U.S. patent application number 15/587420 was filed with the patent office on 2017-08-17 for optical detector and method for manufacturing the same.
This patent application is currently assigned to BASF SE. The applicant listed for this patent is BASF SE. Invention is credited to Ingmar BRUDER, Stephan IRLE, Robert SEND, Erwin THIEL.
Application Number | 20170237926 15/587420 |
Document ID | / |
Family ID | 50884412 |
Filed Date | 2017-08-17 |
United States Patent
Application |
20170237926 |
Kind Code |
A1 |
BRUDER; Ingmar ; et
al. |
August 17, 2017 |
OPTICAL DETECTOR AND METHOD FOR MANUFACTURING THE SAME
Abstract
An optical detector (110) is disclosed. The optical detector
(110) comprises: an optical sensor (112), having a substrate (116)
and at least one photosensitive layer setup (118) disposed thereon,
the photosensitive layer setup (118) having at least one first
electrode (120), at least one second electrode (130) and at least
one photovoltaic material (140) sandwiched in between the first
electrode (120) and the second electrode (130), wherein the
photovoltaic material (140) comprises at least one organic
material, wherein the first electrode (120) comprises a plurality
of first electrode stripes (124) and wherein the second electrode
(130) comprises a plurality of second electrode stripes (134),
wherein the first electrode stripes (124) and the second electrode
stripes (134) intersect such that a matrix (142) of pixels (144) is
formed at intersections of the first electrode stripes (124) and
the second electrode stripes (134); and at least one readout device
(114), the readout device (114) comprising a plurality of
electrical measurement devices (154) being connected to the second
electrode stripes (134) and a switching device (160) for
subsequently connecting the first electrode stripes (124) to the
electrical measurement devices (154).
Inventors: |
BRUDER; Ingmar;
(Neuleiningen, DE) ; SEND; Robert; (Karlsruhe,
DE) ; IRLE; Stephan; (Siegen, DE) ; THIEL;
Erwin; (Siegen, DE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BASF SE |
Ludwigshafen |
|
DE |
|
|
Assignee: |
BASF SE
Ludwigshafen
DE
|
Family ID: |
50884412 |
Appl. No.: |
15/587420 |
Filed: |
May 5, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14787909 |
Oct 29, 2015 |
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PCT/EP2014/061688 |
Jun 5, 2014 |
|
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15587420 |
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Current U.S.
Class: |
348/294 |
Current CPC
Class: |
Y02E 10/549 20130101;
G01S 17/86 20200101; H04N 5/369 20130101; H01L 2031/0344 20130101;
G01S 17/08 20130101; H01L 51/442 20130101; H01L 27/285 20130101;
H01L 27/307 20130101; H04N 5/372 20130101; H01L 51/4226 20130101;
H01L 51/441 20130101; H04N 5/2254 20130101; H04N 5/374 20130101;
H04N 5/378 20130101; G01S 17/06 20130101; H01L 51/4213
20130101 |
International
Class: |
H04N 5/378 20060101
H04N005/378; G01S 17/02 20060101 G01S017/02; H01L 51/44 20060101
H01L051/44; G01S 17/08 20060101 G01S017/08; H01L 27/30 20060101
H01L027/30; H01L 51/42 20060101 H01L051/42 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 13, 2013 |
EP |
13171898.3 |
Mar 19, 2014 |
DE |
10 2014 007 775.6 |
Claims
1. An optical detector, comprising: an optical sensor, comprising a
substrate and at least one photosensitive layer setup disposed
thereon, the photosensitive layer setup comprising at least one
first electrode, at least one second electrode and at least one
photovoltaic material sandwiched in between the first electrode and
the second electrode, wherein the photovoltaic material comprises
at least one organic material, wherein the first electrode
comprises a plurality of first electrode stripes and wherein the
second electrode comprises a plurality of second electrode stripes,
wherein the first electrode stripes and the second electrode
stripes intersect such that a matrix of pixels is formed at
intersections of the first electrode stripes and the second
electrode stripes; and at least one readout device, the readout
device comprising a plurality of electrical measurement devices
connected to the second electrode stripes and a switching device
for subsequently connecting the first electrode stripes to the
electrical measurement devices.
2. The optical detector according to claim 1, wherein the matrix of
pixels comprises rows defined by the first electrode stripes and
columns defined by the second electrode stripes, wherein each
electrical measurement device is connected to a column, such that
electrical signals for the pixels of each row are measured
simultaneously, wherein the switching device is configured to
subsequently connect the rows to the electrical measurement
devices.
3. The optical detector according to claim 1, wherein the
electrical measurement devices are analogue measurement devices,
wherein the electrical measurement devices further comprise
analogue-digital converters.
4. The optical detector according to claim 1, wherein the readout
device further comprises at least one data memory for storing
measurement values for the pixels of the matrix of pixels.
5. The optical detector according to claim 1, wherein one of the
first electrode and the second electrode is a bottom electrode and
wherein the other of the first electrode and the second electrode
is a top electrode, wherein the bottom electrode is applied to the
substrate, wherein the photovoltaic material is applied to the
bottom electrode and at least partially covers the bottom electrode
and wherein the top electrode is applied to the photovoltaic
material.
6. The optical detector according to claim 5, wherein the top
electrode comprises a plurality of metal electrode stripes, wherein
the metal electrode stripes are separated by electrically
insulating separators.
7. The optical detector according to claim 6, wherein the optical
sensor comprises an n-semiconducting metal oxide, wherein the
electrically insulating separators are deposited on top of the
n-semiconducting metal oxide.
8. The optical detector according to claim 7, wherein the optical
sensor further comprises at least one solid p-semiconducting
organic material deposited on top of the n-semiconducting metal
oxide, the solid p-semiconducting organic material being
sub-divided into a plurality of stripe-shaped regions by the
electrically insulating separators.
9. The optical detector according to claim 5, wherein the top
electrode is transparent.
10. The optical detector according to claim 9, wherein the top
electrode comprises at least one metal layer.
11. The optical detector according to claim 10, wherein the top
electrode further comprises at least one electrically conductive
polymer embedded in between the photovoltaic material and the metal
layer.
12. The optical detector according to claim 1, comprising a stack
of at least two imaging devices, wherein at least one of the
imaging devices is the optical sensor.
13. The optical detector according to claim 12, wherein the stack
further comprises at least one additional imaging device.
14. The optical detector according to claim 12, wherein the stack
comprises at least two imaging devices having different spectral
sensitivities.
15. A detector system for determining a position of at least one
object, the detector system comprising at least one optical
detector according to claim 1, and at least one beacon device
configured to direct at least one light beam towards the optical
detector, wherein the beacon device is at least one of a device
attachable to the object, a device holdable by the object and a
device integratable into the object.
16. A human-machine interface for exchanging at least one item of
information between a user and a machine, the human-machine
interface comprising at least one detector system according to
claim 15, wherein the at least one beacon device is configured to
be at least one of directly or indirectly attached to the user and
held by the user, wherein the human-machine interface is designed
to determine at least one position of the user via the detector
system, wherein the human-machine interface is designed to assign
to the position at least one item of information.
17. An entertainment device for carrying out at least one
entertainment function, the entertainment device comprising at
least one human-machine interface according to claim 16, wherein
the entertainment device is designed to enable at least one item of
information to be input by a player via the human-machine
interface, wherein the entertainment device is designed to vary the
entertainment function in accordance with the information.
18. A tracking system for tracking a position of at least one
movable object, the tracking system comprising at least one
detector system according to claim 15, and at least one track
controller, wherein the track controller is configured to track a
series of positions of the object at specific points in time.
19. A camera for imaging at least one object, the camera comprising
at least one optical detector according to claim 1.
20. A method for manufacturing an optical detector, the method
comprising: a) manufacturing an optical sensor, wherein a
photosensitive layer setup is deposited onto a substrate, the
photosensitive layer setup comprising at least one first electrode,
at least one second electrode and at least one photovoltaic
material sandwiched in between the first electrode and the second
electrode, wherein the photovoltaic material comprises at least one
organic material, wherein the first electrode comprises a plurality
of first electrode stripes and wherein the second electrode
comprises a plurality of second electrode stripes, wherein the
first electrode stripes and the second electrode stripes intersect
such that a matrix of pixels is formed at intersections of the
first electrode stripes and the second electrode stripes; and b)
connecting at least one readout device to the optical sensor, the
readout device comprising a plurality of electrical measurement
devices connected to the second electrode stripes, and at least one
switching device for subsequently connecting the first electrode
stripes to the electrical measurement devices.
21. The method according to claim 20, wherein the manufacturing a)
comprises: a1) depositing at least one bottom electrode onto the
substrate, wherein the bottom electrode is one of the first
electrode or second electrode, wherein the bottom electrode
comprises a plurality of bottom electrode stripes; a2) depositing
the at least one photovoltaic material onto the bottom electrode;
and a3) depositing at least one top electrode onto the photovoltaic
material, wherein the top electrode is the other one of the first
electrode and the second electrode, wherein the top electrode
comprises a plurality of top electrode stripes, wherein the top
electrode stripes are deposited such that the bottom electrode
stripes and the top electrode stripes intersect such that the
matrix of pixels is formed.
22. The method according to claim 21, wherein the depositing a3)
comprises one or more of the following: depositing the top
electrode onto the photovoltaic material in a patterned way;
depositing the top electrode onto the photovoltaic material in an
unpatterned way, followed by at least one patterning step; and
providing at least one separator on one or more of the substrate or
the photovoltaic material, followed by an unpatterned deposition of
the top electrode, wherein the top electrode is sub-divided into
the top electrode stripes by the separator.
23. A method of taking at least one image of an object via the
optical detector according to claim 1, the method comprising:
imaging the object onto the optical sensor, subsequently connecting
the first electrode stripes to the electrical measurement devices,
wherein the electrical measurement devices, for each first
electrode stripe, measure electrical signals for the pixels of the
respective first electrode stripe, and composing the electrical
signals of the pixels to form an image.
24. The optical detector according to claim 1, suitable for a
position measurement in traffic technology; an entertainment
application; a security application; a safety application; a
human-machine interface application; a tracking application; a
photography application; or an application in combination with at
least one time-of-flight detector.
25. The optical detector according to claim 7, wherein the
n-semiconducting metal oxide is a nano-porous n-semiconducting
metal oxide.
26. The method according to claim 22, wherein the depositing a3)
comprises depositing the top electrode onto the photovoltaic
material in a patterned way by using a deposition through a shadow
mask.
27. The method according to claim 22, wherein the depositing a3)
comprises depositing the top electrode onto the photovoltaic
material in a patterned way by using a printing technique.
Description
FIELD OF THE INVENTION
[0001] The present invention is based on previous European patent
application number 13171898.3, the full content of which is
herewith included by reference. The invention relates to an optical
detector, a detector system, a human-machine interface, an
entertainment device, a tracking system, a camera, a method for
manufacturing an optical detector, a method of taking at least one
image of an object and to various uses of the optical detector
according to the present invention. The devices and methods
according to the present invention are mainly used in the field of
imaging and camera technology, such as for detecting at least one
object and/or for taking an image of at least one object. Thus, the
optical detector according to the present invention specifically
may be used in the field of photography and/or for purposes of
human-machine-interfaces or gaming. Other applications, however,
are feasible.
PRIOR ART
[0002] A large number of optical sensors and photovoltaic devices
are known from the prior art. While photovoltaic devices are
generally used to convert electromagnetic radiation, for example,
ultraviolet, visible or infrared light, into electrical signals or
electrical energy, optical detectors are generally used for picking
up image information and/or for detecting at least one optical
parameter, for example, a brightness.
[0003] It is generally known that optical sensors may be based on
the use of inorganic and/or organic sensor materials. Examples of
such sensors are disclosed in US 2007/0176165 A1, U.S. Pat. No.
6,995,445 B2, DE 2501124 A1, DE 3225372 A1 or else in numerous
other prior art documents. To an increasing extent, in particular
for cost reasons and for reasons of large-area processing, sensors
comprising at least one organic sensor material are being used, as
described for example in US 2007/0176165 A1. In particular,
so-called dye solar cells are increasingly of importance here,
which are described generally, for example in WO 2009/013282
A1.
[0004] A plurality of detectors for detecting at least one object
are known, which are based on such optical sensors. Such detectors
can be embodied in various ways, depending on the respective
purpose of use. Examples of such detectors are imaging devices, for
example, cameras and/or microscopes. High-resolution confocal
microscopes are known, for example, which can be used in particular
in the field of medical technology and biology in order to examine
biological samples with high optical resolution. Further examples
of detectors for optically detecting at least one object are
distance measuring devices based, for example, on propagation time
methods of corresponding optical signals, for example laser pulses.
Further examples of detectors for optically detecting objects are
triangulation systems, by means of which distance measurements can
likewise be carried out.
[0005] In US 20070080925 A1, a low power consumption display device
is disclosed. Therein, photoactive layers are utilized that both
respond to electrical energy to allow a display device to display
information and that generate electrical energy in response to
incident radiation. Display pixels of a single display device may
be divided into displaying and generating pixels. The displaying
pixels may display information and the generating pixels may
generate electrical energy. The generated electrical energy may be
used to provide power to drive an image. A technically complex
driving electronics of the generating pixels and the displaying
pixels is required.
[0006] In EP 1 667 246 A1, a sensor element capable of sensing more
than one spectral band of electromagnetic radiation with the same
spatial location is disclosed. The element consists of a stack of
sub-elements each capable of sensing different spectral bands of
electromagnetic radiation. The sub-elements each contain a
non-silicon semiconductor where the non-silicon semiconductor in
each sub-element is sensitive to and/or has been sensitized to be
sensitive to different spectral bands of electromagnetic
radiation.
[0007] In WO 2012/110924 A1, the content of which is herewith
included by reference, a detector for optically detecting at least
one object is proposed. The detector comprises at least one optical
sensor. The optical sensor has at least one sensor region. The
optical sensor is designed to generate at least one sensor signal
in a manner dependent on an illumination of the sensor region. The
sensor signal, given the same total power of the illumination, is
dependent on a geometry of the illumination, in particular on a
beam cross section of the illumination on the sensor area. The
detector furthermore has at least one evaluation device. The
evaluation device is designed to generate at least one item of
geometrical information from the sensor signal, in particular at
least one item of geometrical information about the illumination
and/or the object.
[0008] U.S. provisional applications 61/739,173, filed on Dec. 19,
2012, 61/749,964, filed on Jan. 8, 2013, and 61/867,169, filed on
Aug. 19, 2013, and international patent application
PCT/162013/061095, filed on Dec. 18, 2013, the full content of all
of which is herewith included by reference, disclose a method and a
detector for determining a position of at least one object, by
using at least one transversal optical sensor and at least one
optical sensor. Specifically, the use of sensor stacks is
disclosed, in order to determine a longitudinal position of the
object with a high degree of accuracy and without ambiguity.
[0009] Despite the advantages implied by the above-mentioned
devices and detectors, specifically by the detectors disclosed in
WO 2012/110924 A1, U.S. 61/739,173 and 61/749,964, several
technical challenges remain. Thus, generally, a need exists for
optical detectors which are capable of capturing an image of an
object, specifically a 3D image, and which are both reliable and,
still, may be manufactured at low cost. Further, for various
purposes, it is desirable to provide optical detectors which are
both transparent and capable of capturing an image of an
object.
Problem Addressed by the Invention
[0010] It is therefore an object of the present invention to
provide an optical detector and a method for manufacturing the same
which address the above-mentioned technical challenges.
Specifically, an optical detector shall be disclosed which is
capable of taking an image of an object, preferably at high
resolution, which is both reliable and may be manufactured at a low
cost.
DESCRIPTION OF THE INVENTION
[0011] This problem is solved by the invention with the features of
the independent patent claims. Advantageous developments of the
invention, which can be realized individually or in combination,
are presented in the dependent claims and/or in the following
specification and detailed embodiments.
[0012] As used herein, the expressions "have", "comprise" and
"contain" as well as grammatical variations thereof are used in a
non-exclusive way. Thus, the expression "A has B" as well as the
expression "A comprises B" or "A contains B" may both refer to the
fact that, besides B, A contains one or more further components
and/or constituents, and to the case in which, besides B, no other
components, constituents or elements are present in A. Further, as
used herein, the expressions "specifically", "preferably", "more
preferably" or "most preferably" are used in order to mark specific
options for realizing certain optional features of the present
invention, notwithstanding the fact that other embodiments are
feasible. It shall be noted that no restriction of the scope of the
claims shall be intended by the use of these expressions.
[0013] Further, as used in the following, the terms "preferably",
"more preferably", "more preferably", "particularly", "more
particularly", "specifically", "more specifically" or similar terms
are used in conjunction with optional features, without restricting
alternative possibilities. Thus, features introduced by these terms
are optional features and are not intended to restrict the scope of
the claims in any way. The invention may, as the skilled person
will recognize, be performed by using alternative features.
Similarly, features introduced by "in an embodiment of the
invention" or similar expressions are intended to be optional
features, without any restriction regarding alternative embodiments
of the invention, without any restrictions regarding the scope of
the invention and without any restriction regarding the possibility
of combining the features introduced in such way with other
optional or non-optional features of the invention.
[0014] In a first aspect of the present invention, an optical
detector is disclosed. As used herein, an optical detector is a
device capable of measuring at least one optical signal.
Specifically, the optical detector shall be adapted for taking at
least one image of an object. As further used herein, the term
"image" generally refers to an array of information values,
specifically a two-dimensional or even three-dimensional or
higher-dimensional array of information values, wherein each
information value indicates a signal generated by an imaging
element of an array of imaging elements, wherein the imaging
elements of the array of imaging elements, in the following, are
also referred to as "pixels". Consequently, the expression
"imaging" generally refers to the action of taking an image as
defined above.
[0015] The optical detector according to the present invention may
be used for various purposes. Thus, as an example, the optical
detector may be used in the field of photography, specifically in
the field of digital photography and/or in a digital camera.
Additionally or alternatively, the optical detector may be used in
human-machine-interfaces, in order to translate a position and/or
orientation of a user and/or an object into an information and/or
command readable by a machine. Specifically, the optical detector
may be used in a human-machine-interface in the field of computer
gaming, such as for recognizing a position and/or an orientation of
a user, a body part of a user and/or a control element which may be
held and/or influenced by a user. Other applications are
feasible.
[0016] The optical detector comprises at least one optical sensor.
As used herein, the term "optical sensor" generally refers to an
element having a plurality of imaging elements, which, as will be
outlined in further detail below, are also referred to as "pixels".
Thus, an optical sensor comprises a plurality, preferably a matrix
of, imaging elements, such as light-sensitive imaging elements,
such as a matrix of pixels.
[0017] The optical sensor comprises at least one substrate and at
least one photosensitive layer setup disposed thereon. As used
herein, the expression "substrate" generally refers to a carrier
element providing mechanical stability to the optical sensor. As
will be outlined in further detail below, the substrate may be a
transparent substrate and/or an intransparent substrate. As an
example, the substrate may be a plate-shaped substrate, such as a
slide and/or a foil. The substrate generally may have a thickness
of 100 .mu.m to 5 mm, preferably a thickness of 500 .mu.m to 2 mm.
However, other thicknesses are feasible.
[0018] As further used herein, a photosensitive layer setup
generally refers to an entity having two or more layers which,
generally, has light-sensitive properties. Thus, the photosensitive
layer setup is capable of converting light in one or more of the
visible, the ultraviolet or the infrared spectral range into an
electrical signal. For this purpose, a large number of physical
and/or chemical effects may be used, such as photo effects and/or
excitation of organic molecules and/or formation of excited species
within the photosensitive layer setup.
[0019] The photosensitive layer setup has at least one first
electrode, at least one second electrode and at least one
photovoltaic material sandwiched in between the first electrode and
the second electrode. As will be outlined in further detail below,
the photosensitive layer setup may be embodied such that the first
electrode is closest to the substrate and, thus, is embodied as a
bottom electrode. Alternatively, the second electrode may be
closest to the substrate and, thus, may be embodied as a bottom
electrode. Generally, the expressions "first" and "second", as used
herein, are used for identification purposes only, without
intending any ranking and/or without intending to denote any order
of the photosensitive layer setup. Generally, the term "electrode"
refers to an element of the photosensitive layer setup capable of
electrically contacting the at least one photovoltaic material
sandwiched in between the electrodes. Thus, each electrode may
provide one or more layers and/or fields of an electrically
conductive material contacting the photovoltaic material.
Additionally, each of the electrodes may provide additional
electrical leads, such as one or more electrical leads for
contacting the first electrode and/or the second electrode. Thus,
each of the first and second electrodes may provide one or more
contact pads for contacting the first electrode and/or the second
electrode, respectively. As will be outlined in further detail
below, at least one electrode contact pad may be provided for each
of the first electrode stripes and/or for each of the second
electrode stripes which will be defined in further detail
below.
[0020] As used herein, a photovoltaic material generally is a
material or a combination of materials providing the
above-mentioned photosensitivity of the photosensitive layer setup.
Thus, the photovoltaic material may provide one or more layers of
material which, under illumination by light in one or more of the
visible, the ultraviolet or the infrared spectral range, are
capable of generating an electrical signal, preferably an
electrical signal indicating an intensity of illumination. Thus,
the photovoltaic material may comprise one or more photovoltaic
material layers which, by itself or in combination, are capable of
generating positive and/or negative charges in response to the
illumination, such as electrons and/or holes.
[0021] As used herein, the term "sandwiched" generally refers to
the fact that the photovoltaic material, at least partially, is
located in an intermediate space in between the first electrode and
the second electrode, notwithstanding the fact that other regions
of the photovoltaic material may exist, which are located outside
the intermediate space in between the first electrode and the
second electrode.
[0022] The photovoltaic material comprises at least one organic
material. Further, the first electrode comprises a plurality of
first electrode stripes, and the second electrode comprises a
plurality of second electrode stripes. As used herein, the term
"stripe generally refers to an elongated sheet, an elongated layer
of material or an elongated combination of layers of materials,
having a length or elongation which is larger than its width, such
as by at least a factor of 2, more preferably at least a factor of
5, most preferably at least a factor of 10 or at least a factor of
15. Thus, a stripe may be an elongated rectangular stripe.
Additionally or alternatively, the stripe may comprise one or more
bents, curves or other non-linear elements. Thus, generally, the
stripes may be linear stripes or may fully or partially be embodied
as curved or bent stripes, such as meander shaped stripes. A
plurality of stripes preferably may, at least partially, be
oriented in a parallel way. Thus, as an example, the first
electrode stripes may be parallel first electrode stripes.
Similarly, the second electrode stripes may be parallel second
electrode stripes. In case the electrode stripes are bent and/or
curved, the parallel orientation may be present at least for
sections of these electrode stripes. Other orientations are
feasible. Further, the stripes may have a uniform width all over
the elongation of each stripe. Thus, the width may be constant from
a beginning of each stripe to the end of the stripe. Additionally
or alternatively, the stripes each may have at least one section
with a varying width. Preferably, however, the width of each
stripe, over the full elongation of the stripe, does not change by
more than 50%, more preferably by no more than 20% and, most
preferably, by no more than 10% or even no more than 5%.
[0023] Thus, as an example, the electrode stripes may have a
rectangular, elongated shape. Preferably, the first electrode
stripes are parallel to each other, and the second electrode
stripes are parallel to each other, at least in a part of their
longitudinal extension. Further, preferably, the first electrode
stripes are located in a first electrode plane, whereas the second
electrode stripes are located in a second electrode plane, wherein,
preferably, the first electrode plane and the second electrode
plane are oriented parallel to each other. Thus, preferably, the
photovoltaic material at least partially is located in a space in
between the first electrode plane and the second electrode
plane.
[0024] The first electrode stripes and the second electrode stripes
intersect such that a matrix of pixels is formed at intersections
of the first electrode stripes and the second electrode stripes. As
used herein, the term "intersect" refers to the fact that, in a
direction of view perpendicular to the substrate surface, the first
electrode plane and the second electrode plane and/or in a
direction parallel to an optical axis of the optical sensor, the
first and second electrode stripes overlap. Each pixel comprises a
portion of a first electrode stripe and an opposing portion of a
second electrode stripe and an amount of the photovoltaic material
located in between the portion of the first electrode stripe and
the second electrode stripe. As an example, specifically in case
the electrode stripes are elongated rectangular electrode stripes,
the pixels may have a rectangular shape and/or a shape of a
parallelogram, specifically in a direction of view perpendicular to
a substrate surface. Thus, each of the pixels forms an imaging
element, comprising the portion of the first electrode stripe, the
portion of the second electrode stripe and the at least one
photovoltaic material embedded in between these portions.
[0025] As further used herein, a matrix generally refers to a
two-dimensional arrangement of pixels. Thus, the matrix preferably
may be a rectangular matrix having rows and columns of pixels, as
will be outlined in further detail below. Still, other shapes of
the matrix of pixels are feasible.
[0026] Further, each of the first electrode stripes and/or each of
the second electrode stripes may have at least one contacting
portion, such as at least one contact pad, for electrically
contacting the respective electrode stripe. This at least one
contacting portion preferably may be located outside the matrix of
pixels, such as close to a rim of the substrate. However, other
embodiments are feasible.
