U.S. patent application number 15/182205 was filed with the patent office on 2017-12-14 for gasket for an electronic device.
The applicant listed for this patent is Apple Inc.. Invention is credited to Erik G. DE JONG, Maegan K. SPENCER, Katherine E. TONG.
Application Number | 20170359913 15/182205 |
Document ID | / |
Family ID | 60516467 |
Filed Date | 2017-12-14 |
United States Patent
Application |
20170359913 |
Kind Code |
A1 |
SPENCER; Maegan K. ; et
al. |
December 14, 2017 |
GASKET FOR AN ELECTRONIC DEVICE
Abstract
An electronic device having an enclosure and a cover is
disclosed. The cover may be secured with the enclosure by a sealing
element, or gasket. In response to using the sealing element to
secure the cover with the enclosure, the sealing element may
elastically deform. The elastic deformation may cause portions of
the sealing element to extend into undercut regions of the cover
and of the enclosure to form a first locking feature and a second
locking feature, respectively. The first locking feature and the
second locking feature may combine to provide a retaining force
that retains the cover with the enclosure. Also, the first locking
feature and the second locking feature may also provide a
counterforce to a force applied to the electronic device (for
example, dropping the electronic device) that prevents the cover
from becoming unsecured from the enclosure.
Inventors: |
SPENCER; Maegan K.; (Emerald
Hills, CA) ; TONG; Katherine E.; (San Francisco,
CA) ; DE JONG; Erik G.; (San Francisco, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Apple Inc. |
Cupertino |
CA |
US |
|
|
Family ID: |
60516467 |
Appl. No.: |
15/182205 |
Filed: |
June 14, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F 1/1626 20130101;
G04G 17/02 20130101; G04G 17/08 20130101; H05K 5/0217 20130101;
H05K 5/03 20130101; G06F 1/163 20130101; G06F 1/1656 20130101; H05K
5/0221 20130101 |
International
Class: |
H05K 5/02 20060101
H05K005/02; H05K 5/03 20060101 H05K005/03 |
Claims
1. An electronic device, comprising: an enclosure having an opening
and an enclosure undercut surrounding the opening; a cover carried
by the enclosure at the opening, the cover comprising a cover
undercut; and a sealing element securing the cover with the
enclosure by extending to engage: 1) the enclosure undercut to
define a first locking feature and 2) the cover undercut to define
a second locking feature, wherein the first locking feature and the
second locking feature combine to retain the cover with the
enclosure.
2. The electronic device of claim 1, wherein the sealing element,
in response to a force provided by at least one of the enclosure
and the cover, elastically deforms to engage the enclosure undercut
and the cover undercut.
3. The electronic device of claim 1, wherein the enclosure
comprises a support member that receives the cover, and wherein the
cover extends beyond the sealing element to engage the support
member such the sealing element is enclosed between the cover and
the enclosure.
4. The electronic device of claim 1, wherein the enclosure
comprises a threaded region that combines with the enclosure under
to define an interface region that at least partially engages the
sealing element.
5. The electronic device of claim 1, wherein the sealing element is
secured with the enclosure by an adhesive.
6. The electronic device of claim 1, wherein the enclosure
comprises a flange region that compresses the sealing element, and
wherein the enclosure undercut is located at the opening in regions
other than the flange region.
7. The electronic device of claim 1, wherein the cover extends
radially outward beyond the sealing element to engage the enclosure
such that the sealing element is hidden from view.
8. The electronic device of claim 1, wherein the sealing element
comprises a first chamfered region that deforms to define the
second locking feature that engages the enclosure undercut.
9. An electronic device, comprising: a first part; a second part;
and a sealing element disposed between the first part and the
second part, the sealing element elastically deforming in a first
direction and a second direction opposite the first direction when
the first part is coupled with the second part.
10. The electronic device of claim 9, wherein the first part
comprises an undercut, and wherein the sealing element at least
partially extends into the undercut.
11. The electronic device of claim 10, wherein the second part
comprises a second undercut, and wherein the sealing element at
least partially extends into the second undercut.
12. The electronic device of claim 9, wherein the second part
comprises a support member that receives the first part, and
wherein the first part extends radially outward beyond the sealing
element to engage the support member such the sealing element is
enclosed between the first part and the second part.
13. The electronic device of claim 9, wherein the first part
comprises ceramic, and wherein the second part comprises sapphire
that includes an undercut that at least partially receives the
sealing element.
14. The electronic device of claim 9, wherein the sealing element
comprises: a first surface that engages the first part; a second
surface parallel with respect to the first surface; and a chamfered
region angled with the respect to the first surface and the second
surface.
15. A method for assembling an electronic device having an
enclosure that includes an opening and an enclosure undercut
surrounding the opening, the method comprising: coupling a sealing
element with a cover; and coupling the sealing element and the
cover with the enclosure at the opening, the cover comprising a
cover undercut, wherein coupling the cover with the enclosure
causes the sealing element to extend and engage: 1) the cover
undercut to define a first locking feature and 2) the enclosure
undercut to define a second locking feature.
16. The method of claim 15, further comprising: forming a threaded
region on the enclosure along the opening; and engaging the sealing
element with the enclosure at the threaded region.
17. The method of claim 15, further comprising: forming a flange
region on the enclosure along the opening; and engaging a recessed
region of the sealing element with the enclosure at the flange
region.
18. The method of claim 15, wherein coupling the cover with the
enclosure at the opening comprises coupling the cover with a
support member of the enclosure, wherein the cover extends radially
outward beyond the sealing element to engage the support member
such the sealing element is enclosed between the cover and the
enclosure.
19. The method of claim 15, further comprising heating the sealing
element to melt the sealing element into the enclosure
undercut.
20. The method of claim 15, further comprising polishing the
enclosure to define a polished region having a first roughness,
wherein a remaining region of the enclosure comprises a second
roughness greater than the first roughness, and wherein the sealing
element passes along the enclosure at the polished region.
Description
FIELD
[0001] The following description relates to electronic devices. In
particular, the following description relates to coupling together
parts of an electronic device together by a gasket, or seal, that
also provides a locking feature that retains the parts in a coupled
manner.
