U.S. patent application number 15/025370 was filed with the patent office on 2016-12-22 for power conversion unit, power converter, and power conversion method.
The applicant listed for this patent is HITACHI, LTD.. Invention is credited to Yukio HATTORI, Hiroshi KAMIDUMA, Tetsuya KAWASHIMA, Yuichi MABUCHI, Daisuke MATSUMOTO, Akira MIMA.
Application Number | 20160373017 15/025370 |
Document ID | / |
Family ID | 54071073 |
Filed Date | 2016-12-22 |
United States Patent
Application |
20160373017 |
Kind Code |
A1 |
MIMA; Akira ; et
al. |
December 22, 2016 |
Power Conversion Unit, Power Converter, and Power Conversion
Method
Abstract
An imbalance of control signals between two power semiconductor
elements is reduced. A first power semiconductor module and a
second power semiconductor module are arranged in a predetermined
direction along a surface of a control signal wiring circuit board,
each of longitudinal directions of the first power semiconductor
module and the second power semiconductor module along the surface
of the control signal wiring circuit board is a predetermined
direction, and, in a first control signal wiring, a distance
between an external control signal terminal and a second control
signal terminal is equal to a distance between the external control
signal terminal and a first control signal terminal.
Inventors: |
MIMA; Akira; (Tokyo, JP)
; HATTORI; Yukio; (Tokyo, JP) ; KAWASHIMA;
Tetsuya; (Tokyo, JP) ; MABUCHI; Yuichi;
(Tokyo, JP) ; MATSUMOTO; Daisuke; (Tokyo, JP)
; KAMIDUMA; Hiroshi; (Tokyo, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HITACHI, LTD. |
Chiyoda-ku, Tokyo |
|
JP |
|
|
Family ID: |
54071073 |
Appl. No.: |
15/025370 |
Filed: |
March 10, 2014 |
PCT Filed: |
March 10, 2014 |
PCT NO: |
PCT/JP2014/056122 |
371 Date: |
March 28, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H02J 9/06 20130101; H02M
5/4585 20130101; H02M 7/2173 20130101; H02M 7/5387 20130101; H02M
7/003 20130101; H02M 7/537 20130101 |
International
Class: |
H02M 5/458 20060101
H02M005/458; H02M 7/217 20060101 H02M007/217; H02M 7/537 20060101
H02M007/537; H02M 7/00 20060101 H02M007/00; H02J 9/06 20060101
H02J009/06 |
Claims
1. A power conversion unit, comprising: a first power semiconductor
module including a first circuit portion for converting power, a
first power terminal for inputting/outputting power to/from the
first circuit portion, and a first control signal terminal for
inputting a control signal to the first circuit portion; a second
power semiconductor module including a second circuit portion for
converting power, a second power terminal for inputting/outputting
power to/from the second circuit portion, and a second control
signal terminal for inputting a control signal to the second
circuit portion; a power wiring connecting the first power terminal
and the second power terminal in parallel to an external power
terminal for inputting/outputting power; and a control signal
wiring circuit board including a first control signal wiring
connecting the first control signal terminal and the second control
signal terminal in parallel to an external control signal terminal
for receiving a control signal from a control device, wherein: the
first power semiconductor module and the second power semiconductor
module are arranged in a predetermined direction along a surface of
the control signal wiring circuit board; each of longitudinal
directions of the first power semiconductor module and the second
power semiconductor module in a surface direction of the control
signal wiring circuit board is the predetermined direction; and in
the first control signal wiring, a distance between the external
control signal terminal and the second control signal terminal is
equal to a distance between the external control signal terminal
and the first control signal terminal.
2. The power conversion unit according to claim 1, wherein: the
first control signal wiring includes a first main wire serving as a
wiring connecting the external control signal terminal and a first
branch point, a first branch wire serving as a wiring connecting
the first branch point and the first control signal terminal, and a
second branch wire serving as a wiring connecting the first branch
point and the second control signal terminal; and a distance of the
second branch wire is equal to a distance of the first branch
wire.
3. The power conversion unit according to claim 2, wherein: the
first circuit portion includes a first positive-electrode side
switching element, a first negative-electrode side switching
element connected to a negative-electrode side of the first
positive-electrode side switching element, the first control signal
terminal for inputting a control signal to the first
positive-electrode side switching element, and a third control
signal terminal for inputting a control signal to the first
negative-electrode side switching element; the second circuit
portion includes a second positive-electrode side switching
element, a second negative-electrode side switching element
connected to a negative-electrode side of the second
positive-electrode side switching element, the second control
signal terminal for inputting a control signal to the second
positive-electrode side switching element, and a fourth control
signal terminal for inputting a control signal to the second
negative-electrode side switching element; the control signal
wiring circuit board connects the third control signal terminal and
the fourth control signal terminal in parallel to the external
control signal terminal; the second control signal wiring includes
a second main wire serving as a wiring connecting the external
control signal terminal and a second branch point, a third branch
wire serving as a wiring connecting the second branch point and the
third control signal terminal, and a fourth branch wire serving as
a wiring connecting the second branch point and the fourth control
signal terminal; and a distance of the fourth branch wire is equal
to a distance of the third branch wire.
