U.S. patent application number 15/439419 was filed with the patent office on 2017-11-23 for method of manufacturing an implantable neural electrode interface platform.
The applicant listed for this patent is The Charles Stark Draper Laboratory, Inc.. Invention is credited to John Burns, IV, Julianne Grainger, John Lachapelle, Bryan McLaughlin, Tirunelveli S. Sriram.
Application Number | 20170333700 15/439419 |
Document ID | / |
Family ID | 58489756 |
Filed Date | 2017-11-23 |
United States Patent
Application |
20170333700 |
Kind Code |
A1 |
Burns, IV; John ; et
al. |
November 23, 2017 |
METHOD OF MANUFACTURING AN IMPLANTABLE NEURAL ELECTRODE INTERFACE
PLATFORM
Abstract
The present disclosure discusses a method of manufacturing an
implantable neural electrode. The method includes cutting a metal
layer to form a plurality of electrode sites, contact pads and
metal traces connecting the electrode sites to the contact pads. A
first silicone layer including a mesh is formed and coupled to the
metal layer. A second silicone layer is formed and laminated to the
first silicone layer coupled with the metal layer. Holes are formed
in the first or second silicone layer exposing the contact pads and
electrode sites. Wires are welded to the exposed contact pads and a
third layer of silicone is overmolded over the contact pads and
wires.
Inventors: |
Burns, IV; John; (Cambridge,
MA) ; Grainger; Julianne; (Boston, MA) ;
McLaughlin; Bryan; (Cambridge, MA) ; Sriram;
Tirunelveli S.; (Acton, MA) ; Lachapelle; John;
(Princeton, MA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
The Charles Stark Draper Laboratory, Inc. |
Cambridge |
MA |
US |
|
|
Family ID: |
58489756 |
Appl. No.: |
15/439419 |
Filed: |
February 22, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62298272 |
Feb 22, 2016 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
A61N 1/0551 20130101;
A61N 1/0534 20130101; A61B 5/04001 20130101; A61B 2018/00434
20130101; A61N 1/0539 20130101; A61N 1/0529 20130101 |
International
Class: |
A61N 1/05 20060101
A61N001/05 |
Claims
1. A method of manufacturing an implantable neural electrode
comprising: cutting a metal layer to form a plurality of electrode
sites, contact pads and metal traces, wherein the metal layer is
about 5 .mu.m to 25 .mu.m thick and wherein the metal traces
connect one or more electrode sites to one or more contact pads;
forming a first silicone layer by: knife-coating a polymer mesh
with silicone, such that the first silicone layer has a thickness
between about 50 .mu.m and about 100 .mu.m, and curing the first
silicone layer; coupling the metal layer to the first silicone
layer; forming a second silicone layer by calendaring silicone to a
thickness between about 50 .mu.m and about 100 .mu.m; laminating
the first silicone layer to the second silicone layer such that the
metal layer is positioned between the first silicone layer and a
second silicone layer; forming a first set of holes in the first or
second silicone layers to expose one or more electrode sites and a
second set of holes in the first or second silicone layers to
expose one or more contact pads in the metal layer; after exposing
the one or more contact pads, welding one or more wires to the one
or more exposed contact pads; and overmolding a third silicone
layer over the one or more welded contact pads and a portion of the
wires.
2. The method of claim 1, further comprising applying a release
tape to the metal layer prior to cutting the metal layer.
3. The method of claim 2, further comprising removing the release
tape from the metal layer after coupling the cut metal layer to the
first silicone layer.
4. The method of claim 3, wherein removing the release tape
comprises one of heating the release tape, dissolving the release
tape with a solvent and exposing the release tape to ultraviolet
light.
5. The method of claim 1, wherein prior to laminating the first
silicone layer to the second silicone layer the method further
comprises cleaning the metal layer with oxygen plasma.
6. The method of claim 5, wherein after cleaning the metal layer
with oxygen plasma the method further comprises depositing a primer
on the metal layer.
7. The method of claim 1, wherein forming the first silicone layer
comprises knife-coating the mesh such that the first silicone layer
is between about 60 .mu.m and about 90 .mu.m thick and forming the
second silicone layer comprises calendaring the second layer of
silicone to be between about 60 .mu.m and about 90 .mu.m thick.