BACKGROUND
[0002] An electronic device may include an enclosure and a cover
secured to the enclosure. The cover allows for added features of
the electronic device. For example, the cover may protect internal
components of the electronic device. An adhesive may be used to a
primary bond to secure the cover to the housing.
[0003] However, using an adhesive to provide the primary bond
between the transparent piece of material and the housing has
several drawbacks. For example, adhesives tend to break down when
exposed to heat. Further, when the electronic device is a wearable
electronic device, the adhesive may be exposed to skin oils as well
as topical formulas placed on the skin, either of which may break
down the adhesive bond formed by the adhesive. Further, when the
electronic device is dropped, a load or force applied to the
electronic device (from the drop) may cause the transparent piece
of material to disengage from the housing.
SUMMARY
[0004] In one aspect, an electronic device is described. The
electronic device may include an enclosure having an opening and an
enclosure undercut surrounding the opening. The electronic device
may further include a cover carried by the enclosure at the
opening. The cover may include a cover undercut. The electronic
device may further include a sealing element securing the cover
with the enclosure by extending to engage: 1) the enclosure
undercut to define a first locking feature and 2) the cover
undercut to define a second locking feature. In some embodiments,
the first locking feature and the second locking feature combine to
retain the cover with the enclosure.
[0005] In another aspect, an electronic device is described. The
electronic device may include a first part. The electronic device
may further include a second part. The electronic device may
further include a sealing element disposed between the first part
and the second part. The sealing element may elastically deform in
a first direction and a second direction opposite the first
direction when the first part is coupled with the second part.
[0006] In another aspect, a method for assembling an electronic
device having an enclosure that includes an opening and an
enclosure undercut surrounding the opening is described. The method
may include coupling a sealing element with a cover. The method may
further include coupling the sealing element and the cover with the
enclosure at the opening. The cover may include a cover undercut.
In some embodiments, coupling the cover with the enclosure causes
the sealing element to extend and engage: 1) the cover undercut to
define a first locking feature and 2) the enclosure undercut to
define a second locking feature.
[0007] Other systems, methods, features and advantages of the
embodiments will be, or will become, apparent to one of ordinary
skill in the art upon examination of the following figures and
detailed description. It is intended that all such additional
systems, methods, features and advantages be included within this
description and this summary, be within the scope of the
embodiments, and be protected by the following claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The disclosure will be readily understood by the following
detailed description in conjunction with the accompanying drawings,
wherein like reference numerals designate like structural elements,
and in which:
[0009] FIG. 1 illustrates an isometric view of an embodiment of an
electronic device, in accordance with some described
embodiments;
[0010] FIG. 2 illustrates a front view of an alternate embodiment
of an electronic device, in accordance with some described
embodiments;
[0011] FIG. 3 illustrates a rear isometric view of the electronic
device shown in FIG. 1, showing a cover of the electronic
device;
[0012] FIG. 4 illustrates a rear exploded view of the electronic
device shown in FIG. 1, showing a sealing element designed to
secure the cover with the enclosure;
[0013] FIG. 5 illustrates a partial cross sectional view of the
electronic device shown in FIG. 4, showing the sealing element
secured with the cover;
[0014] FIG. 6 illustrates a cross sectional view of the electronic
device shown in FIG. 5, showing the cover prior to securing with
the enclosure;
[0015] FIG. 7 illustrates a cross sectional view of the electronic
device shown in FIG. 6, showing the cover secured with the
enclosure;
[0016] FIG. 8 illustrates a plan view of an alternate embodiment of
an electronic device having an enclosure with several flange
regions, in accordance with some described embodiments;
[0017] FIG. 9 illustrates a partial cross sectional view of the
electronic device shown in FIG. 8;
[0018] FIG. 10 illustrates a plan view an alternate embodiment of
an electronic device that includes an enclosure having a chamfered
region after undergoing a polishing operation, in accordance with
some described embodiments;
[0019] FIG. 11 illustrates a cross sectional view of the electronic
device shown in FIG. 10, showing a cover prior to securing with the
enclosure;
[0020] FIG. 12 illustrates a cross sectional view of the electronic
device shown in FIG. 11, showing the cover secured with the
enclosure;
[0021] FIG. 13 illustrates a partial cross sectional view an
alternate embodiment of an electronic device having an enclosure
with a threaded region, in accordance with some described
embodiments;
[0022] FIG. 14 illustrates a cross sectional view of the electronic
device shown in FIG. 13, showing a cover prior to securing with the
enclosure;
[0023] FIG. 15 illustrates a cross sectional view of the electronic
device shown in FIG. 14, showing the cover secured with the
enclosure;
[0024] FIG. 16 illustrates a cross sectional view of an alternate
embodiment of an electronic device having a sealing element with a
protruding feature corresponding to an indented region of an
enclosure of the electronic device, in accordance with some
described embodiments;
[0025] FIG. 17 illustrates a cross sectional view of the electronic
device shown in FIG. 16, showing the cover secured with the
enclosure;
[0026] FIG. 18 illustrates a cross sectional view of an alternate
embodiment of an electronic device having a sealing element with a
rectilinear configuration, in accordance with some described
embodiments;
[0027] FIG. 19 illustrates a cross sectional view of the electronic
device shown in FIG. 18, showing the cover secured with the
enclosure 602;
[0028] FIG. 20 illustrates a cross sectional view of an alternate
embodiment of an electronic device having a sealing element with a
protruding feature at an alternate location, with the protruding
feature having a shape corresponding to a shape of an indented
region of an enclosure of the electronic device, in accordance with
some described embodiments;
[0029] FIG. 21 illustrates a cross sectional view of the electronic
device shown in FIG. 20, showing the cover engaging the protruding
feature to secure the cover with the enclosure;
[0030] FIG. 22 illustrates a cross sectional view of an alternate
embodiment of an electronic device having a sealing element secured
with a cover, showing the cover prior to securing with an enclosure
of the electronic device, in accordance with some embodiments;
[0031] FIG. 23 illustrates a cross sectional view of the electronic
device shown in FIG. 22, showing the cover secured with the
enclosure;
[0032] FIG. 24 illustrates a cross sectional view of the electronic
device shown in FIG. 23, showing a heating element engaging the
sealing element to at least partially melt the sealing element;
[0033] FIG. 25 illustrates a cross sectional view of the electronic
device shown in FIG. 24, with the heating element removed
subsequent to melting the sealing element;
[0034] FIG. 26 illustrates an exploded view of an alternate
embodiment of an electronic device having a sealing element used
with an outer protective cover and a display assembly of the
electronic device, in accordance with some described
embodiments;
[0035] FIG. 27 illustrates a cross sectional view of the electronic
device shown in FIG. 26, showing the outer protective layer secured
with the enclosure;
[0036] FIG. 28 illustrates a flowchart showing a method for forming
an electronic device having an enclosure that includes an opening
and an enclosure undercut surrounding the opening, in accordance
with some described embodiments; and
[0037] FIG. 29 illustrates a flowchart showing a method for
assembling an electronic device, in accordance with some described
embodiments.
