U.S. patent application number 15/392900 was filed with the patent office on 2017-04-20 for encapsulation of light-emitting elements on a display module.
The applicant listed for this patent is Daktronics, Inc.. Invention is credited to Jordan Gab, Shannon Lee Mutschelknaus, Nathan Lane Nearman, Ryan J. Nielson.
Application Number | 20170110037 15/392900 |
Document ID | / |
Family ID | 49883228 |
Filed Date | 2017-04-20 |
United States Patent
Application |
20170110037 |
Kind Code |
A1 |
Mutschelknaus; Shannon Lee ;
et al. |
April 20, 2017 |
ENCAPSULATION OF LIGHT-EMITTING ELEMENTS ON A DISPLAY MODULE
Abstract
A video display module comprises a circuit board having a front
face, a plurality of light-emitting elements electrically coupled
to the front face of the circuit board, and a polymer encapsulating
member adhered to the front face of the circuit board, the polymer
encapsulating member substantially covering at least a portion of
the circuit board and a portion of the plurality of light-emitting
elements, the polymer encapsulating member substantially sealing
the portion of the circuit board and the portion of the plurality
of light-emitting elements.
Inventors: |
Mutschelknaus; Shannon Lee;
(Aurora, SD) ; Gab; Jordan; (Seattle, WA) ;
Nearman; Nathan Lane; (Brookings, SD) ; Nielson; Ryan
J.; (Brookings, SD) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Daktronics, Inc. |
Brookings |
SD |
US |
|
|
Family ID: |
49883228 |
Appl. No.: |
15/392900 |
Filed: |
December 28, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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14861403 |
Sep 22, 2015 |
9538588 |
|
|
15392900 |
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|
14095584 |
Dec 3, 2013 |
9172929 |
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14861403 |
|
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61735346 |
Dec 10, 2012 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F21V 19/002 20130101;
H05B 33/04 20130101; F21V 19/003 20130101; H04N 9/30 20130101; H05K
1/181 20130101; F21V 23/005 20130101; H05K 2201/10106 20130101;
G09F 9/33 20130101; H05K 3/284 20130101; H01L 25/0753 20130101;
G09F 9/3026 20130101; G09F 27/008 20130101; F21Y 2115/10 20160801;
H05K 2203/1316 20130101; F21V 5/04 20130101; F21Y 2105/10 20160801;
H05K 2203/1327 20130101 |
International
Class: |
G09F 9/302 20060101
G09F009/302; H01L 25/075 20060101 H01L025/075; G09F 27/00 20060101
G09F027/00; F21V 19/00 20060101 F21V019/00; F21V 5/04 20060101
F21V005/04; G09F 9/33 20060101 G09F009/33; H05K 1/18 20060101
H05K001/18; H05K 3/28 20060101 H05K003/28 |
Claims
1. A video display module comprising: a circuit board having a
front face; a plurality of light-emitting elements electrically
coupled to the front face of the circuit board; and a polymer
encapsulating member adhered to at least the front face of the
circuit board, the polymer encapsulating member substantially
covering at least a portion of the circuit board and a portion of
the plurality of light-emitting elements, the polymer encapsulating
member substantially sealing the portion of the circuit board and
the portion of the plurality of light-emitting elements.
Description
CLAIM OF PRIORITY
[0001] This application is a continuation of and claims the benefit
of priority to U.S. application Ser. No. 14/095,584, filed Dec. 3,
2013, entitled "ENCAPSULATION OF LIGHT-EMITTING ELEMENTS ON A
DISPLAY MODULE." which claims the benefit of priority to U.S.
Provisional Application Ser. No. 61/735,346, filed Dec. 10, 2012,
entitled "ENCAPSULATION OF LIGHT-EMITTING ELEMENTS ON A DISPLAY
MODULE." which is hereby incorporated by reference in its
entirety.
BACKGROUND
[0002] Some examples of video display modules incorporate an
arrangement of different colored light-emitting elements, such as
light-emitting diodes (LEDs), for example red-green-blue element
pixel packages. The pixel packages or other light-emitting element
arrangements can be coupled to a circuit board. It can be desirable
to protect the circuit board and electronics mounted thereto from
the surrounding environment, particularly for video displays that
are to be used outdoors such as sporting venue video displays.
SUMMARY
[0003] This patent document discloses, among other things, a video
display module and a video display formed from a plurality of
modules mounted to a support chassis. Each video display module can
include a circuit board with a plurality of light-emitting elements
that are mounted to a face of the circuit board. A polymer
encapsulating member can be adhered to the face so that the polymer
encapsulating member is adhered to at least a portion of the face
and at least a portion of the plurality of light-emitting elements.
The polymer encapsulating member seals the portion of the face of
the circuit board and the portion of the plurality of
light-emitting elements, for example by sealing the circuit board
and electronics mounted thereto from the surrounding
environment.
[0004] This disclosure describes a video display module comprising
a circuit board having a front face, a plurality of light-emitting
elements electrically coupled to the front face of the circuit
board, and a polymer encapsulating member adhered to the front face
of the circuit board. The polymer encapsulating member
substantially covers at least a portion of the circuit board and a
portion of the plurality of light-emitting elements. The polymer
encapsulating member substantially seals the portion of the circuit
board and the portion of the plurality of light-emitting
elements.
[0005] This disclosure also describes a video display module
comprising a circuit board having a front face, a plurality of
light-emitting elements electrically coupled to the front face of
the circuit board, and a polymer encapsulating member adhered to
the front face of the circuit board. The polymer encapsulating
member substantially covers at least a portion of the circuit board
and a portion of the plurality of light-emitting elements. The
polymer encapsulating member is shaped over each of the portion of
the plurality of light-emitting elements to form a lens over each
of the portion of the plurality of light-emitting elements.
[0006] This disclosure also describes a method for manufacturing a
video display module. The method comprises providing or receiving a
circuit board comprising a plurality of light-emitting elements to
a face of the circuit board, forming a polymer encapsulating member
over at least a portion of the face of the circuit board and at
least a portion of the plurality of light-emitting elements,
adhering the polymer encapsulating member to the face of the
circuit board, and sealing at least the portion of the face of the
circuit board and the portion of the plurality of light-emitting
elements with the polymer encapsulating member
[0007] These and other examples and features of the present display
module mounting configurations and related methods will be set
forth, in part, in the following Detailed Description. This Summary
is intended to provide an overview of subject matter of the present
disclosure--it is not intended to provide an exclusive or
exhaustive explanation. The Detailed Description below is included
to provide further information about the present disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] In the drawings, like numerals can be used to describe
similar elements throughout the several views. Like numerals having
different letter suffixes can be used to represent different views
of similar elements. The drawings illustrate generally, by way of
example, but not by way of limitation, various examples discussed
in the present document.
[0009] This patent or application file contains at least one
drawing executed in color. Copies of this patent or patent
application publication with color drawing(s) will be provided by
the Office upon request and payment of the necessary fee.
[0010] FIG. 1 is a perspective view of an example video display
module.
[0011] FIG. 2 is an exploded side view of an example video display
module.
[0012] FIG. 3 is a cross-sectional side view of an example of an
assembled video display module.
[0013] FIG. 4 is a perspective view of several video display
elements mounted to a circuit board that has been encapsulated with
an encapsulation mask.
[0014] FIG. 5 is an exploded rear perspective view of an example
video display module.
