U.S. patent application number 15/593212 was filed with the patent office on 2017-08-24 for board embedded with electronic device.
This patent application is currently assigned to PALLETECHNOLOGY, INC.. The applicant listed for this patent is PALLETECHNOLOGY, INC.. Invention is credited to Richard Linkesch, Anthony John Wainman.
Application Number | 20170243103 15/593212 |
Document ID | / |
Family ID | 58282577 |
Filed Date | 2017-08-24 |
United States Patent
Application |
20170243103 |
Kind Code |
A1 |
Linkesch; Richard ; et
al. |
August 24, 2017 |
BOARD EMBEDDED WITH ELECTRONIC DEVICE
Abstract
The disclosed technology addresses the need in the art for a
board embedded with an electronic device. In some embodiments, a
board can be embedded with a Radio Frequency Emitting Device
(RFED). The board can comprise at least a first layer and a second
layer. The first layer can be made of a first paper based composite
material and include at least a first enclosed cavity storing a
RFED, wherein at least a portion of the first layer is coated with
a moisture resistant material. The first layer can be affixed to
the second layer that is made of a second material different than
the first material, wherein at least a portion of the second layer
is coated with the moisture resistant material.
Inventors: |
Linkesch; Richard; (San
Francisco, CA) ; Wainman; Anthony John; (San
Francisco, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
PALLETECHNOLOGY, INC. |
San Francisco |
CA |
US |
|
|
Assignee: |
PALLETECHNOLOGY, INC.
San Francisco
CA
|
Family ID: |
58282577 |
Appl. No.: |
15/593212 |
Filed: |
May 11, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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15207060 |
Jul 11, 2016 |
9679237 |
|
|
15593212 |
|
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62222129 |
Sep 22, 2015 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
Y02D 30/70 20200801;
H04W 4/80 20180201; H04W 52/0241 20130101; G06K 19/07722 20130101;
G06K 19/07749 20130101; Y02D 70/144 20180101; Y02D 70/22 20180101;
H04W 36/30 20130101; Y02D 70/146 20180101; H04B 1/38 20130101; H04W
12/08 20130101; H04W 76/11 20180201; Y02D 70/166 20180101; Y02D
70/142 20180101; Y02D 70/164 20180101; H04W 52/0254 20130101; Y02D
70/162 20180101; H04B 1/40 20130101 |
International
Class: |
G06K 19/077 20060101
G06K019/077 |
Claims
1. A board comprising: a first layer made of a first paper based
composite material, the first layer comprising at least a portion
of a first enclosed cavity storing a Radio Frequency Emitting
Device (RFED), wherein at least a portion of the first layer is
coated with a moisture resistant material; and a second layer
affixed to the first layer, the second layer made of a second
material different than the first paper based composite, wherein at
least a portion of the second layer is coated with the moisture
resistant material.
2. The board of claim 1, wherein the at least a portion of the
first enclosed cavity is positioned at or substantially near a
center of the first layer.
3. The board of claim 1, wherein the first paper based composite
material is a first density and the second material is a second
density, wherein the second density is greater than the first
density.
4. The board of claim 3, wherein the board is detachably coupled to
at least a first supporting leg of a supply chain asset, the board
creating at least a portion of a shipping surface of the supply
chain asset, wherein the second layer is positioned between the
first layer and the first supporting leg of the supply chain
asset.
5. The board of claim 4, wherein at least a second board is
detachably coupled to the first supporting leg and creating a
second portion of the shipping surface of the supply chain
asset.
6. The board of claim 5, wherein the board is smaller than the
second board.
7. The board of claim 6, wherein the second board is also
detachably coupled to a second supporting leg of the supply chain
asset that the board is not coupled to.
8. The board of claim 4, wherein the supply chain asset is a
pallet.
9. The board of claim 4, wherein the supply chain asset is a
shipping crate.
10. The board of claim 4, wherein the supply chain asset is one of
a beer keg, plastic tote, returnable plastic containers (RPC),
airline container, intermediate bulk container, liquid container,
dry container, hazardous container or horticulture container.
