U.S. patent application number 15/382123 was filed with the patent office on 2017-04-13 for treated component.
The applicant listed for this patent is GENERAL ELECTRIC COMPANY. Invention is credited to Srikanth Chandrudu KOTTILINGAM, Jon Conrad SCHAEFFER.
Application Number | 20170101707 15/382123 |
Document ID | / |
Family ID | 53797307 |
Filed Date | 2017-04-13 |
United States Patent
Application |
20170101707 |
Kind Code |
A1 |
KOTTILINGAM; Srikanth Chandrudu ;
et al. |
April 13, 2017 |
TREATED COMPONENT
Abstract
A treated component and methods for forming a treated component
are disclosed. The methods include providing an untreated component
having an untreated creep strength. The untreated component is
formed by a three-dimensional printing process, and is treated to
yield the treated component having a treated creep strength. The
treated component comprises an arrangement formed by the
three-dimensional printing process, wherein the arrangement has
been subjected to treating to increase creep strength.
Inventors: |
KOTTILINGAM; Srikanth
Chandrudu; (Greenville, SC) ; SCHAEFFER; Jon
Conrad; (Simpsonville, SC) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
GENERAL ELECTRIC COMPANY |
Schenectady |
NY |
US |
|
|
Family ID: |
53797307 |
Appl. No.: |
15/382123 |
Filed: |
December 16, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14183600 |
Feb 19, 2014 |
9555612 |
|
|
15382123 |
|
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|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B22F 5/04 20130101; B22F
2003/248 20130101; B22F 3/24 20130101; B23K 15/0086 20130101; B29L
2031/08 20130101; B22F 5/009 20130101; B33Y 10/00 20141201; B33Y
40/00 20141201; B23K 26/70 20151001; C22F 1/10 20130101; Y02P 10/25
20151101; B23K 26/342 20151001; Y02P 10/295 20151101; B22F 3/105
20130101; B33Y 80/00 20141201; B22F 2998/10 20130101; Y10T
428/24479 20150115; B22F 2998/10 20130101; B22F 9/082 20130101;
B22F 3/1055 20130101; B22F 2003/248 20130101 |
International
Class: |
C22F 1/10 20060101
C22F001/10; B33Y 40/00 20060101 B33Y040/00; B33Y 10/00 20060101
B33Y010/00; B23K 26/70 20060101 B23K026/70; B22F 3/24 20060101
B22F003/24; B23K 15/00 20060101 B23K015/00; B23K 26/342 20060101
B23K026/342; B33Y 80/00 20060101 B33Y080/00; B22F 3/105 20060101
B22F003/105 |
Claims
1. A treated component formed by a three-dimensional printing
process, comprising an arrangement formed by the three-dimensional
printing process, wherein the arrangement has been subjected to
treating to increase creep strength.
2. The treated component of claim 1, wherein the treating comprises
heat-treating the component.
3. The treated component of claim 1, wherein the treating comprises
diffusing at least one element into the untreated component,
wherein the at least one element is pinned to grain boundaries
between the plurality of grains forming a plurality of
precipitates, the plurality of precipitates preventing grain
boundary sliding and dislocation motion.
4. A treated component formed by a three-dimensional printing
process, comprising an arrangement formed by the three-dimensional
printing process, wherein the arrangement has been subjected to
treating to increase creep strength to a treated creep strength,
the treated component including: a plurality of precipitates in
grain boundaries between a plurality of grains, the plurality of
precipitates preventing grain boundary sliding and dislocating
motion, wherein the plurality of precipitates are formed from at
least one element diffused into the arrangement and pinned to the
grain boundaries.
5. The treated component of claim 4, wherein the treated creep
strength is greater than a comparative component lacking the
plurality of precipitates in the grain boundaries between the
plurality of grains.
6. The treated component of claim 5, wherein the treated creep
strength is about 25% to about 90% greater than the comparative
component at 1,600.degree. F.
7. The treated component of claim 5, wherein the treating comprises
heat-treating the component.
8. The treated component of claim 7, wherein the treated creep
strength is about 25% to about 100% greater than the comparative
component at 1,600.degree. F.
9. The treated component of claim 4, wherein the plurality of
grains are about 127 micrometers (0.005 inches) to about 3,175
micrometers (0.125 inches).
10. The treated component of claim 4, wherein the at least one
element is selected from the group consisting of carbon, boron,
nitrogen, aluminum, and combinations thereof.
