U.S. patent application number 15/333165 was filed with the patent office on 2017-02-23 for multi-layer forms and methods of manufacturing the same.
The applicant listed for this patent is R.R. Donnelley & Sons Company. Invention is credited to Lynn Baeten, Joshua Johnson, Kevin Pulley, Eric M. Wood.
Application Number | 20170050410 15/333165 |
Document ID | / |
Family ID | 51609900 |
Filed Date | 2017-02-23 |
United States Patent
Application |
20170050410 |
Kind Code |
A1 |
Johnson; Joshua ; et
al. |
February 23, 2017 |
MULTI-LAYER FORMS AND METHODS OF MANUFACTURING THE SAME
Abstract
Multi-layer forms and methods of producing the same are
disclosed. An example apparatus includes means for moving a first
substrate in a direction; means for applying adhesive to a first
portion of a first side of the first substrate; means for mating a
second substrate with the first portion; means for applying
adhesive to a third portion of a second side of the first
substrate; means for folding the first substrate about a first fold
line to couple the third portion to a fourth portion of the second
side; means for applying adhesive to a first sub-portion of a
second portion of the first side; and means for folding the first
substrate and the second substrate about a second fold line to
couple a face of the first sub-portion and a face of a second
sub-portion of the second portion and to position the first
substrate between the second substrate.
Inventors: |
Johnson; Joshua; (Green Bay,
WI) ; Baeten; Lynn; (Green Bay, WI) ; Wood;
Eric M.; (Schaumburg, IL) ; Pulley; Kevin; (De
Pere, WI) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
R.R. Donnelley & Sons Company |
Chicago |
IL |
US |
|
|
Family ID: |
51609900 |
Appl. No.: |
15/333165 |
Filed: |
October 24, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14025570 |
Sep 12, 2013 |
9511561 |
|
|
15333165 |
|
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B32B 27/36 20130101;
B32B 2317/12 20130101; B32B 38/0004 20130101; B32B 2325/00
20130101; B32B 38/06 20130101; B32B 37/1284 20130101; B32B 27/302
20130101; B32B 27/10 20130101; B42D 25/425 20141001; B32B 2250/04
20130101; Y10T 428/24612 20150115; Y10T 156/1044 20150115; B32B
2367/00 20130101; B32B 3/30 20130101; Y10T 156/1041 20150115; B32B
7/06 20130101; B32B 37/02 20130101; B32B 2425/00 20130101; B42D
25/47 20141001; B32B 3/266 20130101; Y10T 428/15 20150115 |
International
Class: |
B32B 3/30 20060101
B32B003/30; B32B 27/10 20060101 B32B027/10; B32B 37/02 20060101
B32B037/02; B32B 37/12 20060101 B32B037/12; B42D 25/47 20060101
B42D025/47; B32B 38/06 20060101 B32B038/06; B32B 27/36 20060101
B32B027/36; B32B 27/30 20060101 B32B027/30; B42D 25/425 20060101
B42D025/425; B32B 3/26 20060101 B32B003/26; B32B 38/00 20060101
B32B038/00 |
Claims
1. An apparatus, comprising: means for moving a first substrate in
a direction, the first substrate comprising a first side opposite a
second side, the first side having a first portion and a second
portion, the second portion having a first sub-portion and a second
sub-portion, the second side having a third portion and a fourth
portion; means for applying adhesive to the first portion of the
first side; means for mating a second substrate with the first
portion of the first side; means for applying adhesive to the third
portion of the second side; means for folding the first substrate
about a first fold line to couple the third portion to the fourth
portion; means for applying adhesive to the first sub-portion of
the second portion; and means for folding the first substrate and
the second substrate about a second fold line to couple a face of
the first sub-portion and a face of the second sub-portion and to
position the first substrate between the second substrate.
2. The apparatus of claim 1, further comprising means for
positioning an inlay on the first substrate or the second
substrate.
3. The apparatus of claim 1, further comprising means for embossing
the first substrate and the second substrate to enable the first
substrate and the second substrate to include indicia prior to
folding the first substrate about the first fold line
4. An apparatus, comprising: a first substrate first ply comprising
a first surface and a second surface; a second substrate first ply
comprising a first surface and a second surface, the second surface
of the first substrate first ply coupled to the first surface of
the second substrate first ply, the first substrate first ply and
the second substrate first ply being embossed; a second substrate
second ply comprising a first surface and a second surface, the
second substrate first ply is disposed between the second substrate
second ply and the first substrate first ply; a first substrate
second ply comprising a first surface and a second surface, the
first surface of the first substrate second ply coupled to the
second surface of the second substrate second ply, the first
substrate second ply and the second substrate second ply not being
embossed.
5. The apparatus of claim 4, further comprising a line of weakness
through the first substrate first ply, the second substrate first
ply, the first substrate second ply, and the second substrate
second ply to define a removable portion.
6. The apparatus of claim 4, further comprising a second substrate
third ply comprising a first surface and a second surface, the
second surface of the second substrate first ply coupled to the
first surface of the second substrate third ply.
7. The apparatus of claim 6, wherein the second substrate third ply
is not embossed.
8. The apparatus of claim 7, further comprising a second substrate
fourth ply comprising a first surface and a second surface, the
second surface of the second substrate third ply coupled to the
first surface of the second substrate fourth ply.
9. The apparatus of claim 8, wherein the second substrate fourth
ply is not embossed.
10. The apparatus of claim 8, wherein the second surface of the
second substrate fourth ply is coupled to the first surface of the
second substrate second ply.
11. The apparatus of claim 10, further comprising a line of
weakness through the first substrate first ply, the first substrate
second ply, the second substrate first ply, the second substrate
second ply, the second substrate third ply, and the second
substrate fourth ply to define a removable portion.
12. The apparatus of claim 11, wherein the removable portion
comprises at least one of a card, a tag, an ornament, or a card and
key tag.