[0015] FIG. 6 is a cross-sectional side view of an example video
display module showing an altered viewing angle due to the use of
an encapsulation mask and a lens.
[0016] FIG. 7 is a cross sectional view of a circuit board in a
mold for forming an encapsulation mask around the circuit board
with an encapsulating material.
[0017] FIG. 8 is a flow chart of an example method of manufacturing
a video display module.
DETAILED DESCRIPTION
[0018] In the following Detailed Description, reference is made to
the accompanying drawings which form a part hereof. The drawings
show, by way of illustration, specific examples in which the
present display module mounting configurations and related methods
can be practiced. These examples are described in sufficient detail
to enable those skilled in the art to practice, and it is to be
understood that other embodiments can be utilized and that
structural changes can be made without departing from the scope of
the present disclosure. Therefore, the following Detailed
Description is not to be taken in a limiting sense, and the scope
of the present disclosure is defined by the appended claims and
their equivalents.
[0019] FIG. 1 shows a perspective view of a non-limiting example of
a video display module 10. The video display module 10 can be
combined with a plurality of identical or similar video display
modules. Each of the plurality of video display modules 10 can be
mounted to a support chassis and operated together as a single
video display. The video display can appear as a single display
when viewed by a user. The video display module 10 can include a
front display surface 12 that can be configured to provide for a
display of graphics or video content. The front display surface 12
can be formed from a plurality of individual light-emitting
elements 14. In an example, the light-emitting elements 14 can
comprise light-emitting diode (LED) devices, although other types
of light-emitting devices can be used. For the sake of brevity, the
remainder of this disclosure will describe the light-emitting
elements 14 as LEDs 14. The remainder of this disclosure will also
describe the video display module 10 as an LED module 10 and will
describe the video display that can be formed from a plurality of
the LED modules 10 as an LED display. However, a person of skill in
the art will understand that the term "LED" or "LED display," as
used herein, can include any type of practical light-emitting
device, including, but not limited to, light-emitting diodes
(LEDs), organic light-emitting diodes (OLEDs), organic
light-emitting transistors (OLETs), surface-conduction
electron-emitter display devices (SEDs), field-emission display
devices (FEDs), laser TV quantum dot liquid crystal display
devices, quantum dot display devices (QD-LED), ferro-liquid display
devices (FLDs), liquid crystal display devices (LCDs), and
thick-film dielectric electroluminescent devices (TDELs).
[0020] When multiple LEDs 14 are positioned together in close
proximity, various colors can be shown by combining the colors of
one or more of the LEDs 14. In an example, the front display
surface 12 can include an array of LED pixels, with each LED pixel
including a red LED, a green LED, and a blue LED. The red, green,
and blue LEDs can cooperate to provide a spectrum of colors when
one, two, or three of the light emitting elements in a pixel are
lit at varying intensities. The front display surface 12 can also
provide a black or empty looking surface over a portion of the
display, when desired, by deactivating or turning off the LEDs in a
particular portion of the front display surface 12. The front
display surface 12 of the LED module 10 can be combined with front
display surfaces of one or more adjacently-positioned LED modules
to form a front display surface of a larger LED display.
[0021] FIG. 2 shows an exploded side view of an example LED module
10. FIG. 3 shows a cross-sectional side view of a portion of the
example LED module 10. The LED module 10 can include a circuit
board 16 and a plurality of LEDs 14. The plurality of LEDs 14 can
be mounted and electrically coupled to a front face 18 of the
circuit board 16. In an example, the LEDs 14 can comprise
surface-mount technology (SMT) LEDs, also referred to as
surface-mount LEDs. Surface-mount technology is in contrast to
through-hole technology, wherein an LED includes a lead pin that
can be inserted through a hole in the circuit board, wherein the
lead pin can be soldered to a connection pad on the back side of
the circuit board. A surface-mount LED can be mounted directed onto
the front face of a circuit board by being soldered directly to
solder pads. Surface-mount LEDs can be smaller than through-hole
LEDs and can take up less space on the circuit board. Surface-mount
LEDs can therefore achieve higher resolution than through-hole
LEDs.
[0022] Surface-mount LEDs 14 can result in difficulties with
sealing the LEDs 14 and other components of the module 10. For
example, because surface-mount LEDs are often low profile, with
little distance between the surface of the circuit board and the
outer face of the LED, it is often necessary to seal over the top
of the entire LED. For this reason, the sealing structure or
material must be configured so as to not optically interfere with
LEDs. In addition, because surface-mount LEDs are soldered to a
front surface of the circuit board, the solder can be exposed to
ultraviolet (UV) radiation in outdoor video display modules. Many
solder materials are UV-sensitive and can break down over time when
exposed to UV radiation. An encapsulating mask 20 (which can also
be referred to as an encapsulation member) can be formed over at
least the front face 18. As described in more detail below, the
encapsulating mask 20 can substantially cover and substantially
seal at least a portion of the front face 18 and at least a portion
of the LEDs 14 mounted to the front face 18. In an example, best
seen in FIG. 2, the encapsulating mask 20 can include a plurality
of projections 21 that are each configured to receive and cover a
corresponding LED 14. The material that forms the encapsulating
mask 20 can be substantially transparent so that light emitted from
the LEDs 14 can be emitted through the encapsulating mask 20. In an
example, the projections 21 can be configured to form a lens that
can alter the light emitted by an underlying LED 14. As described
in more detail below, the lensing effect of each projection 21 can
be configured to provide for an altered viewing angle of the LED 14
compared to the viewing angle that would be experienced without the
encapsulating mask 20.
[0023] The encapsulated circuit board 16 can be coupled with a
housing 22. The LED module 10 can be configured for use in an
exterior environment, such as a scoreboard or marquee for an
outdoor stadium, arena, or other outdoor venue, or in an interior
environment, such as an indoor stadium, arena, or other indoor
venue.
[0024] A louver 24 can be mounted over the encapsulated front face
18 of the circuit board 16. The louver 24 can include a plurality
of openings that can receive the plurality of LEDs 14 so that the
LEDs 14 extend at least partially into the LED openings. In an
example, each LED opening can be sized and shaped to receive a
corresponding LED 14 and a projection 21 of the encapsulation mask
20. The LED openings in the louver 24 can be in a specified pattern
and posture corresponding to the location of the LEDs 14 mounted to
the circuit board 16. In such an example, the circuit board 16 can
be aligned with the louver 24 and each LED opening can be
registered with a corresponding LED 14. The louver 24 can also
include a plurality of louver blades 28. The louver blades 28 can
extend at least partially over or under the one or more of the LEDs
14 projecting through the LED openings louver 24. Each louver blade
28 can provide a measure of shade to one or more corresponding LEDs
14 and can thus assist in preventing interaction of the LED 14 with
sunlight. For instance, glare, such as sunlight glare off of the
LEDs 14, can interfere with projection of a true color from the LED
module 10. Accurate representation of graphic and video content can
be frustrated by this interference. The shade provided by the
louver blades 28 can assist in preventing glare from the LEDs 14
and additionally can allow the LEDs 14 to present a true color or a
near true color from a shaded field with minimized interaction with
ambient light. Further, the louver blades 28 can provide shadow in
an area of the front display surface 12. When it is desired that a
portion of the front display surface 12 be dark or present a black
surface when video or graphic content is displayed, the shade
provided by the louver blades 28 can assist so that the unlit
portion of the front display surface 12 can appear black. If glare,
such as sunshine glare, is not expected to be an issue, such as
when the LED module 10 is configured for use in an interior
environment or if the module 10 will be shaded by another structure
during use, then the louver blades 28 can be omitted.
