U.S. patent application number 15/291745 was filed with the patent office on 2017-08-03 for chip electronic component and board having the same mounted thereon.
The applicant listed for this patent is SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Young Ghyu AHN, Jin KIM, Ho Jun LEE, Kyo Kwang LEE.
Application Number | 20170223833 15/291745 |
Document ID | / |
Family ID | 59387340 |
Filed Date | 2017-08-03 |
United States Patent
Application |
20170223833 |
Kind Code |
A1 |
LEE; Kyo Kwang ; et
al. |
August 3, 2017 |
CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED
THEREON
Abstract
A chip electronic component includes a body, in which a distance
from a first surface to a second surface opposing with respect to
the first surface is equal to or less than a distance from a third
surface to a fourth surface opposing with respect to the third
surface, a first internal electrode, and a second internal
electrode exposed to the second surface of the body, and spaced
apart from the third surface and the fourth surface of the body by
a predetermined distance. A first corner protection portion is
disposed on portions of surfaces adjacent to a first corner, where
the first corner is a corner formed by the first surface, the third
surface and the fifth surface of the body.
Inventors: |
LEE; Kyo Kwang; (Suwon-si,
KR) ; AHN; Young Ghyu; (Suwon-si, KR) ; KIM;
Jin; (Suwon-si, KR) ; LEE; Ho Jun; (Suwon-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
Suwon-si |
|
KR |
|
|
Family ID: |
59387340 |
Appl. No.: |
15/291745 |
Filed: |
October 12, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 1/181 20130101;
H05K 2201/10636 20130101; Y02P 70/50 20151101; Y02P 70/611
20151101; H01G 4/224 20130101; H01G 2/06 20130101; H01G 4/30
20130101; H05K 2201/10015 20130101; H01G 4/012 20130101; H01G 4/232
20130101 |
International
Class: |
H05K 1/18 20060101
H05K001/18; H01G 4/30 20060101 H01G004/30; H01G 4/224 20060101
H01G004/224; H05K 1/11 20060101 H05K001/11; H01G 4/005 20060101
H01G004/005; H01G 4/248 20060101 H01G004/248 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 3, 2016 |
KR |
10-2016-0013663 |
Claims
1. A chip electronic component comprising: a body having a first
surface and a second surface opposing each other, a third surface
and a fourth surface opposing each other, and a fifth surface and a
sixth surface opposing each other, and in which a distance from the
first surface to the second surface is equal to or less than a
distance from the third surface to the fourth surface; a first
internal electrode formed in an interior of the body, exposed to
the first surface of the body, and spaced apart from the third
surface and the fourth surface of the body, and a second internal
electrode formed in the interior of the body, exposed to the second
surface of the body, and spaced apart from the third surface and
the fourth surface of the body; and a first external electrode
formed on the first surface of the body and connected to the first
internal electrode, and a second external electrode formed on the
second surface of the body and connected to the second internal
electrode, wherein a first corner protection portion is disposed on
portions of surfaces adjacent to a first corner, where the first
corner is a corner formed by the first surface, the third surface
and the fifth surface of the body.
2. The chip electronic component of claim 1, wherein the first
internal electrode includes a first lead portion exposed to the
first surface of the body, and the second internal electrode
includes a second lead portion exposed to the second surface of the
body.
3. The chip electronic component of claim 1, further comprising a
second corner protection portion disposed on portions of surfaces
adjacent to a second corner opposing the first corner, where the
second corner is a corner formed by the first surface, the third
surface and the sixth surface of the body.
4. The chip electronic component of claim 3, further comprising a
first protection member extending from the first corner protection
portion formed on the portions of the surfaces adjacent to the
first corner to be integrally formed with the second corner
protection portion formed on the portions of the surfaces adjacent
to the second corner, and disposed on an edge formed by the first
surface and the third surface of the body.
5. The chip electronic component of claim 1, further comprising a
third corner protection portion disposed on portions of surfaces
adjacent to a third corner opposing the first corner, where the
third corner is a corner formed by the second surface, the third
surface and the fifth surface of the body.
6. The chip electronic component of claim 5, further comprising a
second protection member extending from the first corner protection
portion formed on the portions of the surfaces adjacent to the
first corner to be integrally formed with the third corner
protection portion formed on the portions of the surfaces adjacent
to the third corner, and disposed on an edge formed by the third
surface and the fifth surface of the body.
7. The chip electronic component of claim 4, further comprising: a
third protection member parallel to the first protection member,
and disposed on an edge formed by the second surface and the third
surface of the body, a fifth protection member parallel to the
first protection member, and disposed on an edge formed by the
first surface and the fourth surface of the body, and a seventh
protection member parallel to the first protection member, and
disposed on an edge formed by the second surface and the fourth
surface of the body.
