U.S. patent application number 15/171921 was filed with the patent office on 2016-12-29 for communication module and method of manufacturing communication module.
The applicant listed for this patent is ALPS ELECTRIC CO., LTD.. Invention is credited to Ken MIURA.
Application Number | 20160381784 15/171921 |
Document ID | / |
Family ID | 57601573 |
Filed Date | 2016-12-29 |
United States Patent
Application |
20160381784 |
Kind Code |
A1 |
MIURA; Ken |
December 29, 2016 |
COMMUNICATION MODULE AND METHOD OF MANUFACTURING COMMUNICATION
MODULE
Abstract
A communication module includes a flexible board having a first
region, a second region, and a third region located between the
first region and the second region, a communication circuit
including a communication electronic component mounted on one
surface of the first region, an antenna dielectric mounted on a
portion of one surface of the second region, a matching circuit
including a matching electronic component mounted on another
portion of the one surface of the second region, and an antenna
including a metal pattern formed in the other surface of the second
region, the matching circuit matches the antenna with the
communication circuit, the communication circuit is sealed with a
resin, the third region is folded, and the resin and the antenna
dielectric are brought into contact with each other.
Inventors: |
MIURA; Ken; (Miyagi-ken,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ALPS ELECTRIC CO., LTD. |
Tokyo |
|
JP |
|
|
Family ID: |
57601573 |
Appl. No.: |
15/171921 |
Filed: |
June 2, 2016 |
Current U.S.
Class: |
343/860 |
Current CPC
Class: |
H05K 1/16 20130101; H05K
1/028 20130101; H01Q 9/42 20130101; H05K 1/025 20130101; H05K
2201/055 20130101; H05K 1/0224 20130101; H05K 2201/10098 20130101;
H01Q 1/243 20130101; H05K 2201/042 20130101; H05K 2203/1316
20130101; H01Q 1/38 20130101; H05K 2201/056 20130101; H05K 1/0243
20130101 |
International
Class: |
H05K 1/02 20060101
H05K001/02; H05K 3/30 20060101 H05K003/30; H01Q 1/50 20060101
H01Q001/50; H01Q 1/38 20060101 H01Q001/38 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 26, 2015 |
JP |
2015-128556 |
Claims
1. A communication module, comprising: a flexible board having a
first surface and a second surface opposite to the first surface,
the flexible board including a first region, a second region, and a
third region located between the first region and the second
region; an antenna including a metal pattern formed on the second
surface of the second region; a communication circuit including a
communication electronic component mounted on the first surface of
the first region, the communication circuit being sealed with a
resin: an antenna dielectric mounted on a portion of the first
surface of the second region; and a matching circuit including a
matching electronic component mounted on another portion of the
first surface of the second region, the matching circuit being
configured to match the antenna with the communication circuit,
wherein the flexible board is folded at the third region such that
the resin and the antenna dielectric are brought into contact with
each other.
2. The communication module according to claim 1, wherein the resin
and the antenna dielectric are adhered to each other by an adhesive
provided therebetween.
3. The communication module according to claim 1, wherein the
flexible board further includes a forth region extending from the
second region, a fifth region extending from one side of the first
region, and a sixth region extending from another side of the first
region, the flexible board being folded such that an outer shape of
the communication module has is a rectangular parallelepiped, all
of surfaces constituting the rectangular parallelepiped are formed
with the second surface of the flexible board, and wherein the
communication module further comprising: a ground pattern formed on
all of the side surfaces of the rectangular parallelepiped.
4. A method of manufacturing a communication module including a
flexible board having a first surface and a second surface opposite
to the first surface, the flexible board including a first region,
a second region, and a third region located between the first
region and the second region, the method comprising the steps of:
mounting a communication electronic component of a communication
circuit on the first surface of the first region of the flexible
board, and mounting an antenna dielectric and a matching electronic
component on the first surface of the second region of the flexible
board; sealing the communication circuit with a resin; and bending
the flexible board at the third region such that, the resin comes
into contact with the antenna dielectric, and adhering the resin to
the antenna dielectric with an adhesive provided therebetween.
