U.S. patent application number 14/981970 was filed with the patent office on 2017-06-22 for heat dissipation module.
The applicant listed for this patent is Industrial Technology Research Institute. Invention is credited to Jia-Jen Chang, Hao-Wen Cheng, Hsien-Lin Hu, Ming-Sheng Leu, Wei-Chien Tsai, Jin-Bao Wu.
Application Number | 20170176117 14/981970 |
Document ID | / |
Family ID | 59067021 |
Filed Date | 2017-06-22 |
United States Patent
Application |
20170176117 |
Kind Code |
A1 |
Wu; Jin-Bao ; et
al. |
June 22, 2017 |
HEAT DISSIPATION MODULE
Abstract
A heat dissipation module adapted to perform heat dissipation on
a heat generating component is provided. The heat dissipation
module includes a graphite sheet and an insulating and heat
conducting layer. The graphite sheet includes a plurality of
through holes, an attaching surface and a heat dissipating surface
opposite to the attaching surface, wherein the attaching surface is
configured to be attached to the heat generating component. Each of
the through holes penetrates the graphite sheet, so the attaching
surface and the heat dissipating surface are connected via the
through holes. The insulating and heat conducting layer covers the
graphite sheet. The insulating and heat conducting layer least
covers the attaching surface, the heat dissipating surface and
inner walls of the through holes.
Inventors: |
Wu; Jin-Bao; (Hsinchu City,
TW) ; Tsai; Wei-Chien; (Miaoli County, TW) ;
Cheng; Hao-Wen; (Pingtung County, TW) ; Leu;
Ming-Sheng; (Hsinchu County, TW) ; Chang;
Jia-Jen; (Yunlin County, TW) ; Hu; Hsien-Lin;
(Hsinchu County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Industrial Technology Research Institute |
Hsinchu |
|
TW |
|
|
Family ID: |
59067021 |
Appl. No.: |
14/981970 |
Filed: |
December 29, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/373 20130101;
F28F 2275/025 20130101; F28F 21/02 20130101; F28D 2021/0029
20130101; H01L 23/3737 20130101 |
International
Class: |
F28F 21/02 20060101
F28F021/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 22, 2015 |
TW |
104143069 |
Claims
1. A heat dissipation module, configured to perform heat
dissipation on a heat generating component, the heat dissipation
module comprising: a graphite sheet including a plurality of
through holes, an attaching surface and a heat dissipating surface,
wherein the attaching surface is configured to be attached to the
heat generating component, the heat dissipating surface is opposite
to the attaching surface, and the through holes penetrate the
graphite sheet, so the attaching surface and the heat dissipating
surface are connected to each other via the through holes; and an
insulating and heat conducting layer covering the graphite sheet,
wherein the insulating and heat conducting layer at least covers
the attaching surface, the heat dissipating surface and inner walls
of the through holes.
2. The heat dissipation module as claimed in claim 1, further
comprising an adhesive layer disposed on the attaching surface,
such that the heat dissipation module is attached to the heat
generating component through the adhesive layer.
3. The heat dissipation module as claimed in claim 2, wherein the
adhesive layer comprises a pressure sensitive adhesive (PSA).
4. The heat dissipation module as claimed in claim 2, further
comprising a release film disposed on a surface of the adhesive
layer attaching to the heat generating component.
5. The heat dissipation module as claimed in claim 1, wherein a
thermal conductivity of the insulating and heat conducting layer
along a vertical axis is substantially greater than or equal to 100
W/mK.
6. The heat dissipation module as claimed in claim 1, wherein a
resistivity of the insulating and heat conducting layer is
substantially greater than or equal to 10.sup.5 .OMEGA.cm.
7. The heat dissipation module as claimed in claim 1, wherein
material of the insulating and heat conducting layer comprises
insulation carbide.
8. The heat dissipation module as claimed in claim 1, wherein
composition of the insulating and heat conducting layer comprises
SiCx, and x substantially ranges from 0.5 to 1.
9. The heat dissipation module as claimed in claim 1, wherein
composition of the insulating and heat conducting layer comprises
crystal structure of 3C--SiC.
10. The heat dissipation module as claimed in claim 1, wherein a
diameter of each of the through holes substantially ranges from 1
.mu.m to 1000 .mu.m.
11. The heat dissipation module as claimed in claim 1, wherein a
diameter of each of the through holes substantially ranges from 260
.mu.m to 265 .mu.m.
