U.S. patent application number 15/099738 was filed with the patent office on 2017-10-19 for electroplating system.
The applicant listed for this patent is BOARDTEK ELECTRONICS CORPORATION.. Invention is credited to Wen-Feng Cheng, Shun-Chang HSIAO, Chi-Chang HSU, Huan-Hsin LO, Shang-Pei Sun.
Application Number | 20170298529 15/099738 |
Document ID | / |
Family ID | 60039425 |
Filed Date | 2017-10-19 |
United States Patent
Application |
20170298529 |
Kind Code |
A1 |
Cheng; Wen-Feng ; et
al. |
October 19, 2017 |
ELECTROPLATING SYSTEM
Abstract
An electroplating system includes an electroplating bath in
which a cathode end and at least an anode end are configured. The
anode end is provided with plural anode elements which are
insulative from one another, as well as plural conductive elements
which are connected electrically with each anode element,
respectively. The electroplating system enables a variety of
distribution of the electric lines of force to be formed in the
electroplating bath through energizing one or any number of anode
elements. In particular, good benefits can be achieved by a more
aggressive and reliable means, without a need for changing the
original anode end equipment.
Inventors: |
Cheng; Wen-Feng; (TAOYUAN,
TW) ; HSIAO; Shun-Chang; (TAOYUAN, TW) ; LO;
Huan-Hsin; (TAOYUAN, TW) ; HSU; Chi-Chang;
(TAOYUAN, TW) ; Sun; Shang-Pei; (TAOYUAN,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BOARDTEK ELECTRONICS CORPORATION. |
TAOYUAN |
|
TW |
|
|
Family ID: |
60039425 |
Appl. No.: |
15/099738 |
Filed: |
April 15, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C25D 17/007 20130101;
C25D 21/12 20130101; C25D 17/005 20130101; C25D 17/12 20130101;
C25D 17/10 20130101 |
International
Class: |
C25D 17/00 20060101
C25D017/00; C25D 17/00 20060101 C25D017/00; C25D 17/10 20060101
C25D017/10; C25D 21/12 20060101 C25D021/12 |
Claims
1. An electroplating system comprising an electroplating bath in
which a cathode end and at least an anode end are disposed, wherein
each anode end is provided with plural anode elements which are
insulative from one another, as well as plural conductive elements
which are connected electrically with each anode element,
respectively.
2. The electroplating system according to claim 1, wherein the
anode end is provided with a bracket and each anode element is
disposed on the bracket, insulative from other anode elements.
3. The electroplating system according to claim 2, wherein the
bracket is connected with a swinging device.
4. The electroplating system according to claim 1, wherein the
anode end is provided with a bracket, each anode element is
disposed on the bracket and is insulative from other anode
elements, and each conductive element is fixed on the bracket.
5. The electroplating system according to claim 1, further
comprising a distributor for connecting with an external power
source, wherein the distributor provides for connecting
electrically with the conductive elements disposed on each anode
element and is provided with plural switch circuits, with each
switch circuit controlling the on or off of the circuit of each
anode element.
6. The electroplating system according to claim 1, further
comprising a distributor for connecting with an external power
source, wherein the distributor provides for connecting
electrically with the conductive elements disposed on each anode
element and is provided with plural switch circuits, with each
switch circuit controlling the on or off of the circuit of each
anode element; each anode end being provided with a bracket and
being disposed on the bracket, insulative from other anode ends;
each conductive element being fixed on the bracket; the distributor
being provided with plural lead wires, with each lead wire being
connected electrically with each conductive element.
7. The electroplating system according to claim 6, wherein the
bracket is connected with a swinging device.
8. The electroplating system according to claim 1, wherein each
anode element is provided with plural meshes.
9. The electroplating system according to claim 1, wherein each
anode element manifests a rectangular outline.
10. The electroplating system according to claim 1, wherein each
anode element manifests a circular outline.
11. The electroplating system according to claim 1, wherein each
anode elements manifests a square outline.
12. The electroplating system according to claim 1, wherein each
anode element manifests an elliptic outline.
13. The electroplating system according to claim 1, wherein each
anode element manifests a triangular outline.
14. The electroplating system according to claim 1, wherein each
anode element manifests a trapezoidal outline.
15. The electroplating system according to claim 1, wherein each
anode element manifests an L-shaped outline.
16. The electroplating system according to claim 1, wherein each
anode end is provided with two anode elements in a different
outline.
17. The electroplating system according to claim 1, wherein the
electroplating system includes an anode strip.
18. The electroplating system according to claim 17, wherein the
anode end is further disposed between the anode strip and the
cathode end.
19. The electroplating system according to claim 17, wherein the
anode end is disposed on the other side of the anode strip,
opposite to the cathode end.
20. The electroplating system according to claim 17, wherein the
anode strip is connected with a swinging device.
21. The electroplating system according to claim 1, wherein the
anode end is connected with a swinging device.
22. The electroplating system according to claim 1, wherein the
anode end and the cathode end are connected with a swinging
device.
