U.S. patent application number 15/614979 was filed with the patent office on 2017-12-14 for control systems for three-dimensional printing.
The applicant listed for this patent is Velo3D, Inc.. Invention is credited to Benyamin BULLER, Erel MILSHTEIN.
Application Number | 20170355146 15/614979 |
Document ID | / |
Family ID | 56108274 |
Filed Date | 2017-12-14 |
United States Patent
Application |
20170355146 |
Kind Code |
A1 |
BULLER; Benyamin ; et
al. |
December 14, 2017 |
Control Systems for Three-Dimensional Printing
Abstract
Provided herein are systems, apparatuses and methods for
monitoring a three-dimensional printing process. The
three-dimensional printing process can be monitored in-situ and/or
in real time. Monitoring of the three-dimensional printing process
can be non-invasive. A computer control system can be coupled to
one or more detectors and signal processing units to adjust the
generation of a three-dimensional object that is formed by the
three-dimensional printing.
Inventors: |
BULLER; Benyamin;
(Cupertino, CA) ; MILSHTEIN; Erel; (Cupertino,
CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Velo3D, Inc. |
Campbell |
CA |
US |
|
|
Family ID: |
56108274 |
Appl. No.: |
15/614979 |
Filed: |
June 6, 2017 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
PCT/US2015/065297 |
Dec 11, 2015 |
|
|
|
15614979 |
|
|
|
|
62091438 |
Dec 12, 2014 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B22F 2003/1057 20130101;
B22F 2999/00 20130101; Y02P 10/295 20151101; B29C 64/268 20170801;
B22F 2202/11 20130101; B23K 26/36 20130101; B23K 26/0876 20130101;
B33Y 30/00 20141201; G01B 11/30 20130101; B22F 2003/1056 20130101;
B23K 26/342 20151001; B33Y 50/00 20141201; B22F 3/1055 20130101;
B33Y 50/02 20141201; B33Y 40/00 20141201; B29C 64/153 20170801;
B29C 64/393 20170801; B23K 26/032 20130101; Y02P 10/25 20151101;
B22F 2999/00 20130101; B22F 2003/1056 20130101; B22F 2203/00
20130101; B22F 2999/00 20130101; B22F 2003/1056 20130101; B22F
2203/03 20130101 |
International
Class: |
B29C 64/393 20060101
B29C064/393; B29C 64/268 20060101 B29C064/268 |
Claims
1. An apparatus for printing one or more three-dimensional objects
comprising a controller that is programmed to: (a) direct a first
energy source to project a first energy beam into an atmosphere of
an enclosure in which the one or more three-dimensional objects are
printed by three-dimensional printing; (b) direct at least one
processing unit to process at least one signal that is detected by
at least one sensor to produce a first result, which at least one
signal is indicative of an alternation in the first energy beam
indicative of a change in cleanliness of the atmosphere of the
enclosure, wherein the controller is operatively coupled to: (i)
the first energy source, (ii) the at least one processing unit, and
to (iii) the at least one sensor; and (c) evaluate the first result
to determine an adjustment to the three-dimensional printing.
2. The apparatus of claim 1, wherein the controller is programmed
to adjust the three-dimensional printing to direct a mechanism used
in the three-dimensional printing to alter at least one function of
the mechanism based on evaluation of the first result in (c),
wherein the controller is operatively coupled to the mechanism.
3. The apparatus of claim 1, wherein the at least one processing
unit comprises a computer.
4. The apparatus of claim 1, wherein the at least one processing
unit processes the at least one signal in real time, predetermined
time, after fabrication of the one or more three-dimensional
objects, subsequent to a completion of a layer of material as part
of the one or more three-dimensional objects, or any combination
thereof.
5. The apparatus of claim 1, further comprising a material bed and
a second energy source that generates a second energy beam, which
second energy beam transforms at least a portion of a material bed
to form the one or more three-dimensional objects.
6. The apparatus of claim 5, wherein evaluation of the first result
is used to adjust at least one characteristic of the second energy
beam.
7. An apparatus for printing one or more three-dimensional objects
comprising: an enclosure that has an atmosphere, wherein the one or
more three-dimensional objects are printed in the enclosure; a
first energy source that generates at least one first energy beam,
which energy source is disposed adjacent to the enclosure, wherein
the at least one first energy beam travels through the atmosphere
of the enclosure; and at least one sensor that is configured to
detect an alteration in the at least one first energy beam, wherein
the alteration indicates a change in cleanliness of the
atmosphere.
8. The apparatus of claim 7, wherein the alteration of the at least
one first energy beam comprises intensity alteration or direction
alteration.
9. The apparatus of claim 7, wherein the at least one first energy
beam is a collimated beam.
10. The apparatus of claim 7, wherein the at least one first energy
beam forms a web of beams within the enclosure.
11. The apparatus of claim 7, wherein the at least one sensor
comprises a spectrum analyzer.
12. The apparatus of claim 7, wherein the change in the cleanliness
of the atmosphere is detected in real time, predetermined time,
after printing of the one or more three-dimensional objects, and/or
subsequent to a completion of a layer of material as part of the
one or more three-dimensional objects.
13. The apparatus of claim 7, wherein the change in the cleanliness
of the atmosphere is used to determine an initiation of an
atmosphere cleaning procedure.
14. The apparatus of claim 13, wherein the atmosphere cleaning
procedure comprises purging the atmosphere or irradiating the
atmosphere.
15. The apparatus of claim 13, wherein the atmosphere cleaning
procedure comprises physically and/or chemically removing debris
from the atmosphere.
16. The apparatus of claim 7, further comprising a material bed and
a second energy source that generates a second energy beam that
transforms at least a portion of the material bed to print the one
or more three-dimensional objects.
17. The apparatus of claim 16, wherein the change in the
cleanliness of the atmosphere is used to alter at least one
characteristics of the second energy beam.
18. The apparatus of claim 17, wherein the at least one
characteristic of the second energy beam comprises a power
delivered by the second energy beam, a footprint of the second
energy beam on an exposed surface of the material bed, a focus
parameter of the second energy beam, a pulsing sequence of the
second energy beam, a rate of movement of the second energy beam
along a path, or a printing rate of the one or more
three-dimensional objects.
19. The apparatus of claim 7, further comprising a device that is
configured to capture, display, and/or record a spatial intensity
profile of the at least one first energy beam at a plane transverse
to a propagation path of the at least one energy beam
respectively.
20. The apparatus of claim 19, wherein the at least one sensor or
the device is a beam profiler.
21. The apparatus of claim 19, wherein the at least one sensor or
the device is a particle detector.
Description
CROSS-REFERENCE
[0001] This application claims priority to PCT Patent Application
Serial Number PCT/US15/65297, filed Dec. 11, 2015, which claims
priority to U.S. Provisional Patent Application Ser. No.
62/091,438, filed no Dec. 12, 2014, both of which are entirely
incorporated herein by reference.
BACKGROUND
[0002] Three-dimensional (3D) printing (e.g., additive
manufacturing) is a process for making a three-dimensional (3D)
object of any shape from a design. The design may be in the form of
a data source such as an electronic data source, or may be in the
form of a hard copy. The hard copy may be a two dimensional
representation of a 3D object. The data source may be an electronic
3D model. 3D printing may be accomplished through an additive
processes in which successive layers of material are laid down one
on top of each other. This process may be controlled (e.g.,
computer controlled and/or manually controlled). A 3D printer can
be an industrial robot.
[0003] 3D printing can generate custom parts quickly and
efficiently. A variety of materials can be used in a 3D printing
process including elemental metal, metal alloy, ceramic, elemental
carbon, or polymeric material. In a typical additive 3D printing
process, a first material-layer is formed, and thereafter,
successive material-layers (or parts thereof) are added one by one,
wherein each new material-layer is added on a pre-formed
material-layer, until the entire designed three-dimensional
structure (3D object) is materialized.
[0004] 3D models may be created utilizing a computer aided design
package or via 3D scanner. The manual modeling process of preparing
geometric data for 3D computer graphics may be similar to plastic
arts, such as sculpting or animating. 3D scanning is a process of
analyzing and collecting digital data on the shape and appearance
of a real object. Based on this data, 3D models of the scanned
object can be produced. The 3D models may include computer-aided
design (CAD).
[0005] A large number of additive processes are currently
available. They may differ in the manner layers are deposited to
create the materialized structure. They may vary in the material or
materials that are used to generate the designed structure. Some
methods melt or soften material to produce the layers. Examples for
3D printing methods include selective laser melting (SLM),
selective laser sintering (SLS), direct metal laser sintering
(DMLS), shape deposition manufacturing (SDM) or fused deposition
modeling (FDM). Other methods cure liquid materials using different
technologies such as stereo lithography (SLA). In the method of
laminated object manufacturing (LOM), thin layers (made inter alia
of paper, polymer, metal) are cut to shape and joined together.
[0006] The 3D printing process may be controlled (e.g., monitored
and/or directed) by a controller. In some instances, one or more
apparatuses within the 3D printing system may be controlled by a
controller. The control may benefit from various inputs related to
the process of the 3D printing (e.g., real-time input signals)
which may consequently result in a better outcome of the 3D
printing process. The better outcome may comprise better precision
and/or overall quality of the printed 3D object. The better outcome
may comprise better adherence to desirable material properties.
Better outcome may comprise a lower degree of failure during the 3D
pointing process. The control may include in-situ visualization of
the printed 3D object (e.g., in real time). The control may include
monitoring (e.g., in situ and/or in real-time) of debris (e.g.,
debris type and/or levels) in various positions within the chamber
in which the 3D object is being printed (e.g., an optical window of
the chamber, or an atmosphere of the chamber). The control may
relate to the energy (e.g., temperature) at various positions of
the chamber. The control may related to the energy and/or material
profile of the 3D object. The energy may be heat energy. The
control may relate to a metrology (e.g., distance measurement)
relative to various positions of the chamber. The various positions
of the chamber may include the material bed and/or the exposed
surface of the material bed. The control may relate to relative
distances of objects within the enclosure. The control may relate
to the roughness (or flatness) of a surface. The surface may be an
exposed surface of the material bed and/or a surface of the 3D
object.
SUMMARY
[0007] Although there are three-dimensional printing systems
presently available, recognized herein are various issues with such
systems. At least some or even most of such systems are not capable
of additively printing 3D objects in a manner that reduces or
minimizes the number of operations. This can lead to substantial
inefficiencies during printing, which can lead to wasted material,
energy and/or longer processing times. The 3D printing process
disclosed herein may be automatically and/or remotely controlled.
The control can include computer control. The control may include
receiving input from one or more sensors. The control may comprise
detection and/or monitor systems. The 3D printing process may
comprise quality control of the printed 3D object. The 3D printing
process disclosed herein may include optimizing the number of
operation, time of each operation, amount of energy required for
each operation, and/or amount of material used in each operation.
The present disclosure provides control systems that can enable the
efficient formation of 3D objects. Such control systems can provide
feedback control for optimizing the formation of a 3D object. This
can provide for the formation of 3D objects with reduced or
minimized material loss and shorter processing times. Control
systems provided herein can also enable the formation of 3D objects
at high accuracy.
[0008] In an aspect, a method for printing at least one
three-dimensional object comprises: (a) forming a material bed
disposed adjacent to a platform, wherein the material bed contacts
the platform, wherein the platform includes at least one device
comprising (i) a first sensor, wherein the first sensor is neither
a weight sensor nor a thermocouple or (ii) an energy source that
provides a directional energy beam; (b) forming the
three-dimensional object from at least a portion of the material
bed under at least one formation parameter; (c) detecting an output
signal from a second sensor that is in sensing communication with
the material bed or the three-dimensional object; and (c)
evaluating the formation parameter in (c) based on the output
signal.
[0009] The first sensor and second sensor may be the same sensor.
The first sensor and the second sensor may be different sensors.
The method may further comprise adjusting the formation parameter
in (b) based on the evaluating to provide an adjustment formation
parameter, and repeating (b) using the adjustment formation
parameter. The platform may support the material bed. The step (b)
may comprise transforming a powder material in the material bed by
using a transforming energy beam to form the three dimensional
object. The forming in step (b) may comprise transforming a powder
material by using the transforming energy beam. The transforming
may comprise fusing. The fusing may comprise melting or sintering.
Forming may comprise transforming a powder material in the material
bed by using the transforming energy beam to form a transformed
material that hardens into at least a portion of the three
dimensional object. The method may further comprise subsequent to
step (d), adjusting at least one characteristics of the
transforming energy beam (e.g., as disclosed herein). The at least
one characteristics can comprise (i) a power delivered by the
transforming energy beam, (ii) a footprint of the transforming
energy beam on an exposed surface of the material bed, (iii) a
focus parameter of the transforming energy beam, (iv) a pulsing
sequence of the transforming energy beam, (v) a rate of movement of
the transforming energy beam along the path, or (vi) a rate of
formation of the at least a portion of the three-dimensional
object.
[0010] In another aspect, a system for printing one or more
three-dimensional objects (e.g., a three-dimensional object)
comprises: (a) a platform that accepts a material bed, wherein at
least a portion of the material bed is used to form at least a
portion of a three-dimensional object, wherein the material bed
contacts the platform; (b) a generating device that generates a
signal, which generating device comprises (i) a first sensor that
senses one or more input signals and generates a first output
signal, wherein the first sensor is neither a weight sensor nor a
thermocouple, or (ii) an energy source that provides a directional
energy beam, wherein at least one of the first sensor and the
energy source are embedded in the platform; (c) a forming device
(or a mechanism) used to generate the three-dimensional object
under at least one formation parameter using three-dimensional
printing, wherein the forming device is disposed adjacent to the
material bed; (d) a second sensor that generates an output signal,
which second sensor is disposed adjacent to the material bed; and
(e) a controller comprising a processing unit that is programmed
to: (i) process the output signal to generate a result indicative
of the formation parameter; and (ii) direct the forming device to
alter at least one function of the forming device based on the
result.
[0011] The first sensor and second sensor may be the same sensor.
The first sensor and the second sensor may be different sensors.
The first sensor may be embedded in the platform. The energy source
can be embedded in the platform. The first sensor may not be
embedded in the platform. The energy source may not be embedded in
the platform. In some instances, both the first sensor and the
energy source may be embedded in the platform. Sometimes, the
output signal may be generated during the three-dimensional
printing. The first sensor may be stationary. The first sensor may
be moveable. The first sensor can be coupled to a scanner that
translates the sensor. The first sensor may be part of a
multiplicity (or plurality) of sensors. The multiplicity of sensors
may comprise a sensor array or a sensor matrix. The controller may
be further operatively coupled to the sensor. The three-dimensional
printing may comprise additive manufacturing. The three-dimensional
printing may comprise selective laser melting or selective laser
sintering. "Contacts the platform" may comprise directly contacts
the platform. The material bed directly may contact at least a
portion of a surface of the platform. The first sensor can be
selected from the group consisting of a sound wave sensor,
electromagnetic beam sensor, and magnetic field sensor. The energy
source may comprise an electromagnetic beam generator, a sound wave
generator, or a magnetic field generator. The electromagnetic beam
can be a collimated beam. The electromagnetic beam can be a laser
beam. The electromagnetic beam can be an X-ray beam. The
electromagnetic beam can be an infrared beam. The sound wave can be
an ultrasound wave. The sound wave can be a radio wave. The sound
wave can be non-audible sound by an average human. The
electromagnetic beam can be non-visible by an average human. The
first sensor and the energy source can be a transciever. The energy
beam can be sensed by the first sensor. An alteration of the energy
beam may be sensed by the first sensor. The first sensor may sense
an input signal that comprises an alteration of the energy beam,
and subsequently may generates the output signal. The first sensor
can comprise a spectrum analyzer. The platform can comprise a
surface that directly contacts the material bed, wherein the
surface is non-planar. The platform can comprise a surface that
directly contacts the material bed, and wherein the surface is
planar. The forming device may comprise an energy source. The
mechanism may comprise a layer dispensing mechanism or any
component thereof (e.g., material dispensing mechanism, material
removal mechanism, leveling mechanism, or any combination
thereof).
[0012] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a three-dimensional object)
comprises a controller that is programmed to: (a) direct a
processing unit to process an output signal received from a sensor
and generate a result indicative of a formation parameter during
formation of the three-dimensional object, wherein the sensor
senses an input signal during formation of the one
three-dimensional object by a three-dimensional printing
methodology, wherein the sensor is neither a weight sensor nor a
thermocouple, wherein the controller is operatively coupled to the
sensor, and to the processing unit; and (b) direct a mechanism used
in a three-dimensional printing methodology to alter a function of
the mechanism based on the result, wherein the controller is
operatively coupled to the mechanism, wherein the three-dimensional
is printed adjacent to a platform, wherein the platform comprises
the sensor.
[0013] The mechanism can comprise an energy source, a material
dispensing mechanism, or a leveling mechanism. The function can
comprise an operation of the mechanism. The function can comprise a
characteristic of a function of the mechanism.
[0014] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprising a
controller that is programmed to: (a) direct a processing unit to
process an output signal received from a sensor and generate a
result indicative of a formation parameter during formation of the
three-dimensional object, wherein the sensor senses an input signal
generated by an energy source, which input signal is generated
during formation of the three-dimensional object by
three-dimensional printing, wherein the sensor is neither a weight
sensor nor a thermocouple, wherein the energy source is a
directional energy source, wherein the controller is operatively
coupled to the sensor, to the energy source, and to the processing
unit; and (b) direct a mechanism used in a three-dimensional
printing methodology to alter a function of the mechanism based on
the result, wherein the controller is operatively coupled to the
mechanism, wherein the three-dimensional is printed adjacent to a
platform, wherein the platform comprises the sensor or the energy
source.
[0015] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a three-dimensional object)
comprises a platform for accepting a material bed, which platform
includes at least one device comprising a sensor or an energy
source, wherein the material bed contacts the platform, wherein at
least a portion of the material bed is used to generate the
three-dimensional object using three-dimensional printing, wherein
the sensor is neither a weight sensor nor a thermocouple, and
wherein the energy source is a directional energy source.
[0016] Contacts can comprises directly contacts or indirectly
contracts (e.g., indirectly though a coating, or a surface). The
material bed can directly contact at least a portion of a surface
of the platform. The sensor can exclude a temperature sensor (e.g.,
a certain type of temperature sensor). The sensor may be selected
from the group consisting of a sound wave sensor, electromagnetic
beam sensor, and magnetic field sensor. The energy source can
exclude a radiative heat source. The energy source can exclude a
dispersive heat source. The energy source can exclude a cooling
source. The energy source can exclude a dispersive cooling source.
The energy source may include an infrared (IR) beam array (e.g., IR
laser array). In some embodiments the energy source may exclude an
IR beam array. The energy source can comprise an electromagnetic
beam generator, a sound wave generator, or a magnetic field
generator. The electromagnetic beam can comprise a collimated beam.
The electromagnetic beam can comprise a laser beam. The
electromagnetic beam can comprise an X-ray beam. The
electromagnetic beam can comprise an infrared beam. The sound wave
can comprise an ultrasound wave. The sound wave can comprise a
radio wave. The sound wave may be a sound that is non-audible by an
average human. The electromagnetic beam may be non-visible by an
average human. The platform may comprise one or more transmitters
(e.g., energy sources). The energy source can generate a signal
that is sensed by the sensor. The sensor may sense an alteration in
the energy beam. The sensor may subsequently generates the output
signal. The sensor may comprise a transceiver. The sensor may
comprise a sound sensor, electromagnetic radiation sensor, magnetic
field sensor, electric field sensor, or magnetic field sensor. The
sensor can comprise a spectrum analyzer. The sensor may be coupled
to a spectrum analyzer. The apparatus may comprise a multiplicity
of sensors. The sensor may comprise a sensor array or matrix. The
multiplicity of sensors may be arranged in an array or matrix
(e.g., 2D or 3D). The platform may comprise a surface that directly
contacts the material bed. The surface may be non-planar. The
platform may comprise a surface that directly contacts the material
bed. The surface may comprise a flat or a planar surface.
[0017] In some aspects, a method for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a)
generating the three-dimensional object by three-dimensional
printing, wherein the material bed is disposed in an atmosphere
that forms a plasma; (b) detecting the plasma; and (c) evaluating
an adjustment of the generating according to the detecting.
[0018] The method may further comprising repeating step (a) and
adjusting the generating in (a) based on the detecting. The
generating may comprise transforming the at least a portion of a
material bed by using an energy beam. The generating may comprise
transforming a powder material within the material bed by using an
energy beam. The adjustment may comprise adjusting at least one
characteristics of the energy beam (e.g., as disclosed herein).
[0019] In some aspects, a system for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a) an
enclosure for generating the three-dimensional object from at least
a portion of a material bed by a three-dimensional printing; (b) an
atmosphere disposed within the enclosure, which atmosphere
comprises a plasma; (c) a plasma sensor that senses the plasma and
generates an output signal, which plasma sensor is disposed
adjacent to the enclosure; and (d) a controller that comprises a
processing unit, which controller is programmed to evaluate the
output signal to determine any adjustment to the three-dimensional
printing. The controller may further operatively coupled to the
plasma sensor. The system may further comprise a mechanism that is
used in the three-dimensional printing to generate the
three-dimensional object. The mechanism may be disposed adjacent to
the enclosure. The controller may be operatively coupled to the
mechanism. The controller may be programmed to and direct the
mechanism to alter at least one function of the mechanism based on
the output signal evaluation.
[0020] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprises a
controller that is programmed to: (a) direct a processing unit to
process a plasma generated signal that is detected by a plasma
sensor and generate a result, which plasma is formed in an
enclosure in which the three-dimensional object is formed by
three-dimensional printing, wherein the controller is operatively
coupled to the sensor and to the processing unit; and (b) evaluate
the result to determine any adjustment to the three-dimensional
printing, wherein the controller is operatively coupled to the
three-dimensional printing. The controller can direct a mechanism
used in the three-dimensional printing to alter a function of the
mechanism based on the result. The controller may be operatively
coupled to the mechanism. The plasma can be formed during a
formation of the three-dimensional object.
[0021] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: an
enclosure for generating a three-dimensional object from at least a
portion of a material bed by three-dimensional printing, which
enclosure has an atmosphere that comprises a plasma; and a plasma
sensor that senses the plasma, which plasma sensor is disposed
adjacent to the enclosure.
[0022] The atmosphere comprises a gas, wherein plasma can be
generated from the gas. The plasma can be formed during a formation
of the three-dimensional object. The plasma can be formed during
the three-dimensional printing. Wherein adjacent can comprise
inside, outside, or within the walls of the enclosure. The
enclosure can comprise a chamber. The chamber can be isolated from
the ambient environment. The gas can be an inert gas. The gas can
be depleted in a species that reacts with a material that forms the
material bed during the three-dimensional printing. The gas can be
depleted in a species that reacts with a material that forms the
material bed. An output from the plasma sensor may facilitate an
evaluation of the temperature of a position of the material bed
that corresponds to a position of the plasma. An output from the
plasma sensor may facilitate an evaluation of the temperature of a
corresponding position of the material bed. The corresponding
position may relate to, influence, or facilitate the generation of
the plasma. The corresponding position may cause the generation of
the plasma. The corresponding position can comprise the temperature
in the corresponding position. The corresponding position can
comprise the energy in the corresponding position. The
corresponding position can comprise the electric charge or magnetic
charge in the corresponding position. An output from the plasma
sensor may facilitate an evaluation of the temperature of a
position of the material bed that corresponds to a position of the
plasma. The plasma sensor may sense the electromagnetic radiation
of the plasma. The plasma sensor can comprise a spectrum analyzer.
The plasma sensor may collect the electromagnetic radiation at a
predefined wavelength regiment. The plasma sensor may sense the
electromagnetic radiation of the plasma. The plasma sensor can
comprise, or be coupled to, a spectrometers or monochromator. The
predefined wavelength regiment is from at least about 5 nanometers
to at most about 500 nanometers.
[0023] In another aspect, a method for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a)
forming the three-dimensional object from a particulate material by
using three-dimensional printing; (b) generating a wave having a
wavelength that is greater than an average or median fundamental
length scale of the particulate material; (c) detecting at least
one signal indicative of an alteration of the wave; and (d)
evaluating the ate least one signal to determine an adjustment to
the three-dimensional printing.
[0024] The method may further comprise repeating step (a) and
adjusting the forming in (a) based on the detecting. In some
instances, step (c) may further comprise generating an image of the
at least a portion of the three-dimensional object by using the at
least one signal. The generating can comprise transforming at least
a portion of a material bed that comprises the particulate material
by using an energy beam. The adjustment can comprise adjusting at
least one characteristics of the energy beam (e.g., as disclosed
herein).
[0025] In another aspect, a system for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a) a
material bed that comprises a particulate material of which at
least a portion is used to generate the three-dimensional object by
three-dimensional printing, which material bed is disposed in an
enclosure; (b) a wave source that generates a wave having a
wavelength that is greater than an average or median fundamental
length scale of the particulate material, wherein the wave source
is disposed adjacent to the enclosure; (c) a wave sensor that
detects an input signal indicative of an alteration of the wave and
produces an output signal, wherein the wave sensor is disposed
adjacent to the enclosure; and (d) a controller that comprises a
processing unit, and is programmed to evaluate the output signal to
determine any adjustment to the three-dimensional printing. The
system may further comprise a mechanism that is used in the
three-dimensional printing, wherein the mechanism is disposed
adjacent to the enclosure and is coupled to the controller, wherein
the controller is programmed to direct the mechanism to alter at
least one function based on the evaluation (e.g., by the processing
unit). The mechanism can comprise an energy source that generates
an energy that transforms the particulate material to form the at
least a portion of the three-dimensional object. The controller may
further be operatively coupled to the sensor.
[0026] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprises a
controller that is programmed to: (a) direct a wave source to
generate a wave having a wavelength that is greater than the
average or median fundamental length scale of a particulate
material disposed in a material bed, wherein at least a portion of
the particulate material is used to form the three-dimensional
object using three-dimensional printing; (b) direct at least one
processing unit to process a first signal indicative of an
alteration of the wave and generate a first result, which first
signal is detected by a wave detector, wherein the controller is
operatively coupled to the wave source and to the wave detector;
and (c) evaluate the first result to determine any adjustment to
the three-dimensional printing.
[0027] The controller may direct a mechanism used in the
three-dimensional printing to alter at least one function based on
the evaluation. The controller may be operatively coupled to the
mechanism. The at least one first signal may further comprise the
wave. The direct in steps (a) can comprise direct the processing
unit. Evaluate in step (c) may comprise evaluation by the
processing unit. The controller can further be programmed to: (i)
prior to step (b) direct a magnetic field source to generate a
magnetic field that engulfs the three-dimensional object; and (ii)
in step (b) direct the processing unit to further process a second
signal comprising the magnetic field that is altered and generate a
result, which second signal is detected by a magnetic field
detector, wherein the controller is operatively coupled to the
magnetic field source and to the magnetic field detector. The
controller can further be programmed to: direct the mechanism used
in the three-dimensional printing to alter a function (of the
mechanism) according to the result. The controller may further be
programmed to: (i) prior to step (b) direct an electric field
source to generate an electric field that engulfs the
three-dimensional object; and (ii) in step (b) direct the
processing unit to further process a second signal comprising an
alteration in the electric field and generate a result, which
second signal is detected by an electric field detector, wherein
the controller is operatively coupled to the electric field source
and to the electric field detector. The controller can further be
programmed to: direct the mechanism used in the three-dimensional
printing methodology to alter at least one function (of the
mechanism) according to the result.
[0028] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D objet) comprises: (a) a
material bed that comprises a particulate material of which at
least a portion is used to generate the three-dimensional object by
three-dimensional printing, which material bed is disposed in an
enclosure; (b) a wave source that generates a wave having a
wavelength that is greater than an average or median fundamental
length scale of the particulate material; and (c) a wave detector
that detects at least one first signal comprising an alteration in
the wave, wherein the wave source and the wave detector are
disposed adjacent to the enclosure.
[0029] The at least one first signal may further comprise the wave
(e.g., unaltered). The wave can be an electromagnetic wave. The
electromagnetic wave can be an X-ray wave. The wave can be a sound
wave. The sound wave can be ultrasound. The sound wave can be a
radio wave. The altered wave can be the wave that is altered in
intensity, frequency, and/or modulation. The apparatus may further
comprise a magnetic field source that generates a magnetic field;
and a magnetic filed detector that detects at least one second
signal comprising an alteration in the magnetic field, which
magnetic field source and magnetic field detector are disposed
adjacent to the enclosure. The apparatus may further comprise an
electric field source that generates an electric field; and an
electric filed detector that detects at least one third signal
comprising an alteration in the electric field, which electric
field source and electric field detector are disposed adjacent to
the enclosure. The material bed may be disposed adjacent to a
platform. The platform can comprise the wave generator and/or the
wave detector. The wave generator and/or the wave detector may
contact the material bed. The contact may be direct or indirect
contact. The indirect contact may be though at least one surface.
The at least one surface may be a coating. The coating may be a
protective coating. An output of the wave detector may facilitate
an evaluation of a shape of the at least a portion of the
three-dimensional object. The evaluation may be a real-time
evaluation (e.g., during the 3D printing). The evaluation may be an
evaluation at a predetermined time. The predetermined time can
comprise subsequent to a completion of a layer of hardened material
as part of the three-dimensional object. Adjacent can comprise
within, outside, or within a wall of the enclosure. At least one of
the wave detector and the wave source can be disposed in the
platform. A surface of the platform may directly contact the
material bed. A surface of the platform may indirectly contact the
material bed.
[0030] In another aspect, a method for printing one or more
three-dimensional objects comprising: (a) generating at least a
portion of a three-dimensional object by a three-dimensional
printing methodology; (b) producing a magnetic field that
penetrates the material bed; (c) detecting at least one signal
comprising the magnetic field that is altered; and (d) evaluating
an adjustment of the generating according the detecting in (c).
[0031] The method may further comprise repeating step (a) and
adjusting the generating in (a) based on the detecting in (c). Step
(c) may further comprise generating an image of the at least a
portion of the three-dimensional object by using the at least one
signal. The generating in step (a) can comprise transforming at
least a portion of a material bed by using an energy beam. The
generating in step (a) can comprise transforming a powder material
by using an energy beam. The adjustment in step (d) can comprise
adjusting at least one characteristics of the energy beam (e.g., as
disclosed herein).
[0032] In another aspect, a system for printing one or more
three-dimensional objects comprises: (a) a material bed that
comprises a particulate material, wherein at least a portion of the
material bed is used to generate at least one three-dimensional
object by a three-dimensional printing methodology, wherein the
material bed is disposed in an enclosure; (b) a magnetic field
source that generates a magnetic field; wherein the magnetic field
source is disposed adjacent to the enclosure; (c) a magnetic filed
sensor that detects an input signal comprising the magnetic field
that is altered and generates an output signal, wherein the
magnetic field detector is disposed adjacent to the enclosure; (d)
a mechanism that is used in the three-dimensional printing
methodology to generate the at least a portion of the
three-dimensional object, wherein the mechanism is disposed
adjacent to the enclosure; (e) a processing unit operatively
coupled to the sensor to processes the output signal and generate a
result; and (f) a controller that is operatively coupled to the
processing unit, and the mechanism, and is programmed to direct
the: (i) processing unit to process the output signal to generate
the result; and (ii) mechanism to alter a function of the mechanism
based on the result.
[0033] In another aspect, an apparatus for printing one or more
three-dimensional objects comprises a controller that is programmed
to: (a) direct a magnetic field source to generate a magnetic field
that penetrates a material bed, wherein at least a portion of the
material bed is used to generate at least one three-dimensional
object using a three-dimensional printing methodology; and (b)
direct a processing unit to process a signal comprising the
magnetic field that is altered and generate a result, which signal
is detected by a magnetic field detector, wherein the controller is
operatively coupled to the magnetic field source and to the
magnetic field detector. and (c) direct a mechanism used in the
three-dimensional printing methodology to alter a function of the
mechanism based on the result, wherein the controller is
operatively coupled to the mechanism. The signal can further
comprise the magnetic field.
[0034] The processing unit can comprise a computer, wherein the
controller is operatively coupled to the computer. The processing
(e.g., by a processing unit) can be conducted at real time,
predetermined time, after fabrication of the at least one
three-dimensional object, subsequent to a completion of a layer of
material as part of the at least a portion of the three-dimensional
object, or at a whim.