5. The communication module according to claim 1, wherein the resin
sealing the communication circuit covers substantially the entire
first surface of the first region.
6. The communication module according to claim 1, wherein an outer
shape of the communication module is a rectangular parallelepiped
having a top surface, a bottom surface, and four side surfaces
formed between the top and bottom surfaces, and wherein the second
surface of the flexible board forms the top surface, the bottom
surface, and one of the side surfaces therebetween.
7. The method according to claim 4, further comprising: forming an
antenna including a metal pattern on the second surface of the
second region of the flexible board prior to the mounting the
communication electronic component.
Description
CLAIM OF PRIORITY
[0001] This application claims benefit of Japanese Patent
Application No. 2015-128556 filed on Jun. 26, 2015, which is hereby
incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a communication module in
which a communication circuit and an antenna are formed on a board,
and a method of manufacturing the communication module.
[0004] 2. Description of the Related Art
[0005] Conventionally, an electronic circuit module in which a
communication circuit having a plurality of electronic components
and an antenna are provided on one board has been commercialized.
However, in a case in which the plurality of electronic components
and the antenna are provided on one board, a circuit formation area
on the board greatly increases, and a size of an electronic circuit
device increases. To solve this problem, a structure of an
electronic circuit module in which electronic components are
mounted on two boards, the two boards face each other, and the two
boards are connected by a flexible cable such that a size of the
module is prevented from increasing has been proposed.
[0006] As this type of electronic circuit module, an invention of
an electronic circuit device described in Japanese Unexamined
Patent Application Publication No. 2003-158356 is disclosed. An
electronic circuit device 900 described in Japanese Unexamined
Patent Application Publication No. 2003-158356 is illustrated in
FIG. 8.
[0007] This electronic circuit device 900 includes a plurality of
circuit boards 903 and 904 having electronic components 902a to
902g mounted thereon, a flexible cable 905 integrally formed in the
circuit boards 903 and 904, extending from end surfaces of the
respective boards, and electrically connecting the respective
boards to each other, and a spacer 906 that holds the respective
boards in a state in which the respective boards face each
other.
[0008] In this electronic circuit device 900 configured as above,
the electrical connection between the circuit boards 903 and 904 is
performed by the flexible cable 905, and the respective boards are
held by the spacer 906 in a state in which the respective boards
face each other. Thus, since a function of mechanical connection
and relative positioning of the respective boards and a function of
the electrical connection between the respective boards are
separated from each other, a size (particularly, a thickness) of
the spacer 906 which performs the former can be reduced (narrowed)
to the minimal extent necessary for the relative positioning
between the circuit boards 903 and 904. This can reduce an area
occupied by the spacer 906 in each of the boards. Further, since
the electrical connection between the circuit boards 903 and 904 is
performed by the flexible cable 905, it is unnecessary to secure
the electrical connection in an assembly process, and the assembly
process can be facilitated.
[0009] However, in the electronic circuit device 900, there are the
following problems. The electronic circuit device 900 has a
structure in which the circuit boards 903 and 904 are held by the
spacer 906 in a state in which the circuit boards 903 and 904 face
each other, but in a case in which the thickness of the spacer 906
is decreased to further miniaturize the electronic circuit device
900, there is a problem in which stress is applied to the spacer
906, and the spacer 906 and the electronic circuit device 900 are
damaged. Conversely, in a case in which the thickness of the spacer
906 is increased so that the electronic circuit device 900 is not
damaged, there is a problem in which that the electronic circuit
device 900 cannot be miniaturized.
SUMMARY OF THE INVENTION
[0010] The present invention provides a communication module that
is not damaged even when miniaturized, and a method of
manufacturing the communication module.
