U.S. patent application number 15/378242 was filed with the patent office on 2017-03-30 for power thermal policy using micro-throttle.
The applicant listed for this patent is MEDIATEK INC.. Invention is credited to Hui-Hsuan Wang, Jen-Chieh Yang, Lee-Kee Yong.
Application Number | 20170090545 15/378242 |
Document ID | / |
Family ID | 53044874 |
Filed Date | 2017-03-30 |
United States Patent
Application |
20170090545 |
Kind Code |
A1 |
Wang; Hui-Hsuan ; et
al. |
March 30, 2017 |
Power Thermal Policy Using Micro-Throttle
Abstract
Method and apparatus are provided for thermal management of
mobile devices. In one novel aspect, a throttle method is used to
control the fast rising temperature for the device. In one
embodiment, the thermal management method determines a temperature
of the mobile device and compares the temperature with a plurality
of predefined temperature thresholds. The thermal management
applies a first throttle solution upon detecting the temperature
reaches a first predefined temperature threshold and applies a
second throttle solution upon detecting the temperature reaches a
second predefined temperature threshold. In one embodiment, the
first and the second throttle solutions control the slope of the
rising temperature to be below a first predefined slope and a
second predefined slope, respectively. In one embodiment, the
temperature is controlled by adjusting the operating frequency
and/or voltage of at least one heat-generating component of the
mobile device.
Inventors: |
Wang; Hui-Hsuan; (Taoyuan
County, TW) ; Yang; Jen-Chieh; (Hsinchu, TW) ;
Yong; Lee-Kee; (Hsinchu, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MEDIATEK INC. |
Hsinchu |
|
TW |
|
|
Family ID: |
53044874 |
Appl. No.: |
15/378242 |
Filed: |
December 14, 2016 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
14490958 |
Sep 19, 2014 |
9557786 |
|
|
15378242 |
|
|
|
|
61902417 |
Nov 11, 2013 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
Y02D 10/126 20180101;
G06F 1/3243 20130101; Y02D 10/00 20180101; G06F 1/206 20130101;
G06F 1/324 20130101; G06F 1/3206 20130101; G06F 1/3296 20130101;
Y02D 10/172 20180101; Y02D 10/16 20180101 |
International
Class: |
G06F 1/32 20060101
G06F001/32; G06F 1/20 20060101 G06F001/20 |
Claims
1. A method comprising: determining a temperature of a mobile
device, wherein the mobile device includes at least one
heat-generating component; applying a first throttle solution when
the temperature reaches a first threshold, wherein the first
throttle solution controls the temperature to arise below a first
slope; and applying a second throttle solution when the temperature
reaches a second threshold, wherein the second throttle solution
controls the temperature to arise below a second slope, wherein at
least one of the first throttle solution, the second throttle
solution, the first threshold, the second threshold, the first
slope and the second slope is determined based on at least one of a
temperature indicator and a heat-generating event indicator.
2. The method of claim 1, wherein the at least one heat-generating
component comprises at least one of a central processing unit (CPU)
and a graphic processing unit (GPU).
3. The method of claim 1, wherein at least one of the first and the
second throttle solutions comprises controlling an operating
voltage of at least one of the at least one heat-generating
component.
4. The method of claim 1, wherein at least one of the first and the
second throttle solutions comprises controlling an operating
frequency of at least one of the at least one heat-generating
component.
5. The method of claim 4, wherein the controlling the operating
frequency of at least one of the at least one heat-generating
component comprises controlling a ratio of the heat-generating
component operating at a high frequency to the heat-generating
component operating at a low frequency.
6. The method of claim 1, wherein at least one of the first and the
second throttle solutions is determined based on a benchmark
performance of the mobile device.
7. The method of claim 1, wherein at least one of the first slope
and the second slope is determined based on a benchmark performance
of the mobile device.
8. The method of claim 1, wherein the temperature indicator
indicates generated heat and the heat-generating event indicator
indicates one or more heat-generating events occurrence, and the
first throttle solution and the second throttle solution are
determined based on at least one of the temperature indicator and
the heat-generating event indicator.
9. The method of claim 1, wherein the temperature indicator
indicates generated heat and the heat-generating event indicator
indicates one or more heat-generating events occurrence, and the
first threshold and the second threshold are determined based on at
least one of the temperature indicator and the heat-generating
event indicator.