4. The power conversion unit according to claim 3, comprising a
heat receiving portion into which the first circuit portion and the
second circuit portion are inserted in a direction that is in
parallel to the surface of the control signal wiring circuit board
and is vertical to the predetermined direction, the heat receiving
portion being for receiving heat from the first circuit portion and
the second circuit portion.
5. The power conversion unit according to claim 4, wherein: the
first control signal terminal and the second control signal
terminal are arranged to have mirror symmetry on the control signal
wiring circuit board and the third control signal terminal and the
fourth control signal terminal are arranged to have mirror symmetry
on the control signal wiring circuit board with respect to a
virtual plane vertical to the predetermined direction between the
first power semiconductor module and the second power semiconductor
module.
6. The power conversion unit according to claim 5, wherein: the
first control signal terminal, the second control signal terminal,
the third control signal terminal, and the fourth control signal
terminal are arranged along a virtual straight line in the
predetermined direction on the surface of the control signal wiring
circuit board.
7. The power conversion unit according to claim 5, wherein: the
first power semiconductor module includes a first temperature
detection terminal for outputting a result of temperature detection
using the first circuit portion; the second power semiconductor
module includes a second temperature detection terminal for
outputting a result of temperature detection using the second
circuit portion; the control signal wiring circuit board includes a
first temperature detection wiring between the first temperature
detection terminal and a terminal connected to the control device
and a second temperature detection wiring between the first
temperature detection terminal and a terminal connected to the
control device; and the first control signal wiring, the second
control signal wiring, the first temperature detection wiring, and
the second temperature detection wiring are not overlapped on one
another in a thickness direction of the control signal wiring
circuit board.
8. The power conversion unit according to claim 1, wherein the
external power terminal is connected to an external power terminal
of another power conversion unit via a unit connection portion.
9. The power conversion unit according to claim 7, wherein in the
power wiring, a distance between the external power terminal and
the second power terminal is equal to a distance between the
external power terminal and the first power terminal.
10. The power conversion unit according to claim 1, comprising: a
capacitor connected in parallel to the first circuit portion and
the second circuit portion via the power wiring; and short-circuit
protection elements connected in series to the first circuit
portion and the second circuit portion via the power wiring.
11. The power conversion unit according to claim 1, wherein: the
first power semiconductor module and the second power semiconductor
module have the same configuration and are arranged to have
rotational symmetry with respect to a virtual straight line
vertical to the control signal wiring circuit board.
12. A power converter, comprising: a plurality of power conversion
units; and a unit connection portion for connecting the plurality
of power conversion units, wherein; each of the plurality of power
conversion units includes a first power semiconductor module
including a first circuit portion for converting power, a first
power terminal for inputting/outputting power to/from the first
circuit portion, and a first control signal terminal for inputting
a control signal to the first circuit portion, a second power
semiconductor module including a second circuit portion for
converting power, a second power terminal for inputting/outputting
power to/from the second circuit portion, and a second control
signal terminal for inputting a control signal to the second
circuit portion, a power wiring connecting the first power terminal
and the second power terminal in parallel to an external power
terminal for inputting/outputting power, and a control signal
wiring circuit board including a first control signal wiring
connecting the first control signal terminal and the second control
signal terminal in parallel to an external control signal terminal
for receiving a control signal from a control device; the first
power semiconductor module and the second power semiconductor
module are arranged in a predetermined direction along a surface of
the control signal wiring circuit board; each of longitudinal
directions of the first power semiconductor module and the second
power semiconductor module in a surface direction of the control
signal wiring circuit board is the predetermined direction; and in
the first control signal wiring, a distance between the external
control signal terminal and the second control signal terminal is
equal to a distance between the external control signal terminal
and the first control signal terminal.
13. A power conversion method in a power conversion unit including
a first power semiconductor module including a first circuit
portion for converting power, a first power terminal for
inputting/outputting power to/from the first circuit portion, and a
first control signal terminal for inputting a control signal to the
first circuit portion, a second power semiconductor module
including a second circuit portion for converting power, a second
power terminal for inputting/outputting power to/from the second
circuit portion, and a second control signal terminal for inputting
a control signal to the second circuit portion, a power wiring
connecting the first power terminal and the second power terminal
in parallel to an external power terminal for inputting/outputting
power, and a control signal wiring circuit board including a first
control signal wiring connecting the first control signal terminal
and the second control signal terminal in parallel to an external
control signal terminal for receiving a control signal from a
control device, the method comprising: inputting control signals to
the external control signal terminal from the control device; and
branching the control signals so that, in the first control signal
wiring, a distance between the external control signal terminal and
the second control signal terminal is equal to a distance between
the external control signal terminal and the first control signal
terminal, and inputting the control signals to the first control
signal terminal and the second control signal terminal, wherein:
the first power semiconductor module and the second power
semiconductor module are arranged in a predetermined direction
along a surface of the control signal wiring circuit board; and
each of longitudinal directions of the first power semiconductor
module and the second power semiconductor module in a surface
direction of the control signal wiring circuit board is the
predetermined direction.
Description
TECHNICAL FIELD
[0001] The present invention relates to a circuit for converting
power.
