U.S. patent application number 15/301717 was filed with the patent office on 2017-05-04 for apparatus for distributing gas and apparatus for processing substrate including the same.
The applicant listed for this patent is JUSUNG ENGINEERING CO., LTD.. Invention is credited to Jong Kuk HAN, Suk Chul JUNG, Young-Rok KIM.
Application Number | 20170121815 15/301717 |
Document ID | / |
Family ID | 54288068 |
Filed Date | 2017-05-04 |
United States Patent
Application |
20170121815 |
Kind Code |
A1 |
JUNG; Suk Chul ; et
al. |
May 4, 2017 |
APPARATUS FOR DISTRIBUTING GAS AND APPARATUS FOR PROCESSING
SUBSTRATE INCLUDING THE SAME
Abstract
Disclosed is an apparatus for distributing gas which is capable
of uniformly injecting processing gas into a plurality of gas
passages being communicated with a plurality of gas distribution
holes, and an apparatus for processing substrate including the
same, wherein the apparatus for distributing gas may include a body
including a plurality of gas passages connected with a plurality of
gas distribution holes for distributing processing gas; and at
least one gas injection module connected with at least one lateral
surface of the body and respectively communicated with the
plurality of gas passages, wherein the gas injection module firstly
buffers the processing gas supplied from the external, secondly
buffers the firstly buffered processing gas, and injects the
buffered processing gas into the plurality of gas passages.
Inventors: |
JUNG; Suk Chul; (Gwangju-si,
Gyeonggi-do, KR) ; KIM; Young-Rok; (Gwangju-si,
Gyeonggi-do, KR) ; HAN; Jong Kuk; (Gwangju-si,
Gyeonggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
JUSUNG ENGINEERING CO., LTD. |
Gwangju-si, Gyeonggi-do |
|
KR |
|
|
Family ID: |
54288068 |
Appl. No.: |
15/301717 |
Filed: |
April 3, 2015 |
PCT Filed: |
April 3, 2015 |
PCT NO: |
PCT/KR2015/003343 |
371 Date: |
October 3, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C23C 16/458 20130101;
C23C 16/45563 20130101; C23C 16/45565 20130101; C23C 16/455
20130101; C23C 16/45574 20130101 |
International
Class: |
C23C 16/455 20060101
C23C016/455; C23C 16/458 20060101 C23C016/458 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 11, 2014 |
KR |
10-2014-0043632 |
Claims
1. An apparatus for distributing gas comprising: a body including a
plurality of gas passages connected with a plurality of gas
distribution holes for distributing processing gas; and at least
one gas injection module connected with at least one lateral
surface of the body and respectively communicated with the
plurality of gas passages, wherein the gas injection module
includes: a first gas buffering space for firstly buffering the
processing gas supplied from the external; and a second gas
buffering space for secondly buffering the processing gas firstly
buffered in the first gas buffering space, and injecting the
secondly buffered processing gas into the plurality of gas
passages.
2. The apparatus according to claim 1, wherein the gas injection
module includes: a first gas buffering member provided with the
first gas buffering space being communicated with at least one gas
supply pipe, and connected with one lateral surface of the body;
and a second gas buffering member communicated with the first gas
buffering space, and provided with the second gas buffering space
being communicated with the plurality of gas passages.
3. The apparatus according to claim 2, wherein the gas injection
module further includes a sealing member for sealing a space
between the first gas buffering member and the lateral surface of
the body.
4. The apparatus according to claim 2, wherein the second gas
buffering member is provided with a plurality of communication
holes being communicated with the first gas buffering space.
5. The apparatus according to claim 4, wherein a diameter of each
of the plurality of communication holes is gradually increased from
the center of the body toward both ends of the body with respect to
a longitudinal direction of the lateral surface of the body.
6. The apparatus according to claim 4, wherein an interval between
the center of each of the adjacent communication holes is gradually
decreased from the center of the body toward both ends of the body
with respect to a longitudinal direction of the lateral surface of
the body.
7. The apparatus according to claim 2, wherein, the gas injection
module further includes a gas injection member disposed inside the
second gas buffering member, and connected with the lateral surface
of the body so as to cover the plurality of gas passages being
communicated with the second gas buffering space, and the gas
injection member is provided with a plurality of gas injection
holes for injecting the processing gas secondly buffered in the
second gas buffering space into the plurality of gas passages.
8. The apparatus according to claim 7, wherein the gas injection
hole is smaller than the gas passage.
9. The apparatus according to claim 7, wherein a diameter of each
of the plurality of gas injection holes is gradually increased from
the center of the body toward both ends of the body with respect to
a longitudinal direction of the lateral surface of the body.
10. The apparatus according to claim 7, wherein the lateral surface
of the body is provided with an insertion groove into which the gas
injection member is to be inserted, and the gas injection member is
inserted into and connected with the insertion groove while being
detachably provided in the insertion groove.
11. The apparatus according to claim 2, wherein, the plurality of
gas passages are grouped into a plurality of gas passage groups,
wherein each gas passage group includes the adjacent two or more
gas passages, and the second gas buffering member includes a
plurality of group buffering members which secondly buffer the
processing gas supplied from the first gas buffering space and
inject the secondly-buffered processing gas into the plurality of
gas passage groups.
12. The apparatus according to claim 1, wherein the gas injection
module includes: a first gas injection module connected with one
lateral surface of the body, wherein the first gas injection module
includes first and second gas buffering spaces for injecting first
processing gas into some of the gas passages among the plurality of
gas passages, and a second gas injection module connected with the
other lateral surface of the body in the opposite side of one
lateral surface of the body, wherein the second gas injection
module includes first and second gas buffering spaces for injecting
second processing gas, which is the same as or different from the
first processing gas, into the remaining gas passages among the
plurality of gas passages.
13. The apparatus according to claim 12, wherein, one side of each
of some gas passages among the plurality of gas passages is
communicated with the second gas buffering space of the first gas
injection module, and the other side of each of some gas passages
is closed, and one side of each of the remaining gas passages among
the plurality of gas passages is closed, and the other side of each
of the remaining gas passages is communicated with the second gas
buffering space of the second gas injection module.
14. The apparatus according to claim 12, wherein, the first gas
injection module further includes a first gas injection member for
injecting the first processing gas secondly buffered in the second
gas buffering space into some of the gas passages among the
plurality of gas passages, and the second gas injection module
further includes a second gas injection member for injecting the
second processing gas secondly buffered in the second gas buffering
space into the remaining gas passages among the plurality of gas
passages.
15. The apparatus according to claim 1, wherein the plurality of
gas passages include: a plurality of first gas passages provided at
fixed intervals in parallel to a first longitudinal direction of
the body; and a plurality of second gas passages disposed at a
predetermined interval from the plurality of first gas passages in
a thickness direction of the body, and provided at fixed intervals
in parallel to a second longitudinal direction being perpendicular
to the first longitudinal direction of the body.