10. The method of claim 1, wherein the method controls the
temperature such that the temperature reaches a final threshold
after a predefined time.
11. A mobile device comprising: at least one heat-generating
component; a thermal sensor that determines a temperature of the
mobile device; a thermal control module that applies a first
throttle solution when the temperature reaches a first threshold,
wherein the first throttle solution controls the temperature to
arise below a first slope, wherein the thermal control module also
applies a second throttle solution when the temperature reaches a
second threshold, and wherein the second throttle solution controls
the temperature to arise below a second slope, wherein at least one
of the first throttle solution, the second throttle solution, the
first threshold, the second threshold, the first slope and the
second slope is determined based on at least one of a temperature
indicator and a heat-generating event indicator.
12. The device of claim 11, wherein the at least one
heat-generating component comprises at least one of a central
processing unit (CPU) and a graphic processing unit (GPU).
13. The device of claim 11, wherein at least one of the first and
the second throttle solutions comprises controlling an operating
voltage of at least one of the at least one heat-generating
component.
14. The device of claim 11, wherein at least one of the first and
the second throttle solutions comprises controlling an operating
frequency of at least one of the at least one heat-generating
component.
15. The device of claim 14, wherein the controlling the operating
frequency of at least one of the at least one heat-generating
component comprises controlling a ratio of the heat-generating
component operating at a high frequency to the heat-generating
component operating at a low frequency.
16. The device of claim 11, wherein at least one of the first and
the second throttle solutions is determined based on a benchmark
performance of the mobile device.
17. The device of claim 11, wherein at least one of the first slope
and the second slope is determined based on a benchmark performance
of the mobile device.
18. The device of claim 11, wherein the temperature indicator
indicates generated heat and the heat-generating event indicator
indicates one or more heat-generating events occurrence, and the
first throttle solution and the second throttle solution are
determined based on at least one of the temperature indicator and
the heat-generating event indicator.
19. The device of claim 11, wherein the temperature indicator
indicates generated heat and the heat-generating event indicator
indicates one or more heat-generating events occurrence, and the
first threshold and the second threshold are determined based on at
least one of the temperature indicator and the heat-generating
event indicator.
20. The device of claim 11, wherein the thermal control module
controls the temperature such that the temperature reaches a final
threshold after a predefined time.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation, and claims priority
under 35 U.S.C. .sctn.120 from nonprovisional U.S. patent
application Ser. No. 14/490,958, entitled "New Power Thermal Policy
Using Micro-Throttle," filed on Sep. 19, 2014, the subject matter
of which is incorporated herein by reference. application Ser. No.
14/490,958, in turn, claims priority under 35 U.S.C. .sctn.119 from
U.S. Provisional Application No. 61/902,417, entitled "New Power
Thermal Policy PTP.rarw.Micro-Throttle.fwdarw.Thermal Throttle,"
filed on Nov. 11, 2013, the subject matter of which is incorporated
herein by reference.
TECHNICAL FIELD
[0002] The disclosed embodiments relate generally to wireless
network communication device, and, more particularly, to new power
thermal policy using throttle.
BACKGROUND
[0003] With the advance of semiconductor technologies and the like,
the performance of CPUs and processors used in mobile devices has
been improved remarkably. For example, an operating frequency of
the level of GHz has been used widely in mobile phones. When the
system speed and core requirements reach higher limits, the power
consumption of CPUs and processors is also increasing. As a result,
more and more heat needs to be dissipated in the limited space of a
mobile phone in order to control the skin surface temperature
(Tskin) of the mobile phone.
[0004] Thermal management is one of the key challenges in the
design of today's mobile devices, such as smart phones. The power
consumption in smart devices have grown exponentially compounded by
the needs for higher data rate, more multitasking applications, and
the increasing number of background tasks for popular applications
such as email and social networking. The higher performance
requirement for the smart devices means peak maximum throughput is
frequently required. It leads to higher clock frequencies, which
inevitably generates more heat from various integrated circuits
(ICs) and/or other components in the device. Currently, each IC may
contain one or more heat-generating components. With increasing
number of components running at high clock frequencies inside a
small compact device, heat dissipation requires advanced solutions
for thermal management.
