U.S. patent application number 15/485063 was filed with the patent office on 2017-08-03 for cosmetically self-centering removable module tray.
The applicant listed for this patent is Apple Inc.. Invention is credited to James B. SMITH, Gregory N. STEPHENS.
Application Number | 20170223156 15/485063 |
Document ID | / |
Family ID | 55585451 |
Filed Date | 2017-08-03 |
United States Patent
Application |
20170223156 |
Kind Code |
A1 |
STEPHENS; Gregory N. ; et
al. |
August 3, 2017 |
COSMETICALLY SELF-CENTERING REMOVABLE MODULE TRAY
Abstract
This application relates to methods and apparatus pertaining to
a SIM tray that includes a deformable portion. When the SIM tray is
subjected to stresses that result from tolerance stacking, the
deformable portion accommodates the differences tolerance errors by
allowing the non-deformable portion of the SIM tray to move
substantially independently from one another. Creating the
deformable portion can be accomplished by utilizing materials with
lower relative moduli of elasticity, dovetails, magnets, or other
means.
Inventors: |
STEPHENS; Gregory N.;
(Sunnyvale, CA) ; SMITH; James B.; (San Francisco,
CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Apple Inc. |
Cupertino |
CA |
US |
|
|
Family ID: |
55585451 |
Appl. No.: |
15/485063 |
Filed: |
April 11, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14500966 |
Sep 29, 2014 |
9658641 |
|
|
15485063 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R 12/714 20130101;
H04B 1/38 20130101; G06F 1/1656 20130101; H01R 13/5202 20130101;
H04B 1/3816 20130101; G06F 1/00 20130101; H01R 12/7005 20130101;
G06F 1/1626 20130101; H04M 1/026 20130101 |
International
Class: |
H04M 1/02 20060101
H04M001/02; H04B 1/3816 20060101 H04B001/3816; H01R 12/71 20060101
H01R012/71; H01R 13/52 20060101 H01R013/52; H01R 12/70 20060101
H01R012/70 |
Claims
1. An electronic device, comprising: a housing that includes an
internal volume, the housing having a through hole that opens to
the internal volume; a subscriber identification module (SIM) tray
capable of carrying a SIM card, wherein the through hole includes a
size and shape to receive the SIM tray; and a gasket formed from a
compliant material, the gasket located at an interface between the
SIM tray and the through hole, wherein when the SIM tray is
positioned in the through hole, the gasket forms a seal that
prevents a contaminant from entering the internal volume via the
through hole.
2. The electronic device of claim 1, wherein the SIM tray comprises
an external portion that is co-planar with respect to the housing
when the SIM tray is inserted into the through hole.
3. The electronic device of claim 2, wherein the gasket located
between the external portion and the through hole.
4. The electronic device of claim 2, wherein the SIM tray further
comprises an internal portion secured with the external portion,
the internal portion capable of carrying the SIM tray, wherein the
internal portion comprises an opening.
5. The electronic device of claim 4, further comprising electrical
contacts positioned in the internal volume, wherein when 1) the SIM
card is carried by the internal portion and 2) the SIM tray is
inserted into the opening, the SIM card electrically couples to the
electrical contacts.
6. The electronic device of claim 1, wherein the through hole
defines an internal surface, and wherein the gasket engages the
internal surface when the SIM tray is positioned in the through
hole.
7. The electronic device of claim 1, wherein the compliant material
comprises a rubber gasket.
8. An electronic device, comprising: an enclosure that defines an
internal volume, the enclosure further comprising a sidewall; a
slot formed in the sidewall and in communication with the internal
volume; a subscriber identification module (SIM) tray that is
movable with respect to the enclosure, the SIM tray comprising an
internal portion capable of carrying a SIM card, the SIM tray
further comprising external portion extending from the internal
portion, wherein the external portion is flush with respect to the
sidewall in an inserted configuration defined by the SIM tray being
positioned in the slot; and a sealing element positioned within the
slot when the SIM tray is in the inserted configuration, wherein
the sealing element inhibits a contaminant from entering the
slot.
9. The electronic device of claim 8, wherein the external portion
carries the sealing element.
10. The electronic device of claim 8, wherein the sealing element
comprises a compliant material.
11. The electronic device of claim 10, wherein the compliant
material comprises a rubber gasket.
12. The electronic device of claim 8, wherein the sealing element
is carried by the external portion.
13. The electronic device of claim 8, wherein the sealing element
comprises a rubber gasket.
14. The electronic device of claim 8, wherein the slot defines an
internal surface, and wherein the sealing element engages the
internal surface in the inserted configuration.