[0011] To solve this problem, the communication module of the
present invention includes: a flexible board having a first region,
a second region, and a third region located between the first
region and the second region, a communication circuit including a
communication electronic component mounted on one surface of the
first region, an antenna dielectric mounted on a portion of one
surface of the second region, a matching circuit including a
matching electronic component mounted on another portion of the one
surface of the second region, and an antenna including a metal
pattern formed in the other surface of the second region, wherein
the matching circuit is a circuit for matching the antenna with the
communication circuit, the communication circuit being sealed with
a resin, and the third region is folded and the resin and the
antenna dielectric are brought into contact with each other.
[0012] In the communication module configured as above, since the
antenna dielectric mounted on the one surface of the second region
of the flexible board is supported by the resin covering the
communication circuit configured on the one surface of the first
region of the flexible board, a spacer is not necessary, and the
communication module is not damaged even when the communication
module is miniaturized.
[0013] Further, in the above configuration, the resin and the
antenna dielectric are adhered to each other by an adhesive.
[0014] In the communication module configured as above, since the
resin with a wide area on the first region and the antenna
dielectric with a relatively wide area on the second region are
adhered such that the first region and the second region are
adhered over a wide area, it becomes difficult for the first region
and the second region of the flexible board to be peeled.
[0015] Further, in the above configuration, an outer shape is a
rectangular parallelepiped shape, all of the surfaces constituting
the rectangular parallelepiped are covered with the flexible board,
and a ground pattern is formed on all of the side surfaces of the
rectangular parallelepiped.
[0016] In the communication module configured as above, since the
outer shape is a rectangular parallelepiped, all of the surfaces
constituting the rectangular parallelepiped are covered with the
flexible board, and the ground pattern is formed on all of the side
surfaces of the rectangular parallelepiped, it is possible to
enhance a shielding effect of the communication circuit and the
matching circuit.
[0017] Further, in order to solve this problem, a method of
manufacturing a communication module of the present invention
includes: a first process of mounting a communication electronic
component constituting a communication circuit on one surface of a
first region of a flexible board having the first region and a
second region, and a third region located between the first region
and the second region, and mounting an antenna dielectric and a
matching electronic component on one surface of the second region;
a second process of sealing the communication circuit with a resin;
and a third process of bending the third region, bringing the resin
into contact with the antenna dielectric, and adhering the resin to
the antenna dielectric.
[0018] In the method of manufacturing the communication module
configured as above, since the communication module is manufactured
so that the antenna dielectric mounted on the one surface of the
second region of the flexible board is supported by the resin
covering the communication circuit configured on the one surface of
the first region of the flexible board, a spacer is not necessary,
and the communication module is not damaged even when the
communication module is miniaturized.
[0019] In the communication module of the present invention, since
the antenna dielectric mounted on the one surface of the second
region of the flexible board is supported by the resin covering the
communication circuit configured on the one surface of the first
region of the flexible board, a spacer is not necessary, and the
communication module is not damaged even when the communication
module is miniaturized. Further, in the method of manufacturing the
communication module of the present invention, since the second
region of the flexible board is supported by the resin covering the
communication circuit configured on the one surface of the first
region of the flexible board, a spacer is not necessary, and the
communication module is not damaged even when the communication
module is miniaturized.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 is a perspective view of a communication module of a
first embodiment of the present invention.
[0021] FIG. 2 is a side view of the communication module of the
first embodiment.
[0022] FIG. 3 is a plan view of the communication module of the
first embodiment.
[0023] FIGS. 4A though 4C are side views illustrating a method of
manufacturing a communication module of the first embodiment.
[0024] FIGS. 5A and 5B are plan views illustrating the method of
manufacturing a communication module of the first embodiment.
[0025] FIG. 6 is a perspective view of a communication module of a
second embodiment of the present invention.
[0026] FIG. 7 is a plan view of the communication module of the
second embodiment during a manufacturing process.
[0027] FIG. 8 is a side view of the communication module according
to an example of the related art.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0028] Hereinafter, embodiments of the present invention will be
described with reference to the drawings. In this specification, an
X1 side in each drawing is a right side, an X2 side is a left side,
a Y1 side is a back side, a Y2 side is a front side, a Z1 side is
an upper side, and a Z2 side is a lower side, unless otherwise
mentioned.