8. The method of claim 1, wherein forming the first silicone layer
comprises knife-coating the mesh such that the first silicone layer
is between about 70 .mu.m and about 80 .mu.m thick and forming the
second silicone layer comprises calendaring the second silicone
layer to be between about 70 .mu.m and about 80 .mu.m thick.
9. The method of claim 1, further comprising cutting the metal
layer and forming the first set of holes and the second set of
holes in the first or second silicone layers using laser
ablation.
10. The method of claim 9, wherein the laser ablation comprises
using a picosecond pulsed laser.
11. The method of claim 1, wherein the mesh comprises nylon,
polyamide or polyester fibers.
12. The method of claim 11, wherein the mesh includes an open area
comprising between 40% and 50% of the total area of the mesh.
13. The mesh of claim 11, wherein each fiber comprises a diameter
between about 30 .mu.m and about 50 .mu.m.
14. The mesh of claim 11, wherein the fibers are spaced about 60
.mu.m and about 70 .mu.m apart.
15. The method of claim 11, wherein the mesh is between about 40
.mu.m and about 50 .mu.m thick.
16. The method of claim 1, wherein welding comprises resistance
welding or laser welding.
17. The method of claim 1, wherein the third silicone layer is
overmolded onto the second silicone layer, and the overmolding
achieves a gradual transition between the second silicone layer and
the third silicone layer.
18. The method of claim 1, wherein the third silicone layer is
overmolded onto the first silicone layer, and the overmolding
achieves a gradual transition between the first silicone layer and
the third silicone layer.
19. The method of claim 1, wherein the first set of holes and the
second set of holes are both formed in the first layer of silicone
or are both formed in the second layer of silicone.
20. The method of claim 1, wherein the first set of holes are
formed in a different layer of silicone than the layer of silicone
in which the second set of holes are formed.
Description
RELATED APPLICATIONS
[0001] The present application claims priority to the U.S.
Provisional Application No. 62/298,272 filed on Feb. 22, 2016, and
titled "LONGITUDINAL INTRA-FASCICULAR ELECTRODE," which is herein
incorporated by reference in its entirety.
BACKGROUND
[0002] Peripheral nerves are the nerves outside the central nervous
system (e.g., the brain and spinal cord). They serve as a relay,
connecting the central nervous system to the limbs and organs.
[0003] Peripheral and cortical nerve stimulation are increasingly
popular disease treatments. These techniques function by delivering
an electrical stimulation pulse to a targeted area in order to
create a neural response. Peripheral nerve stimulation has been
used to treat chronic pain and migraines. Cortical neural
stimulation can be used to treat Parkinson's disease and
depression.
SUMMARY OF THE DISCLOSURE
[0004] According to one aspect of the disclosure, a method of
manufacturing an implantable neural electrode interface platform
may include cutting a metal layer to form a plurality of electrode
sites, contact pads and metal traces. The metal layer is between
about 5 .mu.m and about 25 .mu.m thick. The metal traces connect
one or more electrode sites to one or more contact pads. A first
silicone layer is formed by knife-coating a polymer mesh with
silicone and cured. The first silicone layer is between about 50
.mu.m and about 100 .mu.m thick. The metal layer is coupled to the
first silicone layer. A second silicone layer is formed by
calendaring silicone to a thickness between about 50 .mu.m and
about 100 .mu.m. The first silicone layer is laminated to the
second silicone layer. The metal layer is positioned between the
first silicone layer and the second silicone layer. A first set of
holes are formed in the first or second silicone layers to expose
one or more electrode sites. A second set of holes are formed in
the first or second silicone layer to expose one or more contact
pads in the metal layer. Wires are welded to the exposed contact
pads. A third silicone layer is overmolded over the contact pads
and a portion of the wires.
[0005] In some implementations, a release tape is applied to the
metal layer before cutting the metal layer. The release tape may be
removed from the metal layer after coupling the cut metal layer to
the first silicone layer. The release tape can be removed by
heating the release tape, dissolving the release tape in a solvent
or exposing the release tape to ultraviolet light.
[0006] In some implementations, the metal layer is cleaned with
oxygen plasma before laminating the first silicone layer to the
second silicone layer. A primer is deposited on the metal layer
after cleaning the metal layer with oxygen plasma. In some
implementations, laser ablation is used to cut the metal layer and
form the first and second sets of holes. A picosecond pulsed laser
may be used for the laser ablation.