[0005] FIG. 1 shows a current method of thermal management. It
illustrates a temperature curve under thermal throttle. As shown, a
threshold temperature, namely T.sub.bound is configured for a
mobile device, such as a mobile phone, a tablet, a wearable device,
a laptop, etc. The mobile device monitors the temperature starting
from t.sub.o. As the data throughput or processing power in the
device increases, the temperature of the device starts to increase.
In many situations, the high demands for faster data rate, faster
and better graphical processes from an application compounded with
large number of background running tasks requires high frequencies
from various components/ICs of the device. The heat dissipation in
a small, compact smart device, such as smartphone is much harder
because the area to dissipate the heat is limited. Therefore, the
temperature of the device increases quickly. In the current thermal
management, there is no power throttling until the temperature
reaches the predefined or preconfigured threshold temperature
T.sub.bound. As a result, at time t.sub.1, the temperature reaches
the preconfigured threshold T.sub.bound. Upon detecting the
temperature rises to the preconfigured threshold T.sub.bound, the
device starts thermal throttle by controlling the power of the ICs
or components of the device that generates heat. Since the throttle
takes time, the temperature continues to rise after t.sub.1. At
time t.sub.2, the temperature starts to drop because the power
throttling of the devices reduces the heat sources. At time
t.sub.3, the temperature drops back to the preconfigured threshold
T.sub.bound. With the throttling for thermal control starts, the
temperature of the device bounces near the preconfigured
temperature T.sub.bound as shown in FIG. 1.
[0006] The problem of the current thermal management for smart
devices is that it causes large performance degradation. The
current method controls heat generation components or ICs in the
device for thermal throttling. Such process may greatly reduce the
performance of the smart device. For example, one way to reduce
heat generation of a ICs or components of the smart device is to
lower its operation frequency, which results in lower processing
speed. The problem aggravates with the increasing demands for high
performance of the smart devices. For example, to control the
temperature, the throttling lower the clock frequency, which
results in less processing power for data throughput, which results
in backlog queues of pending processing. When the temperature
reaches an acceptable level, the backlog data, together with
continuous tasks, requires high performance of the device. Such
high performance on the devices makes the temperature fast
approaching the preconfigured threshold T.sub.bound again, which
requires performance-degraded throttling.
[0007] Enhancement and improvements are needed to prevent the
device to reach the T.sub.bound too fast. A more efficient way of
thermal management for mobile devices is required.
SUMMARY
[0008] Method and apparatus are provided for thermal management of
mobile devices. In one novel aspect, a throttle method is used to
control the fast rising temperature for the device. In one
embodiment, the thermal management method determines a temperature
of the mobile device and compares the temperature with a plurality
of predefined temperature thresholds. The thermal management
applies a first throttle solution upon detecting the temperature
reaches a first predefined temperature threshold. In one
embodiment, the first throttle solution controls the slope of the
rising temperature to be below a first predefined slope. The
thermal management applies a second throttle solution upon
detecting the temperature reaches a second predefined temperature
threshold. In one embodiment, the second throttle solution controls
the slope of the rising temperature to be below a second predefined
slope. In one embodiment, the thermal management controls the slope
of the rising temperature by controlling the operating voltage of
at least one heat-generating component of the mobile device. In
another embodiment, the thermal management controls the slope of
the rising temperature by controlling the operating frequency of at
least one heat-generating component of the mobile device. In yet
another embodiment, the throttle solutions are determined based on
the benchmark performance of the mobile device.
[0009] In another novel aspect, adaptive feedbacks are used to
further enhance the throttle. In one embodiment, the fixed
throttling on temperature thresholds is used. The fixed throttling
method applies different degrees of throttling to different
temperature threshold. In another embodiment, the adaptive control
for fixed slope is used. The adaptive slope control method
dynamically sends slope feedback such that the rising slope of the
temperature is controlled to be a fixed value. In yet another
embodiment of the current invention, the adaptive slope control for
time prediction is used. In the adaptive prediction time method,
the mobile device dynamically sends slope feedback to the thermal
management of the mobile device. The thermal management adjusts the
power of the system accordingly to control the temperature such
that the temperature stabilized at a predefined fixed predicted
time.
[0010] Other embodiments and advantages are described in the
detailed description below. This summary does not purport to define
the invention. The invention is defined by the claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 (prior art) illustrates a temperature curve under
thermal throttle.
[0012] FIG. 2 is a simplified block diagram of a mobile device with
new power thermal policy in accordance with one novel aspect.