[0025] FIGS. 2 and 3 show an example of a video display module 10
including a circuit board 16 encapsulated by an encapsulating mask
20. As shown in FIGS. 2 and 3, the encapsulating mask 20 can
substantially cover at least the front face 18 of the circuit board
16 and the LEDs 14 mounted to the circuit board 16. In an example,
the encapsulating mask 20 can encapsulate all or substantially all
of the circuit board front face 18 and can encapsulate all or
substantially all of the LEDs 14 mounted to the circuit board 16.
In the example shown in FIG. 2, the encapsulating mask 20 can
encapsulate all or substantially all of the circuit board 16, e.g.,
all or substantially all of the front face 18, all or substantially
all of an opposing rear face 30 of the circuit board 16, and all or
substantially all of an edge 32 of the circuit board 16.
[0026] The encapsulating mask 20 can be adhered to all or
substantially all of the surfaces that the mask 20 is intended to
be sealing. In an example, the encapsulating mask 20 can be formed
over the top of the circuit board 16 and mounted LEDs 14, such as
by casting or molding the material of the encapsulating mask 20
around or over the circuit board 16, as described in more detail
below. Casting or molding of the encapsulating mask 20 can provide
for adhesion of the material to substantially the entirety of the
front face 18 of the circuit board 16, and if desired substantially
the entirety of the rear face 30 as well, to provide for sealing of
substantially all of the surfaces that are covered by the
encapsulating mask 20.
[0027] In an example, described in more detail below, the
encapsulating mask 20 is formed by molding a seal material onto or
around the circuit board 16. The circuit board 16 can be placed in
a mold with a mold cavity having a shape that corresponds to a
desired shape of the encapsulating mask 20. The mold can be
configured so that the resulting encapsulating mask 20 has a
profile that substantially corresponds to or matches a profile of
the circuit board 16.
[0028] The material of the encapsulation mask 20 can be any
material that is suitable for sealing the LEDs 14 and other
electronic components mounted to the circuit board 16 from the
environment, and particularly from air and moisture. The material
of the encapsulation mask 20 can be selected based on at least one
of the following characteristics: [0029] (a) the ability of the
material to be molded into the desired final shape of the
encapsulation mask 20--moldability of the encapsulating material
can include how rapidly the material can be molded (with faster
molding being preferred), and how easily the material can be
dispensed into the mold geometries that form the encapsulating mask
20. The ability to shape the encapsulation mask 20 can also include
the tolerance that can be achieved around the LED 14 and the
encapsulation mask 20, such as between the projections 21 and the
louver 24, as shown, for example, in FIG. 2. A larger tolerance,
while still providing for the same pixel pitch, is desirable
because it can provide for easier large-scale manufacturing; [0030]
(b) the optical properties of the final encapsulation mask 20,
including transparency to the light emitted from the LEDs 14, and
the percentage of light emitted by an LED 14 that is actually
transmitted through the encapsulation mask 20 (e.g., the portion of
the light that is not reflected back by the encapsulation mask 20
or absorbed by the encapsulation mask 20); [0031] (c) the
temperature stability of the material--in an outdoor video display
module 10, the material of the encapsulating mask 20 can be
subjected to a wide range of temperatures over a normal annual
cycle. In an example, it can be preferred that the encapsulating
material be stable at low temperatures down to -40.degree. C., or
lower and at high temperatures of up to 85.degree. C. or higher;
[0032] (d) the ability to dispense the material without the
presence of gas bubbles or to remove the gas bubbles before
curing--because the encapsulating mask 20 can cover the LEDs 14, it
would be undesirable for the encapsulating mask 20 to include
embedded or entrained air bubbles. If an air bubble were to be
placed over an LED 14, then the air bubble could interfere with the
optics of the LED 14 and create a distorting effect in the video
image or video of the video display module 10; [0033] (e) aspects
of the curing of the material, including method of curing, speed of
curing, and changes that occur with the material during curing
(e.g., expansion or contract and shape change); [0034] (f) the
ability for the encapsulating mask 20 to seal against water, such
as the ability to hermetically seal the LEDs 14 and other
components mounted to the circuit board 16; [0035] (g) corrosion
resistance for the components sealed by the encapsulation mask 20;
[0036] (h) the coefficient of thermal expansion for the material in
for the temperatures that are expected to be encountered by the
video display module 10--as noted above, outdoor video display
modules can experience a wide range of temperatures over an annual
cycle (e.g., from -40.degree. C. to 85.degree. C.), such that the
encapsulating mask 20 can experience repeated cycles of expansion
and contraction. Such expansion and contraction can put stress on
the encapsulating mask 20 itself, on the LEDs 14 and other
components of the circuit board 16, and on the adhesive connection
between the encapsulating mask 20 and the LEDs 14 or the circuit
board 16. Preferably, the coefficient of thermal expansion over the
expected ambient temperatures is such that they do not cause damage
to the circuit board 16, the LEDs 14, or the encapsulating mask 20
and does not become separated from the LEDs 14 or the circuit board
16. [0037] (i) the durability of the material--in particular, the
durability of the encapsulating mask 20 with respect to abrasion
(e.g., via dust and other debris that can be blown into the video
display module 10 by winds), the durability of the encapsulating
mask 20 with respect to chemicals that are expected to be
encountered by the video display module 10 (e.g., environmental
chemicals or pollutants such as salt spray in coastal areas), the
encapsulating mask 20 resistance to fire or flame, and resistance
to UV radiation, such as resistance of the encapsulating mask 20 to
UV; [0038] (j) material repairability--the encapsulating mask 20
can become damaged during manufacturing, transportation,
installation, repair, or over time while the video display module
10 is installed. However, it can be undesirable to require
replacement of the entire video display module 10 if small damage
or a small defect in the encapsulating mask 20 is discovered.
Therefore, if the encapsulating mask 20 can be repaired, such as by
filling a defect or painting over the defect with the same or a
different encapsulating material, it would be desirable. In
particular, the ability to repair a defect in the field without
having to ship the video display module 10 back to the original
manufacturer or another repair facility would be very desirable;
[0039] (k) material cost.
[0040] Examples of materials that can be used for the encapsulation
mask 20 include, but are not limited to, silicones and
polyurethanes. In an example, the encapsulation mask 20 can be
molded from a silicone encapsulant, such as silicone electronics
encapsulants manufactured by Dow Corning Corp., Midland, Mich.,
USA, such as Dow Corning EE-1184 silicone encapsulant.
[0041] The encapsulating mask 20 can also form lenses over the LEDs
14 to enhance or optimize the optics for light emitted from the
LEDs 14. As noted above, the lensing effect of the encapsulating
mask 20, e.g., via a lens formed by the projection 21, can be
configured to provide for an altered viewing angle of the LED 14
compared to the viewing angle that would be experienced without the
encapsulating mask 20, as demonstrated in FIG. 6. FIG. 6 shows a
natural viewing angle .theta. of the LED 14 that would occur if the
encapsulating mask 20 did not act as a lens for the LED 14 and an
altered viewing angle .theta..sub.Lens that can occur if the
encapsulating mask 20 is configured to act as a lens. As shown, the
natural viewing angle .theta. can be such that a louver blade 28
will interfere with the light being emitted from the LED 14 unless
the length L.sub.Blade of the louver blade 28 is shortened (which,
in turn, can reduce the effectiveness of the louver blade 28 for
its purpose of improving contrast of the display module 10). The
lens-altered viewing angle .theta..sub.Lens can allow for a desired
length L.sub.Blade of the louver blade 28 without interference with
light from the LED 14.