15. A method for assembling an electronic device having an
enclosure that defines an internal volume, the enclosure further
comprising a sidewall having a slot that opens to the internal
volume, the method comprising: providing a subscriber
identification module (SIM) tray that is movable with respect to
the enclosure, the SIM tray comprising an internal portion capable
of carrying a SIM card, the SIM tray further comprising external
portion extending from the internal portion, wherein the external
portion is flush with respect to the sidewall in an inserted
configuration of the SIM tray defined by the SIM tray being
positioned in the slot; and receiving a sealing element at the SIM
tray, wherein the sealing element is positioned within the slot
when the SIM tray is in the inserted configuration such that the
sealing element inhibits a contaminant from entering the slot.
16. The method of claim 15, wherein receiving the sealing element
comprises receiving a compliant material.
17. The method of claim 16, wherein receiving the compliant
material comprises receiving a rubber gasket.
18. The method of claim 15, wherein the internal portion includes
an opening.
19. The method of claim 18, further comprising electrical contacts,
wherein when 1) the SIM card is carried by the internal portion and
2) the SIM tray is inserted into the opening, the SIM card
electrically couples to the electrical contacts.
20. The method of claim 15, wherein the sealing element engages an
internal surface of the slot in the inserted configuration.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application is a continuation of U.S.
application Ser. No. 14/500,966, filed Sep. 29, 2014, of the same
title, the contents of which are incorporated herein by reference
in their entirety for all purposes.
FIELD
[0002] This paper describes various embodiments that relate to
mobile telephony devices such as a mobile telephone. More
specifically, a user accessible tray that allows users to swap out
components such as a subscriber identification module (SIM) card is
described.
BACKGROUND
[0003] Subscriber identification module (SIM) cards are generally
removable cards for mobile devices that include integrated circuits
that store subscriber information for the mobile devices. SIM cards
are typically supported within a mobile device by a user accessible
tray, which typically slides in and out of the mobile device. The
user accessible tray should perform two essential functions: (1)
facilitate easy access and removal of the SIM card, and (2) when
inserted into a mobile device, maintain a seamless external
cosmetic appearance in relation to a housing of the mobile device.
However, SIM trays can be prone to deformation once inserted into a
mobile device as a result of a phenomenon known in the art as
tolerance stacking. When tolerance stacking causes a substantial
misalignment between an external opening in the mobile device and
internal connectors configured to mate with the SIM card, the user
accessible tray can be subjected to substantial stresses. As a
result, the user accessible tray can deform, which can make it more
difficult for the user to remove the tray. In some cases,
misalignment of internal and external features can cause an
external portion of the SIM tray to deform in a way that prevents
the external portion from matching a surrounding exterior surface
of the housing of the mobile device, thereby marring an external
cosmetic appearance of the mobile device.
SUMMARY
[0004] This paper describes various embodiments that relate to
methods and apparatus for cosmetically aligning a subscriber
identification module (SIM) tray with a SIM tray opening of a
portable electronic device.
[0005] A subscriber information module (SIM) tray assembly is
disclosed that is utilized with a portable electronic device. The
SIM tray assembly can include an external portion designed to cover
an opening in a housing of the portable electronic device. The
opening can take the form of a slot for the SIM tray. The SIM tray
assembly can also include a tray portion designed to hold a SIM
card with an opening disposed on the SIM tray assembly. The SIM
tray assembly also includes a compliant part forming a joint
between the tray portion and the external portion. The compliant
part can adjust for tolerances between internal and external
features of the portable electronic device.
[0006] A subscriber information module (SIM) tray is disclosed that
can include an external portion and a tray portion. The external
portion can cover a SIM slot of a mobile device. The tray portion
can include an opening configured to hold a SIM card. The SIM tray
can also include an interface located between the tray portion and
the external portion. The interface can constrain relative movement
between the external portion and the tray portion in a first
direction parallel to a surface of the tray portion that is
configured to hold the SIM card while also facilitating movement
between the external portion and the tray portion in a second
direction perpendicular to the first direction.
[0007] A mobile device is disclosed that includes a housing forming
an interior volume, a slot defined by the housing that allows
access to the interior volume from outside the housing and an
electrical components positioned within the interior volume that
includes a number of electrical components. A subscriber
identification module (SIM) tray assembly is inserted into the slot
so that a SIM card supported by the SIM tray assembly contacts the
of electrical contacts. The SIM tray assembly includes at least the
following: an external portion that covers the slot of the mobile
device and sits flush with an exterior surface the housing; a tray
portion that supports the SIM card; and a flexible region
connecting the external portion to the tray portion, the flexible
region configured to allows the tray portion to shift with respect
to the external portion to accommodate manufacturing tolerances
that cause an offset between a location of the slot and a location
of the plurality of electrical contacts.