8. The chip electronic component of claim 6, further comprising: a
fourth protection member parallel to the second protection member,
and disposed on an edge formed by the third surface and the sixth
surface of the body, a sixth protection member parallel to the
second protection member, and disposed on an edge formed by the
fourth surface and the fifth surface of the body, and an eighth
protection member parallel to the second protection member, and
disposed on an edge formed by the fourth surface and the sixth
surface of the body.
9. The chip electronic component of claim 7, wherein the first
protection member is extended onto the third surface of the body to
be connected to the third protection member, and the fifth
protection member is extended onto the fourth surface of the body
to be connected to the seventh protection member.
10. The chip electronic component of claim 7, wherein the first
protection member and the fifth protection member are extended to a
boundary area of a region of the first surface of the body, on
which the first external electrode is disposed, and the third
protection member and the seventh protection member are extended to
a boundary area of a region of the second surface of the body, on
which the second external electrode is disposed.
11. The chip electronic component of claim 1, wherein the first
corner protection portion is formed of an insulating material.
12. The chip electronic component of claim 1, wherein the first
corner protection portion is formed of a plating material including
copper (Cu).
13. The chip electronic component of claim 1, wherein the first
corner protection portion is formed of a heat curable resin.
14. The chip electronic component of claim 1, wherein the first
corner protection portion is formed of at least one selected from a
group consisting of an epoxy resin, a cyanateester resin, a
maleimide resin, a bismaleimide-triazine resin, a phenolic resin, a
resorcinol resin, a unsaturated polyester resin, a diallylphthalate
resin, a urea resin, melamine resin, a benzoxazine resin,
polyurethane, and a mixture thereof.
15. A board having a chip electronic component mounted thereon
comprising: a board including an electrode pad on an upper surface
thereof; a chip electronic component installed on the board; and a
solder connecting the electrode pad to the chip electronic
component, wherein the chip electronic component includes: a body
having a first surface and a second surface opposing each other, a
third surface and a fourth surface opposing each other, and a fifth
surface and a sixth surface opposing each other, and in which a
distance from the first surface to the second surface is equal to
or less than a distance from the third surface to the fourth
surface, a first internal electrode formed in an interior of the
body, exposed to the first surface of the body, and spaced apart
from the third surface and the fourth surface of the body, and a
second internal electrode formed in the interior of the body,
exposed to the second surface of the body, and spaced apart from
the third surface and the fourth surface of the body; and a first
external electrode formed on the first surface of the body and
connected to the first internal electrode, and a second external
electrode formed on the second surface of the body and connected to
the second internal electrode, and a first corner protection
portion is disposed on portions of surfaces adjacent to a first
corner, where the first corner is a corner formed by the first
surface, the third surface and the fifth surface of the body.
16. The board having a chip electronic component mounted thereon of
claim 15, wherein the chip electronic component includes a first
protection member extended from the first corner protection portion
formed on the portions of the surfaces adjacent to the first corner
to be integrally formed with a second corner protection portion
formed on portions of surfaces adjacent to a second corner opposing
the first corner, where the second corner is a corner formed by the
first surface, the third surface and the sixth surface of the body,
and further includes a third protection member parallel to the
first protection member and disposed on an edge formed by the
second surface and the third surface of the body, a fifth
protection member parallel to the first protection member and
disposed on an edge formed by the first surface and the fourth
surface of the body, and a seventh protection member parallel to
the first protection member and disposed on an edge formed by the
second surface and the fourth surface of the body.
17. The board having a chip electronic component mounted thereon of
claim 16, wherein the chip electronic component is provided with
the first protection member and the fifth protection member
extended to a boundary area of a region of the first surface of the
body, on which the first external electrode is disposed, and the
third protection member and the seventh protection member extended
to a boundary area of a region of the second surface of the body,
on which the second external electrode is disposed.
18. The board having a chip electronic component mounted thereon of
claim 16, wherein the first corner protection portion is formed of
an insulating material.
19. The board having a chip electronic component mounted thereon of
claim 16, wherein the first corner protection portion is formed of
a plating material including copper (Cu).
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of priority to Korean
Patent Application No. 10-2016-0013663, filed on Feb. 3, 2016 with
the Korean Intellectual Property Office, the entirety of which is
incorporated herein by reference.
TECHNICAL FIELD
[0002] The present disclosure relates to a chip electronic
component and a board having the chip electronic component mounted
thereon.
BACKGROUND
[0003] In line with the recent trend towards electronic products
being miniaturized and implemented with high capacitance,
electronic components used for such electronic products have also
been required to be miniaturized and to have high capacitance.
Thus, demand for chip type electronic components has increased.
[0004] Furthermore, in the case of a multilayer ceramic capacitor
as a chip type electronic component, performance of the electronic
product may be degraded when equivalent series inductance
(hereafter, ESL) is increased. As electronic components are
miniaturized and implemented with high capacitance, an effect in
which an increase in ESL causes functioning of the electronic
component to be degraded may be increased.