[0038] Those skilled in the art will appreciate and understand
that, according to common practice, various features of the
drawings discussed below are not necessarily drawn to scale, and
that dimensions of various features and elements of the drawings
may be expanded or reduced to more clearly illustrate the
embodiments of the present invention described herein.
DETAILED DESCRIPTION
[0039] Reference will now be made in detail to representative
embodiments illustrated in the accompanying drawings. It should be
understood that the following descriptions are not intended to
limit the embodiments to one preferred embodiment. To the contrary,
it is intended to cover alternatives, modifications, and
equivalents as can be included within the spirit and scope of the
described embodiments as defined by the appended claims.
[0040] In the following detailed description, references are made
to the accompanying drawings, which form a part of the description
and in which are shown, by way of illustration, specific
embodiments in accordance with the described embodiments. Although
these embodiments are described in sufficient detail to enable one
skilled in the art to practice the described embodiments, it is
understood that these examples are not limiting such that other
embodiments may be used, and changes may be made without departing
from the spirit and scope of the described embodiments.
[0041] The following disclosure relates to a sealing element, or
gasket, designed to secure together structural components of an
electronic device. For example, the sealing element may couple
together a cover with an enclosure of the electronic device. The
sealing element may not only provide securing means between the
components, but also prevent ingress of contaminants (such as
liquids) from entering the electronic device at an interface region
between the sealing element and the enclosure, and at an interface
region between the sealing element and the cover. In some
instances, the sealing element is initially installed on the cover
by, for example, press fitting the sealing element onto the cover.
The press fitting may stretch the sealing element and cause the
sealing element to secure with the cover by frictional forces.
Then, the combination of the cover and the sealing element may be
inserted into an opening of the enclosure designed to receive the
cover and the sealing element.
[0042] The sealing element may provide an enhanced alternative to
adhesive bonds used to secure components of traditional electronic
devices. For example, the sealing element may include a material
(or materials) having an elasticity that causes the sealing
element, in response to an applied force caused by the cover and/or
the enclosure, to elastically deform to regions of the cover and/or
enclosure that are engaged with the sealing element. The sealing
element may also provide a counterforce against both the cover and
the enclosure, thereby retaining the cover with the enclosure while
the sealing element is under compression. However, in some cases,
the cover and enclosure may include an undercut region that allows
the sealing element to extend into and engage the respective
undercut regions. "Undercut" or "undercut region" as used
throughout this detailed description and in the claims refers to a
space formed by the removal or absence of material from a
structural component, thereby defining a recessed portion in the
structural component. For example, the enclosure may include an
undercut region formed by removing material from the enclosure. As
non-limiting examples, material removal means may include cutting
operations performed by computer number controller ("CNC") tools
and laser cutting tools.
[0043] The undercut regions being free of material minimize or
prevent compression forces to the sealing element, thereby allowing
some portions of the sealing element to extend outward respect to
the sealing element, into the undercut regions. The outward
extension may include a radially outward extension. This may
enhance the ability of the sealing element to retain the cover with
the enclosure. For example, when sealing element elastically
deforms to extend into (or at least partially extend into) an
undercut region of the cover, the extended portion of the sealing
element may provide a lock, or locking feature, between the sealing
element and the cover. Further, the sealing element can also
elastically deform to extend into (or at least partially extend
into) an undercut region of the enclosure can provide a second
lock, or second locking feature, between the sealing element and
the enclosure. In this manner, in addition to provide a retaining
force under compression, the sealing element further provides
locking features by extending outward into undercut regions of the
cover and the enclosure.
[0044] These and other embodiments are discussed below with
reference to FIGS. 1-29. However, those skilled in the art will
readily appreciate that the detailed description given herein with
respect to these Figures is for explanatory purposes only and
should not be construed as limiting.
[0045] FIG. 1 illustrates an isometric view of an embodiment of an
electronic device 100, in accordance with some described
embodiments. In some embodiments, the electronic device 100 is a
tablet computer device. In the embodiment shown in FIG. 1, the
electronic device 100 is a mobile wireless communication device,
such as a smartphone. As shown, the electronic device 100 may
include an enclosure 102. The enclosure 102 may be formed from a
metal, such as steel (including stainless steel), steel alloy,
aluminum, or aluminum alloy. Alternatively, the enclosure 102 may
be formed from non-metal materials, such as ceramic or rigid
plastic, as non-limiting examples. The electronic device 100 may
further include a display assembly 104 designed to present visual
information in the form of illuminated images, text, or the like.
The display assembly 104 may be covered by an outer protective
layer 106 that may be formed from a transparent material, such as
glass, sapphire, crystal, or the like. The display assembly 104 may
respond to a depression or force at the outer protective layer 106
by generating an input to a processor circuit (not shown) disposed
in an internal cavity defined by the enclosure 102. In this regard,
the display assembly 104 may operate in conjunction with a sensor
system (not shown). The input caused by the depression or force to
the outer protective layer 106 may cause the processor circuit to
execute a program stored on a memory circuit (not shown) and alter
the visual information presented on the display assembly 104. Also,
the electronic device 100 may include an internal power supply (not
shown), such as a battery, that provides electrical current to the
processor circuit and the memory circuit. In addition, the
electronic device 100 may include an input feature 108 designed for
actuation by a user to generate a command to the processor circuit.
