U.S. patent application number 15/250623 was filed with the patent office on 2016-12-15 for system and method for cooling information handling resources.
The applicant listed for this patent is Dell Products L.P.. Invention is credited to James Bryan, Jason Franz, Bradley Jackson, Travis North, John Olsen.
Application Number | 20160363975 15/250623 |
Document ID | / |
Family ID | 44277449 |
Filed Date | 2016-12-15 |
United States Patent
Application |
20160363975 |
Kind Code |
A1 |
Franz; Jason ; et
al. |
December 15, 2016 |
SYSTEM AND METHOD FOR COOLING INFORMATION HANDLING RESOURCES
Abstract
Systems and methods for reducing problems and disadvantages
associated with traditional approaches to cooling information
handling resources are provided. A method for cooling information
handling resources, may include conveying a flowing fluid proximate
to one or more information handling resources such that the flowing
fluid is thermally coupled to the one or more information handling
resources and heat generated by the one or more information
handling resources is transferred to the flowing fluid. The method
may also include conveying the flowing fluid to a cooling unit such
that heat is transferred from the flowing fluid.
Inventors: |
Franz; Jason; (Austin,
TX) ; Bryan; James; (Austin, TX) ; Jackson;
Bradley; (Pflugerville, TX) ; North; Travis;
(Pflugerville, TX) ; Olsen; John; (Austin,
TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Dell Products L.P. |
Round Rock |
TX |
US |
|
|
Family ID: |
44277449 |
Appl. No.: |
15/250623 |
Filed: |
August 29, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13858702 |
Apr 8, 2013 |
9448602 |
|
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15250623 |
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|
12690626 |
Jan 20, 2010 |
8416572 |
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13858702 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F 1/206 20130101;
H01L 2924/0002 20130101; H05K 7/20254 20130101; H05K 7/20272
20130101; G06F 1/20 20130101; H01L 2924/0002 20130101; H05K 7/2039
20130101; H01L 2924/00 20130101; H05K 7/20218 20130101; G06F
2200/201 20130101 |
International
Class: |
G06F 1/20 20060101
G06F001/20; H05K 7/20 20060101 H05K007/20 |
Claims
1. A memory module cooling system comprising: a memory module; a
contact plate thermally coupled the memory module; a heat sink
having two end portions and a middle portion, the middle portion is
thermally coupled to the contact plate; and a clamp configured to
mechanically couple the heat sink to the memory module such that
heat generated by the memory module is conducted to the contact
plate and to the heat sink.
2. The system of claim 1, wherein the two end portions of the heat
sink comprise a cylindrical cross-sectional shape.
3. The system of claim 2, further comprising a support member
configured to mechanically support the memory module; and wherein
the two end portions of the heat sink are configured to thermally
couple to the support member.
4. The system of claim 3, wherein the support member comprises two
semi-cylindrically shaped features configured to thermally couple
to the two end portions of the heat sink.
5. The system of claim 1, wherein the middle portion comprises a
rectangular cross-sectional shape.
6. The system of claim 1, wherein the contact plate comprises a
planar surface configured to thermally couple to the memory
module.
7. The system of claim 6, wherein the contact plate is configured
based on an expected heat generation of the memory module.
8. The system of claim 6, wherein the contact plate is configured
based on the size of the memory module.
9. An information handling system comprising: a support member; and
a memory module cooling assembly mechanically coupled to the
support member, the memory module cooling assembly comprises: a
memory module; a contact plate thermally coupled the memory module;
a heat sink having two end portions and a middle portion, the
middle portion is thermally coupled to the contact plate; and a
clamp configured to mechanically couple the heat sink to the memory
module such that heat generated by the memory module is conducted
to the contact plate and to the heat sink.
10. The system of claim 9, wherein the two end portions of the heat
sink comprise a cylindrical cross-sectional shape.
11. The system of claim 10, wherein the two end portions of the
heat sink are configured to thermally couple to the support
member.
12. The system of claim 11, wherein the support member includes two
semi-cylindrically shaped features configured to thermally couple
to the two end portions of the heat sink.
13. The system of claim 9, wherein the middle portion comprises a
rectangular cross-sectional shape.
14. The system of claim 9, wherein the contact plate comprises a
planar surface configured to thermally couple to the memory
module.
15. The system of claim 14, wherein the contact plate is configured
based on an expected heat generation of the memory module.
16. The system of claim 14, wherein the contact plate is configured
based on the size of the memory module.
17. A method for cooling a memory module, comprising: thermally
coupling a memory module to a contact plate; thermally coupling a
middle portion of a heat sink to the contact plate, the heat sink
comprising two end portions and the middle portion; and
mechanically coupling the heat sink and the memory module using a
clamp such that heat generated by the memory module is conducted to
the contact plate and to the heat sink.
18. The method of claim 17, wherein the two end portions of the
heat sink comprise a cylindrical cross-sectional shape.
19. The method of claim 18, further comprising: mechanically
supporting the memory module using a support member; and thermally
coupling the two end portions of the heat sink to the support
member.
20. The method of claim 19, wherein the support member comprises
two semi-cylindrically shaped features configured to thermally
couple to the two end portions of the heat sink.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of pending U.S. patent
application Ser. No. 13/858,702 filed Apr. 8, 2013, which is a
continuation of U.S. patent application Ser. No. 12/690,626 filed
Jan. 20, 2010, now U.S. Pat. No. 8,416,572 granted Apr. 9, 2013;
the contents of which are incorporated in its entirety by
reference.
TECHNICAL FIELD
[0002] The present disclosure relates in general to cooling
information handling resources, and more particularly to fluid
cooling of individual components of an information handling
system.
BACKGROUND
[0003] As the value and use of information continues to increase,
individuals and businesses seek additional ways to process and
store information. One option available to users is information
handling systems. An information handling system generally
processes, compiles, stores, and/or communicates information or
data for business, personal, or other purposes thereby allowing
users to take advantage of the value of the information. Because
technology and information handling needs and requirements vary
between different users or applications, information handling
systems may also vary regarding what information is handled, how
the information is handled, how much information is processed,
stored, or communicated, and how quickly and efficiently the
information may be processed, stored, or communicated. The
variations in information handling systems allow for information
handling systems to be general or configured for a specific user or
specific use such as financial transaction processing, airline
reservations, enterprise data storage, or global communications. In
addition, information handling systems may include a variety of
hardware and software components that may be configured to process,
store, and communicate information and may include one or more
computer systems, data storage systems, and networking systems.
