U.S. patent application number 15/192473 was filed with the patent office on 2017-12-28 for dual gate switch device.
The applicant listed for this patent is Infineon Technologies AG. Invention is credited to Jens Barrenscheen, Anton Mauder, Andreas Meiser.
Application Number | 20170373685 15/192473 |
Document ID | / |
Family ID | 60579568 |
Filed Date | 2017-12-28 |
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United States Patent
Application |
20170373685 |
Kind Code |
A1 |
Meiser; Andreas ; et
al. |
December 28, 2017 |
DUAL GATE SWITCH DEVICE
Abstract
Switch devices using switch transistors with dual gates are
provided. The dual gates may be controlled independently from each
other by first and second gate driver circuits.
Inventors: |
Meiser; Andreas; (Sauerlach,
DE) ; Mauder; Anton; (Kolbermoor, DE) ;
Barrenscheen; Jens; (Munich, DE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Infineon Technologies AG |
Neubiberg |
|
DE |
|
|
Family ID: |
60579568 |
Appl. No.: |
15/192473 |
Filed: |
June 24, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/7825 20130101;
H03K 7/08 20130101; H01L 29/41766 20130101; H01L 29/7397 20130101;
H01L 29/404 20130101; H01L 29/7813 20130101; H01L 29/407 20130101;
H03K 17/18 20130101; H01L 29/4236 20130101; H01L 29/0619 20130101;
H03K 17/687 20130101; H01L 29/1095 20130101; H01L 29/7831 20130101;
H01L 29/0696 20130101; H03K 2017/6878 20130101 |
International
Class: |
H03K 17/687 20060101
H03K017/687; H03K 7/08 20060101 H03K007/08 |
Claims
1. A switch device, comprising: a switch transistor having a first
gate and a second gate, wherein each gate controls part of a
channel of the switch transistor, a first gate driver circuit
coupled to the first gate, and a second gate driver circuit coupled
to the second gate, the second gate driver circuit being
independent from the first gate driver circuit, wherein the switch
transistor is configured such that the switch transistor is in an
on-state only when an active signal level is present at the first
gate and when the active signal level is present at the second
gate.
2. (canceled)
3. The switch device of claim 1, wherein the first gate driver
circuit comprises a first gate driver, and wherein the second gate
driver circuit comprises a second gate driver different from the
first gate driver.
4. The switch device of claim 1, wherein the first gate driver
circuit comprises a first power supply, and wherein the second gate
driver circuit comprises a second power supply different from the
first power supply.
5. The switch device of claim 1, wherein the first gate driver
circuit and the second gate driver circuit are provided on
different chips.
6. The device of claim 1, further comprising a gate discharge
component associated with at least one of the first gate and the
second gate.
7. The device of claim 6, wherein the gate discharge component is
coupled between an associated one of the first and second gates and
a load terminal of the switch transistor.
8. The switch device of claim 1, wherein the second gate driver
circuit is configured to output a signal defining an operation
window of the switch transistor, and wherein the first gate driver
circuit is configured to output a signal controlling switching of
the switch transistor.
9. The switch device of claim 8, wherein the first gate driver
circuit is configured to output a pulse width modulated signal.
10. The switch device of claim 1, wherein the first gate driver
circuit is configured to output a signal having a higher average
toggling frequency than a signal output by the second gate driver
circuit.
11. The switch device of claim 1, wherein the switch device is to
be coupled between a first terminal of a load and a negative supply
voltage or ground, the second terminal of the load to be coupled
with a positive supply voltage.
12. The switch device of claim 11, further comprising a further
switch transistor to be coupled between the load and the positive
supply voltage.
13. A method comprising: providing a dual gate switch transistor
that includes a first gate and a second gate, wherein the dual gate
switch transistor is configured to be in an on-state only when an
active signal level is present at the first gate and when the
active signal level is present at the second gate, coupling a first
gate driver circuit to the first gate of the dual gate switch
transistor, and coupling a second gate driver circuit different
from the first gate driver circuit to the second gate of the dual
gate switch transistor.
14. The method of claim 13, further comprising coupling a discharge
element between one of the first and second gate terminals of the
dual gate switch transistor and a load terminal of the dual gate
switch transistor.
15. A method, comprising: controlling an electronic switch by a
first control signal, wherein the electronic switch includes a
first gate and a second gate and is configured to be in an on-state
only when an active signal level is present at the first gate and
when the active signal level is present at the second gate,
controlling the electronic switch by a second control signal
independent from the first control signal, and combining the first
and second control signals within the electronic switch.
16. The method of claim 15, wherein the electronic switch is a dual
gate switch transistor, wherein controlling the electronic switch
by the first control signal comprises controlling the first gate of
the dual gate switch transistor with a pulse width modulated signal
to control a first part of a channel of the dual gate switch
transistor, and wherein controlling the electronic switch by the
second control signal comprises controlling the second gate of the
dual gate switch transistor with an enable signal defining an
operation window of the dual gate switch transistor to control a
second part of the channel of the dual gate switch transistor, such
that the combining is performed by the dual gate switch
transistor.
