U.S. patent application number 15/694688 was filed with the patent office on 2017-12-21 for sensor device, input device, and electronic apparatus.
This patent application is currently assigned to Sony Corporation. The applicant listed for this patent is Sony Corporation. Invention is credited to Yasuyuki Abe, Hayato Hasegawa, Fumihiko Iida, Tomoko Katsuhara, Hiroto Kawaguchi, Hiroshi Mizuno, Taizo Nishimura, Shogo Shinkai, Tomoaki Suzuki, Takayuki Tanaka, Kei Tsukamoto.
Application Number | 20170364182 15/694688 |
Document ID | / |
Family ID | 51353579 |
Filed Date | 2017-12-21 |
United States Patent
Application |
20170364182 |
Kind Code |
A1 |
Kawaguchi; Hiroto ; et
al. |
December 21, 2017 |
SENSOR DEVICE, INPUT DEVICE, AND ELECTRONIC APPARATUS
Abstract
The sensor device includes a first conductive layer, a second
conductive layer, an electrode substrate, a first support, and a
second support. The first conductive layer is formed to be
deformable sheet-shaped. The second conductive layer is disposed to
be opposed to the first conductive layer. The electrode substrate
includes multiple first electrode wires and multiple second
electrode wires and is disposed to be deformable between the first
conductive layer and the second conductive layer, the multiple
second electrode wires being disposed to be opposed to the multiple
first electrode wires and intersecting with the multiple first
electrode wires. The first support includes multiple first
structures, the multiple first structures connecting the first
conductive layer and the electrode substrate. The second support
includes multiple second structures, the multiple second structures
connecting the second conductive layer and the electrode
substrate.
Inventors: |
Kawaguchi; Hiroto;
(Kanagawa, JP) ; Shinkai; Shogo; (Kanagawa,
JP) ; Tsukamoto; Kei; (Kanagawa, JP) ;
Katsuhara; Tomoko; (Kanagawa, JP) ; Hasegawa;
Hayato; (Kanagawa, JP) ; Iida; Fumihiko;
(Kanagawa, JP) ; Tanaka; Takayuki; (Kanagawa,
JP) ; Suzuki; Tomoaki; (Kanagawa, JP) ;
Nishimura; Taizo; (Kanagawa, JP) ; Mizuno;
Hiroshi; (Kanagawa, JP) ; Abe; Yasuyuki;
(Kanagawa, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Sony Corporation |
Tokyo |
|
JP |
|
|
Assignee: |
Sony Corporation
Tokyo
JP
|
Family ID: |
51353579 |
Appl. No.: |
15/694688 |
Filed: |
September 1, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14763657 |
Jul 27, 2015 |
9785297 |
|
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PCT/JP2013/007186 |
Dec 6, 2013 |
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15694688 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F 2203/04102
20130101; G06F 3/044 20130101; G06F 2203/04106 20130101; G06F
2203/04103 20130101; G06F 3/0414 20130101; G06F 3/0443 20190501;
G06F 3/047 20130101 |
International
Class: |
G06F 3/044 20060101
G06F003/044; G06F 3/041 20060101 G06F003/041; G06F 3/047 20060101
G06F003/047 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 12, 2013 |
JP |
2013-024941 |
Sep 5, 2013 |
JP |
2013-184402 |
Claims
1-12. (canceled)
13. An input device, comprising: a deformable sheet-shaped
operation member that includes a first surface and a second
surface, the first surface receiving an operation by a user, the
second surface being on the opposite side to the first surface; a
conductive layer that is disposed to be opposed to the second
surface; an electrode substrate that includes multiple first
electrode wires and multiple second electrode wires, the multiple
second electrode wires being disposed to be opposed to the multiple
first electrode wires and intersecting with the multiple first
electrode wires, the electrode substrate being disposed to be
deformable between the operation member and the conductive layer
and being capable of electrostatically detecting a change in
distance from the conductive layer; a first support that includes
multiple first structures and a first space portion, the multiple
first structures connecting the operation member and the electrode
substrate, the first space portion being formed between the
multiple first structures; and a second support that includes
multiple second structures and a second space portion, the multiple
second structures being each disposed between the first structures
adjacent to each other and connecting the conductive layer and the
electrode substrate, the second space portion being formed between
the multiple second structures.
14. (canceled)
15. The input device according to claim 13, wherein the operation
member includes a display unit.
16. The input device according to claim 13, wherein the operation
member includes multiple key regions.
17. The input device according to claim 16, wherein the electrode
substrate further includes multiple detection portions, each of the
multiple detection portions being formed in each of intersection
regions of the multiple first electrode wires and the multiple
second electrode wires and having a capacitance variable in
accordance with a relative distance from the conductive layer.
18. The input device according to claim 17, further comprising a
control unit that is electrically connected to the electrode
substrate and is capable of generating information on an input
operation with respect to each of the multiple key regions based on
outputs of the multiple detection portions.
19. The input device according to claim 16, wherein the multiple
first structures are disposed along boundaries between the multiple
key regions.
20. The input device according to claim 13, wherein the multiple
first electrode wires are flat-plate-shaped electrodes and are
disposed on the operation member side relative to the multiple
second electrode wires, and each of the multiple second electrode
wires includes multiple electrode groups.
21-22. (canceled)
23. An electronic apparatus, comprising: a deformable sheet-shaped
operation member that includes a first surface and a second
surface, the first surface receiving an operation by a user, the
second surface being on the opposite side to the first surface; a
conductive layer that is disposed to be opposed to the second
surface; an electrode substrate that includes multiple first
electrode wires and multiple second electrode wires, the multiple
second electrode wires being disposed to be opposed to the multiple
first electrode wires and intersecting with the multiple first
electrode wires, the electrode substrate being disposed to be
deformable between the operation member and the conductive layer
and being capable of electrostatically detecting a change in
distance from the conductive layer; a first support that includes
multiple first structures and a first space portion, the multiple
first structures connecting the operation member and the electrode
substrate, the first space portion being formed between the
multiple first structures; a second support that includes multiple
second structures and a second space portion, the multiple second
structures being each disposed between the first structures
adjacent to each other and connecting the conductive layer and the
electrode substrate, the second space portion being formed between
the multiple second structures; and a controller including a
control unit that is electrically connected to the electrode
substrate and is capable of generating information on an input
operation with respect to each of the multiple operation members
based on an output of the electrode substrate.
24. The electronic apparatus according to claim 23, wherein the
operation member includes a display unit.
25. The electronic apparatus according to claim 23, wherein the
operation member includes multiple key regions.
26. The electronic apparatus according to claim 25, wherein the
electrode substrate further includes multiple detection portions,
each of the multiple detection portions being formed in each of
intersection regions of the multiple first electrode wires and the
multiple second electrode wires and having a capacitance variable
in accordance with a relative distance from the conductive
layer.
27. The electronic apparatus according to claim 26, further
comprising a control unit that is electrically connected to the
electrode substrate and is capable of generating information on an
input operation with respect to each of the multiple key regions
based on outputs of the multiple detection portions.
28. The input device according to claim 25, wherein the multiple
first structures are disposed along boundaries between the multiple
key regions.
29. The input device according to claim 23, wherein the multiple
first electrode wires are flat-plate-shaped electrodes and are
disposed on the operation member side relative to the multiple
second electrode wires, and each of the multiple second electrode
wires includes multiple electrode groups.
Description
TECHNICAL FIELD
[0001] The present technology relates to a sensor device, an input
device, and an electronic apparatus that are capable of
electrostatically detecting an input operation.
BACKGROUND ART
[0002] As a sensor device for an electronic apparatus, for example,
there is known a configuration including a capacitive element and
being capable of detecting an operation position and a pressing
force of an operating element with respect to an input operation
surface (see, for example, Patent Document 1).
[0003] Patent Document 1: Japanese Patent Application Laid-open No.
2011-170659
SUMMARY OF INVENTION
Problem to be solved by the Invention
[0004] In recent years, an input method with a high degree of
freedom has been performed by a gesture operation using the
movement of fingers. Moreover, if a pressing force on an operation
surface can be stably detected with high accuracy, a greater
diversity of input operations are expected to be achieved.
[0005] In view of the circumstances as described above, it is an
object of the present technology to provide a sensor device, an
input device, and an electronic apparatus that are capable of
highly accurately detecting an operation position and a pressing
force.
Means for Solving the Problem
[0006] In order to achieve the object described above, according to
an embodiment of the present technology, there is provided a sensor
device including a first conductive layer, a second conductive
layer, an electrode substrate, a first support, and a second
support.
[0007] The first conductive layer is formed to be deformable
sheet-shaped.
[0008] The second conductive layer is disposed to be opposed to the
first conductive layer.
[0009] The electrode substrate includes multiple first electrode
wires and multiple second electrode wires, the multiple second
electrode wires being disposed to be opposed to the multiple first
electrode wires and intersecting with the multiple first electrode
wires, the electrode substrate being disposed to be deformable
between the first conductive layer and the second conductive layer
and being capable of electrostatically detecting a change in
distance from each of the first conductive layer and the second
conductive layer.
[0010] The first support includes multiple first structures and a
first space portion, the multiple first structures connecting the
first conductive layer and the electrode substrate, the first space
portion being formed between the multiple first structures.
[0011] The second support includes multiple second structures and a
second space portion, the multiple second structures being each
disposed between the first structures adjacent to each other and
connecting the second conductive layer and the electrode substrate,
the second space portion being formed between the multiple second
structures.
[0012] According to the sensor device, a relative distance between
each of the first and second conductive layers and the electrode
substrate changes when the sensor device is pressed from above the
first conductive layer. Based on the change in distance, an input
operation such as a press can be electrostatically detected.
Therefore, the amount of capacitance change with respect to the
input operation can be increased, and detection sensitivity can be
enhanced. This makes it possible to detect not only a conscious
pressing operation but also a minute pressing force when a contact
operation is made, and thus the sensor device can also be used as a
touch sensor.
[0013] Further, since the sensor device does not have a
configuration in which an operating element and each electrode wire
of the electrode substrate is directly capacitively coupled, but
performs an input operation via the first conductive layer, even in
the case of using a gloved finger or an operating element such as a
fine-tipped stylus, the input operation can be detected with high
accuracy.
[0014] The electrode substrate may further include multiple
detection portions, each of the multiple detection portions being
formed in each of intersection regions of the multiple first
electrode wires and the multiple second electrode wires and having
a capacitance variable in accordance with a relative distance from
each of the first conductive layer and the second conductive
layer.
[0015] This allows a detection of an input operation in a so-called
mutual capacitance system in which detection is performed based on
the amount of capacitance change between the first and second
electrode wires. Therefore, simultaneous detection at two or more
positions in a multi-touch operation is easy to perform.
[0016] The multiple detection portions may be formed to be opposed
to the multiple first structures.
[0017] With this, in the case where the first structure is
displaced to the second conductive layer side by an input operation
from above the first conductive layer, the detection portion
opposed to this first structure is also displaced to the second
conductive layer side accordingly. Therefore, a relative distance
between the detection portion and the second conductive layer can
be easily changed, and detection sensitivity can be improved.
[0018] Alternatively, the multiple detection portions may be formed
to be opposed to the multiple second structures.
[0019] Due to the configuration described above, the second
structure and the detection portion are each opposed to the first
space portion. This allows a relative distance between the first
conductive layer and the detection portion to be easily changed via
the first space portion, and detection sensitivity can be
improved.
[0020] The first support may include a first frame, the first frame
connecting the first conductive layer and the electrode substrate
and being disposed along a circumferential edge of the electrode
substrate, and the second support may include a second frame, the
second frame connecting the second conductive layer and the
electrode substrate and being disposed to be opposed to the first
frame.
[0021] The first and second frames reinforce the circumferential
portion of the entire sensor device, so that the strength of the
sensor device is improved and handling performance can be
enhanced.
[0022] Further, the second conductive layer may include a step
portion.
[0023] This can enhance the rigidity of the second conductive layer
and the strength of the entire sensor device.
[0024] Further, in the sensor device according to one embodiment of
the present technology, the second structure is not limited to be
disposed between the first structures adjacent to each other. For
example, the first structures and the second structures may be
disposed to be opposed to each other.
[0025] With this, a region in which the first structures and the
second structures are disposed to be opposed to (overlap) each
other is difficult to deform, and thus is a region having low
detection sensitivity. This allows detection sensitivity in the
sensor device to be controlled and the degree of freedom of the
device configuration to be enhanced.
[0026] Moreover, the electrode substrate is not limited to a
configuration to electrostatically detect a change in distance from
each of the first conductive layer and the second conductive layer.
For example, a change in distance from each of the operating
element made of a conductor and the second conductive layer may be
electrostatically detected.
[0027] Further, the first support is not limited to a configuration
including the first space portion. Gaps between the multiple first
structures may be filled with an elastic material or the like.
[0028] Alternatively, the second support is not limited to a
configuration including the second space portion. Gaps between the
multiple second structures may be filled with an elastic material
or the like.
[0029] Further, each of the multiple first electrode wires may
include multiple first unit electrode bodies, the multiple first
unit electrode bodies each including multiple first sub-electrodes,
each of the multiple second electrode wires may include multiple
second unit electrode bodies, the multiple second unit electrode
bodies each including multiple second sub-electrodes and being
opposed to the multiple first unit electrode bodies, and the
electrode substrate may include a base material, the multiple first
electrode wires and the multiple second electrode wires being
disposed on the base material, and multiple detection portions in
which the multiple first sub-electrodes of each of the first unit
electrode bodies and the multiple second sub-electrodes of each of
the second unit electrode bodies are opposed to each other in an
in-plane direction of the electrode substrate.
[0030] With this, the first electrode wires and the second
electrode wires are opposed to each other in the in-plane direction
of the electrode substrate, to be capacitively coupled. This makes
it possible to make the electrode substrate thinner and achieve
downsizing of the entire sensor device. Moreover, since the
multiple first and second sub-electrodes form the detection
portions, the amounts of capacitive coupling of the detection
portions can be enhanced, and detection sensitivity as a sensor
device can be enhanced.
[0031] According to an embodiment of the present technology, there
is provided an input device including an operation member, a first
conductive layer (conductive layer), an electrode substrate, a
first support, and a second support.
[0032] The operation member is deformable sheet-shaped and includes
a first surface and a second surface, the first surface receiving
an operation by a user, the second surface being on the opposite
side to the first surface.
[0033] The first conductive layer is disposed to be opposed to the
second surface.
[0034] The electrode substrate includes multiple first electrode
wires and multiple second electrode wires, the multiple second
electrode wires being disposed to be opposed to the multiple first
electrode wires and intersecting with the multiple first electrode
wires, the electrode substrate being disposed to be deformable
between the operation member and the conductive layer and being
capable of electrostatically detecting a change in distance from
the first conductive layer.
[0035] The first support includes multiple first structures and a
first space portion, the multiple first structures connecting the
operation member and the electrode substrate, the first space
portion being formed between the multiple first structures.
[0036] The second support includes multiple second structures and a
second space portion, the multiple second structures being each
disposed between the first structures adjacent to each other and
connecting the conductive layer and the electrode substrate, the
second space portion being formed between the multiple second
structures.
[0037] According to the input device, a relative distance between
each of the operation member and the conductive layer and the
electrode substrate changes when the input device is pressed from
above the operation member. Based on the change in distance, an
input operation such as a press can be electrostatically detected.
Therefore, the amount of capacitance change based on the input
operation can be increased, and detection sensitivity can be
enhanced. This allows the input device to detect not only a
conscious pressing operation but also a minute pressing force when
a contact operation is made, and thus to be used as an input device
including a touch sensor.
[0038] The operation member may further include a second conductive
layer that is formed on the second surface.
[0039] The detection substrate may be capable of electrostatically
detecting a change in distance from each of the first conductive
layer and the second conductive layer.
[0040] This allows an input operation to be performed via a metal
film, not by a configuration in which an operating element and each
electrode wire of the electrode substrate is directly capacitively
coupled, and thus even in the case of using a gloved finger or an
operating element such as a fine-tipped stylus, an input operation
can be detected with high accuracy.
[0041] Moreover, the operation member may include a display
unit.
[0042] As described above, the input device does not have a
configuration in which the operating element and each electrode
wire of the electrode substrate are directly capacitively coupled,
and thus even in the case where a display unit including a
conductive material is disposed between the electrode substrate and
the operating element, an input operation can be detected with high
accuracy. In other words, a configuration in which a sensor device
is disposed on the back surface of the display unit can be
provided, and deterioration in display quality of the display unit
can be suppressed.
[0043] The operation member may include multiple key regions.
[0044] This allows the input device to be applied as a keyboard
device.
[0045] Further, the electrode substrate may further include
multiple detection portions, each of the multiple detection
portions being formed in each of intersection regions of the
multiple first electrode wires and the multiple second electrode
wires and having a capacitance variable in accordance with a
relative distance from the conductive layer.
[0046] Moreover, the input device may further include a control
unit that is electrically connected to the electrode substrate and
is capable of generating information on an input operation with
respect to each of the multiple key regions based on outputs of the
multiple detection portions.
[0047] This allows the input device to perform, by the control
unit, control corresponding to a key region on which an input
operation is made.
[0048] The multiple first structures may be disposed along
boundaries between the multiple key regions.
[0049] This can provide a configuration in which the key regions
are opposed to the first space portion. Therefore, the input
operation in the key region can easily change a distance between
the operation member and the electrode substrate, and detection
sensitivity of the input operation can be enhanced.
[0050] Further, the multiple first electrode wires may be
flat-plate-shaped electrodes and may be disposed on the operation
member side relative to the multiple second electrode wires, and
each of the multiple second electrode wires may include multiple
electrode groups.
[0051] With this, the first electrode wires are connected to the
ground to function as an electromagnetic shield. Therefore, without
a configuration of a metal film or the like formed on the operation
member, it is possible to suppress intrusion of electromagnetic
waves from the outside of the electrode substrate, for example, and
to enhance the reliability of detection sensitivity.
