U.S. patent application number 14/857929 was filed with the patent office on 2017-03-23 for electronic device and method for manufacturing the same.
The applicant listed for this patent is InnoLux Corporation. Invention is credited to Po-Yun HSU, Szu-Yu LAI, Po-Ching LIN, Chi-Che TSAI.
Application Number | 20170084838 14/857929 |
Document ID | / |
Family ID | 58283157 |
Filed Date | 2017-03-23 |
United States Patent
Application |
20170084838 |
Kind Code |
A1 |
TSAI; Chi-Che ; et
al. |
March 23, 2017 |
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Abstract
An electronic device and a method for manufacturing the same are
disclosed. The electronic device of the present disclosure
comprises: a target unit comprising an electronic unit layer; and
small molecule residues adhered on a side of the target unit,
wherein the small molecule residues are at least one selected from
the group consisting of ##STR00001## and R.sub.1, R.sub.1',
R.sub.2, R.sub.2', R.sub.3, R.sub.3', R.sub.4, R.sub.5, R.sub.6,
R.sub.7, R.sub.8 are defined in the specification.
Inventors: |
TSAI; Chi-Che; (Miao-Li
County, TW) ; LIN; Po-Ching; (Miao-Li County, TW)
; HSU; Po-Yun; (Miao-Li County, TW) ; LAI;
Szu-Yu; (Miao-Li County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
InnoLux Corporation |
Miao-Li County |
|
TW |
|
|
Family ID: |
58283157 |
Appl. No.: |
14/857929 |
Filed: |
September 18, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/5246 20130101;
H01L 2251/5338 20130101; H01L 51/003 20130101; H01L 51/56
20130101 |
International
Class: |
H01L 51/00 20060101
H01L051/00; H01L 51/52 20060101 H01L051/52; H01L 51/56 20060101
H01L051/56 |
Claims
1. An electronic device, comprising: a target unit comprising an
electronic unit layer; and small molecule residues adhered on a
side of the target unit, wherein the small molecule residues are at
least one selected from the group consisting of ##STR00018##
wherein each of R.sub.1, R.sub.1', R.sub.2, R.sub.2', R.sub.4, and
R.sub.5 independently, is C.sub.1-10 alkyl; each of R.sub.3 and
R.sub.3' independently, is C.sub.1-10 alkyl, C.sub.2-10 alkenyl, or
C.sub.3-20 cycloalkyl; R.sub.6 is H or C.sub.1-10 alkyl; and each
of R.sub.7 and R.sub.8 independently, is C.sub.1-10 alkoxy.
2. The electronic device of claim 1, wherein the target unit
comprises a substrate with the electronic unit layer formed
thereon, wherein the small molecule residues are adhered on a side
of the substrate.
3. The electronic device of claim 1, wherein the target unit
comprises a substrate with an OLED unit formed thereon, and the
small molecule residues are adhered on a side of the OLED unit.
4. The electronic device of claim 1, wherein the small molecule
residues are at least one selected from the group consisting of
##STR00019## and wherein each of Ra, Rb and Rc independently, is
C.sub.2-6 alkyl; R.sub.6 is H or methyl; and each of R.sub.7 and
R.sub.8 independently, is methoxy or ethoxy.
5. A method for manufacturing an electronic device, comprising the
following steps: providing a target unit and a carrier with a UV
release layer formed thereon, wherein the carrier is adhered to the
target unit, the UV release layer is disposed between the target
unit and the carrier, the UV release layer comprises a polymer and
a gas-releasing molecule, and the target unit comprises an
electronic unit layer; and irradiating the UV release layer with UV
light to degrade the gas-releasing molecule and separate the target
unit from the carrier to obtain an electronic device, wherein the
gas-releasing molecule comprises at least one selected from the
group consisting of ##STR00020## wherein each of R.sub.1, R.sub.1',
R.sub.2, R.sub.2' and R.sub.9 independently, is C.sub.1-10 alkyl;
each of R.sub.3 and R.sub.3' independently, is C.sub.1-10 alkyl,
C.sub.2-10 alkenyl, or C.sub.3-20 cycloalkyl; Z.sub.1 is O; Z.sub.2
is N or S; and Q is ##STR00021## in which each of R.sub.4, and
R.sub.5 independently, is C.sub.1-10 alkyl; R.sub.6 is H or
C.sub.1-10 alkyl; and each of R.sub.7 and R.sub.8 independently, is
C.sub.1-10 alkoxy.
