U.S. patent application number 14/864483 was filed with the patent office on 2017-03-30 for flexible heat transfer structure.
The applicant listed for this patent is Jones Tech (USA), Inc.. Invention is credited to Xiaoning Wu.
Application Number | 20170089650 14/864483 |
Document ID | / |
Family ID | 58407022 |
Filed Date | 2017-03-30 |
United States Patent
Application |
20170089650 |
Kind Code |
A1 |
Wu; Xiaoning |
March 30, 2017 |
FLEXIBLE HEAT TRANSFER STRUCTURE
Abstract
A heat transfer structure, including: a plurality of layers of
graphite material each having a shape selected for providing a
thermal path between a hotspot in an electronic device and a heat
dissipating structure of the electronic device; and a set of
intervening bonding layers for coupling together the layers of
graphite material such that the heat transfer structure has a
flexible body for avoiding mechanical stress on the hotspot when
the heat transfer structure is coupled between the hotspot and the
heat dissipating structure.
Inventors: |
Wu; Xiaoning; (Beijing,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Jones Tech (USA), Inc. |
Cupertino |
CA |
US |
|
|
Family ID: |
58407022 |
Appl. No.: |
14/864483 |
Filed: |
September 24, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/36 20130101;
H01L 23/367 20130101; H01L 23/373 20130101 |
International
Class: |
F28F 21/02 20060101
F28F021/02 |
Claims
1. A heat transfer structure for an electronic device, comprising:
a plurality of layers of graphite material each having a shape
selected for providing a thermal path between a hotspot in the
electronic device and a heat dissipating structure of the
electronic device; and a set of intervening bonding layers for
coupling together the layers of graphite material such that the
heat transfer structure has a flexible body for avoiding mechanical
stress on the hotspot when the heat transfer structure is coupled
between the hotspot and the heat dissipating structure.
2. The heat transfer structure of claim 1, wherein the hotspot is
an optical connector on a printed circuit board in the electronic
device.
3. The heat transfer structure of claim 2, wherein the optical
connector is thermally coupled to the heat transfer structure via a
pressure sensitive adhesive.
4. The heat transfer structure of claim 1, wherein the heat
transfer structure is coupled to the heat dissipating structure via
a pressure sensitive adhesive.
5. The heat transfer structure of claim 1, wherein the heat
transfer structure is coupled to the heat dissipating structure via
a detachable mechanism.
6. The heat transfer structure of claim 1, wherein the heat
dissipating structure is a heat sink in the electronic device.
7. The heat transfer structure of claim 1, wherein the heat
dissipating structure is a housing for the electronic device.
8. The heat transfer structure of claim 7, wherein a pair of
respective bent ends of the heat transfer structure are
respectively thermally coupled to a pair of respective opposing
wall of the housing.
9. The heat transfer structure of claim 7, wherein a pair of
respective bent ends of the heat transfer structure are
respectively thermally coupled to a wall of the housing and the
hotspot.
10. The heat transfer structure of claim 7, wherein a flat end and
a bent end of the heat transfer structure are respectively
thermally to the hotspot and a wall of the housing.
11. A method for heat transfer in an electronic device, comprising:
forming a plurality of layers of graphite material each having a
shape selected for providing a thermal path between a hotspot in
the electronic device and a heat dissipating structure of the
electronic device; and bonding together the layers of graphite
material such that the heat transfer structure has a flexible body
for avoiding mechanical stress on the hotspot when the heat
transfer structure is coupled between the hotspot and the heat
dissipating structure.
12. The method of claim 11, wherein forming a plurality of layers
of graphite material comprises forming the layers each having a
shape selected for providing a thermal path between an optical
connector in the electronic device and a heat dissipating structure
of the electronic device.
13. The method of claim 12, further comprising thermally coupling
the optical connector to the heat transfer structure via a pressure
sensitive adhesive.
14. The method of claim 11, further comprising thermally coupling
the heat transfer structure to the heat dissipating structure via a
pressure sensitive adhesive.
15. The method of claim 11, further comprising thermally coupling
the heat transfer structure to the heat dissipating structure via a
detachable mechanism.
16. The method of claim 11, further comprising thermally coupling
the heat transfer structure to a heat sink in the electronic
device.
