U.S. patent application number 15/342316 was filed with the patent office on 2017-02-23 for method for manufacturing semiconductor device.
The applicant listed for this patent is Semiconductor Energy Laboratory Co., Ltd.. Invention is credited to Shinya SASAGAWA, Hideomi SUZAWA, Shunpei YAMAZAKI.
Application Number | 20170054030 15/342316 |
Document ID | / |
Family ID | 44972818 |
Filed Date | 2017-02-23 |
United States Patent
Application |
20170054030 |
Kind Code |
A1 |
YAMAZAKI; Shunpei ; et
al. |
February 23, 2017 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Abstract
An object of an embodiment of the present invention is to
provide a semiconductor device including a normally-off oxide
semiconductor element whose characteristic variation is small in
the long term. A cation containing one or more elements selected
from oxygen and halogen is added to an oxide semiconductor layer,
thereby suppressing elimination of oxygen, reducing hydrogen, or
suppressing movement of hydrogen. Accordingly, carriers in the
oxide semiconductor can be reduced and the number of the carriers
can be kept constant in the long term. As a result, the
semiconductor device including the normally-off oxide semiconductor
element whose characteristic variation is small in the long term
can be provided.
Inventors: |
YAMAZAKI; Shunpei;
(Setagaya, JP) ; SUZAWA; Hideomi; (Atsugi, JP)
; SASAGAWA; Shinya; (Chigasaki, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Semiconductor Energy Laboratory Co., Ltd. |
Atsugi-shi |
|
JP |
|
|
Family ID: |
44972818 |
Appl. No.: |
15/342316 |
Filed: |
November 3, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13107054 |
May 13, 2011 |
9496405 |
|
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15342316 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/66969 20130101;
H01L 29/7869 20130101; H01L 27/1225 20130101 |
International
Class: |
H01L 29/786 20060101
H01L029/786; H01L 27/12 20060101 H01L027/12; H01L 29/66 20060101
H01L029/66 |
Foreign Application Data
Date |
Code |
Application Number |
May 20, 2010 |
JP |
2010-115940 |
Claims
1. (canceled)
2. A method for manufacturing a semiconductor device, comprising:
forming a gate electrode over an insulator; forming a gate
insulating layer over the gate electrode; performing a first plasma
treatment to add oxygen to the gate insulating layer; forming a
first oxide semiconductor layer over the gate insulating layer;
performing a second plasma treatment to add oxygen to the first
oxide semiconductor layer; forming a second oxide semiconductor
layer over the first oxide semiconductor layer after the second
plasma treatment; forming a source electrode and a drain electrode
over the second oxide semiconductor layer; and forming an
insulating layer over the second oxide semiconductor layer, the
source electrode, and the drain electrode, wherein each of the
first oxide semiconductor layer and the second oxide semiconductor
layer overlaps with the gate electrode, and wherein a power for the
second plasma treatment performed to the first oxide semiconductor
layer is greater than or equal to 100 W and less than or equal to
2000 W.
3. The method for manufacturing a semiconductor device according to
claim 2, wherein the second plasma treatment is inductively coupled
plasma treatment, wherein a power applied to a lower electrode
provided on a substrate side in the second plasma treatment is
greater than or equal to 0 W and less than or equal to 300 W.
4. The method for manufacturing a semiconductor device according to
claim 2, wherein the first plasma treatment is inductively coupled
plasma treatment, wherein a power for the first plasma treatment is
greater than or equal to 100 W and less than or equal to 2000 W,
and wherein a power applied to a lower electrode provided on a
substrate side in the first plasma treatment is greater than or
equal to 0 W and less than or equal to 300 W.
5. The method for manufacturing a semiconductor device according to
claim 2, wherein a concentration of hydrogen in the gate insulating
layer is less than or equal to 5.times.10.sup.20
atoms/cm.sup.3.
6. The method for manufacturing a semiconductor device according to
claim 2, wherein the first oxide semiconductor layer and the second
oxide semiconductor layer comprise indium, gallium, and zinc.
7. The method for manufacturing a semiconductor device according to
claim 2, wherein the first plasma treatment and the second plasma
treatment are performed by one selected from an electron cyclotron
resonance (ECR) plasma method, a helicon wave plasma (HWP) method,
an inductively coupled plasma (ICP) method, and a microwave-excited
surface wave plasma (SWP) method; or a combination thereof.
8. The method for manufacturing a semiconductor device according to
claim 2, further comprising: performing a heat treatment at the
time of performing a second plasma treatment to the first oxide
semiconductor layer.
9. A method for manufacturing a semiconductor device, comprising:
forming a first oxide semiconductor layer over an insulator;
performing a first plasma treatment to add oxygen to the first
oxide semiconductor layer; forming a second oxide semiconductor
layer over the first oxide semiconductor layer after the first
plasma treatment; forming a source electrode and a drain electrode
over the second oxide semiconductor layer; forming a gate
insulating layer over the second oxide semiconductor layer, the
source electrode and the drain electrode; performing a second
plasma treatment to add oxygen to the gate insulating layer; and
forming a gate electrode over the gate insulating layer, wherein
the gate electrode overlaps with the first oxide semiconductor
layer and the second oxide semiconductor layer, and wherein a power
for the first plasma treatment performed to the first oxide
semiconductor layer is greater than or equal to 100 W and less than
or equal to 2000 W.
10. The method for manufacturing a semiconductor device according
to claim 9, wherein the first plasma treatment is inductively
coupled plasma treatment, wherein a power applied to a lower
electrode provided on a substrate side in the first plasma
treatment is greater than or equal to 0 W and less than or equal to
300 W.
11. The method for manufacturing a semiconductor device according
to claim 9, wherein the second plasma treatment is inductively
coupled plasma treatment, and wherein a power applied to a lower
electrode provided on a substrate side in the second plasma
treatment is greater than or equal to 0 W and less than or equal to
300 W.
12. The method for manufacturing a semiconductor device according
to claim 9, wherein a concentration of hydrogen in the gate
insulating layer is less than or equal to 5.times.10.sup.20
atoms/cm.sup.3.
13. The method for manufacturing a semiconductor device according
to claim 9, wherein the first oxide semiconductor layer and the
second oxide semiconductor layer comprise indium, gallium, and
zinc.
14. The method for manufacturing a semiconductor device according
to claim 9, wherein the first plasma treatment and the second
plasma treatment are performed by one selected from an electron
cyclotron resonance (ECR) plasma method, a helicon wave plasma
(HWP) method, an inductively coupled plasma (ICP) method, and a
microwave-excited surface wave plasma (SWP) method; or a
combination thereof.
15. The method for manufacturing a semiconductor device according
to claim 9, further comprising: performing a heat treatment at the
time of performing a first plasma treatment to the first oxide
semiconductor layer.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a method for manufacturing
a semiconductor device including a semiconductor element using an
oxide semiconductor. An embodiment of the disclosed invention
relates to a method for manufacturing a semiconductor device
including an oxide semiconductor element with favorable initial
characteristics and small characteristic variation in the long
term.
[0003] 2. Description of the Related Art
[0004] There are a wide variety of metal oxides and such metal
oxides are used for various applications. Indium oxide is a
well-known material and is used as a transparent electrode material
which is necessary for liquid crystal displays and the like.
[0005] Some metal oxides have semiconductor characteristics. The
examples of such metal oxides having semiconductor characteristics
are tungsten oxide, tin oxide, indium oxide, zinc oxide, and the
like. A thin film transistor in which a channel formation region is
formed using such metal oxides having semiconductor characteristics
is known (for example, see Patent Documents 1 to 4, Non-Patent
Document 1, and the like).
[0006] Further, not only single-component oxides but also
multi-component oxides are known as metal oxides. For example,
InGaO.sub.3(ZnO).sub.m (m is natural number) which is a homologous
compound is known as a multi-component oxide containing In, Ga and
Zn (for example, see Non-Patent Documents 2 to 4 and the like).
[0007] Furthermore, it is confirmed that an oxide semiconductor
including such an In--Ga--Zn--O-based oxide is applicable to a
channel layer of a thin film transistor (for example, see Patent
Document 5, Non-Patent Documents 5 and 6, and the like).
REFERENCE
Patent Document
[0008] [Patent Document 1] Japanese Published Patent Application
No. S60-198861
[0009] [Patent Document 2] Japanese Published Patent Application
No. H8-264794
[0010] [Patent Document 3] Japanese Translation of PCT
International Application No. H11-505377
[0011] [Patent Document 4] Japanese Published Patent Application
No. 2000-150900
[0012] [Patent Document 5] Japanese Published Patent Application
No. 2004-103957
Non-Patent Document
[0013] [Non-Patent Document 1] M. W. Prins, K. 0. Grosse-Holz, G.
Muller, J. F. M. Cillessen, J. B. Giesbers, R. P. Weening, and R.
M. Wolf, "A ferroelectric transparent thin-film transistor", Appl.
Phys. Lett., 17 Jun. 1996, Vol. 68 pp. 3650-3652
[0014] [Non-Patent Document 2] M. Nakamura, N. Kimizuka, and T.
Mohri, "The Phase Relations in the
In.sub.2O.sub.3--Ga.sub.2ZnO.sub.4--ZnO System at 1350.degree. C.",
J. Solid State Chem., 1991, Vol. 93, pp. 298-315
[0015] [Non-Patent Document 3] N. Kimizuka, M. Isobe, and M.
Nakamura, "Syntheses and Single-Crystal Data of Homologous
Compounds, In.sub.2O.sub.3(ZnO).sub.m (m=3, 4, and 5),
InGaO.sub.3(ZnO).sub.3, and Ga.sub.2O.sub.3(ZnO).sub.m (m=7, 8, 9,
and 16) in the In.sub.2O.sub.3--ZnGa.sub.2O.sub.4--ZnO System", J.
Solid State Chem., 1995, Vol. 116, pp. 170-178
[0016] [Non-Patent Document 4] M. Nakamura, N. Kimizuka, T. Mohri,
and M. Isobe, "Syntheses and crystal structures of new homologous
compounds, indium iron zinc oxides (InFeO.sub.3(ZnO).sub.m) (m:
natural number) and related compounds", KOTAI BUTSURI (SOLID STATE
PHYSICS), 1993, Vol. 28, No. 5, pp. 317-327
[0017] [Non-Patent Document 5] K. Nomura, H. Ohta, K. Ueda, T.
Kamiya, M. Hirano, and H. Hosono, "Thin-film transistor fabricated
in single-crystalline transparent oxide semiconductor", SCIENCE,
2003, Vol. 300, pp. 1269-1272
[0018] [Non-Patent Document 6] K. Nomura, H. Ohta, A. Takagi, T.
Kamiya, M. Hirano, and H. Hosono, "Room-temperature fabrication of
transparent flexible thin-film transistors using amorphous oxide
semiconductors", NATURE, 2004, Vol. 432 pp. 488-492
SUMMARY OF THE INVENTION
[0019] As described above, an oxide semiconductor has been
extensively researched; however, for its complex composition, the
characteristics of the oxide semiconductor itself have not been
elucidated. The present situation is that under these
circumstances, a manufacturing condition by which a semiconductor
element using an oxide semiconductor can have favorable
characteristics has not been found. In particular, defects such as
tendency to be normally-on and large variation in characteristics
are seen notably. A cause of the tendency to be normally-on is a
large number of carriers existing in an oxide semiconductor.
Hydrogen, oxygen deficiency in an oxide semiconductor, and the like
may cause the generation of carriers.
[0020] In view of the above-described problems, an object of an
embodiment of the invention disclosed in this specification and the
like (including at least the specification, the claims, and the
drawings) is to provide a semiconductor device including an oxide
semiconductor element whose characteristic variation is small in
the long term. Another object of an embodiment is to obtain a
normally-off oxide semiconductor element.
[0021] An embodiment of the present invention is to form a
semiconductor element by adding a cation containing one or more
elements selected from oxygen and halogen to an oxide semiconductor
layer. In addition, the addition of a cation can also be performed
on an insulating layer or an insulator which is in contact with the
oxide semiconductor layer.
[0022] For example, an embodiment of the invention disclosed in
this specification is a method for manufacturing a semiconductor
device, comprising the steps of: forming a first conductive layer
functioning as a gate electrode over a substrate; forming a first
insulating layer covering the first conductive layer; forming an
oxide semiconductor layer over the first insulating layer so that
part of the oxide semiconductor layer overlaps with the first
conductive layer; forming a second conductive layer electrically
connected to the oxide semiconductor layer; forming a second
insulating layer covering the oxide semiconductor layer and the
second conductive layer; and adding a cation containing one or more
elements selected from oxygen and halogen to the oxide
semiconductor layer.
[0023] Note that the above-described oxide semiconductor layer
preferably contains indium, gallium, and zinc.
[0024] In the above method, there is no particular limitation on a
positional relation, a formation order, or the like of the oxide
semiconductor layer and the second conductive layer. In the case
where the second conductive layer has a layered structure, a
structure may be employed in which the oxide semiconductor layer is
sandwiched between layers of the second conductive layer.
[0025] In the above method, a step of performing heat treatment on
the oxide semiconductor layer may be included. The heat treatment
is preferably performed at a temperature higher than or equal to
100.degree. C. and lower than or equal to 500.degree. C.,
preferably higher than or equal to 200.degree. C. and lower than or
equal to 400.degree. C. The heat treatment may be performed while
the cation is being added. Thus, addition of hydrogen can be
suppressed.
[0026] In the above method, the step of adding the cation to the
oxide semiconductor layer is preferably performed at a stage when
at least part of the oxide semiconductor layer is exposed.
[0027] In the above method, the cation containing one or more
elements selected from oxygen and halogen is preferably added to
the first insulating layer or the second insulating layer.
[0028] In the above method, the step of adding the cation is
preferably performed by one selected from an electron cyclotron
resonance (ECR) plasma method, a helicon wave plasma (HWP) method,
an inductively coupled plasma (ICP) method, and a microwave-excited
surface wave plasma (SWP) method; or a combination thereof because
damage to an object to which the cation is added is small.
[0029] For example, another embodiment of the invention disclosed
in this specification is a method for manufacturing a semiconductor
device, comprising the steps of: forming an oxide semiconductor
layer over an insulator; forming a first conductive layer
electrically connected to the oxide semiconductor layer; forming an
insulating layer covering the oxide semiconductor layer and the
first conductive layer; forming a second conductive layer over the
insulating layer so that part of the second conductive layer
overlaps with the oxide semiconductor layer; and adding a cation
containing one or more elements selected from oxygen and halogen to
the oxide semiconductor layer.
[0030] Note that the above-described oxide semiconductor layer
preferably contains indium, gallium, and zinc.
[0031] In the above method, there is no particular limitation on a
positional relation, a formation order, or the like of the oxide
semiconductor layer and the second conductive layer. In the case
where the second conductive layer has a layered structure, a
structure may be employed in which the oxide semiconductor layer is
sandwiched between layers of the second conductive layer.