[0008] Other aspects and advantages of the invention will become
apparent from the following detailed description taken in
conjunction with the accompanying drawings which illustrate, by way
of example, the principles of the described embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The disclosure will be readily understood by the following
detailed description in conjunction with the accompanying drawings,
wherein like reference numerals designate like structural elements,
and in which:
[0010] FIG. 1 shows a perspective view of an illustrative mobile
device suitable for use with the described embodiments;
[0011] FIG. 2A shows a cross-sectional view of the mobile device in
accordance with section line A-A of FIG. 1;
[0012] FIG. 2B shows a cross-sectional view of the mobile device in
accordance with section line A-A of FIG. 1;
[0013] FIG. 3A shows a perspective view of a composite SIM tray
assembly;
[0014] FIG. 3B shows a cross-sectional view of the mobile device
utilizing the composite SIM tray assembly in accordance with
section line A-A of FIG. 1;
[0015] FIG. 4A shows an isometric view of various illustrative
embodiments of a SIM tray;
[0016] FIG. 4B, shows an isometric view of various illustrative
embodiments of a SIM tray;
[0017] FIG. 5 shows an isometric view of a dovetailed SIM tray
assembly;
[0018] FIG. 6 shows an exploded view illustrating an embodiment of
a SIM tray assembly;
[0019] FIG. 7A shows a perspective view of a mobile device suitable
for use with the described embodiments and a close up view of the
SIM tray;
[0020] FIG. 7B shows a cross-sectional view of the mobile device in
accordance with section line B-B of FIG. 7A with the SIM tray
placed within a slot in a housing of the mobile device;
[0021] FIG. 7C shows a cross-sectional view of the mobile device in
accordance with section line A-A of FIG. 1 where the mobile device
is subjected to tolerance stacking; and
[0022] FIG. 8 shows a flow chart describing methods of
manufacturing and utilizing the SIM tray.
DETAILED DESCRIPTION
[0023] Representative applications of methods and apparatus
according to the present application are described in this section.
These examples are being provided solely to add context and aid in
the understanding of the described embodiments. It will thus be
apparent to one skilled in the art that the described embodiments
may be practiced without some or all of these specific details. In
other instances, well known process steps have not been described
in detail in order to avoid unnecessarily obscuring the described
embodiments. Other applications are possible, such that the
following examples should not be taken as limiting.
[0024] In the following detailed description, references are made
to the accompanying drawings, which form a part of the description
and in which are shown, by way of illustration, specific
embodiments in accordance with the described embodiments. Although
these embodiments are described in sufficient detail to enable one
skilled in the art to practice the described embodiments, it is
understood that these examples are not limiting; such that other
embodiments may be used, and changes may be made without departing
from the spirit and scope of the described embodiments.
[0025] A subscriber identification module (SIM) card is an
integrated circuit that securely stores service and subscriber
information used to identify the subscriber on mobile telephony
devices, such as a mobile telephone. A SIM tray is a user
accessible tray utilized in mobile telephony devices that is
adapted to receive and secure the SIM card within the mobile
device. A SIM tray generally includes a tray portion that supports
the SIM card rigidly joined to an external portion that covers an
opening in a housing of the mobile device. The SIM tray should
perform two essential functions: (1) facilitate easy access and
removal of the SIM card, and (2) when inserted into a mobile
device, maintain a seamless external cosmetic appearance in
relation to a housing of the mobile device. However, SIM trays can
be prone to deformation once inserted into a mobile device as a
result of manufacturing tolerances in both the opening that
facilitates insertion of the SIM tray and the positioning and
dimensioning of internal components configured to support and mate
with the SIM card. These manufacturing tolerances can generate
offsets that cause the rigid coupling between the tray portion and
the external portion to experience substantial stresses. Because
the tray portion of the SIM tray is engaged by internal coupling
features that align and position the SIM card with respect to
internal connectors, when the external portion of the SIM tray
contacts the surfaces forming the opening, the external portion is
forced to deform to accommodate any offsets causing misalignment
between the opening and the internal components. Accordingly,
deformation of the external portion of the SIM tray can cause the
external portion of the SIM tray to deviate relative to the
housing, thereby adversely affecting the external cosmetic
appearance between the SIM tray and the housing of the mobile
device.
[0026] Moreover, the aforementioned bending of the SIM tray can
increase the stress and strain applied to the internal electrical
components of the mobile device. Consequently, electrical contacts
between the SIM card and the internal electrical components can be
damaged due the SIM tray bending. Furthermore, over time the SIM
tray can become permanently bent or in severe cases break from
being subjected to the constant stress and strain. As a result,
binding can develop between the housing of the mobile device and
the SIM tray during removal of the SIM tray. These limitations may
be remedied by reducing manufacturing tolerances of the parts;
unfortunately, such machinery can be substantially more expensive
and in some cases can substantially increase an amount of time
spent to produce the part and/or the device due to processes
associated with the higher precision manufacturing operations.