[0005] To reduce ESL in the chip type electronic component, a low
inductance chip capacitor (LICC) may be implemented. An LICC is an
electronic component in which a distance between external terminals
is reduced to reduce a path of current flow, thereby reducing the
inductance of the capacitor.
[0006] The multilayer ceramic capacitor of the chip type electronic
component may have a structure in which internal electrodes having
opposing polarities are alternately stacked with a plurality of
dielectric layers interposed therebetween. Since the dielectric
layer has piezoelectric properties and piezoresistive properties,
when a direct current (DC) or alternating current (AC) voltage is
applied to the multilayer ceramic capacitor, a piezoelectric
phenomenon may occur between the internal electrodes, whereby
vibrations may occur. As the vibrations are transferred to a
substrate on which the multilayer ceramic capacitor is mounted,
through solders of the multilayer ceramic capacitor, the entire
substrate may act as a sound radiating surface and may generate
acoustic noise, which is experienced by the user as noise.
[0007] In addition, chipping of the chip electronic component may
occur through movement between processes and impacts between chip
electronic components during a process, thereby significantly
degrading reliability of the chip electronic component. In detail,
such chipping, degrading reliability of chip type electronic
components, frequently occurs in corners and edges formed by
different surfaces of the chip type electronic component.
SUMMARY
[0008] An aspect of the present disclosure provides a chip
electronic component and a board having the same mounted thereon
and, particularly, a chip electronic component in which equivalent
series inductance and acoustic noise are reduced while reliability
is secured, and a board having the same mounted thereon.
[0009] According to an aspect of the present disclosure, a chip
electronic component includes a body including an internal
electrode in an interior thereof, and a first external electrode
and a second external electrode disposed on exteriors of the body,
and further includes a corner protection portion disposed on
portions of surfaces adjacent to at least one corner of the
body.
[0010] The body may have a first surface and a second surface
opposing each other, a third surface and a fourth surface opposing
each other, and a fifth surface and a sixth surface opposing each
other. In addition, a distance from the first surface to the second
surface of the body may be equal to or less than a distance from
the third surface to the fourth surface of the body.
[0011] The first internal electrode and the second internal
electrode formed in the interior of the body may be drawn out to
the first surface and the second surface of the body, and may
include lead portions drawn out to the first surface and the second
surface as a portion of a main portion, which is overlapped with an
adjacent internal electrode to allow capacitance to be formed, is
led out.
[0012] The first external electrode and the second external
electrode may be disposed on regions of the first surface and the
second surface of the body while being connected to the first
internal electrode and the second internal electrode drawn out to
the first surface and the second surface of the body,
respectively.
[0013] The chip electronic component may include a corner
protection portion on portions of surfaces adjacent to at least one
corner of the body. Here, the corner may be a connection portion
formed by three adjacent surfaces of first to sixth surfaces of the
body.
[0014] In the chip electronic component according to an exemplary
embodiment in the present disclosure, a corner formed by the fifth
surface of the body, and the first surface and the third surface,
adjacent to the fifth surface, is a first corner, and a protection
portion included on the surfaces adjacent to the first corner may
be a first corner protection portion.
[0015] A board having a chip electronic component mounted thereon
according to another exemplary embodiment in the present disclosure
includes a board having an electrode pad on an upper surface
thereof, a chip electronic component installed on the board, and a
solder connecting the electrode pad to the chip electronic
component.
[0016] In the board having the chip electronic component mounted
thereon, the chip electronic component mounted on the board may
include a body having a first surface and a second surface opposing
each other, a third surface and a fourth surface opposing each
other, and a fifth surface and a sixth surface opposing each other,
and in which a distance from the first surface to the second
surface is equal to or less than a distance from the third surface
to the fourth surface, a first internal electrode formed in an
interior of the body, exposed to the first surface of the body, and
spaced apart from the third surface and the fourth surface of the
body, and a second internal electrode formed in the interior of the
body, exposed to the second surface of the body, and spaced apart
from the third surface and the fourth surface of the body. In
addition, the chip electronic component may further include a first
external electrode formed on the first surface of the body and
connected to the first internal electrode, and a second external
electrode formed on the second surface of the body and connected to
the second internal electrode. In addition, the chip electronic
component may further include a first corner protection portion on
portions of surfaces adjacent to a first corner, which is a corner
formed by the fifth surface of the body, and the first surface and
the third surface, adjacent to the fifth surface.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The above and other aspects, features and advantages of the
present disclosure will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings, in which:
[0018] FIG. 1 is a schematic perspective view of a body and
external electrodes formed on exteriors of the body according to an
exemplary embodiment in the present disclosure;
[0019] FIGS. 2A and 2B are exploded perspective views of the body
in FIG. 1;
[0020] FIG. 3 is a schematic perspective view of a chip electronic
component according to an exemplary embodiment in the present
disclosure;
[0021] FIG. 4 is a schematic perspective view of a chip electronic
component according to another exemplary embodiment in the present
disclosure;
[0022] FIG. 5 is a schematic perspective view of a chip electronic
component according to a modified example of an exemplary
embodiment in FIG. 4;
[0023] FIG. 6 is a schematic perspective view of a chip electronic
component according to another exemplary embodiment in the present
disclosure;
[0024] FIG. 7 is a schematic perspective view of a chip electronic
component according to another exemplary embodiment in the present
disclosure;
[0025] FIG. 8 is a schematic perspective view of a chip electronic
component according to a modified example of an exemplary
embodiment in FIG. 5;
[0026] FIG. 9 is a schematic perspective view of a chip electronic
component according to a modified example of an exemplary
embodiment in FIG. 7; and
[0027] FIG. 10 is a schematic perspective view illustrating a board
on which the chip electronic component in FIG. 5 is mounted.
