U.S. patent application number 15/431148 was filed with the patent office on 2017-06-08 for wavelength mixing optical component.
This patent application is currently assigned to Radiant Choice Limited. The applicant listed for this patent is Radiant Choice Limited. Invention is credited to Nguyen The Tran, Jiun-Pyung You.
Application Number | 20170159896 15/431148 |
Document ID | / |
Family ID | 54930319 |
Filed Date | 2017-06-08 |
United States Patent
Application |
20170159896 |
Kind Code |
A1 |
Tran; Nguyen The ; et
al. |
June 8, 2017 |
WAVELENGTH MIXING OPTICAL COMPONENT
Abstract
The present disclosure includes an optical component including
one or more microstructures configured to diffuse light incident
thereto from within the optical component. The microstructures are
provided at least on a light input surface of the optical component
provided in a bottom cavity of its body.
Inventors: |
Tran; Nguyen The; (Garden
Grove, CA) ; You; Jiun-Pyung; (Irvine, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Radiant Choice Limited |
Victoria |
|
SC |
|
|
Assignee: |
Radiant Choice Limited
Victoria
SC
|
Family ID: |
54930319 |
Appl. No.: |
15/431148 |
Filed: |
February 13, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14694850 |
Apr 23, 2015 |
9568768 |
|
|
15431148 |
|
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62018544 |
Jun 28, 2014 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G02F 1/133606 20130101;
F21K 9/65 20160801; G02B 17/00 20130101; F21V 5/002 20130101; F21V
3/02 20130101; G02F 1/133603 20130101; F21V 29/70 20150115; F21Y
2115/10 20160801; F21V 7/00 20130101 |
International
Class: |
F21K 9/65 20060101
F21K009/65; F21V 3/02 20060101 F21V003/02; F21V 5/00 20060101
F21V005/00; F21V 29/70 20060101 F21V029/70; F21V 7/00 20060101
F21V007/00; F21V 23/00 20060101 F21V023/00 |
Claims
1. An optical apparatus for use with a light source comprising at
least one light emitting diode (LED).
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] Any and all applications for which a foreign or domestic
priority claim is identified in the Application Data Sheet as filed
with the present application are hereby incorporated by reference
under 37 CFR 1.57.
BACKGROUND
[0002] Field
[0003] The present disclosure generally relates to optical
components and systems that redistribute light emitted from a light
source and, in particular for use with a light emitting diode.
[0004] Background
[0005] In many applications that use light emitting diode (LED)
emitters as light sources, optical components, such as, for
example, lenses, diffusers, reflectors, redirectors, etc. can be
used to tailor the radiation pattern of the light emitted from the
LED. In various implementations, a light source can include an
array of LEDs. In such implementations, an array of optical
components can be disposed over the array of LEDs such that each
optical component in the array of optical components surrounds a
corresponding LED in the array of LEDs to illuminate a large area
of interest.
[0006] Recently, there is a demand for illumination panels that
have a slim/thin profile and including fewer LEDs to reduce cost.
Optical components that can achieve a desired luminance over an
area with fewer LEDs can provide illumination panels with thin
profile at a low cost.
[0007] Slim illumination panels utilizing white LEDs can also
suffer from color non-uniformity. Accordingly, it is desirable to
provide optical components that can mix different wavelengths of
light emitted from white LEDs in order to reduce color
non-uniformity. The foregoing discussion in this section is to
provide background to the subject matter disclosed herein and does
not constitute an admission of prior art.
SUMMARY
[0008] The systems, methods and devices of this disclosure each
have several innovative aspects, no single one of which is solely
responsible for the desirable attributes disclosed herein.
[0009] Various embodiments described herein comprise an optical
component that can be used to spread light from a LED emitter over
a wide angular range and simultaneously mix different wavelengths
of light emitted from the LED emitter to achieve color uniformity.
The embodiments of the optical component described herein can be
used to redistribute light emitted from a LED emitter over a
desired area of illumination such that the radiation pattern over
illumination area is uniform. For example, in various
implementations, the light intensity can be nearly constant across
the illumination area. In various implementations, the optical
component can be configured to reduce one or more peaks in the
light intensity distribution to achieve a more uniform light
distribution across an illumination surface.
[0010] The embodiments of optical elements described herein
comprise one or more textured surfaces that can scatter and/or
diffuse different wavelengths of light emitted from a LED emitter
so as to mix the different wavelengths of light in the near field
of the optical component and/or in the far field. In various
implementations, the textured surfaces can include a plurality of
microstructures. The plurality of microstructures can include
grooves, protrusions, facets, surface or volume holograms, etc. The
plurality of microstructures can be arranged to form a regular or
an irregular pattern or can be arranged randomly.
[0011] Various embodiments described herein comprise an
illumination device comprising a LED emitter and an optical
component disposed over the LED. In various implementations, a
reflector and/or a printed circuit board (PCB) can be integrated
with a base of the optical component. The printed circuit board can
be reflective. The reflectivity of the reflector and/or the PCB can
affect the intensity of light in the region of the illumination
surface directly overhead the optical component. Accordingly, the
intensity of light across the illumination surface can be tailored
by adjusting the reflectivity of the reflector and/or PCB
integrated with the optical component. In various implementations,
the reflector can be a diffused reflector. In various
implementations, the surface of the reflector and/or the PCB
adjacent the optical component can be textured to mix different
wavelengths of light and/or to spread the light output from the
optical component uniformly across the illumination surface. The
optical component or the optical components in array are configured
to distribute light emitted from the LED emitter uniformly over a
wide angular range and simultaneously mix different wavelengths of
light emitted from the LED emitter to achieve color uniformity. The
illumination device can be included in a backlight with a thin
profile or a slim profile architectural lighting panel to provide
illumination to an illumination panel disposed at a distance from
the LED emitter. Various implementations described herein can be
used for backlighting in direct type or direct-lit display and
liquid crystal display applications and for panel lighting
applications. Various implementations of the illumination device
can be included in a backlight with a thin profile or a slim
profile architectural lighting panel.
[0012] One innovative aspect of the subject matter described in
this disclosure can be implemented in an optical apparatus for use
with a light source comprising at least one light emitting diode
(LED). The apparatus comprises a single-piece, light-transmitting
body comprising a top, a bottom and a side interconnecting the top
and the bottom. An imaginary central axis of the body passes
through the top and the bottom and does not pass through the side.
The apparatus comprises at least one top curved surface formed on
the top of the body and a bottom cavity formed into the body in a
central portion of the bottom such that the central axis passes
through the bottom cavity. The bottom cavity can be arranged
relative to the light source such that the light source is placed
under the bottom cavity and the central axis passes through the
light source along with the top and bottom cavity. The bottom
cavity can comprise at least one light input surface configured to
receive light beams from the light source that are not reflected
while propagating from the light source to the at least one light
input surface when the bottom cavity and the light source are so
arranged. The apparatus further comprises microstructures
configured to diffuse light beams incident thereto and formed on
the bottom of the body. The microstructures can be formed on the at
least one light input surface of the bottom cavity. The bottom
cavity can comprise a central portion and a peripheral portion. The
central axis can pass through the central portion and the
peripheral portion can be located around the central portion when
viewed from the top along the central axis. The microstructures can
be formed on the peripheral portion of the bottom cavity and not
formed on the central portion of the bottom cavity.