11. The board of claim 1, wherein the first layer further comprises
a high impact resistant portion positioned over the first enclosed
cavity.
12. The board of claim 1, further comprising a third layer made of
a high impact resistant material, the third layer affixed to the
first layer, wherein the first layer is positioned between the
third layer and the second layer.
13. The board of claim 1, wherein the first layer further comprises
at least a portion of a second enclosed cavity storing an
electronic sensor.
14. The board of claim 13, wherein the electronic sensor is
configured to gather location data describing location of the
electronic sensor.
15. The board of claim 13, wherein the electronic sensor is
configured to detect changes in motion.
16. The board of claim 13, wherein the electronic sensor is
configured to detect a physical weight of items placed on the
board.
17. The board of claim 13, wherein the first layer further
comprises a high impact resistant portion positioned over the
second enclosed cavity.
18. The board of claim 13, wherein the second enclosed cavity is
positioned at or substantially near a center of the first
layer.
19. The board of claim 13, wherein the second enclosed cavity is
positioned substantially near an end of the first layer.
20. The board of claim 1, wherein the second material is plastic.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of, and claims the
benefit of U.S. patent application Ser. No. 15/207,060, filed on
Jul. 11, 2016, which claims the priority to U.S. provisional
application number 62/222,129, filed on Sep. 22, 2015, which are
expressly incorporated by reference herein in their entireties.
TECHNICAL FIELD
[0002] The present technology pertains to utilizing electronic
devices to track and monitor objects, and more specifically
pertains to a reusable board embedded with one or more electronic
devices to track and monitor objects.
BACKGROUND
[0003] Shipping crates and shipping pallets are widely used to
distribute items worldwide. For example, it is estimated that in
the US alone, over 500 million shipping pallets are manufactured
each year and 1.8-1.9 billion pallets are currently in use. The
vast majority of these are constructed from wooden boards to
provide a shipping surface upon which items can be placed and
secured for transport and distribution. The shipping surface can be
attached to one or more supporting legs or beams that provide a
sufficient gap below the shipping surface to allow forklift prongs
to be positioned underneath the shipping surface so that the pallet
can be lifted and repositioned as desired.
[0004] One common issue with distributing items is tracking and
monitoring the items as they travel from one location to another.
For example, identifying each pallet when it departs and/or arrives
at a location, as well as entering this data into a system is labor
intensive and time consuming. It can also be difficult to determine
what is happening to a pallet during transport from one location to
another. One proposed solution is to attach electronic devices to
the pallets to gather and transmit data during transport. For
example, to reduce the time and labor required for tracking each
pallet, Radio Frequency Emitting Devices (RFEDs) can be attached to
the pallets to electronically track them as they depart and arrive
at various locations. A shipping dock can be equipped with sensors
that can read signals transmitted by an RFED to detect when a
pallet has left or arrived at the shipping dock, and update a
tracking system accordingly. As another example, electronic sensors
can be attached to a pallet to gather information during shipping,
such as location, condition monitoring, weight changes, etc.
[0005] Attaching an electronic device to a wooden pallet can
present numerous obstacles. For example, due to the nature of
shipping, attaching an electronic device to the exterior of a
pallet can cause the electronic device to be damaged, removed,
displayed, stolen or destroyed during transit. Creating a cavity to
embed an electronic device within a wooden beam of a pallet can
weaken the board, causing the wooden board to break during
shipping. Further, wood naturally absorbs water and moisture, which
can also damage, destroy or affect the functioning of an electronic
device.
[0006] Using plastic in place of wood can alleviate problems caused
by moisture, however plastic boards can be costly to manufacture
and require a separate mold to create each desired size of plastic
board. Embedding electronic devices within plastic requires the use
of select electronic devices that can withstand the thermoforming
temperatures required to mold plastic together. Accordingly,
improvements are needed.