[0027] One solution to the aforementioned problem is to build a
compliant portion into a SIM tray assembly that joins the external
portion to the tray portion. The compliant portion can be designed
to accommodate both the internal and external manufacturing
tolerance ranges associated with the mobile device. The compliant
portion of the SIM tray assembly allows the external portion of the
SIM tray to shift or deflect with respect to the tray portion
without adversely affecting other portions of the SIM tray
assembly. Moreover, the compliant portion of the SIM tray can allow
the tray portion of the SIM tray to move independently of an
external portion of the SIM tray. In this way, substantial
tolerance mismatches of components contacting the tray portion of
the SIM tray will not adversely affect the external portion.
[0028] In some embodiments, the compliant portion can take the form
of an elastomeric polymer that forms an interface between the
internal and external portions of the SIM tray. In such a
configuration, the elastomeric polymer acts as a point of
deflection once the SIM tray is fully inserted into the mobile
device. Once inserted, the tray portion of the SIM tray is free to
travel within the mobile device as a result of the interface being
flexible. Moreover, the external portion of the SIM tray can remain
fixed and unaffected from movement of the tray portion.
Alternatively, the compliant portion can take the form of a series
of interlocking features that form an interface between the
internal and external portions of the SIM tray. Furthermore, the
series of interlocking features can decouple horizontal movement of
the tray portion from the external portion. In this way, the tray
portion of the SIM tray does not have to deflect in order to
interact with the internal electrical components but instead can
translate into a proper position. In some embodiments, the
compliant portion can include a series of magnets that form the
interface between the internal and external portions of the SIM
tray. The magnetic coupling permits self-alignment of the external
portion of the SIM tray with the opening in the housing without
exerting any continuous force upon the tray portion of the SIM
tray.
[0029] In some embodiments, the SIM tray can be machined or formed
from a single piece of material and an interface between the tray
portion and the external portion is optimized by removing material
from the interface until a desired balance between flexibility and
structural integrity is achieved at the interface. The material can
be removed in any number of ways and in any number of patterns. For
example, in some embodiments, a number of holes can be drilled at
the interface. In other embodiments, a unitary opening can be
formed to achieve the desired balance. In this way, the flexible
interface joining the tray portion to the external portion can
allow deflection of the external portion without substantially
affecting the rigid region of the tray portion supporting the SIM
card.
[0030] These and other embodiments are discussed below with
reference to FIGS. 1-8; however, those skilled in the art will
readily appreciate that the detailed description given herein with
respect to these figures is for explanatory purposes only and
should not be construed as limiting.
[0031] FIG. 1A shows a perspective view of an illustrative mobile
device suitable for use with the described embodiments. In some
embodiments, mobile device 100 can be a mobile telephony device
along the lines of a mobile telephone. Mobile device 100 can
include housing 102 that creates an internal volume for positioning
and protecting a number of electronic components that include at
least circuitry for supporting display 104. Housing 102 can also
take the form of multiple housing components that cooperate to
define the internal volume for positioning and protecting the
electronic components. Housing 102 can also include an opening,
which can take the form of slot 106 for receiving, positioning, and
protecting SIM tray 108. SIM tray 108 is a user accessible tray
utilized by mobile device 100 to secure SIM card 110. For example,
SIM tray 108 can include an opening for accommodating and
supporting SIM card 110 while leaving a substantial portion of a
bottom surface of SIM card 110 exposed so that electrical contacts
on SIM card 110 can mate with electrical contacts of mobile device
100. SIM card 110 is an integrated circuit that securely stores
service and subscriber information used to identify the subscriber
on mobile devices. When SIM tray 108 is inserted into slot 106, SIM
tray 108 is positioned in such a manner that allows SIM card 110 to
interact with the electronic components in housing 102. SIM tray
108 can be positioned by housing 102 or electronic components
located in the interior volume of housing 102. Additionally, when
SIM tray 108 is inserted into housing 102, an exterior portion of
SIM tray 108 that is exposed to the exterior of housing 102 can be
substantially flush or parallel with external surface 112 of
housing 102. When the exterior portion of SIM tray 108 is
substantially flush or parallel to exterior surface 112 a desirable
cosmetic appearance can be achieved.
[0032] FIG. 2A shows a cross-sectional view of mobile device 100 in
accordance with section line A-A of FIG. 1 with SIM tray 108 placed
within slot 106 in housing 102 of mobile device 100. As depicted,
SIM tray 108 is fully inserted within slot 106. SIM tray 108 is
depicted in an ideal position causing the external portion of SIM
tray 108 to be substantially flush or parallel to surface 112.
