U.S. patent application number 15/616174 was filed with the patent office on 2017-09-21 for method of forming a micro-structure.
The applicant listed for this patent is Hewlett-Packard Development Company, L.P.. Invention is credited to Anthony M. Fuller, Peter Mardilovich, Qingqiao Wei.
Application Number | 20170267520 15/616174 |
Document ID | / |
Family ID | 59855285 |
Filed Date | 2017-09-21 |
United States Patent
Application |
20170267520 |
Kind Code |
A1 |
Mardilovich; Peter ; et
al. |
September 21, 2017 |
METHOD OF FORMING A MICRO-STRUCTURE
Abstract
A method of forming a micro-structure involves forming a
multi-layered structure including i) an oxidizable material layer
on a substrate and ii) another oxidizable material layer on the
oxidizable material layer. The oxidizable material layer is formed
of an oxidizable material having an expansion coefficient, during
oxidation, that is more than 1. The method further involves forming
a template, including a plurality of pores, from the other
oxidizable material layer, and growing a nano-pillar inside each
pore. The nano-pillar has a predefined length that terminates at an
end. A portion of the template is selectively removed to form a
substantially even plane that is oriented in a position opposed to
the substrate. A material is deposited on at least a portion of the
plane to form a film layer thereon, and the remaining portion of
the template is selectively removed to expose the nano-pillars.
Inventors: |
Mardilovich; Peter;
(Cambridge, GB) ; Fuller; Anthony M.; (Corvallis,
OR) ; Wei; Qingqiao; (Corvallis, OR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Hewlett-Packard Development Company, L.P. |
Houston |
TX |
US |
|
|
Family ID: |
59855285 |
Appl. No.: |
15/616174 |
Filed: |
June 7, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13825029 |
Mar 19, 2013 |
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PCT/US2010/053581 |
Oct 21, 2010 |
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15616174 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C25D 11/12 20130101;
B81C 1/00031 20130101; C25D 11/045 20130101; C25D 11/16 20130101;
C25D 11/26 20130101; Y10S 977/888 20130101; Y10T 428/24355
20150115; B81B 2203/0361 20130101; C25D 11/022 20130101; C25D 11/10
20130101; C25D 11/08 20130101; C25D 11/24 20130101; Y10S 977/856
20130101 |
International
Class: |
B81C 1/00 20060101
B81C001/00; B81B 3/00 20060101 B81B003/00; C25D 1/00 20060101
C25D001/00; C25D 11/02 20060101 C25D011/02; C25D 11/04 20060101
C25D011/04; C25D 11/08 20060101 C25D011/08; C25D 11/10 20060101
C25D011/10; C25D 11/18 20060101 C25D011/18; C25D 11/26 20060101
C25D011/26 |
Claims
1. A method of forming a micro-structure, comprising: forming a
multi-layered structure including i) an oxidizable material layer
established on a substrate and ii) an other oxidizable material
layer established on the oxidizable material layer, the oxidizable
material layer being formed of an oxidizable material having an
expansion coefficient, during oxidation, that is more than 1;
forming a template from the other oxidizable material layer, the
template including a plurality of pores; growing a nano-pillar
inside each of the plurality of pores, wherein the nano-pillar has
a predefined length that terminates at an end; selectively removing
a portion of the template to form a substantially even plane that
is oriented in a position opposed to the substrate; depositing a
material on at least a portion of the substantially even plane to
form a film layer; and selectively removing a remaining portion of
the template to expose the plurality of nano-pillars.
2. The method as defined in claim 1 wherein the forming of the
template and the growing of the nano-pillars are accomplished via
anodization using any of oxalic acid, sulfuric acid, phosphoric
acid, chromic acid or mixtures thereof as an electrolyte.
3. The method as defined in claim 1 wherein the forming of the
plurality of pores in the other oxidizable material layer is
accomplished by anodizing the other oxidizable material layer, and
wherein the growing of the nano-pillars is accomplished by
anodizing the oxidizable material layer.
4. The method as defined in claim 3, further comprising tuning at
least one of a height, a pitch, a diameter, or an aspect ratio of
each of the nano-pillars by adjusting at least one parameter of an
anodizing process used to grow the nano-pillars.
5. The method as defined in claim 4 wherein the adjusting further
tunes a gap between adjacent nano-pillars.
6. The method as defined in claim 1 wherein prior to selectively
removing the remaining portion of the template, the method further
comprises selectively patterning the film layer to remove a portion
of the film layer from the substantially even plane.
7. The method as defined in claim 1 wherein prior to selectively
removing the remaining portion of the template, the method further
comprises selectively patterning the film layer, the nano-pillars,
and the pores to form a micro-cluster.
8. The method as defined in claim 1, further comprising controlling
a mass of the micro-structure by adjusting at least one of a
thickness of the film layer or a lateral area of the film
layer.
9.-15. (canceled)
16. A micro-structure, comprising: a substrate; a non-oxidized
portion of an oxidizable material layer formed on the substrate; an
oxide layer formed on the non-oxidized portion and from the
oxidizable material layer; metal oxide nano-pillars extending from
the oxide layer and formed from the oxidizable material layer,
wherein each of the plurality of nano-pillars has a length that
terminates at an end such that the plurality of nano-pillars ends,
together, defines a substantially even plane oriented in a position
that is opposed to the substrate; an empty space separating each
nano-pillar from each adjacent nano-pillar; and a film layer formed
on at least a portion of the substantially even plane; wherein
matter larger than the respective spaces between the adjacent
nano-pillars is to be selectively removed from a gas stream
directed to flow laterally through the nano-pillars.
17. The micro-structure as defined in claim 16, further comprising
a gas sensor in operative communication with the
micro-structure.
18. The micro-structure as defined in claim 16 wherein the film
layer has a thickness ranging in size from about 10 nm to about 5
.mu.m.
19. The micro-structure as defined in claim 16 wherein the film
layer has a thickness ranging in size from about 20 nm to about 500
.mu.nm.
20. The micro-structure as defined in claim 16 wherein the
nano-pillars comprise an amorphous oxide material.
Description
BACKGROUND
[0001] The present disclosure relates generally to methods of
forming a micro-structure.
[0002] Porous anodic oxide structures may be used in a variety of
applications including, but not limited to, micro- and
nano-electronics (such as, e.g., in planarized aluminum
interconnections, precision thin-film resistors, thin-film
capacitors, and nano-structured field-emission cathodes),
electrostatic and thermo-activated switching devices, LC
high-frequency oscillators, AC amplifiers, triggers and other logic
vacuum integrated circuits (VICs), gas micro- and nano-sensors,
micro- and nano-channel plates, mesoscopic engines,
wavelength-sensitive filters, reflective and absorbing surfaces,
membranes, nozzles, precision apertures, and/or like. These anodic
oxide structures may also include one or more arrays of nano-pores
that are used, for example, to form structures having one or more
arrays of nano-pillars formed on and supported by a substrate. In
some cases, the structures may be insensitive to vibration (i.e.,
brittle). This may be due, at least in part, to a lack of internal
structural flexibility of the structures themselves.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] Features and advantages of embodiments of the present
disclosure will become apparent by reference to the following
detailed description and drawings, in which like reference numerals
correspond to similar, though perhaps not identical, components.
For the sake of brevity, reference numerals or features having a
previously described function may or may not be described in
connection with other drawings in which they appear.
[0004] FIGS. 1A through 1I together schematically depict an
embodiment of a method of forming an embodiment of a
micro-structure;
[0005] FIG. 1A through 1G, 1J, and 1K together schematically depict
another embodiment of the method of forming another embodiment of a
micro-structure;
[0006] FIG. 2A is a schematic three-dimensional representation of
the porous anodic alumina template prior to complete anodization of
the aluminum;
[0007] FIG. 2B is a top view of the example of the anodic alumina
template of FIG. 2A;
[0008] FIG. 2C is a scanning electron micrograph (SEM) image
showing a cross section of an anodic alumina template after about
30 minutes of etching;
[0009] FIG. 3 is a schematic side view of an example of a master
that can be used to form an embodiment of an anodic alumina
template;
[0010] FIGS. 4A through 4D are scanning electron micrograph (SEM)
images of a top view (FIG. 4A), a cross-section (FIG. 4B), another
top view at a higher magnification than that shown in FIG. 4A (FIG.