[0013] The height of the body can be between about 3 mm to about 7
mm. The microstructures can be formed on the peripheral portion of
the bottom cavity located at a distance between about 5 mm to about
9 mm from the central axis along a radial direction. The bottom
comprises a bottom peripheral surface provided on the bottom around
the bottom cavity when viewed from the top along the central axis,
wherein the microstructures are formed on the bottom peripheral
surface. In various implementations, a first bottom peripheral
surface and a second bottom peripheral surface can be provided on
the bottom around the bottom cavity. The first bottom peripheral
surface can be interposed between the second bottom peripheral
surface and the bottom cavity when viewed from the top along the
central axis. In such implementations, the microstructures can be
formed on the second bottom peripheral surface and are not formed
on the first bottom peripheral surface. The second bottom
peripheral surface with the microstructures can be inclined
relative to an imaginary plane that is perpendicular to the central
axis such that a first point on the second bottom peripheral
surface closer to the central axis in a radial direction is raised
relative to a second point on the second bottom peripheral surface
farther from the central axis in a radial direction. The
inclination of the second bottom peripheral surface can be
generally symmetrical relative to the central axis. The apparatus
can further comprise additional microstructures configured to
diffuse light beams incident thereto and formed on a side surface
of the side of the body. The side surface can comprise a first
portion generally facing away from the bottom cavity in a direction
along the central axis and a second portion generally facing away
from the bottom cavity in radial directions from the central axis.
In various implementations, the first and second portions can be
immediately neighboring with each other. Additional microstructures
can be disposed on both the first and second portions.
[0014] The microstructures can comprise a first microstructure that
provides a plurality of micro-surfaces having different tangential
planes, which can allow two or more parallel light beams incident
on the first microstructure to reach different micro-surfaces of
the first microstructure such that two or more parallel light beams
can exit the first microstructure in different directions. All or
part of the plurality of micro-surfaces can be continuously curved
with or discretely separated from their immediately neighboring
micro-surfaces.
[0015] In implementations where the light source is placed under
the bottom cavity and the central axis passes through the light
source along with the top and bottom cavity, the apparatus is
configured to provide illumination characteristics such that at an
optical distance within a range of 10-30 mm, an average correlated
color temperature in a first region within 10 mm from the central
axis is within about .+-.20% of an average correlated color
temperature in a second region between 10 and 40 mm from the
central axis.
[0016] In implementations where the light source is placed under
the bottom cavity and the central axis passes through the light
source along with the top and bottom cavity, the apparatus is
configured to provide illumination characteristics such that a
correlated color temperature is between 20000 K and 60000 K at an
optical distance in a range of 10-30 mm.
[0017] In implementations where the light source is placed under
the bottom cavity and the central axis passes through the light
source along with the top and bottom cavity, the apparatus is
configured to provide illumination characteristics such that at an
optical distance between 10-30 mm, variation of correlated color
temperature is less than 30% from the maximum correlated color
temperature.
[0018] The apparatus can be incorporated in an illumination device
comprising a light source comprising at least one light emitting
diode (LED). The light source can be arranged relative to the
apparatus such that the central axis passes the light source and
light beams emitted from the light source are directed to the at
least one light input surface without reflection before reaching
the at least one light input surface. The illumination device can
have illumination characteristics such that at an optical distance
in a range of 10-30 mm, an average color temperature is within
about .+-.20% of an average correlated color temperature of the at
least one light emitting diode. The illumination device can have
illumination characteristics such that a correlated color
temperature at an optical distance in a range of 10-30 mm is
between 60000 K and 20000 K.
[0019] A plurality of the illumination devices can be incorporated
in an illumination system. In various implementations of the
illumination system, the plurality of illumination devices can be
aligned to form a linear arrangement or an array. The illumination
system can be included in a back lighting unit of an LCD display
panel. The LCD display panel can be incorporated in a consumer
electronic device.
[0020] One innovative aspect of the subject matter described in
this disclosure can be implemented in an illumination device
comprising a light source configured to emit light at a plurality
of wavelengths from a light emitting surface; and an optical
component comprising a body. The body comprises a top surface; a
side surface; a bottom surface; and a cavity accessible through an
opening in the bottom surface, the cavity extending through the
body and bounded by an inner surface, the inner portion comprising
a plurality of microstructures such that the plurality of
wavelengths light are scattered randomly in different direction
when incident on the inner surface. The optical component is
configured to redirect output light from the light source over an
area of illumination. In various implementations, the device can
comprise a reflector disposed adjacent the bottom surface of the
optical component. The reflector can comprise a plurality of
microstructures. The reflector can have a reflectivity configured
to reduce variation in the correlated color temperature,
illuminance and/or intensity of the output light.
[0021] In various implementations, at least a portion of the side
surface can comprise a plurality of microstructures. At least a
portion of the bottom surface can comprise a plurality of
microstructures. At least a portion of the top surface can comprise
a plurality of microstructures. The device can further include an
annular structure disposed about the side surface. The device can
further include a bottom panel and a top panel, wherein the LED is
disposed on the bottom panel and light emitted from the optical
element is incident on the top panel. The distance between the
bottom panel and the top panel can be less than about 25 mm. The
device can be configured as a backlight for a display device,
wherein the top panel forms a portion of the display panel. The
device can be configured as a lighting device.
[0022] One innovative aspect of the subject matter described in
this disclosure can be implemented in an optical component
comprising a body. The body comprises a top curved surface disposed
about a central axis, the top surface comprising a central portion
and a peripheral portion surrounding the central portion; a bottom
surface opposite the top surface, the bottom surface comprising a
central region and a peripheral region surrounding central region,
the central region including an opening defining an inner cavity
that extends through the body of the optical element toward top
surface, the inner cavity bounded by a curved inner surface; and a
side surface extending from the top surface to the bottom surface.
At least a portion of the inner surface comprises a plurality of
microstructures. A peripheral region of the bottom surface can be
inclined away from the top surface such that the peripheral region
is at an angle with respect to the central region.
[0023] In various implementations, the optical component can
include a reflector disposed adjacent the bottom surface of the
optical component. The reflector can comprise a plurality of
microstructures. In various implementations, the reflector can be
configured as a diffuser. At least a portion of the peripheral
region can comprise a plurality of microstructures. In various
implementations, a slope of a tangential line to the top surface in
the central portion has an opposite sign from a slope of a
tangential line to the top surface in the peripheral portion. At
least a portion of the top surface can comprise a plurality of
microstructures. The optical component can further comprise an
annular structure disposed about the side surface. In various
implementations, at least one surface of the annular structure can
comprise a plurality of microstructures.
[0024] Details of one or more implementations of the subject matter
described in this disclosure are set forth in the accompanying
drawings and the description below. Other features, aspects, and
advantages will become apparent from the description, the drawings
and the claims. Note that the relative dimensions of the following
figures may not be drawn to scale.
BRIEF DESCRIPTION OF THE DRAWINGS
[0025] FIG. 1A illustrates a partially sectioned isometric view of
an optical component configured to spread light emitted from a LED
emitter.
[0026] FIG. 1B illustrates a different partially sectioned
isometric view of the embodiment of the optical element illustrated
in FIG. 1A.
[0027] FIG. 1C illustrates an isometric view of the embodiment of
the optical component shown in FIG. 1A.
[0028] FIG. 2 illustrates a side-view of the optical component
illustrated in FIG. 1A disposed over a LED emitter.
[0029] FIG. 3 illustrates a side-view of an embodiment of an
optical component configured to mix different wavelengths of light
emitted from a LED emitter and/or reduce peaks in the intensity
distribution of light emitted from a LED emitter.
[0030] FIG. 4 illustrates a side-view of another embodiment of an
optical component configured to mix different wavelengths of light
emitted from a LED emitter and/or reduce peaks in the intensity
distribution of light emitted from a LED emitter.
[0031] FIG. 5 illustrates a cross sectional view of a light bar
including an array of LED emitters and an array of optical
components.
[0032] FIG. 6A illustrates the variation in the correlated color
temperature (CCT) across an illumination surface disposed at a
distance from an illumination system comprising a LED emitter. FIG.
6B illustrates the variation in the correlated color temperature
(CCT) across the illumination surface disposed at a distance from
an illumination system comprising a LED emitter and an
implementation of a color mixing optical component as described
herein.
[0033] Like reference numbers and designations in the various
drawings indicate like elements.
