U.S. patent application number 15/511237 was filed with the patent office on 2017-10-12 for immersion cooled top-loading computing cartridges.
The applicant listed for this patent is HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP. Invention is credited to Kevin D CONN, Kapil Rao Papa Rao Bala GANTA, Sr., Kelly K SMITH.
Application Number | 20170295676 15/511237 |
Document ID | / |
Family ID | 55631116 |
Filed Date | 2017-10-12 |
United States Patent
Application |
20170295676 |
Kind Code |
A1 |
CONN; Kevin D ; et
al. |
October 12, 2017 |
IMMERSION COOLED TOP-LOADING COMPUTING CARTRIDGES
Abstract
A chassis in accordance with one example includes a plurality of
slots to receive a plurality of top-loading computing cartridges
from a top of the chassis. The chassis also includes a supply inlet
on a first side of the chassis to direct cooling fluid from the
first side to a second side of the chassis, and a return outlet on
the second side of the chassis to expel the cooling fluid from the
chassis. The plurality of computing cartridges are immersed in the
cooling fluid.
Inventors: |
CONN; Kevin D; (Montgomery,
TX) ; SMITH; Kelly K; (Spring, TX) ; GANTA,
Sr.; Kapil Rao Papa Rao Bala; (Houston, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
Houston |
TX |
US |
|
|
Family ID: |
55631116 |
Appl. No.: |
15/511237 |
Filed: |
September 29, 2014 |
PCT Filed: |
September 29, 2014 |
PCT NO: |
PCT/US2014/058140 |
371 Date: |
March 15, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/20236 20130101;
G06F 1/181 20130101; H05K 7/2079 20130101; H05K 7/20781 20130101;
H05K 7/203 20130101; G06F 1/20 20130101; H05K 7/20772 20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A multi-tiered cooling structure, comprising: multiple tanks on
each tier of the cooling structure, wherein each tank includes: a
plurality of top-loading computing cartridges insertable from a top
of the tanks; a supply inlet on a first side of the tanks to direct
cooling fluid from the first side to a second side; and a return
outlet on the second side of the tanks to expel the cooling fluid
from the tanks, wherein the plurality of computing cartridges are
immersed in the cooling fluid.
2. The multi-tiered cooling structure of claim 1, wherein each tank
includes a plurality of slots to receive the plurality of computing
cartridges from the top of the tanks.
3. The multi-tiered cooling structure of claim 1, wherein a
computing cartridge of the plurality of computing cartridges is
insertable and removable from a tank without a disruption to other
computing cartridges.
4. The multi-tiered cooling structure of claim 1, wherein a
computing cartridge of the plurality of computing cartridges is
insertable and removable from a tank without powering down the
tank.
5. The multi-tiered cooling structure of claim 4, wherein the
computing cartridge is insertable and removable from the tank
without powering down any of the multiple tanks.
6. The multi-tiered cooling structure of claim 4, wherein the
computing cartridge is insertable and removable from the tank
without powering down other computing cartridges of the plurality
of computing cartridges.
7. The multi-tiered cooling structure of claim 1, further
comprising a heat exchanger to receive the expelled cooling fluid
from the return outlet of the tanks.
8. A chassis, comprising: a plurality of slots to receive a
plurality of top-loading computing cartridges from a top of the
chassis; a supply inlet on a first side of the chassis to direct
cooling fluid from the first side to a second side of the chassis;
and a return outlet on the second side of the chassis to expel the
cooling fluid from the chassis, wherein the plurality of computing
cartridges are immersed in the cooling fluid.
9. The chassis of claim 8, wherein a computing cartridge of the
plurality of computing cartridges is insertable and removable from
the top of the chassis without a disruption to the other computing
cartridges of the plurality of computing cartridges.
10. The chassis of claim 9, wherein the computing cartridge is
powered down when the computing cartridge is to be removed from the
chassis, while power is maintained to the chassis and to the other
computing cartridges.
11. The chassis of claim 8, wherein the cooling fluid is directed
in a horizontal manner across the plurality of computing cartridges
from the first side of the chassis to the second side of the
chassis.
12. A method, comprising: pumping a cooling fluid into a chassis,
wherein the chassis includes a plurality of slots to receive a
plurality of top-loading computing cartridges insertable from a top
of the chassis; directing the cooling fluid through a supply inlet
on a first side of the chassis; and expelling the cooling fluid
through a return outlet on a second side of the chassis, wherein
the plurality of computing cartridges are immersed in the cooling
fluid.
13. The method of claim 12, further comprising: inserting a first
computing cartridge into a first slot without disrupting operation
of other computing cartridges in the chassis; and removing a second
computing cartridge from a second slot without disrupting operation
of the other computing cartridges in the chassis.