11. The treated component of claim 4, wherein the plurality of
precipitates includes a composition selected from the group
consisting of carbides, nitrides, carbo-nitrides, borides, and
combinations thereof.
12. The treated component of claim 11, wherein the composition of
the plurality of precipitates is selected from the group consisting
of carbides, nitrides, carbo-nitrides, borides, and combinations
thereof including a metal constituent selected from the group
consisting of chromium, molybdenum, tungsten, tantalum, titanium,
and combinations thereof.
13. The treated component of claim 4, wherein the treated component
is a hot gas path component or a gas turbine combustion
component.
14. The treated component of claim 11, wherein the treated
component is selected from the group consisting of a shroud, a
nozzle, a bucket, a seal, a liner, a fuel nozzle component, and
combinations thereof.
15. The treated component of claim 4, wherein the plurality of
grains comprises a material selected from the group consisting of
metals, metal alloys including steel, stainless steel, nickel based
superalloys, cobalt based superalloys, metallics, ceramics, and
combinations thereof.
16. The treated component of claim 4, wherein the plurality of
grains comprises a material selected from the group consisting of
stainless steel, tool steel, nickel, cobalt, chrome, titanium,
aluminum, and combinations thereof.
17. A treated component, comprising: a plurality of grains, the
plurality of grains including a material selected from the group
consisting of metals, metal alloys, steels, stainless steels, tool
steels, nickel based superalloys, cobalt based superalloys,
metallics, ceramics, and combinations thereof; and a plurality of
precipitates in grain boundaries between the plurality of grains,
the plurality of precipitates including a composition selected from
the group consisting of carbides, nitrides, carbo-nitrides,
borides, and combinations thereof, wherein the plurality of
precipitates are pinned to the grain boundaries preventing grain
boundary sliding and dislocating motion.
18. The treated component of claim 17, wherein the plurality of
precipitates include a composition formed by the reaction of at
least one element selected from the group consisting of carbon,
boron, nitrogen, aluminum, and combinations thereof, with a metal
constituent selected from the group consisting of chromium,
molybdenum, tungsten, tantalum, titanium, and combinations
thereof.
19. The treated component of claim 17, wherein the treated
component is a hot gas path component or a gas turbine combustion
component.
20. The treated component of claim 19, wherein the treated
component is selected from the group consisting of a shroud, a
nozzle, a bucket, a seal, a liner, a fuel nozzle component, and
combinations thereof.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application relates to and claims the benefit of U.S.
patent application Ser. No. 14/183,600, filed Feb. 19, 2014,
entitled "A Treated Component and Methods of Forming a Treated
Component," the disclosures of which are incorporated by reference
in its entirety.
FIELD OF THE INVENTION
[0002] The present invention is directed to a treated component and
methods for forming a treated component. More specifically, the
present invention is directed to methods which include treating an
untreated component formed by a three-dimensional printing process,
and a treated component formed by a three-dimensional printing
process.
BACKGROUND OF THE INVENTION
[0003] Turbine systems are continuously being modified to increase
efficiency and decrease cost. One method for increasing the
efficiency of a turbine system includes increasing the operating
temperature of the turbine system. To increase the temperature, the
turbine system must be constructed of materials able to withstand
increased temperatures during continued use.
[0004] In addition to modifying component materials and coatings,
one common method of increasing temperature capability of a turbine
component includes the use of complex cooling channels. The complex
cooling channels are often incorporated into metals and alloys used
in high temperature regions of gas turbines. The complex cooling
channels can be difficult to form as brazing and/or thermal
spraying of materials often inadvertently fills the complex cooling
channels blocking the flow of cooling fluids, such as air from a
compressor section of a gas turbine.
[0005] Three-dimensional printing processes are relatively
inexpensive processes capable of manufacturing difficult to
fabricate components, including components with complex cooling
channels. However, some components printed by three-dimensional
printing processes do not have the same temperature tolerance as
cast, forged or milled parts.
[0006] Manufacturing methods that do not suffer from one or more of
the above drawbacks would be desirable in the art.
BRIEF DESCRIPTION OF THE INVENTION
[0007] In one embodiment, a method of forming a treated component
is provided. The method includes providing an untreated component
having an untreated creep strength. The untreated component is
formed by a three-dimensional printing process. The untreated
component is treated to yield the treated component having a
treated creep strength. The treated creep strength is greater than
the untreated creep strength.
