U.S. patent application number 14/956595 was filed with the patent office on 2017-06-08 for cooling a data center.
The applicant listed for this patent is Google Inc.. Invention is credited to Ron Drew, Pascal Kam, Thomas R. Kowalski, Eehern J. Wong.
Application Number | 20170164522 14/956595 |
Document ID | / |
Family ID | 57354168 |
Filed Date | 2017-06-08 |
United States Patent
Application |
20170164522 |
Kind Code |
A1 |
Wong; Eehern J. ; et
al. |
June 8, 2017 |
COOLING A DATA CENTER
Abstract
A data center cooling system includes a plurality of server
racks aligned within a row in a human-occupiable workspace of a
data center, the server racks supporting a plurality of
heat-generating computing devices; a warm air aisle positioned
adjacent the server racks opposite the human-occupiable workspace
and including a warm air inlet adjacent to a back side of the row
of server racks and a warm air outlet in fluid communication with a
warm air plenum; a plurality of cooling modules each including at
least one fan and a cooling coil; and a controller to perform
operations including controlling the plurality of fans in the
plurality of cooling modules to operate at a specified fan speed,
and controlling a plurality of valves fluidly coupled to the
plurality of cooling coils in the plurality of cooling modules to
modulate to a specified valve position.
Inventors: |
Wong; Eehern J.; (Sunnyvale,
CA) ; Kam; Pascal; (Union City, CA) ;
Kowalski; Thomas R.; (Santa Cruz, CA) ; Drew;
Ron; (Cumming, GA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Google Inc. |
Mountain View |
CA |
US |
|
|
Family ID: |
57354168 |
Appl. No.: |
14/956595 |
Filed: |
December 2, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/1492 20130101;
H05K 7/20836 20130101; H05K 7/20745 20130101; H05K 7/2079 20130101;
Y02B 30/70 20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20; H05K 7/14 20060101 H05K007/14 |
Claims
1. A data center cooling system, comprising: a plurality of server
racks aligned within a row in a human-occupiable workspace of a
data center, the server racks supporting a plurality of
heat-generating computing devices; a warm air aisle positioned
adjacent the server racks opposite the human-occupiable workspace
and comprising a warm air inlet adjacent to a back side of the row
of server racks and a warm air outlet in fluid communication with a
warm air plenum; a plurality of cooling modules each comprising at
least one fan and a cooling coil, the cooling modules positioned to
circulate a cooling airflow from the human-occupiable workspace,
through the server racks, and to the warm air aisle; and a
controller communicably coupled to each of the plurality of cooling
modules and operable to perform operations comprising: controlling
the plurality of fans in the plurality of cooling modules to
operate at a specified fan speed; and controlling a plurality of
valves fluidly coupled to the plurality of cooling coils in the
plurality of cooling modules to modulate to a specified valve
position.
2. The data center cooling system of claim 1, further comprising a
plurality of temperature sensors positioned on the plurality of
cooling modules.
3. The data center cooling system of claim 2, wherein the plurality
of temperature sensors are configured to determine a cooling coil
entering air temperature and a cooling coil leaving air
temperature.
4. The data center cooling system of claim 2, wherein the plurality
of temperature sensors are configured to determine a cooling coil
entering cooling liquid temperature and a cooling coil leaving
cooling liquid temperature.
5. The data center cooling system of claim 1, wherein controlling
the plurality of fans in the plurality of cooling modules includes
operating at the specified fan speed based, at least in part, on a
temperature of a cooling module in the plurality of cooling
modules.
6. The data center cooling system of claim 1, wherein controlling
one of the plurality of fans and the plurality of valves is based
on a differential pressure calculated across the warm air
aisle.
7. The data center cooling system of claim 1, further comprising a
plurality of filler panels configured to isolate the human
occupiable workspace from the warm air aisle.
8. The data center cooling system of claim 7, wherein the warm air
aisle is inside a heat containment structure at least partially
defined by the plurality of filler panels.
9. The data center cooling system of claim 8, further comprising a
plurality of temperature sensors coupled to the heat containment
structure.
10. The data center cooling system of claim 1, wherein controlling
the plurality of fans includes individually controlling each fan in
the plurality of fans to a specified rotational speed.
11. The data center cooling system of claim 10, wherein controlling
the plurality of fans includes actuating all the fans in the
plurality of fans together at the same speed.
12. The data center cooling system of claim 1, further comprising a
network interface communicably coupled to the controller for
remotely configuring the controller.
13. The data center cooling system of claim 1, wherein each cooling
module in the plurality of cooling modules includes a power input
interface configured for coupling to a power source and a power
output interface coupled to the controller.
14. The data center cooling system of claim 1, wherein the cooling
module includes a transformer circuit configured to convert AC
current to DC current.
15. The data center cooling system of claim 1, wherein the
transformer is configured to reduce the voltage of the AC
current.
16. The data center cooling system of claim 1, wherein the cooling
conduits of the plurality of cooling modules are serially fluidly
coupled.
17. A method for controlling a plurality of cooling modules each
comprising at least one fan and a cooling coil positioned to
circulate a cooling airflow from a human-occupiable workspace,
through a plurality of server racks, and to a warm air aisle
positioned adjacent the server racks opposite the human-occupiable
workspace and comprising a warm air inlet adjacent to a back side
of the row of server racks and a warm air outlet in fluid
communication with a warm air plenum, the method comprising:
sensing a differential pressure calculated across the warm air
aisle; controlling the plurality of fans in the plurality of
cooling modules based on the differential pressure to operate at a
specified fan speed; sensing a plurality of temperatures in the
plurality of cooling modules; and controlling a plurality of valves
fluidly coupled to the plurality of cooling coils in the plurality
of cooling modules to modulate to a specified valve position based
at least in part on the plurality of temperatures.
