U.S. patent application number 15/647635 was filed with the patent office on 2017-10-26 for organic light emitting display device and method for manufacturing the same.
The applicant listed for this patent is LG Display Co., Ltd.. Invention is credited to Heesuk PANG.
Application Number | 20170309693 15/647635 |
Document ID | / |
Family ID | 53373336 |
Filed Date | 2017-10-26 |
United States Patent
Application |
20170309693 |
Kind Code |
A1 |
PANG; Heesuk |
October 26, 2017 |
ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING
THE SAME
Abstract
Disclosed is an organic light emitting display device including
an anode, a cathode, a plurality of organic layers and a partition
member. The plurality of organic layers is disposed between the
anode and the cathode, where at least one layer is separated to
minimize current leakage into neighboring pixels. The partition
member is disposed between the neighboring pixels and configured to
separate the plurality of organic layers. The least one separated
layer includes a charge generation layer. Because at least one
layer is separated, current leakage into neighboring pixels can be
minimized. Accordingly, defects resulting from light leakage and
the mixing of colors of light from neighboring pixels may be
reduced and display quality is enhanced.
Inventors: |
PANG; Heesuk; (Paju-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
LG Display Co., Ltd. |
Seoul |
|
KR |
|
|
Family ID: |
53373336 |
Appl. No.: |
15/647635 |
Filed: |
July 12, 2017 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
14727376 |
Jun 1, 2015 |
9735212 |
|
|
15647635 |
|
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/3246 20130101;
H01L 27/3248 20130101; H01L 51/56 20130101; H01L 51/5044 20130101;
H01L 2227/323 20130101; H01L 27/3223 20130101 |
International
Class: |
H01L 27/32 20060101
H01L027/32; H01L 27/32 20060101 H01L027/32; H01L 27/32 20060101
H01L027/32; H01L 51/50 20060101 H01L051/50; H01L 51/56 20060101
H01L051/56 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 10, 2014 |
KR |
10-2014-0069893 |
Claims
1-20. (canceled)
21. A method for manufacturing an organic light emitting display
device comprising: forming a thin film transistor (TFT) on a
substrate; forming an anode connected to the TFT; forming an
inorganic insulation film on the anode; forming an organic
insulation film on the inorganic insulation film and forming a
second partition layer having a second opening by patterning the
organic insulation film; forming a first partition layer having a
first opening by patterning the inorganic insulation film such the
anode is exposed; forming a first part of an organic light emitting
part on the anode and a dummy part on the second partition layer
simultaneously by depositing an organic material onto the anode and
the second partition layer; depositing a second part formed of an
organic material onto the first part and the dummy part; and
depositing a cathode onto the first part and the dummy part.
22. The method according to claim 21, wherein the first opening is
larger than the second opening.
23. The method according to claim 21, wherein the first part of the
organic light emitting part is separated from the dummy part.
24. The method according to claim 21, wherein the first part of the
organic light emitting part comprises at least one charge
generation layer.
25. The method according to claim 24, wherein a height of the first
partition layer is greater than or equal to a distance from a top
surface of the anode to a top surface of the charge generation
layer such that the charge generation layer is separated between
neighboring pixels.
26. The method according to claim 21, wherein forming the first
partition layer comprises: patterning the inorganic insulation film
using the second partition layer as a mask.
27. The method according to claim 26, wherein the second partition
layer laterally protrudes farther than the first partition
layer.
28. The method according to claim 26, wherein the first partition
layer is etched on the inorganic insulation film using an etchant
so as to a distance from an end of the first partition layer and an
end of the second partition layer is greater than 0.1 .mu.m.
29. The method according to claim 21, wherein a lateral surface of
at least one of the first partition layer and the second partition
layer is inclined.
30. The method according to claim 21, wherein the anode comes in
contact with the second part.
31. The method according to claim 21, wherein the second opening is
overlapped the first opening.
32. The method according to claim 21, wherein the second part
covers the first part and the dummy part.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to Korean Patent
Application No. 2014-0069893 filed on Jun. 10, 2014, in the Korean
Intellectual Property Office, the disclosure of which is
incorporated herein by reference for all purposes as if fully set
forth herein.
BACKGROUND OF THE INVENTION
Field of the Invention
[0002] The present disclosure relates to an organic light emitting
display device. More particularly, the disclosure relates to an
organic light emitting display device that reduces defects
resulting from light leakage by dividing a charge generation layer
into an active area and a non-active area, and a method for
manufacturing the same.
Description of the Related Art
[0003] An organic light emitting diode (OLED) display device is a
self-light emitting display device in which an organic light
emitting layer is disposed between two electrodes. Electrons and
holes are respectively injected from the two electrodes into the
organic light emitting layer, and light is emitted by combining the
injected electrons and holes.
[0004] OLED display devices can be classified into a top emission
type, a bottom emission type, and a dual emission type based upon
the emission directions of light. The devices can also be
classified into an active matrix type and a passive matrix type
based upon the manner in which the OLED display devices are
driven.
[0005] A white OLED display device for emitting white light can be
implemented by stacking organic emission layers for emitting red,
green and blue light or by stacking organic emission layers for
emitting light of colors that complement each other. Compared to a
layer structure formed by independently patterning each of red,
green and blue emission layers, the white OLED display device can
be implemented by deposition process of the organic emission layers
without patterning the respective organic emission layers. Thus,
white OLED display devices are advantageous in realizing a high
resolution and large-area device.
[0006] The white OLED display device is formed of a structure in
which a plurality of organic emission layers are stacked. Also, it
is provided with a charge generation layer (CGL) disposed between
two neighboring organic emission layers to supply charges to the
neighboring organic emission layers. Similar to the organic
emission layers, the CGL is also formed through the deposition
process, and is disposed in both an active area and non-active
layer of the OLED display device.
SUMMARY OF THE INVENTION
[0007] As described above, a CGL needs to supply charges to
neighboring organic emission layers. Accordingly, the CGL needs to
be sufficiently thick. If the CGL is excessively thin, charges
cannot be supplied sufficiently, and as a result a part of the
active area of the OLED display device may fail to emit light.
[0008] As the CGL is formed to be thick to supply sufficient
charges to the organic emission layers, another defect may occur.
For example, since the CGL is connected to the active area and
non-active area through the deposition process, an electric current
may leak into a part of the CGL formed in the non-active area.
Thereby, the part of the CGL formed in the non-active area serves
as an electrode, and light leakage defect from the non-active area
may increase. Light leakage from the non-active area may cause the
mixing of colors of light from neighboring pixels, degrading the
display quality.
