U.S. patent application number 15/619264 was filed with the patent office on 2017-09-28 for touch screen panel and fabricating method thereof.
The applicant listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Byeong-Kyu Jeon, Hee-Woong Park.
Application Number | 20170277292 15/619264 |
Document ID | / |
Family ID | 51350921 |
Filed Date | 2017-09-28 |
United States Patent
Application |
20170277292 |
Kind Code |
A1 |
Park; Hee-Woong ; et
al. |
September 28, 2017 |
TOUCH SCREEN PANEL AND FABRICATING METHOD THEREOF
Abstract
A method of making a touch screen panel includes providing a
substrate assembly and a multi-layered film. The substrate assembly
includes a substrate, and first and second sensing electrodes
formed over the substrate. The multi-layered film includes a first
conductive photosensitive layer, a second conductive photosensitive
layer, and an insulation photosensitive layer. The insulation
photosensitive layer has a light sensitivity different from that of
at least one of the first and second conductive photosensitive
layers. The method further includes forming insulators by exposing
and developing the insulation photosensitive layer, and forming
bridges and insulators by exposing and developing the second
conductive photosensitive layer. The substrate assembly and the
multi-layered film are assembled to form the touch panel.
Inventors: |
Park; Hee-Woong; (Yongin-si,
KR) ; Jeon; Byeong-Kyu; (Yongin-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin-si |
|
KR |
|
|
Family ID: |
51350921 |
Appl. No.: |
15/619264 |
Filed: |
June 9, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15204482 |
Jul 7, 2016 |
9696834 |
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15619264 |
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13943697 |
Jul 16, 2013 |
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15204482 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F 3/041 20130101;
G02F 2001/13629 20130101; G06F 3/0445 20190501; G06F 2203/04111
20130101; G06F 3/0443 20190501; G06F 3/0446 20190501; G06F 3/044
20130101; G06F 3/03547 20130101; G02F 1/13338 20130101; G06F
2203/04103 20130101; G02F 2001/136295 20130101; G06F 2203/04107
20130101 |
International
Class: |
G06F 3/041 20060101
G06F003/041; G06F 3/044 20060101 G06F003/044 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 19, 2013 |
KR |
10-2013-0017470 |
Claims
1. A method of making a touch screen panel, comprising: providing a
substrate assembly comprising a substrate and first sensing
electrodes formed over the substrate and extending along a first
direction; providing a multi-layered film comprising a first
conductive photosensitive layer and a second conductive
photosensitive layer, the first conductive photosensitive layer
having a light sensitivity different from that of the second
conductive photosensitive layer; forming second sensing electrodes
extending along a second direction by exposing and developing the
second conductive photosensitive layer; and laminating the
substrate assembly and a multi-layered film comprising the second
sensing electrodes such that the second direction intersects the
first direction when viewed in a thickness direction of the
substrate.
2. The method according to claim 1, wherein the second conductive
photosensitive layer has a light sensitivity higher than that of
the first conductive photosensitive layer.
3. The method according to claim 2, wherein the multi-layered film
further comprises an insulation photosensitive layer between the
first and second conductive photosensitive layers.
4. The method according to claim 3, wherein the insulation
photosensitive layer has the light sensitivity substantially equal
to or higher than that of the first conductive photosensitive layer
and has the light sensitivity lower than that of the second
conductive photosensitive layer.
5. The method according to claim 4, wherein the first conductive
photosensitive layer, the second conductive photosensitive layer,
and the insulation photosensitive layer have the amount of exposure
and development condition different from each other in the
exposure/development processes.
6. The method according to claim 5, wherein each of the first and
second conductive photosensitive layers comprises a photosensitive
film and a nano wire conductive film.
7. The method according to claim 6, wherein the nano wire
conductive film comprises silver nano wires.
8. The method according to claim 7, wherein the multi-layered film
comprises a stack of a first silver nano wire conductive film, a
first photosensitive film, the insulation photosensitive layer, a
second silver nano wire conductive film, and a second
photosensitive film which are sequentially stacked.
9. The method according to claim 1, further comprising exposing the
first conductive photosensitive layer.
10. The method according to claim 1, further comprising connecting
the first conductive photosensitive layer to a ground unit.
11. The method according to claim 7, wherein the multi-layered film
comprises a stack of a first silver nano wire conductive film, a
first photosensitive film, a second photosensitive film, a second
silver nano wire conductive film, and the insulation photosensitive
layer which are sequentially stacked.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATIONS
[0001] This application is a divisional of U.S. patent application
Ser. No. 15/204,482, filed on Jul. 7, 2016, which is a divisional
of U.S. patent application Ser. No. 13/943,697, filed on Jul. 16,
2013, which claims priority to and the benefit of Korean Patent
Application No. 10-2013-0017470, filed on Feb. 19, 2013, in the
Korean Intellectual Property Office, the entire content of which is
incorporated herein by reference.
BACKGROUND
[0002] Field
[0003] The present disclosure relates to a touch screen panel and a
fabricating method thereof.
[0004] Description of the Related Art
[0005] A touch screen panel is an input device capable of inputting
a user's instruction by selecting instruction contents displayed on
a screen of an image display device, or the like, with a human hand
or an object.
