U.S. patent application number 15/194077 was filed with the patent office on 2016-12-29 for optical converter system for (w)leds.
This patent application is currently assigned to SCHOTT AG. The applicant listed for this patent is SCHOTT AG. Invention is credited to Robert HETTLER, Edgar PAWLOWSKI, Matthias RINDT, Thomas ZETTERER.
Application Number | 20160380161 15/194077 |
Document ID | / |
Family ID | 40984688 |
Filed Date | 2016-12-29 |
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United States Patent
Application |
20160380161 |
Kind Code |
A1 |
RINDT; Matthias ; et
al. |
December 29, 2016 |
OPTICAL CONVERTER SYSTEM FOR (W)LEDS
Abstract
An optical converter system for (W)LEDs, and a method for
producing the optical converter system are provided. The optical
converter system includes an inorganic converter for converting the
radiation emitted from the LED, an inorganic optical component,
such as glass, disposed downstream relative to the converter in the
direction of emission of the LED. The converter and the first
optical component are adjacent to one another and joined at least
in sections.
Inventors: |
RINDT; Matthias;
(Bruchkobel, DE) ; PAWLOWSKI; Edgar;
(Stadecken-Elsheim, DE) ; ZETTERER; Thomas;
(Landshut, DE) ; HETTLER; Robert; (Kumshausen,
DE) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SCHOTT AG |
Mainz |
|
DE |
|
|
Assignee: |
SCHOTT AG
Mainz
DE
|
Family ID: |
40984688 |
Appl. No.: |
15/194077 |
Filed: |
June 27, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12990385 |
May 6, 2011 |
9409811 |
|
|
PCT/EP2009/003108 |
Apr 29, 2009 |
|
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15194077 |
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Current U.S.
Class: |
257/81 |
Current CPC
Class: |
H01L 33/507 20130101;
H01L 2224/48247 20130101; C03B 19/101 20130101; H01L 33/58
20130101; H01L 31/153 20130101; C03B 2215/80 20130101; C03B 11/082
20130101; H01L 2224/48091 20130101; C03B 23/00 20130101; H01L
33/502 20130101; H01L 2224/48091 20130101; H01L 2924/0002 20130101;
C03B 23/0013 20130101; H01L 2924/00014 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101; C03B 11/08 20130101 |
International
Class: |
H01L 33/50 20060101
H01L033/50; H01L 31/153 20060101 H01L031/153; H01L 33/58 20060101
H01L033/58; C03B 11/08 20060101 C03B011/08; C03B 23/00 20060101
C03B023/00 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 29, 2008 |
DE |
102008021436.1 |
Claims
1. An array comprising a plurality of converter modules for
converting radiation associated with respective opto-electronic
functional elements, each converter module comprising: at least one
inorganic converter for the conversion of at least one of radiation
emitted from and radiation received by a respective opto-electronic
functional element; and at least one optical component comprising
an inorganic material, which is placed downstream relative to the
converter in an emission direction of the respective
opto-electronic functional element, wherein the converter and the
optical component are joined together in a cohesive manner.
2. The array of claim 1, wherein the converter has a temperature
resistance of at least 150.degree. C. and wherein the converter
comprises at least one material selected from the group consisting
of optical ceramics, glass ceramics, ceramicized glass, and
PiG.
3. The array of claim 1, wherein the converter comprises at least 2
stages, and wherein the converter further comprises at least one of
a coating, a barrier structure, and embedded particles.
4. The array of claim 1, wherein the converter and the optical
component comprise substantially similar curved portions, and
wherein the optical component comprises at least one of a coating,
a structuring, and embedded particles.
5. The array of claim 1, wherein the optical component comprises a
glass that has a Tg of less than approximately 800.degree. C. and a
second optical component mounted upstream relative to the emission
direction of the opto-electronic functional element.
6. The array of claim 1, further comprising at least one ring
extending over at least a portion of a periphery of each converter
module, wherein the ring has a metallic coating, at least in
sections.
7. The array of claim 1, further comprising at least one device
associated with the converter for removing heat.
8. An opto-electronic component, comprising: a housing; at least
one converter module of an array comprising at least one inorganic
converter for the conversion of at least one of radiation and at
least one optical component having an inorganic material, which is
placed downstream relative to the converter in an emission
direction, wherein the converter and the optical component are
joined together in a cohesive manner; and at least one
opto-electronic functional element configured for at least one of
emitting radiation and receiving radiation disposed in the
housing.
9. The opto-electronic component of claim 8, further comprising: at
least one LED; and at least one of a monitor photodiode and a
thermocouple.
10. A method for producing a plurality of converter modules for
converting radiation associated with respective opto-electronic
functional elements, comprising: providing a plurality of
converters for converting at least one of radiation emitted from
and radiation received by the respective opto-electronic functional
elements; providing a plurality of optical components, wherein the
plurality of converters and the plurality of optical components are
arranged in an array; and joining the plurality of converters with
respective optical components by heating at least one of the
converters and the optical components so that the plurality of
converters and the respective optical components will adhere to one
another and form a cohesive composite to form an array with a
plurality of converter modules.
11. The method of claim 10, wherein the optical components and the
converters are provided by melting and sealing, wherein the optical
components are provided as glass gobs, which are heated until the
glass reaches a viscosity at which the optical components are
formed, wherein the converters are provided on the optical
components by at least one of a pressing, a dispensing, a
sintering, and a flaming, and wherein the converters and the
optical components are joined by sintering the converters.
12. The method of claim 10, wherein the converters and the optical
components are provided as a molding, wherein at least one of the
converters and the optical components are provided as a bulk
material, which is positioned in a mold, wherein the at least one
of the converters and the optical components are formed by a
pressing of the bulk material, and wherein the converters and the
optical components are heated until they adhere to one another and
form a composite.
13. The method of claim 10, wherein the optical components are
provided as glass gobs.
14. The method of claim 13, wherein the glass gobs are placed onto
the converters and are joined with the converters, wherein the
glass gobs are provided by one of a jetting method and a
microstructuring, and wherein the glass gobs are heated until the
glass reaches a viscosity at which the optical components are
formed.
15. The method of claim 14, wherein at least one limit is provided
for the defined melting of the glass gobs, and wherein the at least
one limit is provided as a discontinuity in surfaces of the
converters, on which the optical components will be introduced.
16. The method of claim 15, wherein the at least one limit will be
provided by a structuring of the surfaces of the converters on
which optical components will be introduced, wherein the at least
one limit is produced by at least one of a material-removing and a
material-introducing method, and wherein the at least one limit is
provided by the positioning of a template proximate to the
converters.
17. The method of claim 10, wherein the converters are positioned
above respective molds and are heated until a material of the
converters reaches a viscosity at which the converters sink into
the respective molds, wherein the optical components are provided
as glass gobs, which are positioned together with the converters on
the respective molds, wherein the glass gobs are heated until the
glass reaches a viscosity at which the optical components are
formed, and wherein the glass gobs and the converters are heated
until they each reach a viscosity at which the converters and the
glass gobs sink into the respective molds and form a composite.
18. The method of claim 10, wherein at least one of the converters
and the optical components are produced by pressing, wherein the
converters and the optical components are joined by at least one of
an organic bonding and an inorganic bonding, and wherein the
optical components are formed at least partially by pressing and
joining.
19. The method of claim 10, further comprising: providing at least
one ring extending over at least a portion of a periphery of each
converter module, wherein the ring has a metallic coating, at least
in sections; and providing at least one device associated with each
converter for removing heat, wherein the optical components and the
converters are prepared by being at least one of structured,
coated, smoothed, and polished, at least in sections.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional application of U.S.
application Ser. No. 12/990,385 filed on Oct. 29, 2010, which is a
national stage entry of International Application No.
PCT/EP2009/003108 filed on Apr. 29, 2009, which claims the benefit
of German Application No. 10 2008 021 436.1 filed on Apr. 29, 2008,
the contents of all of which are incorporated by reference
herein.
BACKGROUND
[0002] 1. Field of the Invention
[0003] The present invention relates to an optical converter system
for LEDs, preferably for so-called (W)LEDs, and a method for the
production of the named optical converter system.
[0004] 2. Description of Related Art
[0005] At the present time, systems having LEDs, converters and
optics are jointly disposed in a housing, which is also called a
package, by means of so-called molding processes. In a familiar
method, the package is constructed directly from the individual
components, which are then solidly joined to one another. In
general, silicone resins are used for this purpose. Such a system
is described, for example, in document DE 10 2005 009 066 A1.