13. The apparatus of claim 11, further comprising a perforation
through the first substrate first ply, the first substrate second
ply, the second substrate first ply, the second substrate second
ply, the second substrate third ply, and the second substrate
fourth ply to define a cutout.
14. An apparatus, comprising: a first substrate first layer
comprising a first side and a second side; a second substrate first
layer comprising a third side and a fourth side, the second side
coupled to the third side, the first substrate first layer and the
second substrate first layer being embossed; a second substrate
second layer comprising a fifth side and a sixth side, the fourth
side coupled to the fifth side; a first substrate second layer
comprising a seventh side and an eighth side, the seventh side
coupled to the sixth side, the first substrate second layer and the
second substrate second layer not being embossed.
15. The apparatus of claim 14, wherein the third side comprises
imaging.
16. The apparatus of claim 14, further comprising a line of
weakness through the first and second substrate first layers and
the first and second substrate second layers to define a card
surrounded by a waste matrix.
17. The apparatus of claim 14, further comprising a line of
weakness through the first and second substrate first layers and
the first and second substrate second layers to define a removable
portion.
18. The apparatus of claim 14, wherein the embossing of the first
substrate first layer is ink tipped.
19. The apparatus of claim 14, wherein the first substrate
comprises plastic.
20. The apparatus of claim 14, wherein the first substrate
comprises an inlay.
Description
RELATED APPLICATION
[0001] This patent arises from a continuation of U.S. patent
application Ser. No. 14/025,570, filed Sep. 12, 2013. Priority is
claimed to U.S. patent application Ser. No. 14/025,570. U.S. patent
application Ser. No. 14/025,570 is hereby incorporated herein by
reference in its entirety.
FIELD OF THE DISCLOSURE
[0002] This patent relates to multi-layer forms and, more
specifically, to multi-layer forms and methods of producing the
same.
BACKGROUND
[0003] Cards or tags may be produced for identification
purposes.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 depicts an example apparatus that can be used to
produce the example multi-layer forms disclosed herein.
[0005] FIGS. 2-12 depict an example multi-layer form at various
stages of an example production process.
[0006] FIGS. 13 and 14 depict an example card and/or form in
accordance with the teachings of this disclosure.
[0007] FIGS. 15 and 16 depict an example sponsorship tag and/or
form in accordance with the teachings of this disclosure.
[0008] FIGS. 17 and 18 depict an example ornament and/or form in
accordance with the teachings of this disclosure.
[0009] FIGS. 19 and 20 depict an example luggage tag and/or form in
accordance with the teachings of this disclosure.
[0010] FIGS. 21 and 22 depict an example card and key tag and/or
form in accordance with the teachings of this disclosure.
[0011] FIG. 23 is a flowchart representation of an example process,
which may be implemented using machine readable instructions, to
produce the example forms of FIGS. 2-22.
[0012] FIG. 24 depicts an example apparatus that can be used to
produce an example multi-layer forms disclosed herein.
[0013] FIGS. 25-35 depict an example multi-layer form at various
stages of an example production process.
[0014] FIG. 36 is a flowchart representation of an example process,
which may be implemented using machine readable instructions, to
produce the example forms of FIGS. 13-22 and 25-35.
[0015] FIG. 37 shows an example web that can be used to produce the
example multi-layer forms disclosed herein.
[0016] FIG. 38 is a block diagram of an example processor platform
capable of executing the instructions to implement the flowcharts f
FIGS. 23 and 36 to implement the apparatus of FIGS. 1 and 24.
DETAILED DESCRIPTION
[0017] Certain examples are shown in the above-identified figures
and described in detail below. In describing these examples, like
or identical reference numbers are used to identify the same or
similar elements. The figures are not necessarily to scale and
certain features and certain views of the figures may be shown
exaggerated in scale or in schematic for clarity and/or
conciseness. Additionally, several examples have been described
throughout this specification. Any features from any example may be
included with, a replacement for, or otherwise combined with other
features from other examples.
[0018] The examples disclosed herein relate to example forms (e.g.,
mailers, sponsorship tags, ornaments, luggage tags, card and key
tags and/or removable inserts) produced in an in-line process. In
some examples, the forms are produced using a multi-ply paper card
surrounded by and/or positioned between polystyrene (poly). One or
more of the plies may be static and/or variably embossed and/or
imaged (e.g., static and/or variably imaged) to enable a single
print run to produce custom and/or different forms for different
customers, recipients, etc. In some examples, the forms may be
embossed and/or imaged with a number, a recipient's name, a
company's name, advertising material and/or any other indicia. The
embossed area may be ink tipped to visually differentiate the
embossed area from the rest of the form.
[0019] In some examples, the forms are produced by mating paper
web(s) and polystyrene (poly) web(s) and cutting, creasing,
scoring, folding and/or gluing one or more of the webs before
and/or after the webs are mated. In some examples, the paper web is
wider than the poly web. The paper web may be variably imaged on a
first side and adhesive and/or paste may be applied to
approximately one half of the first side (e.g., over the imaging)
to enable the poly web to be adhered to the first side of the paper
web and for the poly web to cover half of the first side of the
paper web (e.g., over the imaging).
[0020] In some examples, the mated webs travel through an embosser
(e.g., opposing rollers) where a portion of the mated webs is
embossed with, for example, a number (e.g., static fictitious
credit card numbers, a variable number), a company's name or any
other indicia. In some examples, the embossed portion corresponds
to the front of the form and/or to one half of the poly web. The
embossed area may be ink tipped (e.g., U.V. ink tipped) and
cured.
[0021] In some examples, adhesive and/or paste is applied to
approximately one half of a second side of the paper web and the
webs are folded in half to couple the second side of the paper
substrate together. In some examples, adhesive and/or paste is then
applied to approximately one half of the first side of the paper
web (e.g., the half of the first side without the poly) and the
webs are folded in half such that the first side of the paper web
is coupled together and the poly web forms the front and back
surfaces of the form. In some examples, the folded webs are die cut
to round the corners of the form and/or perforations are added to
enable the form to be easily removed from a waste matrix. The
completed forms may then be glued to a carrier and/or another web
and/or packaged for shipment. The example form may be a card, a
sponsorship and/or luggage tag, a card and key tag, an ornament,
etc.