12. The heat dissipation module as claimed in claim 1, wherein a
thickness of the insulating and heat conducting layer is
substantially greater than or equal to 1 .mu.m, and substantially
equal to or smaller than half of a diameter of each of the through
holes.
13. The heat dissipation module as claimed in claim 1, wherein a
thickness of the insulating and heat conducting layer substantially
ranges from 40 .mu.m to 45 .mu.m.
14. The heat dissipation module as claimed in claim 1, wherein a
thickness of the graphite sheet substantially ranges from 50 .mu.m
to 1 mm.
15. The heat dissipation module as claimed in claim 1, wherein a
thickness of the graphite sheet substantially ranges from 50 .mu.m
to 55 .mu.m.
16. The heat dissipation module as claimed in claim 1, wherein a
cross section of each of the through holes is in circular,
triangular or rectangular shape.
17. The heat dissipation module as claimed in claim 1, wherein the
insulating and heat conducting layer is formed by chemical vapor
deposition (CVD) process.
18. The heat dissipation module as claimed in claim 17, wherein
temperature for the CVD process substantially ranges from
1000.degree. C. to 1400.degree. C.
19. The heat dissipation module as claimed in claim 17, wherein
pressure for the CVD process substantially ranges from 10 pa to
50000 pa.
20. The heat dissipation module as claimed in claim 17, wherein the
graphite sheet comprises pyrolytic graphite sheet (PGS).
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 104143069, filed on Dec. 22, 2015. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND
Technical Field
[0002] The present disclosure relates to a heat dissipation
module.
Related Art
[0003] In recent years, electronic technology, particularly the
processing technology in an integrated circuit (IC), has developed
very quickly, and thus functions of electronic components are
greatly improved. Along with improvements of a processing speed and
efficiency of an electronic component, heat generated by the
electronic components in operating is also increased. If waste heat
cannot be taken away effectively, the electronic components may
fail or be unable to reach optimal efficiency. In an electronic
device such as a smart phone, a tablet PC or a laptop, etc., the
main heat generating components are CPU, chipset on a circuit board
and graphics processing unit (GPU), etc. Generally, heat
dissipation components such as heat sinks, heat pipes, heat
dissipation fins and fans, etc., are usually disposed on the heat
source to lower the temperature of the heat source.
[0004] Currently, electronic devices develop towards the trend of
lightness and thinness. The known heat dissipation components such
as heat sinks, heat pipes, heat dissipation fins and fans usually
take up significant weight and volume, so it is hard for the
electronic devices having the same to meet the requirement of
lightness and thinness. Accordingly, it is an important goal for
the industry to provide a light heat dissipation component without
sacrificing the heat dissipation performance.
SUMMARY
[0005] In one of exemplary embodiments, a heat dissipation module
configured to perform heat dissipation on a heat generating
component is provided. The heat dissipation module includes a
graphite sheet and an insulating and heat conducting layer. The
graphite sheet includes a plurality of through holes, an attaching
surface and a heat dissipating surface, wherein the attaching
surface is configured to be attached to the heat generating
component. The heat dissipating surface is opposite to the
attaching surface, and the through holes penetrate the graphite
sheet, so the attaching surface and the heat dissipating surface
are connected to each other via the through holes. The insulating
and heat conducting layer covers the graphite sheet, wherein the
insulating and heat conducting layer at least covers the attaching
surface, the heat dissipating surface and inner walls of the
through holes.
[0006] Several exemplary embodiments accompanied with figures are
described in detail below to further describe the disclosure in
details.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The accompanying drawings are included to provide further
understanding, and are incorporated in and constitute a part of
this specification. The drawings illustrate exemplary embodiments
and, together with the description, serve to explain the principles
of the disclosure.
[0008] FIG. 1 is a cross-sectional view of a heat dissipation
module according to an exemplary embodiment.
[0009] FIG. 2 is a schematic view of a heat dissipation module
according to an exemplary embodiment.
[0010] FIG. 3 is a partial cross-sectional view of a heat
dissipation module according to an exemplary embodiment.
[0011] FIG. 4 is an X-ray diffraction diagram of an insulating and
heat conducting layer according to an exemplary embodiment.
[0012] FIG. 5 is a wide spectrum diagram of a surface of an
insulating and heat conducting layer according to an exemplary
embodiment.
[0013] FIG. 6 is a binding energy diagram of a surface of an
insulating and heat conducting layer according to an exemplary
embodiment.
[0014] FIG. 7 is a time temperature transfoimation diagram of an
attaching surface and a heat dissipating surface of a known heat
dissipation module.