[0032] In the above method, a step of performing heat treatment on
the oxide semiconductor layer may be included. The heat treatment
is preferably performed at a temperature higher than or equal to
100.degree. C. and lower than or equal to 500.degree. C.,
preferably higher than or equal to 200.degree. C. and lower than or
equal to 400.degree. C. The heat treatment may be performed while
the cation is being added. Thus, addition of hydrogen can be
suppressed.
[0033] In the above method, the step of adding the cation to the
oxide semiconductor layer is preferably performed at a stage when
at least part of the oxide semiconductor layer is exposed.
[0034] In the above method, a cation containing one or more
elements selected from oxygen and halogen is preferably added to
the insulator or the insulating layer.
[0035] In the above method, the step of adding the cation is
preferably performed by one selected from an electron cyclotron
resonance (ECR) plasma method, a helicon wave plasma (HWP) method,
an inductively coupled plasma (ICP) method, and a microwave-excited
surface wave plasma (SWP) method; or a combination thereof because
damage to an object to which the cation is added is small.
[0036] Note that in this specification and the like, a
semiconductor device means any device which can function by
utilizing semiconductor characteristics; and a display device, a
semiconductor circuit, and an electronic device are all included in
the semiconductor devices.
[0037] According to an embodiment of the disclosed invention, a
cation containing one or more elements selected from oxygen and
halogen is added to an oxide semiconductor layer. By adding a
cation containing oxygen, an oxygen deficiency portion in an oxide
semiconductor can be reduced. Accordingly, the number of carriers
can be reduced, so that a normally-off field effect transistor can
be obtained. In addition, elimination of oxygen from the oxide
semiconductor layer can be suppressed, so that a semiconductor
device including an oxide semiconductor element whose
characteristic variation is small in the long term can be
provided.
[0038] The elimination of oxygen is not favorable because it causes
oxygen deficiency in the oxide semiconductor and an increase of the
number of carriers. In addition, in order to further suppress the
elimination of oxygen, it is effective to add a cation containing
oxygen to an insulating layer or an insulator which is in contact
with the oxide semiconductor layer. Note that the above treatments
also have an effect of suppressing characteristic variation of the
semiconductor elements.
[0039] On the other hand, when a cation containing halogen is added
to the oxide semiconductor layer, hydrogen can be eliminated or
movement of hydrogen can be suppressed in advance, whereby the
oxide semiconductor which is closer to intrinsic can be obtained.
Accordingly, a normally-off field effect transistor can be
obtained. It is preferable that a cation containing halogen be also
added to the insulating layer or the insulator which is in contact
with the oxide semiconductor layer because the entry of hydrogen
from the outside into the oxide semiconductor layer can be
suppressed.
[0040] As described above, according to an embodiment of the
disclosed invention, a semiconductor device including a
semiconductor element with favorable characteristics can be
provided.
BRIEF DESCRIPTION OF THE DRAWINGS
[0041] In the accompanying drawings:
[0042] FIGS. 1A to 1E are cross-sectional views illustrating a
method for manufacturing a semiconductor element used for a
semiconductor device;
[0043] FIGS. 2A to 2D are cross-sectional views illustrating the
method for manufacturing the semiconductor element used for the
semiconductor device;
[0044] FIGS. 3A to 3E are cross-sectional views illustrating a
method for manufacturing a semiconductor element used for a
semiconductor device;
[0045] FIGS. 4A to 4D are cross-sectional views illustrating the
method for manufacturing the semiconductor element used for the
semiconductor device;
[0046] FIGS. 5A to 5D are cross-sectional views illustrating a
method for manufacturing a semiconductor element used for a
semiconductor device;
[0047] FIGS. 6A to 6D are cross-sectional views illustrating a
method for manufacturing a semiconductor element used for a
semiconductor device;
[0048] FIGS. 7A to 7C are cross-sectional views illustrating a
method for manufacturing a semiconductor device;
[0049] FIGS. 8A to 8C are cross-sectional views illustrating the
method for manufacturing the semiconductor device;
[0050] FIG. 9 is a plan view of the semiconductor device;
[0051] FIGS. 10A1, 10A2, and 10B illustrate semiconductor
devices;
[0052] FIG. 11 illustrates a semiconductor device;
[0053] FIG. 12 illustrates a semiconductor device;
[0054] FIGS. 13A to 13C illustrate semiconductor devices;
[0055] FIGS. 14A and 14B illustrate a semiconductor device;
[0056] FIGS. 15A and 15B illustrate examples of a usage pattern of
electronic paper;
[0057] FIG. 16 is an external view illustrating an example of an
e-book reader;
[0058] FIGS. 17A and 17B are external views illustrating examples
of a television set and a digital photo frame;
[0059] FIGS. 18A and 18B are external views illustrating examples
of an amusement machine; and
[0060] FIGS. 19A and 19B are external views illustrating examples
of a mobile phone handset.
DETAILED DESCRIPTION OF THE INVENTION
[0061] Embodiments will be described below in detail using
drawings. Note that the present invention is not limited to the
description of the embodiments, and it is apparent to those skilled
in the art that modes and details can be modified in various ways
without departing from the spirit of the present invention
disclosed in this specification and the like. A structure and a
method of the different embodiment can be implemented by
combination appropriately. On the description of the invention with
reference to the drawings, a reference numeral indicating the same
part is used in common throughout different drawings, and the
repeated description is omitted. In addition, the semiconductor
device in this specification indicates all devices that operate by
utilizing semiconductor characteristics.
Embodiment 1
[0062] In this embodiment, an example of a method for manufacturing
a semiconductor element used for a semiconductor device is
described with reference to drawings. In this specification,
although first plasma treatment and second plasma treatment are
disclosed, it is very important to perform the second plasma
treatment. The first plasma treatment may be selectively performed
as appropriate by practitioners in accordance with required
specifications. Note that in this specification, the first plasma
treatment is defined as treatment which is performed on an
insulating layer or an insulator which is in contact with an oxide
semiconductor layer, and the second plasma treatment is defined as
treatment which is performed on the oxide semiconductor layer.
[0063] First, a conductive film 102 is formed over a substrate 100
(see FIG. 1A).
[0064] Any substrate can be used for the substrate 100 as long as
it is a substrate having an insulating surface, for example, a
glass substrate. Further, it is preferable that the glass substrate
be an alkali-free glass substrate. As a material of the alkali-free
glass substrate, a glass material such as aluminosilicate glass,
aluminoborosilicate glass, barium borosilicate glass, or the like
is used, for example. Besides, as the substrate 100, an insulating
substrate formed of an insulator such as a ceramic substrate, a
quartz substrate, or a sapphire substrate, a semiconductor
substrate formed of a semiconductor material such as silicon, over
which an insulating material is covered, a conductive substrate
formed of a conductive material such as metal or stainless steel,
over which an insulating material is covered can be used. In
addition, a plastic substrate can be used as long as it can
withstand heat treatment in a manufacturing process.
[0065] The conductive film 102 is preferably formed using a
conductive material such as aluminum (Al), copper (Cu), molybdenum
(Mo), tungsten (W), or titanium (Ti). As a formation method, a
sputtering method, a vacuum evaporation, a plasma CVD method, and
the like are given. In the case of using aluminum (or copper) for
the conductive film 102, since aluminum itself (or copper itself)
has disadvantages such as low heat resistance and a tendency to be
corroded, it is preferably formed in combination with a conductive
material having heat resistance.
[0066] As the conductive material having heat resistance, it is
possible to use metal containing an element selected from titanium
(Ti), tantalum (Ta), tungsten (W), molybdenum (Mo), chromium (Cr),
neodymium (Nd), and scandium (Sc), an alloy containing any of these
elements as its component, an alloy containing a combination of any
of these elements, a nitride containing any of these elements as
its component, or the like. The conductive material having heat
resistance and aluminum (or copper) may be stacked, whereby the
conductive film 102 may be formed.
[0067] Although not shown in the drawings, a base layer may be
provided over the substrate 100. The base layer has a function of
preventing diffusion of an impurity from the substrate 100, such as
an alkali metal (Li, Cs, Na, or the like), an alkaline earth metal
(Ca, Mg, or the like), or the like. That is, provision of the base
layer can achieve an object of improving the reliability of a
semiconductor device. The base layer may be formed to have a
single-layer structure or a layered structure using a variety of
insulating materials such as silicon nitride or silicon oxide.
Specifically, for example, a structure in which silicon nitride and
silicon oxide are stacked in that order over the substrate 100 is
favorable. This is because silicon nitride has a high blocking
effect against an impurity. At the same time, in the case where
silicon nitride is in contact with a semiconductor, there is a
possibility that a problem occurs in the semiconductor element;
thus, silicon oxide is preferably applied as a material to be in
contact with the semiconductor.
[0068] Next, a resist mask 104 is selectively formed over the
conductive film 102 and the conductive film 102 is selectively
etched using the resist mask 104, whereby a conductive layer 106
which functions as a gate electrode is formed (see FIG. 1B).
[0069] The resist mask 104 is formed through steps such as
application of a resist material, light exposure using a photomask,
and development. For the application of the resist material, a
method such as a spin-coating method can be employed. Instead, the
resist mask 104 may be selectively formed by a droplet discharging
method, a screen printing method, or the like. In that case, the
steps of light exposure using a photomask, development, and the
like are not needed; therefore, improvement in productivity can be
achieved. Note that the resist mask 104 is removed after the
conductive layer 106 is formed by etching the conductive film
102.
[0070] As the above etching, dry etching may be used, or wet
etching may be used. In order to improve coverage with and prevent
disconnection of a gate insulating layer or the like which is
formed later, the etching is preferably performed so that end
portions of the conductive layer 106 are tapered. For example, the
end portions are preferably tapered at a taper angle greater than
or equal to 20.degree. and less than 90.degree.. Here, the "taper
angle" refers to an acute angle formed by a side surface of a layer
which is tapered to a bottom surface thereof when the layer having
a tapered shape is observed from a cross-sectional direction.
[0071] Next, an insulating layer 108 which functions as a gate
insulating layer is formed to cover the conductive layer 106 (see
FIG. 1C). The insulating layer 108 can be formed using a material
such as silicon oxide, silicon oxynitride, silicon nitride, silicon
nitride oxide, aluminum oxide, or tantalum oxide. The insulating
layer 108 may also be formed by stacking films formed of these
materials. These films are preferably formed to a thickness greater
than or equal to 5 nm and less than or equal to 250 nm by a
sputtering method or the like. For example, as the insulating layer
108, a silicon oxide film can be formed to a thickness of 100 nm by
a sputtering method.
[0072] While the method for forming the insulating layer 108 is not
particularly limited as long as the predetermined insulating layer
108 can be obtained, the effect of hydrogen, nitrogen, or the like
in the film needs to be taken into consideration in the case where
the insulating layer 108 is formed using another method (such as a
plasma CVD method). For example, the insulating layer 108 is formed
so that the hydrogen concentration and nitrogen concentration
therein are lower than those in an oxide semiconductor layer to be
formed later. More specifically, the hydrogen concentration in the
insulating layer 108 may be 1.times.10.sup.21 atoms/cm.sup.3 or
less (preferably 5.times.10.sup.20 atoms/cm.sup.3 or less); the
nitrogen concentration in the insulating layer 108 may be
1.times.10.sup.19 atoms/cm.sup.3 or less. Note that in order to
obtain the insulating layer 108 which has favorable
characteristics, the temperature of the deposition is preferably
400.degree. C. or lower; however, an embodiment of the disclosed
invention is not limited to this. Further, the concentrations which
are described above show the average values in the insulating layer
108.
[0073] Alternatively, the insulating layer 108 with a layered
structure may be formed by combination of a sputtering method and a
CVD method (a plasma CVD method or the like). For example, a lower
layer of the insulating layer 108 (a region in contact with the
conductive layer 106) is formed by a plasma CVD method and an upper
layer of the insulating layer 108 can be formed by a sputtering
method. Since a film with favorable step coverage is easily formed
by a plasma CVD method, it is suitable for a method for forming a
film just above the conductive layer 106. In the case of using a
sputtering method, since it is easy to reduce hydrogen
concentration in the film as compared to the case of using a plasma
CVD method, by providing a film by a sputtering method in a region
in contact with the oxide semiconductor layer, the hydrogen in the
insulating layer 108 can be prevented from being diffused into the
oxide semiconductor layer. Since the influence of hydrogen existing
in the oxide semiconductor layer or in the vicinity thereof upon
semiconductor characteristics is extremely large, it is effective
to employ such a structure.
[0074] In this specification, an oxynitride refers to a substance
that contains oxygen and nitrogen so that the content (the number
of atoms) of oxygen is higher (larger) than that of nitrogen. For
example, silicon oxynitride is a substance containing oxygen,
nitrogen, silicon, and hydrogen in ranges of 50 at. % to 70 at. %,
0.5 at. % to 15 at. %, 25 at. % to 35 at. %, and 0.1 at. % to 10
at. %, respectively. A nitride oxide refers to a substance that
contains oxygen and nitrogen so that the content (the number of
atoms) of nitrogen is higher (larger) than that of oxygen. For
example, a silicon nitride oxide is a substance containing oxygen,
nitrogen, silicon, and hydrogen in ranges of 5 at.% to 30 at. %, 20
at. % to 55 at. %, 25 at. % to 35 at. %, and 10 at. % to 25 at. %,
respectively. Note that rates of oxygen, nitrogen, silicon, and
hydrogen fall within the aforementioned ranges in the cases where
measurement is performed using Rutherford backscattering
spectrometry (RBS) or hydrogen forward scattering (HFS). Moreover,
the total of the percentages of the constituent elements does not
exceed 100 at. %.
[0075] Subsequently, the first plasma treatment is performed on the
insulating layer 108. The treatment is performed in such a manner
that plasma containing oxygen, halogen, or two or more elements of
these is generated. As a method for generating plasma, an electron
cyclotron resonance (ECR) plasma method, a helicon wave plasma
(HWP) method, an inductively coupled plasma (ICP) method, a
microwave-excited surface wave plasma (SWP) method, or the like can
be used. In these methods, control of ion flux by an electric
discharge power and control of ion energy by a bias power can be
performed independently, so that a high electron density
approximately higher than or equal to 1.times.10.sup.11
ions/cm.sup.3 and lower than or equal to 1.times.10.sup.13
ions/cm.sup.3 can be obtained. In that case, since a negative bias
is applied to the substrate 100, an ion introduced to the
insulating layer 108 is only a cation. Typically, an oxygen ion
such as O.sup.+, O.sup.2+, O.sup.3+, O.sup.4+, O.sup.5+, or
O.sup.6+; a chlorine ion such as Cl.sup.+, Cl.sup.2+, Cl.sup.3+,
Cl.sup.4+, Cl.sup.5+, Cl.sup.6+, or Cl.sup.7+; a fluorine ion such
as F.sup.+, F.sup.2+, F.sup.3+, F.sup.4+, F.sup.5+, F.sup.6+, or
F.sup.7+; or the like is implanted into the insulating layer
108.