DETAILED DESCRIPTION
[0034] The following detailed description is directed to certain
implementations for the purposes of describing the innovative
aspects. However, the teachings herein can be applied in a
multitude of different ways. As will be apparent from the following
description, the innovative aspects may be implemented in any
device that is configured to provide illumination. More
particularly, it is contemplated that the innovative aspects may be
implemented in illumination systems, such as, a thin backlight
and/or a frontlight unit configured to provide illumination to
various display devices, such as, for example liquid crystal based
display devices or LED based display devices. The described
implementations may be implemented in any device, apparatus, or
system that can be configured to display moving images, such as
video, still images, such as photographs, text, graphics, and/or
pictures. More particularly, it is contemplated that the described
implementations may be included in or associated with a variety of
electronic devices such as, but not limited to: mobile telephones,
smart phones, multimedia Internet enabled cellular telephones,
mobile television receivers, wireless devices, Bluetooth.RTM.
devices, personal data assistants (PDAs), wireless electronic mail
receivers, hand-held or portable computers, tablets, netbooks,
notebooks, smartbooks, tablets, printers, copiers, scanners,
facsimile devices, global positioning system (GPS)
receivers/navigators, cameras, digital media players (such as MP3
players), camcorders, game consoles, wrist watches, clocks,
calculators, television monitors, flat panel displays, electronic
reading devices (e.g., e-readers), computer monitors, auto displays
(including odometer and speedometer displays, etc.), cockpit
controls and/or displays, camera view displays (such as the display
of a rear view camera in a vehicle), electronic photographs,
electronic billboards or signs, projectors, architectural
structures, microwaves, refrigerators, stereo systems, cassette
recorders or players, DVD players, CD players, VCRs, washers,
dryers, washer/dryers, parking meters, billboards, signage, etc.
Additionally, innovative aspects may be implemented in thin
illumination systems and/or luminaires for commercial and/or
residential lighting applications. For example, the embodiments
described herein can be configured as slim profile lighting devices
that can be incorporated in or used as a building material, such
as, for example, walls, floors, ceilings of residential and
commercial structures. Other uses are also possible.
[0035] Various embodiments of an optical component are described
herein with reference to the accompanying figures. The terminology
used in the description presented herein is not intended to be
interpreted in any limited or restrictive manner, simply because it
is being utilized in conjunction with a detailed description of
certain specific embodiments. Furthermore, various embodiments of
the optical component described herein can comprise several
features, no single one of which is solely responsible for its
desirable attributes or which is essential to achieve the light
distribution profiles described herein.
[0036] The terms bottom, top and side are used in the present
disclosure to designate or identify certain features described in
the various implementations. However, these terms are used only to
define relative positions of such features and should not be
interpreted as carrying any meaning other than the relativity of
positons of features reciting these terms.
[0037] Various embodiments of an optical component described herein
can be configured to redistribute light emitted from a LED emitter.
For example, the implementations of the optical component described
herein can be configured to uniformly spread light emitted from the
LED emitter over a wide angular range. Furthermore, the
implementations of the optical component described herein can also
be used to mix different wavelengths of light emitted from the LED
emitter such that a high degree of color uniformity is achieved in
the near field as well as the far field. Additionally, the
implementations of the optical component described herein can also
be configured to reduce peaks in the intensity distribution of
light emitted from the LED emitter over an area of illumination
such that the light intensity is nearly constant across the
illumination area.
[0038] Various implementations described herein include a light bar
including a plurality of LED emitters, each LED emitter associated
with an optical component configured to tailor the radiation
pattern of light emitted from the LED emitter to a desired
radiation pattern. For example, the optical component associated
with each LED emitter may be configured to spread the light emitted
from the LED uniformly over a wide angular, reduce peaks in the
intensity distribution of light emitted from the LED emitter and/or
mix the different wavelengths emitted from the LED to reduce color
non-uniformity.
LED Emitter
[0039] A light emitting diode (LED) is a semiconductor device that
emits light in ultraviolet, visible and/or infrared wavelengths.
Recent advances in semiconductor technology has led to the
development of LEDs with high luminous efficacy that can generate
light having the same amount of luminous flux as a standard 60 W or
100 W incandescent or fluorescent bulb with no more than 1 W of
electrical power. LED emitters with high luminous efficacy can be
miniaturized to have a size less than 10 mm such that they can be
mounted on a printed circuit board (PCB) using semiconductor
packaging techniques. The PCB can include driving circuits to
supply required electrical current and voltage to the LED emitters.
In various implementations, the PCB can also include heat sink
and/or thermo-coolers to cool the LED emitters. Accordingly, a thin
array of LED emitters that can provide a large amount of luminous
flux using a small amount of electrical power can be manufactured.
Such thin arrays of LED emitters are in great demand for a variety
of display applications and/or lighting applications.
[0040] Early LED emitters primarily emitted light in the red and/or
the infrared spectral range. However, recent developments in
semiconductor technology have led to the development of LED
emitters that can emit light in different regions of the
ultraviolet (UV), visible and infrared (IR) spectrum. For example,
LED emitters that can emit in the blue and violet regions of the
visible spectrum have been developed recently. LED emitters that
emit white light have also been developed. White LED (WLED)
emitters can be realized in one of two ways. One method of
producing a WLED emitter is to use LED emitters that emit
contrasting colors and mix the contrasting colors. For example, a
WLED emitter can include a cyan LED emitter and a yellow LED
emitter such that light output from the cyan LED emitter and the
yellow LED emitter are mixed to produce white light. As another
example, a WLED emitter can include a red LED emitter, a green LED
emitter and a blue LED emitter such that light output from the red,
green and blue LED emitters can be mixed to produce white light.
Another method of producing a WLED emitter is to use phosphor
material that absorbs radiation and emits a white light. For
example, a WLED emitted can include a RGB phosphor and a near-UV or
a UV LED. The RGB phosphor can absorb the radiation from the
near-UV or UV LED and emit a broad spectrum white light. As another
example, a WLED emitted can include a yellow phosphor and a blue
LED. The yellow phosphor can absorb the radiation from the blue LED
and emit a broad spectrum white light.
[0041] LED emitters are desirable in backlights and frontlights for
display devices as well as in lighting due to their high luminous
efficacy, long lifetimes, low manufacturing cost and
miniaturization capabilities.
[0042] LED emitters can generally be divided into two classes:
side-emitting emitters and top-emitting emitters. In top-emitting
LED emitters, light is emitted along a direction perpendicular to
the surface of the LED emitter. In side-emitting LED emitters,
light is emitted along a direction parallel to the surface of the
LED. Most top-emitting LED emitters exhibit a Lambertian emission
pattern, where the intensity profile is proportional to the cosine
of the emission angle, which is measured from a normal to the
surface of the LED emitter.
[0043] LED emitters usually emit light from a small area. For
example, the emission area can be less than 1 mm.sup.2. Thus,
optical components that can reflect, refract collimate, focus,
diffuse and/or diffract light are integrated with the LED emitter
to tailor the pattern of radiation emitted from the LED
emitter.
[0044] Conventional optical elements that are configured to collect
light from WLED emitters may not be capable of mixing the different
wavelengths of light efficiently which may result in color
non-uniformity at the illumination surface and/or at the surface of
the optical component. For example, average correlated color
temperature in a central portion of the illuminated region may be
different than the average correlated color temperature in a
peripheral portion of the illuminated region. Moreover, the average
correlated color temperature in various portions of the illuminated
region may be lower than the average color temperature of the LED
emitter. Accordingly, it would be desirable to provide optical
components that can spread light from LED emitters uniformly and/or
monotonically and/or with higher degree of color uniformity.
[0045] Various implementations of light spreading and/or color
mixing optical components described herein include one or more
textured light input surfaces that are configured to receive
different wavelengths of light emitted from the LED emitter and
redirect the different wavelengths of light such that light output
from the optical component and incident on an illumination surface
disposed at an optical distance between about 10-30 mm has a high
degree of color uniformity. For example, various implementations of
optical component described herein include one or more textured
light input surfaces that are configured to spatially mix different
wavelengths of light emitted from the LED emitter such that a
variation between a maximum correlated color temperature (CCT) and
a minimum CCT is less than 60% of the maximum CCT. As another
example, various implementations of optical component described
herein include one or more textured light input surfaces that are
configured to spatially mix different wavelengths of light emitted
from the LED emitter such that an average CCT across the
illumination surface is substantially similar to the average CCT of
the LED emitter.