6. The method of claim 5, wherein the gas-releasing molecule
comprises at least one selected from the group consisting of
##STR00022## wherein each of Rd and Re independently, is C.sub.2-6
alkyl; R.sub.9 is C.sub.1-5 alkyl; Z.sub.1 is O; Z.sub.2 is N or S;
and Q is ##STR00023## in which R.sub.6 is H or methyl; and each of
R.sub.7 and R.sub.8 independently, is methoxy or ethoxy.
7. The method of claim 5, wherein the target unit comprises a
substrate with an electronic unit layer formed thereon, a side of
the substrate is adhered to the UV release layer, and the UV
release layer locates between the substrate and the carrier.
8. The method of claim 5, wherein the target unit comprises a
substrate with an OLED unit as the electronic unit layer formed
thereon, a side of the OLED unit is adhered to the UV release
layer, and the UV release layer locates between the OLED unit and
the carrier.
9. The method of claim 8, wherein in the step of providing the
target unit and the carrier, a sealant layer is further disposed on
the UV release layer, and the UV release layer is disposed between
the carrier and the sealant layer; and in the step of irradiating
the UV release layer with the UV light, the target unit is
separated from the carrier and the sealant layer is transferred
onto the OLED unit.
10. The method of claim 9, wherein in the step of providing the
target unit and the carrier, a barrier layer is further disposed
between the sealant layer and the UV release layer; and in the step
of irradiating the UV release layer with the UV light, the barrier
layer is transferred onto the OLED unit.
Description
BACKGROUND
[0001] 1. Field of the Invention
[0002] The present disclosure relates to an electronic device and a
method for manufacturing the same and, more particularly, to a
method for manufacturing an electronic device with a UV release
layer and an electronic device manufactured by the method of the
present disclosure.
[0003] 2. Description of Related Art
[0004] As the demand for thin and light electronic devices,
conventional glass substrate of the display panel is replaced by
flexible substrate which is a thin glass having a thickness between
0.01 mm to 0.3 mm or a plastic substrate.
[0005] However, rigidity of the flexible substrate is not high
enough for the current used process. Therefore, it is hard to form
electronic units thereon through the current used process for
manufacturing the electronic device.
[0006] In order to obtain the electronic device with the flexible
substrate manufactured through the current used process, the
flexible substrate is loaded on another carrier to increase the
rigidity thereof, and then the flexible substrate is separated from
the carrier after finishing electronic unit formation process.
[0007] On the other hand, the plastic substrate is also used for
preparing a flexible organic light emitting diode (OLED) display
device. In the process for manufacturing the OLED display device
with the plastic substrate, a sealant layer is formed on a carrier
via the conventional thermal release layer, and then transferred
onto OLED units. After the sealant layer is cured, a thermal
treatment is used to de-bond the carrier from the obtained OLED
display device. However, the heat used for curing the sealant layer
may cause the thermal release layer degraded, resulting in the OLED
unit and/or the sealant layer uneven.
[0008] Therefore, it is desirable to provide a novel method for
manufacturing an electronic device (including the OLED display
device), wherein the carrier can be removed easily without damaging
the obtained electronic device.
SUMMARY
[0009] The object of the present disclosure is to provide a method
for manufacturing an electronic device by using a UV release layer
comprising a gas-releasing molecule. After UV irradiation, the
gas-releasing molecule can be degraded to generate gas; and
therefore, the carrier used in the manufacturing process can be
easily removed by degrading the UV release layer. In addition, the
present disclosure also provides an electronic device obtained by
the method of the present disclosure.