16. The apparatus according to claim 15, wherein the gas injection
module includes: a first gas injection module connected with a
first lateral surface of the body, wherein the first gas injection
module includes the first and second gas buffering spaces for
injecting first processing gas into one side of the plurality of
first gas passages; a second gas injection module connected with a
second lateral surface of the body in the opposite side of the
first lateral surface, wherein the second gas injection module
includes the first and second gas buffering spaces for injecting
the first processing gas into the other side of the plurality of
first gas passages; a third gas injection module connected with a
third lateral surface of the body, wherein the first and second gas
buffering spaces for injecting second processing gas, which is the
same as or different from the first processing gas, into one side
of the plurality of second gas passages; and a fourth gas injection
module connected with a fourth lateral surface of the body in the
opposite side of the third lateral surface, wherein the fourth gas
injection module includes the first and second gas buffering spaces
for injecting the second processing gas into the other side of the
plurality of second gas passages.
17. The apparatus according to claim 16, wherein each of the first
to fourth gas injection modules further includes a gas injection
member with a plurality of gas injection holes for injecting the
corresponding processing gas secondly buffered in the second gas
buffering space into the corresponding gas passage.
18. The apparatus according to claim 15, wherein the gas injection
module includes: a first gas injection module connected with a
first lateral surface of the body, wherein the first gas injection
module includes the first and second gas buffering spaces for
injecting first processing gas into some of first gas passages
among a plurality of first gas passages; a second gas injection
module connected with a second lateral surface of the body in the
opposite side of the first lateral surface, wherein the second gas
injection module includes the first and second gas buffering spaces
for injecting second processing gas, which is the same as or
different from the first processing gas, into the remaining first
gas passages among the plurality of first gas passages; a third gas
injection module connected with a third lateral surface of the
body, wherein the third gas injection modules includes the first
and second gas buffering spaces for injecting third processing gas,
which is the same as or different from the second processing gas,
into some of second gas passages among a plurality of second gas
passages; and a fourth gas injection module connected with a fourth
lateral surface of the body in the opposite side of the third
lateral surface, wherein the fourth gas injection module includes
the first and second gas buffering spaces for injecting fourth
processing gas, which is the same as or different from the third
processing gas, into the remaining second gas passages among the
plurality of second gas passages.
19. The apparatus according to claim 18, wherein each of the first
to fourth gas injection modules further includes a gas injection
member with a plurality of gas injection holes for injecting the
corresponding processing gas secondly buffered in the second gas
buffering space into the corresponding gas passage.
20. An apparatus for processing substrate comprising: a processing
chamber; a chamber lid for covering an upper side of the processing
chamber; a substrate supporting means for supporting a substrate,
the substrate supporting means provided inside the processing
chamber; and a gas distribution means confronting the substrate
supporting means, the gas distribution means connected with a lower
surface of the chamber lid, wherein the gas distribution means
includes an apparatus for distributing gas, wherein the apparatus
for distributing gas includes: a body including a plurality of gas
passages connected with a plurality of gas distribution holes for
distributing processing gas; and at least one gas injection module
connected with at least one lateral surface of the body and
respectively communicated with the plurality of gas passages,
wherein the gas injection module includes: a first gas buffering
space for firstly buffering the processing gas supplied from the
external; and a second gas buffering space for secondly buffering
the processing gas firstly buffered in the first gas buffering
space, and injecting the secondly buffered processing gas into the
plurality of gas passages.
Description
TECHNICAL FIELD
[0001] The present invention relates to an apparatus for
distributing gas and an apparatus for processing substrate
including the same.
BACKGROUND ART
[0002] Generally, in order to manufacture a solar cell, a
semiconductor device and a flat panel display device, it is
necessary to form a predetermined thin film layer on a surface of a
substrate. Thus, a semiconductor manufacturing process may be
carried out, for example, a thin film deposition process of
depositing a thin film of a predetermined material on the
substrate, a photo process of selectively exposing the thin film by
the use of photosensitive material, and an etching process of
forming a pattern by selectively removing an exposed portion of the
thin film.
[0003] The semiconductor manufacturing process is performed inside
a substrate processing apparatus designed to be suitable for
optimal circumstances. Recently, a substrate processing apparatus
using plasma is generally used to carry out a deposition or etching
process.
[0004] This semiconductor manufacturing process using plasma may be
a PECVD (Plasma Enhanced Chemical Vapor Deposition) apparatus,
wherein the PECVD apparatus may use a gas distribution apparatus
for introducing gas into the inside of a chamber.
[0005] The gas distribution apparatus is provided to distribute
various processing gases onto the surface of the substrate through
a plurality of gas distribution holes formed in a plate-shaped
body. Generally, the gas distribution apparatus may be formed of
aluminum in consideration of workability and reactivity on the
processing gas.
[0006] As shown in FIG. 1, a related art gas distribution apparatus
may include a plate-shaped body 10, a plurality of gas passages 20
which are provided by forming a plurality of holes along a
predetermined direction of the body 10 at fixed intervals inside
the body 10 by a machinery working using a drill and sealing both
ends of each hole by welding 22, and a plurality of gas
distribution holes 30 which are respectively connected with the
plurality of gas passages 20 and are formed vertically to a lower
surface of the body 10. In this related art gas distribution
apparatus, processing gas, which is injected into the center of
each of the plurality of gas passages 20 through a gas supply pipe
40, is downwardly distributed through the plurality of gas
distribution holes 30.
[0007] In case of the related art gas distribution apparatus, the
processing gas is injected into each of the plurality of gas
passages 20, whereby it is difficult to realize uniformity on
injection of the processing gas into the plurality of gas passages
20. Also, both ends of each of the plurality of gas passages 20 are
permanently sealed by welding, whereby it is difficult to clean the
gas passages 20 and the gas distribution holes 30.
DISCLOSURE
Technical Problem
[0008] Accordingly, the present invention is directed to an
apparatus for distributing gas and an apparatus for processing
substrate including the same that substantially obviates one or
more problems due to limitations and disadvantages of the related
art.
[0009] An aspect of the present invention is to provide an
apparatus for distributing gas and an apparatus for processing
substrate including the same, which is capable of uniformly
injecting processing gas into a plurality of gas passages being
communicated with a plurality of gas distribution holes.
[0010] Another aspect of the present invention is to provide an
apparatus for distributing gas and an apparatus for processing
substrate including the same, which facilitates to clean a
plurality of gas distribution holes and a plurality of gas
passages.
