U.S. patent application number 15/143509 was filed with the patent office on 2017-11-02 for heat dissipating structure and water-cooling heat dissipating apparatus including the structure.
The applicant listed for this patent is TAIWAN MICROLOOPS CORP.. Invention is credited to Chun-Hung LIN.
Application Number | 20170314870 15/143509 |
Document ID | / |
Family ID | 60158209 |
Filed Date | 2017-11-02 |
United States Patent
Application |
20170314870 |
Kind Code |
A1 |
LIN; Chun-Hung |
November 2, 2017 |
HEAT DISSIPATING STRUCTURE AND WATER-COOLING HEAT DISSIPATING
APPARATUS INCLUDING THE STRUCTURE
Abstract
A heat dissipating structure and a water-cooling heat
dissipating apparatus including the structure are disclosed. The
heat dissipating structure includes a vapor chamber, plural heat
pipes and a heat dissipating member, and the vapor chamber has a
hollow slot penetrating through the vapor chamber, and the vapor
chamber also has a cavity. Each heat pipe is vertically installed
to the vapor chamber and communicated with the cavity. The heat
dissipating member includes a substrate and plural fins integrally
extended from the substrate and seals the hollow slot by a
substrate, so as to improve the thermal conduction and dissipation
of the heat dissipating structure and the water-cooling heat
dissipating apparatus.
Inventors: |
LIN; Chun-Hung; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TAIWAN MICROLOOPS CORP. |
New Taipei City |
|
TW |
|
|
Family ID: |
60158209 |
Appl. No.: |
15/143509 |
Filed: |
April 30, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28D 15/00 20130101;
H01L 23/427 20130101; F28D 15/0266 20130101; F28D 15/0275 20130101;
F28F 3/06 20130101; F28D 15/04 20130101; H01L 23/473 20130101; F28F
3/12 20130101; F28F 3/08 20130101; F28D 15/0283 20130101; F28D
15/046 20130101; F28D 2021/0029 20130101; F28F 1/32 20130101 |
International
Class: |
F28D 15/00 20060101
F28D015/00; F28F 3/06 20060101 F28F003/06; F28D 15/04 20060101
F28D015/04; F28D 15/02 20060101 F28D015/02; F28F 3/08 20060101
F28F003/08; F28D 15/02 20060101 F28D015/02 |
Claims
1. A heat dissipating structure, comprising: a vapor chamber,
having a hollow slot penetrating through the vapor chamber, and a
cavity formed in the vapor chamber; a plurality of heat pipes,
installed in the vapor chamber and communicated with the cavity;
and a heat dissipating member, including a substrate and a
plurality of fins integrally extended from the substrate, and the
heat dissipating member sealing the hollow slot by the
substrate.
2. The heat dissipating structure according to claim 1, wherein the
substrate has a bottom side, and the vapor chamber has a heated
surface, and the bottom side of the substrate and the heated
surface of the vapor chamber form a common surface structure.
3. The heat dissipating structure according to claim 2, further
comprising a plurality of heat dissipating fins having a plurality
of through holes configured to be corresponsive to each other
respectively, and each through hole having a circular wall extended
from the periphery of the through hole, and each heat dissipating
fin being coupled to each heat pipe through each through hole, and
the heat dissipating fins being stacked and coupled to each other
through the circular wall, such that a liquid channel is formed
between any two adjacent heat dissipating fins.
4. The heat dissipating structure according to claim 2, wherein the
hollow slot is formed at a middle area of the vapor chamber.
5. The heat dissipating structure according to claim 4, wherein the
vapor chamber installed at the external periphery of the hollow
slot has an upper receiving section disposed at the top of the
vapor chamber, and the substrate includes a base section, a
vertical plate section bent and extended upwardly and separately
from both sides of the base section, and a bridging section bent
and extended from the vertical plate section in a horizontal
direction, and the bottom side is formed outside the base section,
and the base section seals the bottom of the hollow slot, and each
bridging section is attached to each respective upper receiving
section.
6. The heat dissipating structure according to claim 5, wherein
each vertical plate section is attached to an inner wall of the
respective hollow slot.
7. The heat dissipating structure according to claim 5, wherein
each fin is formed with an interval apart from the base section and
each bridging section by extruding or chipping.