18. The method of claim 17, wherein sensing a plurality of
temperatures includes sensing a cooling liquid entering temperature
and a cooling liquid leaving temperature.
19. The method of claim 17, wherein sensing a plurality of
temperatures includes sensing an entering air temperature and a
leaving air temperature.
20. The method of claim 17, wherein controlling a plurality of
valves includes controlling a plurality of valves based on a water
entering temperature, a water leaving temperature, an air entering
temperature, and an air leaving temperature.
21. A data center power system, comprising: a plurality of server
racks aligned within a row in a human-occupiable workspace of a
data center, the server racks supporting a plurality of
heat-generating computing devices; a warm air aisle positioned
adjacent the server racks opposite the human-occupiable workspace
and comprising a warm air inlet adjacent to a back side of the row
of server racks and a warm air outlet in fluid communication with a
warm air plenum; a plurality of cooling modules positioned to
circulate a cooling airflow from the human-occupiable workspace,
through the server racks, and to the warm air aisle, each of the
plurality of cooling modules comprising: at least one fan; a main
power bus electrically coupled to the at least one fan and to a
main power source to receive alternating current (AC) power; and a
transformer electrically coupled with the main power bus; a control
power bus electrically coupled to each of the transformers of the
plurality of cooling modules to receive direct current (DC) power
transformed from the AC power; a controller electrically powered by
the control power bus and communicably coupled to each of the
plurality of cooling modules to control the plurality of fans in
the plurality of cooling modules to operate at a specified fan
speed.
22. The data center power system of claim 21, wherein the
controller is electrically coupled to receive DC power from a first
transformer of the plurality of transformers, through the control
power bus, independently of a loss of AC power to a second
transformer of the plurality of transformers.
23. The data center power system of claim 21, wherein at least one
sensor associated with a first cooling module is electrically
coupled to the control power bus to receive DC power from a
transformer, through the control power bus, associated with a
second cooling module.
24. The data center power system of claim 23, wherein the
controller is configured to adjust an operation of the fan
associated with the second cooling module based on a loss of power
to the sensor associated with the first cooling module.
Description
TECHNICAL FIELD
[0001] The present disclosure relates to systems and methods for
cooling data center systems and computing components.
BACKGROUND
[0002] Data centers house various computing systems and components
such as computer processors, storage systems or drives, servers,
and other computing components. A data center may take up a room in
a building, an entire building itself and may be stationary in form
or may be portable, for example housed in a shipping container. A
data center, whether stationary or portable, may also be modular.
The computer related components housed in a data center consume
significant amounts of electrical power and thereby produce
significant amounts of heat during computing and storage
operations. If the computer related components exceed certain
temperatures, the performance of the components can be compromised
and/or the components may fail. Accordingly, cooling systems are
generally implemented to maintain proper and efficient functioning
of the computer related components housed in a data center as the
components operate to transfer, process, and store data. The
cooling systems may include components configured to move fluids
such as air or liquid through various configurations and based on
varying conditions.
SUMMARY
[0003] The present disclosure describes implementations of data
center cooling systems and related apparatuses, components, and
systems. In a particular implementation, the data center cooling
system includes a plurality of server racks aligned within a row in
a human-occupiable workspace of a data center, the server racks
supporting a plurality of heat-generating computing devices; a warm
air aisle positioned adjacent the server racks opposite the
human-occupiable workspace and including a warm air inlet adjacent
to a back side of the row of server racks and a warm air outlet in
fluid communication with a warm air plenum; a plurality of cooling
modules each including at least one fan and a cooling coil, the
cooling modules positioned to circulate a cooling airflow from the
human-occupiable workspace, through the server racks, and to the
warm air aisle; and a controller communicably coupled to each of
the plurality of cooling modules and operable to perform operations
including controlling the plurality of fans in the plurality of
cooling modules to operate at a specified fan speed, and
controlling a plurality of valves fluidly coupled to the plurality
of cooling coils in the plurality of cooling modules to modulate to
a specified valve position.
[0004] An aspect combinable with this particular implementation
further includes a plurality of temperature sensors positioned on
the plurality of cooling modules.
[0005] In another aspect combinable with any of the previous
aspects, the plurality of temperature sensors are configured to
determine a cooling coil entering air temperature and a cooling
coil leaving air temperature.
[0006] In another aspect combinable with any of the previous
aspects, the plurality of temperature sensors are configured to
determine a cooling coil entering cooling liquid temperature and a
cooling coil leaving cooling liquid temperature.
[0007] In another aspect combinable with any of the previous
aspects, controlling the plurality of fans in the plurality of
cooling modules includes operating at the specified fan speed
based, at least in part, on a temperature of a cooling module in
the plurality of cooling modules.
[0008] In another aspect combinable with any of the previous
aspects, controlling one of the plurality of fans and the plurality
of valves is based on a differential pressure calculated across the
warm air aisle.
[0009] Another aspect combinable with any of the previous aspects
further includes a plurality of filler panels configured to isolate
the human occupiable workspace from the warm air aisle.
[0010] In another aspect combinable with any of the previous
aspects, the warm air aisle is inside a heat containment structure
at least partially defined by the plurality of filler panels.
[0011] Another aspect combinable with any of the previous aspects
further includes a plurality of temperature sensors coupled to the
heat containment structure.
[0012] In another aspect combinable with any of the previous
aspects, controlling the plurality of fans includes individually
controlling each fan in the plurality of fans to a specified
rotational speed.
[0013] In another aspect combinable with any of the previous
aspects, controlling the plurality of fans includes actuating all
the fans in the plurality of fans together at the same speed.
[0014] Another aspect combinable with any of the previous aspects
further includes a network interface communicably coupled to the
controller for remotely configuring the controller.
