U.S. patent application number 15/185510 was filed with the patent office on 2017-06-01 for semiconductor device and method of manufacturing the same.
The applicant listed for this patent is KABUSHIKI KAISHA TOSHIBA. Invention is credited to Yoshinori KITAMURA, Yoshihiro OGAWA, Hiroaki YAMADA, Yasuhito YOSHIMIZU.
Application Number | 20170154894 15/185510 |
Document ID | / |
Family ID | 58670610 |
Filed Date | 2017-06-01 |
United States Patent
Application |
20170154894 |
Kind Code |
A1 |
YOSHIMIZU; Yasuhito ; et
al. |
June 1, 2017 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Abstract
According to one embodiment, a method of manufacturing a
semiconductor device includes: forming a first film including a
conductive material above a semiconductor substrate; forming a
second film on the first film; forming a third film including a
conductive material on the second film; exposing a part of the
second film; and wet etching the second film. In the wet etching, a
first and second insulation films are deposited on side surfaces of
the first and third films, and part of a space between the first
and third films is blocked by the first and second insulation films
to form an air gap between the first and third films.
Inventors: |
YOSHIMIZU; Yasuhito;
(Yokkaichi, JP) ; YAMADA; Hiroaki; (Yokkaichi,
JP) ; KITAMURA; Yoshinori; (Tsu, JP) ; OGAWA;
Yoshihiro; (Yokkaichi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
KABUSHIKI KAISHA TOSHIBA |
Tokyo |
|
JP |
|
|
Family ID: |
58670610 |
Appl. No.: |
15/185510 |
Filed: |
June 17, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/02282 20130101;
H01L 21/7682 20130101; H01L 29/0649 20130101; H01L 21/31111
20130101; H01L 27/11582 20130101; H01L 21/02164 20130101 |
International
Class: |
H01L 27/115 20060101
H01L027/115; H01L 29/06 20060101 H01L029/06; H01L 21/8234 20060101
H01L021/8234 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 1, 2015 |
JP |
2015-234780 |
Claims
1. A method of manufacturing a semiconductor device comprising:
forming a first film including a conductive material above a
semiconductor substrate; forming a second film including Si
(silicon) and N (nitrogen) on the first film; forming a third film
including a conductive material on the second film; exposing part
of the second film; and wet etching the second film, wherein in the
wet etching, a first and second insulation films each including Si
are deposited on side surfaces of the first and third films, and
part of a space between the first and third films is blocked by the
first and second insulation films to form an air gap between the
first and third films.
2. The method according to claim 1, wherein the wet etching
includes etching the second film by providing an etching solution
including H.sub.3PO.sub.4 (phosphoric acid) to the second film.
3. The method according to claim 1, wherein the wet etching
includes controlling a size of the air gap by controlling at least
one of a fluctuation speed, a fluctuation width, a fluctuation
direction, and a fluctuation time of the semiconductor substrate
immersed in an etching solution.
4. The method according to claim 1, further comprising: forming a
pillar that passes through the first to third films, is in contact
with the semiconductor substrate at a bottom surface of the pillar,
and includes a semiconductor layer and a third insulation film, a
charge accumulation layer, and a fourth film stacked on a side
surface of the semiconductor layer after the forming the third
film.
5. The method according to claim 1, wherein the exposing part of
the second film includes forming a slit in which the semiconductor
substrate is exposed at a bottom surface of the slit, and a side
surface of the first to third films is exposed at a side surface of
the slit.
6. The method according to claim 1, wherein the second film is of
SiN (silicon nitride).
7. The method according to claim 1, wherein the first and second
insulation films are of SiO.sub.2 (silicon dioxide).
8. The method according to claim 1, wherein the first and third
films include W (tungsten) and TiN (titanium nitride) that covers
part of the W.
9. The method according to claim 2, wherein the wet etching
includes controlling a size of the air gap by controlling at least
one of a Si concentration of the etching solution including
H.sub.3PO.sub.4, a H.sub.3PO.sub.4 concentration, a H.sub.3PO.sub.4
temperature, and a circulation speed of the etching solution.
10. A method of manufacturing a semiconductor device comprising:
forming a first film including a conductive material above a
semiconductor substrate; forming a second film including Si and N
on the first film; forming a third film including a conductive
material on the second film; exposing part of the second film; wet
etching the second film, and depositing a first and second
insulation films each including Si on side surfaces of the first
and third films; and forming a third insulation film between the
first and second insulation films, and blocking part of a space
between the first and third films by the first, second, and third
insulation films to form an air gap between the first and third
films.
11. The method according to claim 10, wherein the wet etching
includes etching the second film by providing an etching solution
including H.sub.3PO.sub.4 to the second film.
12. The method according to claim 10, wherein in the wet etching
includes controlling a size of the air gap by controlling at least
one of a fluctuation speed, a fluctuation width, a fluctuation
direction and a fluctuation time of the semiconductor substrate
immersed in an etching solution.
13. The method according to claim 10, further comprising: forming a
pillar that passes through the first to third films, is in contact
with the semiconductor substrate at a bottom surface of the pillar,
and includes a semiconductor layer and a third insulation film, a
charge accumulation layer, and a fourth film stacked on a side
surface of the semiconductor layer after the forming the third
film.