BACKGROUND ART
[0002] In recent years, increase in a capacity of an inverter
serving as a power converter has been demanded. In order to
increase the capacity, it is necessary to connect IGBTs (Insulated
Gate Bipolar Transistors) which are power semiconductor elements or
freewheeling diodes in parallel.
[0003] However, in the case where power semiconductor modules
including power semiconductor elements such as IGBTs or diodes are
connected in parallel, it is problematic in that an imbalance of
current flowing through the power semiconductor elements connected
in parallel occurs due to an imbalance of parasitic resistance or
parasitic inductance in power wirings of the power semiconductor
elements. Output current tends to be concentrated on a power
semiconductor element in which a parasitic resistance or a
parasitic inductance of a power wiring is small, and therefore a
life and reliability of the power semiconductor element may be
reduced.
[0004] Regarding the above problem, for example, PTL 1 discloses a
technique for achieving equal output current by having an equal
impedance in power wirings connecting power semiconductor elements.
PTL 2 discloses a structure for correcting a current imbalance and
reducing a surge voltage by having equal current flowing through
switching elements and minimizing a conductor connecting the
switching elements.
CITATION LIST
Patent Literatures
[0005] PTL 1: JP-A-7-007958
[0006] PTL 2: JP-A-6-261556
SUMMARY OF INVENTION
Technical Problem
[0007] However, an imbalance of current occurs also due to an
imbalance between control signal wirings of power semiconductor
elements.
Solution to Problem
[0008] In order to solve the above problem, a power conversion unit
which is an embodiment of the invention includes: a first power
semiconductor module including a first circuit portion for
converting power, a first power terminal for inputting/outputting
power to/from the first circuit portion, and a first control signal
terminal for inputting a control signal to the first circuit
portion; a second power semiconductor module including a second
circuit portion for converting power, a second power terminal for
inputting/outputting power to/from the second circuit portion, and
a second control signal terminal for inputting a control signal to
the second circuit portion; a power wiring connecting the first
power terminal and the second power terminal in parallel to an
external power terminal for inputting/outputting power; and a
control signal wiring circuit board including a first control
signal wiring connecting the first control signal terminal and the
second control signal terminal in parallel to an external control
signal terminal for receiving a control signal from a control
device. The first power semiconductor module and the second power
semiconductor module are arranged in a predetermined direction
along a surface of the control signal wiring circuit board, each of
longitudinal directions of the first power semiconductor module and
the second power semiconductor module in a surface direction of the
control signal wiring circuit board is the predetermined direction,
and, in the first control signal wiring, a distance between the
external control signal terminal and the second control signal
terminal is equal to a distance between the external control signal
terminal and the first control signal terminal.
Advantageous Effects of Invention
[0009] According to an embodiment of the invention, it is possible
to reduce an imbalance of control signals between two power
semiconductor elements.
BRIEF DESCRIPTION OF DRAWINGS
[0010] FIG. 1 is a circuit diagram of a UPS according to an
example.
[0011] FIG. 2 is a circuit diagram of a power conversion unit
300.
[0012] FIG. 3 is a perspective diagram of the power conversion unit
300.
[0013] FIG. 4 is an exploded perspective diagram of and around
power semiconductor modules 101a and 101b in the power conversion
unit 300.
[0014] FIG. 5 is a circuit diagram of the power semiconductor
modules 101a and 101b.
[0015] FIG. 6 is a plan view of a power wiring aggregate 110 seen
in a Y direction.
[0016] FIG. 7 is a plan view of a first modification example of the
power wiring aggregate 110.
[0017] FIG. 8 is a plan view of a second modification example of
the power wiring aggregate 110.
[0018] FIG. 9 is a plan view of a control signal wiring circuit
board 100 seen in a Y direction.
[0019] FIG. 10 is a perspective diagram of a power conversion unit
300b in Example 2.
[0020] FIG. 11 is a perspective diagram of a power conversion part
2a in Example 2.
DESCRIPTION OF EMBODIMENTS
[0021] Examples of the invention will be described below with
reference to drawings. Note that the same components in the
drawings are denoted by the same reference signs and repeated
description thereof is omitted.
Example 1
[0022] A UPS (Uninterruptible Power-supply System) will be
described as an example.
[0023] FIG. 1 is a circuit diagram of a UPS according to an
example.
[0024] This UPS 2 is an online type UPS that can uninterruptedly
continue power supply at the time of interruption of power supply.
Note that the invention is not limited to the online type UPS and
may also be another type UPS such as an off line type UPS.
[0025] A commercial power supply 3 having a three-phase alternating
current supplies power to a load 4 via an converter 411 and an
inverter 412 at the time of normal operation. Herein, the converter
411 converts the commercial power supply 3 having a three-phase
alternating current into a DC voltage 5 and supplies the DC voltage
5 to the inverter 412. The inverter 412 converts the DC voltage 5
into a three-phase AC power 6. With this, even in the case where a
change in voltage such as instantaneous voltage drop occurs in the
commercial power supply 3, power that is equal to that of a normal
commercial power supply can be stably supplied to the load 4 by the
converter 411 and the inverter 412 performing control.