[0035] In another aspect, an apparatus for printing one or more
three-dimensional objects comprises: (a) a material bed that
comprises a particulate material, wherein at least a portion of the
material bed is used to generate at least one three-dimensional
object by a three-dimensional printing methodology; (b) a magnetic
field source that generates a magnetic field; and (c) a magnetic
filed detector that detects at least one signal comprising an
altered magnetic field that is the magnetic field that is altered,
wherein the material bed is disposed in an enclosure, wherein the
magnetic field source and the magnetic field detector are disposed
adjacent to the enclosure.
[0036] The detector may further detect the magnetic field (e.g.,
the non-altered magnetic field, or the magnetic field prior to its
alteration). The material bed can be disposed adjacent to a
platform. The platform can comprise the magnetic field generator or
the magnetic field detector. The magnetic field generator and/or
the magnetic field detector may contact the material bed. The
output of the magnetic field detector may facilitate an evaluation
of a shape of the at least a portion of the at least one
three-dimensional object. The shape may be a three-dimensional
shape or a cross-section thereof. The evaluation may be a real-time
evaluation. The evaluation may be an evaluation at a predetermined
time and/or at a whim. The predetermined time can comprise at time
subsequent to a completion of forming a layer of material as part
of the at least a portion of the three-dimensional object. The
predetermined time can comprise subsequent to a completion of at
least one three-dimensional object. Adjacent can comprise within,
outside, within a wall of the enclosure, or any combination or
permutation thereof. The magnetic field generator can be disposed
within the enclosure. The magnetic field generator can be disposed
outside of the enclosure. The magnetic field generator can be
disposed within a wall of the enclosure. The magnetic field
detector can be disposed within the enclosure. The magnetic field
detector can be disposed outside of the enclosure. The magnetic
field detector can be disposed within a wall of the enclosure. The
material bed can be disposed adjacent to a platform. At least one
of the magnetic field detector and the magnetic field generator can
be disposed in the platform. A surface of the platform may directly
or indirectly contacts the material bed.
[0037] In another aspect, a method for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a)
forming the three-dimensional object by a three-dimensional
printing in an enclosure, and generating a first energy beam
directed towards the optical window of the enclosure; (b) detecting
one or more signals comprising an alteration in the first energy
beam, wherein the alteration in the first energy is indicative of a
change in the cleanliness of the optical window; and (d) evaluating
a procedure according to the detecting in (b), which procedure
comprises an adjustment of the forming, or a cleaning of the
optical window.
[0038] The method may further comprise repeating step (a) and
performing the procedure according to the evaluating in (d). The
forming can comprise transforming at least a portion of a material
bed by using a second energy beam. The forming can comprise
transforming at least a portion of the material bed by using a
second energy beam. The forming can comprise transforming a powder
material by using a second energy beam. The adjustment in step (d)
can comprise adjusting at least one characteristics of the second
energy beam (e.g., as disclosed herein).
[0039] In another aspect, a system for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a) an
enclosure comprising an optical window, in which enclosure the
three-dimensional object is generated by three-dimensional
printing; (b) a first energy source that generates a first energy
beam directed to the optical window, wherein the energy source is
disposed adjacent to the enclosure; (c) an energy sensor that
detects an input signal comprising an alteration in the energy beam
to generate an output signal, wherein the alteration in the energy
beam is indicative of a change in the cleanliness of the optical
window, wherein the energy source is disposed adjacent to the
enclosure; and (d) a controller that comprises a processing unit,
and is programmed to direct the processing unit to process the
output signal to evaluate the output signal to determine any
adjustment to the three-dimensional printing. The system may
further comprise a mechanism that is used in the three-dimensional
printing, which mechanism is disposed adjacent to the enclosure.
The controller may be operatively coupled to the mechanism and
direct the mechanism to alter at least one (of its) function based
on the evaluation.
[0040] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprises a
controller that is programmed to: (a) direct an energy source to
generate an energy beam directed towards an optical window that is
disposed in an enclosure in which a three-dimensional object is
generated by three-dimensional printing, wherein the controller is
operatively coupled to the energy source; (b) direct at least one
processing unit to process a signal indicative of an alteration in
the energy beam, wherein the alteration in the energy beam is
indicative of a change in the cleanliness of an optical window,
wherein the controller is operatively coupled to the processing
unit; and (c) evaluate a result to determine any adjustment to the
three-dimensional printing based on the alteration.
[0041] The controller may further direct a mechanism used in the
three-dimensional printing to alter at least one (of its) function
based on the evaluation, wherein the controller is operatively
coupled to the mechanism. The signal can be detected by an energy
beam detector. The controller can be operatively coupled to the
energy beam detector. The signal may further comprise the energy
beam (e.g., unaltered energy beam). The energy beam can be an
electromagnetic beam. The alteration can comprise intensity and/or
direction alteration.
[0042] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., 3D object) comprises: (a) an
enclosure comprising an optical window, in which enclosure the
three-dimensional object is generated by three-dimensional
printing; (b) a first energy source that generates a first energy
beam directed to the optical window; (c) an energy beam detector
that detects one or more signals comprising an alteration in the
energy beam, wherein the alteration in the energy beam is
indicative of a change in the cleanliness of the optical window,
wherein the energy source and the energy beam detector are disposed
adjacent to the enclosure.
[0043] The one or more signals may further comprise the energy beam
(e.g., unaltered). The energy beam can be an electromagnetic beam.
The altered can comprise varied, changed, modified, revised,
attuned, or modulated. The altered can comprise modulated. The
altered can comprise intensity and/or direction alteration of the
electromagnetic beam (e.g., as generated by the source). The
detector can be disposed outside of the enclosure. The detector can
be disposed within the enclosure. The detector can be disposed
along a line that travels from a projection position of the
electromagnetic beam to a target position of the electromagnetic
beam. The target position can be a target position of the
projection. The detector can comprise a spectrum analyzer. The
electromagnetic beam can be directed at a grazing angle relative
to, or perpendicular to an exposed surface of the optical window.
The electromagnetic beam can be directed at a non-grazing angle
relative to an exposed surface of the optical window. The apparatus
may further comprise a second energy source that generates a second
energy beam that transforms at least a portion of a material bed to
form the at least one three-dimensional object, which material bed
can be disposed in the enclosure, which second energy source can be
disposed adjacent to the enclosure. The change in the cleanliness
of the optical window can be used to adjust at least one
characteristics of a second energy beam. The at least one
characteristics can comprise a power delivered by the second energy
beam, a cross section of the second energy beam, a focus parameter
of the second energy beam, a pulsing sequence of the second energy
beam, a rate of movement of the second energy beam, or any
combination thereof. The second energy beam may travel along a path
(e.g., predetermined and/or controlled by the controller).
Controlled may comprise regulated and/or directed. The at least one
characteristics can comprise a power delivered by the second energy
beam, a footprint of the second energy beam on an exposed surface
of the material bed, a focus parameter of the second energy beam, a
pulsing sequence of the second energy beam, a rate of movement of
the second energy beam along the path, or a rate of formation of
the three-dimensional object. The change in the cleanliness of the
optical window can be used to determine the initiation of a
cleaning procedure of the optical window. The cleaning procedure
can comprise physical and/or chemical removal of debris. The
cleaning procedure can comprise ablation of the debris.
[0044] In another aspect, a method for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a)
generating at least a portion of the three-dimensional object by
three-dimensional printing from at least a portion of a material
bed that is disposed adjacent to an enclosure; (b) measuring a
distance relative to an exposed surface of the material bed; and
(c) evaluating an adjustment of the three-dimensional printing
according to the measuring.
[0045] The method may further comprise repeating step (a) and
adjusting the 3D printing based on the evaluating. The generating
can comprise transforming the at least a portion of the material
bed by using an energy beam. The adjustment can comprise adjusting
at least one characteristics of the energy beam (e.g., as disclosed
herein). The adjustment can comprise adjusting at least one
mechanism used in the three-dimensional printing. The at least one
mechanism can comprise the layer dispensing mechanism. The at least
one mechanism can comprise the material dispensing mechanism,
leveling mechanism, or material removal mechanism. The at least one
mechanism can comprise at least two of the group consisting of
material dispensing mechanism, leveling mechanism, and material
removal mechanism. The adjustment can comprise adjusting at least
one parameter of the three-dimensional printing. The at least one
parameter can comprise an amount of material dispensed into the
material bed, a level of an exposed surface of the material bed, or
an amount of energy injected into the material bed during the
generating.
[0046] In another aspect, a system for printing one or more
three-dimensional objects (e.g., a 3D object) comprising: (a) a
platform for accepting a material bed disposed within an enclosure,
wherein at least a portion of the material bed is used to generate
the three-dimensional object by three-dimensional printing; (b) a
sensor that is used to measure a distance relative to an exposed
surface of the material bed and generates an output signal, wherein
the sensor is disposed adjacent to the enclosure; and (c) a
controller that comprises a processing unit and is programmed to
direct the processing unit to process the output signal evaluate an
adjustment in the three-dimensional printing. The system may
further comprise a mechanism that is used in the three-dimensional
printing, wherein the mechanism is disposed adjacent to the
enclosure and is operatively coupled to the controller, which
controller is programmed to direct the mechanism to alter at least
one (of its) function based on the evaluation.
[0047] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprises a
controller that is programmed to (a) direct a processing unit to
process a signal received from a sensor that is used to measure a
distance relative to an exposed surface of a material bed and
generate a result, wherein at least a portion of the material bed
is used to generate the three-dimensional object by
three-dimensional printing, wherein the controller is operatively
coupled to the material bed and to the one or more sensors; and (b)
evaluate the result to determine any adjustment to the
three-dimensional printing. The apparatus may further direct a
mechanism used in the three-dimensional printing to alter at least
one (of its) function based on the result, which controller is
operatively coupled to the mechanism.
[0048] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprising a platform
for accepting a material bed disposed within an enclosure, wherein
at least a portion of the material bed is used to generate the
three-dimensional object by three-dimensional printing, wherein the
enclosure comprises one or more sensors that are used to measure a
distance relative to an exposed surface of the material bed,
wherein the one or more sensors are disposed adjacent to the
enclosure.
[0049] The distance can be a distance from a mechanism comprising a
component of the layer dispensing mechanism (e.g., recoater). The
component can comprise a material dispensing mechanism, a leveling
mechanism, or a material removal mechanism. The component can
comprise an opening of the component. The material dispensing
mechanism (e.g., material dispenser) can comprise an exit opening
port through which the material exits the material dispensing
mechanism and travels to the material bed. The leveling mechanism
can comprise a blade or an air knife. The component can comprise a
material exit opening, a material entrance opening, a blade, or an
air knife. The component can comprise a surface of the component.
The surface can be the surface that neighbors the exposed surface
of the material bed. The surface can be the surface that faces the
exposed surface of the material bed. The surface can be the surface
that is closest to the exposed surface of the material bed.
Neighbors can comprise above the exposed surface of the powder bed,
wherein above is in a direction opposite to the gravitational
field. Neighbors can comprise above the exposed surface of the
powder bed, wherein above is in a direction opposite to the
platform. The distance can be a distance from a mechanism can
comprise a source of the energy beam. Adjacent can comprise within,
outside, or in a wall of the enclosure. The one or more sensors can
be disposed above the exposed surface of the material bed, wherein
above is in a direction opposite to the direction of the platform.
The one or more sensors can be disposed above the exposed surface
of the material bed, wherein above is in a direction opposite to
the direction of the gravitational field. The one or more sensors
can comprise metrological sensors. An output of the one or more
sensors can be used to evaluate a planarity of the exposed surface
of the material bed. An output of the one or more sensors can be
used to evaluate a roughness of the exposed surface of the material
bed. An output of the one or more sensors can be used to evaluate a
position the exposed surface of the material bed. The position can
be a vertical position.
[0050] In another aspect, a method for printing one or more
three-dimensional objects (e.g., a three-dimensional object)
comprises: (a) forming the three-dimensional object in an enclosure
comprising an atmosphere; (b) generating a first energy beam that
travels in the atmosphere; (c) detecting an alteration (e.g.,
variance, or change) in the first energy beam, wherein the
indicative of a change in the cleanliness of the atmosphere; and
(d) evaluating an adjustment of the forming in (a) according to the
measuring.
[0051] The method may further comprise repeating step (a) and
adjusting the forming in (a) based on the evaluating. The forming
in step (a) may comprise three-dimensional printing. The forming in
step (a) can comprise transforming at least a portion of a material
bed by using a second energy beam. The forming in step (a) can
comprise transforming at least a portion of a powder material
within the material bed by using a second energy beam. The
adjustment (e.g., in step (d)) can comprise adjusting at least one
characteristics of the second energy beam (e.g., as disclosed
herein). The adjustment can comprise adjusting at least one
mechanism involved in (e.g., effectuating) the three-dimensional
printing. The at least one mechanism can comprise the layer
dispensing mechanism (or any component thereof). The at least one
mechanism can comprise the material dispensing mechanism, material
removal mechanism, or leveling mechanism. The adjustment can
comprise adjusting at least one parameter of the three-dimensional
printing. The at least one parameter can comprise an amount of
material (e.g., pre-transformed material) dispensed into the
material bed, a level (e.g., height) of an exposed surface of the
material bed, or an amount of energy injected into the material bed
during the generating (e.g., by the second energy beam).
[0052] In another aspect, a system for printing one or more
three-dimensional objects (e.g., a three-dimensional object)
comprises: (a) an enclosure that comprises an atmosphere, wherein
the three-dimensional object is formed in the enclosure using
three-dimensional printing; (b) a first energy source that
generates a first energy beam that travels through at least a
portion of the atmosphere, which energy source is disposed adjacent
to the enclosure; (c) a sensor that (i) detects an alteration in
the first energy beam indicative of a change in the cleanliness of
the atmosphere and (ii) generate an output signal; wherein the
sensor is disposed adjacent to the enclosure; and (d) a controller
that comprises a processor, which processor is programmed to
evaluate the output signal to determine any adjustment to the
three-dimensional printing. The system may further comprise a
mechanism that is used in the three-dimensional printing. The
mechanism may be disposed adjacent to the enclosure. The processor
may further direct the mechanism to alter a function of the
mechanism based on the evaluation. The mechanism may be operatively
coupled to the controller.
[0053] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a three-dimensional object)
comprises a controller that is programmed to: (a) direct a first
energy source to project a first energy beam into an atmosphere of
an enclosure in which the three-dimensional object is printed by
three-dimensional printing; (b) direct a processing unit to process
at least one signal that is detected by at least one sensor which
signal is indicative of an alternation in the first energy beam
indicative of a change in the cleanliness of the atmosphere of the
enclosure, wherein the controller is operatively coupled to the
first energy source and to the one or more sensors; and (c)
evaluate the first result to determine any adjustment to the
three-dimensional printing. The controller may further adjust the
three-dimensional printing. The adjustment may comprise further
programming the controller to direct a mechanism used in the
three-dimensional printing to alter at least one (of its) function
based on the evaluation in (c). The controller may be operatively
coupled to the mechanism.
[0054] The at least one signal may comprise the first (e.g.,
unaltered) energy beam. The evaluation may comprise directing at
least one processing unit. The controller can be operatively
coupled to the at least one processing unit. The processing unit
can comprise a computer. The controller can be operatively coupled
to the computer. The processing can be conducted at real time,
predetermined time, after fabrication of the three-dimensional
object, subsequent to a completion of a layer of material as part
of the three-dimensional object, at a whim, or any combination
thereof. The apparatus can further comprise a material bed and a
second energy source that generates a second energy beam, which
second energy beam transforms at least a portion of a material bed
to form the three-dimensional object. The second energy source
and/or beam can be operatively coupled to the controller. The
evaluation can be used to adjust at least one characteristics of
the second energy beam.
[0055] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a) an
enclosure that has an atmosphere, wherein a three-dimensional
object is formed in the enclosure; (b) a first energy source that
generates a first energy beam, which energy source is disposed
adjacent to the enclosure and travels though the atmosphere of the
enclosure; (c) at least one sensor that detects an alteration of
the first energy beam, wherein the alteration indicates a change in
the cleanliness of the atmosphere.
[0056] The atmosphere can comprise a gas. The at least one sensor
can sense the first (e.g., unaltered) energy beam. The alteration
of the first energy beam can comprise intensity alteration or
direction alteration. The first energy beam can be an
electromagnetic beam. The first energy beam can be a collimated
beam. Adjacent can comprise inside, outside, or within a wall of
the enclosure. The first energy source can be disposed within the
enclosure. The first energy source can be embedded within a wall of
the enclosure. The first energy source can be disposed outside of
the enclosure. The detector can be disposed within the enclosure.
The detector can be embedded within a wall of the enclosure. The
detector can be disposed outside of the enclosure. The detector can
be disposed substantially along a line that travels from a
projection position of the first energy beam to a target position
of the first energy beam. The detector can be disposed at a
position that is not along a line that travels from a projection
position of the first energy beam to a target position of the first
energy beam. The target position can be a target of the projection.
The detector can comprise a spectrum analyzer. The altered first
energy beam can be used in an evaluation of the cleanliness of the
atmosphere. The evaluation can comprise an evaluation in real time,
predetermined time, after fabrication of the three-dimensional
object, subsequent to a completion of a layer of material (e.g.,
hardened material) as part of the three-dimensional object, or at a
whim. The evaluation can be used to determine an initiation of an
atmosphere cleaning procedure. The cleaning procedure can comprise
purging the atmosphere. The cleaning procedure can comprise
irradiating the atmosphere. The cleaning procedure can comprise
physically and/or chemically removing debris from the atmosphere.
The apparatus may further comprise a material bed and a second
energy source that generates a second energy beam that transforms
at least a portion of the material bed to form the
three-dimensional object. The second energy source can be disposed
within the enclosure. The evaluation may be of an adjustment of at
least one characteristics of the second energy beam. The at least
one characteristics of the second energy beam can comprise a power
delivered by the second energy beam, a footprint of the second
energy beam on an exposed surface of the material bed, a focus
parameter of the second energy beam, a pulsing sequence of the
second energy beam, a rate of movement of the second energy beam
along a path, or a rate of formation of the three-dimensional
object.
[0057] In another aspect, a method for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a)
forming the three-dimensional object by three-dimensional printing
in an enclosure, that comprises an atmosphere; (b) detecting
particles in the atmosphere; and (d) evaluating an adjustment of
the forming in (a) according to the detecting.
[0058] The method may further comprise repeating step (a) and
adjusting the forming in step (a) based on the evaluating in (d).
The forming can comprise transforming a material (e.g., powder)
material disposed in the enclosure by using an energy beam. The
forming can comprise transforming at least a portion of a material
bed by using an energy beam. The adjustment can comprise adjusting
at least one characteristics of the energy beam (e.g., as disclosed
herein).
[0059] In another aspect, a system for printing one or more
three-dimensional objects (e.g., a 3D object) comprising: (a) an
enclosure in which the three-dimensional object is formed by
three-dimensional printing, which enclosure comprises an
atmosphere; (b) a sensor that detects particles in the atmosphere
and generates an output signal, wherein the detector is disposed
adjacent to the enclosure; and (c) a controller that comprises a
processing unit that is programmed to evaluate the output signal to
determine at least one of: (i) any adjustment to the
three-dimensional printing and (ii) initiation of an atmosphere
cleaning procedure. The system may further comprise a mechanism
that is used in the three-dimensional printing, wherein the
mechanism is disposed adjacent to the enclosure. The processing
unit may be operatively coupled to the mechanism. The
three-dimensional printing may comprise operation of the mechanism.
The processing unit may direct in option (i) the mechanism to alter
at least one (of its) function.
[0060] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprises a
controller that is programmed to direct at least one processing
unit to evaluate an output signal from a particle sensor to
determine any adjustment to three-dimensional printing of the
three-dimensional object, wherein the output signal corresponds to
at least one particle in an atmosphere of an enclosure, wherein the
output signal is indicative of a change in the cleanliness of the
atmosphere, wherein the controller is operatively coupled to the
particle sensor, and wherein the controller comprises the at least
one processing unit. The controller may be programmed to direct a
mechanism used in the three-dimensional printing to alter at least
one (of its) function based on the evaluation. The controller may
be operatively coupled to the mechanism. The mechanism can comprise
a second energy source, a material dispensing mechanism, a leveling
mechanism, or a material removal mechanism. The function can
comprise an operation.
[0061] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprising: (a) an
enclosure in which the three-dimensional object is formed by
three-dimensional printing, which enclosure comprises an
atmosphere; and (b) a sensor that detects one or more particles in
the atmosphere, which sensor is disposed adjacent to the
enclosure.
[0062] The atmosphere can comprise a gas. The detector can detect
one or more particles (e.g., residing in the atmosphere). The
detector can detect the one or more particles during a particular
(e.g., predetermined) span of time (e.g., time window). The
detector can detect the nature (e.g., type) of the particles. An
output of the detector can be used in an evaluation of a
cleanliness of the atmosphere (e.g., determination of how clean is
the atmosphere). The evaluation can be used to initiate an
atmosphere cleaning procedure. The cleaning procedure can comprise
purging the atmosphere. The cleaning procedure can comprise
irradiating the atmosphere. The cleaning procedure can comprise
physically or chemically removing debris from the atmosphere. The
apparatus can further comprise a material bed and an energy beam
that transforms at least a portion of the material bed to form the
three-dimensional object. An output of the detector can be used to
adjust at least one characteristics of the energy beam. The at
least one characteristics of the energy beam can comprise a power
(or power per unit area) delivered by the energy beam to the at
least a portion of the material bed, a dwell time of the energy
beam at a position of the material bed (e.g., exposed surface of
the material bed), a footprint of the energy beam on an exposed
surface of the material bed, a focus parameter of the energy beam,
a pulsing sequence of the energy beam, a rate of movement of the
energy beam along a path, or a rate of formation of the
three-dimensional object.
[0063] In another aspect, a method for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a)
forming at least a portion of the three-dimensional object from at
least a portion of a material bed; (b) generating an energy beam
that is directed towards an exposes surface of the material bed;
(c) detecting one or more signals comprising a scattering of the
energy beam from the exposed surface; and (d) evaluating a
roughness of the exposes surface based on the detecting. The method
may further comprise repeating step (a) and adjusting the forming
in step (a) based on the detecting in step (c).
[0064] In another aspect, a system for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a) a
material bed comprising an exposed surface; (b) an energy source
that generates an energy beam directed towards the exposed surface,
wherein the energy source is disposed adjacent to the material bed;
(c) an energy sensor that detects an input signal from the exposed
surface and generates an output signal, which input signal
comprises a scattering and/or an alteration of the energy beam,
which input signal is used to evaluate a roughness of the exposes
surface, wherein the energy sensor is disposed adjacent to the
material bed; and (c) a controller that comprises a processing unit
that evaluates the output signal to determine any adjustment to the
three-dimensional printing. The system may further comprise a
mechanism that is used in the three-dimensional printing. The
mechanism may be disposed adjacent to the material bed. The
controller may be operatively coupled to the mechanism. The
controller may direct the mechanism to alter at least one (of its)
function based on the evaluation.
[0065] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: a
controller that (a) is programmed to direct an energy source to
generate an energy beam that is directed towards an exposed surface
of a material bed, wherein a three-dimensional object is formed
from at least a portion of the material bed by three-dimensional
printing, wherein the energy source is operatively coupled to the
controller; and (b) comprises a processing unit to evaluate a
signal comprising an alteration in the energy beam and/or a
scattering of the energy beam from the exposed surface to determine
a roughness of the exposes surface, which sensor is sensed by a
detector, wherein the detector is operatively coupled to the
controller.
[0066] The evaluation can comprise providing an image output that
can comprise an image, which image is generated using the signal
(e.g., optical signal). The evaluation in step (b) can comprise
processing the image output. The evaluation can comprise image
processing. At least one signal may further comprise the first
energy beam (e.g., that is not altered and/or scattered).
[0067] In another aspect, an apparatus for printing one or more
three-dimensional objects (e.g., a 3D object) comprises: (a) a
material bed comprising an exposed surface; (b) an energy source
generating an energy beam that is directed towards the exposes
surface, wherein the energy source is disposed adjacent to the
material bed; and (c) an energy detector (e.g., sensor) that
detects one or more signals comprising an alteration in the energy
beam and/or a scattering of the energy beam from the exposed
surface, which one or more signals are used to evaluate a roughness
of the exposes surface, wherein the energy beam detector is
disposed adjacent to the material bed.
[0068] Adjacent can be above or below an exposed surface of the
material bed. The material bed can be disposed within an enclosure.
The energy detector can be disposed adjacent to the enclosure.
Wherein adjacent can comprise in the enclosure, outside of the
enclosure, or within a wall of the enclosure. The apparatus may
further comprise an image output that can include at least one
image, which image is generated using the one or more signals. The
evaluation in (b) can comprise processing the image output. The
processing can comprise image processing. The energy beam can be an
electromagnetic beam. The detector can comprise a spectrum
analyzer. The detector can comprise an optical detector. The
optical detector can comprise a camera (e.g., stills and/or video).
The apparatus may further comprise an image processor. The image
processing can be utilized to adjust a leveling of the exposed
surface. The apparatus may further comprise a leveling. The image
processing can be utilized to adjust the operation of the leveling
mechanism. The image processing can be utilized to adjust the rate
of leveling by the leveling mechanism. The image processing can be
utilized to adjust a target level of the material bed according to
which the leveling mechanism and/or material removal mechanism may
level the exposed surface of the material bed. The leveling
mechanism can comprise a blade or an air knife. The material
removal mechanism may comprise a force that attracts the
pre-transformed material away from the material bed towards the
material removal mechanism. The force may comprise vacuum, physical
(e.g., mechanical), magnetic, or electric force. The apparatus may
further comprise a material dispensing mechanism. The material
dispensing mechanism can comprise at least one opening though which
material exits the material dispensing mechanism. The image
processing can be utilized to adjust the operation of the material
dispensing mechanism, material removal mechanism, leveling
mechanism, or any combination or permutation thereof. The image
processing can be utilized to adjust the rate of material dispensed
by the material dispensing mechanism.
[0069] In another aspect, a method for measuring surface roughness
of a three-dimensional object comprises: (a) generating a first
energy beam directed towards a surface of the three-dimensional
object that comprises a feature indicative of a three-dimensional
printing methodology; (b) detecting at least one signal comprising
a scattering of the first energy beam from the surface; and (c)
evaluating a roughness of the surface. The feature can comprise one
or more layers of material. The layers may comprise successively
arranged melt pools.
[0070] In another aspect, a system for measuring surface roughness
of a three-dimensional object comprises: (a) a first energy source
that generates a first energy beam directed towards a surface of
the three-dimensional object that comprises a feature indicative of
a three-dimensional printing methodology, wherein the first energy
source is disposed adjacent to the three-dimensional object; and
(b) an energy sensor that detects an input signal comprising an
alteration of the first energy beam and/or a scattering of the
first energy beam from the surface, wherein the energy sensor is
disposed adjacent to the three-dimensional object; and (d) a
controller that comprises a processing unit, which processing unit
is programmed to evaluate the output signal to determine the
roughness of the surface.
[0071] In another aspect, an apparatus for measuring surface
roughness of a three-dimensional object comprising a controller
that: (a) is programmed to direct an energy source to generate an
energy beam directed towards a surface of the three-dimensional
object that comprises a feature indicative of a three-dimensional
printing methodology, wherein the energy source is operatively
coupled to the controller; (b) comprises a processing unit that
evaluates a signal to determine a roughness of the surface, which
signal comprises an alteration of the energy beam or scattering of
the energy beam from the surface, which signal is sensed by a
sensor, wherein the energy beam, and the sensor are operatively
coupled to the controller.
[0072] The evaluation in step (b) can comprise providing at least
one image output that can comprise at least one image. The image
can be generated using the at least one signal. The evaluation can
comprise processing the image output. The processing can comprise
image processing. The processing can comprise triangulation. The
roughness may be from about a nano scale to about micro scale
roughness, as compared to the average surface. The roughness may be
of a Ra value of at least about 0.1 micrometers. The energy beam
may comprise a collimated light. The processing may comprise using
an algorithm that comprises Lambert's emission law. The result may
be used to evaluate an adjustment of at least one characteristics
(e.g., as disclosed herein) of a second energy beam that is used to
generate the three-dimensional object (e.g., in a subsequent usage
of the three-dimensional printing methodology).
[0073] In another aspect, an apparatus for measuring surface
roughness of a three-dimensional object comprises: (a) an energy
source that generates an energy beam directed towards a surface of
the three-dimensional object that comprises a feature indicative of
a three-dimensional printing methodology, wherein the first energy
source is disposed adjacent to the three-dimensional object; and
(b) an energy detector (e.g., sensor) that detects a signal
comprising an alteration of the first energy beam and/or a
scattering of the first energy beam from the surface, which signal
is used to evaluate a roughness of the surface, wherein the energy
sensor is disposed adjacent to the three-dimensional object.
[0074] The apparatus may further comprise an enclosure. The first
energy source, the three-dimensional object, and/or the energy beam
sensor may be disposed adjacent to (e.g., within) the enclosure.
Adjacent can comprise within or outside of the enclosure. At least
one of the first energy source and the energy sensor may be
disposed within a wall of the enclosure. The enclosure can be open
to the ambient environment. The enclosure can be isolated from the
ambient environment. The apparatus may further comprise an image
output that can comprise at least one image. The image can be
generated using the at least one signal. The evaluation can
comprise processing the image output. The processing can comprise
image processing. The signal may further comprise the first energy
beam (e.g., as non-altered, or before its alteration). The first
energy beam can be an electromagnetic beam. The detector can
comprise a spectrum analyzer. The detector can comprise an optical
detector. The optical detector can comprise a camera. The apparatus
may further comprise an image processor. The image processing can
be used to evaluate a further processing of the three-dimensional
object. The further processing can comprise polishing, trimming, or
cutting. The polishing may comprise chemical or physical polishing.
The physical polishing may comprise blasting. The blasting can
comprise solid blasting, gas blasting, or liquid blasting. The
solid blasting can comprise sand blasting. The gas blasting can
comprise air blasting. The liquid blasting can comprise water
blasting. The blasting can comprise mechanical blasting. The
apparatus may further comprise a material bed and a second energy
beam that transforms at least a portion of the material bed to form
at least a portion of the three-dimensional object. The image
processing can be used to evaluate an adjustment of at least one
characteristics of the second energy beam.
[0075] Another aspect of the present disclosure provides a computer
system comprising one or more computer processors and a
non-transitory computer-readable medium coupled thereto. The
non-transitory computer-readable medium comprises
machine-executable code that, upon execution by the one or more
computer processors, implements any of the methods above or
elsewhere herein.
[0076] In another aspect, a method for three-dimensional printing
comprises (a) providing a powder adjacent to a base, wherein the
powder comprises individual particles having a material selected
from the group consisting of polymer, metal, ceramic and carbon;
(b) additively generating at least a portion of the
three-dimensional object from the powder; (c) collecting signals
from the three-dimensional object or the powder by at least one
detector in sensing communication with the three-dimensional object
or the powder and; (d) processing the signals collected by the at
least one detector to determine (i) a state or property of the
three-dimensional object or the powder, and/or (ii) a state or
progression of the additively generating.
[0077] In another aspect, a method for detecting a discontinuity in
a three-dimensional object comprises (a) providing a
three-dimensional object that is generated from and disposed in a
powder, wherein said powder includes individual particles having a
material selected from the group consisting of polymer, metal,
ceramic and carbon; (b) directing a first ultrasound signal to an
interface between said three-dimensional object or portion thereof
and said powder; (c) receiving a second ultrasound signal from said
interface subsequent to directing said first ultrasound signal; and
(d) detecting a discontinuity in said three-dimensional object at
said interface based on said second ultrasound signal.
[0078] In another aspect, a method of additively generating a
three-dimensional object comprises (a) providing a powder adjacent
to a base, wherein said powder comprises individual particles
having a material selected from the group consisting of polymer,
metal, ceramic and carbon; (b) directing an energy beam to said
powder to additively generate said three-dimensional object or
portion thereof, wherein said energy beam is directed to a location
on said powder that is selected in accordance with a model of said
three-dimensional object; (c) detecting one or more signals emitted
from or adjacent to said location; and (d) generating a spatial or
material profile of said three-dimensional object and/or said
powder from said one or more signals.
