U.S. patent application number 15/241678 was filed with the patent office on 2017-12-21 for heat dissipation device.
The applicant listed for this patent is TAI-SOL ELECTRONICS CO., LTD.. Invention is credited to Ming-Quan CUI, Chuan-Chi TSENG, Yun-Yeu YEH.
Application Number | 20170363367 15/241678 |
Document ID | / |
Family ID | 56997807 |
Filed Date | 2017-12-21 |
United States Patent
Application |
20170363367 |
Kind Code |
A1 |
YEH; Yun-Yeu ; et
al. |
December 21, 2017 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device includes: a heat spreader having a
first plate and a second plate, wherein the plates are connected to
form a receiving space therebetween; a first capillary material
provided on the first plate, the second plate, or both; at least
one heat pipe having a cavity in communication with the receiving
space, wherein the heat pipe is connected to the heat spreader at
one end and is outside the heat spreader and closed at the other
end; a second capillary material provided on the inner wall of the
heat pipe; at least one fiber bundle of an elongated shape, wherein
the fiber bundle has a portion in the receiving space and in
contact with the first capillary material and another portion
extending into the cavity and in contact with the second capillary
material; and a working fluid in the receiving space and the
cavity.
Inventors: |
YEH; Yun-Yeu; (TAIPEI CITY,
TW) ; TSENG; Chuan-Chi; (TAIPEI CITY, TW) ;
CUI; Ming-Quan; (TAIPEI CITY, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TAI-SOL ELECTRONICS CO., LTD. |
Taipei City |
|
TW |
|
|
Family ID: |
56997807 |
Appl. No.: |
15/241678 |
Filed: |
August 19, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/427 20130101;
F28F 21/085 20130101; F28F 1/32 20130101; F28F 2255/18 20130101;
H01L 23/3672 20130101; F28D 15/0258 20130101; F28F 3/02 20130101;
F28D 15/0266 20130101; F28F 2210/02 20130101; F28D 2021/0028
20130101; F28D 15/046 20130101; F28D 15/0233 20130101; F28F 3/12
20130101 |
International
Class: |
F28D 15/04 20060101
F28D015/04; F28F 21/08 20060101 F28F021/08; F28F 3/02 20060101
F28F003/02; F28D 15/02 20060101 F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 21, 2016 |
TW |
105209273 |
Claims
1. A heat dissipation device, comprising: a heat spreader having a
first plate and a second plate, wherein the first plate and the
second plate are connected to form a receiving space therebetween,
and the receiving space is defined with a heated area; a first
capillary material provided on either or both of the first plate
and the second plate and located in the heated area; at least one
heat pipe having a cavity in communication with the receiving
space, wherein the heat pipe has an end connected to the heat
spreader and an opposite end located outside the heat spreader and
closed; a second capillary material provided on an inner wall of
the heat pipe; at least one fiber bundle of an elongated shape,
wherein the fiber bundle has a portion located in the receiving
space and another portion extending into the cavity, the portion of
the fiber bundle that is located in the receiving space is provided
on either or both of the first plate and the second plate and is in
contact with the first capillary material, and the portion of the
fiber bundle that extends into the cavity is in contact with the
second capillary material on the inner wall of the heat pipe; and a
working fluid in the receiving space and the cavity.
2. The heat dissipation device of claim 1, wherein the heat pipe
extends through a fin assembly.
3. The heat dissipation device of claim 1, wherein the first
capillary material is composed of sintered copper powder or a woven
net.
4. The heat dissipation device of claim 1, wherein the second
capillary material is composed of sintered copper powder, a woven
net, or a groove.
5. The heat dissipation device of claim 1, wherein the receiving
space further has a partition formed with a plurality of channels,
the partition abuts against a portion of the first plate and a
portion of the second plate and separates the heated area from the
cavity, the heated area and the cavity are in communication with
each other through the channels, and the fiber bundle is provided
in some of the channels.
6. The heat dissipation device of claims 1, wherein the heat pipe
does not correspond in position to the heated area.
7. The heat dissipation device of claim 5, wherein the heat pipe
does not correspond in position to the heated area.
Description
BACKGROUND OF THE INVENTION
1. Technical Field
[0001] The present invention relates to heat dissipation techniques
and more particularly to a heat dissipation device incorporating a
heat spreader and a heat pipe.