[0015] FIG. 8 is a time temperature transformation diagram of an
attaching surface and a heat dissipating surface of a heat
dissipation module according to an exemplary embodiment.
DESCRIPTION OF THE EMBODIMENTS
[0016] The present disclosure will now be described more fully with
reference to the accompanying drawings, in which exemplary
embodiments of the disclosure are shown.
[0017] The terms used herein such as "top," "bottom," "front,"
"back," "left," and "right" are for the purpose of describing
directions in the figures only and are not intended to be limiting
of the disclosure. Moreover, in the following embodiments, the same
or similar reference numbers denote the same or like
components.
[0018] The disclosure is directed to a heat dissipation module with
great heat dissipation efficiency along a vertical axis, and an
overall thickness thereof is rather thin.
[0019] FIG. 1 is a cross-sectional view of a heat dissipation
module according to an exemplary embodiment. FIG. 2 is a schematic
view of a heat dissipation module according to an exemplary
embodiment. FIG. 3 is a partial cross-sectional view of a heat
dissipation module according to an exemplary embodiment. Referring
to FIG. 1, FIG. 2 and FIG. 3, a heat dissipation module 100 is
configured to perform heat dissipation on a heat generating
component 200. In the present embodiment, the heat dissipation
module 100 includes a graphite sheet 110 and an insulating and heat
conducting layer 120. The graphite sheet 110 includes an attaching
surface 112, a heat dissipating surface 114 and a plurality of
through holes 116, wherein the attaching surface 112 is configured
to be attached to the heat generating component 200. The heat
dissipating surface 114 is opposite to the attaching surface 112,
and the through holes 116 penetrate the graphite sheet 110, so the
attaching surface 112 and the heat dissipating surface 114 are
connected to each other via the through holes 116. In one
embodiment, the graphite sheet 110 may be a pyrolytic graphite
sheet (PGS). The insulating and heat conducting layer 120 covers
the graphite sheet 110. In detail, the insulating and heat
conducting layer 120 at least covers the attaching surface 112, the
heat dissipating surface 114 and inner walls of the through holes
116. In the present embodiment, the thickness of the graphite sheet
110 may substantially range from 50 .mu.m to 1 mm. To be more
specific, the thickness of the graphite sheet 110 may substantially
range from 50 .mu.m to 55 .mu.m. Certainly, it will be apparent to
those skilled in the art that the numbers shown in the present
embodiment are merely for illustrations, and the disclosure is not
limited thereto.
[0020] In the present embodiment, the heat dissipation module 100
may further include an adhesive layer 130 shown in FIG. 1, which is
disposed on the attaching surface 112 of the graphite sheet 110,
such that the heat dissipation module 100 may be attached to the
heat generating component 200 with its own attaching surface 112
through the adhesive layer 130. Moreover, the heat dissipation
module 100 may further includes a release tape, which is detachably
disposed on a surface of the adhesive layer 130 attaching to the
heat generating component 200, so as to temporarily protect the
attaching surface of the adhesive layer 130.
[0021] Under such arrangement, after the release tape is removed,
the heat dissipation module 100 may be attached to the heat
generating component 200 with its attaching surface 112 through the
adhesive layer 130. For instance, the heat generating component 200
may be a central processing unit (CPU), a chipset or single chip on
a circuit board, etc. In the present embodiment, the adhesive layer
130 may be, for example, a pressure sensitive adhesive (PSA). In
general, the PSA is an adhesive which forms a bond when pressure is
applied to many the adhesive with an object.
[0022] The main composition may include rubber, acrylic, silica
gel, Polyurethane (PU), etc. Certainly, the present embodiment is
merely for illustration, and the disclosure does not limit the
types or formations of the heat generating component 200 and the
adhesive layers 130.
[0023] In detail, the material of the insulating and heat
conducting layer 120 includes insulation carbide. Specifically, the
insulation carbide includes silicon carbide, which can be formed on
the surface of the graphite sheet 110 by chemical vapor deposition
(CVD) process under low pressure and high temperature. The
molecular formula of the silicon carbide in the insulating and heat
conducting layer 120 formed by the process described above is SiCx,
and x may substantially range from 0.5 to 1. To be more specific, x
may substantially range from 0.55 to 1. It is noted that the range
set for the value of x is regarding manufacturing capability. In
ideal circumstances, x may be 1. Moreover, composition of the
insulating and heat conducting layer 120 may include cubic crystal
structure of 3C--SiC. Certainly, the present embodiment is merely
for illustration, the disclosure does not limit composition and
forming method of the insulating and heat conducting layer 120 as
long as it can provide insulation and has high thermal
conductivity.