17. The method of claim 16, wherein controlling the first gate
comprises providing the pulse width modulated signal to a first
gate driver circuit, and wherein controlling the second gate
comprises providing the enable signal to a second gate driver
circuit, the second gate driver circuit being independent from the
first gate driver circuit.
18. The method of claim 17, further comprising providing the first
gate driver circuit with power independent from providing the
second gate driver circuit with power.
19. The method of claim 15, further comprising selectively coupling
a load to a supply voltage by controlling the electronic
switch.
20. The method of claim 19, wherein said selectively coupling
comprises selectively coupling the load to one of ground or
negative supply voltage, the method further comprising selectively
coupling the load to a positive supply voltage using a further
electronic switch.
Description
TECHNICAL FIELD
[0001] The present application relates to switch devices and
corresponding methods.
BACKGROUND
[0002] Switches are used in electrical applications to selectively
provide an electrical connection between two or more terminals of a
switch. Power switches are used in applications where high voltages
have to be switched and/or high currents have to be conducted via
the switch, for example voltages of some hundred Volts and currents
of several Amperes, for example several tens of Amperes. Such
switches may inter alia be used in safety-critical environments,
for example in automotive applications. In such environments,
besides the "pure" function of a device like a switch (i.e.
selectively providing an electrical connection), functional safety
aspects become more and more important, for example in automotive
applications in the power transmission chain, braking, engine
management etc.
[0003] For example, according to some functional safety
requirements, for a specific function there may have to be
alternative ways to achieve this function, and/or a safe switch-off
path to deactivate the function. For example, to achieve this,
redundancy may be provided, for example alternative connections
between devices, or different ways to achieve a function may be
provided, which is an example for diversification (sometimes also
referred to as diversity). To give an example, in conventional
systems to control a switch or combination of switches (for example
arranged in a half bridge topology), in some applications two
signal paths are required: one to define a switching behaviour of
the switch (for example by providing a pulse width modulated (PWM)
signal), and another one to enable/disable the operation of the
switch or combination of switches. These two signals are generated
and provided by different paths. For example, a pulse width
modulated signal may use a path through some logic blocks and a
gate driver, whereas the enable signal interacts with the gate
drive very closely for the switch.
[0004] Nevertheless, the two signals in conventional approaches are
combined at some point, for example in a logic circuit or at a gate
driver, to provide a single control signal to the switch.
Therefore, at least in part of a circuit there is only a single
connection to the switch (for example from the gate driver to the
switch), for which no redundancy is provided.
SUMMARY
[0005] According to an implementation, a switch device is provided,
comprising:
[0006] a switch transistor having a first gate and a second gate,
wherein each gate controls part of a channel of the switch
transistor,
[0007] a first gate driver circuit coupled to the first gate,
and
[0008] a second gate driver circuit coupled to the second gate, the
second gate driver circuit being independent from the first gate
driver circuit.
[0009] According to another implementation, a method is provided,
comprising:
[0010] providing a dual gate switch transistor,
[0011] coupling a first gate driver circuit to a first gate of the
dual gate switch transistor, and
[0012] coupling a second gate driver circuit different from the
first gate driver circuit to a second gate of the dual gate switch
transistor.
[0013] According to yet another implementation, a method is
provided, comprising: [0014] controlling an electronic switch by a
first control signal,
[0015] controlling the electronic switch by a second control signal
independent from the first control signal, and
[0016] combining the first and second control signals within the
electronic switch.
[0017] The above summary is only intended to provide a brief
overview and is not to be construed as limiting in any way.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] FIG. 1 is a block diagram of a switch device according to an
embodiment.
[0019] FIG. 2 is a circuit diagram of a switch device according to
an embodiment.
[0020] FIG. 3 illustrates example signals for the switch device of
FIG. 2.
[0021] FIG. 4 illustrates a switch device arrangement.
[0022] FIGS. 5A and 5B illustrate an implementation example of a
dual gate transistor usable in embodiments.
[0023] FIG. 6 illustrates a cross-sectional view of a dual gate
transistor structure usable in some embodiments.
[0024] FIG. 7 illustrates a dual gate transistor structure usable
in some embodiments.
[0025] FIG. 8 is a flow chart illustrating a method according to an
embodiment.
DETAILED DESCRIPTION
[0026] In the following, various embodiments will be described
referring to the attached drawings. These embodiments serve as
examples only and are not to be construed as limiting. For example,
while embodiments may be described comprising a plurality of
features or elements, in other embodiments some of these features
or elements may be omitted and/or may be replaced by alternative
features or elements. Furthermore, in addition to the features or
elements explicitly shown in the drawings and described herein
further features or elements, for example features or elements
employed in conventional switch devices, may be provided.
[0027] Features or elements from different embodiments may be
combined with each other to form further embodiments. Variations or
modifications described with respect to one of the embodiments may
also be applicable to other embodiments.
[0028] In the embodiments described and shown, any direct
electrical connection between components, i.e. any electrical
connection without intervening elements (for example simple metal
layers or wires) may also be replaced by an indirect connection or
coupling, i.e. connection or coupling with one or more additional
intervening elements, and vice versa, as long as the general
purpose and function of the connection, for example to transmit a
certain kind of signal or information or to provide a certain kind
of control, is essentially maintained.