In some embodiments, the input feature 108 is a moving or sliding
switch. In other embodiments, the input feature 108 is a dial or
rotary mechanism. In the embodiment shown in FIG. 1, the input
feature 108 is a button that is actuated by a depression or
force.
[0046] Further, an electronic device described in this detailed
description may take other forms. For example, FIG. 2 illustrates a
front view of an alternate embodiment of an electronic device 180,
in accordance with some described embodiments. As shown, the
electronic device 180 may include an enclosure 182, a display
assembly 184, and an outer protective layer 186. The enclosure 182,
display assembly 184, and outer protective layer 186 may include
any material or feature previously described for an enclosure,
display assembly, and outer protective layer, respectively. Also,
the electronic device 180 may include a first input feature 188 and
a second input feature 190, both of which may be designed to
provide a command to a processor circuit (not shown) in response to
actuation by a user. The first input feature 188 and/or the second
input feature 190 may include any feature or features previously
described for an input feature of an electronic device.
[0047] Also, in the embodiment shown in FIG. 2, the electronic
device 180 is a wearable electronic device. In this regard, the
electronic device 180 may include a feature designed to secure the
electronic device 180 around an appendage (such as a wrist) of a
user. For example, the electronic device 180 may include a first
band 164 and a second band 166. The first band 164 and the second
band 166 may combine to wrap around the appendage and interlock
together. Also, although not shown, the enclosure 182 may include a
first cavity and a second cavity to receive the first band 164 and
the second band 166, respectively.
[0048] FIG. 3 illustrates a rear isometric view of the electronic
device 100 shown in FIG. 1, showing a cover 112 of the electronic
device 100. The cover 112 may be disposed in an opening 114 of the
enclosure 102 and secured with the enclosure 102 by a sealing
element, or gasket (not shown). This will be shown and described in
detail below.
[0049] In some embodiments, the cover 112 is formed from an opaque
material and prevents or obscures light passage. However, the cover
112 may include one or more openings. In this regard, a transparent
material 122 may be positioned behind the cover 112 and at a
location corresponding to the openings. The transparent material
122 allows light transmission through the openings of the cover
112. The transparent material 122 may include sapphire, glass,
crystal, or the like. In this regard, the cover 112 may be used by
the electronic device 100 as a protective cover for internal
components while allowing a detection mechanism disposed inside the
electronic device 100 to transmit light through the cover 112 (by
way of the transparent material 122) and receive at least some of
the light, reflected back by an object, in order to collect data.
For example, in some embodiments, the detection mechanism includes
a light transmitter 124 and a light receiver 126. The openings of
the cover 112, along with the transparent material 122, permit
light transmission by the light transmitter 124 through the cover
112 and may also permit light provided from the light transmitter
124 to reflect and return through the cover 112 to the light
receiver 126. A processor circuit (not shown) may be designed to
execute a program on a memory circuit (not shown) that uses the
light received by the light receiver 126 to determine various
characters. For example, when the electronic device 100 is used as
a wearable electronic device (such as the electronic device 180
shown in FIG. 2), the electronic device 100 may be positioned such
that the light transmitter 124 and the light receiver 126 are
facing an appendage of a user, allowing the electronic device 100
to collect data about the user by light transmitted by the light
transmitter 124 and received by the light receiver 126. Also, a
battery (not shown) may be used to supply electrical current to the
light transmitter 124, the light receiver 126, the processor
circuit, and the memory circuit. Also, it should be noted that the
electronic device 180 (shown in FIG. 2) may include several
features--including the cover 112, the light transmitter 124, and
the light receiver 126--shown and described for the electronic
device 100. While a specific transmitter/receiver pair are shown
and described, other various detection mechanisms are possible.
[0050] FIG. 4 illustrates a rear exploded view of the electronic
device 100 shown in FIG. 1, showing a sealing element 130 designed
to secure the cover 112 with the enclosure 102. For purposes of
simplicity, several internal components (such as a processor
circuit and a memory circuit) of the electronic device 100 are
removed. The sealing element 130 may include a body designed to
compress in response to a force provided by the cover 112 and/or
the enclosure 102 when the cover 112 is coupled with the enclosure
102 (shown later). However, when compressed, the sealing element
130 may provide a counterforce to retain the cover 112 with the
enclosure 102. This not only provides a retaining force for the
cover 112 to maintain coupling with the enclosure 102, but also
provides ingress protection against contaminants at the interface
between the sealing element 130 and the cover 112, as well as the
interface between the sealing element 130 and the enclosure
102.
[0051] While the sealing element 130 may include the aforementioned
compressible properties, the sealing element 103 may also return to
its original size and shape when the compression forces are
removed. Also, in some embodiments, the sealing element 130 is
formed from polytetrafluoroethylene ("PTFE"). In other embodiments,
the sealing element 130 is formed from ethylene tetrafluoroethylene
("ETFE"). Still, in other embodiments, the sealing element 130 is
formed from a viscoelastic material such that the sealing element
130 both viscous to resist at least some shear stresses and elastic
to at least partially deform. Other elastically deformable
materials may be used to form the sealing element 130.
[0052] FIG. 5 illustrates a partial cross sectional view of the
electronic device 100 shown in FIG. 4, showing the sealing element
130 secured with the cover 112. Several components are removed for
purpose of simplicity. As shown, the sealing element 130 may be fit
onto the cover 112 prior to securing the cover 112 with the
enclosure 102. The elastic properties of the sealing element 130
allow the sealing element to be press fit onto the cover 112, and
the sealing element 130 may be frictionally coupled with the cover
112. However, in addition to press fitting the sealing element 130
onto the cover 112, the sealing element 130 may also be adhesively
secured with the cover 112 by an adhesive (not shown). Also,
although not shown, the sealing element 130 may be secured with the
enclosure 102 prior to securing with the cover 112.