[0026] Meanwhile, at the time of interruption of power supply,
power is supplied to the load 4 from a storage battery 14 via the
inverter 412 while the inverter 412 is on. With this, the UPS 2 can
uninterruptedly supply power to the load 4. In this example, in
order to reduce a volume of the UPS 2, a total voltage of the
storage battery 14 is satisfactorily lower than a DC voltage
applied to the inverter 412. Therefore, the UPS 2 in this example
includes a boost chopper 413 for boosting a low DC voltage output
by discharging electricity from the storage battery 14 to a desired
DC voltage 5 and outputting the DC voltage 5 to the inverter 412.
Note that, in the case where there is no limitation in the volume,
the UPS 2 excluding the boost chopper 413 is also applicable to a
UPS 2 including a high-voltage storage battery 14 that can supply a
desired DC voltage.
[0027] In the following description, the converter 411, the
inverter 412, and the boost chopper 413 will be referred to as a
power converter 2a.
[0028] The UPS 2 may further include a cooling mechanism for
performing air-cooling on the power converter 2a.
[0029] A bypass circuit 17 bypasses the power converter 2a in
response to an instruction, thereby directly connecting the
commercial power supply 3 and the load 4. A maintenance bypass
circuit 16 bypasses the power converter 2a and the bypass circuit
17 in response to an instruction in order to maintain the power
converter 2a and the bypass circuit 17, thereby directly connecting
the commercial power supply 3 and the load 4.
[0030] A power conversion unit 300 constituting the power converter
2a will be described below.
[0031] The power converter 2a includes a plurality of power
conversion units 300. The converter 411 is constituted by
connecting three power conversion units 300 corresponding to three
phases R, S, and T in parallel. The inverter 412 is constituted by
connecting three power conversion units 300 corresponding to three
phases U, V, and W in parallel. The boost chopper 413 is
constituted by at least one power conversion unit 300.
[0032] FIG. 2 is a circuit diagram of the power conversion unit
300.
[0033] The power conversion unit 300 includes power semiconductor
modules 101a and 101b, a smoothing capacitor 120, short-circuit
protection elements (fuses) 160p and 160n, a control signal wiring
circuit board 100, and a power wiring aggregate 110. The power
wiring aggregate 110 is integration of an output wiring 170, a
positive-electrode power wiring 180, and a negative-electrode power
wiring 190. For example, the output wiring 170, the
positive-electrode power wiring 180, and the negative-electrode
power wiring 190 are formed as flat-plate like conductors, and the
output wiring 170, the positive-electrode power wiring 180, and the
negative-electrode power wiring 190 are insulated and laminated,
and thus the power wiring aggregate 110 is formed as flat-plate
like.
[0034] The power semiconductor module 101a includes a power
semiconductor element 11, a freewheeling element 21 connected in
parallel to the power semiconductor element 11, a power
semiconductor element 12 connected in series to a
positive-electrode side of the power semiconductor element 11, a
freewheeling element 22 connected in parallel to the power
semiconductor element 12, and a temperature detection element 51
for detecting a temperature in the power semiconductor module 101a.
Similarly, the power semiconductor module 101b includes a power
semiconductor element 13, a freewheeling element 23 connected in
parallel to the power semiconductor element 13, a power
semiconductor element 14 connected in series to a
positive-electrode side of the power semiconductor element 13, a
freewheeling element 24 connected in parallel to the power
semiconductor element 14, and a temperature detection element 52
for detecting a temperature in the power semiconductor module 101b.
In this example, the power semiconductor modules 101a and 101b have
the same configuration. The power semiconductor elements 11, 12,
13, and 14 are, for example, switching elements such as IGBTs. The
freewheeling elements 21, 22, 23, and 24 are, for example,
diodes.
[0035] Positive-electrode power elements 180a and 180b of the power
semiconductor modules 101a and 101b are positive electrodes of the
power semiconductor elements 12 and 14, respectively. The
positive-electrode power elements 180a and 180b are connected to
one end of the positive-electrode side short-circuit protection
element 160p via the positive-electrode power wiring 180, and the
other end of the short-circuit protection element 160p serves as an
external positive-electrode power terminal 180t. Negative-electrode
power terminals 190a and 190b of the power semiconductor modules
101a and 101b are negative electrodes of the power semiconductor
elements 11 and 13, respectively. The negative-electrode power
terminals 190a and 190b are connected to the negative-electrode
side short-circuit protection element 160n via the
negative-electrode power wiring 190, and the other end of the
short-circuit protection element 160n serves as an external
negative-electrode power terminal 190t. With this, the power
semiconductor modules 101a and 101b are connected to each other in
parallel. The external positive-electrode power terminal 180t is
connected to an external positive-electrode power terminal of
another power conversion unit 300 via a unit connection portion.
The external negative-electrode power terminal 190t is connected to
an external negative-electrode power terminal of another power
conversion unit 300 via the unit connection portion. The unit
connection portion is, for example, a bus bar including a positive
electrode conductor for connecting the external positive-electrode
power terminals 180t of the plurality of power units 300 and a
negative electrode conductor for connecting the external
negative-electrode power terminals 190t of the plurality of power
units 300. The output wiring 170 connects an output power terminal
170a between the power semiconductor elements 11 and 12 in the
power semiconductor module 101a and an output power terminal 170b
between the power semiconductor elements 13 and 14 in the power
semiconductor module 101b to an external output terminal 170t. In
the following description, the positive-electrode power terminal
180a, the negative-electrode power terminal 190a, and the output
power terminal 170a of the power semiconductor module 101a, and the
positive-electrode power terminal 180b, the negative-electrode
power terminal 190b, and the output power terminal 170b of the
power semiconductor module 101b will be referred to as power
terminals in some cases.