[0027] The optical detector further comprises at least one readout
device. As used herein, the term "readout device" generally refers
to a device or combination of devices adapted for generating a
plurality of measurement values and/or information values by using
the pixels of the matrix of pixels of the optical sensor. Thus,
generally, the readout device may be a device which is capable of
generating an image from electrical signals captured by using the
matrix of pixels. Thus, as will be outlined in further detail
below, the at least one readout device may comprise a plurality of
electrical measurement devices, such as a plurality of voltmeters
and/or a plurality of amperemeters. Further, the readout device may
comprise additional elements, such as a data memory, for storing
the information values generated that way, such as for storing one
image and/or for storing a plurality of images and/or an image
sequence. Further, additionally or alternatively, the at least one
readout device may comprise one or more electrical interfaces for
data transfer, such as for transferring information values to one
or more external devices, such as to one or more data processing
devices, wherein the at least one interface may be a wireless
interface and/or may fully or partially be embodied as a wire-bound
interface.
[0028] The readout device also may be referred to as an evaluation
device, may be part of a larger evaluation device or may comprise
at least one evaluation device. As used herein, the term evaluation
device generally refers to an arbitrary device adapted to evaluate
one or more sensor signals provided by the at least one optical
sensor and/or for performing one or more further evaluation
algorithms. The evaluation device specifically may comprise at
least one data processing device and, more preferably, by using at
least one processor. Thus, as an example, the at least one
evaluation device may comprise at least one data processing device
having a software code stored thereon comprising a number of
computer commands.
[0029] The evaluation device may be or may comprise one or more
integrated circuits, such as one or more application-specific
integrated circuits (ASICs), and/or one or more data processing
devices, such as one or more computers, preferably one or more
microcomputers and/or microcontrollers. Additional components may
be comprised, such as one or more preprocessing devices and/or data
acquisition devices, such as one or more devices for receiving
and/or preprocessing of the sensor signals, such as one or more
AD-converters and/or one or more filters. Further, the evaluation
device may comprise one or more measurement devices, such as one or
more measurement devices for measuring electrical currents and/or
electrical voltages. Thus, as an example, the evaluation device may
comprise one or more measurement devices for measuring electrical
currents through and/or electrical voltages of the pixels. Further,
the evaluation device may comprise one or more data storage
devices. Further, the evaluation device may comprise one or more
interfaces, such as one or more wireless interfaces and/or one or
more wire-bound interfaces.
[0030] The at least one evaluation device may be adapted to perform
at least one computer program, such as at least one computer
program adapted for performing or supporting one or more or even
all of the method steps of the method according to the present
invention. As an example, one or more algorithms may be implemented
which, by using the sensor signals as input variables, may
determine the position of the object.
[0031] The evaluation device can be connected to or may comprise at
least one further data processing device that may be used for one
or more of displaying, visualizing, analyzing, distributing,
communicating or further processing of information, such as
information obtained by the optical sensor and/or by the evaluation
device. The data processing device, as an example, may be connected
or incorporate at least one of a display, a projector, a monitor,
an LCD, a TFT, a loudspeaker, a multichannel sound system, an LED
pattern, or a further visualization device. It may further be
connected or incorporate at least one of a communication device or
communication interface, a connector or a port, capable of sending
encrypted or unencrypted information using one or more of email,
text messages, telephone, bluetooth, Wi-Fi, infrared or internet
interfaces, ports or connections. It may further be connected or
incorporate at least one of a processor, a graphics processor, a
CPU, an Open Multimedia Applications Platform (OMAP.TM.), an
integrated circuit, a system on a chip such as products from the
Apple A series or the Samsung S3C2 series, a microcontroller or
microprocessor, one or more memory blocks such as ROM, RAM, EEPROM,
or flash memory, timing sources such as oscillators or phase-locked
loops, counter-timers, real-time timers, or power-on reset
generators, voltage regulators, power management circuits, or DMA
controllers. Individual units may further be connected by buses
such as AMBA buses.
[0032] The evaluation device and/or the data processing device may
be connected by or have further external interfaces or ports such
as one or more of serial or parallel interfaces or ports, USB,
Centronics Port, FireWire, HDMI, Ethernet, Bluetooth, RFID, Wi-Fi,
USART, or SPI, or analog interfaces or ports such as one or more of
ADCs or DACs, or standardized interfaces or ports to further
devices such as a 2D-camera device using an RGB-interface such as
CameraLink. The evaluation device and/or the data processing device
may further be connected by one or more of interprocessor
interfaces or ports, FPGA-FPGA-interfaces, or serial or parallel
interfaces ports. The evaluation device and the data processing
device may further be connected to one or more of an optical disc
drive, a CD-RW drive, a DVD+RW drive, a flash drive, a memory card,
a disk drive, a hard disk drive, a solid state disk or a solid
state hard disk.
[0033] The evaluation device and/or the data processing device may
be connected by or have one or more further external connectors
such as one or more of phone connectors, RCA connectors, VGA
connectors, hermaphrodite connectors, USB connectors, HDMI
connectors, 8P8C connectors, BCN connectors, IEC 60320 C14
connectors, optical fiber connectors, D-subminiature connectors, RF
connectors, coaxial connectors, SCART connectors, XLR connectors,
and/or may incorporate at least one suitable socket for one or more
of these connectors.
[0034] Possible embodiments of a single device incorporating one or
more of the optical detectors according to the present invention,
the evaluation device or the data processing device, such as
incorporating one or more of the optical sensor, optical systems,
evaluation device, communication device, data processing device,
interfaces, system on a chip, display devices, or further
electronic devices, are: mobile phones, personal computers, tablet
PCs, televisions, game consoles or further entertainment devices.
In a further embodiment, the 3D-camera functionality which will be
outlined in further detail below may be integrated in devices that
are available with conventional 2D-digital cameras, without a
noticeable difference in the housing or appearance of the device,
where the noticeable difference for the user may only be the
functionality of obtaining and or processing 3D information.
[0035] Specifically, an embodiment incorporating the optical
detector and/or a part thereof such as the evaluation device and/or
the data processing device may be: a mobile phone incorporating a
display device, a data processing device, the optical sensor,
optionally the sensor optics, and the evaluation device, for the
functionality of a 3D camera. The detector according to the present
invention specifically may be suitable for integration in
entertainment devices and/or communication devices such as a mobile
phone.
[0036] A further embodiment of the present invention may be an
incorporation of the optical detector or a part thereof such as the
evaluation device and/or the data processing device in a device for
use in automotive, for use in autonomous driving or for use in car
safety systems such as Daimler's Intelligent Drive system, wherein,
as an example, a device incorporating one or more of the optical
sensors, optionally one or more optical systems, the evaluation
device, optionally a communication device, optionally a data
processing device, optionally one or more interfaces, optionally a
system on a chip, optionally one or more display devices, or
optionally further electronic devices may be part of a vehicle, a
car, a truck, a train, a bicycle, an airplane, a ship, a
motorcycle. In automotive applications, the integration of the
device into the automotive design may necessitate the integration
of the optical sensor, optionally optics, or device at minimal
visibility from the exterior or interior. The detector or a part
thereof such as the evaluation device and/or the data processing
device may be especially suitable for such integration into
automotive design.
[0037] The readout device comprises a plurality of electrical
measurement devices being connected to the second electrode stripes
and a switching device for subsequently connecting the first
electrode stripes to the electrical measurement devices.
[0038] As used herein, an electrical measurement device generally
refers to a device which is capable of performing at least one
electrical measurement, such as for performing at least one current
measurement and/or for performing at least one voltage measurement.
Thus, each electrical measurement device may comprise at least one
voltmeter and/or at least one amperemeter. Other embodiments are
feasible.
[0039] Preferably, at least one electrical measurement device is
provided for each of the second electrode stripes. Thus, as an
example, each second electrode stripe may be connected permanently
or releasably to one or more measurement devices dedicated to the
respective second electrode stripe. The measurement devices,
however, may be comprised within a single device, such as within
one integrated circuit. Preferably, the electrical measurement
devices are adapted for simultaneously measuring electrical signals
assigned to the respective second electrode stripes.
[0040] As further used herein, a switching device generally is a
device which is adapted for subsequently connecting the first
electrode stripes to the electrical measurement devices. Thus,
generally, at a specific moment in time, one specific first
electrode stripe may be connected to all of the measurement devices
and/or to a plurality of the measurement devices. Thus, as an
example, each measurement device may have a first measurement port
and a second measurement port, wherein the first measurement port
of the measurement devices or of a plurality of the measurement
devices is connected to one and the same first electrode stripe
selected by the switching device, whereas the second ports of the
measurement devices each are connected to their respective second
electrode stripes. The switching device, at a subsequent moment in
time, may be adapted to connect the measurement devices to another
one of the first electrode stripes, such as to a subsequent one of
the first electrode stripes. Thus, the switching device preferably
may be adapted to perform a multiplexing scheme, thereby
subsequently switching through all of the first electrode stripes
and/or through a predetermined number of the first electrode
stripes.
[0041] It shall further be noted that the switching may be
performed uniformly for all first electrode stripes. Alternatively,
the optical sensor may be split such that at least two switching
devices may be provided, each switching device being assigned to a
plurality of the first electrode stripes. Thus, the optical sensor
may be sub-divided into different regions of first electrode
stripes, each region being assigned to a dedicated switching
device. Additionally or alternatively, an interleaving switching
scheme may be used, such that every n.sup.th one of the first
electrode stripes is assigned to a specific switching device.
Various embodiments are feasible.
[0042] The optical detector further may comprise at least one
optical element for optically imaging at least one object onto the
optical sensor. As used herein, an optical element generally refers
to an element having focusing and/or defocusing properties. Thus,
as an example, the at least one optical element may comprise at
least one lens for imaging an object onto the at least one optical
sensor. Additional elements may be comprised within the optical
element, such as at least one diaphragm and/or at least one mirror.
Additionally or alternatively, one or more wavelength-selective
elements may be comprised, such as one or more optical filters
and/or one or more prisms and/or one or more dichroitic
mirrors.
[0043] The matrix of pixels, as outlined above, preferably may have
rows defined by the first electrode stripes and columns defined by
the second electrode stripes. Thus, the pixels may be arranged in
rows and columns, wherein each pixel may be identified by a row
number and/or a number of the first electrode stripe forming the
row and by a column number and/or a number of the second electrode
stripe forming the row. Each measurement device preferably may be
connected to a column, such that electrical signals for the pixels
of each row may be measured simultaneously. Thus, in one
measurement step, each of the measurement devices may provide at
least one measurement signal for the pixels contained in the row,
such that measurement values for all pixels of the row and/or at
least for a plurality of the pixels of the row may be measured
simultaneously. Subsequently, as outlined above, the switching
device may switch to another row, such as to a subsequent row, and
may allow for the measurement devices to measure electrical signals
of the pixels of this newly selected row, simultaneously. Thus, by
subsequently switching through the rows, such as by subsequently
switching through all rows of the matrix of pixels and/or through a
plurality of the rows of the matrix of pixels, measurement values
for the pixels may be generated. By assembling the measurement
values, an image may be generated.
[0044] The switching device may be adapted to subsequently connect
the rows to the electrical measurement devices.
[0045] As outlined above, the electrical measurement devices each
may comprise at least one of a current measurement device and a
voltage measurement device. Generally, it shall be noted that the
electrical measurement devices may be adapted to generate
electrical measurement signals which may be used as "raw"
electrical measurement signals, without any further processing.
Additionally or alternatively, the measurement signals may fully or
partially be subject to one or more signal processing steps, such
as one or more of a filtering step, an analogue-digital conversion
step, an averaging step, such as averaging measurement signals over
a number of measurement values and/or over a specific time span.
The at least one readout device may, accordingly, provide one or
more signal processing devices. The signal processing devices may
be adapted to generate processed measurement signals. In the
following, no difference will be made between raw measurement
signals and processed measurement signals, such that, wherever
measurement signals are mentioned, both options are feasible.
[0046] The measurement devices generally may be digital measurement
devices and/or analogue measurement devices. In case the
measurement devices are fully or partially designed as analogue
measurement devices, preferably, the electrical measurement devices
further comprise at least one analogue-digital converter. Thus, as
an example, each of the electrical measurement devices may comprise
at least one analogue-digital converter. Additionally or
alternatively, two or more or even all of the electrical
measurement devices may use one and the same analogue-digital
converter.
[0047] As outlined above, the readout device may further comprise
at least one data memory, such as at least one volatile and/or at
least one non-volatile data memory, for storing measurement values
for the pixels of the matrix.
[0048] It shall be noted that the readout device may be embodied as
a single device or as a plurality of devices. Thus, the readout
device may comprise one or more electrical circuit boards and/or
one or more integrated circuits. Thus, as an example, the readout
device may further comprise one or more application-specific
integrated circuits (ASICs).
[0049] As outlined above, the switching device generally may be
adapted to perform a multiplexing measurement scheme, multiplexing
through the rows of the matrix of pixels. In the multiplexing
measurement scheme, the first electrode stripes may iteratively be
connected to the electrical measurement devices. Thus, once the at
least one switching device has switched through all the rows of the
matrix of pixels and/or through all the rows assigned to the
specific switching device, the switching process may start anew,
from the beginning, such as by switching back to the first row.
Thus, generally, the at least one readout device may be adapted for
driving the detector in a so-called passive-matrix detection
scheme. Thus, generally, the optical detector may be a
passive-matrix optical detector. The electrical signals also
referred to as electrical measurement signals and/or information
values, be it in a raw form and/or in a processed form,
specifically may represent an intensity of illumination for each
pixel. Thus, as an example, the measurement values specifically may
be adapted to provide gray-scale values for each pixel. Thus, the
image may provide a matrix of information values, each information
value comprising a gray-scale value for a respective pixel of the
matrix of pixels. Thus, as an example, for each pixel, 4-bit
information values, 8-bit information values or even 16-bit
information values may be provided.
[0050] It shall further be noted that other information may be
provided by the optical sensor and/or the optical detector. Thus,
as an example, color information may be provided, as will be
outlined in further detail below. Further, it shall be noted that
the optical sensor, besides the pixels, may comprise one or more
additional elements, such as one or more additional light-sensitive
elements. Thus, as an example, the optical sensor may provide one
or more additional light-sensitive elements which are not part of
the matrix. Further, one or more portions of the matrix may be
exempt from the above-mentioned multiplexing scheme, such as for
using these one or more portions of the optical sensor for other
purposes.
[0051] As outlined above, one of the first electrode and the second
electrode may form a bottom electrode closest to the substrate, and
the other one may form a top electrode facing away from the
substrate. Further, the first electrode may be an anode of the
photosensitive layer setup, and the second electrode may be a
cathode of the photosensitive layer setup or vice versa.
[0052] Specifically, one of the first electrode and the second
electrode may be a bottom electrode and the other of the first
electrode and the second electrode may be a top electrode. The
bottom electrode may be applied to the substrate directly or
indirectly, wherein the latter e.g. may imply interposing one or
more buffer layers or protection layers in between the bottom
electrode and the substrate. The photovoltaic material may be
applied to the bottom electrode and may at least partially cover
the bottom electrode. As outlined above, one or more portions of
the bottom electrode may remain uncovered by the at least one
photovoltaic material, such as for contacting purposes. The top
electrode may be applied to the photovoltaic material, such that
one or more portions of the top electrode are located on top of the
photovoltaic material. As further outlined above, one or more
additional portions of the top electrode may be located elsewhere,
such as for contacting purposes. Thus, as an example, the bottom
electrode may comprise one or more contact pads, such as at least
one contact pad per electrode stripe of the bottom electrode, which
remain uncovered by the photovoltaic material. Similarly, the top
electrode may comprise one or more contact pads, such as at least
one contact pad per electrode stripe of the top electrode, wherein
the contact pad preferably is located outside an area coated by the
photovoltaic material.
[0053] As outlined above, the substrate may be intransparent or at
least partially transparent. As used herein, the term "transparent"
refers to the fact that, in one or more of the visible spectral
range, the ultraviolet spectral range or the infrared spectral
range, light may penetrate the substrate at least partially. Thus,
in one or more of the visible spectral range, the infrared spectral
range or the ultraviolet spectral range, the substrate may have a
transparency of at least 10%, preferably at least 30% or, more
preferably, at least 50%. As an example, a glass substrate, a
quartz substrate, a transparent plastic substrate or other types of
substrates may be used as transparent substrates. Further,
multi-layer substrates may be used, such as laminates.
[0054] As further used herein, the term "light" generally refers to
one or more of light in the visible spectral range, the ultraviolet
spectral range or the infrared spectral range. As further used
herein, the visible spectral range shall be a wavelength range of
380 nm to 780 nm. The infrared spectral range generally shall refer
to a spectral range of 780 nm to 1 mm, more preferably to a
spectral range of 780 nm to 3.0 .mu.m. As further used herein, the
term "ultraviolet spectral range" generally shall refer to the
range of 1 nm to 380 nm, preferably to the spectral range of 50 nm
to 380 nm, and, more preferably, to the spectral range of 200 nm to
380 nm.
[0055] As outlined above, one or both of the bottom electrode and
the top electrode may be transparent. Thus, depending on the
direction of illumination of the optical sensor, the bottom
electrode, the top electrode or both may be transparent. As an
example, in case a transparent substrate is used, preferably, at
least the bottom electrode is a transparent electrode. In case the
bottom electrode is the first electrode and/or in case the bottom
electrode functions as an anode, preferably, the bottom electrode
comprises at least one layer of a transparent conductive oxide,
such as indium-tin-oxide, zinc oxide, fluorine-doped tin oxide or a
combination of two or more of these materials. In case a
transparent substrate and a transparent bottom electrode are used,
a direction of illumination of the optical sensor may be through
the substrate. In case an intransparent substrate is used, the
bottom electrode may be transparent or intransparent. Thus, as an
example, an intransparent electrode may comprise one or more metal
layers of generally arbitrary thickness, such as one or more layers
of silver and/or other metals. As an example, the bottom electrode
and/or the first electrode may have a work function of 3 eV to 6
eV.
[0056] As outlined above, the top electrode may be intransparent or
transparent. In case an illumination of the optical sensor takes
place through the substrate and the bottom electrode, the top
electrode may be intransparent. In case an illumination takes place
through the top electrode, preferably, the top electrode is
transparent. Still, as will be outlined in further detail below,
the whole optical sensor may be transparent, at least in one or
more spectral ranges of light. In this case, both the bottom
electrode and the top electrode may be transparent.
[0057] In order to create a transparent top electrode, various
techniques may be used. Thus, as an example, the top electrode may
comprise a transparent conductive oxide, such as zinc oxide. The
transparent conductive oxide may be applied, as an example, by
using appropriate physical vapor deposition techniques, such as
sputtering, thermal evaporation and/or electron-beam evaporation.
The top electrode, preferably the second electrode, may be a
cathode. Alternatively, the top electrode may as well function as
an anode. Specifically in case the top electrode functions as a
cathode, the top electrode preferably comprises one or more metal
layers, such as metal layers having a work function of preferably
less than 4.5 eV, such as aluminum. In order to create a
transparent metal electrode, thin metal layers may be used, such as
metal layers having a thickness of less than 50 nm, more preferably
less than 40 nm or even more preferably less than 30 nm. Using
these metal thicknesses, a transparency at least in the visible
spectral range may be created. In order to still provide sufficient
electrical conductivity, the top electrode may, in addition to the
one or more metal layers, comprise additional electrically
conductive layers, such as one or more electrically conductive
organic materials applied in between the metal layers and the at
least one photovoltaic material. Thus, as an example, one or more
layers of an electrically conductive polymer may be interposed in
between the metal layer of the top electrode and the photovoltaic
material.
[0058] As outlined above, both the bottom electrode and the top
electrode each may comprise a plurality of electrode stripes,
corresponding to the first electrode stripes and the second
electrode stripes. Thus, the bottom electrode may comprise a
plurality of bottom electrode stripes which form one of the first
electrode stripes and the second electrode stripes. The top
electrode may comprise a plurality of top electrode stripes,
forming the other of the first electrode stripes and the second
electrode stripes.
[0059] As an example, the top electrode may comprise a plurality of
metal electrode stripes. As an example, the metal electrode stripes
forming the top electrode may be made of one or more metal layers
comprising one or more metals selected from the group consisting of
Ag, Al, Ag, Au, Pt, Cu. Additionally or alternatively, other metals
and/or combinations of metals, such as combinations of two or more
of the named metals and/or other metals may be used. Further, one
or more alloys may be used, containing two or more metals. As an
example, one or more alloys of the group consisting of NiCr,
AlNiCr, MoNb and AlNd may be used. As outlined above, however,
alternatively, the top electrode may comprise a plurality of
stripes made of a transparent conductive oxide, such as made of one
or more of the transparent conductive oxides listed above.
[0060] In case a plurality of metal electrode stripes are used,
several techniques for depositing the electrode stripes and/or
patterning the metal electrode stripes may be used. Thus, as an
example, one or more deposition techniques of the metal electrode
stripes may be used in which the patterning of the metal electrode
stripes takes place during deposition. Thus, as an example, one or
more shadow masks may be used, with slit-shaped openings
corresponding to the metal electrode stripes. Additionally or
alternatively, however, a large-area coating may be used in order
to deposit the metal electrode, followed by one or more patterning
steps for forming the metal electrode stripes, such as one or more
etching techniques. Again, additionally or alternatively, a
self-patterning technique may be used implementing a plurality of
electrically insulating separators. Thus, as an example, the metal
electrode stripes may be separated by electrically insulating
separators. This technique generally is known in the field of
display technology. For potential separators, which are applicable
for the present invention, reference may be made, e.g., to EP 1 191
819 A2, US 2005/0052120 A1, US 2003/0017360 A1 or other techniques
known in the field of cathode patterning of organic light-emitting
passive-matrix displays. Thus, generally, the electrically
insulating separators may be photoresist structures, specifically
photoresist structures having one or more negative photoresists,
specifically for providing sharp edges at the top. Thus, by using
insulating separators, a self-patterning of the top electrode into
corresponding top electrode stripes may be performed during
deposition of the top electrode.
[0061] As outlined above, the photosensitive layer setup preferably
may be a photovoltaic layer setup, specifically a layer setup of
one or more of an organic photodiode and/or a solar cell having one
or more organic materials. Preferably, the photosensitive layer
setup may be a layer setup of a dye-sensitized solar cell, more
preferably of a solid dye-sensitized solar cell (sDSC). Thus, the
optical sensor, specifically the photosensitive layer setup and,
more preferably, the photovoltaic material, may comprise an
n-semiconducting metal oxide, preferably a nano-porous
n-semiconducting metal oxide, wherein the electrically insulating
separators are deposited on top of the n-semiconducting metal
oxide. Thus, as an example, the optical detector may comprise a
layer setup of bottom electrode stripes directly or indirectly
deposited on top of the substrate, followed by one or more layers
of a nano-porous n-semiconducting metal oxide, such as one or more
layers of titanium dioxide. The electrically insulating separators,
specifically separator bars, may be deposited on top of the one or
more layers of the semiconducting metal oxide. The deposition of
the insulating separators may take place before or after
sensitizing the n-semiconducting metal oxide with at least one dye.
Thus, as an example, the separators may be deposited on top of the
n-semiconducting metal oxide, before sensitizing the
n-semiconducting metal oxide with the at least one dye.
Subsequently, one or more additional layers may be deposited, such
as one or more p-semiconducting materials, preferably one or more
p-semiconducting organic materials, followed by the deposition of
the top electrode which is self-patterned by the insulating
separators. Thus, as an example, the optical sensor may further
comprise at least one solid p-semiconducting organic material which
is deposited on top of the n-semiconducting metal oxide, wherein
the solid p-semiconducting organic material is sub-divided into a
plurality of stripe-shaped regions by the electrically insulating
separators. On top of the p-semiconducting organic material, one or
more layers of the top electrode may be deposited, and the
electrically insulating separators may sub-divide the top electrode
into a plurality of top electrode stripes.
[0062] As outlined above, the top electrode may be intransparent or
transparent. In case a transparent top electrode is provided,
several techniques are applicable, as partially explained above.
Thus, as an example, the top electrode may comprise one or more
metal layers. The at least one metal layer may have a thickness of
less than 50 nm, preferably a thickness of less than 40 nm, more
preferably a thickness of less than 30 nm or even a thickness of
less than 25 nm or less than 20 nm. The metal layer may comprise at
least one metal selected from the group consisting of: Ag, Al, Ag,
Au, Pt, Cu. Additionally or alternatively, other metals and/or
combinations of metals, such as combinations of two or more of the
named metals and/or other metals may be used. Further, one or more
alloys may be used, containing two or more metals. As an example,
one or more alloys of the group consisting of NiCr, AlNiCr, MoNb
and AlNd may be used. The use of other metals, however, is
possible.
[0063] The top electrode may further comprise at least one
electrically conductive polymer embedded in between the
photovoltaic material and the metal layer. The electrically
conductive polymer may be sub-divided into stripes, in order to
follow the shape of the top electrode stripes. The sub-division of
the electrically conductive polymer into electrically conductive
polymer stripes which, again, are covered by the metal stripes, may
be performed in various ways. Thus, as an example, the deposition
of the at least one electrically conductive polymer may be
performed in a patterned way, such as by using appropriate
patterned deposition techniques such as printing techniques.
Additionally or alternatively, a subsequent patterning may be used.