[0011] Additional advantages and features of the invention will be
set forth in part in the description which follows and in part will
become apparent to those having ordinary skill in the art upon
examination of the following or may be learned from practice of the
invention.
Technical Solution
[0012] To achieve these and other advantages and in accordance with
the purpose of the invention, as embodied and broadly described
herein, there is provided an apparatus for distributing gas that
may include a body including a plurality of gas passages connected
with a plurality of gas distribution holes for distributing
processing gas; and at least one gas injection module connected
with at least one lateral surface of the body and respectively
communicated with the plurality of gas passages, wherein the gas
injection module includes a first gas buffering space for firstly
buffering the processing gas supplied from the external; and a
second gas buffering space for secondly buffering the processing
gas firstly buffered in the first gas buffering space, and
injecting the secondly buffered processing gas into the plurality
of gas passages.
[0013] In another aspect of the present invention, there is
provided an apparatus for processing substrate that may include a
processing chamber; a chamber lid for covering an upper side of the
processing chamber; a substrate supporting means for supporting a
substrate, the substrate supporting means provided inside the
processing chamber; and a gas distribution means confronting the
substrate supporting means, the gas distribution means connected
with a lower surface of the chamber lid, wherein the gas
distribution means includes the above apparatus for distributing
gas.
Advantageous Effect
[0014] According to the present invention, the processing gas is
uniformly injected into the plurality of gas passages so that it is
possible to easily clean the plurality of gas passages and the
plurality of gas distribution holes. Also, the processing gas is
uniformly distributed onto the surface of the substrate, which
enables the uniform substrate processing.
DESCRIPTION OF DRAWINGS
[0015] FIG. 1 is a cross sectional view illustrating a related art
gas distribution apparatus;
[0016] FIG. 2 is a rear perspective view illustrating an apparatus
for distributing gas according to the first embodiment of the
present invention;
[0017] FIG. 3 is a vertical cross sectional view along I-I' of FIG.
2;
[0018] FIG. 4 is a horizontal cross sectional view along II-II' of
FIG. 2;
[0019] FIG. 5 is a cross sectional view for explaining a plurality
of communication holes shown in FIG. 4;
[0020] FIG. 6 illustrates a flow of processing gas in the apparatus
for distributing gas according to the first embodiment of the
present invention;
[0021] FIG. 7 illustrates an apparatus for distributing gas
according to the second embodiment of the present invention;
[0022] FIG. 8 is a cross sectional view for explaining a gas
injection hole shown in FIG. 7;
[0023] FIG. 9 illustrates a modified example of the apparatus for
distributing gas according to the second embodiment of the present
invention;
[0024] FIG. 10 illustrates an apparatus for distributing gas
according to the third embodiment of the present invention;
[0025] FIG. 11 illustrates an apparatus for distributing gas
according to the fourth embodiment of the present invention;
[0026] FIG. 12 illustrates a modified example of the apparatus for
distributing gas according to the fourth embodiment of the present
invention;
[0027] FIG. 13 is a rear perspective view illustrating an apparatus
for distributing gas according to the fifth embodiment of the
present invention;
[0028] FIG. 14 is a vertical cross sectional view along III-III' of
FIG. 13;
[0029] FIG. 15 is a horizontal cross sectional view along IV-IV' of
FIG. 13; and
[0030] FIG. 16 is a cross sectional view illustrating an apparatus
for processing substrate according to an embodiment of the present
invention.
MODE FOR INVENTION
[0031] On explanation about the embodiments of the present
invention, the following details about the terms should be
understood.
[0032] The term of a singular expression should be understood to
include a multiple expression as well as the singular expression if
there is no specific definition in the context.
[0033] If using the term such as "the first" or "the second", it is
to separate any one element from other elements. Thus, a scope of
claims is not limited by these terms. Also, it should be understood
that the term such as "include" or "have" does not preclude
existence or possibility of one or more features, numbers, steps,
operations, elements, parts or their combinations. It should be
understood that the term "at least one" includes all combinations
related with any one item. For example, "at least one among a first
element, a second element and a third element" may include all
combinations of the two or more elements selected from the first,
second and third elements as well as each element of the first,
second and third elements. Also, if it is mentioned that a first
element is positioned "on or above" a second structure, it should
be understood that the first and second elements may be brought
into contact with each other, or a third element may be interposed
between the first and second elements.
[0034] Hereinafter, an apparatus for distributing gas (hereinafter,
referred to as `gas distribution apparatus`) according to the
present invention and an apparatus for processing substrate
including the same will be described with reference to the
accompanying drawings.
[0035] FIG. 2 is a rear perspective view illustrating a gas
distribution apparatus according to the first embodiment of the
present invention, FIG. 3 is a vertical cross sectional view along
I-I' of FIG. 2, and FIG. 4 is a horizontal cross sectional view
along II-II' of FIG. 2.
[0036] Referring to FIGS. 2 to 4, the gas distribution apparatus
100 according to the first embodiment of the present invention may
include a body 110, a first gas injection module 120a, and a second
gas injection module 120b.
[0037] The body 110 may be formed of a plate-shaped metal material
with a predetermined thickness, for example, aluminum or aluminum
alloy. The body 110 is detachably provided in a lower surface of a
chamber lid for covering an upper side of a processing chamber (not
shown), whereby the body 110 confronts a substrate supporting means
(not shown) provided on a bottom surface of the processing
chamber.
[0038] The body 110 is provided with a plurality of gas passages
111 and a plurality of gas distribution holes 113.
[0039] The plurality of gas passages 111 are provided at fixed
intervals in parallel to a horizontal direction (X) or vertical
direction (Y) inside the body 110. For example, the plurality of
gas passages 111 may be provided by forming a plurality of holes
penetrating the body 110 from its one surface to the other surface
through a gun drilling working. Herein, processing gas is injected
into the plurality of gas passages 111 from the first and second
gas injection modules 120a and 120b.
[0040] The plurality of gas distribution holes 113 are vertically
formed on a rear surface of the body 110 at fixed intervals, and
are communicated with the plurality of gas passages 111,
respectively. The plurality of gas distribution holes 113
downwardly distribute the processing gas, which is injected into
the plurality of gas passages 111, at a constant pressure. The
plurality of gas distribution holes 113 may include at least one
distribution nozzle to be optimized for at least one among a
distribution area of the processing gas, a distribution angle of
the processing gas, and a distribution amount of the processing
gas.
[0041] Each of the plurality of gas distribution holes 113
according to one embodiment of the present invention may be formed
in a cylinder shape whose diameter is smaller than that of the gas
passage 111.
[0042] Although not shown, each of the plurality of gas
distribution holes 113 according to another embodiment of the
present invention may be formed of a funnel shape with a first
distribution part having a first diameter in communication with the
gas passage 111, and a second distribution part in communication
with the first distribution part, wherein a diameter of the second
distribution part is gradually increased from the first
distribution part having the first diameter to the rear surface of
the body 110.