[0013] FIG. 3 illustrates an exemplary temperature curve under
micro-throttle.
[0014] FIG. 4 is an exemplary flow chart of the micro-throttle in
accordance to embodiments of the current invention.
[0015] FIG. 5 illustrates power behavior under micro-throttle.
[0016] FIG. 6 illustrates temperature slope control with thermal
throttle.
[0017] FIG. 7 illustrates different temperature curves applying
different embodiments of temperature slope control with
micro-throttle.
[0018] FIG. 8 is a flow chart of a method of applying thermal
policy using micro-throttle in accordance with one novel
aspect.
DETAILED DESCRIPTION
[0019] Reference will now be made in detail to some embodiments of
the invention, examples of which are illustrated in the
accompanying drawings.
[0020] FIG. 2 is a simplified block diagram of a mobile device with
new power thermal policy in accordance with one novel aspect.
Mobile device 201 has an antenna 205, which transmits and receives
radio signals. A RF transceiver module 204, coupled with the
antenna, receives RF signals from antenna 205, converts them to
baseband signals and sends them to processor (CPU) 203. RF
transceiver 205 also converts received baseband signals from
processor 203, converts them to RF signals, and sends out to
antenna 205. Processor 203 processes the received baseband signals
and invokes different functional modules to perform features in
mobile device 201. Memory 202 stores program instructions and data
to control the operations of smart mobile station 201.
[0021] Mobile device 201 also includes other modules that carry out
different tasks in accordance with embodiments of the current
invention. The different modules can be implemented by software,
firmware, hardware, or any combination thereof. The function
modules, when executed by the processors 203 allow mobile device
201 carry out embodiments of the current invention such that
improvements and enhancements for thermal management are achieved.
A thermal sensor 211 detects thermal changes, temperatures. Thermal
sensor 211 detects and monitors temperature level of the system. A
thermal control 212 controls system thermal level. In one
embodiment of the current invention, thermal control 212
communicates with thermal sensor 211 and uses micro throttle to
enhance thermal management. Thermal control 212 obtains temperature
information of mobile device 201. Thermal control 212 compares the
obtained temperature information with a plurality of pre-configured
or pre-defined temperature thresholds. Based on the results,
thermal control 212 determines a different throttling method.
Thermal control 212 applies different throttling strategies for
different temperature ranges. In one embodiment, thermal control
212 controls the slope of the rising of temperature. Thermal
control 212 applies different slope to different temperature range.
Using micro thermal control alleviates sharp performance drop in
the traditional way. Different modules also include an exemplary
graphic chip, or graphic processing unit (GPU) 213 and a codec 214.
Graphic chip 213 handles graphic processing for mobile device 201.
Codec 214 handles codec processes for mobile device 201. A power
amplifier 215 controls power of different heat-generating
components and/or components of mobile device 201. In one
embodiment, thermal control 212 controls the slope of temperature
through adjusting powers of one or more heat-generating components
and/or components of mobile device 201. Thermal control 212
communicates with power amplifier 215 and controls the power of
different heat-generating components and components of mobile
device 201 such that the temperature is below a predefined
threshold based on the value of the temperature.
[0022] In one novel aspect, thermal management for mobile devices
uses a dynamic unbalanced slope control, which slows the speed of
temperature rising to a temperature threshold. The new thermal
management method, based on the detected system temperature,
applies different micro throttling before the temperature reaches
the T.sub.bound threshold. During the micro throttling, the system
performance does not degrade too much because the adjustment of the
clock frequency or power throttle is in a small range. Therefore,
the multi-staged micro throttling slows the speed of rising
temperature without sacrificing a lot of system performance.
[0023] FIG. 3 illustrates an exemplary temperature curve under
micro-throttle. Three temperature thresholds, T.sub.bound #1,
T.sub.bound #2, and T.sub.bound #3, are configured. It is
understood by one of ordinary skills in the art that other number
of thresholds can be configured. For example, more than three
thresholds can be configured depends on performance and power
consumption data of a mobile device. Different model, different
manufacture, and different feature set of the mobile devices can
all be factors in determining the number of temperature thresholds
to be configured. The number of temperature threshold can also be
changed, either through network configuration or through local
reconfiguration of the device. The value of these temperature
thresholds can also vary depending on different factors of the
device, such as the model, the different chip sets used, different
mechanical design of the device, and/or features supported by the
device. The value of the temperature thresholds can be
preconfigured or dynamically updated, either through network
configuration or through local reconfiguration of the device. In
one embodiment, T.sub.bound #1 is preconfigured to be 45-Celsius
degree; T.sub.bound #2 is configured to be 65-Celsius degree; and
T.sub.bound #3 is configured to be 90-Celsius degree.