[0046] In various implementations of the light spreading and/or
color mixing optical components described herein, one or more
output surfaces can also be textured to improve color uniformity
and/or to distribute light uniformly across the illumination
surface.
Light Spreading and Color Mixing Optical Component
[0047] FIG. 1A illustrates a partially sectioned isometric view of
an embodiment of an optical component 10 configured to spread light
emitted from a LED emitter as well as mix different wavelengths of
light emitted from the LED emitter. In various implementations, the
optical component 10 can be configured to spread light emitted from
the LED emitter uniformly across an illumination panel such that
the intensity of light across the illumination panel is nearly
constant. In various implementations, the optical component 10 can
be configured to spread light emitted from the LED emitter across
an illumination panel such that the such that the illuminance in a
region located at a distance less than or equal to about 25 mm from
a point where the central axis normal to the optical component
intersects the panel is greater than 75% of the maximum illuminance
on the illumination panel, when an area about the point where the
central axis of the optical component intersects the illumination
surface where the illuminance from a single LED coupled to the
optical component falls to about 50% of the maximum illuminance is
at least about 80 square cm (cm.sup.2). In various implementations,
the optical component 10 can be configured such that the
illuminance in a region located at a distance less than or equal to
about 10 mm from a central axis normal to the optical component is
greater than 80% of the maximum illuminance on the illumination
panel. In various implementations, the optical component 10 can be
configured such that the illuminance in a region located at a
distance between about 20 mm and about 50 mm from a central axis
normal to the optical component is between about 50% and about 90%
of the maximum illuminance on the illumination panel. Without
subscribing to any theory, as used herein, illuminance is a measure
of the luminous flux incident per unit area of an illumination
surface and can be correlated with the intensity of light incident
per unit area of the illumination surface. In various
implementations, the illuminance across the surface can be measured
using a lux meter.
[0048] FIG. 1B illustrates a different partially sectioned
isometric view of the embodiment of the optical element illustrated
in FIG. 1A and FIG. 1C illustrates an isometric view of the
embodiment of the optical component shown in FIG. 1A.
[0049] The optical component 10 can be disposed about a central
axis 11. In various implementations, the optical component 10 can
be rotationally symmetric about the central axis 11. Without any
loss of generality, a direction along the central axis 11 can
represent the vertical direction and a direction perpendicular to
the central axis 11 can represent the horizontal direction. In
implementations of the optical component 10 having a circular
cross-section in a plane perpendicular to the central axis 11, the
central axis 11 can pass through the center of the circular
cross-section. In various implementations of the optical component
10, the central axis 11 can pass through the centroid of the
optical component 10. In various implementations of the optical
component 10, the central axis 11 can pass through a geometric
center of the optical component 10.
[0050] Various implementations of the optical component 10
comprises a top surface 12, an inner cavity 13 bounded by an inner
surface 13a, a bottom surface 19 opposite the top surface 12 and a
side surface 17 joining the bottom surface 19 and the top surface
12. In various implementations, the optical component 10 can
include one or more supporting posts 18 disposed along the bottom
surface 19. The optical component 10 can be integrated with a
reflector. For example, the optical component 10 can be disposed on
the reflector such that the bottom surface 19 is adjacent the
reflector. The reflector can comprise an opening that is configured
to allow light from the LED emitter to be coupled into the optical
component. The LED emitter can be disposed on a printed circuit
board (PCB). In various implementations, one or more surfaces of
the PCB adjacent the bottom surface 19 of the optical component 10
can be reflective. In such implementations, the reflective surface
of the PCB can function as the reflector. Accordingly, a reflector
need not be integrated with the bottom surface 19 of the optical
component 10 in such implementations. The reflectivity of the
reflector can affect the intensity of light in the region of the
illumination surface directly overhead the optical component.
Accordingly, the intensity of light across the illumination surface
can be tailored by adjusting the reflectivity of the reflector
integrated with the optical component 10. In various
implementations, the reflector can be a diffused reflector. In
various implementations, the surface of the reflector and/or the
PCB adjacent the optical component can be textured to mix different
wavelengths of light and/or to spread the light output from the
optical component uniformly across the illumination surface.
[0051] The optical component 10 can have a maximum height between
about 5-10 mm (e.g., about 5.5 mm, 6 mm, about 7 mm, about 8 mm,
about 9 mm). A maximum lateral extent of the optical component 10
from the central axis can be between about 6-10 mm (e.g., about 7
mm, about 8 mm, about 9 mm). In implementations of the optical
component 10 having a top surface 12 with a circular cross-section
in a plane perpendicular to the central axis, the maximum diameter
of the top surface 12 can be between about 12-20 mm (e.g., 13 mm,
14 mm, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm, 20 mm).
Textured Annular Structure
[0052] The optical component 10 can further include an annular
structure 8 disposed about the side surface 17. In various
implementations, the annular structure 8 can form a border between
the top surface 12 and the side surface 17 as shown in FIGS. 1A-1C.
Alternately, in some embodiments, the annular structure 8 can form
a border between the bottom surface 19 and the side surface 17. In
some implementations, the annular structure 8 can be in the
mid-section of the side surface 17 such that it divides the side
surface 17 into an upper portion and a lower portion. In some other
implementations, the entire side surface 17 could be configured as
the annular structure 8 such that a separate annular structure is
not provided. The annular structure 8 can be continuous or include
a plurality of discontinuous linear or curved segments. The annular
structure 8 may be configured to alter the radiation pattern of the
light emitted from a LED emitter disposed with respect to the
optical component 10. In various implementations, the annular
structure 8 can be integrated with the reflector and/or the PCB on
which the LED emitter is disposed (for example, as shown in FIG.
3).
[0053] In the implementations illustrated in FIGS. 1A-1C, the
annular structure 8 is configured as a ring that extends from the
side surface 17 and surrounds the optical element 10. In the
implementations illustrated in FIGS. 1A-1C, the annular structure 8
can be configured to form a lip or a rim. Accordingly, with
reference to FIGS. 1A-1C, the annular structure 8 can be referred
to as a ring step structure. As shown in FIGS. 1A-1C, the annular
structure 8 includes a top surface 14, a side surface 15 and a
bottom surface 16. However, in other implementations, the annular
structure 8 can comprise less than or more than three surfaces. For
example, in some implementations, the annular structure 8 may
comprise only a side surface. As another example, in some
implementations, the annular structure 8 may comprise only a top
surface and a side surface. As yet another example, the annular
structure 8 may comprise only a bottom surface and a side surface.
In some other implementations, the annular structure 8 may comprise
4, 5, 6, 8 or 10 surfaces. Although, in FIGS. 1A-1C, the annular
structure 8 is depicted as a ring, in other implementations, the
annular structure 8 can be a partial ring structure.
[0054] In various implementations, one or more surfaces of the
annular structure 8 can be partially or completely textured.
Partial or complete texturing of one or more surfaces of the
annular structure 8 can be accomplished by providing a plurality of
microstructures 805. The plurality of microstructures 805 can
include grooves, protrusions, facets, surface or volume holograms,
gratings, etc. In various implementations, the plurality of
microstructures can be arranged randomly. However, in other
implementations, the plurality of microstructures can be arranged
to form a regular or an irregular pattern. The plurality of
microstructures can have a size between about 1 micron and about 1
mm. In various implementations, the density of the plurality of
microstructures can be between 1000/mm.sup.2 and 1/mm.sup.2.