[0007] In some implementations, the mesh includes nylon, polyamide,
or polyester fibers. The mesh may include an open area between 40%
and 50% of the total area of the mesh. Each fiber of the mesh may
have a diameter between about 30 .mu.m and about 50 .mu.m. The mesh
fibers may be spaced about 60 .mu.m and about 70 .mu.m apart. The
mesh may be between about 40 .mu.m and 50 .mu.m thick. In some
implementations, forming the first silicone layer comprises
knife-coating the mesh such that the first silicone layer is
between about 60 .mu.m and about 90 .mu.m thick and forming the
second silicone layer comprises calendaring the second layer of
silicone to be between about 60 .mu.m and about 90 .mu.m thick. In
some implementations, forming the first silicone layer comprises
knife-coating the mesh such that the first silicone layer is
between about 70 .mu.m and about 80 .mu.m thick and forming the
second silicone layer comprises calendaring the second silicone
layer to be between about 70 .mu.m and about 80 .mu.m thick.
[0008] In some implementations, resistance welding or laser welding
may be used for the welding the wires to the exposed contact
pads.
[0009] In some implementations, the overmolding achieves a gradual
transition between the first or second silicone layer and the third
silicone layer.
[0010] In some implementations, the first and second sets of holes
are both formed in the first silicone layer. In other
implementations, the first and second sets of holes are both formed
in the second silicone layer. In some implementations, the first
set of holes may be formed in a different layer of silicone than
the layer of silicone in which the second set of holes is
formed.
[0011] The foregoing general description and following description
of the drawings and detailed description are exemplary and
explanatory and are intended to provide further explanation of the
invention as claimed. Other objects, advantages, and novel features
will be readily apparent to those skilled in the art from the
following brief description of the drawings and detailed
description of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The skilled artisan will understand that the figures,
described herein, are for illustration purposes only. It is to be
understood that in some instances various aspects of the described
implementations may be shown exaggerated or enlarged to facilitate
an understanding of the described implementations. In the drawings,
like reference characters generally refer to like features,
functionally similar and/or structurally similar elements
throughout the various drawings. The drawings are not necessarily
to scale, emphasis instead being placed upon illustrating the
principles of the teachings. The drawings are not intended to limit
the scope of the present teachings in any way. The system and
method may be better understood from the following illustrative
description with reference to the following drawings in which:
[0013] FIG. 1 illustrates a system for peripheral nerve stimulation
and recording.
[0014] FIG. 2 illustrates a top view of an example electrode for
use in the system illustrated in FIG. 1.
[0015] FIG. 3 illustrates another example electrode for use with
the system illustrated in FIG. 1.
[0016] FIGS. 4A-4K illustrate cross-sectional views of a method for
manufacturing an example electrode for use with the system
illustrated in FIG. 1.
[0017] FIGS. 5A-5D illustrate cross-sectional views of example
electrodes manufactured by the method illustrated in FIGS.
4A-4K
[0018] FIG. 6 illustrates a scanning electron micrograph of the
coupling of the needle to an electrode for use with the system
illustrated in FIG. 1.
DETAILED DESCRIPTION
[0019] The various concepts introduced above and discussed in
greater detail below may be implemented in any of numerous ways, as
the described concepts are not limited to any particular manner of
implementation. Examples of specific implementations and
applications are provided primarily for illustrative purposes.
[0020] The present disclosure discusses electrodes and the
manufacture thereof. The electrodes are configured to be implanted
within (or adjacent to) neural tissue, such as a peripheral nerve.
The electrodes are then secured to the nerve fascicle to form an
interface between the nerve fibers of the nerve fascicle and a
neural stimulator or recording device. The electrodes include a
metal layer laminated between adhesive silicone layers. One or more
of the silicone layers can include a mesh layer for improved
handling and structural integrity. The electrodes can also include
a detachable needle that enables insertion of the electrode
directly into a nerve fascicle, bundle of nerve fibers, or other
tissue. The electrode's insertion into a nerve fiber enables
stimulation of the central regions of a nerve.
[0021] FIG. 1 illustrates a system 100 for peripheral nerve
stimulation and recording. While the system 100 can be implanted
anywhere in the body, FIG. 1 illustrates the system 100 implanted
into the right arm 102 of a patient. The enlarged portion 104
illustrates that two satellites 106 are coupled to a controller hub
via a connector 108. The second enlarged portion 110 illustrates
that two electrodes 112 are coupled one of the satellites 106. Each
of the electrodes 112 are coupled to a peripheral nerve fascicle
114 in the wrist of the arm 102.