DETAILED DESCRIPTION
[0028] Hereinafter, exemplary embodiments in the present disclosure
will be described as follows with reference to the attached
drawings.
[0029] The present disclosure may, however, be exemplified in many
different forms and should not be construed as being limited to the
specific embodiments set forth herein. Rather, these embodiments
are provided so that this disclosure will be thorough and complete,
and will fully convey the scope of the disclosure to those skilled
in the art.
[0030] Throughout the specification, it will be understood that
when an element, such as a layer, region or wafer (substrate), is
referred to as being "on," "connected to," or "coupled to" another
element, it can be directly "on," "connected to," or "coupled to"
the other element or other elements intervening therebetween may be
present. In contrast, when an element is referred to as being
"directly on," "directly connected to," or "directly coupled to"
another element, there may be no other elements or layers
intervening therebetween. Like numerals refer to like elements
throughout. As used herein, the term "and/or" includes any and all
combinations of one or more of the associated listed items.
[0031] It will be apparent that though the terms first, second,
third, etc. may be used herein to describe various members,
components, regions, layers and/or sections, these members,
components, regions, layers and/or sections should not be limited
by these terms. These terms are only used to distinguish one
member, component, region, layer or section from another region,
layer or section. Thus, a first member, component, region, layer or
section discussed below could be termed a second member, component,
region, layer or section without departing from the teachings of
the exemplary embodiments.
[0032] Spatially relative terms, such as "above," "upper," "below,"
and "lower" and the like, may be used herein for ease of
description to describe one element's relationship relative to
another element(s) as shown in the figures. It will be understood
that the spatially relative terms are intended to encompass
different orientations of the device in use or operation in
addition to the orientation depicted in the figures. For example,
if the device in the figures is turned over, elements described as
"above," or "upper" relative to other elements would then be
oriented "below," or "lower" relative to the other elements or
features. Thus, the term "above" can encompass both the above and
below orientations depending on a particular direction of the
figures. The device may be otherwise oriented (rotated 90 degrees
or at other orientations) and the spatially relative descriptors
used herein may be interpreted accordingly.
[0033] The terminology used herein describes particular embodiments
only, and the present disclosure is not limited thereby. As used
herein, the singular forms "a," "an," and "the" are intended to
include the plural forms as well, unless the context clearly
indicates otherwise. It will be further understood that the terms
"comprises," and/or "comprising" when used in this specification,
specify the presence of stated features, integers, steps,
operations, members, elements, and/or groups thereof, but do not
preclude the presence or addition of one or more other features,
integers, steps, operations, members, elements, and/or groups
thereof.
[0034] Hereinafter, embodiments of the present disclosure will be
described with reference to schematic views illustrating
embodiments of the present disclosure. In the drawings, for
example, due to manufacturing techniques and/or tolerances,
modifications of the shape shown may be estimated. Thus,
embodiments of the present disclosure should not be construed as
being limited to the particular shapes of regions shown herein, for
example, to include a change in shape results in manufacturing. The
following embodiments may also be constituted by one or a
combination thereof.
[0035] The contents of the present disclosure described below may
have a variety of configurations and propose only a required
configuration herein, but are not limited thereto.
Chip Electronic Component
[0036] Hereinafter, a chip electronic component according to an
exemplary embodiment is described and, in detail, a multilayer
capacitor is described as an example without limitation.
[0037] According to an exemplary embodiment in the present
disclosure, a T-direction is a thickness direction of a body of a
chip electronic component, an L-direction is a length direction of
the body, and a W-direction is a width direction of the body. When
the chip electronic component is a multilayer capacitor, the
T-direction may be a dielectric layer stacking direction.
[0038] According to an exemplary embodiment in the present
disclosure, a first surface S1 and a second surface S2 opposing
each other may be two surfaces opposing each other in the width
direction of the body, a third surface S3 and a fourth surface S4
opposing each other may be two surfaces opposing each other in the
length direction of the body, and a fifth surface S5 and a sixth
surface S6 opposing each other may be two surfaces opposing each
other in the thickness direction of the body.
[0039] Here, a distance between the first surface S1 and the second
surface S2 spaced apart from each other in a width direction of the
body and disposed to oppose each other, is equal to or less than a
distance between the third surface S3 and the fourth surface S4
spaced apart from each other in a length direction of the body and
disposed to oppose each other.