[0079] In an aspect, a method for generating a three-dimensional
object comprises (a) providing a powder adjacent to a base, wherein
said powder comprises individual particles having a material
selected from the group consisting of polymer, metal, ceramic and
carbon; (b) directing an energy beam to said powder to additively
form said three-dimensional object or portion thereof, which energy
beam is directed along a pattern that is selected in accordance
with a model design of said three-dimensional object; (c)
collecting signals from said three-dimensional object or said
powder by at least one detector in sensing communication with said
three-dimensional object or said powder; (d) processing said
signals collected by said at least one detector to determine a
deviation of said three-dimensional object or portion thereof from
said model design; and (e) altering said pattern of (b) as
necessary to reduce or maintain said deviation.
[0080] In an aspect, a system for additively generating a
three-dimensional object comprises: a base that accepts a powder
that includes individual particles having a material selected from
the group consisting of polymer, metal, ceramic and carbon; a
powder source that supplies the powder to the base, an energy
source that provides an energy bean to the powder, a detector that
collects one or more signals from the three-dimensional object or
the powder; and a controller that is operatively coupled to the
energy source and the detector, wherein the controller is
programmed to (i) supply of said energy beam from said energy
source to said powder along a pattern that is selected in
accordance with a model design of said three-dimensional object,
(ii) process said one or more signals collected by said detector to
determine a deviation of said three-dimensional object or portion
thereof from said model design, and (iii) alter said pattern as
necessary to reduce or maintain said deviation.
[0081] Additional aspects and advantages of the present disclosure
will become readily apparent to those skilled in this art from the
following detailed description, wherein only illustrative
embodiments of the present disclosure are shown and described. As
will be realized, the present disclosure is capable of other and
different embodiments, and its several details are capable of
modifications in various obvious respects, all without departing
from the disclosure. Accordingly, the drawings and description are
to be regarded as illustrative in nature, and not as
restrictive.
INCORPORATION BY REFERENCE
[0082] All publications, patents, and patent applications mentioned
in this specification are herein incorporated by reference to the
same extent as if each individual publication, patent, or patent
application was specifically and individually indicated to be
incorporated by reference.
BRIEF DESCRIPTION OF THE DRAWINGS
[0083] The novel features of the invention are set forth with
particularity in the appended claims. A better understanding of the
features and advantages of the present invention will be obtained
by reference to the following detailed description that sets forth
illustrative embodiments, in which the principles of the invention
are utilized, and the accompanying drawings (also "Figure" and
"FIG." herein), of which:
[0084] FIG. 1 shows a schematic of a system and apparatuses for
forming a three-dimensional part by a three-dimensional printing
process and monitoring of this process;
[0085] FIG. 2 shows a schematic of a surface comprising
pre-transformed material (e.g., powder) and a three-dimensional
object;
[0086] FIG. 3A and FIG. 3B show schematics of planar alignment
between three-dimensional objects and various surfaces of a
material bed;
[0087] FIG. 4 shows an optical system and apparatuses used in the
present disclosure;
[0088] FIG. 5 shows a schematic of a computer system programmed or
otherwise configured to regulate the formation of a
three-dimensional object;
[0089] FIG. 6 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0090] FIG. 7 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0091] FIG. 8 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0092] FIG. 9 shows a schematic of a system and apparatuses for
detecting the roughness of a three-dimensional object surface.
[0093] FIG. 10 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0094] FIG. 11 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0095] FIG. 12 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0096] FIG. 13 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0097] FIG. 14 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0098] FIG. 15 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0099] FIG. 16 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0100] FIG. 17 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0101] FIG. 18 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0102] FIG. 19 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0103] FIG. 20 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0104] FIG. 21 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0105] FIG. 22 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0106] FIG. 23 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology;
[0107] FIG. 24 shows a schematic of a system and apparatuses for
forming a three-dimensional object by a three-dimensional printing
methodology; and
[0108] FIGS. 25A-25F show various schematic vertical cross sections
of a three-dimensional object in a material bed.
[0109] The figures and components therein may not be drawn to
scale. Various components of the figures described herein may not
be drawn to scale.
DETAILED DESCRIPTION
[0110] While various embodiments of the invention have been shown
and described herein, it will be obvious to those skilled in the
art that such embodiments are provided by way of example only.
Numerous variations, changes, and substitutions may occur to those
skilled in the art without departing from the invention. It should
be understood that various alternatives to the embodiments of the
invention described herein might be employed.
[0111] Terms such as "a," "an" and "the" are not intended to refer
to only a singular entity, but include the general class of which a
specific example may be used for illustration. The terminology
herein is used to describe specific embodiments of the invention,
but their usage does not delimit the invention.
[0112] When ranges are mentioned, the ranges are meant to be
inclusive, unless otherwise specified. For example, a range between
value1 and value2 is meant to be inclusive and include value1 and
value2. The inclusive range will span any value from about value1
to about value2. The term "between" as used herein is meant to be
inclusive unless otherwise specified. For example, between X and Y
is understood herein to mean from X to Y.
[0113] The term "adjacent" or "adjacent to," as used herein,
includes `next to`, `adjoining`, `in contact with,` and `in
proximity to.` In some instances adjacent to may be `above` or
`below.`
[0114] Three-dimensional printing (also "3D printing") generally
refers to a process for generating a 3D object. For example, 3D
printing may refer to sequential addition of material layer or
joining of material layers (or parts of material layers) to form a
3D structure, in a controlled manner. The controlled manner may
include automated control. In the 3D printing process, the
deposited material can be transformed (e.g., fused, sintered,
melted, bound or otherwise connected) to subsequently hardened and
form at least a part of the 3D object. Fusing (e.g., sintering or
melting) binding, or otherwise connecting the material is
collectively referred to herein as transforming the material (e.g.,
powder material). Fusing the material may include melting or
sintering the material. Binding can comprise chemical bonding.
Chemical bonding can comprise covalent bonding. Examples of 3D
printing include additive printing (e.g., layer by layer printing,
or additive manufacturing). 3D printing may include layered
manufacturing. 3D printing may include rapid prototyping. 3D
printing may include solid freeform fabrication. 3D printing may
include direct material deposition. The 3D printing may further
comprise subtractive printing.
[0115] 3D printing methodologies can comprise extrusion, wire,
granular, laminated, light polymerization, or power bed and inkjet
head 3D printing. Extrusion 3D printing can comprise robo-casting,
fused deposition modeling (FDM) or fused filament fabrication
(FFF). Wire 3D printing can comprise electron beam freeform
fabrication (EBF3). Granular 3D printing can comprise direct metal
laser sintering (DMLS), electron beam melting (EBM), selective
laser melting (SLM), selective heat sintering (SHS), or selective
laser sintering (SLS). Power bed and inkjet head 3D printing can
comprise plaster-based 3D printing (PP). Laminated 3D printing can
comprise laminated object manufacturing (LOM). Light polymerized 3D
printing can comprise stereo-lithography (SLA), digital light
processing (DLP), or laminated object manufacturing (LOM).
[0116] 3D printing methodologies may differ from methods
traditionally used in semiconductor device fabrication (e.g., vapor
deposition, etching, annealing, masking, or molecular beam
epitaxy). In some instances, 3D printing may further comprise one
or more printing methodologies that are traditionally used in
semiconductor device fabrication. 3D printing methodologies can
differ from vapor deposition methods such as chemical vapor
deposition, physical vapor deposition, or electrochemical
deposition. In some instances, 3D printing may further include
vapor deposition methods.
[0117] The methods, apparatuses, and systems of the present
disclosure can be used to form 3D objects for various uses and
applications. Such uses and applications include, without
limitation, electronics, components of electronics (e.g., casings),
machines, parts of machines, tools, implants, prosthetics, fashion
items, clothing, shoes, or jewelry. The implants may be directed
(e.g., integrated) to a hard, a soft tissue, or to a combination of
hard and soft tissues. The implants may form adhesion with hard
and/or soft tissue. The machines may include a motor or motor part.
The machines may include a vehicle. The machines may comprise
aerospace related machines. The machines may comprise airborne
machines. The vehicle may include an airplane, drone, car, train,
bicycle, boat, or shuttle (e.g., space shuttle). The machine may
include a satellite or a missile. The uses and applications may
include 3D objects relating to the industries and/or products
listed herein.
[0118] The present disclosure provides systems, apparatuses, and/or
methods for 3D printing of a desired 3D object from an
un-transformed material (e.g., powder material). The object can be
pre-ordered, pre-designed, pre-modeled, or designed in real time
(i.e., during the process of 3D printing). The 3D printing method
can be an additive method in which a first layer is printed, and
thereafter a volume of a material is added to the first layer as
separate sequential layer (or parts thereof). Each additional
sequential layer (or part thereof) can be added to the previous
layer by transforming (e.g., fusing (e.g., melting)) a fraction of
the powder material and subsequently hardening the transformed
material to form at least a portion of the 3D object. The hardening
can be actively induced (e.g., by cooling) or can occur without
intervention.
[0119] A Fundamental length scale may be a diameter, spherical
equivalent diameter, diameter of a bounding circle, or the largest
of height, width and length of an object (e.g., 3D object or a
particle). The fundamental length scale (herein abbreviated as
"FLS") of the printed 3D object can be at least about 50
micrometers (.mu.m), 80 .mu.m, 100 .mu.m, 120 .mu.m, 150 .mu.m, 170
.mu.m, 200 .mu.m, 230 .mu.m, 250 .mu.m, 270 .mu.m, 300 .mu.m, 400
.mu.m, 500 .mu.m, 600 .mu.m, 700 .mu.m, 800 .mu.m, 1 millimeter
(mm), 1.5 mm, 2 mm, 5 mm, 1 centimeter (cm), 1.5 cm, 2 cm, 10 cm,
20 cm, 30 cm, 40 cm, 50 cm, 60 cm, 70 cm, 80 cm, 90 cm, 1 m, 2 m, 3
m, 4 m, 5 m, 10 m, 50 m, 80 m, or 100 m. The FLS of the printed 3D
object can be at most about 1000 m, 500 m, 100 m, 80 m, 50 m, 10 m,
5 m, 4 m, 3 m, 2 m, 1 m, 90 cm, 80 cm, 60 cm, 50 cm, 40 cm, 30 cm,
20 cm, 10 cm, or 5 cm. In some cases the FLS of the printed 3D
object may be in between any of the afore-mentioned FLSs (e.g.,
from about 50 .mu.m to about 1000 m, from about 120 .mu.m to about
1000 m, from about 120 .mu.m to about 10 m, from about 200 .mu.m to
about 1 m, or from about 150 .mu.m to about 10 m).
[0120] Disclosed herein are detection systems and/or apparatuses.
The detection systems and/or apparatuses comprise at least one
detector (e.g., sensor). The detection systems and/or apparatuses
comprise at least one detector (e.g., sensor) and at least one
signal generator. The signal generator may comprise an energy
source. The energy source may generate one or more energy beams.
The energy source may generate an electromagnetic, charged
particle, or sound energy. The energy may be an energy beam. The
energy beam may be collimated or dispersed. At times, the detection
systems may not include a signal generator. At times, the signal
that is detected by the detector is generated during the 3D
printing process. At times, the signal that is detected by the
detector is present during the 3D printing process. At times, the
signal that is detected by the detector is present in the 3D system
and/or apparatus (e.g., in the chamber or any parts thereof)
before, during, and/or after the 3D printing process. FIG. 7 shows
an example of a 3D printing system and apparatus in which the
platform (e.g., the base 702) comprises detectors and/or energy
sources schematically represented as 717, which directly contact
the material bed 704. The systems and/or apparatuses employed by
the methods described herein may comprise a multiplicity of sensors
and/or detectors. The one or more sensors and/or detectors may be
disposed as an array and/or as a matrix. For example, FIG. 7, shows
an example of an array of sensors and/or detectors 717. The one or
more sensors and/or detectors may be stationary or moving. The one
or more sensors and/or detectors can be movable with the aid of a
motor and/or a scanner. The one or more sensors and/or detectors
can be coupled to the motor and/or scanner. The one or more sensors
and/or detectors can be situated above, below, or to the side of
the material bed. Above may be a direction opposite to the
direction of the gravitational field and/or bottom of the
enclosure. Below may be in the direction of the gravitational field
and/or bottom of the enclosure (e.g., FIG. 6, 611). FIG. 17 shows
an example of a system and apparatuses that can be used in the
methods described herein, depicting sensors and/or detectors 1717
that are disposed at the bottom of the enclosure 1707. The one or
more sensors and/or detectors may be embedded in any part of the
enclosure. The one or more sensors and/or detectors may be situated
above, below, or to the side of the platform (e.g., in FIG. 7 the
platform includes a substrate 709 and a base 702). The one or more
sensors and/or detectors may be embedded in the platform. For
example, the one or more sensors and/or detectors may be embedded
in the base. The one or more sensors and/or detectors may be
embedded in the base while contacting (directly or indirectly) the
material bed. Indirectly may comprise having one or more
intervening surfaces and/or coatings (e.g., non-stick coating).
FIG. 16 shows an example of a system and apparatuses that can be
used in the methods described herein, in which an array of sensors
and/or energy sources 1617 is disposed in the substrate 1609 that
is located adjacent to the material bed 1604, and is separated from
the material bed by the base 1602. The one or more sensors and/or
detectors may be embedded in any wall of the enclosure, in the
mechanisms within or outside of the enclosure, in the elevator
translating the platform (e.g., FIG. 6, 612). The mechanism may
comprise a material dispensing mechanism (e.g., FIG. 6, 616),
material leveling mechanism (e.g., FIG. 6, 617), cooling member
(e.g., FIG. 6, 613), energy source (e.g., FIG. 4, 400), or any
combination thereof. The one or more sensors and/or detectors may
be disposed inside and/or outside of the enclosure.
[0121] At least one surface of the platform (e.g., the surface that
directly contacts the material bed) may comprise a self-cleaning
surface. The self-cleaning surface may comprise a geometry that
reduces (e.g., deters or hinders) adhesion to it. The self-cleaning
surface may comprise a material that reduces adhesion of the
transformed material and/or the non-transformed material (e.g.,
powder) to the surface. The self-cleaning surface may comprise a
planar or non-planar surface. The self-cleaning surface may
comprise a non-tacky surface. The self-cleaning surface may
comprise lotus or shark-skin micro or nano-structure. The surface
of the substrate may comprise protrusions or depressions that
reduce adherence to the surface. At least one surface of the
platform (e.g., the surface that directly contacts the material
bed) may comprise tacky surface. The tacky surface may comprise a
geometry that increases adhesion to it. The tacky surface may
comprise a material that increases adhesion of the transformed
material and/or the non-transformed material (e.g., powder) to the
surface. The tacky surface may be magnetic. The tacky surface may
comprise a planar or non-planar surface. The surface may comprise
lotus or shark-skin micro or nano-structure. The surface may
comprise protrusions or depressions that reduce adherence to the
surface.
[0122] At least one of (e.g., both) the source and/or the detector
may be embedded in the platform (e.g., in the base), walls of the
enclosure, any other part within the enclosure, or any combination
thereof. At least one of (e.g., both) the source and/or the
detector may be stationary or moveable. At least one of (e.g.,
both) the source and/or the detector may be above, below, or to the
side of the material bed.
[0123] At least one of (e.g., both) the source and/or the detector
may be embedded in the platform in a stationary manner (e.g.,
non-translatable). At least one of (e.g., both) the source and/or
the detector may be embedded in the platform and be translatable
within the platform. The translation may be in one or more channels
(e.g., pipes) that are grafted into the platform. The channels may
be covered (e.g., by a coating and/or a surface). The translation
may be in a path (e.g., predetermined path) that is controlled
(e.g., regulated and/or directed) by the controller. FIG. 22 shows
an example of a sensor and/or energy source 2217 that is disposed
in a channel 2202, shown as a vertical cross section. The sensor
and/or energy source (e.g., transceiver) 2217 may travel along a
path 2209. The sensor and/or energy source may be operatively
coupled to the controller.
[0124] The material used herein may comprise elemental metal, metal
alloy, ceramics, or an allotrope of elemental carbon. The allotrope
of elemental carbon may comprise amorphous carbon, graphite,
graphene, diamond, or fullerene. The fullerene may be selected from
the group consisting of a spherical, elliptical, linear, and
tubular fullerene. The fullerene may comprise a buckyball or a
carbon nanotube. The ceramic material may comprise cement. The
ceramic material may comprise alumina. The material may comprise
sand, glass, or stone. In some embodiments, the material may
comprise an organic material, for example, a polymer or a resin.
The organic material may comprise a hydrocarbon. The polymer may
comprise styrene. The organic material may comprise carbon and
hydrogen atoms. The organic material may comprise carbon and oxygen
atoms. The organic material may comprise carbon and nitrogen atoms.
The organic material may comprise carbon and sulfur atoms. In some
embodiments, the material may exclude an organic material. The
material may comprise a solid or a liquid. In some embodiments, the
material may comprise a silicon-based material, for example,
silicon based polymer or a resin. The material may comprise an
organosilicon-based material. The material may comprise silicon and
hydrogen atoms. The material may comprise silicon and carbon atoms.
In some embodiments, the material may exclude a silicon-based
material. The solid material may comprise powder material. The
powder material may be coated by a coating (e.g., organic coating
such as the organic material (e.g., plastic coating)). The material
may be devoid of organic material. The liquid material may be
compartmentalized into reactors, vesicles, or droplets. The
compartmentalized material may be compartmentalized in one or more
layers. The material may be a composite material comprising a
secondary material. The secondary material can be a reinforcing
material (e.g., a material that forms a fiber). The reinforcing
material may comprise a carbon fiber, Kevlar.RTM., Twaron.RTM.,
ultra-high-molecular-weight polyethylene, or glass fiber. The
material can comprise powder (e.g., granular material) or wires.
The material may be an un-transformed material (e.g., powder), a
transformed material (e.g., molten material), a hardened material
(e.g., solid material), or any combination thereof.
[0125] At least parts of the layer can be transformed to a
transformed material that may subsequently form at least a fraction
(also used herein "a portion," or "a part") of a hardened (e.g.,
solidified) 3D object. At times a layer of transformed or hardened
material may comprise a cross section of a 3D object (e.g., a
horizontal cross section). At times a layer of transformed or
hardened material may comprise a deviation from a cross section of
a 3D object. The deviation may include vertical or horizontal
deviation. An un-transformed material may be a powder material. An
un-transformed material layer (or a portion thereof) can have a
thickness of at least about 5 micrometer (.mu.m), 10 .mu.m, 50
.mu.m, 100 .mu.m, 150 .mu.m, 200 .mu.m, 300 .mu.m, 400 .mu.m, 500
.mu.m, 600 .mu.m, 700 .mu.m, 800 .mu.m, 900 .mu.m, or 1000 .mu.m.
An un-transformed material layer (or a portion thereof) can have a
thickness of at most about 1000 .mu.m, 900 .mu.m, 800 .mu.m, 700
.mu.m, 60 .mu.m, 500 .mu.m, 450 .mu.m, 400 .mu.m, 350 .mu.m, 300
.mu.m, 250 .mu.m, 200 .mu.m, 150 .mu.m, 100 .mu.m, 75 .mu.m, 50
.mu.m, 40 .mu.m, 30 .mu.m, 20 .mu.m, 10 .mu.m, or 5 .mu.m. An
un-transformed material layer (or a portion thereof) may have any
value in between the aforementioned layer thickness values (e.g.,
from about 1000 .mu.m to about 5 .mu.m, 800 .mu.m to about 5 .mu.m,
600 .mu.m to about 20 .mu.m, 300 .mu.m to about 30 .mu.m, or 1000
.mu.m to about 10 .mu.m). The material composition of at least one
layer within the material bed may differ from the material
composition within at least one other layer in the material bed.
The difference (e.g., variation) may comprise difference in crystal
or grain structure. The variation may comprise variation in grain
orientation, variation in material density, variation in the degree
of compound segregation to grain boundaries, variation in the
degree of element segregation to grain boundaries, variation in
material phase, variation in metallurgical phase, variation in
material porosity, variation in crystal phase, and variation in
crystal structure. The microstructure of the printed object may
comprise planar structure, cellular structure, columnar dendritic
structure, or equiaxed dendritic structure.
[0126] The un-transformed materials of at least one layer in the
material bed may differ in the fundamental length scale of its
particles (e.g., powder particles) from the FLS of the
un-transformed material within at least one other layer in the
material bed. A layer may comprise two or more material types at
any combination. For example, two or more elemental metals, two or
more metal alloys, two or more ceramics, two or more allotropes of
elemental carbon. For example an elemental metal and a metal alloy,
an elemental metal and a ceramic, an elemental metal and an
allotrope of elemental carbon, a metal alloy and a ceramic, a metal
alloy and an allotrope of elemental carbon, a ceramic and an
allotrope of elemental carbon. All the layers of un-transformed
material deposited during the 3D printing process may be of the
same material composition. In some instances, a metal alloy is
formed in situ during the process of transforming at least a
portion of the material bed. In some instances, a metal alloy is
not formed in situ during the process of transforming at least a
portion of the material bed. In some instances, a metal alloy is
formed prior to the process of transforming at least a portion of
the material bed. In a multiplicity (e.g., mixture) of
un-transformed (e.g., powder) materials, one un-transformed
material may be used as support (i.e., supportive powder), as an
insulator, as a cooling member (e.g., heat sink), or as any
combination thereof.
[0127] In some instances, adjacent components in the material bed
are separated from one another by one or more intervening layers.
In an example, a first layer is adjacent to a second layer when the
first layer is in direct contact with the second layer. In another
example, a first layer is adjacent to a second layer when the first
layer is separated from the second layer by at least one layer
(e.g., a third layer). The intervening layer may be of any layer
size disclosed herein. The one or more intervening layers can have
a thickness less than or equal to about 1 millimeter (mm), 0.5 mm,
or 0.1 mm. In an example, a first layer is adjacent to a second
layer when the first layer is in direct contact with the second
layer. In another example, a first layer is adjacent to a second
layer when the first layer is separated from the second layer by a
third layer.
[0128] The un-transformed material (e.g., powder material) can be
chosen such that the material is the desired and/or otherwise
predetermined material for the 3D object. In some cases, a layer of
the 3D object comprises a single type of material. In some
examples, a layer of the 3D object may comprise a single elemental
metal type, or a single metal alloy type. In some examples, a layer
within the 3D object may comprise several types of material (e.g.,
an elemental metal and an alloy, an alloy and a ceramics, an alloy
and an allotrope of elemental carbon). In certain embodiments each
type of material comprises only a single member of that type. For
example: a single member of elemental metal (e.g., iron), a single
member of metal alloy (e.g., stainless steel), a single member of
ceramic material (e.g., silicon carbide or tungsten carbide), or a
single member (e.g., an allotrope) of elemental carbon (e.g.,
graphite). In some cases, a layer of the 3D object comprises more
than one type of material. In some cases, a layer of the 3D object
comprises more than one member of a material type.
[0129] The elemental metal can be an alkali metal, an alkaline
earth metal, a transition metal, a rare earth element metal, or
another metal. The alkali metal can be Lithium, Sodium, Potassium,
Rubidium, Cesium, or Francium. The alkali earth metal can be
Beryllium, Magnesium, Calcium, Strontium, Barium, or Radium. The
transition metal can be Scandium, Titanium, Vanadium, Chromium,
Manganese, Iron, Cobalt, Nickel, Copper, Zinc, Yttrium, Zirconium,
Platinum, Gold, Rutherfordium, Dubnium, Seaborgium, Bohrium,
Hassium, Meitnerium, Ununbium, Niobium, Iridium, Molybdenum,
Technetium, Ruthenium, Rhodium, Palladium, Silver, Cadmium,
Hafnium, Tantalum, Tungsten, Rhenium, or Osmium. The transition
metal can be mercury. The rare earth metal can be a lanthanide, or
an actinide. The lanthanide metal can be Lanthanum, Cerium,
Praseodymium, Neodymium, Promethium, Samarium, Europium,
Gadolinium, Terbium, Dysprosium, Holmium, Erbium, Thulium,
Ytterbium, or Lutetium. The actinide metal can be Actinium,
Thorium, Protactinium, Uranium, Neptunium, Plutonium, Americium,
Curium, Berkelium, Californium, Einsteinium, Fermium, Mendelevium,
Nobelium, or Lawrencium. The other metal can be Aluminum, Gallium,
Indium, Tin, Thallium, Lead, or Bismuth.
[0130] The metal alloy can be an iron based alloy, nickel based
alloy, cobalt based allow, chrome based alloy, cobalt chrome based
alloy, titanium based alloy, magnesium based alloy, copper based
alloy, or any combination thereof. The alloy may comprise an
oxidation or corrosion resistant alloy. The alloy may comprise a
super alloy (e.g., Inconel). The super alloy may comprise Inconel
600, 617, 625, 690, 718, or X-750. The metal (e.g., alloy or
elemental) may comprise an alloy used for applications in
industries comprising aerospace (e.g., aerospace super alloys), jet
engine, missile, automotive, marine, locomotive, satellite,
defense, oil & gas, energy generation, semiconductor, fashion,
construction, agriculture, printing, or medical. The metal (e.g.,
alloy or elemental) may comprise an alloy used for products
comprising, devices, medical devices (human & veterinary),
machinery, cell phones, semiconductor equipment, generators,
engines, pistons, electronics (e.g., circuits), electronic
equipment, agriculture equipment, motor, gear, transmission,
communication equipment, computing equipment (e.g., laptop, cell
phone, i-pad), air conditioning, generators, furniture, musical
equipment, art, jewelry, cooking equipment, or sport gear. The
metal (e.g., alloy or elemental) may comprise an alloy used for
products for human or veterinary applications comprising implants,
or prosthetics. The metal alloy may comprise an alloy used for
applications in the fields comprising human or veterinary surgery,
implants (e.g., dental), or prosthetics.
[0131] The alloy may include a super alloy. The alloy may include a
high-performance alloy. The alloy may include an alloy exhibiting
at least one of excellent mechanical strength, resistance to
thermal creep deformation, good surface stability, resistance to
corrosion, and resistance to oxidation. The alloy may include a
face-centered cubic austenitic crystal structure. The alloy may
comprise Hastelloy, Inconel, Waspaloy, Rene alloy (e.g., Rene-80,
Rene-77, Rene-220, or Rene-41), Haynes alloy, Incoloy, MP98T, TMS
alloy, MTEK (e.g., MTEK grade MAR-M-247, MAR-M-509, MAR-M-R41, or
MAR-M-X-45), or CMSX (e.g., CMSX-3, or CMSX-4). The alloy can be a
single crystal alloy.
[0132] In some instances, the iron alloy comprises Elinvar,
Fernico, Ferroalloys, Invar, Iron hydride, Kovar, Spiegeleisen,
Staballoy (stainless steel), or Steel. In some instances the metal
alloy is steel. The Ferroalloy may comprise Ferroboron,
Ferrocerium, Ferrochrome, Ferromagnesium, Ferromanganese,
Ferromolybdenum, Ferronickel, Ferrophosphorus, Ferrosilicon,
Ferrotitanium, Ferrouranium, or Ferrovanadium. The iron alloy may
include cast iron, or pig iron. The steel may include Bulat steel,
Chromoly, Crucible steel, Damascus steel, Hadfield steel, High
speed steel, HSLA steel, Maraging steel, Reynolds 531, Silicon
steel, Spring steel, Stainless steel, Tool steel, Weathering steel,
or Wootz steel. The high-speed steel may include Mushet steel. The
stainless steel may include AL-6XN, Alloy 20, celestrium, marine
grade stainless, Martensitic stainless steel, surgical stainless
steel, or Zeron 100. The tool steel may include Silver steel. The
steel may comprise stainless steel, Nickel steel, Nickel-chromium
steel, Molybdenum steel, Chromium steel, Chromium-vanadium steel,
Tungsten steel, Nickel-chromium-molybdenum steel, or
Silicon-manganese steel. The steel may be comprised of any Society
of Automotive Engineers (SAE) grade such as 440F, 410, 312, 430,
440A, 440B, 440C, 304, 305, 304L, 304L, 301, 304LN, 301LN, 2304,
316, 316L, 316LN, 316, 316LN, 316L, 316L, 316, 317L, 2205, 409,
904L, 321, 254SMO, 316Ti, 321H, or 304H. The steel may comprise
stainless steel of at least one crystalline structure selected from
the group consisting of austenitic, superaustenitic, ferritic,
martensitic, duplex, and precipitation-hardening martensitic.
Duplex stainless steel may be lean duplex, standard duplex, super
duplex, or hyper duplex. The stainless steel may comprise surgical
grade stainless steel (e.g., austenitic 316, martensitic 420, or
martensitic 440). The austenitic 316 stainless steel may include
316L, or 316LVM. The steel may include 17-4 Precipitation Hardening
steel (also known as type 630, a chromium-copper precipitation
hardening stainless steel, 17-4PH steel).
[0133] The titanium-based alloys may include alpha alloys, near
alpha alloys, alpha and beta alloys, or beta alloys. The titanium
alloy may comprise grade 1, 2, 2H, 3, 4, 5, 6, 7, 7H, 8, 9, 10, 11,
12, 13, 14, 15, 16, 16H, 17, 18, 19, 20, 21, 2, 23, 24, 25, 26,
26H, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, or higher. In
some instances the titanium base alloy includes Ti-6Al-4V or
Ti-6Al-7Nb.
[0134] The Nickel alloy may include Alnico, Alumel, Chromel,
Cupronickel, Ferronickel, German silver, Hastelloy, Inconel, Monel
metal, Nichrome, Nickel-carbon, Nicrosil, Nisil, Nitinol, or
Magnetically "soft" alloys. The magnetically "soft" alloys may
comprise Mu-metal, Permalloy, Supermalloy, or Brass. The brass may
include Nickel hydride, Stainless or Coin silver. The cobalt alloy
may include Megallium, Stellite (e. g. Talonite), Ultimet, or
Vitallium. The chromium alloy may include chromium hydroxide, or
Nichrome.
[0135] The aluminum alloy may include AA-8000, Al--Li
(aluminum-lithium), Alnico, Duralumin, Hiduminium, Kryron
Magnalium, Nambe, Scandium-aluminum, or Y alloy. The magnesium
alloy may be Elektron, Magnox, or T-Mg--Al--Zn (Bergman phase)
alloy.
[0136] The copper alloy may comprise Arsenical copper, Beryllium
copper, Billon, Brass, Bronze, Constantan, Copper hydride,
Copper-tungsten, Corinthian bronze, Cunife, Cupronickel, Cymbal
alloys, Devarda's alloy, Electrum, Hepatizon, Heusler alloy,
Manganin, Molybdochalkos, Nickel silver, Nordic gold, Shakudo, or
Tumbaga. The Brass may include Calamine brass, Chinese silver,
Dutch metal, Gilding metal, Muntz metal, Pinchbeck, Prince's metal,
or Tombac. The Bronze may include Aluminum bronze, Arsenical
bronze, Bell metal, Florentine bronze, Guanin, Gunmetal, Glucydur,
Phosphor bronze, Ormolu, or Speculum metal.
[0137] In some examples the material (e.g., powder material)
comprises a material wherein its constituents (e.g., atoms or
molecules) readily lose their outer shell electrons, resulting in a
free flowing cloud of electrons within their otherwise solid
arrangement. In some examples the material is characterized in
having high electrical conductivity, low electrical resistivity,
high thermal conductivity, or high density (e.g., as measured at
ambient temperature (e.g., R.T., or 20.degree. C.)). The high
electrical conductivity can be at least about 1*10.sup.5 Siemens
per meter (S/m), 5*10.sup.5 S/m, 1*10.sup.6 S/m, 5*10.sup.6 S/m,
1*10.sup.7 S/m, 5*10.sup.7 S/m, or 1*10.sup.8 S/m. The symbol "*"
designates the mathematical operation "times," or "multiplied by."