4C), and a tilted view (FIG. 4D) of a micro-structure including
nano-pillars having a diameter of about 65 nm and a gap between
adjacent nano-pillars of about 105 nm;
[0011] FIGS. 5A through 5D are SEM images of a top view (FIG. 5A),
a cross-section (FIG. 5B), another top view at a higher
magnification than that shown in FIG. 5A (FIG. 5C), and a tilted
view (FIG. 5D) of a micro-structure including nano-pillars having a
diameter of about 30 nm and a gap between adjacent nano-pillars of
about 50 nm;
[0012] FIGS. 6A through 6D are SEM images of a top view (FIG. 6A),
a cross-section (FIG. 6B), another top view at a higher
magnification than that shown in FIG. 6A (FIG. 6C), and a tilted
view (FIG. 6D) of a micro-structure including nano-pillars having a
diameter of about 15 nm and a gap between adjacent nano-pillars of
about 25 nm;
[0013] FIG. 7 is a top view schematically depicting an example of a
micro-structure formed according to the embodiment of the method
described in conjunction with FIGS. 1A through 1G, 1J, and 1K;
[0014] FIG. 8 schematically depicts another example of a
micro-structure that may be used for micro- or nano-filtration;
[0015] FIG. 9 is a SEM image of an example of a micro-structure
being used as a filter for latex ink particles; and
[0016] FIG. 10 is a schematic diagram of another embodiment of the
micro-structure of FIG. 1K used as a filter for gas filtration and
sensing.
DETAILED DESCRIPTION
[0017] Embodiment(s) of the method disclosed herein may be used to
form a micro-structure having an internal structure that is
flexible enough so that the micro-structure may suitably be used as
a shock absorber, a sensor, and/or the like. Devices made with or
incorporating the micro-structure disclosed herein are considered
to be robust, at least in part because of the built in shock
absorbing property of the nano-structure. This is due, at least in
part, to the fact that the weakest part of the structure, i.e., the
nano-pillars, are built from amorphous oxide (i.e., no
microcrystals with grain boundaries) and are built from the same
material as the underlying support (i.e., no interfaces are present
between the nano-pillars and the underlying dense oxide). As such,
when exposed to external forces (e.g., mechanical pressure) the
nano-pillars bend rather than break.
[0018] The micro-structure disclosed herein may include components
that are on the micro-scale (i.e., from 1 .mu.m to 1000 .mu.m) and
components that are on the nano-scale (i.e., from 1 nm to 1000 nm).
In some cases, the micro-structure may also be used as a micro- or
nano-fluidic device. As used herein, a "microfluidic device" refers
to a device for capturing or separating micrometer-sized or smaller
particulates within a fluid sample, whereas a "nanofluidic device"
refers to a device for capturing or separating nanometer-sized or
smaller particulates within a fluid sample. Examples of micro- or
nano-fluidic devices include lab-on-a-chip devices, devices for the
detection of an analyte, filtration devices, and/or devices for
separation of fluidic media.
[0019] Briefly, the micro-structure formed by embodiment(s) of the
method disclosed herein includes a plurality of micro-islands
supported by a set of nano-pillars. As used herein, a
"micro-island" is a dense or non-porous film or layer established
on a pre-designated set of nano-pillars. The combination of the
micro-island and the set of nano-pillars upon which the
micro-island is formed may be referred to herein as a
"micro-cluster". In some instances, the term micro-cluster may be
used interchangeable with the term "multi-legged table
structure".
[0020] One example of the micro-structure is identified by
reference numeral 100 shown in FIG. 1I, another example of the
micro-structure is identified by 100' shown in FIG. 1K, and still
other examples of the micro-structure are identified by 100'' and
100''' are shown, respectively, in FIGS. 8 and 10. It is to be
understood that the embodiment(s) of the method may be used to
selectively control the placement of each nano-pillar in the
micro-structures 100, 100', 100'', 100''' so that each nano-pillar
is substantially uniformly spaced from an adjacent nano-pillar
and/or each set of nano-pillars (e.g., for a micro-cluster) is
substantially uniformly spaced from an adjacent set of
nano-pillars. In other words, the size of a gap formed between
adjacent nano-pillars or sets of nano-structures may be selectively
controlled. In instances where the nano-structure is used as a
micro- or nano-filter, the controlled size of the gap at least
between adjacent nano-pillars advantageously improves the
selectivity of the device. Furthermore, the nano-structures 100,
100', 100'', 100''' enable micro- or nano-filtration of fluidic
media in a vertical direction (see, e.g., FIG. 8) or in a lateral
direction (see, e.g., FIG. 10). Vertical filtration enables the
filtrate to reach a substrate surface relatively quickly. This may
be desirable when the substrate surface is a sensing surface.
Lateral filtration provides a path for effective separation. The
embodiments of the structure 100, 100', 100'', 100''' can improve
both the selectivity and efficiency of the filtration process.
[0021] The embodiment(s) of the method may also be used to control
other properties of the nano-pillars. The geometry and/or
dimensions of the nano-pillars (such as their height, diameter,
shape, etc.) may be controlled by adjusting one or more parameters
of the anodizing process employed in the instant methods. The
process(es) used for controlling the property/ies of the
nano-pillars will be described in further detail below. In one
example, the geometry of the nano-pillars may be controlled so that
the nano-pillars each have a uniform aspect ratio (where the
difference between nano-pillars does not exceed 10%). This imparts
at least some flexibility to the micro-structures 100, 100', 100'',
100''' so that the micro-structures 100, 100', 100'', 100''' can be
used as shock absorbers. The control allowed throughout the
processes disclosed herein enables process uniformity and
reproducibility at least up to the wafer level.
[0022] One embodiment of the method of forming the nano-structure
100 (depicted in FIG. 1I) is schematically depicted in FIGS. 1A
through 1I, while another embodiment of the method of forming the
micro-structure 100' (depicted in FIG. 1K) is schematically
depicted in FIGS. 1A through 1G, 1J, and 1K. As mentioned above,
still another embodiment of forming the micro-structure 100'''
(depicted in FIG. 10) is described below in conjunction with FIG.
10. The micro-structures 100, 100', 100'', 100''' formed by the
embodiments of the instant method may, in some instances, be planar
structures that, as mentioned above, may be used as shock
absorbers, sensors, and/or the like. In some cases, as also
mentioned above, the micro-structures 100, 100', 100'', 100''' may
also be used as micro- or nano-filters for liquid
filtration/separation. The micro-structures 100, 100', 100'',
100''' may also be used for gas filtration/separation, such as, for
example, when portions of the nano-structures 100, 100', 100'' are
exposed to air, it may be desirable to filter out particles from
the air that should not reach a sensor (see, e.g., FIG. 5 discussed
further hereinbelow). It is to be understood, however, that the
micro-structures 100, 100', 100'', 100''' may also be used for
other applications, such as for actuators, pumps, or for delivery
of small and discrete quantities of liquid to a particular
location, for example, via a capillary effect (where liquid is
sucked into spaces between the pillars when the surface properties
(e.g., surface tension, contact angle, etc.) of the pillars are
aligned with the properties of the liquid).
[0023] Referring now to FIG. 1A, the method of forming the
nano-structure 100 includes forming a multi-layered structure 10
that contains i) an oxidizable material layer 14 established on a
substrate 12, and ii) another oxidizable material layer 16
established on the oxidizable material layer 14. The multi-layered
structure 10 may be formed, for example, by depositing an
oxidizable material on the substrate 12 to form the oxidizable
material layer 14 having a thickness, and then depositing another
oxidizable material on the oxidizable material layer 14 to form the
other oxidizable material layer 16, which also has a thickness. In
one embodiment, the oxidizable material layer 14 is formed of a
metal or metal alloys that forms a dense oxide after
electrochemical oxidation and the other oxidizable material layer
16 is formed of a metal or metal alloy that forms a porous oxide
after electrochemical oxidation. Examples of suitable materials
will be discussed further hereinbelow.