2. Description of Related Art
[0002] With the advancement of technology, and in order to satisfy
user needs, many electronic products are designed in pursuit of
ever better performance, and because of that, the heat generated by
the electronic components inside those products is increasing. To
effectively address the issue of high heat, heat spreaders and heat
pipes are typically used, both of which feature good thermal
conductivity. A heat dissipation device, for instance, may include
a combination of a heat spreader and a heat pipe.
[0003] Taiwan Patent No. M286564 discloses a temperature-uniforming
heat dissipator that includes a heat spreader, a plurality of heat
pipes, and a fin assembly. The heat spreader has an upper plate, a
lower plate, and a cavity formed between the plates. The heat
pipes, each having an interior space, are fixed on the upper plate
of the heat spreader and are mounted with the fin assembly. The
temperature-uniforming heat dissipator is characterized mainly in
that the interior spaces of the heat pipes are in communication
with the cavity of the heat spreader.
[0004] As is well known in the art, a heat pipe or heat spreader
has capillary structures for guiding the flow of a working fluid to
achieve heat circulation, wherein the capillary structures are
generally composed of sintered copper powder. In the
temperature-uniforming heat dissipator of the afore-cited patent,
the lower plate of the heat spreader provides a surface for contact
with a heat source, and when the working fluid evaporates into a
gaseous state and enters the heat pipes, the heat of the working
fluid dissipates outward through the pipe walls and the fins. The
temperature-uniforming heat dissipator, therefore, relies on a good
working fluid to maintain efficient heat dissipation. Moreover, to
ensure that the working fluid flows by capillary action, the heat
spreader and the inner wall of each heat pipe of the
temperature-uniforming heat dissipator must be provided with
uninterrupted capillary structures, so an additional processing
step is required to connect the capillary structures at the curved
joints between the heat spreader and the heat pipes. This
additional step, however, complicates the manufacturing process.
Also, capillary structures composed of sintered copper powder
cannot effectively transport a working fluid over a long
distance.
[0005] To overcome the aforesaid drawbacks, the applicant believes
that the foregoing temperature-uniforming heat dissipator needs
improvement in heat conduction.
BRIEF SUMMARY OF THE INVENTION
[0006] In view of the drawbacks of the prior art, the primary
objective of the present invention is to provide a heat dissipation
device in which a heat spreader and a heat pipe are connected by a
fiber bundle, and which is highly efficient in heat dissipation
because the fiber bundle can transport a working fluid over a long
distance with a high mass flux.
[0007] The heat dissipation device of the present invention
includes a heat spreader, a first capillary material, at least one
heat pipe, a second capillary material, at least one fiber bundle,
and a working fluid. The heat spreader has a first plate and a
second plate, and these two plates are connected to form a
receiving space therebetween, wherein the receiving space is
defined with a heated area. The first capillary material is
provided on either or both of the first plate and the second plate
and is located in the heated area. The heat pipe has a cavity in
communication with the receiving space. One end of the heat pipe is
connected to the heat spreader, and the other end of the heat pipe
is located outside the heat spreader and is closed. The second
capillary material is provided on the inner wall of the heat pipe.
The fiber bundle has an elongated shape. A portion of the fiber
bundle is in the receiving space while another portion of the fiber
bundle extends into the cavity. The portion of the fiber bundle
that is in the receiving space is provided on either or both of the
first plate and the second plate and is in contact with the first
capillary material. The portion of the fiber bundle that is in the
cavity is in contact with the second capillary material on the
inner wall of the heat pipe. The working fluid is in the receiving
space and the cavity.
[0008] In the present invention, at least one fiber bundle, which
is known to be capable of transporting a working fluid over a long
distance with a high mass flux, is connected to both the first
capillary material in the heated area and the second capillary
material in the cavity to enhance heat dissipation efficiency,
allowing the heat dissipation device of the present invention to
overcome the drawbacks of the conventional improvements made to
heat dissipators, particularly an increase in product size or cost
and inconveniences in manufacture and use that result from the only
conventional solution of increasing the number, or modifying the
structure, of fins, heat pipes, or heat spreaders.
[0009] Preferably, the location where the heat pipe is provided
does not correspond to that of the heated area.