[0010] To achieve the object, the method for manufacturing an
electronic device comprises the following steps: providing a target
unit and a carrier with a UV release layer formed thereon, wherein
the carrier is adhered to the target unit, the UV release layer is
disposed between the target unit and the carrier, the UV release
layer comprises a polymer and a gas-releasing molecule, and the
target unit comprises an electronic unit layer; and irradiating the
UV release layer with UV light to degrade the gas-releasing
molecule and separate the target unit from the carrier to obtain an
electronic device. Herein, the gas-releasing molecule comprises at
least one selected from the group consisting of
##STR00002##
wherein each of R.sub.1, R.sub.1', R.sub.2, R.sub.2' and R.sub.9
independently, is C.sub.1-10 alkyl; each of R.sub.3 and R.sub.3'
independently, is C.sub.1-10 alkyl, C.sub.2-10 alkenyl, or
C.sub.3-20 cycloalkyl;
Z.sub.1 is O;
Z.sub.2 is N or S; and
Q is
##STR00003##
[0011] in which each of R.sub.4, and R.sub.5 independently, is
C.sub.1-10 alkyl; R.sub.6 is H or C.sub.1-10 alkyl; and each of
R.sub.7 and R.sub.8 independently, is C.sub.1-10 alkoxy.
[0012] After the target unit is separated from the carrier, small
molecule residues degraded from the UV release layer may remain on
the target unit. Hence, after the method of the present disclosure,
and electronic device can be obtained, which comprises: a target
unit comprising an electronic unit layer; and small molecule
residues adhered on a side of the target unit. Herein, the small
molecule residues are at least one selected from the group
consisting of
##STR00004##
wherein each of R.sub.1, R.sub.1', R.sub.2, R.sub.2', R.sub.4, and
R.sub.5 independently, is C.sub.1-10 alkyl; each of R.sub.3 and
R.sub.3' independently, is C.sub.1-10 alkyl, C.sub.2-10 alkenyl, or
C.sub.3-20 cycloalkyl; R.sub.6 is H or C.sub.1-10 alkyl; and each
of R.sub.7 and R.sub.8 independently, is C.sub.1-10 alkoxy.
[0013] In addition, in the method of the present disclosure,
preferably, the gas-releasing molecule comprises at least one
selected from the group consisting of
##STR00005##
wherein each of Rd and Re independently, is C.sub.2-6 alkyl;
R.sub.9 is C.sub.1-5 alkyl;
Z.sub.1 is O;
Z.sub.2 is N or S; and
Q is
##STR00006##
[0014] in which R.sub.6 is H or methyl; and each of R.sub.7 and
R.sub.8 independently, is methoxy or ethoxy.
[0015] When the gas-releasing molecule comprises the aforementioned
preferable molecules, the small molecule residues remained on the
electronic device after UV irradiation preferably are at least one
selected from the group consisting of
##STR00007##
and wherein each of Ra, Rb and Rc independently, is C.sub.2-6
alkyl; R.sub.6 is H or methyl; and each of R.sub.7 and R.sub.8
independently, is methoxy or ethoxy.
[0016] In the present disclosure, alkyl, alkenyl, cycloalkyl,
alkoxy, phenyl present in the small molecule residues and the
gas-releasing molecule include both substituted and unsubstituted
moieties, unless specified otherwise. Possible substituents on
alkyl, alkenyl, cycloalkyl and alkoxy include, but are not limited
to, alkyl, halogen, alkoxy, heterocyclic group or aryl; but alkyl
cannot be substituted with alkyl.