[0024] The layers 14, 16 have respective thicknesses that may be
different or may be substantially the same. In one embodiment, the
thickness of each of the layers 14, 16 ranges from about 10 nm to
about 10 .mu.m. The layer 14 may have any suitable thickness that
will produce (during electrochemical oxidation) enough oxide to
form the nano-pillars 20. In an example, the thickness of the oxide
grown from the layer 14 (i.e., the structure 14', the nano-pillars
20, and the cap layer 22) is determined by multiplying the
anodization voltage by an anodization coefficient (i.e., the number
of nanometers that the oxide grows per one volt of anodization
voltage). For instance, for a Ta layer 14, about 1.8 nm of
Ta.sub.2O.sub.5 grows per volt of anodization voltage applied to
the layer 14 to form a dense Ta.sub.2O.sub.5 film. In another
instance, from about 1.3 nm to about 1.8 nm of Ta.sub.2O.sub.5
grows per volt of anodization voltage applied to the layer 14 to
form nano-pillars with an underlying dense Ta.sub.2O.sub.5 film. In
the latter instance (i.e., when there is a dense Ta.sub.2O.sub.5
film beneath the nano-pillars), the anodization coefficient
depends, at least, on the diameter of the pores in the template
16', the overall porosity of the template 16', the nature of the
electrolyte used for Ta anodization, and the current density during
Ta anodization.
[0025] The thickness of the Ta layer 14 should be thick enough to
produce a Ta.sub.2O.sub.5 layer having any desired thickness and,
in some cases, to maintain some of the Ta layer 14 on the substrate
12 underneath the formed nano-pillars 20 and the dense portion of
Ta.sub.2O.sub.5 (i.e., 14'). For example, to produce a dense
Ta.sub.2O.sub.5 layer with no nano-pillars, the total thickness of
the Ta layer 14 may be calculated by i) multiplying the completed
anodization voltage (i.e., the specific voltage at which the oxide
thickness reaches a steady state value) by 1.8 nm of
Ta.sub.2O.sub.5 growth per volt to determine the thickness of
Ta.sub.2O.sub.5 that grows, and ii) then dividing that number by
the expansion coefficient (i.e., the ratio of Ta.sub.2O.sub.5 to
consumed Ta), which is 2.3. For instance, if an anodization voltage
of 200 V is used and 1.8 nm of Ta.sub.2O.sub.5 grows per volt
(which produces about 360 nm of Ta.sub.2O.sub.5), and the expansion
coefficient is 2.3, then the thickness of the Ta layer 14 is about
160 nm. In instances where nano-pillars, with an underlying dense
Ta.sub.2O.sub.5 film, are grown from the Ta layer 14, the thickness
of the Ta layer 14 is based, at least in part, on the volume of
Ta.sub.2O.sub.5 (which depends, at least in part, on the fraction
of pillars in the entire stack, as well as their filling factor,
i.e., pillar density) and the anodization coefficient (which
depends, at least in part, on the electrolyte used and the
anodization conditions, and is from about 1.3 nm to about 1.8 nm
per volt for tantalum). The following is an example of how the Ta
layer thickness is calculated when it is desirable to form both
nano-pillars and the underlying dense layer. In this example, the
nano-pillars with an underlying dense Ta.sub.2O.sub.5 layer are
fabricated at 200 V. The height of pillars is 240 nm and the dense
layer is 50 nm. The anodization coefficient is 1.45 nm/V. The
pillar filling factor (or pillars density) is around 25%. In this
example, nano-pillars of 240 nm are equivalent to 60 nm of dense
Ta.sub.2O.sub.5, and thus there is a total of 110 nm of dense
Ta.sub.2O.sub.5 that will be formed. In order to generate 110 nm of
dense Ta.sub.2O.sub.5, at least about 50 nm of Ta is used in layer
14 (i.e., 110/2.3.apprxeq.47.8). In other examples, these
calculations may be performed assuming that the overall density of
the nano-pillars is about 90%.
[0026] The thickness of the layer 16, on the other hand, should be
thick enough to form a template 16' (see FIG. 1B) that has a height
that greater than the height of the nano-pillars 20 to be grown
from the layer 14. In one example, the layer 16 has a thickness of
100 nm or less. In another example, the layer 16 has a thickness of
50 nm or less. In still another example, the thickness of the
template 16' is about the thickness of the layer 16 times the
expansion coefficient (e.g., about 1.3, which is the ratio between
the thickness of the porous anodic alumina and the thickness of the
aluminum layer 16 consumed).
[0027] In an example, each of the layers 12, 14 are planar (e.g.,
are substantially flat and may include, if any, a minimal amount of
irregularities). In another example, one or more of the layers 14,
16 are non-planar. In this example, the non-planar layer(s) 14, 16
may also include a special morphology, features, structures, and/or
the like that are etched into or incorporated into the layers 14,
16. The planar or non-planar layers 14, 16 may be deposited on a
planar or non-planar substrate 12, which will be described further
below.
[0028] The deposition of the oxidizable material on the substrate
12 and the deposition of the other oxidizable material on the
oxidizable material layer 14 may be accomplished using any suitable
deposition technique known in the art. Some examples of suitable
deposition techniques include physical vapor deposition (PVD) (such
as, e.g., sputtering, thermal evaporation, and/or pulsed laser
deposition), atomic layer deposition (ALD), or, in some instances,
chemical vapor deposition (CVD).
[0029] The substrate 12 upon which the oxidizable material is
deposited to form the layer 14 may be chosen based, at least in
part, on the application for which the micro-structure 100 will
ultimately be used. If, for example, the micro-structure 100 is to
be used for semiconductor applications, the substrate 12 may be
chosen from suitable support structures for semiconductors such as,
e.g., a substantially planar silicon wafer. By "substantially
planar", it is meant that the surface is flat but may contain some
irregularities. In this example, the substrate 12 may have formed
thereon a layer of insulating material (not shown) such as, e.g.,
silicon oxide or silicon nitride. The substrate 12 may also or
otherwise be a non-planar structure, e.g., the substrate 12 may
have a special morphology etched on or fabricated into the
substrate 12. The substrate 12 may also be chosen from other
materials such as, e.g., glass, quartz, alumina, stainless steel,
plastic, and/or the like, and/or combinations thereof. In instances
where the micro-structure 100 is used as a filter, the substrate 12
may be chosen from a silicon wafer having a thermally grown oxide
(TOX) layer thereon, such as TOX/Si or SiO.sub.2/Si. In an example,
TOX/Si may be formed by oxidizing Si at a high temperature (i.e.,
from about 800.degree. C. to about 1200.degree. C.) using water
vapor (steam) or molecular oxygen as the oxidant. In other words,
TOX/Si may be formed via dry or wet oxidation, and the TOX/Si oxide
layer may be referred to as a high temperature oxide layer. In some
cases, a dry oxygen atmosphere produces a higher quality SiO.sub.2,
but the process itself is relatively slow. For thicker TOX/Si
layers (i.e., a thickness of about 0.5 .mu.m to about 4 .mu.m or
more), oxidation of the Si in a wet oxygen atmosphere is desirable.
Other examples of TOX include, but are not limited to, SiN, SiC,
TEOS (which is SiO.sub.2, but is prepared using a chemical vapor
deposition (CVD) method from tetra-ethyloxy-silane (i.e.,
tetra-ethyl-ortho-silicate)), or the like.