[0006] A disadvantage of such a system, which is based on its
essentially organic properties, is its low temperature resistance,
which in general only attains a value of approximately 100.degree.
C. Based on the low temperature resistance, such a system is
compatible with soldering processes only under certain conditions,
since conducting such processes will bring about or require a high
evolution of heat. In particular, the materials used in the prior
art cannot be exploited further if the so-called junction
temperature used in an LED chip at the present time increases from
the current maximum of 100-150.degree. C. to 200.degree. C.
[0007] Also, such a system is not resistant to UV. Further, such a
package is also not hermetically sealed and is thus susceptible to
environmental influences, such as moisture. The increasing
complexity of semiconductor components and different applications,
however, requires a hermetic package. Examples of this are an LD
and a photodetector or an LED with color monitor.
[0008] Another disadvantage of the known systems is based on the
fact that they are not resistant to aging. In particular, the
so-called degassing effects of plastics lead to an aging of the
semiconductor chip. The preferably low wavelength of the emitted
light in the case of the currently used materials leads to a
degradation of the optical properties and of the adhesion
mechanisms. In addition, a low heat conductivity of the plastics
used, which particularly lies in a range of <1 W/mK is also a
disadvantage.
[0009] The individual components are generally solidly joined to
one another and provided in a package. A flexible matching,
particularly of the index of refraction of the individual
components to one another and to the wavelength of the light, is
also only very difficult or generally not possible. Another
disadvantage is the increased expenditure in manufacture, since the
individual components must be assembled.
SUMMARY
[0010] Against this background, the object of the present invention
is thus to provide an optical converter system or a converter
module for radiation-emitting components, in particular, for LEDs
or (W)LEDs, and a method for the production of such a system, which
at least avoid the above-described disadvantages of the prior
art.
[0011] In particular, the present invention will also comply with
future technological trends and will also be particularly suitable
for mass production.
[0012] These objects will be achieved by the converter module and
the method according to the independent claims. Advantageous
embodiments are the subject of the respective subclaims.
[0013] Within the scope of the invention lies a converter module
for the radiation emitted from at least one opto-electronic
functional element and/or for the radiation being received for
placing it onto the opto-electronic functional element, preferably
an LED, comprising at least one, preferably inorganic, converter
for the conversion of the emitted radiation and/or for the
radiation being received, at least one optical component,
preferably comprising an inorganic material, glass in particular,
which is placed downstream and/or upstream relative to the
converter in the emission direction of the opto-electronic
functional element, whereby the converter and the optical component
are joined or at least are joined in sections adjacent to one
another. The converter and the optical component are preferably
joined together in a cohesive manner.
[0014] Let it be additionally clarified here that the direction
established for a radiation-emitting opto-electronic component,
here the emission direction, also applies to a purely
radiation-receiving opto-electronic component.
[0015] In addition, the invention is extended to a method for
producing a converter module for the radiation emitted from at
least one opto-electronic functional element and/or radiation being
received, preferably from an LED, comprising providing at least one
converter for converting the emitted radiation and/or the radiation
being received, providing at least one optical component, joining
the converter and the optical component in such a way that the
converter will be heated and/or the optical component will be
heated so that the converter and the optical component will adhere
to one another and form a composite.
[0016] Preferably, the converter and/or the optical component is or
are heated so that the converter and/or the optical component
soften at least in sections.
[0017] The converter module according to the invention can be
produced or is produced, particularly with the method according to
the invention. The method according to the invention is preferably
designed for the production of the converter module according to
the invention. In one embodiment of the invention, a plurality of
converter modules according to the invention is provided and/or
produced in one array or one line.
[0018] The converter module is formed by at least two components.
These two components are the optical component and the converter as
the converter component. The converter module is a multi-component
system. The individual components or elements are joined
structurally into one functional unit and form the converter
module. The components are matched to one another relative to their
functions. The converter module is a separate component as such. A
converter module is not to be understood as an optical component,
such as, for example, a lens, in which luminous substances are
embedded in sections for conversion. The converter module is a
module for a modularly constructed opto-electronic component.
Therefore, the converter module will also be designated as a
converter module or as an optical converter system. The total
height of the converter module lies in a range of approximately 0.4
mm to 10 mm. It also has an average diameter of approximately 1 mm
to 20 mm. In one embodiment, the converter module is an inorganic
converter module or a substantially inorganic converter module.
[0019] In one embodiment, the converter module is designed in such
a way that it can be positioned and/or attached over a pass-through
region for the radiation emitted by the opto-electronic functional
element and/or for the radiation being received. In one use, the
converter module is a type of lid, cover or closure for a housing,
which is also called a package. The converter module can be joined
to the housing. In this case, the converter module can be placed
directly on the housing or the opto-electronic functional element.
Due to its modular character, however, the converter module can
also be placed on the housing or the opto-electronic functional
element via an adapter. Preferably, at least one opto-electronic
functional element is disposed in the package. The package can be a
GTMS package ("Glass To Metal Seal"), Si package, a plastic
package, and/or a ceramics package. The package is preferably a
package that is described by the name "Housing for LEDs with high
power" in a Patent Application. This named Patent Application was
filed on the same day as the present Patent Application and has the
internal file number 08SGL0060DEP or P3063. The scope of this
Patent Application is incorporated to the full extent in the
present Patent Application.
[0020] The opto-electronic functional element is a
radiation-emitting and/or a radiation-receiving component.
Preferably, the functional element is designed as a chip. The
functional element is at least one component selected from the
group of LEDs, photodiodes and laser diodes. A first preferred LED
has an emission in a range of approximately 370 nm to approximately
410 nm. A second preferred LED has an emission in a range of
approximately 440 nm to approximately 480 nm. The use of the
converter module according to the invention is particularly
suitable also for LEDs with a high power, preferably with a power
of more than approximately 5 W, since in these LEDs, an efficient
drawing off of heat is necessary, and in addition to the housing,
the converter module must also be sufficiently heat-stable.
[0021] The converter module is suitable for placement on the
opto-electronic functional element and/or on a housing. The
converter or the converter module, on the one hand, can be placed
directly on the LED or the opto-electronic component. The converter
is in contact with the LED. As an alternative, the converter or the
converter module can be placed at a distance relative to the
LED.
[0022] The converter converts at least a part of a primary
radiation to a secondary radiation, which has a wavelength that is
different from the primary radiation. On the one hand, the primary
radiation can be emitted from the opto-electronic functional
element. On the other hand, the secondary radiation can be received
by the opto-electronic functional element. In this case, first, the
interaction between opto-electronic functional element and
converter is substantial. In particular, the interaction between
the primary radiation and the secondary radiation emitted by the
converter is substantial.
[0023] In the case of a radiation-emitting opto-electronic
functional element, such as an LED, in a preferred embodiment, a
so-called white LED results due to an interaction between the
opto-electronic functional element and the converter. The light
emitted from a receiver is perceived as white light. A so-named
(W)LED is formed. In this case, the white light is formed by an
additive color mixing.
[0024] In one embodiment, the converter is an inorganic converter
or a substantially inorganic converter. An inorganic or a
substantially inorganic converter is a converter whose thermal
and/or converting properties is/are determined for a long time
afterward by its inorganic components. In particular, the material
for the matrix, in which the luminous substances are embedded, is
provided by at least one inorganic material. It has a temperature
resistance of at least up to approximately 150.degree. C.,
preferably of up to approximately 250.degree. C., and particularly
preferred of up to approximately 500.degree. C. The application
range particularly preferably lies in a range from approximately
-80.degree. C. to approximately 500.degree. C. A change in the
color coordinates as a function of temperature is reduced in
comparison to the known organic materials. Also, in comparison to
the usual organic converter materials, it possesses a clearly
greater heat conductivity of more than approximately 1 W/mK. The
converter has a refractive index in a range from approximately 1.5
to 2.0. The converter has a T.sub.g (glass transition temperature
of more than approximately 500.degree. C. The converter has the
property of converting a primary radiation or at least a portion
thereof into a secondary radiation of at least a longer wavelength.
The converter possesses its converting properties due to an
embedding or doping of corresponding light-emitting materials,
luminous substances or crystals (e.g., Ce:YAG) and/or due to its
structural assembly or crystal structure. The converter is composed
of at least one material or comprises at least one material
selected from the group of opto-ceramics, glass ceramics,
ceramicized glass and PiG (phosphor in glass). Preferably, the
material for the converter is at least one material that is
described in the Patent Application with the name "Conversion
material, in particular for a white or colored light source
comprising a semiconductor light source, method for the production
thereof, and light source comprising this conversion material. The
named Patent Application was filed on the same day as the present
Patent Application and has the internal file number 08SGL0097DEP or
P3179. The scope of this Patent Application is incorporated to the
full extent in the present Patent Application.