14. The method according to claim 10, wherein the exposing part of
the second film includes forming a slit in which the semiconductor
substrate is exposed at a bottom surface of the slit, and a side
surface of the first to third films is exposed at a side surface of
the slit.
15. The method according to claim 10, wherein the second film is of
SiN.
16. The method according to claim 10, wherein the first and second
insulation films are of SiO.sub.2.
17. The method according to claim 10, wherein the first and third
films include W and TiN that covers part of the W.
18. The method according to claim 11, wherein the wet etching
includes controlling a size of the air gap by controlling at least
one of a Si concentration of the etching solution including
H.sub.3PO.sub.4, a H.sub.3PO.sub.4 concentration, a H.sub.3PO.sub.4
temperature, and a circulation speed of the etching solution.
19. A semiconductor device comprising: a first interconnect layer
provided above a semiconductor substrate; a second interconnect
layer provided away from the first interconnect layer above the
first interconnect layer; a first deposition film including Si
having insulation properties that covers part of a front surface of
the first interconnect layer; a second deposition film including Si
having insulation properties that covers part of a front surface of
the second interconnect layer; and an air gap formed between the
first and second interconnect layers by blocking part of a space
between the first and second interconnect layers by the first and
second deposition films.
20. The device according to claim 19, further comprising: a pillar
that passes through the first and second interconnect layers, is in
contact with the semiconductor substrate at a bottom surface of the
pillar, and includes a semiconductor layer and a first insulation
film, a charge accumulation layer, and a second insulation film
stacked on a side surface of the semiconductor layer.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is based upon and claims the benefit of
priority from Japanese Patent Application No. 2015-234780, filed
Dec. 1, 2015, the entire contents of which are incorporated herein
by reference.
FIELD
[0002] Embodiments described herein relate generally to a
semiconductor device and a method of manufacturing the same.
BACKGROUND
[0003] NAND type flash memories are known as semiconductor
devices.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 is a block diagram of a semiconductor device
according to the first embodiment;
[0005] FIG. 2 is a circuit diagram of a memory cell array in the
semiconductor device according to the first embodiment;
[0006] FIG. 3 is a cross-sectional view of the memory cell array in
the semiconductor device according to the first embodiment;
[0007] FIGS. 4 to 7 are cross sectional views illustrating the
process of the manufacturing method of the semiconductor device
according to the first embodiment;
[0008] FIG. 8 is a table showing the relationship between the wet
etching conditions of SiN and the deposition rate of SiO.sub.2 in
the manufacturing method of the semiconductor device according to
the first embodiment;
[0009] FIGS. 9 to 14 are cross sectional views illustrating the
process of the manufacturing method of the semiconductor device
according to the second embodiment; and
[0010] FIGS. 15 and 16 are cross sectional views illustrating the
process of the manufacturing method of the semiconductor device
according to the third embodiment.
DETAILED DESCRIPTION
[0011] In general, according to one embodiment, a method of
manufacturing a semiconductor device includes: forming a first film
including a conductive material above a semiconductor substrate;
forming a second film including Si and N on the first film; forming
a third film including a conductive material on the second film;
exposing a part of the second film; and wet etching the second
film. In the wet etching, a first and second insulation films each
including Si are deposited on side surfaces of the first and third
films, and part of a space between the first and third films is
blocked by the first and second insulation films to form an air gap
between the first and third films.
1. First Embodiment
[0012] A semiconductor device according to the first embodiment and
a method of manufacturing the semiconductor device will be
explained. In the following description, a three-dimensionally
stacked NAND type flash memory in which memory cell transistors are
stacked above a semiconductor substrate is explained as an example
of a semiconductor device.
[0013] 1.1 Structure
[0014] 1.1.1 Overall Configuration of Semiconductor Device
[0015] To start, an overall configuration of the semiconductor
device will be explained. FIG. 1 is a block diagram showing the
overall configuration of NAND type flash memory 100.
[0016] As shown in FIG. 1, the NAND type flash memory 100 generally
includes a core part 110 and a peripheral circuit 120.
[0017] The core part 110 includes a memory cell array 111, a row
decoder 112, a sense amplifier 113, and a source line driver
114.
[0018] The memory cell array 111 includes a plurality of blocks BLK
(BLK0, BLK1, and so on) that are a set of a plurality of
nonvolatile memory cell transistors. For example, data within a
single block BLK is erased in a batch.
[0019] Each block BLK includes a plurality of string units SU (SU0,
SU1, and so on). Each string unit SU includes a plurality of NAND
strings 115. A plurality of memory cell transistors are connected
in series within each NAND string 115. The number of blocks BLK,
string units SU, and NAND strings 115 may be discretionarily
determined.
[0020] The row decoder 112 decodes an address of a block ELK or an
address of a page to select a target word line when writing or
reading data, for example.
[0021] The sense amplifier 113 senses data read from a memory cell
transistor to a bit line when reading data. The sense amplifier 113
transfers data to be written to a memory cell transistor when
writing data.
[0022] The source line driver 114 applies a required voltage to a
source line when writing, reading, and erasing data.