The high electrical conductivity can be any value between the
aforementioned electrical conductivity values (e.g., from about
1*10.sup.5 S/m to about 1*10.sup.8 S/m). The low electrical
resistivity may be at most about 1*10.sup.-5 ohm times meter
(.OMEGA.*m), 5*10.sup.-6 .OMEGA.*m, 1*10.sup.-6 .OMEGA.*m,
5*10.sup.-7 .OMEGA.*m, 1*10.sup.-7 .OMEGA.*m, 5*10.sup.-8, or
1*10.sup.-8 .OMEGA.*m. The low electrical resistivity can be any
value between the aforementioned electrical resistivity values
(e.g., from about 1.times.10.sup.-5 .OMEGA.*m to about
1.times.10.sup.-8 .OMEGA.*m). The high thermal conductivity may be
at least about 20 Watts per meters times degrees Kelvin (W/mK), 50
W/mK, 100 W/mK, 150 W/mK, 200 W/mK, 205 W/mK, 300 W/mK, 350 W/mK,
400 W/mK, 450 W/mK, 500 W/mK, 550 W/mK, 600 W/mK, 700 W/mK, 800
W/mK, 900 W/mK, or 1000 W/mK. The high thermal conductivity can be
any value between the aforementioned thermal conductivity values
(e.g., from about 20 W/mK to about 1000 W/mK). The high density may
be at least about 1.5 grams per cubic centimeter (g/cm.sup.3), 2
g/cm.sup.3, 3 g/cm.sup.3, 4 g/cm.sup.3, 5 g/cm.sup.3, 6 g/cm.sup.3,
7 g/cm.sup.3, 8 g/cm.sup.3, 9 g/cm.sup.3, 10 g/cm.sup.3, 11
g/cm.sup.3, 12 g/cm.sup.3, 13 g/cm.sup.3, 14 g/cm.sup.3, 15
g/cm.sup.3, 16 g/cm.sup.3, 17 g/cm.sup.3, 18 g/cm.sup.3, 19
g/cm.sup.3, 20 g/cm.sup.3, or 25 g/cm.sup.3. The high density can
be any value between the aforementioned density values (e.g., from
about 1 g/cm.sup.3 to about 25 g/cm.sup.3).
[0138] A metallic material (e.g., elemental metal or metal alloy)
can comprise small amounts of non-metallic materials, such as, for
example, oxygen, sulfur, or nitrogen. In some cases, the metallic
material can comprise the non-metallic material in a trace amount.
A trace amount can be at most about 100000 parts per million (ppm),
10000 ppm, 1000 ppm, 500 ppm, 400 ppm, 200 ppm, 100 ppm, 50 ppm, 10
ppm, 5 ppm, or 1 ppm (on the basis of weight, w/w) of non-metallic
material. A trace amount can comprise at least about 10 ppt, 100
ppt, 1 ppb, 5 ppb, 10 ppb, 50 ppb, 100 ppb, 200 ppb, 400 ppb, 500
ppb, 1000 ppb, 1 ppm, 10 ppm, 100 ppm, 500 ppm, 1000 ppm, or 10000
ppm (on the basis of weight, w/w) of non-metallic material. A trace
amount can be any value between the afore-mentioned trace amounts
(e.g., from about 10 parts per trillion (ppt) to about 100000 ppm,
from about 1 ppb to about 100000 ppm, from about 1 ppm to about
10000 ppm, or from about 1 ppb to about 1000 ppm).
[0139] The material may comprise a powder material. The material
may comprise a solid material. The material may comprise one or
more particles or clusters. The term "powder," as used herein,
generally refers to a solid having fine particles. The particles
may be solid particles. The powder may be a granulate material. The
powder may also be referred to as "particulate material." Powders
may be granular materials. The powder particles may comprise
nanoparticles, microparticles, and/or mesoparticles. In some
examples, a powder comprising particles having an average or a mean
FLS of at least about 5 nanometers (nm), 10 nm, 20 nm, 30 nm, 40
nm, 50 nm, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 1 .mu.m, 5
.mu.m, 10 .mu.m, 15 .mu.m, 20 .mu.m, 25 .mu.m, 30 .mu.m, 35 .mu.m,
40 .mu.m, 45 .mu.m, 50 .mu.m, 55 .mu.m, 60 .mu.m, 65 .mu.m, 70
.mu.m, 75 .mu.m, 80 .mu.m, or 100 .mu.m. The particles comprising
the powder may have an average or mean FLS of at most about 100
.mu.m, 80 .mu.m, 75 .mu.m, 70 .mu.m, 65 .mu.m, 60 .mu.m, 55 .mu.m,
50 .mu.m, 45 .mu.m, 40 .mu.m, 35 .mu.m, 30 .mu.m, 25 .mu.m, 20
.mu.m, 15 .mu.m, 10 .mu.m, 5 .mu.m, 1 .mu.m, 500 nm, 400 nm, 300
nm, 200 nm, 100 nm, 50 nm, 40 nm, 30 nm, 20 nm, 10 nm, or 5 nm. In
some cases the powder may have an average or mean FLS between any
of the values (e.g., from about 5 nm to about 100 .mu.m, from about
1 .mu.m to about 100 .mu.m, from about 15 .mu.m to about 45 .mu.m,
from about 5 .mu.m to about 80 .mu.m, from about 20 .mu.m to about
80 .mu.m, or from about 500 nm to about 50 .mu.m). In some
examples, powders are particles having an average or mean FLS
ranging from about 1 nanometers (nm) to about 1000 micrometers
(microns), 500 microns, 400 microns, 300 microns, 200 microns, 100
microns, 50 microns, 40 microns, 30 microns, 20 microns, 10
microns, 1 micron, 500 nanometers (nm), 400 nm, 300 nm, 200 nm, 100
nm, 50 nm, 40 nm, 30 nm, 20 nm, or 10 nm.
[0140] The powder can be composed of individual particles. The
individual particles can be spherical, oval, prismatic, cubic, or
irregularly shaped. The particles can have a FLS. The powder can be
composed of a homogenously shaped particle mixture such that all of
the particles have substantially the same shape and FLS magnitude
within at most 1%, 5%, 8%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 50%,
60%, or 70%, distribution of FLS. In some cases the powder can be a
heterogeneous mixture such that the particles have variable shape
and/or FLS magnitude.
[0141] Powders can be formed of a material selected from polymer,
elemental metal, metal alloy, ceramic and elemental carbon. For
example, the powder can be formed from nickel, Inconel, maraging
steel, and/or stainless steel. In an example, a powder is formed of
individual carbon particles (e.g., graphite). In another example, a
powder is formed of individual titanium, AlOx or SiOx
particles.
[0142] FIG. 6 depicts an example of a system that can be used to
generate a 3D object using a 3D printing process disclosed herein.
The system can include an enclosure (e.g., a chamber 607). At least
a fraction of the components in the system can be enclosed in the
chamber. At least a fraction of the chamber can be filled with a
gas to create a gaseous environment (i.e., an atmosphere). The gas
can be an inert gas (e.g., Argon, Neon, Helium, Nitrogen). The
chamber can be filled with another gas or mixture of gases. The gas
can be a non-reactive gas (e.g., an inert gas). The gaseous
environment can comprise argon, nitrogen, helium, neon, krypton,
xenon, hydrogen, carbon monoxide, or carbon dioxide. The pressure
in the chamber can be at least 10.sup.-7 Torr, 10.sup.-6 Torr,
10.sup.-5 Torr, 10.sup.-4 Torr, 10.sup.-3 Torr, 10.sup.-2 Torr,
10.sup.-1 Torr, 1 Torr, 10 Torr, 100 Torr, 1 bar, 2 bar, 3 bar, 4
bar, 5 bar, 10 bar, 20 bar, 30 bar, 40 bar, 50 bar, 100 bar, 200
bar, 300 bar, 400 bar, 500 bar, 1000 bar, or more. The pressure in
the chamber can be at least 100 Torr, 200 Torr, 300 Torr, 400 Torr,
500 Torr, 600 Torr, 700 Torr, 720 Torr, 740 Torr, 750 Torr, 760
Torr, 900 Torr, 1000 Torr, 1100 Torr, or 1200 Torr. The pressure in
the chamber can be at most 10.sup.-7 Torr, 10.sup.-6 Torr,
10.sup.-5 Torr, or 10.sup.-4 Torr, 10.sup.-3 Torr, 10.sup.=2 Torr,
10.sup.-1 Torr, 1 Torr, 10 Torr, 100 Torr, 200 Torr, 300 Torr, 400
Torr, 500 Torr, 600 Torr, 700 Torr, 720 Torr, 740 Torr, 750 Torr,
760 Torr, 900 Torr, 1000 Torr, 1100 Torr, or 1200 Torr. The
pressure in the chamber can be at a range between any of the
aforementioned pressure values (e.g., from about 10.sup.-7 Torr to
about 1200 Torr, from about 10.sup.-7 Torr to about 1 Torr, from
about 1 Torr to about 1200 Torr, or from about 10.sup.-2 Torr to
about 10 Torr). The pressure can be measured by a pressure gauge.
The pressure can be measured at ambient temperature (e.g., R.T.).
In some cases the pressure in the chamber can be standard
atmospheric pressure. In some cases the pressure in the chamber can
be ambient pressure (i.e., neutral pressure). In some examples, the
chamber can be under vacuum pressure. In some examples, the chamber
can be under a positive pressure (i.e., above ambient
pressure).
[0143] The chamber can comprise two or more gaseous layers. The
gaseous layers can be separated by molecular weight or density such
that a first gas with a first molecular weight or density is
located in a first region below the imaginary line FIG. 6, 614, and
a second gas with a second molecular weight or density is located
in a second region of the chamber above the imaginary line 614. The
first molecular weight or density may be smaller than the second
molecular weight or density. The first molecular weight or density
may be larger than the second molecular weight or density. The
gaseous layers can be separated by temperature. The first gas can
be in a lower region of the chamber relative to the second gas. The
second gas and the first gas can be in adjacent locations. The
second gas can be on top of, over, and/or above the first gas. In
some cases the first gas can be argon and the second gas can be
helium. The molecular weight or density of the first gas can be at
least about 1.5*, 2*, 3*, 4*, 5*, 10*, 15*, 20*, 25*, 30*, 35*,
40*, 50*, 55*, 60*, 70*, 75*, 80*, 90*, 100*, 200*, 300*, 400*, or
500* larger or greater than the molecular weight or density of the
second gas (e.g., measured at ambient temperature). "*" used herein
designates the mathematical operation "times." The molecular weight
of the first gas can be higher than the molecular weight of air.
The molecular weight or density of the first gas can be higher than
the molecular weight or density of oxygen gas (e.g., O.sub.2). The
molecular weight or density of the first gas can be higher than the
molecular weight or density of nitrogen gas (e.g., N.sub.2). At
times, the molecular weight or density of the first gas may be
lower than that of oxygen gas or nitrogen gas.
[0144] The first gas with the relatively higher molecular weight or
density can fill a region of the system where at least a fraction
of the powder is stored. The second gas with the relatively lower
molecular weight or density can fill a region of the system and/or
apparatus (e.g., 604) where the 3D object is formed. The material
layer can be supported on a substrate (e.g., 609). The substrate
can have a circular, rectangular, square, or irregularly shaped
cross-section. The substrate may comprise a base disposed above the
substrate. The substrate may comprise a base (e.g., 602) disposed
between the substrate and a material layer (or a space to be
occupied by a material layer). A thermal control unit (e.g., a
cooling member such as a heat sink or a cooling plate, a heating
plate, or a thermostat 613) can be provided inside of the region
where the 3D object is formed or adjacent to (e.g., above) the
region where the 3D object is formed. Additionally or
alternatively, the thermal control unit can be provided outside of
the region where the 3D object is formed (e.g., at a predetermined
distance). In some cases the thermal control unit can form at least
one section of a boundary region where the 3D object is formed
(e.g., the container accommodating the powder bed).
[0145] The concentration of oxygen and/or humidity in the enclosure
(e.g., chamber) can be minimized (e.g., below a predetermined
threshold value). For example, the gas composition of the chamber
can contain a level of oxygen and/or humidity that is at most about
100 parts per billion (ppb), 10 ppb, 1 ppb, 0.1 ppb, 0.01 ppb,
0.001 ppb, 100 parts per million (ppm), 10 ppm, 1 ppm, 0.1 ppm,
0.01 ppm, or 0.001 ppm. The gas composition of the chamber can
contain an oxygen and/or humidity level between any of the
aforementioned values (e.g., from about 100 ppb to about 0.001 ppm,
from about 1 ppb to about 0.01 ppm, or from about 1 ppm to about
0.1 ppm). The gas composition may be measures by one or more
sensors (e.g., an oxygen and/or humidity sensor.). In some cases,
the chamber can be opened at the completion of a formation of a 3D
object. When the chamber is opened, ambient air containing oxygen
and/or humidity can enter the chamber. Exposure of one or more
components inside of the chamber to air can be reduced by, for
example, flowing an inert gas while the chamber is open (e.g., to
prevent entry of ambient air), or by flowing a heavy gas (e.g.,
argon) that rests on the surface of the powder bed. In some cases,
components that absorb oxygen and/or humidity on to their
surface(s) can be sealed while the chamber is open.
[0146] The chamber can be configured such that gas inside of the
chamber has a relatively low leak rate from the chamber to an
environment outside of the chamber. In some cases the leak rate can
be at most about 100 milliTorr/minute (mTorr/min), 50 mTorr/min, 25
mTorr/min, 15 mTorr/min, 10 mTorr/min, 5 mTorr/min, 1 mTorr/min,
0.5 mTorr/min, 0.1 mTorr/min, 0.05 mTorr/min, 0.01 mTorr/min, 0.005
mTorr/min, 0.001 mTorr/min, 0.0005 mTorr/min, or 0.0001 mTorr/min.
The leak rate may be between any of the aforementioned leak rates
(e.g., from about 0.0001 mTorr/min to about, 100 mTorr/min, from
about 1 mTorr/min to about, 100 mTorr/min, or from about 1
mTorr/min to about, 100 mTorr/min). The leak rate may be measured
by one or more pressure gauges and/or sensors (e.g., at ambient
temperature). The enclosure can be sealed such that the leak rate
of gas from inside the chamber to an environment outside of the
chamber is low (e.g., below a certain level). The seals can
comprise O-rings, rubber seals, metal seals, load-locks, or bellows
on a piston. In some cases the chamber can have a controller
configured to detect leaks above a specified leak rate (e.g., by
using at least one sensor). The sensor may be coupled to a
controller. In some instances, the controller is able to identify
and/or control (e.g., direct and/or regulate). For example, the
controller may be able to identify a leak by detecting a decrease
in pressure in side of the chamber over a given time interval.
[0147] One or more of the system components can be contained in the
enclosure (e.g., chamber). The enclosure can include a reaction
space that is suitable for introducing precursor to form a 3D
object, such as powder material. The enclosure can contain the
platform. In some cases the enclosure can be a vacuum chamber, a
positive pressure chamber, or an ambient pressure chamber. The
enclosure can comprise a gaseous environment with a controlled
pressure, temperature, and/or gas composition. The gas composition
in the environment contained by the enclosure can comprise a
substantially oxygen free environment. For example, the gas
composition can contain at most at most about 100,000 parts per
million (ppm), 10,000 ppm, 1000 ppm, 500 ppm, 400 ppm, 200 ppm, 100
ppm, 50 ppm, 10 ppm, 5 ppm, 1 ppm, 100,000 parts per billion (ppb),
10,000 ppb, 1000 ppb, 500 ppb, 400 ppb, 200 ppb, 100 ppb, 50 ppb,
10 ppb, 5 ppb, 1 ppb, 100,000 parts per trillion (ppt), 10,000 ppt,
1000 ppt, 500 ppt, 400 ppt, 200 ppt, 100 ppt, 50 ppt, 10 ppt, 5
ppt, or 1 ppt oxygen. The gas composition in the environment
contained within the enclosure can comprise a substantially
moisture (e.g., water) free environment. The gaseous environment
can comprise at most about 100,000 ppm, 10,000 ppm, 1000 ppm, 500
ppm, 400 ppm, 200 ppm, 100 ppm, 50 ppm, 10 ppm, 5 ppm, 1 ppm,
100,000 ppb, 10,000 ppb, 1000 ppb, 500 ppb, 400 ppb, 200 ppb, 100
ppb, 50 ppb, 10 ppb, 5 ppb, 1 ppb, 100,000 ppt, 10,000 ppt, 1000
ppt, 500 ppt, 400 ppt, 200 ppt, 100 ppt, 50 ppt, 10 ppt, 5 ppt, or
1 ppt water. The gaseous environment can comprise a gas selected
from the group consisting of argon, nitrogen, helium, neon,
krypton, xenon, hydrogen, carbon monoxide, carbon dioxide, and
oxygen. The gaseous environment can comprise air. The chamber
pressure can be at least about 10.sup.-7 Torr, 10.sup.-6 Torr,
10.sup.-5 Torr, 10.sup.-4 Torr, 10.sup.-3 Torr, 10.sup.-2 Torr,
10.sup.-1 Torr, 1 Torr, 10 Torr, 100 Torr, 1 bar, 760 Torr, 1000
Torr, 1100 Torr, 2 bar, 3 bar, 4 bar, 5 bar, or 10 bar. The chamber
pressure can be of any value between the afore-mentioned chamber
pressure values (e.g., from about 10.sup.-7 Torr to about 10 bar,
from about 10.sup.-7 Torr to about 1 bar, or from about 1 bar to
about 10 bar). In some cases the enclosure pressure can be standard
atmospheric pressure. The gas can be an ultrahigh purity gas. For
example, the ultrahigh purity gas can be at least about 99%, 99.9%,
99.99%, or 99.999% pure. The gas may comprise less than about 2 ppm
oxygen, less than about 3 ppm moisture, less than about 1 ppm
hydrocarbons, or less than about 6 ppm nitrogen.
[0148] The enclosure can be maintained under vacuum or under an
inert, dry, non-reactive and/or oxygen reduced (or otherwise
controlled) atmosphere (e.g., a nitrogen (N.sub.2), helium (He), or
argon (Ar) atmosphere). In some examples, the enclosure is under
vacuum. In some examples, the enclosure is under pressure of at
most about 1 Torr, 10.sup.-3 Torr, 10.sup.-6 Torr, or 10.sup.-8
Torr. The atmosphere can be provided by providing an inert, dry,
non-reactive, and/or oxygen reduced gas (e.g., Ar) and/or flowing
the gas through the chamber.
[0149] In some examples, a pressure system is in fluid
communication with the enclosure. The pressure system can be
configured to regulate the pressure in the enclosure. In some
examples, the pressure system includes one or more vacuum pumps
selected from mechanical pumps, rotary vain pumps, turbomolecular
pumps, ion pumps, cryopumps, and diffusion pumps. The one or more
vacuum pumps may comprise Rotary vane pump, diaphragm pump, liquid
ring pump, piston pump, scroll pump, screw pump, Wankel pump,
external vane pump, roots blower, multistage Roots pump, Toepler
pump, or Lobe pump. The one or more vacuum pumps may comprise
momentum transfer pump, regenerative pump, entrapment pump, Venturi
vacuum pump, or team ejector. The pressure system can include
valves, such as throttle valves. The pressure system can include a
pressure sensor for measuring the pressure of the chamber and
relaying the pressure to the controller, which can regulate the
pressure with the aid of one or more vacuum pumps of the pressure
system. The pressure sensor can be coupled to a control system. The
pressure can be electronically or manually controlled.
[0150] The system and/or apparatus components described herein can
be adapted and configured to generate a 3D object. The 3D object
can be generated through a 3D printing process. A first layer of
material can be provided adjacent to a platform (e.g., base,
substrate, and/or bottom of the enclosure). A platform can be
formed of a previously formed layer of the 3D object or any other
surface upon which a layer or bed of material is spread, held,
placed, or supported. The first layer of hardened material can be
formed in the material bed without a platform, without one or more
auxiliary support features (e.g., rods), and/or without other
supporting structure other than the un-transformed material (e.g.,
within the material bed. E.g., powder). Subsequent layers can be
formed such that at least one portion of the subsequent layer
melts, sinters, fuses, binds and/or otherwise connects to the at
least a portion of a previously formed layer. In some instances,
the at least a portion of the previously formed layer that is
transformed and subsequently hardens into a hardened material, acts
as a platform for formation of the 3D object. In some cases the
first layer of hardened material comprises at least a portion of
the platform. The un-transformed material may comprise any material
type described herein. The un-transformed material layer can
comprise particles of homogeneous or heterogeneous size and/or
shape.
[0151] A platform can be a sheet. A platform can be flexible. A
platform can be a sheet that is not a bulk material. A platform can
be a substantially thin fabric of fibers, a net, a mesh or other
substantially thin structure that can form a carrier on which one
or more three-dimensional objects are formed.
[0152] The term "platform," as used herein, generally refers to any
work piece on which an object is formed on or from. A platform (or
platform plate) can include, without limitation, silicon,
germanium, silica, sapphire, zinc oxide, carbon (e.g., graphene),
SiC, AlN, GaN, spinel, coated silicon, silicon on oxide, silicon
carbide on oxide, glass, gallium nitride, indium nitride, titanium
dioxide, aluminum nitride, a ceramic material (e.g., alumina, AlN),
a metallic material (e.g., molybdenum, tungsten, copper, aluminum),
and combinations (or alloys) thereof. In some cases, a platform is
part of a susceptor. In some examples, a platform is formed of
steel, stainless steel, or a titanium alloy.
[0153] The 3D printing system and/or apparatus may comprise at
least one detector (e.g., sensor). The sensor may be embedded in
the enclosure or any part thereof. The sensor may be embedded in
the platform (e.g., base, substrate, or bottom of the enclosure).
The sensors may make up the platform. The sensor may be embedded in
the wall of the enclosure. The platform may be a building platform
and/or a supportive platform. The platform may be planar, flat,
smooth, rough, non-flat, or any combination thereof. In some
examples, at least one sensor may contact the material bed. The at
least one sensor may contact the untransformed material. The at
least one sensor may be included in the platform surface that
contacts the material bed. In some examples, the at least one
sensor may not contact the material bed. In some examples, the at
least one sensor may not be embedded in the enclosure or any part
thereof (e.g., the platform). In some embodiments, the at least one
sensor may reside outside of the enclosure.
[0154] The un-transformed material within the material bed (e.g.,
powder) can be configured to provide support to the 3D object. For
example, the supportive powder may be of the same type of powder
from which the 3D object is generated, of a different type, or any
combination thereof. In some instances, a low flowability powder
can be capable of supporting a 3D object better than a high
flowability powder. A low flowability powder can be achieved inter
alia with a powder composed of relatively small particles, with
particles of non-uniform size or with particles that attract each
other. The powder may be of low, medium, or high flowability. The
powder material may have compressibility of at least about 1%, 2%,
3%, 4%, 5%, 6%, 7%, 8%, 9%, or 10% in response to an applied force
of 15 kilo Pascals (kPa). The powder may have a compressibility of
at most about 9%, 8%, 7%, 6%, 5%, 4.5%, 4.0%, 3.5%, 3.0%, 2.5%,
2.0%, 1.5%, 1.0%, or 0.5% in response to an applied force of 15
kilo Pascals (kPa). The powder may have basic flow energy of at
least about 100 milli-Joule (mJ), 200 mJ, 300 mJ, 400 mJ, 450 mJ,
500 mJ, 550 mJ, 600 mJ, 650 mJ, 700 mJ, 750 mJ, 800 mJ, or 900 mJ.
The powder may have basic flow energy of at most about 200 mJ, 300
mJ, 400 mJ, 450 mJ, 500 mJ, 550 mJ, 600 mJ, 650 mJ, 700 mJ, 750 mJ,
800 mJ, 900 mJ, or 1000 mJ. The powder may have basic flow energy
in between the above listed values of basic flow energy (e.g., from
about 100 mj to about 1000 mJ, from about 100 mj to about 600 mJ,
or from about 500 mj to about 1000 mJ). The powder may have a
specific energy of at least about 1.0 milli-Joule per gram (mJ/g),
1.5 mJ/g, 2.0 mJ/g, 2.5 mJ/g, 3.0 mJ/g, 3.5 mJ/g, 4.0 mJ/g, 4.5
mJ/g, or 5.0 mJ/g. The powder may have a specific energy of at most
5.0 mJ/g, 4.5 mJ/g, 4.0 mJ/g, 3.5 mJ/g, 3.0 mJ/g, 2.5 mJ/g, 2.0
mJ/g, 1.5 mJ/g, or 1.0 mJ/g. The powder may have a specific energy
in between any of the above values of specific energy (e.g., from
about 1.0 mJ/g to about 5.0 mJ/g, from about 3.0 mJ/g to about 5
mJ/g, or from about 1.0 mJ/g to about 3.5 mJ/g).
[0155] The 3D object can have one or more auxiliary features. The
auxiliary feature(s) can be supported by the material (e.g.,
powder) bed. The term "auxiliary features," as used herein,
generally refers to features that are part of a printed 3D object,
but are not part of the desired, intended, designed, ordered,
modeled, or final 3D object. Auxiliary features (e.g., auxiliary
supports) may provide structural support during and/or subsequent
to the formation of the 3D object. Auxiliary features may enable
the removal or energy from the 3D object that is being formed.
Examples of auxiliary features comprise heat fins, wires, anchors,
handles, supports, pillars, columns, frame, footing, scaffold,
flange, projection, protrusion, mold (a.k.a. mould), or other
stabilization features. In some instances, the auxiliary support is
a scaffold that encloses the 3D object or part thereof. The
scaffold may comprise lightly sintered or lightly fused powder
material. The 3D object can have auxiliary features that can be
supported by the material bed (e.g., powder bed) and not touch the
base, substrate, container accommodating the material bed, or the
bottom of the enclosure. The 3D part (3D object) in a complete or
partially formed state can be completely supported by the material
bed (e.g., without touching the substrate, base, container
accommodating the powder bed, or enclosure). The 3D object in a
complete or partially formed state can be completely supported by
the powder bed (e.g., without touching anything except the powder
bed). The 3D object in a complete or partially formed state can be
suspended in the powder bed without resting on any additional
support structures. In some cases, the 3D object in a complete or
partially formed (i.e., nascent) state can freely float (e.g.,
anchorless) in the material bed.
[0156] The printed 3D object may be printed without the use of
auxiliary features, may be printed using a reduced amount of
auxiliary features, or printed using spaced apart auxiliary
features. In some embodiments, the printed 3D object may be devoid
of one or more auxiliary support features or auxiliary support
feature marks that are indicative of a presence or removal of the
auxiliary support features. The 3D object may be devoid of one or
more auxiliary support features and of one or more marks of an
auxiliary feature (including a base structure) that was removed
(e.g., subsequent to, or contemporaneous with, the generation of
the 3D object). The printed 3D object may comprise a single
auxiliary support mark. The single auxiliary feature (e.g.,
auxiliary support or auxiliary structure) may be a platform (e.g.,
a building platform such as a base or substrate), or a mold. The
auxiliary support may be adhered to the platform or mold. The 3D
object may comprise marks belonging to one or more auxiliary
structures. The 3D object may comprise two or more marks belonging
to auxiliary features. The 3D object may be devoid of marks
pertaining to an auxiliary support. The 3D object may be devoid of
an auxiliary support. The mark may comprise variation in grain
orientation, variation in layering orientation, layering thickness,
material density, the degree of compound segregation to grain
boundaries, material porosity, the degree of element segregation to
grain boundaries, material phase, metallurgical phase, crystal
phase, or crystal structure; wherein the variation may not have
been created by the geometry of the 3D object alone, and may thus
be indicative of a prior existing auxiliary support that was
removed. The variation may be forced upon the generated 3D object
by the geometry of the support. In some instances, the 3D structure
of the printed object may be forced by the auxiliary support (e.g.,
by a mold). For example, a mark may be a point of discontinuity
that is not explained by the geometry of the 3D object, which does
not include any auxiliary supports. A mark may be a surface feature
that cannot be explained by the geometry of a 3D object, which does
not include any auxiliary supports (e.g., a mold). The two or more
auxiliary features or auxiliary support feature marks may be spaced
apart by a spacing distance of at least 1.5 millimeters (mm), 2 mm,
2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, 5.5 mm, 6 mm, 6.5 mm, 7
mm, 7.5 mm, 8 mm, 8.5 mm, 9 mm, 9.5 mm, 10 mm, 10.5 mm, 11 mm, 11.5
mm, 12 mm, 12.5 mm, 13 mm, 13.5 mm, 14 mm, 14.5 mm, 15 mm, 15.5 mm,
16 mm, 20 mm, 20.5 mm, 21 mm, 25 mm, 30 mm, 30.5 mm, 31 mm, 35 mm,
40 mm, 40.5 mm, 41 mm, 45 mm, 50 mm, 80 mm, 100 mm, 200 mm 300 mm,
or 500 mm. The two or more auxiliary support features or auxiliary
support feature marks may be spaced apart by a spacing distance of
at most 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, 5.5
mm, 6 mm, 6.5 mm, 7 mm, 7.5 mm, 8 mm, 8.5 mm, 9 mm, 9.5 mm, 10 mm,
10.5 mm, 11 mm, 11.5 mm, 12 mm, 12.5 mm, 13 mm, 13.5 mm, 14 mm,
14.5 mm, 15 mm, 15.5 mm, 16 mm, 20 mm, 20.5 mm, 21 mm, 25 mm, 30
mm, 30.5 mm, 31 mm, 35 mm, 40 mm, 40.5 mm, 41 mm, 45 mm, 50 mm, 80
mm, 100 mm, 200 mm 300 mm, or 500 mm. The two or more auxiliary
support features or auxiliary support feature marks may be spaced
apart by a spacing distance of any value between the aforementioned
auxiliary support space values (e.g., from 1.5 mm to 500 mm, from 2
mm to 100 mm, from 15 mm to 50 mm, or from 45 mm to 200 mm).
Collectively referred to herein as the "auxiliary feature spacing
distance."
[0157] Provided herein are systems, apparatuses, and methods for
monitoring a manufacturing process. The manufacturing process can
be a three-dimensional printing process. The manufacturing process
can be an additive manufacturing process. The manufacturing process
can be monitored in real time. In some cases, the manufacturing
process can be monitored non-invasively such that the manufacturing
process is undisturbed while one or more measurements are collected
to monitor the manufacturing process. The manufacturing process can
be monitored (e.g., adjusted, regulated, and/or directed) with a
feedback loop. The adjustment may arise when an error (e.g.
deviation, non-uniformity, adverse condition, and/or mistake) is
detected, the error can be corrected. The adjustment may arise when
a collected signal (e.g., by a detector) deviates from an emitted
signal (e.g., by an energy source). The correction may include
adjusting a characteristic of the energy beam that is used in the
generation of the three-dimensional object. The correction may
include a location on a material (e.g., powder) bed at which energy
is supplied, the rate at which energy is supplied, or the powder at
which energy is supplied. The error can be identified by comparing
one or more measurements to a model of the three-dimensional
object. The model can be a computation model comprising parameters
that can define a correct state and/or condition at one or more
intermediate and/or complete stages in the manufacturing process.
In some cases the error can be analyzed and/or quantified. In some
cases, when the error exceeds a predetermined threshold, the
manufacturing process can be aborted, or paused.
[0158] In some cases, the manufacturing process can be an additive
printing process. A one, two, and/or three-dimensional object can
be generated in the additive printing process by sequentially
providing energy to one or more powder layers. FIG. 1 shows a
schematic of a system that can additively generate a
three-dimensional object (not shown). The system can comprise a
platform (e.g., a base) 101. The platform can be a support
structure. The platform 101 can accept a pre-transformed material
(e.g., powder) to provide a material bed 102. The material bed 102
can include particles having a material selected from the group
consisting of polymer, elemental metal, metal alloy, ceramic, and
elemental carbon (e.g., an allotrope of elemental carbon). In some
cases the material can be a mixture of particles of different
materials and/or particle sizes. The particles can have a
spherical, prismatic, or irregular shape. The particles can have a
monodisperse size distribution such that all of the particles have
substantially equal dimension, where dimension is a fundamental
length scale of the particle shape (e.g., diameter, spherical
equivalent diameter, length, or width). In some cases, the
particles can have a polydisperse size distribution such that the
at least a fraction of the particles have different dimensions. The
particles can have a diameter of at most about 100 micrometers
(.mu.m), 75 .mu.m, 50 .mu.m, 40 .mu.m, 30 .mu.m, 20 .mu.m, 10
.mu.m, 9 .mu.m, 8 .mu.m, 7 .mu.m, 6 .mu.m, 5 .mu.m, 4 .mu.m, 3
.mu.m, 2 .mu.m, 1 .mu.m, 0.5 .mu.m, 0.1 .mu.m, 0.05 .mu.m, 0.01
.mu.m, or 0.005 .mu.m. In some cases, the particles can have a
diameter greater than 100.
[0159] The system can further comprise a pre-transformed material
source 103 (e.g., material dispenser). The pre-transformed material
source can be adjacent to the material bed 102. Pre-transformed
material source can be adjacent to an exposed surface of the
material bed. Adjacent can be above, below, or to the side. The
pre-transformed material source can be a container or reservoir
configured to hold a volume of pre-transformed material.