[0024] Different stages of micro throttling and traditional
throttling are used to enhance the thermal management of the mobile
device. As shown in FIG. 3, when the temperature is below
T.sub.bound #1, the processor is running at full performance. In an
example as shown in FIG. 3, it is running at 2.0 G/1.7 G. In period
301, which starts from time T1, micro throttle zero (mTH-0)
controls the slope of the temperature such that it will not rise
too fast. At time T1, the temperature crosses over T.sub.bound #1.
The mobile device enters period 302, which uses micro-throttle one
(mTH-1). At period 302, micro-throttle one adjusts the power
consumption so that the slope of the rising temperature is
controlled to be below a preconfigured first slope threshold. In
one embodiment, micro-throttle one controls the power consumption
by adjusting the voltage and/or speed of one or more
heat-generating components of the mobile device. As an example
shown in FIG. 3, the speed of a heat-generating component in the
mobile device is adjusted down from 2.0 G/1.7 G to 1.6 G/1.5 G in a
controlled manner. In period 302, since the temperature is still in
a relative lower range, micro-throttle one does not need to greatly
reduce the speed of the heat-generating component. The performance
of the mobile device is not significantly sacrificed. The reduced
power consumption effectively controls the slope of the rising
temperature. In one embodiment, the voltage/speed of the
heat-generating component does not stay in the lowered level.
Instead, it is adjusted to throttle between the higher level of 2.0
G/1.7 G and the lower level of 1.6 G/1.5 G, such the rising slope
of the temperature is controlled at below the first predefined
threshold. In one embodiment, the ratio of the heat-generating
component operating at 2.0 G/1.7 G to the heat-generating component
operating at 1.6 G/1.5 G is 1:1. The ratio of the micro-throttle
one is predefined/preconfigured. The ratio can be dynamically
updated as well. The determination of the ratio may depend on
factors of the mobile device. For example, thermal performance
benchmark of different heat-generating components and/or components
of the mobile device can be used in determining the ratio for
different micro-throttle period. In one embodiment, AnTuTu
performance is used in determining the ratio. Other factors, such
the model of the device, the feature set of the device and the
mechanical design of the device can all be considered in
determining the ratio. In one embodiment, micro-throttle may even
disable one or more heat-generating components.
[0025] Micro-throttle one effectively controls the slope of the
rising temperature so that the temperature would not reach a high
threshold of T.sub.bound too fast. At the same time, because the
adjustment to the speed or power consumption of the one or more
heat-generating components or components of the mobile device is
controlled at a lower level, the performance of the mobile device
is not greatly reduced. As the temperature continues to rise, a new
micro-throttle is triggered. At time T2, the temperature rises to
the preconfigured T.sub.bound #2. The mobile device enters period
303, which uses micro-throttle two (mTH-2). At period 302,
micro-throttle one adjusts the power consumption so that the slope
of the rising temperature is controlled to be below a preconfigured
second slope threshold. Entering period 303, mTH-2 continues to
adjust the speed of the heat-generating component to curb the speed
of the rising temperature. In one embodiment, the ratio of the
heat-generating component operating at 2.0 G/1.7 G to the
heat-generating component operating at 1.6 G/1.5 G changes to 1:4.
In micro-throttle two the heat-generating component operates in a
lower level of speed for a longer period than in micro-throttle
one. Similarly, the ratio can be preconfigured/defined or
dynamically updated. Similar factors are considered in determining
the value of the ratio for micro-throttle two. Similarly, the
second slope threshold can be preconfigured/defined or dynamically
updated. Similar factors are considered in determining the value of
the second slope threshold. Since the heat-generating component
speed adjustment is still in a small range, the performance
sacrifice of the mobile device keeps low. In one embodiment,
micro-throttle may even disable one or more heat-generating
components.