[0025] In general, the converter is a type of plate or converter
plate. The converter is essentially not plastically deformable at
temperatures commonly used. In one embodiment, the converter is
designed multi-stage or multi-layered. In such case, it is at least
2-stage or 2-layered. The individual layers can have different
conversion properties, particularly with respect to the primary
radiation to be converted and/or the generated secondary radiation.
However, scattering and/or diffusor centers may also be present in
the individual layers.
[0026] The converter may also have, for example, at least one
coating on the outer side, at least one structuring or structure in
the surface and/or particles embedded in its bulk or volume. For
example, a coating may be an anti-reflection layer, particularly a
wavelength-selective, anti-reflection layer, which is preferably
disposed on the bottom side of the converter. Further, a coating of
the converter, preferably on its top side, may also be produced
with optical filters, e.g., anti-reflection coatings or bandpass
filters, in order to homogenize, e.g., color spectra. A structuring
may involve, for example, a surface of the converter treated by
roughening, preferably its bottom side and/or its top side. A
targeted roughening of the converter surface may be produced, for
example, by etching and/or sandblasting, in order to increase the
decoupling efficiency. Scattering and/or diffusor centers are
examples of embedded particles. Therefore, in one embodiment, the
converter or at least a layer of the converter has a coating, a
structuring and/or embedded particles, in particular, at least in
sections or completely, preferably in the top side and/or the
bottom side. For this purpose, the surface of the converter can
also be etched, smoothed, roughened, polished, and/or ground
down.
[0027] The height or thickness of the converter in general lies in
a range of approximately 0.05 mm to 1 mm. In one variant according
to the invention, the converter is planar or substantially planar.
In another variant, the converter is not planar. The converter 1 is
designed as curved or curved in sections. The optical component is
also curved or curved in sections in one embodiment. The curvature
of the optical component is preferably adapted to the curvature of
the converter.
[0028] Further, the indices of refraction of the converter and the
optical component are also matched to one another. The difference
between the refractive index of the converter and that of the
optical component in this case amounts to less than 0.4, preferably
less than 0.1.
[0029] Next, the interaction of opto-electronic functional element,
converter and optical component is also substantial. The converter
and the optical component are joined together directly or
indirectly. Preferably, however, the converter and the optical
component are joined together directly. They are particularly
joined together in a cohesive manner. The phrase "converter and
optical component adjacent to one another" is also understood to
mean a contact via an adhesive, solder or binder. The optical
component is substantially transparent to the primary radiation
and/or to the secondary radiation. In one embodiment, the optical
component is substantially transparent to the radiation from the
LED and to the radiation emitted from the converter.
[0030] An optical component is a component by means of which the
beam path of the radiation that is emitted from the converter
and/or from the opto-electronic functional element, and/or is
received by it, is influenced in a targeted manner, in particular,
it is guided and/or deflected. For example, an influencing is a
deviation from the linear propagation of light, which is caused by
refraction, reflection, scattering and/or diffraction.
[0031] An optical component is designed, for example, as an optical
system with imaging properties, such as a concave and/or convex
lens, a light filter, a diffusor, a light guide, a prism, a
so-called DOE ("Diffractive Optical Element") and/or a
concentrator. If the optical component is designed as a
concentrator, then in a variant of the invention, it is disposed on
the top side of the converter or downstream relative to the
converter. In this case, in another embodiment, yet another optical
component, such as a lens, is disposed on the concentrator or
downstream relative to the concentrator. The concentrator is
composed of or comprises glass and/or plastic.
[0032] The enumeration of the above-listed examples of an optical
component is not all-encompassing. In the following, the optical
component is also called optics. An optical component, in
particular, is not to be understood as a "simple", especially
sealing, cover or shell, such as a plate or glass plate. However,
an optical component may also be a "simple" unit, such as a
transparent plate or glass plate, if it has the desired properties
influencing light due to an appropriate design or treatment, for
example, of its surface and/or its volume. The unit may have, for
example, at least one coating on the outer side, at least one
structuring or structure in the surface and/or particles embedded
in the material. A coating may be, for example, in particular, a
wavelength-selective anti-reflection layer. A structuring can be,
for example, a surface of the optical component that is treated by
roughening. Scattering and/or diffusor centers are examples of
embedded particles. Therefore, in one embodiment, the optical
component has a coating, a structuring and/or embedded particles,
in particular, at least in sections or completely, in the top side
and/or the bottom side. For this purpose, the surface of the
optical component can be etched, smoothed, roughened, polished,
and/or ground down. However, an optical component may also be a
"simple" unit, such as a transparent plate or a glass plate, if
this plate represents a type of transition or introduction to the
actual optical component that influences light. The optical
component would then be joined indirectly to the converter. This
unit could also be joined indirectly with the converter.
[0033] The optical component has a T.sub.g (glass transition
temperature) of less than approximately 800.degree. C. The material
or the glass of the optical component has a T.sub.g which is
approximately 50 to 300.degree. C. below the T.sub.g of the
converter. In one embodiment, the optical component is an inorganic
optical component or a substantially inorganic optical component or
an optical component made of glass or comprising glass. In one
embodiment, the glass is a milk glass. The glass of the optical
component is at least a material, preferably a glass, which has a
T.sub.g of less than approximately 800.degree. C., in particular,
as a function of the method for producing the converter module.
Examples of this are SCHOTT 8337, P-SK 57, 8250 and P-LASF 47. The
material of the optical component can also be an inorganic,
monocrystalline or polycrystalline material, such as, e.g.,
sapphire. The material of the optical component has a refractive
index in a range of approximately 1.4 to 2.0. It also has a
temperature stability of more than approximately 400.degree. C.
[0034] In one embodiment, the optical component is formed by a
plurality of smaller optical components. These are preferably
disposed in one plane on the converter in this case.
[0035] In an enhancement of the present invention, the converter
module according to the invention has another optical component,
which is disposed on the opposite-lying side of the converter. The
other optical component is mounted upstream or downstream relative
to the converter in the emission direction of the opto-electronic
functional element. For example, the light emitted from an LED can
be bundled onto the converter by means of a convex lens. The other
optical component in this case may have the same properties or may
be equally provided as the above-described first optical component.
In order to avoid repetition, reference is thus made to the
corresponding parts of the description. In one embodiment, a
concentrator, preferably as another optical component, is disposed
on the bottom side of the converter or upstream relative to the
converter, in particular, for bundling the light emitted from an
LED.
[0036] In one embodiment according to the invention, the converter
module has at least one ring, preferably a metal ring, which
extends at least in sections, or completely over the peripheral
extent of the converter module. On the one hand, the ring can
represent a limit for the defined melting or fusing of the optical
component. Therefore, the ring is generally provided before the
optical component is provided or before a glass gob is melted for
the formation of the optical component. On the other hand, the ring
is a type of support for the converter module. In addition, the
housing can be joined to the converter module by means of the ring.
The ring is generally applied both to the converter as well as also
to the optical component. The ring may also serve as a cooling unit
for the converter module. Therefore, the latter preferably has
materials that possess an appropriate heat conductivity, such as a
metal or a metal alloy. Preferably, the ring possesses a heat
conductivity of at least approximately 10 W/mK. The ring is used or
not used as a function of the housing or of the joining of the
converter module with the housing.
[0037] In another embodiment of the invention, the ring has, at
least in sections or completely, a preferably metal coating or
cladding. The coating is preferably a metallizing. The metal
coating or cladding is disposed, in particular, on the free-lying
part of the outer side. In detail, the contact region to or the
bearing surface on a housing is coated or clad. The coating or the
cladding is a corrosion protection for the ring and/or a binder,
such as a solder material, for joining to the housing.
[0038] Another design of the converter module has at least one
means for drawing off heat. The means is provided, for example, by
at least one metal layer and/or a diamond layer (e.g., "synthetic
diamond"). One metal with a high heat conductivity is copper, for
example. The means is provided as a type of wire or conductor,
preferably formed as a type of network or grid. It may involve a
printed circuit, which can also be called thermal busbars. The
means is integrated on the bottom side of the converter, on the top
side of the converter and/or in the converter. In the case of
so-called arrays, this means runs essentially between the optical
components. In one embodiment, the means runs around the optical
component.