[0030] The oxidizable material for the oxidizable material layer 14
is a conductor and may be chosen from a material that i) can be
electrochemically oxidized and ii) has an expansion coefficient,
during oxidation, that is more than 1. In some cases, the
oxidizable material for the layer 14 may also or otherwise be
thermally oxidized. In one embodiment, the oxidizable material
layer 14 includes a material having an expansion coefficient that
is more than 1. Without being bound to any theory, it is believed
that an expansion coefficient of more than 1 allows the oxidizable
material to squeeze into the pores 18 of the template 16' (which
will be described in further detail below). It is further believed
that the height of the nano-pillars 20 that are formed may, at
least partially, be based on the expansion coefficient of the
material in the layer 14. In an example, a nano-pillar 20 height
ranging from about 10 nm to 1000 nm may be achieved when the
expansion coefficient of the oxidizable material in layer 14 is
more than 1. It is to be understood that the height of the
nano-pillars 20 (including the thickness of structure 14') may also
be based, at least in part, on other factors including the
anodization voltages used during the respective anodization of
layers 16 and 14. Further details about the height of the
nano-pillars 20 will be described below. Some examples of suitable
oxidizable materials include tantalum (which has an expansion
coefficient for thermal oxidation of 2.3, as mentioned above),
titanium (which has an expansion coefficient for thermal oxidation
of 1.7), niobium (which has an expansion coefficient for thermal
oxidation of 2.7), and tungsten (which has an expansion coefficient
for thermal oxidation of 3.3). It is to be understood that the
expansion coefficient for thermal oxidation for each of the
foregoing materials is substantially the same as that for
electrochemical oxidation so long as the phase of each of these
materials during oxidation is the same.
[0031] The other oxidizable material for the other oxidizable
material layer 16 is also a conductor, but is chosen from a metal
or metal alloy that, after electrochemical oxidation, produces a
porous oxide. One example of the other oxidizable material includes
aluminum or aluminum alloys, such as an aluminum alloy having
aluminum as the main component. It is further to be understood that
silicon, titanium, tantalum, niobium, and tungsten in the aluminum
alloy may be present in small quantities such as, e.g., up to about
5%. Another example of the other oxidizable material includes
titanium, where such material may be oxidized using an appropriate
electrolyte and anodization conditions to ultimately produce a
porous oxide. In still another embodiment, the material layer 16
may be formed of silicon. When silicon is selected, field assisted
anisotropic etching of silicon may take place in the presence of an
HF-based electrolyte to create a porous silicon template, which is
then oxidized to form a porous silicon dioxide template. It is
believed that the layer 14 can still be anodized in the desirable
manner when porous silicon dioxide is used as the template 16'. In
yet another example, it is believed that the silicon may be
transformed into Si.sub.xN.sub.y, which is not an oxide but is a
dielectric and may be used as a template for Ta.sub.2O.sub.5
nano-pillar growth.
[0032] The oxidizable material forming the oxidizable material
layer 14 and the other oxidizable material forming the other
oxidizable material layer 16 are substantially pure. As used
herein, the term "substantially pure" refers to a material (such as
a metal or a metal alloy) having a minimal amount, if any,
impurities present therein. In an example, a substantially pure
metal may be one that includes at least 95% of the metal. In some
cases the substantially pure metal includes about 100% metal, and
thus practically no impurities. In these cases, the metal may be
referred to as a substantially pure metal, a pure metal, or just a
metal. In an example, the substantially pure metal has at least
about a 99.9% (e.g., often expressed as 3N), and in some cases at
least about 99.99% purity (e.g., often expressed as 4N). It is to
be understood that, in some instances, the oxidizable material
and/or the other oxidizable material may be a metal alloy.
[0033] For purposes of illustration, the methods depicted in the
FIG. 1 series will now be described using tantalum as the
oxidizable material in the oxidizable material layer 14, and
aluminum as the oxidizable material in the other oxidizable
material layer 16. As such, in reference to FIGS. 1A through 1K,
the layer 14 will be referred to as the tantalum layer 14, and the
layer 16 will be referred to as the aluminum layer 16. However, as
previously noted, the layers 14 and 16 are not to be construed as
being limited to being formed of tantalum and aluminum,
respectively, but can be any of the oxidizable materials listed
herein for the respective layers 14, 16.
[0034] After the multi-layered structure 10 is formed, a template
16' is formed out of the aluminum layer 16, as shown in FIG. 1B. In
one embodiment, the template 16' is formed by anodizing the
aluminum layer 16. Anodization refers to the oxidation of less than
the entire thickness of the layer being anodized. It is to be
understood that enough of the aluminum layer 16 is anodized to form
the desired template 16', which includes a plurality of pores 18
defined therein and a barrier layer B of alumina that defines the
bottom of each pore 18. As illustrated in FIG. 1 B, after template
16' formation, there is some remaining non-anodized aluminum 16
(e.g., the pyramids of aluminum 16).
[0035] Referring back to FIG. 1B, anodization of the aluminum layer
16 to form the template 16' may be accomplished by employing the
aluminum layer 16 as the anode of an electrolytic cell and
selecting at least one of H.sub.2SO.sub.4 (sulfuric acid),
H.sub.3PO.sub.4 (phosphoric acid), C.sub.2H.sub.2O.sub.4 (oxalic
acid), or H.sub.2CrO.sub.4 (chromic acid) as the electrolyte. These
electrolytes form porous alumina rather than dense alumina. The
electrolyte may be present in a water based solution. In one
embodiment where the electrolyte is oxalic acid
(C.sub.2H.sub.2O.sub.4), the electrolyte may be present, in
solution with water, at a wt % ranging from about 1 wt % to about 5
wt %. In another embodiment where the electrolyte is
H.sub.2SO.sub.4, the electrolyte may be present, in solution with
water, at a vol % ranging from about 5 vol % to about 40 vol %. In
some instances, certain additives (e.g., an alcohol, a surfactant,
etc.) may also be added to the electrolyte solution. It is to be
understood that the concentration of electrolyte in solution and
the other conditions may vary as long as they are suitable for
porous anodization (i.e., the formation of the porous template
16'). Any suitable cathode may be used, for example, aluminum or
platinum (e.g., foil or mesh). A suitable amount of voltage and
current is then applied to the electrolytic cell for an amount of
time to anodize the aluminum layer 16 (i.e., where the anodized
portion of the aluminum layer 16 is oxidized). The anodization of
the aluminum layer 16 forms porous anodic aluminum oxide (i.e.,
porous anodic alumina), and allows the alumina to grow to a desired
thickness.
[0036] The porous template 16' is shown in FIG. 1B. It is to be
understood that the pores 18 at this point in the process do not
extend through to, and expose, the underlying tantalum layer 14.
The size of the pores 18 formed during anodization may be
controlled through the selection of the electrolyte and the
anodization conditions. For instance, for an alumina template, the
diameter D of a cell 17 is about 2.8 nm per volt (e.g., when Al is
used for layer 16), and the diameter d of the pore 18 depends on
the electrolyte and the current density. In one embodiment, the
diameter d of the pore 18 is proportional to the voltage used. The
ratio of the cell diameter and the pore diameter (D/d) is, for
example, 3.3 for a H.sub.2CrO.sub.4 electrolyte, 4.9 for a
H.sub.2SO.sub.4 electrolyte, 3.0 for a H.sub.2C.sub.2O.sub.4
electrolyte, and between 1.7 and 2.1 for a H.sub.3PO.sub.4
electrolyte. As some examples, pores of the following sizes may be
obtained using the following electrolytes: pores having about 20 nm
diameters may be obtained using H.sub.2SO.sub.4 as the electrolyte,
pores having about 40 nm diameters may be obtained using
C.sub.2H.sub.2O.sub.4 as the electrolyte, and pores having about
120 nm may be obtained using H.sub.3PO.sub.4 as the electrolyte.
The size of the pores 18 may also be controlled via anisotropic
etching after anodization is complete. This etching process further
defines the already formed pores 18, and in many instances
increases the diameter of the formed pores 18. Anisotropic etching
may be performed using diluted phosphoric acid (5 vol. %), a
solution of H.sub.2SO.sub.4 (20 vol. %), or a diluted form of a
hydroxide such as, e.g., NaOH or KOH. The time for etching may
vary, depending, at least in part, upon the desirable average
diameter for the final pores 18. In an embodiment, the anisotropic
etching time ranges from about 1 minute to about 45 minutes in
instances where anisotropic etching is performed using a diluted
phosphoric acid (5 vol. %). The temperature for etching may also
depend upon the process and etchant used. In one embodiment, the
etchant temperature ranges from about 0.degree. C. to about
100.degree. C. depending, at least in part, on the type of etchant
used. In an example, the etchant temperature ranges from about
20.degree. C. to about 40.degree. C., for example, when a diluted
phosphoric acid etchant is used.