[0052] Further, in the input device according to one embodiment of
the present technology, the second structure is not limited to be
disposed between the first structures adjacent to each other. For
example, the first structures and the second structures may be
disposed to be opposed to each other in the thickness direction of
the input device.
[0053] Moreover, the electrode substrate is not limited to a
configuration to electrostatically detect a change in distance from
each of the first conductive layer and the second conductive layer.
For example, a change in distance from each of the operating
element made of a conductor and the second conductive layer may be
electrostatically detected.
[0054] Further, the first support is not limited to a configuration
including the first space portion. Gaps between the multiple first
structures may be filled with an elastic material or the like.
Alternatively, the second support is not limited to a configuration
including the second space portion. Gaps between the multiple
second structures may be filled with an elastic material or the
like.
[0055] According to an embodiment of the present technology, there
is provided an input device including an operation member, a back
plate, an electrode substrate, a first support, and a second
support.
[0056] The operation member is deformable sheet-shaped and includes
a first surface, a second surface, and a conductive layer, the
first surface receiving an operation by a user, the second surface
being on the opposite side to the first surface, the conductive
layer being formed on the second surface.
[0057] The back plate is disposed to be opposed to the second
surface.
[0058] The electrode substrate includes multiple first electrode
wires and multiple second electrode wires and is disposed to be
deformable between the operation member and the back plate, the
multiple second electrode wires being disposed to be opposed to the
multiple first electrode wires and intersecting with the multiple
first electrode wires.
[0059] The first support includes multiple first structures, the
multiple first structures connecting the operation member and the
electrode substrate.
[0060] The second support includes multiple second structures, the
multiple second structures connecting the back plate and the
electrode substrate.
[0061] Further, the multiple second electrode wires may be
flat-plate-shaped electrodes and may be disposed on the back plate
side relative to the multiple first electrode wires, and each of
the multiple first electrode wires may include multiple electrode
groups.
[0062] With this, the second electrode wires are connected to the
ground to function as an electromagnetic shield. Therefore, if the
back plate is not a conductor, it is possible to suppress intrusion
of electromagnetic waves from the outside of the electrode
substrate, for example, and to enhance the reliability of detection
sensitivity.
[0063] According to an embodiment of the present technology, there
is provided an electronic apparatus including an operation member,
a conductive layer, an electrode substrate, a first support, a
second support, and a controller.
[0064] The operation member is deformable sheet-shaped and includes
a first surface and a second surface, the first surface receiving
an operation by a user, the second surface being on the opposite
side to the first surface.
[0065] The conductive layer is disposed to be opposed to the second
surface.
[0066] The electrode substrate includes multiple first electrode
wires and multiple second electrode wires, the multiple second
electrode wires being disposed to be opposed to the multiple first
electrode wires and intersecting with the multiple first electrode
wires, the electrode substrate being disposed to be deformable
between the operation member and the conductive layer and being
capable of electrostatically detecting a change in distance from
the conductive layer.
[0067] The first support includes multiple first structures and a
first space portion, the multiple first structures connecting the
operation member and the electrode substrate, the first space
portion being formed between the multiple first structures.
[0068] The second support includes multiple second structures and a
second space portion, the multiple second structures being each
disposed between the first structures adjacent to each other and
connecting the conductive layer and the electrode substrate, the
second space portion being formed between the multiple second
structures.
[0069] The controller includes a control unit that is electrically
connected to the electrode substrate and is capable of generating
information on an input operation with respect to each of the
multiple operation members based on an output of the electrode
substrate.
Effect of the Invention
[0070] As described above, according to the present technology, it
is possible to highly accurately detect an operation position and a
pressing force.
BRIEF DESCRIPTION OF DRAWINGS
[0071] [FIG. 1] A schematic cross-sectional view of an input device
according to a first embodiment of the present technology.
[0072] [FIG. 2] An exploded perspective view of the input
device.
[0073] [FIG. 3] A schematic cross-sectional view of a main part of
the input device.
[0074] [FIG. 4] A block diagram of an electronic apparatus using
the input device.
[0075] [FIG. 5] A schematic cross-sectional view showing
configuration examples of a conductive layer of the input
device.
[0076] [FIG. 6] A schematic view for describing a method of
connecting a metal film of the input device and the conductive
layer to a ground potential.
[0077] [FIG. 7] A schematic view for describing a method of
connecting a metal film according to a modified example and the
conductive layer to a ground potential.
[0078] [FIG. 8] A schematic cross-sectional view for describing a
configuration of a detection portion of the input device.
[0079] [FIG. 9] A schematic cross-sectional view showing examples
of a method of forming a first support of the input device.
[0080] [FIG. 10] A schematic cross-sectional view showing an
example of a method of forming a second support of the input
device.
[0081] [FIG. 11] A schematic cross-sectional view showing a
modified example of a method of forming the first or second
support.
[0082] [FIG. 12] A schematic plan view showing arrangement examples
of first and second structures and first and second electrode wires
of the input device.
[0083] [FIG. 13] A schematic plan view showing arrangement examples
of openings of the conductive layer, the first and second
structures, the first and second electrode wires.
[0084] [FIG. 14] A schematic cross-sectional view showing a state
of a force applied to the first and second structures when a point
on the first surface of the input device is pressed downward in a
Z-axis direction with an operating element.
[0085] [FIG. 15] A schematic cross-sectional view of a main part,
showing an aspect of the input device when a point of the first
surface above the first structure receives an operation by an
operating element and showing an example of output signals output
from the detection portions at that time.
[0086] [FIG. 16] A schematic cross-sectional view of a main part,
showing an aspect of the input device when the first surface
receives an operation by the operating element and showing an
example of output signals output from the detection portions at
that time, in which A shows a case where the operating element is a
stylus, and B shows a case where the operating element is a
finger.
[0087] [FIG. 17] A schematic cross-sectional view showing an
example of mounting the input device to an electronic
apparatus.
[0088] [FIG. 18] A schematic cross-sectional view showing a
configuration of a modified example 1 of the input device shown in
FIG. 1, in which an adhesion layer is partially formed.
[0089] [FIG. 19] A view schematically showing a state where a
flexible display (display unit) shown in FIG. 18 is attached to the
entire surface of a metal film shown in the figure, the entire
surface including the outer circumferential portion.
[0090] [FIG. 20] A schematic cross-sectional view showing another
configuration of a modified example 1 of the input device shown in
FIG. 1, showing an example in which an adhesion layer is formed in
a predetermined plane pattern.
[0091] [FIG. 21] A schematic view showing examples of the plane
pattern of the adhesion layer shown in FIG. 20.
[0092] [FIG. 22] A schematic plan view showing a configuration
example of the first and second electrode wires according to a
modified example 2 of the input device shown in FIG. 1, in which A
shows the first electrode wires, and B shows the second electrode
wires.
[0093] [FIG. 23] A schematic view showing shape examples of unit
electrode bodies of the first and second electrode wires shown in
FIG. 22.
[0094] [FIG. 24] A schematic plan view showing arrangement examples
of the first and second structures and the first and second
electrode wires according to a modified example 3 of the input
device shown in FIG. 1.
[0095] [FIG. 25] A schematic cross-sectional view of a main part,
showing an aspect of the input device when the first surface of the
input device of FIG. 24 receives an operation by the operating
element.
[0096] [FIG. 26] A schematic cross-sectional view showing a
configuration of a modified example 4 of the input device shown in
FIG. 1.
[0097] [FIG. 27] A schematic cross-sectional view of a main part,
showing a configuration example 2 of a modified example 5 of the
input device shown in FIG. 1.
[0098] [FIG. 28] A schematic cross-sectional view of a main part,
showing a configuration example 3 of the modified example 5 of the
input device shown in FIG. 1.
[0099] [FIG. 29] A schematic cross-sectional view of a main part,
showing a configuration example 4 of the modified example 5 of the
input device shown in FIG. 1.
[0100] [FIG. 30] A schematic cross-sectional view of a main part,
showing a configuration example 5 of the modified example 5 of the
input device shown in FIG. 1.
[0101] [FIG. 31] A schematic cross-sectional view of an input
device according to a second embodiment of the present
technology.
[0102] [FIG. 32] A schematic cross-sectional view showing a
configuration example of an operation member of the input
device.
[0103] [FIG. 33] An enlarged cross-sectional view showing a
configuration of a modified example of the input device shown in
FIG. 31.
[0104] [FIG. 34] A plan view showing an arrangement example of
first and second structures of the input device shown in FIG. 33,
in which A shows the first structures and B shows the second
structures.
[0105] [FIG. 35] A plan view showing a configuration example of
multiple first and second electrode wires of the input device shown
in FIG. 33, in which A shows the first electrode wires and B shows
the second electrode wires.
[0106] [FIG. 36] An enlarged plan view showing an arrangement
example of first and second structures shown in FIG. 34.
[0107] [FIG. 37] A schematic cross-sectional view of an electronic
apparatus in which an input device according to a third embodiment
of the present technology is incorporated.
[0108] [FIG. 38] A view showing a configuration of an input device
according to a fourth embodiment of the present technology, in
which A is a schematic cross-sectional view and B is an enlarged
cross-sectional view showing the main part of A.
[0109] [FIG. 39] A schematic plan view showing a configuration
example of first and second electrode wires of the input device
shown in FIG. 38, in which A shows the first electrode wires and B
shows the second electrode wires.
[0110] [FIG. 40] A is a plan view showing an array of the first and
second electrode wires of the input device shown in FIG. 38, and B
is a cross-sectional view when viewed from the A-A direction of
A.
[0111] [FIG. 41] A schematic cross-sectional view for describing a
configuration of detection portions shown in FIG. 38.
[0112] [FIG. 42] A schematic cross-sectional view of an input
device according to a configuration example of a fifth embodiment
of the present technology.
[0113] [FIG. 43] A schematic plan view showing an arrangement
example of first and second structures and first and second
electrode wires of the input device shown in FIG. 42.
[0114] [FIG. 44] A schematic cross-sectional view of an input
device according to another configuration example of the fifth
embodiment of the present technology.
[0115] [FIG. 45] A schematic plan view showing an arrangement
example of first and second structures and first and second
electrode wires of the input device shown in FIG. 44.
[0116] [FIG. 46] A schematic plan view showing a configuration
example of the first and second electrode wires according to a
modified example of the input device shown in FIG. 42, in which A
shows the first electrode wires and B shows the second electrode
wires.
[0117] [FIG. 47] A schematic plan view showing a configuration
example of first and second electrode wires according to a modified
example of the input device shown in FIG. 44, in which A shows the
first electrode wires and B shows the second electrode wires.
[0118] [FIG. 48] A view showing a configuration of an input device
according to a modified example of a sixth embodiment of the
present technology, in which A is a perspective view and B is a
cross-sectional view when viewed from the B-B direction of A.
[0119] [FIG. 49] A perspective view showing a configuration of a
modified example of the input device shown in FIG. 48.
MODE(S) FOR CARRYING OUT THE INVENTION
[0120] Hereinafter, embodiments of the present technology will be
described with reference to the drawings.
First Embodiment
[0121] FIG. 1 is a schematic cross-sectional view of an input
device 100 according to a first embodiment of the present
technology. FIG. 2 is an exploded perspective view of the input
device 100. FIG. 3 is a schematic cross-sectional view of a main
part of the input device 100. FIG. 4 is a block diagram of an
electronic apparatus 70 using the input device 100. Hereinafter, a
configuration of the input device 100 of this embodiment will be
described. It should be noted that in the figures, an X axis and a
Y axis represent directions orthogonal to each other (in-plane
direction of the input device 100), and a Z axis represents a
direction orthogonal to the X axis and the Y axis (thickness
direction or vertical direction of the input device 100).
[0122] [Input Device]
[0123] The input device 100 includes a flexible display (display
unit) 11 that receives an operation by a user and a sensor device 1
that detects the operation of the user. The input device 100 is
formed as a flexible touch panel display, for example, and is
incorporated into an electronic apparatus 70 that will be described
later. The sensor device 1 and the flexible display 11 each have a
flat-plate shape that extends in a direction perpendicular to the Z
axis.
[0124] The flexible display 11 includes a first surface 110 and a
second surface 120 on the opposite side to the first surface 110.
The flexible display 11 has a function as an input operation unit
and a function as a display unit in the input device 100. In other
words, the flexible display 11 causes the first surface 110 to
function as an input operation surface and a display surface and
displays an image corresponding to an operation by the user from
the first surface 110 upward in a Z-axis direction. On the first
surface 110, an image corresponding to a keyboard, a GUI (Graphical
User Interface), and the like are displayed. Examples of an
operating element that performs an operation with respect to the
flexible display 11 include a finger f shown in FIG. 16B and a
stylus s shown in FIG. 16A.
[0125] A specific configuration of the flexible display 11 is not
particularly limited. For example, as the flexible display 11, a
so-called electronic paper, an organic EL (electroluminescence)
panel, an inorganic EL panel, a liquid crystal panel, or the like
can be adopted. Additionally, the thickness of the flexible display
11 is also not particularly limited, and is approximately 0.1 mm to
1 mm, for example.
[0126] The sensor device 1 includes a metal film (first conductive
layer or second conductive layer) 12, a conductive layer (second
conductive layer or first conductive layer) 50, an electrode
substrate 20, a first support 30, and a second support 40. The
sensor device 1 is disposed on the second surface 120 side of the
flexible display 11.
[0127] The metal film 12 is formed to have a deformable sheet
shape. The conductive layer 50 is disposed to be opposed to the
metal film 12. The electrode substrate 20 includes multiple first
electrode wires 210 and multiple second electrode wires 220. The
multiple second electrode wires 220 are disposed to be opposed to
the multiple first electrode wires 210 and intersect with the
multiple first electrode wires 210. The electrode substrate 20 is
disposed to be deformable between the metal film 12 and the
conductive layer 50 and is capable of electrostatically detecting a
change in distance from each of the metal film 12 and the
conductive layer 50. The first support 30 includes multiple first
structures 310 and a first space portion 330. The multiple first
structures 310 connect the metal film 12 and the electrode
substrate 20. The first space portion 330 is formed between the
multiple first structures 310. The second support 40 includes
multiple second structures 410 and a second space portion 430. The
multiple second structures 410 are disposed between the multiple
first structures 310 adjacent to each other and connect the
conductive layer 50 and the electrode substrate 20. The second
space portion 430 is formed between the multiple second structures
410.
[0128] The sensor device 1 (input device 100) according to this
embodiment electrostatically detects changes in distance between
the metal film 12 and the electrode substrate 20 and between the
conductive layer 50 and the electrode substrate 20 due to an input
operation on the first surface 110 of the flexible display 11, to
detect the input operation. The input operation is not limited to a
conscious press (push) operation on the first surface 110 and may
be a contact (touch) operation thereon. In other words, as will be
described later, the input device 100 is capable of detecting even
a minute pressing force (for example, approximately several 10 g)
that is applied by a general touch operation, and is thus
configured so as to enable a touch operation similar to that of a
normal touch sensor.
[0129] The input device 100 includes a control unit 60. The control
unit 60 includes an arithmetic unit 61 and a signal generation unit
62. The arithmetic unit 61 detects an operation by a user based on
a capacitance change of a detection portion 20s. The signal
generation unit 62 generates an operation signal based on a result
of the detection by the arithmetic unit 61.
[0130] The electronic apparatus 70 shown in FIG. 4 includes a
controller 710. The controller 710 performs processing based on the
operation signal generated by the signal generation unit 62 of the
input device 100. The operation signal processed by the controller
710 is output, as an image signal, for example, to the flexible
display 11. The flexible display 11 is connected to a drive circuit
via a flexible wiring substrate 113 (see FIG. 2), the drive circuit
being mounted in the controller 710. The drive circuit may be
mounted on the wiring substrate 113.
[0131] The flexible display 11 is formed as a part of an operation
member 10 of the input device 100 in this embodiment. In other
words, the input device 100 includes the operation member 10, the
electrode substrate 20, the first support 30, the second support
40, and the conductive layer 50. Hereinafter, those elements will
be described.
(Operation Member)
[0132] The operation member 10 has a laminate structure of the
flexible display 11 and the metal film 12, the flexible display 11
including the first surface 110 and the second surface 120. In
other words, the operation member 10 includes the first surface 110
and the second surface 120 and is formed to have a deformable sheet
shape. The first surface 110 receives an operation by a user. The
second surface 120 is the opposite side to the first surface 110
and is provided with the metal film 12.
[0133] The metal film 12 is formed to have a sheet shape that is
deformable following the deformation of the flexible display 11.
The metal film 12 is formed of a mesh material or metal foil that
is made of, for example, Cu (copper), Al (aluminum), or steel use
stainless (SUS). The thickness of the metal film 12 is not
particularly limited and is several 10 nm to several 10 .mu.m, for
example. The metal film 12 is connected to a ground potential, for
example. The metal film only needs to function as a conductive
layer, and is not limited to metal. For example, the metal film may
be an oxide conductor such as ITO (indium tin oxide) or an organic
conductor such as carbon nanotube. This allows the metal film 12 to
exert a function as an electromagnetic shield layer when mounted in
the electronic apparatus 70. In other words, it is possible to
suppress intrusion of electromagnetic waves from other electronic
components mounted in the electronic apparatus 70 and leakage of
electromagnetic waves from the input device 100, for example, and
contribute to operation stability as the electronic apparatus 70.
It should be noted that the metal film 12 may include multiple
layers each connected to the ground potential (see FIG. 7). This
can strengthen the function as the electromagnetic shield
layer.
[0134] For example, as shown in FIG. 3, a viscous adhesion layer 13
on which metal foil is formed is attached to the flexible display
11, thus forming the metal film 12. The material of the adhesion
layer 13 is not particularly limited as long as it has viscosity,
but may be a resin film to which a resin material is applied.
Alternatively, the metal film 12 may be formed of a deposited film,
a sputtering film, or the like that is directly formed on the
flexible display 11, or may be a coating film of a conductive paste
or the like that is printed on the surface of the flexible display
11. Further, a non-conductive film may be formed on the surface of
the film metal film 12. Examples of the non-conductive film include
a hardcoat layer resistant to scratches and an antioxidant film
resistant to corrosion.