[0040] FIG. 1 is a schematic perspective view of a body and an
external electrode formed on an exterior of the body according to
an exemplary embodiment, and FIGS. 2A and 2B are exploded
perspective views of the body in FIG. 1.
[0041] With reference to FIG. 1, a chip electronic component 1
according to an exemplary embodiment includes a body 10 and
external electrodes 31 and 32 disposed on exteriors of the
body.
[0042] The body 10 may have a first surface S1 and a second surface
S2 opposing each other, a third surface S3 and a fourth surface S4
opposing each other, and a fifth surface S5 and a sixth surface S6
opposing each other. A form of the body 10 may be hexahedral, as
illustrated in FIG. 1, but is not limited thereto.
[0043] A first external electrode 31 and a second external
electrode 32 are disposed on the body 10. The first external
electrode 31 and the second external electrode 32 may be at a
spaced apart from each other by a predetermined distance in a width
direction of the body to be disposed on the first surface S1 and
the second surface S2 opposing each other, respectively.
[0044] With regard to arrangement of the first external electrode
and the second external electrode of the chip electronic component
according to an exemplary embodiment, for example, in a multilayer
capacitor according to the related art, external electrodes are
disposed on exteriors of two surfaces opposing each other in a
length direction of a capacitor body. A distance of the capacitor
body in a length direction thereof is taken as being longer than a
distance of the capacitor body in a width direction thereof. In
this case, when an alternating current (AC) voltage is applied to
the external electrodes, a current path is longer, and thus, a
current loop may be formed to be larger. Thus, as a size of an
induced magnetic field is increased, inductance may be
increased.
[0045] However, in a chip electronic component according to the
present exemplary embodiment, as a first external electrode and a
second external electrode are disposed on a first surface S1 and a
second surface S2 opposing each other in the width direction of the
body, which is a small displacement direction, a distance between
the first external electrode 31 and the second external electrode
32 is reduced. In this case, as a current path is shorter, a
current loop is reduced, and thus, inductance may be reduced.
[0046] The first external electrode 31 and the second external
electrode 32 may be respectively electrically connected to a first
internal electrode 21 and a second internal electrode 22 disposed
in an interior of the body, to be described later, for the
formation of electrostatic capacitance.
[0047] The first external electrode 31 and the second external
electrode may be formed of a conductive material, which is the same
material as the first internal electrode and the second internal
electrode, but are not limited thereto. For example, the first
external electrode and the second external electrode may be formed
of copper (Cu), silver (Ag), nickel (Ni), or the like.
[0048] The first external electrode and the second external
electrode 32 may be formed as conductive paste prepared by adding
glass frit to metal powder which is then applied to the first
surface S1 and the second surface S2 and sintered.
[0049] With reference to FIG. 2A, the body 10 includes dielectric
layers 11, and first internal electrodes 21 and second internal
electrodes 22 formed on the dielectric layers.
[0050] With reference to FIG. 2B, the first internal electrode 21
may include a first lead portion 211 spaced apart from the third
surface S3 and the fourth surface S4, opposing each other in the
length direction of the body by a predetermined distance, and drawn
out to the first surface S1 of the body. In addition, the second
internal electrode 22 may include a second lead portion 221 spaced
apart from the third surface S3 and the fourth surface S4, opposing
each other in the length direction of the body by a predetermined
distance, and drawn out to the second surface S2 of the body.
[0051] The dielectric layer 11 may be formed by adding various
materials, such as a ceramic additive, an organic solvent, a
plasticizer, a binder, a dispersant, and the like to a powder
formed of a material such as barium titanate (BaTiO.sub.3), or the
like, according to an objective of the present disclosure.
[0052] An average particle size of ceramic powder used for the
formation of the dielectric layer 11 is not particularly limited,
and may be adjusted to achieve an objective of the present
disclosure. For example, the average particle size thereof may be
adjusted to be 400 nm or less.
[0053] A thickness of the dielectric layer 11 may be, for example,
3 .mu.m or less, but is not limited thereto.
[0054] A material included in the first internal electrode 21 and
the second internal electrode 22 may include, for example, a noble
material such as palladium (Pd), a palladium-silver (Pd--Ag) alloy,
or the like, or a conductive paste formed of one or more
transitional metals such as nickel (Ni) and copper (Cu), but is not
limited thereto.
[0055] The first internal electrode 21 and the second internal
electrode 22 may be disposed to face each other with respective
dielectric layers 11 interposed therebetween, and may be
alternately exposed to the first surface S1 and the second surface
S2 of the body 10.
[0056] The first internal electrode 21 and the second internal
electrode 22 include a main portion overlapped with adjacent
internal electrodes to allow capacitance to be formed. In addition,
the first internal electrode 21 and the second internal electrode
22 may respectively include lead portions 211 and 221 drawn out to
exterior surfaces of the body as a portion of the main portion is
led out.