[0037] In another embodiment, prior to performing anodization, the
method includes patterning the aluminum layer 16. Patterning may be
accomplished via any suitable technique, and is used to perform
localized anodization of the aluminum layer 16. Any standard
photolithography method may be utilized. One example of patterning
with standard photolithography includes depositing a hard mask
material (e.g., Si.sub.xN.sub.y such as SiN or Si.sub.3N.sub.4) on
the aluminum layer 16, and then using a photoresist to pattern the
Si.sub.xN.sub.y material to allow localized exposure of aluminum.
In an example, the mask is patterned to expose portion(s) of the
aluminum to the electrolyte. In some cases, the aluminum may also
be patterned and etched to produce clusters of aluminum (i.e.,
formed when areas of aluminum are etched, but the Ta is still
present). In other cases, aluminum and tantalum are patterned and
etched to produce clusters of aluminum/tantalum. In this example,
the interface formed between the mask and the aluminum layer 16 is
robust, which advantageously prevents separation of the layers
during anodization. In one embodiment, the areas that remain
exposed once the mask and photoresist are in position are subject
to local anodization. The aluminum layer exposed via the patterned
mask or the patterned aluminum layer (not shown) is then locally
anodized, for example, by employing the exposed or patterned
aluminum layer as the anode of an electrolytic cell, and employing
any suitable cathode, such as aluminum (having a 99.99% purity)
and/or platinum (foil or mesh). The electrolyte may be selected
from any electrolyte that will suitably allow the formation of
porous alumina. Some examples of the electrolyte include solutions
of H.sub.2SO.sub.4, H.sub.3PO.sub.4, H.sub.2C.sub.2O.sub.4, and
H.sub.2CrO.sub.4. A suitable voltage and current is then applied to
the electrolytic cell for an amount of time to completely or fully
anodize the patterned aluminum layer (i.e., where the entire
thickness of the patterned aluminum layer is oxidized).
[0038] In still another embodiment, the template 16' may be
patterned by transferring a pattern from a master (see, e.g.,
reference numeral 28 in FIG. 3) onto the aluminum layer 16 (which
may be annealed prior to the transfer). In one example, a SiC
master having a surface with hexagonally-ordered array of convexes
may be pressed against the aluminum layer 16 to form an array of
concaves on the surface of the aluminum layer 16. The aluminum
layer 16 may thereafter be anodized via the method described above
using a constant voltage (i.e., a potentiostatic regime). The
dimensions of the master 28 are chosen for a specific anodic
alumina cell diameter D, and as such, that master 28 is used to
obtain a single cell diameter D and a single pore diameter d
(noting that small differences may be expected for pore diameter d
when different electrolytes and/or anodization voltages are used).
This method forms a highly hexagonally-ordered array of pores
(having uniform diameters) in the anodic alumina.
[0039] The combination of patterning and anodization forms a porous
anodic alumina template 16' with specific dimensions (e.g., a
hexagonally-ordered array of pores). The template 16' formed via
this embodiment of the method may also be anisotropically etched as
previously described to further define the pores 18.
[0040] In one example, the anodization of the aluminum layer 16 may
be accomplished via a potentiostatic regime, whereby a constant
anodization voltage is applied. Due at least in part to the pore
diameter being proportional to voltage, anodization using a
constant voltage produces pores having a substantially constant
diameter from top to bottom. In another example, the anodization
may be accomplished via a galvanostatic regime, whereby a constant
current density is applied, and thus a constant rate of anodization
is achieved. In this example, the voltage may vary during the
anodization, which produces pores having a varying diameter from
top to bottom.
[0041] The anodic alumina template 16' is schematically shown in
FIG. 1B (cross-sectional view). Another example of the anodic
alumina template 16' (where a portion of the aluminum layer 16
remains) is shown in FIGS. 2A (perspective view), 2B (top view),
and 2C (an SEM image of a cross section of the template 16') where
the template 16' includes a plurality of cells 17 (see FIGS. 2A and
2B) each having a pore 18 defined therein. It is to be understood
that the SEM image shown in FIG. 2C was anisotropically etched for
30 minutes to increase the diameter of the pores 18. In an example,
each of the pores 18 defined in the template 16' is oriented
substantially normal to the substrate 12 surface.
[0042] Referring now to FIG. 1C, either anodization is continued or
another anodization current and voltage is applied to initiate a
plurality of steps that lead to complete anodization of the
remaining aluminum layer 16 and the formation of tantalum pentoxide
nano-pillars 20 (see FIGS. 1D and 1E). The anodization process that
oxidizes remaining aluminum 16 and oxidizes the tantalum 14 may be
accomplished, for example, using the same process described above
for initial anodization of the aluminum layer 16 (to form the
template 16'). In one embodiment, the anodization of remaining
portions of the aluminum layer 16 and the layer 14 is accomplished
by employing the tantalum layer 14 as the anode of an electrolytic
cell and employing platinum, stainless steel, or any other
appropriate material as the cathode, and applying a suitable
anodization voltage and/or current density to initiate the various
processes described herein.
[0043] It is to be understood that the remaining aluminum layer 16
(e.g., aluminum fragments located between alumina cells 17 of the
template 16') may become anodized via a variety of methods. When
the remaining aluminum layer 16 is anodized, it become alumina and
essentially becomes part of the barrier layer B. This alumina
barrier layer B is a dielectric layer between the electrolyte and
the metal (in this case, tantalum).
[0044] It is to be understood that the remaining aluminum layer 16
can be anodized using the same electrolyte used to form the
template 16', or can be anodized using another electrolyte that
results in the formation of dense (as opposed to porous) alumina.
When the electrolyte used to form the template 16' is used to
oxidize the remaining aluminum layer 16, the anodization process
used for the aluminum layer 16 may simply be continued until
complete aluminum anodization is achieved and the tantalum
interface is reached (as indicated, for e.g., by the change in
current density). In the embodiment where the electrolyte used to
complete aluminum anodization is the same electrolyte that forms
the porous template 16', it is believed that the barrier layer B
making up the bottom of the pores 18 is etched away by field
assisted dissolving. This dissolution opens up the pores 18 to
enable growth of tantalum pentoxide nano-pillars 20 therein. In
this embodiment, tantalum anodization may be performed using the
same electrolyte (i.e., the electrolyte that forms the porous
template) or another electrolyte.
[0045] When the same electrolyte is used for template 16' formation
and tantalum layer 14 anodization, the anodization process is
continued in order to begin the oxidation of the tantalum layer 14.
As shown in FIGS. 1B and 1C, in this embodiment, complete aluminum
anodization (i.e., formation of the template 16', oxidation of the
remaining aluminum 16, and dissolution of the bottom of each pore
18) and tantalum anodization may take place in the same electrolyte
(e.g., oxalic acid). This electrolyte will form the template 16',
anodize remaining aluminum 16, will dissolve alumina from the
bottom of the pores 18, and will subsequently grow a dense oxide
from the layer 14. This advantageously enables the barrier layer B
at the bottom of each pore 18 to dissolve and the Ta.sub.2O.sub.5
to be generated at the same time, thus keeping the overall
thickness of the oxide such that it corresponds to the applied
voltage.
[0046] In another embodiment, complete aluminum anodization is
performed in the electrolyte that results in the porous alumina
template 16' with open pores 18 (e.g., oxalic acid), and then the
electrolyte may be switched to form the dense tantalum pentoxide.
In this embodiment, the electrolyte used during the subsequent
anodization is selected from citric acid (C.sub.6H.sub.8O.sub.7),
boric acid (H.sub.3BO.sub.3), ammonium pentaborate
((NH.sub.4).sub.2B.sub.10O.sub.16.times.8H.sub.2O), ammonium
tartrate (H.sub.4NO.sub.2CCH(OH)CH(OH)CO.sub.2NH.sub.4), mixtures
thereof, or another suitable electrolyte. This electrolyte will
form the dense tantalum pentoxide layer 14' that will ultimately
grow to form the nano-pillars 20.