[0135] (Conductive Layer)
[0136] The conductive layer 50 forms the lowermost portion of the
input device 100 and is disposed to be opposed to the metal film 12
in the Z-axis direction. The conductive layer 50 also functions as,
for example, a support plate of the input device 100 and is formed
so as to have a higher bending rigidity than that of the operation
member 10 and the electrode substrate 20, for example. The
conductive layer 50 may be formed of a metal plate including, for
example, an Al alloy, an Mg (magnesium) alloy, or other metal
materials or may be formed of a conductive plate made of a
carbon-fiber-reinforced plastic or the like. Alternatively, the
conductive layer 50 may have a laminate structure in which a
conductive film such as a plating film, a deposited film, a
sputtering film, and metal foil is formed on an insulating layer
made of a plastic material or the like. Further, the thickness of
the conductive layer 50 is not particularly limited and is
approximately 0.3 mm, for example.
[0137] FIG. 5A to E is a schematic cross-sectional view showing
configuration examples of the conductive layer 50. The conductive
layer 50 is not limited to an example formed into a flat-plate
shape as shown in FIG. 5A and may include step portions 51 shown in
FIG. 5B, C, and E. Alternatively, the conductive layer 50 may be
formed into a mesh provided with openings 50h.
[0138] For example, a conductive layer 50B shown in FIG. 5B
includes step portions 51B. The step portions 51B are each formed
by bending a circumferential portion upward in the Z-axis
direction. Conductive layers 50C shown in FIG. 5C, E include step
portions 51C and 51E, respectively. The step portions 51C and 51E
are formed at the center portion and recessed downward. Such step
portions 51 can enhance bending rigidity of the conductive layer 50
in the Z-axis direction.
[0139] Further, conductive layers 50E shown in FIG. 5D, E are
provided with one or multiple openings 50h. Providing the openings
50h to the conductive layer 50 in such a manner can enhance
radiation performance while maintaining rigidity. Therefore, it is
possible to suppress defects of the input device 100 and to enhance
reliability. Further, the openings 50h can decrease the volume of
the conductive layer 50 and reduce the weight of the input device
100. Furthermore, the openings 50h can facilitate air to flow when
the volume of the second space portion 430 is changed by
deformation, and thus a response time of the electrode substrate 20
is shortened. Here, the response time refers to time from time when
a load applied to the operation member 10 is changed to time when
the volume of the sensor device 1 is actually changed.
[0140] Examples of the shape of the opening 50h in plan view may
include multi-angular shapes such as a triangle and a square,
circular shapes, elliptical shapes, oval shapes, indeterminate
shapes, and slit-like shapes. Those shapes may be used
independently or in combination of two or more of them.
[0141] Further, in the case where the conductive layer 50 is
provided with the multiple openings 50h, an arrangement pattern of
the multiple openings 50h is not particularly limited, but may be a
regular pattern, for example. This can make detection sensitivity
more uniform. Further, the regular pattern describe above may be a
one-dimensional array or a two-dimensional array, and may be
mesh-like, for example, as shown in FIG. 5D. Alternatively, the
multiple openings 50h may be formed into a stripe shape or may be
formed to have a geometric pattern as a whole.
[0142] The openings 50h are provided at positions or in regions
that are not opposed to any of the multiple second structures 410,
for example. In other words, the openings 50h and the second
structures 410 are provided to be displaced in an in-plane (in-XY
plane) direction so as not to overlap in the Z-axis direction (in
the thickness direction of the input device 100). This allows the
electrode substrate 20 and the conductive layer 50 to be stably
connected to each other via the second structures 410.
[0143] The conductive layer 50 is connected to the ground
potential, for example. The conductive layer 50 thus exerts the
function as an electromagnetic shield layer when mounted in the
electronic apparatus 70. In other words, for example, it is
possible to suppress intrusion of electromagnetic waves from other
electronic components and the like that are mounted in the
electronic apparatus 70 and leakage of electromagnetic waves from
the input device 100, and contribute to operation stability as the
electronic apparatus 70. Further, using the following connection
method can enhance the electromagnetic shield function more.
[0144] (Method of Connecting Metal Film and Conductive Layer to
Ground Potential)
[0145] FIG. 6 is a schematic view for describing a method of
connecting the metal film 12 and the conductive layer 50 to a
ground potential. As shown in FIG. 6, the metal film 12 and the
conductive layer 50 are connected to, for example, a ground of the
control unit 60 of the input device 100 and a ground of the
controller 710 of the electronic apparatus 70.
[0146] Here, the flexible display 11 is described as an example of
a device that has an influence on the detection sensitivity of the
sensor device 1. If the metal film 12 and the conductive layer 50
are connected to only the ground of the control unit 60, the
flexible display 11 has a possibility of affecting the ground
potential of the control unit 60 and inhibiting an electromagnetic
shield effect from being sufficiently exerted. In this regard, the
metal film 12 and the conductive layer 50 are connected to the
ground of the controller 710 to which the flexible display 11 is
connected, and thus it is possible to keep the ground potential
more stable and enhance the electromagnetic shield effect. Further,
as shown in the figure, connecting the metal film 12 and the
conductive layer 50 at more contact points can also enhance the
electromagnetic shield effect.
[0147] Alternatively, as shown in FIG. 7, the metal film 12 may be
formed of multiple layers. In the example shown in the figure, the
metal film 12 includes a first metal film 12a on the flexible
display 11 side and a second metal film 12b on the electrode
substrate 20 side. This allows the first metal film 12a to be
connected to the ground of the controller 710 and the second metal
film 12b to be connected to only the control unit 60, for example.
Alternatively, the second metal film 12b may be connected to both
the control unit 60 and the controller 710. This can also enhance
the electromagnetic shield effect.
[0148] (Electrode Substrate)
[0149] The electrode substrate 20 is formed as a laminate of a
first wiring substrate 21 and a second wiring substrate 22. The
first wiring substrate 21 includes the first electrode wires 210.
The second wiring substrate 22 includes the second electrode wires
220.
[0150] The first wiring substrate 21 includes a first base material
211 (see FIG. 2) and the multiple first electrode wires (X
electrodes) 210. The first base material 211 is formed of a sheet
material having flexibility, for example. Specifically, the first
base material 211 is formed of a plastic sheet (film) having
electrical insulation property, which is made of PET, PEN, PC,
PMMA, polyimide, or the like. The thickness of the first base
material 211 is not particularly limited and is several 10 .mu.m to
several 100 .mu.m, for example.
[0151] The multiple first electrode wires 210 are integrally
provided to one surface of the first base material 211. The
multiple first electrode wires 210 are arrayed at predetermined
intervals along an X-axis direction and formed substantially
linearly along a Y-axis direction. The first electrode wires 210
are drawn out to an edge portion and the like of the first base
material 211 and connected to respective different terminals.
Additionally, the first electrode wires 210 are electrically
connected to the control unit 60 via those terminals.
[0152] It should be noted that the multiple first electrode wires
210 may be each formed of a single electrode wire or may be formed
of multiple electrode groups 21w arrayed along the X-axis direction
(see FIG. 12). Additionally, multiple electrode wires that form
each of the electrode groups 21w may be connected to a common
terminal or may be connected to two or more different
terminals.
[0153] On the other hand, the second wiring substrate 22 includes a
second base material 221 (see FIG. 2) and the multiple second
electrode wires (Y electrodes) 220. The second base material 221 is
formed of a sheet material having flexibility, for example,
similarly to the first base material 211. Specifically, the second
base material 221 is formed of a plastic sheet (film) having
electrical insulation property, which is made of PET, PEN, PC,
PMMA, polyimide, or the like. The thickness of the second base
material 221 is not particularly limited and is several 10 .mu.m to
several 100 .mu.m, for example. The second wiring substrate 22 is
disposed to be opposed to the first wiring substrate 21.
[0154] The multiple second electrode wires 220 are formed similarly
to the multiple first electrode wires 210. In other words, the
multiple second electrode wires 220 are integrally provided to one
surface of the second base material 221, arrayed at predetermined
intervals along the Y-axis direction, and formed substantially
linearly along the X-axis direction. Additionally, the multiple
second electrode wires 220 may be each formed of a single electrode
wire or may be formed of multiple electrode groups 22w arrayed
along the Y-axis direction (see FIG. 12).
[0155] The second electrode wires 220 are drawn out to an edge
portion and the like of the second base material 221 and connected
to respective different terminals. Multiple electrode wires that
form each of the electrode groups 22w may be connected to a common
terminal or may be connected to two or more different terminals.
Additionally, the second electrode wires 210 are electrically
connected to the control unit 60 via those terminals.
[0156] The first electrode wires 210 and the second electrode wires
220 may be formed by a method of printing the conductive paste and
the like, such as screen printing, gravure offset printing, and
ink-jet printing, or may be formed by a patterning method using
photolithography technology of metal foil or a metal layer.
Additionally, the first and second base materials 211 and 221 are
each formed of a sheet having flexibility, and thus the electrode
substrate 20 can have flexibility as a whole.
[0157] As shown in FIG. 3, the electrode substrate 20 includes an
adhesion layer 23 that bonds the first wiring substrate 21 and the
second wiring substrate 22 to each other. The adhesion layer 23 has
electrical insulation property and is formed of, for example, a
hardened material of an adhesive, or a pressure-sensitive material
such as a pressure-sensitive tape.
[0158] With such a configuration, the first electrode wires 210 are
disposed to be opposed to the second electrode wires 220 in the
thickness direction of the electrode substrate 20, that is, the
Z-axis direction. Additionally, the electrode substrate 20 includes
the multiple detection portions 20s that are formed in regions
where the first electrode wires 210 and the second electrode wires
220 intersect.
[0159] FIG. 8A is a schematic cross-sectional view for describing a
configuration of the detection portion 20s. The detection portion
20s is formed of a capacitive element in a mutual capacitance
system, the capacitive element including the first electrode wire
210, the second electrode wire 220 opposed to the first electrode
wire 210 in the Z-axis direction, and a dielectric layer provided
between the first and second electrode wires 210 and 220. It should
be noted that in FIG. 8A and B, the first and second electrode
wires 210 and 220 are each assumed to be formed of a single
electrode wire.
[0160] FIG. 8A shows an example in which the first electrode wires
210 (210x1, 210x2, 210x3) are disposed to be opposed to the second
electrode wire 220 (220y ) in the Z-axis direction. In the example
shown in FIG. 8A, the first wiring substrate 21 and the second
wiring substrate 22 are bonded to each other by the adhesion layer
23, and the first base material 211 of the first wiring substrate
21 and the adhesion layer 23 form the dielectric layer described
above. In this case, detection portions 20s1, 20s2, and 20s3 are
formed at intersection regions where the first electrode wires
210x1, 210x2, and 210x3 and the second electrode wire 220y are
capacitively-coupled, respectively. Capacitances C1, C2, and C3 of
the detection portions 20s1, 20s2, and 20s3, respectively, are
changed in accordance with capacitive coupling between each of the
metal film 12 and the conductive layer 50 and the first electrode
wires 210x1, 210x2, and 210x3 and the second electrode wire 220y.
It should be noted that an initial capacitance of the detection
portion 20s is set by, for example, a facing area between the first
and second electrode wires 210 and 220, a facing distance between
the first and second electrode wires 210 and 220, and a dielectric
constant of the adhesion layer 23.
[0161] Further, FIG. 8B shows a modified example of the
configuration of the detection portions 20s, in which first
electrode wires 210D (210Dx1, 210Dx2, and 210Dx3) and second
electrode wires 220D (220Dy1, 220Dy2, and 220Dy3) are disposed in
the same plane on a first base material 211D and are
capacitively-coupled in the XY plane. In this case, the first
electrode wires 210D and the second electrode wires 220D are
disposed to be opposed to each other in the in-plane direction of
the electrode substrate 20 (for example, in the X-axis direction),
and for example, the first base material 211D forms a dielectric
layer of the detection portions 20Ds (20Ds1, 20Ds2, and 20Ds3). In
such an arrangement, capacitances C11, C12, and C13 of the
detection portions 20Ds1, 20Ds2, and 20Ds3, respectively, are
formed to be variable according to the capacitive coupling between
each of the metal film 12 and the conductive layer 50 and the first
and second electrode wires 210Dx and 220Dy. Additionally, in the
configuration described above, the second base material and the
adhesion layer become unnecessary, which can contribute to a
reduction in thickness of the input device 100.
[0162] In this embodiment, the multiple detection portions 20s are
disposed to be opposed to the respective first structures 310,
which will be described later, in the Z-axis direction.
Alternatively, the multiple detection portions 20s may be disposed
to be opposed to the respective second structures 410, which will
be described later, in the Z-axis direction. Further, in this
embodiment, the first wiring substrate 21 is laminated to be an
upper surface of the second wiring substrate 22, but the first
wiring substrate 21 is not limited thereto. The second wiring
substrate 22 may be laminated to be an upper surface of the first
wiring substrate 21.
[0163] (Control Unit)
[0164] The control unit 60 is electrically connected to the
electrode substrate 20. More specifically, the control unit 60 is
connected to the multiple first and second electrode wires 210 and
220 via terminals. The control unit 60 forms a signal processing
circuit that is capable of generating information on an input
operation with respect to the first surface 110 based on output of
the multiple detection portions 20s. The control unit 60 acquires
the amount of capacitance change of each of the detection portions
20s while scanning the detection portions 20s at predetermined
cycles, and generates information on the input operation based on
the amount of capacitance change.
[0165] The control unit 60 is typically formed of a computer
including a CPU/MPU, a memory, and the like. The control unit 60
may be formed of a single chip component or may be formed of
multiple circuit components. The control unit 60 may be mounted to
the input device 100 or to the electronic apparatus 70 in which the
input device 100 is incorporated. In the former case, for example,
the control unit 60 is mounted on the flexible wiring substrate
connected to the electrode substrate 20. In the latter case, the
control unit 60 may be formed integrally with the controller 710
that controls the electronic apparatus 70.
[0166] The control unit 60 includes the arithmetic unit 61 and the
signal generation unit 62 as described above and executes various
functions according to a program stored in a storage unit (not
shown). The arithmetic unit 61 calculates an operation position in
an XY coordinate system on the first surface 110 based on an
electrical signal (input signal) that is output from each of the
first and second electrode wires 210 and 220 of the electrode
substrate 20. The signal generation unit 62 generates an operation
signal based on a result of the calculation. This allows an image,
which is based on the input operation on the first surface 110, to
be displayed on the flexible display 11.
[0167] The arithmetic unit 61 shown in FIGS. 3 and 4 calculates XY
coordinates of the operation position on the first surface 110 by
the operating element based on an output from each of the detection
portions 20s to which unique XY coordinates are assigned.
Specifically, the arithmetic unit 61 calculates the amount of
capacitance change in each detection portion 20s based on the
amount of capacitance change acquired from each of the X electrodes
210 and the Y electrodes 220, each detection portion 20s being
formed in the intersection region of each X electrode 210 and each
Y electrode 220. Using a ratio of the amount of capacitance change
of each detection portion 20s, for example, the XY coordinates of
the operation position by the operating element can be
calculated.
[0168] Additionally, the arithmetic unit 61 can determine whether
the first surface 110 is receiving an operation or not.
Specifically, for example, in the case where the amount of
capacitance change of the whole of the detection portions 20s, the
amount of capacitance change of each detection portion 20s, or the
like is a predetermined threshold value or more, the arithmetic
unit 61 can determine that the first surface 110 is receiving an
operation. Further, with two or more threshold values being
provided, it is possible to distinguish between a touch operation
and a (conscious) push operation for determination, for example.
Moreover, a pressing force can also be calculated based on the
amount of capacitance change of the detection portion 20s.
[0169] The arithmetic unit 61 can output those calculation results
to the signal generation unit 62.
[0170] The signal generation unit 62 generates a predetermined
operation signal based on the calculation results of the arithmetic
unit 61. The operation signal may be, for example, an image control
signal for generating a displayed image to be output to the
flexible display 11, an operation signal corresponding to a key of
a keyboard image displayed at the operation position on the
flexible display 11, or an operation signal on an operation
corresponding to a GUI (Graphical User Interface).
[0171] Here, the input device 100 includes the first and second
supports 30 and 40 as a configuration to cause a change in distance
between each of the metal film 12 and the conductive layer 50 and
the electrode substrate 20 (detection portion 20s ) by an operation
on the first surface 110. Hereinafter, the first and second
supports 30 and 40 will be described.
[0172] (Basic Configuration of First and Second Supports)
[0173] The first support 30 is disposed between the operation
member 10 and the electrode substrate 20. The first support 30
includes the multiple first structures 310, a first frame 320, and
the first space portion 330. In this embodiment, the first support
30 is bonded to the electrode substrate 20 via an adhesion layer 35
(see FIG. 3). The adhesion layer 35 may be an adhesive or may be
formed of a pressure-sensitive material such as a
pressure-sensitive adhesive and a pressure-sensitive tape.
[0174] As shown in FIG. 3, the first support 30 according to this
embodiment includes a laminate structure including a base material
31, a structure layer 32 provided on the surface (upper surface) of
the base material 31, and multiple bonding portions 341 formed at
predetermined positions on the structure layer 32. The base
material 31 is formed of a plastic sheet having electrical
insulation property, which is made of PET, PEN, PC, or the like.
The thickness of the base material 31 is not particularly limited
and is several .mu.m to several 100 .mu.m, for example.
[0175] The structure layer 32 is formed of a resin material having
electrical insulation property, which is made of a UV resin or the
like. The structure layer 32 includes multiple first convex
portions 321, a second convex portion 322, and a concave portion
323 on the base material 31. The first convex portions 321 each
have a shape such as a columnar shape, a rectangular columnar
shape, and a frustum shape protruding in the Z-axis direction, for
example, and are arrayed at predetermined intervals on the base
material 31. The second convex portion 322 is formed to have a
predetermined width so as to surround the circumference of the base
material 31.