[0009] To address the aforementioned problem, provided herein is an
OLED display device having a new structure. The inventors found
that by using a deposition process and at the same time separating
the CGLs from each other, an OLED display device with the new
structure, which minimizes light leakage defects and degradation of
the display quality caused by the mixing of colors of light from
neighboring pixels, can be developed.
[0010] An object of the present disclosure is to provide an organic
light emitting display device capable of reducing current and light
leakage by separately forming a CGL in an active area and a
non-active area without a separate patterning process and a method
for manufacturing the same.
[0011] Another object of the present disclosure is to provide an
organic light emitting display device capable of reducing
degradation of display quality caused by the mixing of colors of
light from neighboring pixels by forming a plurality of partition
layers having openings of different widths such that a dummy part
having the same stack structure as an organic light emitting part
formed in an active area is separately formed on the partition
layers corresponding to a non-active area, and a method for
manufacturing the same.
[0012] Another object of the present disclosure is to provide an
organic light emitting display device capable of reducing defects
such as disconnection between an anode and a cathode and enhancing
the reliability thereof by adjusting the height of a partition
layer for separating a CGL and a method for manufacturing the
same.
[0013] It should be noted that objects of the present disclosure
are not limited to the above-described objects, and other objects
of the present disclosure will be apparent to those skilled in the
art from the following descriptions.
[0014] According to an aspect of the present disclosure, there is
provided an organic light emitting display device including an
anode, a cathode, a plurality of organic layers and a partition
member. The plurality of organic layers is disposed between the
anode and the cathode, where the plurality of organic layers have
at least one separated organic layer that minimizes current leakage
into neighboring pixels. The partition member is disposed between
the neighboring pixels and configured to separate the at least one
of the organic layers. The aft least one separated layer includes a
charge generation layer. As at least one layer is separated,
leakage of current into neighboring pixels may be minimized.
Thereby, defects resulting from light leakage and the mixing of
colors of light from neighboring pixels may be reduced and thus
display quality may be enhanced.
[0015] According to another aspect of the present invention, there
is provided an organic light emitting display device including a
thin film transistor disposed on a substrate, an anode connected to
the thin film transistor, a first partition layer having a first
opening configured to expose at least a portion of the anode, and a
second partition layer disposed on the first partition layer having
a second opening corresponding to the first opening. A width of the
second opening is less than a width of the first opening. The
organic light emitting display device also includes an organic
light emitting part disposed on the anode. The organic light
emitting part comprises a first part including at least one organic
emission layer, a dummy part disposed on the second partition layer
and configured to have the same stack structure as the first part,
and the dummy part being separated from the first part. A cathode
is disposed on the dummy part. As a result, defects resulting from
light leakage and the mixing of colors of light from neighboring
pixels may be reduced and thus display quality may be enhanced.
[0016] According to an embodiment of the present disclosure, a CGL
is separately disposed in an organic light emitting display device
without a separate patterning process, and thus defects caused by
leaking light may be reduced.
[0017] In addition, a portion of an organic light emitting part is
separately disposed in an active area and a non-active area when
deposition process for the entire surface is applied, and thus the
mixing of colors of light from neighboring pixels caused by current
leakage and degradation of display quality may be suppressed.
[0018] Moreover, by adjusting the height of a partition layer for
separating the CGL, operation-related defects such as disconnection
between an anode and a cathode may be reduced and the reliability
of the organic light emitting display device may be enhanced.
[0019] It should be noted that effects of the present disclosure
are not limited to those described above and other effects of the
present disclosure will be apparent to those skilled in the art
from the following descriptions.
[0020] It is to be understood that both the foregoing general
description and the following detailed description of the present
disclosure are exemplary and explanatory and are not intended to
specify essential limitations recited in the claims. Therefore, the
scope of the claims is not restricted by the foregoing general
description and the following detailed description of the present
disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The above and other aspects, features and other advantages
of the present disclosure will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings, in which:
[0022] FIG. 1 is a cross-sectional view of an organic light
emitting display device according to an embodiment of the present
disclosure;
[0023] FIG. 2 is an enlarged view of region A shown in FIG. 1;
[0024] FIG. 3 is an enlarged view of region B shown in FIG. 1;
[0025] FIG. 4 is a cross-sectional view of an organic light
emitting display device according to another embodiment of the
present disclosure;
[0026] FIGS. 5A to 5D are cross-sectional views illustrating
openings according to structures of a partition layer; and
[0027] FIGS. 6A to 6E are cross-sectional views illustrating a
method for manufacturing an organic light emitting display device
according to an embodiment of the present disclosure.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENT
[0028] Advantages and features of the present disclosure and
methods to achieve them will become apparent from the descriptions
of exemplary embodiments herein below with reference to the
accompanying drawings. However, the present disclosure is not
limited to the exemplary embodiments disclosed herein but may be
implemented in various different forms. The exemplary embodiments
are provided to make the description of the present disclosure
thorough and to fully convey the scope of the present disclosure to
those skilled in the art. It is to be noted that the scope of the
present disclosure is defined only by the claims.
[0029] The figures, dimensions, ratios, angles, numbers of elements
given in the drawings are merely illustrative and are not limiting
Like reference numerals denote like elements throughout the
descriptions. Further, in describing the present disclosure,
descriptions of well-known technologies may be omitted in order not
to obscure the gist of the present disclosure.
[0030] It is to be noticed that the terms "comprising," "having,"
"including" and so on, used in the description and claims, should
not be interpreted as being restricted to the means listed
thereafter unless specifically stated otherwise. Where an
indefinite or definite article is used when referring to a singular
noun, e.g. "a," "an," "the," this includes a plural of that noun
unless specifically stated otherwise.
[0031] In describing elements, they are interpreted as including
error margins even if explicit statements are not made.
[0032] In describing positional relationship using phrases such as
"an element A on an element B," "an element A above an element B,"
"an element A below an element B" and "an element A next to an
element B," another element C may be disposed between the elements
A and B unless the term "immediately" or "directly" is explicitly
used.
[0033] In describing temporal relationship, terms such as "after,"
"subsequent to," "next to," "before," and the like may include
cases where any two events are not consecutive, unless the term
"immediately" or "directly" is explicitly used.
[0034] In describing elements, terms such as "first" and "second"
are used, but the elements are not limited by these terms. These
terms are simply used to distinguish one element from another.
Accordingly, as used herein, a first element may be a second
element within the technical idea of the present disclosure.
[0035] Features of various exemplary embodiments of the present
disclosure may be partially or fully combined. As will be clearly
appreciated by those skilled in the art, technically various
interactions and operations are possible. Various exemplary
embodiments can be practiced individually or in combination.
[0036] Hereinafter, an organic light emitting display device
according to an embodiment of the present disclosure will be
described in detail with reference to the accompanying
drawings.