[0004] As the capabilities of information handling systems have
improved, the power requirements of information handling systems
and their component information handling resources have increased.
Accordingly, the amount of heat produced by such information
handling resources has also increased. Because the electrical
properties of information handling resources may be adversely
affected by the presence of heat (e.g., some information handling
resources may not operate correctly outside of a particular range
of temperatures), information handling systems often include
cooling systems configured to cool such information handling
resources.
[0005] Traditionally, information handling resources have been
cooled via the impingement of air driven by one or more fans. As
the density of information handling resources present in
information handling systems have increased, and as information
handling resources have become faster (and thus hotter), the
airflow required to provide adequate cooling has increased, leading
to the need for more powerful fans and/or greater numbers of fans.
This leads to yet more power consumption, larger information
handling system size, and excessive noise. In addition, because
fans often transfer heat the those areas proximate to the
information handling system being cooled, users of such information
handling systems are often required to tolerate higher-than-typical
temperatures.
[0006] As an improvement over traditional fan-based cooling
systems, some information handling system manufacturers have
provided mechanisms to cool individual component information
handling resources with liquid. Such approaches use pumps to
circulate cooling fluid over a heat exchanger plate or "cold
plate") in contact with a component, and then to a liquid-to-air
heat exchanger (e.g., radiator). Most such approaches to liquid
cooling systems cool a handful of information handling resources
with liquid, while the rest of the information handling system may
be air cooled. Thus, such systems may still generate undesirable
noise and discharge undesirable heat into an office space
environment.
SUMMARY
[0007] In accordance with the teachings of the present disclosure,
the disadvantages and problems associated with cooling information
handling resources have been substantially reduced or
eliminated.
[0008] In accordance with one embodiment of the present disclosure,
a system for cooling information handling resources may include an
information handling system and a cooling unit. The information
handling system may include one or more information handling
resources and one or more first fluidic conduits. The one or more
first fluidic conduits may be configured to convey a flowing fluid
proximate to the one or more information handling resources such
that the flowing fluid is thermally coupled to the one or more
information handling resources and heat generated by the one or
more information handling resources is transferred to the flowing
fluid. The cooling unit may have one or more second fluidic
conduits fluidically coupled to the one or more first fluidic
conduits and configured to convey the flowing fluid such that heat
is transferred from the flowing fluid to media proximate to the
cooling unit.
[0009] In accordance with another embodiment of the present
disclosure, an information handling system may include one or more
information handling resources and one or more first fluidic
conduits. The one or more first fluidic conduits may be configured
to convey a flowing fluid proximate to the one or more information
handling resources such that the flowing fluid is thermally coupled
to the one or more information handling resources and heat
generated by the one or more information handling resources is
transferred to the flowing fluid. The one or more first fluidic
conduits may be configured to fluidically couple to a cooling unit
configured to transfer heat from the flowing fluid.
[0010] In accordance with a further embodiment of the present
disclosure, a method for cooling information handling resources,
may include conveying a flowing fluid proximate to one or more
information handling resources such that the flowing fluid is
thermally coupled to the one or more information handling resources
and heat generated by the one or more information handling
resources is transferred to the flowing fluid. The method may also
include conveying the flowing fluid to a cooling unit such that
heat is transferred from the flowing fluid.
[0011] Other technical advantages will be apparent to those of
ordinary skill in the art in view of the following specification,
claims, and drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] A more complete understanding of the present embodiments and
advantages thereof may be acquired by referring to the following
description taken in conjunction with the accompanying drawings, in
which like reference numbers indicate like features, and
wherein:
[0013] FIG. 1 illustrates a system for cooling component
information handling resources of an information handling system,
in accordance with embodiments of the present disclosure;
[0014] FIG. 2A illustrates an isometric view of selected components
of an information handling system, in accordance with embodiments
of the present disclosure;
[0015] FIG. 2B illustrates another isometric view of selected
components of an information handling system, in accordance with
embodiments of the present disclosure;
[0016] FIG. 2C illustrates an exploded view of selected components
of an information handling system, in accordance with embodiments
of the present disclosure;
[0017] FIG. 2D illustrates a partially exploded view of selected
components of an information handling system, in accordance with
embodiments of the present disclosure;
[0018] FIGS. 3A and 3C illustrate a cutaway view of selected
components of the information handling system depicted in FIGS.
2A-2D, such that selected fluidic channels are depicted, in
accordance with embodiments of the present disclosure;
[0019] FIG. 3B illustrates fluidic channels created within the
interior of certain support members and cold plates, in accordance
with the present disclosure.
[0020] FIG. 4 depicts a memory module with heat sinks mechanically
and thermally coupled thereto, in accordance with embodiments of
the present disclosure;
[0021] FIG. 5A illustrates an isometric view of selected components
of a cooling unit, in accordance with embodiments of the present
disclosure;
[0022] FIG. 5B illustrates an exploded view of selected components
of the cooling unit depicted in FIG. 5A, in accordance with
embodiments of the present disclosure; and
[0023] FIGS. 6A-6E illustrate the electrical, mechanical, and
thermal coupling of expansion cards to other components of an
information handling system, in accordance with embodiments of the
present disclosure.
DETAILED DESCRIPTION
[0024] Preferred embodiments and their advantages are best
understood by reference to FIGS. 1-6E, wherein like numbers are
used to indicate like and corresponding parts.
[0025] For the purposes of this disclosure, an information handling
system may include any instrumentality or aggregate of
instrumentalities operable to compute, classify, process, transmit,
receive, retrieve, originate, switch, store, display, manifest,
detect, record, reproduce, handle, or utilize any form of
information, intelligence, or data for business, scientific,
control, entertainment, or other purposes. For example, an
information handling system may be a personal computer, a PDA, a
consumer electronic device, a network storage device, or any other
suitable device and may vary in size, shape, performance,
functionality, and price. The information handling system may
include memory, one or more processing resources such as a central
processing unit (CPU) or hardware or software control logic.