[0176] Additionally, the structure layer 32 is made of a material
that has relatively high rigidity and is capable of deforming the
electrode substrate 20 by an input operation on the first surface
110, but may be made of an elastic material that is deformable
together with the operation member 10 at the time of the input
operation. In other words, an elastic modulus of the structure
layer 32 is not particularly limited and can be selected as
appropriate within a range capable of obtaining a target
operational feeling or detection sensitivity.
[0177] The concave portion 323 is formed of a flat surface that is
formed between the first and second convex portions 321 and 322. In
other words, a spatial region above the concave portion 323 forms
the first space portion 330. Additionally, above the concave
portion 323, in this embodiment, an adhesion prevention layer 342
made of a UV resin or the like having low viscosity is formed (not
shown in FIG. 3). The shape of the adhesion prevention layer 342 is
not particularly limited and may be an island shape or may be
formed in a flat film on the concave portion 323.
[0178] Further, the bonding portions 341 each made of a viscous
resin material or the like are formed on the respective first and
second convex portions 321 and 322. In other words, each of the
first structures 310 is formed as a laminate of the first convex
portion 321 and the bonding portion 341 formed thereon. Each first
frame 320 is formed as a laminate of the second convex portion 322
and the bonding portion 341 formed thereon. This makes the
thickness (height) of the first structures 310 and the first frame
320 substantially the same, and the thickness (height) falls within
a range of, for example, several .mu.m to several 100 .mu.m in this
embodiment. It should be noted that the height of the adhesion
prevention layer 342 is not particularly limited as long as the
height is lower than the first structures 310 and the first frame
320. For example, the height of the adhesion prevention layer 342
is formed to be lower than the first and second convex portions 321
and 322.
[0179] The multiple first structures 310 are disposed to correspond
to the arrangement of the detection portions 20s. In this
embodiment, the multiple first structures 310 are disposed to be
opposed to the multiple detection portions 20s in the Z-axis
direction, for example.
[0180] On the other hand, the first frame 320 is formed so as to
surround the circumference of the first support 30 along the
circumferential edge of the electrode substrate 20. The length in a
short-side direction, that is, the width of the first frame 320 is
not particularly limited as long as the strength of the first
support 30 and the entire input device 100 can be sufficiently
ensured.
[0181] On the other hand, the second support 40 is disposed between
the electrode substrate 20 and the conductive layer 50. The second
support 40 includes the multiple second structures 410, a second
frame 420, and the second space portion 430.
[0182] As shown in FIG. 3, the second support 40 according to this
embodiment includes the second structures 410 and the second frame
420 that are formed directly on the conductive layer 50. The second
structures 410 and the second frame 420 are each made of an
insulating resin material having viscosity, for example, and also
have function of bonding portions that bond the conductive layer 50
and the electrode substrate 20. The thickness of the second
structures 410 and the second frame 420 is not particularly limited
and is several .mu.m to several 100 .mu.m, for example.
[0183] The second structures 410 are each disposed between the
first structures 310 adjacent to each other. In other words, the
second structures 410 are disposed to correspond to the arrangement
of the detection portions 20s, and in this embodiment, disposed
between the detection portions 20s adjacent to each other. On the
other hand, the second frame 420 is formed so as to surround the
circumference of the second support 40 along the circumferential
edge of the conductive layer 50. The width of the second frame 420
is not particularly limited as long as the strength of the second
support 40 and the entire input device 100 can be sufficiently
ensured. For example, the width is formed to have a width
substantially the same as that of the first frame 320.
[0184] Additionally, in the second structures 410, the elastic
modulus is not particularly limited as in the structure layer 32
that forms the first structures 310. In other words, the elastic
modulus can be selected as appropriate within a range capable of
obtaining a target operational feeling or detection sensitivity,
and the second structures 410 may be made of an elastic material
that is deformable together with the electrode substrate 20 at the
time of the input operation.
[0185] Further, the second space portion 430 is formed between the
second structures 410 and form a spatial region around the second
structures 410 and the second frame 420. In this embodiment, the
second space portion 430 houses the detection portions 20s and the
first structures 310 when viewed in the Z-axis direction.
[0186] The first and second supports 30 and 40 configured as
described above are formed as follows.
[0187] (Method of Forming First and Second Supports)
[0188] FIG. 9A, B, C is a schematic cross-sectional view showing
examples of a method of forming the first support 30. First, a UV
resin is disposed on a base material 31a, and a predetermined
pattern is formed on the resin. With this pattern, as shown in FIG.
9A, a structure layer 32a including multiple first and second
convex portions 321a and 322a and concave portions 323a is formed.
As the UV resin described above, a solid sheet material or a liquid
UV curable material may be used. Further, a method of forming a
pattern is not particularly limited. For example, using a
roll-shaped die having a predetermined concavo-convex pattern, a
method of transferring the concavo-convex pattern of the die to the
UV resin and curing the UV resin with UV application from the side
of the base material 31a can be applied. Further, in addition to
the shaping using the UV resin, for example, general thermoforming
(for example, press forming or injection molding) or discharge of a
resin material using a dispenser or the like may be adopted.
[0189] Next, with reference to FIG. 9B, a UV resin or the like
having low adhesiveness is applied to the concave portions 323a in
a predetermined pattern by a screen printing method, for example,
to form an adhesion prevention layer 342a. This can prevent the
metal film 12 disposed on the first support 30 and the concave
portion 323 from adhering to each other, in the case where the
resin material that forms the structure layer 32a has high
adhesiveness, for example. It should be noted that the adhesion
prevention layer 342a may not be formed in the case where the resin
material that forms the structure layer 32a has low
adhesiveness.
[0190] Further, with reference to FIG. 9C, bonding portions 341a
made of a UV resin or the like having high adhesiveness are formed
on the convex portions 321a by a screen printing method, for
example. The bonding portions 341a bond the first support 30 and
the metal film 12. By the forming method described above, the first
structures 310 and the first frame 320 having predetermined shapes
can be formed.
[0191] On the other hand, FIG. 10 is a schematic cross-sectional
view showing an example of a method of forming the second support
40. In FIG. 10, a UV resin or the like having high adhesiveness is
directly applied onto a conductive layer 50b in a predetermined
pattern by a screen printing method, for example, to form second
structures 410b and a second frame 420b. This can reduce the number
of processes to a large degree and enhance productivity.
[0192] The forming method described above is an example. For
example, the first support 30 may be formed by the method shown in
FIG. 10, or the second support 40 may be formed by the method shown
in FIG. 9. Further, the first and second supports 30 and 40 can be
formed by the following method shown in FIG. 11.
[0193] FIG. 11A, B is a schematic cross-sectional view showing a
modified example of the method of forming the first and second
supports 30 and 40. It should be noted that in FIG. 11, description
will be given using reference symbols corresponding to the first
support 30. In FIG. 11A, a UV resin or the like is applied onto a
base material 31C or the like in a predetermined pattern by a
screen printing method, for example, to form first and second
convex portions 311c and 312c. Further, on the first and second
convex portions 311c and 312c, bonding portions 341c made of a UV
resin or the like having high adhesiveness are formed by a screen
printing method, for example. Thus, the first structures 310
(second structures 410) formed of the first convex portions 311c
and the bonding portions 341c, and the first frame 320 (or the
second frame 420) formed of the second convex portion 312c and the
bonding portion 341c can be formed.
[0194] Next, a planar arrangement of the first and second
structures 310 and 410 will be described while touching on a
relationship between the first and second electrode wires (X
electrodes, Y electrodes) 210 and 220.
Arrangement Example of First and Second Structures
[0195] FIG. 12A, B is a schematic plan view showing arrangement
examples of the first and second structures 310 and 410 and the
first electrode wires (X electrodes) 210 and the second electrode
wires (Y electrodes) 220. FIG. 12A, B shows an example in which
each X electrode 210 and each Y electrode 220 have electrode groups
21w and 22w, respectively. Further, since each of the detection
portions 20s is formed in the intersection region of the X
electrode 210 and the Y electrode 220 as described above, for
example, four detection portions 20s surrounded by thick broken
lines are disposed in FIG. 12A, B. It should be noted that black
circles shown in FIG. 12A, B represent the first structures 310,
and white circles represent the second structures 410.
[0196] FIG. 12A shows an example in which the number of first
structures 310 and the number of second structures 410 are
substantially the same. In other words, the first structure 310 is
disposed at substantially the center of the detection portion 20s.
A pitch of the first structures 310 in the X-axis direction and the
Y-axis direction is the same as a pitch of the detection portion
20s in the X-axis direction and the Y-axis direction. The pitch is
P1. Further, the second structures 410 are disposed in the pitch
P1, which is the same in the first structures 310, at regular
intervals between the first structures 310 and between the
detection portions 20s that are adjacent in an oblique direction
forming approximately 45.degree. with each of the X-axis and Y-axis
directions.
[0197] Further, FIG. 12B shows an example in which the number of
first structures 310 and the number of second structures 410 are
different from each other. In other words, the first structures 310
are disposed in the pitch P1 at substantially the center of each
detection portion 20s, as in the example shown in FIG. 12A. On the
other hand, the second structures 410 are different from FIG. 12A
in arrangement and number and disposed in a pitch P2, which is 1/2
times of the pitch P1 of the first structures 310. When viewed in
the Z-axis direction, the second structures 410 are disposed so as
to surround the circumferences of the first structures 310 and the
detection portions 20s. The second structures 410 are disposed in a
larger number than the first structures 310, and thus the strength
of the entire input device 100 can be enhanced.
[0198] Further, the number and arrangement (pitch) of the first and
second structures 310 and 410 are adjusted, and thus the amount of
a change in distance between each of the metal film 12 and the
conductive layer 50 and the detection portion 20s with respect to a
pressing force can be adjusted so as to obtain a target operational
feeling or detection sensitivity.
[0199] Further, in the case where the conductive layer 50 includes
the openings 50h, the openings 50h, the first and second structures
310 and 410, and the first and second electrode wires 210 and 220
are disposed as follows.
Arrangement Example of Openings of Conductive Layer
[0200] FIG. 13A, B is a schematic plan view showing arrangement
examples of the openings 50h of the conductive layer 50, the first
and second structures 310 and 410, and the first and second
electrode wires 210 and 220. Additionally, FIG. 13A shows an
example of the openings 50h each having an oval shape, and FIG. 13B
shows an example of the openings 50h each having a circular shape.
The multiple openings 50h shown in FIG. 13A, B are disposed so as
to surround the circumferences of the detection portions 20s when
viewed in the Z-axis direction. Further, the multiple openings 50h
are provided to be displaced with respect to the second structures
410 in the in-plane (in-XY plane) direction, so as not to overlap
any of the first and second structures 310 and 410 and the
detection portions 20s in the Z-axis direction.
[0201] As shown in the figure, the openings 50h are disposed at
positions that are not opposed to the detection portions 20s, for
example. In other words, the openings 50h and the detection
portions 20s are provided to be displaced in an in-plane (in-XY
plane) direction so as not to overlap in the Z-axis direction. This
can suppress an initial capacitance or a change ratio of
capacitance of the detection portions 20s from being changed and
keep detection sensitivity in the input device 100 more uniform, as
compared with the case where the openings 50h of the conductive
layer 50 are disposed at positions opposed to the detection
portions 20s.
[0202] The openings 50h are disposed at cycles substantially the
same as the detection portions 20s. For example, the openings 50h
are disposed symmetrically with respect to the center of the
detection portion 20s. More specifically, the openings 50h are
disposed linearly symmetrically with respect to the center line of
each of the first and second electrode wires 210 and 220. This can
also prevent the detection sensitivity from being ununiform in the
input device 100.
[0203] As described above, the first and second supports 30 and 40
according to this embodiment have features: (1) including the first
and second structures 310 and 410 and the first and second space
portions 330 and 430; and (2) the first structures 310 and the
second structures 410 do not overlap each other when viewed in the
Z-axis direction, and the first structures 310 are disposed above
the second space portion 430. Therefore, as described later, the
metal film 12 and the conductive layer 50 can be deformed by a
minute pressing force of approximately several 10 g at the time of
operation.
[0204] (Operation of First and Second Supports)
[0205] FIG. 14 is a schematic cross-sectional view showing a state
of a force applied to the first and second structures 310 and 410
when a point P on the first surface 110 is pressed downward in the
Z-axis direction with an operating element h. White arrows in the
figure each schematically show the magnitude of a force applied
downward in the Z-axis direction (hereinafter, simply referred to
as "downward"). In FIG. 14, aspects such as the deflection of the
metal film 12, the electrode substrate 20, and the like and the
elastic deformation of the first and second structures 310 and 410
are not shown. It should be noted that in the following
description, even in the case where a user makes a touch operation
without being conscious of a press, a minute pressing force is
actually applied, and thus those input operations will be
collectively described as "press".
[0206] For example, in the case where a point P above a first space
portion 330p0 is pressed downward by a force F, the metal film 12
immediately below the point P is deflected downward. Along with the
deflection, first structures 310p1 and 310p2 adjacent to the first
space portion 330p0 receive a force F1 and are elastically deformed
in the Z-axis direction, and the thickness is slightly reduced.
Further, due to the deflection of the metal film 12, first
structures 310p3 and 310p4 adjacent to the first structures 310p1
and 310p2 also receive a force F2 that is smaller than F1.
Moreover, by the forces F1 and F2, a force is applied to the
electrode substrate 20 as well, and the electrode substrate 20 is
deflected downward centering on a region immediately blow the first
structures 310p1 and 310p2. With this deflection, a second
structure 410p0 disposed between the first structures 310p1 and
310p2 receives a force F3 and is elastically deformed in the Z-axis
direction, and the thickness is slightly reduced. Further, a second
structure 410p1 disposed between the first structures 310p1 and
310p3 and a second structure 410p2 disposed between the first
structures 310p2 and 310p4 also each receive F4 that is smaller
than F3.
[0207] In such a manner, a force can be transmitted by the first
and second structures 310 and 410 in the thickness direction, and
the electrode substrate 20 can be easily deformed. Further, when
the metal film 12 and the electrode substrate 20 are deflected, and
a pressing force has an influence in the in-plane direction (in a
direction parallel to the X-axis direction and the Y-axis
direction), the force can thus reach not only the region
immediately below the operating element h but also the first and
second structures 310 and 410 adjacent to that region.
[0208] Further, regarding the feature (1) described above, the
metal film 12 and the electrode substrate 20 can be easily deformed
by the first and second space portions 330 and 430. Further, with
respect to the pressing force of the operating element h, a high
pressure can be applied to the electrode substrate 20 by the first
and second structures 310 and 410 each formed of a prism or the
like, and the electrode substrate 20 can be efficiently
deflected.
[0209] Further, regarding the feature (2) described above, since
the first and second structures 310 and 410 are disposed so as not
to overlap each other when viewed in the Z-axis direction, the
first structures 310 can easily deflect the electrode substrate 20
via the second space portion 430 provided below the first
structures 310.
[0210] Hereinafter, description will be given on an example of the
amount of capacitance change of the detection portion 20s in a
specific operation.
Output Example of Detection Unit
[0211] FIG. 15A, B is a schematic cross-sectional view of a main
part, showing an aspect of the input device 100 when the first
surface 110 receives an operation by the operating element h and
showing an example of output signals output from the detection
portions 20s at that time. Bar graphs shown along the X axis in
FIG. 15A, B each schematically show the amount of capacitance
change from a reference value in each detection portion 20s.
Further, FIG. 15A shows an aspect when the operating element h
presses above a first structure 310 (310a2), and FIG. 15B shows an
aspect when the operating element h presses above a first space
portion 330 (330b1).
[0212] In FIG. 15A, the first structure 310a2 immediately below the
operation position receives the largest force and is displaced
downward while elastically deforming the first structure 310a2
itself. Due to the displacement, a detection portion 20sa2
immediately below the first structure 310a2 is displaced downward.
This allows the detection portion 20sa2 and the conductive layer 50
come close to each other via a second space portion 430a2. In other
words, the detection portion 20sa2 obtains the amount of
capacitance change Ca2 by a slight change in distance from the
metal film 12 and a large change in distance from the conductive
layer 50. On the other hand, due to the influence of the deflection
of the metal film 12, first structures 310a1 and 310a3 are also
slightly displaced downward, and the amounts of capacitance change
in detection portions 20sa1 and 20sa3 are Ca1 and Ca3.
[0213] In the example shown in FIG. 15A, Ca2 is the largest, and
Ca1 and Ca3 are substantially the same as each other and smaller
than Ca2. In other words, as shown in FIG. 15A, the amounts of
capacitance change Ca1, Ca2, and Ca3 show a distribution in chevron
with a vertex of Ca2. In this case, the arithmetic unit 61 can
calculate the center of gravity or the like based on the ratio of
Ca1, Ca2, and Ca3, to calculate XY coordinates on the detection
portion 20sa2 as an operation position.
[0214] On the other hand, in FIG. 15B, first structures 310b1 and
310b2 in the vicinity of the operation position are slightly
elastically deformed and displaced downward due to the deflection
of the metal film 12. Due to the displacement, the electrode
substrate 20 is deflected, and detection portions 20sb1 and 20sb2
immediately below the first structures 310b1 and 310b2 are
displaced downward. This allows the detection portions 20sb1 and
20sb2 and the conductive layer 50 come close to each other via
second space portions 430b1 and 430b2. In other words, the
detection portions 20sb1 and 20sb2 obtain the amounts of
capacitance change Cb1 and Cb2, respectively, by a slight change in
distance from the metal film 12 and a large change in distance from
the conductive layer 50.
[0215] In the example shown in FIG. 15B, Cb1 and Cb2 are
substantially the same as each other. The arithmetic unit 61 can
thus calculate XY coordinates between the detection portions 20sb1
and 20sb2 as an operation position.
[0216] As described above, according to this embodiment, both of
the thickness between the detection portion 20s and the metal film
12 and the thickness between the detection portion 20s and the
conductive layer 50 are variable by the pressing force, and thus
the amount of capacitance change in the detection portion 20s can
be made larger. This can enhance the detection sensitivity of the
input operation.