[0036] The temperature detection element 51 is connected to a
temperature detection terminal 51m, and the temperature detection
terminal 51m is connected to the control signal wiring circuit
board 100. The temperature detection element 52 is connected to a
temperature detection terminal 52m, and the temperature detection
terminal 52m is connected to the control signal wiring circuit
board 100.
[0037] The smoothing capacitor 120 may be a plurality of capacitors
connected in parallel to each other.
[0038] In the case where the power semiconductor modules 101a and
101b are connected in parallel, control signal terminals 11g, 12g,
13g, and 14g thereof also need to be connected in parallel. Control
signal wirings of the power semiconductor module 101a and the power
semiconductor module 101b are arranged on the control signal wiring
circuit board 100. The control signal terminals 11g, 12g, 13g, and
14g are gate terminals of the power semiconductor elements 11, 12,
13, and 14, respectively.
[0039] FIG. 3 is a perspective diagram of the power conversion unit
300, and FIG. 4 is an exploded perspective diagram of and around
the power semiconductor modules 101a and 101b in the power
conversion unit 300.
[0040] Herein, a short direction of the control signal wiring
circuit board 100 that is a rectangular flat plate is defined as an
X direction. A thickness direction of the control signal wiring
circuit board 100, which is a direction of the control signal
wiring circuit board 100 with respect to the power semiconductor
modules 101a and 101b and a heat receiving portion 130, is defined
as a Y direction. A longitudinal direction of the control signal
wiring circuit board 100, which is a direction of a radiator fin
150 with respect to the power semiconductor modules 101a and 101b
and the heat receiving portion 130, is defined as a Z direction.
The power semiconductor modules 101a and 101b are arranged side by
side in the Z direction.
[0041] Each of the power semiconductor modules 101a and 101b
includes: a circuit portion having a flat-plate shape in parallel
to a YZ plane and including a power semiconductor element and a
freewheeling element; and a terminal portion protruded in the Y
direction from the circuit portion and including a power terminal
and a control signal terminal. Radiating surfaces 200 are provided
on both surfaces of the circuit portion and are in contact with the
heat receiving portions 130. The two heat receiving portions 130
face to each other in the X direction, and the heat receiving
portions 130 are fixed with bolts while the circuit portion of each
of the power semiconductor modules 101a and 101b is being inserted
therebetween. A heat pipe 140 is protruded in the Z direction
through the heat receiving portions 130 and a protruded portion
thereof is connected to the radiator fin 150.
[0042] A power terminal of the terminal portion is connected to the
power wiring aggregate 110. A control signal terminal of the
terminal portion is connected to the control signal wiring circuit
board 100 through an opening formed in the power wiring aggregate
110.
[0043] The power wiring aggregate 110 is further connected to the
smoothing capacitor 120 and the short-circuit protection elements
160p and 160n for short-circuit protection. The smoothing capacitor
120 is connected between the positive-electrode power wiring 180
and the negative-electrode power wiring 190. The positive-electrode
power wiring 180 and the negative-electrode power wiring 190 are
connected to a power supply system via the short-circuit protection
elements 160p and 160n, respectively. In the case where a
short-circuit current flows due to, for example, breakage of an
element included in the power conversion unit 300, the
short-circuit protection elements 160p and 160n are disconnected
due to the short-circuit current, and power supply of the power
conversion unit 300 is cut off.
[0044] The control signal wiring circuit board 100 is connected to
a control device such as a microprocessor via a control signal
connector 100c, receives drive signals from the control device, and
distributes the drive signals into the power semiconductor modules
101a and 101b with an equal impedance. The power semiconductor
modules 101a and 101b perform switching in accordance with the
drive signals and output current via the output wiring 170.
[0045] In this case, heat generated due to loss of the power
semiconductor modules 101a and 101b is transmitted to the heat
receiving portions 130 from the radiating surface 200 and is
transmitted to the heat pipe 140 from the heat receiving portions
130. The heat pipe 140 can efficiently transmit heat between the
heat receiving portions 130 and the radiator fin 150. The radiator
fin 150 can suppress increase in temperature of the power
semiconductor modules 101a and 101b by emitting heat toward
coolant. For example, a fan serving as a cooling mechanism is
provided in the Y direction of the radiator fin 150 and cools the
radiator fin 150 by sending air in a -Y direction. Because the both
surfaces of the circuit portion are inserted between the heat
receiving portions 130, it is possible to improve cooling
efficiency of the power semiconductor modules 101a and 101b.
[0046] In the case where the plurality of power conversion units
300 are connected in parallel, the external positive-electrode
power terminals 180t of the plurality of power conversion units 300
are connected via the unit connection portion and the external
negative-electrode power terminals 190t of the plurality of power
conversion units 300 are connected via the unit connection portion.
With this configuration, a manager of the power conversion units
300 can easily perform maintenance of the power conversion units
300 from the Y direction of the power conversion units 300.