First Embodiment
[0029] First, a communication module 100 in a first embodiment of
the present invention will be described. The communication module
100 in the first embodiment of the present invention is illustrated
in FIGS. 1 to 3. FIG. 1 is a perspective view of the communication
module 100 of the present invention. Further, FIG. 2 is a side view
of the communication module 100, and FIG. 3 is a plan view of the
communication module 100.
[0030] As illustrated in FIGS. 1 and 3, the communication module
100 has a rectangular shape in a plan view, and includes a flexible
board 10, a communication circuit 5 including a communication
electronic component 5a mounted on the flexible board 10, a
matching circuit 7 including matching electronic component 7a
mounted on the flexible board 10, an antenna dielectric 3, and an
antenna 9 formed in the flexible board 10.
[0031] The communication module 100 is mounted on a small
high-frequency device which is, for example, a mobile device such
as a wearable terminal device, and is configured such that the
communication module 100 can communicate with another terminal
device such as a smartphone using the antenna 9 and the
communication circuit 5.
[0032] The flexible board 10 includes a first region 11, a second
region 12, and a third region 13 located between the first region
11 and the second region 12. The flexible board 10 is a rigid
flexible board having a rectangular shape, and has flexibility.
[0033] The communication electronic component 5a constituting the
communication circuit 5 is mounted on one surface 11a (an upper
surface illustrated in FIG. 2) of the first region 11 of the
flexible board 10, as illustrated in FIGS. 1 and 2. The
communication electronic component 5a is a plurality of electronic
components such as integrated circuits or resistors for
communication with another terminal device using the antenna 9.
Further, the plurality of communication electronic components 5a
are connected to one another by a conductive line (not illustrated)
or a ground pattern (not illustrated) over substantially the entire
region of the one surface 11a of the first region 11, such that the
communication circuit 5 includes the conductor line and the ground
pattern, in addition to the communication electronic components 5a.
The communication circuit 5 is connected to the antenna 9 via the
matching circuit 7.
[0034] Although the conductor line or the ground pattern is formed
in the one surface 11 a in the first region 11 of the flexible
board 10 in the present embodiment, the conductor line or the
ground pattern may be formed in an inner layer of the first region
11 of the flexible board 10.
[0035] The entire communication circuit 5 configured in the first
region 11 is sealed by a resin 23. Accordingly, the resin 23 for
sealing the communication circuit 5 is formed over substantially
the entire region of the one surface 11a in the first region 11 of
the flexible board 10 and occupies substantially the same wide area
as the communication module 100 in a plan view, as illustrated in
FIGS. 2 and 3. The resin 23 is a thermosetting resin.
[0036] As illustrated in FIGS. 1 and 2, the antenna dielectric 3 is
mounted in a portion (a left portion illustrated in FIG. 2) of one
surface 12a (a lower surface illustrated in FIG. 2) of the second
region 12 of the flexible board 10 by soldering or the like. The
antenna dielectric 3 occupies a relatively wide area on the one
surface 12a of the second region 12 of the flexible board 10.
Further, the matching electronic component 7a constituting the
matching circuit 7 is mounted in another portion (a right portion
illustrated in FIG. 2 in which the antenna dielectric 3 is not
mounted) of the one surface 12a (the lower surface illustrated in
FIG. 2) of the second region 12 of the flexible board 10 by
soldering or the like.
[0037] The antenna 9 is formed on the other surface 12b (an upper
surface illustrated in FIG. 2) of the second region 12 of the
flexible board 10, as illustrated in FIGS. 1 to 3. The antenna 9 is
formed of a printed conductor, which is made of a metal pattern 9a.
By arranging the antenna 9 on the other surface 12b of the second
region 12, that is, the upper surface of the communication module
100, it is possible to provide the antenna 9 so that the antenna 9
comes in direct contact with an outer space of the communication
module 100. Therefore, it is possible to prevent characteristics of
the antenna 9 from degrading in comparison with a case in which the
antenna 9 is arranged on the inner side of the folded flexible
board 10.