[0022] While the above-example describes the first substrate as
being a paper web and the second substrate as being a poly web, the
substrates may be any other suitable material such as, for example,
a plastic and/or Polyethylene terephthalate (PET) web and a poly
web. In such examples, the plastic web may include a plurality of
tags (e.g., RFID tags) coupled thereto. Thus, the cards and/or
forms produced may include an internal tag and/or intelligent
functionality.
[0023] FIG. 1 represents an example apparatus 100 that can be used
to implement the processes disclosed herein to produce the example
cards, tags, forms, etc. In some examples, the apparatus 100 may be
an in-line process and includes first, second and third substrate
movers 102, 103, 104; an imager (e.g., a variable imager) 106;
gluers 108, 110, 112, 114; maters 116, 118; an embosser (e.g., a
static embosser) 120; a U.V. ink tipper 122; a curer 124; folders
126, 128; and a cutter 130. While the stations and/or portions
102-130 of the apparatus 100 are depicted in a particular order,
the stations and/or portions 102-130 may be arranged differently.
While the apparatus 100 is depicted as having the gluers 110, 112
being separate from the folders 126, 128, in other examples, the
gluer(s) and the folding station(s) may be combined.
[0024] In some examples, during operation, the first substrate
mover 102 feeds one or more pieces of first substrate and/or a web
of first substrate 132 into the apparatus 100. In some examples,
the imager 106 images a first side of the first substrate 132. The
images may include personal information (e.g., a name, an address,
etc.), brand-related images and/or text, advertisement related
images and/or text, instructional images and/or text, etc. However,
in other examples, the apparatus 100 does not include the imager
106 and, thus the first substrate 132 is imaged at a different
location (e.g., the first substrate 132 is pre-imaged) and/or the
first substrate 132 is not imaged.
[0025] The first gluer 108 may apply glue to a first portion of the
first surface and the mater 116 may mate the first surface portion
with a second substrate 134 such that the first and second
substrates 132, 134 are coupled. In some examples, the second
substrate 134 is fed to the mater 116 by the second substrate mover
103. In some examples, the first substrate 132 is paper,
Polyethylene terephthalate (PET) and/or plastic and the second
substrate 134 is poly and/or any other type of film. The embosser
120 receives and embosses the mated webs of the substrates 132,
134. In some examples, the embosser 120 is a static embosser that
embosses a name, a number, etc. on the mated webs of the substrates
132, 134. However, in other examples, the embosser 120 is a
variable embosser. The U.V. ink tipper 122 may apply ink to the
embossed area and the curer 124 may cure the ink. In some examples,
ink tipping the embossed area enables the embossed area to be
visually differentiated from the surrounding substrate.
[0026] The second gluer 110 may apply glue to a second surface of
the first substrate 132 and the first folder 126 may fold the first
substrate 132 in half along a first fold such that the second
surface of the first substrate 132 is coupled together and the
second substrate 134 is on a first side of the fold (e.g., the
first folder 126 folds the first substrate 132 in half along the
first fold where the first fold is adjacent an edge of the second
substrate 134). The second gluer 112 may then apply glue to a
second portion of the first surface of the first substrate 132 and
the second folder 128 may fold the substrates 132, 134 in half
along a second fold line such that the first surface of the first
substrate 132 is coupled together and the second substrate 134
forms outward facing surfaces of the card, tag and/or form being
produced. In some examples, the second fold line may be
substantially parallel to the first fold line. As used herein, the
phrase substantially parallel means between about ten degrees of
parallel and/or accounts for manufacturing tolerances. In some
examples, the second substrate 134 forms an exterior surface (e.g.,
a back surface, a front surface) and/or layers of the produced
card, tag and/or form and the first substrate 132 forms interior
surfaces and/or layers of the produced card, tag and/or form.
[0027] The cutter 130 may round the corners of the card, tag and/or
form being produced, add one or more lines of weakness to the card,
tag and/or form and/or cut and/or remove a waste matrix surrounding
the card, tag and/or form being produced. In some examples, the
gluer 114 may apply glue to a back surface of the completed card,
tag and/or form (e.g., the smooth back surface opposite the
embossed front surface) and the mater 118 may mate the completed
card, tag and/or form with a third substrate 136. The third
substrate 136 may be a carrier web used to produce a mailer, a
mailer insert, a form, etc.
[0028] FIGS. 2-12 depict different views during a fabrication
process to produce an example card 1200 in accordance with the
teachings of this disclosure. FIG. 2 depicts glue 202 applied to a
first portion 203 of a first surface 204 of the first substrate 132
and the second substrate 134 about to be coupled to the first
portion 203. FIG. 3 depicts the first and second substrate 132, 134
after the first and second substrates 132, 134 are coupled and/or
mated and FIG. 4 shows the embosser 120 embossing part of the first
portion 203 such that an embossed area 402 protrudes from the
second substrate 134. FIG. 5 shows the U.V. ink tipper 122 applying
ink to the embossed area 402 to enable the embossed area 402 to be
visually differentiated from the second substrate 134 surrounding
the embossed area 402.
[0029] FIG. 6 shows glue 602 applied to a second surface 604 of the
first substrate 132 and the first substrate 132 being folded about
a first fold 606 such that the first portion 203 of the first
substrate 132 is coupled to a second portion 608 of the first
substrate 132 and an indentation 610 formed by the embossed area
402 is covered by the second portion 608. FIG. 7 shows the first
and second portions 203, 608 coupled together and the embossed area
402.