[0015] In another aspect combinable with any of the previous
aspects, each cooling module in the plurality of cooling modules
includes a power input interface configured for coupling to a power
source and a power output interface coupled to the controller.
[0016] In another aspect combinable with any of the previous
aspects, the cooling module includes a transformer circuit
configured to convert AC current to DC current.
[0017] In another aspect combinable with any of the previous
aspects, the transformer is configured to reduce the voltage of the
AC current.
[0018] In another aspect combinable with any of the previous
aspects, the cooling conduits of the plurality of cooling modules
are serially fluidly coupled.
[0019] In another particular implementation, a method for
controlling a plurality of cooling modules includes sensing a
differential pressure calculated across the warm air aisle;
controlling the plurality of fans in the plurality of cooling
modules based on the differential pressure to operate at a
specified fan speed; sensing a plurality of temperatures in the
plurality of cooling modules; and controlling a plurality of valves
fluidly coupled to the plurality of cooling coils in the plurality
of cooling modules to modulate to a specified valve position based
at least in part on the plurality of temperatures. Each module
includes at least one fan and a cooling coil positioned to
circulate a cooling airflow from a human-occupiable workspace,
through a plurality of server racks, and to a warm air aisle
positioned adjacent the server racks opposite the human-occupiable
workspace and including a warm air inlet adjacent to a back side of
the row of server racks and a warm air outlet in fluid
communication with a warm air plenum.
[0020] An aspect combinable with this particular implementation
further includes sensing a plurality of temperatures includes
sensing a cooling liquid entering temperature and a cooling liquid
leaving temperature.
[0021] In another aspect combinable with any of the previous
aspects, sensing a plurality of temperatures includes sensing an
entering air temperature and a leaving air temperature.
[0022] In another aspect combinable with any of the previous
aspects, controlling a plurality of valves includes controlling a
plurality of valves based on a water entering temperature, a water
leaving temperature, an air entering temperature, and an air
leaving temperature.
[0023] In another particular implementation, a data center power
system includes a plurality of server racks aligned within a row in
a human-occupiable workspace of a data center, the server racks
supporting a plurality of heat-generating computing devices; a warm
air aisle positioned adjacent the server racks opposite the
human-occupiable workspace and including a warm air inlet adjacent
to a back side of the row of server racks and a warm air outlet in
fluid communication with a warm air plenum; a plurality of cooling
modules positioned to circulate a cooling airflow from the
human-occupiable workspace, through the server racks, and to the
warm air aisle; a control power bus electrically coupled to each of
the transformers of the plurality of cooling modules to receive
direct current (DC) power transformed from the AC power; and a
controller electrically powered by the control power bus and
communicably coupled to each of the plurality of cooling modules to
control the plurality of fans in the plurality of cooling modules
to operate at a specified fan speed. Each of the plurality of
cooling modules includes at least one fan; a main power bus
electrically coupled to the at least one fan and to a main power
source to receive alternating current (AC) power; and a transformer
electrically coupled with the main power bus.
[0024] In an aspect combinable with this particular implementation,
the controller is electrically coupled to receive DC power from a
first transformer of the plurality of transformers, through the
control power bus, independently of a loss of AC power to a second
transformer of the plurality of transformers.
[0025] In another aspect combinable with any of the previous
aspects, at least one sensor associated with a first cooling module
is electrically coupled to the control power bus to receive DC
power from a transformer, through the control power bus, associated
with a second cooling module.
[0026] In another aspect combinable with any of the previous
aspects, the controller is configured to adjust an operation of the
fan associated with the second cooling module based on a loss of
power to the sensor associated with the first cooling module.
[0027] Implementations of the data center cooling systems described
herein may include one, some, or all of the following features. For
example, implementations permit controller powering without failure
if a power providing cooling module fail. Additionally,
implementations allow high voltage AC for powering cooling modules
to be used for powering low voltage controllers and sensors in the
absence of additional powering sockets. Furthermore,
implementations also permit scalability of single controllers for
control and monitoring of larger areas. As another example, loss of
power (e.g., main power to a fan) to one or more cooling modules
may not result in a loss of power to one or more sensors that
evaluate a health of the cooling system (or that particular cooling
module(s)), as the sensors may receive power from a controller
separate from the lost power. In some examples, loss of power
(e.g., main power to a cooling module) may seamlessly permit a
controller (e.g., for a cooling module) to be powered without
interruption from a neighboring or adjacent module. As another
example, a failure of a sensor (e.g., pressure or temperature) for
a particular cooling module may not result in failure of that
cooling module, as the desired measurement may be used from a
neighboring or adjacent sensor(s), which as a result, may
proportionally be compensated in neighboring cooling modules. In
addition, implementations permit cooling without interruption
(e.g., long enough to cause damage due to lack of cooling) even if
a cooling module were to fail due to power or controller
failures.
[0028] It should be appreciated that all combinations of the
foregoing concepts and additional concepts discussed in greater
detail below (provided such concepts are not mutually inconsistent)
are contemplated as being part of the inventive subject matter
disclosed herein. In particular, all combinations of claimed
subject matter appearing at the end of this disclosure are
contemplated as being part of the inventive subject matter
disclosed herein. It should also be appreciated that terminology
explicitly employed herein that also may appear in any disclosure
incorporated by reference should be accorded a meaning most
consistent with the particular concepts disclosed herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The skilled artisan will understand that the drawings
primarily are for illustrative purposes and are not intended to
limit the scope of the inventive subject matter described herein.
The drawings are not necessarily to scale; in some instances,
various aspects of the inventive subject matter disclosed herein
may be shown exaggerated or enlarged in the drawings to facilitate
an understanding of different features.
[0030] FIGS. 1a and 1b illustrate a data center including fan coil
units and hot containment structures, in accordance with example
implementations of data center cooling systems.