[0217] Further, even when the operation position on the flexible
display 11 is any point on the first structure 310 or above the
first space portion 330, the XY coordinates of the operation
position can be calculated. In other words, the influence of the
pressing force is spread in the in-plane direction by the metal
film 12, and thus a capacitance change can be generated in not only
the detection portion 20s immediately below the operation position
but also the detection portions 20s in the vicinity of the
operation position when viewed in the Z-axis direction. Thus, it is
possible to suppress variations in detection accuracy in the first
surface 110 and keep high detection accuracy on the entire first
surface 110.
[0218] Here, a finger or a stylus is exemplified as an operating
element frequently used. The feature of them is as follows: since
the finger has a larger contact area than the stylus, in the case
where the same load (pressing force) is applied, the finger
receives a smaller pressure (hereinafter, operation pressure) with
respect to the pressing force. On the other hand, the stylus has a
smaller contact area, and for example, in a capacitance sensor of a
general mutual capacitance system, there arise problems that the
amount of capacitive coupling to a sensor element is small and the
detection sensitivity is low. According to this embodiment, the
input operation can be detected with high accuracy with use of any
of the operating elements. Hereinafter, description will be given
with reference to FIG. 16A, B.
[0219] FIG. 16A, B is a schematic cross-sectional view of a main
part, showing an aspect of the input device 100 when the first
surface 110 receives an operation by a stylus or a finger and
showing an example of output signals output from the detection
portions 20s at that time. FIG. 16A shows the case where the
operating element is a stylus s, and FIG. 16B shows the case where
the operating element is a finger f. Additionally, bar graphs shown
along the X axis in FIG. 16A, B each schematically show the amount
of capacitance change from a reference value in each detection
portion 20s, as in FIG. 15A, B.
[0220] As shown in FIG. 16A, the stylus s deforms the metal film 12
and also applies a pressing force to a first structure 310c2
immediately below the operation position. Here, the stylus s has a
small contact area, and thus can apply a large operation pressure
to the metal film 12 and the first structure 310c2. For that
reason, the metal film 12 can be largely deformed. As a result, a
large capacitance change can be generated as shown by the amount of
capacitance change Cc2 of a detection portion 20sc2. Thus, the
amounts of capacitance change Cc1, Cc2, and Cc3 of detection
portions 20sc1, 20sc2, and 20sc3, respectively, have a distribution
in chevron with a vertex of Cc2.
[0221] As described above, the input device 100 according to this
embodiment can detect the amount of capacitance change based on an
in-plane distribution of the operation pressure. This is because
the input device 100 does not detect the amount of capacitance
change by direct capacitive coupling to the operating element, but
detects the amount of capacitance change via the deformable metal
film 12 and electrode substrate 20. Therefore, even for the
operating element such as the stylus s having a small contact area,
the operation position and the pressing force can be detected with
high accuracy.
[0222] On the other hand, as shown in FIG. 16B, since the finger f
has a large contact area, the operation pressure becomes small, but
can directly deform the metal film 12 in a wider range than the
stylus s. This can displace first structures 310d1, 310d2, and
310d3 downward and generate the amounts of capacitance change Cd1,
Cd2, and Cd3 of detection portions 20sd1, 20sd2, and 20sd3,
respectively. Cd1, Cd2, and Cd3 show a distribution in gradual
chevron, as compared with Cc1, Cc2, and Cc3 according to FIG.
16A.
[0223] The input device 100 according to this embodiment detects
the amount of capacitance change based on both capacitive coupling
between each of the metal film 12 and the conductive layer 50 and
the detection portion 20s as described above, and thus a sufficient
capacitance change can be generated even with an operating element
such as the finger f having a large contact area. Further, in the
determination on whether an operation has been performed or not,
using a value obtained by adding the amounts of capacitance change
of all the detection portions 20sd1, 20sd2, and 20sd3, in each of
which a capacitance change is generated, for example, can lead to a
highly accurate determination of a contact based on the pressing
force of the entire first surface 110, even if the operation
pressure is small. Moreover, since the capacitance is changed based
on an operation pressure distribution in the first surface 110, an
operation position conforming to an intuition of the user can be
calculated based on a ratio of those change amounts or the
like.
[0224] Moreover, in the case of a general capacitance sensor, the
operation position and the like are detected using capacitive
coupling between the operating element and the X and Y electrodes.
In other words, in the case where a conductor is disposed between
the operating element and the X and Y electrodes, it has been
difficult to detect an input operation due to capacitive coupling
between the conductor and the X and Y electrodes. Further, in a
configuration in which a gap between the operating element and the
X and Y electrodes is thick, there has been a problem that the
amount of capacitive coupling therebetween is made small and the
detection sensitivity is reduced. In view of those circumstances,
it has been necessary to dispose a sensor device on a display
surface of a display, and there has been a problem of deterioration
of a display quality of the display.
[0225] Since the input device 100 (sensor device 1) according to
this embodiment uses the capacitive coupling between each of the
metal film 12 and the conductive layer 50 and the X and Y
electrodes 210 and 220, even in the case where a conductor is
disposed between the operating element and the sensor device, there
is no influence on the detection sensitivity. Further, the metal
film 12 only needs to be deformable by the pressing force of the
operating element, and there are less limits on the thickness of
the gap between the operating element and the X and Y electrodes.
Therefore, even in the case where the sensor device 1 is disposed
on the back surface of the flexible display 11, the operation
position and the pressing force can be detected with high accuracy,
and the deterioration in display characteristics of the flexible
display 11 can be suppressed.
[0226] Moreover, there are less limits on the thickness of an
insulator (dielectrics) that exists between the operating element
and the X and Y electrodes, and thus even in the case where the
user operates while wearing gloves as an insulator, for example,
the detection sensitivity is not reduced. Therefore, this can
contribute to the improvement of convenience for the user.
[0227] [Electronic Apparatus]
[0228] FIG. 17A, B is a view showing an example of mounting the
input device 100 according to this embodiment to the electronic
apparatus 70. An electronic apparatus 70a according to FIG. 17A
includes a casing 720a including an opening portion 721a in which
the input device 100 is disposed. Further, the opening portion 721a
is provided with a support portion 722a, and the support portion
722a supports a circumferential portion of the conductive layer 50
via a bonding portion 723a such as a pressure-sensitive tape.
Further, a method of bonding the conductive layer 50 and the
support portion 722a is not limited to the above method, and the
conductive layer 50 and the support portion 722a may be fixed with
screws, for example.
[0229] Further, in the input device 100 according to this
embodiment, the first and second frames 320 and 420 are formed
along the circumferential edge thereof, and thus a stable strength
can be kept at the time of mounting.
[0230] An electronic apparatus 70b according to FIG. 17B also has a
configuration that is substantially the same as that of the
electronic apparatus 70a. The electronic apparatus 70b includes a
casing 720b including an opening portion 721a and a support portion
722a. The difference is in that the electronic apparatus 70b
includes at least one auxiliary support portion 724b that supports
the back surface of the conductive layer 50. The auxiliary support
portion 724b may be bonded to the conductive layer 50 with a
pressure-sensitive tape or the like or may not be connected. The
configuration described above can support the input device 100 more
stably.
Modified Example 1
[0231] In the first embodiment described above, the metal film 12
is formed by attaching the adhesion layer 13 to the flexible
display 11, the adhesion layer 13 being a viscous resin film and
including the metal foil formed thereon, but the metal film 12 is
not limited thereto. For example, in the case where the metal film
12 is metal foil without a resin film, for example, the adhesion
layer 13 may be a pressure-sensitive adhesive, an adhesive, or the
like capable of attaching the metal film 12 to the flexible display
11.
[0232] In this case, the adhesion layer 13 may be provided to the
entire surface of the flexible display 11 as shown in FIG. 3. This
allows the metal film 12 and the flexible display 11 to be tightly
bonded to each other in the entire plane, to obtain a uniform
sensitivity.
[0233] On the other hand, FIG. 18A, B is a schematic
cross-sectional view showing a modified example in which the
adhesion layer 13 is partially formed. As shown in FIG. 18A, the
adhesion layer 13 may be formed in only an outer circumferential
portion of each of the flexible display 11 and the metal film 12,
and for example, may be formed in a region above the first frame
320 and the second frame 420. This allows the metal film 12 and the
flexible display 11 to be bonded to each other above the first
frame 320 and the second frame 420, the first frame 320 and the
second frame 420 each having a larger bond area in the Z-axis
direction than each of the first structures 310 and the second
structures 410 and being disposed by lamination in the Z-axis
direction. Therefore, even if such a force as to tear the operation
member 10 off upward is applied, it is possible to prevent the
breakage of the first and second structures 310 and 410, peel-off
between the electrode substrate 20 and each of the structures 310
and 410, and the like.
[0234] Alternatively, as shown in FIG. 18B, the adhesion layer 13
may be formed in a display region of the flexible display 11, that
is, in a region including the center portion but excluding the
outer circumferential portion. As shown below, this allows the
breakage of the flexible display 11 or abnormal detection
sensitivity to be suppressed.
[0235] FIG. 19A, B is a schematic view showing a state where the
flexible display 11 is attached to the entire surface of the metal
film 12, including the outer circumferential portion. It should be
noted that in FIG. 19A, B, the adhesion layer 13 is not
illustrated.
[0236] For example, as schematically shown in FIG. 19A, a wire, a
driver, and the like are temporarily provided to an outer
circumferential portion 11a of the flexible display 11. In the case
where there is a bulge or a step, if the outer circumferential
portion 11a is forcedly bonded, a breakage may be caused
particularly in the outer circumferential portion 11a. Further, as
in regions circled by broken lines in the figure, gaps are
generated in boundary portions between the outer circumferential
portion 11a and other regions, and abnormal detection sensitivity
may be caused.
[0237] Additionally, as schematically shown in FIG. 19B, also in
the case where a seal material or the like (not shown) is provided
to the surface of the flexible display 11 and warpage or the like
occurs, if the outer circumferential portion 11a is forcedly
bonded, the flexible display 11 may be broken. Further, as in
regions circled by broken lines in the figure, abnormal detection
sensitivity may be caused due to floating of the flexible display
11. In other words, if the outer circumferential portion 11a of the
flexible display 11 is not forcedly bonded, the failures described
above can be suppressed.
[0238] Moreover, FIG. 20 is a schematic cross-sectional view
showing another modified example of the adhesion layer 13. As shown
in the figure, the adhesion layer 13 may be formed in a
predetermined plane pattern. FIG. 21 is a view showing examples of
a plane pattern of the adhesion layer 13. The adhesion layer 13 may
have a column pattern as shown in FIG. 21A, a stripe pattern as
shown in FIG. 21B, or a lattice pattern shown in FIG. 21C. With the
adhesion layer 13 having such a pattern, air bubbles can be
prevented from being mixed into the adhesion layer 13 when the
flexible display 11 and the metal film 12 are bonded to each other,
and a yield ratio can be improved.
[0239] Additionally, in the case where the adhesion layer 13 has a
predetermined plane pattern, the thickness of the adhesion layer 13
along the Z-axis direction can be formed to be thinner than the
thickness of the metal film 12. This allows the reliability of
bonding of the flexible display 11 and the metal film 12 to be
enhanced. Moreover, the predetermined pattern described above can
be formed to be finer than the arrangement pattern of the first
structures 310. Specifically, the length of each column in the case
of the column pattern or the length of each adjacent line in the
case of the stripe pattern may be formed to be shorter than the
size of the adjacent first structures 310, for example, to be
one-tenth of the length or shorter. This can prevent the pattern of
the adhesion layer 13 and the size of the first structures 310 from
interfering and ununiformity or periodicity in detection
sensitivity from occurring.
Modified Example 2
[0240] In the first embodiment described above, the multiple first
electrode wires 210 and the multiple second electrode wires 220 may
be each formed of a single electrode wire or may be each formed of
the multiple electrode groups 21w and 22w, but the following
configuration can also be provided.
[0241] FIG. 22A is a schematic plan view showing a configuration
example of the first electrode wires 210. For example, each of the
first electrode wires 210 include multiple unit electrode bodies
210m and multiple coupling portions 210n that couple the multiple
unit electrode bodies 210m to one another. Each of the unit
electrode bodies 210m includes multiple sub-electrodes (electrode
elements) 210w. The multiple sub-electrodes 210w are electrodes
formed of multiple electrode elements that are branched electrode
wires, and have a regular or irregular pattern. FIG. 22A shows an
example in which the multiple sub-electrodes 210w have a regular
pattern. In this example, the multiple sub-electrodes 210w are
linear conductive members extending in the Y-axis direction and
those conductive members are arrayed in a stripe pattern. The
coupling portions 210n extend in the Y-axis direction and couple
the adjacent unit electrode bodies 210m to each other.
[0242] FIG. 22B is a schematic plan view showing a configuration
example of the second electrode wires 220. For example, each of the
second electrode wires 220 include multiple unit electrode bodies
220m and multiple coupling portions 220n that couple the multiple
unit electrode bodies 220m to one another. Each of the unit
electrode bodies 220m includes multiple sub-electrodes (electrode
elements) 220w. The multiple sub-electrodes 220w have a regular or
irregular pattern. FIG. 22B shows an example in which the multiple
sub-electrodes 220w have a regular pattern. In this example, the
multiple sub-electrodes 220w are linear conductive members
extending in the X-axis direction and those conductive members are
arrayed in a stripe pattern. The coupling portions 220n extend in
the X-axis direction and couple the adjacent unit electrode bodies
220m to each other.
[0243] The first and second electrode wires 210 and 220 are
disposed to intersect such that the unit electrode bodies 210m and
the unit electrode bodies 220m are opposed to each other in the
Z-axis direction and overlap when viewed in the Z-axis direction,
and thus the intersection regions form the detection portions 20s.
It should be noted that the unit electrode bodies 210m and 220m are
not limited to the configurations described above, and unit
electrode bodies having various configurations can be adopted.
[0244] FIG. 23A to 23P is a schematic view showing shape examples
of the unit electrode bodies 210m and 220m. FIG. 23A to 23P shows
examples of the unit electrode body 210m, but the unit electrode
body 220m may have those shapes.
[0245] FIG. 23A shows an example in which the unit electrode body
210m is formed by an aggregate of multiple linear electrode
patterns radially extending from the center portion. FIG. 23B shows
an example in which one of the radial linear electrodes shown in
FIG. 23A is formed to be thicker than the other linear electrodes.
This allows the amount of capacitance change on the thick linear
electrode to be increased more than that on the other linear
electrodes. Further, FIG. 23C and 23D shows examples in which an
annular linear electrode is disposed at substantially the center
and linear electrodes are radially formed from the center. This
allows the concentration of the linear electrodes at the center
portion to be suppressed and the generation of a
reduced-sensitivity region to be prevented.
[0246] FIG. 23E to 23H shows examples in which multiple linear
electrodes each formed into an annular or rectangular annular shape
are combined to form an aggregate. This allows the electrode
density to be adjusted and the formation of a reduced-sensitivity
region to be suppressed. Further, FIGS. 23I to 23L shows examples
in which multiple linear electrodes each arrayed in the X-axis
direction or the Y-axis direction are combined to form an
aggregate. The adjustment of the shape, length, pitch, or the like
of the linear electrodes allows a desired electrode density to be
obtained. Further, FIG. 23M to 23P shows examples in which linear
electrodes are disposed asymmetrically in the X-axis direction or
the Y-axis direction.
[0247] The shapes of the unit electrode bodies 210m and 220m of the
first and second electrode wires 210 and 220 may be combined in two
sets of the same type or in two sets of different types out of the
shapes shown in FIGS. 22A, 22B, and 23A to 23P. It should be noted
that the shape of a portion other than the unit electrode bodies
210m and 220m, such as the coupling portions 210n and 220n, is not
particularly limited and may be linear, for example.
Modified Example 3
[0248] In the first embodiment described above, the first structure
310 is disposed at substantially the center of the detection
portion 20s, but the first structure 310 is not limited thereto.
For example, the detection portion 20s may be disposed to be
opposed to the second structure 410, and the second structure 410
may be disposed at substantially the center of the detection
portion 20s.
[0249] FIG. 24A, B is a schematic plan view showing arrangement
examples of the first and second structures 310 and 410 according
to this modified example and the first electrode wires (X
electrodes) 210 and the second electrode wires (Y electrodes) 220,
and corresponding to FIG. 12A, B.
[0250] FIG. 24A corresponds to FIG. 12A and shows an example in
which the number of first structures 310 and the number of second
structures 410 are substantially the same. Further, in this
modified example, the second structure 410 is disposed at
substantially the center of the detection portion 20s. A pitch of
the second structures 410 in the X-axis direction and the Y-axis
direction is the same as a pitch of the detection portion 20s in
the X-axis direction and the Y-axis direction. The pitch is P1.
Further, the first structures 310 are disposed in the pitch P1,
which is the same in the second structures 410, at regular
intervals between the second structures 410 and between the
detection portions 20s that are adjacent in an oblique direction
forming approximately 45.degree. with the X-axis and Y-axis
directions.
[0251] Further, FIG. 24B corresponds to FIG. 12B and shows an
example in which the number of first structures 310 and the number
of second structures 410 are different from each other. In other
words, the second structures 410 are disposed in the pitch P1 at
substantially the center of each detection portion 20s, as in the
example shown in FIG. 24A. On the other hand, the first structures
310 are different from FIG. 24A in arrangement and number and
disposed in a pitch P2, which is 1/2 times of the pitch P1 of the
second structures 410. When viewed in the Z-axis direction, the
first structures 310 are disposed so as to surround the
circumferences of the second structures 410 and the detection
portions 20s. The first structures 310 are disposed in a larger
number than the second structures 410, and thus the strength of the
entire input device 100 can be enhanced.
[0252] Further, FIG. 25A, B is a schematic cross-sectional view
showing a state of the modified example described above before and
after the point P on the first surface 110 is pressed downward in
the Z-axis direction with the operating element h. FIG. 25A shows a
state before a press is actually performed and corresponds to FIG.