[0022] As an overview of the system architecture, The system 100
includes a central controller hub (not illustrated) that is
implanted into central location, such as in a surgically created
sub-dermal pocket in the upper arm or chest. The satellites 106 are
coupled to the controller hub and implanted near the regions of
interest. The satellites 106 interface with the electrodes 112.
Power is provided to the satellites 106 and electrodes 112 by the
controller hub. The satellites 106 enable the electrodes 112 to be
configured in real-time for recording or stimulation. The
satellites 106 also include a neural amplifier with an embedded
analog to digital converter that enables recording and digital
transmission of neural signals captured by the electrodes 112. The
hub or satellite 106 includes stimulation channels for stimulating
target tissue via the electrodes 112, one or more processors for
adaptive closed-loop control, bidirectional wireless data telemetry
for communication with an external base station, and a wirelessly
rechargeable lithium battery for power.
[0023] The system 100 includes one or more electrodes 112 coupled
to each of the satellites 106. The electrodes 112 provide the
interface between the system 100 and the patient. The electrodes
112 are configured to be directly secured to a patient's nerve
fascicle 114 or other tissue. The electrode 112 includes a
plurality of electrode sites along a rostrum. The rostrum is an
elongated extension that projects from the body of the electrode
112. In some implementations, the rostrum is configured for
implantation through a nerve fascicle to record from (and/or
stimulate) one or more of the nerve fibers within the nerve
fascicle. The electrode 112 is described further in relation to
FIGS. 4A-4K and FIGS. 5A-5D.
[0024] FIG. 2 illustrates a top view of an example electrode 112.
The electrode 112 includes a rostrum 114, a tab 116 projecting from
the central body of the electrode 112, and a connector pad 118. The
rostrum 114 includes a needle 120 and a plurality of electrode
sites 122. The tabs 116 also include a plurality of electrode sites
122. The connector pad 118 includes a plurality of contact pads
124.
[0025] As described in relation to FIG. 4A-4K, the electrode 112 is
a multi-layer device that includes one or more metal layers
sandwiched between silicone layers. The electrode sites 122, the
traces 128, and the contact pads 124 are formed from the metal
layer. The silicone layers insulate the metal layer and form the
body of the electrode 112.
[0026] The rostrum 114 of the electrode 112 includes the needle 120
and a plurality of electrode sites 122. In some implementations,
the tabs 116 also include electrode sites 122. The rostrum 114 is
configured for insertion into nervous tissue, such as a peripheral
nerve. The needle 120 enables the rostrum 114 to be threaded
through a nerve fascicle or other tissue. In some implementations,
the needle 120 is manufactured from a material that does not
substantially bend when inserted into a target tissue. The needle
120 can be substantially rigid while the rest of the electrode 112
is substantially flexible. The needle 120 can include stainless
steel, platinum, or another medical grade metal. The needle 120 is
detachable from the remainder of the rostrum 114 and electrode 112.
For example, a gap 126 in the metal layer between the electrode
sites 122 and the needle 120 is manufactured in the rostrum 114.
The gap 126 can include materials, such as the silicone layers,
that are easy to cut. After threading the rostrum 114 into the
patient's nerve fascicle, a surgeon may use surgical scissors to
cut through the gap 126 and sever the needle 120 from the electrode
112. In some implementations, the needle 120 had an outer diameter
between about 75 .mu.m and about 200 .mu.m, between about 100 .mu.m
and about 175 .mu.m, or between about 125 .mu.m and about 150
.mu.m.
[0027] The rostrum 114 also includes a plurality of electrode sites
122. The electrode sites 122 are disposed on the rostrum 114
towards the ends of the traces 128. In some implementations, each
electrode site 122 is an exposed area of the trace 128. For
example, the trace 128 is a portion of a metal layer encapsulated
within the silicone layers. A portion of the silicone layer above
the trace 128 can be laser ablated to expose a portion of the metal
layer--forming the electrode site 122. In some implementations,
each of the electrode sites 122 are spaced between about 100 .mu.m
and about 700 .mu.m, between about 200 .mu.m and about 600 .mu.m,
or between about 300 .mu.m and about 500 .mu.m apart along the
rostrum's length. In some implementations, each of the electrode
site 122 have a diameter between about 50 .mu.m and about 300
.mu.m, between about 50 .mu.m and about 200 .mu.m, or between about
50 .mu.m and about 100 .mu.m.