Additional components or the information handling system may
include one or more storage devices, one or more communications
ports for communicating with external devices as well as various
input and output (I/O) devices, such as a keyboard, a mouse, and a
video display. The information handling system may also include one
or more buses operable to transmit communication between the
various hardware components.
[0026] For the purposes of this disclosure, information handling
resources may broadly refer to any component system, device or
apparatus of an information handling system, including without
limitation processors, busses, memories, input-output devices
and/or interfaces, storage resources, network interfaces,
motherboards, electro-mechanical devices (e.g., fans), displays,
and power supplies.
[0027] For the purposes of this disclosure, fluid conduits or
fluidic conduits may broadly refer to any device, system or
apparatus for the conveyance of fluid (e.g., tubing, a pipe, a
hollow cylinder, a channel, a microchannel, etc.).
[0028] FIG. 1 illustrates a system 100 for cooling component
information handling resources of an information handling system
102, in accordance with embodiments of the present disclosure. As
shown in FIG. 1, system 100 may include an information handling
system 102, a cooling unit 104, and an umbilical 106.
[0029] In certain embodiments, information handling system 102 may
comprise a computer chassis or enclosure (e.g., a server chassis
holding one or more server blades). In other embodiments,
information handling system 102 may comprise a storage enclosure.
In yet other embodiments, information handling system 102 may be a
personal computer or workstation (e.g., a desktop computer or a
portable computer).
[0030] Cooling unit 104 may be any system, device or apparatus
configured to deliver a fluid to (e.g., via a pump) and/or receive
a fluid from umbilical 106 and transfer heat from the fluid to
another medium (e.g., air) in order to cool the fluid, in
accordance with embodiments of the present disclosure.
[0031] Umbilical 106 may be any system, device or apparatus
configured to fluidically couple and/or electrically couple
information handling system 102 to cooling unit 104. Umbilical 106
may include one or more tubes or other fluid conduits 108, 110
configured to circulate fluid between information handling system
102 and cooling unit 104, in accordance with embodiments of the
present disclosure. Fluid conduits 108, 110 comprising umbilical
106 may be made of plastic, metal, and/or any other suitable
material. In addition, umbilical 106 may include one or more
electrical conduits 112 (e.g., a collection of one or more
conductive wires) to communicate electric and/or electronic signals
between information handling system 102 and cooling unit 104.
[0032] In operation, cooling unit 104 may deliver a fluid (e.g.,
water, ethylene glycol, propylene glycol, or other coolant) to
information handling system 102 via umbilical 106. Once delivered
to information handling system 102, the fluid may be routed via one
or more conduits and/or channels allowing the fluid to flow
proximate to one or more information handling resources such that
heat from such information handling resources is transferred to the
fluid, as is described in greater detail below. The fluid may then
return to cooling unit 104 via umbilical 106. Once returned to
cooling unit 104, cooling unit 104 may transfer heat from the
heated fluid to another medium (e.g., air) in order to cool the
fluid, as is described in greater detail below. Accordingly,
heat-producing information handling resources may be desirably
cooled.
[0033] In some embodiments, information handling system 102 may not
include a fan or other similar device to cause airflow within,
into, or out of a case, chassis, or enclosure for information
handling system 102. In these and other embodiments, the case,
chassis, or enclosure for information handling system 102 may be
closed such that no substantial airflow enters or leaves such case,
chassis, or enclosure, and no substantial heat is transferred from
the information handling resources of information handling system
102 to the environment immediately proximate to information
handling system 102. Instead, substantially all of the heat
generated by the one or more information handling resources may be
emitted by cooling unit 104. In some embodiments, cooling unit 104
may be located substantially remotely from information handling
system 102 (e.g., outside a cubicle, outside an office, outside a
building, above ceiling tiles, below a floor) such that the
information handling system is essentially silent and/or thermally
neutral to a user local to information handling system 102.
[0034] FIGS. 2A-2D illustrate various views of selected components
of information handling system 102, in accordance with embodiments
of the present disclosure. FIG. 2A illustrates an isometric view of
selected components of information handling system 102. FIG. 2B
illustrates another isometric view of selected components of
information handling system 102 from a perspective different than
that of FIG. 2A. FIG. 2C illustrates an exploded view of selected
components of information handling system 102 from the same
perspective as FIG. 2A. FIG. 2D illustrates a partially exploded
view of selected components of information handling system 102 from
the same perspective as FIG. 2B.
[0035] As shown in FIGS. 2A-2D, information handling system 102 may
include enclosure 202, umbilical assembly 204, support member 210,
support member 220, support member 270, motherboard 232, memory
assembly 250, memory assembly 280, expansion assembly 178, one or
more hard drives 258, a power supply 262, and one or more fluid
conduits 266, 268, 168, 170, and 172.
[0036] Enclosure 202 may be any cabinet or housing suitable to
house and/or mount various components of information handling
system 102. Enclosure 202 may be constructed from aluminum,
plastic, and/or any other suitable material.
[0037] Umbilical assembly 204 may be any system, device or
apparatus configured to fluidically couple and/or electrically
couple umbilical 106 to information handling system 102. As shown
in FIGS. 2A-2D, umbilical assembly 204 may include assembly cover
206 and fluidic coupler 208. Fluidic coupler 208 may be configured
to couple individual fluid conduits 108, 110 of umbilical 106 to
individual fluid conduits of information handling system 102 (e.g.,
via opening 203). Assembly cover 206 may be mechanically fixed to
enclosure 202 and may be configured to mechanically couple fluidic
coupler 208 to enclosure 202 at opening 203.
[0038] Support member 210 may include any system, device or
apparatus configured to serve as a mount one or more components of
information handling system 102 and/or configured to provide
structural support to enclosure 202 and/or one or more components
of information handling system 102. Support member 210 may be
constructed from extruded aluminum, machined aluminum, case
aluminum, and/or another suitable material. As shown in FIGS.