Housing 102 can include chamfers or guiding features that aid in
positioning SIM tray 108 as it slides into slot 106. When inserted
into mobile device 100, SIM tray 108 is positioned in such a manner
that allows SIM card 110, placed within the receptacle in SIM tray
108 which places SIM card 110 just above electrical component 202
so that SIM card 110 can interact with electrical contacts 204. In
some embodiments, electrical component 202 can be a main logic
board (MLB).
[0033] Electrical component 202 occupies a height D.sub.1within
mobile device 100. In some embodiments, electrical component 202
can be a main logic board (MLB). Standoffs 206 occupy a height
D.sub.2 and can support electrical component 202 above an interior
surface of housing 102. The interior surface of housing 102 is
defined by a housing wall, which has a thickness D.sub.3. In the
case where contacts 204 form a substantially flat surface, SIM tray
108 is positioned substantially parallel to a top surface of
electrical component 202 once inserted into mobile device 100. The
sum of D.sub.1, D.sub.2, and D.sub.3 can be equal to a distance
D.sub.total. D.sub.total can be critical in a design such as a
position of slot 106 in housing 102 in order to position SIM tray
108 and assure that SIM tray 108 remains substantially flush or
parallel to surface 112 advantageously creating a desirable
cosmetic appearance. Designers can take into account D.sub.total to
achieve the desirable cosmetic appearance or other design
goals.
[0034] FIG. 2B shows a cross-sectional view of mobile device 100 in
accordance with section line A-A of FIG. 1 where internal
components of device 100 are out of position as a result of
tolerance stacking. Tolerance stacking occurs when a number of
manufactured component suffer dimensional defects. Tolerance
stacking is a phenomenon that occurs when the manufactured
components are manufactured at the maximum allowable dimensions and
the component variations sum or "stack" together to cause design
defects such as clearance issues. In many cases, tolerance stacking
can be difficult to control and be an unavoidable aspect of the
manufacturing of multiple identical or similar parts. Electrical
component 202, housing 102, and standoffs 206 can be manufactured
components. Therefore, Electrical component 202, housing 102, and
standoffs 206 can be subject to tolerance stacking. The sum of the
actual heights of electrical component 202, housing 102, and
standoff 206, D.sub.actual, can be substantially greater than the
designed sum of components heights D.sub.Total. The difference
between D.sub.actual and heights D.sub.1, D.sub.2, and D.sub.3 can
be D.sub.ERROR. In some cases, D.sub.ERROR may not be taken into
account by designers in positioning slot 106. As a result, stress
can be concentrated at interface 208 which can cause SIM tray 108
to bend. Consequently, SIM tray 108 will no longer be substantially
parallel to surface 112 or electrical component 202. In some
embodiments, communication between SIM card 110 and electrical
component traces 204 can be substantially inhibited. Additionally,
mobile device 100 may malfunction due to a miscommunication between
SIM card 110 and electrical component 202 as a result of SIM tray
108 not being substantially parallel to surface 112. Moreover,
tolerance stacking can create substantial stress and strain, such
as stress concentrations at interface 208, thereby causing SIM tray
108 to elastically deform or even structurally fail. Further,
tolerance stacking can cause tray 108 to no longer remain
substantially flush or parallel to surface 112 causing the exterior
of mobile device 100 to no longer be aesthetically appealing. In
some embodiments, both the external portion of SIM tray 108 and the
tray portion can deflect and be biased out of position as a result
of severe cases of tolerance stacking. In some cases, deformation
of the external portion can cause the external portion to protrude
away from an exterior surface of the mobile device, which could
cause the external portion to catch on external objects,
potentially causing damage to mobile device 100.
[0035] FIG. 3A shows an isometric view of SIM tray assembly 300 in
accordance with some embodiments. In some embodiments, SIM tray
assembly 300 can include tray portion 302, external portion 304,
and flexible portion 306. Tray portion 302 can include receptacle
308 that is utilized to hold a SIM card such as SIM card 110. Tray
portion 302, external portion 304, and flexible portion 306 can be
formed from different materials. Flexible portion 306 can form an
interface between tray portion 302 and external portion 304. In
some embodiments, flexible portion 306 can be adhesively coupled to
tray portion 302 and external portion 304. In some embodiments,
flexible portion 306 can be formed from a material with a lower
relative modulus of elasticity than the modulus of elasticity of
the materials used to form tray portion 302 and external portion
304. For example, tray portion 302 and external portion 304 can be
made from a metal such as aluminum or steel. In other embodiments,
tray portion 302 can be made from a polymer. While tolerance
stacking can still cause stress concentrations to be applied along
flexible portion 306, flexible portion 306 can dissipate the stress
by flexing to dissipate the applied stresses. While flexible
portion 306 isn't infinitely stretchable it can be designed to
accommodate an amount of stress expected from tolerance
stacking.