[0037] FIG. 1 is a cross-sectional view of an organic light
emitting display device according to an embodiment of the present
disclosure. Referring to FIG. 1, an organic light emitting display
device 100 includes a thin film transistor (TFT) 120, an anode 140,
an organic light emitting part 150, a cathode 170, a first
partition layer 131, a second partition layer 132 and a dummy part
160, which are disposed on a substrate 110.
[0038] The substrate 110 may include a transparent material, and be
formed of glass, metal, or plastics.
[0039] The TFT 120 disposed on the substrate 110 includes a gate
electrode 121, an active layer 122, a source electrode 123 and a
drain electrode 124. As shown in FIG. 1, the gate electrode 121 is
disposed on the substrate 110, and a first insulation layer 111 is
disposed on the gate electrode 121 to cover the gate electrode 121.
The active layer 122 is disposed on the first insulation layer 111
to overlap the gate electrode 121. The source electrode 123 and the
drain electrode 124 spaced apart from each other are disposed on
the active layer 122.
[0040] The gate electrode 121, the source electrode 123 and the
drain electrode 124 are formed of a conductive material. For
example, the gate electrode 121, the source electrode 123 and the
drain electrode 124 may be formed of one of molybdenum (Mo),
aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel
(Ni), neodymium (Nd), copper (Cu) and alloys thereof, but
embodiments of the present disclosure are not limited thereto. The
gate electrode 121, the source electrode 123 and the drain
electrode 124 may be formed of various materials.
[0041] The active layer 122 may be formed of one of amorphous
silicon (a-Si), polycrystalline silicon (poly-Si), an oxide and an
organic material, but embodiments of the present disclosure are not
limited thereto.
[0042] The first insulation layer 111 may include a single layer or
multiple layers formed of an inorganic material such as silicon
oxide (SiOx), silicon nitride (SiNx), or the like.
[0043] While the TFT 120 is illustrated as having an inverted
staggered structure in FIG. 1, it may have a coplanar
structure.
[0044] A second insulation layer 112 is disposed on the TFT 120,
and a part of the source electrode 123 is exposed through the
second insulation layer 112. The second insulation layer 112 may
include a single layer or multiple layers, and be formed of organic
matter. Specifically, the second insulation layer 112 may be formed
of a polyimide resin, an acrylic resin, or the like.
[0045] Although not shown in FIG. 1, a passivation layer may be
disposed between the second insulation layer 112 and the TFT 120.
The passivation layer may be formed of an inorganic material to
protect the TFT 120. Similar to the second insulation layer 112,
the passivation layer may expose a part of the source electrode
123.
[0046] The anode 140, which is connected to the source electrode
123, is disposed on the second insulation layer 112. Also, the
first partition layer 131 with a first opening OPN1 exposing a part
of the anode 140 is disposed on the anode 140. In addition, the
second partition layer 132 with a second opening OPN2 is disposed
on the first partition layer 131. As shown in FIG. 1, when the
first opening OPN1 of the first partition layer 131 and the second
opening OPN2 of the second partition layer 132 are viewed in the
same cross section, the width of the second opening OPN2 is less
than that of the first opening OPN1. That is, an end of the second
partition layer 132 protrudes farther than a corresponding end of
the first partition layer 131. Thus, the second opening OPN2 may
become smaller than the first opening OPN1.
[0047] The first partition layer 131 may be formed of an inorganic
insulation material, and the second partition layer 132 may be
formed of an organic insulation material. However, embodiments of
the present disclosure are not limited thereto.
[0048] The organic light emitting part 150 including at least one
organic emission layer is disposed on the anode 140, and the
cathode 170 is disposed on the organic light emitting part 150.
Specifically, referring to FIG. 1, a first part 151 of the organic
light emitting part 150 is disposed in an area of the anode 140
which does not overlap either the first partition layer 131 or the
second partition layer 132, namely an active area AA. The dummy
part 160, which has the same stack structure as the first part 151,
is disposed on the second partition layer 132 corresponding to a
non-active area NA. That is, a portion of the organic light
emitting part 150 is separately disposed in the active area AA and
the non-active area NA. In addition, a second part 152 of the
organic light emitting part 150 is disposed to cover the dummy part
160 and the first part 151. Further, the cathode 170 is disposed on
the second part 152 of the organic light emitting part 150. For
reference, the anode 140, the first part 151 and second part 152 of
the organic light emitting part 150 disposed to overlap the anode
140, and the cathode 170, which are disposed on the active area AA,
operate as an organic light emitting element. Relevant detailed
description will be given with reference to FIG. 3 later.
[0049] In the organic light emitting display device 100, the first
part 151 of the organic light emitting part 150 and the dummy part
160 are separately disposed from each other due to the difference
in width between the openings of the first partition layer 131 and
the second partition layer 132. More specifically, the second
partition layer 132 laterally protrudes farther than the first
partition layer 131. Accordingly, when an organic material having
low step coverage is deposited onto the anode 140, the material is
separated into two parts by the difference in the degree of lateral
protrusion between the first partition layer 131 and the second
partition layer 132. Herein, step coverage refers to a capability
to deposit a material having constant thickness on the bottom and
wall surfaces of a trench or hole of a high aspect ratio, such as
reverse taper structures. The organic material having low step
coverage cannot reach and be deposited onto the lateral surface of
the first partition layer 131, which is positioned further inward
than the second partition layer 132. That is, as the first opening
OPN1 has a greater width than the second opening OPN2, portions of
the organic material may be separately disposed in the active area
AA and the non-active area NA even without requiring a separate
patterning process. Thus, a portion of the organic material
positioned on the anode 140 forms the first part 151, and the other
portion of the organic material positioned on the second partition
layer 132 forms the dummy part 160.
[0050] Accordingly, in the organic light emitting display device
100, the partition layer disposed on the anode 140 includes the
first partition layer 131 having the first opening OPN1 and the
second partition layer 132 having the second opening OPN2 whose
width is less than the width of the first opening OPN1. Thus, an
organic material forming at least one organic emission layer may be
separately disposed in the active area AA and the non-active area
NA, namely the upper portions of the anode 140 and the second
partition layer 132, without a separate patterning process.
Moreover, the organic material forming the first part 151 of the
organic light emitting part 150 and the dummy part 160 may also
include a charge generation layer (CGL). As the CGL is also
separately disposed in the active area AA and the non-active area
NA, defects resulting from light leakage and the mixing of colors
of light from neighboring pixels may be reduced.
[0051] FIG. 2 is an enlarged view of region A shown in FIG. 1. FIG.
2 illustrates the stack structure of the organic light emitting
part 150 and the dummy part 160 disposed on the active area AA and
the non-active area NA in a more detailed manner.