2A-2D, support member 210 may include extension 211, and one or
more openings 212, 214, 216, 218, and 219. Extension 211 may be
configured to provide structural support between the main portion
of support member 210 and enclosure 202 and/or mount one or more
components of information handling system 102 (e.g., expansion
assembly 178). Openings 212, 214, 216, 218, and 219 may be provided
to permit components of information handling system 102 on one side
of support member 210 to be electrically, mechanically, and/or
fluidically coupled to components on the other side of support
member 210. For example, openings 212 may allow memory modules 252
of memory assembly 250 to be electrically and mechanically coupled
to memory module connector 242 of motherboard 232. As another
example, opening 214 may allow power supply 262 to be electrically
coupled to connector 234 of motherboard 232 (e.g., via interface
cabling 266). As a further example, opening 216 may allow either or
both of hard drives 258 to be electrically coupled to connector 236
of motherboard 232 (e.g., via interface cabling 261). As yet
another example, opening 218 may permit quick disconnect fluid
fitting 230 of support member 220 to be fluidically coupled to
fluid fitting 231 of support member 270.
[0039] Support member 220 may be mechanically coupled to support
member 210 via one or more screws, fasteners, adhesives, and/or
other suitable means, and may include any system, device or
apparatus configured to serve as a mount and/or provide structural
support for one or more components of information handling system
102. Support member 220 may be constructed from extruded aluminum,
machined aluminum, case aluminum, and/or another suitable material.
In some embodiments, all or one or more portions of support member
220 may comprise a material (e.g., aluminum or other metal) that is
generally thermally conductive. As shown in FIGS. 2A-2D, support
member 220 may include openings 222, 224, and 226, one or more
features 229, and one or more quick disconnect fluid fittings
230.
[0040] Openings 222, 224, and 226 may be provided to permit
components of information handling system 102 mechanically coupled
to one side of support member 220 to be electrically, mechanically,
and/or fluidically coupled to components on the other side of
support member 220. For example, openings 222 may allow memory
modules 252 of memory assembly 250 to be electrically and
mechanically coupled to memory module connector 242 of motherboard
232. As another example, opening 224 may allow power supply 262 to
be electrically coupled to connector 234 of motherboard 232 (e.g.,
via interface cabling 266). As a further example, opening 226 may
allow either or both of hard drives 258 to be electrically coupled
to connector 236 of motherboard 232 (e.g., via interface cabling
261).
[0041] Turning briefly to FIGS. 3A and 3B, support member 220 may
include fluid channels 302 and fluid microchannels 304 formed
predominantly on the interior of support member 220. Fluid channels
302 may include any suitable channel configured to transport fluid
to, from, or within support member 220 and may be formed by
machining, extrusion, or other suitable manner. The position,
length, height, width, and other physical characteristics of fluid
channels 302 may be selected based on desired cooling
characteristics, desired fluid flow rates, desired fluid type,
component types, component locations, expected component heat
generation, and/or any other suitable characteristics of
information handling system 102. Fluid channels 302 of support
member 220 may be fluidically coupled to one or more of a quick
disconnect fluid fitting 230, a fluid microchannel 304, or another
fluid channel 302.
[0042] Fluid microchannels 304 may include any suitable channel
configured to transport fluid within support member 220 and may be
formed by machining, extrusion, or other suitable manner. The
position, length, height, width, and other physical characteristics
of fluid microchannels 304 may be selected based on desired cooling
characteristics, desired fluid flow rates, desired fluid type,
component types, component locations, expected component heat
generation, and/or any other suitable characteristics of
information handling system 102. In some embodiments, fluid
microchannels 304 may be positioned at particular microchannel
regions 221 within support member 220. The microchannel regions 221
may be sized and/or located within support member 220 such that
when information handling system 102 is constructed, each
microchannel region 221 is thermally coupled to a particular
information handling resource (e.g., hard drive 258, power supply
262, memory module 252) by virtue of proximity between the fluid
flowing in the fluid microchannel 304 and the information handling
resource, and the presence of one or more generally thermally
conductive materials (e.g., a portion of the surface of support
member 220) between the fluid and the information handling
resource.
[0043] Turning again to FIGS. 2A-2D, features 229 may include any
structure suitable to mechanically support one or more heat sinks
(e.g., heat sinks 254) on support member 220, and may be formed by
machining, extrusion, or other suitable manner. The position,
length, height, width, and other physical characteristics of
features 229 may be selected based on the size and/or shape of heat
sinks 254, the size and/or shape of microchannel regions 221,
and/or any other suitable characteristics of information handling
system 102. For example, as shown in FIGS. 2A-2D, features 229 may
have a semi-cylindrical shape in embodiments in which heat sinks
254 have a cylindrical shape.
[0044] Support member 220 may also include one or more quick
disconnect fluid fittings 230. Each quick disconnect fluid fitting
230 may be made from plastic, rubber, or other suitable material
and may be any system, device or apparatus configured to couple
fluid channels 302 of support member 220 to fluid channels 306 of
support member 270 via quick disconnect fluid fitting 231.
[0045] Support member 270 may be mechanically coupled to support
member 210 via one or more screws, fasteners, adhesives, and/or
other suitable means, and may include any system, device or
apparatus configured to serve as a mount and/or provide structural
support for one or more components of information handling system
102. Support member 270 may be constructed from extruded aluminum,
machined aluminum, case aluminum, and/or another suitable material.
In some embodiments, all or one or more portions of support member
270 may comprise a material (e.g., aluminum or other metal) that is
generally thermally conductive. As shown in FIGS. 2A-2D, support
member 270 may include openings 272, one or more features 279, and
one or more quick disconnect fluid fittings 231.
[0046] Openings 272 may be provided to permit components of
information handling system 102 mechanically coupled to one side of
support member 270 to be electrically, mechanically, and/or
fluidically coupled to components on the other side of support
member 270. For example, openings 272 may allow memory modules 282
of memory assembly 280 to be electrically and mechanically coupled
to memory module connector 243 of motherboard 232.
[0047] Turning briefly to FIG. 3C, support member 270 may include
fluid channels 306 and fluid microchannels 308 formed predominantly
on the interior of support member 270. Fluid channels 306 may
include any suitable channel configured to transport fluid to,
from, or within support member 270 and may be formed by machining,
extrusion, or other suitable manner. The position, length, height,
width, and other physical characteristics of fluid channels 306 may
be selected based on desired cooling characteristics, desired fluid
flow rates, desired fluid type, component types, component
locations, expected component heat generation, and/or any other
suitable characteristics of information handling system 102. In
some embodiments, fluid channels 306 may be identical or similar to
fluid channels 302. Fluid channels 306 of support member 270 may be
fluidically coupled to one or more of a quick disconnect fluid
fitting 231, a fluid microchannel 308, or another fluid channel
306.