[0047] In still another embodiment (not shown in figures), after
the template 16' is formed and some aluminum layer 16 remains,
another electrolyte (i.e., an electrolyte that results in the
formation of a dense, rather than porous, alumina) is used to
oxidize the remaining aluminum layer 16 and to grow the
Ta.sub.2O.sub.5. In this embodiment, the electrolyte solution will
be switched, and anodization of the remaining aluminum layer 16 and
of the tantalum layer 14 will take place in this other electrolyte
(examples of which include citric acid (C.sub.6H.sub.8O.sub.7),
boric acid (H.sub.3BO.sub.3), ammonium pentaborate
((NH.sub.4).sub.2B.sub.10O.sub.16.times.8H.sub.2O), ammonium
tartrate (H.sub.4NO.sub.2CCH(OH)CH(OH)CO.sub.2NH.sub.4), and/or
another suitable electrolyte). In this embodiment, the anodization
of the remaining aluminum layer 16 will form a dense alumina that
increases the thickness of the barrier layer B, but will not open
up the pores 18. Without being bound to any theory, it is believed
that when the electrolyte selected to anodize the remaining
aluminum layer 16 forms dense alumina (e.g., electrolyte is citric
acid), the growth of the tantalum pentoxide nano-pillars will push
the remaining barrier layer B up through the pores 18, which may be
the source of alumina traces in the resulting nano-pillars 20.
[0048] Whichever process and electrolyte is selected for tantalum
layer 14 anodization, it is to be understood that as the
anodization of the oxidizable material layer 14 (in this example
the tantalum layer 14) continues, the oxidized form of the tantalum
(i.e., tantalum pentoxide structure 14') grows through the
individual pores 18 defined in the template 16' to form a
nano-pillar 20 of tantalum pentoxide in each pore 18, as shown in
FIGS. 1D and 1E. This structure 14' is grown from the tantalum
layer 14, and some of the structure 14' grows through the pores 18
of the template 16'. The growing of the structure 14' may be
accomplished, for example, by partially anodizing the tantalum
layer 14 (i.e., part of the layer 14 is oxidized, and part of the
layer 14 remains non-oxidized) as previously described. As
anodization continues, both the interface between the oxidizable
material layer 14 and the formed anodic oxide (i.e., oxide
structure) 14' and the interface between the anodic oxide 14' and
the electrolyte (not shown) are planarized (see FIG. 1E).
[0049] The oxidized form of the tantalum formed during the
anodization of the tantalum layer 14 is a substantially pure oxide.
As used herein, a "substantially pure oxide" refers to an oxide
that may include some impurities. Typically, dense oxides (such as
the structure 14') have a smaller amount of impurities as compared
to porous oxides (such as the template 16'). In one embodiment, the
dense oxide includes a small portion of the alumina (or other
material forming the template 16') and/or of the electrolyte. In
one embodiment, the porous alumina template 16' may have up to
about 15 wt % or up to about 18 wt % of electrolyte ions
incorporated and/or absorbed/adsorbed therein.
[0050] It is to be understood that the volume of the tantalum
pentoxide that grows during the anodization of the tantalum layer
14 should exceed the volume of the tantalum from which the oxide is
formed so that the oxide squeezes into the pores 18 of the template
16' to form the nano-pillars 20. The orientation of the
nano-pillars 20 is generally controlled by the orientation of the
pores 18. In the example of the method depicted in the FIG. 1
series, the nano-pillars 20 are oriented in a position that is
substantially normal to the substrate 12, and thus is substantially
normal to the non-anodized portion of the flat tantalum layer 14
disposed on the substrate 12.
[0051] As shown in FIG. 1E, the tantalum layer 14 is anodized at an
appropriate anodization voltage and/or current density for an
amount of time sufficient for the tantalum pentoxide nano-pillars
20 to continue to grow, inside their respective pores 18, up to a
predetermined height h. In an example, the tantalum pentoxide
nano-pillars 20 grow until each nano-pillar 20 has substantially
the same predefined length L that terminates at an end 21. As shown
in FIG. 1E, the length L of the nano-pillars 20 is shorter than a
height H of the pores 18 within which the nano-pillars 20 are
grown. As soon as the nano-pillars 20 are grown to the
predetermined height h (and thus each nano-pillar has the same
length L), anodization stops, and the multi-layered stack 10 is
removed from the electrolytic cell.
[0052] It is further to be understood that the
configuration/structure of the pores 18 may also dictate the
geometry and/or dimensions of the individual nano-pillars 20. For
instance, the template 16' may be formed so that the pores 18 have
a uniform diameter, a uniform pitch, and a uniform height. When the
nano-pillars 20 grow during the anodization, the geometry and/or
dimensions of the nano-pillars 20 will conform to that of the pores
18 within which the nano-pillars 20 are growing. The geometry
and/or dimensions of the nano-pillars 20 may further be controlled
by adjusting one or more parameters of the oxidizing material
anodization process. For instance, as illustrated in FIG. 2B, the
pitch D of the nano-pillars 20 (which is equivalent to the cell 17
diameter of the anodic alumina template 16') will depend on the
anodization voltage of the anodization process used to form the
template 16'. The diameter d of the nano-pillars 20 (which is
equivalent to the pore 18 diameter) will depend on the nature of
the electrolyte selected and the current density used during the
anodization of the aluminum layer 16 to form the template 16'. The
diameter d may also depend upon the degree of anisotropic etching
used to further refine and define the pores 18. As mentioned above,
the height h of the nano-pillars 20 and the dense underlying
Ta.sub.2O.sub.5 layer 14' is proportional to the anodization
voltage applied to the tantalum layer 14 during its anodization.
Other factors that affect the height of the nano-pillars 20 and the
dense underlying Ta.sub.2O.sub.5 layer 14' include the duration of
anodization at the anodization voltage, pore diameter, and possibly
one or more other factors. As mentioned above, for growing a dense
tantalum pentoxide film, about 1.8 nm of the oxide grows per one
volt, and for growing nano-pillars with a dense underlying tantalum
pentoxide layer and/or a cap layer, from about 1.3 nm to about 1.8
nm of the oxide grows per one volt. Other dimensions that may be
derived from the pitch D, the diameter d, and the height h include
the gap between the nano-pillars 20 (i.e., D-d=gap) and the aspect
ratio (i.e., h/d=aspect ratio) of the nano-pillars 20. In an
example, the nano-pillars 20 have i) a pitch D ranging from about
30 nm to about 500 nm, ii) a diameter d ranging from about 10 nm to
about 350 nm, and iii) a height h ranging from greater than 10 nm
to about 1000 nm. In another example, the gap between adjacent
nano-pillars 20 ranges from about 0 nm (i.e., where the
nano-pillars 20 physically touch each other) to about 300 nm.
[0053] The dimensions of the nano-pillars 20 may be used to
determine the flexibility of the micro-structure 100, and thus its
usefulness as a shock absorber. In one example, the micro-structure
100 is considered to be flexible when its individual nano-pillars
20 have an aspect ratio that is equal to or exceeds about 7. It is
to be understood that more force may be required to bend
nano-pillars 20 with an aspect ratio of 7 than may be required to
bend nano-pillars 20 with an aspect ratio greater than 10 (which
are flexible enough to bend under their own weight). In another
example, the micro-structure shown in the SEM images of FIGS. 4A
through 4D (which includes nano-pillars having a diameter of about
65 nm and a gap between adjacent nano-pillars of about 105 nm) is
less flexible than the micro-structure shown in the SEM images of
FIGS. 5A through 5D (which includes nano-pillars having a diameter
of about 30 nm and a gap between adjacent nano-pillars of about 50
nm). Further, the micro-structure depicted in the SEM images of
FIGS. 6A through 6D (which includes nano-pillars having a diameter
of about 17 nm and a gap between adjacent nano-pillars of about 25
nm) is more flexible than either of the micro-structures shown in
the FIGS. 4 and 5 series. The nano-pillars shown in FIGS. 6A
through 6D have an aspect ratio about 12, and are flexible enough
to be bent under their own weight.