[0017] In the present disclosure, the term "halogen" includes F,
Cl, Br and I; and preferably is F, Cl or Br. The term "alkyl"
refers to linear and branched alkyl; preferably, includes linear or
branched C.sub.1-10 alkyl; and more preferably, includes linear or
branched C.sub.1-6 alkyl. Specific examples of alkyl include, but
are not limited to, methyl, ethyl, n-propyl, iso-propyl, n-butyl,
sec-butyl, iso-butyl, tert-butyl, pentyl, neo-pentyl or hexyl. The
term "alkenyl" refers to a linear or branched hydrocarbon moiety
that contains at least one double bond; preferably, includes a
linear or branched hydrocarbon C.sub.2-10 moiety containing at
least one double bond; and more preferably, includes a linear or
branched hydrocarbon C.sub.2-6 moiety containing at least one
double bond. Specific examples of alkenyl include, but are not
limited to, ethenyl, propenyl, allyl, or 1,4-butadienyl. The term
"alkoxy" refers to a moiety that the alkyl defined in the present
disclosure coupled with an oxygen atom; preferably, includes linear
or branched C.sub.1-10 alkoxy; and more preferably, includes linear
or branched C.sub.1-6 alkoxy. Specific examples of alkoxy include,
but are not limited to, methoxy, ethoxy, n-propoxy, iso-propoxy,
n-butoxy, iso-butoxy, sec-butoxy, tert-butoxy, pentyloxy,
neo-pentyloxy or hexyloxy. The term "cycloalkyl" refers to a
monovalent saturated hydrocarbon ring system having 3 to 20 carbon
atoms; and preferably having 3 to 12 carbon atoms. Specific
examples of cycloalkyl include, but are not limited to,
cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and
cyclooctyl. The term "heterocyclic group" refers to a 5-8 membered
monocyclic, 8-12 membered bicyclic or 11-14 membered tricyclic
heteroaryl or heterocycloalkyl having at least one heteroatom which
is selected from the group consisting of O, S and N. Specific
examples of heterocyclic group include, but are not limited to,
pyridyl, pyrimidinyl, furyl, thiazolyl, imidazolyl or thienyl. The
term "aryl" refers to a monovalent 6-carbon monocyclic, 10-carbon
bicyclic, or 14-carbon tricyclic aromatic ring system. Specific
examples of aryl include, but are not limited to, phenyl, naphthyl,
pyrenyl, anthracenyl or phenanthryl; and preferably, the aryl is
phenyl.
[0018] In the method of the present disclosure, the conventional
thermal release layer is substituted with a UV release layer, which
does not degrade during the curing process of the sealant layer;
therefore, the aforementioned problem can be solved. Other objects,
advantages, and novel features of the disclosure will become more
apparent from the following detailed description when taken in
conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] FIGS. 1A to 1D are cross-sectional view showing a process
for manufacturing an OLED display device according to Embodiment 1
of the present disclosure.
[0020] FIGS. 2A to 2D are cross-sectional view showing a process
for manufacturing an electronic device according to Embodiment 2 of
the present disclosure.
[0021] FIG. 3 is a cross-sectional view of a testing sheet used in
Texting examples 1 and 2 of the present disclosure.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0022] The present disclosure has been described in an illustrative
manner, and it is to be understood that the terminology used is
intended to be in the nature of description rather than of
limitation. Many modifications and variations of the present
disclosure are possible in light of the above teachings. Therefore,
it is to be understood that within the scope of the appended
claims, the disclosure may be practiced otherwise than as
specifically described.
[0023] In the following embodiments and other embodiments of the
present disclosure, alkyl, alkenyl, cycloalkyl, alkoxy, phenyl
present in the small molecule residues and the gas-releasing
molecule include both substituted and unsubstituted moieties,
unless specified otherwise. Possible substituents on alkyl,
alkenyl, cycloalkyl and alkoxy include, but are not limited to,
alkyl, halogen, alkoxy, heterocyclic group or aryl; but alkyl
cannot be substituted with alkyl.
[0024] In addition, in the following embodiments and other
embodiments of the present disclosure, the term "halogen" includes
F, Cl, Br and I; and preferably is F, Cl or Br. The term "alkyl"
refers to linear and branched alkyl; preferably, includes linear or
branched C.sub.1-10 alkyl; and more preferably, includes linear or
branched C.sub.1-6 alkyl. Specific examples of alkyl include, but
are not limited to, methyl, ethyl, n-propyl, iso-propyl, n-butyl,
sec-butyl, iso-butyl, tert-butyl, pentyl, neo-pentyl or hexyl. The
term "alkenyl" refers to a linear or branched hydrocarbon moiety
that contains at least one double bond; preferably, includes a
linear or branched hydrocarbon C.sub.2-10 moiety containing at
least one double bond; and more preferably, includes a linear or
branched hydrocarbon C.sub.2-6 moiety containing at least one
double bond. Specific examples of alkenyl include, but are not
limited to, ethenyl, propenyl, allyl, or 1,4-butadienyl. The term
"alkoxy" refers to a moiety that the alkyl defined in the present
disclosure coupled with an oxygen atom; preferably, includes linear
or branched C.sub.1-10 alkoxy; and more preferably, includes linear
or branched C.sub.1-6 alkoxy. Specific examples of alkoxy include,
but are not limited to, methoxy, ethoxy, n-propoxy, iso-propoxy,
n-butoxy, iso-butoxy, sec-butoxy, tert-butoxy, pentyloxy,
neo-pentyloxy or hexyloxy. The term "cycloalkyl" refers to a
monovalent saturated hydrocarbon ring system having 3 to 20 carbon
atoms; and preferably having 3 to 12 carbon atoms. Specific
examples of cycloalkyl include, but are not limited to,
cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and
cyclooctyl. The term "heterocyclic group" refers to a 5-8 membered
monocyclic, 8-12 membered bicyclic or 11-14 membered tricyclic
heteroaryl or heterocycloalkyl having at least one heteroatom which
is selected from the group consisting of O, S and N. Specific
examples of heterocyclic group include, but are not limited to,
pyridyl, pyrimidinyl, furyl, thiazolyl, imidazolyl or thienyl. The
term "aryl" refers to a monovalent 6-carbon monocyclic, 10-carbon
bicyclic, or 14-carbon tricyclic aromatic ring system. Specific
examples of aryl include, but are not limited to, phenyl, naphthyl,
pyrenyl, anthracenyl or phenanthryl; and preferably, the aryl is
phenyl.