[0048] Fluid microchannels 308 may include any suitable channel
configured to transport fluid within support member 270 and may be
formed by machining, extrusion, or other suitable manner. The
position, length, height, width, and other physical characteristics
of fluid microchannels 308 may be selected based on desired cooling
characteristics, desired fluid flow rates, desired fluid type,
component types, component locations, expected component heat
generation, and/or any other suitable characteristics of
information handling system 102. In some embodiments, fluid
microchannels 308 may be positioned at particular microchannel
regions 271 within support member 270. The microchannel regions 271
may be sized and/or located within support member 270 such that
when information handling system 102 is constructed, each
microchannel region 271 is thermally coupled to a particular
information handling resource (e.g., processor 233, memory module
282) by virtue of proximity between the fluid flowing in the fluid
microchannel 308 and the information handling resource, and the
presence of one or more generally thermally conductive materials
(e.g., a portion of the surface of support member 270) between the
fluid and the information handling resource.
[0049] Turning again to FIGS. 2A-2D, features 279 may include any
structure suitable to mechanically support one or more heat sinks
(e.g., heat sinks 284) on support member 270, and may be formed by
machining, extrusion, or other suitable manner. The position,
length, height, width, and other physical characteristics of
features 279 may be selected based on the size and/or shape of heat
sinks 284, the size and/or shape of microchannel regions 271,
and/or any other suitable characteristics of information handling
system 102. For example, as shown in FIGS. 2A-2D, features 279 may
have a semi-cylindrical shape in embodiments in which heat sinks
284 have a cylindrical shape.
[0050] Support member 270 may also include one or more quick
disconnect fluid fittings 231. Each quick disconnect fluid fitting
231 may be made from plastic, rubber, or other suitable material
and may be any system, device or apparatus configured to couple
fluid channels 306 of support member 270 to fluid channels 302 of
support member 220 via quick disconnect fluid fitting 230.
[0051] One or more of fluid conduits 168, 170, and 172 may include
any device, system or apparatus for the conveyance of fluid (e.g.,
tubing, a pipe, a hollow cylinder). For example, as depicted in
FIG. 3C, fluid conduit 168 may fluidically couple umbilical 106 to
fluid conduit 170, fluid conduit 170 may fluidically couple fluid
conduit 168 to fluid conduits 172, and/or fluid conduits 172 may
fluidically couple fluid conduit 170 to one or more fluid channels
306 of support member 270. Other fluid conduits or channels not
shown in FIGS. 2A-2D may also be present in information handling
system 102. Fluid conduits 168, 170, and 172 may be made of
plastic, metal, and/or any other suitable material.
[0052] Motherboard 232 may include a printed circuit board
configured to provide structural support for one or more components
of information handling system 102 and/or electrically couple one
or more of such components to each other or to other electric or
electronic components external to information handling system 102.
As shown in FIGS. 2A-2D, motherboard 232 may include one or more
processors 233, one or more expansion slots 235, one or more
connectors 234, and 236, and one or more memory slots 242 and
243.
[0053] Each processor 233 may include any system, device, or
apparatus configured to interpret and/or execute program
instructions and/or process data, and may include, without
limitation a microprocessor, microcontroller, digital signal
processor (DSP), application specific integrated circuit (ASIC), or
any other digital or analog circuitry configured to interpret
and/or execute program instructions and/or process data. In some
embodiments, processor 233 may interpret and/or execute program
instructions and/or process data stored in one or more of memory
modules 252, 282, and/or another component of information handling
system 102.
[0054] Each connector 234, 236 may include any system, device or
apparatus configured to electrically couple an information handling
resource or other component of information handling system 102 to
one or more other components of information handling system 102.
For example, as shown in FIGS. 2A-2D, connector 234 may be adapted
to electrically couple power supply 262 to motherboard 232 and
other components of information handling system 102. Similarly, as
shown in FIGS. 2A-2D, connector 234 may be adapted to electrically
couple hard drives 258 to motherboard 232 and other components of
information handling system 102, for example.
[0055] Each expansion slot 235 may include any system, device or
apparatus configured to electrically couple an information handling
resource or other component of information handling system 102 to
one or more other components of information handling system 102.
For example, as shown in FIGS. 2A-2D, each expansion slot 235 may
have a generally rectangular prism or cuboid shape and may be
configured to removably receive corresponding mating edge
connectors of a card (e.g., a video graphics card or other
expansion card). In some embodiments, each expansion slot 235 may
comprise a peripheral component interconnect (PCI) connector or
peripheral component interconnect express (PCIe) connector.
[0056] Each memory slot 242, 243 may include any system, device or
apparatus configured to electrically couple a memory module 252,
282 to one or more other components of information handling system
102. For example, as shown in FIGS. 2A-2D, each memory slot 242,
243 may have a generally rectangular prism or cuboid shape and may
be configured to removably receive corresponding mating edge
connectors of a memory module (e.g., a single-inline memory module
or dual-inline memory module).
[0057] In some embodiments, one or more of processors 233 may be
positioned on motherboard 232 such that the processor 233 is
thermally coupled to fluid flowing in a microchannel region 271
having fluid microchannels 308 by virtue of proximity between the
fluid flowing in the fluid microchannel 308 and the processor 233,
and the presence of one or more generally thermally conductive
materials (e.g., a portion of the surface of support member 270)
between the fluid and the processor 233.
[0058] Memory assembly 250 may include one or more memory modules
and one or more components configured to thermally couple and/or
mechanically couple such memory modules to support member 220. For
example, as shown in FIGS. 2A-2D, memory assembly 250 may include
one or more memory modules 252, one or more heat sinks 254, and one
or more brackets 256.
[0059] Each memory module 252 may include a printed circuit board
or other system, device, or apparatus whereupon one or more memory
integrated circuits configured to store data and/or instructions
for a period of time (e.g., static random access memory, dynamic
random access memory, FLASH, and/or other suitable type of memory).