[0029] Some embodiments use dual gate transistors as switch
devices. Dual gate transistors are transistors comprising a first
load terminal, a second load terminal, a first gate terminal
coupled to a first gate and a second gate terminal coupled to a
second gate. Each gate controls part of a channel (e.g. n-channel
or p-channel) of the dual gate transistor. In embodiments, only if
a signal level activating the transistor is applied to both first
and second gate terminals, the transistor becomes conducting
between the first and second load terminals, i.e. provides a
low-ohmic connection between the first and second load terminals,
as then the complete channel becomes conducting. This state is also
referred to as on-state or closed state of the transistor or
switch. When at none of the first and second gate terminals or only
at one of the first and second gate terminals a signal level
activating the transistor is applied, the transistor is essentially
non-conducting between its first and second load terminals. This
state is also referred to as an off-state or open state of the
transistor or switch. "essentially non-conducting" in this context
means non-conducting apart from possible small leakage currents,
which depending on the transistor implementation may occur. In case
of implementation as field effect transistors, the first and second
load terminals correspond to source and drain terminals. In case of
other types of transistors like insulated gate bipolar transistors
(IGBTs), the first and second gate terminals may correspond to
collector and emitter terminals.
[0030] The signal level to activate the transistor (referred to as
"active signal level" herein) depends on the type of transistor,
for example on whether the transistor is implemented as an
n-channel or a p-channel transistor.
[0031] As can be seen from the above explanations, the first and
second gate terminals in some embodiments form an AND function for
the signals applied thereto. By using such a dual gate transistor,
independent signal paths (thus providing redundancy and/or
diversity) for controlling the transistor may be provided up to the
transistor itself, without having to merge paths at some position
outside the transistor to provide a single control signal to the
transistor. This in embodiments may increase redundancy and
therefore may help to fulfill functional safety requirements.
[0032] Turning now to the Figures, FIG. 1 illustrates a switch
device according to an embodiment. The switch device of FIG. 1
comprises a dual gate switch transistor 12 having a first gate 13
and a second gate 14. First gate 13 is driven by a first gate
driver circuit 10, and second gate 14 is driven by a second gate
driver circuit 11. First and second gate driver circuits 10, 11
operate independently from each other to drive first and second
gates 13, 14, respectively. Switch 12 is only closed when both
first and second gate driver circuits 10, 11 output a signal with
an active signal level. This provides redundancy in driving switch
transistor 12 and may help to fulfill functional safety
requirements. First and second gate driver circuits 10, 11 to
increase redundancy may be supplied by or comprise different power
supplies. In other embodiments they may be supplied by a same power
supply. As can be seen in FIG. 1, there is no common signal path
for first and second gate drivers circuits 10, 11, such that also
for the path from gate driver circuits 10, 11 to switch 12
redundancy is provided. The merging of the signal paths takes place
in the switch itself by using the dual gate structure of the dual
gate switch transistor, which essentially acts as an AND gate. This
is in contrast to conventional solutions where a merging of signal
paths has to take place outside the switch transistor, which leads
to a path from the merging to the transistor being provided without
redundancy.
[0033] Transistor 12 in some embodiments may be a power transistor
usable to switch high voltages, for example voltages above 50 V or
above 100 V, and/or high currents, for example above 1 A or above
10 A, but is not limited thereto. Transistor 12 may be implemented
for example as a field effect transistor or IGBT and/or may
comprise a plurality of transistor cells coupled in parallel.
Example implementations for dual gate transistors will be discussed
later referring to FIGS. 5-7.
[0034] In embodiments, a timing of signals output by first gate
driver circuit 10 is independent of a timing of signals output by
second gate driver circuit 11. For example, one of first and second
gate driver circuits 10, 11 may output an enable signal, which on
average has a lower toggling frequency (frequency of switching
between an active signal level and inactive signal level) than a
signal output by the other one of first and second gate driver
circuits 10, 11, which is used to control the actual switching of
transistor 12.
[0035] To illustrate further, FIG. 2 illustrates a circuit diagram
of a switch device according to an embodiment. The switch device of
FIG. 2 comprises a dual gate transistor 25 having a first gate
terminal 26 and a second gate terminal 27. Transistor 25 may be
used to selectively couple a load 24 with a supply voltage or
reference potential, for example a positive supply voltage or
ground. In the example of FIG. 2, transistor 25 may act as a
so-called low side switch to selectively couple load 24 with a
reference potential like ground or a negative supply voltage. A
high side switch to couple load 24 selectively to a positive supply
voltage may be implemented correspondingly.
[0036] First gate terminal 26 is driven by a first gate driver 21.
First gate driver 21 is supplied by a first power supply 22. A
first gate driver controller 23 may be used to selectively enable
and disable first gate driver 21. First gate driver 21 receives an
input signal from a logic circuit 20. Logic circuit 20 may receive
or generate a pulse width modulated (PWM) signal for switching
transistor 25 on and off.