[0030] FIG. 8 shows glue 802 applied to the second portion 608 of
the first surface 204 and the first and second substrates 132, 134
being folded about a second fold 804 such that a first half 806 of
the second portion 608 is coupled to a second half 808 of the
second portion 608. FIG. 9 shows a first and/or non-embossed side
902 of a form 904 and FIG. 10 shows a second and/or embossed side
1002 of the form 904 where the form 904 is to be die-cut to form
the card 1200. FIG. 11 shows a waste matrix 1102 that surrounds the
card 1200 prior to removal and FIG. 12 shows the card 1200
produced. As shown in FIG. 12, the card 1200 has first, second,
third and fourth internal plies 1202, 1204, 1206, 1208 formed from
the first substrate 132 and first and second external plies 1210,
1212 formed from the second substrate 134. In other examples, the
card 1200 may have any number of internal plies and/or any number
of external plies.
[0031] FIGS. 13 and 14 depict an example card and/or form 1300 in
accordance with the teachings of this disclosure. In the
illustrated example, the card 1300 includes first, second, third
and fourth paper plies 1302, 1304, 1306, 1308 positioned between
first and second poly plies 1310, 1312. While the example card 1300
is described as having four paper plies and two poly plies, the
example forms disclosed herein may have any other number of paper
plies (e.g., 1, 2, 3, 5, etc.) and/or poly plies (e.g., 1, 3, 4,
etc.).
[0032] As discussed above, the card 1300 is formed by mating the
paper web and/or the first substrate 132 and the poly web and/or
the second substrate 134 and folding the mated webs of the
substrates 132, 134 such that the poly web and/or the second
substrate 134 forms the poly plies 1310, 1312 and the paper web
and/or the first substrate 132 forms the paper plies 1302, 1304,
1306, 1308. During the first folding process performed by the first
folder 126, the first paper ply 1302 is coupled to the second paper
ply 1304 and the third paper ply 1306 is coupled to the fourth
paper ply 1308. During the second folding process performed by the
second folder 128, the second paper ply 1304 is coupled to the
third paper ply 1306.
[0033] As shown in FIGS. 13 and 14, a first surface 1314 of the
first paper ply 1302 includes imaging 1316 and the first paper and
poly plies 1302, 1310 includes an embossed area 1318. Because the
webs and/or the substrates 132, 134 are embossed prior to folding,
no indentations are present on the second poly ply 1312. In
examples in which the cards 1300 are packaged by stacking one card
on top of the other, the second poly ply 1312 not having static
embossing indentations prevents the cards 1300 from sticking to one
another and/or being coupled together. In some examples, not having
indentations on the back surface of the card 1300 opposite the
embossed front surface enables the back surface to relatively
easily receive indicia, be printed on and/or be viewed after
embossing the front surface.
[0034] FIGS. 15 and 16 depict an example card 1500 in accordance
with the teachings of this disclosure. In the illustrated example,
the card 1500 includes first, second, third and fourth paper plies
1502, 1504, 1506, 1508 positioned between first and second poly
plies 1510, 1512. In some examples, corners 1520, 1522, 1526, 1528
of the card 1500 are formed by die cutting and perforations 1518,
1519 are added to the card 1500 to enable an example sponsorship
tag 1514 to be removed from a surrounding waste matrix 1516 and/or
to define an aperture. As shown in FIG. 15, a first surface 1530 of
the first paper ply 1502 includes imaging 1532 and the first paper
and poly plies 1502, 1510 include an embossed area 1534.
[0035] FIGS. 17 and 18 depict an example ornament and/or form 1700
in accordance with the teachings of this disclosure. In the
illustrated example, the ornament 1700 includes first, second,
third and fourth paper plies 1702, 1704, 1706, 1708 positioned
between first and second poly plies 1710, 1712. In some examples,
to enable the example ornament 1700 to be hung, a perforation 1714
is added to the ornament 1700 to define a cutout 1715. In some
examples, a perimeter surface 1716 is formed by die cutting. As
shown in FIG. 17, a first surface 1718 of the first paper ply 1702
includes imaging 1720 and the first paper and poly plies 1702, 1710
include an embossed area 1722. In this example, the imaging 1720
identifies a family name and the embossed area 1722 identifies a
name of a company.
[0036] FIGS. 19 and 20 depict an example luggage tag and/or form
1900 in accordance with the teachings of this disclosure. In the
illustrated example, the tag 1900 includes first, second, third and
fourth paper plies 1902, 1904, 1906, 1908 positioned between first
and second poly plies 1910, 1912. In some examples, to enable the
example tag 1900 to be coupled to a piece of luggage, a perforation
1913 defines a cutout 1914.
[0037] As shown in FIG. 19, a first surface 1918 of the first paper
ply 1902 includes imaging 1920 and the first paper and poly plies
1902, 1910 include an embossed area 1922. In this example, the
imaging 1920 is used to include personal information on the tag
(e.g., a person's name, etc.) and the embossed area 1922 identifies
a name of a company.
[0038] FIGS. 21 and 22 depict an example card and/or form 2100 in
accordance with the teachings of this disclosure. In the
illustrated example, the form 2100 includes first, second, third
and fourth paper plies 2102, 2104, 2106, 2108 positioned between
first and second poly plies 2110, 2112. In this example, the form
2100 includes a card 2114 and a tag 2116. To enable the card 2114
and the tag 2116 to be removed from a surrounding waste matrix
2118, the form 2100 defines perforations 2120, 2122.
[0039] As shown in FIG. 21, a first surface 2124 of the first paper
ply 2102 includes imaging 2126, 2127 and the first paper and poly
plies 2102, 2110 include an embossed area 2128, 2130. In this
example, the imaging 2126, 2127 is used to include personal
information on the form (e.g., a person's name, etc.) and/or a
barcode and the embossed area 2128, 2130 identifies a name of a
company.
[0040] FIG. 23 depicts an example flow diagram representative of a
process that may be implemented using, for example, computer
readable instructions that may be carried out in conjunction with
paper processing equipment such as die cutters, web presses, etc.
to produce the forms disclosed herein and/or any other of the
examples disclosed herein. The example processes of FIG. 23 may be
performed using a processor, a controller and/or any other suitable
processing device. For example, the example processes of FIG. 23
may be implemented using coded instructions (e.g., computer
readable instructions) stored on a tangible computer readable
medium such as a flash memory, a read-only memory (ROM), and/or a
random-access memory (RAM). As used herein, the term tangible
computer readable medium is expressly defined to include any type
of computer readable storage and to exclude propagating signals.