[0006] To this end, the touch screen panel is provided on a front
face of the image display device to convert a contact position that
the human hand or the object directly contacts into an electric
signal. Therefore, an instruction content selected at the contact
position is recognized as an input signal.
[0007] The touch screen panel as described above is generally
fabricated by attaching on an outer surface of the image display
device such as a liquid crystal display (LCD) and an organic light
emitting diode (OLED) display. Therefore, the touch screen panel
having a high transparency and a thin thickness has been
demanded.
[0008] In addition, recently, a flexible image display device has
been developed. In accordance with the trend, the touch screen
panel attached on the flexible image display panel has also been
demanded.
[0009] Additionally, the touch screen panel includes the ground
layer formed on one surface thereof, whereby the noise of a display
image generated at time of driving the touch sensor may be
reduced.
[0010] However, when the ground layer is additionally formed, the
entire thickness of the touch screen panel is increased, such that
the flexible characteristics may be deteriorated.
SUMMARY OF CERTAIN INVENTIVE ASPECTS
[0011] An aspect of the present invention provides a touch screen
panel and a fabricating method thereof capable of improving display
quality by forming a ground layer and minimizing an increase in
thickness of the product.
[0012] One embodiment of the present invention provides a method of
making a touch screen panel, including: providing a substrate
assembly comprising a substrate, first sensing electrodes formed
over the substrate and arranged in rows extending along a first
direction, and second sensing electrodes formed over the substrate
and arranged in columns extending along a second direction
intersecting with the first direction, the first sensing electrodes
arranged in each of the rows being connected to each other;
providing a multi-layered film comprising a first conductive
photosensitive layer, a second conductive photosensitive layer, and
an insulation photosensitive layer having a light sensitivity
different from that of at least one of the first and second
conductive photosensitive layers; forming insulators by exposing
and developing the insulation photosensitive layer; forming bridges
and insulators by exposing and developing the second conductive
photosensitive layer; and assembling the substrate assembly and the
multi-layered film multi-layered film comprising the insulators and
the bridges such that each bridge connects two immediately
neighboring second sensing electrodes and each insulator insulates
one of the bridges and the first sensing electrodes.
[0013] The second conductive photosensitive layer has a light
sensitivity substantially equal to or higher than that of the first
conduct photosensitive layer, and the insulation photosensitive
layer may have the light sensitivity higher than that of the second
conduct photosensitive layer.
[0014] The first conductive photosensitive layer, the second
conductive photosensitive layer, and the insulation photosensitive
layer may have the amount of exposure and development condition
different form each other in the exposure/development
processes.
[0015] Each of the first and second conductive photosensitive
layers may comprise a photosensitive film and a nano wire
conductive film.
[0016] The nano wire conductive film may comprise silver nano
wires.
[0017] The multi-layered film may comprise a stack of the first
silver nano wire conductive film, the first photosensitive film,
the second photosensitive film, the silver nano wire conductive
film, and the insulation photosensitive layer which are
sequentially stacked.
[0018] The insulators and the bridges have substantially the same
width, but the bridges have a length longer than that of the
insulators.
[0019] The method may further include aligning the substrate with
the multi-layered film such that the insulators and bridges are
overlapped with connectors connecting the first sensing
electrodes.
[0020] The method may further include exposing of the first
conductive photosensitive layer.
[0021] The method may further include connecting the first
conductive photosensitive layer to a ground unit.
[0022] The second sensing electrodes may be formed over the
substrate to be disposed between the first sensing electrodes and
to be separate from each other.
[0023] The method may further include forming outer wirings over
the substrate to connect the first sensing electrodes and the
second sensing electrodes to an external driving circuit.
[0024] The substrate assembly is divided into an active area and a
non-active area which is disposed at an outer portion of the active
area when viewed in a thickness direction of the substrate, and the
first and second sensing electrodes may be formed in the active
area and the outer wirings may be formed in the non-active
area.
[0025] The substrate may be made of at least one material selected
from the group consisting of polyethylene terephthalate (PET),
polycarbonate (PC), acryl, poly methyl methacrylate (PMMA), a
triacetylcellulose (TAC) film, polyethersulfone (PES), and a
polyimide (P1) film.
[0026] Another embodiment of the present invention provides a
method of making a touch screen panel, including: providing a
substrate assembly comprising a substrate and first sensing
electrodes formed over the substrate and extending along a first
direction; providing a multi-layered film comprising a first
conductive photosensitive layer and a second conductive
photosensitive layer, the first conductive photosensitive layer
having a light sensitivity different from that of the second
conductive photosensitive layer; forming second sensing electrodes
extending along a second direction by exposing and developing the
second conductive photosensitive layer; and laminating the
substrate assembly and a multi-layered film comprising the second
sensing electrodes such that the second direction intersects the
first direction when viewed in a thickness direction of the
substrate.
[0027] The second conductive photosensitive layer may have a light
sensitivity higher than that of the first conductive photosensitive
layer.
[0028] The forming of the multi-layered film may further comprise
an insulation photosensitive layer between the first and second
conductive photosensitive layers.