[0042] FIG. 8 shows a flow chart of an example method 100 for
manufacturing a video display module, such as module 10, including
a video-display element circuit board 16 at least partially
encapsulated by an encapsulation mask, such as encapsulation mask
20. The method 100 can include, at 102, assembling a circuit board
16 for a video display module 10, such as by mounting a plurality
of light-emitting elements, such as LEDs 14 to a front face 18 of
the circuit board 16. Assembling the circuit board 16, at 102, can
also include mounting other electrical components that can provide
for operation of the video display module 10, such as capacitors
and convertor components (e.g., Direct Current-Direct Current
convertors. Mounting the LEDs 14 and other electrical components
can include soldering the LEDs 14 or components to connection pads
(e.g., solder pads) on the circuit board 16, such as by applying a
solder paste to the solder pads, placing the LEDs 14 and components
onto the solder paste, and reflowing the solder to form a
mechanical and electrical connection between the LEDs 14 and other
components and the solder pads. Assembling the circuit board 16, at
102, can also include electrically connecting the LEDs 14 and other
electrical components, such as by forming the solder pads and
conduction pathways, such as traces, on the circuit board 16.
Alternatively, the circuit board 16 can be manufactured by a third
party. e.g., a vendor or contractor, and received at step 102.
[0043] In an example, the encapsulating material that may be
desirable for its mechanical properties and durability properties
may not form a satisfactory bond with the front face 18 or the LEDs
14. Therefore, some form of surface treatment can be used, at 104,
to surface treat at least a portion of the front face 18 or at
least a portion of the plurality of LEDs 14, or both. In an
example, the surface treatment can comprise chemical treatment of
the front face 18 and the LEDs 14. The chemical treatment can
comprise treating the surfaces of the front face 18 and the LEDs 14
that are to be covered by the encapsulating mask 20 with one or
more chemicals that can alter one or more physical or chemical
properties of the treated surfaces. For example, the treating
chemical or chemicals can alter bonding sites on the surfaces or
the treating chemical can enhance the surface energy of the
surfaces.
[0044] In an example, treating the surfaces, at 104, can comprise
applying a primer material to the surfaces of the front face 18 and
the LEDs 14, wherein the primer material can sufficiently bond to
the front face 18 and the LEDs 14 as well as to the encapsulating
material of the encapsulating mask 20.
[0045] In another example, surface treating the LEDs 14 and the
circuit board 16. e.g., treating the front face 18, at 104, can
include plasma treatment or flame treatment, or both, of the
surfaces that are to be covered by the encapsulating mask 20.
Plasma treatment can include exposing the portions of the circuit
board 16 to a plasma, such as an atmospheric plasma treatment.
Plasma treatment can activate the surfaces to provide for adhesion
of the material of the encapsulating mask 20 to the LEDs 14 and the
circuit board 16. In an example, plasma treatment can alter the
surface energy of the surfaces of the LEDs 14 or the circuit board
16, or can alter the surface tension of the surfaces of the LEDs 14
or the circuit board 16, or both.
[0046] Flame treatment can include exposing the portions of the
circuit board 16 to be surface treated to a flame for a short
period of time, which can activate the surfaces of the circuit
board 16 to promote bonding the encapsulating material. The flame
can also be used as a method of delivering one or more compounds
that can increase the surface energy of the surfaces to be treated
in order to provide for improved adhesion between the surface being
treated and the material of the encapsulating mask 20. The flame
can be formed by combusting a mixture of a fuel such as natural
gas, and air at a burner. The portions of the circuit board 16 to
be treated can be passed through the flame at the burner so that
each portion to be flame treated is exposed to the flame for long
enough to activate the surfaces, but not so long so as to damage or
otherwise alter the circuit board 16, the LEDs 14, or any other
electrical components on the circuit board 16. The flame treatment
can alter the surface tension of the surfaces of the circuit board
16 or the LEDs 14, or both, or can alter the surface energy of the
surfaces. In an example, each portion of the circuit board 16 that
is to be flame treated is exposed to the flame for a short period
of time, e.g., only a few milliseconds to a half a second.
[0047] As discussed above, in an example, wherein the encapsulating
mask 20 is configured to encapsulate substantially the entire
circuit board 16. e.g., the front face 18, the rear face 30, and
the edge 32 of the circuit board 16. In such a case, both the front
face 18 and the rear face 30, and if desired the edge 32, can be
surface treated, such as by applying a chemical primer or other
chemical treatment to the faces 18, 30 and edge 32, or by plasma
treating or flame treating the rear face 30 and edge 32 in addition
to the front face 18.
[0048] After surface treating the surfaces to be encapsulated
(e.g., the front face 18, and if desired, the rear face 30 and the
edge 32), the encapsulating mask 20 can be formed over the circuit
board 16. The encapsulating mask 20 can be adhered to the circuit
board 16 and the LEDs 14 such that the LEDs 14 and any other
electronic components encapsulated by the encapsulating mask 20 are
substantially scaled, e.g., are substantially sealed against
moisture and air.
[0049] In an example, forming the encapsulating mask 20 can
comprise casting or molding the encapsulating material to form the
encapsulating mask 20. Casting or molding the encapsulating mask 20
can comprise a number of steps. At 106, the circuit board 16 (which
may or may not have been surface treated, as described above with
respect to step 104) can be placed into a mold 34 (see, e.g., FIG.
7). The mold 34 can comprise a cavity 36 having a geometry
corresponding to the desired geometry of the encapsulating mask 20.
For example, the cavity 36 can include a plurality of pockets 38
that correspond to the shape of the projections 21 of the
encapsulating mask 20. In an example, the circuit board 16 can be
placed into the mold 34 with the front face 18 facing down so that
each of the LEDs 14 can be placed into and positioned within a
corresponding pocket 38. The mold 34 can also include one or more
positioning structures 40 that correspond to other geometric
features of the circuit board 16 to ensure that the circuit board
16 is properly aligned with the mold 34. A jig 42 can be mounted to
the mold 34 to hold the circuit board 16 in the proper position and
alignment, for example while the mold 34 is moved around.
[0050] At 108, the encapsulating material 44 of the encapsulating
mask 20 can be dispensed into the mold 34, as shown in FIG. 7. In
an example, the encapsulating material 44 can be dispensed using a
vacuum molding technique. The encapsulating material 44 can
comprise a gel-like material that comprises the material of the
encapsulating mask 20. In some examples, the encapsulating material
44 can comprise a silicone-based or a polyurethane-based gel that
can be dispensed by any acceptable gel or liquid dispensing
technique.