[0031] FIG. 2 shows a fan coil unit including air and water sensors
for temperature control of the fan coil unit, in accordance with
example implementations of data center cooling systems.
[0032] FIG. 3 illustrates differential pressure sensor taps and
cold aisle temperature sensors for a hot air containment structure
of example implementations of data center cooling systems.
[0033] FIG. 4 is a schematic diagram of control systems implemented
for operations of data center cooling systems, in accordance with
example implementations.
[0034] The features and advantages of the inventive concepts
disclosed herein will become more apparent from the detailed
description set forth below when taken in conjunction with the
drawings.
DETAILED DESCRIPTION
[0035] Following below are more detailed descriptions of various
concepts related to, and exemplary embodiments of, inventive
systems, methods, and components of data center cooling systems and
related apparatuses, components, and systems.
[0036] FIGS. 1a and 1b illustrate a data center including fan coil
units and hot containment structures, in accordance with example
implementations of data center cooling systems. FIG. 1a illustrates
a top view of a data center 100, which includes, but is not limited
to, a portable modular data center. The portable modular data
center may be implemented as a mobile containment structure, in
accordance with particular embodiments. The mobile containment
structure may be configured for coupling to a trailer or may
include wheels for movement by truck. In other implementations, the
data center 100 may be implemented as a stationary room or may
occupy an entire building.
[0037] FIG. 1b illustrates a perspective view of the data center
100. The data center 100 includes a plurality of server racks 102
holding a plurality of servers therein. The servers in server racks
102 may be implemented for processing, transmitting and/or storing
data. The servers may include other computing devices or components
related to the operation of the servers. The servers, computing
devices, and related components include heat-generating computing
devices that generate heat as the devices operate to process,
transmit, and store data locally and with remote computing systems.
The servers may, for example be connected to a local or remote
network and may receive and respond to various requests from the
network to retrieve, process, and/or store data. The servers may
facilitate communication over the Internet or an intranet to permit
interaction with a plurality of remote computers and to provide
requested services via applications running on the remote computers
or on the servers. Accordingly, the data center 100 includes one or
more power source for powering the servers and related components
and includes a communication interface which may be configured for
wired and wireless transmissions to and from the data center 100.
The power source may be connected to a power grid or may be
generated by batteries or an on-site generator.
[0038] The server racks 102 are positioned, at least in part, in
the cold aisle 110 with the backs of the server racks 102
positioned against a hot air containment structure 104. The hot air
containment structure 104 includes openings configured to receive
or be positioned adjacent to the backs of the server racks 102. The
cold air aisles 110 include human-occupiable workspaces of the data
center 100. Accordingly, someone servicing the data center 100 may
walk through the cold air aisle 110 to access, repair, replace,
add, or service a server or other related components positioned in
the server racks 102. The cold air aisle also provides access to
other components of the data center 100, including the cooling
components, power interfaces, power sources, and other components
and systems. In certain embodiments, each of the server racks 102
includes a plurality of server sub-assemblies, which may be
removably coupled to the server rack 102. The server racks 102 may
themselves also be configured for attachment to and removal from
the hot air containment structure.
[0039] In the illustrated embodiments, the data center 100 includes
hot air containment structures 104 positioned in rows of three;
however, the data centers 100 may include hot air containment
structures 104 configured in rows 122 including two or more hot air
containment structures 104, configured for operation with a single
programmable logic controller (PLC) panel. The single PLC panel,
includes two PLCs 108, in accordance with example implementations,
as discussed further herein. In certain implantations, each row 122
of server racks 102 provides, e.g., around 1 MW of IT load, and
includes three (3) hot air containment structures 104 positioned
between the racks 102. In other implementations, the IT load may
be, for example, 0.5 MW, 2 MW, 3 MW, 5 MW, or 7 MW.
[0040] The hot air containment structures 104 and the server racks
102 are positioned on a floor 118 of the data center 100. The floor
118 may include a sub floor of the mobile container or room, in
accordance with example implementations. The subfloor may be raised
from the actual floor and may be used to route wires, cables, or
may be used for air flow routing in certain implementations. Cold
air intake 120 is pulled through the server racks 102 from the cold
air aisle 110 into the respective hot air containment structure
104. In accordance with example embodiments, the server racks 102
and one or more filler panels and/or doors (not shown) isolate the
cold air aisle 110 from the hot air containment structure and
related hot air exhaust or return plenum. The hot air exhaust
travels up the hot air containment structure 104 and into the fan
coil units 106 via hot air ducts 112 where the hot air is cooled
and exhausted back into the cold air aisle 110 via cold air ducts
114 as discussed further herein.
[0041] In accordance with example embodiments, the fan coil units
106 cool the hot air exhaust via cooled liquid flowing through the
fan coil units 106. The fan coil units 106 include fans for drawing
hot air into the fan coil units 106. Fans of the fan coil units 106
move the hot air exhaust across cold liquid containing coils or
fins within the fan coil units 106. The fans exhaust the cooled air
into the cold air aisle 110 for reentry into the hot air
containment structure 104 so that the cooled air can continue to
cool the servers in the server racks 102. The fan coil units 106
are configured to regulate the pressure and temperature between the
cold aisles 110 and the hot aisles 116.
[0042] FIG. 2 shows a fan coil unit 106 including air and water
sensors for temperature control of the fan coil unit, in accordance
with example implementations of data center cooling systems. As
discussed further herein, a plurality of fan coil units 106 is
controlled via a single controller 108. The single controller 108
is positioned on one of the hot air containment structures 104 at
an end of the row, in certain implementations. The controller 108
is configurable via a graphical touchscreen interface, in certain
implementations. The controller 108 may also be accessed and
configured remotely via a wireless network, in certain
implementations.