14. The method of claim 12, wherein directing the cooling fluid
through the supply inlet comprises directing the cooling fluid in a
horizontal manner across the plurality of computing cartridges.
15. The method of claim 12, further comprising receiving the
expelled cooling fluid at a heat exchanger coupled to the chassis.
Description
BACKGROUND
[0001] Electronic devices have temperature requirements. Heat from
the use of the electronic device is controlled using cooling
systems, because devices may be damaged if they overheat. Thus,
heat is typically siphoned away from electronic devices using
cooling systems. Examples of cooling systems include air, liquid,
and immersion cooling.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] Some examples of the present application are described with
respect to the following figures:
[0003] FIG. 1 illustrates a front perspective of a multi-tiered
cooling structure including multiple tanks to receive a plurality
of top-loading computing cartridges, according to one example;
[0004] FIG. 2 illustrates a chassis including a plurality immersion
cooled top-loading computing cartridges, according to one
example;
[0005] FIG. 3 illustrates a chassis including a plurality of
immersion cooled top-loading computing cartridges where a computing
cartridge is individually insertable and removable from the
chassis, according to one example;
[0006] FIG. 4 is an example of a flowchart illustrating a method
for cooling top-loading computing cartridges by immersion cooling;
and
[0007] FIG. 5 is an example of a flowchart illustrating another
method for cooling top-loading computing cartridges by immersion
cooling.
DETAILED DESCRIPTION
[0008] In immersion cooling, cooling fluid may flow through or
around electronic devices to prevent overheating of the devices.
The heat produced by the components may be transferred to the
cooling fluid to regulate the temperature of the devices.
Conventional cooling systems include standard racks that are placed
on their back in a tank and completely immersed in cooling fluid
(i.e., submerged as a whole unit). To service or replace parts,
entire rack may need to be shut down or powered down and servers
lifted out of the tank which may be several inches deep. Such
cooling systems may create space limitations, difficulties in
accessing and servicing the hardware components, and may also lead
to inefficiencies due to increased down time (i.e., from shutting
down the entire rack).
[0009] Examples disclosed herein address the above needs and
challenges by providing a plurality of servers in a top-loading
modular form factor (i.e., a top-loading computing cartridge) that
can be installed or removed from an immersion cooled tank/chassis
without disrupting the operation of other servers. For example, a
particular computing cartridge can be insertable or removable from
a slot in the chassis, via the top, without powering down other
computing cartridges in the chassis or powering down the chassis.
This allows for better serviceability and less down time.
[0010] In one example, a multi-tiered cooling structure includes
multiple tanks on each tier of the cooling structure. Each tank
includes a plurality of top-loading computing cartridges insertable
from a top of the tank. Each tank also includes a supply inlet on a
first side of the tanks to direct cooling fluid from the first side
to a second side, and a return outlet on the second side of the
tanks to expel the cooling fluid from the tanks. The plurality of
computing cartridges are immersed in the cooling fluid.
[0011] In another example, a chassis includes a plurality of slots
to receive a plurality of top-loading computing cat fridges from a
top of the chassis. The chassis also includes a supply inlet on a
first side of the chassis to direct cooling fluid from the first
side to a second side of the chassis, and a return outlet on the
second side of the chassis to expel the cooling fluid from the
chassis. The plurality of computing cartridges are immersed in the
cooling fluid.
[0012] In another example, a method includes pumping a cooling
fluid into a chassis, where the chassis includes a plurality of
slots to receive a plurality of top-loading computing cartridges
insertable from a top of the chassis. The method includes directing
the cooling fluid through a supply inlet on a first side of the
chassis, and expelling the cooling fluid through a return outlet on
a second side of the chassis. The plurality of computing cartridges
are immersed in the cooling fluid.
[0013] Referring now to the figures, FIG. 1 illustrates a front
perspective of a multi-tiered cooling structure including multiple
tanks to receive a plurality of top-loading computing cartridges,
according to one example. Multi-tiered cooling structure 100
includes multiple tiers 102a-102c (Tier 1, Tier 2, and Tier 3).
Each tier 102a-102c includes multiple tanks 104a-104d. Each tank
104a-104d (collectively referred to as "tank 104") on each tier
102a-102c can accommodate a plurality of top-loading computing
cartridges (not shown) that fit into slots configured to receive
the computing cartridges from above (i.e., the top of the tanks
104). Thus, each computing cartridge can be independently inserted
into a tank 104.
