U.S. patent application number 15/076293 was filed with the patent office on 2017-09-21 for hollow board cooling apparatus.
The applicant listed for this patent is GMA MACHINERY ENTERPRISE CO., LTD. Invention is credited to Chia-Hsi Hsu.
Application Number | 20170268836 15/076293 |
Document ID | / |
Family ID | 59847565 |
Filed Date | 2017-09-21 |
United States Patent
Application |
20170268836 |
Kind Code |
A1 |
Hsu; Chia-Hsi |
September 21, 2017 |
HOLLOW BOARD COOLING APPARATUS
Abstract
A hollow board cooling apparatus is for cooling a formed hollow
board and includes first and second cooling devices, a
coolant-circulating device, and a temperature-controlling unit.
Each of the first and second cooling devices has a main body, a
cooling channel extending through the main body to form inlet and
outlet openings for passage of the hollow board, and a coolant
channel formed in the main body. The coolant-circulating device
introduces a coolant into the coolant channels via coolant inlets,
and retrieves the coolant therefrom via coolant outlets. The
temperature-controlling unit controls the coolant-circulating
device to cool the coolant when the board temperature is higher
than a reference temperature.
Inventors: |
Hsu; Chia-Hsi; (Taichung
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
GMA MACHINERY ENTERPRISE CO., LTD |
Taichung City |
|
TW |
|
|
Family ID: |
59847565 |
Appl. No.: |
15/076293 |
Filed: |
March 21, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B29C 48/9135 20190201;
B29C 48/11 20190201; F28F 27/00 20130101; F28F 3/12 20130101; B29C
48/07 20190201 |
International
Class: |
F28F 27/00 20060101
F28F027/00; F28D 15/00 20060101 F28D015/00 |
Claims
1. A hollow board cooling apparatus adapted for cooling a formed
hollow board which is transported in a transport direction,
comprising: a first cooling device; a second cooling device
disposed downstream of said first cooling device in the transport
direction and spaced-apart from said first cooling device, each of
said first and second cooling devices having a main body that is
substantially board-shaped, a cooling channel that extends through
said main body to form an inlet opening and an outlet opening for
passage of the formed hollow board therethrough, a coolant inlet
that is formed in an outer surface of said main body, a coolant
outlet that is formed in said outer surface of said main body, a
coolant channel that is formed in said main body and that is in
fluid communication with said coolant inlet and said coolant
outlet; a coolant-circulating device introducing a coolant into
said coolant channels of said first and second cooling devices via
said coolant inlets for cooling the formed hollow board, and
retrieving the coolant from said coolant channels via said coolant
outlets for recycling the coolant; and a temperature-controlling
unit configured to generate an upper-limit reference temperature,
to detect a board temperature of a section of the formed hollow
board located between said first and second cooling devices, and to
control said coolant-circulating device to cool the coolant when
the detected board temperature is higher than the upper-limit
reference temperature.
2. The hollow board cooling apparatus according to claim 1, wherein
said temperature-controlling unit includes a temperature detector
for detecting the board temperature of the formed hollow board, and
a comparator that is electrically coupled to said temperature
detector for receiving the detected board temperature therefrom and
that is operable to compare the board temperature with the
upper-limit reference temperature.
3. The hollow board cooling apparatus according to claim 2, wherein
said temperature detector is disposed adjacent to said inlet
opening of said second cooling device.
4. The hollow board cooling apparatus according to claim 1, wherein
said coolant-circulating device is operable to heat the coolant,
and said temperature-controlling unit is operable to further
compare the board temperature with a lower-limit reference
temperature and is operable to drive said coolant-circulating
device to heat the coolant when the board temperature is lower than
the lower-limit reference temperature.
5. The hollow board cooling apparatus according to claim 4, wherein
said temperature-controlling unit is configured to detect a
thickness of the hollow board and is operable to adjust the
upper-limit and lower-limit reference temperatures based on the
detected thickness.
6. The hollow board cooling apparatus according to claim 4, wherein
said temperature-controlling unit is configured to detect a
transporting speed of the hollow board along the transport
direction and is operable to adjust the upper-limit and lower-limit
reference temperatures based on the detected transporting
speed.
7. The hollow board cooling apparatus according to claim 4, wherein
said temperature-controlling unit is configured to detect an
ambient temperature and is operable to adjust the upper-limit and
lower-limit reference temperatures based on the detected ambient
temperature.
8. The hollow board cooling apparatus according to claim 5, wherein
said temperature-controlling unit further includes a reference
temperature-generating module for generating said upper-limit and
lower-limit reference temperatures.
9. The hollow board cooling apparatus according to claim 8,
wherein, for each of said first and second cooling devices, said
coolant inlet and said coolant outlet are respectively formed in
two opposite surface portions of a top surface of said main
body.