[0029] The insulation photosensitive layer may have the light
sensitivity substantially equal to or higher than that of the first
conductive photosensitive layer and have the light sensitivity
lower than that of the second conductive photosensitive layer.
[0030] The first conductive photosensitive layer, the second
conductive photosensitive layer, and the insulation photosensitive
layer may have the amount of exposure and development condition
different form each other in the exposure/development
processes.
[0031] Each of the first and second conductive photosensitive
layers may comprise a photosensitive film and a nano wire
conductive film.
[0032] The nano wire conductive film may comprise silver nano
wires.
[0033] The multi-layered film may comprises a stack of the first
silver nano wire conductive film, the first photosensitive film,
the insulation photosensitive layer, the second silver nano wire
conductive film, and the second photosensitive film which are
sequentially stacked.
[0034] The method may further comprise exposing the first
conductive photosensitive layer.
[0035] The method may further comprise connecting the first
conductive photosensitive layer to a ground unit.
[0036] Still another embodiment of the present invention provides a
touch screen panel including: a substrate; first sensing electrodes
formed over the substrate and arranged in rows extending along a
first direction and second sensing electrodes formed over the
substrate and arranged in columns extending along a second
direction intersecting with the first direction, the first sensing
electrodes arranged in each of the rows being connected to each
other; bridges electrically connecting two immediately neighboring
second sensing electrodes arranged along the second direction;
insulators overlapped interposed between the bridges and connectors
electrically connecting the first sensing electrodes; and a ground
layer covering the first and second sensing electrodes and the
bridges, wherein the insulators and the bridges are formed by
exposing and developing an insulation photosensitive layer and a
second conductive photosensitive layer of a multi-layered film
comprising a first conductive photosensitive layer, the second
conductive photosensitive layer, and the insulation photosensitive
layer having a light sensitivity different from that of at least
one of the first and second conductive photosensitive layers.
[0037] The second conductive photosensitive layer may have a light
sensitivity substantially equal to or higher than that of the first
conduct photosensitive layer, and the insulation photosensitive
layer may have the light sensitivity higher than that of the second
conduct photosensitive layer.
[0038] Each of the first and second conductive photosensitive
layers may comprise a photosensitive film and a nano wire
conductive film.
[0039] The multi-layered film may comprise a stack of the first
silver nano wire conductive film, the first photosensitive film,
the second photosensitive film, the second silver nano wire
conductive film, and the insulation photosensitive layer which are
sequentially stacked.
[0040] The first conductive photosensitive layer may be configured
to form the ground layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0041] The accompanying drawings, together with the specification,
illustrate exemplary embodiments of the present invention, and,
together with the description, serve to explain the principles of
the present invention.
[0042] FIG. 1A is a plan view schematically showing an example of a
touch screen panel.
[0043] FIG. 1B is a cross-sectional view taken along a second
direction shown in FIG. 1A.
[0044] FIGS. 2A to 2G are views describing a fabricating method of
the touch screen panel.
[0045] FIGS. 3A to 3E are views describing a fabricating method of
a touch screen panel according to another embodiment of the present
invention.
DETAILED DESCRIPTION OF CERTAIN INVENTIVE EMBODIMENTS
[0046] In the following detailed description, only certain
exemplary embodiments of the present invention have been shown and
described, simply by way of illustration. As those skilled in the
art would realize, the described embodiments may be modified in
various different ways, all without departing from the spirit or
scope of the present invention. Accordingly, the drawings and
description are to be regarded as illustrative in nature and not
restrictive. In addition, when an element is referred to as being
"on" another element, it can be directly on the other element or be
indirectly on the other element with one or more intervening
elements interposed therebetween. Also, when an element is referred
to as being "connected to" another element, it can be directly
connected to the other element or be indirectly connected to the
other element with one or more intervening elements interposed
therebetween. Hereinafter, like reference numerals refer to like
elements.
[0047] Hereinafter, exemplary embodiments of the present invention
will be described in detail with reference to the accompanying
drawings.
[0048] FIG. 1A is a plan view schematically showing an example of a
touch screen panel and FIG. 1B is a cross-sectional view taken
along a second direction the touch screen panel shown in FIG.
1A.
[0049] Referring to FIGS. 1A and 1B, the touch screen panel
according to the exemplary embodiment of the present invention is
configured to include a substrate 10, sensing electrodes 11,
connection patters 11c, insulators IP, bridges BP, outer wirings
15, insulation film IL, and ground layer (GND).
[0050] The substrate 10, which is a window substrate to be provided
on a front surface of the touch screen panel, overlaps with an
image display area of a display unit 30 disposed in a lower end and
may be divided into an active area AA capable of receiving touch
input by having the sensing electrodes 11 formed on one surface
toward the display unit 30 and a non-active area NA which is
disposed at an outer portion of the active area AA and outer
wirings 15 are formed therein. The substrate is divided into the
active area AA and the non-active area NA when viewed in a
thickness direction of the substrate.
[0051] The non-active area NA is a shaded area overlapped with an
image non-display area of the display unit 30 and has a form
enclosing the active area AA on which the image is displayed.