23. The electroplating system according to claim 1, wherein the
cathode end is connected with a swinging device.
Description
BACKGROUND OF THE INVENTION
a) Field of the Invention
[0001] The present invention relates to an electroplating system,
and more particularly to an electroplating system in which the
electric power distribution can be adjusted according to the shape
of the product or the configuration that the product is suspended
and disposed.
b) Description of the Prior Art
[0002] It is well known that the electroplating process is a method
of coating a layer of membrane on an object using the electrolytic
reduction reaction. The machine used in the electroplating process
depends upon the product to be electroplated, and no matter what
kind of machine is used, the electroplating region is designed with
a different number of electrode bars as the anodes, so as to result
in the ionization of metal ions in the electroplating solution;
whereas, the workpieces to be electroplated are usually designed as
the cathodes.
[0003] When performing the electroplating operation, an electric
voltage is applied to the anodes and the cathodes respectively,
allowing the metal ions to be precipitated in the electroplating
solution by the electrolytic reaction. These metal ions will be
deposited at the cathode end, forming a metal coating which is
plated on the surface of the workpiece to be electroplated after
being reduced at the cathodes. The existing electroplating system
is divided into a soluble anode electroplating system and an
insoluble anode electroplating system depending upon the method for
providing the electroplating metal.
[0004] In the insoluble anode electroplating system, when the
electric current flows from the top of an anode to the bottom of
the anode, the magnitude of electric current will decrease
gradually by the resistance. In other words, at the top of the
anode, more metal ions will be decomposed and released as the
electric current passing through this location is larger; on the
other hand, the electric current passing through the lower part of
the anode is less than the electric current passing through the
upper part of the anode, thus fewer metal ions will be decomposed
and released, which then results in the phenomenon that the
electric lines of force do not distribute uniformly (i.e., the
electric current density does not distribute uniformly) in the
electroplating bath.
[0005] This phenomenon will cause that the product coating is
thicker at the place where the electric current density is large
and the product coating is thinner at the place where the electric
current density is small. Therefore, the quality of product
(especially the sub-product) will be affected seriously as the
surface coating on the product is not uniform. Furthermore, under
some conditions, the product can be charred easily as the electric
current density is too large (the electric lines of force are too
dense). Accordingly, it has long been an issue to be solved by the
related industry to provide an electroplating system in which the
electric power distribution can be adjusted depending upon the
shape of the product or the configuration that the product is
suspended and disposed.
SUMMARY OF THE INVENTION
[0006] Accordingly, the primary object of the present invention is
to provide an electroplating system in which the electric power
distribution can be adjusted depending upon the shape of the
product or the configuration that the product is suspended and
disposed.
[0007] To achieve the abovementioned object, the electroplating
system of the present invention includes an electroplating bath in
which a cathode end and at least an anode end are disposed. The
anode end is provided with plural anode elements which are
insulative from one another. In addition, there are plural
conductive elements which are connected electrically with each
anode element, respectively.
[0008] By using the abovementioned structure features, in the
electroplating system according to the present invention, a variety
of distribution of the electric lines of force is able to be formed
in the electroplating bath through energizing one or any number of
anode elements. In particular, when the shape of the product to be
electroplated or the configuration that the product is suspended
and disposed is changed, the corresponding distribution of the
electric lines of force can be formed only through a simple way of
switching an electric current supplying loop, without a need for
changing the original anode end equipment. Therefore, the quality
of electroplating can be improved by a more aggressive and reliable
means to result in good benefits.
[0009] In the electroplating system disclosed by the present
invention, plural anode elements, each of which is able to control
the on or off of the circuit, are used primarily, such that a
variety of distribution of the electric lines of force can be
formed in the electroplating bath through energizing one or any
number of anode elements. In particular, when the shape of the
product to be electroplated or the configuration that the product
is suspended and disposed is changed, the corresponding
distribution of the electric lines of force can be formed only
through a simple way of switching an electric current supplying
loop, without a need for changing the original anode end equipment.
Therefore, the quality of electroplating can be improved by a more
aggressive and reliable means to result in good benefits.
[0010] To enable a further understanding of the said objectives and
the technological methods of the invention herein, the brief
description of the drawings below is followed by the detailed
description of the preferred embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 shows a structural view of basic compositions of an
electroplating system, according to the present invention.
[0012] FIG. 2 shows a three-dimensional view of appearance of a
first embodiment of an anode end, according to the present
invention.
[0013] FIG. 3 shows a structural schematic view of a second
embodiment of the anode end, according to the present
invention.
[0014] FIG. 4 shows a structural schematic view of a third
embodiment of the anode end, according to the present
invention.
[0015] FIG. 5 shows a structural schematic view of a fourth
embodiment of the anode end, according to the present
invention.
[0016] FIG. 6 shows a schematic view of a state of use of a fifth
embodiment of the anode end, according to the present
invention.