[0055] In various implementations, the density of the plurality of
microstructures disposed on one or more surfaces of the annular
structure 8 can be between 10/mm.sup.2 and 30/mm.sup.2, between
20/mm.sup.2 and 50/mm.sup.2, between 25/mm.sup.2 and 100/mm.sup.2,
between 40/mm.sup.2 and 75/mm.sup.2, between 50/mm.sup.2 and
100/mm.sup.2, between 75/mm.sup.2 and 200/mm.sup.2, between
125/mm.sup.2 and 250/mm.sup.2, between 150/mm.sup.2 and
300/mm.sup.2, between 200/mm.sup.2 and 400/mm.sup.2, between
250/mm.sup.2 and 500/mm.sup.2, between 300/mm.sup.2 and
450/mm.sup.2, between 500/mm.sup.2 and 750/mm.sup.2, between
550/mm.sup.2 and 800/mm.sup.2, between 600/mm.sup.2 and
700/mm.sup.2, between 750/mm.sup.2 and 850/mm.sup.2, between
800/mm.sup.2 and 1000/mm.sup.2, or values therebetween.
[0056] In various implementations, the plurality of microstructures
can have a size such that an individual microstructure is not
resolved by a normal human eye without the aid of magnification.
Each of the plurality of microstructures 805 can have a size in a
range between 1 micron and about 100 microns. For example, in
implementations where some of the plurality of microstructures 805
include grooves, a depth (or height) of grooves can be in the range
between about 1 micron and about 10 microns, between about 5 micron
and about 20 micron, between about 10 microns and about 30 microns,
between about 30 microns and about 50 microns, between about 40
microns and about 75 microns, between about 50 microns and about 80
microns, between about 75 microns and about 100 microns, or values
therebetween.
[0057] As another example, in implementations where some of the
plurality of microstructures include facets, a height of the facets
can be in the range between about 1 micron and about 10 microns,
between about 5 micron and about 20 micron, between about 10
microns and about 30 microns, between about 30 microns and about 50
microns, between about 40 microns and about 75 microns, between
about 50 microns and about 80 microns, between about 75 microns and
about 100 microns, or values therebetween.
[0058] For example, in implementations where some of the plurality
of microstructures include gratings, a depth of the gratings and/or
the distance between two consecutive gratings can be in the range
between about 1 micron and about 10 microns, between about 5 micron
and about 20 micron, between about 10 microns and about 30 microns,
between about 30 microns and about 50 microns, between about 40
microns and about 75 microns, between about 50 microns and about 80
microns, between about 75 microns and about 100 microns, or values
therebetween.
Top Surface of the Optical Component
[0059] The top surface 12 can comprise a central portion 12a and a
peripheral portion surrounding the central portion 12a. In various
implementations, the top surface 12 can be planar or curved. For
example, the top surface 12 can be concave, convex or an aspheric.
In implementations of the optical component 10 wherein the top
surface 12 is curved, the top surface 12 can be formed by a
rotating a curved segment about the central axis 11. Accordingly,
in such implementations, the top surface 12 can be rotationally
symmetric about the central axis 11. In various implementations,
the top surface 12 can appear to be dome shaped or bell shaped as
viewed along the central axis 11 from a position above the top
surface 12. In various implementations, the top surface 12 can be a
part of a sphere such that a cross-section of the top surface 12 in
a plane perpendicular to the central axis 11 is a circle. In
various implementations, the top surface 12 can be a part of an
ellipsoid such that a cross-section of the top surface 12 in a
plane perpendicular to the central axis 11 is an ellipse. In some
implementations, the top surface 12 can comprise a plurality of
curved sections such that a cross-section of the top surface 12 in
a plane perpendicular to the central axis 11 comprises a plurality
of concave or convex curves. For example, the top surface 12 can
comprise a plurality of curved sections such that a cross-section
of the top surface 12 in a plane perpendicular to the central axis
11 has a flower shape.
[0060] In various implementations, the top surface 12 can be
partially or entirely textured by providing a plurality of
microstructures. The plurality of microstructures can include
grooves, protrusions, facets, surface or volume holograms,
gratings, etc. In various implementations, the plurality of
microstructures can be arranged randomly. However, in other
implementations, the plurality of microstructures can be arranged
to form a regular or an irregular pattern. The density of the
plurality of microstructures disposed on the top surface 12 can be
between 1/mm.sup.2 and 1000/mm.sup.2. The ranges of the size and
density of the microstructures disposed on the top surface 12 can
be similar to the ranges provided above. The plurality of
microstructures on the top surface 12 can further increase color
mixing capability of the optical component 10. In some
implementations, texturing the top surface 12 can reduce intensity
spreading. In such implementations, the density of the plurality of
microstructures can be adjusted to provide increased color mixing
without significantly reducing the spread in the intensity of
output light.
[0061] In various implementations, the curvature of the top surface
12 can be configured such that the central portion 12a is recessed
such that a vertical distance between points in the central region
12a and the bottom surface 19 is shorter than a vertical distance
between points outside the central region 12a (e.g., the peripheral
region) and the bottom surface 19. For example, the central portion
12a can be shaped like a funnel or an inverted bell. In some such
implementations, the top surface 12 can have a curvature such that
an internal angle between a tangential line to the portion of the
surface included in the central section 12a and the central axis 11
in air is less than 90 degrees and an internal angle between a
tangential line to the portion of the surface outside the central
section 12a and the central axis 11 is greater than 90 degrees.
Side Surface of the Optical Component
[0062] The side surface 17 of the optical component 10 can be
formed by rotating a curved segment around the central axis 11. In
various implementations, the side surface 17 can be configured as a
cylindrical surface disposed about the central axis 11.
Accordingly, in such implementations, the side surface 17 is
rotationally symmetric about the central axis 11. In some
embodiments, the side surface 17 may be configured to widen near
the bottom surface 19 and narrow toward the top surface 12.
Alternately, in some embodiments, the side surface 17 may be
configured to narrow near the bottom surface 19 and widen toward
the top surface 12.
Bottom Surface of the Optical Component
[0063] The bottom surface 19 can be planar or curved. For example,
in various implementations, the bottom surface 19 can appear to be
concave, convex or aspheric as viewed along the central axis 11.
The bottom surface 19 can have a circular or elliptical
cross-section in a plane perpendicular to the central axis 11.
Alternately, in some implementations, the cross-section of the
bottom surface 19 in a plane perpendicular to the central axis 11
can be a polygon. The bottom surface 19 can comprise a central
region 22 and a peripheral region 20. The bottom surface 19
includes an opening 19a to the inner cavity 13. The opening 19a can
be located in the central region of the bottom surface 19.
[0064] In various implementations, the peripheral region 20 can be
inclined with respect to the central region 22. For example, in
various implementations, the peripheral region 20 can be configured
such that a tangential line to the peripheral region 20 forms an
angle with respect to a tangential line to the central region 22.
In various implementations, the peripheral region 20 can slope
downward as a radial distance from the central axis 11 increases.
In such implementations, an angle between a tangential line to the
peripheral region 20 and the central axis 11 can be smaller than an
angle between a tangential line to the central region 22 and the
central axis 11. Such a geometry can be advantageous in reducing
peaks in the distribution of intensity of light emitted from an LED
emitter as discussed below. In various implementations, the
peripheral region 20 can be partially or completely textured.
Partial or complete texturing of the peripheral region 20 can be
advantageous in reducing intensity peaks in the distribution of
intensity of light at the output of the optical component 10.
Partial or complete texturing of the peripheral region 20 can be
accomplished by providing a plurality of plurality of
microstructures. The plurality of microstructures can include
grooves, protrusions, facets, surface or volume holograms,
gratings, etc. In various implementations, the plurality of
microstructures can be arranged randomly. However, in other
implementations, the plurality of microstructures can be arranged
to form a regular or an irregular pattern. The plurality of
microstructures can have a size between about 1 micron and about 1
mm. In various implementations, the density of the plurality of
microstructures can be between 1000/mm.sup.2 and 1/mm.sup.2. The
ranges of the size and density of the microstructures disposed on
the surfaces of the peripheral region 20 can be similar to the
ranges provided above.
Inner Cavity of the Optical Component
[0065] As discussed above, the inner cavity 13 can be bounded by an
inner surface 13a. The inner surface 13a can have a dome shape or a
bell shape as viewed along the central axis 11 through the bottom
surface. The inner surface 13a can be formed by rotating a curve
about the central axis 11. The curve can have any shape. For
example, the curve can be concave, convex, aspheric, parabolic or
elliptical. Accordingly, in various implementations, a
cross-section of the inner surface 13a in a plane including the
central axis 11 can be convex, aspheric, parabolic or elliptical.