[0052] The substrate 10 has a flexible characteristic and may be
formed of a material having characteristics of transparency, heat
resistance, and chemical resistance. For example, the substrate 10
may be made of at least one material selected from the group
consisting of polyethylene terephthalate (PET), polycarbonate (PC),
acryl, poly methyl methacrylate (PMMA), a triacetylcellulose (TAC)
film, polyethersulfone (PES), and a polyimide (P1) film.
[0053] The sensing electrodes 11 are distributed and disposed in
the active area AA on the substrate 10 and include a plurality of
first sensing electrodes 11a formed to be arranged in rows and to
electrically connect along a first direction D1 and a plurality of
second sensing electrodes 11b distributed in columns and disposed
between the first sensing electrodes 11a so as not to overlap with
the first sensing electrodes 11a when viewed in the thickness
direction, and formed so as to electrically connect along a second
direction D2 intersecting with the first direction D1.
[0054] That is, the first sensing electrodes 11a and the second
sensing electrodes 11b are alternately disposed with each other to
be connected to different directions from each other. For example,
the first sensing electrodes 11a are formed so as to connect along
a row direction (a horizontal direction) to be connected to each of
the outer wirings 15 row by row, and the second sensing electrodes
11b are formed so as to connect along a column direction (a
vertical direction) to be connected to each of the outer wirings 15
column by column. In one embodiment, the row direction is
perpendicular to the column direction. In another embodiment, the
row direction is not perpendicular to the column direction.
[0055] The first sensing electrodes 11a and second sensing
electrodes 11b having the same diamond shape may be disposed in the
same layer and be formed of a transparent electrode material such
as an ITO so that light irradiated from the display unit 30
disposed in the lower portion thereof may be transmitted.
[0056] According to another embodiment of the present invention,
the sensing electrodes 11 may have a stripe shape, and the
material, shape and disposition structure of the sensing electrodes
11 may have variously modified exemplary embodiments.
[0057] The connectors 11c connect the first sensing electrodes 11a
along the first direction D1 and the bridges BP connect the second
sensing electrode 11b along the second direction D2.
[0058] More specifically, the connectors 11c are formed as patterns
directly connected with the first sensing electrode 11a in the same
layer and the bridges BP are formed as patterns separated from the
second sensing electrode 11b, however the bridges BP are
electrically connected to the second sensing electrodes 11b at
upper or lower portion of the second sensing electrodes 11b to
thereby connect the second sensing electrodes 11b in a line unit in
the second direction D2.
[0059] Here, the insulators IP are formed at a portion at which the
first sensing electrodes 11a and second sensing electrodes 11b
intersect with each other, that is, between the connectors 11c and
the bridges BP, to electrically insulate bridges from
connectors.
[0060] In partial embodiment, the connectors 11c are formed of the
transparent electrode material together with the sensing electrodes
11, the bridges BP may be formed of opaque metal material with the
low resistance.
[0061] In the case in which the connectors 11c are formed of the
transparent electrode material, in patterning the transparent
electrode material, the first sensing electrodes 11a and the
connectors 11c are patterned integrally with each other, thereby
making it possible to simplify a manufacturing process.
[0062] The bridges BP are formed of the transparent electrode
material such as the sensing electrodes 11 and the connectors 11c
or the opaque metal material with the low resistance. In this case,
a width, a thickness, a length and the like may be controlled so
that visualization may be prevented.
[0063] In the case in which the bridges BP are formed of the opaque
metal material with the row resistance, in forming the outer
wirings 15 which is disposed in non-active area NA, the bridges BP
are formed simultaneously, thereby making it possible to simplify
the manufacturing process. That is, the bridges BP may be formed of
the same material as the outer wirings 15 in the same layer.
[0064] However, the width is limited so that the visualization may
be prevented, therefore, the width of the bridges BP is formed
narrower than that of the connectors 11c which are formed of the
transparent material.
[0065] In another embodiment, the bridges BP may be inclined in a
diagonal direction so that the visualization may be more
effectively prevented.
[0066] The outer wirings 15 are to connect each of the first
sensing electrodes 11a and second sensing electrodes 11b to an
external driving circuit (not shown) in the line unit along the
first direction D1 and second direction D2. For example, the outer
wirings 15 are electrically connected to the first and second
sensing electrodes 11a and 11b in the row and column units to
connect to the external driving circuit (not shown) such as a
position detection circuit through a pad unit (PAD).
[0067] The outer wirings 15 are disposed in a non-active area at
the outer side of the touch screen panel to avoid the active area
AA on which an image is displayed, and may be formed of the metal
material with the low resistance such as molybdenum Mo, silver Ag,
titanium Ti, copper Cu, aluminum Al, molybdenum/aluminum/molybdenum
Mo/Al/Mo or the like in addition to the transparent conductive
material to be used in order to form the sensing electrodes 11 by a
wider selection of material.
[0068] The ground layer GND is entirely formed on the active area
AA of the touch screen panel to thereby serve to reduce a noise of
the display image generated at the time of driving of the sensing
electrodes 11.
[0069] The ground layer GND is formed of the transparent electrode
material and is electrically connected to a ground unit (not
shown). In addition, the ground layer GND and the sensing
electrodes 11 have the insulation film IL interposed therebetween
to insulate both of the conductive films.