[0053] FIG. 6 illustrates a cross sectional view of the electronic
device 100 shown in FIG. 5, showing the cover 112 prior to securing
with the enclosure 102. In some embodiments, the sealing element
130 includes a generally rounded cross section. However, as shown
in the enlarged view, the sealing element 130 may include a
multi-sided cross section. This may facilitate installation of
cover 112 with the enclosure 102. For example, the sealing element
130 may include a chamfered region 132 that facilities sliding the
sealing element 130 along the enclosure 102. Further, the enclosure
102 may include a chamfered region 142 that further facilitates
movement of the sealing element 130 along the enclosure 102. The
described chamfered regions may define regions free of material
that limit forces acting on the structural components. For example,
the chamfered region 132 of the sealing element 130 and the
chamfered region 142 of the enclosure 102 may limit or prevent
axial forces (in either direction denoted by a two-sided arrow 170)
from damaging the sealing element 130 during installation.
[0054] Additional structural modifications may be used to
facilitate installation and retain the cover 112 with the enclosure
102. For example, the cover 112 may include an undercut region 134,
or cover undercut, formed by removing material from the cover 112.
Also, the enclosure 102 may also include an undercut region 144, or
enclosure undercut, formed by removing material from the enclosure
102. The aforementioned undercut regions may allow the sealing
element 130 to extend, or at least partially extend, into the cover
112 and the enclosure 102 in locations corresponding to their
respective undercut regions. This will be shown and described
below. Further, the enclosure 102 may include a support member 146,
or support, designed to receive and engage the cover 112. Also,
although a cross section is shown, the remaining regions of the
cover 112 and the enclosure 102 may generally be consistent with
the cross section. While the aforementioned undercut regions are
described as being formed by removing material, in some embodiments
(not shown), the undercut regions are formed by a molding operation
used to form the structural components having the undercut regions.
For example, in some embodiments, the undercut region 144 of the
enclosure 102 is formed based on a mold cavity (not shown) use to
form the enclosure 102 such that the undercut region 144 is formed
with the enclosure 102.
[0055] FIG. 7 illustrates a cross sectional view of the electronic
device 100 shown in FIG. 6, showing the cover 112 secured with the
enclosure 102. When the cover 112 is installed in the enclosure 102
(as shown in FIG. 7), the enclosure 102 and the cover 112 may
provide radial compressions forces to the sealing element 130. For
example, the enclosure 102 may provide a radial compression force
to the sealing element 130 in a direction (denoted by an arrow 192)
toward the cover 112. Conversely, the cover 112 may provide a
radial compression force to the sealing element 130 in a direction
(denoted by an arrow 194) toward the enclosure 102.
[0056] In response to the aforementioned radial compression forces,
the sealing element 130 may provide a counterforce against the
radial compression forces. For example, the sealing element 130 may
provide counterforces opposite the direction of the arrow 192 and
also opposite the direction of the arrow 194. Further, the sealing
element 130 may expand along areas that do not undergo compression
forces. For example, as shown in FIG. 7, the sealing element 130
may extend into the undercut region 134 of the cover 112, thereby
forming a first locking feature 152. The first locking feature 152
may include a portion of the sealing element 130 positioned in the
undercut region 134 of the cover 112. The first locking feature 152
may also provide a mechanical coupling between the sealing element
130 and the cover 112. Further, the sealing element 130 may extend
into the undercut region 144 of the enclosure 102, thereby forming
a second locking feature 154. The second locking feature 154 may
include a portion of the sealing element 130 positioned in the
undercut region 144 of the enclosure 102. The second locking
feature 154 may also provide a mechanical coupling between the
sealing element 130 and the enclosure 102. Together, the first
locking feature 152 and the second locking feature 154 may provide
a mechanical force that retains the cover 112 with the enclosure
102, and may counter forces acting in a direction denoted by an
arrow 196.
[0057] Also, as shown in FIG. 7, the sealing element 130 may
include an interface region 160 defined as region of the sealing
element 130 engages both the enclosure 102 and the cover 112. In
order to maximize ingress protection for a device, traditional
devices (such as watches) may include an increased interface region
(as compared to the interface region 160). Accordingly, traditional
devices may not include undercuts and/or chamfers. However, the
first locking feature 152 and the second locking feature 154 may
provide additional protection, in terms of sealing and securing,
for the electronic device 100, and the interface region 160 may
provide the same or similar ingress protection as traditional
devices having no undercuts or chamfered regions. Also, the
interface region 160 may expand to include a region or regions
associated with an interface between the first locking feature 152
and the cover 112, and also an interface region between the second
locking feature 154 and the enclosure 102. Optionally, the
electronic device 100 may further include an adhesive layer 158 to
secure the sealing element 130 (including the second locking
feature 154) with the enclosure 102. This may further improve
protection against ingress.
[0058] Also, traditional devices may position a sealing element
between a cover and an enclosure such that the sealing element is
exposed to the ambient environment. However, as shown in FIG. 7,
the cover 112 may extend radially outward beyond the sealing
element 130 to engage the enclosure 102 at the support member 146
such that the cover 112 and the enclosure 102 combine to shield the
sealing element 130 from the ambient environment. In this manner,
the cover 112 and the enclosure 102 may limit or prevent the
sealing element 130 from exposure to factors that may cause the
sealing element 130 to break down, such as sunlight, chemicals,
oils, or the like. Accordingly, the cover 112 may combine with the
enclosure 102 to hide the sealing element 130.
[0059] FIG. 8 illustrates a plan view of an alternate embodiment of
an electronic device 200 having an enclosure with several flange
regions, in accordance with some described embodiments. As shown,
the electronic device 200 may include an enclosure 202 having
multiple flange regions, such as a first flange region 212, a
second flange region 214, a third flange region 216, and fourth
flange region 218. Also, the aforementioned flange regions may be
located at an opening 204 of the enclosure 202, with the opening
204 designed to receive a cover (not shown). While a discrete
number of flange regions are shown, the number of flange regions
may differ in other embodiments.
[0060] The flange regions may provide increased surface area of the
enclosure 202, which may in turn increase an interface region
between the enclosure 202 and a sealing element. For example, FIG.
9 illustrates a partial cross sectional view of the electronic
device 200 shown in FIG. 8. Several components of the electronic
device 200 removed for purpose of simplicity. However, the
electronic device 200 may include any component previously
described for an electronic device. Also, the electronic device 200
may include a sealing element 230 designed to engage the enclosure
202 and seal a cover (not shown) with the enclosure 202.