[0038] Although the antenna 9 in the communication module 100 of
the present embodiment is formed of the printed conductor on the
flexible board 10, the antenna 9 may be a type of chip antenna
placed on and attached to the other surface 12b of the second
region 12 of the flexible board 10. Further, although the antenna 9
is a monopole antenna having a meandering shape in this embodiment,
the antenna 9 may be an antenna having another form such as
inverted-F type antenna.
[0039] The antenna dielectric 3 has an effect of shortening a
wavelength of a high-frequency signal. Therefore, by forming the
antenna 9 on the other surface 12b of the second region 12 of the
flexible board 10 and mounting the antenna dielectric 3 on the one
surface 12a of the second region 12 of the flexible board 10, it is
possible to shorten a length of the metal pattern 9a of the antenna
9 while maintaining a resonant frequency. As a result, it is
possible to miniaturize the communication module 100.
[0040] The matching circuit 7 is a circuit for matching impedance
of the antenna 9 with impedance of the communication circuit 5. The
matching electronic component 7a constituting the matching circuit
7 usually includes a plurality of circuit elements such as
capacitors and inductors. An individual electronic component may be
used as the inductor, but the inductor may be realized by a
transmission line made of a printed conductor. Capacitance between
transmission lines made of printed conductors may be used as the
capacitor. With these components, it is possible to further
miniaturize the communication module 100. The matching circuit 7
also includes a conductor line and a ground pattern, in addition to
the matching electronic component 7a. The matching circuit 7 and
the communication circuit 5 are connected to each other by a
transmission line on the flexible board 10, and the matching
circuit 7 and the antenna 9 are connected to each other by a
through-hole (not illustrated) formed in the second region 12 of
the flexible board 10.
[0041] The third region 13 of the flexible board 10 is located
between the first region 11 and the second region 12. As
illustrated in FIGS. 1 and 2, the communication module 100 has a
structure in which the third region 13 is folded and the one
surface 11a of the first region 11 and the one surface 12a of the
second region 12 face each other. Therefore, the resin 23 formed on
the one surface 11a of the first region 11 and the antenna
dielectric 3 mounted on the one surface 12a of the second region 12
come into contact with each other. The resin 23 formed on the one
surface 11a of the first region 11 and the antenna dielectric 3
mounted on the one surface 12a of the second region 12 are adhered
and fixed to each other by adhesive 21, as illustrated in FIG.
2.
[0042] The resin 23 formed on the one surface 11a of the first
region 11 and the antenna dielectric 3 mounted on the one surface
12a of the second region 12 occupy a greater area in a plan view
within the one surface 11a of the first region 11 or the one
surface 12a of the second region 12. Therefore, the first region 11
and the second region 12 are adhered to each other over a wide
area. As a result, it is possible to firmly adhere the resin 23 to
the antenna dielectric 3.
[0043] On the other surface 11b of the first region 11 which is a
surface opposite to the one surface 11a of the first region 11
illustrated in FIG. 2, a conductor is formed and a plurality of
connection terminals (not illustrated) connected to the
communication circuit 5 by through-holes (not illustrated) are
provided, such that an electronic device such as a mobile device on
which the communication module 100 is mounted can be connected to
the communication circuit 5 in the communication module 100.
[0044] Embodiment of method of manufacturing communication
module
[0045] Next, a method of manufacturing the communication module 100
will be described with reference to FIGS. 3 to 5.
[0046] FIGS. 4A to 4C are side views illustrating a method of
manufacturing the communication module 100. FIG. 4A illustrates a
first process of the method of manufacturing the communication
module 100, FIG. 4B illustrates a second process of the method of
manufacturing the communication module 100, and FIG. 4C illustrates
a third process of the method of manufacturing the communication
module 100. FIGS. 5A and 5B are plan views illustrating the method
of manufacturing the communication module 100. FIG. 5A illustrates
the communication module 100 after the first process, and FIG. 5B
illustrates the communication module 100 after the second process.
A plan view of the communication module 100 after the third process
is as illustrated in FIG. 3.