[0008] In another embodiment, a method of forming a treated
component is provided. The method includes providing an untreated
component having an untreated creep strength. The untreated
component is formed by a three-dimensional printing process and has
a plurality of grains with a grain size of about 25 micrometers
(0.001 inches) to about 254 micrometers (0.010 inches). The
untreated component is treated to yield the treated component
having a treated creep strength. The treating of the untreated
component includes heat-treating, and diffusing at least one
element into, the untreated component. The treated component is a
hot gas path component or a gas turbine combustion component. The
heat-treating causes the plurality of grains to grow to about 127
micrometers (0.005 inches) to about 3.175 micrometers (0.125
inches). The at least one element is pinned to grain boundaries
between the plurality of grains forming a plurality of
precipitates, the plurality of precipitates preventing grain
boundary sliding and dislocation motion. The treated creep strength
is about 25% to about 100% greater than the untreated creep
strength at 1,600.degree. F.
[0009] In yet another embodiment, a treated component formed by a
three-dimensional printing process is provided. The treated
component includes an arrangement formed by the three-dimensional
printing process, wherein the arrangement has been subjected to
treating to increase creep strength.
[0010] Other features and advantages of the present invention will
be apparent from the following more detailed description of the
preferred embodiment, taken in conjunction with the accompanying
drawings which illustrate, by way of example, the principles of the
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a depiction of a method of forming a treated
component, according to an embodiment of the disclosure.
[0012] Wherever possible, the same reference numbers will be used
throughout the drawings to represent the same parts or steps.
DETAILED DESCRIPTION OF THE INVENTION
[0013] Provided are a treated component and methods of forming a
treated component. Embodiments of the present disclosure, in
comparison to processes and articles that do not include one or
more of the features disclosed herein, provide an increase in creep
strength, a higher operational temperature limit, increased
corrosion resistance, increased oxidation resistance, increased
wear and fatigue resistance, or a combination thereof.
[0014] One or more specific embodiments of the present invention
will be described below. In an effort to provide a concise
description of these embodiments, all features of an actual
implementation may not be described in the specification. It should
be appreciated that in the development of any such actual
implementation, as in any engineering or design project, numerous
implementation-specific decisions must be made to achieve the
developers' specific goals, such as compliance with system-related
and business-related constraints, which may vary from one
implementation to another. Moreover, it should be appreciated that
such a development effort might be complex and time consuming, but
would nevertheless be a routine undertaking of design, fabrication,
and manufacture for those of ordinary skill having the benefit of
this disclosure.
[0015] When introducing elements of various embodiments of the
present invention, the articles "a," "an," "the," and "said" are
intended to mean that there are one or more of the elements.
[0016] Referring to FIG. 1, a method 100 for forming a treated
component 103 is provided. In one embodiment the method 100
includes providing, step 102, an untreated component 101 having an
untreated creep strength, the untreated component 101 having been
formed by a three-dimensional printing process. The method 100
further includes treating, step 104, the untreated component 101 to
yield the treated component 103 having a treated creep strength.
The treated creep strength is greater than the untreated creep
strength.
[0017] Examples of three-dimensional printing processes include,
but are not limited to, the processes known to those of ordinary
skill in the art as Direct Metal Laser Melting (DMLM), Direct Metal
Laser Sintering (DMLS), Selective Laser Sintering (SLS), Selective
Laser Melting (SLM), Electron Beam Melting (EBM), other suitable
processes, or a combination thereof. As used herein, the term
"three-dimensional printing process" refers to the processes
described above as well as other suitable current or future
processes that include the build-up of materials layer by
layer.
[0018] The method 100 includes any suitable technique(s) for the
treating, step 104, to increase creep strength. For example,
suitable techniques include, but are not limited to, heat-treating
the untreated component 101, diffusing at least one element into
the untreated component 101, or both.
[0019] The method 100 includes any suitable sequence(s) for the
treating, step 104, to increase creep strength. In one embodiment,
the treating, step 104, of the untreated component 101 includes the
heat-treating of, followed by the diffusing of the at least one
element into, the untreated component 101. In an alternate
embodiment, the treating, step 104, of the untreated component 101
includes the diffusing of the at least one element into, followed
by the heat-treating of, the untreated component 101. In yet
another embodiment, the treating, step 104, of the untreated
component 101 includes the simultaneously heat-treating of the
untreated component 101 and the diffusing of the at least one
element into the untreated component 101.