[0057] The lead portion, for example, may have a shorter length
than the main portion of the internal electrode in the body 10 in a
length direction, but is not limited thereto.
[0058] The chip electronic component according to an exemplary
embodiment may include a corner protection portion on portions of
surfaces adjacent to at least one corner of the body. As one
example of a chip electronic component shown in FIG. 3, a first
corner is disposed as a corner formed by three surfaces, the fifth
surface S5 of the body, and the first surface S1 and the third
surface S3 adjacent thereto, and a first corner protection portion
41a is disposed on portions of surfaces adjacent to the first
corner.
[0059] In the chip electronic component according to an exemplary
embodiment, external electrodes are disposed on both surfaces
opposing each other in a width direction of the body rather than on
both surfaces opposing each other in a length direction of the
body, in a manner different from a multilayer capacitor according
to the related art.
[0060] As a result, a corner formed by three adjacent surfaces of
the body is exposed outwardly as it is as external electrodes are
not coated. When a chip electronic component is manufactured,
physical impacts between chip electronic components may be
generated by movement between a plurality of processes and
treatment during a plurality of processes, whereby unexpected
chipping may occur. Chipping may reduce the reliability of the chip
electronic component and the production yield of the chip
electronic component.
[0061] However, in a case of a chip electronic component according
to an exemplary embodiment, the first corner protection portion 41a
is disposed on portions of surfaces adjacent to the first corner,
and thus, chipping caused by physical impacts between chip
electronic components may be effectively prevented. As a result,
reliability and production yield of the chip electronic component
may be improved at the same time.
[0062] The first corner protection portion 41a may be formed of a
material attached to a surface adjacent to the first corner of the
body to prevent chipping, for example, an insulating material, but
is not limited thereto.
[0063] In addition, the insulating material may be a heat curable
resin, for example, one selected from a group consisting of an
epoxy resin, a cyanateester resin, a maleimide resin, a
bismaleimide-triazine resin, a phenolic resin, a resorcinol resin,
a unsaturated polyester resin, a diallylphthalate resin, a urea
resin, melamine resin, a benzoxazine resin, polyurethane, and a
mixture thereof, but is not limited thereto.
[0064] The first corner protection portion 41a may be formed of a
plating material containing Cu (copper). When the first corner
protection portion 41a is formed of an insulating material, a heat
curable resin, the first corner protection portion may be formed
through a sintering process separate from a curing process of a
chip electronic component. In a manner different therefrom, when
the first corner protection portion 41a of the chip electronic
component is formed of a plating material containing Cu, the first
corner protection portion 41a may be formed on portions of surfaces
adjacent to the first corner of the body while an external
electrode and the like are sintered.
[0065] Next, FIG. 4 illustrates an example of a chip electronic
component according to another exemplary embodiment. The chip
electronic component shown in FIG. 4 includes a first corner
protection portion 41a disposed on portions of surfaces adjacent to
a first corner. In addition, the chip electronic component may
further include second to eighth corner protection portions 41b,
43a, 43b, 45a, 45b, 47a, and 47b. An example of the chip electronic
component according to the present exemplary embodiment is not
limited thereto.
[0066] In other words, the chip electronic component according to
an exemplary embodiment may be manufactured to allow the first
corner protection portion 41a formed on portions of surfaces
adjacent to the first corner to be disposed on a corner of a body
region of the chip electronic component, and to further include one
or more of the second to eighth corner protection portions, in
consideration of expected impact strength during a process, an
expected movement path between processes, and the like.
[0067] The second corner protection portion 41b may oppose a first
corner in a thickness direction of the body, and may be disposed on
portions of surfaces adjacent to a second corner formed by a sixth
surface S6 of the body, and a first surface S1 and a third surface
S3 adjacent thereto.
[0068] In a manner similar thereto, a third corner protection
portion 43a may oppose the first corner in a width direction of the
body, and may be disposed on portions of surfaces adjacent to a
third corner formed by a fifth surface S5 of the body, and a second
surface S2 and a third surface S3 adjacent thereto.
[0069] As an arrangement of the fourth to eighth corner protection
portions 43b, 45a, 45b, 47a, and 47b may be more clearly identified
through FIG. 4, a description related to the arrangement of the
fourth to eighth corner protection portions is not described
here.
[0070] Meanwhile, FIG. 5 illustrates a modified example of the chip
electronic component according to an exemplary embodiment
illustrated in FIG. 4.
[0071] The chip electronic component according to an exemplary
embodiment may include a first protection member 41 extended from a
first corner protection portion 41a formed on portions of surfaces
adjacent to a first corner to be integrally formed with a second
corner protection portion 41b formed on portions of surfaces
adjacent to a second corner, and disposed on an edge formed by a
first surface S1 and a third surface S3 of the body.
[0072] In other words, the first protection member 41 may
substantially include the first corner protection portion 41a and
the second corner protection portion 41b.