The cross-section of the inner surface 13a in a plane perpendicular
to the central axis 11 can be circular or elliptical. In various
implementations, an angle between a tangential line to the curve
forming the inner surface 13a and the central axis 11 can be small
in regions of the inner surface 13a adjacent the bottom surface 19
and large in regions of the inner surface 13a adjacent the top
surface 12. For example, the angle between a tangential line to the
curve forming the inner surface 13a and the central axis 11 can be
between about 0 degrees and about 30 degrees in regions of the
inner surface 13a adjacent the bottom surface 19. As another
example, the angle between a tangential line to the curve forming
the inner surface 13a and the central axis 11 can be between about
60 degrees and about 90 degrees in regions of the inner surface 13a
adjacent the top surface 12.
[0066] In various implementations, the inner surface 13a can be
partially or completely textured. Partial or complete texturing of
the inner surface 13a can be accomplished by providing a plurality
of plurality of microstructures. The plurality of microstructures
can include grooves, protrusions, facets, surface or volume
holograms, gratings, etc. In various implementations, the plurality
of microstructures can be arranged randomly. However, in other
implementations, the plurality of microstructures can be arranged
to form a regular or an irregular pattern. The plurality of
microstructures can have a size between about 1 micron and about 1
mm. In various implementations, the density of the plurality of
microstructures can be between 1000/mm.sup.2 and 1/mm.sup.2. The
ranges of the size and density of the microstructures disposed on
the inner surface 13a can be similar to the ranges provided above.
The textured inner surface 13a can advantageously mix the different
wavelengths of light emitted from a light source disposed within
the inner cavity 13 and reduce color non-uniformity in the
near-field and/or far-field radiation pattern emitted from the
optical component 10, as discussed in detail below.
Optical Component Coupled to a LED Emitter
[0067] FIG. 2 illustrates a side-view of the optical component 10
disposed over a LED emitter 21. The LED emitter 21 can emit a
plurality of wavelengths. For example, the LED emitter 21 can be a
WLED and emit wavelengths in the yellow and blue spectral range.
The optical component 10 can be disposed over the LED emitter 21
such that the central axis 11 coincides with a central axis of the
LED emitter 21. In various implementations, optical component 10
and the LED emitter 21 can be disposed such that the central axis
11 of the optical component 10 and the central axis of the LED
emitter 21 coincide with a vertical direction. The inner cavity 13
can have a size and a shape such that when the optical component 10
is disposed over the LED emitter 21, the inner cavity envelopes the
LED emitter 21 such that most of the light emitted from the LED
emitter 21 is collected by the optical component 10. For example,
in various implementations, the inner surface 13a can be configured
to collect between about 50% and about 99% of the light emitted
from the LED emitter 21. In various implementations, the curvatures
of the central and peripheral surfaces of the top surface 12 and
the inner surface 13a are configured to direct light emitted from
the LED emitter 21 along directions away from the central axis 11.
Configuring the curvatures of the top surface 12 and the inner
surface 13a such that light emitted from the LED emitter 21 are
redirected along directions away from the central axis 11 can be
advantageous in distributing light emitted from the LED emitter 21
over a wide angle. In various implementations, light emitted from
the LED emitter 21 can be redistributed by the optical component 10
in a region having an angular extent between about -90 degrees and
about 90 degrees with respect to the central axis 11. For example,
light emitted from the LED emitter 21 can be redistributed by the
optical component 10 in a region having an angular extent between
about -80 degrees and about 80 degrees with respect to the central
axis 11, between about -70 degrees and about 70 degrees with
respect to the central axis 11, between about -60 degrees and about
60 degrees with respect to the central axis 11, between about -50
degrees and about 50 degrees with respect to the central axis 11 or
between about -40 degrees and about 40 degrees with respect to the
central axis 11.
Distribution of Light Across an Illumination Panel at the Output of
the Optical Component
[0068] Usually, light distributed by conventional optical
components that are integrated with LED emitters across an
illumination surface can have a varying illuminance (or intensity)
profile with illuminance (or intensity) peaks and dips. For various
applications, such peaks and dips in the intensity profile across
the illumination surface may be undesirable. Implementations of
optical components similar to the embodiment of optical component
10 that are configured to redistribute light from the LED emitter
21 by redirecting light emitted from the LED emitter in a certain
angular range to regions located away from the central axis 11 of
the optical component 10 are desirable since they may reduce the
intensity of one or more peaks in the illuminance (or intensity)
profile and provide a more uniform distribution of light.
[0069] The light spreading mechanism of the optical component 10
illustrated in FIGS. 1A-1C is explained with reference to FIG. 2.
Light emitted from the LED emitter 21 is incident on the inner
surface 13a of the inner cavity 13 and refracted by the inner
surface 13a toward the top surface 12. As discussed above, the
curvature of the top surface 12 is configured such that light
incident from the inner cavity 13 propagates along directions away
from the central axis 11. Light incident on the portion of the
inner surface 13a that is closer to the top surface 12 propagates
towards the central portion 12a of the top surface 12. Light
incident on the portion of the inner surface 13a that is closer to
the bottom surface 19 propagates towards annular structure 8 and
the side surface 17. As discussed above, one or more surfaces of
the annular structure 8 and the side surface 17 could be textured
such that light incident on annular structure 8 and the side
surface 17 is diffused or scattered. In this manner light emitted
from the LED emitter 21 can be uniformly distributed over an area
of an illumination surface such that the intensity of light
intensity of light at every 1 mm.sup.2 region of the illumination
surface in an area between about 1-80 cm.sup.2 around the central
axis 11 is not less than 50% of the maximum intensity on the
illumination surface. Furthermore, the optical component 10 can be
configured such that the illumination area has a large size. For
example, in various implementations, the angle subtended by
illumination area at the LED emitter 21 can be between about -80
degrees and 80 degrees with respect to the central axis 11.
Reduction of Color Non-Uniformity at the Output of the Optical
Component
[0070] In implementations, where the LED emitter 21 is
polychromatic (e.g., a WLED), the emitted light can have color
non-uniformity on the emitting surface of the LED emitter 21 or in
the vicinity of the LED emitter 21. This color non-uniformity can
be referred to spatial color non-uniformity and/or near-field
angular color non-uniformity. The color non-uniformity in LED
emitter 21 can result in the light extracted from the optical
component 10 to have color non-uniformity as well. For example,
light extracted from the optical component 10 and incident on the
illumination surface can exhibit change in color that results in
rings of different colors and/or gradual change in color which can
cause the average correlated color temperature (CCT) across a
region of the illumination surface to be different from the average
color temperature of the LED emitter 21. Conventional optical
components may not be able to reduce the color non-uniformity as
the optical distance (OD) between the LED emitter 21 and the
illumination panel becomes smaller (e.g., less than or equal to
about 25 mm). The color non-uniformity across the illumination
surface disposed at a distance between about 10-30 mm from a LED
emitter that can result when the LED emitter is optically coupled
with a conventional light redistributing optical element is
illustrated in FIG. 6A. It is observed from FIG. 6A that the
average CCT in a central illumination region located within a
distance of about 10 mm from a position on the illumination surface
that intersects the central axis of the LED emitter is about 50% of
the maximum CCT on the illumination surface. The variation in the
CCT between the central illumination region located within a
distance of about 10 mm from a position on the illumination surface
that intersects the central axis of the LED emitter and the
illumination region located within a distance between about 40-80
mm from the position on the illumination surface that intersects
the central axis of the LED emitter can result in the formation of
yellow and blue rings in the illumination pattern which may be
undesirable in certain applications.