[0037] Second gate terminal 27 is driven by a second gate driver
28. Second gate driver 28 is supplied by a second power supply 29,
which is independent from first power supply 22. Second gate driver
28 may be selectively enabled and disabled using a second gate
driver controller 211, which is independent from first gate driver
controller 23. Second gate driver 28 in the example of FIG. 2
receives an ENABLE signal to selectively enable and disable
switching of transistor 25.
[0038] Therefore, in the embodiment of FIG. 2 signals driving first
and second gate terminals 26, 27 of transistor 25 are generated
independently from each other.
[0039] Optionally, and shown only for second gate terminal 27 in
FIG. 2, a discharge element 210, for example a discharge resistor
or other impedance, may be provided. Such a discharge element in
embodiments may ensure that the respective gate terminal is
discharged in case the gate driver output (in this case output of
second gate driver 28) is disconnected from the respective gate
terminal (here: 27). A similar discharge element alternatively or
additionally may be provided for first gate terminal 26. In other
embodiments, providing a discharge element may be omitted. The
discharge element may be implemented in the switch itself, e.g. in
a polysilicon structure. Such a discharge element may define a safe
state for the transistor.
[0040] In some embodiments, all elements of FIG. 2 apart from load
24 may be implemented in a single integrated circuit on a single
chip die. In other embodiments, for example discharge element 210
may be an external element. In yet other embodiments, discharge
element 210 may be integrated in a package of the switch device for
example by chip-on-chip or chip-by-chip embedding or can be
directly integrated in the switch device itself, for example formed
as a polysilicon layer. In other embodiments, the circuitry
controlling first gate terminal 26 (i.e. components 20-23) may be
implemented on a separate chip die from the components controlling
second gate terminal 27 (i.e. components 28, 29, 211).
[0041] To illustrate the operation of the embodiment of FIG. 2,
FIG. 3 illustrates example signal waveforms. It should be noted
that the signal waveforms of FIG. 3 serve only for illustration
purposes to provide a deeper understanding and are not to be
construed as limiting, as the signals used may depend on a
particular implementation of the switched device and on a
particular application.
[0042] FIG. 3 illustrates a pulse width modulated signal PWM (as
input for example to logic circuit 20 to control first gate driver
21) and an ENABLE signal fed to second gate driver circuit 28.
[0043] The ENABLE signal as illustrated in FIG. 3 defines an
operating window within which transistor 25 may be switched using
the signal PWM. The signal PWM defines the actual switching.
[0044] For the PWM signal, a number of desired PWM pulses are shown
within operating window defined by the ENABLE signal. These change
the switch state of transistor 25 as shown in the bottom line of
FIG. 3. In contrast thereto, an erroneous PWM pulse occurring
outside the operating window does not lead to a change of state of
the switch. Therefore, the ENABLE signal provides an additional
safety measure to prevent undesired switching due to erroneous PWM
pulses outside the operating window.
[0045] It should be noted that while in the embodiments above dual
gate transistors are used providing two independent paths, also
more than two gates, for example three gates, with a corresponding
number of independent control paths may be used.
[0046] For comparison purposes, FIG. 4 shows a conventional switch
control of a switch transistor 44 operated as low side switch
together with further elements. In FIG. 4, low side switch
transistor 44 is a single gate transistor and serves to selectively
couple a load 45 to a negative supply voltage or reference
potential like ground. Low side switch transistor 44 is controlled
by a gate driver 43. Gate driver 43 is controlled by an output
signal of a logic circuit 42, which in turn may be controlled by a
pulse width modulated signal PWM1.
[0047] Furthermore, logic circuit 42, gate driver 43 or both may be
enabled and disabled by an enable signal ENABLE1. Signals PWM1,
ENABLE1 essentially serve the same function as the signals PWM,
ENABLE discussed with reference to FIGS. 2 and 3. However, in FIG.
4, as the enable signal ENABLE1 acts on logic circuit 42 and/or
gate driver 43, only a single connection runs from gate driver 43
to switch transistor 44, such that for controlling switch
transistor 44 itself no redundance is provided between gate driver
43 and switch transistor 44. In contrast thereto, by using a dual
gate switch transistor as explained with reference to FIGS. 1-3
redundancy may be provided.
[0048] Therefore, in embodiments instead of components 42, 43 and
44 illustrated in FIG. 4 a dual gate transistor with corresponding
control circuitry as explained with reference to FIG. 1 or 2 may be
provided to selectively couple load 45 to a negative supply voltage
or a reference potential like ground. In addition to components 42,
43 and 44 implementing a low side switch, the device of FIG. 4
comprises further components 40, 41 and 46. These components will
be described next and may also be used in embodiments using a dual
gate switch. For example, in embodiments as explained above
components 42, 43 and 44 may be replaced by the switch device of
FIG. 1 or 2, while the remaining components of FIG. 4 remain. In
other embodiments, some or all of the remaining components of FIG.
4 may be omitted. It should be noted that in other embodiments the
order of transistor 44 and load 45 or transistor 41 and load 45 may
also be reversed. In some embodiments, this may make a circuit
layout easier.