[0043] Although not shown, each of the plurality of gas
distribution holes 113 according to another embodiment of the
present invention may be formed of a predetermined shape with a
first distribution part having a first diameter in communication
with the gas passage 111, a second distribution part having a
second diameter being smaller than the first diameter in
communication with the first distribution part, and a third
distribution part in communication with the second distribution
part, wherein a diameter of the third distribution part is
gradually increased from the second distribution part having the
second diameter to the rear surface of the body 110.
[0044] The first gas injection module 120a is connected with one
lateral surface of the body 110, wherein the first gas injection
module 120a injects the processing gas supplied through at least
one of first gas supply pipe 130a to each of the plurality of gas
passages 111. The first gas injection module 120a according to one
embodiment of the present invention may include a first gas
buffering space (GB S1) for firstly buffering the processing gas
supplied from the first gas supply pipe 130a, and a second gas
buffering space (GBS2) for secondly buffering the processing gas
supplied from the first gas buffering space (GBS1) and injecting
the buffered processing gas into one side of each of the plurality
of gas passages 111. For example, the first gas injection module
120a may include a first gas buffering member 121 having the first
gas buffering space (GBS1), and a second gas buffering member 123
having the second gas buffering space (GBS2).
[0045] The first gas buffering member 121 includes the first gas
buffering space (GBS1) for firstly buffering the processing gas
supplied through the first gas supply pipe 130a, and the first gas
buffering member 121 is connected with one lateral surface of the
body 110 so as to cover one side of each of the plurality of gas
passages 111. For example, the first gas buffering member 121 may
be formed in a case shape whose inner lateral surface facing toward
the plurality of gas passages 111 is opened so as to include the
first gas buffering space (GBS1) surrounded by an outer lateral
surface and each lateral sidewall being vertical to the outer
lateral surface. Accordingly, the first gas buffering member 121
firstly buffers or diffuses the processing gas supplied through the
first gas supply pipe 130a in the first gas buffering space
(GBS1).
[0046] A gas supply hole 120h being in communication with the first
gas supply pipe 130a is formed in a lateral surface of the first
gas buffering member 121, for example, an upper lateral surface of
the first gas buffering member 121. In this case, a sealing member
may be provided between the upper lateral surface of the first gas
buffering member 121 and the first gas supply pipe 130a. In
addition, a connection part between the first gas supply pipe 130a
and the gas supply hole 120h may be sealed by a sealing jacket 131.
Herein, the first gas buffering member 121 may be provided with the
two or more first gas supply pipes 130a. In this case, the two or
more first gas supply pipes 130a may be individually connected with
a gas supply means (not shown), or may be diverged from a main
supply pipe connected with the gas supply means (not shown).
[0047] A sealing member 125 is provided between each sidewall of
the first gas buffering member 121 and one lateral surface of the
body 110. The sealing member 125 may be an O-ring or pad, wherein
the O-ring or pad may be formed of a material which is not damaged
by the processing gas.
[0048] The second gas buffering member 123 includes the second gas
buffering space (GBS2) for secondly buffering the processing gas
which is firstly buffered in the first gas buffering space (GBS1)
of the first gas buffering member 121, and injecting the
secondly-buffered processing gas into the plurality of gas passages
111. Also, the second gas buffering member 123 is disposed inside
the first gas buffering member 121, and is connected with one
lateral surface of the body 110 so as to cover one side of each of
the plurality of gas passages 111. For example, the second gas
buffering member 123 may be formed in a case shape whose inner
lateral surface facing toward the plurality of gas passages 111 is
opened so as to include the second gas buffering space (GBS2)
surrounded by an outer lateral surface and each lateral
sidewall.
[0049] According to one embodiment of the present invention, a size
of the second gas buffering space (GBS2) may be the same as a size
of the first gas buffering space (GBS1).
[0050] According to another embodiment of the present invention, a
size of the second gas buffering space (GBS) may be relatively
smaller than a size of the first gas buffering space (GBS1) since
the processing gas firstly buffered in the first gas buffering
space (GBS1) is secondly buffered in the second gas buffering space
(GBS2). In this case, it is possible to decrease a width of the
first gas injection module 120a.
[0051] A plurality of communication holes 123h are provided at
fixed intervals in the outer lateral surface of the second gas
buffering member 123, that is, a confronting surface which
confronts the outer lateral surface of the first gas buffering
member 121, and are communicated with the first gas buffering space
(GBS1). Herein, the plurality of communication holes 123h form the
passage of the processing gas, which is buffered and diffused in
the first gas buffering space (GBS1), to the second gas buffering
space (GBS2).
[0052] Through the plurality of communication holes 123h, the
processing gas whose pressure is lowered by the first diffusion in
the first gas buffering space (GBS1) is distributed at a constant
pressure toward the second gas buffering space (GBS2), whereby the
firstly-diffused processing gas is secondly diffused in the second
gas buffering space (GBS2) with smoothness.
[0053] The plurality of communication holes 123h according to one
embodiment of the present invention may be provided at fixed
intervals in the outer lateral surface of the second gas buffering
member 123, wherein the plurality of the communication holes 123h
may have the same diameter (or size).
[0054] As shown in (a) of FIG. 5, in consideration of a flow
distance of the processing gas, a diameter (D1, D2, D3) of each of
the plurality of communication holes 123h according to another
embodiment of the present invention may be gradually increased from
the center of the second gas buffering member 123 toward both ends
of the second gas buffering member 123 with respect to the outer
lateral surface of the second gas buffering member 123 (or both
ends of the body 110 with respect to a longitudinal direction of
one lateral surface of the body 110) . In this case, the processing
gas supplied from the first gas buffering space (GBS1) to the
second gas buffering space (GBS2) may be buffered or diffused more
uniformly.
[0055] As shown in (b) of FIG. 5, in consideration of a flow
distance of the processing gas, each of the plurality of
communication holes 123h according to another embodiment of the
present invention may have the same diameter, and an interval (S1,
S2) between the center of each of the neighboring communication
holes 123h may be gradually decreased from the center of the second
gas buffering member 123 toward both ends of the second gas
buffering member 123 with respect to the outer lateral surface of
the second gas buffering member 123. In this case, the processing
gas supplied from the first gas buffering space (GBS1) to the
second gas buffering space (GBS2) may be buffered or diffused more
uniformly. Additionally, although not shown, in consideration of a
flow distance of the processing gas, the diameter (D1, D2, D3) of
each of the plurality of communication holes 123h may be gradually
increased from the center of the second gas buffering member 123
toward both ends of the second gas buffering member 123 with
respect to the outer lateral surface of the second gas buffering
member 123, and the interval (51, S2) between the center of each of
the neighboring communication holes 123h may be gradually decreased
from the center of the second gas buffering member 123 toward both
ends of the second gas buffering member 123 with respect to the
outer lateral surface of the second gas buffering member 123.