8. The heat dissipating structure according to claim 4, wherein the
vapor chamber installed at the external periphery of the hollow
slot has a lower receiving section disposed at the bottom of the
vapor chamber, and the substrate includes a base section and a
bridging section extended from both sides of the base section in a
horizontal direction, and the bottom side is formed outside the
base section, and the base section seals bottom of the hollow slot,
and each bridging section is attached to each respective lower
receiving section.
9. The heat dissipating structure according to claim 4, wherein the
substrate includes a base section, and the bottom side is formed
outside the base section, and the base section seals the bottom of
the hollow slot, and each fin is attached onto an inner wall of the
respective hollow slot.
10. A water-cooling heat dissipating apparatus, comprising: a heat
dissipating structure, further comprising: a vapor chamber, having
a hollow slot penetrating through the vapor chamber, and further
having a cavity; a plurality of heat pipes, vertically installed to
the vapor chamber, and communicated with the cavity; and a heat
dissipating member, including a substrate and a plurality of fins
integrally extended from the substrate, and sealing the hollow slot
by the substrate; and a cover, covered onto the vapor chamber, and
a liquid cavity being formed between the cover and the vapor
chamber, and each heat pipe and each fin being formed in the liquid
cavity, and the cover having a water inlet and a water outlet, both
being communicated with the liquid cavity.
11. The water-cooling heat dissipating apparatus according to claim
10, wherein the substrate has a bottom side, and the vapor chamber
has a heated surface, and the bottom side of the substrate and the
heated surface of the vapor chamber form a common surface
structure.
12. The water-cooling heat dissipating apparatus according to claim
11, wherein the heat dissipating structure further comprises a
plurality of heat dissipating fins, and each heat dissipating fin
has a plurality of through holes configured to be corresponsive to
one another, and a circular wall extended from the periphery of
each through hole, and each heat dissipating fin is coupled to each
heat pipe through each through hole and stacked and coupled to one
another through each respective circular wall, so as to form a
liquid channel between any two adjacent heat dissipating fins.
13. The water-cooling heat dissipating apparatus according to claim
11, wherein the hollow slot is formed at a middle area of the vapor
chamber, and the hollow slot has an upper receiving section
disposed at the top of the vapor chamber, and the substrate
includes a base section, vertical plate section bent and extended
upwardly and separately from both sides of the base section, and a
bridging section bent and extended from the vertical plate section
in a horizontal direction, and the bottom side is formed outside
the base section, and the base section seals the bottom of the
hollow slot, and each bridging section is attached to each
respective upper receiving section.
14. The water-cooling heat dissipating apparatus according to claim
13, wherein each vertical plate section is attached onto an inner
wall of the respective hollow slot.
15. The water-cooling heat dissipating apparatus according to claim
13, wherein each fin is formed with an interval apart from the base
section and each bridging section by extruding or chipping.
16. The water-cooling heat dissipating apparatus according to claim
11, wherein the hollow slot is formed at a middle area of the vapor
chamber, and the vapor chamber installed at the external periphery
of the hollow slot has a lower receiving section disposed at the
bottom of the vapor chamber, and the substrate includes a base
section and a bridging section extended from both sides of the base
section in a horizontal direction, and the bottom side is formed
outside the base section, and the base section seals the bottom of
the hollow slot, and each bridging section is attached to each
respective lower receiving section.
17. The water-cooling heat dissipating apparatus according to claim
11, wherein the substrate includes a base section, and the bottom
side is formed outside the base section, and the base section seals
the bottom of the hollow slot, and each fin is attached onto an
inner wall of the respective hollow slot.
18. The water-cooling heat dissipating apparatus according to claim
11, wherein the vapor chamber has a circular insert slot formed at
the top of the vapor chamber, and the bottom edge of the cover is
embedded into the insert slot for sealing.
19. The water-cooling heat dissipating apparatus according to claim
11, further comprising a water inlet pipe and at least a water
outlet pipe, wherein the water inlet pipe is coupled to the water
inlet correspondingly, and the water outlet pipe is coupled to the
water outlet correspondingly.
20. The water-cooling heat dissipating apparatus according to claim
19, further comprising a partition plate clamped between each heat
pipe and the cover, and a liquid channel formed at a position of
the partition plate corresponsive to the water inlet pipe.