[0073] In addition, the chip electronic component includes the
first protection member 41, and further includes a third protection
member 43 parallel to the first protection member, and disposed on
an edge formed by the second surface S2 and the third surface S3 of
the body, a fifth protection member 45 parallel to the first
protection member, and disposed on an edge formed by the first
surface S1 and the fourth surface S4 of the body, and a seventh
protection member 47 parallel to the first protection member, and
disposed on an edge formed by the second surface S2 and the fourth
surface S4 of the body.
[0074] FIG. 6 illustrates an example of a chip electronic component
according to another exemplary embodiment. A chip electronic
component according to FIG. 6 may include a second protection
member 42 extended from the first corner protection portion 41a
formed on portions of surfaces adjacent to the first corner,
integrally formed with a third corner protection portion formed on
portions of surfaces adjacent to the third corner, and disposed on
an edge formed by the third surface S3 and the fifth surface S5 of
the body.
[0075] In other words, the second protection member 42 may
substantially include the first corner protection portion 41a and
the third corner protection portion 43a.
[0076] In addition, the chip electronic component includes the
second protection member 42, and may further include a fourth
protection member 44 parallel to the second protection member, and
disposed on an edge formed by the third surface S3 and the sixth
surface S6 of the body, a sixth protection member 46 parallel to
the second protection member, and disposed on an edge formed by the
fourth surface S4 and the fifth surface S5 of the body, and an
eighth protection member 48 parallel to the second protection
member, and disposed on an edge formed by the fourth surface S4 and
the sixth surface S6 of the body.
[0077] Next, FIG. 7 illustrates a chip electronic component as
another example according to an exemplary embodiment, including
protection members connecting first to fourth protection members 41
to 44 and fifth to eighth protection members 45 to 48 disposed on a
body 10.
[0078] Here, a method of forming first to eighth protection members
may vary. For example, a method in which an insulating resin is
cured after a proper amount of the insulating resin is pasted on
the body, may be used.
[0079] In addition, the chip electronic component may include
protection members connecting the first to fourth protection
members 41 to 44 and the fifth to eighth protection members 45 to
48, and may include protection members integrally formed with the
protection member connecting the first to fourth protection members
and the fifth to eighth protection members on surfaces of a third
surface and a fourth surface opposing each other in a length
direction of the body, respectively.
[0080] In this case, in a manner similar to the method of forming
the first to eighth protection members, a method of forming the
protection member may be a method in which an insulating resin is
cured after a proper amount of the insulating resin is pasted on
the body. In this case, the first to fourth protection members and
the fifth to eighth protection members, and the protection members
disposed on the third surface and the fourth surface of the body
may be integrally formed, respectively.
[0081] As another method, for example, for a method of forming a Cu
plating layer, during a process in which an external electrode
disposed on a body is sintered, a plating material including Cu is
sintered to form the protection member.
[0082] FIG. 8 is one example of a chip electronic component
according to an exemplary embodiment, as a modified example of a
chip electronic component shown in FIG. 5.
[0083] In FIG. 8, among a first protection member 41, a third
protection member 43, a fifth protection member 45, and a seventh
protection member 47, disposed on a body, the first protection
member 41 and the fifth protection member 45 may be extended to a
boundary area of a region of a first surface S1 of the body, on
which a first external electrode 31 is disposed, and the third
protection member 43 and the seventh protection member 47 may be
extended to a boundary area of a region of a second surface S2 of
the body, on which a second external electrode 32 is disposed.
[0084] In this case, in the chip electronic component, eight
corners of the body are applied with protection portions,
respectively, and thus, occurrence of chipping generated from
external impacts between chip electronic components may be
prevented. Furthermore, the first, third, fifth, and seventh
protection members 41, 43, 45, and 47 are extended to surface
regions of the body on which the first external electrode 31 and
the second external electrode 32 are formed. In detail, water
resistance properties in edges of the external electrodes, which
are vulnerable to water resistance load, may be improved.
[0085] The first, third, fifth, and seventh protective members 41,
43, 45, and 47 of the chip electronic component may be formed by
applying an insulating material, for example, insulating epoxy
before a plating process for formation of the first external
electrode 31 and the second external electrode 32, but a forming
method is not limited thereto.
[0086] FIG. 9 is an example of a chip electronic component
according to another exemplary embodiment, as a modified example of
the chip electronic component in FIG. 7.
[0087] The chip electronic component in FIG. 9 includes first to
eighth protection members 41 to 48 disposed on eight edges of a
body. The first protection member 41 and the fifth protection
member 45 are extended to a boundary area of a region of a first
surface S1 of the body, on which a first external electrode 31 is
disposed, and the third protection member 43 and the seventh
protection member 47 are extended to a boundary area of a region of
a second surface S2 of the body, on which a second external
electrode 32 is disposed. In addition, the second, fourth, sixth,
and eighth protection members 42, 44, 46, and 48 may be extended
onto a third surface S3 or a fourth surface S4 of the body, and may
be extended to boundary areas of regions on which the first
external electrode 31 and the second external electrode 32 are
disposed.
