 42,
a vacuumizing step S15 for vacuumizing the internal space of the
housing 41 and the cover 42 through the tube 64, and a sealing step
S16 for sealing the tube 64.
Thermoelectric Module Accommodation Step (S11)
[0102] As illustrated in FIG. 8, at least one thermoelectric module
10 may be accommodated in the inside of the housing 41 in step
S11.
Tube Installation Step (S12)
[0103] As illustrated in FIG. 8, the tube 64 may be provided on the
periphery of the electric wire 71 of the thermoelectric module 10
in step S12.
[0104] The tube 64 may be formed of an insulating material such as
resin. An inner diameter of the tube 64 may be larger than an outer
diameter of the electric wire 71. When the electric wire 71 is
inserted into the inside of the tube 64, a gap 64a may be formed
between an internal surface of the tube 64 and an external surface
of the electric wire 71. An inert gas may be injected into the
inside of the housing 41 and the cover 42 or air within the housing
41 and the cover 42 may be discharged externally through the gap
64a between the tube 64 and the electric wire 71, thereby
vacuumizing the internal space of the housing 41 and the cover
42.
Bonding Member Interposing Step (S13)
[0105] After the tube 64 is provided to enclose the electric wire
71 of the thermoelectric module 10, the tube 64 may pass through
the bonding member 61 as illustrated in FIG. 8, and then, the
portion 61c (the bottom portion) of the bonding member 61 may be
inserted into the top of the sidewall 45 of the housing 41.
[0106] As illustrated in FIG. 9, after the cover 42 is positioned
on the top of the housing 41, the portion 61b (the top portion) of
the bonding member 61 may be inserted into the bottom of the
sidewall 46 of the cover 42, and thus, the bonding member 61 may be
interposed between the top of the sidewall 45 of the housing 41 and
the bottom of the sidewall 46 of the cover 42 in step S13.
Bonding Step (S14)
[0107] As illustrated in FIG. 9, after a heat resistant cap 66 is
provided on an outer end portion of the tube 64, heat H may be
applied to the bonding member 61 interposed between the sidewall 45
of the housing 41 and the sidewall 46 of the cover 42, and thus,
the bonding member 61 may be melted (or thermally shrunk) onto the
first fitting part 51 of the housing 41 and the second fitting part
52 of the cover 42 and be then cured. The sidewall 45 of the
housing 41 and the sidewall 46 of the cover 42 may be firmly
combined through the melting (thermal shrinkage) and curing of the
bonding member 61 and be hermetically sealed in step S14.
[0108] Here, the heat resistant cap 66 may be formed of a material
having high thermal resistance, thereby preventing the tube 64 from
being melted by heat.
[0109] According to other exemplary embodiments, the bonding member
61 may be formed to have a shape corresponding to the
aforementioned structure of the first and second fitting parts 51
and 52, and the bonding member 61 may be forcibly fitted to the
first and second fitting parts 51 and 52. Thus, the bonding force
and sealability of the housing 41 and the cover 42 through the
bonding member 61 may be stably secured, and the assembly of the
housing 41 and the cover 42 may be convenient and easy.
Vacuumizing Step (S15)
[0110] As illustrated in FIG. 10, after the heat resistant cap 66
is separated from the outer end portion of the tube 64, the inert
gas may be injected to the inside of the housing 41 and the cover
42 through the gap 64a between the tube 64 and the electric wire 71
disposed in one side of the housing (see a K1 direction indicated
by arrows in FIG. 10), and the air within the housing 41 and the
cover 42 may be discharged through the gap 64a between the tube 64
and the electric wire 71 disposed in the other side of the housing
(see a K2 direction indicated by arrows in FIG. 10), whereby the
internal space of the housing 41 and the cover 42 may be vacuumized
in step S15.
Tube Sealing Step (S16)
[0111] After the internal space of the housing 41 and the cover 42
is vacuumized, a sealing cap 65 may be provided on the outer end
portion of the tube 64 as illustrated in FIG. 11. By applying heat
H to the sealing cap 65, the outer end portion of the tube 64 may
be sealed by the sealing cap 65 as illustrated in FIG. 12.
[0112] The sealing cap 65 may be formed of an insulating resin
material to implement the sealing of the tube 64 and the insulation
of the electric wire 71.
[0113] In addition, the sealing cap 65 may be formed of a heat
shrinkable material. By applying the heat to the sealing cap 65
formed of the heat shrinkable material, the sealing cap 65 formed
of the heat shrinkable material may be thermally shrunk and
attached to the external and internal surfaces of the tube 64,
thereby firmly sealing the end portion of the tube 64. Furthermore,
the sealing cap 65 may also be attached to a portion of the
external surface of the electric wire 71, whereby the insulating
properties of the electric wire 71 may also be secured.