Embodiment 1
[0025] FIGS. 1A to 1D are cross-sectional view showing a process
for manufacturing an OLED display device according to the present
embodiment.
[0026] As shown in FIG. 1A, a target unit comprising a substrate 11
with an OLED unit 12 (as an electronic unit layer) formed thereon
is provided; and a carrier 13 with a UV release layer 14 formed
thereon is also provided. Herein, the UV release layer 14 can be
formed on the carrier 13 by a coating process such as a spin
coating process, a dip coating process, a blade coating process, a
printing process and so on; or the UV release layer 14 can be
formed in a tap manner in advance, and then the UV release layer 14
is adhered onto the carrier 13 through a rolling process.
[0027] In the present embodiment, the material of the carrier 13 is
not particularly limited; as long as the carrier can be applied on
the current used machine in the art, for example, a glass carrier,
a quartz carrier, or a plastic carrier. Preferably, the carrier 13
has a light transmittance larger than 30%. More preferably, the
light transmittance of the carrier is in a range from 80% to 99%.
Most preferably, the light transmittance thereof is in a range from
90% to 99%. Specifically, the carrier 13 preferably has a light
transmittance larger than 30% under UV irradiation (which has a
wavelength of 200-420 nm). More preferably the light transmittance
of the carrier 13 is in a range from 80% to 99% under UV
irradiation. Most preferably, the light transmittance thereof is in
a range from 90% to 99% under UV irradiation.
[0028] In the present embodiment, a material of the UV release
layer 14 comprises a polymer and a gas-releasing molecule. In
addition, a photo initiator is also contained in the material of
the UV release layer 14.
[0029] Herein, the polymer contained in the UV release layer 14 is
preferably has the following properties. The first one is that the
polymer can provide enough adhesion for the carrier 13. The second
one is that the adhesion thereof is decreased after the UV
irradiation; in particular, after the UV irradiation, the polymer
is cross-linked, the loss factor (adhesive behavior) tan .delta.
decreases and thus the adhesion thereof is decreased. Wherein the
loss factor tan .delta.=G''/G', G' is storage modulus (elastic
behavior), and G'' is loss modulus (viscous behavior). In the
present embodiment, specific examples of the polymer include, but
are not limited to acrylic polymer.
[0030] In addition, the gas-releasing molecule contained in the UV
release layer 14 of the present embodiment may comprise: at least
one selected from the group consisting of
##STR00008##
wherein each of R.sub.1, R.sub.1', R.sub.2, R.sub.2' and R.sub.9
independently, is C.sub.1-10 alkyl; each of R.sub.3 and R.sub.3'
independently, is C.sub.1-10 alkyl, C.sub.2-10 alkenyl, or
C.sub.3-20 cycloalkyl;
Z.sub.1 is O;
Z.sub.2 is N or S; and
Q is
##STR00009##
[0031] in which each of R.sub.4, and R.sub.5 independently, is
C.sub.1-10 alkyl; R.sub.6 is H or C.sub.1-10 alkyl; and each of
R.sub.7 and R.sub.8 independently, is C.sub.1-10 alkoxy.