[0023] The peripheral circuit 120 includes a sequencer 121 and a
voltage generator 122.
[0024] The sequencer 121 controls the entire operation of the NAND
type flash memory 100.
[0025] The voltage generator 122 generates a required voltage for
writing, reading, and erasing data to supply the voltage to the row
decoder 112, the sense amplifier 113, and the source line driver
114, for example.
[0026] 1.1.2 Configuration of Memory Cell Array
[0027] Next, the configuration of the memory cell array 111 will be
explained. FIG. 2 is a circuit diagram of the memory cell array
111.
[0028] As shown in FIG. 2, each of the NAND strings 115 includes,
for example, eight memory cell transistors MT (MT0 to MT7) and
select transistors ST1 and ST2. The memory cell transistor MT
includes a stacked gate including a control gate and a charge
accumulation layer, and stores data in a nonvolatile manner. The
memory cell transistor MT may be a MONOS type memory transistor
that uses an insulation film as a charge accumulation layer, or an
FG type memory transistor that uses a conductive film as a charge
accumulation layer. In the present embodiment, a MONOS type memory
transistor will be explained as an example. The number of the
memory cell transistors MT is not limited to eight, and may be set
at 16, 32, 64, 128, etc. In addition, the number of each of select
transistors ST1 and ST2 may be discretionarily determined.
[0029] Electric current paths of the memory cell transistors MT0 to
MT7 are connected in series. A drain of the memory cell transistor
MT7 is connected to a source of the select transistor ST1, and a
source of the memory cell transistor MT0 is connected to a drain of
the select transistor ST2.
[0030] Gates of the select transistors ST1 within a single string
unit SU are commonly connected to a single select gate line SGD. In
FIG. 2, gates of the select transistors ST1 within the string unit
SU0 of the block BLK0 are commonly connected to a select gate line
SGD0, and gates of the select transistors ST1 within the string
unit SU1 not shown in the drawing are commonly connected to a
select gate line SGD1.
[0031] Gates of the select transistors ST2 within a single block
BLK are commonly connected to a single select gate line SGS.
[0032] Control gates of the memory cell transistors MT0 to MT7 in
each NAND string 115 within a single block BLK are commonly
connected to different word lines WL0 to WL7, respectively.
[0033] A drain of a select transistor ST1 of each of the NAND
strings 115 arranged in a single column among the NAND strings 115
arranged in a matrix pattern within the memory cell array 111 is
connected respectively to a different bit lines BL (BL0 to BL
(N-1); (N-1) is a natural number equal to or greater than 1). In
addition, a drain of a select transistor ST1 of each of the NAND
strings 115 arranged in a single row is commonly connected to any
one of bit lines BL0 to BL(N-1). That is, the bit line BL commonly
connects the NAND string 115 of each of the string unit SU between
the plurality of blocks BLK. In addition, sources of the select
transistors ST2 within each block BLK are commonly connected to a
source line SL. That is, the source line SL commonly connects the
NAND strings 115 within the memory cell array 111.
[0034] Next, the configuration of the memory cell array 111 will be
explained in detail. FIG. 3 is a cross-sectional view of the string
units SU0 and SU1.
[0035] As shown in FIG. 3, a string unit SU and a source line
contact LI are periodically arranged in a second direction D2
parallel to the semiconductor substrate 10. In each string unit SU,
a NAND string 115 is formed in a third direction D3 vertical to the
semiconductor substrate 10. The plurality of NAND strings 115
within a string unit SU are arranged along a line in a first
direction D1. The source line contact LI has a line shape extending
in the first direction D1, for example.
[0036] Next, the configuration of the NAND string 115 will be
explained in detail. The semiconductor substrate 10 has a p-type
well 11 on a surface area. The p-type well 12 has an n.sup.+ type
diffusion layer 12 on a surface area. An insulation layer 20 is
formed on the semiconductor substrate 10, and a plurality of
interconnect layers 21 functioning as a select gate line SGS, word
lines WL0 to WL7, and a select gate line SGD are sequentially
stacked with a space therebetween. For example, SiO.sub.2 (silicon
dioxide) is used for the insulation layer 20. The interconnect
layer 21 is formed of a conductive material, for example, W
(tungsten). An insulation film 23 is formed to cover each
interconnect layer 21. An air gap AG sandwiched between adjacent
insulation films 23 is formed between adjacent interconnect layers
21. For example, SiO.sub.2 is used for the insulation layer 23. In
FIG. 3, the air gap AG has a triangle shape by the side surface of
a memory hole MH and the adjacent insulation layers 23. The air gap
AG may have a triangle shape with bent sides, or rounded
corners.
[0037] The memory hole MH is formed by passing through the
interconnect layers and insulation films to the p-type well 11. A
block insulation film 13, a charge accumulation film 14, and a
tunnel insulation film 15 are sequentially formed on the side
surface of the memory hole MH, and the inside of the memory hole MH
is filled with the semiconductor layer 16. For example, SiO.sub.2
is used for the block insulation layer 13 and the tunnel insulation
film 15. For example, SiN (silicon nitride) is used for the charge
accumulation film 14. For example, Poly-Si (polycrystalline
silicon) is used for the semiconductor layer 16. The semiconductor
layer 16 within the memory hole MH is a region where a channel is
formed when the memory cell transistor MT and select transistors
ST1 and ST2 are in an ON state. A pillar formed of the block
insulation layer 13, charge accumulation film 14, tunnel insulation
film 15, and semiconductor layer 16 within the memory hole MH is
called a "memory pillar MP". A plurality of memory pillars MP
included in each string unit SU each have a contact plug, not shown
in the drawings, on the upper surface and are connected to
different bit lines BL.