SUMMARY
[0007] Additional features and advantages of the disclosure will be
set forth in the description which follows, and in part will be
obvious from the description, or can be learned by practice of the
herein disclosed principles. The features and advantages of the
disclosure can be realized and obtained by means of the instruments
and combinations particularly pointed out in the appended claims.
These and other features of the disclosure will become more fully
apparent from the following description and appended claims, or can
be learned by the practice of the principles set forth herein.
[0008] The disclosed technology addresses the need in the art for a
board embedded with an electronic device. In some embodiments, a
board can be embedded with a Radio Frequency Emitting Device
(RFED). The board can comprise at least a first layer and a second
layer. The first layer can be made of a first paper based composite
material and include at least a first enclosed cavity storing a
RFED, wherein at least a portion of the first layer is coated with
a moisture resistant material. The first layer can be affixed to
the second layer that is made of a second material different than
the first material, wherein at least a portion of the second layer
is coated with the moisture resistant material.
[0009] In some embodiments, a board embedded with a Radio Frequency
Emitting Device (RFED) can be manufactured by coating at least a
portion of a first paper based composite material with a moisture
resistant material, wherein the first paper based composite
material comprises at least a first enclosed cavity storing a RFED.
At least a portion of a second material can also be coated with the
moisture resistant material. After coating the first paper based
composite material and coating the second material, the first paper
based composite material can be affixed to the second material to
create a first board embedded with a RFED.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The above-recited and other advantages and features of the
disclosure will become apparent by reference to specific
embodiments thereof which are illustrated in the appended drawings.
Understanding that these drawings depict only exemplary embodiments
of the disclosure and are not therefore to be considered to be
limiting of its scope, the principles herein are described and
explained with additional specificity and detail through the use of
the accompanying drawings in which:
[0011] FIG. 1 shows an example of a board embedded with an
electronic device.
[0012] FIG. 2 shows an example of a board embedded with multiple
electronic devices.
[0013] FIG. 3 shows an example side view of a board embedded with
an electronic device.
[0014] FIG. 4 shows another example side view of a board embedded
with an electronic device.
[0015] FIGS. 5A and 5B show an example top and side view of a board
including a high impact resistant portion to enclose an enclosed
cavity.
[0016] FIG. 6 shows an example side view of a board including a
high impact resistant portion to enclose an enclosed cavity.
[0017] FIGS. 7A-7C show examples of a board including a support
beam.
[0018] FIGS. 8A and 8B show examples of a pallet including a board
embedded with an electronic device.
[0019] FIG. 9 shows an example of a shipping crate including a
board embedded with an electronic device.
[0020] FIG. 10 shows an example method of creating a board embedded
with an electronic device.
[0021] FIG. 11A and FIG. 11B illustrate exemplary possible system
embodiments.
DESCRIPTION
[0022] Various embodiments of the disclosure are discussed in
detail below. While specific implementations are discussed, it
should be understood that this is done for illustration purposes
only. A person skilled in the relevant art will recognize that
other components and configurations may be used without parting
from the spirit and scope of the disclosure.
[0023] The disclosed technology addresses the need in the art for a
board embedded with an electronic device to track and manage items
during shipping. A board embedded with an electronic device can be
used to build a shipping pallet or shipping crate and assist with
tracking the shipping pallet or shipping crate during transit. For
example, a board can be embedded with a Radio Frequency Emitting
Device (RFED) that can be used to transmit data to sensors at a
shipping facility. The RFED can transmit data indicating that a
pallet has arrived or is departing a shipping facility. Further,
the RFED can store information describing the items stored on the
pallet. Likewise, the RFED can transmit data identifying the
pallet, such as transmitting a unique identifier assigned to the
pallet. In some embodiments, a board can be embedded with
electronic sensors that can gather data during transit, such as
motion sensors, location sensors, weight sensors, etc. The sensors
can communicate with an embedded RFED to share the collected data,
which can then be transmitted by the RFED. Although a shipping
pallet and shipping crate are used as examples, these are only two
possible embodiments are not meant to be limiting. A board embedded
with an electronic device can be attached to any number of supply
chain assets and used to track and manage shipping, transport etc.