17. The method of claim 11, further comprising thermally coupling
the heat transfer structure to a housing for the electronic
device.
18. The method of claim 17, further comprising forming a pair of
respective bent ends of the heat transfer structure and thermally
coupling the respective bent ends to a pair of respective opposing
wall of the housing.
19. The method of claim 17, further comprising forming a pair of
respective bent ends of the heat transfer structure and thermally
coupling the respective bent ends to a wall of the housing and the
hotspot.
20. The method of claim 17, further comprising forming a flat end
and a bent end of the heat transfer structure and thermally
coupling the flat end and the bent end to the hotspot and a wall of
the housing, respectively.
Description
BACKGROUND
[0001] An electronic device can include components that generate
heat. A component that generates heat in an electronic device can
be referred to as a hotspot. A hotspot in an electronic device can
negatively impact the functioning of the electronic device. An
electronic device can include a heat dissipating structure, e.g., a
housing or heat sink, for dissipating heat generated by hotspots in
the electronic device.
[0002] A hotspot in an electronic device can be located a distance
away from a heat dissipating structure. A metal, e.g., copper,
bridge structure can be used to transfer heat from a hotspot to a
heat dissipating structure located a distance away from the
hotspot. A metal bridge structure can place mechanical stress on
components in an electronic device, which can negatively impact the
functioning of the electronic device.
SUMMARY
[0003] In general, in one aspect, the invention relates to a heat
transfer structure for an electronic device. The can include: a
plurality of layers of graphite material each having a shape
selected for providing a thermal path between a hotspot in the
electronic device and a heat dissipating structure of the
electronic device; and a set of intervening bonding layers for
coupling together the layers of graphite material such that the
heat transfer structure has a flexible body for avoiding mechanical
stress on the hotspot when the heat transfer structure is coupled
between the hotspot and the heat dissipating structure.
[0004] In general, in another aspect, the invention relates to a
method for heat transfer in an electronic device. The method can
include: forming a plurality of layers of graphite material each
having a shape selected for providing a thermal path between a
hotspot in the electronic device and a heat dissipating structure
of the electronic device; and bonding together the layers of
graphite material such that the heat transfer structure has a
flexible body for avoiding mechanical stress on the hotspot when
the heat transfer structure is coupled between the hotspot and the
heat dissipating structure.
[0005] Other aspects of the invention will be apparent from the
following description and the appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] Embodiments of the present invention are illustrated by way
of example, and not by way of limitation, in the figures of the
accompanying drawings and in which like reference numerals refer to
similar elements.
[0007] FIG. 1 is a perspective view of a heat transfer structure
installed in an electronic device in one or more embodiments.
[0008] FIG. 2 is a perspective view of a heat transfer structure in
one or more embodiments.
[0009] FIG. 3 is a perspective view of a heat transfer structure
showing how its layers of graphite material and intervening bonding
layers enable flexing and bending.
[0010] FIG. 4 is a perspective view of a heat transfer structure
installed in an electronic device in another embodiment.
[0011] FIG. 5 is a perspective view of a heat transfer structure
installed in an electronic device in yet another embodiment.
[0012] FIG. 6 illustrates a method for heat transfer in an
electronic device in one or more embodiments.
DETAILED DESCRIPTION
[0013] Reference will now be made in detail to the various
embodiments of the present disclosure, examples of which are
illustrated in the accompanying drawings. Like elements in the
various figures are denoted by like reference numerals for
consistency. While described in conjunction with these embodiments,
it will be understood that they are not intended to limit the
disclosure to these embodiments. On the contrary, the disclosure is
intended to cover alternatives, modifications and equivalents,
which may be included within the spirit and scope of the disclosure
as defined by the appended claims. Furthermore, in the following
detailed description of the present disclosure, numerous specific
details are set forth in order to provide a thorough understanding
of the present disclosure. However, it will be understood that the
present disclosure may be practiced without these specific details.
In other instances, well-known methods, procedures, components,
have not been described in detail so as not to unnecessarily
obscure aspects of the present disclosure.
[0014] FIG. 1 is a perspective view of a heat transfer structure 10
installed in an electronic device 12 in one or more embodiments.