[0038] The memory cell transistors MT0 to MT7 are formed by the
memory pillars MP and the word lines WL0 to WL7. Similarly, the
select transistors ST1 and ST2 are formed by the memory pillars MP
and the select gate lines SGD and SGS.
[0039] The select gate lines SGD and SGS may be stacked as more
than two layers, and the number thereof is not limited. In
addition, the NAND strings 115 may include a dummy memory cell
transistor MT. In this case, a dummy word line WL may be provided
between the select gate line SGS and the word line WL0, or between
the select gate line SGD and the word line WL7.
[0040] Furthermore, the plurality of NAND strings 115 within each
string unit SU are not limited to be arranged along a line in the
first direction D1, and may be arranged in two or more parallel
lines or in a staggered pattern.
[0041] The source contact LI is connected to the n.sup.+ type
diffusion layer 12 at the bottom surface, and is connected to the
source line SL at the upper surface not shown in the drawings. For
example, Poly-Si is used for the source contact LI. Insulation
layers 24 are formed on the side surfaces of the source line
contact LI. Specifically, the insulation layers 24 are formed to
sandwich the source line contact LI from both sides in the first
direction D1. For example, SiO.sub.2 is used for the insulation
layer 24. The insulation layer 24 may be omitted.
[0042] 1.2 Method of Forming an Air Gap
[0043] The method of forming an air gap will be explained. FIGS. 4
to 7 are cross-sectional views of the memory cell array in the
manufacturing step of the semiconductor device. In the embodiment,
when wet etching an insulation layer formed between adjacent
interconnect layers 21, the insulation film 23 is deposited at the
same time of wet etching, and a gap between interconnect layers 21
is blocked by the insulation film 23, in order to form an air gap
AG.
[0044] As shown in FIG. 4, the plurality of interconnect layers 21
and the insulation layers 22 alternately stacked one another, and a
plurality of memory pillars MP passing through the plurality of
interconnect layers 21 and the insulation layers 22 and connected
to the p-type well 11 are formed in each string unit SU. Then, the
insulation layer 20 that covers the entire string unit SU is
formed. That is, the insulation layers 22 are formed between the
adjacent interconnect layers 21 each including the word lines WL,
and the select gate lines SGD and SGS.
[0045] In the following description, an example where SiN is used
for the insulation layer 22, and SiO.sub.2 is used for the
insulation film 23 is explained.
[0046] The insulation layer 22 is not limited to be formed of SiN,
and may be formed of an insulation material including Si (silicon)
and N (nitrogen) as structural elements and having a Si--N
coupling, for example, SiON (silicon oxynitride). The insulation
layer 22 is also not limited to be formed of an insulation material
including Si and N, and may be formed of a material which can
obtain a necessary selection wet etching ratio with respect to the
interconnect layer 21, and can deposit a reaction product
(insulation film 23) by wet etching.
[0047] As shown in FIG. 5, a slit SLT is formed along the first
direction D1 to expose an end (side surface) of the insulation
layer 22 of each string unit SU. That is, the slit SLT and the
string unit SU are alternately arranged in the second direction
D2.
[0048] Next, the insulation layer 22 is wet etched as shown in FIG.
6. In this step, the insulation film 23 deposited from an etching
solution covers the upper surface of the insulation layer 20, the
side surface of the slit SLT (side surface of the insulation layer
20), the bottom surface of the slit SLT (front surface of the
semiconductor substrate 10), and the interconnect layer 21.
Accordingly, part of a gap (space) between interconnect layers 21
formed by the wet etching is closed by the adjacent insulation film
23 to form an air gap AG. Specifically, when the semiconductor
substrate 10 is immersed in the etching solution of SiN, the
exposed insulation layer 22 (SiN) within the slit SLT is wet
etched, and a gap is formed between the adjacent interconnect
layers 21. If the etching solution is hardly stirred, for example,
the Si concentration of the etching solution becomes high in the
vicinity of the semiconductor substrate 10, i.e., the vicinity of
the area where the insulation layer 22 (SiN) is etched. If the Si
concentration exceeds a saturation solubility of etching solution,
the insulation film 23 (SiO.sub.2) is deposited. The insulation
film 23 (SiO.sub.2) is formed thick at the end of the interconnect
layer 21, and accordingly closes the gap. By this process, an air
gap AG enclosed by the vertically adjacent insulation films 23
(SiO.sub.2) and the block insulation layer 13 is formed.