A supply chain asset can be any type of object used to ship or
store an item. For example, a supply chain asset can be a pallet,
shipping crate, beer keg, plastic tote, returnable plastic
containers (RPC), airline container, intermediate bulk container,
liquid container, dry container, hazardous container, horticulture
container, etc.
[0024] FIG. 1 shows an example of a board embedded with an
electronic device. As shown, board 100 can include enclosed cavity
105 to embed an electronic device into board 100. An electronic
device can include any type of electronic device, such as an RFED,
electronic sensor, etc. For example, an electronic device can
include some or all of the features, components, and peripherals of
computing device 1100 of FIGS. 11A and 11B.
[0025] Board 100 can be made of one or more layers of cellulose
material, such as a paper based composite material like greyboard.
Each layer can be affixed to each other to create board 100. For
example, the layers can be affixed using a water and moisture
resistant glue and/or resins such as Prefect Paper Adhesive (PPA)
or other conventionally available moisture resistant glues. In a
preferred embodiment, the material used to affix the layers can be
a moisture resistant material to provide additional protection for
an electronic device embedded within board 100. Affixing two layers
together can include affixing the layers directly together or
affixing the two layers together indirectly via one or more
intermediate layers positioned between them.
[0026] Enclosed cavity 105 can be made within one or more layers of
board 100. For example, during manufacturing of board 100, laser
cutting or other subtractive manufacturing techniques can be used
to create enclosed cavity 105, after which an electronic device can
be placed within enclosed cavity 105. Additional material or layers
can be added to enclose enclosed cavity 105, thereby securing the
electronic device within board 100. Enclosed cavity 105 can be made
to any desired size or dimension. For example, enclosed cavity 105
can be made to a specified dimension to fit a specified electronic
device, such as an RFED or a sensor.
[0027] Board 100 can be made to any size, thickness, length or
other desired specification. For example, the layers of cellulose
material can be cut to any desired dimension and any number of
layers can be used to create a desired thickness. In some
embodiments, board 100 can be made to a specified size for use in
constructing an object such as a pallet or shipping container.
[0028] Enclosed cavity 105 can be located at any desired location
within board 100. For example, enclosed cavity 105 can be located
near and end of board 100, at or substantially near the center of
board 100, etc. In some embodiments, it may be beneficial to locate
enclosed cavity 105 at or near the center of board 100 to provide
additional protection for an electronic device within enclosed
cavity 105. For example, board 100 can be used to create a pallet
for shipping items, and the center of the pallet may provide the
greatest protection against damage during shipping. Accordingly,
enclosed cavity 105 can be located at or substantially near the
center of board 100 when manufactured for this use.
[0029] To provide additional protection for the electronic device
embedded within board 100, each layer of board 100 can be coated
with a moisture resistant resin or other barrier coating. For
example, each layer can be coated with a thermally or magnetically
cured hydrophobic resin such as polytetrafluoroethylene (e.g.,
Teflon.RTM.). Coating each layer with a moisture resistant resin
can provide moisture resistance, fire retardancy, bacterial and
viral protection, etc., to protect an electronic device embedded
within enclosed cavity 105.
[0030] In some embodiments, layers of board 100 can be coated with
a moisture resistant resin prior to creation of enclosed cavity
105. For example, a layer can be coated with the moisture resistant
resin prior to a portion of the layer being cut to create enclosed
cavity 105. Alternatively, a layer can be coated with the moisture
resistant resin after it has been cut to create enclosed cavity
105.
[0031] FIG. 2 shows an example of a board that can be embedded with
multiple electronic devices. As shown, board 200 includes enclosed
cavity 205, enclosed cavity 210 and enclosed cavity 215. Each of
the enclosed cavities 205, 210 and 215 can be used to embed an
electronic device within board 200, although this is not required.