[0028] Each of the traces 128 terminate at a contact pad 124 on the
connector pad 118. In some implementations, each of the traces 128
terminate at a different contact pad 124, making each of the
electrode sites 122 individually addressable. In other
implementations, one or more of the traces 128 terminate at the
same contact pad 124. Wires of a flexible cable are welded to each
of the contact pads 124 to couple the electrode 112 to the
satellite 106. In some implementations, each of the contact pads
124 have a length between about 200 .mu.m and about 500 .mu.m,
between about 200 .mu.m and about 400 .mu.m, or between about 200
.mu.m and about 300 .mu.m.
[0029] The tabs 116 are used to secure the electrode 112 to the
nerve fascicle or other target site. The tabs 116 are flexible and
include one or more layers of silicone. In some implementations,
additional electrode sites 122 are distributed along the length of
the tabs 116. The tabs 116 are configured to wrap around the nerve
fascicle. Once wrapped around the nerve fascicle the tabs 116 can
be coupled together to secure the electrode 112 to the nerve
fascicle. For example, the ends of the tabs 116 can be sutured
together to secure the electrode 112 to the nerve fascicle without
having to suture directly to the nerve fascicle.
[0030] FIG. 3 illustrates another example electrode 200 for use
with the system 100 discussed above. The electrode 200 is
configured for electrocorticographic (ECoG) recordings. In this
configuration the electrode 200 is configured for placement on the
cortical tissue of a patient's brain to record (or stimulate)
populations of cortical neurons. As illustrated, the electrode 200
includes 32 electrode sites 202. Each of the electrode sites 202
are coupled by traces 128 to a different contact pad 124. In some
implementations, the electrode 200 includes between about 2 and
about 128, between about 2 and about 64, or between about 2 and 32
electrode sites 202.
[0031] The electrode sites 202 of the electrode 200 are configured
to have greater relative surface area compared to the electrode
sites 122 discussed above. For example, the larger surface area
enables the electrode sites 202 to receive electrical signals form
a greater number of neurons.
[0032] FIGS. 4A-4K illustrate cross-sectional views of a method for
manufacturing the electrodes described herein. The cross-sectional
views are taken along the line A-A' shown in FIG. 2. FIG. 4A
illustrates a cross-sectional view of the first step in
manufacturing the electrodes described herein. In the first step, a
metal layer 402 is applied to a release tape 404. In some
implementations, the metal layer 402 includes stainless steel or a
platinum iridium alloy. In some implementations, the metal layer
402 may be a metal foil that is between about 10 .mu.m and about 30
.mu.m, between about 10 .mu.m and about 15 .mu.m, or between about
10 .mu.m and about 12.5 .mu.m thick. In some implementations, the
release tape 404 is a thermal release tape or a UV release tape. In
other implementations, the release tape 204 can be dissolved using
a solvent.
[0033] FIG. 4B illustrates a cross-sectional view of the electrode
during the second stage of the manufacturing process. The metal
layer 402 is cut to form the electrode sites, traces, contact pads
of the electrode, and any other element of the metal layer. Laser
ablation is used to form cuts 403 in the metal layer or metal foil
402. In some implementations, the laser may be a picosecond pulsed
laser operating at a wavelength between about 245 nanometers and
about -2000 nanometers and configured with a pulse width between
about 40 picoseconds and about 500 picoseconds. In other
implementations, the laser may be a nanosecond pulsed laser and/or
a femtosecond pulsed laser.
[0034] FIG. 4C illustrates a cross-sectional view of the electrode
after the excess metal is removed from the release tape 404. The
relatively larger portions of the metal layer 402 that do not form
a portion of the electrode sites, traces, and contact pads can be
peeled off from the release tape 404 to leave just the desired
portions of the portions of the metal layer 402 forming the
electrode sites, traces, and contract pads coupled to the release
tape 404. In other implementations, relatively smaller portions of
the metal layer 402 are entirely removed through laser ablation.
For example, the portion of the metal layer 402 between two
neighboring traces may be removed through laser ablation. After
removing the release tape 404 from the metal layer 402, the
remaining metal is cleaned using pure oxygen plasma to remove any
residual organic material and to improve adhesion to the silicone
layer described in FIG. 4D.