[0056] Referring once again to FIGS. 2 to 4, the second gas
injection module 120b is connected with the other lateral surface
of the body 110 in the opposite side of one lateral surface of the
body 110, whereby the processing gas supplied through at least one
of second gas supply pipe 130b is injected into each of the
plurality of gas passages 111 by the second gas injection module
120b. The second gas injection module 120b according to one
embodiment of the present invention may include a first gas
buffering space (GBS1) for firstly buffering the processing gas
supplied from the second gas supply pipe 130b, and a second gas
buffering space (GBS2) for secondly buffering the processing gas
supplied from the first gas buffering space (GBS1) and injecting
the buffered processing gas into the plurality of gas passages 111.
For example, the first gas injection module 120a may include the
first gas buffering member 121 with the first gas buffering space
(GBS1), and the second gas buffering member 123 with the second gas
buffering space (GBS2). Except that the processing gas supplied
from the second gas supply pipe 130b is injected into the other
side of each of the plurality of gas passages 111, the second gas
injection module 120b is identical in structure to the first gas
injection module 120a, whereby the same reference numbers will be
used throughout the drawings to refer to the same or like parts,
and a detailed description for the same parts will be omitted.
[0057] FIG. 6 illustrates a flow of the processing gas in the gas
distribution apparatus according to the first embodiment of the
present invention.
[0058] Referring to FIG. 6 in connection with FIG. 4, in case of
the gas distribution apparatus according to the first embodiment of
the present invention, the processing gas (PG) supplied through the
first and second gas supply pipes 130a and 130b is firstly buffered
and diffused in the first gas buffering space (GBS1) of the first
and second gas injection modules 120a and 120b, and then the
firstly-buffered processing gas is supplied to the second gas
buffering space (GBS2) via the communication hole 123h of the first
and second gas injection modules 120a and 120b, secondly buffered
and diffused in the second gas buffering space (GBS2), and then
injected into the plurality of gas passages 111. Then, the
processing gas injected into the plurality of gas passages 111 is
thirdly buffered and diffused in the plurality of gas passages 111,
and is then downwardly distributed through the plurality of gas
distribution holes 113.
[0059] In the aforementioned description, the processing gas is
buffered in each of the first and second gas injection modules 120a
and 120b, and is injected into both sides of each of the plurality
of gas passages 111, to thereby realize the uniform injection of
the processing gas into the plurality of gas passages 111 with
smoothness, but not limited to this structure. It is possible to
omit the second gas injection module 120b. In this case, the other
end of each of the plurality of gas passages 111 is not permanently
sealed by welding, but closed by the use of detachable sealing cap
for a easy cleaning process.
[0060] In the gas distribution apparatus according to the first
embodiment of the present invention, the gas injection modules 120a
and 120b are detachably connected with one lateral surface and the
other lateral surface of the body 110 provided with the plurality
of gas passages 111 and the plurality of gas distribution holes
113, and the processing gas is injected into the plurality of gas
passages 111 being in communication with the plurality of gas
distribution holes 113 through the first and second buffering
processes in the gas injection modules 120a and 120b, whereby it is
possible to uniformly inject the processing gas into the plurality
of gas passages 111, and to easily clean the plurality of gas
passages 111 and the plurality of gas distribution holes 113
through the detachment of the gas injection modules 120a and
120b.
[0061] FIG. 7 illustrates a gas distribution apparatus according to
the second embodiment of the present invention. Except that a gas
injection member is additionally provided in each of first and
second gas injection modules shown in FIG. 4, the gas distribution
apparatus according to the second embodiment of the present
invention is identical in structure to the gas distribution
apparatus according to the first embodiment of the present
invention. Hereinafter, only the gas injection member will be
described in detail.
[0062] First, a first gas injection member 127a of a first gas
injection module 120a injects (or distributes) processing gas which
is secondly buffered and diffused in a second gas buffering space
(GBS2) into one side of each of a plurality of gas passages 111 at
a constant pressure. To this end, the first gas injection member
127a is formed in a plate shape with a constant thickness, and is
then connected with one lateral surface of a body 111 for covering
one side of each of the plurality of gas passages 111. A plurality
of gas injection holes 127h are provided in the first gas injection
member 127a, and the plurality of gas injection holes 127h are
respectively overlapped with the plurality of gas passages 111 in
one-to-one correspondence, whereby the processing gas secondly
buffered in the second gas buffering space (GBS2) is injected at a
constant pressure into one side of each of the plurality of gas
passages 111.
[0063] Each of the plurality of gas injection holes 127h may has a
diameter and/or a cross sectional shape for increasing a pressure
of the processing gas injected into the plurality of gas passages
111 in the second gas buffering space (GBS2). For example, a
diameter in each of the plurality of gas injection holes 127h may
be relatively smaller than a diameter in each of the plurality of
gas passages 111.
[0064] Additionally, in consideration of a flow of the processing
gas secondly buffered in the second gas buffering space (GBS2), a
diameter (or size, D1 to D5) of each of the plurality of gas
injection holes 127h may be gradually increased from the center of
the body 110 toward both ends of the body 110 with respect to a
longitudinal direction of one lateral surface of the body 110,
whereby the processing gas may be uniformly injected into each of
the plurality of gas passages 111, as shown in FIG. 8.
[0065] Preferably, a sealing member (not shown) is provided between
the first gas injection member 127a and one lateral surface of the
body 110 except the periphery of one side of each of the plurality
of gas passages 111 and the periphery of the plurality of gas
injection holes 127h.
[0066] A second gas injection member 127b of a second gas injection
module 120b injects (or distributes) the processing gas which is
secondly buffered and diffused in the second gas buffering space
(GBS2) into the other side of each of the plurality of gas passages
111 at a constant pressure. To this end, the second gas injection
member 127b is formed in a plate shape with a constant thickness,
and is then connected with the other lateral surface of the body
111 for covering the other side of each of the plurality of gas
passages 111. A plurality of gas injection holes 127h are provided
in the second gas injection member 127b, and the plurality of gas
injection holes 127h are respectively overlapped with the plurality
of gas passages 111 in one-to-one correspondence, whereby the
processing gas secondly buffered in the second gas buffering space
(GBS2) is injected at a constant pressure into the other side of
each of the plurality of gas passages 111. Each of the plurality of
gas injection holes 127h provided in the second gas injection
module 120b is identical in structure to that of the first gas
injection module 120a, whereby the same reference numbers will be
used throughout the drawings to refer to the same or like parts,
and a detailed description for the same parts will be omitted.