The heat transfer structure 10 includes multiple layers of graphite
material each having a shape selected for providing a thermal path
between a hot spot 14 in the electronic device 12 and a heat
dissipating structure 16 of the electronic device 12.
[0015] The hot spot 14 in this example is an optical fiber
connector mounted on a printed circuit board in the electronic
device 12. For example, the electronic device can be a
communication hub, switch, router, bridge, repeater, etc. The
optical fiber connector can generate heat when converting an
optical signal into an electrical signal.
[0016] The heat dissipating structure 16 in this example is a
housing of the electronic device 12. In other embodiments, the heat
dissipating structure 16 can be a heat sink for one or more
electronic components on a printed circuit board in the electronic
device 12.
[0017] In the embodiment of FIG. 1, the heat transfer structure 10
is positioned to carry heat away from the hotspot 14 to a pair
opposing walls 16a-16b of the housing of the electronic device 12.
A pair of respective bent ends 10a-10b of the heat transfer
structure 10 can be thermally coupled to the inner surfaces of the
respective opposing walls 16a-16b using a pressure sensitive
adhesive, or an adhesive resin. Alternatively, a mechanism, e.g.,
slots, grooves, clips, etc. can be used to enable attachment and
detachment of the respective bent ends 10a-10b of the heat transfer
structure 10 to and from the inner surfaces of the respective
opposing walls 16a-16b.
[0018] In one or more embodiments, the heat transfer structure 10
can include 5 layers of 32 micrometers thick graphite sheets bonded
to each other by intervening 10-micrometer double-sided pressure
sensitive adhesive tape. The adhesive areas of each bent end
10a-10b can measure 15 millimeters by 15 millimeters of pressure
sensitive adhesive tape. The heat transfer structure 10 in this
configuration can decrease a temperature of the hotspot 14 of 129
degrees C. by approximately 41 degrees C.
[0019] FIG. 2 is a perspective view of the heat transfer structure
10 in one or more embodiments. The heat transfer structure 10
includes multiple layers 20 of graphite material and a set of
intervening bonding 22 for coupling together the layers 20 of
graphite material. The layers 20 of graphite material and the
intervening bonding layers 22 yield a flexible body for the heat
transfer structure 10. There can be any number of the layers 20 in
the heat transfer structure 10. The intervening bonding layers 22
can be a flexible bonding material selected to allow flexing of the
heat transfer structure 10. The intervening bonding layers 22 can
be formed using a pressure sensitive adhesive, an adhesive resin,
etc.
[0020] FIG. 3 is a perspective view of the heat transfer structure
10 in one or more embodiments showing how the layers 20 of graphite
material and the intervening bonding layers 22 enable flexing and
bending of the heat transfer structure 10. Bending can facilitate
the installation of the heat transfer structure 10 between the hot
spot 14 and the heat dissipating structure 16. The flexibility of
the heat transfer structure 10 can help avoid mechanical stress on
the hot spot 14 when the heat transfer structure 10 is installed,
removed, manipulated, etc. For example, in embodiments in which the
hot spot 14 is an optical fiber connector mounted on a printed
circuit board, the flexibility of the heat transfer structure 10
can help avoid mechanical stress on the optical fiber connector and
the printed circuit board.
[0021] In the embodiment shown in FIG. 3, the heat transfer
structure 10 includes a pair of island structures 30-32 formed
through the layers 20 of graphite material and the intervening
bonding layers 22. The island structures 30-32 maintain a high
thermal conductivity for the heat transfer structure 10 by enabling
high thermal conduction between the layers 20. The island
structures 30-32 can be formed from a material having high thermal
conductivity, e.g., copper, silver, other metals, metal alloys,
etc. The island structures 30-32 can be formed from a thermal
compound. The island structures 30-32 can be formed in the heat
transfer structure 10 at positions selected for providing thermal
coupling to the hot spot 14 and the heat dissipating structure 16
of the electronic device 12, respectively.