Again, additionally or alternatively, the above-mentioned
separators may as well be used for separating the electrically
conductive polymer into electrically conductive polymer
stripes.
[0064] Various possibilities of electrically conductive polymers
which are usable within the present invention exist. Thus, as an
example, the electrically conductive polymer may be intrinsically
electrically conductive. As an example, the electrically conductive
polymer may comprise one or more conjugated polymers. As an
example, the electrically conductive polymer may comprise at least
one polymer selected from the group consisting of a
poly-3,4-ethylenedioxythiophene (PEDOT), preferably PEDOT being
electrically doped with at least one counter ion, more preferably
PEDOT doped with sodium polystyrene sulfonate (PEDOT:PSS); a
polyaniline (PANI); a polythiophene.
[0065] The optical detector may further comprise at least one
encapsulation protecting one or more of the photovoltaic material,
the first electrode or the second electrode at least partially from
moisture. Thus, as an example, the encapsulation may comprise one
or more encapsulation layers and/or may comprise one or more
encapsulation caps. As an example, one or more caps selected from
the group consisting of glass caps, metal caps, ceramic caps and
polymer or plastic caps may be applied on top of the photosensitive
layer setup in order to protect the photosensitive layer setup or
at least a part thereof from moisture. Additionally or
alternatively, one or more encapsulation layers may be applied,
such as one or more organic and/or inorganic encapsulation layers.
Still, contact pads for electrically contacting the bottom
electrode stripes and/or the top electrode stripes may be located
outside the cap and/or the one or more encapsulation layers, in
order to allow for an appropriate electrical contacting of the
electrode stripes.
[0066] As outlined above, each of the pixels may form an individual
photovoltaic device, preferably an organic photovoltaic device.
Thus, as an example, each pixel may form a dye-sensitized solar
cell (DSC), more preferably a solid dye-sensitized solar cell
(sDSC). Thus, as outlined above, the photovoltaic material
preferably may comprise at least one n-semiconducting metal oxide,
at least one dye and at least one solid p-semiconducting organic
material. As further outlined above, the n-semiconducting metal
oxide may be sub-divided into at least one dense layer or solid
layer of the n-semiconducting metal oxide, functioning as a buffer
layer on top of the first electrode. Additionally, the
n-semiconducting metal oxide may comprise one or more additional
layers of the same or another n-semiconducting metal oxide having
nano-porous and/or nano-particulate properties. The dye may
sensitize the latter layer, by forming a separate dye layer on top
of the nano-porous n-semiconducting metal oxide and/or by soaking
at least part of the n-semiconducting metal oxide layer. Thus,
generally, the nano-porous n-semiconducting metal oxide may be
sensitized with the at least one dye, preferably with the at least
one organic dye.
[0067] The optical detector may comprise one or more of the optical
sensors as disclosed above and/or as disclosed in further detail
below. The optical detector, however, may comprise, additionally,
one or more additional imaging devices. As used herein, an
additional imaging device is imaging device which the setup of the
optical sensor as disclosed above or as disclosed in further detail
below. Thus, as an example, other types of optical sensors may be
used as additional imaging devices which do not have the setup as
disclosed above. Thus, as an example, the at least one optional
additional imaging device may be or may comprise one or more
conventional imaging devices. As an example, one or more
semiconductor imaging devices may be present within the optical
detector, such as one or more CCD chips and/or one or more CMOS
chips. Thus, the optical sensor may be used alone, in combination
with one or more additional optical sensors and/or in combination
with one or more additional imaging devices. As an example, the
optical detector may comprise a stack of at least two imaging
devices, wherein at least one of the imaging devices is the optical
sensor. As an example, a plurality of imaging devices may be
stacked along an optical axis of the detector, such as with their
respective sensitive surfaces facing parallel to the optical axis
of the detector. As an example, the optical sensor may be a
transparent optical sensor, and light entering the optical detector
may, firstly, pass the at least one optical sensor, before finally
illuminating an intransparent imaging device at an end of the stack
of imaging devices facing away from the object emitting the
light.
[0068] Further, in case a stack comprising at least two imaging
devices is used, the imaging devices may have the same spectral
sensitivity and/or may have differing spectral sensitivities. Thus,
as an example, one of the imaging devices may have a spectral
sensitivity in a first wavelength band, and another one of the
imaging devices may have a spectral sensitivity in a second
wavelength band, the first wavelength band being different from the
second wavelength band. By evaluating signals and/or images
generated with these imaging devices, a color information may be
generated. In this context, it is preferred to use at least one
transparent optical sensor within the stack of imaging devices, as
discussed above. The spectral sensitivities of the imaging devices
may be adapted in various ways. Thus, the at least one photovoltaic
material comprised in the imaging devices may be adapted to provide
a specific spectral sensitivity, such as by using different types
of dyes. Thus, by choosing appropriate dyes, a specific spectral
sensitivity of the imaging devices may be generated. Additionally
or alternatively, other means for adjusting the spectral
sensitivity of the imaging devices may be used. Thus, as an
example, one or more wavelength-selective elements may be used and
may be assigned to one or more of the imaging devices, such that
the one or more wavelength-selective elements, by definition,
become part of the respective imaging devices. As an example, one
or more wavelength-selective elements may be used selected from the
group consisting of a filter, preferably a color filter, a prism
and a dichroitic mirror. Thus, generally, by using one or more of
the above-mentioned means and/or other means, the imaging devices
may be adjusted such that two or more of the imaging device is
exhibit differing spectral sensitivities.
[0069] As outlined above, the optical detector specifically may
comprise a stack of at least two imaging devices. Therein, one or
preferably at least two of the imaging devices may be optical
sensors having the setup disclosed above or disclosed in further
detail below. These optical sensors may also be referred to as
pixelated optical sensors or simply pixelated sensors. Thus,
generally, the optical detector comprises one, two or more imaging
devices, wherein one or more of the imaging devices may be embodied
as or may comprise one or more optical sensors having the setup
disclosed above or as disclosed in further detail below. Thus, the
stack may comprise one, two or more optical sensors, such as
transparent or at least partially transparent optical sensors. The
stack specifically may comprise two or more optical sensors having
differing spectral sensitivities. Differing spectral sensitivities
specifically may be achieved by using two or more different types
of dyes. Thus, the stack may comprise at least one first type of
optical sensor having at least one first spectral sensitivity, such
as a first absorption spectrum, such as a first absorption spectrum
generated by using at least one first type of dye, and at least one
second type of optical sensor, having at least one second spectral
sensitivity, such as a second absorption spectrum, such as a second
absorption spectrum generated by using at least one second type of
dye. By evaluating sensor signals from the optical sensors having
differing spectral sensitivities, the optical detector may be
adapted to generate at least one item of color information
regarding an object within a field of view of the optical detector
and/or at least one item of color information regarding a light
beam entering the optical detector, such as color coordinates or
the like. For generating the at least one item of color
information, the sensor signals of the optical sensors having
differing spectral sensitivities specifically may be evaluated by
using at least one evaluation algorithm such as an algorithm using
the sensor signals as input variables and/or a lookup table or the
like. The stack specifically may comprise the optical sensors
having differing spectral sensitivities in an alternating
sequence.
[0070] By using a stack comprising two or more optical sensors, the
optical detector specifically may be adapted to acquire a
three-dimensional image by evaluating sensor signals of the optical
sensors. Thus, as outlined above, the pixelated optical sensors may
be arranged in a plurality of focal planes, allowing for
simultaneously or subsequently acquiring a stack of two-dimensional
images, wherein the two-dimensional images in combination may form
a three-dimensional image. The optical detector specifically may be
adapted to acquire a multicolor three-dimensional image, preferably
a full-color three-dimensional image, by evaluating sensor signals
of the optical sensors having differing spectral properties. Thus,
summarizing, the optical detector generally may be adapted to
acquire a three-dimensional image of a scene within a field of view
of the optical detector. A possible evaluation algorithm for
aquiring 3D image information is depth from defocus, further
algorithms are possible.
[0071] Additionally or alternatively, the optical detector may be
adapted for determining at least one position of at least one
object, such as an object within a field of view of the optical
detector and/or within a scene captured by the optical detector. As
used herein, the term "position" generally refers to an arbitrary
item of information regarding an absolute position and/or an
orientation of the object in space. As an example, the position may
be determined by one or more coordinates, such as one or more
Cartesian coordinates and/or rotational coordinates. Further, as an
example, the position may be determined by determining a distance
between the optical detector and the object.
[0072] For determining the position of the object and/or for
deriving at least one item of information regarding the position,
various algorithms may be used. Specifically, the optical detector
may be adapted, such as by an appropriate evaluation device and/or
by appropriately designing the readout device, to evaluate at least
one image captured by the at least one optical sensor of the
optical detector. For this purpose, various image evaluation
algorithms may be used. As an example, a transversal coordinate of
the object may be determined by evaluating a position of an image
of the object on the optical sensor. For determining a distance
between the object and the optical detector, various algorithms are
known to the skilled person and generally may be used. Thus, as an
example, the size of an image of the object on the optical sensor
may be evaluated, in order to determine the distance between the
object and the optical detector. Further, as an example, evaluation
algorithms such as "blob tracking" and/or "counter tracking" are
generally known to the skilled person and may be used in the
context of the present invention.
[0073] As will be outlined in further detail below, the optical
detector may further be adapted for acquiring a three-dimensional
image of an object and/or of a scene captured by the optical
detector. Thus, specifically by using a stack of pixelated optical
sensors, one or more three-dimensional images may be captured.
Thus, images acquired by each pixelated optical sensor may be
combined to achieve one or more three-dimensional images. By
evaluating the one or more three-dimensional images, further
information regarding the position of at least one object may be
derived. Thus, by detecting an image of the object within the
three-dimensional image generated by using the optical detector, a
position of the object in space may be derived. This is generally
due to the fact that, by detecting the image of the object within
the three-dimensional image and by using generally known imaging
properties of the optical detector, position information regarding
the object in space may be derived.
[0074] Thus, generally, the optical detector, may be used to record
images such as at different focal planes simultaneously. Preferably
the distances to the lens are as such, that different parts of the
images are in focus. Thus, the images can be used in
image-processing techniques known as focus stacking, z-stacking,
focal plane merging. One application of these techniques is
obtaining images with greater depth of field, which is especially
helpful in imaging techniques with typically very shallow depth of
field such as macro photography or optical microscopy. Another
application is to obtain distance information using algorithms,
convolution based algorithms such as depth from focus or depth from
defocus. Another application is to optimize the images to obtain a
greater artistic or scientific merit.
[0075] The optical detector having the plurality of pixelated
sensors also may be used to record a light-field behind a lens or
lens system of the detector, comparable to a plenoptic or
light-field camera. Thus, specifically, the detector may be
embodied as a light-field camera adapted for acquiring images in
multiple focal planes, such as simultaneously. The term
light-field, as used herein, generally refers to the spatial light
propagation of light inside the detector such as inside camera. The
detector according to the present invention, specifically having a
stack of optical sensors, may have the capability of directly
recording a light-field within the detector or camera, such as
behind a lens. The plurality of pixelated sensors may record images
at different distances from the lens. Using, e.g.,
convolution-based algorithms such as "depth from focus" or "depth
from defocus", the propagation direction, focus points, and spread
of the light behind the lens can be modeled. From the modeled
propagation of light behind the lens, images at various distances
to the lens can be extracted, the depth of field can be optimized,
pictures that are in focus at various distances can be extracted,
or distances of objects can be calculated. Further information may
be extracted.
[0076] Once the light propagation inside the detector, such as
behind a lens of the detector, is modeled and/or recorded, this
knowledge of light propagation provides a large number of
advantages. This knowledge of light propagation, as an example,
allows for slightly modifying the observer position after recording
an image stack using image processing techniques. In a single
image, an object may be hidden behind another object and is not
visible. However, if the light scattered by the hidden object
reaches the lens and through the lens one or more of the sensors,
the object may be made visible, by changing the distance to the
lens and/or the image plane relative to the optical axis, or even
using non-planar image planes. The change of the observer position
may be compared to looking at a hologram, in which changing the
observer position slightly changes the image. The modification of
observer position may be especially beneficial in motion capture
and three dimensional video recordings as an unrealistically flat
perception of three dimensional objects, known as cardboard effect,
is avoided.
[0077] The use of several pixelated sensors further allows for
correcting lens errors in an image processing step after recording
the images. Optical instruments often become expensive and
challenging in construction, when lens errors need to be corrected.
These are especially problematic in microscopes and telescopes. In
microscopes, a typical lens error is that rays of varying distance
to the optical axis are distorted differently (spherical
aberration). In telescopes, varying the focus may occur from
differing temperatures in the atmosphere. Static errors such as
spherical aberration or further errors from production may be
corrected by determining the errors in a calibration step and then
using a fixed image processing such as fixed set of pixels and
sensor, or more involved processing techniques using light
propagation information. In cases in which lens errors are strongly
time-dependent, i.e. dependent on weather conditions in telescopes,
the lens errors may be corrected by using the light propagation
behind the lens, calculating extended depth of field images, using
depth from focus techniques, and others.
[0078] The optical detector according to the present invention,
comprising the at least one optical sensor and the at least one
readout device, may further be combined with one or more other
types of sensors or detectors. Thus, the optical detector
comprising the at least one optical sensor having the matrix of
pixels (in the following also simply referred to as the pixelated
optical sensor and/or the pixelated sensor) and the at least one
readout device may further comprise at least one additional
detector. The at least one additional detector may be adapted for
detecting at least one parameter, such as at least one of: a
parameter of a surrounding environment, such as a temperature
and/or a brightness of a surrounding environment; a parameter
regarding a position and/or orientation of the detector; a
parameter specifying a state of the object to be detected, such as
a position of the object, e.g. an absolute position of the object
and/or an orientation of the object in space. Thus, generally, the
principles of the present invention may be combined with other
measurement principles in order to gain additional information
and/or in order to verify measurement results or reduce measurement
errors or noise.
[0079] Specifically, the detector according to the present
invention may further comprise at least one time-of-flight (ToF)
detector adapted for detecting at least one distance between the at
least one object and the optical detector by performing at least
one time-of-flight measurement. As used herein, a time-of-flight
measurement generally refers to a measurement based on a time a
signal needs for propagating between two objects or from one object
to a second object and back. In the present case, the signal
specifically may be one or more of an acoustic signal or an
electromagnetic signal such as a light signal. A time-of-flight
detector consequently refers to a detector adapted for performing a
time-of-flight measurement. Time-of-flight measurements are
well-known in various fields of technology such as in commercially
available distance measurement devices or in commercially available
flow meters, such as ultrasonic flow meters. Time-of-flight
detectors even may be embodied as time-of-flight cameras. These
types of cameras are commercially available as range-imaging camera
systems, capable of resolving distances between objects based on
the known speed of light.
[0080] Presently available ToF detectors generally are based on the
use of a pulsed signal, optionally in combination with one or more
light sensors such as CMOS-sensors. A sensor signal produced by the
light sensor may be integrated. The integration may start at two
different points in time. The distance may be calculated from the
relative signal intensity between the two integration results.
[0081] Further, as outlined above, ToF cameras are known and may
generally be used, also in the context of the present invention.
These ToF cameras may contain pixelated light sensors. However,
since each pixel generally has to allow for performing two
integrations, the pixel construction generally is more complex and
the resolutions of commercially available ToF cameras are rather
low (typically 200.times.200 pixels). Distances below .about.40 cm
and above several meters typically are difficult or impossible to
detect. Furthermore, the periodicity of the pulses leads to
ambiguous distances, as only the relative shift of the pulses
within one period is measured.
[0082] ToF detectors, as standalone devices, typically suffer from
a variety of shortcomings and technical challenges. Thus, in
general, ToF detectors and, more specifically, ToF cameras suffer
from rain and other transparent objects in the light path, since
the pulses might be reflected too early, objects behind the
raindrop are hidden, or in partial reflections the integration will
lead to erroneous results. Further, in order to avoid errors in the
measurements and in order to allow for a clear distinction of the
pulses, low light conditions are preferred for ToF-measurements.
Bright light such as bright sunlight can make a ToF-measurement
impossible. Further, the energy consumption of typical ToF cameras
is rather high, since pulses must be bright enough to be
back-reflected and still be detectable by the camera. The
brightness of the pulses, however, may be harmful for eyes or other
sensors or may cause measurement errors when two or more ToF
measurements interfere with each other. In summary, current ToF
detectors and, specifically, current ToF-cameras suffer from
several disadvantages such as low resolution, ambiguities in the
distance measurement, limited range of use, limited light
conditions, sensitivity towards transparent objects in the light
path, sensitivity towards weather conditions and high energy
consumption. These technical challenges generally lower the
aptitude of present ToF cameras for daily applications such as for
safety applications in cars, cameras for daily use or
human-machine-interfaces, specifically for use in gaming
applications.
[0083] In combination with the optical detector according to the
present invention, providing at least one pixelated optical sensor
and the readout device, the advantages and capabilities of both
systems may be combined in a fruitful way. Thus, the optical
detector may provide advantages at bright light conditions, while
the ToF detector generally provides better results at low-light
conditions. A combined device, i.e. an optical detector according
to the present invention further including at least one ToF
detector, therefore provides increased tolerance with regard to
light conditions as compared to both single systems. This is
especially important for safety applications, such as in cars or
other vehicles.
[0084] Specifically, the optical detector may be designed to use at
least one ToF measurement for correcting at least one measurement
performed by using the pixelated optical sensor and vice versa.
Further, the ambiguity of a ToF measurement may be resolved by
using the optical detector. A measurement using the pixelated
optical sensor specifically may be performed whenever an analysis
of ToF measurements results in a likelihood of ambiguity.
Additionally or alternatively, measurements using the pixelated
optical sensor may be performed continuously in order to extend the
working range of the ToF detector into regions which are usually
excluded due to the ambiguity of ToF measurements. Additionally or
alternatively, the pixelated optical sensor may cover a broader or
an additional range to allow for a broader distance measurement
region. The pixelated optical sensor, specifically when used in a
camera, may further be used for determining one or more important
regions for measurements to reduce energy consumption or to protect
eyes. Thus the pixelated optical sensor may be adapted for
detecting one or more regions of interest. Additionally or
alternatively, the pixelated optical sensor may be used for
determining a rough depth map of one or more objects within a scene
captured by the detector, wherein the rough depth map may be
refined in important regions by one or more ToF measurements.
Further, the pixelated optical sensor may be used to adjust the ToF
detector, such as the ToF camera, to the required distance region.
Thereby, a pulse length and/or a frequency of the ToF measurements
may be pre-set, such as for removing or reducing the likelihood of
ambiguities in the ToF measurements. Thus, generally, the pixelated
optical sensor may be used for providing an autofocus for the ToF
detector, such as for the ToF camera.
[0085] As outlined above, a rough depth map may be recorded by the
pixelated optical sensor, which may be used as a camera or as a
part of a camera. Further, the rough depth map, containing depth
information or z-information regarding one or more objects within a
scene captured by the detector, may be refined by using one or more
ToF measurements. The ToF measurements specifically may be
performed only in important regions. Additionally or alternatively,
the rough depth map may be used to adjust the ToF detector,
specifically the ToF camera.
[0086] Further, the use of the pixelated optical sensor in
combination with the at least one ToF detector may solve the
above-mentioned problem of the sensitivity of ToF detectors towards
the nature of the object to be detected or towards obstacles or
media within the light path between the detector and the object to
be detected, such as the sensitivity towards rain or weather
conditions. A combined pixelated/ToF measurement may be used to
extract the important information from ToF signals, or measure
complex objects with several transparent or semi-transparent
layers. Thus, objects made of glass, crystals, liquid structures,
phase transitions, liquid motions, etc. may be observed. Further,
the combination of a pixelated detector and at least one ToF
detector will still work in rainy weather, and the overall detector
will generally be less dependent on weather conditions. As an
example, measurement results provided by the pixelated optical
sensor may be used to remove the errors provoked by rain from ToF
measurement results, which specifically renders this combination
useful for safety applications such as in cars or other
vehicles.
[0087] The implementation of at least one ToF detector into the
optical detector according to the present invention may be realized
in various ways. Thus, the at least one pixelated optical sensor
and the at least one ToF detector may be arranged in a sequence
within the same light path. As an example, at least one transparent
pixelated optical sensor may be placed in front of at least one ToF
detector. Additionally or alternatively, separate light paths or
split light paths for the pixelated optical sensor and the ToF
detector may be used. Therein, as an example, light paths may be
separated by one or more beam-splitting elements, such as one or
more of the beam splitting elements listed above or listed in
further detail below. As an example, a separation of beam paths by
wavelength-selective elements may be performed. Thus, e.g., the ToF
detector may make use of infrared light, whereas the pixelated
optical sensor may make use of light of a different wavelength. In
this example, the infrared light for the ToF detector may be
separated off by using a wavelength-selective beam splitting
element such as a hot mirror. Additionally or alternatively, light
beams used for the measurement using the pixelated optical sensor
and light beams used for the ToF measurement may be separated by
one or more beam-splitting elements, such as one or more
semitransparent mirrors, beam-splitter cubes, polarization beam
splitters or combinations thereof. Further, the at least one
pixelated optical sensor and the at least one ToF detector may be
placed next to each other in the same device, using distinct
optical pathways. Various other setups are feasible.
[0088] The at least one optional ToF detector may be combined with
basically any of the embodiments of the optical detector according
to the present invention. Specifically, the at least one ToF
detector which may be a single ToF detector or a ToF camera, may be
combined with a single optical sensor or with a plurality of
optical sensors such as a sensor stack. Further, the optical
detector may also comprise one or more imaging devices such as one
or more inorganic imaging devices like CCD chips and/or CMOS chips,
preferably one or more full-color CCD chips or full-color CMOS
chips. Additionally or alternatively, the optical detector may
further comprise one or more thermographic cameras.
[0089] As outlined above, the at least one optical sensor or
pixelated sensor of the detector, as an example, may be or may
comprise at least one organic optical sensor. As an example, the at
least one optical sensor may be or may comprise at least one
organic solar cell, such as at least one dye-sensitized solar cell
(DSC), preferably at least one solid DSC or sDSC. Specifically, the
at least one optical sensor may be or may comprise at least one
optical sensor capable of showing an effect of the sensor signal
being dependent on a photon density or flux of photons. In the
following, these types of optical sensors are referred to as FiP
sensors. In FiP sensors, given the same total power p of
illumination, the sensor signal i is generally dependent on a flux
F of photons, i.e. the number of photons per unit area. In other
words, the at least one optical sensor may comprise at least one
optical sensor which is defined as a FiP sensor, i.e. as an optical
sensor capable of providing a sensor signal, the optical sensor
having at least one sensor region, such as a plurality of sensor
regions like e.g. pixels, wherein the sensor signal, given the same
total power of illumination of the sensor region by the light beam,
is dependent on a geometry of the illumination, in particular on a
beam cross section of the illumination on the sensor area. This
effect including potential embodiments of optical sensors
exhibiting this effect (such as sDSCs) is disclosed in further
detail in WO 2012/110924 A1, in U.S. provisional applications
61/739,173, filed on Dec. 19, 2012, 61/749,964, filed on Jan. 8,
2013, and 61/867,169, filed on Aug. 19, 2013, and international
patent application PCT/162013/061095, filed on Dec. 18, 2013. The
embodiments of optical sensors exhibiting the FiP effect as
disclosed in these prior art documents, which all are included
herewith by reference, may also be used as optical sensors in the
detector according to the present invention, besides the fact that
the optical sensors or at least one of the optical sensors are
pixelated. Thus, the optical sensors as used in one or more of the
above-mentioned prior art documents, in a pixelated fashion, may
also be used in the context of the present invention. As outlined
above, a pixelation may simply be achieved by an appropriate
patterning of the first and/or second electrodes of these optical
sensors. Thus, each of the pixels of the pixelated optical sensor
exhibiting the above-mentioned FiP-effect may, by itself, form a
FiP sensor.
[0090] Thus, the optical detector according to the present
invention specifically may fully or partially be embodied as a
pixelated FiP camera, i.e. as a camera in which the at least one
optical sensor or, in case a plurality of optical sensors is
provided, at least one of the optical sensors, are embodied as
pixelated FiP sensors. In pixeled FiP-cameras, pictures may be
recorded in a similar way as disclosed above in the setup of the
light-field camera. Thus, the detector may comprise a stack of
optical sensors, each optical sensor being embodied as a pixelated
FiP sensor. Pictures may be recorded at different distances from
the lens. A depth can be calculated from these pictures using
approaches such as depth-from-focus and/or depth-from-defocus.
[0091] The FiP measurement typically necessitates two or more FiP
sensors such as organic solar cells exhibiting the FiP effect. The
photon density on the different cells may vary as such, that a
current ratio of at least 1/100 is obtained between a cell close to
focus and a cell out of focus. If the ratio is closer to 1, the
measurement may be imprecise.
[0092] The at least one readout device, which may fully or
partially be embodied as an evaluation device of the optical
detector or which may fully or partially be part of an evaluation
device of the optical detector, may specifically be embodied to
compare signals generated by pixels of different optical sensors,
the pixels being located on a line parallel to an optical axis of
the detector. A light cone of the light beam might cover a single
pixel in the focus region. In the out-of-focus region, only a small
part of the light cone will cover the pixel. Thus, in a stack of
pixelated FiP sensors, the signal of the pixel of the sensor being
out of focus will generally be much smaller than the signal of the
pixel of the sensor being in focus. Consequently, the signal ratio
will improve. For a calculation of the distance between the object
and the detector, more than two optical sensors may be used in
order to further increase the precision.