[0049] Next, as shown in FIG. 7, a sidewall by an insulation layer
24 formed, for example, of SiO.sub.2 is formed within the slit SLT
to cover the insulation film 23. Specifically, an insulation layer
24 is formed to cover the entire upper surface of the insulation
layer 20 and the slit SLT. Then, the insulation film 23 and the
insulation layer 24 formed on the upper surface of the insulation
layer 20 and the bottom part of the slit SLT are removed by etching
so that the semiconductor substrate 10 is exposed at the bottom
part of the slit SLT, and a sidewall by the insulation layer 24 is
formed within the slit SLT.
[0050] The slit SLT is then filled with a semiconductor layer to
form the source line contact LI, as shown in FIG. 3.
[0051] A thermal annealing process may be executed after the
insulation layer 22 is wet etched. By so doing, the moisture
content within the air gap AG and the insulation film 23 may be
removed, or the insulation film 23 may be improved.
[0052] In addition, the insulation layer 22 may not be completely
removed between the adjacent interconnect layers 21, and may remain
in the vicinity of the memory pillars MP, for example.
[0053] Furthermore, if SiN is used as the insulation layer 22, for
example, a thermal annealing process may be executed in a nitrogen
atmosphere after a SiN film is formed, or in the state where SiN is
exposed after forming the slit SLT. It is also possible to control
the wet etching rate of SiN by improving the film characteristics
of SiN by a thermal annealing process (for example, increasing the
film density or the nitrogen concentration (N/Si ratio)).
[0054] 1.3 Wet Etching of SiN
[0055] The wet etching of SiN will be explained in detail.
[0056] An etching solution including H.sub.3PO.sub.4 (phosphoric
acid) is used for wet etching of SiN (insulation layer 22). For
example, the semiconductor substrate 10 is immersed in the etching
solution which is heated to about 100.degree. C. to 200.degree. C.,
and wet etching is executed. The reaction formula of SiN and
H.sub.3PO.sub.4 is as follows:
3Si.sub.3N.sub.4+36H.sub.2O+4H.sub.3PO.sub.4.fwdarw.9Si(OH).sub.4+4(NH4)-
.sub.3PO.sub.4.
[0057] In the etching solution, Si(OH).sub.4 (orthosilicic acid) is
dissolved as a reaction product.
[0058] When the etching of SiN proceeds, and Si(OH).sub.4
concentration in the etching solution (i.e., Si concentration)
exceeds the saturation solubility (e.g., 100 ppm at 100.degree.
C.), SiO.sub.2 (insulation film 23) is deposited by
hydro-concentration reaction. The film density of the deposited
SiO.sub.2 is equal to or less than the film density of SiO.sub.2
formed by using plasma chemical vapor deposition (CVD).
[0059] The present embodiment focuses on the relation between the
aforementioned wet etching condition and deposition of SiO.sub.2,
and SiO.sub.2 is deposited by increasing the Si concentration in
the etching solution in the vicinity of the semiconductor substrate
10. Then, the deposition amount of SiO.sub.2 is controlled by the
wet etching condition and the wet etching time to control the rate
of blocking the gap between the interconnect layers 21 (the size of
air gap AG). Specifically, when the semiconductor substrate 10 is
stationarily immersed in the etching solution, i.e., the etching
solution is hardly stirred, SiN (insulation layer 22) is etched
between the adjacent interconnect layers 21, and the Si
concentration of the etching solution is increased. If the Si
concentration exceeds the saturation solubility, SiO.sub.2
(insulation film 23) is deposited. As the amount of SiN being
etched increases, the amount of Si dissolved in the etching
solution increases. As a result, the deposition amount of SiO.sub.2
increases, and the rate of blocking the gap becomes high. That is,
the air gap AG is likely to become smaller. In addition, no SiN to
be etched is present on the upper surface or side surface of the
insulation layer 20. However, since dissolved Si (i.e.,
Si(OH).sub.4) discharged from the slit SLT is retained in the
vicinity of the semiconductor substrate 10, SiO.sub.2 (insulation
film 23) is deposited, in a similar manner to the inside the slit
SLT.
[0060] Next, the relation between the wet etching condition and the
deposition rate will be explained in detail. FIG. 8 is a table
showing the relation between the wet etching condition and the
deposition rate.
[0061] As shown in FIG. 8, using the etching solution which is high
in the Si concentration causes the deposition rate of SiO.sub.2 to
increase.
[0062] If the H.sub.3PO.sub.4 concentration in the etching solution
increases, the Si saturation solubility in the etching solution
becomes high, thereby making the deposition of SiO.sub.2 difficult.
Accordingly, the deposition rate is decreased.
[0063] If the H.sub.3PO.sub.4 temperature (the temperature of the
etching solution) increases, the Si saturation solubility in the
etching solution becomes high, thereby making it difficult to
deposit SiO.sub.2. Accordingly, the deposition rate is
decreased.
[0064] If the flow speed of the etching solution on the surface of
the semiconductor substrate 10 increases, the etching solution is
stirred more. Accordingly, it becomes difficult to increase the Si
concentration of the etching solution in the vicinity of the
semiconductor substrate 10. Therefore it becomes difficult to
deposit SiO.sub.2, and the deposition rate is decreased. It should
be noted that the etching rate of SiN basically does not depend on
the flow speed of the etching solution.