[0043] The single controller 108 is configured to adjust water and
airflow rates and temperatures for a plurality of fan coil units
106. In particular, the single controller 108 is configured to
adjust water and airflow rates and temperatures for all of the fan
coil units 106 in the respective row 122 in the data center 100. As
described further herein, the fan coil units 106 in row 122 are
daisy chained, serially connected to one another by power,
communication, or both, in certain implementations. The controller
108 adjusts the water and airflow rates and temperatures for the
plurality of fan coil units 106, for example, based on the local
temperatures of each individual fan coil unit 106 in the respective
row 122. Each row 122 of fan coil units 106 may be daisy chained to
a distinct bus duct and two bus ducts may be implemented with a row
of hot air containment structures 104, in accordance with
particular implementations. Each fan coil unit 106 is coupled to a
hot air containment structure 104. In certain embodiments, the fan
coil unit 106 is coupled to the top of the hot air containment
structure 104, for example via one or more brackets or
fasteners.
[0044] As illustrated in FIG. 2, the fan coil unit 106 includes 3
electrical fans 201-203, a valve(s) 204, and an electrical box 205
communicably coupling the fans 201-203 and valve(s) 204 to
controller 108 and a plurality of pressure and temperature sensors.
The electrical fans 201-203 control the intake flow of hot air into
the fan coil unit 106 and the exhaust flow of cooled air out of the
fan coil unit 106. The cooled air is drawn past the server racks
102 for cooling the servers positioned thereon through apertures in
the hot air containment structure 104 and into the hot air
containment structure 104.
[0045] Heat is transferred from the heat generating computing
device on the server racks 102 to the cooled air as the cooled air
passes the server racks 102 and enters the hot air containment
structure 104. Accordingly, the cooled air is heated by the heat
generating computing device on the server racks 102 as it enters
the hot air containment structure 104. The cooled air is drawn into
the hot air containment structure 104 on multiple sides. The ends
of the hot air containment structure 104 may be closed via a panel,
door, or wall (e.g., 310 of FIG. 3) of the hot air containment
structure 104. The heated air is then exhausted from the hot air
containment structure 104, for example, via an exhaust duct at or
near the top of the hot air containment structure 104. The exhaust
hot air then enters the fan coil unit 106 for cooling via cold
water flowing through the fan coil unit 106.
[0046] The valve(s) 204 controls the flow of cooling water into and
out of the fan coil unit 106. The cooling water is cooled via one
or more condensers or coolers and is pumped into the fan coil unit
106 for cooling hot air exhaust received from the hot air
containment structure 104 and into the fan coil unit 106. In
certain embodiments, a refrigerant may be used instead of or in
addition to cooling water. In certain embodiments, conduits for
cooling fluid in one fan coil unit 106 is coupled to a conduit for
cooling fluid in an fan coil unit 106 coupled to another hot air
containment structure 104 positioned in the same row 122.
Accordingly, cooling fluid flows between the fan coil units 106 in
the row 122 before returning to the water cooler or condenser. The
hot air exhaust received into the fan coil unit 106 is circulated
over one or more fluid conduits or radiator fins through which the
cooling water is flowing. As the hot air exhaust flows across the
conduits containing the cooling fluid, the hot air exhaust is
cooled and exhausted from the fan coil unit 106.
[0047] The controller 108 determines and/or monitors, via a
plurality of sensors, including, but not limited to, thermistors,
the air temperature of cooled air leaving the fan coil unit 106.
The air temperature of cooled air leaving the fan coil unit 106 is
monitored via LAT (leaving air temperature) sensors 206-208. The
controller 108 determines and/or monitors, via a plurality of
sensors, including, but not limited to, thermistors, the air
temperature of hot air leaving the fan coil unit 106. The air
temperature of hot air entering the fan coil unit 106 is monitored
via, EAT (entering air temperature) sensors 211-213. The controller
108 determines and/or monitors, via a plurality of sensors,
including, but not limited to, thermistors, the water temperature
of cooling water entering the fan coil unit 106. The water
temperature of cooled water entering the fan coil unit 106 is
monitored via EWT (entering water temperature) sensor 209. The
cooling water enters via valve(s) 204. The controller 108
determines and/or monitors the water temperature of cooling water
leaving the fan coil unit 106 via valve(s) 204 by checking the LWT
(leaving water temperature) sensor 210, of water leaving the fan
coil unit 106.
[0048] In certain implementations all of the temperature sensors,
the EAT sensors 211-213, the LAT sensors 206-208, the EWT sensor
209, and the LWT sensor 210, are located on the fan coil unit 106.
In certain implementations, the controller 108 is configured to
actuate all of fans 206-208 together at the same speed. In certain
implementations, the controller 108 is configured to actuate all of
the fans 206-208 independently, whereby all of the fans of the
plurality of fan coil units 106 in the row 122 may be individually
controlled as warranted. As shown in FIG. 2, the EWT sensor 209 is
located near (or coupled to) piping coming from a condenser,
whereas the LAT sensors 206-208 are spread out near each of fans
201-203 of the fan coil unit 106. The temperature sensors 206-208
and 209 are used to control the approach temperature (LAT-EWT) by
adjusting water flow rate with the valve(s) 204 of the fan coil
unit 106. The water flow rate is adjusted independently on each fan
coil unit 106 in the row 122. The position of the valve(s) 204 is
controlled with a 2-10y analog signal through a remote sensor
box.
[0049] In certain embodiments, the fan coil unit 106 includes a
power connection in the electrical box 205. The power connection
may be coupled to a power source powering multiple fan coil units
106, for example, the fan coil units in a row 122, for power
redundancy. The power connection also permits powering all of the
supporting equipment with a single high voltage AC power input that
powers each of the fan coil units. The single high voltage AC power
is converted to low voltage DC power in the electrical box 205 for
powering the remote telemetry boxes (e.g., the remote sensor box
306 illustrated in FIG. 3), the controller 108.