[0071] It is further noted that a variation between a maximum
correlated color temperature (CCT) and a minimum CCT is greater
than 60% of the maximum CCT on the illumination surface which can
also be undesirable. Additionally, the average CCT across the
illumination surface may be substantially different from the
average CCT of the LED emitter which can also be undesirable. The
embodiments of optical components described herein are configured
to reduce color non-uniformity at optical distance less than or
equal to 25 mm as well as greater than 25 mm.
[0072] In order to reduce the color non-uniformity in the light
emitted from the LED emitter 21, the ability to mix and/or blend
different wavelengths of light is introduced at one or more
surfaces of the optical component 10. For example, the textured
inner surface 13a can be capable of mixing and/or blending the
different wavelengths of light emitted from the LED emitter 21. The
textured inner surface 13a can mix and/or blend different
wavelengths of light emitted from the LED emitter 21 by scattering
as explained in detail below with reference to FIG. 3.
Color Mixing
[0073] FIG. 3 illustrates a side-view of an embodiment of the
optical component 10 configured to mix different wavelengths of
light emitted from a LED emitter 21 and/or reduce peaks in the
intensity distribution of light emitted from a LED emitter 21. The
LED emitter 21 can be disposed on a PCB 112. Light emitted from the
LED emitter 21 is directed in an upward direction away from the
central axis 11 towards an illumination panel 113. In some
implementations, the optical distance between the LED emitter 21
and the illumination panel 113 can be between 10-30 mm (e.g., less
than or equal to 25 mm, less than or equal to 20 mm, between 13-20
mm, between 15-18 mm, etc.). In some other implementations, the
optical distance between the LED emitter 21 and the illumination
panel 113 can be greater than 25 mm. The color mixing and light
redirection properties of the optical component 10 are discussed in
detail below.
[0074] Light incident on points P1 and P2 of the textured portions
of the inner surface 13a interact with the microstructures in those
regions of the textured surface and is scattered randomly in
different directions. In contrast if the inner surface 13a in the
vicinity of points P1 and P2 was not textured, light emitted from
the LED emitter 21 would be refracted along a path that is
determined by Snell's law of refraction. By scattering different
wavelengths of light randomly in different directions, the textured
surface can reduce color non-uniformity. The amount of color mixing
provided by the inner surface 13a can depend on the density and the
size of the microstructures. For example, if the density of
microstructures on the inner surface 13a is high, then the inner
surface 13a may be capable of providing a large amount of color
mixing. In contrast, if the density of microstructures on the inner
surface 13a is low, then the inner surface 13a may be capable of
providing a small amount of color mixing
[0075] The density and size of the microstructures on the inner
surface 13a can be adjusted depending on the color uniformity of
the LED emitter 21. For example, if the LED emitter 21 has a high
degree of color uniformity such that little to no color mixing is
required, then the inner surface 13a can have a low density of
microstructures. Accordingly, the inner surface 13a can be
minimally textured or not textured at all. However, if the LED
emitter 21 has a low degree of color uniformity such that a large
amount of color mixing is required, then the inner surface 13a can
have a high density of microstructures. Accordingly, the inner
surface 13a can be heavily textured.
[0076] Moreover different portions of the inner surface 13a could
have different densities of microstructures to provide different
color mixing capabilities for light emitted at different angles.
For example, consider an implementation of a LED emitter 21 that
has a high degree of color uniformity for light emitted at small
angles with respect to the central axis 11 which are incident on
the portion of the inner surface 13a toward the top surface 12 and
has a low degree of color uniformity for light emitted at large
angles with respect to the central axis 11 which are incident on
the portion of the inner surface 13a toward the bottom surface 12.
For such an implementation of a LED emitter, the portion of the
inner surface 13a toward the top surface 12 can have a low density
of microstructures thereby providing a small amount of color mixing
while, the portion of the inner surface 13a toward the bottom
surface 19 can have a high density of microstructures thereby
providing a large amount of color mixing. Accordingly, the
microstructures can be arranged to form a regular pattern, an
irregular pattern, randomly and/or periodically depending on the
desired amount of color mixing required. For LEDs with poor color
uniformity, the top surface 12 can also be partially or entirely
textured to increase color mixing as discussed above. As discussed
above, the amount of texturing of the top surface can be selected
such that color mixing is increased without significantly reducing
the amount of light scattering.
[0077] In various implementations, the peripheral region 20 of the
bottom surface can 20 can also be textured to diffuse or scatter
any light redirected towards the bottom surface 19 by the top
surface 12. Since, the peripheral region 20 is inclined with
respect to the central region 21, as discussed above, light
diffused or scattered by the peripheral region 20 is directed
toward the side surface 17 instead of being redirected toward the
top surface 12. If the peripheral region 20 were not inclined as
discussed above, light redirected towards the bottom surface 19 by
the top surface 12 would be redirected back towards the top surface
12 and either be lost or result in an increase in the peak in the
center of the illumination area. However, by inclining the
peripheral region 20 with respect to the central region 21 light
redirected towards the bottom surface 19 by the top surface 12 and
incident in the vicinity of point P3 on the peripheral region 20 is
redirected toward the side surface 17 and extracted along a
direction away from the central axis 11 such that the light
extraction efficiency can be increased and the light uniformly
distributed across the illumination area by reducing one or more
intensity peaks.
[0078] In addition to redirecting light, the textured surfaces of
the peripheral region 20 of the bottom surface 19 and/or the
annular structure 8 can also be configured to mix and/or blend
different wavelengths of light, as discussed above.
[0079] In various implementations, some of the light redirected
towards the bottom surface 19 by the top surface 12 can be
redirected out of the optical component 10 such that it is incident
on the PCB 112 or a bottom reflector integrated with the optical
component, for example, at point P4 in FIG. 3. By providing a
redirecting element on the PCB 112 or by configuring the PCB 112 as
a redirecting element, light incident on the PCB can be redirected
upwards towards the illumination panel. As discussed above, the PCB
112 can be reflective. The reflectivity of the bottom reflector
and/or the PCB 112 can affect the intensity of light in the region
of the illumination surface directly overhead the optical
component. Accordingly, the illuminance profile (or the intensity
of light) across the illumination surface can be tailored by
adjusting the reflectivity of the reflector and/or PCB integrated
with the optical component. For example, the redirecting element or
the PCB 112 can be configured to redirect the light incident on the
PCB 112 in a direction away from the central axis 11 such that the
intensity in the central region of the area of illumination is
reduced. In various implementations, the redirecting element on the
PCB 112 can be a diffused reflector, a specular reflector, a
scattering element, etc.
[0080] In panel light or backlighting applications where the
optical distance between the LED emitter and the illumination
surface is small (e.g., between about 15-18 mm, between about 13-20
mm, less than 20 mm), the intensity of the light in the central
region (e.g., in a region located within a distance of about 10 mm
from a position on the illumination surface that intersects the
central axis 11) can be affected by the reflectivity of the portion
of the PCB 112 directly below the optical component. In such
implementations, the reflectivity of the reflector adjacent the
bottom surface 19 of the optical component or the reflectivity of
the portion of the surface of the PCB 112 directly below the
optical component can be selected to reduce intensity peaks and/or
dips in the central region. Furthermore, the portion of the surface
of the PCB 112 directly below the optical component can be textured
to mix different wavelengths of light and/or to spread the light
output from the optical component uniformly across the illumination
surface.
[0081] FIG. 4 illustrates a side-view of another embodiment of an
optical component 30 configured to mix different wavelengths of
light emitted from a LED emitter and/or reduce peaks in the
intensity distribution of light emitted from a LED emitter. The
optical component 30 differs from the optical component 10 in that
the annular structure 8 is not distinct from the side surface 17.
Instead, the annular structure 8 is incorporated in the side
surface 17 to form a combined side surface 25. Thus, portions of
the side surface 25 can be textured to provide color mixing and/or
light spreading functions.
[0082] The optical component 10 or 30 can be integrated with an LED
emitter for use in a backlight or a panel light as discussed below.