[0047] FIG. 5 is a circuit diagram of the power semiconductor
modules 101a and 101b.
[0048] An internal parasitic element 42 exists in the power
semiconductor module 101a. Similarly, an internal parasitic element
46 exists in the power semiconductor module 101b. Herein, the power
semiconductor module 101a and the power semiconductor module 101b
are generally prepared by the same production process, and
therefore the internal parasitic element 42 of the power
semiconductor module 101a and the internal parasitic element 46 of
the power semiconductor module 101b are expected to have an equal
parasitic impedance.
[0049] The high-side (positive-electrode side) control signal
terminals 11g and 13g, which are gate terminals of the power
semiconductor elements 11 and 13, are connected to a high-side
signal wiring 53. The low-side (negative-electrode side) control
signal terminals 12g and 14g, which are gate terminals of the power
semiconductor elements 12 and 14, are connected to a low-side
signal wiring 54. Further, the temperature detection element 51
included in the power semiconductor module 101a is connected to a
temperature detection element signal wiring 55, and the temperature
detection element 52 included in the power semiconductor module
101b is connected to a temperature detection element signal wiring
56.
[0050] Control signal wiring external parasitic elements 33 and 34
exist between the high-side control signal terminal of the power
semiconductor module 101a and the high-side signal wiring 53, and
control signal wiring external parasitic elements 37 and 38 exist
between the high-side control signal terminal of the power
semiconductor module 101b and the high-side signal wiring 53.
Control signal wiring external parasitic elements 31 and 32 exist
between the low-side control signal terminal of the power
semiconductor module 101a and the low-side signal wiring 54, and
control signal wiring external parasitic elements 35 and 36 exist
between the low-side control signal terminal of the power
semiconductor module 101b and the low-side signal wiring 54.
[0051] In the case where the power semiconductor module 101a and
the power semiconductor module 101b are connected in parallel, an
external parasitic element 44 exists between the power
semiconductor module 101a and the positive-electrode power wiring
180, and an external parasitic element 48 exists between the power
semiconductor module 101b and the positive-electrode power wiring
180. Further, an external parasitic element 43 exists between the
power semiconductor module 101a and the output wiring 170, and an
external parasitic element 47 exists between the power
semiconductor module 101b and the output wiring 170. Furthermore,
an external parasitic element 41 exists between the power
semiconductor module 101a and the negative-electrode power wiring
190, and an external parasitic element 45 exists between the power
semiconductor module 101b and the negative-electrode power wiring
190.
[0052] FIG. 6 is a plan view of the power wiring aggregate 110 seen
in the Y direction.
[0053] The power wiring aggregate 110 is arranged to be in the Y
direction with respect to the power semiconductor module 101a and
the power semiconductor module 101b and be vertical to a Y axis.
The power semiconductor module 101a and the power semiconductor
module 101b are arranged to have rotational symmetry with respect
to a rotational axis 104 in parallel to the Y axis. That is, the
output power terminal 170a, the positive-electrode power terminal
180a, the negative-electrode power terminal 190a, the control
signal terminals 11g and 12g, and the temperature detection
terminal 51m of the power semiconductor module 101a and the output
power terminal 170b, the positive-electrode power terminal 180a,
the negative-electrode power terminal 190b, the control signal
terminals 13g and 14g, and the temperature detection terminal 52m
of the power semiconductor module 101b are arranged to have
rotational symmetry with respect to the rotational axis 104.
[0054] Among them, the output power terminal 170a, the
positive-electrode power terminal 180a, the negative-electrode
power terminal 190a, the output power terminal 170b, the
positive-electrode power terminal 180b, and the negative-electrode
power terminal 190b are connected to the power wiring aggregate
110. The power wiring aggregate 110 has openings 211a, 212a, 211b,
and 212b arranged along a straight line 105 in parallel to a Z
axis. The temperature detection terminal 51m and the control signal
terminal 11g pass through the opening 211a and are protruded from
the power wiring aggregate 110 in the Y direction. The control
signal terminal 12g passes through the opening 212a and is
protruded from the power wiring aggregate 110 in the Y direction.
The control signal terminal 14g passes through the opening 212b and
is protruded from the power wiring aggregate 110 in the Y
direction. The control signal terminal 13g and the temperature
detection terminal 52m pass through the opening 211b and are
protruded from the power wiring aggregate 110 in the Y
direction.
[0055] In the case where the power semiconductor module 101a and
the power semiconductor module 101b are connected in parallel, an
imbalance between the external parasitic elements occurs depending
on arrangement of the power wirings. In view of this, the power
terminals of the power semiconductor module 101a and the power
semiconductor module 101b are arranged to have rotational symmetry
with respect to the rotational axis 104 and are connected in
parallel, and therefore the imbalance between the external
parasitic elements is corrected and equalization of output current
is achieved.
[0056] FIG. 7 is a plan view of a first modification example of the
power wiring aggregate 110.
[0057] In this first modification example, the power terminals of
the power semiconductor module 101a and the power semiconductor
module 101b are arranged to have mirror symmetry with respect to a
mirror plane 102 positioned between the power semiconductor modules
101a and 101b and are connected in parallel, and therefore an
imbalance between the external parasitic elements is corrected and
equalization of output current is achieved.