[0035] FIG. 4D illustrates a cross-sectional view of a first
silicone layer 406 that is formed separately from the metal layer
402 and the release tape 404. The first silicone layer 406 may
include an implantable grade silicone substrate specifically
designed for implantation within the body of a human or an animal.
The first silicone layer 406 may include a nylon, polyamide,
polyester mesh. The mesh is impregnated with liquid silicone, which
is then cured, to form the first silicone layer 406. In some
implementations, the first silicone layer 406 is formed by
knife-coating the mesh with uncured silicone, for example MED 4850
or MED 4250 silicone manufactured by NuSil.TM. of Carpinteria,
Calif. In some implementations, the mesh is a MEDIFAB.RTM. mesh
(part number 07-64/45) made available by SEFAR AG of Thal,
Switzerland. In some implementations, the mesh is between about 40
.mu.m and about 50 .mu.m thick. In other implementations, the mesh
is about 75 .mu.m thick. The mesh can include an open area of
between about 40% and about 50%. In some implementations, the
diameter of each mesh fiber is between about 30 .mu.m and about 50
.mu.m and the fibers are spaced between about 60 .mu.m and about 70
.mu.m apart. For example, the mesh can be knife-coated with
silicone, which is then cured, and then, additionally, or
alternatively, be calendared (e.g., heat pressed) to achieve a
desired thickness. The mesh can reinforce the first silicone layer
406 to improve the longevity of the electrode, ease the handling of
the electrode, and provide structural integrity to the electrode.
In some implementations, the improved structural integrity of the
first silicone layer 406 reduces the likelihood that the metal
layer 402 will separate from the first silicone layer 406 in
subsequent steps or during the handling of the completed electrode.
In some implementations, the first silicone layer 406 is between
about 50 .mu.m and about 100 .mu.m, between about 60 .mu.m and
about 90 .mu.m, or between about 70 .mu.m and about 80 .mu.m
thick.
[0036] FIG. 4E illustrates a cross-sectional view of the next step
in manufacturing the electrodes described herein. In this step, a
glue layer 408 is applied to the first silicone substrate 406. The
glue layer 408 is applied to the top surface of the first silicone
layer 406 to help hold the additional layers of material to the
first silicone layer 406.
[0037] FIG. 4F illustrates a cross-sectional view of the sixth step
in manufacturing the electrodes described herein. As illustrated in
FIG. 4F, the metal layer 402 and release tape 404 (from FIG. 4C)
are inverted and coupled to the glue layer 408 (from FIG. 4E). The
glue layer 408 is then cured to permanently fix the metal layer 402
to the first silicone layer 406.
[0038] FIG. 4G illustrates a cross-sectional view of the seventh
step in manufacturing the electrodes described herein. Once the
metal layer 402 is coupled to the glue layer 408, the release tape
404 is removed from the metal layer 402. In some implementations,
the release tape 404 is removed by heating the release tape 404 to
a predetermined temperature, which causes the release tape 404 to
release (or dissolve) from the metal layer 402. In other
implementations, the release tape 404 can be dissolved with a
solvent or exposed to UV light to cause the release tape 404 to
release from the metal layer 402.
[0039] FIG. 4H illustrates the next step in manufacturing the
electrodes described herein. Once the release tape 404 is removed,
the exposed metal layer 402 is cleaned using oxygen plasma and a
primer 410 is applied to the exposed metal layer 402. For example,
a silicone primer such as MED6-161 manufactured by NuSil.TM. of
Carpinteria, Calif. may be used to increase the adhesion of the
metal layer 402 to a second layer of silicone.
[0040] FIG. 4I illustrates a cross-sectional view of the ninth
stage of manufacturing the electrodes described herein. Once the
primer 410 has been applied to the exposed metal layer 402, the
metal layer 402 is encapsulated with a second silicone layer 412.
The second silicone layer 412 may include a calendared layer of
silicone. For example, the second silicone layer 412 may be
produced by calendaring or applying heat and mechanical force to
create the second silicone layer 412 at a desired thickness. Using
this technique, the second silicone layer 412 may be as thin as 50
.mu.m. In some implementations, the second silicone layer 412 is
between about 50 .mu.m and 100 .mu.m thick. In other
implementations, the second silicone layer 412 is similar to the
first silicone layer 406. For example, the second silicone layer
412 can be impregnated with a mesh. In other implementations, the
second silicone layer 412 is not impregnated with a mesh, but may
be about the same thickness as the first silicone layer 406.