[0049] In particular, the device of FIG. 4 comprises a transistor
41 acting as high side switch driven by a gate driver 40. Gate
driver 40 is controlled by a further enable signal ENABLE2. Using
both transistors 41 and 44 may help in dealing with short circuits
over load 45. In the device of FIG. 4, only when both enable
signals ENABLE1 and ENABLE2 indicate an enabling of the respective
switch, current may flow via load 45.
[0050] Furthermore, and independently therefrom, the device of FIG.
4 comprises a feedback monitor 46 which may for example measure a
current flow via load 45 and may open transistor 41 and/or
transistor 44 (for example via enable signals ENABLE2, ENABLE1,
respectively) for example in case an overcurrent, overvoltage or
other undesired potential error state is detected.
[0051] Next, for further illustration with reference to FIGS. 5-7
example implementations of dual gate transistors which are usable
as dual gate transistors 12, 25 of FIGS. 1 and 2, respectively will
be discussed. These dual gate transistors are merely implementation
examples, and other dual gate transistors may also be used.
[0052] FIG. 5A illustrates a cross-sectional view of a dual gate
transistor according to an embodiment, and FIG. 5B illustrates a
horizontal cut through the structure of FIG. 5B close to the
silicon surface, as indicated by reference points I and I' visible
in both Figures. In the dual gate transistor of FIGS. 5A and 5B, a
source down configuration may be used where a deep metal contact on
the source side feeds in current from a backside of the
semiconductor body to two serial ordered gate trenches in a common
bulk region. Both channel regions are connected to each other with
an additional deep n+/metal contal plug. A high voltage drift zone
is realized with separate field plate trenches compensating drift
zone doping. A shallower drain contact metal plug is collecting the
current and conducts it towards a front side of the semiconductor
body.
[0053] FIGS. 5A and 5B show a dual gate transistor. The terms
"lateral" and "horizontal" as used for describing dual gate
transistor structures intend to describe an orientation parallel to
a first surface of a semiconductor substrate or semiconductor body.
This can be for instance the surface of a wafer or a die.
[0054] The term "vertical" intends to describe an orientation which
is arranged perpendicular to the first surface of the semiconductor
substrate or semiconductor body.
[0055] The terms "wafer", "substrate", "semiconductor substrate" or
"semiconductor body" used in the following may include any
semiconductor-based structure that has a semiconductor surface.
Wafer and structure are to be understood to include silicon,
silicon-on-insulator (SOI), silicon-on sapphire (SOS), doped and
undoped semiconductors, epitaxial layers of silicon supported by a
base semiconductor foundation, and other semiconductor structures.
The semiconductor need not be silicon-based. The semiconductor
could as well be silicon-germanium, germanium, or gallium arsenide.
According to other embodiments, silicon carbide (SiC) or gallium
nitride (GaN) may form the semiconductor substrate material.
[0056] The transistor of FIGS. 5A and 5B comprises a source region
201 and a drain region 205. The transistor further comprises a
first gate electrode 210 and a second gate electrode 213. The first
gate electrode 210 is disconnected from the second gate electrode
213, i.e. the first gate electrode and the second gate electrode
are separated from each other and are not connected to a common
terminal. The transistor 200 further comprises a body region 220.
The first gate electrode 210 is disposed adjacent to a first
portion 221 of the body region 220 and the second gate electrode
213 is adjacent to a second portion 222 of the body region 220.
[0057] The transistor further comprises first trenches 212, the
first trenches patterning the first portion 221 of the body region
220 into a first ridge. The transistor further comprises second
trenches 215, the second trenches 215 patterning the second portion
222 of the body region 220 into a second ridge. The first gate
electrode 210 is arranged in at least one of the first trenches 212
and the second gate electrode 213 is arranged in at least one of
the second trenches 215. The first and the second trenches 212, 215
are indicated by broken lines in FIG. 5A. In more detail, they are
disposed before and behind the depicted plane of the drawing. The
first trenches 212 and the second trenches 215 pattern the first
portion 221 of the body region into first ridges and pattern the
second portions 222 of the body region 220 into second ridges.
[0058] Elements of field effect transistors are described herein.
Generally, a field effect transistor comprises a plurality of
transistor cells that are connected in parallel. For example, as
will be discussed in the present specification, each single
transistor cell comprises a first gate electrode, a second gate
electrode, a body region and further components. The first gate
electrodes of the single transistor cells may be connected to a
common terminal, e.g. a first gate terminal. The second gate
electrodes of the single transistor cells may be connected to a
common terminal, e.g. a second gate terminal. Further components of
the single transistor cells, e.g. source regions, drain regions may
be respectively connected to a common source terminal, a common
drain terminal etc. The following description specifically
describes the structure of the single transistor cells while
generally referring to a transistor. However, as is to be clearly
understood the single transistor cells are connected with a
plurality of further transistor cells so as to form the respective
transistor. Some of the components of the transistor cells such as
the body regions may be formed separately from each other. Other
components of the transistor cells such as the drain regions may be
formed jointly for all of the transistor cells connected in
parallel.
[0059] The source region 201 and the drain region 205 may be of the
first conductivity type, e.g. n-type, and the body region 220 may
be of the second conductivity type, e.g. p-type.