[0050] In such implementations, each fan coil unit 106 is
individually powered and down converts AC power to DC power. The DC
power from each fan coil unit 106 is then recombined along a low
voltage DC bus with a diode network in order to power the remote
telemetry boxes (e.g. the remote sensor box 306 illustrated in FIG.
3) and the controller 108. This configuration permits the single
controller 108 to be powered without permitting outages to the
controller 108 in the case where any one of the fan coil units 106
in the row 122 fails. Accordingly, the remote sensors and the
controllers 108 also free up a data center power socket, which can
instead be allocated to powering a server rack 102.
[0051] For example, in some implementations, one or more individual
fan coil units 106 may lose power, such as from a blown fuse. In
such implementations, the controller 108 may remain powered since
both may be powered from the same AC bus. Further, in some
implementations, the controller 108 may include or be electrically
coupled to a back-up power source (e.g., battery, solar, flywheel,
or otherwise). Thus, even in situations where main power is lost to
the controller 108, telemetry boxes (e.g., remote sensor box 306)
may be operable and monitored, e.g., to determine or measure an
increased heat load due to operating electronic equipment (e.g.,
servers).
[0052] FIG. 3 illustrates differential pressure sensor taps and
cold aisle temperature sensors for a hot air containment structure
of example implementations of data center cooling systems. Each of
the hot air containment structures 104 includes a plurality of
sensors (e.g., thermistors) 302 for detecting temperatures in the
hot air containment structures 104. The sensors 302 are
electrically coupled to a remote sensor box 306, which is
communicably coupled to the controller 108. Each of the hot air
containment structures 104 includes plurality of differential
pressure sensors 306, which are also electrically coupled to a
remote sensor box 306, which is communicably coupled to the
controller 108. While both the thermistors 302 and the differential
pressure sensors 306 are used for monitoring, only the differential
pressure sensors are used for controlling fan speeds in the fan
coil units 106 in certain implementations. In particular, the
differential pressure sensors 302 are used to compute a
characteristic pressure for controlling the fan speeds of the fans,
206-208 of the fan coil unit 106 (which may be positioned above the
hot air containment structures 104, at ends of rows of racks, or
otherwise).
[0053] Each PLC controller 108 monitors differential pressures
across the cold aisle 110 and hot plenum 116 for the three hot
containment structures 104 in its row 122. Differential pressure
sensors 302 are located inside remote pressure sensors boxes, but
tubing 308 fans out to taps located on each upright on the hot
containment structures 104. As demonstrated in FIG. 3, the
differential pressure sensors 302 are connected via tubing
connection 308 to the cold aisle 110 and the hot air containment
structure 104 to monitor differential pressure across the cold
aisle 110 and the hot air containment structure 104. The tubing may
be coupled to an upright surface on the hot air containment
structure 104. In certain implementations, half of the pressure
sensors are routed to each of the air containment structures 104 on
each side of the air containment structure 104 and are coupled to
the controller 108. The configuration provides redundant monitoring
in the event that a single controller 108 fails. The differential
pressure sensors 302 provide sensor measurements that are combined
to create a characteristic differential pressure that is used to
control the fans 206-208 for the plurality of fan coil units 106
distributed along each row 122.
[0054] Each controller 108 is configured for controlling two sets
of control loops. The first control loop that each controller 108
is configured for controlling includes temperature control. The
temperature control may be facilitated by adjusting the valve
position to control the cooling liquid (e.g., chilled liquid,
condenser liquid, refrigerant, or otherwise) flow for each fan coil
unit 106. The second control loop that each controller 108 is
configured for controlling includes differential pressure control.
The differential pressure may be controlled by adjusting blower
speeds for all of the fan coil units 106 in the row 122 together,
in certain embodiments.
[0055] FIG. 4 is a schematic diagram of control systems implemented
for operation of a data center cooling system, in accordance with
example implementations. Airflow and temperature are controlled by
a distributed network of controllers 108, one per row of fan coil
units 106 and are located on the front face of the first hot air
containment structure 104 of that row. Each PLC controller 108
operates autonomously to satisfy its local pressure and temperature
set points, which control is based on remote pressure sensors on
the hot air containment structures 104 and temperature sensors on
the fan coil units 106 in the corresponding row. In particular
embodiments, all of the sensors, including the pressure and
temperature sensors communicate with the respective controller 108
via, e.g., Modbus RTU over RS485. As demonstrated in FIG. 4, the
pressure and temperature sensors of the hot air containment
structure 104 communicate with the controller 108 via the remote
sensor boxes 306. The temperature sensors of the fan coil units 106
also communicate with the controller 108. The controller 108
processes the sensor data from the remote sensor boxes 306 and the
fan coil units 106 sensors to control the fans and valves of the
fan coil units 106 locally.
[0056] In certain implementations, configuration of the controllers
108 may be updated over Ethernet and persistent. Accordingly, a
network connection may be implemented for configuration and optimal
control of the controllers 108. After configuration of the
controllers 108, a network connection may be further implemented,
but the data center cooling system 100 will enter a safe state if
the network connection is briefly lost.
[0057] As demonstrated in FIG. 4, a cloud based 2nd tier controller
406 (e.g., a building automation system or other main control
system) communicates dynamic set points 401 and operational
regimes, such as the approach set point 402, to each PLC controller
108 independently to balance airflow and temperature in the data
center facility as a whole, in accordance with particular
implementations. The 2nd tier controller 406 communicates the set
points to the controller 108 via network 403. The 2nd tier
controller 406 adjusts the facility monitoring infrastructure to
adjusts the set points of the local PLC controller 108 in
real-time. The objective of operation of the 2nd tier controller
406 is to handle airflow in the case of failure of a fan coil unit
106 within a share zone and to trim fan speeds. In certain
implementations, the local controllers 108 may be configured to
communicate with one another or to operate under the shared regime
of share group controller 405. The share group controller 405 is
configured to control the fan coil units in a plurality of rows
identified by share zone 404.