[0076] When the energy of plasma is increased, not only a cation
with a low valence but also a cation with a high valence is
generated. When the cation with a high valence is implanted into
the insulating layer 108, the cation has higher energy. Therefore,
the cation with a high valence is added into a deeper position from
a surface of the insulating layer 108 than the cation with a low
valence. The depth is almost proportional to the valence.
Accordingly, the cation is added to the insulating layer 108 with
uniform distribution, which is preferable. Specifically, when a
distribution having a peak of a cation with a valence of 1 at a
depth of around d is formed, a peak of a cation with a valence of 2
is formed at a depth of around 2 d. In a similar manner, as the
valence is increased to 3, 4, or more, the position of the peak is
deeper as 3 d, 4 d, or more. In addition, as the position of the
peak is deeper, the distribution is expanded. Accordingly, for
example, in the case of d=10 nm, it is preferable that plasma
including a cation with a valence of 2 or more or preferably 4 or
more be formed and added to the insulating layer 108 with a
thickness of 50 nm. In the case of the insulating layer 108 with a
thickness of 70 nm, it is preferable that plasma including a cation
with a valence of 3 or more or preferably 6 or more be formed and
the cation be added. A relational expression between a thickness t
of a layer to which a cation is added and the valence n of a cation
which is preferably contained is described below:
n=[t/2d], preferably n=2.times.[t/2d].
Note that [x] indicates a maximum integer which does not exceed
x.
[0077] In order to generate a cation with such a high valence, an
electron temperature of the plasma may be higher than or equal to 5
eV and lower than or equal to 100 eV. In addition, it is preferable
that a substrate temperature be higher than or equal to 100.degree.
C. and lower than or equal to 500.degree. C. at the time when a
cation is added because the amount of hydrogen which is added at
the same time can be reduced. This is because as the substrate
temperature is higher, hydrogen is remarkably eliminated from the
insulating layer 108. However, a high substrate temperature of
500.degree. C. or higher is not preferable because such a high
substrate temperature impairs an advantage that an oxide
semiconductor element can be manufactured at a low temperature.
After the heat treatment, a step of accelerating a cooling speed
may be performed. Note that the first plasma treatment may be
performed at room temperature (defined as 25.degree. C. in this
specification), or may be performed at a temperature lower than
room temperature.
[0078] In this embodiment, an inductively coupled plasma (ICP)
method is employed for the first plasma treatment. An example of
recommended treatment conditions is as follows: the power for ICP
is greater than or equal to 100 W and less than or equal to 2000 W,
the power applied to a lower electrode provided on a substrate side
is greater than or equal to 0 W and less than or equal to 300 W,
the treatment time is greater than or equal to 10 seconds and less
than or equal to 100 seconds, the inside pressure of a treatment
chamber is greater than or equal to 0.1 Pa and less than or equal
to 100 Pa, the oxygen (O.sub.2) flow rate is greater than or equal
to 10 sccm and less than or equal to 500 sccm, the temperature of
the lower electrode is higher than or equal to -20.degree. C. and
lower than or equal to 500.degree. C., and the RF power source
frequency of ICP is 13.56 MHz. Note that the temperature of the
lower electrode is conducted to the substrate; therefore, the
temperature of the lower electrode is set so that the substrate
temperature does not exceed 500.degree. C. In addition, when power
is applied to the lower electrode, the recommended RF power source
frequency applied to the lower electrode is 3.2 MHz or 13.56 MHz.
Note that halogen such as fluorine or chlorine may be used instead
of oxygen (O.sub.2) at the same or approximately the same flow
rate. Alternatively, a gas containing two or more elements of these
elements may be used.
[0079] Next, an oxide semiconductor film 110 is formed to cover the
insulating layer 108 (see FIG. 1D). In this embodiment, a metal
oxide semiconductor material is used for the oxide semiconductor
film 110.
[0080] The oxide semiconductor layer includes at least one element
selected from In, Ga, Sn, Zn, Al, Mg, Hf and lanthanoid. For
example, a four-component metal oxide such as an
In--Sn--Ga--Zn--O-based oxide semiconductor; a three-component
metal oxide such as an In--Ga--Zn--O-based oxide semiconductor, an
In--Sn--Zn--O-based oxide semiconductor, an In--Al--Zn--O-based
oxide semiconductor, a Sn--Ga--Zn--O-based oxide semiconductor, an
Al--Ga--Zn--O-based oxide semiconductor, or a Sn--Al--Zn--O-based
oxide semiconductor, an In--Hf--Zn--O-based oxide semiconductor, an
In--La--Zn--O-based oxide semiconductor, an In--Ce--Zn--O-based
oxide semiconductor, an In--Pr--Zn--O-based oxide semiconductor, an
In--Nd--Zn--O-based oxide semiconductor, an In--Pm--Zn--O-based
oxide semiconductor, an In--Sm--Zn--O-based oxide semiconductor, an
In--Eu--Zn--O-based oxide semiconductor, an In--Gd--Zn--O-based
oxide semiconductor, an In--Tb--Zn--O-based oxide semiconductor, an
In--Dy--Zn--O-based oxide semiconductor, an In--Ho--Zn--O-based
oxide semiconductor, an In--Er--Zn--O-based oxide semiconductor, an
In--Tm--Zn--O-based oxide semiconductor, an In--Yb--Zn--O-based
oxide semiconductor, or an In--Lu--Zn--O-based oxide semiconductor;
a two-component metal oxide such as an In--Zn--O-based oxide
semiconductor, a Sn--Zn--O-based oxide semiconductor, an
Al--Zn--O-based oxide semiconductor, a Zn--Mg--O-based oxide
semiconductor, a Sn--Mg--O-based oxide semiconductor, an
In--Mg--O-based oxide semiconductor, or an In--Ga--O-based oxide
semiconductor; a single-component metal oxide such as an
In--O-based oxide semiconductor, a Sn--O-based oxide semiconductor,
or a Zn--O-based oxide semiconductor; or the like can be used. In
addition, any of the above oxide semiconductors may contain an
element other than In, Ga, Sn, Zn, Al, Mg, Hf and lanthanoid, for
example, SiO.sub.2.
[0081] For example, an In--Ga--Zn--O-based oxide semiconductor
means an oxide semiconductor containing indium (In), gallium (Ga),
and zinc (Zn), and there is no limitation on the composition ratio
thereof
[0082] As an example of the above oxide semiconductor material, one
represented by InMO.sub.3 (ZnO).sub.m (m>0) is given. Here, M
denotes one or more of metal elements selected from zinc (Zn),
gallium (Ga), iron (Fe), nickel (Ni), manganese (Mn), and cobalt
(Co) and the like. For example, the case where Ga is selected as M
includes the case where the above metal element except Ga is also
selected such as a combination of
[0083] Ga and Ni, or a combination of Ga and Fe as well as the case
where only Ga is used. Moreover, in the above oxide semiconductor,
in some cases, a transition metal element such as Fe or Ni or an
oxide of the transition metal is contained as an impurity element
in addition to a metal element contained as M. Needless to say, the
oxide semiconductor material is not limited to the above materials
and a variety of oxide semiconductor materials such as zinc oxide
or indium oxide can be used.
[0084] In the case where the oxide semiconductor film 110 is formed
using an In--Ga--Zn--O-based material as the oxide semiconductor
material, for example, a sputtering method using an oxide
semiconductor target containing In, Ga, and Zn
(In.sub.2O.sub.3:Ga.sub.2O.sub.3:ZnO=1:1:1) can be employed. The
sputtering can be performed under the following conditions, for
example: the distance between the substrate 100 and the target is
30 mm to 500 mm; the pressure is 0.1 Pa to 2.0 Pa; the direct
current (DC) power supply is 0.25 kW to 5.0 kW; the temperature is
20.degree. C. to 100.degree. C.; the atmosphere is a rare gas
atmosphere such as argon, an oxide atmosphere, or a mixed
atmosphere of a rare gas such as argon and oxide. As the above
sputtering method, an RF sputtering method using a high frequency
power supply for a power supply for sputtering, a DC sputtering
method using a DC power supply, a pulsed DC sputtering method in
which a DC bias is applied in a pulsed manner or the like can be
employed.
[0085] In the case where an In--Zn--O-based material is used as the
oxide semiconductor, a target used has a composition ratio of
In:Zn=50:1 to 1:2 in an atomic ratio (In.sub.2O.sub.3:ZnO=25:1 to
1:4 in a molar ratio), preferably In:Zn=20:1 to 1:1 in an atomic
ratio (In.sub.2O.sub.3:ZnO=10:1 to 1:2 in a molar ratio), further
preferably In:Zn=15:1 to 1.5:1 (In.sub.2O.sub.3:ZnO=15:2 to 3:4 in
a molar ratio). For example, in a target used for formation of an
In--Zn--O-based oxide semiconductor which has an atomic ratio of
In:Zn:O=X:Y:Z, the relation of Z>1.5X+Y is satisfied.
[0086] In this embodiment, the case of forming the oxide
semiconductor film 110 using a single layer is described; however,
the oxide semiconductor film 110 may be formed with a layered
structure. For example, instead of the above structure, an oxide
semiconductor film (hereinafter called an "oxide semiconductor film
with normal conductivity") having the same composition as the oxide
semiconductor film 110 is formed over the insulating layer 108, and
after that, an oxide semiconductor film (hereinafter called an
"oxide semiconductor film with high conductivity") having
constituent elements which are the same as those of the oxide
semiconductor film 110 and having a composition ratio thereof which
is different from that of the oxide semiconductor film 110 is
formed. In that case, since the oxide semiconductor film with high
conductivity is provided between a source electrode (or a drain
electrode) and the oxide semiconductor film with normal
conductivity, element characteristics can be improved.
[0087] The oxide semiconductor film with normal conductivity and
the oxide semiconductor film with high conductivity can be formed
by making deposition conditions thereof different. In this case, it
is preferable that a flow rate ratio of an oxygen gas to an argon
gas in the deposition conditions of the oxide semiconductor film
with high conductivity be smaller than that in the deposition
conditions of the oxide semiconductor film with normal
conductivity. More specifically, the oxide semiconductor film with
high conductivity is formed in a rare gas (such as argon or helium)
atmosphere or an atmosphere containing an oxygen gas at 10% or less
and a rare gas at 90% or more. The oxide semiconductor film with
normal conductivity is formed in an oxygen atmosphere or an
atmosphere in which a flow rate of an oxygen gas is 1 time or more
that of a rare gas. In such a manner, two kinds of oxide
semiconductor films having different conductivities can be
formed.
[0088] Further, after the plasma treatment is performed, when the
oxide semiconductor film 110 is formed without exposure to the air,
the attachment of dust or moisture to an interface between the
insulating layer 108 and the oxide semiconductor film 110 can be
prevented.
[0089] Note that, the oxide semiconductor film 110 may have a
thickness of approximately 5 nm to 200 nm.
[0090] Subsequently, the second plasma treatment is performed on
the oxide semiconductor film 110. A symbol "+" in FIG. 1D denotes a
cation. The second plasma treatment can be performed using a method
similar to that of the first plasma treatment. Note that the second
plasma treatment may be performed at a stage when the oxide
semiconductor film 110 is exposed; therefore, the treatment is not
necessarily performed at this stage. The plasma treatment can
dramatically improve characteristics of the semiconductor elements
and reduce variation in the characteristics.
[0091] In the case where the oxide semiconductor film 110 is formed
with a multi-layer structure including m layers, the second plasma
treatment may be performed, for example, at a timing after
deposition of any of a first layer to an (m-1)-th layer. Further,
after heat treatment in the second plasma treatment, a step of
accelerating a cooling speed may be performed. Note that the second
plasma treatment may be performed at room temperature or a
temperature lower than room temperature.
[0092] Next, a resist mask 112 is selectively formed over the oxide
semiconductor film 110 and the oxide semiconductor film 110 is
selectively etched using the resist mask 112, whereby an oxide
semiconductor layer 114 is formed (see FIG. 1E). Here, the resist
mask 112 can be formed in a method similar to the resist mask 104.
After the semiconductor layer 114 is formed by etching the oxide
semiconductor film 110, the resist mask 112 is removed.
[0093] Wet etching or dry etching can be used for the etching of
the oxide semiconductor film 110. Here, an unnecessary portion of
the oxide semiconductor film 110 is removed by wet etching using a
mixed solution of acetic acid, nitric acid, and phosphoric acid, so
that the oxide semiconductor layer 114 is formed. Note that an
etchant (an etching solution) for the wet etching is not limited to
the above solution as long as the oxide semiconductor film 110 can
be etched.
[0094] In the case of using dry etching, for example, a gas
containing a chlorine atom (such as chlorine (Cl.sub.2) or chlorine
dioxide (ClO.sub.2)) or a gas containing a chlorine atom to which
oxygen (O.sub.2) is added is preferably used. This is because by
using a gas containing a chlorine atom, etching selectivity of the
oxide semiconductor film 110 with respect to the conductive layer
or the base layer can be easily obtained.
[0095] As an etching apparatus used for the dry etching, an etching
apparatus using a reactive ion etching method (an RIE method), or a
dry etching apparatus using a high-density plasma source such as
ECR (electron cyclotron resonance) or ICP (inductively coupled
plasma) can be used. Alternatively, a technique similar to the
above methods may be used.
[0096] Next, a conductive film 116 is formed to cover the
insulating layer 108 and the oxide semiconductor layer 114 (see
FIG. 2A). The conductive film 116 can be formed using a material
and a method which are similar to those of the conductive film 102.
For example, the conductive film 116 can be formed to have a
single-layer structure of a molybdenum film or a titanium film.
Alternatively, the conductive film 116 may be formed to have a
layered structure and can have a layered structure of an aluminum
film and a titanium film, for example. A three-layer structure in
which a titanium film, an aluminum film, and a titanium film are
sequentially stacked may be used. A three-layer structure in which
a molybdenum film, an aluminum film, and a molybdenum film are
sequentially stacked may be used. As the aluminum films used for
these layered structures, an aluminum film including neodymium
(Al--Nd) may be used. Further alternatively, the conductive film
116 may have a single-layer structure of an aluminum film
containing silicon.
[0097] Next, a resist mask 118 and a resist mask 120 are
selectively formed over the conductive film 116 and the conductive
film 116 is selectively etched using the resist masks to form a
conductive layer 122 which functions as one of source and drain
electrodes and a conductive layer 124 which functions as the other
of the source and drain electrodes (see FIG. 2B). Here, the resist
mask 118 and the resist mask 120 can be formed in a method similar
to that of the resist mask 104. Note that the resist mask 118 and
the resist mask 120 are removed after the conductive layer 122 and
the conductive layer 124 are formed by etching the conductive film
116.
[0098] The resist mask 118 may be formed using a multi-tone mask.
Here, the multi-tone mask is a mask capable of light exposure with
multi-level light intensity. With the use of a multi-tone mask,
one-time exposure and development process allow a resist mask with
plural thicknesses (typically, two kinds of thicknesses) to be
formed. By use of the multi-tone mask, the number of steps can be
suppressed.