[0052] The organic light emitting part 150 includes at least one
organic emission layer and at least one CGL. Referring to FIG. 2,
the organic light emitting part 150 includes the first part 151 and
the second part 152. The first part 151 includes a first organic
emission layer 151b and a CGL 151d, and the second part 152
includes a second organic emission layer 152b. The dummy part 160
having the same stack structure as the first part 151 of the
organic light emitting part 150 is disposed on the second partition
layer 132. More specifically, the first part 151 of the organic
light emitting part 150 includes a first intermediate layer 151a,
the first organic emission layer 151b, a second intermediate layer
151c and the CGL 151d, which are stacked one over another onto the
anode 140. In addition, the dummy part 160 includes a first dummy
layer 160a, a second dummy layer 160b, a third dummy layer 160c and
a fourth dummy layer 160c, which are stacked one over another onto
the second partition layer 132. Herein, the first intermediate
layer 151a and the first dummy layer 160a are formed of the same
material, and the first organic emission layer 151b and the second
dummy layer 160b are formed of the same material. Also, the second
intermediate layer 151c and the third dummy layer 160c are formed
of the same material, and the CGL 151d and the fourth dummy layer
160c are formed of the same material. That is, each layer of the
first part 151 and a corresponding layer of the dummy part 160 are
simultaneously formed of the same material, thereby having the same
stack structure.
[0053] As the organic material forming the first part 151 of the
organic light emitting part 150 and the dummy part 160 includes
materials of the first organic emission layer 151b and the CGL
151d, the CGL 151d is also separately disposed in the active area
AA and the non-active area NA. Thereby, defects resulting from
light leakage and the mixing of colors of light from neighboring
pixels may be reduced.
[0054] The second part 152 of the organic light emitting part 150
is disposed on the first part 151 of the organic light emitting
part 150, and the second part 152 contacts and covers the first
part 151 and the dummy part 160 without being separated into parts.
Referring to FIG. 2, the second part 152 has a stack structure
constructed by stacking a third intermediate layer 152a, the second
organic emission layer 152b and a fourth intermediate layer 152c
one over another. The cathode 170 is disposed on the second part
152. As mentioned above, the anode 140, the first part 151 and
second part 152 of the organic light emitting part 150, which are
disposed to overlap the anode 140, and the cathode 170 operate as
an organic light emitting element of the organic light emitting
display device 100. Lights emitted from the first organic emission
layer 151b the second organic emission layer 152b are mixed
together to finally emit white light.
[0055] In order to separately dispose the CGL 151d and the fourth
dummy layer 160c, which are formed of the same material, on the
upper portion of the anode 140 and the upper portion of the second
partition layer 132, an upper surface 131t of the first partition
layer 131 may be positioned higher than an upper surface 151t of
the first part 151. Or, it may be positioned in the same plane as
the upper surface 151t of the first part 151. This means that the
height of the first partition layer 131 is greater than or equal to
the distance from the anode 140 to the first part 151 of the
organic light emitting part 150. In other words, the thickness of
the first partition layer 131 is greater than or equal to the sum
of the thicknesses of the anode 140 and the first part 151. More
specifically, this means that the thickness of the first partition
layer 131 is greater than or equal to the sum of the thicknesses of
the anode 140, the first intermediate layer 151a, the first organic
emission layer 151b, the second intermediate layer 151c and the CGL
151d. Referring to FIG. 2, the upper surface 131t of the first
partition layer 131 is disposed in a plane that is close to (or
positioned a little higher than) the plane where the upper surface
151t of the first part 151, more particularly, the upper surface
151t of the CGL 151d which the uppermost layer of the first part
151 lies. Thereby, the CGL 151d may be ensured to be separately
disposed in the active area AA and the non- active area NA.
[0056] Although not shown in the figure, if the upper surface 131t
of the first partition layer 131 is positioned higher than the
upper surface 151t of the CGL 151d, the uppermost layer of the
first part 151 may become a part of the second part 152 of the
organic light emitting part 150 rather than becoming the CGL 151d,
more specifically, one of the third intermediate layer 152a, the
second organic emission layer 152b and the fourth intermediate
layer 152c. In this case, the uppermost layer of the dummy part 160
having the same stack structure of the first part 151 may be formed
of the same material as one of the third intermediate layer 152a,
the second organic emission layer 152b and the fourth intermediate
layer 152c.
[0057] Meanwhile, the upper surface 131t of the first partition
layer 131 may be positioned lower than an upper surface 152t of the
organic light emitting part 150, specifically, the upper surface
152t of the fourth intermediate layer 152c corresponding to the
uppermost layer of the second part 152. Or it may be positioned in
the same plane as the upper surface 152t of the fourth intermediate
layer 152c. This means that the height of the first partition layer
131 is less than or equal to the distance from the anode 140 to the
second part 152 of the organic light emitting part 150. In other
words, the thickness of the first partition layer 131 is less than
or equal to the sum of the thicknesses of the anode 140, the first
part 151, and second part 152 of the organic light emitting part
150. If the upper surface 131t of the first partition layer 131 is
positioned higher than the upper surface 152t of the organic light
emitting part 150, a defect is likely to be caused by the cathode
170. More specifically, if the upper surface 131t of the first
partition layer 131 is positioned higher than the upper surface
152t of the organic light emitting part 150, both the first part
151 and second part 152 of the organic light emitting part 150 will
be separately disposed in the active area AA and the non-active
area NA by the aforementioned step coverage of the organic
material. However, the cathode 170 is formed of a material having
high step coverage rather than an organic material. Thus, it may be
deposited by extending down along the lateral surface of the first
partition layer 131 positioned further inward than the lateral
surface of the second partition layer 132 and the exposed upper
surface of the anode 140. As a result, the anode 140 comes in
contact with the cathode 170, and thus an operation-related defect
may be caused by disconnection.
[0058] In summary, for the organic light emitting display device
100, the CGL 151d may be separately disposed in the active area AA
and the non-active area NA by positioning the upper surface 131t of
the first partition layer 131 higher than the upper surface 151d of
the CGL 151d of the organic light emitting part 150. Or it may be
positioned in the same plane as the upper surface 151d of the CGL
151d. Thus, defects resulting from light leakage and the mixing of
colors of light caused by, for example, current leaking into the
non-active area NA, may be reduced. In addition, by positioning the
upper surface 131t of the first partition layer 131 lower than or
in the same plane as the upper surface 152t of the organic light
emitting part 150, operation-related defects produced by
disconnection between the anode 140 and the cathode 170 may be
reduced. Thereby, the reliability of the organic light emitting
display device 100 may be enhanced.