[0014] Tank 104 includes a supply inlet 116 on a first side 106
(e.g., the front side) to receive the cooling fluid and direct the
cooling fluid to a second side 126 (e.g., the backside/opposite
side) of the tank 104. Tank 104 also includes a return outlet (not
shown) on the second side 126 to direct an outflow of the cooling
liquid and expel the cooling liquid from the tank 104. In one
example, the expelled cooling fluid enters a heat exchanger 130 to
transfer the heat from the cooling fluid so that the cooling fluid
may be pumped back into the tanks 104a-104d. In some examples, the
cooling fluid can be a dielectric fluid or mineral oil that is not
electrically conductive and has better heat properties than water,
for example.
[0015] The plurality of computing cartridges are immersed in the
cooling fluid as the cooling fluid is directed into and expelled
from the tank 104. The heat generated by the computing cartridges
are removed by the cooling fluid. Although FIG. 1 illustrates the
multi-tiered cooling structure 100 as including three tiers,
implementations should not be limited as this was done for
illustration purposes. For example, the multi-tiered cooling
structure 100 may include less than three tiers (e.g., two tiers)
or greater than three tiers (e.g., four tiers). Further, although
FIG. 1 illustrates four tanks 104a-104d on each of the multiple
tiers 102a-102c, this was done for illustration purposes and not
for limiting implementations. For example, each tier 102 may
include less than four tanks or greater than four tanks.
[0016] FIG. 2 illustrates a chassis including a plurality immersion
cooled top-loading computing cartridges, according to one example.
In the example of FIG. 2, chassis 204 includes a plurality of
top-loading computing cartridges 220 inserted into the chassis 204.
Chassis 204 includes a supply inlet 216 on a front side 206 to
direct cooling liquid from the front side 216 to a backside 226,
and a return outlet (not shown) on the backside 226 to expel the
cooling liquid from the chassis 204. As the cooling fluid is
directed from the front side 206 to the back side 226 of the
chassis 204, the computing cartridges 220 are immersed in the
cooling fluid to remove heat generated by the computing cartridges
220.
[0017] In some examples, chassis 204 also includes other devices
260 such as power components that may not be immersed in the
cooling fluid. In other examples, chassis 204 can include switches
280 (or similar devices) that may be immersed in the cooling fluid
and collocated with the computing cartridges 220.
[0018] Computing cartridges 220 can be server cartridges,
microservers, servers and/or other type of electrical component in
which the temperature may be regulated by immersion cooling, for
example. As described above, computing cartridges 220 are
top-loading computing cartridges. Further computing cartridges 220
are hot pluggable into the chassis 204. As used herein,
"hot-pluggable" or "hot-plug" means a computing cartridge 220 can
be inserted or removed from the chassis 204 without disrupting the
operation of another cartridge.
[0019] Accordingly, in some examples, a computing cartridge 220 is
insertable/removable from the chassis (via the top) without
powering down or shutting down any other computing cartridge 220 or
the chassis 204, thereby improving serviceability and reducing
downtime.
[0020] FIG. 3 illustrates a chassis including a plurality of
immersion cooled top-loading computing cartridges where a computing
cartridge is individually insertable and removable from the
chassis, according to one example. In the example of FIG. 3,
computing cartridge 320 is insertable/removable from a slot 302 of
the chassis 204 without disrupting the operation of the chassis 204
and other computing cartridges.
[0021] Computing cartridge 320 can be a server cartridge, a
microserver, a server and/or other type of electrical component in
which the temperature may be regulated by immersion cooling, for
example. Computing cartridge 320 can include additional elements
thereon. For example, computing cartridge 320 can include a first
electronic device 322, second electronic device 324, third
electronic device 326, and fourth electronic device 328 to perform
the functionalities of computing cartridge 320.
[0022] In one example, electronic devices 322, 324, 326, 328 may be
a set of electronic devices configured to optimize performance of a
specific application. By way of illustration, if computing
cartridge 320 is designed to serve as a web server, first
electronic device 322 may serve as a data store (e.g., hard disk,
solid state drive, etc.) on which web content is stored, and
electronic devices 322, 324, and 326 may be processors that receive
and/or respond to incoming requests for system resources.
[0023] The electronic devices 322, 324, 326, 328 of computing
cartridge 320 are immersed into the cooling fluid and cooled as the
cooling fluid flows from the front side 206 (via inlet 216) to the
backside 226 (via an outlet) of the chassis 204. Computing
cartridge 320 is removable from the chassis 204 without disrupting
the operation of other computing cartridges within the chassis 204.
For example, computing cartridge 320 can be powered down and
removed from the slot 302 (via the top of the chassis) while
maintaining power to the other computing cartridges of the chassis
204.