Accordingly, the aforementioned flange region of enclosure 202 may
cause additional compression to the sealing element 230. Also, as
shown in the enlarged view, the enclosure 202 may include an
undercut 244 extending along the opening 204 in locations other
than the flange regions. In this regard, the flange regions, having
no undercut region, provide additional material to facilitate
compression of the sealing element 230 in order to enhance the
sealing effect thereby improving ingress protection.
[0061] FIG. 10 illustrates a plan view an alternate embodiment of
an electronic device 300 that includes an enclosure 302 having a
chamfered region 342 after undergoing a polishing operation, in
accordance with some described embodiments. As shown, the chamfered
region 342 may include a polished surface such that the chamfered
region 342 includes a smoother surface as compared to remaining
surfaces of the enclosure. Conversely, the chamfered region 342 may
include a polished surface such that the chamfered region 342
includes a roughness less than the remaining surfaces of the
enclosure 302.
[0062] Having a relatively smooth surface, the chamfered region 342
may facilitate installation of a sealing element-cover combination
to an enclosure. For example, FIG. 11 illustrates a cross sectional
view of the electronic device 30 shown in FIG. 10, showing a cover
312 prior to securing with the enclosure 302. As shown, during
installation of the cover 312, the enclosure 302 may be designed
such that the sealing element 330 initially engages the chamfered
region 342. In this regard, the chamfered region 342 may be
referred to as a "leading edge." Due in part to the smooth,
polished finish of the chamfered region 342, the chamfered region
342 allows the sealing element 330 to slide along the enclosure
302, as the frictional forces of the chamfered region 342 are
reduced based on the aforementioned polishing operation. Also, in
some embodiments, the sealing element 330 includes a chamfered
region. In the embodiment shown in FIG. 11, the sealing element 330
does not include a chamfered region, as the chamfered region 342,
having a smooth finish, provides sufficient enablement of the
sealing element 330 to slide along the enclosure 302.
[0063] FIG. 12 illustrates a cross sectional view of the electronic
device 300 shown in FIG. 11, showing the cover 312 secured with the
enclosure 302. The enclosure 302 and the cover 312 may provide
radial compression forces to the sealing element 330. The enclosure
302 and the cover 312 may also include undercut regions. In this
regard, similar to a manner previously described, the radial
compression forces provided by the enclosure 302 and the cover 312
may cause the sealing element 330 to extend into an undercut region
334 of the cover 312 to form a first locking feature 352, and an
undercut region 344 of the enclosure 302 to form a second locking
feature 354.
[0064] FIG. 13 illustrates a partial cross sectional view an
alternate embodiment of an electronic device 400 having an
enclosure 402 with a threaded region 410, in accordance with some
described embodiments. Several components of the electronic device
400 are removed for purposes of simplicity. However, the electronic
device 400 may include several features and components previously
described for an electronic device. The threaded region 410 may
provide a non-planar surface that provides an enhanced attachment
with a sealing element (not shown). As shown in the enlarged view,
the threaded region 410 may include several threads, similar to
those of a threaded fastener.
[0065] FIG. 14 illustrates a cross sectional view of the electronic
device 400 shown in FIG. 13, showing a cover 412 prior to securing
with the enclosure 402. As shown in the enlarged view, a sealing
element 430 may include elastic properties that cause the sealing
element 430 to deform when the cover 412 is secured with the
enclosure 402, and in particular, with the threaded region 410. The
sealing element 430 may include any material or property previously
described for a sealing element.
[0066] FIG. 15 illustrates a cross sectional view of the electronic
device 400 shown in FIG. 14, showing the cover 412 secured with the
enclosure 402. The enclosure 402 and the cover 412 may provide
radial compression forces to the sealing element 430. The enclosure
402 and the cover 412 may also include undercut regions. In this
regard, similar to a manner previously described, the radial
compression forces provided by the enclosure 402 and the cover 412
may cause the sealing element 430 to extend into an undercut region
434 of the cover 412 to form a first locking feature 452, and an
undercut region 444 of the enclosure 402 to form a second locking
feature 454. Also, as shown in FIG. 15, the radial compression
forces may cause the sealing element 430 to extend into the
threaded region 410 of the enclosure 402, thereby by forming a
mechanical attachment between the sealing element 430 and the
enclosure 402. This may provide additional resistance against a
force to the electronic device 400 that would otherwise cause the
cover 412 to decouple from the enclosure 402. Also, in some
embodiments (not shown), the enclosure 402 includes a roughened
region that replaces the threaded region 410. The roughened region
may provide additional frictional forces between the enclosure 402
and the sealing element 430. The roughened region of the enclosure
402 may be formed by, for example, sandblasting the enclosure
402.
[0067] Rather than several threads, an enclosure may include a
single indented feature. For example, FIG. 16 illustrates a cross
sectional view of an alternate embodiment of an electronic device
500 having a sealing element 530 with a protruding feature 532 and
an enclosure 502 with an indented region 506, in accordance with
some described embodiments. As shown in the enlarged view, the
indented region 506 may include a size and shape generally
corresponding to that of the protruding feature 532. Several
components of the electronic device 500 are removed for purposes of
simplicity. However, the electronic device 500 may include several
features and components previously described for an electronic
device.
[0068] FIG. 17 illustrates a cross sectional view of the electronic
device 500 shown in FIG. 16, showing the cover 512 secured with the
enclosure 502. As shown, the enclosure 502 and the cover 512 may
provide radial compression forces to the sealing element 530. The
enclosure 502 and the cover 512 may also include undercut regions.
In this regard, similar to a manner previously described, the
radial compression forces provided by the enclosure 502 and the
cover 512 may cause the sealing element 530 to extend into an
undercut region 534 of the cover 512 to form a first locking
feature 552, and an undercut region 544 of the enclosure 502 to
form a second locking feature 554. Also, as shown in FIG. 17, the
radial compression forces may cause the sealing element 530, and
particular, the protruding feature 532, to extend into the indented
region 506 of the enclosure 502, thereby by forming a mechanical
attachment between the sealing element 530 and the enclosure 502.
Further, the indented region 506 and the protruding feature 532 are
shaped to counter forces to the electronic device 500 that would
otherwise cause the cover 512 to decouple from the enclosure 502.