For example, each memory module 252 may comprise a dual inline
memory module (DIMM). Memory module 252 may be mechanically and/or
electrically coupled to motherboard 232 via memory module connector
242. For example, each memory module 252 may include an edge
connector configured to mount memory module 252 in memory module
connector 242. In some embodiments, memory module 252 may be
mechanically coupled to motherboard 232 such that memory module 252
and/or the surfaces of integrated circuits mounted thereto may be
substantially perpendicular to the surface of motherboard 232, as
shown in FIGS. 2A-2D.
[0060] Each heat sink 254 may comprise any system, device, or
apparatus configured to thermally couple one or more integrated
circuits (e.g., memory integrated circuits) mounted on one side of
a corresponding memory module 252 to support member 220. For
example, turning briefly to FIG. 4, an individual memory module 252
having two heat sinks 254 coupled to the memory module 252 is
depicted. Each heat sink 254 may be generally conductive of heat,
and accordingly may include or be made from copper, aluminum, or
another material that is generally conductive of heat. As shown in
FIG. 4, each heat sink 254 may include two end portions 404 and a
middle portion 402. Although depicted as different portions in FIG.
4, end portions 404 and middle portion 402 of each heat sink 254
may be formed from the same piece of material. The middle portion
402 may include a trace 406 and a contact plate 408 mechanically
and thermally coupled to the trace 406 (e.g., trace 406 may be
coupled to contact plate 408 via an adhesive or trace 406 and 408
may be formed from the same piece of material). Contact plate 408
may in turn be thermally coupled to integrated circuits mounted on
memory module 252, as discussed in greater detail below.
[0061] Clamps 410 may mechanically couple one or two heat sinks 254
to each memory module 252. Such mechanical coupling facilitates
thermal coupling between integrated circuits mounted on memory
module 252 and contact plates 408. Accordingly, heat generated by
integrated circuits mounted on memory module 252 may be conducted
to contact plate 408 by virtue of contact plate 408 being in direct
contact or in proximity with such integrated circuits. The heat may
further be conducted to trace 406, and then to end portions 404.
Each end portion 404 may be also be thermally coupled to support
member 220 (e.g., proximate to a microchannel region 221) thus
allowing heat generated by integrated circuits of memory module 252
to be transferred to fluid flowing in support member 220.
[0062] The position, length, height, width, shape, and other
physical characteristics of each portion of each heat sink 254 may
be selected based on desired cooling characteristics, desired fluid
flow rates, desired fluid type, component types, component
locations, expected component heat generation, and/or any other
suitable characteristics of memory modules 252 and information
handling system 102. For example, because the surfaces of
integrated circuits on a memory module are often substantially
co-planar, contact plate 408 may have a planar surface sized and
shaped to cover the surface of each such integrated circuit.
Likewise, trace 406 may be have the general shape of a rectangular
cube with a small height, to effectively transfer heat from contact
plate 408 to end portions 404 while allowing for memory modules 252
to be mounted as densely as possible in information handling system
102 in order to achieve a desired memory density in information
handling system 102. As another example, end portions 404 may have
the general shape of cylinders, potentially maximizing the contact
surface area (and thus thermal conductivity) between heat sinks 254
and features 229, as well as facilitating mechanical coupling of
memory assembly 250 to support member 220.
[0063] Turning again to FIGS. 2A-2D, brackets 256 may be coupled to
support member 220 via screws, fasteners, adhesives, and/or other
suitable means, and may include any structure suitable to
mechanically support one or more heat sinks (e.g., heat sinks 254)
on support member 220, and may be formed by machining, extrusion,
or other suitable manner. The position, length, height, width, and
other physical characteristics of brackets 256 may be selected
based on the size and/or shape of heat sinks 254, and/or any other
suitable characteristics of information handling system 102. For
example, as shown in FIGS. 2A-2D, a side of each bracket 256
proximate to heat sinks 254 may have a semi-cylindrical shape in
embodiments in which heat sinks 254 have a cylindrical shape.
[0064] Memory assembly 280 may include one or more memory modules
and one or more components configured to thermally couple and/or
mechanically couple such memory modules to support member 270. For
example, as shown in FIGS. 2A-2D, memory assembly 280 may include
one or more memory modules 282, one or more heat sinks 284, and one
or more brackets 286.
[0065] Each memory module 282 may include a printed circuit board
or other system, device, or apparatus whereupon one or more memory
integrated circuits configured to store data and/or instructions
for a period of time (e.g., static random access memory, dynamic
random access memory, FLASH, and/or other suitable type of memory).
For example, each memory module 282 may comprise a dual inline
memory module (DIMM). Memory module 282 may be mechanically and/or
electrically coupled to motherboard 232 via memory module connector
243. For example, each memory module 282 may include an edge
connector configured to mount memory module 282 in memory module
connector 243. In some embodiments, memory module 282 may be
mechanically coupled to motherboard 232 such that memory module 282
and/or the surfaces of integrated circuits mounted thereto may be
substantially perpendicular to the surface of motherboard 282, as
shown in FIGS. 2A-2D. In these and other embodiments, memory
modules 282 may be identical or similar to memory modules 252.
[0066] Each heat sink 284 may comprise any system, device, or
apparatus configured to thermally couple one or more integrated
circuits (e.g., memory integrated circuits) mounted on one side of
a corresponding memory module 282 to support member 270. For
example, each sink 284 may be identical or similar to heat sink 254
depicted in FIG. 4, and may be mechanically and/or thermally
coupled to support member 270 and/or integrated circuits of memory
modules 282 in a manner identical or similar to that depicted in
FIG. 4. Each heat sink 284 may be also be thermally coupled to
support member 270 (e.g., proximate to a microchannel region 271)
thus allowing heat generated by integrated circuits of memory
module 282 to be transferred to fluid flowing in support member
270.
[0067] The position, length, height, width, shape, and other
physical characteristics of each portion of each heat sink 284 may
be selected based on desired cooling characteristics, desired fluid
flow rates, desired fluid type, component types, component
locations, expected component heat generation, and/or any other
suitable characteristics of memory modules 282 and information
handling system 102.
[0068] Brackets 286 may be coupled to support member 270 via
screws, fasteners, adhesives, and/or other suitable means, and may
include any structure suitable to mechanically support one or more
heat sinks (e.g., heat sinks 284) on support member 270, and may be
formed by machining, extrusion, or other suitable manner. The
position, length, height, width, and other physical characteristics
of brackets 286 may be selected based on the size and/or shape of
heat sinks 284, and/or any other suitable characteristics of
information handling system 102. For example, as shown in FIGS.