[0024] As such, the heat dissipation efficiency of the insulating
and heat conducting layer 120 is outstanding, wherein a thermal
conductivity of the insulating and heat conducting layer 120 along
a vertical axis is substantially greater than or equal to 100 W/mK,
and the vertical axis is parallel to a longitudinal direction of
each of the through holes 116. Moreover, the insulating and heat
conducting layer 120 comprehensively covers the inner walls of the
through holes 116 to connect and cover the attaching surface 112
and heat dissipating surface 114 opposite to each other.
Accordingly, the heat dissipation module 100 of the present
embodiment may vertically conduct the thermal energy from the
attaching surface 112 to the heat dissipating surface 114 through
the insulating and heat conducting layer 120. Therefore, the heat
dissipation module 100 of the present embodiment not only have
great heat dissipation efficiency in horizontal direction (parallel
to the direction of the attaching surface 112) owing to the
graphite sheet 110, but also enhances the heat dissipation
efficiency in vertical direction (longitudinal direction of each
through hole 116) by the insulating and heat conducting layer 120
covering the through holes 116.
[0025] Furthermore, a resistivity of the insulating and heat
conducting layer 120 is substantially greater than or equal to
10.sup.5 .OMEGA.cm, so it has great insulation property. Therefore,
owing to the insulating and heat conducting layer 120 covering the
graphite sheet 110, the heat dissipation module 100 of the present
embodiment not only enhances the thermal conductivity thereof along
the vertical direction (the longitudinal direction of the through
holes 116), but also can provide insulation effect, such that there
is no need to additionally attach an insulation tape such as
polyethylene terephthalate (PET) on the heat dissipation module
100, so as to reduce the production cost and the overall thickness
of the heat dissipation module 100.
[0026] In addition, in the present embodiment, a diameter of each
of the through holes 116 may substantially range from 1 .mu.m to
1000 .mu.m, and a thickness of the insulating and heat conducting
layer 120 may be substantially greater than or equal to 1 .mu.m,
and substantially equal to or smaller than half of the diameter of
each of the through holes 116. Namely, the insulating and heat
conducting layer 120 at most can completely fill up each of the
through holes 116 of the graphite sheet 110. Moreover, a cross
section of each of the through holes 116 may be in circular,
triangular or rectangular shape. The disclosure does not limit the
shapes of the cross sections of the through holes 116 as long as
the through holes 116 penetrate the graphite sheet 110 to connect
the attaching surface 112 and the heat dissipating surface 114
opposite to each other.
[0027] In detail, to faun the insulating and heat conducting layer
120 described above, an apparatus capable of controlling
temperature for chemical vapor deposition (CVD) process may be
adopted, and halogen containing silane may be adopted as volatile
precursor. By applying hydrogen, argon and methane at around
1300.degree. C., the halogen containing silane as precursor is
brought into the reaction chamber of the apparatus by argon, so as
to diffuse to the surface of the graphite sheet 110. At the time,
the graphite sheet 110 is heated to the specific temperature for
the process, so the precursor is decomposed into atoms or small
molecules such as silicon, carbon, hydrogen, and halogen, etc., by
pyrolysis under high temperature to be adsorbed to the surface of
the graphite sheet 110, and then is nucleated on the surface of the
graphite sheet 110 to form the insulating and heat conducting layer
120 at least covering the attaching surface 112, the heat
dissipating surface 114 and the inner walls of the through holes
116 of the graphite sheet 110. In the present embodiment, the
diameter of each of the through holes 116 may substantially range
from 260 .mu.m to 265 .mu.m, and the thickness of the insulating
and heat conducting layer 120 may range from 40 .mu.m to 45 .mu.m.
Certainly, the numbers shown in the present embodiment are merely
for illustration, the present disclosure does not limit the
diameters of the through holes 116 and the thickness of the
insulating and heat conducting layer 120. In terms of manufacturing
capability, the thickness of the insulating and heat conducting
layer 120 formed by CVD process can reach 1000 .mu.m. Namely, the
thickness of the insulating and heat conducting layer 120 may range
from 1 .mu.m to 1000 .mu.m.