[0059] FIG. 3 is an enlarged view of region B shown in FIG. 1. FIG.
3 illustrates the stack structure of an organic light emitting
element disposed in the active area AA.
[0060] As described above with reference to FIG. 2, by separately
disposing a portion of the organic material including the CGL 151d
on the upper portion of the anode 140 and the upper portion of the
second partition layer 132, the CGL 151d may be prevented from
causing current leaking into the non-active area NA. Thus, light is
emitted from only the active area AA. That is, the dummy part 160
disposed in the non-active area NA does not emit light. As shown in
FIG. 3, an organic light emitting element is disposed in the active
area AA, and includes the anode 140, the first part 151 and second
part 152 of the organic light emitting part 150 and the cathode
170. Hereinafter, each layer will be described in detail.
[0061] The anode 140 is a positive electrode for supplying holes.
The anode 140 may be formed of transparent conductive oxide such as
indium tin oxide (ITO), indium zinc oxide (IZO), or the like.
[0062] The cathode 170 is a negative electrode. The cathode 170 is
formed of a material having high step coverage including a metal
such as, for example gold (Au), silver (Ag), aluminum (Al),
molybdenum (Mo), magnesium (Mg), or an alloy thereof.
[0063] The first intermediate layer 151a disposed on the anode 140
may include a signal layer of a hole injection layer (HIL) or hole
transporting layer (HTL) or a combination of two layers. The HIL,
which allows holes transported from the anode 140 to be smoothly
injected into the first organic emission layer 151b, may enhance
the interfacial and adhesive properties of the anode 140 formed of
an inorganic material and the organic emission layer 151b formed of
an organic material. The HTL, which is a layer serving to move
injected holes to the organic emission layer 151b, may be formed of
a material having high hole mobility.
[0064] The first organic emission layer 151b disposed on the first
intermediate layer 151a includes a dopant and host. The first
organic emission layer 151b emits light when electrons are combined
with holes.
[0065] The second intermediate layer 151c disposed on the first
organic emission layer 151b may be an electron transporting layer
(ETL). The ETL serves to move electrons injected from the CGL 151d,
which is positioned on the ETL, to the first organic emission layer
151b.
[0066] The CGL 151d, which is a source of supply of electrons and
holes, supplies electrons or holes to the organic emission layers
151b and 152b adjacent thereto. The CGL 151d may have a dual
structure with a P-type CGL and an N-type CGL or may consist of a
single layer.
[0067] The third intermediate layer 152a, which may be an HTL,
serves to move holes injected from the CGL 151d to the second
organic emission layer 152b.
[0068] Similar to the first organic emission layer 151b, the second
organic emission layer 152b includes a dopant and host, and emits
light. As mentioned above, lights emitted from the first organic
emission layer 151b and the second organic emission layer 152b are
mixed to emit white light. For example, the first organic emission
layer 151b may be a blue organic light emitting layer and the
second organic emission layer 152b may be a yellow organic light
emitting layer. However, embodiments of the present disclosure are
not limited thereto. White light may be emitted through various
combinations of light.
[0069] The fourth intermediate layer 152c includes a signal layer
of an electron injection layer (EIL) or ETL or a combination of two
layers. The EIL allows electrons transported from the cathode 170
to be smoothly injected into the second organic emission layer
152b.
[0070] The first intermediate layer 151a, the second intermediate
layer 151c, the third intermediate layer 152a and the fourth
intermediate layer 152c, which are auxiliary layers provided to
enhance emission efficiency of the organic light emitting element
150, are not limited to the aforementioned structure. Each of the
layers may be designed as one of or a combination of an HIL, an
HTL, an EIL and an ETL.
[0071] FIG. 4 is a cross-sectional view of an organic light
emitting display device according to another embodiment of the
present disclosure. In this embodiment, the organic light emitting
part includes a plurality of CGLs. Description of constituents
identical to or corresponding to constituents of the previous
embodiment will be omitted.
[0072] Referring to FIG. 4, a first part 251 of an organic light
emitting part 250 is disposed on an anode 240, and a first
partition layer 231 is disposed on the edge of the anode 240. A
second partition layer 232 laterally protruding farther than the
first partition layer 231 is disposed on the first partition layer
231. Also a dummy part 260 having the same stack structure as the
first part 251 of the organic light emitting part 250 is disposed
on the second partition layer 232. In addition, a second part 252
of the organic light emitting part 250 is disposed on the first
part 251 of the organic light emitting part 250 and the dummy part
260. The second part 252 is disposed without being separated into
parts. A cathode 270 is disposed on the second part 252.
[0073] The organic light emitting part 250 may include a plurality
of CGLs. As shown in FIG. 4, the first part 251 of the organic
light emitting part 250 is formed by disposing a first intermediate
layer 251a, a first organic emission layer 251b, a second
intermediate layer 251c, a first CGL 251d, a third intermediate
layer 251e, a second organic emission layer 251f, a fourth
intermediate layer 251g and a second CGL 251h one over another. The
dummy part 260 disposed on the second partition layer 232 is formed
by stacking a first dummy layer 260a, a second dummy layer 260b, a
third dummy layer 260c, a fourth dummy layer 260d, a fifth dummy
layer 260e, a sixth dummy layer 260f, a seventh dummy layer 260g
and an eighth dummy layer 260h one over another. Each layer of the
dummy part 260 corresponds to a layer of the first part 251 and is
formed of the same material as the corresponding layer of the first
part 251.
[0074] Referring to FIG. 4, an upper surface 231t of the first
partition layer 231 may be positioned higher than an upper surface
251t1 of the first part 251 of the organic light emitting part 250.
Specifically, the upper surface 251t1 of the second CGL 251h is the
uppermost layer of the first part 251. Or an upper surface 231t may
be positioned in the same plane as the upper surface 251t1 of the
second CGL 251h. This means that the height of the first partition
layer 231 is greater than or equal to the distance from the anode
240 to the first part 251 of the organic light emitting part 250.
In other words, the thickness of the first partition layer 231 is
greater than or equal to the sum of the thicknesses of the anode
240 and the first part 251. More specifically, this means that the
thickness of the first partition layer 231 is greater than or equal
to the sum of the thicknesses of the anode 240, the first
intermediate layer 251a, first organic emission layer 251b, second
intermediate layer 251c, first CGL 251d, third intermediate layer
251e, second organic emission layer 251f, fourth intermediate layer
251g and second CGL 251h. Referring to FIG. 4, by positioning the
upper surface 231t of the first partition layer 231 close to (or a
little higher than) the plane where the upper surface 251t1 of the
second CGL 251h lies, each of the first CGL 251d and the second CGL
251h can be separately disposed in an active area AA and a
non-active area NA. In other words, each of the first CGL 251d and
the second CGL 251H may not continuously extend over the active
area AA and non-active area NA.