Description
FIELD OF THE INVENTION
[0001] The technical field relates to heat dissipation, more
particularly to a heat dissipating structure and a water-cooling
heat dissipating apparatus including the structure provided for
heat generating electronic components.
BACKGROUND OF THE INVENTION
[0002] As the computing speed of electronic components becomes
increasingly higher, the heat generated by the electronic
components also becomes greater. To overcome the high heat issue
effectively, manufacturers have used heat sinks, heat pipes or
vapor chambers made of aluminum and copper alloys extensively, but
such heat dissipating structures still require further improvements
on their thermal conduction and manufacturability.
[0003] The conventional heat sink generally comprises a bottom
plate and a heat dissipating fin extended from the bottom plate.
Although such conventional heat sink has the feature of good heat
dissipation, the thermal conductivity of the heat sink cannot be
improved. Therefore, a heat dissipating structure including a vapor
chamber and the aforementioned heat sink has been developed,
wherein the heat sink is mounted onto the vapor chamber by a
soldering material such as a solder paste, and the vapor chamber
comprises an upper casing plate and a lower casing plate, and a
capillary tissue is installed in an internal space of the upper and
lower casing plates, and then the upper and lower casing plates are
engaged with each other by soldering, and a working fluid is filled
into the interior of the upper and lower casing plates, and finally
the manufacturing processes of removing air and sealing are taken
place to complete the manufacture of the heat sink.
[0004] Although the conventional heat dissipating structure has the
effects of conducting and dissipating heat, its actual application
still has the following problems. Since the vapor chamber is
limited by space, and thus is capable of dispersing heat by a
traverse flow way, so that the thermal conduction and dissipation
cannot be enhanced effectively. In addition, a soldering material
is coated onto the interface of the vapor chamber and the heat
sink, and such material may hinder the heat transfer. Obviously,
the conventional heat sink requires improvements.
[0005] In view of the aforementioned problems of the prior art, the
discloser of this disclosure based on years of experience in the
related industry to conduct extensive researches and experiments,
and finally provided a feasible solution to overcome the problems
of the prior art.
SUMMARY OF THE INVENTION
[0006] It is a primary objective of this disclosure to provide a
heat dissipating structure and a water-cooling heat dissipating
apparatus including the structure and to use the vapor chamber
communicated with the heat pipe and a heat dissipating member
assembled to the vapor chamber to improve the thermal conduction
and dissipation of the heat dissipating structure and the
water-cooling heat dissipating apparatus effectively.
[0007] To achieve the aforementioned and other objectives, this
disclosure provides a heat dissipating structure, comprising a
vapor chamber, a plurality of heat pipes and a heat dissipating
member, wherein the vapor chamber has a hollow slot penetrating
through the vapor chamber, and the vapor chamber further has a
cavity; each heat pipe is vertically installed to the vapor chamber
and communicated with the cavity; and the heat dissipating member
comprises a substrate and a plurality of fins integrally extended
from the substrate, and the heat dissipating member seals the
hollow slot by the substrate.
[0008] To achieve the aforementioned and other objectives, this
disclosure further provides a water-cooling heat dissipating
apparatus, comprising a heat dissipating structure and a cover,
wherein the heat dissipating structure comprises a vapor chamber, a
plurality of heat pipes and a heat dissipating member, and the
vapor chamber has a hollow slot penetrating through the vapor
chamber, and the vapor chamber also has a cavity; each heat pipe is
vertically installed to the vapor chamber and communicated with the
cavity; the heat dissipating member comprises a substrate and a
plurality of fins integrally extended from the substrate, and the
heat dissipating member seals the hollow slot by the substrate; the
cover is covered onto the vapor chamber and a liquid cavity is
formed between the cover and the vapor chamber, and each heat pipe
and each fin are formed in the liquid cavity, and the cover has a
water inlet and a water outlet, both communicated with the liquid
cavity.
[0009] This disclosure further provides the following effects.