[0067] Preferably, a sealing member (not shown) is provided between
the second gas injection member 127b and the other lateral surface
of the body 110 except the periphery of the other side of each of
the plurality of gas passages 111 and the periphery of the
plurality of gas injection holes 127h.
[0068] Meanwhile, as shown in FIG. 9, the aforementioned first gas
injection member 127a may be inserted into and connected with a
first insertion groove 115a which is provided at a predetermined
depth in one lateral surface of the body 110. In this case, the
first gas injection member 127a is not protruding out of one
lateral surface of the body 110, preferably. In the same manner,
the second gas injection member 127b may be inserted into and
connected with a second insertion groove 115b which is provided at
a predetermined depth in the other lateral surface of the body 110.
In this case, the second gas injection member 127b is not
protruding out of the other lateral surface of the body 110,
preferably. Accordingly, the first and second gas injection members
127a and 127b are respectively inserted into one lateral surface of
the body 110 and the other lateral surface of the body 110, whereby
it facilitates sealing between the body 110 and each of first and
second gas buffering members 121 and 123.
[0069] The gas distribution apparatus 200 according to the second
embodiment of the present invention provides the same effect as the
first gas distribution apparatus according to the first embodiment
of the present invention. Furthermore, the gas distribution
apparatus 200 according to the second embodiment of the present
invention increases the pressure of processing gas injected into
each of the plurality of gas passages 111 from the second gas
buffering space (GBS2), and thus to uniformly inject the processing
gas into each of the plurality of gas passages 111.
[0070] FIG. 10 illustrates a gas distribution apparatus according
to the third embodiment of the present invention. Except a
structure of a second gas buffering member in each of first and
second gas injection modules shown in FIGS. 1 to 4, the gas
distribution apparatus according to the third embodiment of the
present invention is identical in structure to the gas distribution
apparatus according to the first embodiment of the present
invention. Hereinafter, only the second gas buffering member will
be described in detail.
[0071] First, a plurality of gas passages 111 are formed in a body
110, and a plurality of gas passage groups (GPG1, GPG2) are formed
by grouping the plurality of gas passages 111, wherein each of the
gas passage groups (GPG1, GPG2) includes the adjacent two or more
gas passages 111. For example, if the body 110 includes the ten of
gas passages 111, it is possible to form the first and second gas
passage groups (GPG1, GPG2), wherein each of the first and second
gas passage groups (GPG1, GPG2) includes the adjacent five gas
passages 111.
[0072] A second gas buffering member 123 in each of first and
second gas injection modules 120a and 120b may include a plurality
of group buffering members 123a and 123b for secondly buffering
processing gas supplied from a first gas buffering space (GBS1) and
injecting the secondly-buffered processing gas into each of the gas
passage groups (GPG1, GPG2).
[0073] Each of the plurality of group buffering members 123a and
123b may include at least one communication hole 123h and a second
gas buffering space (GBS2) for secondly buffering the processing
gas firstly buffered in the first gas buffering space (GBS1), and
injecting the buffered processing gas into the corresponding gas
passages 111 of the corresponding gas passage group (GPG1, GPG2) in
common Each of the group buffering members 123a and 123b is
identical in structure to the second gas buffering member 123 shown
in FIGS. 1 to 4, whereby the same reference numbers will be used
throughout the drawings to refer to the same or like parts, and a
detailed description for the same parts will be omitted.
[0074] The gas distribution apparatus 300 according to the third
embodiment of the present invention provides the same effect as the
first gas distribution apparatus according to the first embodiment
of the present invention. In case of the gas distribution apparatus
300 according to the third embodiment of the present invention, the
second gas buffering space (GBS2) is divided into the plurality of
parts, and the processing gas is injected into the plurality of gas
passages 111 through each divided part, whereby it is possible to
uniformly inject the processing gas into the plurality of gas
passages 111. The gas distribution apparatus 300 according to the
third embodiment of the present invention may further include a gas
injection member (not shown) which is disposed in the inside of
each of the group buffering members 123a and 123b, and is connected
with one lateral surface of the body 110 and the other lateral
surface of the body 110 corresponding to each of the plurality of
gas passage groups (GPG1, GPG2). The gas injection member is
identical in structure to the gas injection members 127a and 127b
shown in FIGS. 8 to 10, whereby a detailed description for the
structure of the gas injection member will be omitted.
[0075] FIG. 11 illustrates a gas distribution apparatus according
to the fourth embodiment of the present invention, which shows a
change of processing gas supplied to a plurality of gas passages
shown in FIGS. 1 to 4. Hereinafter, only the plurality of gas
passages and the processing gas will be described in detail.
[0076] First, a plurality of gas passages 111 are formed in a body
110. Among the plurality of gas passages 111 formed in the body
110, one side of each of some gas passages 111o, that is, the
odd-numbered gas passage 111o is communicated with a second gas
buffering space (GBS2) of a first gas injection module 120a, and
the other side of the odd-numbered gas passage 111o is closed by a
detachable sealing cap 140. Herein, first processing gas (PG1) is
injected into the odd-numbered gas passage 111o through first and
second buffering of the first gas injection module 120a.
[0077] Among the plurality of gas passages 111 formed in the body
110, one side of each of the remaining gas passages 111e, that is,
the even-numbered gas passage 111e is closed by a detachable
sealing cap 140, and the other side of each of the even-numbered
gas passages 111e is communicated with a second gas buffering space
(GBS2) of a second gas injection module 120b. Herein, second
processing gas (PG2), which is the same as or different from the
first processing gas (PG1), is injected into the even-numbered gas
passage 111e through first and second buffering of the second gas
injection module 120b.
[0078] In detail, a first gas injection member 127a is connected
with one lateral surface of the body 110 so as to cover one side of
the plurality of gas passages 111, wherein the first gas injection
member 127a includes a plurality of gas injection holes 127h which
are respectively overlapped with only one side of some gas passages
111o among the plurality of gas passages 111. Thus, while one side
of each of some gas passages 111o is communicated with the second
gas buffering space (GBS2) of the first gas injection module 120a
through the plurality of gas injection holes 127h, one side of each
of the remaining gas passages 111e is closed by the first gas
injection member 127a.
[0079] Meanwhile, the second gas injection member 127b is connected
with the other lateral surface of the body 110 so as to cover the
other side of the plurality of gas passages 111, wherein the second
gas injection member 127b includes a plurality of gas injection
holes 127h which are respectively overlapped with only the other
side of the remaining gas passages 111e among the plurality of gas
passages 111. Thus, while the other side of each of some gas
passages 111o is closed by the first gas injection member 127a, the
other side of each of the remaining gas passages 111e is
communicated with the second gas buffering space (GBS2) of the
second gas injection module 120b through the plurality of gas
injection holes 127h.