[0032] Specific examples of the gas-releasing molecule include, but
are not limited to
##STR00010##
wherein each of Rd and Re independently, is C.sub.2-6 alkyl;
R.sub.9 is C.sub.1-5 alkyl;
Z.sub.1 is O;
Z.sub.2 is N or S; and
Q is
##STR00011##
[0033] in which R.sub.6 is H or methyl; and each of R.sub.7 and
R.sub.8 independently, is methoxy or ethoxy.
[0034] The gas-releasing molecules represented by the formulas (I)
and (II) can respectively release N.sub.2 and CO.sub.2 after UV
irradiation. Herein, the gas-releasing molecules represented by the
formulas (I) and (II) can be used alone or in combination. In
addition, the wavelength of the UV light used in the UV irradiation
is not particularly limited, and depends upon the substituents
present in the formulas (I) and/or (II).
[0035] Herein, the thickness of the UV release layer 14 is
10.about.100 .mu.m. If the thickness of the UV release layer 14 is
too thin, the UV release layer 14 cannot provide enough adhesion
for adhering the target unit and the carrier 13. If the thickness
thereof is too thick, the polymer contained in the UV release layer
14 may be remain on the obtained electronic device.
[0036] In the present embodiment, as shown in FIG. 1A, a sealant
layer 16 is further disposed on the UV release layer 14, and the UV
release layer 14 is disposed between the carrier 13 and the sealant
layer 16. Herein, a sealant layer 16 is a face sealant used in the
OLED display device. In addition, in the present embodiment, a
barrier layer 15 is also formed on the UV release layer 14, and the
barrier layer 15 is disposed between the UV release layer 14 and
the sealant layer 16.
[0037] In the present embodiment, the substrate 11 is a plastic
substrate such as a poly(ethylene terephthalate) (PET) substrate, a
polyethylene naphthalate (PEN) substrate and a cyclic olefin
copolymer (COP) substrate, but the present disclosure is not
limited thereto. In other embodiment, the substrate 11 is a thin
glass substrate. Herein, the OLED unit 12 shown in FIGS. 1A to 1D
is simplified into one single layer; however, even though not shown
in the figure, the OLED unit 12 of the present embodiment may
comprise: TFT units; electrode layers containing anode and cathode;
conducting wires containing scan lines, data lines, and power
lines; a pixel define layer; capping layers; encapsulation layers;
OLED layers containing a light emitting layer, an electron
transporting layer, an electron injection layer, a hole
transporting layer, a hole injection layer, and/or other layers
capable of facilitating the combination of holes and electrons.
[0038] After the carrier 13 and the target unit comprising the
substrate 11 with the OLED unit 12 formed thereon are provided, the
carrier 13 is adhered to the target unit, the UV release layer 14
is disposed between the target unit and the carrier 13, as shown in
FIG. 1B. More specifically, a side of the OLED unit 12 is adhered
to the sealant layer 16 on the UV release layer 14, and the UV
release layer 14 locates between the OLED unit 12 and the carrier
13. Then, after the sealant layer 16 is cured by heating, UV light
is applied onto the carrier 13 and penetrates through the carrier
13 to achieve the UV release layer 14 to degrade the gas-releasing
molecule in the UV release layer 14, and thus the target unit
comprising the substrate 11 and the OLED unit 12 can be separated
from the carrier 13 (as shown in FIG. 1C) to obtain an OLED display
device (as shown in FIG. 1D) in which the sealant layer 16 as well
as the barrier layer 15 are transferred onto the OLED unit 12.
[0039] Herein, the UV irradiation is provided from the side of the
carrier 13. More specifically, the radiation is provided onto the
carrier 13 without the UV release layer 14 formed thereon, so that
the light can penetrate through the carrier 13 to achieve the UV
release layer 14 to perform the photo-reaction (the photo-cleavage,
or the photo-degradation). Herein, the wavelength, the light
intensity, and the UV irradiation time are not particularly
limited, and can be selected according to the gas-releasing
molecule, as long as the separation between the target unit and the
carrier 13 can be achieved.