[0039] In an enhancement of the invention, the optical component is
processed or treated at least in sections. Preferably, the top side
and/or the bottom side of the optical component is processed. The
processing may be or may comprise a structuring and/or a coating.
In order to achieve, for example, an improved illumination, the
optical component can be roughened. An increased diffuse reflection
is obtained. That is, the incident light from a specific direction
is scattered into many different directions. The optical component,
however, can also be designed, in particular, as
wavelength-selective and reflecting.
[0040] The converter, the converter material, the glass gob, the
optical component, the material for the optical component and/or
the ring is or are provided or positioned by means of a so-called
"pick and place process" in one embodiment.
[0041] A mold for the uptake of at least one converter and/or at
least one optical component or at least one glass gob or at least
one preform is provided in one embodiment. The respective
components named above are provided via a positioning on or in the
mold. Positioning on the mold is understood to mean that the
components are placed on the surface of the mold. A section or at
least one section of its bottom side is in contact with the surface
of the mold.
[0042] According to one aspect of the invention, the optical
component is provided in a first step. In this case, the optical
component is provided via a melting. Providing the optical
component comprises providing a mold, positioning a glass gob on or
in the mold, and heating the glass gob until the material has
reached a viscosity at which the material is free-flowing and the
optical component forms. In this case, the material preferably
sinks into the mold. Here, the optical component can also be
provided as a glass gob or a preform, from which the optical
component is then formed via a melting ("reflow"). In order to
avoid repetition, reference in this regard is made to the following
corresponding description.
[0043] Subsequently, a processing, particularly a surface
processing, of the optical component is conducted. The properties
of the optical component are improved and/or adjusted by the
processing. After the processing, the optical component is joined
to the provided converter.
[0044] A first possibility for processing is etching the optical
component, preferably by means of HF and/or HCl. Etching has proven
advantageous for the case when the optical component will also
possess the properties of a diffusor. An additional treatment of
the optical component for producing this function is no longer
necessary.
[0045] However, if a particularly smooth surface is to be obtained,
in particular, a smoothing or a polishing, preferably a fire
polishing, of the surface of the optical component can be
subsequently conducted.
[0046] Grinding down the optical component represents another
possibility. The surface of the optical component can be smoothed,
roughened, and, in particular, a structure can also be produced by
grinding. A roughness of the surface can be produced, so that the
property of a diffusor is formed. On the other hand, the side of
the optical component on which the converter will be disposed may
also be ground down, preferably planar ground, and/or polished.
[0047] The converter or the material of the converter is provided
by introducing it onto the optical component, preferably onto its
bottom side. The converter is provided by printing, such as screen
printing and/or by means of a template, by dispensing, by
sintering, preferably a compact or preform, and/or by laminating a
foil. A foil can be provided, for example, by a slip cast in the
form of a strip.
[0048] In an unsintered embodiment of the optical component, such
as for unsintered PiG, the converter is provided by printing,
laminating, sintering, sintering and/or dispensing. In a
pre-sintered embodiment, such as for PiG and/or ceramicized glass
and/or glass ceramics, the converter is provided as a tape and/or
as a sintered compact. Providing an organic converter represents
another alternative.
[0049] The converter and the optical component are joined with one
another in a subsequent step. The joining is preferably achieved by
sintering the converter. The sintering can be conducted with or
without pressure.
[0050] According to another aspect of the invention, initially the
converter is provided in a first step. In a first embodiment, the
converter is provided as a layer or a type of plate. Here, the
converter is a molding. It is thus essentially dimensionally
stable. The molding has its own stability. In this case, the
molding can be dimensionally stable, but still be deformable. The
converter is preferably positioned in a mold.
[0051] In another embodiment, the converter, preferably for a PiG
converter, is first provided as a pourable material, which is
positioned in a mold or introduced into a mold. A pourable material
is a material that is provided essentially as small converter
particles, such as, for example, as a type of powder or beads or
grains.
[0052] In a subsequent step, the converter or the configuration of
the converter will be formed by pressing the pourable material or
particles. The particles adhere together mechanically. A molding is
formed. Based on the applied pressure, this can in fact lead to a
type of cold welding of the particles at their contact surfaces. In
addition to the pressing and/or after the pressing, the formed
molding or the pourable material, which forms the converter, can be
heated so that the particles adhere to one another. The converter
is thus provided or produced via a sintering process.
[0053] The optical component is provided in the next method step.
In this case, the optical component is positioned on the
converter.
[0054] In one embodiment, the optical component is provided as is.
In this case, it essentially already has its "final" configuration.
The converter and/or the optical component are heated so that they
adhere to one another and form a composite. They are joined via
sintering.
[0055] In another embodiment, the optical component is formed by a
pressing and/or heating a pourable material from which the optical
component is formed. The optical component is thus likewise
produced via a sintering process. It is, so to speak, a type of
2-step sintering.
[0056] In another embodiment, which represents a type of 1-step
sintering, the mold is filled sequentially. The converter and the
optical component are provided in such a way that the mold is first
filled with the material that will form the converter, and then is
filled with the material that will form the optical component. Each
of the two materials is preferably a pourable material. On the one
hand, the converter and the optical component are formed via a
common pressing and/or heating of the two materials, and
simultaneously to this, the composite made up of converter and
optical component is also formed.
[0057] In another embodiment of the invention, the optical
component is provided in such a way that the optical component is
provided as a glass gob or a preform. The glass gob is also called
a glass section.
[0058] A glass gob or a preform is a molding from which the optical
component is formed or shaped by heating or melting. The optical
component is formed by a defined collapsing or folding together of
the molding or of the glass gob due to the reduced viscosity caused
by its heating. The shape of the molding can be adapted to the
shape of the optical component to be formed. The molding can also
be porous. It can also be multi-part. In this case, in one
embodiment, the glass gob or the preform is placed on the
converter, compressed and/or joined with the converter.
[0059] In another embodiment, the glass gob or the preform is
provided via a so-called "jetting" method. This name designates a
method in which the glass or the material is provided in such a
low-viscous state, that it can be sprayed on, so to speak, or
applied dropwise. The viscosity lies in a range of approximately
10.sup.2 dPas to approximately 10.sup.4 dPas. For illustration: The
named "jetting" method, for example, is similar to the mode of
operation of an ink-jet printer.
[0060] In another embodiment, the glass gob or the preform is
provided via a structuring or a so-called micro-structuring. For
this purpose, in one variant, a vitreous body or object, preferably
a plate, is placed on the converter and/or is produced on the
converter by means of a deposition method, such as, for example,
PVD ("Physical Vapor Deposition"). In the first named version, the
vitreous body or the object is placed on the converter, pressed,
and/or joined with the converter, for example, by means of
sintering. Optionally, the vitreous body or the object is or will
be heated prior ro the structuring, until it attains or possesses a
viscosity at which it adheres to the converter. The vitreous body
or object is "sintered" onto the converter. The glass gob or the
preform is produced by a material-abrading method. In this case,
the method comprises the following steps: 1.) Introducing a mask
onto the vitreous body or object, which maps the structure of the
glass gob or the perform, 2.) Removing the free-lying regions of
the vitreous body or of the object by means of lift-off technology,
and 3.) Removing the mask. The glass gob or the preform remains on
the converter. In another variant of the structuring, first a mask
is introduced onto the converter, which maps the structure of the
glass gob or the preform. In a next step, a vitreous body or an
object is deposited on the converter by means of a deposition
method, such as, for example, PVD ("Physical Vapor Deposition").
The mask, i.e., the regions of the mask that cover the converter,
are removed by the so-called lift-off method. The glass gob or the
preform remains on the converter.
[0061] In another embodiment, the glass gob or the preform is
heated until it attains or possesses a viscosity at which the
material adheres to the converter. The glass gob or the preform is
"sintered" onto the converter. A composite is formed.
[0062] In a next step, the glass gob or the preform is heated and
when it is molten or of low viscosity, the first optical component
is formed, preferably as a substantially semispherical lens. Such a
melting is named as so-called "reflow". Therefore, the optical
component as defined can be formed if the material is heated to a
viscosity that lies in a range of approximately 10.sup.3 dPas to
approximately 10.sup.8 dPas. For this purpose, the material or the
glass of the optical component has a T.sub.g which is approximately
50 to 300.degree. C. below the T.sub.g of the converter.