[0088] In this case, in the chip electronic component, eight
corners of the body are applied with protection portions,
respectively, and thus, chipping generated between chip electronic
components may be prevented. In detail, the first to eighth
protection members are extended to surface regions of the body, on
which a first external electrode 31 and a second external electrode
32 are formed, and thus water resistance properties in edges of the
external electrodes vulnerable to water resistance load, may be
improved.
[0089] In the chip electronic component according to an exemplary
embodiment, as a distance between a first surface S1 and a second
surface S2 of the body on which a first external electrode 31 and a
second external electrode 32 are disposed, is equal to or less than
a distance between a third surface S3 and a fourth surface S4 of
the body, a distance between the first external electrode 31 and
the second external electrode 32 is reduced. As a result, as a
current path is shorter, a current loop is reduced, and thus,
inductance may be reduced.
[0090] In addition, in the chip electronic component according to
an exemplary embodiment, as the first external electrode 31 and the
second external electrode 32 are formed on the first surface S1 and
the second surface S2 opposing each other in a width direction of
the body, variations in contraction and expansion are minimized,
thereby reducing acoustic noise which may be generated after the
chip electronic component is mounted on a board.
[0091] However, in the case of the chip electronic component
described above, as the first external electrode 31 and the second
external electrode 32 are disposed on the first surface S1 and the
second surface S2 of the body, eight corners formed by three
adjacent surfaces of the first to sixth surfaces of the body, are
exposed as it is without protection of an external electrode,
whereby chipping caused by movement between processes and physical
impacts between chip electronic components during a process may
occur. Thus, a protection portion is disposed on at least one
corner of the eight corners, thereby effectively preventing
undesired chipping.
[0092] In addition, the chip electronic component according to an
exemplary embodiment may prevent chipping, and may improve water
resistance properties in edges of an external electrode as a
protection portion may be extended to boundary areas of regions of
surfaces of a body, on which the external electrode is formed.
Board Having Chip Electronic Component Mounted Thereon
[0093] FIG. 10 is a perspective view illustrating a structure in
which a chip electronic component in FIG. 5 is mounted on a
board.
[0094] With reference to FIG. 10, a mounting board 200 having a
chip electronic component thereon according to an exemplary
embodiment includes a board 210 on which the chip electronic
component is mounted, and a first electrode pad 221 and a second
electrode pad 222 formed to be spaced apart from each other on an
upper surface of the board 210.
[0095] In this case, the chip electronic component may be
electrically connected to the board 210 by a solder 230 while a
first external electrode and a second external electrode are
located to be in contact with a first electrode pad 221 and a
second electrode pad 222, respectively.
[0096] As described above, while the chip electronic component 1 is
mounted on the board 210, when a voltage is applied thereto,
acoustic noise may be generated.
[0097] In this case, sizes of the first electrode pad 221 and the
second electrode pad 222 may allow an amount of a solder for
connection of the external electrode of the chip electronic
component 1 with the first electrode pad 221 and the second
electrode pad 222 to be determined. According to the amount of the
solder 230, a level of acoustic noise may be controlled.
[0098] Here, in the chip electronic component according to an
exemplary embodiment, the first external electrode and the second
external electrode are disposed on the first surface and the second
surface of the body, in which a distance therebetween is equal to
or less than a distance between the third surface and the fourth
surface opposing each other of the body of the chip electronic
component, respectively. Thus, variations in contraction and
expansion are minimized, thereby reducing acoustic noise.
[0099] In addition, in the chip electronic component according to
an exemplary embodiment, a distance between the first external
electrode and the second external electrode may be reduced, thereby
minimizing equivalent series resistance.
[0100] In addition, in the chip electronic component according to
an exemplary embodiment, a protection portion is disposed on a
corner and an edge between different surfaces of the body, thereby
improving reliability and a production yield through chipping
prevention and improving water resistance properties.
[0101] As set forth above, according to an exemplary embodiment in
the present disclosure, a chip electronic component having improved
equivalent series resistance (ESR) properties, and a board having
the same mounted thereon, may be provided.
[0102] When the chip electronic component is mounted on the board,
the chip electronic component in which a solder crack and acoustic
noise generated in the chip electronic component are reduced, and a
board having the same mounted thereon, may be provided.
[0103] The chip electronic component having improved reliability
and an improved production yield as chipping, due to movement
between processes of manufacturing the chip electronic component
and physical collisions between the chip electronic components
during a process thereof, may be prevented and water resistance
properties on edges of an external electrode may be improved, and a
board having the same mounted thereon, may be provided.
[0104] While exemplary embodiments have been shown and described
above, it will be apparent to those skilled in the art that
modifications and variations could be made without departing from
the scope of the present invention as defined by the appended
claims.
* * * * *