[0041] FIG. 4J illustrates a cross-sectional view of the tenth
stage of manufacturing the electrodes described herein. Once the
metal layer is encapsulated with the second silicone layer 412, one
or more sets of holes or openings 414 are formed in the second
silicone layer 412. The sets of holes 414 expose a portion of the
metal layer 402. The openings or sets of holes 414 are formed over
the portions of the metal layer 402 that form electrode sites and
the contact pads. The openings 414 may be created using laser
ablation. After the sets of holes or openings 414 have been
created, the exposed metal layer is cleaned using oxygen plasma
mixed with tetrafluoromethane gas to remove any residual silicone
that may remain on the contact pads or electrode sites following
the laser ablation. In some implementations, a thin layer of
silicone is intentionally left in the openings 414 (e.g., the
openings over the contact pads and/or the electrode sites) prior to
the aforementioned cleaning process to prevent the laser from
damaging the contact pads or electrode sites. In some
implementations, the electrode sites may be located on the same
side of the electrode as the contact pads. In some implementations,
the electrode sites may be located on the opposite side of the
electrode as the contact pads.
[0042] In some implementations, the first and second silicone
layers 406 and 412 are larger than the total shape of the
electrode. For example, the metal layer 402 defining a plurality of
electrodes can be laminated between large, single first and second
silicone layers 406 and 412. In these implementations, after
forming the sets of holes or openings 414 for each respective
electrode site and contact pad, each of the electrodes are cut from
the first silicone layer 406 and the second silicone layer 412 by
laser cutting the shape of each electrode body from the first
silicone layer 406 and the second silicone layer 412. The edges of
the formed electrodes may be cleaned by plasma cleaning.
[0043] FIG. 4K illustrates a cross-sectional view of the next stage
of manufacturing the electrodes described herein. As shown in FIG.
4K, where the openings 414 are formed over the contact pads, the
wires 416 are coupled to each of the exposed metal areas that form
the contact pads. The wires 416 are welded to the exposed metal
layer 402. In some implementations, the wires are resistance welded
to the exposed metal layer 402. In other implementations, the wires
are laser welded to the exposed metal layer 402. The wires 416
couple the contact pads (and ultimately, the electrode sites) to
the satellites described above. To protect the weld between the
wires 416 and metal layer 402 (e.g., at the location of each
contact pad), a third silicone layer 418 is applied as an overmold
over the openings 414, (e.g., the one or more contact pad
openings). The openings that are formed over the electrode sites
are not covered with the third silicone layer, e.g., the overmold
418, so that the metal layer is exposed and can record and
stimulate the neural tissue. The third silicone layer 418 is
overmolded onto the first or second silicone layer to achieve a
gradual transition between the first or second silicone layer and
the third silicone layer. The gradual transition between the first
or second silicone layer and the third silicone layer is
substantially smooth, for example, such that is does not possess
sharp angles, abrupt changes and/or discontinuities in the gradient
of the slope of the overmolded third silicone layer.
[0044] In some implementations, such for the manufacture of an
intra-fascicular electrode similar to the electrode 112 illustrated
in FIGS. 1 and 2, the manufacturing method illustrated in FIGS.
4A-4K continues with the coupling of a needle to the electrode's
formed body. In some implementations, such as when the electrode is
configured for cortical recordings and stimulation, the electrode
does not include a needle and the manufacturing method ends at the
step illustrated in FIG. 4K. In some implementations, the needle is
coupled to the electrode with a biocompatible glue. In some
implementations, the transition between the needle and the
electrode is configured to be substantially smooth such that the
transition does not cause damage when the rostrum is pulled through
a nerve fascicle. In some implementations, the end of the needle
coupled to the electrode is first thinned, such that the
combination of the needle material and the electrode does not form
a bulge along the electrode's rostrum. The needle can be thinned by
grinding down a portion of the needle.
[0045] FIGS. 5A-5D illustrate cross-sectional views of example
electrodes manufactured by the method illustrated in FIGS. 4A-4K.