[0017] FIG. 7 shows a schematic view of a state of use of a sixth
embodiment of the anode end, according to the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0018] The present invention provides primarily an electroplating
system in which the electric power distribution can be adjusted
according to the shape of the product or the configuration that the
product is suspended and disposed. As shown in FIG. 1, the
electroplating system of the present invention comprises basically
an electroplating bath 10 in which an cathode end 20 and at least
an anode end 30 are disposed, wherein the anode end 30 is provided
with plural anode elements 32 which are insulative from one
another. In addition, there are plural conductive elements 33 which
are connected electrically with each anode element 32,
respectively. Upon implementation, the said anode end 30 can be
further provided with a bracket 31, and each anode element 32 is
disposed on the bracket 31, insulative from other anode elements
32.
[0019] In principle, when the electroplating system of the present
invention operates practically, the anode ends 30 in pairs are
disposed respectively in the electroplating bath 10, opposite to
two sides of the cathode end 20. The product to be electroplated,
whereas, is suspended on the cathode end 20. Therefore, when the
electric current is applied respectively to the anode ends 30 and
the cathode end 20, metal ions will be precipitated and deposited
on the cathode end 20 in the electroplating solution in the
electroplating bath 10 due to the electrolytic reaction. When the
metal ions are reduced on the cathode, a metal coating will be
plated on the surface of the product.
[0020] As the electroplating system of the present invention is
provided with plural anode elements 32, with each of which being
able to control the on or off of the circuit, a variety of
distribution of the electric lines of force can be formed in the
electroplating bath 10 through energizing one or any number of
anode elements 32. In particular, when the shape of the product to
be electroplated or the configuration that the product is suspended
and disposed is changed, the corresponding distribution of the
electric lines of force can be formed only through a simple way of
switching an electric current supplying loop, without a need for
changing the original anode end equipment. Therefore, the quality
of electroplating can be improved by a more aggressive and reliable
means to result in good benefits.
[0021] Referring to FIG. 2, the said anode end 30 is provided with
a bracket 31, and each anode element 32 is disposed on the bracket
31, insulative from other anode elements 32. Under this
configuration, each conductive element 33 can be also fixed on the
bracket 31, and it is preferred that an end of each conductive
element 33 is extended out of the bracket 31 by a predetermined
length, which not only facilitates the installation of the entire
anode ends 30, but also is easier to connect electrically the
conductive elements 33 with an external power source.
[0022] Referring to FIG. 3, the electroplating system of the
present invention further includes a distributor 40 to connect with
the external power source. The distributor 40 provides for
connecting electrically with the conductive elements 33 disposed on
the anode elements 32, and is provided with plural switch circuits,
each of which controls the on or off of the circuit of each anode
element 32. A preferred structure configuration is that the anode
ends 30 are provided with a bracket 31, each anode element 32 is
disposed on the bracket 31 and is insulative from other anode
elements 32, each conductive element 33 is fixed on the bracket 31,
and the distributor 40 is provided with plural lead wires for
connecting electrically with each conductive element 33,
respectively.
[0023] Under all kinds of the abovementioned structure patterns
that can be implemented, in the electroplating system of the
present invention, the said each anode element 32 is provided with
plural meshes 321. In other words, the said anode element 32 can
manifest as a structure pattern of a net or basket, so that the
metal ions in the electroplating bath can have a better
fluidity.
[0024] In addition, in the embodiment as shown in FIG. 2, each said
anode element 32 is provided with a rectangular outline. Upon
implementation, each said anode element 32 can manifest as a
circular outline as shown in FIG. 3, a square outline as shown in
FIG. 4, or even an elliptic, triangular, trapezoidal or L-shaped
outline as shown in FIG. 5. When necessary, the said each anode end
30 can be also provided with at least two anode elements 32 in a
different outline. Furthermore, as shown in FIG. 6, upon
implementation, the said each anode end 30 can be further disposed
between an anode strip 50 and the cathode end 20 to assure the
quality of electroplating. Or, as shown in FIG. 7, upon
implementation, the said each anode end 30 can be disposed on the
other side to the anode strip 50, opposite to the cathode end 20.
Moreover, when necessary, the cathode end 20, the anode ends 30 and
the anode strips 50 can be connected with a swinging device 70,
thereby achieving an effect that the coating is more uniform.
[0025] Specifically, in the electroplating system disclosed by the
present invention, plural anode elements, each of which is able to
control the on or off of the circuit, are used primarily to form a
variety of distribution of the electric lines of force in the
electroplating bath through energizing one or any number of anode
elements. In particular, when the shape of the product to be
electroplated or the configuration that the product is suspended
and disposed is changed, the corresponding distribution of the
electric lines of force can be formed only through a simple way of
switching an electric current supplying loop, without a need for
changing the original anode end equipment. Accordingly, the quality
of electroplating can be improved by a more aggressive and reliable
means to result in good benefits.
[0026] It is of course to be understood that the embodiments
described herein is merely illustrative of the principles of the
invention and that a wide variety of modifications thereto may be
effected by persons skilled in the art without departing from the
spirit and scope of the invention as set forth in the following
claims.
* * * * *