2A-2D, a side of each bracket 286 proximate to heat sinks 284 may
have a semi-cylindrical shape in embodiments in which heat sinks
284 have a cylindrical shape.
[0069] Each hard drive 258 may include any non-volatile storage
device which stores data. As depicted in FIGS. 2A-2D, each hard
drive 258 may be mechanically coupled to support member 220 via a
bracket 260 and/or electrically coupled to motherboard 232 via
interface cabling 261. Each bracket 260 may itself be mechanically
coupled to each of hard drive 258 and support member 220 via
screws, fasteners, adhesives, and/or other suitable means. In some
embodiments, one or more of hard drives 258 may be mechanically
coupled to support member 220 such that the hard drive 258 is
thermally coupled to fluid flowing in a microchannel region 221
having fluid microchannels 304 by virtue of proximity between the
fluid flowing in the fluid microchannel 304 and the hard drive 258,
and the presence of one or more generally thermally conductive
materials (e.g., a portion of the surface of support member 220)
between the fluid and the hard drive 258.
[0070] Power supply 262 may include any device, system, or
apparatus operable to supply electrical energy to one or more
components of information handling system 102. As depicted in FIGS.
2A-2D, power supply 262 may be mechanically coupled to support
member 220 via a bracket 262 and/or electrically coupled to
motherboard 232 via interface cabling 266. Each bracket 262 may
itself be mechanically coupled to power supply 262 and support
member 220 via screws, fasteners, adhesives, and/or other suitable
means. In some embodiments, power supply 262 may be mechanically
coupled to support member 220 such that power supply 262 is
thermally coupled to fluid flowing in a microchannel region 221
having fluid microchannels 304 by virtue of proximity between the
fluid flowing in the fluid microchannel 304 and power supply 262,
and the presence of one or more generally thermally conductive
materials (e.g., a portion of the surface of support member 220)
between the fluid and power supply 262.
[0071] Expansion assembly 178 may include one or more expansion
cards and one or more components configured to mechanically couple
such expansion cards to support member 210 and/or motherboard 232
and/or to thermally couple such expansion cards to cold plates. For
example, as shown in FIGS. 2A-2D, expansion assembly 178 may
include a cover 180, cold plate assembly 182, and one or more
expansion cards 196. Coldplate assembly 182 may be mechanically
coupled to support member 210 at mounting locations on brackets 190
via one or more screws, fasteners, adhesives, and/or other suitable
means, and may include any system, device or apparatus configured
to serve as a mount and/or provide structural support for expansion
cards 196. The position, length, height, width, and other physical
characteristics of coldplate assembly 182 may be selected based on
desired cooling characteristics, desired fluid flow rates, desired
fluid type, component types, component locations, expected
component heat generation, and/or any other suitable
characteristics of information handling system 102.
[0072] Cover 180 may be any suitable apparatus for sealing or
covering cold plates 184. Cover 180 may be made from any suitable
material, including without limitation plastic.
[0073] Each expansion card 196 may include a printed circuit board
or other system, device, or apparatus that may be inserted into an
expansion slot 235 of motherboard 232 and may include a processor
198, one or more integrated circuits, and/or other components
mounted thereto and configured to add a particular functionality to
information handling system 102 (e.g., graphics card, video card,
sound card, network interface card, TV or radio tuner card, host
adapter card, etc.). Expansion card 196 may be mechanically and/or
electrically coupled to motherboard 232 via expansion slot 235. For
example, each expansion card 196 may include an edge connector
configured to mount expansion card 196 in expansion slot 195. In
some embodiments, expansion card 196 may be mechanically coupled to
motherboard 232 such that expansion card 196 and/or the surfaces of
integrated circuits mounted thereto may be substantially parallel
to the surface of motherboard 232, as shown in FIGS. 2A-2D. In
these and other embodiments, each expansion card 196 may be
mechanically coupled to cold plate assembly 182 via one or more
screws, fasteners, adhesives, and/or other suitable means
[0074] Cold plate assembly 182 may include one or more cold plates
184 and one or more components configured to mechanically and
thermally couple such cold plates to expansion cards 198. For
example, as shown in FIGS. 2A-2D, cold plate assembly 182 may
include one or more cold plates 184, one or more brackets 190, and
one or more quick disconnect fluid fittings 192, 194. In some
embodiments, cold plate assembly may be slidable relative to
support member 210, in order to facilitate user-convenient fluidic
coupling of cold plates 184 with quick disconnect fluid fitting 292
and fluid conduit 268, electrical coupling of expansion cards 196
to motherboard 232, and thermal coupling of components of expansion
cards 196 to cold plates 184 as described in greater detail in
FIGS. 6A-6E below.
[0075] Each cold plate 184 may be mechanically coupled to support
member 210 via one or more screws, fasteners, adhesives, and/or
other suitable means. Each cold plate 184 may be constructed from
extruded aluminum, machined aluminum, case aluminum, and/or another
suitable material. In some embodiments, all or one or more portions
of each cold plate 184 may comprise a material (e.g., aluminum or
other metal) that is generally thermally conductive.
[0076] Turning again briefly to FIG. 3A, each cold plate 184 may
include fluid channels 310 and fluid microchannels 312 formed
predominantly on the interior of such cold plate 184. Fluid
channels 310 may include any suitable channel configured to
transport fluid to, from, or within each cold plate 184 and may be
formed by machining, extrusion, or other suitable manner. The
position, length, height, width, and other physical characteristics
of fluid channels 310 may be selected based on desired cooling
characteristics, desired fluid flow rates, desired fluid type,
component types, component locations, expected component heat
generation, and/or any other suitable characteristics of
information handling system 102. Fluid channels 310 of each cold
plate 184 may be fluidically coupled to one or more of a bracket
190, a fluid microchannel 312, or another fluid channel 310.