For example, an RFED can be embedded within enclosed cavity 205 and
electronic sensors can be embedded in one or both of enclosed
cavities 210 and 215. Devices other than electronic devices can
also be embedded that can serve as an integral part of the system.
Such devices can include strain coils, buttons, actuators, drives,
rails, etc.
[0032] FIG. 3 shows an example side view of a board embedded with
an electronic device. As shown, board 300 is made of layers 305,
310 and 315. Although only three layers are shown, this is only one
example. Board 300 can be made of any number of boards, as
desired.
[0033] Each of layers 305, 310 and 315 can be made of a cellulose
material, such as greyboard. In some embodiments, each layer 305,
310 and 315 can be made of the same cellulose material.
Alternatively, some of layers 305, 310 and 315 can be made of
different or varying types of cellulose materials. Alternatively,
in some embodiments, one or more of layers 305, 310 and 315 can be
made of a non-cellulose material, such as plastic, electric grade
fiber board, carbon fiber, or even metallic layers.
[0034] In some embodiments, the layers can be made of materials
with varying densities to provide additional strength or protection
to board 300 and/or an electronic device embedded within board 300.
For example, if board 300 is intended for use in a pallet or
shipping crate, it may be advantageous to use a cellulose material
with a higher density for layers that may be in direct contact with
machinery or other objects that may cause damage to board 300.
Hence, if board 300 is used to make a shipping surface of a pallet,
layer 315 may be in direct contact with forklifts or other
machinery used to lift and transport the pallet. Accordingly, it
may be desirable for layer 315 to be made of a material that has
greater density and strength than the cellulose material used for
layers 310 and 305.
[0035] As shown, board 300 includes enclosed cavity 320 within
layer 305, which is the top layer of board 300. This can be
advantageous when board 300 is used as in a pallet as it provides
additional protection from forklifts or other machinery that may be
used to lift and transport the pallet. Alternatively, enclosed
cavity can be included in one or more of the other layers of board
300, such as layer 310.
[0036] FIG. 4 shows another example side view of a board embedded
with an electronic device. As shown, board 400 is made of six
individual layers affixed to each other. Board 400 includes
enclosed cavity 405 made out of layer 410 and layer 415. Although
enclosed cavity 405 is shown within two layers, this is just one
embodiments and is not meant to be limiting. An enclosed cavity can
be made out of any number of layers.
[0037] FIGS. 5A and 5B show an example top and side view of a board
including a high impact resistant portion to enclose an enclosed
cavity. FIG. 5A shows a top view of board 500. As shown, board 500
includes enclosed cavity 505 used to embed an electronic device
within board 500. To further protect an electronic device included
within enclosed cavity 505, board 500 can include high impact
resistant portion 510 positioned over enclosed cavity 505. High
impact resistant portion 510 can be made of any type of high impact
resistant material, such as electrical grade fiberglass (e.g.,
GPO3).
[0038] As shown, high impact resistant portion 510 is limited in
size to covering enclosed cavity 505. This can reduce the cost of
manufacturing board 500 by limiting the amount of high impact
resistant material used in board 500 to only what is needed to
provide adequate protection to an electronic device embedded within
board 500.
[0039] FIG. 5B shows a side view of board 500. As shown, enclosed
cavity 505 is made within layer 515. High impact resistant portion
505 is also included within layer 515 and positioned over enclosed
cavity 505. During manufacturing, layer 515 can be made to include
space for enclosed cavity 505 and high impact resistant portion
505. After an electronic device is placed within enclosed cavity
505, high impact resistant portion 510 can be added to enclose the
electronic device within enclosed cavity 505.
[0040] FIG. 6 shows an example side view of a board including a
high impact resistant portion to enclose an enclosed cavity. As
shown board 600 includes enclosed cavity 605 within layer 610.
Board 600 further includes layer 615 affixed above layer 610, which
encloses enclosed cavity 605. Layer 610 can be made of a high
impact resistant material such as electrical grade fiberglass.
[0041] FIGS. 7A-7C show examples of a board including a support
beam. As shown, board 700 includes embedded support beam 705.