[0058] Share zones 404 (or share groups) are air sharing domains
where fan coil units 106 are controlled as a group with the 2nd
tier controller 406. In certain implementations, the share zones
404 are grouped in, e.g., 3 MW domains, and the share zones 404 can
be anywhere from several rows to an entire site, depending on the
control granularity and operational requirements (e.g., operating
costs, operating efficiencies, and otherwise). In some alternative
examples, the domains may provide for smaller IT loads, e.g., 0.5
MW, 1 MW, 2 MW, or greater IT loads, e.g., 1.5 MW, 4 MW, 9 MW, or
otherwise.
[0059] The 2nd tier controller 406 monitors fan speeds of all
active fan coil units 106 in a particular share zone 404 (standby
units ignored) and uses the values of those active fan coil units
to adjust local set points of the PLC controller 108. The values
are collected and set the facilities network 403, in addition to
all other monitored and configurable parameters on the PLC
controller 108.
[0060] In certain implementations, fan coil pressure controls
operate in one of the following modes: (1) a normal (auto) fan
mode, where fan speeds controlled by the PLC using a calculation of
enabled differential pressure sensors 304, (2) a manual override
mode, where failsafe conditions are manually set, (3) a controller
108 failsafe fan mode, where the fans 206-208 of each fan coil unit
106 are operated at max speed by the controller 108 in the event of
a sensor failure, (4) a fan failsafe mode, where the fan defaults
to a last open position when communication with the controller 108
is lost, and (5) an operator mode, where an operator interface is
engaged by user (for example to verify and test operations.
[0061] In certain implementations, fan coil temperature controls
operate in one of the following modes: (1) a normal (auto) valve
mode where the valves 204 are normally controlled off of the
approach setpoint, are controlled off of LAT during extremely low
LAT and high EWT conditions (adjustable), (2) and a manual override
mode, where failsafe conditions can be set, (3) a failsafe (valve
open) mode where the valve is controlled to a failsafe position,
(4) a communication failsafe (valve stops) mode where the valves
remain in their last known position if the controller 108 loses
communication with the valve 204, (5) an operator mode, where an
operator interface is enabled, for example, for verification and
testing.
[0062] Embodiments of the subject matter and the operations
described in this specification can be implemented by digital
electronic circuitry, or via computer software, firmware, or
hardware, including the structures disclosed in this specification
and their structural equivalents, or in combinations of one or more
of them. Embodiments of the subject matter described in this
specification can be implemented as one or more computer programs,
i.e., one or more modules of computer program instructions, encoded
on computer storage medium for execution by, or to control the
operation of, data processing apparatus.
[0063] A computer storage medium can be, or be included in, a
computer-readable storage device, a computer-readable storage
substrate, a random or serial access memory array or device, or a
combination of one or more of them. Moreover, while a computer
storage medium is not a propagated signal, a computer storage
medium can be a source or destination of computer program
instructions encoded in an artificially-generated propagated
signal. The computer storage medium can also be, or be included in,
one or more separate physical components or media (e.g., multiple
CDs, disks, or other storage devices).
[0064] The operations described in this specification can be
implemented as operations performed by a data processing apparatus
on data stored on one or more computer-readable storage devices or
received from other sources.
[0065] The term "data processing apparatus" encompasses all kinds
of apparatus, devices, and machines for processing data, including
by way of example a programmable processor, a computer, a system on
a chip, or multiple ones, or combinations, of the foregoing. The
apparatus can include special purpose logic circuitry, e.g., an
FPGA (field programmable gate array) or an ASIC
(application-specific integrated circuit). The apparatus can also
include, in addition to hardware, code that creates an execution
environment for the computer program in question, e.g., code that
constitutes processor firmware, a protocol stack, a database
management system, an operating system, a cross-platform runtime
environment, a virtual machine, or a combination of one or more of
them. The apparatus and execution environment can realize various
different computing model infrastructures, such as web services,
distributed computing and grid computing infrastructures.
[0066] A computer program (also known as a program, software,
software application, script, or code) can be written in any form
of programming language, including compiled or interpreted
languages, declarative or procedural languages, and it can be
deployed in any form, including as a stand-alone program or as a
module, component, subroutine, object, or other unit suitable for
use in a computing environment. A computer program may, but need
not, correspond to a file in a file system. A program can be stored
in a portion of a file that holds other programs or data (e.g., one
or more scripts stored in a markup language document), in a single
file dedicated to the program in question, or in multiple
coordinated files (e.g., files that store one or more modules,
sub-programs, or portions of code). A computer program can be
deployed to be executed on one computer or on multiple computers
that are located at one site or distributed across multiple sites
and interconnected by a communication network.
[0067] The processes and logic flows described in this
specification can be performed by one or more programmable
processors executing one or more computer programs to perform
actions by operating on input data and generating output. The
processes and logic flows can also be performed by, and apparatus
can also be implemented as, special purpose logic circuitry, e.g.,
a FPGA (field programmable gate array) or an ASIC
(application-specific integrated circuit).
[0068] Processors suitable for the execution of a computer program
include, by way of example, both general and special purpose
microprocessors, and any one or more processors of any kind of
digital computer. Generally, a processor will receive instructions
and data from a read-only memory or a random access memory or both.