[0065] Thus, if the deposition rate of SiO.sub.2 is intended to be
lowered, the Si concentration in the etching solution may be
decreased, the H.sub.3PO.sub.4 concentration in the etching
solution may be increased, the temperature of the etching solution
is increased, or the flow speed of the etching solution is
increased.
[0066] Next, the flow speed of the etching solution will be
explained in detail. For example, the flow speed of the etching
solution on the front surface of the semiconductor substrate 10 can
be increased by increasing any one of the circulation speed of the
etching solution, the fluctuation speed, or the fluctuation width
of the semiconductor substrate 10 immersed in the solution. In
addition, if the fluctuation direction of the semiconductor
substrate 10 is changed, the stirring status of the etching
solution will be changed.
[0067] For example, when the semiconductor substrate 10 is
fluctuated in a horizontal orientation, the etching solution is
stirred on the front surface of the semiconductor substrate 10 more
than when being fluctuated in the vertical orientation.
Accordingly, the deposition rate of SiO.sub.2 is decreased. If the
time of fluctuating the semiconductor substrate 10 immersed in the
etching solution becomes longer, the etching solution is stirred
more. Accordingly, the deposition rate of SiO.sub.2 is
decreased.
[0068] The wet etching of SiN in the present embodiment is
implemented by a wet etching apparatus which is capable of
controlling one of the Si concentration, the H.sub.3PO.sub.4
concentration, the H.sub.3PO.sub.4 temperature (temperature of the
etching solution), the circulation speed of the etching solution,
and the fluctuation speed, the fluctuation width, the fluctuation
direction and the fluctuation time of the semiconductor substrate
10.
[0069] In the above explanation, the semiconductor substrate 10 is
fluctuated in the etching solution. However, the etching solution
may be stirred by using, for example, an ultrasonic fluctuation
apparatus.
[0070] In addition, the flow speed of the etching solution may be
discretionarily changed during the wet etching. For example, it may
be possible that the semiconductor substrate 10, which is
stationarily immersed in the etching solution for a predetermined
time, is fluctuated in order to control deposition of
SiO.sub.2.
[0071] 1.4 Advantageous Effects of Present Embodiment
[0072] In the following, the advantageous effects of the present
embodiment will be described.
[0073] When forming an air gap between the adjacent interconnect
layers, a slit is formed between the interconnect layers, and then
a film of SiO.sub.2 with a high deposition rate (with poor step
coverage) is formed by using, for example, plasma CVD. By so doing,
the slit between the adjacent interconnect layers is blocked at the
interconnect end portion, and an air gap is formed. The above
method is generally known. In this case, the SiO.sub.2 film
deposition rate at the upper surface of the semiconductor substrate
becomes fastest. Thus, for example, the slit frontage is blocked
first in the structure exposing the end portions of stacked
interconnect layers within the slit and having a gap between the
adjacent interconnect layers. Otherwise, the gap between
interconnect layers at the upper layer is blocked earlier in the
stacked interconnect layer, and the shape of the air gap may vary
in the upper layer and the lower layer. To solve such a problem,
there is a method of forming an air gap by providing a convex part
at the end of interconnect layer to narrow the width of the space
between interconnect layers, and forming a SiO.sub.2 film in the
condition of better step coverage. This method, however, increases
the manufacturing steps, and increases the manufacturing costs.
[0074] In contrast, the embodiment applies depositing the
insulation film 23 out in the vicinity of the area (gap) where the
insulation layer 22 is etched when wet etching the insulation layer
22 in the structure having the insulation layer 22 between the
adjacent interconnect layers 21, and blocking the gap to form an
air gap AG. Accordingly, the air gap AG can be formed without
applying another etching step or a film deposition step, for
example. Therefore, the embodiment can suppress an increase of the
manufacturing steps or the manufacturing costs for forming an air
gap AG.
[0075] In addition, the present embodiment decreases the flow speed
of the etching solution on the front surface of the semiconductor
substrate 10 when wet etching the insulation layer 22. By this
process, the Si concentration of the etching solution in the
vicinity of the semiconductor substrate 10, i.e., the area where
the insulation layer 22 is etched, is increased to deposit the
insulation film 23. Accordingly, the area of deposition can be
controlled by forming the area where the insulation film 23 should
be deposited by the insulation layer 22. Therefore, an air gap AG
can be formed even in the complicated structure where the stacked
interconnect layers are exposed to the inside of the slit.
[0076] Furthermore, the present embodiment applies an air gap AG
between the adjacent interconnect layers, which can reduce a
capacitance between the interconnects. With this configuration, the
signal delay due to the capacitance between the interconnects is
reduced, and the processing speed can be improved. The intervals
between interconnects can be narrowed because of the reduction of
the capacitance between the interconnects, thereby accomplishing
miniaturization of the semiconductor device.
[0077] The present embodiment applies the deposited insulation film
23, which can reduce the capacitance between the interconnects. For
example, the deposited SiO.sub.2 (insulation film 23) tends to have
a film density lower than that of a SiO.sub.2 film formed by plasma
CVD using tetraethyl orthosilicate (TEOS) or SiH4. Accordingly, a
dielectric constant of the deposited SiO.sub.2 is lower than that
of the SiO.sub.2 film formed by plasma CVD. With this structure,
the present embodiment can reduce the capacitance between the
interconnects.