Additionally or alternatively, the example process of FIG. 23 may
be implemented using coded instructions (e.g., computer readable
instructions) stored on a non-transitory computer readable medium
such as a flash memory, a read-only memory (ROM), a random-access
memory (RAM), a cache, or any other storage media in which
information is stored for any duration (e.g., for extended time
periods, permanently, brief instances, for temporarily buffering,
and/or for caching of the information). As used herein, the term
non-transitory computer readable medium is expressly defined to
include any type of computer readable medium and to exclude
propagating signals.
[0041] Alternatively, some or all of the example processes of FIG.
23 may be implemented using any combination(s) of application
specific integrated circuit(s) (ASIC(s)), programmable logic
device(s) (PLD(s)), field programmable logic device(s) (FPLD(s)),
discrete logic, hardware, firmware, etc. Also, some or all of the
example processes of FIG. 23 may be implemented manually or as any
combination(s) of any of the foregoing techniques, for example, any
combination of firmware, software, discrete logic and/or hardware.
Further, although the example processes of FIG. 23 are described
with reference to the flow diagram of FIG. 23, other methods of
implementing the processes of FIG. 23 may be employed. For example,
the order of execution of the blocks may be changed, and/or some of
the blocks described may be changed, eliminated, sub-divided, or
combined. Additionally, any or all of the example processes of FIG.
23 may be performed sequentially and/or in parallel by, for
example, separate processing threads, processors, devices, discrete
logic, circuits, etc.
[0042] FIG. 23 represents an example method of producing the
examples disclosed herein. While the processes of the method are
depicted as being performed sequentially, one or more of the
processes may be performed in parallel, for example. The process
may begin by unwinding a substrate and/or paper substrate from a
roll and/or moving one or more pieces of the paper substrate into a
press and toward an imager that images the paper substrate (blocks
2302, 2304). In some examples, the imager images a portion of a
first side of the paper substrate. The images may include
brand-related images and/or text, instructional images and/or text,
personal information, a barcode, etc. In some examples, glue and/or
paste may be applied to the imaged portion and/the first side of
the paper substrate and a poly web and/or substrate may be mated
therewith (blocks 2306, 2308). In some such examples, the poly
substrate covers approximately one half of the paper substrate
(e.g., over the glued portion) and the glue is substantially clear
when dried.
[0043] In some examples, the mated substrates may pass through an
embosser that embosses the mated substrates. (block 2310). The
embosser may be a static embosser and/or a variable embosser that
embosses a number(s), a name(s), etc. on a portion of the
substrates. In some examples, the embossed area is ink tipped and
cured. (blocks 2312, 2314). The ink tipping enables the embossed
area to stand out and/or be more visible.
[0044] In some examples, paste and/or glue is applied to a second
side of the paper substrate (e.g., opposite the side where the poly
substrate is coupled) and then the paper substrate is folded in
half such that the second side of the paper substrate is coupled
together. (blocks 2316, 2318). In some examples, paste and/or glue
is then applied to the first side of the paper substrate (e.g., the
half of the first side not covered by the poly substrate) and then
the paper and poly substrates are folded in half such that the
first side of the paper substrate is coupled together and the poly
substrate forms the front and the back of the form. (blocks 2320,
2322).
[0045] In some examples, to complete the process of producing the
example form, a die cutter may cut the form from a surrounding
matrix and/or produce one or more lines of weakness through the
form. (block 2324). In some examples, the lines of weakness are
perforations that define a cutout. The forms produced may then be
mated with another web and/or carrier web using paste and/or glue
(blocks 2326, 2328). The carrier web may be used to form a mailer,
a mailer insert, a form, etc.
[0046] FIG. 24 represents an example apparatus 2400 that can be
used to implement the processes disclosed herein to produce the
example cards, tags, forms, etc. In some examples, the apparatus
2400 may be an in-line process and includes first, second and third
substrate movers 2402, 2404, 2406; an imager (e.g., a variable
imager) 2408; an embosser 2410; folders 2412, 2414; maters 2416,
2418; a fuser 2420; cutters 2421, 2422; and a gluer 2424. While the
stations and/or portions 2402-2424 of the apparatus 2400 are
depicted in a particular order, the stations and/or portions
2402-2424 may be arranged differently and/or one or more of the
stations and/or portions 2402-2424 may be removed and/or
combined.
[0047] In some examples, during operation, the first substrate
mover 2402 feeds one or more pieces of first substrate and/or a web
of first substrate 2426 into the apparatus 2400. In some examples,
the first substrate 2426 is PET and/or any other suitable type of
plastic that may or may not have intelligent inlays coupled
thereto. In examples in which the first substrate 2426 includes
inlays (e.g., RFID tags, NFC tags) coupled thereto, the cutter 2421
may die cut the first substrate to form a plurality of holes and/or
apertures into which the chips of the inlays are to be positioned
after the first substrate 2426 is folded during the production
process to enable the form and/or card produced to be substantially
flat, have a substantially consistent thickness and/or not have a
bulge formed by the inlay. In some examples, the imager 2408 images
a first side of the first substrate 2426. The images may include
personal information (e.g., a name, an address, etc.),
brand-related images and/or text, advertisement related images
and/or text, instructional images and/or text, etc. However, in
other examples, the apparatus 2400 does not include the imager 2408
and, thus the first substrate 2426 is imaged at a different
location (e.g., the first substrate 2426 is pre-imaged) and/or the
first substrate 2426 is not imaged.
[0048] The embosser 2410 receives and embosses the first substrate
2426. In some examples, the embosser 2410 is a static embosser that
embosses a name, a number, etc. on the first substrate 2426. In
other examples, the embosser 2410 is a variable embosser that
embosses text (e.g., a person's name) and/or a variable number
(e.g., a credit card number) on the first substrate 2426.