[0099] Either wet etching or dry etching can be employed as a
method for etching the conductive film 116. Here, an unnecessary
portion of the conductive film 116 is removed by dry etching to
form the conductive layer 122 and the conductive layer 124.
[0100] Note that, although a structure (a channel etch type) in
which part of the oxide semiconductor layer 114 is removed when the
conductive film 116 is etched is employed in this embodiment, an
embodiment of the disclosed invention is not limited to this
structure. Instead, another structure (an etching stopper type) can
be employed in which a layer (an etching stopper) which prevents
the etching from proceeding is formed between the oxide
semiconductor layer 114 and the conductive film 116, so that the
oxide semiconductor layer 114 is not etched.
[0101] After the conductive layer 122 and the conductive layer 124
are formed, heat treatment is performed at 100.degree. C. to
500.degree. C., typically 200.degree. C. to 400.degree. C. The
atmosphere of the heat treatment can be, for example, an air
atmosphere, a nitrogen atmosphere, an oxygen atmosphere, or the
like. Further, the heat treatment time can be about 0.1 to 5 hours.
Here, the heat treatment at 350.degree. C. for one hour in an air
atmosphere is performed. Note that the timing of the heat treatment
is not particularly limited as long as it is after the oxide
semiconductor film 110 is formed and before an insulating layer
serving as an interlayer insulating layer is formed. For example,
the heat treatment may be performed just after the oxide
semiconductor film 110 is formed. Alternatively, the heat treatment
may be performed just after the oxide semiconductor layer 114 is
formed or just after the conductive film 116 is formed. By
performing the heat treatment (the first heat treatment) and the
following heat treatment (second heat treatment), the
characteristics of the semiconductor elements can be improved and
variation in the characteristics can be reduced.
[0102] Note that it is preferable that the above-described heat
treatment be performed at 400.degree. C. or lower so as not to
change (deteriorate) the characteristics of the insulating layer
108 which functions as the gate insulating layer. Needless to say,
an embodiment of the disclosed invention should not be interpreted
as being limited thereto.
[0103] Next, an insulating layer 126 is formed to cover the
conductive layer 122, the conductive layer 124, the oxide
semiconductor layer 114, and the like (see FIG. 2C).
[0104] Here, the insulating layer 126 serves as a so-called
interlayer insulating layer. The insulating layer 126 can be formed
using a material such as silicon oxide, aluminum oxide, or tantalum
oxide. The insulating layer 126 may also be formed by stacking
films formed of these materials.
[0105] The hydrogen concentration in the insulating layer 126 is
preferably 1.times.10.sup.21 atoms/cm.sup.3 or less (in particular,
5.times.10.sup.20 atoms/cm.sup.3 or less). In addition, the
nitrogen concentration in the insulating layer 126 is preferably
1.times.10.sup.19 atoms/cm.sup.3 or less. Note that the above
concentrations show the average values in the insulating layer
126.
[0106] As a more specific example of the insulating layer 126
satisfying the above-described condition, a silicon oxide film
formed by a sputtering method can be given. This is because, in the
case of using a sputtering method, it is easy to reduce the
hydrogen concentration in the film as compared to the case of using
a plasma CVD method. Needless to say, any of other methods
including a plasma CVD method may be employed as long as the
above-described condition is satisfied. For example, the hydrogen
concentration in the film can be reduced in such a manner that the
insulating layer 126 is formed by a plasma CVD method and then
plasma treatment similar to that performed on the insulating layer
108 is performed on the insulating layer 126. The other conditions
of the insulating layer 126 are not particularly limited. For
example, the thickness of the insulating layer 126 may vary within
a feasible range.
[0107] After that, a variety of electrodes and wirings are formed,
whereby a semiconductor device provided with a transistor 150 is
completed (see FIG. 2D). In this embodiment, a typical example is
described in which a conductive layer 128 functioning as a pixel
electrode of a display device is formed. However, an embodiment of
the disclosed invention is not limited thereto.
[0108] After the conductive layer 128 is formed, heat treatment is
performed at 100.degree. C. to 500.degree. C., typically,
200.degree. C. to 400.degree. C. The atmosphere in which the heat
treatment is performed can be, for example, an air atmosphere, a
nitrogen atmosphere, an oxygen atmosphere, or the like. Further,
the heat treatment time can be about 0.1 to 5 hours. Here, the heat
treatment at 350.degree. C. for one hour in an air atmosphere is
performed. Note that the timing of the heat treatment is not
particularly limited as long as it is after the formation of the
insulating layer 126. For example, the above heat treatment may be
performed just after the insulating layer 126 is formed or after
another insulating layer, conductive layer, or the like is formed.
By performing the heat treatment (the second heat treatment) and
the preceding heat treatment (the first heat treatment), the
characteristics of the semiconductor elements can be improved and
variation in the characteristics can be reduced.
[0109] Note that the effect of the second heat treatment is not
limited to the above. For example, the second heat treatment also
provides an advantageous effect of repairing defects in the
insulating layer 126. Since the insulating layer 126 is formed at a
relatively low temperature, defects exist in the film. The element
characteristics might be adversely affected when the insulating
layer 126 is used as it is. From a perspective of repairing such
defects in the insulating layer 126, it can be said that the
above-described heat treatment plays an important role.
[0110] In addition, it is preferable that the heat treatment be
performed at 400.degree. C. or lower so as not to change
(deteriorate) the characteristics of the insulating layer 108 which
functions as the gate insulating layer. Needless to say, an
embodiment of the disclosed invention should not be interpreted as
being limited thereto.
[0111] As described in this embodiment, by performing plasma
treatment on the oxide semiconductor film 110 with the use of a
cation, the oxide semiconductor element having excellent
characteristics can be provided. When the insulating layer 108
and/or the insulating layer 126 in contact with the oxide
semiconductor film 110 are/is subjected to the treatment, the
semiconductor element with higher reliability can be obtained.
Accordingly, a semiconductor device including an oxide
semiconductor element with excellent characteristics can be
provided.
[0112] This embodiment can be combined with any of the other
embodiments as appropriate.
Embodiment 2
[0113] In this embodiment, an example which is different from the
above embodiment of a method for manufacturing a semiconductor
element used for a semiconductor device is described with reference
to drawings. Note that many parts of a method for manufacturing a
semiconductor device in this embodiment are the same as those in
the above embodiment. Therefore, in the following description,
repeated description of the same portions is omitted, and different
points are described in detail.
[0114] First, a conductive film 202 is formed over a substrate 200
(see FIG. 3A). The above embodiment (the description with reference
to FIG. 1A or the like) can be referred to for the details of the
substrate 200, the conductive film 202, or the like. A base layer
may be formed over the substrate 200. The above embodiment can also
be referred to for the detail of the base layer.
[0115] Next, a resist mask 204 is selectively formed over the
conductive film 202 and the conductive film 202 is selectively
etched using the resist mask 204, whereby a conductive layer 206
which functions as a gate electrode is formed (see FIG. 3B). The
above embodiment (the description with reference to FIG. 1B or the
like) can be referred to for the details of the resist mask 204,
the conductive layer 206, the etching, or the like.
[0116] Then, an insulating layer 208 which functions as a gate
insulating layer is formed so as to cover the conductive layer 206
(see FIG. 3C). The above embodiment (the description with reference
to FIG. 1C or the like) can be referred to for the detail of the
insulating layer 208 or the like.
[0117] Subsequently, treatment which is similar to the first plasma
treatment described in Embodiment 1 is performed. The plasma
treatment may be performed at a stage when at least part of the
insulating layer 208 is exposed; therefore, the plasma treatment is
not necessarily performed at this stage. The plasma may be
generated by a microwave. A frequency at this time is 2.45 GHz, for
example.
[0118] Next, a conductive film 210 is formed to cover the
insulating layer 208 (see FIG. 3D). The conductive film 210 can be
formed using a material and a method which are similar to those of
the conductive film 202. In other words, the above embodiment (the
description with reference to FIG. 1A and FIG. 2A or the like) can
be referred to for the details.
[0119] Next, a resist mask 212 and a resist mask 214 are
selectively formed over the conductive film 210 and the conductive
film 210 is selectively etched using the resist masks to form a
conductive layer 216 which functions as one of source and drain
electrodes and a conductive layer 218 which functions as the other
of the source and drain electrodes (see FIG. 3E). Here, the resist
mask 212 and the resist mask 214 can be formed in manner similar to
the resist mask 204. In other words, the above embodiment (the
description with reference to FIG. 1B and FIG. 2B or the like) can
be referred to for the details of the resist masks.
[0120] Either wet etching or dry etching can be employed as a
method for etching the conductive film 210. Here, an unnecessary
portion of the conductive film 210 is removed by dry etching to
form the conductive layer 216 and the conductive layer 218. Note
that although not illustrated in this embodiment, part of the
insulating layer 208 is removed by the etching in some cases.
[0121] Next, an oxide semiconductor film 220 is formed to cover the
insulating layer 208, the conductive layer 216, the conductive
layer 218, and the like (see FIG. 4A). The above embodiment (the
description with reference to FIG. 1D or the like) can be referred
to for the detail of the oxide semiconductor film 220.
[0122] Subsequently, treatment which is similar to the second
plasma treatment described in Embodiment 1 is performed. A symbol
"+" in FIG. 4A denotes a cation. The plasma treatment is performed
at a stage when at least part of the oxide semiconductor film 220
is exposed; therefore, the treatment is not necessarily performed
at this stage. The plasma may be generated by a microwave. A
frequency at this time is 2.45 GHz, for example.
[0123] Next, a resist mask 222 is selectively formed over the oxide
semiconductor film 220 and the oxide semiconductor film 220 is
selectively etched using the resist mask 222 to form an oxide
semiconductor film 224 (see FIG. 4B). The above embodiment (the
description with reference to FIGS. 1B and 1E or the like) can be
referred to for the detail of the resist mask 222.
[0124] Either wet etching or dry etching can be employed as a
method for etching the oxide semiconductor film 220. Here, an
unnecessary portion of the oxide semiconductor film 220 is removed
by wet etching using a mixed solution of acetic acid, nitric acid,
and phosphoric acid, so that the oxide semiconductor film 224 is
formed. Note that an etchant (an etchant solution) used for the wet
etching is not limited to the above solution as long as the oxide
semiconductor film 220 can be etched using the etchant.
[0125] In the case of dry etching, for example, a gas containing a
chlorine atom (such as chlorine (Cl.sub.2) or chlorine dioxide
(ClO.sub.2)) or a gas containing a chlorine atom to which oxygen
(O.sub.2) is added is preferably used. This is because by using a
gas including a chlorine atom, etching selectivity of the oxide
semiconductor film 220 with respect to the conductive layer or the
base layer can be easily obtained. Note that the above embodiment
can be referred to for the detail of the etching or the like.
[0126] After the oxide semiconductor film 224 is formed, heat
treatment at 100.degree. C. to 500.degree. C., typically
200.degree. C. to 400.degree. C., is performed. The atmosphere of
the heat treatment can be, for example, an air atmosphere, a
nitrogen atmosphere, an oxygen atmosphere, or the like. Further,
the heat treatment time can be about 0.1 to 5 hours. Here, the heat
treatment at 350.degree. C. for one hour in an air atmosphere is
performed. Note that the timing of the heat treatment is not
particularly limited as long as it is after the oxide semiconductor
film 220 is formed and before an insulating layer serving as an
interlayer insulating layer is formed. For example, the above heat
treatment may be performed just after the oxide semiconductor film
220 is formed. By performing the heat treatment (the first heat
treatment) and the following heat treatment (the second heat
treatment), the characteristics of the semiconductor elements can
be improved and variation in the characteristics can be
reduced.
[0127] Note that it is preferable that the heat treatment be
performed at 400.degree. C. or lower so as not to change
(deteriorate) the characteristics of the insulating layer 208 which
functions as the gate insulating layer. Needless to say, an
embodiment of the disclosed invention should not be interpreted as
being limited thereto.
[0128] Next, an insulating layer 226 is formed to cover the
conductive layer 216, the conductive layer 218, the oxide
semiconductor film 224, and the like (see FIG. 4C). Here, the
insulating layer 226 serves as a so-called interlayer insulating
layer. The insulating layer 226 can be formed using a material such
as silicon oxide, aluminum oxide, or tantalum oxide. The insulating
layer 226 may also be formed by stacking films formed of these
materials.
[0129] Subsequently, treatment which is similar to the first plasma
treatment described in Embodiment 1 is performed. The plasma
treatment may be performed at a stage when at least part of the
insulating layer 226 is exposed; therefore, the plasma treatment is
not necessarily performed at this stage.
[0130] The hydrogen concentration in the insulating layer 226 is
preferably 1.times.10.sup.21 atoms/cm.sup.3 or less (in particular
5.times.10.sup.2.degree. atoms/cm.sup.3 or less). In addition, the
nitrogen concentration in the insulating layer 226 is preferably
1.times.10.sup.19 atoms/cm.sup.3 or less. Note that the above
concentrations show the average values in the insulating layer
226.
[0131] As a more specific example of the insulating layer 226,
which satisfies the above-described condition, a silicon oxide film
formed by a sputtering method can be given. This is because, in the
case of using a sputtering method, it is easy to reduce hydrogen
concentration in the film as compared with the case of using a
plasma CVD method. Needless to say, any of other methods including
a plasma CVD method may be employed as long as the above-described
condition is satisfied. For example, the hydrogen concentration in
the film can be reduced in such a manner that the insulating layer
226 is formed by a plasma CVD method and then plasma treatment
similar to that performed on the insulating layer 108 described in
Embodiment 1 is performed on the insulating layer 226. The other
conditions of the insulating layer 226 are not particularly
limited. For example, the thickness of the insulating layer 226 may
vary within a feasible range.
[0132] After that, a variety of electrodes and wirings are formed,
whereby a semiconductor device provided with a transistor 250 is
completed (see FIG. 4D). In this embodiment, a typical example is
described in which a conductive layer 228 which functions as a
pixel electrode of a display device is formed (see FIG. 4D).
However, an embodiment of the disclosed invention is not limited to
this.
[0133] In addition, after the conductive layer 228 is formed, heat
treatment is performed at 100.degree. C. to 500.degree. C.,
typically 200.degree. C. to 400.degree. C. The atmosphere in which
the heat treatment is performed can be, for example, an air
atmosphere, a nitrogen atmosphere, an oxygen atmosphere, or the
like. Further, the heat treatment time can be about 0.1 to 5 hours.
Here, the heat treatment at 350.degree. C. for one hour in an air
atmosphere is performed. Note that the timing of the heat treatment
is not particularly limited as long as it is after the insulating
layer 226 is formed. For example, the above heat treatment may be
performed just after the insulating layer 226 is formed or after
another insulating layer, conductive layer, or the like is formed.
By performing the heat treatment (the second heat treatment) and
the preceding heat treatment (the first heat treatment), the
characteristics of the semiconductor elements can be improved and
variation in the characteristics can be reduced.