[0047] In the method of manufacturing the communication module 100,
the flexible board 10 is first prepared. The flexible board 10
includes the first region 11, the second region 12, and the third
region 13 located between the first region 11 and the second region
12, as illustrated in FIG. 4A. The antenna 9 including the metal
pattern 9a has already been formed in the other surface 12b (a
lower surface illustrated in FIG. 4A) of the second region 12 of
the flexible board 10 by printing.
[0048] In the first process of the method of manufacturing the
communication module 100 illustrated in FIG. 4A, the communication
electronic component 5a constituting the communication circuit 5 is
mounted on the one surface 11a (an upper surface of illustrated in
FIG. 4A) of the first region 11 of the flexible board 10. That is,
the communication electronic component 5a, including an integrated
circuit, a resistor, and the like, is placed at a predetermined
position on the one surface 11a of the first region 11, and then,
the communication electronic component 5a is attached to a
conductor electrode (not illustrated) provided in the one surface
11a of the first region 11 by soldering or the like.
[0049] In the first process of the method of manufacturing the
communication module 100, the matching electronic component 7a
constituting the matching circuit 7 and the antenna dielectric 3
are mounted on the one surface 12a (an upper surface illustrated in
FIG. 4A) of the second region 12 of the flexible board 10,
simultaneously with the communication electronic component 5a being
mounted as illustrated in FIG. 4A. That is, the matching electronic
component 7a, including a capacitor or an inductor, and the antenna
dielectric 3 are placed at predetermined positions on the one
surface 12a of the second region 12, and then, such a plurality of
components are attached to a conductor electrode (not illustrated)
provided on the one surface 12a of the second region 12 by
soldering or the like.
[0050] If the communication module 100 after the first process of
the method of manufacturing the communication module 100 is viewed
from the top, it can be seen that the communication electronic
component 5a constituting the communication circuit 5 is mounted on
the one surface 11a of the first region 11 of the flexible board
10, as illustrated in FIG. 5A. Further, it can be seen that the
matching electronic component 7a constituting the matching circuit
7 and the antenna dielectric 3 are mounted on the one surface 12a
of the second region 12 of the flexible board 10. The antenna 9 is
on the other surface 12b side (a back side) of the second region 12
in the flexible board 10.
[0051] A second process of the method of manufacturing the
communication module 100 illustrated in FIG. 4B is a process of
sealing the communication circuit 5 including the communication
electronic components 5a mounted on the one surface 11a of the
first region 11 of the flexible board 10, and the conductor line
formed in the one surface 11a of the first region 11 and connecting
the plurality of communication electronic components 5a, with the
resin 23. The resin 23 is injected into only the one surface 11a of
the first region 11 including the communication electronic
component 5a of the flexible board 10 at least at a height of the
communication electronic component 5a. The injected resin 23 is
cured by applied heat to seal the communication circuit 5.
[0052] When the communication circuit 5 is sealed with the resin
23, a mold 50 is placed on one surface 13a (an upper surface
illustrated in FIG. 4B) of the third region 13 of the flexible
board 10 on which no component is mounted. By placing the mold 50,
it is possible to prevent the resin 23 from being injected into
each of the one surface 12a of the second region 12 and one surface
13a of the third region 13 of the flexible board 10. The mold 50 is
removed after the communication circuit 5 is sealed with the resin
23.
[0053] When the communication module 100 after the second process
of the method of manufacturing the communication module 100 is
viewed from the top, it can be seen that the communication circuit
5 including the communication electronic components 5a mounted on
the one surface 11a of the first region 11 of the flexible board 10
is covered with the resin 23 to a boundary line with the third
region 13 in which there is the mold 50, as illustrated in FIG.
5B.
[0054] The third process of the method of manufacturing the
communication module 100 illustrated in FIG. 4C is a process of
bending the third region 13 located between the first region 11 and
the second region 12 of the flexible board 10, bringing the resin
23 mounted in the first region 11 into contact with the antenna
dielectric 3 mounted in the second region 12, and adhering the
resin 23 to the antenna dielectric 3.