[0075] As mentioned above, if the upper surface 231t of the first
partition layer 231 is positioned higher than the upper surface
251t1 of the CGL 251h, the uppermost layer of the first part 251
may be a part of the second part 252, more specifically, one of a
fifth intermediate layer 252a, a third organic emission layer 252b
and a sixth intermediate layer 252c, rather than the CGL 251h, of
the organic light emitting part 250. In this case, the uppermost
layer of the dummy part 260 having the same stack structure as the
first part 251 may be formed of the same material as one of the
fifth intermediate layer 252a, third organic emission layer 252b
and sixth intermediate layer 252c.
[0076] Although not shown in the figure, only the first CGL 251d
may be separately disposed depending on the structure and design of
the organic light emitting part 250. If the upper surface 231t of
the first partition layer 231 is positioned higher than the upper
surface 251t2 of the first CGL 251d of the organic light emitting
part 250 and lower than the upper surface 251t1 of the second CGL
251h, the first CGL 251d may be separately disposed on the upper
portion of the anode 240 and the upper portion of the second
partition layer 232. The second CGL 251h may be disposed without
being separated into parts in a manner that the second part 252 of
the organic light emitting part 250 shown in FIG. 4 is
disposed.
[0077] Accordingly, when the organic light emitting part 250 of the
organic light emitting display device 200 includes a plurality of
CGLs 251d and 251h, the upper surface 231t of the first partition
layer 231 may be positioned higher than the upper surface 251t2 of
the first CGL 251d that is closer to the anode 240 than the other
CGL 251h. Or the upper surface 231t may be positioned in the same
plane as the upper surface 251t2 of the first CGL 251d. As a
result, at least one CGL may be separately disposed in the active
area AA and the non-active area NA, and thus current leakage due to
the CGL may be reduced and light leakage and the mixing of colors
of light may be suppressed.
[0078] The upper surface 231t of the first partition layer 231 may
be positioned lower than the upper surface 252t of the organic
light emitting part 250, specifically, the upper surface 252t of
the sixth intermediate layer 252c which is the uppermost layer of
the second part 252. Or the upper surface 231t may be positioned in
the same plane as the upper surface 252t of the sixth intermediate
layer 252c. This means that the height of the first partition layer
231 is less than or equal to the distance from the anode 240 to the
second part 252 of the organic light emitting part 250. In other
words, the thickness of the first partition layer 231 is less than
or equal to the sum of the thicknesses of the anode 240 , the first
part 251 and second part 252 of the organic light emitting part
250. If the upper surface 231t of the first partition layer 231 is
positioned higher than the upper surface 252t of the organic light
emitting part 250, the cathode 270 having high step coverage may be
deposited along the lateral surface of the first partition layer
231. The first partition layer 231 is positioned further inward
than the second partition layer 232 and the exposed upper surface
of the anode 240, as described above. Thus, an operation-related
defect may be produced by disconnection between the anode 240 and
the cathode 270.
[0079] In summary, the CGL may be separately disposed in the active
area AA and the non-active area NA by positioning the upper surface
231t of the first partition layer 231 higher than or in the same
plane as the upper surface 251t2 of the first CGL 251d of the
organic light emitting part 250 or the upper surface 251t1 of the
second CGL 251h. As a result, defects resulting from light leakage
and the mixing of colors of light caused by, for example, current
leaking into the non-active area NA, may be reduced. In addition,
by positioning the upper surface 231t of the first partition layer
231 lower than or in the same plane as the upper surface 252t of
the organic light emitting part 250, operation-related defects
produced by disconnection between the anode 240 and the cathode 270
may be reduced. Thus, the reliability of the organic light emitting
display device 200 may be enhanced.
[0080] FIGS. 5A to 5D are cross-sectional views illustrating
openings according to structures of a partition layer. Hereinafter,
openings according to structures and shapes of a partition layer
will be described in more detail without describing the other
constituents described above.
[0081] Referring to FIG. 5A, a first partition layer 331a having a
first opening OPN1a configured to expose a portion of an anode 340a
is disposed on the anode 340a. Also a second partition layer 332a
having a second opening OPN2a is disposed on the first partition
layer 331a. The second opening OPN2a may be disposed to overlap the
first opening OPN1a and expose a portion of the anode 340a. The
width of the second opening OPN2a may be less than that of the
first opening OPN1a such that the second partition layer 332a
laterally protrudes farther than the first partition layer
331a.
[0082] The degree of protrusion of the second partition layer 332a
compared to the first partition layer 331a may be expressed by a
distance from an end of the first partition layer 331a to an end of
the second partition layer 332a. The degree of protrusion may
correspond to a distance Da between the lateral surface of the
first partition layer 331a and the lateral surface of the second
partition layer 332a in the structure of the partition layer shown
in FIG. 5A. The distance Da may be greater than 0.1 .mu.m and less
than the thickness of the second partition layer 332a. Preferably,
the distance Da may be between 0.1 .mu.m and 2 .mu.m. If the
distance Da between the lateral surface of the first partition
layer 331a and the lateral surface of the second partition layer
332a is greater than the thickness of the second partition layer
332a, the second partition layer 332a disposed in a protruding
manner may be collapsed down toward the anode 340a by gravity.
Thus, an unexpected defect may occur in the partition layer as the
partition layer is formed in an improper shape. For example, if the
inclined lateral surface of the second partition layer 332a comes
in contact with the anode 340a, the difference between the openings
of the partition layer provided to separately dispose an organic
material may be eliminated. Thus, the organic material may be
continuously disposed rather than being properly separated into
parts. As a result, light may leak into the non-active area. If the
distance Da between the lateral surface of the first partition
layer 331a and the lateral surface of the second partition layer
332a is less than 0.1 .mu.m, there may be little difference between
the width of the second opening OPN2a and the width of the first
opening OPN1a. Thus, the effect of step coverage may hardly occur.
As a result, the organic material may be continuously disposed
without being properly separated into parts, and thus light leakage
may occur in the non-active area.
[0083] FIG. 5B shows a second partition layer 332b whose lateral
surface has a different shape over the lateral surface shown in
FIG. 5A. The other constituents shown in FIG. 5B are the same as
those of FIG. 5A and thus description thereof will be omitted.
[0084] As shown in FIG. 5B, the lateral surface of the second
partition layer 332b is inclined. More specifically, the lateral
surface of the second partition layer 332b is inclined in a taper
shape such that the upper portion of the lateral surface protrudes
farther than the lower portion of the lateral surface. In this
case, a second opening OPN2b may be defined based on the lower
surface of the second partition layer 332b. The shape of the
inclined lateral surface of the second partition layer 332b may be
determined by a processing method, process conditions, and
properties of a material forming the second partition layer 332b.