[0028] In one embodiment, the insulating and heat conducting layer
120 is formed by CVD process under low pressure and high
temperature, so the insulating and heat conducting layer 120
composed of silicon carbide is formed on the graphite sheet 110. To
be more specific, in the present embodiment, the insulating and
heat conducting layer 120 composed of silicon carbide is formed on
the graphite sheet 110 by halogen containing silane, methane,
hydrogen, and argon, and the temperature for the CVD process may
range from 1000.degree. C. to 1400.degree. C., and the pressure for
the CVD process may substantially range from 10 pa to 50000 pa to
deposit the insulating and heat conducting layer 120 composed of
silicon carbide. The insulating and heat conducting layer 120
formed under such conditions have great insulation property and
also have great adhesion and step coverage to the graphite sheet
110. Therefore, the insulating and heat conducting layer 120 can
completely cover the surface of the graphite sheet 110, which
includes the attaching surface 112, the heat dissipating surface
114 and the inner walls of the through holes 116.
[0029] FIG. 4 is an X-ray diffraction diagram of an insulating and
heat conducting layer according to an exemplary embodiment. To
understand the film structure and the crystal phase of the
insulating and heat conducting layer 120 composed of silicon
carbide, the present embodiment adopts the analysis of X-ray
diffraction (XRD) to obtain the X-ray diffraction diagram shown in
FIG. 4. The X-ray diffraction is a technique for non-destructive
analysis, which is for detecting properties of crystalline
materials, so as to provide analyses of structure, phase, primary
crystal orientation and other structural parameters such as an
average of granularity, crystallinity, strain and crystal defect,
etc. The diffraction peak of X-ray is generated by constructive
interference of monochromatic light diffracted at a specific angle
through a lattice plane of a film under test, and the intensity of
the peak value is determined by the distribution of the atoms in
the lattice. It is shown in FIG. 4 that there are 3 diffraction
peaks in the spectrum, and the intensity of the diffraction peaks
are (111), (220) and (311), respectively. To further compared with
Joint. Committee on Powder Diffraction Standards (JCPDS), it is
shown that the micro structures of the insulating and heat
conducting layer 120 composed of silicon carbide are all crystal
structures of 3C--SiC, which are the cubic crystal structures of
silicon carbide with 3-layered stacking period (stacking sequence
is ABC).
[0030] FIG. 5 is a wide spectrum diagram of a surface of an
insulating and heat conducting layer according to an exemplary
embodiment. FIG. 6 is a binding energy diagram of a surface of an
insulating and heat conducting layer according to an exemplary
embodiment. To understand the binding type of the insulating and
heat conducting layer 120 composed of silicon carbide, in the
present embodiment, after cleaning process is performed on the
surface of the graphite sheet 100 by Ar.sup.+, the analysis of
X-ray photoelectron spectroscopy (XPS) is applied to obtain the
wide spectrum diagram shown in FIG. 5. It is shown in FIG. 5 that
the energy spectrum of the insulating and heat conducting layer 120
includes the compositions of carbon and silicon. To be more
specific, it is shown in the energy spectrum of XPS in FIG. 6,
apart from having the composition of carbon and silicon. Moreover,
from composition identification, the insulating and heat conducting
layer 120 is composed of SiC.sub.0.55. Certainly, the numbers shown
in the present embodiment are merely for illustration. In ideal
circumstances, the insulating and heat conducting layer 120 is
composed of SiC.
[0031] Table 1 shown below illustrates the data of several
properties of the insulating and heat conducting layer 120 obtained
by analyses in the present embodiment. In detail, .rho. represents
film density of the insulating and heat conducting layer 120;
C.sub.p represents heat capacity at constant pressure, which means
the heat energy absorbed or released by unit mass of the insulating
and heat conducting layer 120 as its temperature increases
1.degree. C. or 1K at constant pressure; a represents thermal
diffusivity, which means the thermal conductivity divided by
volumetric heat capacity; and K represents thermal conductivity,
the quantity of heat that passes in unit time through a unit area
and length of the insulating and heat conducting layer 120 when its
opposite faces differ in unit temperature. It should be noted that
the value of K shown herein is the thermal conductivity of the
insulating and heat conducting layer 120 along the vertical axis
(parallel to the longitudinal direction of the through holes 116).
The table shown below clearly indicates that the insulating and
heat conducting layer 120 has great property and performance in
thermal conductivity.