[0080] In the gas distribution apparatus 400 according to the
fourth embodiment of the present invention, if the first processing
gas and the second processing gas (PG1, PG2) are the same, the
first processing gas (PG1) and the second processing gas (PG2) are
respectively injected into some gas passages 1110 and the remaining
gas passages 111e from the opposite directions so that it is
possible to uniformly inject the processing gas into the plurality
of gas passages 111.
[0081] Even though the first processing gas (PG1) is different from
the second processing gas (PG2) in the gas distribution apparatus
400 according to the fourth embodiment of the present invention,
some gas passages 111o are spatially separated from the remaining
gas passages 111e so that it is possible to prevent the first
processing gas (PG1) and the second processing gas (PG2) from being
mixed inside the body 110, and to uniformly distribute the first
processing gas (PG1) and the second processing gas (PG2) which are
different from each other.
[0082] FIG. 13 is a rear perspective view illustrating a gas
distribution apparatus according to the fifth embodiment of the
present invention. FIG. 14 is a vertical cross sectional view along
of FIG. 13. FIG. 15 is a horizontal cross sectional view along
IV-IV' of FIG. 13.
[0083] Referring to FIGS. 13 to 15, the gas distribution apparatus
500 according to the fifth embodiment of the present invention may
include a body 110, and first to fourth gas injection modules 120a,
120b, 120c and 120d.
[0084] The body 110 may be formed of a plate-shaped metal material
with a predetermined thickness, for example, aluminum or aluminum
alloy. The body 110 is detachably provided in a lower surface of a
chamber lid for covering an upper side of a processing chamber (not
shown), whereby the body 110 confronts a substrate supporting means
(not shown) provided on a bottom surface of the processing
chamber.
[0085] The body 110 is provided with a plurality of first and
second gas passages 116 and 117, and a plurality of first and
second gas distribution holes 118 and 119.
[0086] The plurality of first gas passages 116 are provided at
fixed intervals in parallel to a vertical direction (Y) inside the
body 110, and the plurality of second gas passages 117 are provided
at fixed intervals in parallel to a horizontal direction (X) inside
the body 110, wherein each of the second gas passages 117 is
disposed at a predetermined interval from each of the first gas
passages 116 in a thickness direction (Z) of the body 110. In the
same manner as the aforementioned first embodiment of the present
invention, the plurality of first and second gas passages 116 and
117 may be formed through a gun drill working.
[0087] The plurality of fist gas distribution holes 118 are
vertically formed on a rear surface of the body 110 at fixed
intervals. Also, the plurality of fist gas distribution holes 118
are communicated with the plurality of first gas passages 116,
respectively, to thereby downwardly distribute first processing gas
(PG1), which is injected into the plurality of first gas passages
116, at a constant pressure. The plurality of second gas
distribution holes 119 are vertically formed on the rear surface of
the body 110 at fixed intervals, and are disposed to avoid the
first gas passages 116. Also, the plurality of second gas
distribution holes 119 are communicated with the plurality of
second gas passages 117, respectively, to thereby downwardly
distribute second processing gas (PG2), which is injected into the
plurality of second gas passages 117, at a constant pressure. In
this case, the second processing gas (PG2) may be the same as or
different from the first processing gas (PG1). In the same manner
as the first embodiment of the present invention, the plurality of
first and second gas distribution holes 118 and 119 may include at
least one distribution nozzle.
[0088] The first gas injection module 120a is connected with a
first lateral surface of the body 110. The first gas injection
module 120a injects the first processing gas (PG1), which is
supplied through at least one of first gas supply pipe 130a, into
one side of each of the first gas passages 116. This first gas
injection module 120a is identical to the first gas injection
module 120a according to the first embodiment of the present
invention, whereby a detailed description for the first gas
injection module 120a will be omitted.
[0089] The second gas injection module 120b is connected with a
second lateral surface being opposite to the first lateral surface
of the body 110. The second gas injection module 120b injects the
first processing gas (PG1), which is supplied through at least one
of second gas supply pipe 130b, into the other side of each of the
first gas passages 116. This second gas injection module 120b is
identical to the second gas injection module 120b according to the
first embodiment of the present invention, whereby a detailed
description for the second gas injection module 120b will be
omitted.
[0090] The third gas injection module 120c is connected with a
third lateral surface of the body 110. The third gas injection
module 120c injects the second processing gas (PG2), which is
supplied through at least one of third gas supply pipe 130c, into
one side of each of the second gas passages 117. In this case, the
second processing gas (PG2) may be the same as or different from
the first processing gas (PG1). The third gas injection module 120c
according to one embodiment of the present invention may include a
first gas buffering space (GBS1) for firstly buffering the second
processing gas supplied from the third gas supply pipe 130c, and a
second gas buffering space (GBS2) for secondly buffering the second
processing gas (PG2) supplied from the first gas buffering space
(GBS1) and injecting the second processing gas (PG2) into one side
of each of the plurality of second gas passages 117. For example,
the third gas injection module 120c may include a first gas
buffering member 121 with the first gas buffering space (GBS1), and
a second gas buffering member 123 with the second gas buffering
space (GBS2). Except that the second processing gas (PG2) supplied
from the third gas supply pipe 130c is injected into one side of
each of the plurality of second gas passages 117, the third gas
injection module 120c is identical in structure to the
aforementioned first gas injection module 120a, whereby a detailed
description for the structure of the third gas injection module
120c will be omitted.
[0091] The fourth gas injection module 120d is connected with a
fourth lateral surface being opposite to the third lateral surface
of the body 110. The fourth gas injection module 120d injects the
second processing gas (PG2), which is supplied through at least one
of fourth gas supply pipe 130d, into the other side of each of the
second gas passages 117. In the same manner as the third gas
injection module 120c, the fourth gas injection module 120d may
include a first gas buffering member 121 with a first gas buffering
space (GBS1), and a second gas buffering member 123 with a second
gas buffering space (GBS2). Except that the second processing gas
(PG2) supplied from the fourth gas supply pipe 130d is injected
into the other side of each of the plurality of second gas passages
117, the fourth gas injection module 120d is identical in structure
to the aforementioned third gas injection module 120c, whereby a
detailed description for the fourth gas injection module 120d will
be omitted.
[0092] In the gas distribution apparatus 500 according to the fifth
embodiment of the present invention, if the first processing gas
and the second processing gas (PG1, PG2) are the same, the first
processing gas (PG1) and the second processing gas (PG2) are
respectively injected into the both sides of each of the first and
second gas passages 116 and 117 intersecting each other so that it
is possible to uniformly inject the processing gas into the
plurality of gas passages 116 and 117.