[0063] In order to be able to melt the glass gob or the preform in
a defined manner, limits or at least one limit will be provided or
disposed over and/or on the side of the converter, onto which the
optical component will be introduced. The limit is a type of
boundary or mold insert for the collapsing or melting of the glass
gob or the preform, so that the optical component can form in a
defined manner based on the surface tension. A convex lens is
preferably formed substantially as the optical component. The limit
extends at least in sections or essentially completely over the
peripheral extent of the glass gob or the preform. It defines a
boundary for the size and the shape of the optical component that
is being formed. The shape and the size of the limit are formed at
least in a base region of the optical component.
[0064] In one embodiment, the limit is a discontinuity in the
surface or the side of the converter, on which the optical
component will be introduced or formed. For example, it is a type
of discontinuity in a planar plane. Preferably, a plurality of
smaller optical components may also be produced in this way on a
converter.
[0065] The limit will be produced by a structuring of the side of
the converter on which the optical component will be introduced or
formed.
[0066] In this case, in one embodiment, raised structures or
crosspieces will be produced on the corresponding side of the
converter. In one embodiment, the limit will be produced via an
additive or material-applying method. One embodiment for producing
the limit is introducing a separate layer. The material for forming
the separate layer is at least a material selected from the group
including metal, glass and glass ceramics. The limit is introduced,
for example, via a coating process, such as vapor deposition,
and/or bonding, such as adhesion and/or sintering, and/or screen
printing.
[0067] In another embodiment, the limit is produced by a
material-abrading method or a correspondingly configured production
method for the converter. In this case, recesses, such as slots
and/or grooves, are produced or introduced on the corresponding
side of the converter. These are named as so-called "V grooves".
The limits are introduced, for example, via sandblasting, etching,
such as RIE ("Reactive Ion Etching"), ultrasonic machining, sawing,
and/or laser ablation.
[0068] In another embodiment, a limit is provided by positioning a
type of template, which is preferably positioned just above or on
the top side of the converter. The template can preferably be
removed again after melting. The template, preferably at least, is
composed of a material that does not adhere to the viscous glass
gob or to the viscous preform. An example is graphite. The template
is designated a fixation in the following.
[0069] In another embodiment, in a first step, the optical
component is provided first. In this case, the first optical
component essentially already has its "final" configuration.
[0070] In a subsequent method step, the converter is now provided
and joined with the optical component. The optical component will
be applied onto the converter. Possible methods for introducing the
converter are screen printing, pyrolysis, introducing a foil, flame
pyrolysis, and/or a CVD ("Chemical Vapor Deposition") process
and/or the introduction of a so-called microstructured glass.
[0071] According to another aspect of the present invention, the
converter is positioned via a mold, preferably as a molding. In a
next step, a heating is conducted, at least of the converter, until
the material of the converter reaches a viscosity at which the
converter sinks into the mold. Therefore, the converter can be
formed in a defined manner, if the material is heated to a
viscosity that lies in a range of approximately 10.sup.5 dPas to
approximately 10.sup.8 dPas. In order to make possible a defined
sagging of the converter, the latter possesses an average thickness
or height of approximately 0.05 mm to approximately 0.5 mm.
[0072] In the embodiment in which the optical component is provided
directly or already formed, it can be placed on the converter,
preferably while the converter is still in the heated and thus
"adherent" state and/or is pressed on it, so that a composite is
formed of the converter and the optical component.
[0073] In another embodiment, the providing of the optical
component comprises providing a glass gob or a preform, which is
positioned together with the converter on the mold. The glass gob
or the preform is disposed on or under the converter. Each time
depending on the embodiment, the glass gob or the preform can be
positioned before, during and/or after the sinking of the
converter.
[0074] The glass gob or the preform and the converter are heated
until they each reach a viscosity at which the converter and the
glass gob or the preform sink into the mold, in particular jointly
or sequentially. The converter and the glass gob or the preform
adhere to one another. A composite is formed. In the sinking or
sagging, the optical component is also formed at the same time from
the glass gob or the preform.
[0075] In one embodiment, the glass gob or the preform, preferably
after the converter has sunk, is heated and melted until the
material reaches a viscosity, at which the optical component is
formed, preferably as an essentially semispherical lens. Such a
melting is named a so-called "reflow". For further details or
improvements of the "reflow", in order to avoid repetition, refer
to the corresponding description.
[0076] According to another aspect of the invention, the converter
and the glass gob or the preform or the optical component are
disposed in a mold, sequentially or simultaneously. The converter
and the glass gob or the preform or the optical component are
joined together by pressing, preferably by so-called blank
pressing, and heating. In the case of the glass gob or the preform,
the optical component is formed simultaneously during the
pressing.
[0077] In one embodiment, the contact surface of the mold,
preferably the contact surface relative to the optical component is
provided structured, at least in sections. Thus, when the two
components, i.e., the converter and the optical component, are
joined, a structure, such as a DOE structure or a micro-optics
structure, can be introduced into the converter and/or the optical
component. For example, in this case, the structure of a Fresnel
lens can be impressed in the top side of the optical component.
[0078] According to another aspect of the invention, the converter
and/or the optical component is or are provided as such. Here, each
has already essentially reached the "final" configuration. The
converter and/or the optical component is or are produced, for
example, by pressing, preferably by so-called blank pressing.
[0079] In one embodiment, the converter and the optical component
are joined by means of an organic bonding, such as gluing, and/or
an inorganic bonding, such as sintering, sol-gel bonding and/or
diffusion bonding. In one variant, the converter and/or the optical
component is or are heated until they adhere to one another and
form a composite.
[0080] Not only can a single converter module be produced and/or
provided alone, but rather a plurality of converter modules can be
produced or provided jointly. Thus, an array or an arrangement that
comprises a plurality of the above-described converter modules also
lies within the scope of the present invention. The array results
in an embodiment in that rings are provided as the matrix. A ring,
particularly when it is manufactured of a metal material, is
produced by a so-called conductor frame method, such as, e.g.,
photochemical etching, punching, laser cutting, and/or water jet
cutting. In one embodiment, a plate is structured in such a way
that a plurality of rings is formed per plate. The ring is a
component of a matrix of individual housings. A matrix is a type of
base unit, in which the rings are embedded or disposed. The
individual rings are fastened to the respective matrix by means of
so-called crosspieces or connection rods.
[0081] In addition, the invention extends to an opto-electronic
component, which comprises at least one housing, at least one
converter module according to the present invention and at least
one opto-electronic functional element, in particular an LED, which
is disposed in the housing. In one embodiment, the opto-electronic
component has at least one LED and at least one monitoring
component, such as, for example, a photodiode, and/or at least one
thermocouple. These are disposed on the opto-electronic component,
preferably in the housing. The light intensity of the LED can be
monitored and/or regulated by means of the monitoring component.
The temperature of the LED can be monitored and/or regulated by
means of the thermocouple.
[0082] Further, a lighting device that contains at least one
converter module and/or an opto-electronic component according to
the present invention also lies within the scope of the present
invention. Examples of the lighting device are a seat lighting; a
reading light; a work light, which can be integrated into ceilings
or walls in particular; an object lighting in furniture and/or
buildings; a headlight and/or a rear light and/or an inside
lighting and/or an instrument or display lighting, preferably in
motor vehicles; and/or a background lighting for LCD displays.
DESCRIPTION OF THE DRAWINGS
[0083] The present invention will be explained in detail on the
basis of the following embodiment examples. Reference is made
hereto to the appended drawings. The same reference numbers refer
to the same parts in the individual drawings.
[0084] FIGS. 1a to 1i show schematically different embodiments of
the optical converter system according to the invention.
[0085] FIGS. 2a to 2f show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0086] FIGS. 3a to 3d show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0087] FIGS. 4a to 4d show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0088] FIGS. 5a to 5d show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0089] FIGS. 6a to 6d show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0090] FIGS. 7a to 7d show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0091] FIGS. 8a to 8h show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0092] FIGS. 9a to 9c show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0093] FIGS. 10a to 10d show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0094] FIGS. 11a to 11d show schematically different embodiments of
the method for producing the optical converter system according to
the invention.
[0095] FIGS. 12a to 12d each show schematically an optical
converter system having a package or housing in the assembled
state.