TABLE-US-00001 TABLE 1 Material .rho. (g/cm.sup.3) C.sub.p (J/gK)
.alpha. (mm.sup.2/s) K (W/m K) SiC 3.17 0.707 57.805 129.571
[0032] It is noted that the present embodiment takes the pyrolytic
graphite sheet 110 for example, whose thermal conductivity along
the horizontal axis (parallel to the attaching surface 112 or heat
dissipating surface 114) can reach about 1500 W/mK. Therefore, with
the coverage of the insulating and heat conducting layer 120, the
heat dissipation module 100 of the present embodiment enhances its
own heat dissipation performance along the vertical axis.
[0033] FIG. 7 is a time temperature transformation diagram of an
attaching surface and a heat dissipating surface of a known heat
dissipation module. FIG. 8 is a time temperature transformation
diagram of an attaching surface and a heat dissipating surface of a
heat dissipation module according to an exemplary embodiment. It is
noted that, in order to proof the thermal conductivity of the heat
dissipation module 100 of the disclosure is greater than that of a
known heat dissipation module, i.e. the structure of a known
graphite sheet attached with an insulation tape, the heat
dissipation module 100 shown in FIG. 2 is disposed in a thermal
resistance measuring apparatus, and a heating process with 80 W of
heating power is performed on the attaching surface 112 to simulate
a heating scenario for the attaching surface 112 of the heat
dissipation module 100 attached to the heat generating component
200. Then, the temperatures of the attaching surface 112 and the
heat dissipating surface 114 of the heat dissipation module 100 are
measured. Similarly, the same experiment is also performed to the
known heat dissipation module, and the experiment results of the
known heat dissipation module and the heat dissipation module 100
in the present embodiment are respectively illustrated in FIG. 7
and FIG. 8, wherein T1 represents the temperature of the attaching
surface of the heat dissipation module, and T2 represents the
temperature of the heat dissipating surface of the heat dissipation
module.
[0034] Referring to both FIG. 7 and FIG. 8, it is shown in FIG. 7
that the temperature difference between the temperature T1 of the
attaching surface and the temperature T2 of the heat dissipating
surface of the known heat dissipation module is about 30.4.degree.
C. Accordingly, the thermal resistance of the known heat
dissipation module can be calculated by formula of thermal
resistance (R=(T1-T2)/Q.sub.out), and is about 0.38.degree. C./W.
On the contrary, it is shown in FIG. 8 that the temperature
difference between the temperature T1 of the attaching surface 112
and the temperature T2 of the heat dissipating surface 114 of the
heat dissipation module 100 is about 8.1.degree. C. Accordingly,
the thermal resistance of the heat dissipation module 100 can be
calculated by thermal resistance formula (R=(T1-T2)/Q.sub.out), and
is about 0.1.degree. C./W. Therefore, the heat dissipation module
100 in the present embodiment can effectively decrease the thermal
resistance along the vertical axis, and further improves the
thermal conductivity of the heat dissipation module 100 along the
vertical axis.
[0035] In sum, in the heat dissipation module of the present
disclosure, the graphite sheet includes a plurality of through
holes, and the insulating and heat conducting layer covers the
inner walls of the through holes to connect and cover the attaching
surface and the heat dissipating surface of the graphite sheet.
Under such disposition, the heat dissipation module of the present
disclosure can vertically conduct the heat generated by the heat
generating components from the attaching surface to the heat
dissipating surface through the insulating and heat conducting
layer, so as to solve the issue of poor thermal conductivity of a
known graphite sheet along the vertical axis. Therefore, the heat
dissipation module of the present disclosure not only has great
thermal conductivity along the horizontal axis (parallel to the
attaching surface), but also enhances the thermal conductivity of
the heat dissipation module along the vertical axis (the
longitudinal direction of the through holes) through the insulating
and heat conducting layer covering the through holes.
[0036] In addition, the insulating and heat conducting layer of the
present disclosure also has great insulation effect. Therefore,
owing to the insulating and heat conducting layer covering the
surface of the graphite sheet, the heat dissipation module of the
present disclosure not only enhances the thermal conductivity
thereof along the vertical direction, but also can provide
insulation effect, such that there is no need to additionally
attach an insulation tape such as polyethylene terephthalate (PET)
on the heat dissipation module. Accordingly, the present disclosure
indeed reduces the production cost of the heat dissipation module
and reduces the overall thickness of the heat dissipation module.
It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
disclosed embodiments without departing from the scope or spirit of
the disclosure. In view of the foregoing, it is intended that the
disclosure cover modifications and variations of this disclosure
provided they fall within the scope of the following claims and
their equivalents.
* * * * *