10. The hollow board cooling apparatus according to claim 9,
wherein, for each of said first and second cooling devices, said
coolant inlet is disposed away from said coolant-circulating
device, and said coolant outlet is disposed adjacent to said
coolant-circulating device.
Description
FIELD
[0001] The disclosure relates to a cooling apparatus, more
particularly to a hollow board cooling apparatus.
BACKGROUND
[0002] Conventionally, a hollow board formed by an extruder will be
transported by a transporting mechanism to a cooling device for
cooling until a board temperature of the hollow board is lower than
a target temperature. However, a cooling temperature of the cooling
device is usually set to be relatively low and at a constant value
so as to assure that different hollow boards manufactured under
various manufacturing parameters, such as board thickness,
transporting speed, ambient temperature, etc., can be cooled enough
to reach the target temperature. Such setting of the temperature of
the cooling device inevitably results in energy loss and thus
increases the manufacturing costs.
SUMMARY
[0003] Therefore, an object of the disclosure is to provide a
hollow board cooling apparatus that can alleviate at least one of
the drawbacks of the prior art.
[0004] According to the disclosure, a hollow board cooling
apparatus adapted for cooling a formed hollow boa rd which is
transported in a transport direction may be provided. Such a hollow
board cooling apparatus may include a first cooling device, a
second cooling device, a coolant-circulating device, and a
temperature-controlling unit. The second cooling device is disposed
downstream of the first cooling device in the transport direction
and is spaced apart from the first cooling device. Each of the
first and second cooling devices has a main body that is
substantially board-shaped, a cooling channel that extends through
the main body to form an inlet opening and an outlet opening for
passage of the formed hollow board therethrough, a coolant inlet
that is formed in an outer surface of the main body, a coolant
outlet that is formed in the outer surface of the main body, and a
coolant channel that is formed in the main body and that is in
fluid communication with the coolant inlet and the coolant outlet.
The coolant-circulating device introduces a coolant into the
coolant channels of the first and second cooling devices via the
coolant inlets for cooling the formed hollow board, and retrieves
the coolant from the coolant channels via the coolant outlets for
recycling the coolant. The temperature-controlling unit is
configured to generate an upper-limit reference temperature, to
detect a board temperature of a section of the formed hollow board
located between the first and second cooling devices, and to
control the coolant-circulating device to cool the coolant when the
detected board temperature is higher than the upper-limit reference
temperature.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Other features and advantages of the disclosure will become
apparent in the following detailed description of the embodiment
(s) with reference to the accompanying drawings, of which:
[0006] FIG. 1 is a perspective view illustrating an exemplary
embodiment of a hollow board cooling apparatus according to the
disclosure;
[0007] FIG. 2 is a fragmentary sectional view taken along line
II-II of FIG. 1, illustrating the exemplary embodiment; and
[0008] FIG. 3 is schematic block diagram of the exemplary
embodiment illustrating a temperature-controlling unit and a
coolant-circulating device.
DETAILED DESCRIPTION
[0009] Referring to FIGS. 1 to 3, one exemplary embodiment of a
hollow board cooling apparatus, which is adapted for cooling a
formed hollow board 10 transported in a transport direction, is
shown to include a first cooling device 1, a second cooling device
2 disposed downstream of the first cooling device 1, a
coolant-circulating device 3, and a temperature-controlling unit
4.
[0010] As illustrated in FIG. 1, each of the first and second
cooling devices 1, 2 has a main body 11, 21 that is substantially
board-shaped, a cooling channel 14, 24 that extends through the
main body 11, 21 to form an inlet opening 12, 22 and an outlet
opening 13, 23 for passage of the formed hollow board 10 along the
transport direction, a pair of coolant inlets 15, 25 that are
formed in an outer surface of the main body 11, 21, a pair of
coolant outlets 16, 26 that are formed in the outer surface of the
main body 11, 21, and a plurality of coolant channels 17, 27 that
are correspondingly formed in the main body 11, 21 and that are in
fluid communication with the coolant inlets 15, 25 and the coolant
outlets 16, 26, correspondingly. It should be noted that the number
of the coolant inlets 15, 25, of the coolant outlets 16, 26, and of
the coolant channels 17, 27 are not limited herein, that is, to
have one single coolant inlet 15, 25, one single coolant outlet 16,
26, and/or one single coolant channel 17, 27 for each of the first
and second cooling devices 1, 2 may also suffice according to the
present disclosure. In this embodiment, for each of the first and
second cooling devices 1, 2, the coolant inlets 15, 25 and the
coolant outlets 16, 26 are respectively formed in two opposite
surface portions of the top surface of the main body 11, 21.
Moreover, for each of the first and second cooling devices 1, 2,
the coolant inlets 15, 25 are disposed away from the
coolant-circulating device 3, and the coolant outlets 16, 26 are
disposed adjacent to the coolant-circulating device 3 in this
embodiment as shown in FIG. 1.