[0024] FIG. 4 is an example of a flowchart illustrating a method
for cooling top-loading computing cartridges by immersion cooling,
according to one example. Method 400 may be implemented, for
example, in the form of executable instructions stored on a
non-transitory computer-readable storage medium and/or in the form
of electronic circuitry.
[0025] Method 400 includes pumping a cooling fluid into a chassis,
where the chassis includes a plurality of top-loading computing
cartridges insertable from a top of the chassis, at 410. For
example, cooling fluid is pumped into chassis 204. A pump may be
included as part of the cooling structure 100 of FIG. 1 or coupled
to the chassis 204. In one example, the cooling fluid may be
stagnant until the pump operates to pump the cooling fluid into the
chassis. In this example, the cooling fluid may remain within the
pump or may be located within the chassis. The pump may enable the
flow of the cooling fluid. In another example, pumping the cooling
fluid into the chassis includes immersing the computing cartridges
within the chassis with cooling fluid.
[0026] Method 400 includes directing the cooling fluid through a
supply inlet on a first side of the chassis, at 420. For example,
by directing the cooling fluid through the supply inlet, the
cooling fluid may flow from the front side to the backside (i.e.,
the opposite side) of the chassis. In this example, the cooling
fluid may be directed across the plurality of computing cartridges
in a horizontal manner.
[0027] Method 400 includes expelling the cooling fluid through a
return outlet on a second side of the chassis, where the plurality
of computing cartridges are immersed in the cooling fluid, at 430.
The second side of the chassis is located opposite from the first
side of the chassis. In this example, the cooling fluid may flow
through the inlet on the first side to the outlet on the opposite
side of the chassis. In some examples, method 400 of FIG. 4
includes additional steps in addition to and/or in lieu of those
depicted in FIG. 4.
[0028] FIG. 5 is an example of a flowchart illustrating another
method for cooling top-loading computing cartridges by immersion
cooling. Method 500 may be implemented, for example, in the form of
executable instructions stored on a non-transitory
computer-readable storage medium and/or in the form of electronic
circuitry.
[0029] Method 500 includes inserting a first computing cartridge
into a first slot without disrupting operation of other computing
cartridges in the chassis, at 510. For example, a computing
cartridge may be inserted into a slot within the chassis without
removing power from the other computing cartridges within the
chassis.
[0030] Method 500 includes receiving a second computing cartridge
from a second slot without disrupting operation of the other
computing cartridges in the chassis, at 520. For example, a
computing cartridge may be powered down and removed from a slot
within the chassis without removing power from the other computing
cartridges within the chassis.
[0031] Method 500 also includes receiving the expelled cooling
fluid at a heat exchanger coupled to the chassis, at 530. For
example, upon expelling the cooling fluid from the chassis, a heat
exchanger may accept the expelled cooling fluid. The heat exchanger
may transfer heat from the cooling fluid to another medium within
the heat exchanger. In this example, the cooling fluid may be
pumped back into the chassis. In this manner, the cooling fluid
remains in a continuous loop from the chassis into the heat
exchanger and back to the chassis. Looping the cooling fluid
through the chassis and the heat exchanger, the chassis includes a
continuous flow of the cooling fluid to regulate the temperature of
the plurality of computing cartridges within the chassis. In some
examples, method 500 of FIG. 5 includes additional steps in
addition to and/or in lieu of those depicted in FIG. 5.
[0032] The techniques described above may be embodied in a
computer-readable medium for configuring a computing system to
execute the method. The computer-readable media may include, for
example and without limitation, any number of the following
non-transitive mediums: magnetic storage media including disk and
tape storage media; optical storage media such as compact disk
media (e.g., CD-ROM, CD-R, etc.) and digital video disk storage
media; holographic memory; nonvolatile memory storage media
including semiconductor-based memory units such as FLASH memory,
EEPROM, EPROM, ROM; ferromagnetic digital memories; volatile
storage media including registers, buffers or caches, main memory,
RAM, etc.; and the Internet, just to name a few. Other new and
obvious types of computer-readable media may be used to store the
software modules discussed herein. Computing systems may be found
in many forms including but not limited to mainframes,
minicomputers, servers, workstations, personal computers, notepads,
personal digital assistants, tablets, smartphones, various wireless
devices and embedded systems, just to name a few.
[0033] In the foregoing description, numerous details are set forth
to provide art understanding of the present disclosure. However, it
will be understood by those skilled in the art that the present
disclosure may be practiced without these details. While the
present disclosure has been disclosed with respect to a limited
number of examples, those skilled in the art will appreciate
numerous modifications and variations therefrom. It is intended
that the appended claims cover such modifications and variations as
fall within the true spirit and scope of the present
disclosure.
* * * * *