[0093] Thus, generally, the at least one optical sensor may
comprise at least one stack of optical sensors, each optical sensor
having at least one sensor region and being capable of providing at
least one sensor signal, wherein the sensor signal, given the same
total power of illumination of the sensor region by the light beam,
is dependent on a geometry of the illumination, in particular on a
beam cross section of the illumination on the sensor area, wherein
the evaluation device may be adapted to compare at least one sensor
signal generated by at least one pixel of a first one of the
optical sensors with at least one sensor signal generated by at
least one pixel of a second one of the optical sensors,
specifically for determining a distance between at least one object
and the optical detector and/or a z-coordinate of the object. The
readout device, specifically the evaluation device, may further be
adapted for evaluating the sensor signals of the pixels. Thus, one
or more evaluation algorithms may be used. Additionally or
alternatively, other means of evaluation may be used, such as by
using one or more lookup tables, such as one or more lookup tables
comprising FiP sensor signal values or ratios thereof and
corresponding z-coordinates of the object and/or corresponding
distances between the object and the detector. An analysis of
several FiP-signals, taking into account the distance to the lens
and/or a distance between the optical sensors may also result in
information regarding the light beam, such as the spread of the
light beam and, thus, the conventional FiP-distance.
[0094] The photosensitive layer setup may comprise at least 3 first
electrode stripes, preferably at least 10 first electrode stripes,
more preferably at least 30 first electrode stripes and most
preferably at least 50 first electrode stripes. Similarly, the
photosensitive layer setup may comprise at least 3 second electrode
stripes, preferably at least 10 second electrode stripes, more
preferably at least 30 second electrode stripes and most preferably
at least 50 second electrode stripes. Thus, as an example, the
photosensitive layer setup may comprise 3-1200 first electrode
stripes and 3-1200 second electrode stripes, preferably 10-1000
first electrode stripes and 10-1000 second electrode stripes and
more preferably 50-500 first electrode stripes and 50-500 second
electrode stripes. Other embodiments, however, are feasible.
[0095] In a further aspect of the present invention, a detector
system for determining a position of at least one object is
disclosed. The detector system comprises at least one optical
detector according to the present invention, such as at least one
optical detector as disclosed in one or more of the embodiments
described above and/or as disclosed in one or more of the
embodiments disclosed in further detail below. As outlined above,
the optical detector comprises one, two or more imaging devices,
wherein one or more of the imaging devices may be embodied as or
may comprise one or more optical sensors having the setup disclosed
above or as disclosed in further detail below, i.e. one or more
pixelated optical sensors. Specifically, the optical detector may
comprise a stack of two or more pixelated optical sensors. As
outlined above, by using two or more pixelated optical sensors,
such as a stack of two or more pixelated optical sensors, and by
acquiring images using these pixelated optical sensors, a
three-dimensional image of a scene captured by the optical detector
and/or of an object may be captured. By evaluating the
three-dimensional image, such as by detecting an image of the
object within the three-dimensional image, and optionally by using
known imaging properties of the optical detector, such as known
imaging properties of at least one lens of the optical detector, a
position of the object in space may be determined, such as a
distance between the object and the optical detector and/or other
items of information regarding the position of the object in
space.
[0096] The detector system may further comprise at least one beacon
device adapted to direct at least one light beam towards the
detector. As used herein, a beacon device generally refers to an
arbitrary device adapted to direct at least one light beam towards
the optical detector. The beacon device may fully or partially be
embodied as an active beacon device, comprising at least one
illumination source for generating the light beam. Additionally or
alternatively, the beacon device may fully or partially be embodied
as a passive beacon device comprising at least one reflective
element adapted to reflect a primary light beam generated
independently from the beacon device towards the optical
detector.
[0097] The beacon device is at least one of attachable to the
object, holdable by the object and integratable into the object.
Thus, the beacon device may be attached to the object by an
arbitrary attachment means, such as one or more connecting
elements. Additionally or alternatively, the object may be adapted
to hold the beacon device, such as by one or more appropriate
holding means. Additionally or alternatively, again, the beacon
device may fully or partially be integrated into the object and,
thus, may form part of the object or even may form the object.
[0098] Generally, with regard to potential embodiments of the
beacon device, reference may be made to one or more of U.S.
provisional applications 61/739,173, filed on Dec. 19, 2012,
61/749,964, filed on Jan. 8, 2013, and 61/867,169, filed on Aug.
19, 2013, and international patent application PCT/162013/061095,
filed on Dec. 18, 2013, the full content of all of which is
herewith included by reference. Other embodiments are feasible.
[0099] As outlined above, the beacon device may fully or partially
be embodied as an active beacon device and may comprise at least
one illumination source. Thus, as an example, the beacon device may
comprise a generally arbitrary illumination source, such as an
illumination source selected from the group consisting of a
light-emitting diode (LED), a light bulb, an incandescent lamp and
a fluorescent lamp. Other embodiments are feasible.
[0100] Additionally or alternatively, as outlined above, the beacon
device may fully or partially be embodied as a passive beacon
device and may comprise at least one reflective device adapted to
reflect a primary light beam generated by an illumination source
independent from the object. Thus, in addition or alternatively to
generating the light beam, the beacon device may be adapted to
reflect a primary light beam towards the detector.
[0101] The detector system may comprise none, one, two, three or
more beacon devices. Thus, generally, in case the object is a rigid
object which, at least on a microscope scale, does not change its
shape, preferably, at least two beacon devices may be used. In case
the object is fully or partially flexible or is adapted to fully or
partially change its shape, preferably, three or more beacon
devices may be used. Generally, the number of beacon devices may be
adapted to the degree of flexibility of the object. Preferably, the
detector system comprises at least three beacon devices.
[0102] The object generally may be a living or non-living object.
The detector system even may comprise the at least one object, the
object thereby forming part of the detector system. Preferably,
however, the object may move independently from the detector, in at
least one spatial dimension.
[0103] The object generally may be an arbitrary object. In one
embodiment, the object may be a rigid object. Other embodiments are
feasible, such as embodiments in which the object is a non-rigid
object or an object which may change its shape.
[0104] As will be outlined in further detail below, the present
invention may specifically be used for tracking positions and/or
motions of a person, such as for the purpose of controlling
machines, gaming or simulation of sports. In this or other
embodiments, specifically, the object may be selected from the
group consisting of: an article of sports equipment, preferably an
article selected from the group consisting of a racket, a club, a
bat; an article of clothing; a hat; a shoe. In a further aspect of
the present invention, a human-machine interface for exchanging at
least one item of information between a user and a machine is
disclosed. The human-machine interface comprises at least one
detector system according to the present invention, such as to one
or more of the embodiments disclosed above and/or according to one
or more of the embodiments disclosed in further detail below. The
beacon devices are adapted to be at least one of directly or
indirectly attached to the user and held by the user. The
human-machine interface is designed to determine at least one
position of the user by means of the detector system. The
human-machine interface further is designed to assign to the
position at least one item of information.
[0105] In a further aspect of the present invention, an
entertainment device for carrying out at least one entertainment
function is disclosed. The entertainment device comprises at least
one human-machine interface according to the present invention. The
entertainment device further is designed to enable at least one
item of information to be input by a player by means of the
human-machine interface. The entertainment device further is
designed to vary the entertainment function in accordance with the
information.
[0106] In a further aspect of the present invention, a tracking
system for tracking a position of at least one movable object is
disclosed. The tracking system comprises at least one detector
system according to the present invention, such as to one or more
of the embodiments disclosed above and/or according to one or more
of the embodiments disclosed in further detail below. The tracking
system further comprises at least one track controller, wherein the
track controller is adapted to track a series of positions of the
object at specific points in time.
[0107] In a further aspect of the present invention, a method for
manufacturing an optical detector is disclosed. Preferably, the
optical detector is an optical detector according to the present
invention, such as according to one or more of the embodiments
disclosed above and/or according to one or more of the embodiments
disclosed in further detail below. Thus, for potential embodiments
of the optical detector, reference may be made to the disclosure of
the optical detector above and/or below. Other embodiments,
however, are feasible.
[0108] The method comprises the following method steps. The method
steps are given in a preferred order. It shall be noted, however,
that the method steps may also be performed in a different order.
Further, two or more or even all of the method steps may be
performed simultaneously and/or in an overlapping fashion. Further,
one, two or more of the method steps may be performed repeatedly.
The method may comprise additional method steps which are not
listed in the following.
[0109] The method steps are as follows: [0110] a) manufacturing an
optical sensor, wherein a photosensitive layer setup is deposited
onto a substrate, the photosensitive layer setup having at least
one first electrode, at least one second electrode and at least one
photovoltaic material sandwiched in between the first electrode and
the second electrode, wherein the photovoltaic material comprises
at least one organic material, wherein the first electrode
comprises a plurality of first electrode stripes and wherein the
second electrode comprises a plurality of second electrode stripes,
wherein the first electrode stripes and the second electrode
stripes intersect such that a matrix of pixels is formed at
intersections of the first electrode stripes and the second
electrode stripes; and [0111] b) connecting at least one readout
device to the optical sensor, the readout device comprising a
plurality of electrical measurement devices being connected to the
second electrode stripes, the readout device further comprising at
least one switching device for subsequently connecting the first
electrode stripes to the electrical measurement devices.
[0112] With regard to potential embodiments of the optical sensor
and/or the readout device as well as with regard to potential
deposition techniques, reference may be made to the disclosure of
the optical detector as given above and/or as given in further
detail below.
[0113] The connection of the at least one readout device to the
optical sensor, preferably to electrical contact pads of the
optical sensor contacting the electrode stripes, may be performed
in a permanent way and/or in a releasable way. Thus, in a most
simple fashion, contact pins and/or contact clamps may be used for
electrically contacting the electrode stripes. Additionally or
alternatively, permanent connection techniques may be used, such as
connector techniques known in display technology, such as liquid
crystal display technology and/or other display technologies. Thus,
the connection may take place by using one or more electrically
conductive adhesives, such as one or more anisotropic electrically
conductive adhesives and/or so-called zebra connectors, i.e.
adhesive stripes having conductive portions and non-conductive
portions. These techniques are generally known to the skilled
person.
[0114] One or both of the method steps given above may comprise two
or more sub-steps. Thus, as an example, method step a) may comprise
the following sub-steps: [0115] a1. providing the substrate; [0116]
a2. depositing at least one bottom electrode onto the substrate,
wherein the bottom electrode is one of the first electrode or
second electrode, wherein the bottom electrode comprises a
plurality of bottom electrode stripes; [0117] a3. depositing the at
least one photovoltaic material onto the bottom electrode; [0118]
a4. depositing at least one top electrode onto the photovoltaic
material, wherein the top electrode is the other one of the first
electrode and the second electrode as compared to method step a2.,
wherein the top electrode comprises a plurality of top electrode
stripes, wherein the top electrode stripes are deposited such that
the bottom electrode stripes and the top electrode stripes
intersect such that the matrix of pixels is formed.
[0119] For potential details of the substrate and the deposition of
the bottom electrode and/or the top electrode, reference may be
made to the disclosure given above and/or for further optional
embodiments given below. For depositing the at least one
photovoltaic material, reference may be made to known deposition
techniques, such as deposition techniques disclosed in one or more
of WO 2012/110924 A1, U.S. provisional application No. 61/739,173
or U.S. provisional application No. 61/749,964. Other deposition
techniques, however, are feasible.
[0120] As outlined above, various techniques are feasible for
patterning the bottom electrode. Thus, as an example, the bottom
electrode may be deposited in an unpatterned way and may
subsequently be patterned, preferably by using lithographic
techniques such as etching techniques. These techniques, as an
example, are known in the field of display technologies, such as
for patterning indium-doped tin oxide (ITO), which may also be used
within the present invention. Additionally or alternatively, the
bottom electrode may be deposited in a patterned way, preferably by
using one or more of a deposition technique through a mask, such as
a shadow mask, or a printing technique.
[0121] Method step a3. may comprise a number of sub-steps by
itself. Thus, as an example, the deposition of the at least one
photovoltaic material may comprise a build-up of a layer setup of a
plurality of photovoltaic materials. As an example, method step a3.
may comprise the following method steps: [0122] depositing at least
one layer of a dense n-semiconducting metal oxide, preferably a
dense layer of TiO.sub.2; [0123] depositing at least one layer of a
nano-porous n-semiconducting metal oxide, preferably at least one
layer of nano-porous TiO.sub.2; [0124] sensitizing the at least one
layer of the nano-porous n-semiconducting metal oxide with at least
one organic dye; [0125] depositing at least one layer of a solid
p-semiconducting organic material on top of the sensitized
nano-porous n-semiconducting metal oxide.
[0126] The deposition techniques used for depositing these layers
generally are known to the skilled person. Thus, again, reference
may be made to the above-mentioned documents. As an example, for
depositing the dense layer of the n-semiconducting metal oxide,
spray pyrolysis deposition or physical vapor deposition techniques
may be used, such as sputtering, preferably reactive sputtering.
Thus, as an example, the at least one layer of the dense
n-semiconducting metal oxide may comprise one or more layers of
titanium dioxide, preferably having a thickness of 10 nm-500 nm.
For depositing the at least one layer of the nano-porous
n-semiconducting metal oxide, various deposition techniques may be
used, such as wet processing and/or printing. As an example, wet
coating techniques may be used, such as doctor blading and/or spin
coating, of solutions and/or dispersions containing particles of
the nano-porous n-semiconducting metal oxide, such as nano-porous
titanium dioxide particles. As an example, the at least one layer
of the nano-porous n-semiconducting metal oxide may comprise one or
more layers having a thickness, in a dry state, of 10 nm-10000
nm.
[0127] For sensitizing the at least one layer of the nano-porous
n-semiconducting metal oxide, various techniques may be used,
preferably wet processing techniques, such as dip-coating,
spraying, spin-coating, doctor blading, printing or other
techniques or simply soaking the at least one layer of the
nano-porous n-semiconducting metal oxide in a solution of the at
least one organic dye.
[0128] Similarly, for depositing the at least one layer of the
solid p-semiconducting organic material, known deposition
techniques may be used, such as physical vapor deposition,
preferably vacuum evaporation techniques, and/or wet processing
techniques such as printing and/or spin-coating.
[0129] It shall be noted that the layer setup disclosed above may
also be inverted, by performing the mentioned method steps in a
reverse order.
[0130] The deposition of the at least one top electrode, as
mentioned above, may be performed in various ways. Thus, as an
example, a deposition in a patterned way may be performed,
preferably by depositing the top electrode onto the photovoltaic
material in a patterned way, such as by using a deposition through
a shadow mask and/or a printing technique. Additionally or
alternatively, as outlined above, depositing the top electrode onto
the photovoltaic material may be performed in an unpatterned way,
followed by at least one patterning step of the top electrode, such
as by laser ablation and/or another patterning step. Again,
additionally or alternatively, the deposition of the top electrode
may fully or partially be performed by providing at least one
separator on one or more of the substrate or the photovoltaic
material or a part thereof, followed by an unpatterned deposition
of the top electrode, wherein the top electrode is sub-divided into
the top electrode stripes by the separator. Thus, for potential
insulating separators, reference may be made to the documents
listed above. Preferably, the at least one separator, which
preferably comprises a plurality of separator stripes, may be a
photoresist structure having sharp edges at the top, for
sub-dividing the top electrode into the top electrode stripes.
[0131] As outlined above, the top electrode may be a pure
electrode, such as pure metal electrode comprising one or more
metal layers, or may be a composite electrode comprising one or
more electrically conductive layers and one or more metal layers.
Thus, as an example, method step a4. may comprise depositing at
least one electrically conductive polymer on top of the
photovoltaic material and, preferably subsequently, depositing at
least one metal layer on top of the electrically conductive
polymer. In this way, as an example, transparent top electrodes may
be manufactured. Thus, as an example, the metal layer may have a
thickness of less than 50 nm, preferably a thickness of less than
40 nm, more preferably a thickness of less than 30 nm. As outlined
above, for metal thicknesses of less than 30 nm, such as
thicknesses of less than 20 nm or even less, a transparency of the
metal layers may be achieved. Electrical conductivity still may be
provided by providing the electrically conductive polymer
underneath the at least one metal layer. The at least one
electrically conductive polymer, as outlined above, may be applied
in an unpatterned way, followed by one or more patterning steps.
Additionally or alternatively, the at least one layer of the
electrically conductive polymer may be performed in a patterned
way, such as by using one or more printing techniques. Again,
additionally or alternatively, the at least one layer of the
electrically conductive polymer may be patterned in a
self-patterning step, such as by using the above-mentioned one or
more electrically insulating separators. Thus, the electrically
conductive polymer may be spin-coated on top of the substrate
having the one or more electrically insulating separators, wherein
the one or more electrically insulating separators are adapted to
sub-divide the at least one layer of the electrically conductive
polymer into a plurality of electrically conductive polymer
stripes. Subsequently, one or more metal layers may be deposited,
which, again, may be sub-divided into metal stripes by the one or
more electrically insulating separators.
[0132] In a further aspect of the present invention, a method of
taking at least one image of an object is disclosed. The object
generally may be an arbitrary object of which an image may be
taken. The method comprises the use of the optical detector
according to the present invention, such as according to one or
more of the above-mentioned embodiments and/or according to one or
more of the embodiments mentioned in further detail below.
[0133] The method comprises the following method steps which may be
performed in the given order. A different order, however, is
feasible. Further, two or more of the method steps may be performed
overlapping in time and/or simultaneously. Further, one or more or
even all of the method steps may be performed repeatedly. Further,
the method may comprise additional method steps which are not
listed.
[0134] The method comprises the following steps: [0135] imaging the
object onto the optical sensor, [0136] subsequently connecting the
first electrode stripes to the measurement devices, wherein the
measurement devices, for each first electrode stripe, measure
corresponding electrical signals for the pixels of the respective
first electrode stripe, [0137] composing the electrical signals of
the pixels to form an image.
[0138] The electrical signals of the pixels, as outlined above, may
be stored within a data memory, such as a volatile and/or a
non-volatile data memory. The data memory may provide an array of
values representing the electrical signals, such as digital values,
more preferably gray-scale values.
[0139] As outlined above, the method may be performed by using raw
or primary electrical signals which may be subject to one or more
processing steps. Thus, the electrical signals may comprise primary
electrical signals in an analogue format, wherein the primary
electrical signals, also referred to as raw electrical signals, may
be transformed into secondary electrical signals. The secondary
electrical signals may be digital electrical signals. For
transforming the primary electrical signals into secondary
electrical signals, one or more analogue-digital converters may be
used. It shall be noted, however, that, alternatively or
additionally, other processing techniques besides analogue-digital
conversion may be used, such as filtering techniques and/or data
compression techniques. Preferably, however, the secondary
electrical signals comprise gray-scale levels for each pixel. Thus,
as an example, 4-bit gray-scale levels, 8-bit gray-scale levels or
even 16-bit gray-scale levels may be used. Other embodiments are
feasible.
[0140] In a further aspect of the present invention, a use of the
optical detector according to the present invention, such as to one
or more of the embodiments disclosed above and/or according to one
or more of the embodiments disclosed in further detail below, is
disclosed, for a purpose of use, selected from the group consisting
of: a position measurement in traffic technology; an entertainment
application; a security application; a safety application; a
human-machine interface application; a tracking application; a
photography application, such as an application for digital
photography for arts, documentation or technical purposes.
[0141] Thus, generally, the optical detector according to the
present invention may be applied in various fields of uses.
Specifically, the optical detector may be applied for a purpose of
use, selected from the group consisting of: a position measurement
in traffic technology; an entertainment application; a security
application; a human-machine interface application; a tracking
application; a photography application; a mapping application for
generating maps of at least one space, such as at least one space
selected from the group of a room, a building and a street; a
mobile application; an optical head-mounted display; a webcam; an
audio device, a Dolby surround audio system; a computer peripheral
device; a gaming application; a camera or video application; a
security application; a surveillance application; an automotive
application; a transport application; a medical application; a
sports' application; a machine vision application; a vehicle
application; an airplane application; a ship application; a
spacecraft application; a building application; a construction
application; a cartography application; a manufacturing
application; a use in combination with at least one time-of-flight
detector. Additionally or alternatively, applications in local
and/or global positioning systems may be named, especially
landmark-based positioning and/or navigation, specifically for use
in cars or other vehicles (such as trains, motorcycles, bicycles,
trucks for cargo transportation), robots or for use by pedestrians.
Further, indoor positioning systems may be named as potential
applications, such as for household applications and/or for robots
used in manufacturing technology.
[0142] Thus, as for the optical detectors and devices disclosed in
WO 2012/110924 A1 or in U.S. provisional applications 61/739,173,
filed on Dec. 19, 2012, 61/749,964, filed on Jan. 8, 2013, and
61/867,169, filed on Aug. 19, 2013, and international patent
application PCT/162013/061095, filed on Dec. 18, 2013, the optical
detector, the detector system, the human-machine interface, the
entertainment device, the tracking system or the camera according
to the present invention (in the following simply referred to as
"the devices according to the present invention" may be used for a
plurality of application purposes, such as one or more of the
purposes disclosed in further detail in the following.
[0143] Thus, firstly, the devices according to the present
invention may be used in mobile phones, tablet computers, wearable
computers, laptops, smart panels or other stationary or mobile
computer or communication applications. Thus, the devices according
to the present invention may be combined with at least one active
light source, such as a light source emitting light in the visible
range or infrared spectral range, in order to enhance performance.
Thus, as an example, the devices according to the present invention
may be used as cameras and/or sensors, such as in combination with
mobile software for scanning environment, objects and living
beings. The devices according to the present invention may even be
combined with 2D cameras, such as conventional cameras, in order to
increase imaging effects. The devices according to the present
invention may further be used for surveillance and/or for recording
purposes or as input devices to control mobile devices, especially
in combination with voice and/or gesture recognition and/or eye
tracking. Thus, specifically, the devices according to the present
invention acting as human-machine interfaces, also referred to as
input devices, may be used in mobile applications, such as for
controlling other electronic devices or components via the mobile
device, such as the mobile phone. As an example, the mobile
application including at least one device according to the present
invention may be used for controlling a television set, a game
console, a music player or music device or other entertainment
devices.
[0144] Further, the devices according to the present invention may
be used in webcams or other peripheral devices for computing
applications. Thus, as an example, the devices according to the
present invention may be used in combination with software for
imaging, recording, surveillance, scanning or motion detection. As
outlined in the context of the human-machine interface and/or the
entertainment device, the devices according to the present
invention are particularly useful for giving commands by facial
expressions and/or body expressions. The devices according to the
present invention can be combined with other input generating
devices like e.g. a mouse, a keyboard, a touchpad, a microphone, an
eye tracker etc. Further, the devices according to the present
invention may be used in applications for gaming, such as by using
a webcam. Further, the devices according to the present invention
may be used in virtual training applications and/or video
conferences.
[0145] Further, the devices according to the present invention may
be used in mobile audio devices, television devices and gaming
devices, as partially explained above. Specifically, the devices
according to the present invention may be used as controls or
control devices for electronic devices, entertainment devices or
the like. Further, the devices according to the present invention
may be used for eye detection or eye tracking, such as in 2D- and
3D-display techniques, especially with transparent or intransparent
displays for virtual and/or augmented reality applications and/or
for recognizing whether a display is being looked at and/or from
which perspective a display is being looked at.
[0146] Further, the devices according to the present invention may
be used in or as digital cameras such as DSC cameras and/or in or
as reflex cameras such as SLR cameras. For these applications,
reference may be made to the use of the devices according to the
present invention in mobile applications such as mobile phones
and/or smart phones, as disclosed above.
[0147] Further, the devices according to the present invention may
be used for security or surveillance applications. Thus, as an
example, at least one device according to the present invention can
be combined with one or more digital and/or analog electronics that
will give a signal if an object is within or outside a
predetermined area (e.g. for surveillance applications in banks or
museums). Specifically, the devices according to the present
invention may be used for optical encryption. Detection by using at
least one device according to the present invention can be combined
with other detection devices to complement wavelengths, such as
with IR, x-ray, UV-VIS, radar or ultrasound detectors. The devices
according to the present invention may further be combined with at
least one active infrared light source and/or at least one active
structured light source to allow detection in low light
surroundings. The devices according to the present invention are
generally advantageous as compared to active detector systems,
specifically since the devices according to the present invention
avoid actively sending signals which may be detected by third
parties, as is the case e.g. in radar applications, ultrasound
applications, LIDAR or similar active detector devices. Thus,
generally, the devices according to the present invention may be
used for an unrecognized and undetectable tracking of moving
objects. Additionally, the devices according to the present
invention generally are less prone to manipulation and irritations
as compared to conventional devices.
[0148] Further, given the ease and accuracy of 3D detection by
using the devices according to the present invention, the devices
according to the present invention generally may be used for
facial, body and person recognition and identification. Therein,
the devices according to the present invention may be combined with
other detection means for identification or personalization
purposes such as passwords, finger prints, iris detection, voice
recognition or other means. Thus, generally, the devices according
to the present invention may be used in security devices and other
personalized applications.