[0010] The heat dissipation device of the present invention allows
the joint between the heat spreader and the heat pipe to be changed
in position according to user needs, thereby providing greater
convenience in manufacture and use than the prior art.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0011] The technical features of the present invention are detailed
below with reference to some preferred embodiments in conjunction
with the accompanying drawings, in which:
[0012] FIG. 1 is a perspective view of the first preferred
embodiment of the present invention;
[0013] FIG. 2 is a bottom perspective view of the first preferred
embodiment of the present invention, with the first plate
removed;
[0014] FIG. 3 is a section view taken long line 3-3 in FIG. 1;
[0015] FIG. 4 is a bottom view of the first preferred embodiment of
the present invention, with the first plate removed;
[0016] FIG. 5 is a bottom view of the second preferred embodiment
of the present invention, with the first plate removed;
[0017] FIG. 6 is a sectional view taken along line 6-6 of FIG.
5;
[0018] FIG. 7 is a bottom perspective view of the third preferred
embodiment of the present invention, with the first plate
removed;
[0019] FIG. 8 is a bottom view of the third preferred embodiment of
the present invention, with the first plate removed; and
[0020] FIG. 9 is a sectional view taken along line 9-9 in FIG.
8.
DETAILED DESCRIPTION OF THE INVENTION
[0021] Referring to FIG. 1 to FIG. 4, the first preferred
embodiment of the present invention provides a heat dissipation
device 10 composed essentially of a heat spreader 11, a first
capillary material 12, at least one heat pipe 13, a second
capillary material 14, at least one fiber bundle 15, and a working
fluid (not shown).
[0022] The heat spreader 11 has a first plate 111 and a second
plate 112. The first plate 111 and the second plate 112 are
connected in a sealing manner to form a receiving space 113
therebetween. The receiving space 113 is defined with a heated area
H. The heat spreader 11 is further provided with an exhaust pipe
16. One end of the exhaust pipe 16 is located in the heat spreader
11 and is in communication with the receiving space 113. The other
end of the exhaust pipe 16 is located outside the heat spreader 11
and is closed.
[0023] The first capillary material 12 is located in the heated
area H. The first capillary material 12 may be provided on the
first plate 111, the second plate 112, or both plates 111 and 112.
In this embodiment, the first capillary material 12 is provided on
the second plate 112 by way of example. Besides, the first
capillary material 12 may be composed of sintered copper powder or
a woven net. In this embodiment, for instance, the first capillary
material 12 is composed of sintered copper powder.
[0024] There are three heat pipes 13 in this embodiment. Each heat
pipe 13 has a cavity 131 in communication with the receiving space
113. Moreover, each heat pipe 13 has one end connected to the heat
spreader 11 and the other end outside the heat spreader 11 and
closed. The heat pipes 13 in this embodiment do not correspond in
position to the heated area H, but it is totally alright that they
do. In addition, the heat pipes 13 are inserted through a fin
assembly 17.
[0025] The second capillary material 14 is provided on the inner
wall of each heat pipe 13 and may be composed of sintered copper
powder, a woven net, or a groove. In this embodiment, for example,
the second capillary material 14 is composed of sintered copper
powder.
[0026] There are three fiber bundles 15 in this embodiment. The
fiber bundles 15 are elongated in shape, are partially located in
the receiving space 113, and partially extend into the cavities 131
of the heat pipes 13. The portions of the fiber bundles 15 that are
in the receiving space 113 may be provided on the first plate 111,
the second plate 112, or both plates 111 and 112, and in this
embodiment are provided on the second plate 112 for example. These
portions of the fiber bundles 15 are in contact with first
capillary material 12 in the heated area H. Meanwhile, the portions
of the fiber bundles 15 that are in the cavities 131 are in contact
with the second capillary material 14 in the heat pipes 13.
[0027] The working fluid is in the receiving space 113 and the
cavity 131 of each heat pipe 13 and is uniformly contained in the
first capillary material 12, the second capillary material 14, and
the fiber bundles 15. The working fluid is well known in the art
and difficult to show in the drawings and therefore will not be
further described herein.
[0028] Having described the structure of the first preferred
embodiment, the present specification continues to explain how the
first preferred embodiment is used.