It should be noted that the sealing element 530 may be compressed
at the protruding feature 532 in order for the cover 512 to couple
with the enclosure 502.
[0069] In another embodiment, the enclosure, rather than the
sealing element, may include a protruding feature. For example,
FIG. 18 illustrates a cross sectional view of an alternate
embodiment of an electronic device 600 having a sealing element 630
with a rectilinear configuration, in accordance with some described
embodiments. Several components of the electronic device 600 are
removed for purposes of simplicity. However, the electronic device
600 may include several features and components previously
described for an electronic device. As shown in the enlarged view,
the enclosure 602 may include a protruding feature 632 designed to
engage the sealing element 630 when the cover 612 is secured with
the enclosure 602. Also, the cover 612 may include an undercut
region 634. Generally, the protruding feature 632 and the undercut
region 634 are centrally located at a surface of their respective
components. However, the protruding feature 632 and the undercut
region 634 may be positioned in other locations.
[0070] FIG. 19 illustrates a cross sectional view of the electronic
device 600 shown in FIG. 18, showing the cover 612 secured with the
enclosure 602. As shown, when the cover 612 is secured with the
enclosure 602, the enclosure 602 and the cover 612 may provide
compression forces to the sealing element 630 to alter its
appearance. For example, the enclosure 602, and in particular, the
protruding feature 632, may provide a force that elastically
deforms the sealing element 630 around the protruding feature 632.
This may provide a locking means that prevents or limits movement
of the sealing element 630 relative to the enclosure 602. Also, the
cover 612 may provide a force that deforms the sealing element 630,
causing the sealing element 630 to at least partially extend into
the undercut region 634 and define a locking feature 652, thereby
preventing or limiting movement of the cover 612 with respect to
the sealing element 630.
[0071] Rather than a protruding feature that is centrally located
(shown in FIGS. 16-19), a protruding feature of a sealing element
may be in other locations. For example, FIG. 20 illustrates a cross
sectional view of an alternate embodiment of an electronic device
700 having a sealing element 730 with a protruding feature 732 at
an alternate location, with the protruding feature having a shape
corresponding to an indented region 706 of an enclosure 702 of the
electronic device 700, in accordance with some described
embodiments. Several components of the electronic device 700 are
removed for purposes of simplicity. However, the electronic device
700 may include several features and components previously
described for an electronic device. As shown in the enlarged view,
the indented region 706 having a size and shape generally
corresponding to that of a protruding feature 732 of the sealing
element 730. Also, due in part to the size of the protruding
feature 732 and its location on the sealing element 730, the
sealing element 730 may be installed on the enclosure 702 prior to
receiving a cover 712. In this regard, the sealing element 730 may
enter through an internal region of the enclosure 702 to engage the
indented region 706.
[0072] FIG. 21 illustrates a cross sectional view of the electronic
device 700 shown in FIG. 20, showing the cover 712 engaging the
protruding feature 732 to secure the cover 712 with the enclosure
702. The cover 712 may be secured with the enclosure 702 and
sealing element 730 in a process subsequent to the sealing element
730 being secured with the enclosure 702. As shown, the enclosure
702 and the cover 712 may provide radial compression forces to the
sealing element 730. The enclosure 702 may also include an undercut
region. In this regard, similar to a manner previously described,
the radial compression forces provided by the enclosure 702 and the
cover 712 may cause the sealing element 730 to extend into an
undercut region 734 of the cover 712 to form a first locking
feature 752. Also, as shown in FIG. 21, the radial compression
forces may cause the sealing element 730, and particular, the
protruding feature 732, to extend into the indented region 706 of
the enclosure 702, thereby by forming an additional locking feature
by a mechanical attachment between the sealing element 730 and the
enclosure 702. Further, the indented region 706 and the protruding
feature 732 are shaped to counter forces to the electronic device
700 that would otherwise cause the cover 712 to decouple from the
enclosure 702. It should be noted that the sealing element 730 may
be compressed at the protruding feature 732 in order for the cover
712 to couple with the enclosure 702.
[0073] The sealing elements may deform by methods other than just
radial compression. For example, FIGS. 22-25 describe a method for
applying heat to deform a sealing element by melting the sealing
element. This may be referred to as a heat staking process. The
sealing element shown in FIGS. 22-25 may be oversized, then melted
to conform to other features of an electronic device.
[0074] FIG. 22 illustrates a cross sectional view of an alternate
embodiment of an electronic device 800 having a sealing element 830
secured with a cover 812, showing the cover 812 prior to securing
with an enclosure 802 of the electronic device 800, in accordance
with some embodiments. As shown, the sealing element 830 may extend
beyond the cover 812. Also, several components of the electronic
device 800 are removed for purposes of simplicity. However, the
electronic device 800 may include several features and components
previously described for an electronic device.
[0075] FIG. 23 illustrates a cross sectional view of the electronic
device shown in FIG. 22, showing the cover 812 secured with the
enclosure 802. As shown, the sealing element 830 may engage both
the enclosure 802 and the cover 812. Further, the sealing element
830 may extend beyond the enclosure 802. While the cover 812 and/or
the enclosure 802 may apply radial compression forces, the sealing
element 830 may include a size and a shape that provides minimal
engagement with the cover 812 and/or the enclosure 802. Thing may
facilitate installing and securing the cover 812 with the enclosure
802, as the sealing element 830 may readily slide along the
enclosure 802.
[0076] FIG. 24 illustrates a cross sectional view of the electronic
device 800 shown in FIG. 23, showing a heating element 860 engaging
the sealing element 830 to at least partially melt the sealing
element 830. The heating element 860 may provide sufficient heat to
melt the sealing element 830, causing the sealing element 830 to
reduce in size and become co-planar, or flush, with respect to a
surface of the enclosure 802 and a surface of the cover 812, as
shown in FIG. 24. FIG. 25 illustrates a cross sectional view of the
electronic device 800 shown in FIG. 24, with the heating element
860 (shown in FIG. 24) removed subsequent to melting the sealing
element 830. As shown, the melting of the sealing element 830 may
cause the sealing element 830 to extend into an undercut region 844
of the enclosure 802. Also, the heating element 860 (shown in FIG.
24) may provide not only heat to the sealing element 830, but may
also provide some axial force such that the sealing element 830,
while heated, extends into an undercut region 834 of the cover 812.