[0070] As described above, in the case of the touch screen panel in
which the ground layer GND is formed in order to increase the
display quality, the entire thickness of the touch screen panel is
increased, such that the flexible characteristics thereof are
deteriorated.
[0071] Therefore, the ground layer GND is formed to use the thin
film type photosensitive film including the silver nanowire
conductive photosensitive layer.
[0072] Particularly, the bridges or the sensing electrodes are
formed by exposing and developing each layer of the multi-layered
film having at least two the silver nanowire conductive
photosensitive layers having the light sensitivity different from
each other stacked therein, thereby making it possible to improve
the flexible characteristics and simplify the fabricating process
of the touch screen panel.
[0073] As a result, an aspect of the present invention provides the
touch screen panel and the fabricating method thereof capable of
improving the display quality, the flexible characteristics, and
the productivity and minimizing the increase in the thickness of
the product.
[0074] The fabricating method of the multi photosensitive film or
multi-layered film and the touch screen panel using the same will
be described with reference to FIGS. 2A to 2E.
[0075] FIGS. 2A to 2G are views describing a fabricating method of
the touch screen panel.
[0076] First, referring to FIG. 2A, a first sensing electrodes 11a
connected along a first direction D1, a second sensing electrodes
11b arranged along a second direction D2 intersecting with the
first direction D2, and connectors 11c which are directly connected
with the first sensing electrodes 11a in the same layer are formed
on a substrate 10. The substrate 10 and the first and second
sensing electrodes 11a and 11b can form a sub-assembly.
[0077] In addition, outer wirings 15 for connecting each of the
first sensing electrodes 11a and the second sensing electrode 11b
with an external driving circuit in the line unit along the first
direction D1 and second direction D2 may further form.
[0078] However, bridges BP for connecting the second sensing
electrodes 11b along the second direction D2 and insulators IP
formed between the connectors 11c and bridges BP do not form in
this sub-assembly.
[0079] In the step shown in FIG. 2A, the insulators IP, the bridges
BP, the insulation film IL, and the ground layer GND are not
formed, but formed using a multi-layered film in the later steps to
be described below.
[0080] As described above, the sensing electrodes 11 may be formed
of a transparent electrode material such as an ITO thereon so that
light may be transmitted. Further, the sensing electrodes 11 may be
formed by performing the patterning by a photolithography process
and an etching process after the conductive material is deposited
on the whole surface of the substrate 10.
[0081] Referring to FIG. 2B, in the multi-layered film 20, a first
conductive photosensitive layer 21, a second conductive
photosensitive layer 22, and an insulation photosensitive layer 23
having a light sensitivity different from each other are
sequentially stacked.
[0082] Here, the second conductive photosensitive layer 22 has the
light sensitivity higher than that of the first conductive
photosensitive layer 21, and the insulation photosensitive layer 23
have a light sensitivity higher than that of the second conductive
photosensitive layer 22.
[0083] The degree of light sensitivity is relatively classified
according to the amount of light irradiation required for hardening
of a photosensitive layer at the time of the exposing process,
wherein the insulation photosensitive layer 23 having the highest
light sensitivity is hardened by a relatively small amount of light
irradiation, and the first conductive photosensitive layer 21
having the lowest light sensitivity is hardened by a relatively
large amount of light irradiation.
[0084] In the embodiment of the present invention, it may be
defined that the first conductive photosensitive layer 21 has low
sensitivity, the second conductive photosensitive layer 22 has
medium sensitivity, and the insulation photosensitive layer 23 has
high sensitivity, for the sake of convenience.
[0085] Generally, since the photosensitive material used in the
photosensitive film, such as a dry film resist and the like, is the
insulation material, the conductive material should be mixed in
order to provide conductivity.
[0086] The first and second photosensitivity layers 21 and 22
having the conductivity may have a photosensitive film and a nano
wire conductive film, respectively. In this case, the insulation
photosensitive layer 23 is made of a pure photosensitive material
that does not include the conductive material.
[0087] When considering thinning effect of the multi-layered film
20, it is preferable that the nano wire conductive film is made of
silver nano wire AgNW.
[0088] In the partial embodiment, in the multi-layered film 20, a
first silver nano wire conductive film 21a, the first
photosensitive film 21b, the second photosensitive film 22a, a
second silver nano wire conductive film 22b, and the insulation
photosensitive layer 23 is sequentially stacked.
[0089] The stacked structure of the multi-layered film 20 may have
various modified examples as needed within the range including at
least two of conductive photosensitive layers.
[0090] The first photosensitive film 21b is made of the low
sensitivity photosensitive material, the second photosensitive film
22a is made of the medium sensitivity photosensitive material, and
the insulation photosensitive layer 23 is made of the high
sensitivity photosensitive material. The light sensitivity may be
decided by the photosensitive material, the mixture ratio, and the
like.
[0091] In addition, each of the photosensitive layers preferably
uses the positive type that the exposed portion may be removed by
developing.
[0092] Therefore, configuring the multi-layered film 20, each of
the first conductive photosensitive layer 21, the second conductive
photosensitive layer 22, and the insulation photosensitive layer 23
have the amount of exposure and development conditions in the
exposure/development processes.