[0051] The mold 34 can be placed into a vacuum chamber where a
vacuum pressure can be applied. In an example, the vacuum pressure
in the vacuum chamber can be between about 10 torr (about 1.33
kilopascal) and about 40 torr (about 5.33 kilopascal). After the
vacuum is formed in the vacuum chamber (e.g., after sufficient air
has been evacuated from the vacuum chamber), the encapsulating
material 44 can be dispensed into the mold 34. The application of a
vacuum to the encapsulating material 44 can provide for the removal
of air or other gas bubbles entrained within the encapsulating
material 44. An air or gas bubble that is in front of an LED 14,
e.g., within a projection 21, can distort the optics from the LED
14. Therefore, removal of air or gas bubbles from the encapsulating
material 44 can, in some examples, be critical. In an example, the
encapsulating material 44 can be "pre-vacuumed." e.g., the
encapsulating material 44 can be subjected to a vacuum before it is
dispensed into the mold 34 in order to remove a substantial portion
of the air or other gas from within the encapsulating material 44.
The encapsulating material 44 can be dispensed into the mold 34
until the encapsulating material 44 covers a desired portion of the
circuit board 16. In an example, the encapsulating material 44 can
be dispensed until it covers the entire rear face 30 or
substantially the entire rear face 30. After dispensing the
encapsulating material 44, the mold 34 can be allowed to flow
around the circuit board 16 and to settle for a predetermined
period of time. In an example, the encapsulating material 44 can be
allowed to flow and settle for from about 2 seconds to about 3
minutes, such as from about 3 seconds to about 10 seconds. The mold
34 can then be removed from the vacuum chamber.
[0052] At 110, after dispensing the encapsulating material 44 into
the mold 34, the encapsulating material 44 can be cured to form the
substantially solidified encapsulating mask 20. In an example, the
encapsulating material 44 can be a heat curable material that will
cure upon the application of sufficient heat energy so that the
encapsulating material 44 reaches a trigger temperature. In an
example, the mold 34 with the dispensed encapsulating material 44
can be heated to the trigger temperature encapsulating material 44
with a heater. In an example, the mold 34 can be placed between a
pair of heating plates. The mold 34 and the jig 42 can be
compressed between the heating plates. The heating plates can then
be heated to a temperature that is sufficient so that heat
transferred from the heating plates through the mold 34 and the jig
42 will be sufficient for the encapsulating material 44 to reach
the trigger temperature. The heat from the heating plates will heat
the mold 34 and the jig 42, which can then heat the encapsulating
material 44 via conduction. The heated encapsulating material 44
can begin to cure and solidify, eventually forming the
encapsulating mask 20. In an example, the encapsulating material
441 can continue to cure and solidify after the mold 34 is removed
from the heater. In an example, the curing of the encapsulating
material 44 causes the encapsulating mask 20 to be adhered to the
surfaces to be encapsulated. As described above, the surface
treatment, such as chemical treatment or flame treatment, can
facilitate adhesion of the encapsulating mask 20 to the circuit
board 16.
[0053] At 112, after curing the encapsulating material 44 via
heating, the mold 34 can optionally be cooled, such as by a cooler.
In an example, the cooler can comprise a pair of cooled plates that
can be similar to the heating plates of the heater, with the mold
34 and the jig 42 being compressed between the cooling plates. A
cooling fluid, such as chilled water, can be circulated by or
through the cooled plates. The cooler can cool the mold 34 and the
cured encapsulating mask 20, such as down to room temperature.
[0054] At 114, after curing the encapsulating material 44 to form
the encapsulating mask 20 and, if desired, cooling the mold 34, the
encapsulated circuit board 16 can be removed from the mold 34. In
an example, the encapsulated circuit board 16 can be removed by
unsecuring the jig 42 from the mold 34 and lifting the encapsulated
circuit board 16 from the mold 34. The used mold 34 and jig 42 can
be returned to the surface treatment step where a newly treated
circuit board 16 can be placed into the mold 34, secured by the jig
42, and the encapsulating material 44 dispensing process can be
started again.
[0055] At 116, the video display module 10 can be assembled using
the encapsulated circuit board 16. The encapsulated circuit board
16 can be aligned with a corresponding louver 24 and a
corresponding housing 22. In an example, a frame (not shown) can be
used to position the louver 24, the encapsulated circuit board 16,
and the housing 22 with respect to each other. In an example, the
louver 24 is first placed on the frame, with a front side of the
louver 24 being placed down on the frame. Next, the encapsulated
circuit board 16 can be placed, with the front face 18 down onto
the louver 24. The circuit board 16 can comprise a plurality of
louver registering openings that corresponding to a plurality of
louver pegs 46 that extend rearward from the louver 24 (best seen
in FIG. 2). The louver pegs 46 can be aligned with the louver
registering openings in the circuit board 16 to align the louver 24
and the encapsulated circuit board 16 with respect to each other.
Next, the housing 22 can be placed with a front side of the housing
being placed down onto the rear face 30 of the encapsulated circuit
board 16. Aligning structures on the rear face 30 of the circuit
board 16 and the front side of the housing 22 can ensure alignment
of the encapsulated circuit board 16 and the housing 22.
Alternatively, the louver registration openings in the circuit
board 16 can extend throughout the entire thickness of the circuit
board 16 so that the pegs 46 can extend through the circuit board
16 and past the rear face 30. The aligning structures of the
housing 22 can include a plurality of registration recesses that
can each receive a portion of a corresponding louver pegs 46 so
that the louver 24, the encapsulated circuit board 16, and the
housing 22 can be aligned with respect to one another.
[0056] After aligning the louver 24, the encapsulated circuit board
16, and the housing 22, the components can be attached together. In
an example, the louver 24 and the housing 22 can be made from a
plastic or other polymeric material, so that the louver 24,
encapsulated circuit board 16, and housing 22 can be welded
together. As noted above, the louver registering openings in the
circuit board 16 can extend through the entire thickness of the
circuit board 16 so that the louver pegs 46 can extend through the
circuit board 16 and contact the housing 22. The registration
recesses of the housing 22 can receive the corresponding louver
pegs 46. The components can then be clamped together, and the
louver pegs 46 can be welded to the housing 22. In an example, a
clamping apparatus can include a plurality of heating probes that
are aligned with the louver pegs 46 and the registration recesses
of the housing 22. When the module components are clamped together,
the heating probes can be compressed against the housing 22 or the
louver 24 at the locations of the louver pegs 46 and heat can be
locally applied, which can heat stake the louver pegs 46 so that
the louver pegs 46 become coupled with the housing 22. The louver
pegs 46 can also become coupled with the encapsulated circuit board
16, such as by becoming coupled to the encapsulating mask 20. The
module 10 can then be allowed to cool while still clamping the
module components together so that the louver pegs 46 cool and
become coupled to the housing 22 to form a module assembly.
[0057] After attaching the louver 24, the encapsulated circuit
board 16, and the housing 22 together, any final components of the
video display assembly 10 can be assembled, as needed. For example,
electronics 48 (FIG. 5), such as power supply electronics or
control electronics, can be coupled to the housing and electrically
coupled to the electronics of the circuit board. A fan 50 can be
coupled adjacent to the electronics and the housing 22. The
electronics 48 and the fan 50 can be attached to the assembly, for
example, by fastening the electronics 48 and the fan 50 to the
housing 22 with fasteners, such as screws 52.