Since the vapor chamber is communicated with the heat pipe, so that
the internal working fluid can be used for dispersing heat by
transverse and longitudinal gas flowing ways. Both vapor chamber
and substrate are used simultaneously for conducting heat from a
heat generating source to conduct and dissipate heat quickly with
the feature of low thermal resistance. The heat dissipating member
is formed at a middle area of the vapor chamber to maximize the
effect of conducting heat from the largest heat area of the heat
generating source, so as to dispersing and dissipating heat of the
heat generating source effectively.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a perspective exploded view of a heat dissipating
structure in accordance with a first preferred embodiment of the
present invention;
[0011] FIG. 2 is a perspective exploded view of a heat dissipating
structure in accordance with the first preferred embodiment of the
present invention;
[0012] FIG. 3 is a cross-sectional view of a heat dissipating
structure in accordance with the first preferred embodiment of the
present invention;
[0013] FIG. 4 is a perspective exploded view of a heat dissipating
structure in accordance with a second preferred embodiment of the
present invention;
[0014] FIG. 5 is a perspective exploded view of a heat dissipating
structure in accordance with the second preferred embodiment of the
present invention;
[0015] FIG. 6 is a perspective exploded view of a heat dissipating
structure in accordance with a third preferred embodiment of the
present invention;
[0016] FIG. 7 is a perspective exploded view of a heat dissipating
structure in accordance with the third preferred embodiment of the
present invention; and
[0017] FIG. 8 is a perspective view of a water-cooling heat
dissipating apparatus of this disclosure.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0018] The technical contents of this disclosure will become
apparent with the detailed description of preferred embodiments
accompanied with the illustration of related drawings as follows.
It is intended that the embodiments and figures disclosed herein
are to be considered illustrative rather than restrictive.
[0019] With reference to FIGS. 1 to 3 for a heat dissipating
structure of this disclosure, the heat dissipating structure 1
comprises a vapor chamber 10, a plurality of heat pipes 20 and a
heat dissipating member 30.
[0020] The vapor chamber 10 has a cavity 11 formed therein, and a
first capillary tissue 12 such as a woven mesh or a sintered metal
and a support member (not shown in the figure) such as a spring or
a pillar are placed into the cavity 11, and a working fluid 13 such
as pure water is filled, and the vapor-liquid phase change of the
working fluid 13 is used to achieve the effect of thermal
conduction, and the vapor chamber 10 of this embodiment is
substantially a rectangular object. It is noteworthy that vapor
chamber 10 of this disclosure is not limited to the rectangular
shape only, but a circular shape or any other shape may be used
instead. The external bottom side of the vapor chamber 10 has a
heated surface 14, and a hollow slot 15 formed at a middle area of
the vapor chamber 10 penetrates through the vapor chamber 10, and
the vapor chamber 10 installed at the external periphery of the
hollow slot 15 has a stepped upper receiving section 16 disposed at
the top of the vapor chamber.
[0021] The heat pipe 20 has a cavity 21 formed therein, and the
cavity 21 is filled with a second capillary tissue 22 composed of
woven meshes, ditches, or sintered metals. In this embodiment, each
heat pipe 20 is vertically installed to the vapor chamber 10, and
each cavity 21 is communicated with the cavity 11, and each second
capillary tissue 22 is coupled to the first capillary tissue 12 to
achieve a good circulation effect of the internal working fluid
13.
[0022] The heat dissipating member 30 may be made of copper,
aluminum, or their alloys, and the heat dissipating member 30
comprises a rectangular substrate 31 and a plurality of fins 32,
and the substrate 31 has a bottom side 311. The substrate 31 of
this embodiment includes a base section 312, a vertical plate
section 313 bent and extended upwardly from both sides of the base
section 312, and a bridging section 314 bent and extended from the
vertical plate section 313 in a horizontal direction, and the
bottom side 311 is formed outside the base section 312. Each fin 32
is formed with an interval apart from the base section 312 and the
bridging section 314 by extruding or chipping.
[0023] The heat dissipating member 30 is installed at a position
corresponsive to the hollow slot 15 of the vapor chamber 10,
wherein the base section 312 seals the bottom of the hollow slot
15, and the bridging section 314 is attached to the respective
upper receiving section 16, and the vertical plate section 313 is
attached onto the inner wall of the hollow slot 15, and a
conductive medium (not shown in the figure) is applied and fixed
between the bridging section 314 and the upper receiving section 16
and between the vertical plate section 313 and the inner wall of
the hollow slot 15, so that the bottom side 311 of the substrate 31
and the heated surface 14 form a common surface structure A, and
the common surface structure A is provided for attaching and
contacting a heat generating source (not shown in the figure).