[0134] Note that the effect of the second heat treatment is not
limited to the above. For example, the second heat treatment also
provides an advantageous effect of repairing defects in the
insulating layer 226. Since the insulating layer 226 is formed at a
relatively low temperature, defects exist in the film. The element
characteristics might be adversely affected when the insulating
layer is used as it is. From a perspective of repairing such
defects in the insulating layer 226, it can be said that the
above-described heat treatment plays an important role.
[0135] Note that it is preferable that the heat treatment be
performed at 400.degree. C. or lower so as not to change
(deteriorate) the characteristics of the insulating layer 208 which
functions as the gate insulating layer. Needless to say, an
embodiment of the disclosed invention should not be interpreted as
being limited thereto.
[0136] As described in this embodiment, by performing plasma
treatment on the oxide semiconductor film 220 with the use of a
cation, the oxide semiconductor element having excellent
characteristics can be provided. When the insulating layer 208 in
contact with the oxide semiconductor film 220 and/or the insulating
layer 226 are/is subjected to the treatment, the semiconductor
element with higher reliability can be obtained. Accordingly, a
semiconductor device including an oxide semiconductor element which
has excellent characteristics can be provided.
[0137] Note that this embodiment can be implemented in combination
with the previous embodiment as appropriate.
Embodiment 3
[0138] In this embodiment, an example of a method for manufacturing
a semiconductor element used for a semiconductor device is
described with reference to drawings.
[0139] First, a conductive film 502 is formed over a substrate 500
(see FIG. 5A). Before the conductive film 502 is formed, treatment
which is similar to the first plasma treatment described in
Embodiment 1 may be performed on the substrate 500, which is an
insulator. Since the plasma treatment may be performed on an
insulating surface of the substrate which is in contact with an
oxide semiconductor layer 508 formed later, it is not necessarily
performed at this stage. In the case where a base layer 501
described later is formed as an insulating layer between the
substrate 500 and the conductive film 502, the plasma treatment may
performed on the base layer 501. Note that the plasma may be
generated by a microwave. A frequency at this time is 2.45 GHz, for
example.
[0140] Any substrate can be used for the substrate 500 as long as
it is a substrate having an insulating surface, for example, a
glass substrate. Further, it is preferable that the glass substrate
be an alkali-free glass substrate. As a material of the alkali-free
glass substrate, a glass material such as aluminosilicate glass,
aluminoborosilicate glass, barium borosilicate glass, or the like
is used, for example. Alternatively, as the substrate 500, an
insulating substrate formed using an insulator such as a ceramic
substrate, a quartz substrate, or a sapphire substrate, a
semiconductor substrate which is formed using a semiconductor
material such as silicon and whose surface is covered with an
insulating material, or a conductive substrate which is formed
using a conductor such as metal or stainless steel and whose
surface is covered with an insulating material can be used. In
addition, a plastic substrate can be used as long as it can
withstand heat treatment in a manufacturing process.
[0141] The conductive film 502 is preferably formed using a
conductive material such as aluminum (Al), copper (Cu), molybdenum
(Mo), tungsten (W), or titanium (Ti). As a formation method, a
sputtering method, a vacuum evaporation method, a plasma CVD
method, and the like are given. In the case of using aluminum (or
copper) for the conductive film 502, since aluminum itself (or
copper itself) has disadvantages such as low heat resistance and a
tendency to be corroded, it is preferably formed in combination
with a conductive material having heat resistance.
[0142] As the conductive material having heat resistance, it is
possible to use metal containing an element selected from titanium
(Ti), tantalum (Ta), tungsten (W), molybdenum (Mo), chromium (Cr),
neodymium (Nd), and scandium (Sc), an alloy containing any of these
elements as its component, an alloy containing a combination of any
of these elements, a nitride containing any of these elements as
its component, or the like. The conductive material having heat
resistance and aluminum (or copper) may be stacked, whereby the
conductive film 502 may be formed.
[0143] The base layer 501 may be formed over the substrate 500. The
base layer 501 has a function of preventing diffusion of an
impurity from the substrate 500, such as an alkali metal (e.g., Li,
Cs, or Na) or an alkaline earth metal (e.g., Ca or Mg). In other
words, the provision of the base layer 501 can realize improvement
in the reliability of the semiconductor device. The base layer 501
may be formed with a single-layer structure or a layered structure
using a variety of insulating materials such as silicon nitride or
silicon oxide. Specifically, for example, a structure in which
silicon nitride and silicon oxide are stacked in that order over
the substrate 500 is favorable. This is because silicon nitride has
a high blocking effect against an impurity. At the same time, in
the case where silicon nitride is in contact with a semiconductor,
there is a possibility that a problem occurs in the semiconductor
element; thus, silicon oxide is preferably applied as a material to
be in contact with the semiconductor. The base layer 501 can be
formed by a sputtering method or a plasma CVD method.
[0144] Next, a resist mask is selectively formed over the
conductive film 502 and the conductive film 502 is selectively
etched using the resist mask to form conductive layers 506
functioning as source and drain electrodes.
[0145] The resist mask is formed through steps such as application
of a resist material, light exposure using a photomask, and
development. For the application of the resist material, a method
such as a spin-coating method can be employed. Instead, the resist
mask may be selectively formed by a droplet discharging method, a
screen printing method, or the like. In that case, the steps of
light exposure using a photomask, development, and the like are not
needed; therefore, improvement in productivity can be achieved.
Note that the resist mask is removed after the conductive layers
506 are formed by etching the conductive film 502.
[0146] The resist mask may be formed using a multi-tone mask. Here,
the multi-tone mask is a mask which enables light exposure with
multi-level light intensity. With the use of a multi-tone mask,
one-time exposure and development process allow a resist mask with
plural thicknesses (typically, two kinds of thicknesses) to be
formed. By use of the multi-tone mask, the number of steps can be
suppressed.
[0147] As the above etching treatment, dry etching may be used, or
wet etching may be used. In order to improve coverage with a gate
insulating layer or the like which is formed later and prevent
disconnection, the etching is preferably performed so that end
portions of the conductive layers 506 are tapered. For example, the
end portions are preferably tapered at a taper angle greater than
or equal to 20.degree. and less than 90.degree.. Here, the "taper
angle" refers to an acute angle formed by a side surface of a layer
which is tapered to a bottom surface thereof when the layer having
a tapered shape is observed from a cross-sectional direction.
[0148] Next, an oxide semiconductor film 503 is formed to cover the
conductive layers 506 (see FIG. 5B). The oxide semiconductor film
503 can be formed using the material and the method described in
Embodiment 1. Note that heat treatment may be performed after the
oxide semiconductor film 503 is formed and before or after the
oxide semiconductor film 503 is processed into an island shape. In
this embodiment, treatment which is similar to the first heat
treatment described in Embodiment 1 is performed.
[0149] Subsequently, treatment which is similar to the second
plasma treatment is performed on the oxide semiconductor film 503.
This treatment is performed before or after the oxide semiconductor
film 503 is processed into an island shape (see FIG. 5B or FIG.
5C). The oxide semiconductor film 503 is processed into an island
shape by a photolithography method or the like to be the oxide
semiconductor layer 508. The plasma may be generated by a
microwave. A frequency at this time is 2.45 GHz, for example.
[0150] Then, an insulating layer 510 functioning as a gate
insulating film is formed. After that, treatment which is similar
to the first plasma treatment may be performed on the insulating
layer 510. Next, a conductive layer 512 functioning as a gate
electrode is formed. These layers can be formed using the materials
and the methods which are described in the above embodiment. The
plasma may be generated by a microwave. A frequency at this time is
2.45 GHz, for example.
[0151] Next, an insulating layer 514 is formed to cover the
conductive layer 512 and the insulating layer 510 (see FIG. 5C).
Here, the insulating layer 514 corresponds to a so-called
interlayer insulating layer. The insulating layer 514 can be formed
using a material such as silicon oxide, aluminum oxide, or tantalum
oxide. The insulating layer 514 may also be formed by stacking
films formed of these materials.
[0152] After that, a variety of electrodes and a wiring are formed,
whereby a semiconductor device provided with a transistor 550 is
completed (see FIG. 5D). In this embodiment, a typical example is
described in which conductive layers 528 functioning as pixel
electrodes of a display device are formed (see FIG. 5D). However,
an embodiment of the disclosed invention is not limited
thereto.
[0153] In addition, after the conductive layers 528 are formed,
heat treatment is performed at 100.degree. C. to 500.degree. C.,
typically 200.degree. C. to 400.degree. C. The atmosphere in which
the heat treatment is performed can be, for example, an air
atmosphere, a nitrogen atmosphere, an oxygen atmosphere, or the
like. Further, the heat treatment time can be about 0.1 to 5 hours.
Here, the heat treatment at 250.degree. C. for one hour in a
nitrogen atmosphere is performed. Note that the timing of the heat
treatment is not particularly limited as long as it is after the
insulating layer 510 is formed. For example, the above heat
treatment may be performed just after the insulating layer 510 is
formed or after another insulating layer, conductive layer, or the
like is formed. By performing the heat treatment (the second heat
treatment) and the preceding heat treatment (the first heat
treatment), the characteristics of the semiconductor elements can
be improved and variation in the characteristics can be
reduced.
[0154] It is preferable that the heat treatment be performed at
400.degree. C. or lower so as not to change (deteriorate) the
characteristics of the insulating layer 510 which functions as the
gate insulating layer. Needless to say, an embodiment of the
disclosed invention should not be interpreted as being limited
thereto.
[0155] As described in this embodiment, by performing plasma
treatment on the oxide semiconductor film 503 or the oxide
semiconductor layer 508 with the use of a cation, the oxide
semiconductor element having excellent characteristics can be
provided. When the insulating layer 510 in contact with the oxide
semiconductor layer 508 is also subjected to the treatment, the
semiconductor element with higher reliability can be obtained.
Similarly, the treatment may be performed on the substrate 500 or
the base layer 501 which is in contact with the oxide semiconductor
layer 508. Accordingly, a semiconductor device including an oxide
semiconductor element which has excellent characteristics can be
provided.
[0156] As illustrated in FIG. 6D, a stacking order of the
conductive layers 506 and the oxide semiconductor layer 508 may be
inversed. In that case, treatment which is similar to the second
plasma treatment is preferably performed at a stage when the oxide
semiconductor layer is exposed. For example, the treatment is
preferably performed at the timing after the oxide semiconductor
film 503 is formed and before the oxide semiconductor film 503 is
processed into an island shape as illustrated in FIG. 6A; the
timing after the oxide semiconductor film 503 is processed to be
the island-shaped oxide semiconductor layer 508 as illustrated in
FIG. 6B; the timing after the conductive layers 506 are formed as
illustrated in FIG. 6C; or the like. The plasma may be generated by
a microwave. A frequency at this time is 2.45 GHz, for example.
[0157] Note that this embodiment can be implemented in combination
with the previous embodiment as appropriate.
Embodiment 4
[0158] In this embodiment, a manufacturing process of an active
matrix substrate which is an example of a semiconductor device is
described with reference to drawings. Note that many parts of the
manufacturing process described in this embodiment are the same as
those in the above embodiments. Therefore, in the following
description, repeated description of the same portions is omitted,
and different points are described in detail. Note that in the
following description, FIGS. 7A to 7C and FIGS. 8A to 8C are
cross-sectional views and FIG. 9 is a plan view. In addition, line
A1-A2 and line B1-B2 in each of FIGS. 7A to 7C and FIGS. 8A to 8C
correspond to line A1-A2 and line B1-B2 in FIG. 9, respectively.
Note also that in this embodiment, a semiconductor element
illustrated in a structure taken along line A1-A2 is similar to the
semiconductor element described in Embodiment 2.
[0159] First, a wiring and an electrode (a gate electrode 302, a
capacitor wiring 304, and a first terminal 306) are formed over a
substrate 300 (see FIG. 7A). Specifically, after a conductive layer
is formed over the substrate, the wiring and electrode are formed
through an etching using a resist mask. In this embodiment, the
wiring and electrode can be formed by a method similar to the
method which is shown in the above embodiments; therefore, the
above embodiments (the description with reference to FIGS. 1A and
1B, FIGS. 3A and 3B, or the like) can be referred to for the
details. Note that in the above description, the distinction
between "an electrode" and "a wiring" is made only for convenience,
and their functions are not limited by the denomination of "the
electrode" or "the wiring". For example, a gate electrode may refer
to a gate wiring.
[0160] Note that the capacitor wiring 304 and the first terminal
306 can be formed at the same time using the same material and the
same manufacturing method as those of the gate electrode 302.
Therefore, for example, the gate electrode 302 and the first
terminal 306 can be electrically connected. The above embodiments
can be referred to for the details of the material and the
manufacturing method of the gate electrode 302.
[0161] Next, a gate insulating layer 308 is formed over the gate
electrode 302 and the gate insulating layer 308 is selectively
etched so as to expose the first terminal 306, whereby a contact
hole is formed (see FIG. 7B). The above embodiments (the
description with reference to FIG. 1C, FIG. 3C, or the like) can be
referred to for the detail of the gate insulating layer 308. There
is no particular limitation on the etching treatment, and either
dry etching or wet etching may be used.
[0162] Next, after a conductive film covering the gate insulating
layer 308 and the first terminal 306 is formed, the conductive film
is selectively etched, so that a source electrode 310, a drain
electrode 312, a connection electrode 314, and a second terminal
316 are formed (see FIG. 7C). Note that in the above description,
the distinction between "an electrode" and "a wiring" is made only
for convenience, and their functions are not limited by the
denomination of "the electrode" or "the wiring". For instance, a
source electrode may refer to a source wiring. In addition, the
source electrode and the drain electrode may be interchanged
depending on the structure or the operation condition of the
transistor.
[0163] The above embodiments (the description with reference to
FIGS. 2A and 2B, FIGS. 3D and 3E, or the like) can be referred to
for the material, the manufacturing method, the etching treatment,
or the like of the above conductive film. Note that by performing
dry etching in the etching treatment, a wiring structure can be
miniaturized as compared with the case of using wet etching. For
example, the connection electrode 314 can be directly connected to
the first terminal 306 through the contact hole formed in the gate
insulating layer 308. In addition, the second terminal 316 can be
electrically connected to the source electrode 310.
[0164] Next, after an oxide semiconductor film is formed to cover
at least the source electrode 310 and the drain electrode 312, the
oxide semiconductor film is selectively etched to form an oxide
semiconductor layer 318 (see FIG. 8A). Here, the oxide
semiconductor layer 318 is in contact with parts of the source
electrode 310 and the drain electrode 312. The above embodiments
(the description with reference to FIGS. 1D and 1E, FIGS. 4A and
4B, or the like) can be referred to for the detail of the oxide
semiconductor layer 318.
[0165] Subsequently, treatment which is similar to the second
plasma treatment described in Embodiment 1 is performed. The plasma
treatment may be performed at a stage when at least part of the
oxide semiconductor layer 318 is exposed; therefore, the treatment
is not necessarily performed at this stage. Note that not only the
treatment but also treatment which is similar to the first plasma
treatment of the above embodiments may be performed at a stage when
at least part of an insulating layer in contact with the oxide
semiconductor layer 318 is exposed.