[0093] Referring to FIG. 2C, the insulators IP overlapped with
crossed portion of first sensing electrodes 11a and second sensing
electrodes 11b are formed by exposing and developing the insulation
photosensitive layer 23, which is a top layer of the multi-layered
film 20.
[0094] Specifically, a first exposing process of exposing the
insulation photosensitive layer 23 to ultraviolet (UV) is performed
using a first photo mask PM1 including a first mask pattern MP1
corresponding to an insulator pattern of the insulators IP.
[0095] Here, since the insulation photosensitive layer 23 is the
positive type, the area other than the insulators IP corresponding
to the first mask pattern MP1 is exposed, and then the exposed area
is hardened.
[0096] In addition, the exposing conditions of the first exposing
process correspond to the light sensitivity of the insulation
photosensitive layer 23. In this case, since a low intensity light
for a short time is irradiated, the first conductive photosensitive
layer 21 and the second conductive photosensitive layer 22 having
the light sensitivity lower than that of the insulation
photosensitive layer 23 are not hardened.
[0097] Next, a first developing process using a developing solution
in order to remove the area hardened by the first exposing process
is performed.
[0098] However, the first conductive photosensitive layer 21 and
the second conductive photosensitive layer 22 which are not
hardened by the first developing process are not removed.
[0099] In addition, the development conditions of the first
development process correspond to characteristic (the
photosensitive material and the mixture ratio) of the insulation
photosensitive layer 23. In this case, an influence on the first
conductive photosensitive layer 21 and the second conductive
photosensitive layer 22 having the characteristics different from
each other may be neglected.
[0100] As a result, the insulators IP are formed by performing the
patterning only insulation photosensitive layer 23 of the
multi-layered film 20 by a photolithography process.
[0101] Referring to FIG. 2d, the bridges BP are formed to
electrically connect the second sensing electrodes 11b are formed
along the second direction D2, while being overlapped with the
insulators IP by exposing and developing the second conductive
photosensitive layer 22.
[0102] More specifically, a second exposing process is performed
using a second photo mask PM2 in which a second mask pattern MP2 is
formed corresponding to a bridge pattern of the bridges BP.
[0103] Here, the bridges BP are overlapped with the insulator IP,
but since both end portions thereof are connected to the second
sensing electrodes 11b disposed adjacent to each other, the bridges
BP should be formed so as to have a length longer than that of the
insulator IP.
[0104] Accordingly, the length d2 of the second mask pattern MP2 is
longer than that of the first mask pattern Mp1. However, a width of
both of the mask patterns is substantially the same.
[0105] Since the second conductive photosensitive layer 22 is the
positive type, the area other than the bridges BP corresponding to
the second mask pattern MP2 is exposed, and then the exposed area
is hardened.
[0106] Since the insulators IP on the bridges BP blocks the light
by the second mask pattern MP2, the insulators IP are not hardened
together with the bridges BP.
[0107] In addition, the exposing conditions of the second exposing
process correspond to the light sensitivity of the second
conductive photosensitive layer 22. In this case, the first
conductive photosensitive layer 21 having the light sensitivity
lower than that of the second conductive photosensitive layer 22 is
not hardened.
[0108] However, the exposing conditions of the second exposing
process should be set by considering the slight exposing process
performed on the second conductive photosensitive layer 22.
[0109] Next, a second developing process using a developing
solution in order to remove the area hardened by the second
exposing process is performed.
[0110] Here, the second conductive photosensitive layer 22 is
configured of the second photosensitive film 22a and the second
silver nano wire conductive film 22b coated on the second
photosensitive film 22a. When the exposed area in the second
photosensitive film 22a is removed, the second silver nanowire
conductive film 22b is removed, too.
[0111] That is, the silver nano wire layer is made of the material
that the light is transmitted and has a very fine thickness, such
that the metallic nano wire conductive film coated on the
photosensitive film is patterned during the process of patterning
by the exposing and developing the photosensitive film by the
photolithography process.
[0112] As a result, photosensitive layer portions 22c remaining by
patterning becomes a part of the insulation film IP, and a part of
the second silver nano wire conductive film 22b becomes the bridge
BP.
[0113] Referring to FIG. 2E, the multi-layered film 20 has a
structure in which the bridges BP that the second conductive
photosensitive layer 22 is patterned and the insulators IP that the
insulation photosensitive layer 23 is patterned are formed in
plurality on the entire surface of first conductive photosensitive
layer 21 disposed at the bottom after the two patterning
processes.
[0114] Since the first conductive photosensitive layer 21 needs to
be used as ground layer covering the entire surface of the active
area AA, it is not separately patterned.
[0115] Additionally, a third exposing process may be performed to
entirely expose the multi-layered film 20.
[0116] The third exposing process hardens all the first conductive
photosensitive layer 21, the bridges BP, and insulators IP to
stabilize the material and prevent the bridges and the insulators
from peeling.
[0117] As described above, according to the embodiment of the
present invention, the insulator IP and bridges BP are subjected to
the exposing and developing processes and patterning on the
multi-layered film 20, such that an etching process etching the
patterns will be omitted.