[0093] Even though the first processing gas (PG1) is different from
the second processing gas (PG2) in the gas distribution apparatus
500 according to the fifth embodiment of the present invention, the
plurality of first gas passages 116 are spatially separated from
the plurality of second gas passages 117 so that it is possible to
prevent the first processing gas (PG1) and the second processing
gas (PG2) from being mixed inside the body 110, and to uniformly
distribute the first processing gas (PG1) and the second processing
gas (PG2) which are different from each other.
[0094] For the more uniform injection of the processing gas (PG1,
PG2) into the plurality of first and second gas passages 116 and
117, the gas distribution apparatus 500 according to the fifth
embodiment of the present invention may further include the
structure of the gas injection member 127a and 127b shown in FIGS.
7 to 9, the structure of the plurality of group buffering members
123a and 123b shown in FIG. 10, the structure of the sealing cap
140 shown in FIG. 11, or the structure of the gas injection member
127a and 127b shown in FIG. 12, wherein the above structures may be
disposed in each of the first to fourth lateral surfaces of the
body 110. For example, if the gas distribution apparatus 500
according to the fifth embodiment of the present invention includes
the gas injection member 127a and 127b shown in FIG. 12, the
processing gas injected into the plurality of first and second gas
passages 116 and 117 will be described as follows. The first
processing gas (PG1) may be supplied to some of the first gas
passages among the plurality of first gas passages 116 through the
first gas injection member 127a, the second processing gas (PG2)
may be supplied to the remaining first gas passages through the
second gas injection member 127b, the third processing gas which is
the same as or different from the second processing gas may be
supplied to some of the second gas passages among the plurality of
second gas passages 117 through the third gas injection member (not
shown) which is the same as the aforementioned first gas injection
member 127a, and the fourth processing gas which is the same as or
different from the third processing gas may be supplied to the
remaining second gas passages through the fourth gas injection
member (not shown) which is the same as the aforementioned second
gas injection member 127b.
[0095] FIG. 16 is a cross sectional view illustrating an apparatus
for processing substrate according to one embodiment of the present
invention.
[0096] Referring to FIG. 16, the apparatus for processing substrate
700 may include a processing chamber 710, a chamber lid 730, a
substrate supporting means 750, and a gas distribution means
770.
[0097] The processing chamber 710 is formed in shape of "U" whose
upper side is opened. A substrate inlet (not shown), through which
a substrate is loaded or unloaded, is formed at one side of the
processing chamber 710, and at least one exhaust port 712 for
discharging the processing gas is formed on a bottom surface of the
processing chamber 710.
[0098] The chamber lid 730 is provided at an upper side of the
processing chamber 710, to thereby cover the upper side of the
processing chamber 710. In this case, an insulating member 720 such
as O-ring is provided between a connection part between the
processing chamber 710 and the chamber lid 730. The insulating
member 720 seals a space between the processing chamber 710 and the
chamber lid 730, and electrically separates the processing chamber
710 and the chamber lid 730 from each other.
[0099] The chamber lid 730 is connected with an external power
supply means 790 via a power cable 792, and is supplied with a
plasma power from the power supply means 790. In this case, an
impedance matching circuit 794 may be provided in the power cable
792. The impedance matching circuit 794 may include at least two
impedance devices (not shown) for matching a source impedance and a
load impedance of the plasma power supplied to the chamber lid 730.
The impedance device may be formed of at least one of variable
capacitor and variable inductor.
[0100] The substrate supporting means 750, which is provided in the
processing chamber 710, supports the substrate (S) which is loaded
into a processing space by the use of substrate transferring
apparatus (not shown). The substrate supporting means 750 may be
movably provided in the processing chamber 710. In this case, the
substrate supporting means 750 is movably provided by the use of
elevating axis 752 penetrating through the bottom surface of the
processing chamber 710 so that the substrate supporting means 750
is moved to a processing position or a substrate loading and
unloading position by the movement of the elevating axis 752 in
accordance with the driving of elevating apparatus (not shown).
Herein, a space between the elevating axis 752 and the processing
chamber 710 is sealed by a bellows 754.
[0101] The gas distribution means 770 confronting the substrate
supporting means 750 is connected with a lower surface of the
chamber lid 730. The gas distribution means 770 distributes the
processing gas supplied from an external gas supply apparatus onto
the substrate (S). The gas distribution means 770 may be formed of
any one of the gas distribution apparatuses 100, 200, 300, 400 and
500 according to the first to fifth embodiments of the present
invention shown in FIGS. 2 to 15, wherein a detailed description
for the gas distribution means 770 will be omitted.
[0102] Hereinafter, a thin film deposition process using the above
substrate processing apparatus 700 according to the embodiment of
the present invention will be described as follows.
[0103] First, a plurality of substrates (S) or a large-sized
substrate (S) may be loaded and placed onto the substrate
supporting means 750.
[0104] According as the processing gas is injected into the gas
injection module of the gas distribution means 770 through the gas
supply pipe 130a and 130b, the injected processing gas is firstly
and secondly buffered (or diffused) by the first and second gas
buffering spaces of the gas injection module, and is injected into
the plurality of gas passages, and then the processing gas is
downwardly distributed onto the substrate (S) through the plurality
of gas distribution holes. At the same time, the plasma power is
applied to the chamber lid 730 through the power supply means 790,
whereby the plasma power is applied to the gas distribution means
770 through the chamber lid 730. Thus, the plasma is formed between
the substrate supporting means 750 and the gas distribution means
770.
[0105] Accordingly, the processing gas distributed from the gas
distribution means 770 is activated by the plasma, and is
distributed onto the substrate (S), to thereby deposit a
predetermined thin film onto the upper surface of the substrate (S)
by the activated processing gas.
[0106] In the substrate processing apparatus 700 according to the
present invention, the processing gas is firstly and secondly
buffered and diffused in the gas injection module connected with
the body of the gas distribution means 770, and is then injected
into the gas passages, whereby the processing gas is uniformly
distributed onto the substrate (S), to thereby enable the uniform
substrate processing. For cleaning the gas distribution means 770,
both ends of each of the plurality of gas passages are exposed to
the external by the detachment of the gas injection module, which
is detachably provided in the body of the gas distribution means
770, so that it is possible to facilitate the cleaning of the gas
passages and the gas distribution holes, and to reduce the cleaning
time.
[0107] It will be apparent to those skilled in the art that various
modifications and variations can be made in the present invention
without departing from the spirit or scope of the inventions. Thus,
it is intended that the present invention covers the modifications
and variations of this invention provided they come within the
scope of the appended claims and their equivalents.
* * * * *