[0026] By controlling the slope of the rising temperature in
different micro-throttle stages, the mobile device avoids the
problem of fast-rising temperature of the device that triggers
performance degraded throttling too fast. Therefore, the overall
performance of the mobile device can be greatly improved. At time
T3, the temperature of the mobile device rises to over the
preconfigured T.sub.bound #3. The mobile device enters period 304.
T.sub.bound #3 is preconfigured to be in the range of the
traditional T.sub.bound. Therefore, at period 304, traditional
throttling is used to control the temperature. The voltage/speed of
the heat-generating component drops significantly. As an example,
the voltage/speed of the heat-generating component drops to below
1.4 G/1.3 G. During this period, it is possible that the
performance of the mobile device is noticeably dropped.
[0027] Using micro-throttle for thermal management may also shorten
the period of the performance-degraded traditional throttling. At
time T4, the temperature of the mobile device drops back to
T.sub.bound #2. Upon detecting the temperature drops back to
T.sub.bound #2, the mobile device enters period 305, which switches
back to micro-throttle two (mTH-2). Upon entering period 305, mTH-2
adjusts the voltage/speed of the heat-generating component back
throttle between 2.0 G/1.7 G and 1.6 G/1.5 G. The ratio of the
heat-generating component operating at 2.0 G/1.7 G to the
heat-generating component operating at 1.6 G/1.5 G is 1:4. During
this period, the performance of the mobile device improves while
the temperature is effectively controlled as well. At T5, the
temperature of the mobile device rises to be over T.sub.bound #3.
The mobile device enters period 306, which goes back to the
traditional throttling to bring the temperature down. The speed of
the heat-generating component drops significantly.
[0028] FIG. 4 is an exemplary flow chart of the micro-throttle in
accordance to embodiments of the current invention. In one novel
aspect, the mobile device monitors the temperatures and applies
micro-throttle and traditional throttle for thermal management. A
micro-throttle stage 410, as shown in FIG. 4, may include one or
more different stages. Micro-throttle 410 can effectively prevent
the temperature of the mobile device from rising too fast to
trigger the traditional throttle. Micro-throttle 410 combined with
the traditional thermal throttle, effectively controls the
temperature of the mobile device while maintaining the performance
of the mobile device.
[0029] At step 401, the mobile device monitors temperature. At step
411, the mobile device checks whether the current temperature is
below a predefined first temperature threshold, Tb1. If at step
411, the mobile device determines that the temperature is below
Tb1, it moves to step 421. At step 421, the mobile device applies
micro-throttle zero (mTH-0) and continues monitors the temperature
as in step 401. If step 411 determines the temperature is above
Tb1, the mobile device moves to step 412. At step 412, the mobile
device checks whether the current temperature is below a predefined
second temperature threshold, Tb2. If at step 412 the mobile device
determines that the temperature is below Tb2, it moves to step 422.
At step 422, the mobile device applies micro-throttle one (mTH-1)
and continues monitors the temperature as in step 401. If step 412
determines the temperature is above Tb2, the mobile device moves to
step 413. At step 413, the mobile device checks whether the current
temperature is below a predefined second temperature threshold,
Tb3. If at step 413 the mobile device determines that the
temperature is below Tb3, it moves to step 423. At step 423, the
mobile device applies micro-throttle two (mTH-2) and continues
monitors the temperature as in step 401. If step 413 determines the
temperature is above Tb3, the mobile device moves to step 424. At
step 424, the mobile device starts traditional throttle to lower
the temperature of the device and continues monitors the
temperature as in step 401. In one embodiment, micro-throttle may
even disable one or more heat-generating components.
[0030] One of the advantages of the micro throttle thermal
management is improved system performance. In one hand, the micro
throttle prevents the temperature of the mobile device from rising
too fast. It limits the time of thermal throttling, which has
significant negative impact on the system performance. On the other
hand, the multi-level temperature configuration applying to
corresponding micro throttle stages also shortens the costly
thermal throttling period. All these result in a better system
performance while controlling the temperature of the mobile device
effectively.