[0020] The temperature of the heat-treating is any suitable
temperature capable of increasing creep strength. In one
embodiment, suitable for materials including, but not limited to,
nickel-based superalloys and stainless steels, the heat-treating is
conducted at a temperature range of about 1,800.degree. F. to about
2,300.degree. F., alternatively 1,800.degree. F. to about
2,000.degree. F., alternatively 1,900.degree. F. to about
2,100.degree. F., alternatively 2,000.degree. F. to about
2,200.degree. F., alternatively 2,100.degree. F. to about
2,300.degree. F., or any suitable combination, sub-combination,
range, or sub-range therein. In another embodiment, suitable for
materials including, but not limited to, non-stainless steels, the
heat-treating is conducted at a temperature range of about
1,450.degree. F. to about 1,900.degree. F., alternatively
1,450.degree. F. to about 1,600.degree. F., alternatively
1,600.degree. F. to about 1,750.degree. F., alternatively
1,750.degree. F. to about 1,900.degree. F., or any suitable
combination, sub-combination, range, or sub-range therein.
[0021] The duration of the heat-treating is any suitable duration
capable of increasing creep strength. In one embodiment, the
heat-treating is conducted for about 1 hour to about 24 hours,
alternatively about 1 hour to about 12 hours, alternatively about
12 hours to about 24 hours, alternatively about 1 hour to about 8
hours, alternatively about 8 hours to about 16 hours, alternatively
about 16 hours to about 24 hours, alternatively about 1 hour to
about 4 hours, alternatively about 4 hours to about 8 hours,
alternatively about 8 hours to about 12 hours, alternatively about
12 hours to about 16 hours, alternatively about 16 hours to about
20 hours, alternatively about 20 hours to about 24 hours, or any
suitable combination, sub-combination, range, or sub-range
therein.
[0022] The microstructure of the untreated component 101 includes
any sized grains permitting the increase of creep strength through
the treating, step 104. In one embodiment, the untreated component
101 has a plurality of grains with grain size of about 25
micrometers (0.001 inches) to about 254 micrometers (0.010 inches),
alternatively about 25 micrometers (0.001 inches) to about 178
micrometers (0.007 inches), alternatively about 25 micrometers
(0.001 inches) to about 102 micrometers (0.004 inches),
alternatively about 51 micrometers (0.002 inches) to about 152
micrometers (0.006 inches), alternatively about 102 micrometers
(0.004 inches) to about 203 micrometers (0.008 inches),
alternatively about 152 micrometers (0.006 inches) to about 254
micrometers (0.010 inches), or any suitable combination,
sub-combination, range, or sub-range therein.
[0023] The microstructure of the treated component 103 includes any
suitable increase in grain size permitting the increase of creep
strength through the treating, step 104. In one embodiment, the
treating, step 104, of the untreated component 101 includes the
heating-treating, wherein the heat-treating of the untreated
component 101 causes the plurality of grains of the untreated
component 101 to grow to about 127 micrometers (0.005 inches) to
about 3,175 micrometers (0.125 inches), alternatively about 635
micrometers (0.025 inches) to about 3,175 micrometers (0.125
inches), alternatively about 1,270 micrometers (0.050 inches) to
about 3,175 micrometers (0.125 inches), alternatively about 1,905
micrometers (0.075 inches) to about 3,175 micrometers (0.125
inches), alternatively about 2,540 micrometers (0.100 inches) to
about 3,175 micrometers (0.125 inches), alternatively about 127
micrometers (0.005 inches) to about 635 micrometers (0.025 inches),
alternatively about 635 micrometers (0.025 inches) to about 1,270
micrometers (0.050 inches), alternatively about 1,270 micrometers
(0.050 inches) to about 1,905 micrometers (0.075 inches),
alternatively about 1,905 micrometers (0.075 inches) to about 2,540
micrometers (0.100 inches), or any suitable combination,
sub-combination, range, or sub-range therein.
[0024] The increase in creep strength of the treated component 103
relative to the untreated component 101 is any suitable increase in
creep strength. In one embodiment, the treating, step 104, of the
untreated component 101 includes the heating-treating, wherein the
treated component 103 has a treated creep strength about 25% to
about 100% greater than the creep strength of the untreated
component 101 at 1,600.degree. F., alternatively about 25% to about
50% greater, alternatively about 50% to about 75% greater,
alternatively about 75% to about 100% greater, or any suitable
combination, sub-combination, range, or sub-range therein.
[0025] The at least one element diffused into the untreated
component 101 is any suitable element capable of increasing creep
strength. In one embodiment, the treating, step 104, of the
untreated component 101 includes the diffusing of the at least one
element into the untreated component 101, wherein the at least one
element is any suitable element, including, but not limited to,
carbon, boron, nitrogen, aluminum or combinations thereof.