14. FIG. 25B shows a pressed state and corresponds to FIG. 15.
[0253] For example, in the case where the point P above a first
space portion 330p0 is pressed downward, a region of the metal film
12 above the first space portion 330p0 is deflected downward, the
first space portion 330p is crushed in the Z-axis direction, and
the metal film 12 and the detection portion 20s come close to each
other. Moreover, first structures 310p1 and 310p2 that are adjacent
to the first space portion 330p0 also receive a force. With this
force, regions connected to the first structures 310p1 and 310p2 in
the electrode substrate 20 are also deflected downward, and the
thickness of a second structure 410p0 is also slightly reduced by
elastic deformation in the Z-axis direction. In other words, the
detection portion 20s located below the operating element h and the
conductive layer 50 come close to each other.
[0254] As described above, also in this modified example in which
the second structures 410 are opposed to the detection portions
20s, a force can be transmitted in the thickness direction by the
first and second structures 310 and 410, and the electrode
substrate 20 can be easily deformed. Thus, as in the first
embodiment, the input device 100 according to this modified example
can efficiently change a capacitance of the detection portion 20s
and highly accurately detect a pressing force and a pressing
position.
[0255] Further, as shown in FIG. 25A, B, the second support 40 may
include a laminate structure including a base material 41, a
structure layer 42 provided on the surface (upper surface) of the
base material 41, and multiple bonding portions 441 formed at
predetermined positions on the structure layer 42. On the other
hand, the first support 30 may not include such a laminate
structure. This can enhance operability while keeping the strength
of the input device 100 also in this modified example.
Modified Example 4
[0256] FIG. 26 is a schematic cross-sectional view showing another
modified example of this embodiment. As shown in the figure, the
operation member 10 may include a protective film 14 that is
disposed on the metal film 12 to face the first support 30. In
other words, the protective film 14 is disposed to be opposed to
the electrode substrate 20. The protective film 14 may be an
antioxidant resin film or the like, and formed on the metal film 12
by coating, for example. Providing such a protective film 14 can
prevent the metal film 12 from being corroded or broken. Therefore,
the reliability of the metal film 12 can be enhanced, and favorable
detection sensitivity can be kept.
Modified Example 5
[0257] The electrode substrate 20 is formed as a laminate of the
first wiring substrate 21, the second wiring substrate 22, and the
adhesion layer 23 therebetween, and the base material 31 of the
first support 30 is disposed on the first wiring substrate 21 via
the adhesion layer 35, but the configuration is not limited
thereto. For example, the following configurations may be
provided.
Configuration Example 1
[0258] The input device 100 (sensor device 1) may include an
insulating cover layer instead of the base material 31 and the
adhesion layer 35. Such a cover layer is made of, for example, an
insulating UV curable resin or a thermoset resin, and the thickness
may be several .mu.m to several 100 .mu.m. The cover layer may be a
single layer or may include multiple layers. Further, the first
structures 310 of the first support 30, the first frame 320, and
the first space portion 330 are disposed on the cover layer. The
first structures 310 and the first frame 320 can be formed by a
screen printing method or a UV molding method, for example. Such a
configuration can make the thickness of the electrode substrate 20
and the first support 30 thinner and contribute to a reduction in
thickness of the input device 100.
Configuration Example 2
[0259] FIG. 27 is a schematic cross-sectional view of a main part,
showing a configuration example 2 according to this modified
example. As shown in the figure, this configuration example
includes an insulating layer 24 instead of the first base material
211 and the adhesion layer 23. In other words, the insulating layer
24 is formed on the second wiring substrate 22 including the second
electrode wires 220, and the first electrode wires 210 are formed
thereon. The insulating layer 24 may be made of, for example, an
insulating UV curable resin or a thermoset resin, and the thickness
may be several .mu.m to several 100 .mu.m. Such a configuration can
make the electrode substrate 20 thinner and contribute to a
reduction in thickness of the entire input device 100. It should be
noted that the input device 100 according to this configuration
example may include a cover layer instead of the base material 31
and the adhesion layer 35, as described in the configuration
example 1.
Configuration Example 3
[0260] FIG. 28A, B is a schematic cross-sectional view of a main
part, showing a configuration example 3 according to this modified
example. As shown in FIG. 28A, an electrode substrate 20 according
to this configuration example includes one base material 211, and
first electrode wires 210 and second electrode wires 220 are formed
on both surfaces of the base material 211. In other words, the base
material 211 has a configuration in which two-layer electrodes are
formed by both-side printing. In this case, as shown in FIG. 28A, a
cover layer 25 may be formed on the surface (lower surface) of the
base material 211 on which the second electrode wires 220 are
formed. The cover layer 25 may be made of, for example, an
insulating UV curable resin or a thermoset resin, and the thickness
may be several .mu.m to several 100 .mu.m. Alternatively, as shown
in FIG. 28B, an adhesion layer 23 and a second base material 221
may be formed on the lower surface of the first base material 211,
both the surfaces of which includes the first and second electrode
wires 210 and 220. Further, though not shown in the figure, a
configuration in which the second support 40 is directly formed on
the lower surface of the base material 211 may be provided. It
should be noted that the input device 100 according to this
configuration example may include a cover layer instead of the base
material 31 and the adhesion layer 35, as described in the
configuration example 1.
Configuration Example 4
[0261] FIG. 29A, B is a schematic cross-sectional view of a main
part, showing a configuration example 4 according to this modified
example. As shown in the figure, an electrode substrate 20
according to this configuration example includes a first wiring
substrate 21 including first electrode wires 210 and a first base
material 211, a second wiring substrate 22 including second
electrode wires 220 and a second base material 221, and an adhesion
layer 23, but the orientation of the second wiring substrate 22
with respect to the first wiring substrate 21 is different from
that of the configuration shown in FIG. 3 or the like. In other
words, the second electrode wires 220 are not formed on the side
facing the adhesion layer 23 but formed to face the second support
40. In this case, as shown in FIG. 29A, an insulating cover layer
25 may be formed on the lower surface of the second base material
221. Alternatively, as shown in FIG. 29B, an adhesion layer 252 and
a third base material 251 may be formed on the lower surface of the
second base material 221. Further, though not shown in the figure,
a configuration in which the second support 40 is directly formed
on the lower surface of the second base material 221 may be
provided. It should be noted that the input device 100 according to
this configuration example may include an insulating cover layer
instead of the base material 31 and the adhesion layer 35, as
described in the configuration example 1.
Configuration Example 5
[0262] FIG. 30 is a schematic cross-sectional view of a main part,
showing a configuration example 5 according to this modified
example. As shown in the figure, an electrode substrate 20 is
disposed such that the configuration described with reference to
FIG. 3 or the like is turned upside down. Further, the first
support 30 does not include the base material 31, and the second
support 40 includes the base material 41 formed on the electrode
substrate 20 side. In this case, as shown in FIG. 30, an adhesion
layer 45 may be provided between the base material 41 of the second
support 40 and the first wiring substrate 21 of the electrode
substrate 20, and an adhesion layer may not be provided between the
electrode substrate 20 and the first support 30. It should be noted
that this configuration example may be combined with the
configurations described as the configuration examples 1 to 4 as
appropriate. For example, the base material 41 and the adhesion
layer 45 can be the cover layer as described above.
Second Embodiment
[0263] FIG. 31 is a schematic cross-sectional view of an input
device 100A according to a second embodiment of the present
technology. A configuration other than an operation member 10A of
the input device 100A according to this embodiment is similar to
that of the first embodiment, and description thereof will be
omitted as appropriate. FIG. 31 is a view corresponding to FIG. 1
according to the first embodiment.
[0264] (Overall Configuration)
[0265] The input device 100A according to this embodiment includes
a flexible sheet 11A instead of the flexible display, and a sensor
device 1 similar to that of the first embodiment. As will be
described later, multiple key regions 111A are disposed on the
flexible sheet 11A, and the input device 100A is used as a keyboard
device as a whole.
[0266] (Input Device)
[0267] The flexible sheet 11A is formed of an insulating plastic
sheet having flexibility, which is made of PET (polyethylene
terephthalate), PEN (polyethylene naphthalate), PMMA
(polymethylmethacrylate), PC (polycarbonate), PI (polyimide), or
the like. The thickness of the flexible sheet 11A is not
particularly limited and is approximately several 10 .mu.m to
several 100 .mu.m, for example.
[0268] It should be noted that the flexible sheet 11A is not
limited to a single-layer structure and may have a configuration of
a laminate of two or more sheets. In this case, in addition to the
plastic sheet described above, an insulating plastic sheet having
flexibility made of PET, PEN, PMMA, PC, PI, or the like may be
laminated as a base material, for example.
[0269] The flexible sheet 11A includes a first surface 110A as an
operation surface and a second surface 120A as a back surface of
the first surface 110A. On the first surface 110A, the multiple key
regions 111A are arrayed. On the second surface 120A, a metal film
12 is laminated.
[0270] The flexible sheet 11A and the metal film 12 may be formed
of a composite sheet or the like in which metal foil is previously
attached to the surface of a resin sheet, or may be formed of a
deposited film, a sputtering film, or the like formed on the second
surface 120A. Alternatively, the flexible sheet 11A and the metal
film 12 may be a coating film of a conductive paste or the like
that is printed on the second surface 120A.
[0271] Each of the key regions 111A corresponds to a keycap that is
subjected to a pressing operation by the user, and has a shape and
size corresponding to the type of a key. Each of the key regions
111A may be provided with an appropriate key indication. The key
indication may indicate the type of a key, a position (outline) of
an individual key, or both of them. For the indication, an
appropriate printing method such as screen printing, flexographic
printing, and gravure offset printing can be adopted.
[0272] The first surface 110A has a form in which a groove portion
112A is formed around each of the key regions 111A. For formation
of a concave-convex surface corresponding to the key regions 111A,
an appropriate processing technology such as press forming,
etching, and laser processing can be adopted. Alternatively, a
flexible sheet 11A including a concave-convex surface may be formed
by a molding technology such as injection molding.
[0273] Further, the configuration of the flexible sheet 11A is not
limited to the example described above. For example, FIG. 32A, B is
a schematic view showing a modified example of the flexible sheet
11A. A flexible sheet 11Aa shown in FIG. 32A shows an example in
which a first surface 110A is formed of a flat surface. In this
case, each key region (not shown) may be described by printing or
the like, or the flexible sheet 11Aa may not include key regions
and may be used as a touch sensor. Further, a flexible sheet 11Ab
shown in FIG. 32B is formed by performing press forming on the
flexible sheet 11A, for example, and each of key regions 111Ab is
formed to be independently deformable in the vertical direction
(sheet thickness direction).
[0274] Further, the flexible sheet 11A may be made of a material
having conductivity, such as metal. This can make the metal film 12
unnecessary and the operation member 10A thinner. In this case, the
flexible sheet 11A has a function of the metal film 12 as well and
is connected to a ground potential, for example.
[0275] In this embodiment, when a user performs a key input
operation, the user presses the center portion of the key region
111A. In this regard, first and second structures 310 and 410 and
detection portions 20s can be disposed as follows.
Arrangement Example 1
[0276] For example, as shown in FIG. 31, the first structure 310 of
the first support 30 may be disposed below the key region 111A. In
this case, the detection portion 20s is disposed at a position
overlapping with the first structure 310 when viewed in the Z-axis
direction, and the second structure 410 is disposed below the
groove portion 112A between the first structures 310 adjacent to
each other.
[0277] In the arrangement example 1, the position above the first
structure 310 is pressed at the time of a key input operation. As
described with reference to FIG. 15A, this allows each of the metal
film 12 and the conductive layer 50 and the detection portion 20s
to come close to each other and a capacitance change of the
detection portion 20s to be obtained.
[0278] Further, the shape of the first structure 310 is not limited
to a columnar body or the like as shown in FIG. 12, and may be
disposed to be wall-like along the groove portion 112A, for
example. In this case, each second structure 410 is disposed along
a boundary between the multiple key regions 111A.
Arrangement Example 2
[0279] Alternatively, the first structure 310 may be disposed below
the groove portion 112A. In this case, the second structure 410 is
disposed below the key region 111A between the first structures 310
adjacent to each other. Further, the detection portion 20s is
disposed at a position overlapping with the first structure 310
when viewed in the Z-axis direction.
[0280] In the arrangement example 2, as described with reference to
FIG. 15B, a position above the first space portion 330 is pressed
at the time of a key input operation, and thus the metal film 12
and the detection portion 20s come close to each other. Further,
the first structures 310, which are adjacent to the first space
portion 330 immediately below the operation position, are displaced
downward and the electrode substrate 20 is deflected, and thus the
second structure 410 is also slightly elastically deformed.
Therefore, each of the metal film 12 and the conductive layer 50
and the detection portion 20s come close to each other, and a
capacitance change of the detection portion 20s can be
obtained.
[0281] It should be noted that the arrangement of the detection
portions 20s is not limited to the above, and the detection
portions 20s may be disposed to overlap with the second structures
410.
[0282] As described above, the control unit 60 includes the
arithmetic unit 61 and the signal generation unit 62 and is
electrically connected to the electrode substrate 20. Additionally,
in this embodiment, the control unit 60 is configured to be capable
of generating information on an input operation made on each of the
multiple key regions 111A based on the outputs of the multiple
detection portions 20s. In other words, the arithmetic unit 61
calculates an operation position in the XY coordinate system on the
first surface 110 based on electrical signals (input signals)
output from the first and second electrode wires 210 and 220 of the
electrode substrate 20 and determines a key region 111A that is
assigned to the operation position. The signal generation unit 62
generates an operation signal corresponding to the key region 111A
on which the press is detected.
[0283] The input device 100A is incorporated into an electronic
apparatus such as a laptop personal computer and a mobile phone and
can thus be applied as a keyboard device as described above.
Additionally, the input device 100A includes a communication unit
(not shown), and may thus be electrically connected to another
electronic apparatus such as a personal computer in a wired or
wireless manner and capable of performing an input operation for
controlling the electronic apparatus.
[0284] Further, the input device 100A can also be used as a
pointing device as described in the first embodiment. In other
words, two or more threshold values are set for an output of each
detection portion 20s, and the arithmetic unit 61 determines a
touch operation or a push operation, thus achieving an input device
that doubles as a pointing device and a keyboard.
Modified Example
[0285] FIG. 33 is an enlarged cross-sectional view showing an input
device 100A of a modified example according to this embodiment. The
input device 100A shown in the figure does not have a configuration
in which multiple second structures 410 are each disposed between
multiple first structures 310 adjacent to each other, but has a
configuration in which at least part of the multiple first
structures 310 is disposed to be opposed to at least part of the
multiple second structures 410 in the Z-axis direction. Moreover,
the first structures 310 and the second structures 410 that are
disposed to be opposed to each other in the Z-axis direction are
disposed to be opposed to the groove portions 112A in the Z-axis
direction and are disposed at boundaries between the multiple key
regions 111A.
[0286] FIG. 34A is a plan view showing an arrangement example of
the first structures 310. FIG. 34B is a plan view showing an
arrangement example of the second structures 410. In this modified
example, as will be described later, the multiple first structures
310 and the multiple second structures 410 are disposed to
correspond to the arrangement of the multiple key regions 111A.
Additionally, the multiple first structures 310 have various types
of shapes corresponding to the arrangement thereof, and the
multiple second structures 410 also have various types of shapes
corresponding to the arrangement thereof. Further, when viewed in
the Z-axis direction, the multiple first structures 310 and the
multiple second structures 410 are configured such that a first
structure 310e in the first structures 310 shown in FIG. 34A and a
second structure 410e in the second structures 410 shown in FIG.
34B overlap each other.
[0287] FIG. 35A is a plan view showing a configuration example of
multiple X electrodes 210. FIG. 35B is a plan view showing a
configuration example of multiple Y electrodes 220. As shown in
FIG. 35A, each of the X electrodes 210 includes multiple unit
electrode bodies 210m, and the unit electrode bodies 210m are
connected to each other in the Y-axis direction by electrode wires.
Each of the unit electrode bodies 210m includes multiple
sub-electrodes and is disposed to correspond to each of the key
regions 111A. On the other hand, as shown in FIG. 35B, the Y
electrodes 220 are formed of electrode groups 22w each including
multiple electrode wires extending in the X-axis direction. An
intersection region of each unit electrode body 210m of the X
electrode 210 and each electrode group 22w of the Y electrode forms
a detection portion 20s, and the detection portion 20s is formed to
correspond to each key region 111A. It should be noted that the
configuration is not limited to the configuration described above,
and a configuration in which the X electrode 210 includes multiple
electrode groups and the Y electrode 220 includes multiple unit
electrode bodies may be provided.
[0288] In this modified example, intersection points of the
sub-electrodes in the unit electrode bodies 210m and electrode
wires in the electrode group 22w are densely disposed at the center
portion of each of the key regions 111A. This allows detection
sensitivity when the key region 111A is pressed to be improved.
[0289] FIG. 36 is an enlarged plan view showing an arrangement
example of the first structures 310 and the second structures 410
and is a view showing one key region 111A. In the figure, the first
structures 310 are denoted by reference symbols u1 to u10 and the
second structures 410 are denoted by reference symbols s1 to s9,
for convenience sake.
[0290] As shown in the figure, a first structure u9 and a second
structure s8 are disposed to be opposed to each other, and a first
structure u10 and a second structure s4 are disposed to be opposed
to each other, in the Z-axis direction on the sides indicated by
chain double-dashed lines around the key region 111A along the
Y-axis direction. In such a manner, in a region in which the first
structure 310 and the second structure 410 are disposed to overlap
each other in the Z-axis direction, a distance between each of the
metal film 12 and the conductive layer 50 and the electrode
substrate 20 is hard to change, and detection sensitivity as a
sensor is low. Further, in the region, when a certain key region
111A is pressed, the deformation of the flexible sheet 11A (metal
film 12) and the electrode substrate 20 is hard to propagate to
another key region 111A. Therefore, the first structures u9 and u10
and the second structures s8 and s4, which are opposed to each
other in the Z-axis direction, respectively, are disposed around
the key region 111A, and thus malfunctions between key regions 111A
that are adjacent particularly in the X-axis direction can be
prevented.