In this regard, the melting of the sealing element 830 may cause
the sealing element 830 to form a first locking feature 852 (at the
undercut region 834) and a second locking feature 854 (at the
undercut region 844).
[0077] The prior embodiments show and describe a sealing element
that may be used to secure a cover with a rear portion of the
enclosure. However, as shown in previous embodiments, electronic
devices may include an outer protective cover designed to overlay a
display assembly. Some methods described for a sealing element may
be used to secure the outer protective layer with the enclosure at
a front region of an electronic device.
[0078] For example, FIGS. 26 and 27 illustrate a sealing element
that may be used to secure the outer protective cover with an
enclosure of an electronic device. FIG. 26 illustrates an exploded
view of an alternate embodiment of an electronic device 900 having
a sealing element 930 used with an outer protective layer 906 and a
display assembly 904 of the electronic device 900 in accordance
with some described embodiments. The display assembly 904 and outer
protective layer 906 may include any features or properties
previously described for a display assembly and an outer protective
layer, respectively. Also, the sealing element 930 may include
materials and elastic features previously described for a sealing
element. However, as shown in the enlarged view, the sealing
element 930 may include a sensor system 932 embedded in the sealing
element 930.
[0079] In some embodiments, the sensor system 932 is a capacitive
sensor system. In this regard, the sensor system 932 may include a
first plate 934 and a second plate 936, both of which may be
electrically coupled with a circuit 938 and a power source (not
shown). At least one of the first plate 934 or the second plate 936
may receive power to store charge, such that at least one of the
plates includes a capacitance between the first plate 934 and the
second plate 936. The capacitance may be inversely proportional to
a distance between the first plate 934 and the second plate 936. In
this regard, the capacitive may be altered (increased, for example)
in response to a force applied to the outer protective layer 906
that causes the first plate 934 to move in a direction toward the
second plate 936, thereby reducing the distance between the first
plate 934 and the second plate 936.
[0080] FIG. 27 illustrates a cross sectional view of the electronic
device 900 shown in FIG. 26, showing the outer protective layer 906
secured with the enclosure 902. Several components of the
electronic device 900 are removed for purposes of simplicity.
However, the electronic device 900 may include several features and
components previously described for an electronic device. In some
embodiments (not shown), the outer protective layer 906 extends to
allow the sealing element 930 to be press fit onto the outer
protective layer 906. In the embodiment shown in FIG. 27, the
sealing element 930 is secured with the outer protective layer 906
by an adhesive 940. In some embodiments, the sealing element 930 is
adhesively secured with the enclosure 902 by an adhesive (not
shown).
[0081] As shown in FIG. 27, the enclosure 902 may include an
undercut region 944. In this regard, when the outer protective
layer 906 is secured with the enclosure 902, the outer protective
layer 906 and/or the enclosure 902 may provide compression forces
to the sealing element 930, causing the sealing element 930 to at
least partially extend into the undercut region 944 and form a
locking feature 952 between the enclosure 902 and the sealing
element 930. Accordingly, a sealing element may be used to provide
mechanical locking features in different locations, and for
different structural components, of an electronic device.
[0082] FIG. 28 illustrates a flowchart 1000 showing a method for
forming an electronic device having an enclosure that includes an
opening and an enclosure undercut surrounding the opening, in
accordance with some described embodiments. In step 1002, a sealing
element is coupled with a cover. The sealing element may include
elastically deformable properties and may be formed from materials
such as PTFE or ETFE. The cover may be made from a material such as
glass, sapphire, or crystal, such that light may pass through the
transparent material. Further, the sealing element may be press fit
onto the cover, and optionally, may also be adhesively secured with
the cover.
[0083] In step 1004, the sealing element and the cover are coupled
with the enclosure at the opening. The cover may include a cover
undercut that includes an undercut region formed by a material
removal process to the cover. When the cover is coupled with the
enclosure, radial compression forces may cause the sealing element
to extend and engage: 1) the cover undercut to define a first
locking feature and 2) the enclosure undercut to define a second
locking feature. In this regard, the sealing element may be at
least partially disposed between the cover and the enclosure.
[0084] The first locking feature may combine with the second
locking feature to provide a retaining force that maintains the
cover (along with the sealing element) secured with the enclosure.
Also, the enclosure and/or the cover may provide radial compression
force in opposing directions (both of which are directed toward the
sealing element). In response, the sealing element may provide
counterforces in a radially outward direction (with respect to the
sealing element), thereby providing an additional retaining force
that maintains the cover (along with the sealing element) with the
enclosure. Also, the enclosure may be formed from a material such
as steel or aluminum, or alloys that include at least one of the
aforementioned metals. Also, the enclosure undercut may include an
undercut region formed by a material removal process to the
enclosure.
[0085] FIG. 29 illustrates a flowchart 1100 showing a method for
assembling an electronic device, in accordance with some described
embodiments. In step 1102, a sealing element is secured with an
enclosure of the electronic device. In some embodiments, the
enclosure includes an indented region and the sealing element
includes a protruding feature designed to mate with the recessed
region. Further, the protruding feature may be located at a
bottommost portion of the sealing element. However, in other
embodiments, the protruding feature is centrally located on the
sealing element.
[0086] In step 1104, a cover is secured with the enclosure
subsequent to securing the sealing element with the enclosure. The
cover may combine with the enclosure to provide compression forces
to the sealing element. In response, the sealing element may extend
into an undercut region of the cover, and the sealing element may
provide a locking feature. Further, the sealing element, having the
protruding feature disposed in the indented region, may provide an
additional locking feature to retain the cover with the enclosure
and enhance ingress protection.
[0087] The foregoing description, for purposes of explanation, used
specific nomenclature to provide a thorough understanding of the
described embodiments. However, it will be apparent to one skilled
in the art that the specific details are not required in order to
practice the described embodiments. Thus, the foregoing
descriptions of the specific embodiments described herein are
presented for purposes of illustration and description. They are
not targeted to be exhaustive or to limit the embodiments to the
precise forms disclosed. It will be apparent to one of ordinary
skill in the art that many modifications and variations are
possible in view of the above teachings.
* * * * *