[0011] The coolant-circulating device 3 may introduce a coolant 31
into the coolant channels 17, 27 of the first and second cooling
devices 1, 2 via the coolant inlets 15, 25 for cooling the formed
hollow board 10, and may retrieve the coolant 31 from the coolant
channels 17, 27 via the coolant outlets 16, 26 for recycling the
coolant 31 along the directions indicated by arrows illustrated in
FIG. 1.
[0012] With reference to FIG. 3, the temperature-controlling unit 4
of this embodiment is configured to generate an upper-limit
reference temperature (T.sub.H), to detect a board temperature of a
section of the formed hollow board 10 located between the first and
second cooling devices 1, 2, and to control the coolant-circulating
device 3 to cool the coolant 31 when the detected board temperature
is higher than an upper-limit reference temperature (T.sub.H). The
temperature-controlling unit 4 may include one or more temperature
detectors 41 (three detectors are shown in FIG. 1) that are
disposed adjacent to the inlet opening 22 of the second cooling
device 2 for detecting the board temperature of the formed hollow
board 10, and a comparator 43 that is electrically coupled to the
temperature detectors 41 for receiving the detected board
temperature therefrom and that is operable to compare the board
temperature with the upper-limit reference temperature (T.sub.H).
In this embodiment, the coolant-circulating device 3 may be
operable to heat the coolant, and the temperature-controlling unit
4 is operable to further compare the detected board temperature
with a lower-limit reference temperature (T.sub.L) and is operable
to drive the coolant-circulating device 3 to heat the coolant 31
when the board temperature is lower than the lower-limit reference
temperature (T.sub.L). It should be noted that, the
temperature-controlling unit 4 of this embodiment may further
include a reference temperature-generating module 42 for generating
the upper-limit and lower-limit reference temperatures (T.sub.H),
(T.sub.L). Such a reference temperature-generating module 42 may be
configured to detect manufacturing parameters of the formed hollow
board 10, such as a thickness of the hollow board 10, a
transporting speed of the hollow board 10 and an ambient
temperature, and to adjust the upper-limit and lower-limit
reference temperatures (T.sub.H), (T.sub.L) based on the
corresponding detected values. It is worth noting that such
manufacturing parameters may be diverse, e.g., the thickness of the
hollow board 10 usually ranges from 2 mm to 10 mm, and the
transporting speed usually ranges from 5 m/min to 15 m/min. In
other words, based on various manufacturing parameters of the
hollow board 10, the upper-limit and lower-limit reference
temperatures (T.sub.H), (T.sub.L) may be adjusted accordingly so as
to be efficient in terms of energy consumption.
[0013] It is also worth noting that, when multiple temperature
detectors 41 are incorporated into the temperature-controlling unit
4, the board temperature detected by each temperature detector 41
may vary. Under such condition, the comparator 43 may perform an
operation on the detected board temperatures to obtain an
equivalent board temperature (T.sub.PP) and compare the equivalent
board temperature (T.sub.PP) with either one or both of the
upper-limit and lower-limit reference temperatures (T.sub.H),
(T.sub.L).
[0014] The hollow board cooling apparatus of the present disclosure
has advantages as follows:
[0015] (1) The temperature-controlling unit 4 may control the
coolant-circulating device 3 to cool the coolant 31 when the board
temperature is higher than the upper-limit reference temperature or
to heat the coolant when the board temperature is lower than the
lower-limit reference temperature, thereby allowing the hollow
board cooling apparatus to be relatively efficient in terms of
energy consumption.
[0016] (2) The temperature-controlling unit 4 may be configured to
detect the board thickness, the transporting speed, and/or the
ambient temperature and to adjust the upper-limit and lower-limit
reference temperatures (T.sub.H), (T.sub.L) based thereon, allowing
the hollow board cooling apparatus of the present disclosure to be
efficient in terms of energy consumption during various
manufacturing processes.
[0017] In the description above, for the purposes of explanation,
numerous specific details have been set forth in order to provide a
thorough understanding of the embodiment(s). It will be apparent,
however, to one skilled in the art, that one or more other
embodiments may be practiced without some of these specific
details. It should also be appreciated that reference throughout
this specification to "one embodiment," "an embodiment," an
embodiment with an indication of an ordinal number and so forth
means that a particular feature, structure, or characteristic may
be included in the practice of the disclosure. It should be further
appreciated that in the description, various features are sometimes
grouped together in a single embodiment, figure, or description
thereof for the purpose of streamlining the disclosure and aiding
in the understanding of various inventive aspects.
[0018] While the disclosure has been described in connection with
what is (are) considered the exemplary embodiment(s), it is
understood that this disclosure is not limited to the disclosed
embodiment(s) but is intended to cover various arrangements
included within the spirit and scope of the broadest interpretation
so as to encompass all such modifications and equivalent
arrangements.
* * * * *