[0291] It should be noted that first structures and second
structures that are opposed to each other in the Z-axis direction
may be disposed on a side along the X-axis direction around the key
region 111A. Specifically, the first structures may be disposed
above the second supports s1 to s3 and s5 to s7. In this case,
malfunctions between key regions 111A that are adjacent in the
Y-axis direction can be prevented.
[0292] Moreover, as shown in the figure, the multiple first
structures u5 to u8 are disposed within the key region 111A. The
first structures u5 to u8 disposed without overlapping with the
second structures efficiently deform the flexible sheet 11A (key
region 111A) and the electrode substrate 20 as described above, and
thus detection sensitivity within the key region 111A can be
improved.
[0293] If only one first structure is disposed within the key
region 111A, in the case where a region distant from the first
structure is pressed, the flexible sheet 11A and the electrode
substrate 20A cannot be efficiently deformed. In particular, in the
case where a pressing operation is made with an operating element
having a small contact area, such as a claw and a stylus, there is
a possibility that sensitivity varies depending on the position in
the key region 111A. In contrast to this, in this modified example,
the multiple first structures u5 to u8 are symmetrically disposed
in the key region 111A, and thus high detection sensitivity can be
kept irrespective of the pressing position in the key region 111A
or the contact area of the operating element.
[0294] Moreover, intersection points of the sub-electrodes in the
unit electrode bodies 210m and electrode wires in the electrode
groups 22w may be densely disposed inside and in the vicinity of a
region defined by the first structures u5 to u8 (region indicated
by a dashed-dotted line of FIG. 36). This allows detection
sensitivity when the key region 111A is pressed to be improved
more.
[0295] The second structure s9 is disposed at substantially the
center of the key region 111A. If no structure is disposed at the
center portion of the key region 111A, the center portion tends to
have a large deformation amount in the flexible sheet 11A and the
electrode substrate 20, as compared to the circumferential portion.
This has caused a difference in detection sensitivity between the
center potion of the key region 111A and the circumferential
portion. In this regard, the second structure s9 is disposed at
substantially the center of the key region 111A, and thus the
detection sensitivity in the center portion of the key region 111A
and the circumferential portion can be uniformly kept.
[0296] On the other hand, around the key region 111A, the first
structures u1 to u4 and the second structures s1 to s3 and s5 to s7
are disposed without overlapping each other. Those first and second
structures u1 to u4, s1 to s3, and s5 to s7 are formed to be larger
than the first and second structures u5 to u8 and s9, which are
disposed within the key region 111A. This can enhance the
adhesiveness between the first and second structures, and the
electrode substrate 20, the flexible sheet 11A, and the like and
enhance the strength as the input device 100A. Further, this can
suppress the deformation around the key region 111A and prevent
malfunctions.
[0297] Further, as shown in FIG. 36, the first and second
structures disposed around each of the key regions 111A are
desirably spaced away from each other. If the first and second
structures surround the key region 111A without gaps, an internal
pressure rises in the first space portion 330 and the second space
portion 430 in the key region 111A. This may cause a slow
restoration of the flexible sheet 11A and the electrode substrate
20 from deformation and a reduction in detection sensitivity. In
this regard, disposing the first and second structures to be spaced
away from each other can prevent the detection sensitivity from
being reduced, without hindering air from moving in the first space
portion 330 and the second space portion 430.
Third Embodiment
[0298] FIG. 37 is a schematic cross-sectional view of an electronic
apparatus 70B in which an input device 100B according to a third
embodiment of the present technology is incorporated. A
configuration other than an operation member 10B of the input
device 100B according to this embodiment is similar to that of the
first embodiment, and description thereof will be omitted as
appropriate.
[0299] In the input device 100B according to this embodiment, a
part of a casing 720B of the electronic apparatus 70B forms a part
of the operation member 10B. In other words, the input device 100B
includes an operation region 721B that forms a part of the casing
720B, and a sensor device 1 similar to that of the first
embodiment. As the electronic apparatus 70B, for example, a
personal computer or the like equipped with a touch sensor can be
applied.
[0300] The operation member 10B has a laminate structure of an
operation region 721B and a metal film 12. The operation region
721B includes a first surface 110B and a second surface 120B and is
deformable. In other words, the first surface 110B is one surface
of the casing 720B, and the second surface 120B is a back surface
(inner surface) of the one surface.
[0301] The operation region 721B may be made of the same material
as other regions of the casing 720B, for example, a conductive
material such as an aluminum alloy and a magnesium alloy or a
plastic material. In this case, the operation region 721B is formed
to have a thickness in which the operation region 721B is
deformable when a user makes a touch operation or a push operation.
Alternatively, the operation region 721B may be made of a material
different from other regions of the casing 720B. In this case, a
material having small rigidity than the other regions can be
adopted.
[0302] Further, on the second surface 120B, the metal film 12 such
as metal foil, which is formed on a viscous adhesion layer 13, is
formed. In the case where the operation region 721B is made of a
conductive material, the metal film 12 is unnecessary and the
operation member 10B can be made thinner. In this case, the
operation region 721B also has a function as the metal film 12 and
is connected to a ground potential, for example.
[0303] As described above, the input device 100B according to this
embodiment can be formed using a part of the casing 720B made of a
conductive material or the like. This is because, as described
above, the input device 100B does not detect an input operation
using capacitive coupling between the operating element and the X
and Y electrodes, but uses capacitive coupling between each of the
metal film 12 and the conductive layer 50 and the detection portion
20s, the metal film 12 being pressed with the operating element,
the conductive layer 50 being opposed to the metal film 12.
Therefore, according to the input device 100B, the number of
components of the electronic apparatus 70B can be reduced, and
productivity can be enhanced more.
[0304] Further, the input device 100B according to this embodiment
includes the sensor device 1 similar to that of the first
embodiment described above and can thus highly accurately detect an
operation position and a pressing force even for a minute pressing
force. Therefore, according to this embodiment, there are less
limits on the material of the operation region 721B, and the input
device 100B having high detection sensitivity can be provided.
Fourth Embodiment
[0305] FIG. 38A is a schematic cross-sectional view of an input
device 100C according to a fourth embodiment of the present
technology. FIG. 38B is a cross-sectional view showing a main part
of the input device 100C in an enlarged manner. This embodiment is
different from the first embodiment in that the electrode substrate
20 electrostatically detects a change in distance from each of the
metal film 12 and the conductive layer 50 based on the amount of
capacitive coupling change in the XY plane. In other words, a Y
electrode 220C includes an opposed portion that is opposed to an X
electrode 210C in an in-plane direction of an electrode substrate
20C, and the opposed portion forms a detection portion 20Cs.
[0306] The electrode substrate 20 includes a base material 211C on
which multiple first electrode wires (X electrodes) 210C and
multiple second electrode wires (Y electrodes) 220C are disposed,
the multiple X electrodes 210C and Y electrodes 220C being disposed
on the same plane.
[0307] With reference to FIG. 39A, B, description will be given on
an example of a configuration of the X electrodes 210C and the Y
electrodes 220C. Here, an example is shown in which each of the X
electrodes 210C includes multiple unit electrode bodies (first unit
electrode bodies) 210m each having a pectinate shape and each of
the Y electrodes 220C includes multiple unit electrode bodies
(second unit electrode bodies) 220m each having a pectinate shape,
and one unit electrode body 210m and one unit electrode body 220m
form each detection portion 20Cs.
[0308] As shown in FIG. 39A, the X electrode 210C includes the
multiple unit electrode bodies 210m, an electrode wire portion
210p, and multiple connection portions 210z. The electrode wire
portion 210p is extended in the Y-axis direction. The multiple unit
electrode bodies 210m are disposed at constant intervals in the
Y-axis direction. The electrode wire portion 210p and the unit
electrode bodies 210m are disposed to be spaced away from each
other at predetermined intervals and are connected by the
connection portions 210z.
[0309] As described above, the unit electrode bodies 210m each have
a pectinate shape as a whole. Specifically, the unit electrode
bodies 210m each include multiple sub-electrodes 210w and a
coupling portion 210y. The multiple sub-electrodes 210w are
extended in the X-axis direction. Adjacent sub-electrodes 210w are
spaced away from each other at predetermined intervals. One end of
each sub-electrode 210w is connected to the coupling portion 210y
extended in the X-axis direction.
[0310] As shown in FIG. 39B, the Y electrode 220C includes the
multiple unit electrode bodies 220m, an electrode wire portion
220p, and multiple connection portions 220z. The electrode wire
portion 220p is extended in the X-axis direction. The multiple unit
electrode bodies 220m are disposed at constant intervals in the
X-axis direction. The electrode wire portion 220p and the unit
electrode bodies 220m are disposed to be spaced away from each
other at predetermined intervals and are connected by the
connection portions 220z. It should be noted that a configuration
in which the connection portions 220z are omitted and the unit
electrode bodies 220m are directly provided on the electrode wire
portion 220p may be adopted.
[0311] As described above, the unit electrode bodies 220m each have
a pectinate shape as a whole. Specifically, the unit electrode
bodies 220m each include multiple sub-electrodes 220w and a
coupling portion 220y. The multiple sub-electrodes 220w are
extended in the X-axis direction. Adjacent sub-electrodes 220w are
spaced away from each other at predetermined intervals. One end of
each sub-electrode 220w is connected to the coupling portion 220y
extended in the Y-axis direction.
[0312] As shown in FIG. 40A, in regions in which the unit electrode
bodies 210m and the unit electrode bodies 220m are mutually
combined, the respective detection portions 20Cs are formed. The
multiple sub-electrodes 210w of the unit electrode bodies 210m and
the multiple sub-electrodes 220w of the unit electrode bodies 220m
are alternately arrayed toward the Y-axis direction. In other
words, the sub-electrodes 210w and 220w are disposed to be opposed
to each other in the in-plane direction of the electrode substrate
20C (for example, in the Y-axis direction).
[0313] FIG. 40B is a cross-sectional view when viewed from the A-A
direction of FIG. 40A. The Y electrodes 220 are provided so as to
intersect with the X electrodes 210 as in the first embodiment and
formed on the same plane as the X electrode 210. In this regard, as
shown in FIG. 40B, a region in which the X electrode 210 and the Y
electrode 220 intersect with each other is formed such that each X
electrode 210 and each Y electrode 220 do not directly come into
contact with each other. In other words, an insulating layer 220r
is provided on the electrode wire portion 210p of the X electrode
210. Jumper wiring 220q is provided so as to step over the
insulating layer 220r. The electrode wire portion 220p is coupled
by the jumper wiring 220q.
[0314] FIG. 41 is a schematic cross-sectional view for describing a
configuration of the detection portion 20Cs according to this
embodiment. In the example shown in the figure, in the detection
portion 20Cs, a sub-electrode 210w1 and a sub-electrode 220w1, the
sub-electrode 220w1 and a sub-electrode 210w2, the sub-electrode
210w2 and a sub-electrode 220w2, the sub-electrode 220w2 and a
sub-electrode 210w 3, and the sub-electrode 210w 3 and a
sub-electrode 220w 3 are capacitively coupled to each other. In
other words, with the base material 211C being as a dielectric
layer, capacitances Cc11, Cc12, Cc13, Cc14, and Cc15 between the
sub-electrodes are configured to be variable in accordance with the
capacitive coupling between each of the metal film 12 and the
conductive layer 50 and the first and second electrode wires 210C
and 220C including sub-electrodes.
[0315] The configuration described above can make the second base
material of the electrode substrate and the adhesion layer
unnecessary and make it possible to contribute to a reduction in
thickness of the input device 100C. Further, the configuration
described above allows a large number of sub-electrodes to
capacitively couple to each other and shorten a distance between
the sub-electrodes capacitively coupled. This can increase the
amount of capacitive coupling of the input device 100C as a whole
and improve the detection sensitivity.
Fifth Embodiment
[0316] An input device 100D according to a fifth embodiment of the
present technology is different from that of the first embodiment
in that one of the X electrode 210 and the Y electrode 220 includes
multiple electrode groups and the other electrode includes a
flat-plate-shaped electrode.
First Structural Example
[0317] FIG. 42 is a schematic cross-sectional view of the input
device 100D according to this embodiment. As shown in the figure,
the input device 100D includes an operation member 10D, a
conductive layer 50, an electrode substrate 20D, a first support
30, and a second support 40. The conductive layer 50, the first
support 30, and the second support 40 each have substantially the
same configuration as the first embodiment, but the operation
member 10D and the electrode substrate 20D have configurations
different from those of the first embodiment. Specifically, the
operation member 10D does not include a metal film. Further, in the
electrode substrate 20D, multiple X electrodes (first electrode
wires) 210D are flat-plate-shaped electrodes and are disposed on
the operation member 10D side relative to multiple Y electrodes
(second electrode wires) 220D. The multiple Y electrodes 220D each
include multiple electrode groups 22Dw. Further, the electrode
substrate 20D is configured to be capable of electrostatically
detecting a change in distance from each of a conductive operating
element such as a user's finger and the conductive layer 50.
[0318] FIG. 43 is a schematic plan view showing an arrangement
example of the first and second structures 310 and 410, the X
electrodes 210D, and the Y electrodes 220D. As shown in the figure,
each of the X electrodes 210D is a strip-shaped electrode extending
in the Y-axis direction. Each of the Y electrodes 220D extends in
the X-axis direction and includes multiple electrode groups 22Dw.
The detection portion 20Ds is formed in an intersection region of
each X electrode 210D and each Y electrode and formed to be opposed
to each first structure 210, as in the first embodiment.
[0319] As shown in FIG. 42, the X electrode 210D is connected to a
drive-side (pulse-input side) terminal of the controller 710, for
example, and can be switched to a drive pulse potential in
detection and to a ground potential in standby state, for example.
This allows a shield effect to be exerted with respect to external
noise (external electric field). This allows a shield effect to be
kept with respect to external noise from the operation member 10D
side and a metal film to be omitted, even if the input device 100D
has a configuration in which the operation member 10D does not
include a metal film. Therefore, it is possible to achieve
simplification of the configuration and contribute to improvement
of productivity. It should be noted that X electrode 210E may be
connected to a ground potential irrespective of detection or
standby state.
[0320] Moreover, as in the first embodiment, the metal film 12 is
provided to the operation member 10 and connected to a ground
potential, and thus a stronger shield effect can be exerted. This
can make the detection portions 20Ds stable with respect to
external noise and make it possible to stably keep the detection
sensitivity.
Second Structural Example
[0321] FIG. 44 is a schematic cross-sectional view of an input
device 100E according to this embodiment. As shown in the figure,
the input device 100E includes an operation member 10, a back plate
50E, an electrode substrate 20E, a first support 30, and a second
support 40. The operation member 10, the first support 30, and the
second support 40 each have substantially the same configuration as
the first embodiment, but this embodiment is different from the
first embodiment in that the back plate 50E is provided instead of
the conductive layer and in the configuration of the electrode
substrate 20E.
[0322] The back plate 50E forms the lowermost part of the input
device 100E, like the conductive layer according to the first
embodiment, and is disposed to be opposed to a metal film
(conductive layer) 12 (second surface 120) in the Z-axis direction.
The back plate 50E functions as a support plate of the input device
100E and is formed to have higher bending rigidity than the
operation member 10 and the electrode substrate 20E, for example.
The material of the back plate 50E is not particularly limited as
long as a desired strength is obtained, and may be a resin plate
made of reinforced plastic, a metal plate, or the like. Moreover,
as described on the conductive layer in the first embodiment, the
back plate 50E may include step portions from the viewpoint of
enhancement of rigidity or may be formed to be mesh-like from the
viewpoint of radiation performance.
[0323] The electrode substrate 20E includes multiple X electrodes
(first electrode wires) 210E and multiple Y electrodes (second
electrode wires) 220E, as in the first embodiment. The Y electrodes
220E are flat-plate-shaped electrodes and are disposed on the back
plate 50E side relative to the multiple X electrodes 210E. The
multiple X electrodes 210E each include multiple electrode groups
21Ew. The electrode substrate 20E is configured to be capable of
electrostatically detecting a change in distance from the metal
film 12.
[0324] FIG. 45 is a schematic plan view showing an arrangement
example of the first and second structures 310 and 410, the X
electrodes 210E, and the Y electrodes 220E. As shown in the figure,
each of the X electrodes 210E extends in the Y-axis direction and
includes the multiple electrode groups 21Ew. Each of the Y
electrodes 220E is a wide strip-shaped electrode extending in the
X-axis direction. A detection portion 20Es is formed in an
intersection region of each X electrode 210E and each Y electrode
and formed to be opposed to each first structure 210, as in the
first embodiment.
[0325] As shown in FIG. 44, the Y electrode 220E is connected to a
drive-side (pulse-input side) terminal of the controller 710, for
example, and can be switched to a drive pulse potential in
detection and to a ground potential in standby state, for example.
This allows a shield effect to be exerted with respect to external
noise (external electric field). This allows a shield effect to be
kept with respect to external noise from the back plate 50E side
and the conductive plate 50E to be omitted, even if the input
device 100E has the back plate 50E as an insulator. Therefore, it
is possible to provide a configuration with which the material
selectivity of the back plate 50E is enhanced and which is
advantageous in terms of costs. It should be noted that the Y
electrodes 220E may be connected to a ground potential irrespective
of detection or standby state.
[0326] Moreover, forming the back plate 50E of a conductive plate
and connecting both of the Y electrodes 220E and the back plate 50E
to a ground potential allows a stronger shield effect to be
exerted. This can make the detection portions 20Es stable with
respect to external noise and make it possible to stably keep the
detection sensitivity.
[0327] It should be noted that in the second structural example,
the Y electrodes 220E are each configured to be flat-plate-shaped
and capable of detecting a change in distance between each of the
detection portions 20Es and the metal film 12. Thus, it is
desirable to provide a configuration in which the distance between
the detection portion 20Es and the metal film 12 can be largely
changed and the second structures 410 are opposed to the detection
portions 20Es, as shown in FIG. 25. Such a configuration can
provide larger detection sensitivity.