[0118] Referring to FIGS. 2F and 2G, the multi-layered film 20 in
which the insulators
[0119] IP and bridges BP are formed laminates on the substrate 10
in which the sensing electrodes 11 are formed.
[0120] More specifically, the surface in which the bridges and
insulators are formed is arranged to face the surface in which the
sensing electrodes 11 are formed, and the process of compressing
and closely adhering the multi-layered film 20 on the substrate 10
using a heated roller is performed.
[0121] Here, an operation of aligning the position of the substrate
10 and the multi-layered film 20 with each other is further
performed so that the insulators IP and bridges BP are accurately
overlapped with the crossed portion of the first and second sensing
electrodes 11a and 11b, that is, the connectors 11c.
[0122] As described above, since the bridges BP have a length
longer than that of the insulators IP and the silver nano wire
conductive film, which is the bridges BP, is disposed under the
photosensitive layer portions 22c, the bridge BP closely adhered
may provide an electrical interconnecting line to contact to the
second sensing electrode 11b.
[0123] Since the first photosensitive film 21b and the
photosensitive layer portions 22c are made of the insulation
material, the first photosensitive film 21b and the photosensitive
layer portions 22c serve to insulate between the ground layer GND
and the sensing electrodes 11.
[0124] The ground layer GND is the first silver nano wire
conductive film 21a of the multi-layered film 20 and is
electrically connected to a grounding unit (not shown) to maintain
a ground potential.
[0125] Although the present embodiment describes the fabricating
method of the touch screen panel by forming the sensing electrodes
11 on the substrate 10, and forming and patterning the
multi-layered film 20, the present invention is not limited
thereto. That is, a process order may be changed and an additional
process may be added as needed.
[0126] FIGS. 3A to 3E are views describing a fabricating method of
a touch screen panel according to another embodiment of the present
invention.
[0127] In the touch screen panel according to another embodiment of
the present invention, a first sensing electrode 111 and a second
sensing electrode 211 are provided in layer different from each
other, and the second sensing electrode 211, the insulation film IL
and ground layer GND are formed by patterning a multi-layered film
20.
[0128] In addition, the above-mentioned detailed description will
be used to the same components as those of the above-mentioned
embodiment as long as it is opposite to the concept of the present
invention. Therefore, an overlapped description thereof will be
omitted.
[0129] Referring to FIG. 3A, the first sensing electrodes 111 which
extend along the first direction D1 are formed on the substrate
100.
[0130] In addition, outer wirings 150 for connecting each of the
first sensing electrodes 111 and the second sensing electrode 211
with an external driving circuit (not shown) may further be
formed.
[0131] But, the second sensing electrodes 211 which extend along
the second direction D2 which intersect the first direction D1 in
the completed product and the insulators IP formed between the
first sensing electrodes 111 and the second sensing electrodes 211
are not formed during the step illustrated in FIG. 3A.
[0132] In the present step in FIG. 3A, only the first sensing
electrodes are directly formed on the substrate 100 form, the other
configuration to be formed on the first sensing electrodes 111 is
formed using the multi-layered film 200 as described below.
[0133] As described above, the first sensing electrodes 111 may be
formed of a transparent electrode material such as an ITO thereon
so that light may be transmitted. Further, the sensing electrodes
11 may be formed by performing the patterning by a photolithography
process and an etching process after the conductive material is
deposited on the whole surface of the substrate 100.
[0134] In addition, in the embodiment of the present invention, the
sensing electrodes have a straight stripe pattern. However, the
shape of the sensing electrodes may have variously modified
exemplary embodiments, and the present invention is not limited
thereto.
[0135] Referring to FIG. 3B, in the multi-layered film 200, a first
conductive photosensitive layer 210, an insulation photosensitive
layer 220 and a second conductive photosensitive layer 230 having a
light sensitivity different from each other are sequentially
stacked.
[0136] Here, the second conductive photosensitive layer 230 has the
light sensitivity higher than that of the insulation photosensitive
layer 220, and the insulation photosensitive layer 220 has the
light sensitivity higher than that of the first conductive
photosensitive layer 210.
[0137] In the embodiment of the present invention, it may be
defined that the first conductive photosensitive layer 210 has low
sensitivity, insulation photosensitive layer 220 has medium
sensitivity, and the second conductive photosensitive layer 230 has
high sensitivity, for the sake of convenience.
[0138] The first and second conductive photosensitivity layers 210
and 230 having the conductivity may have a structure in which the
photosensitive film and nanowire conductive film are stacked,
respectively. In this case, the insulation photosensitive layer 220
is made of a pure photosensitive material that does not include the
conductive material.
[0139] When considering thinning effect of the multi-layered film
200, it is preferable that the nano wire conductive film is made of
silver nano wire AgNW.
[0140] In the partial embodiment, the multi-layered film 200 may
have the structure in which a first silver nano wire conductive
film 210a, the first photosensitive film 210b, the insulation
photosensitive layer 220, a second silver nano wire conductive film
230a, and the second photosensitive film 230b are sequentially
stacked.
[0141] In this case, the insulation photosensitive layer 220 may be
selectively used. Further, the stack structure of the insulation
photosensitive layer 220 may have various modified examples as
needed within the range including at least two of conductive
photosensitive layers.