The essential elements of a computer are a processor for performing
actions in accordance with instructions and one or more memory
devices for storing instructions and data. Generally, a computer
will also include, or be operatively coupled to receive data from
or transfer data to, or both, one or more mass storage devices for
storing data, e.g., magnetic, magneto-optical disks, or optical
disks. However, a computer need not have such devices. Moreover, a
computer can be embedded in another device, e.g., a mobile
telephone, a personal digital assistant (PDA), a mobile audio or
video player, a game console, a Global Positioning System (GPS)
receiver, or a portable storage device (e.g., a universal serial
bus (USB) flash drive), to name just a few. Devices suitable for
storing computer program instructions and data include all forms of
non-volatile memory, media and memory devices, including by way of
example semiconductor memory devices, e.g., EPROM, EEPROM, and
flash memory devices; magnetic disks, e.g., internal hard disks or
removable disks; magneto-optical disks; and CD-ROM and DVD-ROM
disks. The processor and the memory can be supplemented by, or
incorporated in, special purpose logic circuitry.
[0069] To provide for interaction with a user, embodiments of the
subject matter described in this specification can be implemented
on a computer having a display device, e.g., a CRT (cathode ray
tube) or LCD (liquid crystal display) monitor, for displaying
information to the user and a keyboard and a pointing device, e.g.,
a mouse or a trackball, by which the user can provide input to the
computer. Other kinds of devices can be used to provide for
interaction with a user as well; for example, feedback provided to
the user can be any form of sensory feedback, e.g., visual
feedback, auditory feedback, or tactile feedback; and input from
the user can be received in any form, including acoustic, speech,
or tactile input. In addition, a computer can interact with a user
by sending documents to and receiving documents from a device that
is used by the user; for example, by sending web pages to a web
browser on a user's user device in response to requests received
from the web browser.
[0070] Embodiments of the subject matter described in this
specification can be implemented in a computing system that
includes a back-end component, e.g., as a data server, or that
includes a middleware component, e.g., an application server, or
that includes a front-end component, e.g., a user computer having a
graphical display or a Web browser through which a user can
interact with an implementation of the subject matter described in
this specification, or any combination of one or more such
back-end, middleware, or front-end components. The components of
the system can be interconnected by any form or medium of digital
data communication, e.g., a communication network. Examples of
communication networks include a local area network ("LAN") and a
wide area network ("WAN"), an inter-network (e.g., the Internet),
and peer-to-peer networks (e.g., ad hoc peer-to-peer networks).
[0071] The computing system can include users and servers. A user
and server are generally remote from each other and typically
interact through a communication network. The relationship of user
and server arises by virtue of computer programs running on the
respective computers and having a user-server relationship to each
other. In some embodiments, a server transmits data (e.g., an HTML
page) to a user device (e.g., for purposes of displaying data to
and receiving user input from a user interacting with the user
device). Data generated at the user device (e.g., a result of the
user interaction) can be received from the user device at the
server.
[0072] While this specification contains many specific
implementation details, these should not be construed as
limitations on the scope of any inventions or of what may be
claimed, but rather as descriptions of features specific to
particular embodiments of particular inventions. Certain features
that are described in this specification in the context of separate
embodiments can also be implemented in combination in a single
embodiment. Conversely, various features that are described in the
context of a single embodiment can also be implemented in multiple
embodiments separately or in any suitable sub combination.
Moreover, although features may be described above as acting in
certain combinations and even initially claimed as such, one or
more features from a claimed combination can in some cases be
excised from the combination, and the claimed combination may be
directed to a sub combination or variation of a sub
combination.
[0073] For the purpose of this disclosure, the term "coupled" means
the joining of two members directly or indirectly to one another.
Such joining may be stationary or moveable in nature. Such joining
may be achieved with the two members or the two members and any
additional intermediate members being integrally formed as a single
unitary body with one another or with the two members or the two
members and any additional intermediate members being attached to
one another. Such joining may be permanent in nature or may be
removable or releasable in nature.
[0074] It should be noted that the orientation of various elements
may differ according to other exemplary embodiments, and that such
variations are intended to be encompassed by the present
disclosure. It is recognized that features of the disclosed
embodiments can be incorporated into other disclosed
embodiments.
[0075] While various inventive embodiments have been described and
illustrated herein, those of ordinary skill in the art will readily
envision a variety of other means and/or structures for performing
the function and/or obtaining the results and/or one or more of the
advantages described herein, and each of such variations and/or
modifications is deemed to be within the scope of the inventive
embodiments described herein. More generally, those skilled in the
art will readily appreciate that all parameters, dimensions,
materials, and configurations described herein are meant to be
exemplary and that the actual parameters, dimensions, materials,
and/or configurations will depend upon the specific application or
applications for which the inventive teachings is/are used. Those
skilled in the art will recognize, or be able to ascertain using no
more than routine experimentation, many equivalents to the specific
inventive embodiments described herein. It is, therefore, to be
understood that the foregoing embodiments are presented by way of
example only and that, within the scope of the appended claims and
equivalents thereto, inventive embodiments may be practiced
otherwise than as specifically described and claimed. Inventive
embodiments of the present disclosure are directed to each
individual feature, system, article, material, kit, and/or method
described herein. In addition, any combination of two or more such
features, systems, articles, materials, kits, and/or methods, if
such features, systems, articles, materials, kits, and/or methods
are not mutually inconsistent, is included within the inventive
scope of the present disclosure.
[0076] Also, the technology described herein may be embodied as a
method, of which at least one example has been provided. The acts
performed as part of the method may be ordered in any suitable way.
Accordingly, embodiments may be constructed in which acts are
performed in an order different than illustrated, which may include
performing some acts simultaneously, even though shown as
sequential acts in illustrative embodiments.
[0077] The claims should not be read as limited to the described
order or elements unless stated to that effect. It should be
understood that various changes in form and detail may be made by
one of ordinary skill in the art without departing from the spirit
and scope of the appended claims. All embodiments that come within
the spirit and scope of the following claims and equivalents
thereto are claimed.
* * * * *