Embedded support beam 705 can be made of a rigid material such as
aluminum, carbon fiber, iron, hard plastic, etc., to provide
additional support to board 700. For example, embedded support beam
705 can be included in board 700 to increase the weight that can be
supported by board 700 by items during shipping. As shown, embedded
support beam 705 can span the length of board 700. Additionally,
embedded support beam 705 can be shaped to create space 710 to
include an embedded electronic device.
[0042] FIG. 7B shows another example of board 700 including a
support beam. As shown, board 700 includes embedded support beams
715, 720, 725 and 730. Embedded support beams 715, 720 can be
located to provide support for one half of board 700, and embedded
support beams 725 and 730 can be located to provide support for the
opposite half of board 7009. Further embedded support beams 715,
720, 725 and 730 can be positioned to leave space 735 in the middle
of board 700 to allow room in which an electronic device can be
embedded within board 700.
[0043] FIG. 7C shows another example of board 700 including a
support beam. As shown, board 700 incudes embedded support beam 740
that spans the entire length of board 700. In this type of
embodiment, embedded support beam 740 can be positioned either
below or above an embedded cavity in board 700 in which an
electronic device can be embedded.
[0044] FIGS. 8A and 8B show examples of a pallet including a board
embedded with an electronic device. As shown in FIG. 8A, pallet 800
includes multiple boards 805, 810 and 815, coupled to supporting
legs 820. Boards 805, 810 and 815 create a portion of a shipping
surface upon which items can be placed and prepared for shipping.
Each of boards 805, 810 and 815 can be coupled to supporting legs
820 using any means know in the art, such as nails, screws, glue,
etc.
[0045] As shown board 805, 810 and 815 can include enclosed
cavities 825, 830 and 835, respectively, that includes an
electronic device. Boards 805, 810 and 815 can be made from layers
of cellulose material, such as boards 100, 200, 300, 400, 500, 600
and 700 described above. Alternatively, the remainder of pallet
800, including other boards used to create the shipping surface and
supporting legs 820 can be made of any material used to manufacture
pallets, such as wood.
[0046] In some embodiments, board 805, 810 and 815 can be
detachably coupled to supporting legs 820 so that board 805, 810
and 815 can be coupled and decoupled as desired. For example, board
805, 810 and 815 can be coupled to supporting legs 820 using
screws, nails, etc., which can be removed to decouple board 805,
810 and 815 from supporting legs 820. This can allow board 805, 810
and 820 to be coupled to any existing wooden pallet as well as
removed from a wooden pallet to be coupled to another wooden
pallet. In this way, board 805, 810 and 815 can be used with any
existing pallet, as well as be reusable and remain in use even if
pallet 800 is damaged or otherwise ruined.
[0047] As shown, board 810 is placed as the middle board of pallet
800. Further, enclosed space 830 is positioned substantially in the
center of board 810, thereby positioning the electronic device
embedded within board 810 substantially in the center of pallet
800. This can provide the electronic device with greater security
against damage caused by use of pallet 800 for shipping items.
[0048] As shown, board 805 and board 815 both include enclosed
spaces 825 and 835 positioned near the end of boards 805 and 815.
Accordingly, boards 805 and 815 can also be embedded with
electronic devices that work in conjunction with or separately from
an electronic device embedded within board 810.
[0049] FIG. 8B shows another example of a pallet including a board
embedded with an electronic device. As shown, pallet 800 includes
board 840. Board 840 can include three enclosed spaces 845.
Electronic devices can be embedded in one or more of enclosed
spaces 845.
[0050] FIG. 9 shows an example of a shipping crate including a
board embedded with an electronic device. As shown, shipping crate
900 can include board 905 coupled to at least one other board to
form shipping crate 900. While board 900 can be made of layers of
cellulose material, the other boards of shipping crate 900 can be
made of any other material used to create shipping crates, such as
wood. As shown, board 900 can include enclosed space 910 which can
include an electronic device such as an RFED. Board 905 can be
detachably coupled through use of screws, nails, or other means
such that board 900 can be coupled and decoupled from shipping
crate 900.