[0049] The first folder 2412 may fold the first substrate 2426 in
half along a first fold such that a second surface of the first
substrate 132 is immediately adjacent each other. The second folder
2414 may fold the first substrate 2426 in half along a second fold
line such that the first surface of the first substrate 2426 is
immediately adjacent each other. The mater 2416 may mate a second
substrate (e.g., poly) 2428 with the opposing exterior surfaces of
the folded first substrate 2426 and the fuser 2420 may fuse the
substrates 2426, 2428 together to form a card, tag and/or form. In
some examples, the fuser 2420 heat fuses and/or plastic welds the
substrates 2426, 2428 together.
[0050] The cutter 2422 may round the corners of the card, tag
and/or form being produced, add one or more lines of weakness to
the card, tag and/or form and/or cut and/or remove a waste matrix
surrounding the card, tag and/or form being produced. In some
examples, the gluer 2424 may apply glue to a back surface of the
completed card, tag and/or form (e.g., the smooth back surface
opposite the embossed front surface) and the mater 2418 may mate
the completed card, tag and/or form with a third substrate 2430.
The third substrate 2430 may be a carrier web used to produce a
mailer, a mailer insert, a form, etc.
[0051] FIGS. 25-35 depict different views during a fabrication
process to produce an example card 3500 in accordance with the
teachings of this disclosure. FIG. 25 depicts the first substrate
2426 and FIG. 26 shows the embosser 120 an embossed area 2602 part
of a first portion 2604 of the first substrate 2604 such that the
embossed area 2602 protrudes from a first side 2606 of the first
substrate 2426.
[0052] FIG. 27 shows the first substrate 2426 being folded about a
first fold 2702 such that the first portion 2604 of the first
substrate 2426 is adjacent to a second portion 2704 of the first
substrate 2426 and an indentation 2706 formed by the embossed area
2602 is covered by the second portion 2704. FIG. 28 shows the first
and second portions 2604, 2704 immediately adjacent one another and
the embossed area 2602.
[0053] FIG. 29 shows the first substrate 2426 being folded about a
second fold 2902 such that a first half 2904 of the second portion
2704 is adjacent a second half 2906 of the second portion 2704.
FIG. 30 shows a first and/or non-embossed side 3002 of a form 3004
and FIG. 31 shows a second and/or embossed side 3102 of the form
3004 where the form 3004 is to be die-cut to form the card 3500.
FIG. 32 shows a first portion 3202 of the second substrate 2428
coupled to the first and/or non-embossed side 3002 of the first
substrate 2426 and FIG. 33 shows a second portion 3302 of the
second substrate 2428 coupled to the second and/or embossed side
3102 of the first substrate 2426.
[0054] FIG. 34 shows a waste matrix 3400 that surrounds the card
3500 prior to removal and FIG. 35 shows the card 3500 produced. As
shown in FIG. 35, the card 3500 has first, second, third and fourth
internal plies 3502, 3504, 3506, 3508 formed from the first
substrate 2426 and first and second external plies 3510, 3512
formed from the second substrate 2428. In other examples, the card
3500 may have any number of internal plies and/or any number of
external plies. For example, in some examples, the card 3500 does
not include the external 3510, 3512. In such examples, the card
3500 is made of the first substrate 2426.
[0055] FIG. 36 depicts an example flow diagram representative of a
process that may be implemented using, for example, computer
readable instructions that may be carried out in conjunction with
paper processing equipment such as die cutters, web presses, etc.
to produce the forms disclosed herein and/or any other of the
examples disclosed herein. The example processes of FIG. 36 may be
performed using a processor, a controller and/or any other suitable
processing device. For example, the example processes of FIG. 36
may be implemented using coded instructions (e.g., computer
readable instructions) stored on a tangible computer readable
medium such as a flash memory, a read-only memory (ROM), and/or a
random-access memory (RAM). As used herein, the term tangible
computer readable medium is expressly defined to include any type
of computer readable storage and to exclude propagating signals.
Additionally or alternatively, the example process of FIG. 36 may
be implemented using coded instructions (e.g., computer readable
instructions) stored on a non-transitory computer readable medium
such as a flash memory, a read-only memory (ROM), a random-access
memory (RAM), a cache, or any other storage media in which
information is stored for any duration (e.g., for extended time
periods, permanently, brief instances, for temporarily buffering,
and/or for caching of the information). As used herein, the term
non-transitory computer readable medium is expressly defined to
include any type of computer readable medium and to exclude
propagating signals.
[0056] Alternatively, some or all of the example processes of FIG.
36 may be implemented using any combination(s) of application
specific integrated circuit(s) (ASIC(s)), programmable logic
device(s) (PLD(s)), field programmable logic device(s) (FPLD(s)),
discrete logic, hardware, firmware, etc. Also, some or all of the
example processes of FIG. 36 may be implemented manually or as any
combination(s) of any of the foregoing techniques, for example, any
combination of firmware, software, discrete logic and/or hardware.
Further, although the example processes of FIG. 36 are described
with reference to the flow diagram of FIG. 36, other methods of
implementing the processes of FIG. 36 may be employed. For example,
the order of execution of the blocks may be changed, and/or some of
the blocks described may be changed, eliminated, sub-divided, or
combined. Additionally, any or all of the example processes of FIG.
36 may be performed sequentially and/or in parallel by, for
example, separate processing threads, processors, devices, discrete
logic, circuits, etc.
[0057] FIG. 36 represents an example method of producing the
examples disclosed herein. While the processes of the method are
depicted as being performed sequentially, one or more of the
processes may be performed in parallel, for example. The process
may begin by unwinding a first substrate and/or plastic/PET
substrate from a roll and/or moving one or more pieces of the
plastic and/or PET substrate into a press and toward a cutter that
forms chip receiving apertures in the first substrate and an imager
that images the plastic substrate (blocks 3602, 3604). In some
examples, the imager images a portion of a first side of the first
substrate. The images may include brand-related images and/or text,
instructional images and/or text, personal information, a barcode,
etc.