[0058] FIG. 8 is a plan view of a second modification example of
the power wiring aggregate 110.
[0059] In this second modification example, the power terminals of
the power semiconductor module 101a and the power semiconductor
module 101b are arranged to have rotational symmetry with respect
to the rotational axis 104 and are connected in parallel, and
therefore an imbalance between the external parasitic elements is
corrected and equalization of output current is achieved. Further,
the power terminals of the power semiconductor module 101a and the
power semiconductor module 101b are arranged to mirror symmetry
with respect to the straight line 105.
[0060] Note that, in the power conversion unit 300 in the example
or the power conversion unit 300 in the second modification
example, the power semiconductor module 101a and the power
semiconductor module 101b may be formed to have a mirror symmetry
with respect to the mirror plane 102 by switching the
positive-electrode power wiring 180 and the negative-electrode
power wiring 190 of one power semiconductor module of the power
semiconductor module 101a and the power semiconductor module
101b.
[0061] FIG. 9 is a plan view of the control signal wiring circuit
board 100 seen in the Y direction.
[0062] The control signal wiring circuit board 100 is arranged to
be in the Y direction with respect to the power wiring aggregate
110 and be vertical to the Y axis. The control signal wiring
circuit board 100 is a multilayer circuit board. In a control
signal wiring layer that is a layer illustrated in FIG. 9, the
high-side signal wiring 53, the low-side signal wiring 54, and the
temperature detection element signal wirings 55 and 56 are
arranged. In other layers, a power supply wiring or wirings of
other components are arranged.
[0063] In the control signal wiring layer, the temperature
detection terminal 51m, the control signal terminal 11g, the
control signal terminal 12g, the control signal terminal 14g, the
control signal terminal 13g, and the temperature detection terminal
52m are connected in this order along a straight line 106 in
parallel to the Z axis. Further, the temperature detection terminal
51m, the low-side control signal terminal 11g, and the high-side
control signal terminal 12g and the temperature detection terminal
52m, the low-side control signal terminal 13g, and the high-side
control signal terminal 14g are arranged to have mirror symmetry
with respect to the mirror plane 102 positioned between the power
semiconductor modules 101a and 101b.
[0064] In the control signal wiring layer, an area between the
control signal terminals 12g and 14g, the area being between
straight lines Aa and Ab that are straight lines in parallel to the
X axis and are positioned at a certain distance from the mirror
plane 102, is defined as a central area. In the control signal
wiring circuit board 100, a control signal wiring from the control
device is branched into two control signal wirings in the central
area, and the control signal wirings between the central area and
the terminals of the power semiconductor modules 101a and 101b have
a shape of mirror symmetry with respect to the mirror plane 102.
That is, the high-side signal wiring 53 and the low-side signal
wiring 54 have respective branch points in the central area. With
this, distances of the signal wirings between the central area and
the two control signal terminals of the power semiconductor modules
101a and 101b are equal. That is, in the high-side signal wiring 53
and the low-side signal wiring 54, distances of the signal wirings
between the control device and the two control signal terminals are
equal.
[0065] In the case where the power semiconductor modules 101a and
101b are connected in parallel and an imbalance of impedance
between the control signal wiring external parasitic elements
occurs, an imbalance of output current may occur, as in the case of
the power wirings. According to the control signal wiring circuit
board 100 in this example, it is possible to equalize impedances of
the control signal wiring external parasitic elements of the power
semiconductor modules 101a and 101b existing in the high-side
signal wiring 53 and the low-side signal wiring 54.
[0066] The temperature detection element signal wirings 55 and 56
are independent signal wirings, respectively, and therefore do not
need branch points.
[0067] The high-side control signal wiring 53, the low-side signal
wiring 54, and the temperature detection element signal wirings 55
and 56 are not overlapped on one another in the thickness direction
of the control signal wiring circuit board 100. Further, the
high-side control signal wiring 53, the low-side signal wiring 54,
and the temperature detection element signal wirings 55 and 56 do
not have an area where the above wirings and wirings in other
layers are not overlapped on one another. As an effect of this, it
is possible to suppress mismatching of impedance caused by
connection between layers of the control signal wirings. As a
result, it is possible to equalize control signals and correct an
imbalance of output current.
[0068] According to this example, it is possible to equalize output
current of the power semiconductor elements connected in parallel
by equalizing impedances of power wirings of the power
semiconductor elements connected in parallel and the control signal
wirings.
Example 2
[0069] FIG. 10 is a perspective diagram of a power conversion unit
300b in Example 2.
[0070] As compared with Example 1, the power conversion unit 300b
in this example includes a heat receiving portion 130b instead of
the heat receiving portion 130, includes a heat pipe 140b instead
of the heat pipe 140, and includes a radiator fin 150b instead of
the radiator fin 150. The heat pipe 140b passes through the heat
receiving portion 130b and is protruded from the heat receiving
portion 130b in a direction between a -Y direction and a Z
direction. The radiator fin 150b is connected to a portion of the
heat pipe 140b, the portion being protruded from the heat receiving
portion 130b. In this example, for example, a fan is provided in
the -Z direction of the radiator fin 150b and cools the radiator
fin 150b by sending air in the Z direction.
[0071] FIG. 11 is a perspective diagram of a power conversion part
2a in Example 2.