Modified Examples
Modified Example 1
[0328] FIG. 46 is a schematic plan view showing an electrode
configuration according to a modified example of the input device
100D (first configuration example). FIG. 46A shows a configuration
example of the X electrodes 210D, and FIG. 46B shows a
configuration example of the Y electrodes 220D. As shown in FIG.
46A, B, the X electrode 210D and the Y electrode 220D may include
unit electrode bodies 210Dm and unit electrode bodies 220Dm,
respectively. As shown in FIG. 46A, the unit electrode bodies 210Dm
of the X electrode 210D are each a flat-plate-shaped electrode, and
as shown in FIG. 46B, the unit electrode bodies 220Dm of the Y
electrodes 220D are each formed of multiple sub-electrodes 220Dw.
In this modified example, the multiple sub-electrodes 220Dw of each
unit electrode body 220D functions as an electrode group.
Modified Example 2
[0329] FIG. 47 is a schematic plan view showing an electrode
configuration according to a modified example of the input device
100E (second configuration example). FIG. 47A shows a configuration
example of the X electrodes 210E, and FIG. 47B shows a
configuration example of the Y electrodes 220E. As shown in FIG.
47A, B, the X electrode 210E and the Y electrode 220E may include
unit electrode bodies 210Em and unit electrode bodies 220Em,
respectively, as in the modified example 1. As shown in FIG. 47A,
the unit electrode bodies 210Em of the X electrode 210E are each
formed of multiple sub-electrodes 210Ew, and as shown in FIG. 47B,
the unit electrode bodies 220Em of the Y electrode 220E are each a
flat-plate-shaped electrode. In this modified example, the multiple
sub-electrodes 210Ew of each unit electrode body 210E functions as
an electrode group.
Other Modified Examples
[0330] In this embodiment, the configurations of the X electrodes
210D and 210E and the Y electrodes 220D and 220E are not limited to
those described above, and both of the X electrodes 210D and 210E
and the Y electrodes 220D and 220E may be formed of
flat-plate-shaped electrodes.
Sixth Embodiment
[0331] FIG. 48A is a perspective view showing an example of the
outer appearance of an input device 100F according to a sixth
embodiment of the present technology. FIG. 48B is an enlarged
cross-sectional view when viewed from the B-B direction of FIG.
48A. The input device 100F according to the sixth embodiment has a
cylindrical shape as a whole. Therefore, a first surface 110F as an
input operation surface has a cylindrical surface. Other
configurations of the input device 100F are similar to those of the
input device 100 according to the first embodiment.
[0332] An electrode substrate 20F includes multiple detection
portions 20Fs that are two-dimensionally arrayed in an in-plane
direction of the cylindrical shape. FIG. 48A shows an example in
which the multiple detection portions 20Fs are two-dimensionally
arrayed in a circumferential direction and an axial direction
(height direction) of the electrode substrate 20F having the
cylindrical shape. Further, in the example shown in FIG. 48A, first
and second frames 320F and 420F are disposed in the circumferential
direction of the upper and lower ends of the cylinder. This can
enhance the strength of the entire input device 100F.
[0333] As shown in FIG. 48B, the input device 100F according to
this embodiment has such a shape that the input device 100 of FIG.
1 is curved with the first surface 110 (110F) facing out. In other
words, the input device 100F includes an operation member 10F, a
conductive plate 50F, an electrode substrate 20F, a first support
30F, and a second support 40F, and is formed by those constituent
elements curved into a cylindrical shape.
[0334] Even such an input device 100F can enhance the detection
sensitivity of the first surface 110F at the time of an input
operation, and can be used as a touch sensor or a keyboard device.
It should be noted that the shape of the entire input device 100F
is not limited to the cylindrical shape. For example, the shape may
be a flattened cylindrical shape, and the cross section may be a
rectangular cylindrical shape. Further, FIG. 48A shows an example
in which the first and second frames 320F and 420F are disposed
only in the circumferential direction of the upper and lower ends
of the cylinder, but the arrangement is not limited thereto. The
first and second frames 320F and 420F may be disposed along a
longitudinal direction (height direction of the cylinder). This can
make it possible to provide stronger support.
Modified Example 1
[0335] FIG. 49A is a perspective view showing an example of a
configuration of an input device 100F according to a modified
example of the sixth embodiment of the present technology. The
input device 100F according to this modified example has a curved
shape as a whole. In other words, the input device 100F has a
configuration of a curved rectangular input device. Therefore, a
first surface 110F as an input operation surface has a curved
shape. Further, an electrode substrate (not shown) includes
multiple detection portions 20Fs that are two-dimensionally arrayed
in an in-plane direction of the cylindrical shape. It should be
noted that the entire shape of the input device 100F is not limited
to the example shown in FIG. 49A and can be formed into a desired
curved shape.
Modified Example 2
[0336] FIG. 49B is a perspective view showing an example of a
configuration of an input device 100F according to a modified
example of the sixth embodiment of the present technology. In the
input device 100F according to this modified example, two sensor
devices each formed into a semicircular shape are coupled to each
other to form one input device 100F. In other words, the input
device 100F includes two detection regions 200 corresponding to the
respective sensor devices and is formed into a cylindrical shape as
a whole. It should be noted that the number of detection regions
200 is not limited and three or more detection regions 200 may be
included. Further, the shape of the entire input device 100F is
also not limited to the cylindrical shape. For example, the input
device 100F may include four detection regions 200 and may be
formed to have a rectangular cylindrical cross section such that
the four detection regions 200 form the respective surfaces.
[0337] Hereinabove, the embodiments of the present technology have
been described, but the present technology is not limited to the
embodiments described above and can be variously modified without
departing from the gist of the present technology as a matter of
course.
[0338] For example, the input device may not include the metal film
and may detect a capacitance change of a detection portion due to
capacitive coupling between each of the operating element and the
conductive layer and the X and Y electrodes. In this case, a
flexible sheet (see second embodiment) made of an insulating
material can be used as an operation member. With such a
configuration as well, the first and second supports can change a
distance from each of the operating element and the conductive
layer and the detection portion, to obtain an input device with
high detection accuracy for an operation position and a pressing
force.
[0339] Further, in the embodiments described above, the detection
portions are disposed immediately below the first structures, but
are not limited thereto. For example, the detection portions may be
formed to be opposed to the respective second structures or may be
disposed at positions where the detection portions are not opposed
to any of the first and second structures. Such configurations also
allow highly accurate detection of an operation position and a
pressing force as in the embodiments described above.
[0340] In the embodiments described above, the detection portions
each form a capacitive element of the mutual capacitance system,
but may form a capacitive element of a self-capacitance system. In
this case, an input operation can be detected based on the amount
of capacitance change between each of the metal film and the
conductive layer and an electrode layer included in the detection
portion.
[0341] In the embodiments described above, the first space portion
is disposed between the multiple first structures, and the second
space portion is disposed between the multiple second structures,
but the space portions are not limited to this configuration. For
example, a region corresponding to all or part of the multiple
first and second space portions may be filled with an elastic
material or the like. The elastic material or the like for filling
is not particularly limited as long as it does not hinder the
electrode substrate, the operation member, and the like from being
deformed.
[0342] Further, the first and second supports 30 and 40 may not
include the first and second frames 320 and 330.
[0343] Further, the input device is not limited to the
flat-plate-shaped configuration or the configuration described in
the sixth embodiment, and may be formed to have a plate shape
having a first surface of an indefinite shape, for example. In
other words, the sensor device of the present technology is
flexible as a whole and thus a mounting method with a high degree
of freedom is achieved.
[0344] It should be noted that the present technology can have the
following configurations. [0345] (1) A sensor device,
including:
[0346] a deformable sheet-shaped first conductive layer;
[0347] a second conductive layer that is disposed to be opposed to
the first conductive layer;
[0348] an electrode substrate that includes multiple first
electrode wires and multiple second electrode wires and is disposed
to be deformable between the first conductive layer and the second
conductive layer, the multiple second electrode wires being
disposed to be opposed to the multiple first electrode wires and
intersecting with the multiple first electrode wires;
[0349] a first support that includes multiple first structures, the
multiple first structures connecting the first conductive layer and
the electrode substrate; and
[0350] a second support that includes multiple second structures,
the multiple second structures connecting the second conductive
layer and the electrode substrate. [0351] (2) A sensor device,
including:
[0352] a deformable sheet-shaped first conductive layer;
[0353] a second conductive layer that is disposed to be opposed to
the first conductive layer;
[0354] an electrode substrate that includes multiple first
electrode wires and multiple second electrode wires, the multiple
second electrode wires being disposed to be opposed to the multiple
first electrode wires and intersecting with the multiple first
electrode wires, the electrode substrate being disposed to be
deformable between the first conductive layer and the second
conductive layer and being capable of electrostatically detecting a
change in distance from each of the first conductive layer and the
second conductive layer;
[0355] a first support that includes multiple first structures and
a first space portion, the multiple first structures connecting the
first conductive layer and the electrode substrate, the first space
portion being formed between the multiple first structures; and
[0356] a second support that includes multiple second structures
and a second space portion, the multiple second structures being
each disposed between the first structures adjacent to each other
and connecting the second conductive layer and the electrode
substrate, the second space portion being formed between the
multiple second structures. [0357] (3) The sensor device according
to (1) or (2), in which
[0358] the electrode substrate further includes multiple detection
portions, each of the multiple detection portions being formed in
each of intersection regions of the multiple first electrode wires
and the multiple second electrode wires and having a capacitance
variable in accordance with a relative distance from each of the
first conductive layer and the second conductive layer. [0359] (4)
The sensor device according to (3), in which the multiple detection
portions are formed to be opposed to the multiple first structures.
[0360] (5) The sensor device according to (3), in which the
multiple detection portions are formed to be opposed to the
multiple second structures. [0361] (6) The sensor device according
to any one of (1) to (5), in which
[0362] the first support includes a first frame, the first frame
connecting the first conductive layer and the electrode substrate
and being disposed along a circumferential edge of the electrode
substrate, and
[0363] the second support includes a second frame, the second frame
connecting the second conductive layer and the electrode substrate
and being disposed to be opposed to the first frame. [0364] (7) The
sensor device according to any one of (1) to (6), in which
[0365] the second conductive layer includes a step portion. [0366]
(8) The sensor device according to (1), in which
[0367] the electrode substrate is configured to be capable of
electrostatically detecting a change in distance from each of the
first conductive layer and the second conductive layer. [0368] (9)
The sensor device according to (1) or (8), in which
[0369] the first support further includes a first space portion,
the first space portion being formed between the multiple first
structures. [0370] (10) The sensor device according to any one of
(1), (8), and (9), in which
[0371] the second support further includes a second space portion,
the second space portion being formed between the multiple second
structures. [0372] (11) The sensor device according to any one of
(1), (2), and (8) to (10), in which
[0373] each of the multiple first electrode wires includes multiple
first unit electrode bodies, the multiple first unit electrode
bodies each including multiple first sub-electrodes,
[0374] each of the multiple second electrode wires includes
multiple second unit electrode bodies, the multiple second unit
electrode bodies each including multiple second sub-electrodes and
being opposed to the multiple first unit electrode bodies, and
[0375] the electrode substrate includes [0376] a base material, the
multiple first electrode wires and the multiple second electrode
wires being disposed on the base material, and [0377] multiple
detection portions in which the multiple first sub-electrodes of
each of the first unit electrode bodies and the multiple second
sub-electrodes of each of the second unit electrode bodies are
opposed to each other in an in-plane direction of the electrode
substrate. [0378] (12) An input device, including:
[0379] a deformable sheet-shaped operation member that includes a
first surface and a second surface, the first surface receiving an
operation by a user, the second surface being on the opposite side
to the first surface;
[0380] a conductive layer that is disposed to be opposed to the
second surface;
[0381] an electrode substrate that includes multiple first
electrode wires and multiple second electrode wires and is disposed
to be deformable between the operation member and the conductive
layer, the multiple second electrode wires being disposed to be
opposed to the multiple first electrode wires and intersecting with
the multiple first electrode wires;
[0382] a first support that includes multiple first structures, the
multiple first structures connecting the operation member and the
electrode substrate; and
[0383] a second support that includes multiple second structures,
the multiple second structures connecting the conductive layer and
the electrode substrate. [0384] (13) An input device,
including:
[0385] a deformable sheet-shaped operation member that includes a
first surface and a second surface, the first surface receiving an
operation by a user, the second surface being on the opposite side
to the first surface;
[0386] a first conductive layer that is disposed to be opposed to
the second surface;
[0387] an electrode substrate that includes multiple first
electrode wires and multiple second electrode wires, the multiple
second electrode wires being disposed to be opposed to the multiple
first electrode wires and intersecting with the multiple first
electrode wires, the electrode substrate being disposed to be
deformable between the operation member and the first conductive
layer and being capable of electrostatically detecting a change in
distance from the first conductive layer;
[0388] a first support that includes multiple first structures and
a first space portion, the multiple first structures connecting the
operation member and the electrode substrate, the first space
portion being formed between the multiple first structures; and
[0389] a second support that includes multiple second structures
and a second space portion, the multiple second structures being
each disposed between the first structures adjacent to each other
and connecting the first conductive layer and the electrode
substrate, the second space portion being formed between the
multiple second structures. [0390] (14) The input device according
to (12), in which
[0391] the operation member further includes a second conductive
layer that is formed on the second surface, and
[0392] the detection substrate is capable of electrostatically
detecting a change in distance from each of the first conductive
layer and the second conductive layer. [0393] (15) The input device
according to (12) or (13), in which the operation member includes a
display unit. [0394] (16) The input device according to (12) or
(13), in which the operation member includes multiple key regions.
[0395] (17) The input device according to (16), in which
[0396] the electrode substrate further includes multiple detection
portions, each of the multiple detection portions being formed in
each of intersection regions of the multiple first electrode wires
and the multiple second electrode wires and having a capacitance
variable in accordance with a relative distance from the first
conductive layer. [0397] (18) The input device according to (17),
further including a control unit that is electrically connected to
the electrode substrate and is capable of generating information on
an input operation with respect to each of the multiple key regions
based on outputs of the multiple detection portions. [0398] (19)
The input device according to any one of (16) to (18), in which
[0399] the multiple first structures are disposed along boundaries
between the multiple key regions. [0400] (20) The input device
according to any one of (12) to (19), in which
[0401] the multiple first electrode wires are flat-plate-shaped
electrodes and are disposed on the operation member side relative
to the multiple second electrode wires, and
[0402] each of the multiple second electrode wires includes
multiple electrode groups. [0403] (21) An input device,
including:
[0404] a deformable sheet-shaped operation member that includes a
first surface, a second surface, and a metal film, the first
surface receiving an operation by a user, the second surface being
on the opposite side to the first surface, the metal film being
formed on the second surface;
[0405] a back plate that is disposed to be opposed to the second
surface;
[0406] an electrode substrate that includes multiple first
electrode wires and multiple second electrode wires, the multiple
second electrode wires being disposed to be opposed to the multiple
first electrode wires and intersecting with the multiple first
electrode wires, the electrode substrate being disposed to be
deformable between the operation member and the back plate and
being capable of electrostatically detecting a change in distance
from the metal film;
[0407] a first support that includes multiple first structures and
a first space portion, the multiple first structures connecting the
operation member and the electrode substrate, the first space
portion being formed between the multiple first structures; and
[0408] a second support that includes multiple second structures
and a second space portion, the multiple second structures being
each disposed between the first structures adjacent to each other
and connecting the back plate and the electrode substrate, the
second space portion being formed between the multiple second
structures. [0409] (22) The input device according to (21), in
which
[0410] the multiple second electrode wires are flat-plate-shaped
electrodes and are disposed on the back plate side relative to the
multiple first electrode wires, and
[0411] each of the multiple first electrode wires includes multiple
electrode groups. [0412] (23) An electronic apparatus,
including:
[0413] a deformable sheet-shaped operation member that includes a
first surface and a second surface, the first surface receiving an
operation by a user, the second surface being on the opposite side
to the first surface;
[0414] a conductive layer that is disposed to be opposed to the
second surface;
[0415] an electrode substrate that includes multiple first
electrode wires and multiple second electrode wires, the multiple
second electrode wires being disposed to be opposed to the multiple
first electrode wires and intersecting with the multiple first
electrode wires, the electrode substrate being disposed to be
deformable between the operation member and the conductive layer
and being capable of electrostatically detecting a change in
distance from the conductive layer;
[0416] a first support that includes multiple first structures and
a first space portion, the multiple first structures connecting the
operation member and the electrode substrate, the first space
portion being formed between the multiple first structures;
[0417] a second support that includes multiple second structures
and a second space portion, the multiple second structures being
each disposed between the first structures adjacent to each other
and connecting the conductive layer and the electrode substrate,
the second space portion being formed between the multiple second
structures; and
[0418] a controller including a control unit that is electrically
connected to the electrode substrate and is capable of generating
information on an input operation with respect to each of the
multiple operation members based on an output of the electrode
substrate.
DESCRIPTION OF SYMBOLS
[0419] 1 sensor device
[0420] 100, 100A, 100B, 100C, 100D, 100E, 100F input device
[0421] 10, 10A, 10B, 10D, 1OF operation member
[0422] 11 flexible display (display unit)
[0423] 12 metal film (first conductive layer)
[0424] 20, 20A, 20D, 20E, 20F electrode substrate
[0425] 20s, 20Cs, 20Ds detection portion
[0426] 210 first electrode wire
[0427] 220 second electrode wire
[0428] 30, 30F first support
[0429] 310 first structure
[0430] 320 first frame
[0431] 330 first space portion
[0432] 40, 40F second support
[0433] 410 second structure
[0434] 420 second frame
[0435] 430 second space portion
[0436] 50, 50B, 50C conductive layer (second conductive layer)
[0437] 50E, 50F back plate
[0438] 51, 51B, 51C step portion
[0439] 60 control unit
[0440] 70, 70B electronic apparatus
[0441] 710 controller
* * * * *