[0040] After the UV release layer 14 is degraded and the carrier 13
is removed, small molecule residues degraded from the UV release
layer 14 may remain on the target unit (especially on the barrier
layer 15), which are at least one selected from the group
consisting of
##STR00012##
wherein each of R.sub.1, R.sub.1', R.sub.2, R.sub.2', R.sub.4, and
R.sub.5 independently, is C.sub.1-10 alkyl; each of R.sub.3 and R3'
independently, is C.sub.1-10 alkyl, C.sub.2-10 alkenyl, or
C.sub.3-20 cycloalkyl; R.sub.6 is H or C.sub.1-10 alkyl; and each
of R.sub.7 and R.sub.8 independently, is C.sub.1-10 alkoxy.
[0041] Herein, specific examples of the small molecule residues
include, but are not limited to
##STR00013##
and wherein each of Ra, Rb and Rc independently, is C.sub.2-6
alkyl; R.sub.6 is H or methyl; and each of R.sub.7 and R.sub.8
independently, is methoxy or ethoxy.
[0042] After the aforementioned process, as shown in FIG. 1D, an
OLED display device of the present embodiment is provided, which
comprises: a target unit comprising the substrate 11 with the OLED
unit 12 (as an electronic unit layer) formed thereon; and small
molecule residues adhered on a side of the target unit. More
specifically, in the present embodiment, the small molecule
residues are adhered on a side of the OLED unit 12, and
particularly on a surface of the barrier layer 15.
[0043] Herein, it should be noted that, the UV release layer 14 is
almost separated from the target unit (especially, the barrier
layer 15 on the OLED unit 12) after the UV irradiation, and only
small molecule residues are maintained on the surface of the target
unit.
[0044] In the present embodiment, as shown in FIGS. 1A to 1D, for
the flexible OLED display device, the used substrate 11 is a
plastic substrate and the sealant layer 16 (which is usually a face
sealant) is transferred from the carrier 13 onto the OLED unit 12.
In the conventional process, the sealant layer 16 is adhered on the
carrier 13 via the conventional thermal release layer in advance,
the carrier 13 is laminated onto the substrate 11 by facing the
sealant layer 16 to the OLED unit 12, and then the sealant layer 16
is cured by heating and pressing. However, the heat for curing the
sealant layer 16 may cause the conventional thermal release layer
gradually degraded. The degraded thermal release layer may loss its
adhesion property; and the gas released from the degraded thermal
release layer may compress OLED unit 12 and/or the sealant layer
16, causing the OLED unit 12 and/or the sealant layer 16
uneven.
[0045] In the present embodiment, as shown in FIGS. 1A to 1D, the
UV release layer 14, which is not degraded by heat, is used to
replace the conventional thermal release layer. Therefore, during
the curing process of the sealant layer 16, the UV release layer 14
does not degrade and the adhesion thereof can be maintained. When
the curing process of the sealant layer 16 is completed, the UV
light is applied onto the UV release layer 14. During the UV
irradiation, the polymer contained in the UV release layer 14 is
gradually cross-linked, resulting in the adhesion thereof
decreased. In addition, the gas-releasing molecule contained in the
UV release layer 14 is gradually degraded due to the UV
irradiation, and the gas degraded from the gas-releasing molecule
can expand and open up the adhesion interface between the UV
release layer 14 and the OLED unit 12 (in the present embodiment,
the barrier layer 15). Therefore, the debonding of the carrier 13
can be accomplished. Since the UV release layer 14 does not degrade
and there is no gas generated during the curing process of the
sealant layer 16, the aforementioned problem resulting from using
the conventional thermal release layer can be eliminated.
Embodiment 2
[0046] FIGS. 2A to 2D are cross-sectional view showing a process
for manufacturing an electronic device according to the present
embodiment.
[0047] As shown in FIG. 2A, a carrier 23 with a UV release layer 24
formed thereon is provided. Next, as shown in FIG. 2B, a substrate
21 and an electronic unit layer 22 are sequentially laminated on
the UV release layer 24 to form a target unit. Herein, the carrier
23 is adhered to the target unit, and the UV release layer 24 is
disposed between the carrier 23 and the target unit comprising the
substrate 21 and the electronic unit layer 22. More specifically, a
side of the substrate 21 is adhered to the UV release layer 24, and
the UV release layer 24 locates between the substrate 21 and the
carrier 23.