[0058] In some examples, the first substrate passes through an
embosser that embosses the first substrate. (block 3606). The
embosser may be a static embosser and/or a variable embosser that
embosses a number(s), a name(s), etc. on a portion of the
substrate.
[0059] In some examples, the first substrate is folded in half such
that the second side of the first substrate is immediately adjacent
one another. (block 3608). In some examples, the first substrate is
folded in half again such that the first side of the first
substrate is immediately adjacent one another. (block 3610).
[0060] In some examples, the first substrate is mated with the
second substrate and/or the poly web and the first and substrates
are coupled together. (blocks 3612, 3614). In some examples, the
second substrate includes a bar code, a magnetic strip, etc. to
enable, for example, the card produced to be used as a credit card,
an access card, an identification card and, more generally, to
include and/or convey information. In some examples, the substrates
are coupled together by fusing the layers of the first substrate
together and/or fusing the first and second substrates together. In
some examples, to complete the process of producing the form, a die
cutter may cut the form from a surrounding matrix and/or produce
one or more lines of weakness through the form. (block 3616). In
some examples, the lines of weakness are perforations that define a
cutout. The forms produced may then be mated with another web
and/or carrier web using paste and/or glue (blocks 3618, 3620). The
carrier web may be used to form a mailer, a mailer insert, a form,
etc.
[0061] FIG. 37 depicts an example substrate 3700 that can be used
to produce the example card 3500. As shown, the substrate 3700
includes the fold lines 2702, 2902, inlays 3704 and apertures 3706.
In practice, once the substrate 3700 is folded about the fold line
2702, chips 3708 of the inlays 3704 are received within the
apertures 3706 to substantially ensure the card 3500 produced has a
substantially consistent thickness and/or to substantially prevent
the chips 3708 from being damaged (e.g., the chips 3708 are
substantially housed within the respective aperture 3706, thereby
protecting the chips 3708). In examples in which the chips 3708 are
relatively thick and/or thicker than the substrate 3700, more than
one aperture 3706 may be defied such that when the substrate 3700
is folded about the fold line 2702, the respective chips 3708 are
received in two or more apertures 3706.
[0062] FIG. 38 is a block diagram of an example processor platform
3800 capable of executing the instructions of FIGS. 23, 36 to
implement the apparatus 100 of FIGS. 1, 24. The processor platform
3800 can be, for example, a server or any other type of computing
device.
[0063] The processor platform 3800 of the illustrated example
includes a processor 3812. The processor 3812 of the illustrated
example is hardware. For example, the processor 3812 can be
implemented by one or more integrated circuits, logic circuits,
microprocessors or controllers from any desired family or
manufacturer.
[0064] The processor 3812 of the illustrated example includes a
local memory 3813 (e.g., a cache). The processor 3812 of the
illustrated example is in communication with a main memory
including a volatile memory 3814 and a non-volatile memory 3816 via
a bus 3818. The volatile memory 3814 may be implemented by
Synchronous Dynamic Random Access Memory (SDRAM), Dynamic Random
Access Memory (DRAM), RAMBUS Dynamic Random Access Memory (RDRAM)
and/or any other type of random access memory device. The
non-volatile memory 3816 may be implemented by flash memory and/or
any other desired type of memory device. Access to the main memory
3814, 3816 is controlled by a memory controller.
[0065] The processor platform 3800 of the illustrated example also
includes an interface circuit 3820. The interface circuit 3820 may
be implemented by any type of interface standard, such as an
Ethernet interface, a universal serial bus (USB), and/or a PCI
express interface.
[0066] In the illustrated example, one or more input devices 3822
are connected to the interface circuit 3820. The input device(s)
3822 permit a user to enter data and commands into the processor
3812. One or more output devices 3824 are also connected to the
interface circuit 3820 of the illustrated example. The interface
circuit 3820 of the illustrated example, thus, typically includes a
graphics driver card.
[0067] The interface circuit 3820 of the illustrated example also
includes a communication device such as a transmitter, a receiver,
a transceiver, a modem and/or network interface card to facilitate
exchange of data with external machines (e.g., computing devices of
any kind) via a network 3826 (e.g., an Ethernet connection, a
digital subscriber line (DSL), a telephone line, coaxial cable, a
cellular telephone system, etc.).
[0068] The processor platform 3800 of the illustrated example also
includes one or more mass storage devices 3828 for storing software
and/or data. Examples of such mass storage devices 3828 include
floppy disk drives, hard drive disks, compact disk drives, Blu-ray
disk drives, RAID systems, and digital versatile disk (DVD)
drives.
[0069] The coded instructions 3832 of FIGS. 23, 36 may be stored in
the mass storage device 3828, in the volatile memory 3814, in the
non-volatile memory 3816, and/or on a removable tangible computer
readable storage medium such as a CD or DVD.
[0070] From the foregoing, it will appreciated that the above
disclosed methods, apparatus and articles of manufacture relate to
forms and/or forms produced in an in-line process. In some
examples, the example forms are produced using a roll of paper that
is folded and/or glued one or more times. In other examples, the
example forms are produced using a roll of plastic (e.g., PET,
plastic film) that is folded and/or fused one or more time times.
In example in which the forms are produced using plastic, an inlay
and/or tag (e.g., and RFID inlay, an NFC inlay) may be internally
positioned within the card produced and/or positioned on and/or
carried by the plastic web. Making intelligent cards (e.g., cards
including RFID and/or NFC inlays) using an in-line process may
significantly reduce the cost of producing such cards.
[0071] In examples in which the example plastic cards are produced
without an embedded tag, the example cards may be produced by using
a roll of film material that is folded and/or fused. In some such
examples, the film is a white material and/or imaged with digital,
flexographic, offset and/or other static and/or variable printing
technologies. In some examples, an exterior layer of film (e.g.,
poly film) may be coupled and/or fused to the folded PET layers to
substantially protect the imaged data, for example.