[0051] FIG. 10 shows an example method of creating a board embedded
with an electronic device. At step 1005, at least a portion of a
first paper based composite material is coated with a moisture
resistant material, wherein the first paper based composite
material comprises at least a first enclosed cavity storing an
electronic device, such as an RFED or electronic sensor.
[0052] At step 1010, at least a portion of a second paper based
composite material is coated with the moisture resistant material.
At step 1015 the second paper based composite material is affixed
to the first paper based composite material after the first paper
based composite material and the second paper based material are
coated with the moisture resistant material. Affixing the first
paper based material to the second paper based material can result
in a first board embedded with an electronic device, such as an
RFED or electronic sensor.
[0053] FIG. 11A, and FIG. 11B illustrate exemplary possible system
embodiments. The more appropriate embodiment will be apparent to
those of ordinary skill in the art when practicing the present
technology. Persons of ordinary skill in the art will also readily
appreciate that other system embodiments are possible.
[0054] FIG. 11A illustrates a conventional system bus computing
system architecture 1100 wherein the components of the system are
in electrical communication with each other using a bus 1105.
Exemplary system 1100 includes a processing unit (CPU or processor)
1110 and a system bus 1105 that couples various system components
including the system memory 1115, such as read only memory (ROM)
1120 and random access memory (RAM) 1125, to the processor 1110.
The system 1100 can include a cache of high-speed memory connected
directly with, in close proximity to, or integrated as part of the
processor 1110. The system 1100 can copy data from the memory 1115
and/or the storage device 1130 to the cache 1112 for quick access
by the processor 1110. In this way, the cache can provide a
performance boost that avoids processor 1110 delays while waiting
for data. These and other modules can control or be configured to
control the processor 1110 to perform various actions. Other system
memory 1115 may be available for use as well. The memory 1115 can
include multiple different types of memory with different
performance characteristics. The processor 1110 can include any
general purpose processor and a hardware module or software module,
such as module 1 1132, module 2 1134, and module 3 1136 stored in
storage device 1130, configured to control the processor 1110 as
well as a special-purpose processor where software instructions are
incorporated into the actual processor design. The processor 1110
may essentially be a completely self-contained computing system,
containing multiple cores or processors, a bus, memory controller,
cache, etc. A multi-core processor may be symmetric or
asymmetric.
[0055] To enable user interaction with the computing device 1100,
an input device 1145 can represent any number of input mechanisms,
such as a microphone for speech, a touch-sensitive screen for
gesture or graphical input, keyboard, mouse, motion input, speech
and so forth. An output device 1135 can also be one or more of a
number of output mechanisms known to those of skill in the art. In
some instances, multimodal systems can enable a user to provide
multiple types of input to communicate with the computing device
1100. The communications interface 1140 can generally govern and
manage the user input and system output. There is no restriction on
operating on any particular hardware arrangement and therefore the
basic features here may easily be substituted for improved hardware
or firmware arrangements as they are developed.
[0056] Storage device 1130 is a non-volatile memory and can be a
hard disk or other types of computer readable media which can store
data that are accessible by a computer, such as magnetic cassettes,
flash memory cards, solid state memory devices, digital versatile
disks, cartridges, random access memories (RAMs) 1125, read only
memory (ROM) 1120, and hybrids thereof.
[0057] The storage device 1130 can include software modules 1132,
1134, 1136 for controlling the processor 1110. Other hardware or
software modules are contemplated. The storage device 1130 can be
connected to the system bus 1105. In one aspect, a hardware module
that performs a particular function can include the software
component stored in a computer-readable medium in connection with
the necessary hardware components, such as the processor 1110, bus
1105, display 1135, and so forth, to carry out the function.
[0058] FIG. 11B illustrates a computer system 1150 having a chipset
architecture that can be used in executing the described method and
generating and displaying a graphical user interface (GUI).