[0054] After the nano-pillars 20 are grown, a portion of the
template 16' defining the pores 18 is removed, leaving behind a
remaining portion of the template 16' that is substantially planar
with the nano-pillars 20 formed in the pores 18, as shown in FIG.
1F. In one embodiment, the excessive portion of the template 16'
(i.e., the portion that is not filled with the grown nano-pillars
20) is removed. In another embodiment, a portion of the template
16' and portions of the nano-pillars 20 are removed (e.g., from
about 5 nm to about 10 nm of nano-pillar height). Removal is
accomplished via chemical mechanical polishing (CMP), which
planarizes the respective ends 21 of the individual nano-pillars
20, as well as respective ends 25 of the template 16' to form a
substantially even plane 23. By "a substantially even plane", it is
meant that the ends 21 of the nano-pillars 20 and the ends 25 of
the remaining template 16' line up to form a flat/smooth plane. It
is to be understood that the plane may be substantially even when
the plane is flat, but may also contain some irregularities.
[0055] In an embodiment, a material is deposited on at least a
portion of the substantially even plane 23 to form a film layer 22
thereon, as shown in FIG. 1G. This film layer 22 is formed to have
a predetermined thickness t. In an example, the thickness t of the
film layer 22 ranges from the diameter of the nano-pillars 20 (as
small as 10 nm) up to 1000 nm. It is to be understood that the
thickness t depends, at least in part, upon the density of the
material used to form the film layer 22. When a lighter material is
used, a thicker layer 22 may be deposited. In one embodiment, the
thickness t ranges from about 10 nm to about 5 .mu.m, or even
greater if the material is light. In another embodiment, the
thickness t ranges from about 20 nm to about 500 nm.
[0056] The selection of the material of the film layer 22 depends
upon the application of the micro-structure 100, and may be used,
for example, to determine the chemical, mechanical, optical,
magnetic, piezoelectric, and/or ferroelectric properties of the
micro-structure 100. For instance, if piezoelectric properties are
desired and/or required, the material selected for the film layer
22 may be zinc oxide (ZnO), aluminum nitride (AlN), lead zirconate
titanate (PZT), or another piezoceramic material. When these
materials are used, it is to be understood that electrodes are also
incorporated into the micro-structure 100. The electrodes could be
deposited to sandwich the film layer 22 or could be deposited as
inter-digitated electrodes on the top of film layer 22. More
generally, the material for the film layer 22 may be selected from
oxides, nitrides, metals, composite materials (cermets), polymers,
composites based on monomers or polymers (e.g., monomers or
polymers with oxides, metals, particles, nano-wires, nano-crystals,
carbon nano-tubes, etc.). In an example, a single material may be
deposited on the plane 23 to form a single film layer 22, or two or
more different materials may be deposited in discrete portions to
form a single film layer 22 on the plane 23, or two or more
different materials may be stacked to form a multi-layered
structure (e.g., two or more layers). In instances where the film
layer 22 includes multiple stacked layers, the layers may be
deposited directly one on top of the other, or may include an
adhesive layer disposed between each layer. For example, the first
layer may be selected to provide adhesion to the Ta.sub.2O.sub.5
pillars 20 and chemical stability to withstand chemical etching of
the alumina template 16', and the second layer may be selected to
provide mechanical properties (toughness, micro-hardness, weight,
etc.) to the micro-structure 100. The inclusion of multiple layers
can, in some instances, give the micro-structure 100 additional
properties (e.g., chemical stability, reflectivity (when position
change is detected using light reflection), etc.) that a single
layer alone may not be able to achieve. Other examples of the
materials suitable for forming the single or multi-layered film
layer 22 include SiN, TiN, SiO.sub.2, Al.sub.2O.sub.3 (not
amorphous anodic alumina, just ordinary alumina which is chemically
more robust), Ta.sub.2O.sub.5, HfO.sub.2, Al, Au, W, Pt, Pd, etc.
In an embodiment when a noble metal is used, it may be desirable to
include a thin layer (e.g., up to 5 nm) of an adhesion layer (e.g.,
Ta, Cr, Ti, etc.) between the noble metal and the planar surface
23.
[0057] Deposition of the material on the plane 23 may be
accomplished using any suitable deposition technique known in the
art. Some examples of deposition techniques that may be used
include different variations of chemical vapor deposition (CVD),
physical vapor deposition (PVD) (such as, e.g., sputtering,
co-sputtering, reactive sputtering or co-sputtering, thermal
evaporation, pulsed laser deposition), atomic layer deposition
(ALD), spin-coating (in some instances in combination with curing
via UV and/or temperature, e.g., when monomers are used), chemical
solution deposition (CSD), plating, electroplating, etc.
[0058] Referring now to FIG. 1H, in an embodiment, the film layer
22 alone is selectively patterned to remove a portion of the film
layer 22 from the substantially even plane 23, leaving a remaining
portion of the film layer 22' behind. It is to be understood that,
in the embodiment of the method described in conjunction with FIGS.
1A through 1I, the remaining film layer 22' covers a designated set
of nano-pillars 20, however all of the nano-pillars 20 remain after
patterning. The portion of the film layer 22' left behind is a
micro-island or, in instances where the micro-cluster 24' (shown in
FIG. 1I) is also referred to as a multi-legged table structure, the
remaining film layer 22' can be referred to as a table top surface.
As shown in FIG. 1H, the micro-island 22' covers the designated set
of nano-pillars 20, and the combination of the micro-island 22' and
the set of nano-pillars 20 with the alumina template 16' still
positioned between the nano-pillars 20 is referred to herein as a
pre-micro-cluster 24. It is to be understood that the
pre-micro-cluster 24 is a precursor to the micro-cluster 24' shown
in FIG. 1I.
[0059] In an example, patterning of the film layer 22 may be
accomplished using any selective patterning process such as, e.g.,
a standard photolithography process. In one embodiment, patterning
is performed to remove desired portion(s) of the film layer 22 to
form the micro-island 22' while leaving the underlying template 16'
and nano-pillars 20 in tact (moving from FIG. 1G to FIG. 1H). In
another embodiment, patterning is performed such that the template
16' is etched during the patterning of the film layer 22. In this
embodiment, the method moves from FIG. 1G directly to FIG. 1I. This
embodiment may also require the use of multiple etchants
simultaneously.
[0060] Referring now to FIG. 1H, in one embodiment, once the
pre-micro-cluster(s) 24 is/are formed (and the template 16' has not
yet been removed), the method further includes selectively removing
any remaining portion(s) of the template 16'. In an example, the
template 16' is removed using a selective etching process that will
remove the anodic alumina template 16' without deleteriously
affecting the other features (e.g., 14', 20, 22'). Selective
etching may be accomplished using an etchant solution (such as,
e.g., H.sub.3PO.sub.4--CrO.sub.3--H.sub.2O) solution) at a
temperature ranging from about 80.degree. C. to about 95.degree. C.
It is to be understood that etching may also be accomplished at a
temperature outside of the foregoing range, but the duration of the
etching may be affected. For instance, at a temperature lower than
80.degree. C., the duration of the etching may be longer. In some
cases, etching may also be accomplished at temperatures as high as
the boiling point of the solution (such as, e.g., about 100.degree.
C.). In this embodiment, H.sub.3PO.sub.4 etches the alumina and the
CrO.sub.3 passivates aluminum etching (this is particularly
desirable when working with patterned aluminum and localized
alumina). In one example, the etchant solution includes about 92 g
of H.sub.3PO.sub.4, about 32 g of CrO.sub.3, and about 200 g of
H.sub.2O, although it is to be understood that the components of
the etchant may vary. It has been found that the nano-pillars 20
can withstand this particular etching process for more than one
hour, while the anodic alumina template 16' is etched away at a
rate of about 1 micron per minute. Other etching solutions that may
be used include hydroxide solutions such as, e.g., NaOH, KOH, etc.
The alumina template 16' may also be etched using a 5%
H.sub.3PO.sub.4 solution at 30.degree. C., H.sub.2SO.sub.4, etc.