[0048] In the present embodiment, the substrate 21 is a flexible
substrate, such as a plastic substrate, a thin glass substrate with
a thickness of 0.3 mm or less, a metal substrate, and a stainless
steel substrate. The flexible substrate does not have enough
rigidity, so the carrier 23 can be used as a support for the
sequential process for forming the electronic unit layer 22.
[0049] Herein, the carrier 23 and the UV release layer 24 are
similar to those illustrated in Embodiment 1, and therefore the
descriptions thereof are not repeated.
[0050] Then, as shown in FIG. 2C, UV light is applied onto the
carrier 23 and penetrates through the carrier 23 to achieve the UV
release layer 24 to degrade the gas-releasing molecule in the UV
release layer 24, and thus the target unit comprising the substrate
21 and the electronic unit layer 22 can be separated from the
carrier 23, as shown in FIG. 2D.
[0051] After the UV release layer 24 is degraded and the carrier 23
is removed, small molecule residues degraded from the UV release
layer 24 may remain on the target unit (especially on a surface of
the substrate 21). Herein, the small molecule residues on the
substrate 21 are similar to those illustrated in Embodiment 1, and
therefore the descriptions thereof are not repeated.
[0052] After the aforementioned process, as shown in FIG. 2D, an
electronic device of the present embodiment is provided, which
comprises: a target unit comprising the substrate 21 and the
electronic unit layer 22; and small molecule residues adhered on a
side of the target unit. More specifically, in the present
embodiment, the small molecule residues are adhered on a side of
the substrate 21, but not on a side of the electronic unit layer
22.
[0053] In the present embodiment, as shown in FIGS. 2A to 2D, for
the flexible electronic device, the used flexible substrate 21 does
not have enough rigidity, and therefore, a carrier 23 has to be
used to support the flexible substrate for the sequential process.
If the flexible substrate is adhered onto the carrier via the
conventional thermal release layer, the sequential high temperature
process may cause the adhesion of the thermal release layer
deteriorated, and thus the manufacturing process may be failed.
[0054] In the present embodiment, as shown in FIGS. 2A to 2D, the
UV release layer 24, which is not degraded by heat, is used to
replace the conventional thermal release layer. Even though the
heat is generated during the sequential high temperature process,
the UV release layer 24 still can keep its adhesion property, and
therefore the aforementioned problem caused by the using of the
thermal release layer can be solved.
Test Example 1
[0055] In the present test example, the used testing sheet
comprises: a substrate 31; a carrier 33; and a UV release layer 34
sandwiched between a carrier 33 and a substrate 31. Herein, the
substrate 31 and the carrier 33 are glass substrates; and the UV
release layer 34 comprises acrylic acid polymer and methacrylic
polymer and a gas-releasing molecule represented by the following
formula (I-1):
##STR00014##
[0056] After UV light having a wavelength of 375 nm is applied onto
the UV release layer 34, a photo-degradation process is progressed
in the UV release layer 34 to degrade the compound of the formula
(I-1); and
##STR00015##
and N.sub.2 are generated. Bubbles can be observed in the testing
sheet (the photo not shown), which are caused by the generated
N.sub.2.
Test Example 2
[0057] The testing sheet used in the present test example is
similar to that used in Test example 1, except that the
gas-releasing molecule used in the present Test example is
represented by the following formula (II-1):
##STR00016##
[0058] After UV light having a wavelength of 365 nm is applied onto
the UV release layer 34,
##STR00017##
and CO.sub.2 degraded from the compound of formula (II-1) are
generated. Bubbles can be observed in the testing sheet (the photo
not shown), which are caused by the generated CO.sub.2.
[0059] The results shown in Test examples 1 and 2 indicate that the
gas can generate due to the photo-degradation process of the
gas-releasing molecule, and the generated gas can expand and open
up the adhesion interface between the UV release layer and the
substrate.
[0060] In the present disclosure, the electronic device obtained in
the present embodiment can also be applied to various apparatus,
such as cell phones, notebooks, video cameras, cameras, music
players, navigation devices, and televisions.
[0061] Although the present disclosure has been explained in
relation to its preferred embodiment, it is to be understood that
many other possible modifications and variations can be made
without departing from the spirit and scope of the disclosure as
hereinafter claimed.
* * * * *