The width of the second opening OPN2b may be less than the width of
a first opening OPN1b, and the second opening OPN2b may be disposed
to overlap the first opening OPN1b. The distance Db from an end of
the first partition layer 331b to a corresponding end of the second
partition layer 332b may be greater than about 0.1 .mu.m and less
than the thickness of the second partition layer 332b. Preferably,
the distance Db may be between about 0.1 .mu.m and 2 .mu.m. In this
case, the end of the first partition layer 331b corresponds to the
lateral surface of the first partition layer 331b. Also the end of
the second partition layer 332b corresponds to a portion of the
inclined lateral surface of the second partition layer 332b that
protrudes farther than the other portion of the lateral
surface.
[0085] FIG. 5C shows a first partition layer 331c whose lateral
surface has a different shape over the lateral surface shown in
FIG. 5B. The other constituents shown in FIG. 5C are the same as
those of FIG. 5B and thus description thereof will be omitted.
[0086] As shown in FIG. 5C, similar to a second partition layer
332c, the first partition layer 331c has an inclined lateral
surface. More specifically, the lateral surface of the first
partition layer 331c is formed in a reverse taper shape such that
the upper portion of the lateral surface protrudes farther than the
lower portion of the lateral surface. In this case, a first opening
OPN1c may be defined based on the upper surface of the first
partition layer 331c. The shape of the inclined lateral surface of
the first partition layer 331c may be determined by a processing
method, process conditions, and properties of a material forming
the first partition layer 331c. The width of a second opening OPN2c
may be less than that of the first opening OPN1c, and the second
opening OPN2c may be disposed to overlap the first opening OPN1c.
The distance Dc from an end of the first partition layer 331c to a
corresponding end of a second partition layer 332c may be greater
than 0.1 .mu.m and less than the thickness of the second partition
layer 332c. Preferably, the distance Dc may be between about 0.1
.mu.m and 2 .mu.m. In this case, the end of the first partition
layer 331c corresponds to a portion of the inclined lateral surface
of the first partition layer 331c that is dented further inward
than the other portion of the lateral surface. Also, the end of the
second partition layer 332c corresponds to a portion of the
inclined lateral surface of the second partition layer 332c that
protrudes farther than the other portion of the lateral
surface.
[0087] FIG. 5D shows a first partition layer 331d whose lateral
surface has a different shape over the lateral surface shown in
FIG. 5C. The other constituents shown in FIG. 5D are the same as
those of FIG. 5C and thus description thereof will be omitted.
[0088] As shown in FIG. 5D, the lateral surface of the first
partition layer 331d is inclined. More specifically, similar to a
second partition layer 332d, the first partition layer 331d has a
lateral surface formed in a taper shape such that the upper portion
of the lateral surface protrudes father than the lower portion of
the lateral surface. In this case, a first opening OPN1d may be
defined based on the upper surface of the first partition layer
331d. The shape of the inclined lateral surface of the first
partition layer 331d may be determined by a processing method,
process conditions, and properties of a material forming the first
partition layer 331d. The width of a second opening OPN2d may be
less than that of the first opening OPN1d, and the second opening
OPN2d may be disposed to overlap the first opening OPN1d. The
distance Dd from an end of the first partition layer 331d to an end
of a second partition layer 332d may be greater than about 0.1
.mu.m and less than the thickness of the second partition layer
332d. Preferably, the distance Dd may be between about 0.1 .mu.m
and 2 .mu.m. In this case, the end of the first partition layer
331d corresponds to a portion of the inclined lateral surface of
the first partition layer 331d that is dented further inward than
the other portion of the lateral surface. Also the end of the
second partition layer 332d corresponds to a portion of the
inclined lateral surface of the second partition layer 332d that
protrudes farther than the other portion of the lateral
surface.
[0089] Accordingly, referring to FIGS. 5A to 5D, when a cross
section of an organic light emitting display device according to an
embodiment of the present disclosure is viewed, the width of a
first opening OPN1 of a first partition layer 331 is greater than
that of a second opening OPN2 of a second partition layer 332.
Further, the first opening OPN1 and the second opening OPN2 are
disposed to overlap each other. In addition, the first opening OPN1
may be defined based on the upper surface of the first partition
layer 331, and the second opening OPN2 may be defined based on the
lower surface of the second partition layer 332. As an organic
material having low step coverage is separately formed on the upper
portion of the anode 340 corresponding to an active area and the
upper portion of the second partition layer 332 corresponding to a
non-active area by the aforementioned difference in width between
the first opening OPN1 and the second opening OPN2, light leakage
and the mixing of colors of light caused by current leaking into
the non-active area may be suppressed.
[0090] FIGS. 6A to 6E are cross-sectional views illustrating a
method for manufacturing an organic light emitting display device
according to an embodiment of the present disclosure.
[0091] Referring to FIG. 6A, a TFT 420 is formed on a substrate
410. Specifically, a conductive material is deposited onto the
substrate 410 and patterning is performed to form a gate electrode
421. Then, a first insulation layer 411 formed of an insulation
material is formed on the gate electrode 421. A semiconductor
material is applied onto the first insulation layer 411 and then
patterning is performed to form an active layer 422 such that the
active layer 422 overlaps the gate electrode 421. After a
conductive material is deposited onto the active layer 422,
patterning is performed to form a source electrode 423 and a drain
electrode 42 such that the source electrode 423 and the drain
electrode 42 are spaced apart from each other. A second insulation
layer 412 having a contact hole configured to expose a portion of
the source electrode 423 is disposed on the TFT 420.
[0092] Next, referring to FIG. 6B, an anode 440 connected to the
source electrode 423 through the contact hole of the second
insulation layer 412 is formed on the second insulation layer 412.
The anode 440 may be formed for each pixel by performing the
patterning operation. Thereafter, an inorganic insulation film 430
formed of an inorganic insulation material is deposited onto the
anode 440. The inorganic insulation film 430 may be formed of
silicon oxide (SiOx) or silicon nitride (SiNx), but embodiments of
the present disclosure are not limited thereto.
[0093] Next, referring to FIG. 6C, an organic insulation film
formed of an organic insulation material is deposited on the entire
inorganic insulation film 430. Then patterning is performed using,
for example, photo resist to form a second partition layer 432. The
second partition layer 432 is patterned to have a second opening
OPN2, and the second opening OPN2 is formed to overlap the anode
440. The second partition layer 432 may be formed of a polyimide
resin, an acrylic resin or a benzocyclobutene (BCB) resin, but
embodiments of the present disclosure are not limited thereto.