[0058] To better illustrate the apparatuses and methods disclosed
herein, a non-limiting list of examples is provided here:
[0059] EXAMPLE 1 can include subject matter (such as an apparatus,
a device, a method, or one or more means for performing acts), such
as can include a video display module comprising a circuit board
having a front face, a plurality of light-emitting elements
electrically coupled to the front face of the circuit board, and a
polymer encapsulating member adhered to at least the front face of
the circuit board, the polymer encapsulating member substantially
covering at least a portion of the circuit board and a portion of
the plurality of light-emitting elements, the polymer encapsulating
member substantially sealing the portion of the circuit board and
the portion of the plurality of light-emitting elements.
[0060] EXAMPLE 2 can include, or can optionally be combined with
the subject matter of EXAMPLE 1, to optionally include the polymer
encapsulating member having a profile that substantially
corresponds to a mating profile of the portion of the circuit board
and the portion of the plurality of light-emitting elements.
[0061] EXAMPLE 3 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1 and 2,
to optionally include the front face of the circuit board being
treated to promote adhesion between the polymer encapsulating
member and the front face.
[0062] EXAMPLE 4 can include, or can optionally be combined with
the subject matter of EXAMPLE 3, to optionally include the front
face of the circuit board being treated by plasma treating the
front face.
[0063] EXAMPLE 5 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 3 and 4,
to optionally include the front face of the circuit board being
treated by flame treating the front face.
[0064] EXAMPLE 6 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 3-5, to
optionally include the front face of the circuit board being
treated by applying a primer to the front face.
[0065] EXAMPLE 7 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-6, to
optionally include the portion of the circuit board being treated
to promote adhesion between the polymer encapsulating member and
the portion of the circuit board.
[0066] EXAMPLE 8 can include, or can optionally be combined with
the subject matter of EXAMPLE 7, to optionally include at least the
portion of the circuit board being treated by plasma treating.
[0067] EXAMPLE 9 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 7 and 8,
to optionally include at least the portion of the circuit board
being treated by flame treating.
[0068] EXAMPLE 10 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 7-9, to
optionally include at least the portion of the circuit board being
treated by applying a primer to the portion of the circuit.
[0069] EXAMPLE 11 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-10, to
optionally include the portion of the plurality of light-emitting
elements being treated to promote adhesion between the polymer
encapsulating member and the portion of the plurality of
light-emitting elements.
[0070] EXAMPLE 12 can include, or can optionally be combined with
the subject matter of EXAMPLE 11, to optionally include at least
the portion of the light-emitting elements being treated by plasma
treating.
[0071] EXAMPLE 13 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 11 and 12,
to optionally include at least the portion of the light-emitting
elements being treated by flame treating.
[0072] EXAMPLE 14 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 11-13, to
optionally include at least the portion of the light-emitting
elements being treated by applying a primer to the portion of the
light-emitting elements.
[0073] EXAMPLE 15 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-14, to
optionally include the plurality of light-emitting elements
comprising surface-mounted light-emitting elements.
[0074] EXAMPLE 16 can include, or can optionally be combined with
the subject matter of EXAMPLE 15, to optionally include each of the
plurality of surface-mounted light-emitting elements being soldered
to the circuit board with an ultraviolet light resistant
solder.
[0075] EXAMPLE 17 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-16, to
optionally include at least a portion of the polymer encapsulating
member over each of the portion of the plurality of light-emitting
elements being substantially transparent to visible light.
[0076] EXAMPLE 18 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-17, to
optionally include a louver mounted over the polymer encapsulating
member.
[0077] EXAMPLE 19 can include, or can optionally be combined with
the subject matter of EXAMPLE 18, to optionally include the louver
comprising louver blades extending from an exterior side of the
louver.
[0078] EXAMPLE 20 can include, or can optionally be combined with
the subject matter of EXAMPLE 19, to optionally include the louver
blades extending at least partially over each of the plurality of
light-emitting elements.
[0079] EXAMPLE 21 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 19 and 20,
to optionally include the louver blades extending at least
partially under each of the plurality of light-emitting
elements.
[0080] EXAMPLE 22 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 18-21, to
optionally include the louver comprising a plurality of
openings.
[0081] EXAMPLE 23 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 1-22, to optionally
include the polymer encapsulating member comprising a plurality of
light-emitting element receiving projections that extend from an
exterior side of the polymer encapsulating member.
[0082] EXAMPLE 24 can include, or can optionally be combined with
the subject matter of EXAMPLE 23, to optionally include each
projection being configured to receive one of the plurality of
light-emitting elements.
[0083] EXAMPLE 25 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 22 and 24,
to optionally include each light-emitting element receiving
projection extending at least partially into one of the plurality
of openings in the louver.
[0084] EXAMPLE 26 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-25, to
optionally include the circuit board comprising a rear face
opposing the front face.
[0085] EXAMPLE 27 can include, or can optionally be combined with
the subject matter of EXAMPLE 26, to optionally include the polymer
encapsulating member covering substantially all of the front
face.
[0086] EXAMPLE 28 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 26 and 27,
to optionally include the polymer encapsulating member covering
substantially all of the rear face.
[0087] EXAMPLE 29 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 26-28, to
optionally include the rear face of the circuit board being treated
to promote adhesion between the polymer encapsulating member and
the rear face.
[0088] EXAMPLE 30 can include, or can optionally be combined with
the subject matter of EXAMPLE 29, to optionally include the rear
face of the circuit board being treated by plasma treating the rear
face.
[0089] EXAMPLE 31 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 29 and 30,
to optionally include the rear face of the circuit board being
treated by flame treating the rear face.
[0090] EXAMPLE 32 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 29-31, to
optionally include the rear face of the circuit board being treated
by applying a primer to the rear face.
[0091] EXAMPLE 33 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-32, to
optionally include the circuit board comprising an edge along one
or more sides extending rearward from the front face.
[0092] EXAMPLE 34 can include, or can optionally be combined with
the subject matter of EXAMPLE 33, to optionally include the polymer
encapsulating member covering substantially all of the edge.
[0093] EXAMPLE 35 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 33 and 34,
to optionally include the edge of the circuit board being treated
to promote adhesion between the polymer encapsulating member and
the edge.
[0094] EXAMPLE 36 can include, or can optionally be combined with
the subject matter of EXAMPLE 35, to optionally include the edge of
the circuit board being treated by plasma treating the edge.
[0095] EXAMPLE 37 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 35 and 36,
to optionally include the edge of the circuit board being treated
by flame treating the edge.
[0096] EXAMPLE 38 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 35-37, to
optionally include the edge of the circuit board being treated by
applying a primer to the edge.
[0097] EXAMPLE 39 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-38, to
optionally include the polymer encapsulating member comprising a
silicone or polyurethane material.
[0098] EXAMPLE 40 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-39, to
include subject matter (such as an apparatus, a device, a method,
or one or more means for performing acts), such as can include a
video display module comprising a circuit board having a front
face, a plurality of light-emitting elements electrically coupled
to the front face of the circuit board, and a polymer encapsulating
member adhered to the front face of the circuit board, the polymer
encapsulating member substantially covering at least a portion of
the circuit board and a portion of the plurality of light-emitting
elements, wherein the polymer encapsulating member is shaped over
each of the portion of the plurality of light-emitting elements to
form a lens over each of the portion of the plurality of
light-emitting elements.
[0099] EXAMPLE 41 can include, or can optionally be combined with
the subject matter of EXAMPLE 40, to optionally include the shape
of each lens over each of the portion of the plurality of
light-emitting elements being configured to provide for a
predetermined viewing angle of each of the portion of the plurality
of light-emitting elements.