[0036] To illustrate, FIG. 3B shows a cross-sectional view of
mobile device 100 utilizing SIM tray assembly 300 in accordance
with section line A-A of FIG. 1. In some embodiments, external
portion 304 can fit tightly within slot 106 of housing 102, thereby
inhibiting contaminants from entering the interior of housing 102.
In some embodiments, external portion 304 can utilize a rubber
gasket located at an interface between external portion 304 and
housing 102 to more substantially prevent contaminants from
entering the interior of housing 102 through slot 106. SIM tray
assembly 300 can be utilized to accommodate tolerance stacking of
internal components of mobile device 100. For example, SIM tray
assembly 300 can be inserted into mobile device 100 in the same
manner as SIM tray 108. In this particular embodiment, tolerance
stacking can cause a stress concentration to form at flexible
portion 306. Flexible portion 306 can be formed from various
durometers of rubber, elastomeric polymers, silicon, or any
suitable material with a lower modulus of elasticity than the
material that forms tray portion 302 and/or external portion. As a
result, flexible portion 306 can deform by a greater magnitude than
tray portion 302 and/or external portion 304 for a given stress.
Therefore, when subjected to a tolerance stacking phenomenon,
flexible portion 306 may bend, deform or comply by a greater
magnitude than tray portion 302 and external portion 304. As a
result, tray portion 302 and external portion 304 can bend, deform,
or comply by a substantially lower magnitude relative to flexible
portion 306. Therefore, tray portion 302 and electrical component
202 may remain substantially parallel to each other. In this way,
tray portion 302 is not adversely affected by tolerance stacking
and communication between SIM card 110 and electrical component 202
can be maintained. Additionally, flexible portion 306 can be
utilized to maintain a smooth interface between external portion
304 and housing 102. In this way, tolerance stacking may allow
external portion 304 to be flush with surface 112 thereby providing
an aesthetically appealing exterior for mobile device.
[0037] FIG. 4A shows an isometric view of various illustrative
embodiments of SIM tray 400. SIM tray 400 can be monolithic and
formed from a single material such as a polymer, aluminum, steel,
or any material that can be cut, machined, and/or molded. SIM
assembly 400 can include tray portion 402 and external portion 404.
Moreover, tray portion 402 can include flexible region 406 and
rigid region 408. Rigid region 408 can support a SIM card such as
SIM card 110. Flexible region 406 can include one or more openings
which define a number of arms 410. Thus, 402 remains attached to
external portion 404 via arms 410. In some embodiments material can
be removed from both top and lateral surfaces of flexible region
406 to increase flexibility of flexible region 406. As more
material is removed from flexible region 406, an amount of force
required to bend flexible region 406 is reduced, thereby reducing
an amount of stress endured by SIM tray 400 when inserted within a
mobile device. Although flexible region 406 and rigid region 408
are formed from the same material, flexible region 406 can deform
by a greater magnitude for a given stress than rigid region 408.
Tolerance stacking can cause stress concentrations to form at
flexible region 406 and create a potential weak point on SIM tray
400. Flexible region 406 is designed to compensate for this stress
concentration and alleviate problems associated with the stress
concentrations.
[0038] As shown in FIG. 4B, flexible region 406 can also take the
form of series of holes 412 in SIM tray 450. SIM tray 450 can have
tray portion 402 and external portion 404. Tray portion can include
a rigid region 408 capable of receiving a SIM card and flexible
region 406, capable of deforming by a greater magnitude for a given
stress than one or both of rigid region 408 and external portion
404. Deforming by a greater magnitude for a given stress can be
achieved by removing material from flexible region 406 such as the
removal of material accomplished by series of holes 412. Holes 412
can take many forms depending on the desired flexibility of SIM
tray 450 and other manufacturing considerations. For example,
drilling a quantity of large diameter holes may result in the same
deformation for a given stress as a larger quantity of small
diameter holes. In this way, a desired balance between flexibility
and structural integrity can be achieve while manufacturing
expenses can be substantially reduced. In some embodiments, holes
412 can include many small holes as shown in FIG. 4B. Small holes
may be desirable to achieve a more precise flexibility to
structural integrity ratio, which could not be achieved using large
cumbersome drills. Each additional small hole can incrementally
increase a flexibility of flexible region 406. Furthermore, tray
portion 402 made from certain materials, such as a hard plastic,
may be susceptible to cracking. Therefore, it may be desirable to
use fewer, and further spaced series of holes 412 to avoid cracking
flexible region 406.