Pre-transformed material from the pre-transformed material source
can be moved from the pre-transformed material source to the
material bed. Pre-transformed material from the pre-transformed
material source can be arranged in a layer on a surface of the
material bed. The layer can have a uniform or non-uniform
thickness. Pre-transformed material layers can be provided from the
pre-transformed material source on a surface of the material bed
sequentially to generate at least one 3D object (or parts thereof)
in an additive manufacturing process. Pre-transformed material
(e.g., powder) can be moved from the pre-transformed material
source to the material bed by a leveling mechanism, for example, a
rake, plough, or roller. The pre-transformed material source may be
included in a layer dispensing mechanism. The layer dispensing
mechanism (e.g., recoater) may include at least two of a material
removal mechanism, a material leveling mechanism, and a material
dispensing mechanism. An example of a layer dispensing mechanism
and any parts thereof can be found in PCT application number
PCT/US15/36802 titled "APPARATUSES, SYSTEMS AND METHODS FOR
THREE-DIMENSIONAL PRINTING" that was filed on Jun. 19, 2015, which
is entirely incorporated herein by reference. The leveling
mechanism may shear the material bed using a blade and/or an air
knife. The material removal system may level (e.g., make planar
and/or make flat) the exposed surface of the material bed without
contacting the exposed surface of the material bed. The material
removal system may level the exposed surface of the material bed
without contacting the material bed. Material from the material bed
may be attracted to the material removal mechanism using a force
comprising a mechanical, vacuum, electric, or magnetic force. The
material removal system may be separated from the exposed surface
of the material bed by a gap. The gap may be adjustable (e.g.,
manually or by a control mechanism).
[0160] The layer dispensing mechanism may expose the material bed
(e.g., powder bed) to reveal at least a portion of a 3D object
embedded within a material bed. FIGS. 25A-25F show examples of
various stages in the exposure of a portion of a three dimensional
object 2504 that is embedded in a material bed 2505. The exposure
may comprise using the leveling mechanism and/or the material
removal mechanism. The layer dispensing mechanism may remove at
least a portion of a layer (e.g., an entire layer). FIG. 25A shows
an example of a leveling member 2503 and a material removal
mechanism 2502 that level the exposed surface of the material bed
by translating the direction 2501. FIG. 25B shows an example of a
material removal mechanism 2502 that levels the exposed surface of
the material bed by translating the direction 2511, thus exposing a
top portion of the 3D object 2504. The layer dispensing mechanism
may remove a predetermined height of the material bed. The
predetermined height in each removal round may be substantially
similar. The predetermined height in at least one removal round may
be different from a second removal round. In the examples shown in
FIGS. 25A-25B, the layer dispensing mechanism removes one ruler
digit, as depicted according to the digits next to ruler 2522. The
layer dispensing mechanism may remove a layer of material of a
substantially fixed height (e.g., predetermined height) from
material bed. The removal may be sequential (e.g., remove one layer
height at a time). The removal may be during the printing process
of the 3D object. The removal may be subsequent to completion of at
least a layer of hardened material. The removal may exposed at
least a portion of the layer of hardened material. FIGS. 25D-25F
show examples in which a portion of the exposed surface of the
material bed is removed. The removal may result in a new (e.g.,
portion of the) exposed surface that is of a lower height as
compared to the original exposed surface of the material bed. FIG.
25A shows an example of an initial height of the material bed
(e.g., corresponding to digit 2 in the ruler). FIG. 25B shows an
example of an subsequent height of the material bed after removal
of one layer (e.g., corresponding to digit 3 in the ruler). FIG.
25B shows an example of a position that is irradiated by an energy
beam emitted from an energy beam source 2512, which position is
disposed within an exposed portion of the 3D object 2504, wherein
the 3D object is mostly embedded in the material bed 2505. During
and/or after the removal, at least a portion of the 3D object may
be revealed. The height of various positions on the exposed 3D
object portion may be measured (e.g., using a method described
herein), as well as the overall shape of the exposed 3D object
section. FIG. 25C shows an example of an energy source 2512 that
irradiates an energy beam towards an exposed surface of the 3D
object, which energy beam is reflected and sensed by a sensor 2511.
The measurements may add up to a layered imaging of the formed 3D
object, as layers of the material bed (that were not transformed to
form the 3D object) are removed. The sequential removal of layers
of the material bed may provide a leveled (e.g., digitized) height
image in situ. The leveled image may be formed subsequent to the
completion of the 3D printing process. The leveled image may be
formed during an intermission of the 3D printing process. After the
intermission and creation (e.g., and evaluation) of the leveled
image, the 3D object portion can be embedded with a fresh layer of
pre-transformed material (e.g., powder) such that it is
substantially embedded with the material layer, and the 3D printing
process may resume. The energy beam may be the energy beam that
transforms at least a portion of the material bed to form a
transformed material. The energy beam may be an energy beam
different from the energy beam that transforms at least a portion
of the material bed to form a transformed material. In some
instances, only a portion of the material bed is removed to expose
only a portion in an area of the 3D object. The sequence of FIGS.
25D-25F shows an example in which only a portion of the material
bed is removed to form a gradually growing void (e.g., 2532, 2542
and 2552) that exposes a portion of the 3D object in sequential
layers, wherein the surface of the exposed 3D object may be
sequentially sensed (e.g., imaged). The removed (e.g., evacuated)
layers (or layer portions) may correspond to the layers of the 3D
object. The height of the removed layers (or layer portions) may
differ from the height of the layers composing the 3D object. The
height of the removed (e.g., evacuated) layers (or layer portions)
may correspond to the height of the layers of the 3D object. The
height of the removed layers (or layer portions) may differ from
the height of the layers of the 3D object.
[0161] The system and/or apparatus described herein may comprise at
least one energy source. The first energy source may project a
first energy (e.g., first energy beam). The first energy beam may
travel along a path. The path may be predetermined (e.g., by the
controller). The apparatuses may comprise at least a second energy
source. The second energy source may generate a second energy
(e.g., second energy beam). The first and/or second energy may
transform at least a portion of the un-transformed material in the
material bed to a transformed material. In some embodiments, the
first and/or second energy source may heat but not transform at
least a portion of the un-transformed material in the material bed.
In some cases, the system can comprise 1, 2, 3, 4, 5, 6, 7, 8, 9,
10, 30, 100, 300, 1000 or more energy beams and/or sources. The
system can comprise an array of energy sources (e.g., laser diode
array). Alternatively or additionally the target surface, material
bed, 3D object (or part thereof), or any combination thereof may be
heated by a heating mechanism. The heating mechanism may comprise
dispersed energy beams. In some cases the at least one energy
source is a single (e.g., first) energy source. FIG. 22 shows an
example of a second energy beam 2201 that is generated by a second
energy source 2213.
[0162] An energy source can be a source configured to deliver
energy to an area (e.g., a confined area). An energy source can
deliver energy to the confined area through radiative heat
transfer. The energy source can project energy (e.g., heat energy,
and/or energy beam). The energy (e.g., beam) can interact with at
least a portion of the material in the material bed. The energy can
heat the material in the material bed before, during and/or after
the material is being transformed. The energy can heat at least a
fraction of a 3D object at any point during formation of the 3D
object. Alternatively or additionally, the material bed may be
heated by a heating mechanism projecting energy (e.g., radiative
heat and/or energy beam). The energy may include an energy beam
and/or dispersed energy (e.g., radiator or lamp). The energy may
include radiative heat. The radiative heat may be projected by a
heating mechanism comprising a lamp, a strip heater (e.g., mica
strip heater, or any combination thereof), a heating rod (e.g.,
quartz rod), or a radiator (e.g., a panel radiator). The heating
mechanism may comprise an inductance heater. The heating mechanism
may comprise a resistor (e.g., variable resistor). The resistor may
comprise a varistor or rheostat. A multiplicity of resistors may be
configured in series, parallel, or any combination thereof. In some
cases the system can have a single (e.g., first) energy source. An
energy source can be a source configured to deliver energy to an
area (e.g., a confined area). An energy source can deliver energy
to the confined area through radiative heat transfer (e.g., as
described herein).
[0163] The energy beam may include a radiation comprising an
electromagnetic, or charged particle beam. The energy beam may
include radiation comprising electromagnetic, electron, positron,
proton, plasma, or ionic radiation. The electromagnetic beam may
comprise microwave, infrared, ultraviolet, or visible radiation.
The energy beam may include an electromagnetic energy beam,
electron beam, particle beam, or ion beam. An ion beam may include
a cation or an anion. A particle beam may include radicals. The
electromagnetic beam may comprise a laser beam. The energy beam may
comprise plasma. The energy source may include a laser source. The
energy source may include an electron gun. The energy source may
include an energy source capable of delivering energy to a point or
to an area. In some embodiments the energy source can be a laser
source. The laser source may comprise a CO.sub.2, Nd:YAG, Neodymium
(e.g., neodymium-glass), or a Ytterbium laser. The energy source
may include an energy source capable of delivering energy to a
point or to an area. The energy source can provide an energy beam
having an energy density of at least about 50 joules/cm.sup.2
(J/cm.sup.2), 100 J/cm.sup.2, 200 J/cm.sup.2, 300 J/cm.sup.2, 400
J/cm.sup.2, 500 J/cm.sup.2, 600 J/cm.sup.2, 700 J/cm.sup.2, 800
J/cm.sup.2, 1000 J/cm.sup.2, 1500 J/cm.sup.2, 2000 J/cm.sup.2, 2500
J/cm.sup.2, 3000 J/cm.sup.2, 3500 J/cm.sup.2, 4000 J/cm.sup.2, 4500
J/cm.sup.2, or 5000 J/cm.sup.2. The energy source can provide an
energy beam having an energy density of at most about 50
J/cm.sup.2, 100 J/cm.sup.2, 200 J/cm.sup.2, 300 J/cm.sup.2, 400
J/cm.sup.2, 500 J/cm.sup.2, 600 J/cm.sup.2, 700 J/cm.sup.2, 800
J/cm.sup.2, 1000 J/cm.sup.2, 500 J/cm.sup.2, 1000 J/cm.sup.2, 1500
J/cm.sup.2, 2000 J/cm.sup.2, 2500 J/cm.sup.2, 3000 J/cm.sup.2, 3500
J/cm.sup.2, 4000 J/cm.sup.2, 4500 J/cm.sup.2, or 5000 J/cm.sup.2.
The energy source can provide an energy beam having an energy
density of an value between the aforementioned values (e.g., from
about 50 J/cm.sup.2 to about 5000 J/cm.sup.2, from about 200
J/cm.sup.2 to about 1500 J/cm.sup.2, from about 1500 J/cm.sup.2 to
about 2500 J/cm.sup.2, from about 100 J/cm.sup.2 to about 3000
J/cm.sup.2, or from about 2500 J/cm.sup.2 to about 5000
J/cm.sup.2). In an example a laser can provide light energy at a
peak wavelength of at least about 100 nanometer (nm), 500 nm, 750
nm, 1000 nm, 1010 nm, 1020 nm, 1030 nm, 1040 nm, 1050 nm, 1060 nm,
1070 nm, 1080 nm, 1090 nm, 1100 nm, 1200 nm, 1500 nm, 1600 nm, 1700
nm, 1800 nm, 1900 nm, or 2000 nm. In an example a laser can provide
light energy at a peak wavelength of at most about 2000 nm, 1900
nm, 1800 nm, 1700 nm, 1600 nm, 1500 nm, 1200 nm, 1100 nm, 1090 nm,
1080 nm, 1070 nm, 1060 nm, 1050 nm, 1040 nm, 1030 nm, 1020 nm, 1010
nm, 1000 nm, 750 nm, 500 nm, or 100 nm. The laser can provide light
energy at a peak wavelength between any of the afore-mentioned peak
wavelength values (e.g., from about 100 nm to about 2000 nm, from
about 500 nm to about 1500 nm, or from about 1000 nm to about 1100
nm). The energy beam (e.g., laser) may have a power of at least
about 0.5 Watt (W), 1 W, 2 W, 3 W, 4 W, 5 W, 10 W, 20 W, 30 W, 40
W, 50 W, 60 W, 70 W, 80 W, 90 W, 100 W, 120 W, 150 W, 200 W, 250 W,
300 W, 350 W, 400 W, 500 W, 750 W, 800 W, 900 W, 1000 W, 1500 W,
2000 W, 3000 W, or 4000 W. The energy beam may have a power of at
most about 0.5 W, 1 W, 2 W, 3 W, 4 W, 5 W, 10 W, 20 W, 30 W, 40 W,
50 W, 60 W, 70 W, 80 W, 90 W, 100 W, 120 W, 150 W, 200 W, 250 W,
300 W, 350 W, 400 W, 500 W, 750 W, 800 W, 900 W, 1000 W, 1500, 2000
W, 3000 W, or 4000 W. The energy beam may have a power between any
of the afore-mentioned laser power values (e.g., from about 0.5 W
to about 100 W, from about 1 W to about 10 W, from about 100 W to
about 1000 W, or from about 1000 W to about 4000 W).
[0164] An energy beam from the energy source(s) can be incident on,
or be directed perpendicular to, the target surface. An energy beam
from the energy source(s) can be directed at an acute angle within
a value of from parallel to perpendicular relative to the target
surface. The energy beam can be directed onto a specified area of
at least a portion of the source surface and/or target surface for
a specified time period. The material in target surface (e.g.,
powder material such as in a top surface of a powder bed) can
absorb the energy from the energy beam and, and as a result, a
localized region of the solid material can increase in temperature.
The energy beam can be moveable such that it can translate relative
to the source surface and/or target surface. The energy source may
be movable such that it can translate relative to the target
surface. The energy beam(s) can be moved via a scanner (e.g., as
disclosed herein). At least two (e.g., all) of the energy sources
can be movable with the same scanner. A least two (e.g., all) of
the energy beams can be movable with the same scanner. At least two
of the energy source(s) and/or beam(s) can be translated
independently of each other. In some cases at least two of the
energy source(s) and/or beam(s) can be translated at different
rates (e.g., velocities). In some cases at least two of the energy
source(s) and/or beam(s) can be comprise at least one different
characteristic. The characteristics may comprise wavelength, power,
amplitude, trajectory, footprint, dwell time, intensity, energy, or
charge. The charge can be electrical and/or magnetic charge. The
characteristics may be adjustable (e.g., by a controller). The
characteristics may be adjustable based on a signal from the
detector.
[0165] The energy source and/or detector can be an array, or a
matrix, of energy sources (e.g., laser diodes). Each of the energy
sources in the array, or matrix, can be independently controlled
(e.g., by a control mechanism) such that the energy beams can be
turned off and on independently. At least a part of the energy
sources in the array or matrix can be collectively controlled such
that the at least two (e.g., all) of the energy sources can be
turned off and on simultaneously. The energy per unit area or
intensity of at least two energy sources in the matrix or array can
be modulated independently (e.g., by a control mechanism or
system). At times, the energy per unit area or intensity of at
least two (e.g., all) of the energy sources in the matrix or array
can be modulated collectively (e.g., by a control mechanism). The
energy source can scan along the source surface and/or target
surface by mechanical movement of the energy source(s), one or more
adjustable reflective mirrors, or one or more polygon light
scanners. The energy source(s) can project energy using a DLP
modulator, a one-dimensional scanner, a two-dimensional scanner, or
any combination thereof. The energy source(s) can be stationary.
The target and/or source surface can translate vertically,
horizontally, or in an angle (e.g., planar or compound).
[0166] The energy source can be modulated. The energy beam emitted
by the energy source can be modulated. The modulator can include
amplitude modulator, phase modulator, or polarization modulator.
The modulation may alter the intensity of the energy beam. The
modulation may alter the current supplied to the energy source
(e.g., direct modulation). The modulation may affect the energy
beam (e.g., external modulation such as external light modulator).
The modulation may include direct modulation (e.g., by a
modulator). The modulation may include an external modulator. The
modulator can include an aucusto-optic modulator or an
electro-optic modulator. The modulator can comprise an absorptive
modulator or a refractive modulator. The modulation may alter the
absorption coefficient the material that is used to modulate the
energy beam. The modulator may alter the refractive index of the
material that is used to modulate the energy beam.
[0167] An energy beam from the first and/or second energy source
can be incident on, or be directed to, a target surface (e.g., the
exposed surface of the material bed). The energy beam can be
directed to a specified area in the material bed for a specified
time period. The material in the material bed can absorb the energy
from the energy source (e.g., energy beam and/or dispersed energy),
and as a result, a localized region of the material can increase in
temperature. The energy source and/or beam can be moveable such
that it can translate relative to the surface. In some instances,
the energy source may be movable such that it can translate across
(e.g., laterally) the top surface of the material bed. The energy
beam(s) and/or source(s) can be moved via a scanner. The scanner
may comprise a galvanometer scanner, a polygon, a mechanical stage
(e.g., X-Y stage), a piezoelectric device, gimble, or any
combination of thereof. The galvanometer may comprise a mirror. The
scanner may comprise a modulator. The scanner may comprise a
polygonal mirror. The scanner can be the same scanner for two or
more energy sources and/or beams. At least two (e.g., each) energy
source and/or beam may have a separate scanner. The energy sources
can be translated independently of each other. In some cases at
least two energy sources and/or beams can be translated at
different rates, and/or along different paths. For example, the
movement of the first energy source may be faster (e.g., greater
rate) as compared to the movement of the second energy source. The
systems and/or apparatuses disclosed herein may comprise one or
more shutters (e.g., safety shutters). The energy beam(s), energy
source(s), and/or the platform can be moved by the scanner. The
galvanometer scanner may comprise a two-axis galvanometer scanner.
The scanner may comprise a modulator (e.g., as described herein).
The energy source(s) can project energy using a DLP modulator, a
one-dimensional scanner, a two-dimensional scanner, or any
combination thereof. The energy source(s) can be stationary or
translatable. The energy source(s) can translate vertically,
horizontally, or in an angle (e.g., planar or compound angle). The
energy source(s) can be modulated. The scanner can be included in
an optical system that is configured to direct energy from the
energy source to a predetermined position on the target surface
(e.g., exposed surface of the material bed). The controller can be
programmed to control a trajectory of the energy source(s) with the
aid of the optical system. The controller can regulate a supply of
energy from the energy source to the material (e.g., at the target
surface) to form a transformed material.
[0168] The energy beam(s) emitted by the energy source(s) can be
modulated. The modulator can include an amplitude modulator, phase
modulator, or polarization modulator. The modulation may alter the
intensity of the energy beam. The modulation may alter the current
supplied to the energy source (e.g., direct modulation). The
modulation may affect the energy beam (e.g., external modulation
such as external light modulator). The modulation may include
direct modulation (e.g., by a modulator). The modulation may
include an external modulator. The modulator can include an
aucusto-optic modulator or an electro-optic modulator. The
modulator can comprise an absorptive modulator or a refractive
modulator. The modulation may alter the absorption coefficient the
material that is used to modulate the energy beam. The modulator
may alter the refractive index of the material that is used to
modulate the energy beam.
[0169] FIG. 1 shows an example of an energy sources 104. FIG. 6
shows an example of an energy source 601. The system can comprise a
plurality of energy sources with different properties. For example,
the system can comprise a plurality of energy sources with
different powers and/or emission intensities. The system can vary
the focus of the energy source (e.g., energy beam) along the beam
path. The system can comprise an additional energy source. The
additional energy source can be an energy source that complements
the one or more energy sources 104.
[0170] The one or more energy sources can provide energy to the
material bed. In some cases energy can be transferred from the
energy source to the powder by an energy beam. At least a portion
of the powder can have an increased temperature and/or change of
state (e.g. melt) resulting from transfer of the energy from the
energy source to the powder. The additional energy source can
provide energy to the un-transformed material in the material bed,
in some cases the additional energy source can provide energy to
the pre-transformed material through an energy beam.
[0171] One or more additional energy sources can be provided to
generate one or more signals upon exposure to the material bed or
3D object. For example, an energy source can be an illumination
energy source configured to generate a light scattering signal when
incident on the powder and/or at least a fraction of the
three-dimensional object. The one or more additional energy sources
can generate one more signals that can be detected and processed to
measure a property and/or condition of the powder bed and/or at
least a portion of the three-dimensional object in the powder bed.
In some cases, the one or more additional energy sources can
generate one more signals to measure a property and/or condition of
a boundary between the powder bed and at least a portion of a
three-dimensional object in the powder bed.
[0172] Operation of the energy source and one or more additional
energy sources can be synchronized. For example, operation of the
energy source and one or more additional energy sources can be
synchronized such that the energy source and the one or more
additional energy sources can be turned on and/or off at the same
time and/or consecutively. The energy source can emit an energy
beam with a first discrete wavelength and/or range of wavelengths.
The one or more additional energy sources can emit an energy beam
with a second discrete wavelength and/or range of wavelengths. In
some cases, the first discrete wavelength and/or range of
wavelengths and the second discrete wavelength and/or range of
wavelengths can be different. In some cases the first discrete
wavelength and/or range of wavelengths and the second discrete
wavelength and/or range of wavelengths can be different from each
other by at least about 50 nanometers (nm), 100 nm, 250 nm, 500 nm,
or 1000 nm. Alternatively, the first discrete wavelength and/or
range of wavelengths and the second discrete wavelength and/or
range of wavelengths can be the same. The energy source and the one
or more additional energy source energy beams can be optical beams
(e.g., optically visible beams). The energy source may be a source
of sound wave. The energy source may emit a sound wave. The
additional energy source can be operated at a plurality of powers
and/or intensities.
[0173] The energy beam can be scanned over at least a portion of
the material bed along a path (e.g., in a pattern). The path may be
a predetermined pattern. The beam can be "on" while continuously
scanning, alternatively the beam can modulate between the "on" mode
while in a stationary location and the "off" mode while moving
(e.g., scanning). In some cases the energy source can provide a
pulsed energy emission when the energy source is operating in "on"
mode. The energy pulses can have a dwell time of at least about
0.01 microseconds (.mu.s), 0.1 .mu.s, 1 .mu.s, 10 .mu.s, 50 .mu.s,
100 .mu.s, 500 .mu.s, 1000 .mu.s, 5000 .mu.s, or 10000 .mu.s. The
energy pulses can be locked in to a predetermined frequency. In
cases where the system comprises two or more energy sources pulse
energy emissions from the two or more energy sources can be
synchronized. Alternatively, the pulse energy emissions from the
two or more energy sources can be independent of each other and/or
not synchronized. The dwell time can comprise a time that the
energy source is dwelling (e.g., incident) on a given point and/or
portion of the powder bed. Alternatively the dwell time can
comprise a time that it takes the energy source to traverse a beam
spot size in situations where the energy source is moving
continuously. The beam can be scanned in a raster and/or a vector
pattern. The beam can be applied at a plurality of powers.
[0174] The systems and/or apparatuses disclosed herein may comprise
one or more motors. The motors may comprise servomotors. The
servomotors may comprise actuated linear lead screw drive motors.
The motors may comprise belt drive motors. The motors may comprise
rotary encoders. The apparatuses and/or systems may comprise
switches. The switches may comprise homing or limit switches. The
motors may comprise actuators. The motors may comprise linear
actuators. The motors may comprise belt driven actuators. The
motors may comprise lead screw driven actuators. The actuators may
comprise linear actuators.
[0175] In some examples, the pressure system includes one or more
pumps. The one or more pumps may comprise a positive displacement
pump. The positive displacement pump may comprise rotary-type
positive displacement pump, reciprocating-type positive
displacement pump, or linear-type positive displacement pump. The
positive displacement pump may comprise rotary lobe pump,
progressive cavity pump, rotary gear pump, piston pump, diaphragm
pump, screw pump, gear pump, hydraulic pump, rotary vane pump,
regenerative (peripheral) pump, peristaltic pump, rope pump, or
flexible impeller. Rotary positive displacement pump may comprise
gear pump, screw pump, or rotary vane pump. The reciprocating pump
comprises plunger pump, diaphragm pump, piston pumps displacement
pumps, or radial piston pump. The pump may comprise a valveless
pump, steam pump, gravity pump, eductor-jet pump, mixed-flow pump,
bellow pump, axial-flow pumps, radial-flow pump, velocity pump,
hydraulic ram pump, impulse pump, rope pump, compressed-air-powered
double-diaphragm pump, triplex-style plunger pump, plunger pump,
peristaltic pump, roots-type pumps, progressing cavity pump, screw
pump, or gear pump.
[0176] One or more sensors (at least one sensor) can detect the
topology of the exposed surface of the material bed and/or the
exposed surface of the 3D object or any part thereof. The sensor
can detect the amount of material deposited in the material bed.
The sensor may detect one or more particles in a certain are of the
enclosure. For example, the sensor may detect one or more particles
in the atmosphere of the enclosure (e.g., FIGS. 6, 616 and/or 617).
The sensor may detect one or more particles in an optical window
(FIG. 6, 615) of the enclosure (e.g., FIG. 6, 607). The sensor may
detect plasma in the enclosure. The sensor may detect 3D object
(e.g., FIG. 6, 606) within the material bed (e.g., FIG. 6, 604).
The sensor may detect the shape and/or size of the 3D object (e.g.,
FIG. 6, 606) within the material bed (e.g., FIG. 6, 604). The
sensor may detect the flatness and/or roughness of the surface of
the 3Dobject and/or of the material bed (e.g., exposed surface of
the material bed. FIG. 12 shows an example of a system and/or
apparatus that may be used in the methods disclosed herein. Energy
source 1217 emits an energy beam towards the exposed surface of a
material bed 1204. The energy beam deflects and is sensed by an
energy beam sensor 1218. The sensor and/or energy source can be
stationary or translatable. The sensor can be a proximity sensor.
For example, the sensor can detect the amount of un-transformed
material deposited on the exposes surface of a material bed or
platform. The sensor can detect the amount of material transferred
by the material dispensing mechanism. The sensor can detect the
amount of relocated by a leveling mechanism. The sensor can detect
the temperature of the material. For example, the sensor may detect
the temperature of the un-transformed material in a material (e.g.,
powder) dispensing mechanism, and/or in the material bed. The
sensor may detect the temperature of the material during and/or
after its transformation. The sensor may detect the temperature
and/or pressure of the atmosphere within an enclosure (e.g.,
chamber). The sensor may detect the temperature of the material
(e.g., powder) bed at one or more locations. The sensor may detect
location of an item (e.g., 3D objet) in the material bed. The
temperature may be sensed in a delay relative to the point in time
at which the energy beam transforms a position in the material bed.
The temperature sensor may correspond to a delayed temperature
response. The temperature of the transformed position may form
temperature equilibration within the material bed. The temperature
of the transformed position may heat up at least a portion of the
material bed and form a temperature gradient. The temperature
gradient may reach one or more sensors (e.g., an array or a matrix
of sensors). The heated sensor(s) may serve as an indicator to the
position of the transformed material in the material bed (e.g.,
powder bed). The indication of the position may include processing
of the temperature sensor by the controller (e.g., by a computer).
One or more parameters in the three-dimensional printing
methodology may be adjusted based on the indication. For example,
the position, power and/or path (e.g., hatch spacing or shape) of
the energy beam that transforms at least a portion of the material
bed may be adjusted.
[0177] The at least one sensor can be operatively coupled to a
control system (e.g., computer control system). The sensor may
comprise light sensor, acoustic sensor, vibration sensor, chemical
sensor, electrical sensor, magnetic sensor, fluidity sensor,
movement sensor, speed sensor, position sensor, pressure sensor,
force sensor, density sensor, distance sensor, or proximity sensor.
The sensor may include temperature sensor, weight sensor, material
(e.g., powder) level sensor, metrology sensor, gas sensor, or
humidity sensor. The metrology sensor may comprise measurement
sensor (e.g., height, length, width, angle, and/or volume). The
metrology sensor may comprise a magnetic, acceleration,
orientation, or optical sensor. The sensor may transmit and/or
receive sound (e.g., echo), magnetic, electronic, or
electromagnetic signal. The electromagnetic signal may comprise a
visible, infrared, ultraviolet, ultrasound, radio wave, or
microwave signal. The metrology sensor may measure the tile. The
metrology sensor may measure the gap. The metrology sensor may
measure at least a portion of the layer of material. The layer of
material may be an un-transformed material (e.g., powder),
transformed material, or hardened material. The metrology sensor
may measure at least a portion of the 3D object. The gas sensor may
sense any of the gas delineated herein. The distance sensor can be
a type of metrology sensor. The distance sensor may comprise an
optical sensor, or capacitance sensor. The temperature sensor can
comprise Bolometer, Bimetallic strip, calorimeter, Exhaust gas
temperature gauge, Flame detection, Gardon gauge, Golay cell, Heat
flux sensor, Infrared thermometer, Microbolometer, Microwave
radiometer, Net radiometer, Quartz thermometer, Resistance
temperature detector, Resistance thermometer, Silicon band gap
temperature sensor, Special sensor microwave/imager, Temperature
gauge, Thermistor, Thermocouple, Thermometer (e.g., resistance
thermometer), or Pyrometer. The temperature sensor may comprise an
optical sensor. The temperature sensor may comprise image
processing. The temperature sensor may comprise a camera (e.g., IR
camera, CCD camera). The pressure sensor may comprise Barograph,
Barometer, Boost gauge, Bourdon gauge, Hot filament ionization
gauge, Ionization gauge, McLeod gauge, Oscillating U-tube,
Permanent Downhole Gauge, Piezometer, Pirani gauge, Pressure
sensor, Pressure gauge, Tactile sensor, or Time pressure gauge. The
position sensor may comprise Auxanometer, Capacitive displacement
sensor, Capacitive sensing, Free fall sensor, Gravimeter,
Gyroscopic sensor, Impact sensor, Inclinometer, Integrated circuit
piezoelectric sensor, Laser rangefinder, Laser surface velocimeter,
LIDAR, Linear encoder, Linear variable differential transformer
(LVDT), Liquid capacitive inclinometers, Odometer, Photoelectric
sensor, Piezoelectric accelerometer, Rate sensor, Rotary encoder,
Rotary variable differential transformer, Selsyn, Shock detector,
Shock data logger, Tilt sensor, Tachometer, Ultrasonic thickness
gauge, Variable reluctance sensor, or Velocity receiver. The
optical sensor may comprise a Charge-coupled device, Colorimeter,
Contact image sensor, Electro-optical sensor, Infra-red sensor,
Kinetic inductance detector, light emitting diode (e.g., light
sensor), Light-addressable potentiometric sensor, Nichols
radiometer, Fiber optic sensors, Optical position sensor, Photo
detector, Photodiode, Photomultiplier tubes, Phototransistor,
Photoelectric sensor, Photoionization detector, Photomultiplier,
Photo resistor, Photo switch, Phototube, Scintillometer,
Shack-Hartmann, Single-photon avalanche diode, Superconducting
nanowire single-photon detector, Transition edge sensor, Visible
light photon counter, or Wave front sensor. The weight of the
material bed can be monitored by one or more weight sensors in, or
adjacent to, the material. For example, a weight sensor in the
material bed can be at the bottom of the material bed. The weight
sensor can be between the bottom of the enclosure (e.g., FIG. 6,
611) and the substrate (e.g., FIG. 6, 609) on which the base (e.g.,
FIG. 6, 602) or the material bed (e.g., FIG. 6, 604) may be
disposed. The weight sensor can be between the bottom of the
enclosure and the base on which the material bed may be disposed.
The weight sensor can be between the bottom of the enclosure and
the material bed. A weight sensor can comprise a pressure sensor.
The weight sensor may comprise a spring scale, a hydraulic scale, a
pneumatic scale, or a balance. At least a portion of the pressure
sensor can be exposed on a bottom surface of the material bed. In
some cases, the weight sensor can comprise a button load cell. The
button load cell can sense pressure from powder adjacent to the
load cell. In another example, one or more sensors (e.g., optical
sensors or optical level sensors) can be provided adjacent to the
material bed such as above, below, or to the side of the material
bed. In some examples, the one or more sensors can sense the level
of pre-transformed material with the material bed. The material
(e.g., powder) level sensor can be in communication with a material
dispensing mechanism (e.g., powder dispenser). Alternatively, or
additionally a sensor can be configured to monitor the weight of
the material bed by monitoring a weight of a structure that
contains the material bed. One or more position sensors (e.g.,
height sensors) can measure the height of the material bed relative
to the substrate. The position sensors can be optical sensors. The
position sensors can determine a distance between one or more
energy beams (e.g., a laser or an electron beam) and a surface of
the material (e.g., powder). The one or more sensors may be
connected to a control system (e.g., to a processor, to a
computer).