[0031] FIG. 5 illustrates power behavior under micro-throttle. As
an example of the improved system performance using micro
throttling for thermal management, FIG. 5 shows a specific output
of system performance applying micro throttle for thermal
management. Graph 501 illustrates average power level for a system
on chip (SoC) over the time. Graph 502 illustrates average power
level for a CPU PMIC (power management IC) chip over the time. One
of the benchmarks that measure system and/or component performance
is AnTuTu score. AnTuTu is a popular tool that measures performance
of android devices. It includes performance benchmarks on the
device level as well on chip level. Applying micro throttle for
thermal management increases AnTuTu score as shown in FIG. 5. A
period 510 illustrates the amount of time for the traditional
thermal throttling. The performance of both chips, the SoC and CPU
PMIC both drop dramatically. Compared with system without micro
throttle, period 510 is greatly shortened. Therefore, the overall
system performance increases. It results in better AnTuTu score for
the system as well as for chips SoC and CPU PMIC.
[0032] FIG. 6 illustrates temperature slope control with thermal
throttle. A temperature threshold T.sub.bound is configured such
that the thermal management of the mobile device controls the
temperature to stay within a range below T.sub.bound. Graph 601
shows the temperature curve without micro throttle for thermal
management. The mobile device monitors the temperature starting
from t.sub.0. Without micro throttling, the temperature continues
to rise without any adjustment until the temperature reaches
T.sub.bound. Therefore, the temperature of the device increases
quickly. As a result, at time t.sub.1, the temperature reaches the
preconfigured threshold T.sub.bound. Upon detecting the temperature
rises to the preconfigured threshold T.sub.bound, the device starts
thermal throttle by controlling the power of the heat-generating
components or components of the device that generates heat. Since
the throttle takes time, the temperature continues to rise after
t.sub.1. At time t.sub.2, the temperature starts to drop because
the power throttling of the devices reduces the heat sources. At
time t.sub.3, the temperature drops back to the preconfigured
threshold T.sub.bound. With the throttling for thermal control
starts, the temperature of the device bounces near the
preconfigured temperature T.sub.bound. As shown from graph 601, the
temperature of mobile device reaches T.sub.bound fast, resulting in
long period of costly thermal throttling starting from t.sub.1.
[0033] In comparison, graph 602 of FIG. 6 illustrates an exemplary
temperature curve without micro throttle. When micro throttle is
used, the thermal management in the mobile device controls the
rising slope of the temperature before it reaches T.sub.bound.
Multi-stage micro throttle can be used with different parameter
configured for each stage. In one embodiment, the parameters for
the multi-stage micro throttle can be enhanced based on benchmarks
of the system and heat-generating components and/or components of
the mobile device. During the micro throttle process, the
performance of the system and the heat-generating components are
maintained at a relative high level because it slowly adjusts the
speed or power level of the components. The temperature of the
mobile device, as shown in graph 602, reaches T.sub.bound at a much
slower pace until t.sub.4. It is understood by one of ordinary
skills in the art that t.sub.4 may be as early as in between
t.sub.1 and t.sub.2 and can be further delayed beyond. A period 610
between t.sub.0 and t.sub.4 is the micro throttle period also
called T.sub.j heat up slope control.
[0034] In other novel aspects, the micro throttle process can be
further enhanced applying different T.sub.j heat up slope control.
In one embodiment, the fixed throttling on T.sub.j thresholds is
used. In the fixed throttling method, multiple T.sub.j thresholds
are defined. For different T.sub.j threshold ranges, different
degrees of throttling are used. The configuration of T.sub.j
thresholds and degrees of throttling are adjusted for different
thermal solutions and different chip leakage corners.
[0035] In another embodiment, the adaptive method of T.sub.j slopes
control for fixed slope is used. The adaptive slope control method
dynamically sends T.sub.j slope feed back to the thermal management
of the mobile device. The thermal management adjusts the power of
the system accordingly to control the rising of the temperature at
a fixed slope. In the dynamic slope control method, multiple
T.sub.j thresholds can be configured. The thermal management of the
mobile device can define different slopes for different configured
T.sub.j thresholds. The parameters of T.sub.j threshold and
different slopes for each T.sub.j threshold can be further enhanced
based on benchmark performances of the system and/or the
heat-generating components and components of the mobile device.
[0036] In yet another embodiment of the current invention, the
adaptive T.sub.j heat up slope control for time prediction is used.
In the adaptive prediction time method, the mobile device
dynamically sends T.sub.j slope feed back to the thermal management
of the mobile device. The thermal management adjusts the power of
the system accordingly to control the temperature such that the
temperature stabilized at a predefined fixed predicted time. In one
embodiment, micro-throttle may even disable one or more
heat-generating components.