[0149] Further, the devices according to the present invention may
be used as 3D barcode readers for product identification.
[0150] In addition to the security and surveillance applications
mentioned above, the devices according to the present invention
generally can be used for surveillance and monitoring of spaces and
areas. Thus, the devices according to the present invention may be
used for surveying and monitoring spaces and areas and, as an
example, for triggering or executing alarms in case prohibited
areas are violated. Thus, generally, the devices according to the
present invention may be used for surveillance purposes in building
surveillance or museums, optionally in combination with other types
of sensors, such as in combination with motion or heat sensors, in
combination with image intensifiers or image enhancement devices
and/or photomultipliers.
[0151] Further, the devices according to the present invention may
advantageously be applied in camera applications such as video and
camcorder applications. Thus, the devices according to the present
invention may be used for motion capture and 3D-movie recording.
Therein, the devices according to the present invention generally
provide a large number of advantages over conventional optical
devices. Thus, the devices according to the present invention
generally require a lower complexity with regard to optical
components. Thus, as an example, the number of lenses may be
reduced as compared to conventional optical devices, such as by
providing the devices according to the present invention having one
lens only. Due to the reduced complexity, very compact devices are
possible, such as for mobile use. Conventional optical systems
having two or more lenses with high quality generally are
voluminous, such as due to the general need for voluminous
beam-splitters. As a further advantage in potential applications of
devices according to the present invention for motion capturing,
the simplified combination of several cameras in order to cover a
scene may be named, since absolute 3D information may be obtained.
This also may simplify merging scenes recorded by two or more
3D-cameras. Further, the devices according to the present invention
generally may be used for focus/autofocus devices, such as
autofocus cameras. Further, the devices according to the present
invention may also be used in optical microscopy, especially in
confocal microscopy.
[0152] Further, the devices according to the present invention
generally are applicable in the technical field of automotive
technology and transport technology. Thus, as an example, the
devices according to the present invention may be used as distance
and surveillance sensors, such as for adaptive cruise control,
emergency brake assist, lane departure warning, surround view,
blind spot detection, rear cross traffic alert, and other
automotive and traffic applications. Further, the devices according
to the present invention can also be used for velocity and/or
acceleration measurements, such as by analyzing a first and second
time-derivative of position information gained by using the optical
detector according to the present invention. This feature generally
may be applicable in automotive technology, transportation
technology or general traffic technology. As an example, a specific
application in an indoor positioning system may be the detection of
positioning of passengers in transportation, more specifically to
electronically control the use of safety systems such as airbags.
The use of an airbag may be prevented in case the passenger is
located as such, that the use of an airbag will cause a severe
injury. Applications in other fields of technology are feasible.
For use in automotive systems, devices according to the present
invention may be connected to one or more electronic control units
of the vehicle and may enable further connections via controller
area networks and the like. For testing purposes in automotive or
other complex applications, especially for use in combination with
further sensors and/or actuators, the integration in
hardware-in-the-loop simulation systems is possible.
[0153] In these or other applications, generally, the devices
according to the present invention may be used as standalone
devices or in combination with other sensor devices, such as in
combination with radar and/or ultrasonic devices. Specifically, the
devices according to the present invention may be used for
autonomous driving and safety issues. Further, in these
applications, the devices according to the present invention may be
used in combination with infrared sensors, radar sensors, which are
sonic sensors, two-dimensional cameras or other types of sensors.
In these applications, the generally passive nature of the devices
according to the present invention is advantageous. Thus, since the
devices according to the present invention generally do not require
emitting signals, the risk of interference of active sensor signals
with other signal sources may be avoided. The devices according to
the present invention specifically may be used in combination with
recognition software, such as standard image recognition software.
Thus, signals and data as provided by the devices according to the
present invention typically are readily processable and, therefore,
generally require lower calculation power than established
stereovision systems such as LIDAR. Given the low space demand, the
devices according to the present invention such as cameras may be
placed at virtually any place in a vehicle, such as on a window
screen, on a front hood, on bumpers, on lights, on mirrors or other
places and the like. Various optical detectors according to the
present invention such as one or more optical detectors based on
the effect disclosed within the present invention can be combined,
such as in order to allow autonomously driving vehicles or in order
to increase the performance of active safety concepts. Thus,
various devices according to the present invention may be combined
with one or more other devices according to the present invention
and/or conventional sensors, such as in the windows like rear
window, side window or front window, on the bumpers or on the
lights.
[0154] A combination of at least one device according to the
present invention such as at least one optical detector according
to the present invention with one or more rain detection sensors is
also possible. This is due to the fact that the devices according
to the present invention generally are advantageous over
conventional sensor techniques such as radar, specifically during
heavy rain. A combination of at least one device according to the
present invention with at least one conventional sensing technique
such as radar may allow for a software to pick the right
combination of signals according to the weather conditions.
[0155] Further, the devices according to the present invention
generally may be used as break assist and/or parking assist and/or
for speed measurements. Speed measurements can be integrated in the
vehicle or may be used outside the vehicle, such as in order to
measure the speed of other cars in traffic control. Further, the
devices according to the present invention may be used for
detecting free parking spaces in parking lots.
[0156] Further, the devices according to the present invention may
be used in the fields of medical systems and sports. Thus, in the
field of medical technology, surgery robotics, e.g. for use in
endoscopes, may be named, since, as outlined above, the devices
according to the present invention may require a low volume only
and may be integrated into other devices. Specifically, the devices
according to the present invention having one lens, at most, may be
used for capturing 3D information in medical devices such as in
endoscopes. Further, the devices according to the present invention
may be combined with an appropriate monitoring software, in order
to enable tracking and analysis of movements. These applications
are specifically valuable e.g. in medical treatments and
long-distance diagnosis and tele-medicine. Further, applications
for positioning the body of patients in tomography or radiotherapy
are possible, or for measuring the body shape of patients before
surgery, to detect diseases, or the like.
[0157] Further, the devices according to the present invention may
be applied in the field of sports and exercising, such as for
training, remote instructions or competition purposes.
Specifically, the devices according to the present invention may be
applied in the fields of dancing, aerobic, football, soccer,
basketball, baseball, cricket, hockey, track and field, swimming,
polo, handball, volleyball, rugby, sumo, judo, fencing, boxing etc.
The devices according to the present invention can be used to
detect the position of a ball, a bat, a sword, motions, etc., both
in sports and in games, such as to monitor the game, support the
referee or for judgment, specifically automatic judgment, of
specific situations in sports, such as for judging whether a point
or a goal actually was made.
[0158] The devices according to the present invention further may
be used in rehabilitation and physiotherapy, in order to encourage
training and/or in order to survey and correct movements. Therein,
the devices according to the present invention may also be applied
for distance diagnostics.
[0159] Further, the devices according to the present invention may
be applied in the field of machine vision. Thus, one or more of the
devices according to the present invention may be used e.g. as a
passive controlling unit for autonomous driving and or working of
robots. In combination with moving robots, the devices according to
the present invention may allow for autonomous movement and/or
autonomous detection of failures in parts. The devices according to
the present invention may also be used for manufacturing and safety
surveillance, such as in order to avoid accidents including but not
limited to collisions between robots, production parts and living
beings. In robotics, the safe and direct interaction of humans and
robots is often an issue, as robots may severely injure humans when
they are not recognized. Devices according to the present invention
may help robots to position objects and humans better and faster
and allow a safe interaction. Given the passive nature of the
devices according to the present invention, the devices according
to the present invention may be advantageous over active devices
and/or may be used complementary to existing solutions like radar,
ultrasound, 2D cameras, IR detection etc. One particular advantage
of the devices according to the present invention is the low
likelihood of signal interference. Therefore multiple sensors can
work at the same time in the same environment, without the risk of
signal interference. Thus, the devices according to the present
invention generally may be useful in highly automated production
environments like e.g. but not limited to automotive, mining,
steel, etc. The devices according to the present invention can also
be used for quality control in production, e.g. in combination with
other sensors like 2-D imaging, radar, ultrasound, IR etc., such as
for quality control or other purposes. Further, the devices
according to the present invention may be used for assessment of
surface quality, such as for surveying the surface evenness of a
product or the adherence to specified dimensions, from the range of
micrometers to the range of meters. Other quality control
applications are feasible. In a manufacturing environment, the
devices according to the present invention are especially useful
for processing natural products such as food or wood, with a
complex 3-dimensional structure to avoid large amounts of waste
material. Further, devices according to the present invention may
be used in to monitor the filling level of tanks, silos etc.
[0160] Further, the devices according to the present invention may
be used in the polls, airplanes, ships, spacecraft and other
traffic applications. Thus, besides the applications mentioned
above in the context of traffic applications, passive tracking
systems for aircraft, vehicles and the like may be named. The use
of at least one device according to the present invention, such as
at least one optical detector according to the present invention,
for monitoring the speed and/or the direction of moving objects is
feasible. Specifically, the tracking of fast moving objects on
land, sea and in the air including space may be named. The at least
one device according to the present invention, such as the at least
one optical detector according to the present invention,
specifically may be mounted on a still-standing and/or on a moving
device. An output signal of the at least one device according to
the present invention can be combined e.g. with a guiding mechanism
for autonomous or guided movement of another object. Thus,
applications for avoiding collisions or for enabling collisions
between the tracked and the steered object are feasible. The
devices according to the present invention generally are useful and
advantageous due to the low calculation power required, the instant
response and due to the passive nature of the detection system
which generally is more difficult to detect and to disturb as
compared to active systems, like e.g. radar. The devices according
to the present invention are particularly useful but not limited to
e.g. speed control and air traffic control devices.
[0161] The devices according to the present invention generally may
be used in passive applications. Passive applications include
guidance for ships in harbors or in dangerous areas, and for
aircraft at landing or starting. Wherein, fixed, known active
targets may be used for precise guidance. The same can be used for
vehicles driving in dangerous but well defined routes, such as
mining vehicles.
[0162] Further, as outlined above, the devices according to the
present invention may be used in the field of gaming. Thus, the
devices according to the present invention can be passive for use
with multiple objects of the same or of different size, color,
shape, etc., such as for movement detection in combination with
software that incorporates the movement into its content. In
particular, applications are feasible in implementing movements
into graphical output. Further, applications of the devices
according to the present invention for giving commands are
feasible, such as by using one or more of the devices according to
the present invention for gesture or facial recognition. The
devices according to the present invention may be combined with an
active system in order to work under e.g. low light conditions or
in other situations in which enhancement of the surrounding
conditions is required. Additionally or alternatively, a
combination of one or more of the devices according to the present
invention with one or more IR or VIS light sources is possible. A
combination of an optical detector according to the present
invention with special devices is also possible, which can be
distinguished easily by the system and its software, e.g. and not
limited to, a special color, shape, relative position to other
devices, speed of movement, light, frequency used to modulate light
sources on the device, surface properties, material used,
reflection properties, transparency degree, absorption
characteristics, etc. The device can, amongst other possibilities,
resemble a stick, a racquet, a club, a gun, a knife, a wheel, a
ring, a steering wheel, a bottle, a ball, a glass, a vase, a spoon,
a fork, a cube, a dice, a figure, a puppet, a teddy, a beaker, a
pedal, a hat, a pair of glasses, a helmet, a switch, a glove,
jewelry, a musical instrument or an auxiliary device for playing a
musical instrument, such as a plectrum, a drumstick or the like.
Other options are feasible.
[0163] Further, the devices according to the present invention
generally may be used in the field of building, construction and
cartography. Thus, generally, one or more devices according to the
present invention may be used in order to measure and/or monitor
environmental areas, e.g. countryside or buildings. Therein, one or
more of the devices according to the present invention may be
combined with other methods and devices or can be used solely in
order to monitor progress and accuracy of building projects,
changing objects, houses, etc. the devices according to the present
invention can be used for generating three-dimensional models of
scanned environments, in order to construct maps of rooms, streets,
houses, communities or landscapes, both from ground or from air.
Potential fields of application may be construction, cartography,
real estate management, land surveying or the like.
[0164] One or more devices according to the present invention can
further be used for scanning of objects, such as in combination
with CAD or similar software, such as for additive manufacturing
and/or 3D printing. Therein, use may be made of the high
dimensional accuracy of the devices according to the present
invention, e.g. in x-, y- or z-direction or in any arbitrary
combination of these directions, such as simultaneously. Further,
the devices according to the present invention may be used in
inspections and maintenance, such as pipeline inspection
gauges.
[0165] As outlined above, the devices according to the present
invention may further be used in manufacturing, quality control or
identification applications, such as in product identification or
size identification (such as for finding an optimal place or
package, for reducing waste etc.). Further, the devices according
to the present invention may be used in logisitics applications.
Thus, the devices according to the present invention may be used
for optimized loading or packing containers or vehicles. Further,
the devices according to the present invention may be used for
monitoring or controlling of surface damages in the field of
manufacturing, for monitoring or controlling rental objects such as
rental vehicles, and/or for insurance applications, such as for
assessment of damages. Further, the devices according to the
present invention may be used for identifying a size of material,
object or tools, such as for optimal material handling, especially
in combination with robots and/or for ensuring quality or accuracy
in a manufacturing process, such as the accuracy of product size or
volume or the optical precision of a manufactured lens. Further,
the devices according to the present invention may be used for
process control in production, e.g. for observing filling level of
tanks. Further, the devices according to the present invention may
be used for maintenance of production assets like, but not limited
to, tanks, pipes, reactors, tools etc. Further, the devices
according to the present invention may be used for analyzing
3D-quality marks. Further, the devices according to the present
invention may be used in manufacturing tailor-made goods such as
tooth inlays, dental braces, prosthesis, clothes or the like. The
devices according to the present invention may also be combined
with one or more 3D-printers for rapid prototyping, 3D-copying or
the like. Further, the devices according to the present invention
may be used for detecting the shape of one or more articles, such
as for anti-product piracy and for anti-counterfeiting
purposes.
Preferred Embodiments of the Photosensitive Layer Setup
[0166] In the following, examples of the photosensitive layer
setup, specifically with regard to materials which may be used
within this photosensitive layer setup, are disclosed. As outlined
above, the photosensitive layer setup preferably is a
photosensitive layer setup of a solar cell, more preferably an
organic solar cell and/or a dye-sensitized solar cell (DSC), more
preferably a solid dye-sensitized solar cell (sDSC). Other
embodiments, however, are feasible.
[0167] As outlined above, preferably, the photosensitive layer
setup comprises at least one photovoltaic material, such as at
least one photovoltaic layer setup comprising at least two layers,
sandwiched between the first electrode and the second electrode.
Preferably, the photosensitive layer setup and the photovoltaic
material comprise at least one layer of an n-semiconducting metal
oxide, at least one dye and at least one p-semiconducting organic
material. As an example, the photovoltaic material may comprise a
layer setup having at least one dense layer of an n-semiconducting
metal oxide such as titanium dioxide, at least one nano-porous
layer of an n-semiconducting metal oxide contacting the dens layer
of the n-semiconducting metal oxide, such as at least one
nano-porous layer of titanium dioxide, at least one dye sensitizing
the nano-porous layer of the n-semiconducting metal oxide,
preferably an organic dye, and at least one layer of at least one
p-semiconducting organic material, contacting the dye and/or the
nano-porous layer of the n-semiconducting metal oxide.
[0168] The dense layer of the n-semiconducting metal oxide, as will
be explained in further detail below, may form at least one barrier
layer in between the first electrode and the at least one layer of
the nano-porous n-semiconducting metal oxide. It shall be noted,
however, that other embodiments are feasible, such as embodiments
having other types of buffer layers.
[0169] The first electrode may be one of an anode or a cathode,
preferably an anode. The second electrode may be the other one of
an anode or a cathode, preferably a cathode. The first electrode
preferably contacts the at least one layer of the n-semiconducting
metal oxide, and the second electrode preferably contacts the at
least one layer of the p-semiconducting organic material. The first
electrode may be a bottom electrode, contacting a substrate, and
the second electrode may be a top electrode facing away from the
substrate. Alternatively, the second electrode may be a bottom
electrode, contacting the substrate, and the first electrode may be
the top electrode facing away from the substrate. Preferably, one
or both of the first electrode and the second electrode are
transparent.
[0170] In the following, some options regarding the first
electrode, the second electrode and the photovoltaic material,
preferably the layer setup comprising two or more photovoltaic
materials, will be disclosed. It shall be noted, however, that
other embodiments are feasible.
a) Substrate, First Electrode and n-Semiconductive Metal Oxide
[0171] Generally, for preferred embodiments of the first electrode
and the n-semiconductive metal oxide, reference may be made to WO
2012/110924 A1, U.S. provisional application No. 61/739,173 or U.S.
provisional application No. 61/708,058, the full content of all of
which is herewith included by reference. Other embodiments are
feasible.
[0172] In the following, it shall be assumed that the first
electrode is the bottom electrode directly or indirectly contacting
the substrate. It shall be noted, however, that other setups are
feasible, with the first electrode being the top electrode.
[0173] The n-semiconductive metal oxide which may be used in the
photosensitive layer setup, such as in at least one dense film
(also referred to as a solid film) of the n-semiconductive metal
oxide and/or in at least one nano-porous film (also referred to as
a nano-particulate film) of the n-semiconductive metal oxide, may
be a single metal oxide or a mixture of different oxides. It is
also possible to use mixed oxides. The n-semiconductive metal oxide
may especially be porous and/or be used in the form of a
nanoparticulate oxide, nanoparticles in this context being
understood to mean particles which have an average particle size of
less than 0.1 micrometer. A nanoparticulate oxide is typically
applied to a conductive substrate (i.e. a carrier with a conductive
layer as the first electrode) by a sintering process as a thin
porous film with large surface area.
[0174] Preferably, the optical sensor uses at least one transparent
substrate. However, setups using one or more intransparent
substrates are feasible.
[0175] The substrate may be rigid or else flexible. Suitable
substrates (also referred to hereinafter as carriers) are, as well
as metal foils, in particular plastic sheets or films and
especially glass sheets or glass films. Particularly suitable
electrode materials, especially for the first electrode according
to the above-described, preferred structure, are conductive
materials, for example transparent conductive oxides (TCOs), for
example fluorine- and/or indium-doped tin oxide (FTO or ITO) and/or
aluminum-doped zinc oxide (AZO), carbon nanotubes or metal films.
Alternatively or additionally, it would, however, also be possible
to use thin metal films which still have a sufficient transparency.
In case an intransparent first electrode is desired and used, thick
metal films may be used.
[0176] The substrate can be covered or coated with these conductive
materials. Since generally, only a single substrate is required in
the structure proposed, the formation of flexible cells is also
possible. This enables a multitude of end uses which would be
achievable only with difficulty, if at all, with rigid substrates,
for example use in bank cards, garments, etc.
[0177] The first electrode, especially the TCO layer, may
additionally be covered or coated with a solid or dense metal oxide
buffer layer (for example of thickness 10 to 200 nm), in order to
prevent direct contact of the p-type semiconductor with the TCO
layer (see Peng et al., Coord. Chem. Rev. 248, 1479 (2004)). The
use of solid p-semiconducting electrolytes, in the case of which
contact of the electrolyte with the first electrode is greatly
reduced compared to liquid or gel-form electrolytes, however, makes
this buffer layer unnecessary in many cases, such that it is
possible in many cases to dispense with this layer, which also has
a current-limiting effect and can also worsen the contact of the
n-semiconducting metal oxide with the first electrode. This
enhances the efficiency of the components. On the other hand, such
a buffer layer can in turn be utilized in a controlled manner in
order to match the current component of the dye solar cell to the
current component of the organic solar cell. In addition, in the
case of cells in which the buffer layer has been dispensed with,
especially in solid cells, problems frequently occur with unwanted
recombinations of charge carriers. In this respect, buffer layers
are advantageous in many cases specifically in solid cells.
[0178] As is well known, thin layers or films of metal oxides are
generally inexpensive solid semiconductor materials (n-type
semiconductors), but the absorption thereof, due to large bandgaps,
is typically not within the visible region of the electromagnetic
spectrum, but rather usually in the ultraviolet spectral region.
For use in solar cells, the metal oxides therefore generally, as is
the case in the dye solar cells, have to be combined with a dye as
a photosensitizer, which absorbs in the wavelength range of
sunlight, i.e. at 300 to 2000 nm, and, in the electronically
excited state, injects electrons into the conduction band of the
semiconductor. With the aid of a solid p-type semiconductor used
additionally in the cell as an electrolyte, which is in turn
reduced at the counter electrode, electrons can be recycled to the
sensitizer, such that it is regenerated.
[0179] Of particular interest for use in organic solar cells are
the semiconductors zinc oxide, tin dioxide, titanium dioxide or
mixtures of these metal oxides. The metal oxides can be used in the
form of nanocrystalline porous layers. These layers have a large
surface area which is coated with the dye as a sensitizer, such
that a high absorption of sunlight is achieved. Metal oxide layers
which are structured, for example nanorods, give advantages such as
higher electron mobilities or improved pore filling by the dye.
[0180] The metal oxide semiconductors can be used alone or in the
form of mixtures. It is also possible to coat a metal oxide with
one or more other metal oxides. In addition, the metal oxides may
also be applied as a coating to another semiconductor, for example
GaP, ZnP or ZnS.
[0181] Particularly preferred semiconductors are zinc oxide and
titanium dioxide in the anatase polymorph, which is preferably used
in nanocrystalline form.
[0182] In addition, the sensitizers can advantageously be combined
with all n-type semiconductors which typically find use in these
solar cells. Preferred examples include metal oxides used in
ceramics, such as titanium dioxide, zinc oxide, tin(IV) oxide,
tungsten(VI) oxide, tantalum(V) oxide, niobium(V) oxide, cesium
oxide, strontium titanate, zinc stannate, complex oxides of the
perovskite type, for example barium titanate, and binary and
ternary iron oxides, which may also be present in nanocrystalline
or amorphous form.
[0183] Due to the strong absorption that customary organic dyes and
ruthenium, phthalocyanines and porphyrins have, even thin layers or
films of the n-semiconducting metal oxide are sufficient to absorb
the required amount of dye. Thin metal oxide films in turn have the
advantage that the probability of unwanted recombination processes
falls and that the internal resistance of the dye subcell is
reduced. For the n-semiconducting metal oxide, it is possible with
preference to use layer thicknesses of 100 nm up to 20 micrometers,
more preferably in the range between 500 nm and approx. 3
micrometers.
b) Dye
[0184] In the context of the present invention, as usual in
particular for DSCs, the terms "dye", "sensitizer dye" and
"sensitizer" are used essentially synonymously without any
restriction of possible configurations. Numerous dyes which are
usable in the context of the present invention are known from the
prior art, and so, for possible material examples, reference may
also be made to the above description of the prior art regarding
dye solar cells. As a preferred example, one or more of the dyes
disclosed in WO 2012/110924 A1, U.S. provisional application No.
61/739,173 or U.S. provisional application No. 61/708,058 may be
used, the full content of all of which is herewith included by
reference. Additionally or alternatively, one or more of the dyes
as disclosed in WO 2007/054470 A1 and/or WO 2012/085803 A1 may be
used, the full content of which is included by reference, too.
[0185] Dye-sensitized solar cells based on titanium dioxide as a
semiconductor material are described, for example, in U.S. Pat. No.
4,927,721, Nature 353, p. 737-740 (1991) and U.S. Pat. No.
5,350,644, and also Nature 395, p. 583-585 (1998) and EP-A-1 176
646. The dyes described in these documents can in principle also be
used advantageously in the context of the present invention. These
dye solar cells preferably comprise monomolecular films of
transition metal complexes, especially ruthenium complexes, which
are bonded to the titanium dioxide layer via acid groups as
sensitizers.
[0186] Many sensitizers which have been proposed include metal-free
organic dyes, which are likewise also usable in the context of the
present invention. High efficiencies of more than 4%, especially in
solid dye solar cells, can be achieved, for example, with indoline
dyes (see, for example, Schmidt-Mende et al., Adv. Mater. 2005, 17,
813). U.S. Pat. No. 6,359,211 describes the use, also implementable
in the context of the present invention, of cyanine, oxazine,
thiazine and acridine dyes which have carboxyl groups bonded via an
alkylene radical for fixing to the titanium dioxide
semiconductor.
[0187] Particularly preferred sensitizer dyes in the dye solar cell
proposed are the perylene derivatives, terrylene derivatives and
quaterrylene derivatives described in DE 10 2005 053 995 A1 or WO
2007/054470 A1. Further, as outlined above, one or more of the dyes
as disclosed in WO 2012/085803 A1 may be used. The use of these
dyes, which is also possible in the context of the present
invention, leads to photovoltaic elements with high efficiencies
and simultaneously high stabilities.
[0188] The rylenes exhibit strong absorption in the wavelength
range of sunlight and can, depending on the length of the
conjugated system, cover a range from about 400 nm (perylene
derivatives I from DE 10 2005 053 995 A1) up to about 900 nm
(quaterrylene derivatives I from DE 10 2005 053 995 A1). Rylene
derivatives I based on terrylene absorb, according to the
composition thereof, in the solid state adsorbed onto titanium
dioxide, within a range from about 400 to 800 nm. In order to
achieve very substantial utilization of the incident sunlight from
the visible into the near infrared region, it is advantageous to
use mixtures of different rylene derivatives I. Occasionally, it
may also be advisable also to use different rylene homologs.