[0178] In some embodiments, as the energy beam (e.g., that
transforms the pre-transformed material in the material bed into a
transformed material) may reflect from a target surface (e.g.,
exposed surface of the material bed, or top surface of a 3D object)
as it travels along a path. The 3D object may be embedded in the
material bed. The power and/or speed of the energy beam may be
controlled (e.g., varied, regulated and/or directed) by the
controller. One or more sensors may detect the reflection of the
energy beam. The reflection of the energy beam from the target
surface can be detected by an optical detector (e.g., optical
sensor). The reflection of the energy beam from the target surface
can be detected by an imaging device (e.g., camera) and/or by a
spectrum analyzer. The controller may vary one or more
characteristics of the energy beam based on an output of the
sensor. The characteristics of the energy beam may comprise its
power, power per unit area, speed, cross section, or footprint on
the exposed surface of the material bed. The controller may
comprise performing image analysis (e.g., image processing) using
the output of the sensor (e.g., optical sensor, and/or imaging
device), to provide a result. The reflection from the target
surface may be sensed (e.g., imaged) from one or more angles (e.g.,
sequentially, simultaneously, or at random). The result may be used
in the control of the energy beam (e.g., to alter the at least one
of its characteristics). The result may be used in the evaluation
of the height and/or planarity of the target surface. The result
may be used in the evaluation of the height at various points
within the target surface. The height may be relative to a known
height (e.g., control), to the platform, or to other positions
within the target surface. The result may be used in the evaluation
of the planarity of the target surface. The result may provide a
height and/or planarity profile of the target surface. The
resolution of the height and/or planarity profile may correspond to
the FLS of a cross section of the energy beam, and/or the FLS of a
footprint of the energy beam on the target surface. The energy beam
may be the energy beam that transforms at least a portion of the
material bed to form a transformed material. The energy beam may be
an energy beam different from the energy beam that transforms at
least a portion of the material bed to form a transformed material.
FIG. 24 shows an example of an energy beam 2401 that is used to
generate the 3D object. A portion of that beam is reflected and
detected by a detector (e.g., sensor) 2417. The detector may be
coupled to the controller. The controller may analyze the signal.
The detector may alter at least one characteristics of the energy
beam (e.g., 2401) as a result of the analysis.
[0179] The system can comprise one or more detectors (e.g., FIG. 1,
105). The detectors can comprise the sensors. The detectors (e.g.,
sensors) can be configured to measure one or more properties of the
3D object and/or the pre-transformed material (e.g., powder). The
detectors can collect one or more signals from the 3D object and/or
the material bed. In some cases, the detectors can collect signals
from one or more optical sensors (e.g., as disclosed herein). The
detectors can collect signals from one or more vision sensors (e.g.
camera), thermal sensors, acoustic sensors, vibration sensors,
spectroscopic sensor, radar sensors, and/or motion sensors. In some
cases, at least one of the detectors can be a charge-coupled device
(CCD) camera. At least one of the detectors can be a pyrometer
and/or a bolometer. The radar sensor may comprise an antenna. The
antenna may be a scanning antenna. The radar sensor may comprise an
electronically scanned array (ESA), or a phase array. The ESA may
be passive or active. The antenna may comprise an aperture. The
radar frequency can be at least about 1 GigaHertz (GHz), 3 GHz, 10
GHz, 24 GHz, 35 GHz, 77 GHz, 94 GHz, or 100 GHz. The radar
frequency can be at most about 3 GHz, 10 GHz, 24 GHz, 35 GHz, 77
GHz, 94 GHz, or 100 GHz. The radar frequency can be any value
between the above mentioned values (e.g., from about 1 GHz to about
100 GHz)
[0180] At least one of the detectors can be an InGaAs sensor. The
one or more detectors can comprise proximity detectors (e.g.,
sensors) configured to detect one or more signals that can be
processed to determine a proximity of a first object (e.g., 3D
object) or region to a second object (e.g., 3D object) or region.
In some cases, one or more of the detectors can be mounted to a
heat transfer member (e.g., FIG. 1, 107; FIG. 6, 613) adjacent to
the material bed. The heat transfer member can be a cooling plate
and/or heating plate. The heat transfer member can be configured to
transfer energy to and/or from the material bed and/or the 3D
object before, during and/or after its formation. One or more
signals can be detected using different filters to attain coarse
spectral segregation of the one or more signals. Each filter can
isolate one or more wavelengths or narrow a range of wavelengths.
The filters can be optical and/or audio filters.
[0181] In some cases, one or more of the detectors can be movable.
The one or more detectors can be movable along a plane that is
parallel to the material bed (e.g., to the exposed surface of the
material bed. The one or more detectors can be movable
horizontally, vertically, and/or in an angle (e.g., planar or
compound). The one or more detectors can be movable along a plane
that is parallel to a surface of the material bed. The one or more
detectors can be movable along an axis this is orthogonal to the
material bed and/or a surface of the material bed. The one or more
detectors can be translated, rotated, and/or tilted at an angle
(e.g., planar or compound).
[0182] The one or more detectors (e.g., FIG. 1, 105) can be
disposed within the enclosure, outside the enclosure, within the
structure of the enclosure (e.g., within a wall of the enclosure),
or any combination thereof. The one or more detectors can be
oriented in a location such that the detector can receive one or
more signals in the field of view of the detector. A viewing angle
and/or field of view of at least one of the one or more detectors
can be maneuverable via a scanner. In some cases the viewing angle
and/or field of view can be maneuverable relative to an energy beam
that is employed to additively generate the 3D object. In some
cases, movement (e.g., scanning) of the energy beam and maneuvering
of the viewing angle and/or field of view of one or more detectors
can be synchronized. The detectors and/or energy beams may be
movable using a scanner. The scanner may comprise a galvanometer
scanner, a polygon, a mechanical stage (e.g., X-Y stage), a
piezoelectric device, gimble, or any combination of thereof. The
galvanometer may comprise a mirror. The scanner may comprise a
modulator. The scanner may comprise a polygonal mirror.
[0183] The scanner can be the same scanner for two or more
detectors. At least two (e.g., each) detectors may have a separate
scanner. The detectors can be translated independently of each
other. The scanner can be the same scanner for two or more energy
sources and/or beams. At least two (e.g., each) energy source
and/or beam may have a separate scanner. The energy sources can be
translated independently of each other. In some cases at least two
energy sources and/or beams can be translated at different rates,
and/or along different paths. For example, the movement of the
first energy source may be faster (e.g., greater rate) as compared
to the movement of the second energy source. The systems and/or
apparatuses disclosed herein may comprise one or more shutters
(e.g., safety shutters). The energy beam(s), energy source(s),
and/or the platform can be moved by the scanner. The galvanometer
scanner may comprise a two-axis galvanometer scanner. The scanner
may comprise a modulator (e.g., as described herein). The energy
source(s) can project energy using a DLP modulator, a
one-dimensional scanner, a two-dimensional scanner, or any
combination thereof. The energy source(s) and/or detectors can be
stationary or translatable. The energy source(s) and/or detectors
can translate vertically, horizontally, or in an angle (e.g.,
planar or compound angle). The energy source(s) can be modulated.
The scanner can be included in an optical system that is configured
to direct energy from the energy source to a predetermined position
on a target surface (e.g., exposed surface of the material bed).
The controller can be programmed to control a trajectory of the
energy source(s) with the aid of the optical system. The controller
can regulate a supply of energy from the energy source to the
material (e.g., at the target surface) to form a transformed
material.
[0184] The energy beam(s) emitted by the energy source(s) can be
modulated. The modulator can include an amplitude modulator, phase
modulator, or polarization modulator. The modulation may alter the
intensity of the energy beam. The modulation may alter the current
supplied to the energy source (e.g., direct modulation). The
modulation may affect the energy beam (e.g., external modulation
such as external light modulator). The modulation may include
direct modulation (e.g., by a modulator). The modulation may
include an external modulator. The modulator can include an
aucusto-optic modulator or an electro-optic modulator. The
modulator can comprise an absorptive modulator or a refractive
modulator. The modulation may alter the absorption coefficient the
material that is used to modulate the energy beam. The modulator
may alter the refractive index of the material that is used to
modulate the energy beam.
[0185] A controller (e.g., FIG. 1, 106) can be operatively coupled
to the energy source (e.g., FIG. 1, 104) and/or the one or more
detectors (e.g., FIG. 1, 105). The controller can be a computer
system with one or more computer processors that are programmed to
direct a supply of energy from the energy source to the material
bed. The energy can be supplied from the energy source to the
pre-transformed material by an energy beam. The controller can
direct the energy source along a path that is selected in
accordance with a model design of the 3D object. The controller can
also control maneuvering of the detector and/or the field of view
of the detector. The controller can process one or more signals
collected by the detector to determine a deviation (e.g. error) of
the emitted energy beam from the energy source. Additionally, the
controller can process one or more signals collected by the
detector to determine a deviation (e.g. error) of the 3D object or
portion thereof from a model design of the 3D object. The
controller can process one or more signals (e.g., collected by the
detector) to generate a map of the enclosure, the optical window,
the material bed and/or at least a portion of the 3D object (e.g.,
within the material bed). The controller can alter the path of the
energy beam as necessary to reduce or maintain the deviation form a
model design of the 3D object. In some cases, the controller can
increase a local deviation to decrease an overall deviation. In
some cases the controller can abort the process of forming the 3D
object when the deviation is at or above a predetermined threshold
value.
[0186] The system of FIG. 1 can be used to additively generate a 3D
object. In an additive 3D printing process, pre-transformed
material (e.g., powder) can be provided adjacent to a platform. At
least a portion of the 3D object can be additively generated from
the pre-transformed material (e.g., within the material bed).
Additively generating the object can comprise transforming at least
a portion of the material bed with the one or more energy sources.
An energy beam from the one or more energy sources can be incident
on an exposed surface of the material bed (e.g., top surface) in a
predetermined path (e.g., pattern) to form at least a portion of
the 3D object. The predetermined pattern can correspond to a model
of the 3D object.
[0187] While forming the 3D object, signals can be collected from
at least a portion of the 3D object, material bed, enclosure
atmosphere, optical window, and/or energy beam by at least one
detector in sensing communication with the 3D object, material bed,
enclosure atmosphere, optical window, and/or energy beam. The
signals can be detected in real time (e.g., while forming the 3D
object). The signals can be detected continuously or at discrete
intervals (e.g., while forming the 3D object). In some cases, the
discrete intervals can correspond to predetermined checkpoints,
which can be selected, for example, based on a model design of the
3D object.
[0188] The signals collected by the detector can be processed to
determine one or more properties of at least a portion of the 3D
object, the material bed, the pre-transformed material, the
enclosure atmosphere, the optical window, or any combination
thereof. The signals collected by the detector can be processed to
determine one or more properties of a boundary between the material
bed and at least a portion of the 3D or the atmosphere of the
enclosure. The signals collected by the detector can be processed
to determine one or more properties of cleanliness of the material
bed. The signals collected by the detector can be processed to
determine a roughness of a surface (e.g., the exposed surface of
the material bed and/or of the 3D object). The signals collected by
the detector can be processed to determine one or more properties
of the melt pool comprising the 3D object. For example, at what
temperature the melt pool was formed and/or how quickly the melt
pool solidified (e.g., cooled). The signals can be processed to
determine a state or property of the three-dimensional object of
the powder. The signals can be processed to determine a state or
progression of the additive printing process. The signals can be
processed to determine a cooling rate profile, heat profile, and/or
solidification rate profile of the 3D object. The state and/or
properties determined from the signals can be specified by a user.
In some cases, one or more states and/or properties can be
determined concurrently, sequentially, and/or separately. The
signals can be processed with a triangulation technique. The
enclosure atmosphere may comprise one or more gases.
[0189] Signals can be detected and processed to determine one or
more material or state properties of the material bed and/or 3D
object before, during, at, or after the completion of a
manufacturing process. For example, a material state or property of
the 3D object and/or the material bed can include on or more of a
depth of the material bed relative to the platform, a uniformity of
the pre-transformed material within the material bed (e.g. spatial
uniformity, temperature uniformity, composition uniformity, and/or
density uniformity), roughness of the exposed surface of the
material bed and/or a surface of the 3D object, stress of the 3D
object (e.g. internal or external thermal, compressive, or tension
stress), a location or state of the boundary and/or interface
between at least a portion of the 3D object and the material bed, a
height of the 3D object with respect to a surface within the
material bed or with respect to the substrate, one or more defects
in the 3D object (e.g. deviation of dimension or shape of the 3D
object relative to a model of the 3D object above a predetermined
threshold), porosity and/or voids in the 3D object, discontinuity
at the interface, curvature of a surface of the 3D object, a height
of one location on the 3D object with respect to another location
on the 3D object, a color uniformity map of the 3D object (e.g.,
surface thereof), and/or an chemical transformation (e.g.,
oxidation) uniformity of a surface of the 3D object.
[0190] Spatial properties can be determined by one or more signals
collected at the detector. In some cases, the spatial properties
can comprise depth of the pre-transformed material (e.g., powder)
relative to a predetermined plane, spatial uniformity of the
material bed, spatial properties of the interface between at least
a portion of the 3D object and the pre-transformed material (e.g.,
material bed), location of one or more stresses in at least a
portion of the 3D object, and/or the size and location of one or
more features of the 3D object. The signals can be processed to
produce a spatial measurement with an accuracy within at least
about 100 micrometers (.mu.m), 50 .mu.m, 10 .mu.m, 1 .mu.m, 0.5
.mu.m, or 0.25 .mu.m.
[0191] The signals that are detected can be processed. In some
cases processing the signals can comprise generating at least one
map. The map can comprise a visual, graphical, and/or numerical
representation of one or more measurements. The measurements can be
derived from processing of one or more signals collected by one or
more detectors. The map can be a map may comprise a differential
contrast map between the 3D object and the un-transformed material,
spatial color map of the 3D object and/or the un-transformed
material, spatial map of an interface between the 3D object and the
un-transformed material, temperature map of the 3D object and/or
the un-transformed material, thermal dissipation map, dark field
map, a bright field map, stress and/or deformation map of the 3D
object and/or the untransformed material, proximity map of the
untransformed material, scattering map of the signals, spectral map
from the signals, integral untransformed material emission map of
the 3D object and/or the untransformed material, integral power
emission map of the 3D object and/or the untransformed material,
reflectivity map, temperature decay map, oxidation map, or
curvature map (e.g., of at least one surface of the 3D object). The
untransformed material may be a powder material. The untransformed
material may be within the material bed.
[0192] Detectors (e.g., sensors) can be provided adjacent to the
material bed (e.g., powder bed). The material bed can have a
surface comprising untransformed material and at least a portion of
the 3D object. In some cases two or more detectors can be located
at different angles and/or distances from the surface of the
material bed. FIG. 2 shows a horizontal (top) view of a system with
an exposed surface 202 of a material bed 200. The exposed surface
(e.g., top surface) can comprise at least a fraction of a 3D object
201. The exposed surface can comprise untransformed material within
a material bed adjacent to the 3D object. The 3D object 201 can be
floating (e.g., suspended anchorless) in the material bed. For
example, the 3D object 201 can be in contact with the untransformed
material but no other surface (e.g., platform) within the
enclosure. The one or more detectors can scan the exposed surface
to generate a map of the exposed surface. The one or more detectors
can be stationary or moving. The moving one or more detectors may
scan the surface. The one or more detectors may be stationary while
the material bed may be moving. The detectors (e.g., sensors) may
be sensitive to one or more energy beam (e.g., sound wave,
electromagnetic beam, and/or charged particle beam, energy
emission). The one or more energy beam may be generated from one or
more energy sources. The energy source can be stationary or moving.
The energy source may be moving while the material bed is
stationary. The energy source may be stationary while the material
bed is moving. In some instances the material bed is moving and at
least one of the energy source and detector is moving. The movement
may be synchronized and/or controlled (e.g., regulated and/or
directed). The control may comprise a controller. In some cases the
one or more detectors, and/or energy sources can scan the surface
at predetermined time intervals to generate a map at multiple time
points. In some cases, the location and/or angle of the detectors
can be varied relative to the surface to generate one or more maps
corresponding to different perspective angles (e.g., planar or
compound) and/or orientations of the detector or energy source
respectively. In some cases, one or more boundaries of the material
bed surface can have fiducial markers 203. The fiducial markers can
be lights, patterns, and/or symbols that can be observed by the
detector.
[0193] A cross section (e.g., vertical cross section) of the
generated (i.e., formed) 3D object may reveal a microstructure or a
grain structure indicative of a layered deposition. Without wishing
to be bound to theory, the microstructure or grain structure may
arise due to the solidification of transformed powder material that
is typical to and/or indicative of the 3D printing method. For
example, a cross section may reveal a microstructure resembling
ripples or waves that are indicative of solidified melt pools that
may be formed during the 3D printing process. The repetitive
layered structure of the solidified melt pools may reveal the
orientation at which the part was printed. The melt pools may be
arranged in layers. The cross section may reveal a substantially
repetitive microstructure or grain structure. The microstructure or
grain structure may comprise substantially repetitive variations in
material composition, grain orientation, material density, degree
of compound segregation or of element segregation to grain
boundaries, material phase, metallurgical phase, crystal phase,
crystal structure, material porosity, or any combination thereof.
The microstructure or grain structure may comprise substantially
repetitive solidification of layered melt pools. The substantially
repetitive microstructure may have an average layer width of at
least about 0.5 .mu.m, 1 .mu.m, 5 .mu.m, 10 .mu.m, 20 .mu.m, 30
.mu.m, 40 .mu.m, 50 .mu.m, 60 .mu.m, 70 .mu.m, 80 .mu.m, 90 .mu.m,
100 .mu.m, 150 .mu.m, 200 .mu.m, 250 .mu.m, 300 .mu.m, 350 .mu.m,
400 .mu.m, 450 .mu.m, or 500 .mu.m. The substantially repetitive
microstructure may have an average layer width of at most about 500
.mu.m, 450 .mu.m, 400 .mu.m, 350 .mu.m, 300 .mu.m, 250 .mu.m, 200
.mu.m, 150 .mu.m, 100 .mu.m, 90 .mu.m, 80 .mu.m, 70 .mu.m, 60
.mu.m, 50 .mu.m, 40 .mu.m, 30 .mu.m, 20 .mu.m, or 10 .mu.m. The
substantially repetitive microstructure may have an average layer
size of any value between the aforementioned values of layer widths
(e.g., from about 0.5 .mu.m to about 500 .mu.m, from about 15 .mu.m
to about 50 .mu.m, from about 5 .mu.m to about 150 .mu.m, from
about 20 .mu.m to about 100 .mu.m, or from about 10 .mu.m to about
80 .mu.m).
[0194] The un-transformed material within the material bed (e.g.,
powder) can be configured to provide support to the 3D object. For
example, the supportive powder may be of the same type of powder
from which the 3D object is generated, of a different type, or any
combination thereof. In some instances, a low flowability powder
can be capable of supporting a 3D object better than a high
flowability powder. A low flowability powder can be achieved inter
alia with a powder composed of relatively small particles, with
particles of non-uniform size or with particles that attract each
other. The powder may be of low, medium, or high flowability. The
powder material may have compressibility of at least about 1%, 2%,
3%, 4%, 5%, 6%, 7%, 8%, 9%, or 10% in response to an applied force
of 15 kilo Pascals (kPa). The powder may have a compressibility of
at most about 9%, 8%, 7%, 6%, 5%, 4.5%, 4.0%, 3.5%, 3.0%, 2.5%,
2.0%, 1.5%, 1.0%, or 0.5% in response to an applied force of 15
kilo Pascals (kPa). The powder may have basic flow energy of at
least about 100 milli-Joule (mJ), 200 mJ, 300 mJ, 400 mJ, 450 mJ,
500 mJ, 550 mJ, 600 mJ, 650 mJ, 700 mJ, 750 mJ, 800 mJ, or 900 mJ.
The powder may have basic flow energy of at most about 200 mJ, 300
mJ, 400 mJ, 450 mJ, 500 mJ, 550 mJ, 600 mJ, 650 mJ, 700 mJ, 750 mJ,
800 mJ, 900 mJ, or 1000 mJ. The powder may have basic flow energy
in between the above listed values of basic flow energy (e.g., from
about 100 mj to about 1000 mJ, from about 100 mj to about 600 mJ,
or from about 500 mj to about 1000 mJ). The powder may have a
specific energy of at least about 1.0 milli-Joule per gram (mJ/g),
1.5 mJ/g, 2.0 mJ/g, 2.5 mJ/g, 3.0 mJ/g, 3.5 mJ/g, 4.0 mJ/g, 4.5
mJ/g, or 5.0 mJ/g. The powder may have a specific energy of at most
5.0 mJ/g, 4.5 mJ/g, 4.0 mJ/g, 3.5 mJ/g, 3.0 mJ/g, 2.5 mJ/g, 2.0
mJ/g, 1.5 mJ/g, or 1.0 mJ/g. The powder may have a specific energy
in between any of the above values of specific energy (e.g., from
about 1.0 mJ/g to about 5.0 mJ/g, from about 3.0 mJ/g to about 5
mJ/g, or from about 1.0 mJ/g to about 3.5 mJ/g).
[0195] Optical measurements can distinguish between the
untransformed material and at least a portion of the 3D object. In
some cases, the untransformed material can be a substantially
diffuse reflector. The portion of the three-dimensional object can
be a substantially specular reflector. The optical measurement can
be a dark field and/or bright field measurement. The dark field
and/or bright field measurement can isolate non-specular reflection
(e.g., diffuse reflection) arising from the material bed. The dark
field and/or bright field measurement can be processed to produce a
map of spatial properties of the material bed.
[0196] Signals can be collected and processed to determine planar
uniformity of the 3D object and the material bed. Signals can be
collected and processed to determine respective planar uniformity
and/or planar uniformity between the 3D object and the material
bed. Respective planar uniformity can be achieved when a 3D object
and a surface of the material bed are in substantially parallel
planes. Planar uniformity can be achieved when a 3D object and a
surface of the material bed are in the same planes.
[0197] FIG. 3A shows an example of an exposed (e.g., top) surface
of a material bed 301 and an exposed surface of a 3D object 302
which lay in the same plane. In some cases, a 3D object and a
surface of the material bed can lay in different planes. For
example, FIG. 3B shows a surface of a 3D object 312 and a surface
of the powder bed 311 that lay in different planes. In some cases,
a deviation from planar uniformity can be identified by one or more
signals and detectors. A deviation from planar uniformity can be
corrected.
[0198] Planar uniformity can be continuously monitored during a
fabrication process of the 3D object. Planar uniformity can be
monitored by one or more scanning proximity sensors. The proximity
sensors can determine the height of the exposed surface of the
material bed and/or the 3D object. The proximity sensors can
determine the absolute height and/or a relative height of the
material bed and/or the 3D object. In some instances, the proximity
sensor can be disposed on the heat transfer plate. Planar
uniformity can be measured by interferometry.
[0199] In some cases, reflectivity measurements can be processed to
distinguish between the exposed surface of the material bed and a
surface of the 3D object. For example, the untransformed material
in the material bed can be a diffuse reflector and the 3D object
can be a specular reflector. One or more optical detectors (e.g.,
optical sensors), for example a CCD camera, can image a surface of
the material bed comprising untransformed material and at least a
portion of the 3D object. A signal that can be detected by the CCD
camera can be generated using background lighting. The background
lighting can be incident on the surface to be imaged. The
background lighting can be provided at a predetermined discrete
wavelength or within a range of wavelengths. The wavelength or
range of wavelengths of the background lighting can be different
from the wavelength or range of wavelengths of an energy beam that
is forming the 3D object. In some cases, the background lighting
can be provided at a predetermined wavelength or range of
wavelengths with the aid of an optical filter and/or charge coupled
device (CCD). The optical filter or CCD can allow only transmission
of background lighting at a predetermined wavelength or within a
range of wavelengths. The background lighting can be provided with
a constant, oscillating, and/or varying intensity. The intensity of
the background lighting can be varied with a regular or irregular
periodicity. Oscillation and/or variation of the intensity of the
background lighting can be synchronized with at least one detector.
Similarly, oscillation and/or variation of the intensity of the
background lighting can additionally be synchronized with emission
from an energy source that is forming the 3D object.
[0200] Signals from the background lighting or another source of
electromagnetic radiation can be processed to determine surface
topography and/or roughness. The signals can comprise reflected
and/or scattered light from the surface. The signals can be
identified and collected by one or more detectors (e.g., sensors),
for example a CCD camera, InGaAs sensor, pyrometer, or bolometer.
The detectors can image the surface at variable heights and/or
angles relative to the surface. Images from the detectors can be
processed to determine topography, roughness, and/or reflectivity
of the surface comprising the untransformed material and the 3D
object. The surface can be measured with dark-field and/or light
field illumination and a map and/or image of the illumination can
be generated from signals detected during the dark-field and/or
light field illumination. The maps from the dark-field and/or light
field illumination can be compared to characterize the surface
(e.g., of the material bed and/or of the 3D object). For example,
surface roughness can be determined from a comparison of dark-field
and/or light field detection measurements. In some cases analyzing
the signals can include polarization analysis of reflected or
scattered light signals.
[0201] FIG. 4 shows an example of a schematic optical system that
can perform measurements on a surface to determine surface
topography (e.g., relative and/or absolute heights of surface
features). The surface can be the exposed surface of the material
bed and/or a surface of the 3D object (or a portion thereof). An
energy source 400 may emit an energy beam (e.g., an electromagnetic
beam, charged particle beam, or sound wave). The energy beam 401
can be incident on a surface 402. In some cases the energy beam 401
can be focused through at least one focusing device (e.g., a lens,
not shown). At least a fraction of the incident energy beam can be
scattered by and/or reflected off of the surface 402. The scattered
and/or reflected energy beam can be a signal 403 that can be
optionally transmitted through an optical device (e.g., a lens) 404
that alters (e.g., modulates) the reflected energy beam 403 in at
least one energy beam characteristics to form an altered reflected
energy beam 407. At least one mirror 405 can direct the reflected
energy beam to one or more detectors 406. The angle and orientation
of the one or more mirrors can be varied to collect signals from
the surface at different angles of reflection and/or scattering.
The optical device may alter at least one path of the energy beam
(e.g., converge or diverge rays) or magnify the cross section of
the energy beam. In some cases, the reflection and/or scattering
angle can be processed to determine the topography and or roughness
of the surface. The intensity of a reflected and/or scattered
energy beam (i.e., signal) can be processed to determine the
spatial location of the untransformed material and/or 3D object
that reflected the signal received by the detector. The incident
energy beam can be provided at a plurality of powers. The detector
can collect reflected and/or scattered energy beams (e.g., signals)
from the untransformed material (e.g., in the material bed) and/or
3D object in response to the different incident energy powers.
[0202] In some cases, the optical system can additional comprise an
amplifier (e.g., a lock-in amplifier). The lock-in amplifier can
detect variations in the one or more reflected and/or scattered
signals. The lock-in amplifier can isolate signals in a desired
frequency range. The lock-in amplifier can isolate scattered and
reflected light signals from an electromagnetic emission that is
derived from a measurement system and an electromagnetic emission
coming from the energy source that forms the 3D object.
[0203] The systems, apparatuses, and/or methods disclosed herein
may use proximity measurements. The proximity measurements may
indicate the height of various features with respect to a plane.
The plane may be the substrate and/or the (e.g., average) exposed
surface of the material bed. The proximity measurements may measure
the height of a protruding 3D object (or any part thereof) from the
exposed surface of the material bed. The proximity measurements may
comprise using energy beams (e.g. laser lines) and/or stereoscopic
triangulation. Triangulation can be a process of determining the
location of a point by measuring angles to it from known points at
either end of a fixed baseline, rather than measuring distances to
the point directly (trilateration). The point can then be fixed as
the third point of a triangle with one known side and two known
angles. The triangulation can be based on two or more measurements
of the same point from at least two different position, and
comparing (e.g., aligning) the at least two different measurements.
The measurements may be based on images of the point. The images
may be generated using an optical sensor (e.g., as disclosed
herein). The images may be generated using an imaging system (e.g.,
comprising a camera). The one or more sensors may be height
sensors. The height sensors may be used to measure stress at a
certain position on the 3D object (e.g., on surface of the 3D
object).
[0204] The methods, systems and/or apparatuses disclosed herein may
further incorporate using the triangulation measurements and/or
image processing to evaluate the roughness of a surface (and any
components used to effectuate these measurements). The surface may
be a surface of the printed 3D object (or any portion thereof), an
exposed surface of a material bed, or any other surface. The method
may afford a resolution of at least a few micrometers. The method
may afford a resolution of at least a few tenths of a micrometer.
The method may afford a resolution of at most about 150 .mu.m, 100
.mu.m, 70 .mu.m, 50 .mu.m, 40 .mu.m, 30 .mu.m, 20 .mu.m, 10 .mu.m,
5 .mu.m, 1 .mu.m, 0.5 .mu.m, 0.2 .mu.m, 0.1 .mu.m, 0.05 .mu.m or
0.02 .mu.m. The method may afford a resolution of at least about
150 .mu.m, 100 .mu.m, 70 .mu.m, 50 .mu.m, 40 .mu.m, 30 .mu.m, 20
.mu.m, 10 .mu.m, 5 .mu.m, 1 .mu.m, 0.5 .mu.m, 0.2 .mu.m, 0.1 .mu.m,
0.05 .mu.m or 0.02 .mu.m. The method may afford a resolution of any
value between the aforementioned values (e.g., from about 100 .mu.m
to about 5 .mu.m, from about 30 .mu.m to about 0.02 .mu.m, from
about 10 .mu.m to about 0.02 .mu.m, or from about 100 .mu.m to
about 0.02 .mu.m). The techniques may include image processing. The
techniques may include CCD imaging, bright field, dark field,
and/or multi-angle viewing (e.g., triangular measurements).
[0205] The bright field measurement may include an un-scattered
beam (i.e., a beam that was not scattered) from the image. The
bright field measurements may include an absorbance of some of the
transmitted light in dense areas of the position of interest. The
dark field measurement may exclude an un-scattered beam from the
image. The techniques may include image processing. The techniques
may afford nanoscale to microscale resolution. The surface
roughness may be measured as the arithmetic average of the
roughness profile (hereinafter "Ra"). The techniques may evaluate a
surface roughness having a Ra value of at least 0.1 micrometers
(.mu.m), 1 .mu.m, or 8 .mu.m. The surface roughness may be the
deviations in the direction of the normal vector of a real surface,
from its ideal form. The 3D object can have a Ra value of at least
about 300 .mu.m, 250 .mu.m, 200 .mu.m, 100 .mu.m, 75 .mu.m, 50
.mu.m, 45 .mu.m, 40 .mu.m, 35 .mu.m, 30 .mu.m, 25 .mu.m, 20 .mu.m,
15 .mu.m, 10 .mu.m, 9 .mu.m, 8 .mu.m, 7 .mu.m, 5 .mu.m, 3 .mu.m, 1
.mu.m, 500 nm, 400 nm, 300 nm, 200 nm, 100 nm, 50 nm, 40 nm, or 30
nm. The formed object can have a Ra value of at most about 300
.mu.m, 250 .mu.m, 200 .mu.m, 100 .mu.m, 75 .mu.m, 50 .mu.m, 45
.mu.m, 40 .mu.m, 35 .mu.m, 30 .mu.m, 25 .mu.m, 20 .mu.m, 15 .mu.m,
10 .mu.m, 9 .mu.m, 8 .mu.m, 7 .mu.m, 5 .mu.m, 3 .mu.m, 1 .mu.m, 500
nm, 400 nm, 300 nm, 200 nm, 100 nm, 50 nm, 40 nm, or 30 nm. The 3D
object can have a Ra value between any of the aforementioned Ra
values (e.g., from about 30 nm to about 50 .mu.m, from about 5
.mu.m to about 40 .mu.m, from about 3 .mu.m to about 30 .mu.m, from
about 10 nm to about 50 .mu.m, from about 80 .mu.m to about 300
.mu.m, or from about 15 nm to about 80 .mu.m). The methods may use
collimated light. The methods may substantially not use dispersed
light. The roughness measurements may serve as an indication for
the powder density of the energy beam that was used to form the
surface (e.g., of the 3D object). The roughness measurement may
comprise using Lambert's emission law when evaluating the optical
measurements. The Ra values may comprise measuring by a roughness
tester and/or by a microscopy method. The measurements may be
conducted at ambient temperatures (e.g., R.T.). The roughness may
be measured by a method comprising contact or by a non-contact
method. The roughness measurement may comprise one or more sensors
(e.g., optical sensors). The roughness measurement may comprise a
metrological measurement device (e.g., using metrological
sensor(s)). The roughness may comprise using an electromagnetic
beam (e.g., visible or IR).