[0055] In a state in which the matching electronic component 7a and
the antenna dielectric 3 are mounted in the second region 12 of the
flexible board 10, the third region 13 is folded at a boundary line
between the first region 11 and the third region 13, the third
region 13 is then bent, the third region 13 is further folded at a
boundary line between the second region 12 and the third region 13,
and the resin 23 mounted in the first region 11 is brought into
contact with the antenna dielectric 3 mounted in the second region
12.
[0056] The adhesive 21 is applied to a lower surface of the antenna
dielectric 3 or an upper surface of the resin 23 illustrated in
FIG. 4C, and the antenna dielectric 3 and the resin 23 are pressed
and brought into contact with each other. Accordingly, the antenna
dielectric 3 and the resin 23 are strongly adhered and fixed to
each other by the adhesive 21. Thereafter, the communication module
100 is set up, as illustrated in FIG. 3.
[0057] Through the respective processes of the method of
manufacturing the communication module 100 illustrated in FIGS. 4A
to 4C, it is possible to manufacture the communication module
100.
[0058] Thus, in the method of manufacturing the communication
module 100, the antenna dielectric 3 mounted on the one surface 12a
of the second region 12 is firmly supported by the resin 23
covering the communication circuit 5 including the communication
electronic component 5a mounted on the one surface 11a of the first
region 11 of the flexible board 10.
Second Embodiment
[0059] Next, a communication module 200 in a second embodiment of
the present invention will be described. The communication module
200 is illustrated in FIGS. 6 and 7. FIG. 6 is a perspective view
of the communication module 200. Further, FIG. 7 is a plan view of
the communication module 200 in a manufacturing process.
[0060] A difference between constituent elements constituting the
communication module 200 and the constituent elements constituting
the communication module 100 is that a flexible board 40 of the
communication module 200 is different from the flexible board 10 of
the communication module 100, and other constituent elements are
the same. Accordingly, the constituent elements other than the
flexible board 40 constituting the communication module 200 are
denoted with the same reference signs as those in the communication
module 100.
[0061] As illustrated in FIG. 7, the communication module 200
includes a flexible board 40, a communication circuit 5 including a
communication electronic component 5a mounted on the flexible board
40, a matching circuit 7 including a matching electronic component
7a mounted on the flexible board 40, an antenna dielectric 3, and
an antenna 9 formed in the flexible board 10, similar to the
communication module 100.
[0062] As illustrated in FIG. 6, the communication module 200 has a
rectangular shape, is mounted on a small high-frequency device, for
example, a mobile device such as a wearable terminal device, and is
configured to be capable of communicating with another terminal
device such as a smart phone using the antenna 9 and the
communication circuit 5, similar to the communication module
100.
[0063] The flexible board 40 includes a first region 41, a second
region 42, a third region 43 located between the first region 41
and the second region 42, a fourth region 44 extending to a right
side of the second region 42, a fifth region 45 extending to an
upper side of the first region 41, and a sixth region 46 extending
to a lower side of the first region 41, as illustrated in FIG. 7.
The fifth region 45 may extend to an upper side of the second
region 42, and the sixth region 46 may extend to a lower side of
the second region 42. The flexible board 40 is flexible, similar to
the flexible board 10 of the communication module 100.
[0064] The communication electronic component 5a constituting the
communication circuit 5, the matching electronic component 7a
constituting the matching circuit 7, the antenna dielectric 3, the
resin 23, and the antenna 9, and a method of mounting or forming
these on the flexible board 40 are the same as those in the
communication module 100. Therefore, description thereof is
omitted.
[0065] As described above, the flexible board 40 includes six
regions including the first region 41, the second region 42, the
third region 43, the fourth region 44, the fifth region 45, and the
sixth region 46. Accordingly, by bending portions at boundary lines
of the six regions, it possible to obtain a shape of rectangular
parallelepiped closed to the outside.