[0166] After the oxide semiconductor layer 318 is formed, heat
treatment at 100.degree. C. to 500.degree. C., typically
200.degree. C. to 400.degree. C., is performed. The atmosphere of
the heat treatment can be, for example, an air atmosphere, a
nitrogen atmosphere, an oxygen atmosphere, or the like. Further,
the heat treatment time can be about 0.1 to 5 hours. Here, the heat
treatment at 350.degree. C. for one hour in an air atmosphere is
performed. Note that the timing of the heat treatment is not
particularly limited as long as it is after the oxide semiconductor
layer 318 is formed and before an insulating layer serving as an
interlayer insulating layer is formed. For example, the heat
treatment may be performed just after the oxide semiconductor layer
318 is formed. By performing the heat treatment (the first heat
treatment) and the following heat treatment (the second heat
treatment), the characteristics of the semiconductor elements can
be improved and variation in the characteristics can be
reduced.
[0167] Note that it is preferable that the heat treatment be
performed at 400.degree. C. or lower so as not to change
(deteriorate) the characteristics of the gate insulating layer 308.
Needless to say, an embodiment of the disclosed invention should
not be interpreted as being limited thereto.
[0168] Then, an insulating layer 320 is formed to cover the source
electrode 310, the drain electrode 312, the oxide semiconductor
layer 318, and the like and the insulating layer 320 is selectively
etched, whereby contact holes which reach the drain electrode 312,
the connection electrode 314, and the second terminal 316 are
formed (see FIG. 8B). The insulating layer 320 can be formed using
a material such as silicon oxide, aluminum oxide, or tantalum
oxide. The insulating layer 320 may also be formed by stacking
films formed of these materials.
[0169] The hydrogen concentration in the insulating layer 320 is
preferably 1.times.10.sup.21 atoms/cm.sup.3 or less (preferably
5.times.10.sup.2.degree. atoms/cm.sup.3 or less). In addition, the
nitrogen concentration in the insulating layer 320 is preferably
1.times.10.sup.19 atoms/cm.sup.3 or less. Note that the above
concentrations show the average values in the insulating layer
320.
[0170] As a more specific example of the insulating layer 320,
which satisfies the above-described condition, a silicon oxide film
formed by a sputtering method can be given. This is because, in the
case of using a sputtering method, it is easy to reduce hydrogen
concentration in the film as compared with the case of using a
plasma CVD method. Needless to say, any of other methods including
a plasma CVD method may be employed as long as the above condition
is satisfied. For example, the hydrogen concentration in the film
can be reduced in such a manner that the insulating layer 320 is
formed by a plasma CVD method and then plasma treatment similar to
that performed on the insulating layer 108 described in Embodiment
1 is performed on the insulating layer 320. The other conditions of
the insulating layer 320 are not particularly limited. For example,
the thickness of the insulating layer 320 may vary within a
feasible range.
[0171] Next, a transparent conductive layer 322 which is
electrically connected to the drain electrode 312, a transparent
conductive layer 324 which is electrically connected to the
connection electrode 314, and a transparent conductive layer 326
which is electrically connected to the second terminal 316 are
formed (see FIG. 8C and FIG. 9).
[0172] The transparent conductive layer 322 functions as a pixel
electrode and the transparent conductive layer 324 and the
transparent conductive layer 326 function as electrodes or wirings
used for connection with a flexible printed circuit (an FPC). More
specifically, the transparent conductive layer 324 formed over the
connection electrode 314 can be used as a terminal electrode for
connection which functions as an input terminal of a gate wiring,
and the transparent conductive layer 326 formed over the second
terminal 316 can be used as a terminal electrode for connection
which functions as an input terminal of a source wiring.
[0173] In addition, a storage capacitor can be formed using the
capacitor wiring 304, the gate insulating layer 308, and the
transparent conductive layer 322.
[0174] The transparent conductive layer 322, the transparent
conductive layer 324, and the transparent conductive layer 326 can
be formed using a material such as indium oxide (In.sub.2O.sub.3),
indium tin oxide (In.sub.2O.sub.3--SnO.sub.2, also abbreviated as
ITO), or an indium oxide zinc oxide alloy (In.sub.2O.sub.3--ZnO).
For example, after the films containing the above material are
formed by a sputtering method, a vacuum evaporation method, or the
like, an unnecessary portion is removed by etching, whereby the
transparent conductive layer 322, the transparent conductive layer
324, and the transparent conductive layer 326 may be formed.
[0175] In addition, after the transparent conductive layer 322, the
transparent conductive layer 324, and the transparent conductive
layer 326 are formed, heat treatment is performed at 100.degree. C.
to 500.degree. C., typically 200.degree. C. to 400.degree. C. The
atmosphere of the heat treatment can be, for example, an air
atmosphere, a nitrogen atmosphere, an oxygen atmosphere, or the
like. Further, the heat treatment time can be about 0.1 to 5 hours.
Here, the heat treatment at 350.degree. C. for one hour in an air
atmosphere is performed. Note that the timing of the heat treatment
is not particularly limited as long as it is after the insulating
layer 320 is formed. For example, the above heat treatment may be
performed just after the insulating layer 320 is formed or after
the contact holes are formed in the insulating layer 320.
Alternatively, the heat treatment may be performed after another
insulating layer, conductive layer, or the like is formed. By
performing the heat treatment (the second heat treatment) and the
preceding heat treatment (the first heat treatment), the
characteristics of the semiconductor elements can be improved and
variation in the characteristics can be reduced.
[0176] Note that the effect of the second heat treatment is not
limited to the above. For example, the second heat treatment also
provides an advantageous effect of repairing defects in the
insulating layer 320. Since the insulating layer 320 is formed at a
relatively low temperature, defects exist in the film. Thus, the
element characteristics might be adversely affected when the
insulating layer is used as it is. From a perspective of repairing
such defects in the insulating layer 320, it can be said that the
above-described heat treatment plays an important role.
[0177] Note that it is preferable that the heat treatment be
performed at 400.degree. C. or lower so as not to change
(deteriorate) the characteristics of the gate insulating layer
308.
[0178] Needless to say, an embodiment of the disclosed invention
should not be interpreted as being limited thereto.
[0179] Through the above steps, an active matrix substrate
including a bottom-gate transistor 350 and an element such as a
storage capacitor can be completed. For example, in the case of
manufacturing an active matrix liquid crystal display device by
using this, a liquid crystal layer may be provided between an
active matrix substrate and a counter substrate provided with a
counter electrode, and the active matrix substrate and the counter
substrate may be fixed to each other.
[0180] As described in this embodiment, by performing plasma
treatment on the oxide semiconductor layer 318 with the use of a
cation, the oxide semiconductor element having excellent
characteristics can be provided. When the insulating layer 308 in
contact with the oxide semiconductor layer 318 and/or the
insulating layer 320 are/is subjected to the treatment, the
semiconductor element with higher reliability can be obtained.
Accordingly, a semiconductor device including an oxide
semiconductor element with excellent characteristics can be
provided.
[0181] Note that although the case where the transistor 350 or
other structures are formed using the method described in
Embodiment 2 is described, the disclosed invention is not limited
thereto. The method described in Embodiment 1 or the like may be
used. Note that this embodiment can be implemented in combination
with the above embodiment as appropriate.
Embodiment 5
[0182] In this embodiment, an example is described in which thin
film transistors are manufactured and a semiconductor device having
a display function (also referred to as a display device) is
manufactured using the thin film transistors in a pixel portion and
in a driver circuit. Further, part or whole of a driver circuit can
be formed over the same substrate as a pixel portion, whereby a
system-on-panel can be obtained.
[0183] The display device includes a display element. As the
display element, a liquid crystal element (also referred to as a
liquid crystal display element), a light-emitting element (also
referred to as a light-emitting display element), or the like can
be used. The light-emitting element includes, in its category, an
element whose luminance is controlled by a current or a voltage,
and specifically includes, in its category, an inorganic
electroluminescent (EL) element, an organic EL element, and the
like. Further, a display medium whose contrast is changed by an
electric effect, such as electronic ink, may be used.
[0184] The display device includes in its category a panel in which
a display element is sealed, and a module in which an IC including
a controller or the like is mounted on the panel. Furthermore, an
element substrate which forms a display device is provided with
means for supplying current to the display element in each of
pixels. Specifically, the element substrate may be in a state after
only a pixel electrode of the display element is formed, or a state
after a conductive film to be a pixel electrode is formed and
before the conductive film is etched.
[0185] Note that a display device in this specification means an
image display device, a display device, a light source (including a
lighting device), and the like. Further, the display device also
includes the following modules in its category: a module to which a
connector such as an FPC (flexible printed circuit), a TAB (tape
automated bonding) tape, or a TCP (tape carrier package) is
attached; a module having a TAB tape or a TCP at the tip of which a
printed wiring board is provided; a module in which an IC
(integrated circuit) is directly mounted on a display element by a
COG (chip on glass) method, and the like.
[0186] Hereinafter, in this embodiment, an example of a liquid
crystal display device is described. FIGS. 10A1 and 10A2 are plan
views and FIG. 10B is a cross-sectional view of panels in which
thin film transistors 4010 and 4011 and a liquid crystal element
4013 that are formed over a first substrate 4001 are sealed by a
second substrate 4006 and a sealant 4005. Here, each of FIGS. 10A1
and 10A2 is a plan view, and FIG. 10B is a cross-sectional view
taken along M-N of FIGS. 10A1 and 10A2.
[0187] The sealant 4005 is provided to surround a pixel portion
4002 and a scan line driver circuit 4004 that are provided over the
first substrate 4001. The second substrate 4006 is provided over
the pixel portion 4002 and the scan line driver circuit 4004. In
other words, the pixel portion 4002 and the scan line driver
circuit 4004 are sealed together with a liquid crystal layer 4008,
by the first substrate 4001, the sealant 4005, and the second
substrate 4006. Further, a signal line driver circuit 4003 that is
formed using a single crystal semiconductor film or a
polycrystalline semiconductor film over a substrate separately
prepared is mounted in a region different from the region
surrounded by the sealant 4005 over the first substrate 4001.
[0188] Note that there is no particular limitation on the
connection method of a driver circuit which is separately formed,
and a COG method, a wire bonding method, a TAB method, or the like
can be used as appropriate. FIG. 10A1 illustrates an example of
mounting the signal line driver circuit 4003 by a COG method, and
FIG. 10A2 illustrates an example of mounting the signal line driver
circuit 4003 by a TAB method.
[0189] In addition, the pixel portion 4002 and the scan line driver
circuit 4004 provided over the first substrate 4001 each include a
plurality of thin film transistors. FIG. 10B illustrates the thin
film transistor 4010 included in the pixel portion 4002 and the
thin film transistor 4011 included in the scan line driver circuit
4004. Insulating layers 4020 and 4021 are provided over the thin
film transistors 4010 and 4011.
[0190] The transistors described in any of the above embodiments or
the like can be applied to the thin film transistors 4010 and 4011.
Note that in this embodiment, the thin film transistors 4010 and
4011 are n-channel thin film transistors.
[0191] A pixel electrode layer 4030 included in the liquid crystal
element 4013 is electrically connected to the thin film transistor
4010. A counter electrode layer 4031 of the liquid crystal element
4013 is formed for the second substrate 4006. The liquid crystal
element 4013 is formed by the pixel electrode layer 4030, the
counter electrode layer 4031, and the liquid crystal layer 4008.
Note that the pixel electrode layer 4030 and the counter electrode
layer 4031 are provided with an insulating layer 4032 and an
insulating layer 4033, respectively, each of which functions as an
alignment film. The liquid crystal layer 4008 is sandwiched between
the pixel electrode layer 4030 and the counter electrode layer 4031
with the insulating layers 4032 and 4033 provided therebetween.
[0192] Note that as the first substrate 4001 and the second
substrate 4006, glass, metal (typically, stainless steel), ceramic,
plastic, or the like can be used. As plastic, an FRP
(fiberglass-reinforced plastics) substrate, a PVF (polyvinyl
fluoride) film, a polyester film, an acrylic resin film, or the
like can be used. Alternatively, a sheet with a structure in which
an aluminum foil is sandwiched between PVF films or polyester films
can be used.
[0193] A columnar spacer 4035 is provided in order to control the
distance (a cell gap) between the pixel electrode layer 4030 and
the counter electrode layer 4031. The columnar spacer 4035 can be
obtained by selective etching of an insulating film. Note that a
spherical spacer may be used instead of a columnar spacer. In
addition, the counter electrode layer 4031 is electrically
connected to a common potential line formed over the same substrate
as the thin film transistor 4010. For example, the counter
electrode layer 4031 can be electrically connected to the common
potential line through conductive particles provided between the
pair of substrates. Note that the conductive particles are
preferably contained in the sealant 4005.
[0194] In the case of using a horizontal electric field mode, a
liquid crystal exhibiting a blue phase for which an alignment film
is unnecessary may be used. A blue phase is one of the liquid
crystal phases, which is generated just before a cholesteric phase
changes into an isotropic phase while temperature of cholesteric
liquid crystal is increased. Since the blue phase is only generated
within a narrow range of temperatures, a liquid crystal composition
containing a chiral agent at 5 wt % or more is preferably used.
Thus, the temperature range in which the blue phase is generated
can be extended. The liquid crystal composition which includes
liquid crystal exhibiting a blue phase and a chiral agent has such
characteristics that the response time is as short as 10 .mu.s to
100 .mu.s, alignment treatment is not needed because the liquid
crystal composition has optical isotropy, and viewing angle
dependency is small.
[0195] Although an example of a transmissive liquid crystal display
device is described in this embodiment, the present invention is
not limited thereto. An embodiment of the present invention may
also be applied to a reflective liquid crystal display device or a
semi-transmissive liquid crystal display device.
[0196] In this embodiment, an example of the liquid crystal display
device is described (see FIG. 11) in which a polarizing plate is
provided on the outer surface of the substrate (on the viewer side)
and a coloring layer and an electrode layer used for a display
element are provided on the inner surface of the substrate in this
order; however, the polarizing plate may be provided on the inner
surface of the substrate. In addition, the layered structure of the
polarizing plate and the coloring layer is not limited to this
embodiment. The layered structure can be varied as appropriate in
accordance with the material, manufacturing conditions, or the like
of the polarizing plate and the coloring layer. Further, a
light-blocking film serving as a black matrix may be provided.
[0197] In this embodiment, in order to reduce the surface roughness
of the thin film transistor, the thin film transistors obtained in
the above embodiment are covered with the insulating layer 4021. As
the insulating layer 4021, an organic material having heat
resistance such as polyimide, acrylic resin, benzocyclobutene
resin, polyamide, or epoxy resin can be used. Other than such
organic materials, it is also possible to use a low-dielectric
constant material (a low-k material), a siloxane-based resin, PSG
(phosphosilicate glass), BPSG (borophosphosilicate glass), or the
like. Note that the insulating layer 4021 may be formed by stacking
a plurality of insulating films formed of these materials.