[0206] The surface roughness may be the deviations in the direction
of the normal vector of a real surface, from its ideal form. Ra may
use absolute values. The 3D object can have a Ra value of at least
about 300 .mu.m, 250 .mu.m, 200 .mu.m, 100 .mu.m, 75 .mu.m, 50
.mu.m, 45 .mu.m, 40 .mu.m, 35 .mu.m, 30 .mu.m, 25 .mu.m, 20 .mu.m,
15 .mu.m, 10 .mu.m, 7 .mu.m, 5 .mu.m, 3 .mu.m, 1 .mu.m, 500 nm, 400
nm, 300 nm, 200 nm, 100 nm, 50 nm, 40 nm, or 30 nm. The formed
object can have a Ra value of at most about 300 .mu.m, 250 .mu.m,
200 .mu.m, 100 .mu.m, 75 .mu.m, 50 .mu.m, 45 .mu.m, 40 .mu.m, 35
.mu.m, 30 .mu.m, 25 .mu.m, 20 .mu.m, 15 .mu.m, 10 .mu.m, 7 .mu.m, 5
.mu.m, 3 .mu.m, 1 .mu.m, 500 nm, 400 nm, 300 nm, 200 nm, 100 nm, 50
nm, 40 nm, or 30 nm. The 3D object can have a Ra value between any
of the aforementioned Ra values (e.g., the Ra value can be from
about 30 nm to about 50 .mu.m, from about 5 .mu.m to about 40
.mu.m, from about 3 .mu.m to about 30 .mu.m, from about 10 nm to
about 50 .mu.m, from about 80 .mu.m to about 300 .mu.m, or from
about 15 nm to about 80 .mu.m).
[0207] The systems and/or apparatuses described herein may comprise
one or more optical windows. The optical window may be incorporated
in the cover, coating, and/or walls of the enclosure. The optical
window may allow an energy beam that is emitted from a location
(e.g., energy source) outside of the enclosure, to travel to a
location within the enclosure. The optical window may allow
substantially in-tact preservation of the properties of the energy
beam during its travel though the optical window, while allowing
isolation of an atmosphere within the enclosure. The properties of
the energy beam may comprise power, wavelength, beam footprint,
beam collimation, or beam path. FIG. 6, 615 shows an example of an
optical window that allows transmission of an energy beam 601 from
a location outside the enclosure, towards a location within the
enclosure 607. The optical window can become contaminated (e.g.,
dirty, or murky) during the manufacturing process. The
contamination on the optical window can comprise untransformed
material that clings to, or is condensed on the optical window,
products of chemical and/or physical reactions that cling or
condense on the optical window, and/or other ambient dust or dirt.
The optical window can be an optical window placed between an
energy source and the material bed. The optical window can be an
optical window placed in the path of the energy beam that travels
towards the material bed. The optical window can be an optical
window placed in the path of the energy beam that travels towards
the enclosure interior. An obstruction (e.g., contamination) in the
optical window can reduce one or more characteristics of the energy
beam that is used to generate the 3D object. In some instances,
maintaining a clean optical window may ensure reliable
characteristics of the energy beam that is used to generate the 3D
object from at least a portion of the material bed. Maintaining a
clean optical window may ensure reliable control (e.g., regulation
and/or direction) of the energy beam that is used to generate the
3D object from at least a portion of the material bed. A state of
progression of the additive generating of a 3D object can include
maintaining a level of cleanliness of the optical window. The
cleanliness of the optical window can be monitored continuously or
at discrete intervals during the manufacturing process. The
cleanliness of the optical window can be determined, at least in
part, by a reflectivity of one or more signals from the optical
window. The cleanliness (or conversely the contamination level) of
the optical window can be determined, at least in part, by a
reflectivity of one or more signals from an energy source located
outside of the enclosure towards the optical window, and measuring
any reflection of the signal by using a detector located outside of
the enclosure. The cleanliness (or conversely the contamination
level) of the optical window can be determined, at least in part,
by a reflectivity of one or more signals from an energy source
located outside of the enclosure towards the optical window, and
measuring any reflection of the signal by using a detector located
inside the enclosure. The cleanliness (or conversely the
contamination level) of the optical window can be determined, at
least in part, by a reflectivity of one or more signals from an
energy source located inside the enclosure towards the optical
window, and measuring any reflection of the signal by using a
detector located outside of the enclosure. The cleanliness (or
conversely the contamination level) of the optical window can be
determined, at least in part, by a reflectivity of one or more
signals from an energy source located inside the enclosure towards
the optical window, and measuring any reflection of the signal by
using a detector located inside the enclosure. The detection of the
contamination level of the optical window can be done mostly or
entirely inside the enclosure. The detection of the contamination
level of the optical window can be done mostly or entirely outside
of the enclosure. The detection of the contamination level of the
optical window can be done mostly or entirely during the formation
of the 3D object (e.g., simultaneously. E.g., in real time). In
some cases, contamination on the window can cause the reflectivity
of the window to vary from a known value. Multiple locations on the
window can be tested to determine a reflectivity value at multiple
locations on the window corresponding to a level of cleanliness at
each location. When reflectivity varies from a benchmark (e.g.,
known, predetermined) reflectivity value beyond a (e.g.,
predetermined) threshold, the optical window can be cleaned
automatically. When reflectivity varies from a benchmark (e.g.,
known, predetermined) reflectivity value, at least one
characteristics of the energy beam used to generate the 3D object
may be varied (e.g., power, beam footprint, intensity, wavelength,
emission time at a certain position). When reflectivity varies from
a benchmark reflectivity value beyond a threshold, the
manufacturing process can be aborted or stalled until the optical
window returns to an acceptable cleanliness level. The acceptable
cleanliness level may be predetermined. the return to an acceptable
cleanliness level may be done by cleaning the optical window. The
cleaning may use a mechanical cleaner, energy beam cleaning,
pyrolytic cleaning, chemical cleaning, or any combination thereof.
The window can be cleaned by an energy beam cleaning that comprises
ablation (e.g., laser ablation).
[0208] One or more detector (e.g., sensor) may evaluate the
cleanliness and/or contamination of the optical window by measuring
an alteration in a penetration and/or reflection of an energy beam
(e.g., light beam) that is projected (e.g., shined) onto the
optical window (e.g., at least one surface of the optical window).
The detection mechanism may include a detector (e.g., an optical
sensor), and/or an image-capturing device (e.g., as disclosed
herein). The energy beam (e.g., light) measurement may be conducted
outside of the enclosure. The energy beam may be projected onto the
optical window (e.g., at least one surface thereof) from a position
outside of the enclosure, and be reflected from the at least one
surface to a position outside of the enclosure. FIG. 8 shows an
example of a 3D printing system and apparatus that includes an
optical window 815. The energy beam 801 used to generate the 3D
object 806 is generated by a first energy source 813 located
outside of the enclosure 807. A second energy source 817 located
outside of the enclosure 807 generates a second energy beam that is
directed to the lower surface of the optical window that faces the
exposed surface of the material bed 804. Debris 819 is disposed on
the lower surface of the optical window, and alters at lest one
property of the second energy beam (e.g., its direction).
Optionally or additionally, the altered energy beam may be
deflected and detected by a detector 818 located outside of the
enclosure 807. Optionally or additionally, the altered energy beam
may be detected by a detector 820 located inside the enclosure 807.
In some examples, the detector located inside the enclosure (e.g.,
820) may be disposed at a position that may detect the emitted
energy beam by the second energy source (e.g., 817). The second
energy beam may be different than the first energy beam (e.g., that
is used to form the 3D object). The second energy beam may have one
or more unique characteristics that may differentiate it from the
first energy beam. The unique characteristics may comprise
wavelength, power, footprint, type (e.g., electromagnetic, charge
particle, or sound), angle, or position. In some instances, the
first energy beam is located within the enclosure. In some
instances at least one detector is disposed outside of the
enclosure. In some instances at least one detector is disposed
within the enclosure. FIG. 14 shows an example of a first energy
source 1420 located within the enclosure 1407, a sensor 1418
located outside of the enclosure, and an optical window 1415
comprising debris 1419.
[0209] The sensor and/or energy source can be located within a wall
of the enclosure. The sensor and/or energy source can be located at
either sides of the optical window. FIG. 15 shows an example of an
optical window 1415, a first energy source 1517 disposed within the
wall of the enclosure 1507 and to a first side of the optical
window 1515, and a sensor 1518 disposed within the wall of the
enclosure 1507 and to a second side of the optical window 1515. The
first and second side can be perpendicular to each other, or
directly opposite to each other (e.g., as in FIG. 15).
[0210] In some embodiments, the system, method, and/or apparatus
disclosed herein may comprise an atmosphere cleanliness monitoring
system. FIG. 10 shows an example of an atmosphere cleanliness
monitoring system and/or apparatus that can be used in the methods
disclosed herein. The atmosphere cleanliness monitoring system may
monitor the environment (comprising a gas) within the enclosure.
The atmosphere cleanliness monitoring system may comprise one or
more energy beams (e.g., sound, charge, and/or electromagnetic beam
such as a laser beam. E.g., FIG. 10, 1017). The energy beams may
form a web of beam within the enclosure. The one or more energy
beams may be collimated. Each energy beam may be directed towards a
detector (e.g. an optical detector. E.g., 1018) that detects any
alteration in the characteristics of the energy beam (e.g., the
intensity and/or angle of the energy beam as compared to the
emitted energy beam). The emitted energy beam may be altered as it
encounters a species (e.g., debris) in the atmosphere of the
enclosure. Any deviation from the intensity of the emitted energy
beam may serve as an indication of the cleanliness of the
atmosphere within the enclosure. The system measuring the
cleanliness of the atmosphere may further comprise a laser beam
profiler.
[0211] The atmosphere cleanliness monitoring system may comprise a
device that captures, displays, and/or records the spatial
intensity profile of the energy beam at a particular plane
transverse to the beam propagation path. The energy beam may be a
laser. The laser may be an ultraviolet, visible, infrared,
continuous wave, pulsed, high-power, low-power, or any combination
thereof. The beam profile can be measured using a laser beam
profiler. The laser beam profiler may comprise a scanning-aperture
or a charge coupled device (i.e., CCD) camera.
[0212] The atmosphere cleanliness monitoring system may comprise
one or more particle counters to indicate the cleanliness of the
atmosphere within the enclosure. FIG. 11 shows an example of a
system and/or apparatus that can be used in the methods disclosed
herein. The one or more particle counters (e.g., FIG. 11, 1118) may
be located within the enclosure (e.g., FIG. 11, 1107). For example,
the particle counter may be located at one or more walls of the
enclosure. The particle counter may be embedded in any part within
the enclosure (e.g., as disclosed herein). The particle detector
(also designated herein as "particle counter," or "particle
sensor") can measure a density of particles (e.g., FIG. 11, 1113)
in the atmosphere with or without being exposed to direct particle
flux originating from the material bed. The particle flux may
include particle splatter, spray, sprinkle, scatter, dispersion, or
any combination thereof. In some instances, the particle detector
can measure a density of particles in the atmosphere without being
exposed to direct particles originating from (e.g., splatter) from
the material bed. The particle entrance port to the detector may be
in a position that is opposing, or not looking at the material bed.
The particle detector can be disposed in various positions within
the enclosure, or embedded within any part of the enclosure (e.g.,
as disclosed herein). The particle detector may comprise
obstructions that may lower the amount of particle originating from
the material bed detected by the detector. The obstructions may
comprise baffles. The system and/or apparatus may comprise
obstructions that are connected or not connected to the particle
detector, which obstructions may lower the amount of particle
originating from the material bed detected by the detector. The
obstructions may comprise baffles. In some instances, the particle
opening port may face the exposed surface of the material bed. In
some instances, the particle counter may detect particles arising
from the material bed. The particle detector may be translatable
(e.g., using a motor and/or scanner). The particle detector may
measure particle(s) at a certain height (e.g., relative to the
exposed surface of the material bed) within the enclosure (e.g.,
FIG. 11, 1119).
[0213] The particle counter may detect and/or counts particles
(e.g., detect and/or counts particles one at a time). The particle
counter may detect light scattering, light obscuration, and/or
direct imaging of the particles. The particle counter may include a
high intensity light source to illuminate the particle as it passes
through a detection chamber. As particle passes through the light
source (typically a laser or halogen light) the light may be
scattered. The redirected light may be detected by an optical
sensor (e.g., as used herein). The light source may be a halogen
light. The light source may illuminates the particles from the back
within a detection chamber. A high definition, high magnification
image capturing device (e.g., video camera) may record the passing
particles. The recorded video may then be analyzed by computer
software to measure particle attributes. The amplitude of the light
scattered or light blocked can be measured and the particle is
counted and tabulated into standardized counting bins.
[0214] Direct imaging particle counting may use a high-resolution
camera and light to detect particles. Vision based particle sizing
units obtain 2D images that may be analyzed by a computer to obtain
the particle size measurement (e.g., before, during and after
formation of the 3D object). The system may determine the particle
size, color and/or shape and type (e.g., chemical formula).
[0215] Stress and deformation of the 3D object can be monitored in
real time during the formation the 3D object. The control system
can alleviate, reduce, or counterbalance stress and or deformation
that can occur in the 3D object during formation. When stress
and/or deformation are detected in the 3D object above a (e.g.,
predetermined) threshold, the manufacturing process can be aborted
or altered to reduce the deformation. Stress and/or deformation of
the 3D object can be detected with high resolution triangulation of
the part surface curvature, power measurements through a narrow
slit, distance to part proximity mapping, scanning of a pyrometer
and/or bolometer, colorimetry mapping, and or gap/layering
detection using ultrasonic waves.
[0216] In some embodiments, the systems, apparatus, and method
described herein for printing a 3D object may include an object
detection system. The object detection system may comprise a
ultrasound, radio wave, nuclear magnetic resonance, X-ray, or a
magnetic field generator and/or detector. The object detection
system may comprise ultrasound, radio wave, nuclear magnetic
resonance, X-ray, or a magnetic field. The object detection system
may comprise radar, magnetic resonance imaging, or computer
tomography (CT). The computer tomography may be X-ray computer
tomography. The object detection system may detect at least the
volume of the 3D object or parts thereof (e.g., as they are being
printed). The object detection system may detect at least a portion
of a surface of the 3D object or parts thereof (e.g., as they are
being printed). The object detection system may detect at least a
portion of an interface between the 3D object and non-transformed
material. The object detection system may detect at least a portion
of an interface between the 3D object and the remaining substance
in the material bed that excludes the 3D object.
[0217] FIG. 13 shows an example of an object detection system
and/or apparatuses that can be used in the methods described
herein, comprising a wave emitter 1317 and a wave detector 1318,
which may be an integral part of a tranciever (comprising 1317 and
1318), which detect a three dimensional structure of the object
1306 that is embedded in the material bed 1304.
[0218] FIG. 18 shows an example of an object detection system
and/or apparatuses that can be used in the methods described
herein, comprising a multiplicity of beam (e.g., X-ray) emitters
(e.g., sources) 1816 disposed above the material bed 1804, and a
multiplicity of beam detectors 1817 disposed at the bottom of the
enclosure and below the material bed 1804, which detect a three
dimensional structure of the object 1806 that is embedded in the
material bed 1804.
[0219] FIG. 19 shows an example of an object detection system
and/or apparatuses that can be used in the methods described
herein, comprising a multiplicity of beam (e.g., X-ray) emitters
(e.g., sources) 1917 disposed at the bottom of the enclosure and
below the material bed 1904, and a multiplicity of beam detectors
1916 disposed above the material bed 1904, which detect a three
dimensional structure of the object 1906 that is embedded in the
material bed 1904.
[0220] FIG. 20 shows an example of an object detection system
and/or apparatuses that can be used in the methods described
herein, comprising a beam (e.g., X-ray) source 2017 disposed below
the material bed 2004, and a beam detector 2016 disposed above the
material bed 2004, which detect a three dimensional structure of
the object 2006 that is embedded in the material bed 2004. The
source is translatable along a path 2018. The detector 2016 is
translatable along a path 2019.
[0221] The translation of the detector may be coupled to the angle
at which the energy beam is projected to (e.g., so that the
detector may detect any non-dispersed angle). The translation of
the detector may be coupled to the translation of the energy beam
(e.g., so that the detector may detect any non-dispersed angle). In
some instances, at least one of (e.g., both) the energy source and
sensor can be moving. In some instances, at least one of (e.g.,
both) the energy source and sensor can be stationary.
[0222] FIG. 21 shows an example of an object detection system
and/or apparatuses that can be used in the methods described
herein, comprising a beam (e.g., X-ray) source array 2117 disposed
below the material bed 2104 (e.g., in the area 2121) at the bottom
of the enclosure 2111, and a beam detector 2116 disposed above the
material bed 2104 (e.g., in the area 2120) that travels along a
path 2119, which detect a three-dimensional structure of the object
2106 that is embedded in the material bed 2104.
[0223] In some embodiments, the material bed (e.g., powder bed)
portion comprising the pre-transformed material is at least
partially transparent to an (e.g., incoming) energy beam. For
example, the material bed portion comprising the pre-transformed
material may be at least partially transparent to a sound wave, or
electromagnetic beam (e.g., laser or X-ray beam). The
electromagnetic beam may a visible beam. The material bed (e.g.,
powder bed) portion comprising the pre-transformed material (e.g.,
powder material) may be at least partially transparent to an energy
beam, while the hardened material within the material bed (e.g., at
least a portion of the 3D object) may be substantially less
transparent (e.g., non transparent). The energy beam may travel
though the at least a portion of the material bed that comprises
the pre-transformed material and substantially reflect from the 3D
object (or a portion thereof) within the material bed. The
reflection of the energy beam from a surface of the hardened
material (e.g., 3D object) may be greater than its reflection from
the portion of the material bed comprising pre-transformed
material. The at least partial transparency of the material bed as
opposed to its reflection from the surface of the hardened material
may allow the generation of an image of the surface of the hardened
material from which the energy beam reflects (e.g., 3D object). The
image may be generated in situ and in real time during the
generation of the 3D object. The image may be generated in situ at
an intermission from the 3D object printing process. The image may
be generated in situ subsequent to the 3D object printing process.
"In situ" refers to the object being in the enclosure and at least
partially within the material bed. The image may allow evaluation
of the height of a surface of the hardened material (e.g., from
which the energy beam reflects). The image may allow evaluation of
the planarity, evenness, and/or smoothness of the surface of the
hardened material. The height may be calibrated using known
absorption, reflection, and/or penetration of the energy beam
through a volume of the material bed. Known may be experimental
and/or theoretical. The height may be calibrated using a reference
object that is embedded with known height marks within the material
bed (e.g., a ruler). The method may comprise measuring absorption
and/or reflection of the energy beam at one or more positions above
the exposed surface of the material bed. The method may comprise
imaging (e.g., using an optical sensor such as an imaging device)
the hardened material. The method may comprise image processing.
The method may comprise analyzing the spectrum of the energy beam
(e.g., that is reflected and/or absorbed). The energy beam may be
the energy beam that transforms at least a portion of the material
bed to form a transformed material. The energy beam may be an
energy beam different from the energy beam that transforms at least
a portion of the material bed to form a transformed material. FIG.
23 shows an example of a 3D object 2306 that is embedded within a
material bed 2304. An energy source 2317 generates an energy beam
that is irradiated towards the substrate 2309. The energy beam
penetrates at least in part into the material bed 2304. As the
energy beam travels though the material bed 2304, it interacts with
the surface of the 3D object 2306, from which it is (at least in
part) reflected from. The reflected energy beam is detected by a
detector 2318. The detector and the energy source may be separate.
A transceiver may comprise the energy source and the detector. The
detector may be an optical sensor (e.g., an imaging device).
[0224] The object detection system may comprise an energy source
that produces an energy beam, a detector receiving altered and/or
non-altered energy beams, a system that interprets the altered
and/or non-altered energy beams detected by the detector, or any
combination thereof. The object detection system may comprise a
wave source that produces a wave (e.g., sound or light), a detector
receiving an altered or non-altered wave, a system that interprets
the altered or non-altered wave detected by the detector, or any
combination thereof. The object detection system may comprise a
field generator that produces a field (e.g., magnetic or electric),
a detector sensing any alteration or non-alteration in the field, a
system that interprets the altered or non-altered field detected by
the detector, or any combination thereof. The object detection
system may comprise transmission of an energy beam (e.g., sound,
electromagnetic, or charged particle energy beam) by an energy
source. The object detection system may comprise transmission of a
wave (e.g., sound or light) by an energy source. The object
detection system may comprise transmission of a field (e.g.,
electric or magnetic) by an energy source. The object detection
system may rely on different dielectric constants, diamagnetic
constants, density between the untransformed material and the 3D
object, or density between the 3D object and the remainder of the
material bed (e.g., that excludes the 3D object). Without wishing
to be bound to theory, these differences may cause the generated
energy beam, wave, or field to become altered due to the
interaction with the boundary between the materials (e.g., of the
untransformed material and the 3D object). The alteration may
comprise deflection and/or scattering of energy (e.g., energy beam,
wave). The alteration may comprise alteration in field lines (e.g.,
magnetic field lines), for example, alteration in the course,
direction, and/or density of the filed lines (e.g., vectors). The
alteration may comprise alteration in the course, intensity, and/or
footprint of the energy beam or wave. The object detection system
may comprise transmission of a field (e.g., magnetic or electric),
an energy beam (e.g., X-ray), sound wave (e.g., ultrasound or
radio), or any combination thereof.
[0225] The object detection system may exclude transmission of an
energy beam, wave, or field. The object detection system may
exclude an energy source. The object detection system may rely on
energy (e.g., field) that is emitted by the 3D object as it is
being formed (e.g., magnetic field, electric field, or heat energy
such as infrared energy (IR)). The electromagnetic energy may
comprise X-ray.
[0226] The sound wave may be generated using a transducer (e.g.,
piezoelectric or capacitive transducer. E.g., ultrasound
transducer). The sound generator may comprise a crystal (e.g.,
piezoelectric crystal). The transducer can comprise a contact or
immersion transducer. The transducer may comprise a dual element,
delay line, angle beam, normal incidence shear wave, or paint brush
transducer. The transducer may comprise piston source transducer.
Electrical pulses may drive the transducer at the desired
frequency. The frequencies can be anywhere between 1 and 18 Mega
Hertz (MHz). The transducers may alter the sound beam using lenses
and/or phase array techniques. The alteration may comprise
focusing, direction changing, or penetration depth of the beam. The
energy source may comprise a scanner. The scanner may control the
sound pulses (e.g., using beam-forming). The sound wave may return
to the transducer. The returned sound wave may vibrate the
transducer. The transducer may turn the vibrations into electrical
pulses that travel to the scanner (e.g., ultrasonic scanner) where
they may be processed and transformed into a digital image.
[0227] The sound detector may comprise flow-meter (e.g., acoustic
flow-meter such as an ultrasound flow-meter). The ultrasound
detector may use the Doppler effect. The ultrasound detector may
comprise fluid. The ultrasound detector may comprise a transducer.
The sound generator and/or detector may comprise a device that is
able to convert sound waves to electrical signals and/or vice versa
(e.g., a transducer). The sound generator and/or detector can be a
device that both transmits and receives (e.g., detects) sound wave
(e.g., a transceiver). The sound generator and/or detector can
comprise a material able to generate a voltage when force is
applied to it. The sound generator and/or detector can comprise a
material that can change size slightly when exposed to a magnetic
field (e.g., using the principle of magnetostriction). The sound
generator and/or detector can comprise a capacitor (e.g.,
condenser) microphone. The sound generator and/or detector can
comprise a (thin) diaphragm that responds to sound waves. Changes
in the electric field between the diaphragm and a closely spaced
backing plate may convert sound signals to electric currents. The
electric current can be amplified.
[0228] The object detection system may comprise a system that
interprets the altered energy beams, wave, or field received by the
detector. The interpretation may comprise determination of time
elapsed from sending the energy (e.g., energy beam, wave, or field)
to receiving the returning (e.g., altered or non-altered) energy
and the strength of the altered energy. The altered energy may
include deflected and/or returning energy beam or wave (e.g.,
echo).
[0229] In some embodiments, an energy beam (e.g., comprising a
sound and/or electromagnetic wave) may be used to map at least a
portion of the 3D object and generate a special map of the 3D
object (e.g., volume of the 3D object or a portion thereof). In
some embodiments, a field (e.g., comprising a magnetic and/or
electric field) may be used to map at least a portion of the 3D
object and generate a special map of the 3D object (e.g., volume of
the 3D object or a portion thereof). The map may measure the
progression of the 3D object formation in real time. The mapping
may be conducted in real time (e.g., while the 3D object is being
formed). The mapping may be conducted after the 3D object was
formed, but while it is embedded within the material bed. The
energy beam may have a wavelength that is greater than the FLS
(e.g., median, average, or maximal size) of the particulate
material that forms the material (e.g., powder) bed. The energy
beam may travel within the material bed, and be reflected from an
object (e.g., 3D object or parts thereof) within the material bed,
and/or from the sides (e.g., walls and/or platform) that defines
the boundaries of the material bed. The energy beam may travel
within the material bed, and substantially not be deflected by the
un-transformed material within the material bed (e.g., powder
particles). The energy beam (e.g., sound or electromagnetic wave)
may be reflected when it approaches an object (e.g., 3D object)
that has a dimension that is greater than or equal to its
wavelength. For example, the sound wave may be an ultrasound,
acoustic, or infrasound wave. The sound wave may be an ultrasound
wave. The electromagnetic wave may be an X-ray, infrared,
microwave, or radio wave. The radio wave may be an FM, AM, or long
radio wave. The electromagnetic wave may have a wavelength that is
at least about 0.1 .mu.m, 1 .mu.m, 10 .mu.m, 100 .mu.m, 1 mm, 10
mm, 100 mm, or 1 m. The sound or electromagnetic wave may have a
wavelength that is at most about 0.5 .mu.m, 1 .mu.m, 10 .mu.m, 100
.mu.m, 1 mm, 10 mm, 100 mm, or 1 m. The sound or electromagnetic
wave may have a wavelength that is any value between the
afore-mentioned values (e.g., from about 0.1 .mu.m to about 1 mm,
from about 1 mm to about 100 mm, from about 100 mm to about 1 m).
The sound wave may have a frequency that is higher than the upper
audible limit of average human hearing. The frequency of the sound
wave may be at least about 20 kilo Hertz (kHz), 50 kHz, 100 kHz,
200 kHz, 1000 kHz, 2000 kHz, 5000 kHz, 8000 Hz, 10000 kHz, 20000
kHz, 50000 kHz, 100000 kHz, 200000 kHz, 500000 kHz, or 10000000
kHz. The frequency of the sound or electromagnetic wave may be any
value between the aforementioned values (e.g., from about 20 kHz to
about 10000000 Hz, from about 20 kHz to about 200 kHz, from about
200 kHz to about 10000 kHz, from about 10000 kHz to about 10000000
kHz). At times the system and/or apparatus disclosed herein may use
a combination of sound and electromagnetic waves.
[0230] The magnetic field may be generated by a magnetic field
generator. The electric field may be generated by an electric field
generator. The sound wave may be generated by a sound wave
generator. The energy beam may be generated by an energy source
(e.g., energy beam generator). The magnetic field may be detected
by a magnetic field detector. The electric field may be detected by
an electric field detector. The sound wave may be detected by a
sound detector. The energy beam may be detected by an energy beam
detector (e.g., an optical detector such as a spectrum analyzer).
The generator may comprise a direct (DC) or alternating (AC)
current. the generator may comprise a motor. The generator may
comprise a magnet. The generator and/or detector may be operatively
coupled and/or controlled (e.g., regulated and/or directed) by the
controller. The generator may produce pulsed field or non-pulsed
field. The generator may comprise a dynamo. The generator may
comprise a solid state generator. The generator may comprise a
magnet. The generator may comprise electric current (e.g., DC or
AC). The generator may comprise a coil (e.g., Solenoid coil). The
generator may comprise a coil whose length is greater (e.g.,
substantially greater) than its diameter. The magnetic field
detector (e.g., sensor) can be a magnetometer.
[0231] The magnetic field detector (e.g., sensor) may comprise a
Hall effect sensor, magneto-diode, magneto-transistor, anisotropic
magnetoresistance (AMR) magnetometer, giant magnetoresistance (GMR)
magnetometer, magnetic tunnel junction magnetometer,
magneto-optical sensor, Lorenz force based MEMS sensor, Electron
Tunneling based microelectromechanical systems (MEMS) sensor, MEMS
compass, Nuclear precession magnetic field sensor, optically pumped
magnetic field sensor, fluxgate magnetometer, search coil magnetic
field sensor, or superconducting quantum interference device
(SQUID) magnetometer. The magnetic field detector may comprise a
coil though which current passes (e.g., induction coil). The
electric field sensor may comprise an electric field proximity
sensor. The electric field sensor may comprise MOS. The electric
field sensor may comprise a dielectric material.
[0232] Sound waves (e.g., sound signals. E.g., ultrasound) can be
used to monitor stress and/or deformation of the 3D object. Sound
energy can be directed to the 3D object and/or the material bed.
Sound signals can be emitted from the 3D object and/or material
bed. Sound signals can be processed to detect discontinuities where
discontinuities can comprise cracks, defects, gaps, and/or voids in
the 3D object during and/or after formation. In some cases sound
energy can be directed to the 3D object during formation. Sound
energy can be directed with one or more sound (e.g., ultrasound
transducers). A sound transducer can be a piezoelectric device.
Sound signals from the 3D object can be detected by one or more
sound (e.g., ultrasound) detectors to generate a sound map and/or
image. Sound signals can have a frequency from about 20 kHz to
about 2 MHz. Sound signals can have a frequency from about 100 kHz
to about 500 kHz. The frequency of the Sound signals may have any
value disclosed herein for the frequency of the sound or
electromagnetic wave disclosed herein.
[0233] The one or more sound detectors can be adjacent to the
platform. In some cases, one or more sound detectors can be under
the platform such that the detectors are opposite an exposed
surface of the material bed. The sound map and/or image can be
compared to a model of an expected map and/or image to identify
errors such as cracks, voids, and/or discontinuities in the 3D
object.
[0234] A state of progression of the 3D printing process can be
monitored using the system, apparatus and/or method disclosed
herein (e.g., using the mapping process). The progress of printing
the 3D object (e.g., generation of the volume map of the printed 3D
object) can be monitored continuously or at discrete intervals
during the manufacturing process. The volume of the printed 3D
object can be determined, at least in part, by a reflectivity of
one or more signals from the at least a portion of the 3D object
that is embedded in the material bed. The progress of the 3D
printing can be determined, at least in part, by a reflectivity of
one or more signals from an energy source located outside of the
enclosure towards the material bed, and measuring any reflection of
the signal by using a detector located outside of the enclosure.
The progress of the 3D printing can be determined, at least in
part, by a reflectivity of one or more signals from an energy
source located outside of the enclosure towards the material bed,
and measuring any reflection of the signal by using a detector
located inside the enclosure. The progress of the 3D printing can
be determined, at least in part, by a reflectivity of one or more
signals from an energy source located inside the enclosure towards
the material bed, and measuring any reflection of the signal by
using a detector located outside of the enclosure. progress of the
3D printing can be determined, at least in part, by a reflectivity
of one or more signals from an energy source located inside the
enclosure towards the material bed, and measuring any reflection of
the signal by using a detector located inside the enclosure. The
progress of the 3D printing can be determined mostly or entirely
inside the enclosure. The progress of the 3D printing can be
determined mostly or entirely outside of the enclosure. The
progress of the 3D printing can be determined mostly or entirely
during the formation of the 3D object (e.g., simultaneously. E.g.,
in real time). In some embodiments, the energy beam may scan at
least a portion (e.g., the entire) material bed. In some
embodiments, the energy beam may penetrate at least a portion
(e.g., the entire) material bed. Multiple locations in the material
bed can be tested to determine a reflectivity value at multiple
locations in the material bed corresponding to a volume of at least
a portion of the 3D object. When the volume of the printed 3D
object deviates from an expected volume, the printing process may
be altered (e.g., using a controller). When the volume of the
printed 3D object indicates a completion of the 3D printing
process, the printing process may stop (e.g., using a
controller).