DETAILED DESCRIPTION
[0096] FIGS. 1a to 1i show schematically different embodiments of a
converter module 100 according to the invention, which is
designated below as optical converter system 100, in a cross
section. The system 100 presented in FIG. 1a is composed of a
converter 1, an optical component 2, which is called optics 2
below, a metal ring 3, and a layer 4, which is preferably applied
on the outside of metal ring 3. Optics 2 is disposed on the top
side is of converter 1. Optics 2 and converter 1 are joined
together cohesively. The top side 2a of optics 2 or optics 2 forms
a convex lens 2, at least in sections or completely. The convex
lens, for example, essentially has the form of a hemisphere. In
this way, the light emitted from converter 1 can be guided, in
particular, can be focussed. Metal ring 3 is fully extended over
the peripheral extent of optics 2. Ring 3 essentially serves as a
support for system 100 and/or for drawing off heat and/or as a
positioning aid and/or as a fastening means, for example, for a
housing 200. A layer 4 or a cladding 4 is presently applied onto
the outer side of ring 3. Layer 4 can be formed, for example, as a
cladding 4, in particular, by a deposition method. It serves
essentially for corrosion protection and/or for improving the
connection to a housing 200. Reference is made hereto to the
remarks relating to FIGS. 12a to 12d.
[0097] The individual embodiments illustrated in FIGS. 1b to 1i
correspond in part to the embodiment shown in FIG. 1a. With respect
to the same components, in order to avoid repetition, refer to the
explanations for FIG. 1a given above. The following remarks refer
essentially to the differences.
[0098] FIG. 1b shows an embodiment, in which converter 1 is
designed as a two-stage or an at least two-stage converter system
1. A multi-stage system can also be designated a sandwich
construction. Here, in particular, different converter layers 11
and 12, such as phosphor layers, for example, can be combined into
a converter 1. Examples of two different converters 1 are a Ce:YAG
converter 11 and a red phosphor converter 12.
[0099] FIG. 1a shows an embodiment, in which converter 1 is
embodied in turn as a two-stage or an at least two-stage system 11
and 13. Targeted scattering and/or diffusor centers, particularly
in one layer 13, will be produced hereby. An example of such a
two-stage system is a Ce:YAG converter 11 and a preferably white
YAG layer 13.
[0100] It may or may not be equipped with a ring 3, depending on
the use of the optical converter system 100 according to the
invention. FIG. 1d shows for this an embodiment of optical
converter system 100, which is composed only of converter 1 and
optics 2.
[0101] FIG. 1e shows an embodiment in which optics 2 is constructed
of a plurality of smaller optics 2. The large convex lens 2 which
is shown in FIG. 1d is presently exchanged or replaced by a
plurality of small convex lenses 2, which are disposed on the top
side is of converter 1. This makes possible comparable optical
properties of optics 2 with simultaneously reduced height of optics
2.
[0102] An optical converter system 100 according to the invention
is not necessarily designed only as a planar system 100. This is
also visible, in particular from the configuration illustrated in
FIG. 1f. Converter layer 1 or converter 1 is non-planar. The
converter 1 is designed as curved or curved in sections. Optics 2
is also formed as curved or curved in sections.
[0103] FIG. 1g shows an embodiment, in which the top side 2a of
optics 2 is formed as a so-called DOE ("Diffractive Optical
Element") 2. An example of a DOE 2 is a Fresnel lens. This is shown
in simplified form. In addition, an optional coating 14 or
functional layer 14 is applied onto the bottom side 1b of converter
1. An exemplary embodiment of such a functional layer 14 is an
anti-reflection layer 14, preferably in order to increase the light
decoupling efficiency of the optical converter system 100. For
example, a matching of the refractive index of converter 1 to a
blue LED 260 can be produced hereby.
[0104] An increase in the light decoupling efficiency can be
achieved as an alternative or additionally, by matched refractive
indices between converter 1 and optics 2. For example, converter 1
can possess a refractive index of 1.8. For example, a glass with a
low T.sub.g, such as P-LASF 47, has a matched refractive index of
1.8 for optics 2.
[0105] FIG. 1h shows an embodiment, in which another optics 21,
such as a convex lens, is disposed or applied onto the bottom side
1b of converter 1. The light beam coming from an LED 260 can then
be bundled by this additional optics 21. This in turn leads to an
improved decoupling efficiency.
[0106] FIG. 1i shows an embodiment, in which a means 5 for drawing
off heat is disposed or applied onto the top side is of converter
1. Means 5 for drawing off heat, for example, is a grid or network
made of a metal layer or diamond layer. Means 5 is coupled to metal
ring 3 or is applied to it. This leads to an improved heat
discharge.
[0107] Converter 1 is preferably an inorganic converter 1 or
comprises an inorganic material. Examples of materials for an
inorganic converter 1 are or comprise glass ceramics, PiG (phosphor
in glass) and/or ceramicized glass. As already mentioned above,
ring 3 is preferably a metal ring 3. Examples of materials for
metal ring 3 are or comprise NiFeCo alloys, NiFe alloys and/or
preferably ferritic special steels. The material or glass of the
optics is preferably matched to the properties of the converter.
The glasses have a refractive index in a range from approximately
1.4 to approximately 2. Suitable materials or glasses for optics 2
can be: Glasses with high IR transmission, since these are
transparent to heat radiation and/or glasses with matched
coefficient of thermal expansion (CTE), in order to obtain a
reduction in stress opposite converter 1 and metal ring 3 and/or
transparent glasses with refractive index matched to converter 1,
in order to increase the decoupling efficiencies, and/or glasses
with low T.sub.g, which essentially lie below the T.sub.g of
converter 1. Preferably, the T.sub.g of the glasses lies
approximately 50.degree. C. to approximately 300.degree. C. below
the T.sub.g of converter 1. Suitable glasses are, e.g., glasses
with a low T.sub.g, such as Schott glasses 8250, T-SK57, T-LASF47.
Unsuitable glasses are, e.g., P-SF67, since color changes and/or
opacities may occur. The application or deposition of a coating 4
is not presented in the following figures. An example of such a
coating 4 is an electroplated coating 4. A concrete execution is an
SnAgCu solder. If a coating 4 is to be applied onto metal ring 3, a
pretreatment of metal ring 3 is necessary in many cases. An example
of a pretreatment is an etching process. This can be carried out,
e.g., by means of an HF and/or an HCl acid. Thus, in a preferred
embodiment, the optical converter system 100 according to the
invention is an inorganic optical converter system 100.
[0108] The optical converter systems 100 according to the invention
may be produced individually. It is preferred, however, to produce
a plurality of optical converter systems 100 simultaneously.
Components 1, 2, 3 and/or 4, which are necessary for this purpose,
are each disposed or provided, at least partially, in a type of
matrix 40 or array 40 or line 40. A matrix 40 can preferably
contain approximately 50 to approximately 20,000 positions. FIGS.
2a to 11d show schematically different embodiments of the method
for producing the optical converter system 100 according to the
invention. The production takes place each time in a matrix 40. The
components necessary for this are shown in a cross section.
[0109] FIGS. 2a to 2f show a first exemplary embodiment of the
method according to the invention. First, a support 40 is provided,
in the top side of which is introduced a plurality of recesses 41
(FIG. 2a). Since a plurality of recesses 41 is introduced, support
40 is also designated as array 40. Support 40 is a preferably
conditioned graphite mold. In a subsequent method step, converter 1
or converter plates 1 are now positioned on the top side of support
40 or in recesses 41 (FIG. 2b). In a subsequent step, the metal
rings 3 are now positioned on the top side of support 40, for
example, by a simple placement (FIG. 2c). The positioning of
converter 1, rings 3 and/or glass gobs 2, from which optics 2 are
formed, can hereby be supported by so-called limiters 50 or
barriers 50 (FIG. 2d). These barriers 50, on the one hand, serve as
melting barriers, so that the glass blanks 2 that are introduced in
the following method steps can be melted in a defined manner.
Barriers 50 can also be used as centering aids and thus can also be
designated as adjustment pins 50. Barriers 50 can be provided,
e.g., as a plate 50, preferably a graphite plate 50, which is
positioned directly over the top side of support 40. In a
subsequent method step, glass gobs 2, which are also designated as
glass sections 2, are positioned on the top side of support 40, in
detail on converters 1 (FIG. 2e). Glass gobs 2 are positioned, for
example, also by a placement process, such as "pick and place".
Glass gobs 2 can be provided, e.g., as beads and/or as rod-shaped
segments. In a next step, glass gobs 2 are melted (FIG. 2f). For
this purpose, glass gobs 2 are heated to a temperature of
approximately 600 to approximately 1000.degree. C. Glass sections 2
become of low viscosity and run. In each case, glass gob 2 is
joined with metal ring 3 and converter 1. It is a cohesive
connection. Barriers 50 and/or rings 3 form a limit for the
collapsing or liquefying of glass gobs 2, so that, based on the
surface tension, an essentially defined convex lens is formed as
optics 2. This particularly takes place with a viscosity in a range
from approximately 10.sup.4 dPas to 10.sup.6 dPas. Melting
typically takes place with a time duration of approximately 1 to 15
min. During the melting, the formation of optics 2 and the joining
of optics 2 with converter 1 essentially take place
simultaneously.