[0037] FIG. 7 illustrates different temperature curves applying
different embodiments of temperature slope control with
micro-throttle. Graph 701 is the temperature curve when there is no
micro thermal management. As shown in graph 701, the temperature
will rise to over 115.degree. C. without adaptive thermal control.
Graph 702 is the temperature curve of a micro thermal control. As
shown in graph 702, the thermal management starts to control the
temperature curve from lower temperature, for example at 45.degree.
C. The adaptive thermal control configures one or more multi-stage
temperature thresholds, T.sub.bound#j. Upon detecting the
temperature rises above one of the configured temperature
threshold, the adaptive thermal control uses a new control method.
The control method would throttle between high performance
frequency and lower performance frequencies with preconfigured high
frequency to low frequency ratios. In one embodiment, the micro
thermal control is customized to different models to achieve better
temperature curve. For example, one or more benchmarks are obtained
for a particular model of the mobile device. Temperature thresholds
and high-low frequency ratio are preconfigured based on these
benchmark measures. Further, the values of the high frequency and
low frequency are also configured for each temperature threshold.
As shown in graph 702, with adaptive throttle control, the
temperature rises under control and stays below 105.degree. C.
Graph 703 is the temperature curve for an adaptive thermal
throttle. As shown, Graph 703 is further enhanced for thermal
control. The adaptive thermal control would dynamically adjust
thermal control parameters, such as temperature threshold, high
frequency, low frequency, and high frequency to low frequency
ratios. The thermal control parameters are dynamically adjusted
based on detected system condition. The system thermal conditions,
such as the current temperature, temperature indicators, and
heat-generating events, are detected by the mobile device. In one
embodiment, the hardware (e.g. CPU the heat source) may notify the
thermal management about heat-generating event. The heat-generating
event may include the predicted heat it may generate or parameters
of the event such the thermal management may derive a thermal
prediction based on the parameters. In another embodiment, the
thermal management may monitor one or more driver behaviors. The
thermal management may predict system thermal condition changes
based on the detected driver behaviors. The system thermal
condition may be an indicator of generated heat or an indicator of
heat about to be generated. The latter indicator enables the
thermal management to adjust proactively the thermal control.
[0038] The thermal management can be further enhanced. In one
embodiment, adaptive time-based T.sub.j slope control is used. The
adaptive throttling method can be adaptively applied to different
chips. For example, the adaptive method can be based on CPU or GPU
thermal performance using benchmark score, such AnTuTu. In another
embodiment, context-aware dynamic thermal management (DTM) is used.
The context-aware DTM applies different strategies based on
different benchmarks to achieve the best thermal performance. In
yet another embodiment, a hybrid use of different strategies can be
employed to enhance further the performance. Thermal management
applies separate methods for different stages of the thermal
control. For example, before the temperature rises to T.sub.bound,
methods of slope control or adaptive slope control can be used;
while after the temperature rises above T.sub.bound, constant
control can be used. In the second stage of the thermal control
when the temperature rises above T.sub.bound, the thermal
management can further prioritize the control performance of
different heat-generating components or components of the mobile
device. For example, the thermal management can prioritize to
adjust the performance of GPU first based on
preconfigured/predefined criteria. In one embodiment,
micro-throttle may even disable one or more heat-generating
components.
[0039] FIG. 8 is a flow chart of a method of applying thermal
policy using throttle in accordance with one novel aspect. At step
801, the mobile device determines a temperature of the mobile
device, wherein the mobile device comprises at least one
heat-generating component. At step 802, the mobile device applies a
first throttle solution when the temperature reaches a first
threshold, wherein the first throttle solution controls the
temperature to arise below a first slope. At step 803, the mobile
device applies a second throttle solution when the temperature
reaches a second threshold, wherein the second throttle solution
controls the temperature to arise below a second slope. In one
embodiment, the second slope may be the same as the first slope. In
another embodiment, the second throttle solution may be the same as
the first throttle solution. In one embodiment, throttle may even
disable one or more heat-generating components.
[0040] Although the present invention has been described in
connection with certain specific embodiments for instructional
purposes, the present invention is not limited thereto.
Accordingly, various modifications, adaptations, and combinations
of various features of the described embodiments can be practiced
without departing from the scope of the invention as set forth in
the claims.
* * * * *