[0114] Meanwhile, as illustrated in FIGS. 13 and 14, the method may
further include a step for forming a thermal resistance increasing
part 48 or 49 before the thermoelectric module accommodation step
or after the bonding step. The thermal resistance increasing part
48 or 49 may be provided to increase thermal resistance at the
sidewall 45 of the housing 41 or the sidewall 46 of the cover 42,
thereby minimizing the flow or transfer of heat through the
sidewall 45 of the housing 41 or the sidewall 46 of the cover
42.
[0115] Referring to FIG. 13, a thin wall portion 48 may be formed
in a portion of the sidewall 45 of the housing 41 or the sidewall
46 of the cover 42, before the thermoelectric module accommodation
step S1 or S11.
[0116] As illustrated in FIG. 13, by pressurizing the portion of
the sidewall 45 of the housing 41 using a pressure means, the
thickness of the portion of the sidewall 45 may be reduced to form
the thin wall portion 48. Thermal resistance may be increased by
the thin wall portion 48. After the thermal resistance increasing
part 48 such as the thin wall portion 48 is formed, the
thermoelectric module 10 may be accommodated in the housing 41.
[0117] Referring to FIG. 14, before the thermoelectric module
accommodation step S1 or S11 or after the bonding step S4 or S14, a
non-straight portion 49 may be formed to have a zigzag structure or
a curved structure in a portion of the sidewall 45 of the housing
41 by various processing means 107, and thus, thermal resistance
may be increased by the non-straight portion 49.
[0118] According to various embodiments, the method may further
include a step for providing a cooling unit 80 or 90 to be adjacent
to the low temperature part of the thermoelectric module 10 after
at least one thermoelectric module 10 is hermetically packaged by
the housing 41 and the cover 42 that are bonded by the bonding
member 61.
[0119] Here, a portion 85 or 95 of the cooling unit 80 or 90 may be
extended to contact or be adjacent to at least a portion of the
bonding member 61.
[0120] Referring to FIGS. 15 and 16, the cooling unit 80 or 90 may
be provided on the top portion 44 of the cover 42, such that the
first insulating board 31 of the thermoelectric module 10 and parts
adjacent thereto may form the low temperature part.
[0121] The cooling unit 80 according to the various embodiments of
FIG. 15 includes a cooling body 81 having a channel 82 through
which a cooling fluid such as coolant passes, and an extension
portion 85 extending from one side of the cooling body 81 toward
the bonding member 61.
[0122] The extension portion 85 may contact or be adjacent to at
least a portion of the bonding member 61 such that cool air of the
cooling body 81 may be transferred to the bonding member 61,
thereby preventing heat strain or damage of the bonding member 61
and effectively preventing strain, dielectric breakdown, electrical
shorting or the like of the electric wire 71.
[0123] The cooling unit 90 according to the various embodiments of
FIG. 16 includes a cooling body 91 having cooling fins 92 through
which a vapor-phase cooling fluid such as air passes, and an
extension portion 95 extending from one side of the cooling body 91
toward the bonding member 61.
[0124] The extension portion 95 may contact or be adjacent to at
least a portion of the bonding member 61, such that cool air of the
cooling body 91 may be transferred to the bonding member 61,
thereby preventing heat strain or damage of the bonding member 61
and effectively preventing strain, dielectric breakdown, electrical
shorting or the like of the electric wire 71.
[0125] According to various embodiments, the housing and the cover
may package the external surface of the thermoelectric module,
i.e., the external surfaces of the insulating boards and the
thermoelectric elements and the electrodes disposed between the
insulating boards, thereby effectively preventing an oxidation
reaction, chemical changes, and the like that may be caused by
external factors, avoid electrical shorting that may be caused by
moist, conducting liquid or the like, and protect the individual
elements of the thermoelectric module from stress, strain, shear
force and the like due to external physical factors.
[0126] In addition, the housing and the cover may be firmly bonded
by the bonding member, thereby effectively pressurizing the
insulating boards, the electrodes, and the thermoelectric elements.
Thus, electric resistance and thermal resistance at interfaces of
the thermoelectric elements and the electrodes due to temperature
changes may be minimized, and thermal resistance at interfaces of
the electrodes and the insulating boards may also be minimized.
[0127] For convenience in explanation and accurate definition in
the appended claims, the terms "upper" or "lower", "inner" or
"outer" and etc. are used to describe features of the exemplary
embodiments with reference to the positions of such features as
displayed in the figures.
[0128] The foregoing descriptions of specific exemplary embodiments
of the present invention have been presented for purposes of
illustration and description. They are not intended to be
exhaustive or to limit the invention to the precise forms
disclosed, and obviously many modifications and variations are
possible in light of the above teachings. The exemplary embodiments
were chosen and described in order to explain certain principles of
the invention and their practical application, to thereby enable
others skilled in the art to make and utilize various exemplary
embodiments of the present invention, as well as various
alternatives and modifications thereof. It is intended that the
scope of the invention be defined by the Claims appended hereto and
their equivalents.
* * * * *