[0142] Referring to FIGS. 3C and 3D, the second sensing electrodes
211 which are connected along the second direction D2 intersecting
with the first direction D1 and the insulators IP which are
disposed between the first sensing electrode 111 and the second
sensing electrode 211 to insulate both of the electrodes are formed
by exposing and developing the second conductive photosensitive
layer 230, which is top layer of the multi-layered film 200.
[0143] The second silver nano wire conductive film 230a, which is
one layer configuring the second conductive photosensitive layer
230, is patterned into the second sensing electrode 211, and the
second photosensitive film 230b, which is the other layer, is
patterned into the insulator IP. Since the second sensing
electrodes 211 and the insulators IP are patterned using the same
mask, they have the same shape and size.
[0144] More specifically, an exposing process that the second
conductive photosensitive layer 230 is exposed to ultraviolet (UV)
is performed using the third photo mask PM3 in which the mask
pattern correspond to the second sensing electrode 211 is
formed.
[0145] Here, since the second conductive photosensitive layer 230
is the positive type, the area other than the second sensing
electrodes and the insulators IP corresponding to the mask pattern
is exposed, and then the exposed area is hardened.
[0146] In addition, the exposing conditions of the exposing process
correspond to the light sensitivity of the second conductive
photosensitive layer 230. In this case, since a low intensity light
for a short time is irradiated, the first conductive photosensitive
layer 210 and the insulation photosensitive layer 220 having the
light sensitivity lower than that of the second conductive
photosensitive layer 230 are not hardened.
[0147] Then, a developing process using a developing solution in
order to remove the area hardened by the exposing process is
performed.
[0148] Here, when the exposed area in the second photosensitive
film 230b is removed, the second silver nano wire conductive film
230a coated on the lower surface the second photosensitive film
230b is removed.
[0149] That is, the silver nano wire layer is made of the material
that the light is transmitted and has a very fine thickness, such
that the metallic nano wire conductive film coated on the
photosensitive film is patterned together during the process of
patterning by the exposing and developing the photosensitive film
by the photolithography process.
[0150] Meanwhile, since the first conductive photosensitive layer
210 needs to be used as ground layer GND covering the whole surface
of the active area AA, and the insulation layer 220 needs to be
insulated with the first and second sensing electrodes 111 and 211
while entirely covering the ground layer GND, it is not separately
patterned.
[0151] Additionally, an additional exposing process may be
performed to entirely expose the multi-layered film 200.
[0152] The additional exposing process hardens all patterns of each
layer in the multi-layered film 200 to stabilize the material and
prevent a peeling of the patterns.
[0153] As described above, according to the embodiment of the
present invention, the insulators IP and the second sensing
electrodes 211 are subjected to the exposing and developing
processes and patterning on the multi-layered film 200, such that
an etching process etching the patterns will be omitted.
[0154] Referring to FIG. 3E, the multi-layered film 200 in which
the second sensing electrodes 211 are formed is laminated on the
substrate 100 in which the first sensing electrodes 111 are
formed.
[0155] More specifically, the surface in which the first sensing
electrodes 111 are formed is formed to face the surface in which
the second sensing electrodes 111 are formed and the process of
compressing and closely adhering the multi-layered film 200 on the
substrate 100 using a heated roller is performed.
[0156] The insulators IP are interposed between the first sensing
electrodes 111 and the second sensing electrodes 211 to insulate
both of the electrodes, and the insulation photosensitive layer 220
and the first photosensitive film 210b are buried at a space
between the second sensing electrodes 211 as one insulation film IL
to entirely cover the upper ground layer GND.
[0157] The ground layer GND is the first silver nano wire
conductive film 210a of the multi-layered film 200 and is
electrically connected to a grounding unit (not shown) to maintain
a ground potential.
[0158] As set forth above, with the touch screen panel and the
fabricating method thereof according to the exemplary embodiments
of the present invention, the ground layer is formed using the thin
film type photosensitive film including the silver nanowire
conductive photosensitive layer, thereby making it possible to
minimize the increase in the thickness of the product due to the
forming of the ground layer.
[0159] In addition, the bridges or the sensing electrodes are
formed by exposing and developing each layer of the multi-layered
film having at least two of the silver nanowire conductive
photosensitive layer having the light sensitivity different from
each other stacked therein, thereby making it possible to improve
the flexible characteristics and simplify a fabricating process of
the touch screen panel.
[0160] As a result, an aspect of the present invention can provide
the touch screen panel and the fabricating method thereof capable
of improving the display quality, the flexible characteristics, and
the productivity and minimizing the increase in the thickness of
the product.
[0161] Although the present embodiment describes the fabricating
method of the touch screen panel by forming the first sensing
electrodes 111 on the substrate 100, and forming and patterning the
multi-layered film 200 to form the second sensing electrodes 211,
the present invention is not limited thereto. That is, a process
order may be changed and an additional process may be added as
needed.
[0162] While embodiments of the present invention have been
described in connection with certain exemplary embodiments, it is
to be understood that the invention is not limited to the disclosed
embodiments, but, on the contrary, is intended to cover various
modifications and equivalent arrangements included within the
spirit and scope of the appended claims, and equivalents
thereof.
* * * * *