FIG. 5 illustrates a cross sectional view of a light bar including
an array of LED emitters 21a, 21b and 21c and an array of optical
components 40a, 40b and 40c. The array of LED emitter 21a-21c can
be mounted on a PCB 112. Each LED emitter 21a-21c is associated
with a corresponding optical component 40a-40c. The bottom surfaces
of each of the optical component 40a-40c can be integrated with a
reflector as discussed above. The reflector can have an opening
sized and shaped such that when the optical component 40a-40c is
disposed over a corresponding LED emitter 21a-21c, light emitted
from the LED emitter is coupled into the optical component. As
discussed above, the reflectivity of the reflector can be tailored
to achieve desired illuminance and average CCT at the illumination
surface.
[0083] Various structural and functional features of the optical
components 40a-40c can be similar to the various structural and
functional features of optical components 10 and 30 discussed
herein. The optical component 40a-40c can be configured to tailor
the radiation pattern of light emitted from the corresponding LED
emitter 21a-21c by mixing and/or blending different wavelengths of
light emitted from the LED emitter 21a-21c and/or uniformly
distribute light emitted from the LED emitter 21a-21c over an area
of the illumination panel 113 by reducing peaks in the intensity
distribution across the area. In various implementations of the
light bar or panel light, the illumination panel 113 can be
disposed at a distance less than 25 mm from the array of LED
emitters 21a-21c.
[0084] For example, the light bar including an array of LED
emitters 21a-21c and an array of optical components 40a-40c can be
configured to provide an average correlated color temperature that
is substantially equal to or within about .+-.20% of the average
correlated color temperature of the LED emitters 21a-21c. The light
bar including an array of LED emitters 21a-21c and an array of
optical components 40a-40c can also be configured to provide an
illuminance does not have large variations. For example, the
illuminance within a distance of about 10 mm from the point where
the central axis intersects the illumination surface can be not
less than 80% of the maximum illuminance. As another example, the
illuminance within a distance of about 50 mm from the point where
the central axis intersects the illumination surface can be not
less than 50% of the maximum illuminance.
[0085] FIG. 6B illustrates the variation in the CCT across an
illumination surface disposed at a distance between about 10-30 mm
from a LED emitter that can result when the LED emitter is
optically coupled with an implementation of a light redistributing
and color mixing optical component (e.g., 10, 30, 40a-40c) as
described herein. The correlated temperature across the
illumination surface varies between about 60000 Kelvin and about
20000 Kelvin. It is observed from FIG. 6B that in contrast to FIG.
6A, the average CCT value in a central illumination region located
within a distance of about 10 mm from a position on the
illumination surface that intersects the central axis of the LED
emitter is less than 30% of the maximum CCT on the illumination
surface. Furthermore, it is observed that the variation in the
average CCT in the central illumination region located within a
distance of about 10 mm from a position on the illumination surface
that intersects the central axis of the LED emitter and the
illumination region located within a distance between about 40-80
mm from the position on the illumination surface that intersects
the central axis of the LED emitter is less than 25% (e.g., 5-20%).
Accordingly, the illumination pattern can have a uniform color
appearance without the appearance of yellow and/or blue rings.
[0086] It is further noted that a variation between a maximum
correlated color temperature (CCT) and a minimum CCT is less than
60% of the maximum CCT on the illumination surface which also
indicates less variation in the color appearance. Additionally, the
average CCT across the illumination surface can be substantially
equal to or within about .+-.20% of the average CCT of the LED
emitter.
CONCLUSION
[0087] The implementations of optical components 10, 30 and 40a-40c
described herein can comprise materials that are transparent or
transmissive to wavelengths in UV, visible and/or IR spectrum. For
example, the optical components 10 and 30 can comprise materials
including but not limited to inorganic glass, organic glass,
optical grade polymer or composite materials. The inner cavity 13
and 23 of the optical components 10 and 20 can include a material
having a refractive index that is lower than the refractive index
of the material of the optical components 10, 30 and 40a-40c. For
example, in various implementations, the inner cavity 13 and 23 can
include air, nitrogen, argon, xenon or some other gas. In various
implementations, the optical components 10, 30 and 40a-40c can be
fabricated as a monolithic structure. In various implementations,
the annular structure 8 can be integrated with other surfaces of
the optical components 10, 30 and 40a-40c. The optical components
10, 30 and 40a-40c can be manufactured using known manufacturing
methods including but not limited to glass turning, glass blowing,
molding, casting and embossing, 3D printing, etc. Various
implementations, of optical components 10, 10a, 10b, 10c, and 20
can be fabricated as a unitary or a monolithic structure. For
example, optical components 10, 10a, 10b, 10c, and 20 can be
fabricated by inserting optical grade material into a mold.
[0088] The plurality of microstructures can be disposed on the
various surfaces of the optical components 10, 30 and 40a-40c using
methods, such as, for example, patterning, etching,
photolithography, 3D printing, embossing, machining, etc. In those
implementations of optical components 10, 30 and 40a-40c that are
manufactured using a molding method, metal or other particles can
be disposed on those surfaces of the mold that correspond to the
surfaces of the optical components 10, 30 and 40a-40c that are
textured such that during the molding process, a texture is
imparted to the optical grade material that comes in contact with
the surfaces of the mold including metal or other particles.
[0089] References throughout this specification to "one
embodiment," "an embodiment," "a related embodiment," "an
implementation," or similar language mean that a particular
feature, structure, or characteristic described in connection with
the referred to "embodiment" or "implementation," is included in at
least one embodiment of the present invention. Thus, appearances of
the phrases "in one embodiment," "in an embodiment," and similar
language throughout this specification may, but do not necessarily,
all refer to the same embodiment. It is to be understood that no
portion of disclosure, taken on its own and in possible connection
with a figure, is intended to provide a complete description of all
features of the invention.
[0090] In the drawings like numbers are used to represent the same
or similar elements wherever possible. The depicted structural
elements are generally not to scale, and certain components are
enlarged relative to the other components for purposes of emphasis
and understanding. It is to be understood that no single drawing is
intended to support a complete description of all features of the
invention. In other words, a given drawing is generally descriptive
of only some, and generally not all, features of the invention. A
given drawing and an associated portion of the disclosure
containing a description referencing such drawing do not,
generally, contain all elements of a particular view or all
features that can be presented is this view, for purposes of
simplifying the given drawing and discussion, and to direct the
discussion to particular elements that are featured in this
drawing. A skilled artisan will recognize that the invention may
possibly be practiced without one or more of the specific features,
elements, components, structures, details, or characteristics, or
with the use of other methods, components, materials, and so forth.
Therefore, although a particular detail of an embodiment of the
invention may not be necessarily shown in each and every drawing
describing such embodiment, the presence of this detail in the
drawing may be implied unless the context of the description
requires otherwise. In other instances, well known structures,
details, materials, or operations may be not shown in a given
drawing or described in detail to avoid obscuring aspects of an
embodiment of the invention that are being discussed. Furthermore,
the described single features, structures, or characteristics of
the invention may be combined in any suitable manner in one or more
further embodiments.
[0091] The features recited in claims appended to this disclosure
are intended to be assessed in light of the disclosure as a
whole.
[0092] As used herein, a phrase referring to "at least one of" a
list of items refers to any combination of those items, including
single members. As an example, "at least one of: a, b, or c" is
intended to cover: a, b, c, a-b, a-c, b-c, and a-b-c.
[0093] Various modifications to the implementations described in
this disclosure may be readily apparent to those skilled in the
art, and the generic principles defined herein may be applied to
other implementations without departing from the spirit or scope of
this disclosure. Thus, the claims are not intended to be limited to
the implementations shown herein, but are to be accorded the widest
scope consistent with this disclosure, the principles and the novel
features disclosed herein.
[0094] Certain features that are described in this specification in
the context of separate implementations also can be implemented in
combination in a single implementation. Conversely, various
features that are described in the context of a single
implementation also can be implemented in multiple implementations
separately or in any suitable subcombination. Moreover, although
features may be described above as acting in certain combinations
and even initially claimed as such, one or more features from a
claimed combination can in some cases be excised from the
combination, and the claimed combination may be directed to a
subcombination or variation of a subcombination.
* * * * *