[0029] To use the heat dissipation device 10, referring to FIG. 1
through FIG. 4, the heated area H is brought into contact with a
heat source (not shown) such that the temperature of the heated
area H increases. Due to the rise of temperature, the working fluid
contained in the first capillary material 12 evaporates into a
gaseous state and permeates the receiving space 113. The gaseous
working fluid then flows from the receiving space 113 to the cavity
131 of each heat pipe 13. In the meantime, the heat carried by the
gaseous working fluid is conducted through the walls of the heat
pipes 13 to the fin assembly 17 and dissipates outward. After that,
the cooled gaseous working fluid condenses into a liquid state, is
contained in the second capillary material 14, then flows back to
the first capillary material 12 in the heated area H through the
fiber bundles 15 by capillary action, and is contained in the first
capillary material 12 again. The heat circulation mechanism
described above enables the heat dissipation device 10 of the
present invention to dissipate heat.
[0030] It can be known from the description of the first preferred
embodiment that the fiber bundles 15 in the heat dissipation device
10 are connected to both the first capillary material 12 in the
heated area H and the second capillary material 14 in the cavities
131. Hence, by virtue of the long-distance working fluid
transportation ability of the fiber bundles 15 and the high mass
flux of the working fluid through the fiber bundles 15, the heat
dissipation device 10 has higher heat conduction efficiency than
its prior art counterparts, in particular the aforementioned
temperature-uniforming heat dissipator, whose capillary structures
are formed by sintered copper powder.
[0031] The first preferred embodiment also shows that the heat
dissipation device 10 of the present invention allows the heat
pipes 13 to be connected to whichever part of the heat spreader 11
as needed, thus bringing about greater convenience in manufacture
and use.
[0032] FIG. 5 and FIG. 6 show the heat dissipation device 20
provided by the second preferred embodiment of the present
invention. The second preferred embodiment is generally the same as
the first preferred embodiment except that the fiber bundles 25
abut against the first plate 211 and the second plate 212, and that
the first capillary material 22 is provided on the first plate
211.
[0033] The heat dissipation device 20 disclosed in the second
preferred embodiment is so configured that, with the fiber bundles
25 abutting against the first plate 211 as well as the second plate
212, a heat source (not shown) to be in contact with the heated
area H2 can be brought into contact with either or both of the
first plate 211 and the second plate 212 in the heated area H2. The
only adjustment to be made is to have the first capillary material
22 in the heated area H2 correspond in position to the heat source.
Since such an adjustment involves no other changes in structure or
appearance, the aforesaid structural modification can be
implemented with ease. The basic heat dissipation mechanism can be
achieved even without the first capillary material 22, although the
presence of the first capillary material 22 leads to higher heat
dissipation efficiency. The functions of the other components are
the same as those in the first preferred embodiment and therefore
will not be described repeatedly.
[0034] FIG. 7 to FIG. 9 show the heat dissipation device 30
provided by the third preferred embodiment of the present
invention. The third preferred embodiment is generally the same as
the first preferred embodiment except that there are two heat pipes
33 and one fiber bundle 35; that the receiving space 313 further
has a plurality of partitions 38 formed with a plurality of
channels 39; that the partitions 38 are provided between and abut
against the first plate 311 and the second plate 312 and separate
the heated area H3 from the cavities 331; that the partitions 38 do
not abut against the heated area H3, the channels 39, or the joints
between the cavities 331 and the receiving space 313; that the
heated area H3 and the cavities 331 of the heat pipes 33 are in
communication with each other only through the channels 39; that
the fiber bundle 35 is partially in contact with the first
capillary material 32 and partially extends into the heat pipes 33
through any two channels 39; and that the two ends of the fiber
bundle 35 are in contact with the second capillary material 34. The
functions of the other components are the same as those in the
first preferred embodiment and therefore will not be described
repeatedly.
[0035] The heat dissipation device 30 disclosed in third preferred
embodiment is so configured that the partitions 38 abutting against
the first plate 311 and the second plate 312 provide the heat
dissipation device 30 with additional structural support. Moreover,
with the fiber bundle 35 extending through only some of the
channels 39, the working fluid is guided through the channels 39
where the fiber bundle 35 extends when in a liquid state, and flows
through the channels 39 where the fiber bundle 35 is absent when in
a gaseous state. Thus, the partitions 38 formed with the channels
39 not only reinforce the heat dissipation device 30 structurally,
but also are effective in guiding the liquid-state portion and the
gaseous portion of the working fluid through different channels 39,
preventing the high-speed gaseous portion from interfering with the
reflow of the working fluid; consequently, high thermal conduction
efficiency can be achieved.
* * * * *