Etching may be accomplished, e.g., in a lateral direction to a
distance of about 100 .mu.m, and in some instances even further.
The resultant micro-structure 100 after removing the template 16'
is shown in FIG. 1I, which includes i) one or more micro-clusters
24', and ii) one or more free-standing nano-pillars 20.
[0061] The micro-structure 100 shown in FIG. 1I includes free
standing nano-pillars 20 (i.e., not covered by the layer 22'),
which, in some applications, can bend and absorb energy of acoustic
waves. The surface of the micro-cluster 24' has a much larger
surface area than the free-standing nano-pillars 20. This surface
can catch more energy than the free-standing nano-pillars 20, which
can be transferred to the underlying nano-pillars 20. When the
micro-structure 100 is used as filter, the layer 22' creates
protection and closure for the underlying pillars 20 such that
solution or gas can be directed laterally from one side and the
filtrate will exit the structure 100 laterally from another side.
In another embodiment, the free-standing nano-pillars 20 may be
used to further filter out large particulates, and the liquid of
interest may be collected under the film layer 22' for further
processing (e.g., sensing, concentration, processing, or the
like).
[0062] As stated above, another embodiment of the method for
forming another embodiment of the micro-structure 100' is
schematically depicted in FIGS. 1A through 1G, 1J, and 1K. In this
embodiment, after the film layer 22 is deposited on the
substantially even plane 23 (as shown in FIG. 1G), the method
further includes patterning some of the nano-pillars 20, some of
the film layer 22, some of the template 16', and, in some cases,
some of the layer 14' to form a pre-micro-island 24, shown in FIG.
1J. In contrast to the embodiment described above in conjunction
with FIGS. 1A through 1I, some of the nano-pillars 20 are removed
so that the remaining nano-pillars 20 are part of the
pre-micro-island 24. As shown in FIG. 1J, the remaining film layer
22' covers the set of nano-pillars 20 and the remaining template
16' alone. Any suitable patterning and removal process may be used
to remove the desired portions of the nano-pillars 20, the film
layer 22, the template 16', and the underlying structure 14'. In
one example, standard photolithography, wet or dry etching, or
laser ablation is used to remove the desired portions of the
components 20, 22, 16', 14' leaving the pre-micro-cluster 24. Any
of these processes may use a photoresist or a hard mask to achieve
selectively. It is to be understood that in some embodiments,
portions of the remaining Ta layer 14 may also be removed. In
another example, SiN, Si.sub.xN.sub.y, or SiNH.sub.4 hard mask may
be used for patterning, and then the desired portions of the
components 20, 22, 16', 14' may be etched away.
[0063] Once the pre-micro-cluster 24 is formed, the method further
includes selectively removing any remaining portion of the template
16', as shown in FIG. 1K. This may be accomplished using the
process(es) previously described in reference to FIG. 1I. In this
embodiment, the removal of the template 16' forms the micro-cluster
24'. The resultant micro-structure 100' shown in FIG. 1K includes
the micro-cluster 24' without any free-standing nano-pillars
20.
[0064] It is to be understood that although a single micro-cluster
24' is shown in FIGS. 1J and 1K, the processes described above may
be used to form a plurality of micro-clusters 24'. For instance,
the patterning/removal process may be used to remove particular
groupings of the film layer 22 (for forming the structure 100) or
particular groupings of nano-pillars 20, film layer 22 established
thereon, and any template 16' and layer 14' located therebetween or
therebeneath (for forming the structure 100') to form isolated
pre-micro-islands 24. When the remaining template 16' is removed
from these pre-micro-clusters 24, multiple isolated micro-clusters
24' will be formed on the flat tantalum layer 14, which is disposed
on the substrate 12.
[0065] A top view of the micro-structure 100' including a plurality
of micro-clusters 24' is schematically shown in FIG. 7. As shown in
FIG. 7, the film layer 22' and/or the micro-clusters 24' may be
circularly shaped, rectangularly shaped, donut shaped, frame
shaped, and/or have any other desirable geometric shape.
[0066] It is to be understood that, in some cases, it may be
desirable to modify the surface chemistry of the nano-pillars 20
and/or of the nano-island 22', for example, to improve the chemical
robustness/stability of the micro-structure 100, 100', to tune the
contact angle of these surfaces in order to improve wettability or
to stop wetting, to change the acidity of zeta potential of these
surfaces so that the surfaces may have a different affinity to
different chemicals, to alter the catalytic properties, etc.
Modification of the surface chemistry may be accomplished, for
example, by depositing a material on a surface of the nano-pillars
20 and/or the micro-island 22'. Deposition of the material may be
accomplished, for example, by atomic layer deposition, chemical
vapor deposition, metal organic chemical vapor deposition (MOCVD),
electrochemical deposition, and/or the like. In an example, the
material may be conformally deposited over the entire surface of
the selected nano-pillars 20 and/or the micro-island 22' at a
thickness ranging from about 4 nm to about 8 nm. In another
example, the thickness of the deposited layer is about 6 nm. Some
examples of the materials that may be deposited on the nano-pillars
20 and/or the nano-island 22' include aluminum oxide, zirconium
oxide, titanium oxide, silicon dioxide, tungsten oxide, zinc oxide,
hafnium oxide, or combinations thereof. Monolayers of special
coatings, such as hydrophobic coatings, may also be deposited on
the resulting micro-structures 100, 100'.
[0067] In an embodiment, the micro-structures disclosed herein may
include at least one opening 30 defined in the micro-island 22'
(i.e., the remaining portion of the film layer 22 left over after
patterning as shown in FIGS. 1H and 1J). An embodiment of this
micro-structure 100'' is shown schematically in FIG. 8. The
opening(s) 30 may be formed as part of the patterning process of
the layer 22. The opening(s) 30 may be used, for example, as an
entrance for fluidic media for micro- or nano-filtration, such as
to deliver small quantities of a reagent for testing or screening.
Any particles 32 of the fluidic media that are larger than the
diameter of the opening(s) 30 cannot pass through the opening 30,
whereas the particles that are small enough to enter the opening(s)
30 will pass through and travel under the micro-island 22' (and
perhaps into the gaps formed between the nano-pillars 20 of the
micro-cluster 24' as shown in FIG. 8). An example of a
micro-structure being used as a nano-filter for vertical
filteration/separation of latex ink particles is shown in the SEM
image in FIG. 9 (where the micro-island 22' is not shown).
[0068] Any embodiment of the micro-structure disclosed herein may
be used as a filter for lateral filtration of liquids and gases.
One embodiment of such a structure 100''' is shown in FIG. 10. FIG.
10 illustrates micro-clusters 24' similar to those shown in FIG.
1K, with a gap between the clusters 24'. This type of structure
100''' may be formed by etching away the opening 34 after the
partial template removal process is performed (i.e., after CMP is
performed), filling the opening 34 with a sacrificial layer,
depositing layer 22, and then removing the sacrificial layer and
the template 16'. FIG. 10 schematically depicts the nano-structure
100''' as a nano-filter for gases, whereby a gas stream (identified
by arrows in the figure and labeled "Air") is directed to flow
laterally through the nano-pillars 20. Particulates (e.g.,
particles, cells, colloid particles, etc.) or other matter larger
than the spaces between the nano-pillars 20 are selectively removed
from the gas stream and are not able to pass through to the sensor.
This filter may advantageously be used in combination with the
sensor (schematically shown in FIG. 10) so that the sensor is
exposed to the desirable components of the gas stream alone.
[0069] In some cases, it may also be desirable to control the mass
of the micro-island 22'. For instance, the micro-structures 100,
100', 100'', 100''' may include an array of micro-clusters 24'
having respective micro-islands 22' of different masses. In an
example, the mass of the micro-island 22' may be controlled by
adjusting the thickness of the micro-island 22' and/or the lateral
area of the micro-island 22'.
[0070] While several embodiments have been described in detail, it
will be apparent to those skilled in the art that the disclosed
embodiments may be modified. Therefore, the foregoing description
is to be considered non-limiting.
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