[0198] Here, the siloxane-based resin corresponds to a resin
including a Si-O-Si bond which is formed using a siloxane-based
material as a starting material. As a substituent, an organic group
(e.g., an alkyl group or an aryl group) or a fluoro group may be
used. In addition, the organic group may include a fluoro
group.
[0199] There is no particular limitation on the method of forming
the insulating layer 4021, and the following method or means can be
employed depending on the material, by a deposition method such as
a sputtering method, an SOG method, a spin coating method, a
dipping method, a spray coating method, or a droplet discharge
method (e.g., an ink-jet method, screen printing, or offset
printing), or a tool such as a doctor knife, a roll coater, a
curtain coater, a knife coater, or the like.
[0200] The pixel electrode layer 4030 and the counter electrode
layer 4031 can be made of a light-transmitting conductive material
such as indium oxide containing tungsten oxide, indium zinc oxide
containing tungsten oxide, indium oxide containing titanium oxide,
indium tin oxide containing titanium oxide, indium tin oxide (ITO),
indium zinc oxide, or indium tin oxide to which silicon oxide is
added.
[0201] A conductive composition containing a conductive high
molecule (also referred to as a conductive polymer) may be used for
the pixel electrode layer 4030 and the counter electrode layer
4031. The pixel electrode formed of the conductive composition has
preferably a sheet resistance of less than or equal to
1.0.times.10.sup.4 .OMEGA./square and a transmittance of greater
than or equal to 70% at a wavelength of 550 nm. Furthermore, the
resistivity of the conductive high molecule contained in the
conductive composition is preferably 0.1 .OMEGA.cm or less.
[0202] As the conductive high molecule, a so-called .pi.-electron
conjugated conductive macromolecule can be used. For example,
polyaniline or a derivative thereof, polypyrrole or a derivative
thereof, polythiophene or a derivative thereof, a copolymer of two
or more of aniline, pyrrole, and thiophene or a derivative thereof,
or the like can be given.
[0203] A variety of signals are supplied to the signal line driver
circuit 4003, the scan line driver circuit 4004, the pixel portion
4002, or the like from an FPC 4018.
[0204] In addition, a connection terminal electrode 4015 is formed
from the same conductive film as the pixel electrode layer 4030
included in the liquid crystal element 4013, and a terminal
electrode 4016 is formed from the same conductive film as source
and drain electrode layers of the thin film transistors 4010 and
4011.
[0205] The connection terminal electrode 4015 is electrically
connected to a terminal included in the FPC 4018 via an anisotropic
conductive film 4019.
[0206] Although FIGS. 10A1, 10A2, and 10B, the signal line driver
circuit 4003 is formed separately and mounted on the first
substrate 4001, this embodiment is not limited to this structure.
The scan line driver circuit may be separately formed and then
mounted, or only part of the signal line driver circuit or part of
the scan line driver circuit may be separately formed and then
mounted.
[0207] FIG. 11 illustrates an example in which a substrate 2600
provided with an oxide semiconductor element is used for a liquid
crystal display module which corresponds to one mode of the
semiconductor device.
[0208] In FIG. 11, the substrate 2600 provided with the oxide
semiconductor element and a counter substrate 2601 are attached to
each other with a sealant 2602, and between them, an element layer
2603 including an oxide semiconductor element and the like, a
liquid crystal layer 2604 including an alignment film and/or a
liquid crystal layer, a coloring layer 2605, and the like are
provided to form a display region. The coloring layer 2605 is
necessary for color display. In the case of an RGB method,
respective coloring layers corresponding to red, green, and blue
are provided for pixels. Polarizing plates 2606 and 2607 and a
diffusion plate 2613 are provided outside the counter substrate
2601 and the substrate 2600 provided with the oxide semiconductor
element. A light source includes a cold cathode tube 2610 and a
reflective plate 2611. A circuit board 2612 is connected to a
wiring circuit portion 2608 of the substrate 2600 provided with the
oxide semiconductor element through a flexible wiring board 2609.
Accordingly, an external circuit such as a control circuit or a
power source circuit is included in a liquid crystal module. A
retardation plate may be provided between the polarizing plate and
the liquid crystal layer.
[0209] For a driving method of a liquid crystal, a TN (twisted
nematic) mode, an IPS (in-plane-switching) mode, an FFS (fringe
field switching) mode, an MVA (multi-domain vertical alignment)
mode, a PVA (patterned vertical alignment) mode, an ASM (axially
symmetric aligned micro-cell) mode, an OCB (optical compensated
birefringence) mode, an FLC (ferroelectric liquid crystal) mode, an
AFLC (antiferroelectric liquid crystal) mode, or the like can be
used.
[0210] Through the above steps, a high-performance liquid crystal
display device can be manufactured. This embodiment can be
implemented in combination with the above embodiment, as
appropriate.
Embodiment 6
[0211] In this embodiment, active matrix electronic paper that is
an example of a semiconductor device will be described with
reference to FIG. 12. A thin film transistor 650 used for the
semiconductor device can be manufactured in a manner similar to
that of the thin film transistor or the like described in the above
embodiments.
[0212] The electronic paper illustrated in FIG. 12 is an example of
a display device in which a twist ball display method is employed.
The twisting ball display system refers to a method in which
spherical particles each colored in black and white are arranged
between a first electrode layer and a second electrode layer, and a
potential difference is generated between the first electrode layer
and the second electrode layer, whereby orientation of the
spherical particles is controlled, so that display is
performed.
[0213] The source or drain electrode layer of the thin film
transistor 650 is electrically connected to a first electrode layer
660 through a contact hole formed in an insulating layer 585. A
substrate 602 is provided with a second electrode layer 670.
Spherical particles 680 each having a black region 680a and a white
region 680b are provided between the first electrode layer 660 and
the second electrode layer 670. A space around the spherical
particles 680 is filled with a filler 682 such as a resin (see FIG.
12). In FIG. 12, the first electrode layer 660 corresponds to a
pixel electrode, and the second electrode layer 670 corresponds to
a common electrode. The second electrode layer 670 is electrically
connected to a common potential line provided over the same
substrate as the thin film transistor 650.
[0214] Instead of the twisting ball, an electrophoretic display
element can also be used. In that case, for example, a microcapsule
having a diameter of approximately 10 .mu.m to 200 .mu.m in which
transparent liquid, positively-charged white microparticles, and
negatively-charged black microparticles are encapsulated, is
preferably used. When an electric field is applied between the
first electrode layer and the second electrode layer, the white
microparticles and the black microparticles move to opposite sides
from each other, so that white or black is displayed. The
electrophoretic display element has higher reflectance than a
liquid crystal display element, and thus, an auxiliary light is
unnecessary and a display portion can be recognized in a place
where brightness is not sufficient. In addition, there is an
advantage that even when power is not supplied to the display
portion, an image which has been displayed once can be
maintained.
[0215] Thus, high-performance electronic paper can be manufactured
using an embodiment of the disclosed invention. Note that this
embodiment can be implemented in combination with the above
embodiment as appropriate.
Embodiment 7
[0216] In this embodiment, a light-emitting display device which is
an example of a semiconductor device will be described. Here, a
case is described where a light-emitting element utilizing
electroluminescence is used as a display element. Note that
light-emitting elements utilizing electroluminescence are
classified by whether a light-emitting material is an organic
compound or an inorganic compound. In general, the former is called
an organic EL element, and the latter is called an inorganic EL
element.
[0217] In an organic EL element, when voltage is applied to a
light-emitting element, electrons and holes are injected from a
pair of electrodes into a layer containing a light-emitting organic
compound. Then, the carriers (electrons and holes) recombine,
thereby emitting light. Owing to such a mechanism, the
light-emitting element is called a current-excitation
light-emitting element.
[0218] The inorganic EL elements are classified according to their
element structures into a dispersion-type inorganic EL element and
a thin-film inorganic EL element. A dispersion-type inorganic EL
element has a light-emitting layer where particles of a
light-emitting material are dispersed in a binder, and its light
emission mechanism is donor-acceptor recombination-type light
emission which utilizes a donor level and an acceptor level. A
thin-film-type inorganic EL element has a structure where a
light-emitting layer is sandwiched between dielectric layers, which
are further sandwiched between electrodes, and its light emission
mechanism is localized-type light emission that utilizes
inner-shell electron transition of metal ions. Note that an example
of an organic EL element as a light-emitting element is described
here.
[0219] Structures of the light-emitting element will be described
with reference to FIGS. 13A to 13C. Here, the case where a driving
transistor is an n-channel transistor is illustrated, and
cross-sectional structures of pixels are described. Transistors
701, 711, and 721 used for semiconductor devices illustrated in
FIGS. 13A to 13C can be manufactured in a manner similar to that of
the transistors described in the above embodiment.
[0220] In order to extract light from a light-emitting element, at
least one of the anode and the cathode is transparent. Here,
transparent means that at least light with an emission wavelength
has sufficiently high transmittance. As a method for extracting
light, a thin film transistor and a light emitting element are
formed over a substrate; and there are a top emission method (a top
extraction method) by which light is extracted from a side opposite
to the substrate, a bottom emission method (a bottom extraction
method) by which light is extracted from the substrate side, a dual
emission method (a dual extraction method) by which light is
extracted from both the substrate side and the side opposite to the
substrate, and the like.
[0221] A top-emission-type light-emitting element is described
using FIG. 13A.
[0222] FIG. 13A is a cross-sectional view of a pixel in the case
where light is emitted from a light-emitting element 702 to an
anode 705 side. Here, a cathode 703 of the light-emitting element
702 is electrically connected to the transistor 701 which is a
driving transistor, and a light-emitting layer 704 and the anode
705 are stacked in this order over the cathode 703. For the cathode
703, a conductive film which has a low work function and reflects
light can be used. For example, a material such as Ca, Al, MgAg, or
AlLi is preferably used to form the cathode 703. The light-emitting
layer 704 may be formed using either a single layer or a plurality
of layers stacked. When the light-emitting layer 704 is formed
using a plurality of layers, an electron-injection layer, an
electron-transport layer, a light-emitting layer, a hole-transport
layer, and a hole-injection layer are preferably stacked in this
order over the cathode 703; however, needless to say, it is not
necessary to form all of these layers and a different layered
structure may be employed. The anode 705 is formed using a
light-transmitting conductive material. For example, a
light-transmitting conductive material, such as indium oxide
containing tungsten oxide, indium zinc oxide containing tungsten
oxide, indium oxide containing titanium oxide, indium tin oxide
containing titanium oxide, indium tin oxide (ITO), indium zinc
oxide, or indium tin oxide to which silicon oxide is added, may be
used.
[0223] A structure in which the light-emitting layer 704 is
sandwiched between the cathode 703 and the anode 705 can be called
the light-emitting element 702. In the case of the pixel
illustrated in FIG. 13A, light is emitted from the light-emitting
element 702 to the anode 705 side as indicated by an arrow.
[0224] Next, a bottom-emission-type light-emitting element is
described using FIG. 13B.
[0225] FIG. 13B is a cross-sectional view of a pixel in the case
where light is emitted from a light-emitting element 712 to a
cathode 713 side. Here, the cathode 713 of the light-emitting
element 712 is formed over a light-transmitting conductive film 717
which is electrically connected to the driving transistor 711, and
a light-emitting layer 714 and an anode 715 are stacked in this
order over the cathode 713. Note that a light-blocking film 716 may
be formed to cover the anode 715 when the anode 715 has a
light-transmitting property. Similar to the case of FIG. 13A, the
cathode 713 can be formed using a conductive material which has a
low work function. The cathode 713 is formed to have a thickness
that can transmit light (preferably, approximately 5 nm to 30 nm).
For example, an aluminum film with a thickness of approximately 20
nm can be used as the cathode 713. The light-emitting layer 714 may
be formed using a single layer or a plurality of layers stacked
similarly to FIG. 13A. The anode 715 does not necessarily transmit
light, but may be formed using a light-transmitting conductive
material as in the case of FIG. 13A. As the light-blocking film
716, a metal which reflects light or the like can be used; however,
it is not limited thereto. For example, a resin to which black
pigments are added or the like can be used.
[0226] A structure in which the light-emitting layer 714 is
sandwiched between the cathode 713 and the anode 715 can be called
the light-emitting element 712. In the case of the pixel shown in
FIG. 13B, light emitted from the light-emitting element 712 is
extracted through the cathode 713 side as indicated by an
arrow.
[0227] Next, a dual-emission-type light-emitting element is
described with reference to FIG. 13C.
[0228] In FIG. 13C, a cathode 723 of a light-emitting element 722
is formed over a light-transmitting conductive film 727 which is
electrically connected to the driving transistor 721, and a
light-emitting layer 724 and an anode 725 are stacked in this order
over the cathode 723. The cathode 723 can be formed using a
conductive material which has a low work function as in the case of
FIG. 13A. The cathode 723 is formed to have a thickness that can
transmit light. For example, an Al film with a thickness of
approximately 20 nm can be used as the cathode 723. As in FIG. 13A,
the light-emitting layer 724 may be formed using a single layer or
a plurality of layers stacked. As in FIG. 13A, the anode 725 can be
formed using a light-transmitting conductive material.
[0229] A structure in which the cathode 723, the light-emitting
layer 724, and the anode 725 overlap with each other can be called
the light-emitting element 722. In the case of the pixel
illustrated in FIG. 13C, light is emitted from the light-emitting
element 722 to both the anode 725 side and the cathode 723 side as
indicated by arrows.
[0230] Although a case of using an organic EL element as a
light-emitting element is described here, an inorganic EL element
can also be used as a light-emitting element. The example is
described here in which a thin film transistor (a driving
transistor) which controls the driving of a light-emitting element
is electrically connected to the light-emitting element; however, a
transistor for current control or the like may be connected between
the driving transistor and the light-emitting element.
[0231] The structure of the semiconductor device described in this
embodiment is not limited to the structures of FIGS. 13A to 13C and
can be modified in various ways.
[0232] Next, the appearance and a cross section of a light-emitting
display panel (also referred to as a light-emitting panel) are
described with reference to FIGS. 14A and 14B. FIG. 14A is a plan
view and FIG. 14B is a cross-sectional view of a panel in which
thin film transistors 4509 and 4510 and a light-emitting element
4511 that are formed over a first substrate 4501 are sealed by a
second substrate 4506 and a sealant 4505. Here, FIG. 14A is a plan
view and FIG. 14B is a cross-sectional view taken along line H-I in
FIG. 14A.
[0233] The sealant 4505 is provided to surround a pixel portion
4502, signal line driver circuits 4503a and 4503b, and scan line
driver circuits 4504a and 4504b, which are provided over the first
substrate 4501. In addition, the second substrate 4506 is provided
over the pixel portion 4502, the signal line driver circuits 4503a
and 4503b, and the scan line driver circuits 4504a and 4504b. That
is, the pixel portion 4502, the signal line driver circuits 4503a
and 4503b, and the scan line driver circuits 4504a and 4504b are
sealed together with a filler 4507, with the first substrate 4501,
the sealant 4505, and the second substrate 4506. In such a manner,
it is preferable that packaging (sealing) be performed using a
protective film (such as a bonding film or an ultraviolet curable
resin film), a cover material, or the like with high air-tightness
and little degasification.