[0189] The rylene derivatives I can be fixed easily and in a
permanent manner to the n-semiconducting metal oxide film. The
bonding is effected via the anhydride function (x1) or the carboxyl
groups --COOH or --COO-- formed in situ, or via the acid groups A
present in the imide or condensate radicals ((x2) or (x3)). The
rylene derivatives I described in DE 10 2005 053 995 A1 have good
suitability for use in dye-sensitized solar cells in the context of
the present invention.
[0190] It is particularly preferred when the dyes, at one end of
the molecule, have an anchor group which enables the fixing thereof
to the n-type semiconductor film. At the other end of the molecule,
the dyes preferably comprise electron donors Y which facilitate the
regeneration of the dye after the electron release to the n-type
semiconductor, and also prevent recombination with electrons
already released to the semiconductor.
[0191] For further details regarding the possible selection of a
suitable dye, it is possible, for example, again to refer to DE 10
2005 053 995 A1. By way of example, it is possible especially to
use ruthenium complexes, porphyrins, other organic sensitizers, and
preferably rylenes.
[0192] The dyes can be fixed onto or into the n-semiconducting
metal oxide film, such as the nano-porous n-semiconducting metal
oxide layer, in a simple manner. For example, the n-semiconducting
metal oxide films can be contacted in the freshly sintered (still
warm) state over a sufficient period (for example about 0.5 to 24
h) with a solution or suspension of the dye in a suitable organic
solvent. This can be accomplished, for example, by immersing the
metal oxide-coated substrate into the solution of the dye.
[0193] If combinations of different dyes are to be used, they may,
for example, be applied successively from one or more solutions or
suspensions which comprise one or more of the dyes. It is also
possible to use two dyes which are separated by a layer of, for
example, CuSCN (on this subject see, for example, Tennakone, K. J.,
Phys. Chem. B. 2003, 107, 13758). The most convenient method can be
determined comparatively easily in the individual case.
[0194] In the selection of the dye and of the size of the oxide
particles of the n-semiconducting metal oxide, the organic solar
cell should be configured such that a maximum amount of light is
absorbed. The oxide layers should be structured such that the solid
p-type semiconductor can efficiently fill the pores. For instance,
smaller particles have greater surface areas and are therefore
capable of adsorbing a greater amount of dyes. On the other hand,
larger particles generally have larger pores which enable better
penetration through the p-conductor.
c) p-Semiconducting Organic Material
[0195] As described above, the at least one photosensitive layer
setup, such as the photosensitive layer setup of the DSC or sDSC,
can comprise in particular at least one p-semiconducting organic
material, preferably at least one solid p-semiconducting material,
which is also designated hereinafter as p-type semiconductor or
p-type conductor. Hereinafter, a description is given of a series
of preferred examples of such organic p-type semiconductors which
can be used individually or else in any desired combination, for
example in a combination of a plurality of layers with a respective
p-type semiconductor, and/or in a combination of a plurality of
p-type semiconductors in one layer.
[0196] In order to prevent recombination of the electrons in the
n-semiconducting metal oxide with the solid p-conductor, it is
possible to use, between the n-semiconducting metal oxide and the
p-type semiconductor, at least one passivating layer which has a
passivating material. This layer should be very thin and should as
far as possible cover only the as yet uncovered sites of the
n-semiconducting metal oxide. The passivation material may, under
some circumstances, also be applied to the metal oxide before the
dye. Preferred passivation materials are especially one or more of
the following substances: Al.sub.2O.sub.3; silanes, for example
CH.sub.3SiCl.sub.3; Al.sup.3+; 4-tert-butylpyridine (TBP); MgO; GBA
(4-guanidinobutyric acid) and similar derivatives; alkyl acids;
hexadecylmalonic acid (HDMA).
[0197] As described above, preferably one or more solid organic
p-type semiconductors are used --alone or else in combination with
one or more further p-type semiconductors which are organic or
inorganic in nature. In the context of the present invention, a
p-type semiconductor is generally understood to mean a material,
especially an organic material, which is capable of conducting
holes, that is to say positive charge carriers. More particularly,
it may be an organic material with an extensive .pi.-electron
system which can be oxidized stably at least once, for example to
form what is called a free-radical cation. For example, the p-type
semiconductor may comprise at least one organic matrix material
which has the properties mentioned. Furthermore, the p-type
semiconductor can optionally comprise one or a plurality of dopants
which intensify the p-semiconducting properties. A significant
parameter influencing the selection of the p-type semiconductor is
the hole mobility, since this partly determines the hole diffusion
length (cf. Kumara, G., Langmuir, 2002, 18, 10493-10495). A
comparison of charge carrier mobilities in different Spiro
compounds can be found, for example, in T. Saragi, Adv. Funct.
Mater. 2006, 16, 966-974.
[0198] Preferably, in the context of the present invention, organic
semiconductors are used (i.e. one or more of low molecular weight,
oligomeric or polymeric semiconductors or mixtures of such
semiconductors). Particular preference is given to p-type
semiconductors which can be processed from a liquid phase. Examples
here are p-type semiconductors based on polymers such as
polythiophene and polyarylamines, or on amorphous, reversibly
oxidizable, nonpolymeric organic compounds, such as the
spirobifluorenes mentioned at the outset (cf., for example, US
2006/0049397 and the spiro compounds disclosed therein as p-type
semiconductors, which are also usable in the context of the present
invention). Preference is also given to using low molecular weight
organic semiconductors, such as the low molecular weight p-type
semiconducting materials as disclosed in WO 2012/110924 A1,
preferably spiro-MeOTAD, and/or one or more of the p-type
semiconducting materials disclosed in Leijtens et al., ACS Nano,
VOL. 6, NO. 2, 1455-1462 (2012). In addition, reference may also be
made to the remarks regarding the p-semiconducting materials and
dopants from the above description of the prior art.
[0199] The p-type semiconductor is preferably producible or
produced by applying at least one p-conducting organic material to
at least one carrier element, wherein the application is effected
for example by deposition from a liquid phase comprising the at
least one p-conducting organic material. The deposition can in this
case once again be effected, in principle, by any desired
deposition process, for example by spin-coating, doctor blading,
knife-coating, printing or combinations of the stated and/or other
deposition methods.
[0200] The organic p-type semiconductor may especially comprise at
least one spiro compound such as spiro-MeOTAD and/or at least one
compound with the structural formula:
##STR00001##
in which A.sup.1, A.sup.2, A.sup.3 are each independently
optionally substituted aryl groups or heteroaryl groups, R.sup.1,
R.sup.2, R.sup.3 are each independently selected from the group
consisting of the substituents --R, --OR, --NR.sub.2, -A.sup.4-OR
and -A.sup.4-NR.sub.2, where R is selected from the group
consisting of alkyl, aryl and heteroaryl, and where A.sup.4 is an
aryl group or heteroaryl group, and where n at each instance in
formula I is independently a value of 0, 1, 2 or 3, with the
proviso that the sum of the individual n values is at least 2 and
at least two of the R.sup.1, R.sup.2 and R.sup.3 radicals are --OR
and/or --NR.sub.2.
[0201] Preferably, A.sup.2 and A.sup.3 are the same; accordingly,
the compound of the formula (I) preferably has the following
structure (Ia)
##STR00002##
[0202] More particularly, as explained above, the p-type
semiconductor may thus have at least one low molecular weight
organic p-type semiconductor. A low molecular weight material is
generally understood to mean a material which is present in
monomeric, nonpolymerized or nonoligomerized form. The term "low
molecular weight" as used in the present context preferably means
that the p-type semiconductor has molecular weights in the range
from 100 to 25 000 g/mol. Preferably, the low molecular weight
substances have molecular weights of 500 to 2000 g/mol.
[0203] In general, in the context of the present invention,
p-semiconducting properties are understood to mean the property of
materials, especially of organic molecules, to form holes and to
transport these holes and/or to pass them on to adjacent molecules.
More particularly, stable oxidation of these molecules should be
possible. In addition, the low molecular weight organic p-type
semiconductors mentioned may especially have an extensive
.pi.-electron system. More particularly, the at least one low
molecular weight p-type semiconductor may be processable from a
solution. The low molecular weight p-type semiconductor may
especially comprise at least one triphenylamine. It is particularly
preferred when the low molecular weight organic p-type
semiconductor comprises at least one spiro compound. A Spiro
compound is understood to mean polycyclic organic compounds whose
rings are joined only at one atom, which is also referred to as the
spiro atom. More particularly, the spiro atom may be
spa-hybridized, such that the constituents of the spiro compound
connected to one another via the spiro atom are, for example,
arranged in different planes with respect to one another.
[0204] More preferably, the spiro compound has a structure of the
following formula:
##STR00003##
where the aryl.sup.1, aryl.sup.2, aryl.sup.3, aryl.sup.4,
aryl.sup.5, aryl.sup.6, aryl.sup.7 and aryl.sup.8 radicals are each
independently selected from substituted aryl radicals and
heteroaryl radicals, especially from substituted phenyl radicals,
where the aryl radicals and heteroaryl radicals, preferably the
phenyl radicals, are each independently substituted, preferably in
each case by one or more substituents selected from the group
consisting of --O-alkyl, --OH, --F, --Cl, --Br and --I, where alkyl
is preferably methyl, ethyl, propyl or isopropyl. More preferably,
the phenyl radicals are each independently substituted, in each
case by one or more substituents selected from the group consisting
of --O--Me, --OH, --F, --Cl, --Br and --I.
[0205] Further preferably, the spiro compound is a compound of the
following formula:
##STR00004##
where R.sup.r, R.sup.s, R.sup.t, R.sup.u, R.sup.v, R.sup.w, R.sup.x
and R.sup.y are each independently selected from the group
consisting of --O-alkyl, --OH, --F, --Cl, --Br and --I, where alkyl
is preferably methyl, ethyl, propyl or isopropyl. More preferably,
R.sup.r, R.sup.s, R.sup.t, R.sup.u, R.sup.v, R.sup.w, R.sup.x and
R.sup.y are each independently selected from the group consisting
of --O--Me, --OH, --F, --Cl, --Br and --I.
[0206] More particularly, the p-type semiconductor may comprise
spiro-MeOTAD or consist of spiro-MeOTAD, i.e. a compound of the
formula below, commercially available from Merck KGaA, Darmstadt,
Germany:
##STR00005##
[0207] Alternatively or additionally, it is also possible to use
other p-semiconducting compounds, especially low molecular weight
and/or oligomeric and/or polymeric p-semiconducting compounds.
[0208] In an alternative embodiment, the low molecular weight
organic p-type semiconductor comprises one or more compounds of the
above-mentioned general formula I, for which reference may be made,
for example, to PCT application number PCT/EP2010/051826. The
p-type semiconductor may comprise the at least one compound of the
above-mentioned general formula I additionally or alternatively to
the Spiro compound described above.
[0209] The term "alkyl" or "alkyl group" or "alkyl radical" as used
in the context of the present invention is understood to mean
substituted or unsubstituted C.sub.1-C.sub.20-alkyl radicals in
general. Preference is given to C.sub.1- to C.sub.10-alkyl
radicals, particular preference to C.sub.1- to C.sub.8-alkyl
radicals. The alkyl radicals may be either straight-chain or
branched. In addition, the alkyl radicals may be substituted by one
or more substituents selected from the group consisting of
C.sub.1-C.sub.20-alkoxy, halogen, preferably F, and
C.sub.6-C.sub.30-aryl which may in turn be substituted or
unsubstituted. Examples of suitable alkyl groups are methyl, ethyl,
propyl, butyl, pentyl, hexyl, heptyl and octyl, and also isopropyl,
isobutyl, isopentyl, sec-butyl, tert-butyl, neopentyl,
3,3-dimethylbutyl, 2-ethylhexyl, and also derivatives of the alkyl
groups mentioned substituted by C.sub.6-C.sub.30-aryl,
C.sub.1-C.sub.20-alkoxy and/or halogen, especially F, for example
CF.sub.3.
[0210] The term "aryl" or "aryl group" or "aryl radical" as used in
the context of the present invention is understood to mean
optionally substituted C.sub.6-C.sub.30-aryl radicals which are
derived from monocyclic, bicyclic, tricyclic or else multicyclic
aromatic rings, where the aromatic rings do not comprise any ring
heteroatoms. The aryl radical preferably comprises 5- and/or
6-membered aromatic rings. When the aryls are not monocyclic
systems, in the case of the term "aryl" for the second ring, the
saturated form (perhydro form) or the partly unsaturated form (for
example the dihydro form or tetrahydro form), provided the
particular forms are known and stable, is also possible. The term
"aryl" in the context of the present invention thus comprises, for
example, also bicyclic or tricyclic radicals in which either both
or all three radicals are aromatic, and also bicyclic or tricyclic
radicals in which only one ring is aromatic, and also tricyclic
radicals in which two rings are aromatic. Examples of aryl are:
phenyl, naphthyl, indanyl, 1,2-dihydronaphthenyl,
1,4-dihydronaphthenyl, fluorenyl, indenyl, anthracenyl,
phenanthrenyl or 1,2,3,4-tetrahydronaphthyl. Particular preference
is given to C.sub.6-C.sub.10-aryl radicals, for example phenyl or
naphthyl, very particular preference to C.sub.6-aryl radicals, for
example phenyl. In addition, the term "aryl" also comprises ring
systems comprising at least two monocyclic, bicyclic or multicyclic
aromatic rings joined to one another via single or double bonds.
One example is that of biphenyl groups.
[0211] The term "heteroaryl" or "heteroaryl group" or "heteroaryl
radical" as used in the context of the present invention is
understood to mean optionally substituted 5- or 6-membered aromatic
rings and multicyclic rings, for example bicyclic and tricyclic
compounds having at least one heteroatom in at least one ring. The
heteroaryls in the context of the invention preferably comprise 5
to 30 ring atoms. They may be monocyclic, bicyclic or tricyclic,
and some can be derived from the aforementioned aryl by replacing
at least one carbon atom in the aryl base skeleton with a
heteroatom. Preferred heteroatoms are N, O and S. The hetaryl
radicals more preferably have 5 to 13 ring atoms. The base skeleton
of the heteroaryl radicals is especially preferably selected from
systems such as pyridine and five-membered heteroaromatics such as
thiophene, pyrrole, imidazole or furan. These base skeletons may
optionally be fused to one or two six-membered aromatic radicals.
In addition, the term "heteroaryl" also comprises ring systems
comprising at least two monocyclic, bicyclic or multicyclic
aromatic rings joined to one another via single or double bonds,
where at least one ring comprises a heteroatom. When the
heteroaryls are not monocyclic systems, in the case of the term
"heteroaryl" for at least one ring, the saturated form (perhydro
form) or the partly unsaturated form (for example the dihydro form
or tetrahydro form), provided the particular forms are known and
stable, is also possible. The term "heteroaryl" in the context of
the present invention thus comprises, for example, also bicyclic or
tricyclic radicals in which either both or all three radicals are
aromatic, and also bicyclic or tricyclic radicals in which only one
ring is aromatic, and also tricyclic radicals in which two rings
are aromatic, where at least one of the rings, i.e. at least one
aromatic or one nonaromatic ring has a heteroatom. Suitable fused
heteroaromatics are, for example, carbazolyl, benzimidazolyl,
benzofuryl, dibenzofuryl or dibenzothiophenyl. The base skeleton
may be substituted at one, more than one or all substitutable
positions, suitable substituents being the same as have already
been specified under the definition of C.sub.6-C.sub.30-aryl.
However, the hetaryl radicals are preferably unsubstituted.
Suitable hetaryl radicals are, for example, pyridin-2-yl,
pyridin-3-yl, pyridin-4-yl, thiophen-2-yl, thiophen-3-yl,
pyrrol-2-yl, pyrrol-3-yl, furan-2-yl, furan-3-yl and imidazol-2-yl
and the corresponding benzofused radicals, especially carbazolyl,
benzimidazolyl, benzofuryl, dibenzofuryl or dibenzothiophenyl.
[0212] In the context of the invention, the term "optionally
substituted" refers to radicals in which at least one hydrogen
radical of an alkyl group, aryl group or heteroaryl group has been
replaced by a substituent. With regard to the type of this
substituent, preference is given to alkyl radicals, for example
methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl and octyl, and
also isopropyl, isobutyl, isopentyl, sec-butyl, tert-butyl,
neopentyl, 3,3-dimethylbutyl and 2-ethylhexyl, aryl radicals, for
example C.sub.6-C.sub.10-aryl radicals, especially phenyl or
naphthyl, most preferably C.sub.6-aryl radicals, for example
phenyl, and hetaryl radicals, for example pyridin-2-yl,
pyridin-3-yl, pyridin-4-yl, thiophen-2-yl, thiophen-3-yl,
pyrrol-2-yl, pyrrol-3-yl, furan-2-yl, furan-3-yl and imidazol-2-yl,
and also the corresponding benzofused radicals, especially
carbazolyl, benzimidazolyl, benzofuryl, dibenzofuryl or
dibenzothiophenyl. Further examples include the following
substituents: alkenyl, alkynyl, halogen, hydroxyl.
[0213] The degree of substitution here may vary from
monosubstitution up to the maximum number of possible
substituents.
[0214] Preferred compounds of the formula I for use in accordance
with the invention are notable in that at least two of the R.sup.1,
R.sup.2 and R.sup.3 radicals are para-OR and/or --NR.sub.2
substituents. The at least two radicals here may be only --OR
radicals, only --NR.sub.2 radicals, or at least one --OR and at
least one --NR.sub.2 radical.
[0215] Particularly preferred compounds of the formula I for use in
accordance with the invention are notable in that at least four of
the R.sup.1, R.sup.2 and R.sup.3 radicals are para-OR and/or
--NR.sub.2 substituents.
[0216] The at least four radicals here may be only --OR radicals,
only --NR.sub.2 radicals or a mixture of --OR and --NR.sub.2
radicals.
[0217] Very particularly preferred compounds of the formula I for
use in accordance with the invention are notable in that all of the
R.sup.1, R.sup.2 and R.sup.3 radicals are para-OR and/or --NR.sub.2
substituents. They may be only --OR radicals, only --NR.sub.2
radicals or a mixture of --OR and --NR.sub.2 radicals.
[0218] In all cases, the two R in the --NR.sub.2 radicals may be
different from one another, but they are preferably the same.
[0219] Preferably, A.sup.1, A.sup.2 and A.sup.3 are each
independently selected from the group consisting of
##STR00006##
in which [0220] m is an integer from 1 to 18, [0221] R.sup.4 is
alkyl, aryl or heteroaryl, where R.sup.4 is preferably an aryl
radical, more preferably a phenyl radical, [0222] R.sup.5, R.sup.6
are each independently H, alkyl, aryl or heteroaryl, where the
aromatic and heteroaromatic rings of the structures shown may
optionally have further substitution. The degree of substitution of
the aromatic and heteroaromatic rings here may vary from
monosubstitution up to the maximum number of possible
substituents.
[0223] Preferred substituents in the case of further substitution
of the aromatic and heteroaromatic rings include the substituents
already mentioned above for the one, two or three optionally
substituted aromatic or heteroaromatic groups.
[0224] Preferably, the aromatic and heteroaromatic rings of the
structures shown do not have further substitution.
[0225] More preferably, A.sup.1, A.sup.2 and A.sup.3 are each
independently
##STR00007##
more preferably
##STR00008##
[0226] More preferably, the at least one compound of the formula
(I) has one of the following structures
##STR00009##
[0227] In an alternative embodiment, the organic p-type
semiconductor comprises a compound of the type ID322 having the
following structure:
##STR00010##
[0228] The compounds for use in accordance with the invention can
be prepared by customary methods of organic synthesis known to
those skilled in the art. References to relevant (patent)
literature can additionally be found in the synthesis examples
adduced below.
d) Second Electrode
[0229] The second electrode may be a bottom electrode facing the
substrate or else a top electrode facing away from the substrate.
As outlined above, the second electrode may be fully or partially
transparent or, else, may be intransparent. As used herein, the
term partially transparent refers to the fact that the second
electrode may comprise transparent regions and intransparent
regions.
[0230] One or more materials of the following group of materials
may be used: at least one metallic material, preferably a metallic
material selected from the group consisting of aluminum, silver,
platinum, gold; at least one nonmetallic inorganic material,
preferably LiF; at least one organic conductive material,
preferably at least one electrically conductive polymer and, more
preferably, at least one transparent electrically conductive
polymer.
[0231] The second electrode may comprise at least one metal
electrode, wherein one or more metals in pure form or as a
mixture/alloy, such as especially aluminum or silver may be
used.
[0232] Additionally or alternatively, nonmetallic materials may be
used, such as inorganic materials and/or organic materials, both
alone and in combination with metal electrodes. As an example, the
use of inorganic/organic mixed electrodes or multilayer electrodes
is possible, for example the use of LiF/Al electrodes. Additionally
or alternatively, conductive polymers may be used. Thus, the second
electrode of the optical sensor preferably may comprise one or more
conductive polymers.
[0233] Thus, as an example, the second electrode may comprise one
or more electrically conductive polymers, in combination with one
or more layers of a metal. Preferably, the at least one
electrically conductive polymer is a transparent electrically
conductive polymer. This combination allows for providing very thin
and, thus, transparent metal layers, by still providing sufficient
electrical conductivity in order to render the second electrode
both transparent and highly electrically conductive. Thus, as an
example, the one or more metal layers, each or in combination, may
have a thickness of less than 50 nm, preferably less than 40 nm or
even less than 30 nm.
[0234] As an example, one or more electrically conductive polymers
may be used, selected from the group consisting of: polyanaline
(PANI) and/or its chemical relatives; a polythiophene and/or its
chemical relatives, such as poly(3-hexylthiophene) (P3HT) and/or
PEDOT:PSS (poly(3,4-ethylenedioxythiophene)
poly(styrenesulfonate)). Additionally or alternatively, one or more
of the conductive polymers as disclosed in EP2507286 A2, EP2205657
A1 or EP2220141 A1. For further exemplary embodiments, reference
may be made to U.S. provisional application No. 61/739,173 or U.S.
provisional application No. 61/708,058, the full content of all of
which is herewith included by reference.
[0235] In addition or alternatively, inorganic conductive materials
may be used, such as inorganic conductive carbon materials, such as
carbon materials selected from the group consisting of: graphite,
graphene, carbon nano-tubes, carbon nano-wires.
[0236] In addition, it is also possible to use electrode designs in
which the quantum efficiency of the components is increased by
virtue of the photons being forced, by means of appropriate
reflections, to pass through the absorbing layers at least twice.
Such layer structures are also referred to as "concentrators" and
are likewise described, for example, in WO 02/101838 (especially
pages 23-24).
[0237] Summarizing the findings of the present invention, the
following embodiments are preferred:
Embodiment 1
[0238] An optical detector, comprising: [0239] an optical sensor,
having a substrate and at least one photosensitive layer setup
disposed thereon, the photosensitive layer setup having at least
one first electrode, at least one second electrode and at least one
photovoltaic material sandwiched in between the first electrode and
the second electrode, wherein the photovoltaic material comprises
at least one organic material, wherein the first electrode
comprises a plurality of first electrode stripes and wherein the
second electrode comprises a plurality of second electrode stripes,
wherein the first electrode stripes and the second electrode
stripes intersect such that a matrix of pixels is formed at
intersections of the first electrode stripes and the second
electrode stripes; and [0240] at least one readout device, the
readout device comprising a plurality of electrical measurement
devices being connected to the second electrode stripes and a
switching device for subsequently connecting the first electrode
stripes to the electrical measurement devices.
Embodiment 2
[0241] The optical detector according to the preceding embodiment,
wherein the optical detector further comprises at least one optical
element for optically imaging at least one object onto the optical
sensor.
Embodiment 3
[0242] The optical sensor according to the preceding embodiment,
wherein the at least one optical element comprises at least one
lens.
Embodiment 4
[0243] The optical detector according to any one of the preceding
embodiments, wherein the matrix of pixels has rows defined by the
first electrode stripes and columns defined by the second electrode
stripes, wherein each electrical measurement device is connected to
a column, such that electrical signals for the pixels of each row
may be measured simultaneously.
Embodiment 5
[0244] The optical detector according to the preceding embodiment,
wherein the switching device is adapted to subsequently connect the
rows to the electrical measurement devices.
Embodiment 6
[0245] The optical detector according to any one of the preceding
embodiments, wherein the switching device is adapted to perform a
multiplexing measurement scheme, wherein, in the multiplexing
measurement scheme, the first electrode stripes are iteratively
connected to the electrical measurement devices.
Embodiment 7
[0246] The optical detector according to any one of the preceding
embodiments, wherein the electrical measurement devices each
comprise at least one of a current measurement device and a voltage
measurement device.
Embodiment 8
[0247] The optical detector according to any one of the preceding
embodiments, wherein the electrical measurement devices are
analogue measurement devices.
Embodiment 9
[0248] The optical detector according to the preceding embodiment,
wherein the electrical measurement devices further comprise
analogue-digital converters.
Embodiment 10
[0249] The optical detector according to any one of the preceding
embodiments, wherein the readout device further comprises at least
one data memory for storing measurement values for the pixels of
the matrix of pixels.