[0072] The power conversion part 2a in this example includes a
plurality of power conversion units 300b. The plurality of power
conversion units 300b are connected in parallel by a unit
connection portion 310. The unit connection portion 310 includes a
positive electrode conductor for connecting external
positive-electrode power terminals 180t of the plurality of power
conversion units and a negative electrode conductor for connecting
external negative-electrode power terminals 190t of the plurality
of power conversion units. Three power conversion units 300b of the
plurality of power conversion units 300b constitute the converter
411, and other three power conversion units 300b thereof constitute
the inverter 412, and other two power conversion units 300b thereof
constitute the boost chopper 413.
[0073] Output wirings 170t of the three power conversion units 300b
serving as the converter 411 correspond to three phases R, S, and
T. Output wirings 170t of the three power conversion units 300b
serving as the inverter 412 correspond to three phases U, V, and W.
Each power conversion unit 300b is controlled by inputting a
control signal from a control device to a control signal wiring
circuit board 100 of the power conversion unit 300b. With this
control method, the plurality of power conversion unit devices 300b
can function as the converter 411, the inverter 412, and the boost
chopper 413. Further, with this configuration, a manager of a UPS 2
can easily perform maintenance of the power conversion part 2a from
a Y direction of the power conversion part 2a.
[0074] It is possible to achieve the power conversion part 2a by
connecting the plurality of power conversion units 300 in Example 1
in parallel in the same way as the power conversion units 300b in
Example 2.
[0075] As described above, the power conversion units 300 and 300b
are applicable to a power converter including the converter 411,
the inverter 412, the boost chopper 413, and the like and are
applicable to a UPS, a PCS (Power Conditioning System), and the
like including the power converter. The power conversion units 300
and 300b are also applicable to a power converter for driving a
motor of an industrial machine.
[0076] Terms will be described. A power conversion unit corresponds
to, for example, the power conversion units 300 and 300b. A power
converter corresponds to, for example, the converter 411, the
inverter 412, the boost chopper 413, and the UPS 2. A power wiring
corresponds to, for example, the power wiring aggregate 110. A
control signal wiring circuit board corresponds to, for example,
the control signal wiring circuit board 100. A first circuit
portion corresponds to, for example, the power semiconductor
elements 11 and 12, the freewheeling elements 21 and 22, and the
radiating surface 200. A first power terminal corresponds to, for
example, the positive-electrode power terminal 180a, the
negative-electrode power terminal 190a, and the output power
terminal 170a. A first control signal terminal corresponds to, for
example, the control signal terminal 11g. A second circuit portion
corresponds to, for example, the power semiconductor elements 13
and 14, the freewheeling elements 23 and 24, and the radiating
surface 200. A second power terminal corresponds to, for example,
the positive-electrode power terminal 180b, the negative-electrode
power terminal 190b, and the output power terminal 170b. An
external power terminal corresponds to, for example, the external
positive-electrode power terminal 180t and the external
negative-electrode power terminal 190t. A second control signal
terminal corresponds to, for example, the control signal terminal
13g. A first control signal wiring corresponds to, for example, the
low-side control signal wiring 55. A first branch point corresponds
to, for example, a portion of the low-side control signal wiring 55
in the central area. A third control signal terminal corresponds
to, for example, the control signal terminal 12g. A fourth control
signal terminal corresponds to, for example, the control signal
terminal 14g. A second control signal wiring corresponds to, for
example, the high-side control signal wiring 54. A second branch
point corresponds to, for example, a portion of the high-side
control signal wiring 54 in the central area. A heat receiving
portion corresponds to, for example, the heat receiving portions
130 and 130b. A virtual plane corresponds to, for example, the
mirror plane 102. A virtual straight line in a predetermined
direction corresponds to, for example, the straight line 106. A
capacitor corresponds to, for example, the smoothing capacitor 120.
A short-circuit protection element corresponds to, for example, the
short-circuit protection elements 160p and 160n. A unit connection
portion corresponds to, for example, the unit connection portion
310. A virtual straight line vertical to the control signal wiring
circuit board corresponds to, for example, the rotational axis
104.
[0077] The invention is not limited to the above examples and can
be changed in other various forms within the scope of the
invention.
REFERENCE SIGNS LIST
[0078] 2: UPS [0079] 2a: power conversion part [0080] 11, 12, 13,
14: power semiconductor element [0081] 21, 22, 23, 24: freewheeling
element [0082] 51, 52: temperature detection element [0083] 53:
high-side signal wiring [0084] 54: low-side signal wiring [0085]
55, 56: temperature detection element signal wiring [0086] 100:
control signal wiring circuit board [0087] 101a, 101b: power
semiconductor module [0088] 110: power wiring aggregate [0089] 120:
smoothing capacitor [0090] 130, 130b: heat receiving portion [0091]
140, 140b: heat pipe [0092] 150, 150b: radiator fin [0093] 160p,
160n: short-circuit protection element [0094] 170: output wiring
[0095] 180: positive-electrode power wiring [0096] 190:
negative-electrode power wiring [0097] 300, 300b: power conversion
unit [0098] 310: unit connection portion [0099] 411: converter
[0100] 412: inverter [0101] 413: boost chopper
* * * * *