[0026] The process conditions for diffusion of the at least one
element into the untreated component 101 are any suitable process
conditions capable of increasing creep strength. In one embodiment,
the diffusing of the at least one element into the untreated
component 101 pins the at least one element to grain boundaries
between the plurality of grains forming a plurality of
precipitates, the plurality of precipitates preventing grain
boundary sliding and dislocation motion. In a further embodiment,
the at least one element diffused into the untreated component 101,
includes, but is not limited to, carbon, boron, nitrogen, or
combinations thereof, which combines with other elements present in
the untreated component 101, such as, but not limited to, chromium,
molybdenum, tungsten, tantalum and titanium, to form a variety of
carbides, nitrides, carbo-nitrides and borides which form the
plurality of precipitates.
[0027] The increase in creep strength of the treated component 103
relative to the untreated component 101 is any suitable increase in
creep strength. In one embodiment, the treating, step 104, of the
untreated component 101 includes the diffusing of the at least one
element into the untreated component 101, wherein the treated
component 103 has a treated creep strength about 25% to about 90%
greater than the creep strength of the untreated component 101 at
1,600.degree. F., alternatively about 25% to about 50% greater,
alternatively about 50% to about 75% greater, alternatively about
75% to about 90% greater, or any suitable combination,
sub-combination, range, or sub-range therein.
[0028] The application technique for diffusion of the at least one
element into the untreated component 101 is any suitable
application technique capable of increasing creep strength. In one
embodiment, the treating, step 104, of the untreated component 101
includes the diffusing of the at least one element into the
untreated component 101, wherein the diffusing of the at least one
element into the untreated component 101 includes any suitable
technique, including, but not limited to, chemical diffusion, gas
diffusion, pack diffusion, chemical vapor deposition (CVD),
physical vapor deposition (PVD), sputtering, or a combination
thereof.
[0029] The component is any suitable component in need of increased
creep strength. In one embodiment, the treated component 103 is a
hot gas path component, a compressor component, or a gas turbine
combustion component. In another embodiment, the treated component
103 is a shroud 105 (as shown by way of example), a nozzle, a
bucket, a seal, a liner, a fuel nozzle component, or a combination
thereof.
[0030] The formation process of the untreated component 101 is any
suitable formation process capable of producing an untreated
component 101 very close to the final shape of the untreated
component 101. In one embodiment, the untreated component 101 is
formed to near-net shape. As used herein "near-net shape" means
that the untreated component 101 is formed by a three-dimensional
printing process very close to the final shape of the untreated
component 101, not requiring significant traditional mechanical
finishing techniques such as machining or grinding following the
three-dimensional printing process.
[0031] The material is any suitable material capable of forming the
untreated component 101. In one embodiment, the three-dimensional
printing process includes melting an atomized powder. In a further
embodiment, the atomized powder is any suitable material,
including, but not limited to, a metal, a metal alloy including
steel, a stainless steel, a nickel based superalloy, a cobalt based
superalloy, a metallic, a ceramic or a combination thereof. In
another embodiment, the atomized powder is any suitable material,
including, but not limited to, a stainless steel, a tool steel,
nickel, cobalt, chrome, titanium, aluminum or a combination
thereof. In one embodiment, the atomized powder is CoCrMo. In
another embodiment, the atomized powder has a composition, by
weight, of: about 10% nickel, about 29% chromium, about 7%
tungsten, about 1% iron, about 0.25% carbon, about 0.01% boron, and
balance cobalt (e.g. FSX414); about 0.015% boron, about 0.05% to
about 0.15% carbon, about 20% to about 24% chromium, about 3% iron,
about 0.02% to about 0.12% lanthium, about 1.25% manganese, about
20% to about 24% nickel, about 0.2% to about 0.5% silicon, about
13% to about 15% tungsten, and balance cobalt (e.g. HAYNES.RTM.