Embodiment 11
[0250] The optical detector according to any one of the preceding
embodiments, wherein one of the first electrode and the second
electrode is a bottom electrode and wherein the other of the first
electrode and the second electrode is a top electrode, wherein the
bottom electrode is applied to a substrate, wherein the
photovoltaic material is applied to the bottom electrode and at
least partially covers the bottom electrode and wherein the top
electrode is applied to the photovoltaic material.
Embodiment 12
[0251] The optical detector according to the preceding embodiment,
wherein the substrate is a transparent substrate.
Embodiment 13
[0252] The optical detector according to any one of the two
preceding embodiments, wherein at least one of the bottom electrode
and the top electrode is transparent.
Embodiment 14
[0253] The optical detector according to the preceding embodiment,
wherein the bottom electrode is transparent.
Embodiment 15
[0254] The optical detector according to the preceding embodiment,
wherein the bottom electrode comprises a transparent conductive
oxide, preferably a transparent conductive oxide selected from the
group consisting of fluorine-doped tin oxide, indium-doped tin
oxide and zinc oxide.
Embodiment 16
[0255] The optical detector according to any one of the preceding
embodiments, wherein the top electrode comprises a plurality of
metal electrode stripes.
Embodiment 17
[0256] The optical detector according to the preceding embodiment,
wherein the metal electrode stripes are separated by electrically
insulating separators.
Embodiment 18
[0257] The optical detector according to the preceding embodiment,
wherein the electrically insulating separators are photoresist
structures.
Embodiment 19
[0258] The optical detector according to any one of the two
preceding embodiments, wherein the optical sensor comprises an
n-semiconducting metal oxide, preferably a nano-porous
n-semiconducting metal oxide, wherein the electrically insulating
separators are deposited on top of the n-semiconducting metal
oxide.
Embodiment 20
[0259] The optical detector according to the preceding embodiment,
wherein the optical sensor further comprises at least one solid
p-semiconducting organic material deposited on top of the
n-semiconducting metal oxide, the solid p-semiconducting organic
material being sub-divided into a plurality of stripe-shaped
regions by the electrically insulating separators.
Embodiment 21
[0260] The optical detector according to any one of the preceding
embodiments, wherein the top electrode is transparent.
Embodiment 22
[0261] The optical detector according to the preceding embodiment,
wherein the top electrode comprises at least one metal layer, the
metal layer preferably having a thickness of less than 50 nm, more
preferably a thickness of less than 40 nm, and most preferably a
thickness of less than 30 nm.
Embodiment 23
[0262] The optical detector according to the preceding embodiment,
wherein the metal layer comprises at least one metal selected from
the group consisting of: Ag, Al, Ag, Au, Pt, Cu; and/or one or more
alloys selected from the group consisting of NiCr, AlNiCr, MoNb and
AlNd.
Embodiment 24
[0263] The optical detector according to any one of the three
preceding embodiments, wherein the top electrode further comprises
at least one electrically conductive polymer embedded in between
the photovoltaic material and the metal layer.
Embodiment 25
[0264] The optical detector according to the preceding embodiment,
wherein the electrically conductive polymer comprises at least one
conjugated polymer.
Embodiment 26
[0265] The optical detector according to any one of the two
preceding embodiments, wherein the electrically conductive polymer
comprises at least one polymer selected from the group consisting
of: a poly-3,4-ethylenedioxythiophene (PEDOT), preferably PEDOT
being electrically doped with at least one counter ion, more
preferably PEDOT doped with sodium polystyrene sulfonate
(PEDOT:PSS); a polyaniline (PANI); a polythiophene.
Embodiment 27
[0266] The optical detector according to any one of the preceding
embodiments, wherein the optical detector comprises at least one
encapsulation protecting one or more of the photovoltaic material,
the first electrode or the second electrode at least partially from
moisture.
Embodiment 28
[0267] The optical detector according to any one of the preceding
embodiments, wherein each pixel forms an individual photovoltaic
device, preferably an organic photovoltaic device.
Embodiment 29
[0268] The optical detector according to the preceding embodiment,
wherein each pixel forms a dye-sensitized solar cell, more
preferably a solid dye-sensitized solar cell.
Embodiment 30
[0269] The optical detector according to any one of the preceding
embodiments, wherein the at least one optical sensor comprises at
least one optical sensor having at least one sensor region and
being capable of providing at least one sensor signal, wherein the
sensor signal, given the same total power of illumination of the
sensor region by the light beam, is dependent on a geometry of the
illumination, in particular on a beam cross section of the
illumination of the sensor area.
Embodiment 31
[0270] The detector according to any one of the preceding
embodiments, wherein the at least one optical sensor comprises at
least one stack of optical sensors, each optical sensor having at
least one sensor region and being capable of providing at least one
sensor signal, wherein the sensor signal, given the same total
power of illumination of the sensor region by the light beam, is
dependent on a geometry of the illumination, in particular on a
beam cross section of the illumination on the sensor area, wherein
the evaluation device is adapted to compare at least one sensor
signal generated by at least one pixel of a first one of the
optical sensors with at least one sensor signal generated by at
least one pixel of a second one of the optical sensors.
Embodiment 32
[0271] The optical detector according to any one of the preceding
embodiments, wherein the photovoltaic material comprises at least
one n-semiconducting metal oxide, at least one dye, and at least
one solid p-semiconducting material, preferably at least one
p-semiconducting organic material.
Embodiment 33
[0272] The optical detector according to the preceding embodiment,
wherein the n-semiconducting metal oxide comprises at least one
nano-porous n-semiconducting metal oxide.
Embodiment 34
[0273] The optical detector according to the preceding embodiment,
wherein the nano-porous n-semiconducting metal oxide is sensitized
with at least one organic dye.
Embodiment 35
[0274] The optical detector according to any one of the two
preceding embodiments, wherein the n-semiconducting metal oxide
further comprises at least one dense layer of the n-semiconducting
metal oxide.
Embodiment 36
[0275] The optical detector according to any one of the preceding
embodiments, wherein the optical detector comprises a stack of at
least two imaging devices, wherein at least one of the imaging
devices is the optical sensor.
Embodiment 37
[0276] The optical detector according to the preceding embodiment,
wherein the stack of imaging devices further comprises at least one
additional imaging device, preferably at least one additional
imaging device selected from the group consisting of a CCD chip and
a CMOS chip.
Embodiment 38
[0277] The optical detector according to any one of the two
preceding embodiments, wherein the stack comprises at least two
imaging devices having differing spectral sensitivities.
Embodiment 39
[0278] The optical detector according to any one of the three
preceding embodiments, wherein the stack comprises at least two
optical sensors.
Embodiment 40
[0279] The optical detector according to the preceding embodiment,
wherein the stack comprises optical sensors having differing
spectral sensitivities.
Embodiment 41
[0280] The optical detector according to the preceding embodiment,
wherein the stack comprises the optical sensors having differing
spectral sensitivities in an alternating sequence.
Embodiment 42
[0281] The optical detector according to any one of the six
preceding embodiments, wherein the optical detector is adapted to
acquire three-dimensional image by evaluating sensor signals of the
optical sensors.
Embodiment 43
[0282] The optical detector according to the preceding embodiment,
wherein the optical detector is adapted to acquire a multicolor
three-dimensional image, preferably a full-color three-dimensional
image, by evaluating sensor signals of the optical sensors having
differing spectral properties.
Embodiment 44
[0283] The optical detector according to any one of the eight
preceding embodiments, wherein the optical detector is adapted to
acquire a three-dimensional image of a scene within a field of view
of the optical detector.
Embodiment 45
[0284] The optical detector according to any one of the preceding
embodiments, wherein the detector further comprises at least one
time-of-flight detector adapted for detecting at least one distance
between the at least one object and the optical detector by
performing at least one time-of-flight measurement.
Embodiment 46
[0285] The optical detector according to any one of the preceding
embodiments, wherein the photosensitive layer setup comprises at
least 3 first electrode stripes, preferably at least 10 first
electrode stripes, more preferably at least 30 first electrode
stripes and most preferably at least 50 first electrode
stripes.
Embodiment 47
[0286] The optical detector according to any one of the preceding
embodiments, wherein the photosensitive layer setup comprises at
least 3 second electrode stripes, preferably at least 10 second
electrode stripes, more preferably at least 30 second electrode
stripes and most preferably at least 50 second electrode
stripes.
Embodiment 48
[0287] The optical detector according to any one of the preceding
embodiments, wherein the photosensitive layer setup comprises
3-1200 first electrode stripes and 3-1200 second electrode stripes,
preferably 10-1000 first electrode stripes and 10-1000 second
electrode stripes and more preferably 50-500 first electrode
stripes and 50-500 second electrode stripes.
Embodiment 49
[0288] The optical detector according to any one of the preceding
embodiments, wherein the optical sensor is transparent.
Embodiment 50
[0289] A detector system for determining a position of at least one
object, the detector system comprising at least one optical
detector according to any one of the preceding embodiments, the
detector system further comprising at least one beacon device
adapted to direct at least one light beam towards the optical
detector, wherein the beacon device is at least one of attachable
to the object, holdable by the object and integratable into the
object.
Embodiment 51
[0290] The detector system according to the preceding embodiment,
wherein the beacon device comprises at least one illumination
source.
Embodiment 52
[0291] The detector system according to any one of the two
preceding embodiments, wherein the beacon device comprises at least
one reflective device adapted to reflect a primary light beam
generated by an illumination source independent from the
object.
Embodiment 53
[0292] The detector system according to any one of the three
preceding embodiments, wherein the detector system comprises at
least two beacon devices, preferably at least three beacon
devices.
Embodiment 54
[0293] The detector system according to any one of the four
preceding embodiments, wherein the detector system further
comprises the at least one object.
Embodiment 55
[0294] The detector system according to the preceding embodiment,
wherein the object is a rigid object.
Embodiment 56
[0295] The detector system according to any one of the two
preceding embodiments, wherein the object is selected from the
group consisting of: an article of sports equipment, preferably an
article selected from the group consisting of a racket, a club, a
bat; an article of clothing; a hat; a shoe; a helmet; a pair of
glasses.
Embodiment 57
[0296] A human-machine interface for exchanging at least one item
of information between a user and a machine, wherein the
human-machine interface comprises at least one detector system
according to any one of the preceding embodiments referring to a
detector system, wherein the at least one beacon device is adapted
to be at least one of directly or indirectly attached to the user
and held by the user, wherein the human-machine interface is
designed to determine at least one position of the user by means of
the detector system, wherein the human-machine interface is
designed to assign to the position at least one item of
information.
Embodiment 58
[0297] An entertainment device for carrying out at least one
entertainment function, wherein the entertainment device comprises
at least one human-machine interface according to the preceding
embodiment, wherein the entertainment device is designed to enable
at least one item of information to be input by a player by means
of the human-machine interface, wherein the entertainment device is
designed to vary the entertainment function in accordance with the
information.
Embodiment 59
[0298] A tracking system for tracking a position of at least one
movable object, the tracking system comprising at least one
detector system according to any one of the preceding embodiments
referring to a detector system, the tracking system further
comprising at least one track controller, wherein the track
controller is adapted to track a series of positions of the object
at specific points in time.
Embodiment 60
[0299] A camera for imaging at least one object, the camera
comprising at least one optical detector according to any one of
the preceding embodiments referring to an optical detector.
Embodiment 61
[0300] A method for manufacturing an optical detector, the method
comprising the following steps: [0301] a) manufacturing an optical
sensor, wherein a photosensitive layer setup is deposited onto a
substrate, the photosensitive layer setup having at least one first
electrode, at least one second electrode and at least one
photovoltaic material sandwiched in between the first electrode and
the second electrode, wherein the photovoltaic material comprises
at least one organic material, wherein the first electrode
comprises a plurality of first electrode stripes and wherein the
second electrode comprises a plurality of second electrode stripes,
wherein the first electrode stripes and the second electrode
stripes intersect such that a matrix of pixels is formed at
intersections of the first electrode stripes and the second
electrode stripes; and [0302] b) connecting at least one readout
device to the optical sensor, the readout device comprising a
plurality of electrical measurement devices being connected to the
second electrode stripes, the readout device further comprising at
least one switching device for subsequently connecting the first
electrode stripes to the electrical measurement devices.
Embodiment 62
[0303] The method according to the preceding embodiment, wherein
method step a) comprises the following sub-steps: [0304] a1.
providing the substrate; [0305] a2. depositing at least one bottom
electrode onto the substrate, wherein the bottom electrode is one
of the first electrode or second electrode, wherein the bottom
electrode comprises a plurality of bottom electrode stripes; [0306]
a3. depositing the at least one photovoltaic material onto the
bottom electrode; [0307] a4. depositing at least one top electrode
onto the photovoltaic material, wherein the top electrode is the
other one of the first electrode and the second electrode as
compared to method step a2., wherein the top electrode comprises a
plurality of top electrode stripes, wherein the top electrode
stripes are deposited such that the bottom electrode stripes and
the top electrode stripes intersect such that the matrix of pixels
is formed.
Embodiment 63
[0308] The method according to the preceding embodiment, wherein
method step a2. comprises one of the following patterning
techniques: [0309] the bottom electrode is deposited in an
unpatterned way and subsequently patterned, preferably by using the
lithography; [0310] the bottom electrode is deposited in a
patterned way, preferably by using one or more of a deposition
technique through a mask or a printing technique.
Embodiment 64
[0311] The method according to any one of the two preceding
embodiments, wherein method step a3. comprises: [0312] depositing
at least one layer of a dense n-semiconducting metal oxide,
preferably TiO.sub.2; [0313] depositing at least one layer of a
nano-porous n-semiconducting metal oxide, preferably at least one
layer of nano-porous TiO.sub.2; [0314] sensitizing the at least one
layer of the nano-porous n-semiconducting metal oxide with at least
one organic dye; [0315] depositing at least one layer of a solid
p-semiconducting organic material.
Embodiment 65
[0316] The method according to any one of the three preceding
embodiments, wherein method step a4 comprises one or more of the
following: [0317] depositing the top electrode onto the
photovoltaic material in a patterned way, preferably by using a
deposition through a shadow mask and/or a printing technique;
[0318] depositing the top electrode onto the photovoltaic material
in an unpatterned way, followed by at least one patterning step;
[0319] providing at least one separator on one or more of the
substrate or the photovoltaic material, followed by an unpatterned
deposition of the top electrode, wherein the top electrode is
sub-divided into the top electrode stripes by the separator.
Embodiment 66
[0320] The method according any of the three preceding embodiments,
wherein method step a4. comprises depositing at least one
electrically conductive polymer on top of the photovoltaic material
and depositing at least one metal layer on top of the electrically
conductive polymer.
Embodiment 65
[0321] The method according to the preceding embodiment, wherein
the metal layer has a thickness of less than 50 nm, preferably a
thickness of less than 40 nm, more preferably a thickness of less
than 30 nm.
Embodiment 68
[0322] A method of taking at least one image of an object, the
method comprising a use of the optical detector according to any
one of the preceding embodiments referring to an optical detector,
the method comprising the following steps: [0323] imaging the
object onto the optical sensor, [0324] subsequently connecting the
first electrode stripes to the electrical measurement devices,
wherein the electrical measurement devices, for each first
electrode stripe, measure electrical signals for the pixels of the
respective first electrode stripe, [0325] composing the electrical
signals of the pixels to form an image.
Embodiment 69
[0326] The method according to the preceding embodiment, wherein
electrical signals of the pixels are stored within a data memory,
the data memory providing an array of values representing the
electrical signals.
Embodiment 70
[0327] The method according to any one of the two preceding
embodiments, wherein the electrical signals comprise primary
electrical signals in an analogue format, the primary electrical
signals being transformed into secondary electrical signals being
digital electrical signals by using analogue-digital
converters.
Embodiment 71
[0328] The method according to the preceding embodiment, wherein
the secondary electrical signals comprise gray-scale levels for
each pixel.
Embodiment 72
[0329] A use of the optical detector according to any one of the
preceding embodiments relating to an optical detector, for a
purpose of use, selected from the group consisting of: a position
measurement in traffic technology; an entertainment application; a
security application; a safety application; a human-machine
interface application; a tracking application; a photography
application; a use in combination with at least one time-of-flight
detector.
BRIEF DESCRIPTION OF THE FIGURES
[0330] Further optional details and features of the invention are
evident from the description of preferred exemplary embodiments
which follows in conjunction with the dependent claims. In this
context, the particular features may be implemented alone or with
several in combination.
[0331] The invention is not restricted to the exemplary
embodiments. The exemplary embodiments are shown schematically in
the figures. Identical reference numerals in the individual figures
refer to identical elements or elements with identical function, or
elements which correspond to one another with regard to their
functions.
[0332] Specifically, in the figures:
[0333] FIG. 1 shows an embodiment of an optical detector having an
optical sensor and a readout device;
[0334] FIGS. 2A to 2C show cross-sectional views along cutting line
A-A to the optical detector in FIG. 1, with various embodiments of
layer setups;
[0335] FIG. 3 shows a cross-sectional view of an optical detector
having a stack of imaging devices;
[0336] FIG. 4 shows a schematic setup of an optical detector
embodied as a light-field camera;
[0337] FIG. 5 shows a schematic setup of a detector system, a
tracking system, a human-machine interface and an entertainment
device using the optical detector according to the present
invention; and
[0338] FIG. 6 shows an integration of at least one time-of-flight
detector into the detector according to the present invention.
EXEMPLARY EMBODIMENTS
[0339] In FIG. 1, a top view of an embodiment of an optical
detector 110 according to the present invention is shown. The
optical detector 110 comprises, in this embodiment, one or more
optical sensors 112 and at least one readout device 114 connected
to or connectable to the optical sensor 112.
[0340] The optical sensor 112 comprises a substrate 116 and at
least one photosensitive layer setup 118 disposed thereon. The
photosensitive layer setup 118 comprises a first electrode 120
which, in this embodiment, may be embodied as a bottom electrode
122. It shall be noted, however, that the first electrode 120 may
as well be a top electrode, as discussed above. The first electrode
120 comprises a plurality of first electrode stripes 124, which,
accordingly, are embodied as bottom electrode stripes 126 and,
which, alternatively, may as well be embodied as top electrode
stripes. Each of the first electrode stripes 124 comprises at least
one contact pad 128 for electrically contacting the respective
first electrode stripe 124.
[0341] The photosensitive layer setup 118 further comprises at
least one second electrode 130 which may be embodied as a top
electrode 132. As outlined above, the second electrode 130,
alternatively, may be embodied as a bottom electrode and, thus, the
setup shown in FIG. 1 may as well be reversed. The second electrode
130 comprises a plurality of second electrode stripes 134 which,
accordingly, may be embodied as top electrode stripes 136. As
outlined above, a reverse setup, with the second electrode stripes
134 being bottom electrode stripes, is feasible, as well.
[0342] The second electrode stripes 134, similar to the setup of
the first electrode stripes 124, may electrically be contacted via
contact pads 138.
[0343] It shall be noted that, in the exemplary embodiment shown in
FIG. 1, four first electrode stripes 124 and five second electrode
stripes 134 are depicted. A different number of first electrode
stripes 124 and/or a different number of second electrode stripes
134 is feasible, as well.
[0344] The photosensitive layer setup 118 further comprises at
least one photovoltaic material 140 sandwiched in between the first
electrode 120 and the second electrode 130. Preferably, the
photovoltaic material 140 is applied such that the contact pads 128
remain uncovered by the photovoltaic material 140. Exemplary
details of the photovoltaic material 140 will be given with regard
to FIGS. 2A to 2C below.
[0345] As can be seen in FIG. 1, the first electrode stripes 124
and the second electrode stripes 134 intersect such that a matrix
142 of pixels 144 is formed. Each pixel 144 comprises a portion of
a first electrode stripe 124, a portion of a second electrode
stripe 134 and a portion of the photovoltaic material 140
sandwiched in between. In this exemplary embodiment shown in FIG.
1, the matrix 142 is a rectangular matrix, with the pixels 144
disposed in rows 146 (horizontal direction in FIG. 1) and columns
148 (vertical direction in FIG. 1). Thus, as an example, each of
the pixels 144 may be identified by a row number and a column
number.
[0346] Each of the first electrode stripes 124 and the bottom
electrode stripes 126, in this embodiment, is contacted via a
respective first lead 150 contacting the contact pads 128.
Similarly, each of the second electrode stripes 134 and each of the
top electrode stripes 136 is electrically contacted by a respective
second lead 152 electrically contacting the contact pads 138.
Further, the readout device 114 comprises a plurality of
measurement devices 154. Preferably, one measurement device 154 is
provided per column. It shall be noted that, as will be explained
in further detail below, the embodiment in FIG. 1 shows a
row-switching. Alternatively, a column-switching is feasible. In
the latter case, preferably, one measurement device 154 is provided
per row. Further, it is generally possible to combine measurement
devices 154, such as by multiple columns 148 sharing a measurement
device 154 and/or by combining measurement devices 154 for a
plurality of columns 148 into a single integrated device, such as
an ASIC.
[0347] The measurement devices 154 may be adapted to generate at
least one electrical signal. Thus, preferably, the measurement
devices 154 may be selected from the group consisting of current
measurement devices, as indicated in FIG. 1, and/or voltage
measurement devices. In the embodiment depicted in FIG. 1, current
measurement devices are provided, adapted to measure electrical
currents for the columns 148, indicated by I.sub.1, . . . ,
I.sub.5.
[0348] The measurement devices 154 each may comprise ports 156,
158, wherein a first port 156 may be connected to a switching
device 160, preferably an automatic switching device 160, and
wherein a second port 158 is connected to the respective column 148
via the respective second lead 152. As may be seen in FIG. 1, the
first ports 156 of the measurement devices 154 may be combined in a
combined lead 162 connecting the first ports 156 to the switching
device 160. The switching device 160, also referred to as S in FIG.
1, is adapted to selectively connect the combined lead 162 and/or
the first ports 156 to the first leads 150. Thus, preferably, the
switching device 160 subsequently connects the first leads 150 to
the combined lead 162. Thus, a subsequent switching from the top
row 146 to the bottom row 146 may take place, followed by switching
back to the top row. Alternative switching schemes are possible.
Further, as outlined above, the optical sensor 112 and/or the
readout 114 may be adapted to sub-divide the matrix 142 into
sub-matrices which are switched and/or selected separately.
[0349] In each position of the switching device 160, a specific row
146 is connected to the combined lead 162 and, thus, is connected
to all first ports 156 of the measurement devices 154. Thus, a
specific row 146 is selected, and the measurement devices 154 are
adapted to measure signals for the respective pixels 144 of the
selected row. The signals may be processed, such as by using
analogue-digital-converters 164 and may be stored in a data memory
166. As an example, the data memory 166 may comprise a plurality of
data fields 168 which may correspond to the pixels 144 of the
matrix 142. Thus, for each measurement signal, a corresponding
field of the data memory 166 may be selected, and the measurement
value, preferably a digital measurement value, may be stored in the
respective data field 168. Thus, the data memory 166, when the
switching device 160 switches through the rows 146, subsequently is
filled in a row-by-row fashion with corresponding measurement
values. Finally, the data memory 166, with the entity of data
fields 168 and their corresponding measurement values, will
represent an image 170 in an electronic format.
[0350] It shall be noted that, in this embodiment or other
embodiments, the switching by the switching device 160 preferably
takes place automatically, by using a predetermined multiplexing
scheme. These multiplexing schemes as well as corresponding
switching devices 160 generally are known in the field of display
technology. In display technology, however, switching devices 160
are used for passive-matrix addressing of display pixels, such as
for providing appropriate voltages and/or currents through these
pixels. In the present invention, however, an inverse passive
matrix scheme is used, by using the switching device 160 for
measurement purposes, in order to readout electrical signals from
the pixels 146.
[0351] In FIGS. 2A to 2C, cross-sectional views through the optical
sensor 112 along cutting line A-A in FIG. 1 are given. Therein,
various possible embodiments of layer setups of the optical sensor
112 are depicted. It shall be noted, however, that other layer
setups are possible. The readout device 114 and/or leads 150, 152
are not depicted in these figures.
[0352] As depicted in all embodiments shown in FIG. 2C and as
discussed above, the optical sensor 112 comprises a substrate 116
with a photosensitive layer setup 118 disposed thereon. Further,
the photosensitive layer setup 118 may fully or partially be
covered by one or more encapsulations 172, such as at least one
encapsulation element like a glass cover, a metal cover or a
ceramic cover. Additionally or alternatively, one or more
encapsulation layers may be coated on top of the photosensitive
layer setup 118. The encapsulation 172 may be transparent or
intransparent. Preferably, at least in the setup shown in FIG. 2B,
the encapsulation 172 may fully or partially be transparent. The
encapsulation 172 may be located such that the contact pads 128
and/or the contact pads 138 (not shown in FIGS. 2A to 2C) remain
uncovered by the encapsulation 172 and, thus, are accessible for
electrical contacting.
[0353] As can be seen in FIG. 1 discussed above, the first
electrode 120, in all embodiments, comprises a plurality of first
electrode stripes 124. As an example, fluorine-doped tin oxide
(FTO) may be used. The patterning into stripes may be performed by
standard lithographic techniques known from display technology,
such as etching techniques. Thus, as an example, a large-area
coating of the substrate 116 with FTO may be provided, and the
regions of the first electrode stripes 124 may be covered with a
photoresist. Subsequently, regions uncovered by the photoresist may
be etched by standard etching techniques, such as wet etching
and/or dry etching, in order to remove the FTO from these
portions.