The cross-sectional views are taken along the line B-B' shown in
FIG. 2. A variety of electrode shapes and formations may be enabled
by this method of manufacturing. For example, the method of
manufacture described herein may be used, but is not limited to,
the manufacture of electrocorticographic (ECoG) electrodes,
micro-electrocorticographic electrodes, longitudinal
intra-fascicular electrodes, cuff electrodes, transverse
intra-fascicular electrodes, and surface electrodes. The
arrangement of electrode sites and contact pads may vary based on
the nerve size, nerve location or area of nerve tissue to be
stimulated or from which signals are to be recorded. A larger
electrode surface area may include more electrode sites enabling
the electrode to receive electrical signals form a greater number
of neurons. For example, an electrode may be configured for
electrocorticographic (ECoG) recordings. The electrode may be
placed on the cortical tissue of a patient's brain to record (or
stimulate) populations of cortical neurons. The electrode may
include between about 2 and about 128, between about 2 and about
64, or between about 2 and 32 electrode sites. In some
implementations, each of the electrode sites 122 are spaced between
about 100 .mu.m and about 700 .mu.m, between about 200 .mu.m and
about 600 .mu.m, or between about 300 .mu.m and about 500 .mu.m
apart from each other.
[0046] The arrangement of the contact pads and traces connecting
the electrode site to the contact pad may also vary. In some
implementations, each of the traces terminates at a contact pad
corresponding to a specific electrode site, making each of the
electrode sites individually addressable. In other implementations,
each of the traces terminates at a different contact pad. In some
implementations, one or more of the traces terminate at the same
contact pad. In some implementations, each of the contact pads has
a length between about 200 .mu.m and about 500 .mu.m, between about
200 .mu.m and about 400 .mu.m, or between about 200 .mu.m and about
300 .mu.m.
[0047] FIG. 5A illustrates a cross-sectional view of an electrode
where the electrode site opening 512 and the contact pad opening
514 are formed on the same side of the electrode. As shown in FIG.
5A, the electrode site opening 512 and the contact pad opening 514
are formed in the second silicone layer 508. One or more traces 513
connect the electrode site to the contact pad. A wire 516 is welded
to the contact pad and an overmold 518 is applied over the contact
pad opening 514.
[0048] FIG. 5B illustrates a cross-sectional view of an electrode
where the electrode site opening 512 and the contact pad opening
514 are also formed on the same side of the electrode. As shown in
FIG. 5B, the electrode site opening 512 and the contact pad opening
514 are formed in the second silicone layer 506. One or more traces
513 connect the electrode site to the contact pad. A wire 516 is
welded to the contact pad and an overmold 518 is applied over the
contact pad opening 514.
[0049] FIG. 5C illustrates a cross-sectional view of an electrode
where the electrode site opening 512 and the contact pad opening
514 are formed on opposite sides of the electrode. As shown in FIG.
5C, the electrode site opening 512 is formed in the first silicone
layer 506 and the contact pad opening 514 is formed in the second
silicone layer 508. One or more traces 513 connect the electrode
site to the contact pad. A wire 516 is welded to the contact pad
and an overmold 518 is applied over the contact pad opening
514.
[0050] FIG. 5D illustrates a cross-sectional view of an electrode
where the electrode site opening 512 and the contact pad opening
514 are also formed on opposite sides of the electrode. As shown in
FIG. 5D, the electrode site opening 512 is formed in the second
silicone layer 508 and the contact pad opening 514 is formed in the
first silicone layer 506. One or more traces 513 connect the
electrode site to the contact pad. A wire 516 is welded to the
contact pad and an overmold 518 is applied over the contact pad
opening 514.
[0051] FIG. 6 illustrates a scanning electron micrograph of the
coupling between the needle and the electrode formed using the
above described manufacturing method. FIG. 6 illustrates that the
needle 120 is thinned from its initial thickness 602 to a thinned
thickness 604 that is about half the thickness of the initial
thickness 602. In the example illustrated in FIG. 6, the initial
thickness 602 is about 350 .mu.m and the thinned thickness 604 is
about 175 .mu.m. Thinning the needle 120 exposes the needle's inner
lumen 606 and forms a trough 608. The portion 610 of the rostrum
114 that couples to the needle 120 is sized to fit into the trough
608. The portion 610 can then be glued to the trough 608.
[0052] The disclosed methods may be embodied in other specific
forms without departing from the spirit or essential
characteristics thereof. The forgoing implementations are therefore
to be considered in all respects illustrative, rather than limiting
of the invention.
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