[0110] Subsequently, the individual optical converter systems 100
are inspected. After this, they are then incorporated in a
corresponding housing 200. Reference is made hereto, however, to
the remarks relating to FIGS. 12a to 12d. The separation of the
individual optical converter systems 100 or the removal from
support 40 is not shown in the figures. Since components 100 in the
present example are only mounted or placed in recesses 41 of
support 40 or on the top side of the support, these can be simply
removed. Optical converter systems 100, however, are not
necessarily removed. A plurality of formed optical converter
systems 100 can also be supplied to a customer in a matrix.
[0111] In order to at least reduce an adverse effect on the
properties of optics 2 during the melting, the melting can be
carried out in a defined atmosphere. Examples of such a defined
atmosphere are nitrogen and/or hydrogen and/or argon. In order to
improve the glass surface of optics 2, here for the glass optics, a
fire polishing can still be conducted on the top side 2a of optics
2.
[0112] FIGS. 3a to 3b show a variant of the above-illustrated
method. A method is described in which the recesses 41 in the top
side of support 40 are configured such that both converter 1 as
well as metal ring 3 belonging thereto are disposed in recess 41.
Both converter 1 and metal rings 3 are preferably positioned by
means of a "pick and place process". This is different than in
FIGS. 2c to 2d, in which metal ring 3 is found on the surface of
support 40 and converter 1 is found in recess 41. Of course, it is
also conceivable that both converter 1 and metal ring 3 are
positioned on the surface of support 40. In such a case, the
positioning could be achieved via the above-described barriers 50.
Also, converters 1 are present combined from smaller converter
units 1. The individual converter units 1 are combined into a
converter 1 via the composite with optics 2 to be melted.
[0113] FIGS. 3c to 3d show another variant of the method, in which
only the metal frame 3 is positioned on the top side of support 40.
Glass sections 2 are positioned and a melting of glass sections 2
is carried out in metal frame 3. The formed composite is removed
from support 40. After this, the back side 2b of formed optics 2 is
planar ground and/or polished. Subsequently, the composite is
joined to a converter 1 via the ground-down back side 2b of optics
2. Joining the composite with converter 1, here with the front side
is of converter 1, is carried out via a bonding, pressing,
sintering, dispensing and/or laminating of converter 1 onto the
processed back side 2b of optics 2 or of the composite.
[0114] Another embodiment of the method according to the invention
is described in FIGS. 4a to 4d. A glass plate 20 and a converter 1
or a converter plate 10 are positioned opposite one another in a
first step (FIG. 4a). A sintering of glass plate 20 is carried out
on converter plate 10 (FIG. 4b). This takes place at a temperature
that lies just above the T.sub.g of the glass of glass plate 20. As
a result, there is a structuring of the glass plate (FIG. 4c).
Structuring is such that recesses 22 or passages 22 are formed in
glass plate 20. In this case, individual glass gobs 2 are formed on
the top side of converter plate 10, from which are later formed
optics 2. Structuring can be conducted by means of RIE ("Reactive
Ion Etching") and/or sandblasting and/or wet etching and/or
ultrasonic machining and/or sawing. Structuring is preferably
conducted via a lithography method. For structuring, in particular,
by means of RIE, in general, a type of mask is applied onto top
side 20a of glass plate 20, which is then removed again after the
structuring, which is not shown, however, in the present figures.
After the structuring, a melting of glass section 2 is conducted
(FIG. 4d). In the defined melting of the glass, in turn, a
so-called semi-spherical lens is formed as optics 2. The glass is
fused in a temperature range from approximately 100 to 140.degree.
C., preferably of approximately 120.degree. C., above the T.sub.g
of the glass. In this case, a temperature of 625.degree. C. results
for glass T-SK57. The duration of melting lies in a range of
approximately 15 min to approximately 25 min, preferably of
approximately 20 min. Optical converter systems 100 are separated,
for example, by means of cutting or lapping. If a correspondingly
large component is necessary, it can also be used directly.
[0115] FIGS. 5a to 5d show a variant of the process, in which a
glass plate 20 is structured. In this case, a support 40 is
provided, in which recesses 41 are introduced and in which the
converter plates 1 or converter 1 can be positioned (FIG. 5a). A
sintering of glass plate 20 on converter 1 and preferably also on
support 40 (FIG. 5b), a structuring of glass plate 20 (FIG. 5c),
and a melting of glass gobs 2 formed by the structuring (FIG. 5d)
are all carried out (FIG. 5d). For further details, reference is
made to the embodiments relating to FIGS. 4a to 4d. Optics 2 are
formed here, however, in a defined manner, since a type of barrier
50 is formed for the collapsing of glass gobs 2 by means of the
edges of converter 1 or of recesses 41.
[0116] FIGS. 6a to 6d show the next embodiment of the method
according to the invention. First, a converter plate 10 is provided
(FIG. 6a). Converter plate 10 is equipped with a fixation 50 or a
barrier 50 and glass gobs 2 (FIG. 6b or FIG. 6c). Glass gobs 2 can
be provided, e.g. as glass beads 2. A barrier for the melting of
glass blanks 2 is defined by means of barrier 50. Barrier 50 is
preferably formed from graphite. The melting is shown in FIG. 6d.
The melting occurs analogously to the melting shown in FIG. 5d.
[0117] FIGS. 7a to 7d show a modification of the method presented
in FIGS. 6a to 6d. In this case, barrier 50 or limit 50 is formed
or defined for the melting by means of a structuring 15 of the top
side 10a of converter 1 or of converter plate 10. In this case,
barrier 50 or structuring 50 can be provided by a subtractive
structure 15, such as a recess 15, or by an additive structure,
such as an applied layer 15, or by a combination of the two.
Structuring 50 is presently formed, for example, as recess 15 or
opening 15 in top side 10a of converter plate 10. The structuring
is produced, for example, via sintering, RIE, sawing and/or a
coating/lithography process. A barrier 50 can also be produced by a
combination of providing a barrier 50 and by structuring,
preferably, top side is of converter 1.
[0118] Another embodiment of the method according to the invention
is illustrated in FIGS. 8a to 8h. First, a mold 60, preferably a
graphite mold, is provided (FIG. 8a). A plurality of recesses 61 is
introduced into one side of mold 60. The mold and the dimensions of
the individual recesses 61 or openings 61 are matched to the
optical converter system 100 to be formed. Recesses 61 represent a
negative mold for the optical converter system 100 to be formed,
here, optics 2 to be formed. In order to produce a desired lens
effect, the lens shape is adjusted via the geometry of graphite
molds 61 or openings 61. Optics 2 are provided via a so-called
blank pressing process. Mold 60 is furnished with glass gobs 2 in
its openings 61 (FIG. 8b). By means of a second top mold 70,
preferably formed as a graphite mold, glass gob 2 is now
blank-pressed between the bottom mold 60 and the top mold 70 (FIGS.
8c and 8d). This takes place at a temperature that preferably lies
in a range from approximately 50 to approximately 90.degree. C.
above the T.sub.g of the glass.
[0119] The providing of converter 1 or of converters 1 is described
in FIGS. 8e to 8g. First, a mold 80 is provided. Corresponding
openings 81 are introduced in the top side of mold 80. Openings 81
are adapted to the mold and the dimensions of the optical converter
system 100 or of converter 1 to be formed. Openings 81 represent a
negative mold of the optical converter system 100, particularly of
converter 1 to be formed. A type of channel 82 is optionally
introduced in the top side of the respective opening 81. Converters
1 are positioned by this channel 82. Converters 1 preferably
possess a constant thickness due to the color coordinate stability
that is to be produced. Converters 1 are now heated. Heating is
conducted at a temperature in a range from approximately 400 to
800.degree. C. Converters 1 collapse, sinking into opening 81 and
are essentially matched to the shape of opening 81.
[0120] The combining of the two pre-shaped components, optics 2 and
converter 1, is illustrated in FIG. 8h. The two components 1 and 2
are joined together via a connection process, such as, e.g.,
sol-gel bonding and/or diffusion bonding.
[0121] A variant of the above-described sagging and sinking process
is shown in FIGS. 9a to 9c. First, converter plates 1 in a shape
(FIG. 9a) as has already been illustrated in FIGS. 8e to 8g are
provided and heated. After converters 1 are shaped or formed, now
optics 2, preferably lenses 2, are applied via a reflow process.