[0078] In the present embodiment, the flow speed of the etching
solution is decreased by controlling the circulation speed of the
etching solution, and controlling the fluctuation speed and
fluctuation width of the semiconductor substrate 10 during wet
etching of the insulation layer 22, thereby increasing the Si
concentration of the etching solution near the area where the
insulation layer 22 is etched. Accordingly, the deposition amount
of SiO.sub.2, and the rate of blocking the gap (the size of air gap
AG) can be controlled.
[0079] In the present embodiment, stirring of the etching solution
is controlled by controlling the fluctuation direction and
fluctuation time of the semiconductor substrate 10 during wet
etching of the insulation layer 22, thereby controlling the Si
concentration of the etching solution near the area where the
insulation layer 22 is etched. With this structure, the rate of
blocking the gap can be controlled.
[0080] In the present embodiment, the deposition rate of the
insulation film 23 can be increased by increasing the Si
concentration of the etching solution during wet etching of the
insulation layer 22. By controlling the deposition rate of the
insulation film 23, the rate of blocking the gap can be
controlled.
[0081] In the present embodiment, the allowed saturation solubility
of Si in the etching solution is controlled by controlling the
H.sub.3PO.sub.4 concentration and the H.sub.3PO.sub.4 temperature
(temperature of the etching solution), thereby controlling the
deposition rate of the insulation film 23. With this structure, the
rate of blocking the gap can be controlled.
[0082] In the present embodiment, the wet etching rate of the
insulation layer 22 is changed by improving the film
characteristics of the insulation layer 22 by a thermal annealing
process, thereby changing the rate of blocking the gap.
Specifically, if SiN (insulation layer 22), for example, is
subjected to a thermal annealing process in the nitrogen
atmosphere, the nitrogen concentration (N/Si ratio) of SiN is
increased, and the film density is increased. As a result, the
deposition rate of SiO.sub.2 is lowered because of a decrease in
the wet etching rate of SiN. Thus, the rate of blocking the gap
becomes lower for SiN subjected to the thermal processing even if
the wet etching is performed for the same time period.
2. Second Embodiment
[0083] A semiconductor device according to the second embodiment
and a method of manufacturing the semiconductor device will be
explained. The method of forming a interconnect layer is different
from the first embodiment. In the following, only the items
different from the first embodiment will be explained.
[0084] 2.1 Method of Forming an Air Gap
[0085] The method of forming an air gap will be explained. FIGS. 9
to 14 are cross-sectional views of the memory cell array in the
manufacturing step of the semiconductor device.
[0086] As shown in FIG. 9, the plurality of sacrificial films 25
and the insulation layers 22 are alternately stacked on one
another, and a plurality of memory pillars MP passing through the
plurality of sacrificial films 25 and the insulation layers 22 and
connected to the p-type well 11 are formed in each string unit SU.
Then, the insulation layer 20 that covers the entire string unit SU
is formed. A sacrificial film 25 is formed by a material having a
sufficiently fast etching rate for wet etching relative to the
insulation layer 20 and the insulation layer 22.
[0087] Specifically, the insulation layer 20 is formed, for
example, of SiO.sub.2 formed by plasma CVD, the insulation layer 22
is formed of SiN, and the sacrificial film 25 is formed of an
inorganic spin on glass (SOG) having a film density lower than
SiO.sub.2 used for the insulation layer 20. In this case, by
performing wet etching with the HF type etching solution, the
inorganic SOG has the etching rate higher than SiN and SiO.sub.2
formed by plasma CVD. Accordingly, an etching selective rate
sufficient for selectively removing the inorganic SOG can be
obtained.
[0088] A slit SLT is then formed to expose an end (side surface) of
the insulation layer 22 and the sacrificial film 25 of each string
unit SU, as shown in FIG. 10.
[0089] Next, the sacrificial film 25 is wet etched to form a gap
between the insulation layer 20 and the insulation layer 22 and
between the adjacent insulation layers 22, as shown in FIG. 11.
[0090] Then, a TiN (titanium nitride) 26 is formed, for example, by
CVD, as a barrier metal so as to cover the entire upper surface of
the semiconductor substrate 10. A W 27 is then formed, for example,
by CVD. The gaps between the insulation layer 20 and the insulation
layer 22 and between the adjacent insulation layers 22 are
accordingly filled.
[0091] Next, TiN 26 and W 27 formed on the upper surface of the
insulation layer 20 and within the slit SLT are removed by etching,
as shown in FIG. 13. The interconnect layers 21 are formed
accordingly by TiN 26 and W 27. That is, the upper and lower
surfaces of W 27 are covered with TiN 26.
[0092] Next, the insulation layer 22 is wet etched as shown in FIG.
14. The insulation film 23 (for example, SiO.sub.2) and the air gap
AG are formed at this time.