[0060] The source region 201 is disposed adjacent to a first main
surface of a semiconductor substrate 100. For example, the source
region 201 may extend into the semiconductor substrate 100, for
example to a bottom side of the first trench 212. The source region
201 may be electrically connected to a source terminal 204 via a
source contact 202. According to an embodiment, the source contact
202 may be electrically connected to the first portion 221 of the
body region 220 and to the body region 220 by means of a horizontal
body contact portion 226. The horizontal body contact portion 226
may be disposed at a bottom side of the source contact 202.
[0061] The source region 201 and the drain region 205 are disposed
along a first direction, e.g. the x-direction parallel to a
horizontal surface of the semiconductor substrate 100. The first
and second trenches 212, 215 may have a longitudinal axis that
extends in the first direction.
[0062] The semiconductor device may further comprise a connection
portion 216 that electrically connects the first portion 221 of the
body region with the second portion 222 of the body region. For
example, as is illustrated in FIG. 1A, the connection portion may
be implemented by a connection groove having sidewalls which are
doped with dopants of the first conductivity type to form a doped
region 218 and may be filled with a conductive filling 217.
[0063] The first gate electrode 210 may be insulated from the first
portion 221 of the body region by means of a first gate dielectric
layer 211. Further, the second gate electrode 213 may be
electrically insulated from the second portion 222 of the body
region by means of a second gate dielectric layer 214. The first
gate electrode 210 may be connected to a first gate terminal 231,
and the second gate electrode 213 may be electrically connected to
a second gate terminal 232.According to an interpretation, the
second gate electrode 213 and the adjacent second portion 222 of
the body region may be understood to implement a drift region which
is controlled by a second gate electrode 213.
[0064] The transistor of FIGS. 5A and 5B further comprises a drift
zone 260 disposed between the second portion 222 of the body region
220 and the drain region 205. For example, the drift zone 260 may
be of the first conductivity type, e.g. at a lower doping
concentration than the source region 201 or the drain region 205.
Due to the presence of the drift zone 260 even at high voltages
between source region and drain region a breakdown may be
prevented.
[0065] FIG. 5A shows a horizontal cross-sectional view. As is
shown, the drift zone 260 is disposed as a region extending along
the second direction, e.g. the y direction. The drift zone 260 is
disposed between the body region 220 and the drain region 205.
[0066] According to the embodiment illustrated in FIGS. 5A and 5B,
the semiconductor substrate 100 may comprise a base layer which may
be of the second conductivity type, e.g. p-type. A second
semiconductor layer 150 of the first conductivity type, e.g. n-type
may be formed over the base layer. A buried layer of the first
conductivity type which is doped at a higher doping concentration
than the second semiconductor layer 150 may be disposed between the
base layer and the second semiconductor layer 150. A doped layer
160 which may e.g. be of the second conductivity type is formed
over the second semiconductor layer 150. The buried layer provides
an electrical insulation of the components of the transistor 200
from the base layer. The body region 220 may be defined by the
doped layer 160.
[0067] According to any embodiments, the doping concentration in
the various semiconductor layers may have a gradient. For example,
the doping concentration may vary at different portions depending
on the requirements of the semiconductor device.
[0068] The transistor according to the embodiment shown in FIGS. 5A
and 5B furthermore comprises a field plate 250 which may be
disposed adjacent to the drift zone 260. The field plate 250 may be
insulated from the drift zone 260 by means of a field dielectric
layer 251. The field plate 250 may be connected to a suitable
terminal. For example, as is illustrated in FIG. 5A, the field
plate 250 may be electrically connected to the source terminal 204.
When the transistor is switched off, the field plate may deplete
charge carriers from the drift zone so that the breakdown voltage
characteristics of the semiconductor device are improved. In a
semiconductor device comprising a field plate, the doping
concentration of the drift zone may be increased without
deteriorating the breakdown voltage characteristics in comparison
to a device without a field plate. For example, the doping
concentration may be increased in a portion adjacent to the field
plate. Further, a region below this portion may be doped at a lower
doping concentration in order to provide the desired breakdown
voltage characteristics. Due to the higher doping concentration of
the drift zone, the on-resistance Ron.A is further decreased
resulting in improved device characteristics.
[0069] The field plate 250 may be implemented as a planar field
plate which is disposed entirely over the semiconductor substrate
100. According to a further embodiment, the field plate 250 may be
disposed in field plate trenches 252 that pattern the drift zone
260 into a third ridge. For example, as is shown in FIG. 5A, the
field plate trenches 252 may be disposed before and behind the
depicted plane of the drawing. For example, the field plate
trenches 252 may extend to a deeper depth than the first and second
gate trenches 212, 215. Further, as is shown in FIG. 5A, the depth
t2 may larger than the depth t1 of the gate trenches. For example,
etching the gate trenches 212, 215 may be performed simultaneously
with etching the field plate trenches 252. Due to the larger width
of the field plate trenches 252 the field plate trenches may be
etched to a larger depth. For example, a bottom side of the field
plate trench 252 may be below the bottom side of the body region
220.