[0100] EXAMPLE 42 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 40 and 41,
to optionally include the polymer encapsulating member
substantially sealing the portion of the circuit board.
[0101] EXAMPLE 43 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 40-42, to
optionally include the polymer encapsulating member substantially
sealing the portion of the plurality of light-emitting
elements.
[0102] EXAMPLE 44 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 40-43, to
optionally include the front face of the circuit board being
treated to promote adhesion between the polymer encapsulating
member and the front face.
[0103] EXAMPLE 45 can include, or can optionally be combined with
the subject matter of EXAMPLE 44, to optionally include the front
face of the circuit board being treated by plasma treating the
front face.
[0104] EXAMPLE 46 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 44 and 45,
to optionally include the front face of the circuit board being
treated by flame treating the front face.
[0105] EXAMPLE 47 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 44-46, to
optionally include the front face of the circuit board being
treated by applying a primer to the front face.
[0106] EXAMPLE 48 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 40-47, to
optionally include the portion of the circuit board being treated
to promote adhesion between the polymer encapsulating member and
the portion of the circuit board.
[0107] EXAMPLE 49 can include, or can optionally be combined with
the subject matter of EXAMPLE 48, to optionally include at least
the portion of the circuit board being treated by plasma
treating.
[0108] EXAMPLE 50 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 48 and 49,
to optionally include at least the portion of the circuit board
being treated by flame treating.
[0109] EXAMPLE 51 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 48-50, to
optionally include at least the portion of the circuit board being
treated by applying a primer to the portion of the circuit.
[0110] EXAMPLE 52 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 40-51, to
optionally include the portion of the plurality of light-emitting
elements being treated to promote adhesion between the polymer
encapsulating member and the portion of the plurality of
light-emitting elements.
[0111] EXAMPLE 53 can include, or can optionally be combined with
the subject matter of EXAMPLE 52, to optionally include at least
the portion of the light-emitting elements being treated by plasma
treating.
[0112] EXAMPLE 54 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 52 and 53,
to optionally include at least the portion of the light-emitting
elements being treated by flame treating.
[0113] EXAMPLE 55 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 52-54, to
optionally include at least the portion of the light-emitting
elements being treated by applying a primer to the portion of the
light-emitting elements.
[0114] EXAMPLE 56 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 40-55, to
optionally include the plurality of light-emitting elements
comprising surface-mounted light-emitting elements.
[0115] EXAMPLE 57 can include, or can optionally be combined with
the subject matter of EXAMPLE 56, to optionally include each of the
plurality of surface-mounted light-emitting elements are soldered
to the circuit board with a ultraviolet light resistant solder.
[0116] EXAMPLE 58 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 40-57, to
optionally include a louver mounted over the polymer encapsulating
member.
[0117] EXAMPLE 59 can include, or can optionally be combined with
the subject matter of EXAMPLE 58, to optionally include the louver
comprising louver blades extending from an exterior side of the
louver.
[0118] EXAMPLE 60 can include, or can optionally be combined with
the subject matter of EXAMPLE 59, to optionally include the louver
blades extending at least partially over each of the plurality of
light-emitting elements.
[0119] EXAMPLE 61 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 59 and 60,
to optionally include the louver blades extending at least
partially under each of the plurality of light-emitting
elements.
[0120] EXAMPLE 62 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 58-61, to
optionally include the louver comprising a plurality of
openings.
[0121] EXAMPLE 63 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 40-63, to optionally
include the polymer encapsulating member comprising a plurality of
light-emitting element receiving projections that extend from an
exterior side of the polymer encapsulating member.
[0122] EXAMPLE 64 can include, or can optionally be combined with
the subject matter of EXAMPLE 63, to optionally include each
projection being configured to receive one of the plurality of
light-emitting elements.
[0123] EXAMPLE 65 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 62 and 64,
to optionally include each light-emitting element receiving
projection extending at least partially into one of the plurality
of openings in the louver.
[0124] EXAMPLE 66 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 40-65, to optionally
include the circuit board comprising a rear face opposing the front
face.
[0125] EXAMPLE 67 can include, or can optionally be combined with
the subject matter of EXAMPLE 66, to optionally include the polymer
encapsulating member covering substantially all of the front
face.
[0126] EXAMPLE 68 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 66 and 67,
to optionally include the polymer encapsulating member covering
substantially all of the rear face.
[0127] EXAMPLE 69 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 66-68, to
optionally include the rear face of the circuit board being treated
to promote adhesion between the polymer encapsulating member and
the rear face.
[0128] EXAMPLE 70 can include, or can optionally be combined with
the subject matter of EXAMPLE 69, to optionally include the rear
face of the circuit board being treated by plasma treating the rear
face.
[0129] EXAMPLE 71 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 69 and 70,
to optionally include the rear face of the circuit board being
treated by flame treating the rear face.
[0130] EXAMPLE 72 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 69-71, to
optionally include the rear face of the circuit board being treated
by applying a primer to the rear face.
[0131] EXAMPLE 73 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 40-72, to
optionally include the circuit board comprising an edge along one
or more sides extending from the front face.
[0132] EXAMPLE 74 can include, or can optionally be combined with
the subject matter of EXAMPLE 73, to optionally include the polymer
encapsulating member covering substantially all of the edge.
[0133] EXAMPLE 75 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 73 and 74,
to optionally include the edge of the circuit board being treated
to promote adhesion between the polymer encapsulating member and
the edge.
[0134] EXAMPLE 76 can include, or can optionally be combined with
the subject matter of EXAMPLE 75, to optionally include the edge of
the circuit board being treated by plasma treating the edge.
[0135] EXAMPLE 77 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 75 and 76,
to optionally include the edge of the circuit board being treated
by flame treating the edge.
[0136] EXAMPLE 78 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 75-77, to
optionally include the edge of the circuit board being treated by
applying a primer to the edge.
[0137] EXAMPLE 79 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 40-78, to optionally
include the polymer encapsulating member comprising a silicone
material.
[0138] EXAMPLE 80 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 40-79, to optionally
include the polymer encapsulating member comprising a polyurethane
material.
[0139] EXAMPLE 81 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 1-80, to
include subject matter (such as an apparatus, a device, a method,
or one or more means for performing acts), such as can include a
method of manufacturing a video display module, the method
comprising providing or receiving a circuit board comprising a
plurality of light-emitting elements mounted to a front face of the
circuit board, forming a polymer encapsulating member over at least
a portion of the front face of the circuit board and at least a
portion of the plurality of light-emitting elements, adhering the
polymer encapsulating member to the front face of the circuit
board, and sealing at least the portion of the front face of the
circuit board and the portion of the plurality of light-emitting
elements with the polymer encapsulating member.
[0140] EXAMPLE 82 can include, or can optionally be combined with
the subject matter of EXAMPLE 81, to optionally include the
providing the circuit board comprising mounting the plurality of
light-emitting elements to the front face of the circuit board.
[0141] EXAMPLE 83 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 81 and 82, to optionally
include forming the polymer encapsulating member with a profile
that substantially corresponds to a mating profile of the portion
of the front face of the circuit board and the portion of the
plurality of light-emitting elements.
[0142] EXAMPLE 84 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 81-83, to optionally
include molding a polymer material to form the polymer
encapsulation member.
[0143] EXAMPLE 85 can include, or can optionally be combined with
the subject matter of EXAMPLE 84, to optionally include molding the
polymer material over at least the portion of the front face of the
circuit board.