[0039] FIG. 5 shows an isometric view of dovetailed SIM tray
assembly 500. SIM tray assembly 500 can be utilized in mobile
device 100. In some embodiments, SIM tray assembly 500 can include
tray portion 502 and external portion 504. FIG. 5 also shows a
close up view depicting a dovetail feature that can form an
interface between tray portion 302 and external portion 304. Tray
portion 502 can join to external portion 504 by utilizing joints
506. Tray portion 502 can also join external portion 504 by
utilizing a number of joints. Joint 506 can substantially limit
movement of tray portion 502 and external portion 504 relative to
each other in x and y directions. However, joint 506 can allow the
positions of tray portion 502 and external portion 504 to float
relative to each other in z direction. Freedom of movement between
tray portion 502 and external portion 504 would be desirable in the
event that stress concentrations would form at region 510, a
potential weak point of SIM tray assembly 500. For example, region
510 could be analogous to stress concentrations at interface 208
depicted in FIG. 2. In some embodiments, external portion 504 can
further comprise a rubber gasket.
[0040] FIG. 5 also shows a close up view showing a particular joint
506. External portion 504 can include channel 512 defined by an
interior facing surface of external portion 504. Channel 512 can
take the form of a square, rectangular, or curved slot. Tray
portion can include protrusion 514 integrally formed within the
tray portion. Protrusion can be adapted for insertion into channel
512. Channel 512 can be shaped to accept protrusion 514 and trap a
distal end of protrusion 514 within channel 512. For example, a
trapezoidal or fan shape can facilitate insertion in a direction
but resist removal in a different direction. Channel 512 and
protrusion 514 can cooperate to form joint 506 which can take the
form of a tight interlocking joint that can be rigid in x and y
directions but not in z direction. In some embodiments, channel 512
can be oriented in a direction to allow movement of the external
portion 504 in the direction. Tray portion 502 can include
receptacle 508 that is utilized to hold a SIM card. A lubricant or
a coating that increases lubricity can facilitate movement in z
direction.
[0041] SIM tray assembly 500 can also be utilized to accommodate
tolerance stacking of internal components of mobile device 100. For
example, SIM tray assemblies 400 and 450 can be inserted into
mobile device 100 in the same manner as SIM tray 108. In this
particular embodiment, tolerance stacking can cause a stress
concentration to form at region 510. However, joint 506 can allow
external portion 504 and tray portion 502 to translate relative to
each other in the z direction to dissipate any stress concentration
resulting from the tolerance stacking. Rather than deforming, joint
506 allows tray portion to translate by movement of protrusion 514
within channel 512. Likewise, external portion can also translate
in z direction. In this way, tray portion 502 is not adversely
affected by tolerance stacking and communication between SIM card
110 and electrical component 202 can be maintained. Additionally,
external portion 304 can be flush with surface 112 providing an
aesthetically appealing exterior for mobile device.
[0042] To illustrate, FIG. 6 depicts an exploded perspective view
of a specific implementation of SIM tray 600 utilizing a dovetail
joint. SIM tray 600 includes tray portion 602 including mortise 612
and external portion 604 including tenon 614. Tenon 614 can join to
mortise 612 along axis 616 in order to form a dovetail joint. As
depicted, tenon 614 can translate along axis 616 relative to
external portion 604 according slot of mortise 612. However,
relative movement between tray portion 602 and external portion 604
in directions perpendicular to axis 616 is substantially limited by
the cooperation of tenon 614 and mortise 612.
[0043] FIG. 7A depicts a perspective view of illustrative mobile
device 100 suitable for use with the described embodiments and a
close up view SIM tray 700. Mobile device 100 includes housing 102
that creates an internal volume for positioning and protecting a
number of electronic components. Housing 102 can also take the form
of multiple housing components that cooperate to define the
internal volume for positioning and protecting the number of
electronic components. Housing 102 may also include slot 106 for
receiving SIM tray 700. In some embodiments, SIM tray assembly 700
can include external portion 702 and tray portion 704. Tray portion
704 can join to external portion 702 by utilizing a magnetic force.
The magnetic force can be provided by magnets 706 embedded in
external portion 702. The magnetic force can substantially limit
movement of tray portion 704 and external portion 702 relative to
each other in x and/or y directions. However, the magnetic force
can allow the positions of tray portion 704 and external portion
702 to float relative to each other in z direction.