[0066] Accordingly, the communication module 200 is formed such
that an outer shape thereof is a rectangular parallelepiped, and
all of surfaces constituting the rectangular parallelepiped are
covered with the flexible board 40, as illustrated in FIG. 6.
[0067] In order for the communication module 200 to be assembled in
the shape of rectangular parallelepiped, a process of folding the
fourth region 44 so that the fourth region 44 is connected to the
first region 41 and the third region 43 and folding the fifth
region 45 and the sixth region 46 so that the fifth region 45 and
the sixth region 46 are respectively connected to the second region
42 and the third region 43 is only added to the method of
manufacturing the communication module 100 described above.
[0068] Further, a ground pattern 47 is formed an outer surface of
each of the third region 43, the fourth region 44, the fifth region
45, and the sixth region 46 among the respective regions of the
flexible board 40, as illustrated in FIG. 6. In other words, the
ground pattern 47 is formed on all of side surfaces of the
rectangular parallelepiped constituting the communication module
200. The ground patterns 47 are connected to the respective ground
patterns (not illustrated) of the communication circuit 5 and the
matching circuit 7 formed on the flexible board 40, and the
respective ground patterns of the communication circuit 5 and the
matching circuit 7 are connected to a ground pattern of an
electronic device such as a mobile device on which the
communication module 100 is mounted. Although the surfaces in which
the ground patterns 47 of the third region 43, the fourth region
44, the fifth region 45, and the sixth region 46 are formed are
outer surfaces of the respective regions in this embodiment, the
surfaces may be inner surfaces or inner layer surfaces of the
respective regions (the third region 43, the fourth region 44, the
fifth region 45, and the sixth region 46).
[0069] Hereinafter, effects of the present embodiment will be
described.
[0070] In the communication module 100, since the antenna
dielectric 3 mounted on the one surface 12a of the second region 12
of the flexible board 10 is supported by the resin 23 covering the
communication circuit 5 configured on the one surface 11a of the
first region 11 of the flexible board 10, a spacer is not
necessary, and the communication module 100 is not damaged even
when the communication module 100 is miniaturized.
[0071] Further, since the resin 23 with a wide area on the first
region 11 and the antenna dielectric 3 with a relatively wide area
on the second region 12 are adhered to each other such that the
first region 11 and the second region 12 are adhered to each other
over a wide area, it becomes difficult for the first region 11 and
the second region 12 of the flexible board 10 to be peeled.
[0072] Since in the communication module 200, the outer shape is a
rectangular parallelepiped, all of the surfaces constituting the
rectangular parallelepiped are covered with the flexible board 40,
and the ground pattern 47 is formed on all side surfaces of the
rectangular parallelepiped, it is possible to enhance a shielding
effect for the communication circuit 5 and the matching circuit
7.
[0073] In the method of manufacturing the communication module 100,
since the communication module 100 is manufactured so that the
antenna dielectric 3 mounted on the one surface 12a of the second
region 12 of the flexible board 10 is supported by the resin 23
covering the communication circuit 5 configured on the one surface
11a of the first region 11 of the flexible board 10, a spacer is
not necessary, and the communication module 100 is not damaged even
when the communication module 100 is miniaturized.
[0074] As described above, in the communication module of the
present invention, since the antenna dielectric mounted on the one
surface of the second region of the flexible board is supported by
the resin covering the communication circuit configured on the one
surface of the first region of the flexible board, a spacer is not
necessary, and the communication module is not damaged even when
the communication module is miniaturized. In the method of
manufacturing the communication module, since the communication
module is manufactured so that the antenna dielectric mounted on
the one surface of the second region of the flexible board is
supported by the resin covering the communication circuit
configured on the one surface of the first region of the flexible
board, a spacer is not necessary, and the communication module is
not damaged even when the communication module is miniaturized.
[0075] The present invention is not limited to the above
embodiments, and can be variously modified and implemented without
departing from the gist.
[0076] It should be understood by those skilled in the art that
various modifications, combinations, sub-combinations and
alterations may occur depending on design requirements and other
factors insofar as they are within the scope of the appended claims
of the equivalents thereof.
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