[0072] In examples in which the plastic cards are produced with an
embedded tag and/or intelligent functionality (e.g., RFID tag, NFC
tag and/or another functional component(s)), the example cards are
produced with a roll of film having inlays and/or tags positioned
thereon where the film is folded and/or fused. In some examples,
the inlays and/or tags are positioned on the PET film by printing
and/or imaging an antenna on the film and then positioning a chip
adjacent the antenna. In some examples, to substantially prevent
deformation and/or damage of the card including the intelligent
functionality (e.g., RFID tag, NFC tag), the PET film may be die
cut to form an aperture into the chip of the tag is received after
the PET film is folded.
[0073] An example method includes moving a first substrate in a
direction, the first substrate including a first side opposite a
second side; applying adhesive to a first portion of the first
side, the first portion being spaced apart from a second portion of
the first side; mating a second substrate with the first portion;
applying adhesive to a third portion of the second side, the third
portion being spaced apart from a fourth portion of the second
side; folding the first substrate about a first fold line to couple
the third portion to the fourth portion; applying adhesive to a
fifth portion of the second portion, the fifth portion being spaced
apart from a sixth portion of the second portion; and folding the
first substrate and the second substrate about a second fold line
to couple the fifth portion and the sixth portion and to position
the first substrate between the second substrate.
[0074] In some examples, the method includes prior to applying
adhesive to the first portion, imaging the first portion. In some
examples, the method includes prior to folding the first substrate
about the first fold line, embossing the first substrate and the
second substrate. In some examples, the second substrate includes
an eighth portion and a ninth portion, the first substrate being
positioned between the eighth portion and the ninth portion, the
eight portion including the embossing and the ninth portion being
non-embossed. In some examples, the method includes ink tipping the
embossing.
[0075] In some examples, the folding the first substrate and the
second substrate about the second fold line is to produce a
multi-layer form. In some example, the multi-layer form includes at
least one of a card, a tag, an ornament, or a card and key tag. In
some examples, the method includes mating the multi-layer form with
a third substrate. In some examples, the third substrate includes a
carrier web. In some examples, the method includes forming one or
more lines of weakness in the multi-layer form. In some examples,
the one or more lines of weakness define a removable portion. In
some examples, the method includes die-cutting the first and second
substrates to separate the multi-layer form from a surrounding
waste matrix. In some examples, the first substrate includes paper
and the second substrate includes polystyrene. In some examples,
the method includes an in-line process.
[0076] An example apparatus includes a first substrate first layer
including a first side and a second side; a second substrate first
layer including a third side and a fourth side, the second side
coupled to the third side, the first substrate first layer and the
second substrate first layer being embossed; a second substrate
second layer including a fifth side and a sixth side, the fourth
side coupled to the fifth side; a first substrate second layer
including a seventh side and an eighth side, the seventh side
coupled to the sixth side, the first substrate second layer and the
second substrate second layer not being embossed.
[0077] In some examples, the third side includes imaging. In some
examples, the apparatus includes a line of weakness through the
first and second substrate first layers and the first and second
substrate second layers to define a card surrounded by a waste
matrix. In some examples, the apparatus includes a line of weakness
through the first and second substrate first layers and the first
and second substrate second layers to define a removable portion.
In some examples, the embossing of the first substrate first layer
is ink tipped. In some examples, the first substrate includes
plastic. In some examples, the first substrate includes an
inlay.
[0078] An example method includes moving a first substrate in a
direction, the first substrate including a first side opposite a
second side, the first side having a first portion and a second
portion, the second portion having a first sub-portion and a second
sub-portion, the second side having a third portion and a fourth
portion; applying adhesive to the first portion of the first side;
mating a second substrate with the first portion of the first side;
applying adhesive to the third portion of the second side; folding
the first substrate about a first fold line to couple the third
portion to the fourth portion; applying adhesive to the first
sub-portion of the second portion; and folding the first substrate
and the second substrate about a second fold line to couple a face
of the first sub-portion and a face of the second sub-portion and
to position the first substrate between the second substrate.
[0079] In some examples, the method includes, prior to applying
adhesive to the first portion, imaging the first portion. In some
examples, the method includes prior to folding the first substrate
about the first fold line, embossing the first substrate and the
second substrate to enable the first substrate and the second
substrate to include indicia. In some examples, the second
substrate includes a fifth portion and a sixth portion, the first
substrate being positioned between the fifth portion and the sixth
portion, the fifth portion including the embossing and the sixth
portion being non-embossed. In some examples, the method includes
ink tipping the embossing. In some examples, the folding the first
substrate and the second substrate about the second fold line is to
produce a multi-layer form. In some examples, the multi-layer form
includes at least one of a card, a tag, an ornament, or a card and
key tag. In some examples, the method includes mating the
multi-layer form with a third substrate, prior to folding the first
substrate about the first fold line, the multi-layer form not being
mated to the third substrate. In some examples, the third substrate
includes a carrier web.
[0080] In some examples, the method includes forming one or more
lines of weakness in the multi-layer form. In some examples, the
one or more lines of weakness define a removable portion. In some
examples, the method includes die-cutting the first and second
substrates to separate the multi-layer form from a surrounding
waste matrix, after the multi-layer form is separated from the
surrounding waste matrix, a perimeter of the multi-layer form is
free of any fold lines. In some examples, the first substrate
includes paper and the second substrate includes polystyrene. In
some examples, the method includes an in-line process. In some
examples, the method includes forming a line of weakness through
the first and second substrates to define a card surrounded by a
waste matrix. In some examples, the first substrate includes
plastic. In some examples, the method includes inlaying the first
substrate.
[0081] Although certain example methods, apparatus and articles of
manufacture have been described herein, the scope of coverage of
this patent is not limited thereto. On the contrary, this patent
covers all methods, apparatus and articles of manufacture fairly
falling within the scope of the claims of this patent.
* * * * *