[0234] The pixel portion 4502, the signal line driver circuits
4503a and 4503b, and the scan line driver circuits 4504a and 4504b,
which are formed over the first substrate 4501, each include a
plurality of thin film transistors. FIG. 14B illustrates the thin
film transistor 4510 included in the pixel portion 4502 and the
thin film transistor 4509 included in the signal line driver
circuit 4503a.
[0235] As the thin film transistors 4509 and 4510, the transistors
described in the above embodiments can be employed. Note that in
this embodiment, the thin film transistors 4509 and 4510 are
n-channel thin film transistors.
[0236] Moreover, reference numeral 4511 denotes a light-emitting
element. A first electrode layer 4517 which is a pixel electrode
included in the light-emitting element 4511 is electrically
connected to a source electrode layer or a drain electrode layer of
the thin film transistor 4510. Note that a structure of the
light-emitting element 4511 is a layered structure of the first
electrode layer 4517, an electroluminescent layer 4512, and a
second electrode layer 4513, but there is no particular limitation
on the structure. The structure of the light-emitting element 4511
can be changed as appropriate depending on the direction in which
light is extracted from the light-emitting element 4511, or the
like.
[0237] A partition 4520 is formed using an organic resin film, an
inorganic insulating film, organic polysiloxane, or the like. It is
particularly preferable that the partition 4520 be formed using a
photosensitive material to have an opening portion over the first
electrode layer 4517 so that a sidewall of the opening portion is
formed as an inclined surface with continuous curvature.
[0238] The electroluminescent layer 4512 may be formed using either
a single layer or a plurality of layers stacked.
[0239] A protective film may be formed over the second electrode
layer 4513 and the partition 4520 in order to prevent oxygen,
hydrogen, moisture, carbon dioxide, or the like from entering the
light-emitting element 4511. As the protective film, a silicon
nitride film, a silicon nitride oxide film, a DLC (diamond like
carbon) film, or the like can be formed.
[0240] A variety of signals are supplied to the signal line driver
circuits 4503a and 4503b, the scan line driver circuits 4504a and
4504b, the pixel portion 4502, or the like from FPCs 4518a and
4518b.
[0241] In this embodiment, an example is described in which a
connection terminal electrode 4515 is formed from the same
conductive film as the first electrode layer 4517 of the
light-emitting element 4511, and a terminal electrode 4516 is
formed from the same conductive film as the source and drain
electrode layers of the thin film transistors 4509 and 4510.
[0242] The connection terminal electrode 4515 is electrically
connected to a terminal included in the FPC 4518a via an
anisotropic conductive film 4519.
[0243] The substrate located in the direction in which light is
extracted from the light-emitting element 4511 needs to have a
light-transmitting property. As a substrate having a
light-transmitting property, a glass plate, a plastic plate, a
polyester film, an acrylic film, and the like are given.
[0244] As the filler 4507, an ultraviolet curable resin, a
thermosetting resin, or the ilke can be used, in addition to an
inert gas such as nitrogen or argon. For example, polyvinyl
chloride (PVC), acrylic, polyimide, an epoxy resin, a silicone
resin, polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), or
the like can be used. In this embodiment, an example in which
nitrogen is used for the filler is described.
[0245] If needed, an optical film, such as a polarizing plate, a
circularly polarizing plate (including an elliptically polarizing
plate), a retardation plate (a quarter-wave plate or a half-wave
plate), or a color filter, may be provided on a light-emitting
surface of the light-emitting element. Furthermore, an
antireflection treatment may be performed on a surface thereof For
example, anti-glare treatment by which reflected light can be
diffused by projections and depressions on the surface so as to
reduce the glare can be performed.
[0246] The signal line driver circuits 4503a and 4503b and the scan
line driver circuits 4504a and 4504b may be formed using a single
crystal semiconductor film or a polycrystalline semiconductor film
over a substrate separately prepared. Alternatively, only the
signal line driver circuits or part thereof or only the scan line
driver circuits or part thereof may be separately formed and
mounted. This embodiment is not limited to the structure
illustrated in FIGS. 14A and 14B.
[0247] Through the above process, a high-performance light-emitting
display device (display panel) can be manufactured. Note that this
embodiment can be implemented in combination with the above
embodiment as appropriate.
Embodiment 8
[0248] The semiconductor device manufactured by the method for
manufacturing a semiconductor device according to an embodiment of
the present invention can be applied to electronic paper.
Electronic paper can be used for electronic appliances of a variety
of fields as long as they can display data. For example, electronic
paper can be applied to an e-book reader (electronic book), a
poster, an advertisement in a vehicle such as a train, or displays
of various cards such as a credit card. Examples of the electronic
devices are illustrated in FIGS. 15A and 15B and FIG. 16.
[0249] FIG. 15A illustrates a poster 2631 formed using electronic
paper. In the case where an advertising medium is printed paper,
the advertisement is replaced by hands;
[0250] however, by using the electronic paper, the advertising
display can be changed in a short time. Furthermore, stable images
can be obtained without display defects. Note that the poster may
have a configuration capable of wirelessly transmitting and
receiving data.
[0251] FIG. 15B illustrates an advertisement 2632 in a vehicle such
as a train. In the case where an advertising medium is printed
paper, the advertisement is replaced by hands; however, by using an
electronic paper, advertising display can be changed in a short
time without using much human resources. Furthermore, stable images
can be obtained without display defects. Note that the
advertisement in a vehicle may have a configuration capable of
wirelessly transmitting and receiving data.
[0252] FIG. 16 illustrates an example of an e-book reader. For
example, an e-book reader 2700 includes a housing 2701 and a
housing 2703. The housing 2701 and the housing 2703 are combined
with a hinge 2711 so that the e-book reader 2700 can be opened and
closed with the hinge 2711 as an axis. With such a structure, the
e-book reader 2700 can operate like a paper book.
[0253] A display portion 2705 and a display portion 2707 are
incorporated in the housing 2701 and the housing 2703,
respectively. The display portion 2705 and the display portion 2707
may display one image or different images. In the structure where
different images are displayed on the display portion 2705 and the
display portion 2707, for example, the right display portion (the
display portion 2705 in FIG. 16) can display text and the left
display portion (the display portion 2707 in FIG. 16) can display
images.
[0254] FIG. 16 illustrates an example in which the housing 2701 is
provided with an operation portion and the like. For example, the
housing 2701 is provided with a power switch 2721, an operation key
2723, a speaker 2725, and the like. With the operation key 2723,
pages can be turned. Note that a keyboard, a pointing device, and
the like may be provided on the same surface as the display portion
of the housing. Furthermore, an external connection terminal (an
earphone terminal, a USB terminal, a terminal that can be connected
to various cables such as an AC adapter and a USB cable, or the
like), a recording medium insertion portion, and the like may be
provided on the back surface or the side surface of the housing.
Moreover, the e-book reader 2700 may have a function of an
electronic dictionary.
[0255] The e-book reader 2700 may have a configuration capable of
wirelessly transmitting and receiving data. Through wireless
communication, desired book data or the like can be purchased and
downloaded from an electronic book server.
[0256] This embodiment can be implemented in combination with the
above embodiment, as appropriate.
Embodiment 9
[0257] A semiconductor device which is manufactured by a method for
manufacturing a semiconductor device according to an embodiment of
the present invention can be applied to a variety of electronic
appliances (including an amusement machine). Examples of electronic
devices are a television set (also referred to as a television or a
television receiver), a monitor of a computer or the like, a camera
such as a digital camera or a digital video camera, a digital photo
frame, a mobile phone handset (also referred to as a mobile phone
or a mobile phone device), a portable game console, a portable
information terminal, an audio reproducing device, a large-sized
game machine such as a pachinko machine, and the like.
[0258] FIG. 17A illustrates an example of a television set. In a
television set 9600, a display portion 9603 is incorporated in a
housing 9601. The display portion 9603 can display images. Here,
the housing 9601 is supported by a stand 9605.
[0259] The television set 9600 can be operated with an operation
switch of the housing 9601 or a separate remote controller 9610.
Channels and volume can be controlled with an operation key 9609 of
the remote controller 9610 so that an image displayed on the
display portion 9603 can be controlled. Furthermore, the remote
controller 9610 may be provided with a display portion 9607 for
displaying information output from the remote controller 9610.
[0260] Note that the television set 9600 is provided with a
receiver, a modem, and the like. With the use of the receiver,
general television broadcasting can be received. Moreover, when the
television set 9600 is connected to a communication network with or
without wires via the modem, one-way (from a sender to a receiver)
or two-way (between a sender and a receiver or between receivers)
information communication can be performed.
[0261] FIG. 17B illustrates an example of a digital photo frame.
For example, in a digital photo frame 9700, a display portion 9703
is incorporated in a housing 9701. The display portion 9703 can
display a variety of images. For example, the display portion 9703
can display data of an image taken with a digital camera or the
like and function as a normal photo frame.
[0262] Note that the digital photo frame 9700 is provided with an
operation portion, an external connection portion (a USB terminal,
a terminal that can be connected to various cables such as a USB
cable, or the like), a recording medium insertion portion, and the
like. Although these components may be provided on the surface on
which the display portion is provided, it is preferable to provide
them on the side surface or the back surface for the design of the
digital photo frame 9700. For example, a memory storing data of an
image taken with a digital camera is inserted in the recording
medium insertion portion of the digital photo frame, whereby the
image data can be transferred and then displayed on the display
portion 9703.
[0263] The digital photo frame 9700 may be configured to transmit
and receive information wirelessly. The structure may be employed
in which desired image data is transferred wirelessly to be
displayed.
[0264] FIG. 18A illustrates a portable amusement console including
two housings: a housing 9881 and a housing 9891. The housings 9881
and 9891 are connected with a connection portion 9893 so as to be
opened and closed. A display portion 9882 and a display portion
9883 are incorporated in the housing 9881 and the housing 9891,
respectively. The portable game console illustrated in FIG. 18A
additionally includes a speaker portion 9884, a storage medium
inserting portion 9886, an LED lamp 9890, an input means (operation
keys 9885, a connection terminal 9887, a sensor 9888 (having a
function of measuring force, displacement, position, speed,
acceleration, angular speed, rotational frequency, distance, light,
liquid, magnetism, temperature, chemical substance, sound, time,
hardness, electric field, current, voltage, electric power,
radiation, flow rate, humidity, gradient, vibration, smell, or
infrared ray), and a microphone 9889), and the like. It is needless
to say that the structure of the portable amusement console is not
limited to the above and other structures provided with at least a
semiconductor device may be employed. The portable amusement
machine may include an additional accessory equipment, as
appropriate. The portable game console illustrated in FIG. 18A has
a function of reading a program or data stored in a storage medium
to display it on the display portion, and a function of sharing
information with another portable game console via wireless
communication. The portable game console of FIG. 18A can have a
variety of functions other than those above.
[0265] FIG. 18B illustrates an example of a slot machine, which is
a large game machine. In a slot machine 9900, a display portion
9903 is incorporated in a housing 9901. In addition, the slot
machine 9900 includes an operation means such as a start lever or a
stop switch, a coin slot, a speaker, and the like. It is needless
to say that the structure of the slot machine 9900 is not limited
to the above and other structures provided with at least a
semiconductor device may be employed. The slot machine 9900 may
include an additional accessory equipment, as appropriate.
[0266] FIG. 19A illustrates an example of a mobile phone handset. A
mobile phone handset 1000 includes a display portion 1002
incorporated in a housing 1001, operation buttons 1003, an external
connection port 1004, a speaker 1005, a microphone 1006 and the
like.
[0267] When the display portion 1002 of the mobile phone handset
1000 illustrated in FIG. 19A is touched with a finger or the like,
information can be input into the mobile phone handset 1000.
Furthermore, operations such as making calls and composing mails
can be performed by touching the display portion 1002 with a finger
or the like.
[0268] There are mainly three screen modes of the display portion
1002. The first mode is a display mode mainly for displaying
images. The second mode is an input mode mainly for inputting
information such as text. The third mode is a display-and-input
mode in which two modes of the display mode and the input mode are
combined.
[0269] For example, in a case of making a call or composing a mail,
a text input mode mainly for inputting text is selected for the
display portion 1002 so that text displayed on a screen can be
input. In that case, it is preferable to display a keyboard or
number buttons on almost all area of the screen of the display
portion 1002.
[0270] When a detection device including a sensor for detecting
inclination, such as a gyroscope or an acceleration sensor, is
provided inside the mobile phone handset 1000, display on the
screen of the display portion 1002 can be automatically switched by
determining the installation direction of the mobile phone handset
1000 (whether the mobile phone handset 1000 is placed horizontally
or vertically for a landscape mode or a portrait mode).
[0271] The screen modes are switched by touching the display
portion 1002 or operating the operation buttons 1003 of the housing
1001. Alternatively, the screen modes may be switched depending on
the kind of the image displayed on the display portion 1002. For
example, when a signal of an image displayed on the display portion
is a signal of moving image data, the screen mode is switched to
the display mode. When the signal is a signal of text data, the
screen mode is switched to the input mode.
[0272] Further, in the input mode, when input by touching the
display portion 1002 is not performed for a certain period while a
signal detected by the optical sensor in the display portion 1002
is detected, the screen mode may be controlled so as to be switched
from the input mode to the display mode.
[0273] The display portion 1002 may function as an image sensor.
For example, an image of a palm print, a fingerprint, or the like
is taken when the display portion 1002 is touched with a palm or a
finger, whereby personal identification can be performed.
[0274] Further, by providing a backlight or a sensing light source
which emits a near-infrared light in the display portion, an image
of a finger vein, a palm vein, or the like can be taken.
[0275] FIG. 19B also illustrates an example of a mobile phone
handset. The mobile phone handset in FIG. 19B includes a display
device 9410 in a housing 9411, which includes a display portion
9412 and operation buttons 9413, and a communication device 9400 in
a housing 9401, which includes operation buttons 9402, an external
input terminal 9403, a microphone 9404, a speaker 9405, and a
light-emitting portion 9406 that emits light when a phone call is
received. The display device 9410 having a display function can be
detached from and attached to the communication device 9400 having
a telephone function in two directions shown by arrows.
Accordingly, the display device 9410 and the communication device
9400 can be attached to each other along respective short axes or
long axes. When only the display function is needed, the display
device 9410 can be detached from the communication device 9400 and
used alone. Images or input information can be transmitted or
received by wireless or wire communication between the
communication device 9400 and the display device 9410, each of
which has a rechargeable battery.
[0276] Note that this embodiment can be implemented in combination
with the above embodiment as appropriate.
[0277] This application is based on Japanese Patent Application
serial no. 2010-115940 filed with Japan Patent Office on May 20,
2010, the entire contents of which are hereby incorporated by
reference.
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