188); about 22.5% to about 24.25% chromium, up to about 0.3%
titanium (e.g., about 0.15% to about 0.3% titanium), about 6.5% to
about 7.5% tungsten, about 9% to about 11% nickel, about 3% to
about 4% tantalum, up to about 0.65% carbon (e.g., about 0.55% to
about 0.65% carbon), about 2% to about 3% boron (e.g., about 2% to
about 3% boron), about 1.3% iron, up to about 0.4% silicon, up to
about 0.1% manganese, up to about 0.02% sulfur, and balance cobalt
(e.g. MarM509); about 0.05% carbon, about 20% nickel, about 20%
chromium, about 0.1% zirconium, about 7.5% tantalum, and balance
cobalt (e.g. MarM918); about 6.6% to about 7.0% chromium, about
11.45% to about 12.05% cobalt, about 5.94% to about 6.30% aluminum,
about 0.02% titanium, about 4.70% to about 5.10% tungsten, about
1.3% to about 1.7% molybdenum, about 2.6% to about 3.0% rhenium,
about 6.20% to about 6.50% tantalum, about 1.3% to about 1.7%
hafnium, about 0.10% to about 0.14% carbon, about 0.0035%
manganese, about 0.03% zirconium, about 0.01% to about 0.02% boron,
about 0.2% iron, about 0.06% silicon, about 0.1% potassium, about
0.004% sulfur, about 0.1% niobium, and balance nickel (e.g. Rene
142); about 13.70% to about 14.30% chromium, about 9% to about 10%
cobalt, about 3.2% aluminum, about 4.8% to about 5.20% titanium,
about 3.7% to about 4.3% tungsten, about 0.1% rhenium, up to about
4.3% rhenium and tungsten combined, about 0.5% tantalum, about 0.1%
hafnium, about 0.15% to about 0.19% carbon, about 0.15% palladium,
about 0.3% platinum, about 0.01% magnesium, about 0.02% to about
0.1% zirconium, about 0.01% to about 0.02% boron, about 0.35% iron,
about 0.1% silicon, about 0.1% manganese, about 0.015% phosphorus,
about 0.0075% sulfur, about 0.1% niobium, and balance nickel (e.g.
Rene 80); about 0.08 to about 0.12% carbon, about 22.2 to about
22.8% chromium, about 0.10% manganese, about 0.25% silicon, about
18.5 to about 19.5% cobalt, about 1.8 to about 2.2% tungsten, about
2.3% titanium, about 1.2% aluminum, about 1.0% tantalum, about 0.8%
niobium, about 0.05% zirconium, about 0.008% boron, and balance
nickel (e.g. GTD-222.RTM., available from General Electric
Company); about 20% chromium, about 10% cobalt, about 8.5%
molybdenum, up to about 2.5% titanium, about 1.5% aluminum, up to
about 1.5% iron, up to about 0.3% manganese, up to about 0.15%
silicon, about 0.06% carbon, about 0.005% boron, and balance nickel
(e.g. HAYNES.RTM. 282); about 20% to about 24% chromium, about 10%
to about 15% cobalt, about 8% to about 10% molybdenum, about 0.8%
to about 1.5% aluminum, about 0.05% to about 0.15% carbon, about
3.0% iron, about 1.0% manganese, about 0.015% silicon, about 0.015%
sulfur, about 0.6% titanium, about 0.5% copper, about 0.006% boron,
and balance nickel (e.g. IN617); about 5% iron, about 20% to about
23% chromium, up to about 0.5% silicon, about 8% to about 10%
molybdenum, up to about 0.5% manganese, up to about 0.1% carbon,
and balance nickel (e.g. IN625); or about 50% to about 55% nickel
and cobalt combined, about 17% to about 21% chromium, about 4.75%
to about 5.50% columbium and tantalum combined, about 0.08% carbon,
about 0.35% manganese, about 0.35% silicon, about 0.015%
phosphorus, about 0.015% sulfur, about 1.0% cobalt, about 0.35% to
0.80% aluminum, about 2.80% to about 3.30% molybdenum, about 0.65%
to about 1.15% titanium, about 0.001% to about 0.006% boron, about
0.15% copper, and balance of iron (e.g. IN718).
[0032] A treated component 103 formed by a three-dimensional
printing process is provided. In one embodiment, the treated
component 103 formed by a three-dimensional printing process
includes an arrangement 107 formed by the three-dimensional
printing process, wherein the arrangement 107 has been subjected to
treating, step 104, to increase creep strength.
[0033] While the invention has been described with reference to a
preferred embodiment, it will be understood by those skilled in the
art that various changes may be made and equivalents may be
substituted for elements thereof without departing from the scope
of the invention. In addition, many modifications may be made to
adapt a particular situation or material to the teachings of the
invention without departing from the essential scope thereof.
Therefore, it is intended that the invention not be limited to the
particular embodiment disclosed as the best mode contemplated for
carrying out this invention, but that the invention will include
all embodiments falling within the scope of the appended
claims.
* * * * *