[0093] In the above explanation, the case where TIN 26 and W 27 are
used for the interconnect layers 21 was explained; however, any
conductive material exhibiting the high etching resistance relative
to the etching solution may be used when wet etching the insulation
layer 22. In addition, a conductive material used for the
interconnect layer 21 may be a single-layer film, or a film of two
or more-layers. Furthermore, a thin film of SiO.sub.2, for example,
may be formed on upper and lower surfaces of the interconnect layer
21 to cover the upper and lower surface the interconnect layer
21.
[0094] 2.2 Advantageous Effects of Present Embodiment
[0095] The present embodiment can produce the same effect as the
first embodiment.
[0096] In the present embodiment, the upper and lower surfaces of
the interconnect layer 21 can be covered with a material exhibiting
the high etching resistance relative to the etching solution used
for the insulation layer 22. With this structure, the interconnect
layer 21 can be prevented from being etched and being reduced in
thickness during wet etching.
3. Third Embodiment
[0097] A semiconductor device according to the third embodiment and
a method of manufacturing the semiconductor device will be
explained. The third embodiment is different from the first and
second embodiments in the method for blocking the gap between the
adjacent interconnect layers. In the following, only the items
different from the first embodiment will be explained.
[0098] 3.1 Method of Forming an Air Gap
[0099] The method of forming an air gap will be explained. FIGS. 15
and 16 are cross-sectional views of the memory cell array in the
manufacturing step of the semiconductor device.
[0100] First, the insulation layer 22 (SiN) is wet etched, and the
insulation film 23 (SiO.sub.2) is formed at the same time, as shown
in FIG. 15. In this case, the amount of the insulation film 23 to
be deposited is set to be smaller than the first and second
embodiments to avoid blocking the gap between the interconnect
layers 21 by the insulation film 23.
[0101] Then, the insulation layer 24 is formed on the sidewall of
the slit SLT to cover the insulation layer 23, as shown in FIG. 16.
The insulation film 23 and the gap are accordingly covered with the
insulation layer 24, and the gap between the interconnect layers 21
is blocked. By this process, an air gap AG is formed.
[0102] 3.2 Advantageous Effects of Present Embodiment
[0103] The present embodiment can produce the same effect as the
first and second embodiments.
[0104] In the present embodiment, the air gap AG can be formed by
blocking the gap between the interconnect layers 21 using the
insulation film 23 and the insulation layer 24. Since the gap is
not blocked when wet etching the insulation layer 22, it is
possible to suppress residual etching solution in the gap.
[0105] In addition, the gap is blocked by the insulation layer 24
in this embodiment. Accordingly, even when the width between the
adjacent interconnect layers 21 varies, or the deposition speed of
the insulation film 23 varies, the gap can be securely blocked by
the insulation layer 24.
4. Modified Example, Etc
[0106] In general, according to the aforementioned embodiments, a
method of manufacturing a semiconductor device includes: forming a
first film (21 @ FIG. 4) including a conductive material above a
semiconductor substrate; forming a second film (22 @ FIG. 4)
including Si and N on the first film; forming a third film (21 @
FIG. 4) including a conductive material on the second film;
exposing a part of the second film; and wet etching the second
film. In the wet etching, a first and second insulation films (23 @
FIG. 6) each including Si are deposited on side surfaces of the
first and third films, and part of a space between the first and
third films is blocked by the first and second insulation films to
form an air gap (AG @ FIG. 6) between the first and third
films.
[0107] By applying the aforementioned embodiments, it is possible
to provide a semiconductor device having an air gap structure that
can reduce manufacturing costs. Note that the embodiments are not
limited to the above-explained aspects, and different variations
are possible.
[0108] The aforementioned embodiments adopt a slit SLT; however, a
hole passing through the interconnect layer 21 and the insulation
layer 22, for example, may be formed.
[0109] In the aforementioned embodiments, a memory hole MH passing
through the interconnect layer 21 and the insulation layer 20 is
formed, and an air gap AG may be then formed by using the memory
hole MH.
[0110] In addition, in the aforementioned embodiments, an air gap
AG may be formed between the semiconductor substrate 10 and the
select gate line SGS, and an air gap AG may be formed between the
select gate line SGD and the interconnect layer provided above (not
shown in the drawings).
[0111] Furthermore, the aforementioned embodiments can be applied
to a three-dimensional stacked NAND flash memory which is different
from the first to third embodiments. For example, a structure in
which the semiconductor layer of the NAND strings 115 has a U-shape
toward above the semiconductor substrate may be applied. In
addition, the aforementioned embodiments can be applied not only to
the NAND flash memory, but also to a semiconductor memory device
using other storage units. The aforementioned embodiments are not
limited to the semiconductor memory device, but may be applied to a
semiconductor device in which the interconnect layers are
stacked.
[0112] In the aforementioned embodiments, the state indicated by
the terms "connect" and "couple" includes a state where elements
are indirectly connected through an element such as a transistor or
a resistance.
[0113] While certain embodiments have been described, these
embodiments have been presented by way of example only, and are not
intended to limit the scope of the inventions. Indeed, the novel
methods and systems described herein may be embodied in a variety
of other forms; furthermore, various omissions, substitutions and
changes in the form of the methods and systems described herein may
be made without departing from the spirit of the inventions. The
accompanying claims and their equivalents are intended to cover
such forms or modifications as would fall within the scope and
spirit of the inventions.
* * * * *