[0022] FIG. 4 is a perspective view of the heat transfer structure
10 for the electronic device 12 in another embodiment. The heat
transfer structure 10 in this embodiment is positioned to carry
heat away from the hotspot 14 to an upper wall 16d of the housing
of the electronic device 12. A pair of respective bent ends 10c-10d
of the heat transfer structure 10 can be thermally coupled to the
hot spot 14 and the inner surface of the upper wall 16d,
respectively, using a pressure sensitive adhesive, an adhesive
resin, etc. Alternatively, a mechanism, e.g., slots, grooves,
clips, etc. can be used to enable attachment and detachment of the
bent end 10d of the heat transfer structure 10 to and from the
inner surface of the upper wall 16d.
[0023] In an example of the configuration shown in FIG. 4, the heat
transfer structure 10 can include 5 layers of 32 micrometers thick
graphite sheets bonded to each other by intervening 10-micrometer
double-sided pressure sensitive adhesive tape. The adhesive areas
of each bent end 10c-10d can measure 15 millimeters by 15
millimeters of pressure sensitive adhesive tape. The heat transfer
structure 10 in this configuration can decrease the temperature of
the hotspot 14 of 125 degrees C. by approximately 40 degrees C.
[0024] FIG. 5 is a perspective view of the heat transfer structure
10 for the electronic device 12 in yet another embodiment. The heat
transfer structure 10 in this embodiment is positioned to carry
heat away from the hotspot 14 to a sidewall 16e of the housing of
the electronic device 12. A bent end 10e of the heat transfer
structure 10 can be thermally coupled the inner surface of the
sidewall 16e using a pressure sensitive adhesive, an adhesive
resin, etc. Alternatively, a mechanism, e.g., slots, grooves,
clips, etc. can be used to enable attachment and detachment of the
bent end 10e to and from the inner surface of the sidewall 16e. A
flat end 10f of the heat transfer structure 10 can be thermally
coupled the hotspot 14 using a pressure sensitive adhesive, an
adhesive resin, etc.
[0025] In an example of the configuration shown in FIG. 5, the heat
transfer structure 10 can include 5 layers of 32 micrometers thick
graphite sheets bonded to each other by intervening 10-micrometer
double-sided pressure sensitive adhesive tape. The adhesive areas
of the ends 10e-10f can each measure 15 millimeters by 15
millimeters of pressure sensitive adhesive tape. The heat transfer
structure 10 in this configuration can decrease the temperature of
the hotspot 14 of 125 degrees C. by approximately 40 degrees C.
[0026] FIG. 6 illustrates a method for heat transfer in an
electronic device in one or more embodiments. While the various
steps in this flowchart are presented and described sequentially,
one of ordinary skill will appreciate that some or all of the steps
can be executed in different orders and some or all of the steps
can be executed in parallel. Further, in one or more embodiments,
one or more of the steps described below can be omitted, repeated,
and/or performed in a different order. Accordingly, the specific
arrangement of steps shown in FIG. 6 should not be construed as
limiting the scope of the invention.
[0027] At step 650, a plurality of layers of graphite material are
formed, each having a shape selected for providing a thermal path
between a hotspot in the electronic device and a heat dissipating
structure of the electronic device. Step 650 can include cutting
the layers from a synthetic graphite sheet. The dimensions and
shape of the cuts and the number of layers can be adapted to the
distance between the hotspot and the heat dissipating
structure.
[0028] At step 660, the layers of graphite material are bonded
together such that the heat transfer structure has a flexible body
for avoiding mechanical stress on the hotspot when the heat
transfer structure is coupled between the hotspot and the heat
dissipating structure. Step 760 can applying a pressure sensitive
adhesive or an adhesive resin between the layers.
[0029] While the foregoing disclosure sets forth various
embodiments using specific diagrams, flowcharts, and examples, each
diagram component, flowchart step, operation, and/or component
described and/or illustrated herein may be implemented,
individually and/or collectively, using a range of processes and
components.
[0030] The process parameters and sequence of steps described
and/or illustrated herein are given by way of example only. For
example, while the steps illustrated and/or described herein may be
shown or discussed in a particular order, these steps do not
necessarily need to be performed in the order illustrated or
discussed. The various example methods described and/or illustrated
herein may also omit one or more of the steps described or
illustrated herein or include additional steps in addition to those
disclosed.
[0031] While the invention has been described with respect to a
limited number of embodiments, those skilled in the art, having
benefit of this disclosure, will appreciate that other embodiments
may be devised which do not depart from the scope of the invention
as disclosed herein.
* * * * *