[0235] At least one of (e.g., both) the energy source that produces
the energy beam and/or the detector receiving altered energy beams
of the object detection system may be embedded in the platform
(e.g., in the base), walls of the enclosure, any other part within
the enclosure, or any combination thereof. The sources and/or
detectors can be stationary, moveable, or any combination
thereof.
[0236] FIG. 7 shows an example of a platform (e.g., base 702) that
includes detectors and/or energy sources 717. In an analogous
manner, the base 702 may include at least part of the components of
the object detection system (e.g., the energy source and/or the
detector). In some embodiments, the platform excludes a detector
(e.g., sensor). For example, the platform may exclude a temperature
and/or a weight sensor.
[0237] In some embodiments, the spectral characteristics (e.g. the
color) of at least a portion of the formed 3D object (or pats
thereof) may be detected and/or evaluated using a detector (e.g.,
sensor). This method may be referred herein as "colorimetry". The
detector may comprise an optical sensor (e.g., as described
herein), an image-capturing device, a spectrum analyzer. The
spectrum analyzer may be a device measuring absorption and/or
emission wavelengths (e.g., FTIR, or UV-Vis measuring device). The
image-capturing device may be a camera or an optical scanner.
[0238] The color of a position in/on the 3D object may indicate the
temperature at which it was formed, and/or the time spent by the
energy beam forming the 3D object in that position and/or at that
temperature. The color may be of a position on a surface of the 3D
object. The color may be affected by presence of a reactive (e.g.,
chemical) species in the atmosphere of the chamber during formation
of the 3D object. The color of a position on the 3D object may
indicate the temperature at which the meltpool(s) at that position
was formed, and/or the time spent by the energy beam at that
position and/or at that temperature in a known atmosphere. The
known atmosphere may allow cancellation of any chemical effects
(e.g., reaction of the surface with reactive species present in the
atmosphere). The reactive species may include hydrogen, humidity,
oxygen, hydrogen sulfide, sulfur dioxide, carbon monoxide, oxidized
nitrogen compounds (NO.sub.x), volatile organic compounds (VOC),
ozone, or any combination thereof.
[0239] Discontinuities in the 3D object can be detected using
colorimetry. Colorimetry can be used to identify difference in heat
transfer through the 3D object and/or chemical reactions on the
surface (e.g., oxidation and/or nitrogenation) of the 3D object.
Colorimetry measurements of the 3D object can be processed to
identify stress and/or discontinuities that occur in the 3D object
during formation.
[0240] One or more signals can be emitted from the untransformed
material and/or at least a portion of the 3D object. In some cases,
the signals can be electromagnetic energy (e.g., light) that is
reflected and/or scattered by the untransformed material and/or the
3D object. The signals can be detected (e.g., by a spectrum
analyzer). The detected signals can be associated with a spatial
location on the material bed. The detectors can be single cell
detectors. The detected signals can be time stamped such that they
can correspond to a predetermined time interval during the
manufacturing of the 3D object. One or more spatial and/or material
profiles of the 3D object and or the untransformed material can be
generated from the signals collected at one or more detectors.
[0241] FIG. 9 shows an example of a 3D object 900 that exhibits a
spectral diversity at its surface. An energy source 912 emits an
energy beam towards a surface of the 3D object 900, which is
deflected and captured by a detector 911 that analyzes at least one
characteristics of the altered energy beam (e.g., its spectrum,
angle, and/or intensity).
[0242] The spatial and/or material profile can be a map selected
from the group consisting of differential contrast map between the
3D object and the untransformed material, spatial color map of the
3D object and/or the untransformed material, spatial map of an
interface between the 3D object and the untransformed material,
temperature map of the 3D object and/or the untransformed material,
thermal dissipation map, dark field map, bright field map, stress
or deformation map of the 3D object and/or the untransformed
material, proximity map of the untransformed material, scattering
map of the one or more signals, spectral map from the one or more
signals, integral power emission map of the 3D object and/or the
untransformed material, reflectivity map, temperature decay map,
roughness map, and/or height uniformity map.
[0243] A spatial and/or material profile can be a thermal profile.
A thermal profile can be measured by an array of detectors. The
thermal profile can be a hardening (e.g., solidification) profile
and/or a cooling profile. The cooling profile can be a time history
of a temperature gradient in one or more spatial locations in the
untransformed material. In some cases, a hardening and/or cooling
profile can be processed to determine one or more material
properties of the 3D object, for example grain size and/or melt
pools forming the 3D object. The thermal profile can be a
temperature profile as a function of time and/or space.
[0244] The systems, apparatuses, and/or methods used herein may
comprise using spontaneously or at predetermined times a closed
loop control based on at least one temperature measurement
conducted by a sensor. The closed loop control may comprise
adjusting a 3D printing system to reach a target temperature based
on one or more sensor measurements. The sensor may include an
optical and/or plasma sensor. The sensor may include any
temperature sensor (e.g., as disclosed herein).
[0245] The heat measurements may be a measurement of a particular
position that is being heated, was heated, or is being heated by an
energy beam (e.g., laser). The heat measurement may be in the range
of at least about 500.degree. C., 250.degree. C., 100.degree. C.,
50.degree. C., 25.degree. C., or 10.degree. C. below the melting
point (m.p.) of the powder material, up to at most about 10.degree.
C., 25.degree. C., 50.degree. C., 100.degree. C., 250.degree. C.,
or 500.degree. C. above the m.p. of the powder material.
[0246] The heat measurement may facilitate creation of a heat map,
solidification map, and/or solidification profile of a 3D object or
any part thereof (e.g., a layer of the 3D object, or a surface of
the 3D). The heat measurement may facilitate an indication of the
temperature at a position of the 3D object during its
formation.
[0247] The heat measurement may measure the temperature and/or
solidification rate at a position before, during and/or after the
laser beam reached that position. The heat measurements may allow
prediction of the temperature and/or solidification rate at a
position before the energy beam reached that position to form at
least a portion of the 3D object. The heat measurements may allow
manipulation of the temperature of the material bed, the target
position, the energy beam power, intensity, and/or footprint before
the energy beam transforms at least a portion of the material bed
at the target position. The temperature manipulation may include
lowering, maintaining, or elevating the temperature at the target
position. The manipulation may be a manipulation to reach a target
temperature value. The manipulation may be a manipulation to reach
a target temperature value. The temperature manipulation may allow
control of the temperature and/or solidification rate at the target
position. The control may allow maintenance of a homogenous
temperature and/or solidification rate of a desired portion of the
3D object (e.g., the entire 3D object).
[0248] The optical sensor may be used for temperature measurements.
The optical sensor may include any optical sensor disclosed herein.
For example, the optical sensor may include an analogue device
(e.g., CCD). The optical sensor may include a p-doped
metal-oxide-semiconductor (MOS) capacitor, charge-coupled device
(CCD), active-pixel sensor (APS),
micro/nano-electro-mechanical-system (MEMS/NEMS) based sensor, or
any combination thereof. The APS may be a complementary MOS (CMOS)
sensor. The MEMS/NEMS sensor may include a MEMS/NEMS inertial
sensor. The MEMS/NEMS sensor may be based on silicon, polymer,
metal, ceramics, or any combination thereof.
[0249] In some embodiments, plasma can be created during the 3D
printing process by causing heating of a gas or subjecting the gas
to a strong electromagnetic field. The appearance of plasma may
reduce the throughput of the 3D printing process. The
electromagnetic field can be applied, for example, with a laser or
microwave generator. The heating may be caused by heating and/or
transforming a material (e.g., pre-transformed material) within the
material bed (e.g., using an energy beam). The plasma may be formed
in the enclosure during the process of 3D printing, for example,
due to evaporating ionized material at a high temperature and/or
speed of the energy beam while projecting it on at least a portion
of the material bed. The at least one gas in the enclosure
atmosphere may absorb at least a portion of the energy of the
energy beam (e.g., become over heated) and may become ionized
(i.e., form plasma). A plasma monitoring system may comprise
measuring the amount of conductivity in the plasma using at least
one conductivity sensor. The plasma monitoring system may comprise
measuring the emission wavelength of the plasma using at least one
optical sensor (e.g., as disclosed herein). The plasma monitoring
system may comprise measuring the plasma density (e.g., electrical
density). The plasma monitoring system may comprise measuring the
plasma temperature. The formed plasma may subsequently be quenched,
for example, by interacting with the material bed, the platform,
the walls of the enclosure and/or with any other part within the
enclosure.
[0250] The ionization of the atmosphere may cause a positive
feedback of additional ionization of the enclosure atmosphere. The
ionization of the atmosphere may cause an enhancement and/or
amplification of the plasma formation by its own influence on the
process that gives rise to it. In order to maintain a constant
level of plasma, the speed, cross section, and/or power of the
energy beam may be adjusted. The adjustment may be manual and/or
automatic (e.g., by a controller). In order to maintain a constant
level of plasma, a cooling member (e.g., heat sink) may be
introduced to reduce the temperature of the plasma.
[0251] The appearance of plasma, its location and/or its intensity,
may serve as an indication of the temperature at the position in
the material that is being transformed. The appearance of plasma,
its location and/or its intensity may indicate a system instability
(e.g., system drift). The appearance of plasma, its location and/or
its intensity may indicate an instability (e.g., drift) in the 3D
printing process.
[0252] The plasma may emit in wavelengths that are not otherwise
emitted in the system, and thus may be used as a distinct (e.g.,
unique) detector of the temperature (e.g., at a specific position
in the material bed). The usage of the distinct wavelength may
allow fast detection of the temperature at the particular (e.g.,
melting) position. The plasma monitoring system may comprise an
optical detector (e.g., spectrometer). The plasma monitoring system
may comprise a computer that analyzes the detected signals. The
plasma monitoring system may comprise one or more detectors that
reside inside, outside, or embedded within at least one part of the
enclosure. The detector may be embedded within the wall and/or
platform of the enclosure. The plasma monitoring system may be
controlled by a controller. The controller may adjust at least one
characteristics of the energy beam in response to an output of the
plasma monitoring system. The controller may adjust at least one
characteristics of the energy beam in response to an output of a
detection signal gathered by at least one of the plasma monitoring
system detectors. The plasma detector may comprise a magnetic field
detector (e.g., as described herein). The plasma detector may
comprise a coil. The plasma detector may comprise a pick-up coil,
or Hall probe. The plasma detector may rely on the magneto-optic
effect (e.g., Faraday effect). The plasma sensor may be an optical
sensor (e.g., spectrum analyzer).
[0253] The wavelength regiment of the plasma sensor (e.g.,
spectrometer) may be from at least about 5 nanometers (nm), 10 nm,
50 nm, 100 nm, 150 nm, 200 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450
nm, 500 nm, 600 nm, 700 nm, or 800 nm. The wavelength regiment of
the plasma sensor may be up to at most about 10 nm, 50 nm, 100 nm,
150 nm, 200 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450 nm, 500 nm, 600
nm, 700 nm, or 800 nm. The wavelength regiment of the plasma sensor
may be between any value between the aforementioned values (e.g.,
from about 5 nm to about 500 nm, from about 5 nm to about 250 nm,
from about 5 nm to about 50 nm, from about 250 nm to about 500 nm,
or from about 500 nm to about 800 nm).
[0254] A computer system can be in communication with the
detectors, sensors, and/or controller. The computer system can
comprise one or more computer processors programmed or otherwise
configured to process one or more signals collected at the one or
more detectors. The processing of the signals can comprise
multi-wavelength analysis of the signals. The signals can be
processed by the computer system to monitor a manufacturing
process. The signals can be used in a feedback loop control during
formation of a 3D object. The feedback loop can be used to, without
limitation, (i) assess a quality of the 3D object during formation,
(ii) make any necessary corrections to the 3D object during
formation, (iii) optimize the formation of the 3D object to
minimize material use and/or overall processing time, and/or (iv)
to generate sample working conditions that will allow the system to
fabricate the 3D object without using a feedback loop control. For
example, signals collected during formation of the 3D object can be
used to regulate the supply of energy to a material bed in real
time to correct deviation of the 3D object from a model design.
[0255] One or more signals can be collected from the 3D object
and/or the untransformed material by at least one detector in
sensing communication with the 3D object and/or the untransformed
material, as described herein. The sensing communication can be
electronic and/or optical communication. The computer system can
process the signals collected by the at least one detector to
determine a deviation of the 3D object or portion thereon from a
model design. A map that is generated based on one or more signals
can be compared to a model of the 3D object to determine a state or
property of the 3D object and/or untransformed material and/or a
state or progression of the 3D printing process. The state of the
3D printing process can comprise a degree of completion of the 3D
object. The model design can comprise a temporal evolution
component such that the model design includes a model for a
complete 3D object as well as a model for the 3D object at
intermediate manufacturing steps. The temporal evolution model can
depend, at least in part, on temperature decay of the 3D object in
the material bed. The computer system can instruct a controller to
alter a pattern of scanning by the energy source to reduce or
maintain the deviation. Corrective measures can be employed to the
additive manufacturing process to decrease or eliminate the
deviation. The deviation can be reduced to less than or equal to
about 10%, 5%, or 1%, where the deviation percent can be the
current deviation relative to an ideal model value. When the
deviation exceeds a (e.g., predetermined) threshold the computer
system can instruct the controller to abort the manufacturing
process.
[0256] In some cases, the signals can be processed using a
triangulation technique. The triangulation technique can produce
spatial data about the powder bed and/or the 3D object. In some
cases the triangulation technique can process the one or more
signals to determine a location of the 3D object relative to the
material bed.
[0257] FIG. 5 shows a computer system 501 that is programmed or
otherwise configured to control additive manufacturing system
provided herein. The computer system can include various parameters
of such systems, such as, for example, the rate at which an object
is additively generated, the supply of energy from one or more
energy sources that supply energy to a untransformed material
adjacent to the platform, environmental conditions in the enclosure
(e.g., chamber) in which the 3D object is formed (e.g., pressure
and/or gas composition).
[0258] For example, the computer system 501 controls the scanning
rate and/or location of energy supplied from an energy source to at
least a portion of the material bed. In some cases, energy is
supplied to the material bed along a path. The computer system 501
can direct a scan of the energy beam in a raster and/or vector
pattern on the surface of the material bed to form the 3D object or
a portion thereof. The computer system can control the material bed
and dwell time of the energy beam. When the energy beam is supplied
from an energy source, then the computer system can control (e.g.,
regulate and/or direct) the modulation of the energy beam (e.g.,
turn the energy source on/off). When the energy beam is supplied
from a laser system having an array of laser diodes, then the
computer system can turn different diodes on and off.
[0259] The computer system 501 can include processing unit 505. The
processing unit may be any processing unit disclosed in patent
application No. 62/252,330, titled "APPARATUSES, SYSTEMS AND
METHODS FOR THREE-DIMENSIONAL PRINTING," filed on Nov. 6, 2015,
which is entirely incorporated herein by reference. The processing
unit may be a central processing unit (e.g., CPU). The processing
unit may be referred herein as "processor" or "computer processor."
The processing unit can be a single core or multi core processor,
or a plurality of processors for parallel processing. The computer
system also includes memory or memory location 510 (e.g.,
random-access memory, read-only memory, flash memory), electronic
storage unit 515 (e.g., hard disk), communication interface 520
(e.g., network adapter) for communicating with one or more other
systems, and peripheral devices 525, such as cache, other memory,
data storage and/or electronic display adapters. The memory,
storage unit, interface, and peripheral devices are in
communication with the processing unit through a communication bus
(solid lines), such as a motherboard. The storage unit can be a
data storage unit (or data repository) for storing data. The
computer system can be operatively coupled to a computer network
("network") 530 with the aid of the communication interface. The
network can be the Internet, an internet and/or extranet, or an
intranet and/or extranet that is in communication with the
Internet. The network can be a telecommunication and/or data
network. The network can include one or more computer servers,
which can enable distributed computing, such as cloud computing.
The network, in some cases with the aid of the computer system, can
implement a peer-to-peer network, which may enable devices coupled
to the computer system to behave as a client or a server.
[0260] The processing unit can execute a sequence of
machine-readable instructions, which can be embodied in a program
or software. The instructions may be stored in a memory location,
such as the memory. Examples of operations performed by the
processing unit can include fetch, decode, execute, and
write-back.
[0261] The processing unit can be part of a circuit, such as an
integrated circuit. One or more other components of the system can
be included in the circuit. In some cases, the circuit is an
application specific integrated circuit (ASIC).
[0262] The storage unit can store files, such as drivers, libraries
and saved programs. The storage unit can store user data, e.g.,
user preferences and user programs. The computer system in some
cases can include one or more additional data storage units that
are external to the computer system, such as located on a remote
server that is in communication with the computer system through an
intranet or the Internet.
[0263] The computer system can communicate with one or more remote
computer systems through the network. For instance, the computer
system can communicate with a remote computer system of a user
(e.g., operator). Examples of remote computer systems include
personal computers (e.g., portable PC), slate or tablet PC's (e.g.,
Apple.RTM. iPad, Samsung.RTM. Galaxy Tab), telephones, Smart phones
(e.g., Apple.RTM. iPhone, Android-enabled device, Blackberry.RTM.),
or personal digital assistants. The user can access the computer
system via the network.
[0264] Methods as described herein can be implemented by way of
machine (e.g., computer processor) executable code stored on an
electronic storage location of the computer system, such as, for
example, on the memory or electronic storage unit. The machine
executable or machine readable code can be provided in the form of
software. During use, the code can be executed by the processor. In
some cases, the code can be retrieved from the storage unit and
stored on the memory for ready access by the processor. In some
situations, the electronic storage unit can be precluded, and
machine-executable instructions are stored on memory.
[0265] The code can be pre-compiled and configured for use with a
machine have a processer adapted to execute the code, or can be
compiled during runtime. The code can be supplied in a programming
language that can be selected to enable the code to execute in a
pre-compiled or as-compiled fashion.
[0266] Aspects of the systems and methods provided herein, such as
the computer system, can be embodied in programming. Various
aspects of the technology may be thought of as "products" or
"articles of manufacture" typically in the form of machine (or
processor) executable code and/or associated data that is carried
on or embodied in a type of machine readable medium.
Machine-executable code can be stored on an electronic storage
unit, such memory (e.g., read-only memory, random-access memory,
flash memory) or a hard disk. "Storage" type media can include any
or all of the tangible memory of the computers, processors or the
like, or associated modules thereof, such as various semiconductor
memories, tape drives, disk drives and the like, which may provide
non-transitory storage at any time for the software programming.
All or portions of the software may at times be communicated
through the Internet or various other telecommunication networks.
Such communications, for example, may enable loading of the
software from one computer or processor into another, for example,
from a management server or host computer into the computer
platform of an application server. Thus, another type of media that
may bear the software elements includes optical, electrical and
electromagnetic waves, such as used across physical interfaces
between local devices, through wired and optical landline networks
and over various air-links. The physical elements that carry such
waves, such as wired or wireless links, optical links or the like,
also may be considered as media bearing the software. As used
herein, unless restricted to non-transitory, tangible "storage"
media, terms such as computer or machine "readable medium" refer to
any medium that participates in providing instructions to a
processor for execution.
[0267] Hence, a machine readable medium, such as
computer-executable code, may take many forms, including but not
limited to, a tangible storage medium, a carrier wave medium or
physical transmission medium. Non-volatile storage media include,
for example, optical or magnetic disks, such as any of the storage
devices in any computer(s) or the like, such as may be used to
implement the databases, etc. shown in the drawings. Volatile
storage media include dynamic memory, such as main memory of such a
computer platform. Tangible transmission media include coaxial
cables; copper wire and fiber optics, including the wires that
comprise a bus within a computer system. Carrier-wave transmission
media may take the form of electric or electromagnetic signals, or
acoustic or light waves such as those generated during radio
frequency (RF) and infrared (IR) data communications. Common forms
of computer-readable media therefore include for example: a floppy
disk, a flexible disk, hard disk, magnetic tape, any other magnetic
medium, a CD-ROM, DVD or DVD-ROM, any other optical medium, punch
cards paper tape, any other physical storage medium with patterns
of holes, a RAM, a ROM, a PROM and EPROM, a FLASH-EPROM, any other
memory chip or cartridge, a carrier wave transporting data or
instructions, cables or links transporting such a carrier wave, or
any other medium from which a computer may read programming code
and/or data. Many of these forms of computer readable media may be
involved in carrying one or more sequences of one or more
instructions to a processor for execution.
[0268] The computer system can include or be in communication with
an electronic display that comprises a user interface (UI) for
providing, for example, a design of an object to be formed by the
additive manufacturing system, status of one or more components in
the additive manufacturing system, or time remaining to form an
object. Examples of UI's include, without limitation, a graphical
user interface (GUI) and web-based user interface.
[0269] Methods and systems of the present disclosure can be
implemented by way of one or more algorithms. An algorithm can be
implemented by way of software upon execution by one or more
computer processors.
[0270] In some cases, a layer of the 3D object can be formed within
at most about 1 hour (h), 30 minutes (min), 20 min, 10 min, 5 min,
1 min, 40 seconds (s), 20 s, 10 s, 9 s, 8 s, 7 s, 6 s, 5 s, 4 s, 3
s, 2 s, or 1 s. A layer of the 3D object can be formed within at
least about 30 minutes (min), 20 min, 10 min, 5 min, 1 min, 40
seconds (s), 20 s, 10 s, 9 s, 8 s, 7 s, 6 s, 5 s, 4 s, 3 s, 2 s, or
1 s. A layer of the 3D can be formed within any time between the
aforementioned time scales (e.g., from about 1 h to about 1 s, from
about 10 min to about 1 s, from about 40 s to about 1 s, from about
10 s to about 1 s, or from about 5 s to about 1 s).
[0271] The final form of the 3D object can be retrieved soon after
cooling of a final material layer. Soon after hardening (e.g.,
cooling) may be at most about 1 day, 12 hours (h), 6 h, 5 h, 4 h, 3
h, 2 h, 1 h, 30 minutes, 15 minutes, 5 minutes, 240 s, 220 s, 200
s, 180 s, 160 s, 140 s, 120 s, 100 s, 80 s, 60 s, 40 s, 20 s, 10 s,
9 s, 8 s, 7 s, 6 s, 5 s, 4 s, 3 s, 2 s, or 1 s. Soon after cooling
may be between any of the aforementioned time values (e.g., from
about is to about 1 day, from about is to about 1 hour, from about
30 minutes to about 1 day, or from about 20 s to about 240 s). In
some cases, the cooling can occur by method comprising active
cooling by convection using a cooled gas or gas mixture comprising
argon, nitrogen, helium, neon, krypton, xenon, hydrogen, carbon
monoxide, carbon dioxide, or oxygen. Cooling may be cooling to a
temperature that allows a person to handle the 3D object. Cooling
may be cooling to a handling temperature. The 3D object can be
retrieved during a time period between any of the aforementioned
time periods (e.g., from about 12 h to about 1 s, from about 12 h
to about 30 min, from about 1 h to about 1 s, or from about 30 min
to about 40 s).
[0272] The generated 3D object can require very little or no
further processing after its retrieval. In some examples, the
diminished further processing or lack thereof, will afford a 3D
printing process that requires smaller amount of energy and/or less
waste as compared to commercially available 3D printing processes.
The smaller amount can be smaller by at least about 1.1, 1.3, 1.5,
2, 3, 4, 5, 6, 7, 8, 9, or 10. The smaller amount may be smaller by
any value between the aforementioned values (e.g., from about 1.1
to about 10, or from about 1.5 to about 5). Further processing may
comprise trimming, as disclosed herein. Further processing may
comprise polishing (e.g., sanding). For example, in some cases the
generated 3D object can be retrieved and finalized without removal
of transformed material and/or auxiliary features. The 3D object
can be retrieved when the 3D part, composed of hardened (e.g.,
solidified) material, is at a handling temperature that is suitable
to permit the removal of the 3D object from the material bed
without substantial deformation. The handling temperature can be a
temperature that is suitable for packaging of the 3D object. The
handling temperature a can be at most about 120.degree. C.,
100.degree. C., 80.degree. C., 60.degree. C., 40.degree. C.,
30.degree. C., 25.degree. C., 20.degree. C., 10.degree. C., or
5.degree. C. The handling temperature can be of any value between
the aforementioned temperature values (e.g., from about 120.degree.
C. to about 20.degree. C., from about 40.degree. C. to about
5.degree. C., or from about 40.degree. C. to about 10.degree.
C.).
[0273] The methods and systems provided herein can result in fast
and efficient formation of 3D objects. In some cases, the 3D object
can be transported within at most about 120 min, 100 min, 80 min,
60 min, 40 min, 30 min, 20 min, 10 min, or 5 min after the last
layer of the object hardens (e.g., solidifies). In some cases, the
3D object can be transported within at least about 120 min, 100
min, 80 min, 60 min, 40 min, 30 min, 20 min, 10 min, or 5 min after
the last layer of the object hardens. In some cases, the 3D object
can be transported within any time between the above-mentioned
values (e.g., from about 5 min to about 120 min, from about 5 min
to about 60 min, or from about 60 min to about 120 min). The 3D
object can be transported once it cools to a temperature of at most
about 100.degree. C., 90.degree. C., 80.degree. C., 70.degree. C.,
60.degree. C., 50.degree. C., 40.degree. C., 30.degree. C.,
25.degree. C., 20.degree. C., 15.degree. C., 10.degree. C., or
5.degree. C. The 3D object can be transported once it cools to a
temperature value between the above-mentioned temperature values
(e.g., from about 5.degree. C. to about 100.degree. C., from about
5.degree. C. to about 40.degree. C., or from about 15.degree. C. to
about 40.degree. C.). Transporting the 3D object can comprise
packaging and/or labeling the 3D object. In some cases the 3D
object can be transported directly to a consumer.
[0274] Systems and methods presented herein can facilitate
formation of custom or stock 3D objects for a customer. A customer
can be an individual, a corporation, organization, government,
non-profit organization, company, hospital, medical practitioner,
engineer, retailer, any other entity, or individual. The customer
may be one that is interested in receiving the 3D object and/or
that ordered the 3D object. A customer can submit a request for
formation of a 3D object. The customer can provide an item of value
in exchange for the 3D object. The customer can provide a design or
a model for the 3D object. The customer can provide the design in
the form of a stereo lithography (STL) file. The customer can
provide a design where the design can be a definition of the shape
and dimensions of the 3D object in any other numerical or physical
form. In some cases, the customer can provide a 3D model, sketch,
or image as a design of an object to be generated. The design can
be transformed in to instructions usable by the printing system to
additively generate the 3D object. The customer can provide a
request to form the 3D object from a specific material or group of
materials (e.g., a material as described herein). In some cases,
the design may not contain auxiliary features or marks of any past
presence of auxiliary support features.
[0275] In response to the customer request the 3D object can be
formed or generated with the printing method, system and/or
apparatus as described herein. In some cases, the 3D object can be
formed by an additive 3D printing process. Additively generating
the 3D object can comprise successively depositing and melting a
powder comprising one or more materials as specified by the
customer. The 3D object can subsequently be delivered to the
customer. The 3D object can be formed without generation or removal
of auxiliary features (e.g., that is indicative of a presence or
removal of the auxiliary support feature). Auxiliary features can
be support features that prevent a 3D object from shifting,
deforming or moving during formation.
[0276] The 3D object (e.g., solidified material) that is generated
for the customer can have an average deviation value from the
intended dimensions of at most about 0.5 microns (.mu.m), 1 .mu.m,
3 .mu.m, 10 .mu.m, 30 .mu.m, 100 .mu.m, 300 .mu.m, or less. The
deviation can be any value between the aforementioned values (e.g.,
from about 0.5 .mu.m to about 300 .mu.m, from about 10 .mu.m to
about 50 .mu.m, from about 15 .mu.m to about 85 .mu.m, from about 5
.mu.m to about 45 .mu.m, or from about 15 .mu.m to about 35 .mu.m).
The 3D object can have a deviation from the intended dimensions in
a specific direction, according to the formula Dv+L/K.sub.Dv,
wherein Dv is a deviation value, L is the length of the 3D object
in a specific direction, and K.sub.Dv is a constant. Dv can have a
value of at most about 300 .mu.m, 200 .mu.m, 100 .mu.m, 50 .mu.m,
40 .mu.m, 30 .mu.m, 20 .mu.m, 10 .mu.m, 5 .mu.m, 1 .mu.m, or 0.5
.mu.m. Dv can have a value of at least about 0.5 .mu.m, 1 .mu.m, 3
.mu.m, 5 .mu.m, 10 .mu.m, 20 .mu.m, 30 .mu.m, 50 .mu.m, 70 .mu.m,
100 .mu.m, or 300 .mu.m. Dv can have any value between the
aforementioned values (e.g., from about 0.5 .mu.m to about 300
.mu.m, from about 10 .mu.m to about 50 .mu.m, from about 15 .mu.m
to about 85 .mu.m, from about 5 .mu.m to about 45 .mu.m, or from
about 15 .mu.m to about 35 .mu.m). K.sub.dv can have a value of at
most about 3000, 2500, 2000, 1500, 1000, or 500. K.sub.dv, can have
a value of at least about 500, 1000, 1500, 2000, 2500, or 3000.
K.sub.dv can have any value between the aforementioned values
(e.g., from about 3000 to about 500, from about 1000 to about 2500,
from about 500 to about 2000, from about 1000 to about 3000, or
from about 1000 to about 2500).
[0277] The intended dimensions can be derived from a model design.
The 3D part can have the stated accuracy value immediately after
its formation, without additional processing or manipulation.
Receiving the order for the object, formation of the object, and
delivery of the object to the customer can take at most about 7
days, 6 days, 5 days, 3 days, 2 days, 1 day, 12 hours, 6 hours, 5
hours, 4 hours, 3 hours, 2 hours, 1 hour, 30 min, 20 min, 10 min, 5
min, 1 min, 30 seconds, or 10 seconds. In some cases, the 3D object
can be additively generated in a period between any of the
aforementioned time periods (e.g., from about 10 seconds to about 7
days, from about 10 seconds to about 12 hours, from about 12 hours
to about 7 days, or from about 12 hours to about 10 minutes). The
time can vary based on the physical characteristics of the object,
including the size and/or complexity of the object.
[0278] While some methods, apparatuses and/or systems provided
herein have been described in the context of powders, such methods
and systems may be applied in other contexts. For example, methods
and systems of the present disclosure may be used in fused
deposition modeling (FDM), which can be used to additively generate
a 3D object by laying down material in layers. In FDM, a plastic
filament or metal wire, for example, may be unwound from a coil and
supplies material to produce the 3D object. As an alternative,
methods and systems of the present disclosure may be used in
stereolithography (SLA), which may be used to additively generate
the 3D object one layer at a time, for example, by curing a
photo-reactive resin with a UV laser or another similar power
source. As another alternative, methods and systems of the present
disclosure may be used in poly jet printing, which may be used to
additively generate the 3D object by providing liquids through one
or more jetting heads along a pattern. The liquids may be
photopolymers, which may be cured by an ultraviolet (UV) lamp.
[0279] While some methods, apparatuses and/or systems provided
herein have been described in the context of additive formation of
3D objects, such methods and systems may be used with subtractive
formation of 3D objects. The subtractive formation of a 3D object
may include machining, etching, fluid jetting (e.g., water
jetting), and/or laser cutting. Additive and subtractive approaches
may be used separately or in combination with one another.
[0280] While preferred embodiments of the present invention have
been shown and described herein, it will be obvious to those
skilled in the art that such embodiments are provided by way of
example only. It is not intended that the invention be limited by
the specific examples provided within the specification. While the
invention has been described with reference to the aforementioned
specification, the descriptions and illustrations of the
embodiments herein are not meant to be construed in a limiting
sense. Numerous variations, changes, and substitutions will now
occur to those skilled in the art without departing from the
invention. Furthermore, it shall be understood that all aspects of
the invention are not limited to the specific depictions,
configurations or relative proportions set forth herein which
depend upon a variety of conditions and variables. It should be
understood that various alternatives to the embodiments of the
invention described herein may be employed in practicing the
invention. It is therefore contemplated that the invention shall
also cover any such alternatives, modifications, variations, or
equivalents. It is intended that the following claims define the
scope of the invention and that methods and structures within the
scope of these claims and their equivalents be covered thereby.
* * * * *