[0070] FIG. 5B as mentioned shows a horizontal cross-sectional view
of the transistor. As is shown, field plate trenches 252 are
disposed in the drift zone 260. For example, field plate trenches
252 may have larger width measured along the second direction than
the gate trenches 212, 215. Further, a distance between adjacent
field plate trenches 252 may be larger than a distance between
adjacent first gate trenches 212 or adjacent second gate trenches
215.
[0071] FIG. 6 essentially illustrates a cross-sectional view with
two dual gate transistors having separate drain regions (206A,
206B), but a common source terminal 61. The structure of FIG. 6 is
essentially a symmetrically mirrored version of the structure of
FIG. 5A, and corresponding elements are labelled with the same
reference numerals (with additions of A and B to distinguish
elements of the two transistors) separated by a trench material 60.
Therefore, the elements will not be described again in detail. By
providing two transistors with separate drains but common source,
for example a current sensing may be performed, usable for example
for feedback monitoring as by component 46 of FIG. 4
[0072] FIG. 7 illustrates a dual gate device according to a further
embodiment in form of a vertical dual gate device. FIG. 7 shows a
perspective sectional view of one transistor cell having a first
gate terminal G1 and a second gate terminal G2. A transistor usable
in embodiments may comprise a plurality of cells as shown in FIG. 7
connected in parallel. In FIG. 7, numeral 74 denotes a drain region
or a collector region in case the dual gate device is an IGBT, 76
denotes a source region or an emitter region in case of an IGBT, 72
denotes a drift region, 73 denotes an optional field-stop region of
a same doping type as drift region 73, a doping concentration in
region 73 being higher than in drift region 73 and lower than in
drain region 74 or lower than in the source region 76, 71 denotes a
body region and 70 denotes a contact region to the source. In the
embodiment shown in FIG. 7, a section of a second gate electrode
713 extends to a first surface 79 of a semiconductor body. By this,
the second gate electrode 713, like a first gate electrode 710, can
be contacted at the first surface 101 of the semiconductor body. In
a region where the second gate electrodes 713 extends to the
surface 79, the second gate electrode 713 is insulated from the
first gate electrode 710 by a separation layer 711. This separation
layer 711 may include the same type of material as a first gate
dielectric 75, a second gate dielectric 78 and a separation layer
712. A thickness, which defines the shortest distance between the
first gate electrode 710 and the second gate electrode 713, is
greater than a first thickness of the first gate dielectric 75 and
a second thickness of the second gate dielectric 78, for
example.
[0073] With the dual gate transistor in FIG. 7, for example gate G1
may be controlled by an enable signal (for example signal ENABLE of
FIG. 2), and gate G2 may be controlled by a pulse width modulation
signal (for example PWM of FIG. 2). The structure of FIG. 7 in
embodiments may be adapted to prevent an unintended turn on of the
transistor during a high voltage gradiant (high DV/DT) at drain or
collector terminals.
[0074] The illustrated dual gate transistors, as already mentioned,
serve only as example for possible implementation of dual gate
transistors.
[0075] FIG. 8 illustrates a flow chart illustrating a method
according to an embodiment. While the method of FIG. 8 is depicted
and will be described as a series of acts or events, the order in
which these acts or events are described is not to be construed as
limiting. For ease of reference, the method of FIG. 8 will be
described referring to the embodiments of FIGS. 1 and 2. However,
this is merely for illustration purposes, and the method of FIG. 8
may also be used independently from the embodiment of FIGS. 1 and
2.
[0076] At 80 in FIG. 8, a dual gate transistor, in particular a
dual gate power transistor is provided. For example, dual gate
transistor 12 of FIG. 1 or dual gate transistor 25 of FIG. 2 may be
provided. The dual gate transistor may be implemented as described
with reference to FIGS. 5-7, but is not limited thereto.
[0077] At 81 in FIG. 8, the method comprises coupling a first gate
of the dual gate transistor to a first control circuit. Examples
for the first control circuit are first gate driver circuit 10 of
FIG. 1 or components 20-23 of FIG. 2.
[0078] At 82, the method comprises coupling a second gate of the
dual gate transistor to a second control circuit. Examples for the
second control signal include second gate driver circuit 11 of FIG.
11 or components 28, 29 and 211 of FIG. 2.
[0079] The coupling at 81 may involve supplying a first control
signal to the first gate terminal by the first gate control
circuit. The coupling at a 82 may involve providing a second
control terminal to the second gate terminal of the dual gate
transistor by the second gate control circuit. The first and second
control signals may be, as discussed previously, for example with
respect to FIG. 3.
[0080] Optionally, additional components may be provided, for
example a discharge element like discharge element 210 of FIG. 2,
an additional switch transistor like transistor 41 of FIG. 4 or a
feedback circuit like feedback monitor 46 of FIG. 4. [0081]
According to some embodiments, the following examples are
provided:
EXAMPLE 1
[0082] A switch device, comprising:
[0083] a switch transistor having a first gate and a second gate,
wherein each gate controls part of a channel of the switch
transistor,
[0084] a first gate driver circuit coupled to the first gate,
and
[0085] a second gate driver circuit coupled to the second gate, the
second gate driver circuit being independent from the first gate
driver circuit.