This is illustrated in FIGS. 9b and 9c. First, glass gobs 2,
presently formed as small beads, are provided in openings 81. A
joining of the individual converters 1 and the respective glass
gobs 2 is conducted by heating and melting glass gobs 2. Lens 2 or
optics 2 is formed or shaped simultaneously.
[0122] FIGS. 10a to 10d show another variant of the method
according to the invention. In this case, the optical converter
system 100 is produced via a blank pressing process. For this
purpose, both glass gobs 2 and converter 1 are each provided in an
opening 61 of mold 60. The forming of optical converter system 100
or the forming of the configuration of optical converter system 100
is produced here by combining mold 60 with mold 70. In order to
additionally introduce a DOE structure 23 or a micro-optics
structure 23 in optics 2, in detail to introduce it in the top side
2a of optics 2, corresponding structures 62 are introduced or
disposed in the bottom of openings 61. The zigzag shape that is
shown illustrates the corresponding structure. Structures 62
represent a negative mold of the structures 23 to be formed on the
top side 2a of optics 2. Thus, a hot press is again equipped with a
press mold 60 and 70, converter substrate 1 and glass gob 2 made of
a glass with low T.sub.g. Structures 62 are impressed, as it were,
in the glass or in optics 2. The following method parameters result
for a glass P-SK57: A pressing takes place at a temperature of 530
to 590.degree. C., preferably approximately 560.degree. C., at
approximately 10 to 50 kg/cm.sup.2, particularly for a time of
approximately 1 to 3 min.
[0123] Of course, optical converter systems 100 produced with the
above-described method may or may not be equipped with a metal ring
3, even if this is not shown in detail in the individual figures.
If a metal ring 3 is used, the metal ring 3, of course, can also be
metallized. For this purpose, FIGS. 11a to 11d illustrate once more
the method that is described in FIGS. 10a to 10d, with the use of
metal rings 3. Metal rings 3 are provided, for example, by the mold
70. They can also be positioned in the spaces formed.
[0124] FIGS. 12a to 12d illustrate the use of the optical converter
systems 100 according to the invention in a package 200 or housing
200. A total system 300 or an LED package 300 is formed. The
optical converter system 200 according to the invention serves, so
to speak, as a type of cover for the housing 200. The package 200
can be a GTMS package ("Glass To Metal Seal"), Si package, a
plastic package, and/or a ceramics package.
[0125] FIGS. 12a to 12d illustrate the cross section of a housing
200. In each case, this is a three-layer housing 200. It is
composed of or comprises a composite made of a base part 201, a
first glass layer 202, two connection parts 203, a second glass
layer 204 and a head part 205. An LED 260 is disposed inside
housing 200. LED 260 or LED chip 260 is disposed in a mounting
region 212. LED 260 is joined to connection parts 203 and 204 via
wires 273. The so-called passage region 261 for the radiation or
the light that is emitted from LED 260 is found above LED 260. The
top side of passage region 261 is closed by the optical converter
system 100 according to the invention. The passage region 261 and
thus package 200 is preferably hermetically sealed by cover 100.
This can be carried out, e.g., via soldering the optical converter
system 100 to the head part 205 or the top side 200a of housing
200, which is provided from a metal.
[0126] For example, LED 260 is a blue-emitting LED and converter 1
is a glass that contains a luminescent coloring substance, such as
so-called yellow phosphorus. The short-wave blue light excites the
coloring substance to light up. This effect is called
photoluminescence. In this way, a long-wave yellow light is
emitted. In general, the entire blue light is not converted. In
this way, white light results from an additive color mixing of the
two spectral colors blue and yellow. The conversion from blue to
yellow can take place also by means of a ceramicized glass. In
another example, LED 260 is an LED emitting UV light, and converter
1 is a glass that contains several luminescent coloring substances,
such as so-called red, green and blue (RGB) phosphorus. The
short-wave UV light excites the coloring substance to light up.
Red, green and blue light are emitted in this way. Therefore, white
light results from an additive color mixing. In order to increase
the CRI values, a converter 1 can also be combined with an RGB-LED
260. Optionally, in each case, at least one red LED 260 and/or one
green LED 260 can be used additionally, which is not shown,
however, in the figures. In this way, the color location can be
changed and the light can be finely adjusted.
[0127] FIG. 12a shows an embodiment in which the system 100 is
"simply" placed on housing 200. The three arrows depicted above LED
260 illustrate the direction of emission of radiation emitted by
LED 260. FIG. 12b shows an embodiment in which a concentrator 24 or
a so-called "light pipe" 24 is disposed on converter 1 as optics 2.
On the one hand, the insides of concentrator 24 act as the
reflector. On the other hand, the walls also operate as a type of
light guide for the light that is emitted laterally from converter
1. The decoupling efficiency of the entire system 300 can be
increased by means of concentrator 24. In addition, a second optics
2, designed as lens 25, is disposed on concentrator 23.
[0128] In addition, another optics 21 can be disposed underneath
converter 1, preferably directly on the bottom side 1b of converter
1. A bundling of the light coming from LED 260 or from the light
radiation coming from LED 260 can be produced via such an optics
21. This is shown in FIG. 12c.
[0129] FIGS. 12a to 12c in each case show an application of the
present invention, in which system 100 is disposed at a distance
from LED 260. FIG. 12d shows an embodiment, in which converter 1
sits on LED 260 or is positioned adjacent to LED 260. The passage
region 261 in this case is filled essentially completely by the
converter 1.
[0130] The present system 100 is preferably an inorganic system
100. System 100 is composed, preferably at least, of one converter
1 and/or an optics 2 and/or a metal support 3. Metal support 3, as
described above, can be formed as a ring 3 or as a cap 3. System
100, among other things, can be used as a package cover or as a
package closure. The design of the method is suitable for mass
production. This is possible based on prevailing processes, such as
melting, sagging, sintering, stamping, etc. The temperature
resistance, but also the resistance to temperature changes of an
optical converter system 100 according to the invention clearly
lies above the temperature resistance of known systems. A
temperature resistance of up to approximately 400.degree. C. can be
obtained for system 100 without a metal ring 3. With a metal ring 3
and for, e.g., a solder containing Sn, system 100 has a resistance
of up to approximately 350.degree. C. Also, the preferred
components of the system are resistant or are substantially
resistant to UV and to chemicals. If system 100 according to the
invention is used as a package cover, it can be fastened onto a
package 200 in a way that is sealed against air and/or moisture.
Since preferably essentially only inorganic components are used,
there is no degassing of components, e.g., in the form of
hydrocarbons. Thus, an organic contamination of LED 260 can be
essentially avoided. Package 200 can be baked and, in fact, filled
with inert gas and sealed.
[0131] It is obvious to the person skilled in the art that the
described embodiments are to be understood by way of example. The
invention is not limited to these embodiments, but can be varied in
many ways without leaving the spirit of the invention. Features of
individual embodiments and the features named in the general part
of the description in each case can be combined among themselves
and also with one another.
LIST OF REFERENCE SYMBOLS
TABLE-US-00001 [0132] 1 Converter 1a Top side of the converter 1b
Bottom side of the converter 2 Optical component or optics or glass
gob or glass section 2a Top side of the optical component 2b Bottom
side of the optical component 3 Ring or metal ring or metal support
4 Coating or cladding 5 Means for heat removal 10 Converter plate
10a Top side of the converter plate 10b Bottom side of the
converter plate 11 Converter layer 12 Converter layer 13 Converter
layer 14 Functional layer or coating 15 Structuring or opening or
recess 20 Glass plate 20a Top side of the glass plate 20b Bottom
side of the glass plate 21 Optical component or optics 22 Recesses
or passages 23 DOE structure or microstructure 24 Concentrator 25
Lens 40 Matrix or array or support 41 Recess 50 Limit or limiter or
barrier 60 Lower mold or support 61 Recess or opening 62 Structure
70 Top mold 71 Counterpiece to recess 61 80 Mold or support 81
Recess or opening 82 Channel 100 Converter module or optical
converter system 200 Housing or functional element housing 200a Top
side of the housing 201 Base part or base or support 202 First
glass layer 203 Connection part or conductor strip 204 Second glass
layer 205 Head part or reflector 212 Assembly region for the
functional element 260 Opto-electronic functional element or LED
261 Passage region 273 Wire or wire bonding 300 Total system or LED
package
* * * * *