[0144] EXAMPLE 86 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 84 and 85, to optionally
include molding the polymer material over at least the portion of
the plurality of light-emitting elements.
[0145] EXAMPLE 87 can include, or can optionally be combined with
the subject matter of any one of EXAMPLE 81-86, to optionally
include casting a polymer material to form the polymer
encapsulation member.
[0146] EXAMPLE 88 can include, or can optionally be combined with
the subject matter of EXAMPLE 87, to optionally include casting the
polymer material over at least the portion of the front face of the
circuit board.
[0147] EXAMPLE 89 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 87 and 88, to optionally
include casting the polymer material over at least the portion of
the plurality of light-emitting elements.
[0148] EXAMPLE 90 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 84-89, to optionally
include the polymer material comprising a polyurethane.
[0149] EXAMPLE 91 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 84-90, to optionally
include the polymer material comprising a silicone.
[0150] EXAMPLE 92 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 81-91, to optionally
include treating at least the portion of the front face of the
circuit board to promote adhesion between the polymer encapsulating
member and the portion of the front face of the circuit board.
[0151] EXAMPLE 93 can include, or can optionally be combined with
the subject matter of EXAMPLE 92, to optionally include the
treating comprising plasma treating at least the portion of the
front face of the circuit board.
[0152] EXAMPLE 94 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 92 and 93, to optionally
include the treating comprising flame treating at least the portion
of the front face of the circuit board.
[0153] EXAMPLE 95 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 92-94, to optionally
include the treating comprising applying a primer to at least the
portion of the front face of the circuit board.
[0154] EXAMPLE 96 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 81-95, to optionally
include treating at least the portion of the plurality of
light-emitting elements to promote adhesion between the polymer
encapsulating member and the portion of the plurality of
light-emitting elements.
[0155] EXAMPLE 97 can include, or can optionally be combined with
the subject matter of EXAMPLE 96, to optionally include the
treating comprising plasma treating at least the portion of the
plurality of light-emitting elements.
[0156] EXAMPLE 98 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 96 and 97, to optionally
include the treating comprising flame treating at least the portion
of the plurality of light-emitting elements.
[0157] EXAMPLE 99 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 96-98, to optionally
include the treating comprising applying a primer to at least the
portion of the plurality of light-emitting elements.
[0158] EXAMPLE 100 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 81-99, to optionally
include the circuit board comprising a rear face opposing the front
face.
[0159] EXAMPLE 101 can include, or can optionally be combined with
the subject matter of EXAMPLE 100, to optionally include forming
the polymer encapsulating member to cover substantially all of the
front face.
[0160] EXAMPLE 102 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 100 and
101, to optionally include forming the polymer encapsulating member
to cover substantially all of the rear face.
[0161] EXAMPLE 103 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 100-102,
to optionally include treating at least the rear face of the
circuit board to promote adhesion between the polymer encapsulating
member and the rear face.
[0162] EXAMPLE 104 can include, or can optionally be combined with
the subject matter of EXAMPLE 103, to optionally include the
treating comprising plasma treating at least the rear face of the
circuit board.
[0163] EXAMPLE 105 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 103 and
104, to optionally include the treating comprising flame treating
at least the rear face of the circuit board.
[0164] EXAMPLE 106 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 103-105,
to optionally include the treating comprising applying a primer to
at least the rear face of the circuit board.
[0165] EXAMPLE 107 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 40-72, to
optionally include the circuit board comprising an edge along one
or more sides extending from the front face.
[0166] EXAMPLE 108 can include, or can optionally be combined with
the subject matter of EXAMPLE 107, to optionally include forming
the polymer encapsulating member to cover substantially all of the
edge.
[0167] EXAMPLE 109 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 107 and
108, to optionally include treating at least the edge of the
circuit board to promote adhesion between the polymer encapsulating
member and the edge.
[0168] EXAMPLE 110 can include, or can optionally be combined with
the subject matter of EXAMPLE 109, to optionally include the
treating comprising plasma treating at least the edge of the
circuit board.
[0169] EXAMPLE 111 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 109 and
110, to optionally include the treating comprising flame treating
at least the edge of the circuit board.
[0170] EXAMPLE 112 can include, or can optionally be combined with
the subject matter of one or any combination of EXAMPLES 109-111,
to optionally include the treating comprising applying a primer to
at least the edge of the circuit board.
[0171] EXAMPLE 113 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 81-112, to optionally
include the polymer encapsulating member comprising a silicone
material.
[0172] EXAMPLE 114 can include, or can optionally be combined with
the subject matter of any one of EXAMPLES 81-113, to optionally
include the polymer encapsulating member comprising a polyurethane
material.
[0173] The above Detailed Description is intended to be
illustrative, and not restrictive. For example, the above-described
examples (or one or more elements thereof) can be used in
combination with each other. Other embodiments can be used, such as
by one of ordinary skill in the art upon reviewing the above
description. Also, various features or elements can be grouped
together to streamline the disclosure. This should not be
interpreted as intending that an unclaimed disclosed feature is
essential to any claim. Rather, inventive subject matter can lie in
less than all features of a particular disclosed embodiment. Thus,
the following claims are hereby incorporated into the Detailed
Description, with each claim standing on its own as a separate
embodiment. The scope of the invention should be determined with
reference to the appended claims, along with the full scope of
equivalents to which such claims are entitled.
[0174] In the event of inconsistent usages between this document
and any documents so incorporated by reference, the usage in this
document controls.
[0175] In this document, the terms "a" or "an" are used, as is
common in patent documents, to include one or more than one,
independent of any other instances or usages of "at least one" or
"one or more." In this document, the term "or" is used to refer to
a nonexclusive or, such that "A or B" includes "A but not B." "B
but not A," and "A and B," unless otherwise indicated. In this
document, the terms "including" and "in which" are used as the
plain-English equivalents of the respective terms "comprising" and
"wherein." Also, in the following claims, the terms "including" and
"comprising" are open-ended, that is, a system, device, article,
composition, formulation, or process that includes elements in
addition to those listed after such a term in a claim are still
deemed to fall within the scope of that claim. Moreover, in the
following claims, the terms "first." "second." and "third," etc.
are used merely as labels, and are not intended to impose numerical
requirements on their objects.
[0176] Method examples described herein can be machine or
computer-implemented, at least in part. Some examples can include a
computer-readable medium or machine-readable medium encoded with
instructions operable to configure an electronic device to perform
methods or method steps as described in the above examples. An
implementation of such methods or method steps can include code,
such as microcode, assembly language code, a higher-level language
code, or the like. Such code can include computer readable
instructions for performing various methods. The code may form
portions of computer program products. Further, in an example, the
code can be tangibly stored on one or more volatile,
non-transitory, or non-volatile tangible computer-readable media,
such as during execution or at other times. Examples of these
tangible computer-readable media can include, but are not limited
to, hard disks, removable magnetic disks, removable optical disks
(e.g., compact disks and digital video disks), magnetic cassettes,
memory cards or sticks, random access memories (RAMs), read only
memories (ROMs), and the like.
[0177] The Abstract is provided to comply with 37 C.F.R.
.sctn.1.72(b), to allow the reader to quickly ascertain the nature
of the technical disclosure. It is submitted with the understanding
that it will not be used to interpret or limit the scope or meaning
of the claims.
* * * * *