Computer system 1150 is an example of computer hardware, software,
and firmware that can be used to implement the disclosed
technology. System 1150 can include a processor 1155,
representative of any number of physically and/or logically
distinct resources capable of executing software, firmware, and
hardware configured to perform identified computations. Processor
1155 can communicate with a chipset 1160 that can control input to
and output from processor 1155. In this example, chipset 1160
outputs information to output 1165, such as a display, and can read
and write information to storage device 1170, which can include
magnetic media, and solid state media, for example. Chipset 1160
can also read data from and write data to RAM 1175. A bridge 1180
for interfacing with a variety of user interface components 1185
can be provided for interfacing with chipset 1160. Such user
interface components 1185 can include a keyboard, a microphone,
touch detection and processing circuitry, a pointing device, such
as a mouse, and so on. In general, inputs to system 1150 can come
from any of a variety of sources, machine generated and/or human
generated.
[0059] Chipset 1160 can also interface with one or more
communication interfaces 1190 that can have different physical
interfaces. Such communication interfaces can include interfaces
for wired and wireless local area networks, for broadband wireless
networks, as well as personal area networks. Some applications of
the methods for generating, displaying, and using the GUI disclosed
herein can include receiving ordered datasets over the physical
interface or be generated by the machine itself by processor 1155
analyzing data stored in storage 1170 or 1175. Further, the machine
can receive inputs from a user via user interface components 1185
and execute appropriate functions, such as browsing functions by
interpreting these inputs using processor 1155.
[0060] It can be appreciated that exemplary systems 1100 and 1150
can have more than one processor 1110 or be part of a group or
cluster of computing devices networked together to provide greater
processing capability.
[0061] For clarity of explanation, in some instances the present
technology may be presented as including individual functional
blocks including functional blocks comprising devices, device
components, steps or routines in a method embodied in software, or
combinations of hardware and software.
[0062] In some embodiments the computer-readable storage devices,
mediums, and memories can include a cable or wireless signal
containing a bit stream and the like. However, when mentioned,
non-transitory computer-readable storage media expressly exclude
media such as energy, carrier signals, electromagnetic waves, and
signals per se.
[0063] Methods according to the above-described examples can be
implemented using computer-executable instructions that are stored
or otherwise available from computer readable media. Such
instructions can comprise, for example, instructions and data which
cause or otherwise configure a general purpose computer, special
purpose computer, or special purpose processing device to perform a
certain function or group of functions. Portions of computer
resources used can be accessible over a network. The computer
executable instructions may be, for example, binaries, intermediate
format instructions such as assembly language, firmware, or source
code. Examples of computer-readable media that may be used to store
instructions, information used, and/or information created during
methods according to described examples include magnetic or optical
disks, flash memory, USB devices provided with non-volatile memory,
networked storage devices, and so on.
[0064] Devices implementing methods according to these disclosures
can comprise hardware, firmware and/or software, and can take any
of a variety of form factors. Typical examples of such form factors
include laptops, smart phones, small form factor personal
computers, personal digital assistants, and so on. Functionality
described herein also can be embodied in peripherals or add-in
cards. Such functionality can also be implemented on a circuit
board among different chips or different processes executing in a
single device, by way of further example.
[0065] The instructions, media for conveying such instructions,
computing resources for executing them, and other structures for
supporting such computing resources are means for providing the
functions described in these disclosures.
[0066] Although a variety of examples and other information was
used to explain aspects within the scope of the appended claims, no
limitation of the claims should be implied based on particular
features or arrangements in such examples, as one of ordinary skill
would be able to use these examples to derive a wide variety of
implementations. Further and although some subject matter may have
been described in language specific to examples of structural
features and/or method steps, it is to be understood that the
subject matter defined in the appended claims is not necessarily
limited to these described features or acts. For example, such
functionality can be distributed differently or performed in
components other than those identified herein. Rather, the
described features and steps are disclosed as examples of
components of systems and methods within the scope of the appended
claims.
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