[0024] In addition, the heat dissipating structure 1 further
includes a plurality of heat dissipating fins 40, and each heat
dissipating fin 40 has a plurality of through holes 41 configured
to be corresponsive to each other, and a circular wall 42 is
extended form the periphery of each through hole 41, and the heat
dissipating fin 40 is coupled to the heat pipe 20 through the
through hole 41, and the heat dissipating fins 40 are stacked on
one another, such that a liquid channel 43 is formed between any
two adjacent heat dissipating fins 40.
[0025] When use, the bottom side 311 of the substrate 31 and the
heated surface 14 of the vapor chamber 10 are in contact with the
heat generating source, wherein some of the heat is transferred
along the base section 312 to the fin 32 and dispersed to the
outside, and some of the heat is dissipated quickly through a
vapor-liquid phase of the vapor chamber 10, and then dispersed
through each heat pipe 20 and each heat dissipating fin 40 to the
outside, so as to enhance the cooling performance.
[0026] With reference to FIGS. 4 and 5 for a heat dissipating
structure 1a of another embodiment of this disclosure, the heat
dissipating structure 1a comprises a stepped lower receiving
section 18 disposed at the bottom of the vapor chamber 10 installed
at the external periphery of the hollow slot 15, and the substrate
31 of the heat dissipating member 30a includes a base section 312
and a bridging section 314 extended from both sides of the base
section 312 in a horizontal direction, wherein the base section 312
seals the bottom of the hollow slot 15, and each bridging section
314 is attached to each respective lower receiving section 18, and
a thermal conductive medium is applied and fixed between the
bridging section 314 and the lower receiving section 18, so that
the bottom side 311 of the substrate 31 and the heated surface 14
form a common surface structure A.
[0027] With reference to FIGS. 6 and 7 for a heat dissipating
structure 1b of this embodiment, the base section 312 seals the
bottom of the hollow slot 15, and the fins 32 on both sides are
attached to the inner wall of the hollow slot 15, and a thermal
conductive medium is applied and fixed between the fin 32 and the
inner wall of the hollow slot 15, so that the bottom side 311 of
the substrate 31 and the heated surface 14 form a common surface
structure A.
[0028] With reference to FIG. 8 for a water-cooling heat
dissipating apparatus including the aforementioned heat dissipating
structure, the water-cooling heat dissipating apparatus comprises a
heat dissipating structure 1 and a cover 5, wherein the cover 5 is
covered onto the vapor chamber 10, and the bottom edge of the cover
5 is embedded into the insert slot 17 for sealing, and a liquid
cavity B is formed between the cover 5 and the vapor chamber 10,
and each heat pipe 20, each fin 32, and each heat dissipating fin
40 are formed in the liquid cavity B, and the cover 5 has a water
inlet 51 and two water outlets 52 which are communicated with the
liquid cavity B.
[0029] In addition, the water-cooling heat dissipating apparatus of
this disclosure further comprises a water inlet pipe 6, two water
outlet pipes 7 and a partition plate 8, wherein the water inlet
pipe 6 is coupled to the water inlet 51 correspondingly, and each
water outlet pipe 7 is coupled to the water outlet 52
correspondingly, and the partition plate 8 is clamped between each
heat pipe 20 and the top of each fin 32 and the top plate of the
cover 5, and a liquid channel 81 is formed at the middle of the
partition plate 8 corresponsive to the water inlet pipe 6. After
the fluid has entered through the water inlet pipe 6 into the
liquid cavity B, the fluid impacts each fin 32 and the base section
312 and carries away the primary heat of each fin 32 and the base
section 312, and then continues flowing through each heat pipe 20
on both sides and each heat dissipating fin 40 to carry away the
secondary heat. The fluid flows through the channel formed by the
partition plate 8 and the top plate of the cover 5 and out from
each water outlet pipe 7, so as to achieve the effect of flowing
the fluid in the water-cooling heat dissipating apparatus.
[0030] While this disclosure has been described by means of
specific embodiments, numerous modifications and variations could
be made thereto by those skilled in the art without departing from
the scope and spirit of this disclosure set forth in the
claims.
* * * * *