[0044] FIG. 7B shows a cross-sectional view of mobile device 100 in
accordance with section line B-B of FIG. 7A with SIM tray 700
placed within slot 106 in housing 102 of mobile device 100. As
depicted, SIM tray 700 is fully inserted within slot 106 forming
the part of SIM tray 700 that is substantially flush or parallel to
surface 112. Housing 102 can have chamfers that aid in positioning
SIM tray 700 relative to housing 102 when inserted. Magnets 706 can
be embedded in external portion 702. Magnets 706 can be attracted
to tray portion 704. In other embodiments, tray portion 704 can
also contain magnets 708. Magnets 706 and 708 can also be any pair
of materials that are magnetically attracted to each other. For
example, magnet 706 can be formed from ferromagnetic material and
magnet 708 can be a rare earth magnet. In lieu of magnets 706, tray
portion 704 can be formed from a ferromagnetic material such as
steel. When inserted into mobile device 100, SIM tray 108 is
positioned in such a manner that allows SIM card 110 positioned
within the receptacle in SIM tray 700 to interact with electrical
component 202 within mobile device 100. External portion 702 can be
flush with surface 112. Electrical component 202 can be a main
logic board (MLB). Standoffs 206 can support electrical component
202 on housing 102. SIM card 110 can then electrically interact
with electrical component 202 through contacts 204. In the case
where contacts 204 form a substantially flat surface, SIM tray 108
is positioned substantially parallel to electrical component 202
once inserted into mobile device. SIM tray 700 can remain
substantially flush or parallel to surface 112 advantageously
creating a desirable cosmetic appearance.
[0045] To illustrate, FIG. 7C shows a cross-sectional view of
mobile device 100 in accordance with section line A-A of FIG. 1
where device 100 is subjected to tolerance stacking. SIM tray
assembly 700 can be utilized to accommodate tolerance stacking of
internal components of mobile device 100. In this particular
embodiment, housing 102, standoffs 206, and electrical component
202 can be manufactured components having dimensional errors. As a
result of tolerance stacking phenomenon, SIM tray 700 can be moved
by distance D.sub.ERROR. However, rather than deforming, tray
portion 704 can translate in z direction in order to accommodate
tolerance stacking. In this way, tray portion 704 is not adversely
affected by tolerance stacking and communication between SIM card
110 and electrical component 202 can be maintained. Additionally,
external portion 702 can remain be flush with surface 112 thereby
providing an aesthetically appealing exterior for mobile device. A
lubricant or a coating that increases lubricity can facilitate
movement of external portion 702 in the z axis. Additionally,
magnets 706 and 708 can also facilitate relative movement between
external portion 702 and tray portion 704 in both the z and x
directions. In other embodiments, housing 102 can also include a
number of magnets. For example, magnets 708 can be located on
housing 102 rather than tray portion 704. In this case, magnets 708
and 706 can cooperate to allow translation in the z direction in
order to accommodate tolerance stacking.
[0046] FIG. 8 illustrates a flow chart depicting a method 800 for
manufacturing and utilizing a SIM tray in accordance with an
embodiment of the invention. As shown, method 800 begins at step
802, which involves forming a tray portion for housing and
positioning a SIM card and an external portion for forming a
substantially flush surface with a housing of a mobile telephony
device. Step 804 forming a compliant portion joining the tray
portion to the external portion. For example, the tray portion and
the external portion can be connected with a compliant material
formed from as rubber, an elastomeric polymer, or any material with
a lower modulus of elasticity than the materials that form the
external portion or the tray portion. In some embodiments, the
compliant portion can take the form of a compliant join such as a
dovetail joint. For example, the tray portion could form a
protrusion that can be inserted into a channel located on the
external portion. In other embodiments, the compliant portion could
take the form of magnets. Step 806 involves inserting the SIM tray
assembly into the mobile telephony device. Because of the tolerance
stacking phenomenon, the SIM tray could be subjected to a force. In
step 808, the compliant portion can allow the external portion to
remain flush with the housing of the mobile device. In some
embodiments, the compliant portion can deform (strain) by a greater
magnitude than the tray portion and/or the external portion. In
other embodiments, compliant portion can allow the tray portion and
the external portion to translate in a direction.
[0047] The various aspects, embodiments, implementations or
features of the described embodiments can be used separately or in
any combination. Various aspects of the described embodiments can
be implemented by software, hardware or a combination of hardware
and software. The described embodiments can also be embodied as
computer readable code on a computer readable medium for
controlling manufacturing operations or as computer readable code
on a computer readable medium for controlling a manufacturing line.
The computer readable medium is any data storage device that can
store data which can thereafter be read by a computer system.
Examples of the computer readable medium include read-only memory,
random-access memory, CD-ROMs, HDDs, DVDs, magnetic tape, and
optical data storage devices. The computer readable medium can also
be distributed over network-coupled computer systems so that the
computer readable code is stored and executed in a distributed
fashion.
[0048] The foregoing description, for purposes of explanation, used
specific nomenclature to provide a thorough understanding of the
described embodiments. However, it will be apparent to one skilled
in the art that the specific details are not required in order to
practice the described embodiments. Thus, the foregoing
descriptions of specific embodiments are presented for purposes of
illustration and description. They are not intended to be
exhaustive or to limit the described embodiments to the precise
forms disclosed. It will be apparent to one of ordinary skill in
the art that many modifications and variations are possible in view
of the above teachings.
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