EXAMPLE 2
[0086] The switch device of example 1, wherein the switch
transistor is configured such that it is an on-state only when an
active signal level is present both at the first gate and at the
second gate.
EXAMPLE 3
[0087] The switch device of example 1 or 2, wherein the first gate
driver circuit comprises a first gate driver, and wherein the
second gate driver circuit comprises a second gate driver different
from the first gate driver.
EXAMPLE 4
[0088] The switch device of any one of examples 1-3, wherein the
first gate driver circuit comprises a first power supply, and
wherein the second gate driver circuit comprises a second power
supply different from the first power supply.
EXAMPLE 5
[0089] The switch device of any one of examples 1-4, wherein the
first gate driver circuit and the second gate driver circuit are
provided on different chips.
EXAMPLE 6
[0090] The switch device of any one of examples 1-5, wherein the
first gate driver circuit and the second gate driver circuit are
provided as independent control paths.
EXAMPLE 7
[0091] The device of any one of examples 1-6, further comprising a
gate discharge component associated with at least one of the first
gate and the second gate.
EXAMPLE 8
[0092] The device of example 7, wherein the gate discharge
component is coupled between an associated one of the first and
second gates and a load terminal of the switch transistor.
EXAMPLE 9
[0093] The switch device of any one of examples 1-8, wherein the
second gate driver circuit is configured to output a signal
defining an operation window of the switch transistor, and wherein
the first gate driver circuit is configured to output a signal
controlling switching of the switch transistor.
EXAMPLE 10
[0094] The switch device of example 9, wherein the first gate
driver circuit is configured to output a pulse with modulated
signal.
EXAMPLE 11
[0095] The switch device of any one of examples 1-10, wherein the
first gate driver circuit is configured to output a signal having a
higher average toggling frequency than a signal output by the
second gate driver circuit.
EXAMPLE 12
[0096] The switch device of any one of examples 1-11, wherein the
switch device is to be coupled between a first terminal of a load
and a negative supply voltage or ground, the second terminal of the
load to be coupled with a positive supply voltage.
EXAMPLE 13
[0097] The switch device of example 12, further comprising a
further switch transistor to be coupled between the load and the
positive supply voltage.
EXAMPLE 14
[0098] A method comprising:
[0099] providing a dual gate switch transistor,
[0100] coupling a first gate driver circuit to a first gate of the
dual gate switch transistor, and
[0101] coupling a second gate driver circuit different from the
first gate driver circuit to a second gate of the dual gate switch
transistor.
EXAMPLE 15
[0102] The method of example 14, further comprising coupling a
discharge element between one of the first and second gates of the
dual gate switch transistor and a load terminal of the dual gate
switch transistor.
EXAMPLE 16
[0103] The method of example 14 or 15, further comprising supplying
a pulse width modulated signal to the first gate driver circuit,
and supplying an enable signal to the second gate driver
circuit.
EXAMPLE 17
[0104] The method of any one of examples 14-16, further comprising
providing the first gate driver circuit including a logic
circuit.
EXAMPLE 18
[0105] A method, comprising:
[0106] controlling an electronic switch by a first control
signal,
[0107] controlling the electronic switch by a second control signal
independent from the first control signal, and
[0108] combining the first and second control signals within the
electronic switch.
EXAMPLE 19
[0109] The method of claim 18,
[0110] wherein the electronic switch is a dual gate switch
transistor,
[0111] wherein controlling the electronic switch by the first
control signal comprises controlling a first gate of the dual gate
switch transistor with a pulse width modulated signal to control a
first part of a channel of the dual gate switch transistor, and
[0112] wherein controlling the electronic switch by the second
control signal comprises controlling a second gate of the dual gate
switch transistor with an enable signal defining an operation
window of the dual gate switch transistor to control a second part
of the channel of the dual gate switch transistor, such that the
combining is performed by the dual gate switch transistor.
EXAMPLE 20
[0113] The method of example 19, wherein controlling the first gate
comprises providing a pulse width modulated signal to a first gate
driver circuit, and wherein controlling the second gate comprises
providing an enable signal to a second gate driver circuit, the
second gate driver circuit being independent from the first gate
driver circuit.
EXAMPLE 21
[0114] The method of example 20, further comprising providing the
first gate driver circuit with power independent from providing the
second gate driver circuit with power.
EXAMPLE 22
[0115] The method of any one of examples 18-21, further comprising
selectively coupling a load to a supply voltage by controlling the
electronic switch.
EXAMPLE 23
[0116] The method of example 22, wherein said selectively coupling
providing comprises selectively coupling the load to one of ground
or negative supply voltage, the method further comprising
selectively coupling the load to a positive supply voltage using a
further switch transistor.
EXAMPLE 24
[0117] The method of any one of examples 18-23, further comprising
independently controlling a first gate driver coupled to the first
gate and a second gate driver coupled to the second gate.
[0118] As can be seen from the variations and modifications
described above, the discussed embodiments serve as examples only
and are not to be construed as limiting.
* * * * *