[0094] Next, referring to FIG. 6D, a first partition layer 431 is
etched on the inorganic insulation film 430 using an etchant. In
this operation, the second partition layer 432 serves as a mask of
the inorganic insulation film 430. An end of the first partition
layer 431 may be dented further inward than an end of the second
partition layer 432 by adjusting a processing condition,
particularly, a process time. That is, a portion of the inorganic
insulation film 430 where the second partition layer 432 is not
formed is removed by the etchant, and the lateral surface of the
first partition layer 431 is gradually dented inward by the process
time and the etchant. In this operation, the first partition layer
431 is provided with the first opening OPN1, and the first opening
OPN1 is formed to have a greater width than the second opening
OPN2.
[0095] Dry etching or wet etching may be used to form the first
partition layer 431 depending on the type of the inorganic
insulation film 430. In addition, the structures and shape of the
first partition layer 431 and the second partition layer 432, more
specifically, the shape of the lateral surface of each of the first
partition layer 431 and the second partition layer 432 may be
determined by processing conditions corresponding to properties of
a material in use, a process time and a process environment. The
lateral surfaces may have the structures described above with
reference to FIGS. 5A to 5D.
[0096] Lastly, referring to FIG. 6E, an organic material is
deposited on the anode 440 and on the second partition layer 432.
In this operation, the organic material having low step coverage is
separately formed on the upper portion of the anode 440 and the
upper portion of the second partition layer 432 due to the
structure of the partition layers. That is, the organic material
having low step coverage cannot reach the dented lateral surface of
the first partition layer 431, and is thus discontinuously formed
on the upper portion of the anode 440 and the upper portion of the
second partition layer 432. Thus, a first part 451 of an organic
light emitting part 450 and a dummy part 460 are simultaneously
formed on the upper portion of the anode 440 and the upper portion
of the second partition layer 432 respectively without being
connected to each other. The first part 451 and the dummy part 460
have the same stack structure.
[0097] As described above, the height of the first partition layer
431 may be adjusted such that the first part 451 of the organic
light emitting part 450 includes at least one CGL. Thereby, the CGL
may be separately formed in the active area AA corresponding to the
upper portion of the anode 440 and the non-active area NA
corresponding to the upper portion of the second partition layer
432. Accordingly, light leakage and the mixing of colors of light
caused by current leaking into the non-active area NA may be
suppressed.
[0098] A second part 452 formed of an organic material is deposited
onto the first part 451 of the organic light emitting part 450 and
the dummy part 460. The second part 452 is deposited onto the
active area AA and the non-active area NA without being separated
into parts by the thickness of the organic material. In addition, a
cathode 470 is formed on the second part 460.
[0099] According to the method for manufacturing the organic light
emitting display device 400, as an organic material including a CGL
is separately formed in the active area AA and the non-active area
NA using the structures of the first partition layer 431 and the
second partition layer 432 which have openings of different widths,
display quality deteriorated by light leakage and the mixing of
colors of light from neighboring pixels, which are caused by
current leaking into the non-active area NA may be enhanced.
[0100] In an organic light emitting display device according to an
embodiment of the present disclosure, the partition member may have
an eaves shape that include a first partition layer having an
opening and a second partition layer disposed on the first
partition layer. Also, the second partition layer has an opening
configured to overlap the opening of the first partition layer and
is to be smaller than the opening of the first partition layer.
[0101] A height of the first partition layer may be greater than or
equal to a distance from a top surface of the anode to a top
surface of the CGL such that the CGL is separately formed in
neighboring pixels.
[0102] Organic layers disposed between the anode and a specific
layer of the plurality of organic layers may be separated by the
partition member. Also organic layers between the specific layer
and the cathode may be connected to each other in neighboring
pixels, wherein at least one of the organic layers separated by the
partition member may include the CGL.
[0103] In an organic light emitting display device according to
another embodiment of the present disclosure, a first part may
further include at least one CGL.
[0104] An organic light emitting part may include a second part
disposed between the first part and a cathode, wherein the second
part may be disposed to cover the first part and a dummy part.
[0105] The upper surface of the first partition layer may be
positioned lower than or in the same plane as the upper surface of
an organic light emitting part.
[0106] An upper surface of the first partition layer may be
positioned higher than or in the same plane as the upper surface of
the CGL.
[0107] When the organic light emitting part includes a plurality of
CGLs, the upper surface of the first partition layer may be
positioned higher than or in the same plane as the upper surface of
a CGL disposed closest to the anode among the CGLs.
[0108] A lateral surface of at least one of the first partition
layer and the second partition layer may be inclined.
[0109] A first opening may be defined based on the upper surface of
the first partition layer, and a second opening may be defined
based on the lower surface of the second partition layer.
[0110] A distance from an end of the first partition layer and an
end of the second partition layer may be greater than 0.1 .mu.m and
less than thickness of the second partition layer.
[0111] The first partition layer may be formed of an inorganic
insulation material, and the second partition layer may be formed
of an organic insulation material.
[0112] A method for manufacturing an organic light emitting display
device according to an embodiment of the present disclosure
comprises forming an thin film transistor (TFT) on a substrate,
forming an anode connected to the TFT, forming an inorganic
insulation film on the anode, forming an organic insulation film on
the inorganic insulation film and forming a second partition layer
having a second opening by patterning the organic insulation film,
forming a first partition layer having a first opening by
patterning the inorganic insulation film such the anode is exposed,
forming a first part positioned on the anode and a dummy part
positioned on the second partition layer simultaneously by
depositing an organic material onto the anode and the second
partition layer, and depositing a cathode onto the first part and
the dummy part. The first opening may be larger than the second
opening.
[0113] The first part may be separated from the dummy part.
[0114] The first part may include at least one CGL.
[0115] The method may further include depositing a second part
formed of an organic material onto the first part and the dummy
part.
[0116] Forming the first partition layer may include patterning the
inorganic insulation film using the second partition layer as a
mask.
[0117] Exemplary embodiments of the present disclosure have been
described in detail above with reference to the accompanying
drawings. Those skilled in the art will appreciate that the present
disclosure is not limited to the exemplary embodiments, and various
modifications and variations can be made in the present disclosure
without departing from the spirit or scope of the disclosure.
Accordingly, the exemplary embodiments described herein are merely
illustrative and are not intended to limit the scope of the present
disclosure. The technical idea of the present disclosure is not
limited by the exemplary embodiments. Therefore, the embodiments
described herein should be construed in all aspects as illustrative
and not restrictive. The scope of protection sought by the present
disclosure should be determined by the appended claims and their
legal equivalents, and all changes coming within the meaning and
equivalency range of the appended claims are intended to be
embraced therein.
* * * * *