[0354] On top of the first electrode 120, the photovoltaic material
140 is disposed. In the embodiments shown in FIG. 2C, which are
given as exemplary embodiments only, without restricting the
possibility of using other types of photovoltaic materials 140
and/or other types of layer setups, the photovoltaic material 140
comprises a dense layer of an n-semiconducting metal oxide 174
disposed on top of the first electrode 120. The dense layer 174
acts as a barrier layer and may e.g. have a thickness of 10 nm to
500 nm. On top of the dense layer 174, one or more layers 176 of a
nano-porous n-semiconducting metal oxide may be disposed. On top of
the layer 176 and/or within the layer 176, at least one organic dye
178 may be applied, such as by doping and/or soaking the layer 176,
at least partially, with the organic dye 178. Additionally or
alternatively, a separate layer of the organic dye 178 may be
disposed on top of the layer 176.
[0355] On top of the layer 176 and/or on top of the organic dye
178, one or more layers of a solid p-semiconducting organic
material 180 are disposed. Generally, for the layers 174, 176 and
180 as well as for the organic dye 178, reference may be made to
the exemplary embodiments given above. Further, with regard to
processing techniques and/or materials or combinations of
materials, reference may be made to one or more of WO 2012/110924
A1, U.S. 61/739,173 and U.S. 61/749,964. Despite the fact that,
within the present invention, the bottom electrode 122 is a
stripe-shaped bottom electrode 122, the same materials and/or
processing techniques may be used.
[0356] In the embodiment shown in FIG. 2A, after subsequently
depositing the layers of the photosensitive layer setup 118, the
second electrode stripes 134 are deposited. For this purpose, metal
stripes may be deposited by known deposition techniques, such as
thermal evaporation and/or electron beam evaporation and/or
sputtering. In order to generate the stripe-shaped pattern, as an
example, a shadow mask may be used. Thus, regions of the surface of
the setup outside the second electrode stripes 134 may be covered
by the shadow mask, whereas regions in which the second electrode
stripes 134 are to be deposited may be left uncovered. As an
example, a steel mask may be used, with slot-shaped openings
corresponding to the shape of the second electrode stripes 134. The
setup, with this shadow mask on top, may be inserted into a vacuum
bell, and, as an example, an aluminum layer may be deposited ton
top, such as by using electron beam evaporation and/or thermal
evaporation from a crucible. As an example, the at least one metal
layer of the second electrode stripes 134 may have a thickness of
20 nm to 500 nm, preferably a thickness of 30 nm to 300 nm. Thus,
in the embodiment shown in FIG. 2A, symbolically, an illumination
is denoted by reference number 182. In this embodiment, the
illumination takes place through the substrate 116, which,
preferably, may be a glass substrate and/or a plastic substrate
with transparent properties. Additionally or alternatively,
however, an illumination from the top, i.e. from the opposite
direction, may take place. In order to provide sufficient light
within the photosensitive layer setup 118, in this case, the
encapsulation 172 preferably is fully or partially transparent and,
additionally, the second electrode stripes 134 may be provided as
transparent second electrode stripes 134. In order to provide
transparent second electrode stripes 134, several techniques may be
used. Thus, as outlined above, thin metal layers may be used. Thus,
specifically for aluminum, a sufficient transparency in the visible
spectral range may be provided in case a metal layer thickness of
less than 40 nm, preferably less than 30 nm or even 20 nm or less
is provided. However, with decreasing metal layer thickness, an
insufficient electrical conductivity along the second electrode
stripes 134 may occur.
[0357] In order to circumvent this problem, the one or more metal
layers of the second electrode 130 may be replaced and/or supported
by fully transparent electrically conductive materials. Thus, as an
example, one or more electrically conductive polymer layers may be
used for the second electrode stripes 134, as shown in an
alternative embodiment depicted in FIG. 2B. In this embodiment,
which may be used for generating a transparent optical sensor 112
which may be illuminated from one or both sides and which may even
be adapted to pass light, again, the second electrode stripes 134
comprise one or more metal layers 184, as in FIG. 2A. Additionally,
however, in between the metal layers 184 of the second electrode
stripes 134 and the p-semiconducting organic material 180, one or
more layers 186 of an electrically conductive organic material are
interposed. Preferably, the at least one layer 186 of the
electrically conductive polymer is patterned, in order to provide
electrically conductive polymer stripes 188 which are fully or
partially covered by metal stripes 190. The stripes 188 and 190, in
combination, form the second electrode stripes 134 and/or the top
electrode stripes 136.
[0358] As discussed above, in this embodiment and/or in other
embodiments, in order to keep the metal stripes 190 transparent, a
thickness of less than 40 nm, preferably less than 30 nm, is
preferred for the metal stripes 190. The layer 186 of the
electrically conductive polymer provides additional electric
conductivity, in order to sustain appropriate electrical
currents.
[0359] As discussed above, the metal stripes 190 may be generated
by various metal deposition techniques, such as physical vapor
deposition, preferably sputtering and/or thermal evaporation and/or
electron beam evaporation. Thus, as an example, one or more
aluminum layers may be deposited. In order to pattern the
electrically conductive polymer stripes 188, the electrically
conductive polymer may be applied in a patterned fashion. Thus, as
an example, various printing techniques for the electrically
conductive polymer may be used. For exemplary embodiments of
printing techniques, reference may be made to printing techniques
known in the technology of organic light-emitting displays and/or
printing techniques known from organic electronics. Thus, as an
example, reference may be made to the screen-printing techniques as
disclosed in US 2004/0216625 A1. Additionally or alternatively,
other types of printing techniques may be used, such as printing
techniques selected from the group consisting of screen-printing,
inkjet printing, flexo printing or other techniques.
[0360] The embodiments shown in FIGS. 2A and 2B are embodiments of
a patterned deposition of the top electrode 132, such as the second
electrode 130. Thus, deposition techniques are used in which the
top electrode 132 is deposited in a patterned fashion. As outlined
above, additionally or alternatively, other techniques are
feasible. Thus, generally, a large-area deposition is possible,
followed by a patterning step, such as a laser ablation and/or an
etching technique. Additionally or alternatively, as discussed
above, self-patterning techniques may be used. Thus, the optical
sensor 112 itself may comprise one or more separation elements 192,
as depicted in an exemplary embodiment shown in FIG. 2C. These
separation elements 192, as an example, may be longitudinal bars
applied to the substrate 116 and/or to one or more layers of the
photosensitive layer setup 118. In the cross-sectional view, the
separation elements, also referred to as separators, run
perpendicular to the plane of view, parallel to the second
electrode stripes 134. The separators 192, on or close to their
upper ends, may provide sharp edges 194, such as by providing a
trapezoidal shape. When evaporating the one or more metal layers
184 of the top electrode 132, with or without a shadow mask
limiting the area of evaporation, the metal layer 184 breaks at the
sharp edges 194 and, thus, separated metal stripes in between
neighboring separators 192 occur, forming the top electrode stripes
136.
[0361] This self-patterning technique generally is known from
display technology. Thus, as an example, the separators 192 may
fully or partially be made of photoresist structures. For
patterning these photoresist structures, reference may be made to
one or more of US 2003/0017360 A1, US 2005/0052120 A1, US
2003/0094607 A1 or other patterning techniques.
[0362] The self-patterning may be applied to the top electrode 132
only. However, as depicted in the embodiment in FIG. 2C,
additionally, the self-patterning by the one or more separators 192
may as well be used for patterning one or more additional layers
and/or elements of the optical sensor. Thus, as an example, one or
more organic layers may be patterned that way. As an example, the
organic dye 178 and/or the p-semiconducting organic material 180
may be patterned fully or partially by the at least one separator
192. Thus, generally, the at least one separator 192 may be applied
before applying the one or more organic components of the
photosensitive layer setup 118. As an example, the one or more
separators 192 may be applied after preparing the at least one
layer 176 of nano-porous n-semiconducting metal oxide. Since
typical photoresist patterning techniques require aggressive
etching steps and/or aggressive heating steps, such as heating to
temperatures above 100.degree. C., these steps might be detrimental
for organic materials. Thus, the separators 192 might be created
before applying the organic materials, such as before applying the
at least one organic dye 178 and/or before applying the at least
one p-semiconducting organic material 180. As known from display
technology, an application of organic materials and a patterning of
the organic materials is feasible in a homogeneous way, even though
the one or more separators 192 are present on the substrate 116.
Thus, the one or more organic dyes 178 and/or the one or more
p-semiconducting organic materials 180 may be applied by known
deposition techniques, such as vacuum evaporation (CVD and/or PVD),
wet processing (such as spin coating and/or printing) or other
deposition techniques. With regard to patterning of the separators
192, potential geometries of the separators 192, potential
materials of the separators 192 and other details of these
separators 192, reference may be made to the documents disclosed
above.
[0363] It shall be noted that, in addition to the at least one
metal layer 184, again, one or more layers of an electrically
conductive polymer may be deposited, such as one or more layers of
PEDOT:PSS, as e.g. used in the embodiment of FIG. 2B. Thus, as in
FIG. 2B, a transparent top electrode 132 may be manufactured even
when using the one or more separators 192.
[0364] The optical detector 110, besides the at least one optical
sensor 112, may comprise one or more additional elements. Thus, in
FIG. 3, an exemplary embodiment of the optical detector 110 is
shown in a cross-sectional view. The optical detector 110, as an
example, may be embodied as a camera 214 for photographic purposes.
In this embodiment, the optical detector 110 comprises a stack 196
of at least two, preferably at least three, imaging devices 198.
The imaging devices 198 are stacked along an optical axis 200 of
the optical detector 110. At least one of the imaging devices 198
is an optical sensor 112 as defined in claim 1 and/or as disclosed
in one or more of the embodiments discussed above, such as one or
more of the embodiments shown in FIG. 1 or 2A to 2C. As an example,
the stack 196 may comprise three optical sensors 112, such as in
positions numbered 1, 2 and 3 in FIG. 3. Additionally, the stack
196 may comprise one or more additional imaging devices 202, such
as in position number 4 in FIG. 3, which is the last position of
the stack 196, facing away from an entry opening 204 of the optical
detector 110. The at least one additional imaging device 202, which
may be embodied in an alternative way as compared to the at least
one optical sensor 112 as defined in claim 1, as an example, may be
an organic or an inorganic or a hybrid imaging device. As an
example, the additional imaging device 202 may be or may comprise
an inorganic semiconductor imaging device, such as a CCD chip
and/or a CMOS chip. Thus, as an example, the stack 196 may be a
combination of organic and inorganic imaging devices 198.
Alternatively, the stack 196 may comprise optical sensors 112 as
defined in claim 1, only.
[0365] In case a stack 196 is provided, preferably, at least one of
the imaging devices 198 is transparent. Thus, as an example, all
imaging devices 198 except for the last imaging device 198 facing
away from the entry opening 204 may be embodied as fully or
partially transparent imaging devices 198. As discussed above, this
transparency is easily feasible by using transparent first and
second electrodes 120, 130. As for the last imaging device 198, no
transparency is required. Thus, as discussed above, this last
imaging device 198 (such as imaging device 198 number 4 in FIG. 3)
may be an inorganic semiconductor imaging device 198, which not
necessarily has to provide transparent properties. Thus, typical
high-resolution imaging devices may be used, as known e.g. in
camera technologies.
[0366] Further, specifically in case a stack 196 of imaging devices
198 is provided, the imaging devices 198 of the stack 196 or at
least two of the imaging devices 198 may provide different spectral
sensitivities. Thus, as an example, the optical sensors 112 may
provide different types of organic dyes 178, having different
absorption properties. Thus, as an example, the organic dye 178 of
imaging device number 1 may absorb in the blue spectral range,
imaging device number 2 may absorb in the green spectral range, and
imaging device number 3 may absorb in the red spectral range.
Alternatively, any arbitrary permutations of these absorption
properties may be possible. The last imaging device 198 may have a
broad-band spectral sensitivity, in order to generate an
integrating signal over the whole spectral range. Thus, by
comparing images from the different imaging devices 198, color
information on a light beam 206 entering the optical detector 110
may be provided. As an example, signals of one imaging device 198,
such as integrated signals, may be divided by sum signals of all
imaging devices 198 and/or by one or more signals of the additional
imaging device 202, in order to provide color information.
[0367] The optical detector 110 may be adapted to take an image of
the light beam 206 at different positions along the optical axis
202, such as at different focal planes. By comparing these images,
various types of information may be derived from the images
generated by the imaging devices 198, such as position information
on an object emitting the at least one light beam 206. In order to
evaluate this information, the optical detector 110 may, besides
the one or more readout devices 114, comprise one or more
controllers 208 in order to evaluate images created by the imaging
devices 198. The one or more controllers 208 may form an evaluation
device 216 and/or may be part of an evaluation device 216 which,
besides, may also comprise the one or more readout devices 114. The
above-mentioned at least one data memory 166 may be part of the
controller 208 and/or the evaluation device 216.
[0368] As discussed above, the optical detector 110 may further
comprise one or more optical elements 210, such as one or more
optical elements 210 adapted for changing beam-propagation
properties of the light beam 206. As an example, the optical
element 210 may comprise one or more focusing and/or defocusing
lenses. The optical detector 110 may further comprise a housing 212
in which the imaging devices 198 are located, such as a light-tight
housing.
[0369] As outlined above, the optical detector 110 may be adapted
to take an image of the light beam 206 at different positions along
the optical axis 202, such as at different focal planes. By
comparing these images, various types of information may be derived
from the images generated, such as position information on an
object emitting the at least one light beam 206. This possibility
is symbolically shown in FIG. 4 which, basically, repeats the setup
of FIG. 3. Therein, one or more objects 218, denoted by A, B and C,
and/or one or more beacon devices 220 attached to, integrated into
or held by the object's 218 emit and/or reflect light beams 206
towards the optical detector 110.
[0370] The optical detector 110, in this embodiment or other
embodiments, may be set up to be used as a light-field camera.
Basically, the setup shown in FIG. 4 may correspond to the
embodiment shown in FIG. 3 or any other embodiment of the present
invention. The optical detector 110, as outlined above, comprises
the stack 196 of optical sensors 112, also referred to as pixelated
sensors, which specifically may be transparent. As an example,
pixelated organic optical sensors may be used, such as organic
solar cells, specifically sDSCs. In addition, the detector 110 and,
specifically, the stack 196, may comprise at least one additional
imaging device 202, such as an intransparent imaging device 202,
such as a CCD and/or a CMOS imaging device. The optical detector
110 may further comprise at least one optical element 210, such as
at least one lens or lens system, adapted for imaging the objects
218.
[0371] As outlined above, the detector 110 in the embodiment shown
herein is suited to act as a light-field camera. Thus, light-beams
206 propagating from the one or more objects 218 or beacon devices
may be focused by the optical element 210 into corresponding
images, denoted by A', B' and C' in FIG. 4. By using the stack 196
of optical sensors 112, a three-dimensional image may be captured.
Thus, specifically in case the optical sensors 112 are FiP-sensors,
i.e. sensors for which the sensor signals are dependent on the
photon density, the focal points for each of the light beams 206
may be determined by evaluating sensor signals of neighboring
optical sensors 112. Thus, by evaluating the sensor signals of the
stack 196, beam parameters of the various light beams 206 may be
determined, such as a focal position, spreading parameters or other
parameters. Thus, as an example, each light beam 206 and/or one or
more light beams 206 of interest may be determined in terms of
their beam parameters and may be represented by a parameter
representation and/or vector representation. Thus, since the
optical qualities and properties of the optical element 210 are
generally known, as soon as the beam parameters of the light beams
206 are determined by using the stack 196, a scene captured by the
optical detector 110, containing one or more objects 218, may be
represented by a simplified set of beam parameters. For further
details of the light-field camera shown in FIG. 4, reference may be
made to the description of the various possibilities given
above.
[0372] Further, as outlined above, the optical sensors 112 of the
stack 196 of optical sensors may have identical or different
wavelength sensitivities. Thus, the stack 196 may comprise two
types of optical sensors 112, such as in an alternating fashion.
Therein, a first type and a second type of optical sensors 112 may
be provided in the stack 196. The optical sensors 112 of the first
type and the second type specifically may be arranged in an
alternating fashion along the optical axis 200. The optical sensors
112 of the first type may have a first spectral sensitivity, such
as a first absorption spectrum, such as a first absorption spectrum
defined by a first dye, and the optical sensors 112 of the second
type may have a second spectral sensitivity different from the
first spectral sensitivity, such as a second absorption spectrum,
such as a second absorption spectrum defined by a second dye. By
evaluating sensor signals of these two or more types of optical
sensors 112, color information may be obtained. Thus, in addition
to the beam parameters which may be derived, the two or more types
of optical sensors 112 may allow for deriving additional color
information, such as for deriving a full-color three-dimensional
image. Thus, as an example, color information may be derived by
comparing the sensor signals of the optical sensors 112 of
different color with values stored in a look-up table. Thus, the
setup of FIG. 4 may be embodied as a monochrome, a full-color or
multicolor light-field camera 214. As outlined above and as will be
shown in further detail with reference to FIG. 5, the optical
detector 110 according to the present invention, in one or more of
the embodiments disclosed above, specifically may be part of one or
more of: a camera 214, a detector system 222, a tracking system
224, a human-machine interface 226 or an entertainment device
228.
[0373] FIG. 5 shows, in a highly schematic illustration, an
exemplary embodiment of the detector 110, having a plurality of the
optical sensors 112. The detector 110 specifically may be embodied
as a camera 214 or may be part of a camera 214. The camera 214 may
be made for imaging, specifically for 3D imaging, and may be made
for acquiring standstill images and/or image sequences such as
digital video clips. Other embodiments are feasible. FIG. 5 further
shows an embodiment of a detector system 222, which, besides the at
least one detector 110, comprises one or more of the beacon devices
220, which, in this exemplary embodiment, are attached and/or
integrated into an object 218, the position of which shall be
detected by using the detector 110. FIG. 5 further shows an
exemplary embodiment of a human-machine interface 226, which
comprises the at least one detector system 222, and, further, an
entertainment device 228, which comprises the human-machine
interface 226. The figure further shows an embodiment of a tracking
system 224 for tracking a position of the object 218, which
comprises the detector system 222 and the controller 208 which, in
this embodiment or other embodiments, may act as a track
controller. The components of the devices and systems shall be
explained in further detail in the following.
[0374] The detector 110, besides the one or more optical sensors
112, comprises the at least one readout device 114 which may be
part of at least one evaluation device 216, as explained in detail
above. The evaluation device 216 may be connected to the optical
sensors 112 by one or more connectors 230 and/or one or more
interfaces. Instead of using the at least one optional connector
230, the evaluation device 216 may fully or partially be integrated
into the optical sensors 112 and/or into a housing 232 of the
detector 110. Additionally or alternatively, the evaluation device
216 may fully or partially be designed as a separate device.
[0375] In this exemplary embodiment, the object 218, the position
of which may be detected, may be designed as an article of sports
equipment and/or may form a control element 234, the position of
which may be manipulated by a user 236. As an example, the object
218 may be or may comprise a bat, a record, a club or any other
article of sports equipment and/or fake sports equipment. Other
types of objects 218 are possible. Further, the user 236 himself or
herself may be considered as the object 218, the position of which
shall be detected.
[0376] As outlined above, the detector 110 comprises the plurality
of optical sensors 112. The optical sensors 112 may be located
inside the housing 232 of the detector 110. Further, at least one
optical element 210 may be comprised, such as one or more optical
systems, preferably comprising one or more lenses. An opening 238
inside the housing 232, which, preferably, is located
concentrically with regard to an optical axis 200 of the detector
110, preferably defines a direction of view 240 of the detector
110. A coordinate system 242 may be defined, in which a direction
parallel or antiparallel to the optical axis 200 is defined as a
longitudinal direction, whereas directions perpendicular to the
optical axis 200 may be defined as transversal directions. In the
coordinate system 242, symbolically depicted in FIG. 5, a
longitudinal direction is denoted by z, and transversal directions
are denoted by x and y, respectively. Other types of coordinate
systems 242 are feasible.
[0377] The detector 110 may comprise one or more of the optical
sensors 112. Preferably, as depicted in FIG. 5, a plurality of
optical sensors 112 is comprised, which, more preferably, are
stacked along the optical axis 200, in order to form a sensor stack
196. In the embodiment shown in FIG. 5, five optical sensors 112
are depicted. It shall be noted, however, that embodiments having a
different number of optical sensors 112 are feasible.
[0378] As outlined above, the detector 110 may further comprise one
or more time-of-flight detectors. This possibility is shown in FIG.
6. The detector 110, firstly, comprises at least one component
comprising the one or more pixelated optical sensors 112, such as a
sensor stack 196. In the embodiment shown in FIG. 6, the at least
one unit comprising the optical sensors 112 is denoted as a camera
214. It shall be noted, however, that other embodiments are
feasible. For details of potential setups of the camera 214,
reference may be made to the setups shown above, such as the
embodiment shown in FIG. 3 or 5, or other embodiments of the
detector 110. Basically any setup of the detector 110 as disclosed
above may also be used in the context of the embodiment shown in
FIG. 6.
[0379] Further, the detector 110 comprises at least one
time-of-flight (ToF) detector 244. As shown in FIG. 6, the ToF
detector 244 may be connected to the readout device 114 and/or the
evaluation device 216 of the detector 110 or may be provided with a
separate evaluation device. As outlined above, the ToF detector 244
may be adapted, by emitting and receiving pulses 246, as
symbolically depicted in FIG. 6, to determine a distance between
the detector 110 and the object 218 or, in other words, a
z-coordinate along the optical axis 200.
[0380] The at least one optional ToF detector 244 may be combined
with the at least one detector having the pixelated optical sensors
112 such as the camera 214 in various ways. Thus, as an example and
as shown in FIG. 6, the at least one camera 214 may be located in a
first partial beam path 248, and the ToF detector 244 may be
located in a second partial beam path 250. The partial beam paths
248, 250 may be separated and/or combined by at least one
beam-splitting element 252. As an example, the beam-splitting
element 252 may be a wavelength-indifferent beam-splitting element
252, such as a semi-transparent mirror. Additionally or
alternatively, a wavelength-dependency may be provided, thereby
allowing for separating different wavelengths. As an alternative,
or in addition to the setup shown in FIG. 6, other setups of the
ToF detector 244 may be used. Thus, the camera 214 and the ToF
detector 244 may be arranged in line, such as by arranging the ToF
detector 244 behind the camera 214. In this case, preferably, no
intransparent optical sensor is provided in the camera 214, and all
optical sensors 112 are at least partially transparent. Again, as
an alternative or in addition, the ToF detector 244 may also be
arranged independently from the camera 214, and different light
paths may be used, without combining the light paths. Various
setups are feasible.
[0381] As outlined above, the ToF detector 244 and the camera 214
may be combined in a beneficial way, for various purposes, such as
for resolving ambiguities, for increasing the range of weather
conditions in which the optical detector 110 may be used, or for
extending a distance range between the object 218 and the optical
detector 110. For further details, reference may be made to the
description above.
LIST OF REFERENCE NUMBERS
[0382] 110 optical detector [0383] 112 optical sensor [0384] 114
readout device [0385] 116 substrate [0386] 118 photosensitive layer
setup [0387] 120 first electrode [0388] 122 bottom electrode [0389]
124 first electrode stripes [0390] 126 bottom electrode stripes
[0391] 128 contact pad [0392] 130 second electrode [0393] 132 top
electrode [0394] 134 second electrode stripe [0395] 136 top
electrode stripe [0396] 138 contact pad [0397] 140 photovoltaic
material [0398] 142 matrix [0399] 144 pixel [0400] 146 row [0401]
148 column [0402] 150 first leads [0403] 152 second leads [0404]
154 electrical measurement devices [0405] 156 first port [0406] 158
second port [0407] 160 switching device [0408] 162 combined lead
[0409] 164 analogue-digital-converter [0410] 166 data memory [0411]
168 data fields [0412] 170 image [0413] 172 encapsulation [0414]
174 dense layer of n-semiconducting metal oxide [0415] 176 layer of
nano-porous n-semiconducting metal oxide [0416] 178 organic dye
[0417] 180 p-semiconducting organic material [0418] 182
illumination [0419] 184 metal layer [0420] 186 layer of
electrically conductive polymer [0421] 188 electrically conductive
polymer stripes [0422] 190 metal electrode stripes [0423] 192
separation element, separator [0424] 194 sharp edge [0425] 196
stack [0426] 198 imaging device [0427] 200 optical axis [0428] 202
additional imaging device [0429] 204 entry opening [0430] 206 light
beam [0431] 208 controller [0432] 210 optical element [0433] 212
housing [0434] 214 camera [0435] 216 evaluation device [0436] 218
object [0437] 220 beacon device [0438] 222 detector system [0439]
224 tracking system [0440] 226 human-machine interface [0441] 228
entertainment device [0442] 230 connector [0443] 232 housing [0444]
234 control element [0445] 236 user [0446] 238 opening [0447] 240
direction of view [0448] 242 coordinate system [0449] 244
time-of-flight detector [0450] 246 pulses [0451] 248 first partial
beam path [0452] 250 second partial beam path [0453] 252
beam-splitting element
* * * * *