[0077] Fluid microchannels 312 may include any suitable channel
configured to transport fluid within each cold plate 184 and may be
formed by machining, extrusion, or other suitable manner. The
position, length, height, width, and other physical characteristics
of fluid microchannels 312 may be selected based on desired cooling
characteristics, desired fluid flow rates, desired fluid type,
component types, component locations, expected component heat
generation, and/or any other suitable characteristics of
information handling system 102. In some embodiments, fluid
microchannels 304 may be positioned at particular microchannel
regions 186 within each cold plate 184. The microchannel regions
186 may be sized and/or located within each cold plate 184 such
that when information handling system 102 is constructed, each
microchannel region 186 is thermally coupled to a particular
information handling resource (e.g., processor 198) by virtue of
proximity between the fluid flowing in the fluid microchannel 312
and the information handling resource, and the presence of one or
more generally thermally conductive materials (e.g., a portion of
the surface of a particular cold plate) between the fluid and the
information handling resource.
[0078] Turning again to FIGS. 2A-2D, each bracket 190 may be
mechanically coupled to one or more of a cold plate 184 and an
expansion card 196 via one or more screws, fasteners, adhesives,
and/or other suitable means, and may include any system, device or
apparatus configured to mechanically couple a cold plate 184 and/or
expansion card 196 to support member 210. Each bracket 190 may also
include fluid channels to fluidically couple a fluid channel 310 of
a cold plate 184 to at least one of a quick disconnect fluid
fitting 192, 194 or a fluid channel 310 of another cold plate
184.
[0079] Quick disconnect fluid fitting 192 may be made from plastic,
rubber, or other suitable material and may be any system, device or
apparatus configured to couple fluid channels 310 of cold plate
184b to fluid channels of support member 210 and/or fluid channels
302 of support member 220 via quick disconnect fluid fitting
292.
[0080] Quick disconnect fluid fitting 194 may be made from plastic,
rubber, or other suitable material and may be any system, device or
apparatus configured to couple fluid channels 310 of cold plate
184a to fluid conduit 268.
[0081] FIGS. 5A-5B illustrate various views of selected components
of cooling unit 104, in accordance with embodiments of the present
disclosure. FIG. 5A illustrates an isometric view and FIG. 5B
illustrates an exploded view. As shown in FIGS. 5A-5B, cooling unit
104 may include an enclosure 502, an umbilical assembly 504, a fan
506, a power supply 508, a radiator 510, and one or more fluid
conduits 512, 513 and 514, and a pump 518.
[0082] Enclosure 502 may be any cabinet or housing suitable to
house and/or mount various components cooling unit 104. Enclosure
502 may be constructed from aluminum, plastic, and/or any other
suitable material.
[0083] Umbilical assembly 504 may be any system, device or
apparatus configured to fluidically couple and/or electrically
couple umbilical 106 to cooling unit 104. In some embodiments,
umbilical assembly 504 may be identical or similar to umbilical
assembly 204 depicted in FIGS. 2A-2D (e.g., may include an assembly
cover and a fluidic coupler such as assembly cover 206 and fluidic
coupler 208, for example).
[0084] Fan 506 may be any device, system or apparatus configured to
produce an airflow proximate to radiator 510 and/or other
components of cooling unit 104.
[0085] Power supply 508 may include any device, system, or
apparatus configured to supply electrical energy to one or more
components of, including without limitation, power fan 508 and pump
518.
[0086] Radiator 510 may include any device, system or apparatus
configured to transfer thermal energy from one medium (e.g., fluid)
to another (e.g., air) for the purpose of cooling and heating. In
some embodiments, radiator 510 may include fluidic channels and/or
conduits in at least a portion of radiator 510. Such fluidic
channels and/or conduits may be fluidically coupled to one or more
of fluid conduits 512, 513 and 514 and pump 518 (e.g., via one or
more quick disconnect fluid fittings such as quick disconnect fluid
fitting 516, for example).
[0087] One or more of fluid conduits 512, 513, 514 may include any
device, system or apparatus for the conveyance of fluid (e.g.,
tubing, a pipe, a hollow cylinder). For example, as depicted in
FIGS. 5A-5B, fluid conduit 512 may fluidically couple pump 518 to
umbilical 106 and/or fluid conduit 514 may fluidically couple
umbilical 106 to radiator 510. Other fluid conduits or channels not
shown in FIGS. 5A-5B may also be present in cooling unit 104. Fluid
conduits 512, 513 and 514 may be made of plastic, metal, and/or any
other suitable material.
[0088] Pump 518 may be any device, system, or apparatus configured
to produce a flow of fluid (e.g., fluid in one or more fluidic
channels, conduits, etc. of information handling system 102,
cooling unit 104 and/or umbilical 106). As shown in FIGS. 5A-5B,
pump 518 may be fluidically coupled to umbilical 106 and radiator
510.
[0089] In operation, pump 518 may induce a flow of fluid (e.g.,
water, ethylene glycol, propylene glycol, or other coolant) through
various fluidic channels, conduits, etc. of information handling
system 102, cooling unit 104 and/or umbilical 106. For example,
pump 518 may pump fluid from cooling unit 104 to fluid conduit 110
of umbilical 106 and then to fluid conduit of 168. From fluid
conduit 168, fluid may flow to fluid conduit 170 where the fluid
may be split into fluid conduits 172a and 172b, as shown by arrows
in FIG. 3C.
[0090] From fluid conduits 172a and 172b, fluid may then flow into
fluid channels 306 of support member 270. The fluid may then flow
through the various fluid channels 306 and fluid microchannels 308
of support member 270 as shown by the arrows depicted in FIG. 3C.
As fluid flows through fluid microchannels 308, heat generated by
microprocessors 233 may be transferred to the fluid. In addition,
heat generated by integrated circuits mounted on memory modules 282
may be transferred to heat sinks 284, and from heat sinks 284 to
fluid flowing in fluid microchannels 308. Such transfers of heat
may reduce the temperatures of microprocessors 233 and/or the
integrated circuits mounted on memory modules 282.
[0091] Fluid may also flow from fluid channels 306, through quick
disconnect fluid fittings 231 of support member 270 and quick
disconnect fluid fittings 230 of support member 220, and into fluid
channels 302 of support member 220. The fluid may then flow through
the various fluid channels 302 and fluid microchannels 304 of
support member 220 as shown by the arrows depicted in FIG. 3A. As
fluid flows through fluid microchannels 304, heat generated by hard
drives 258 and power source 262 may be transferred to the fluid. In
addition, heat generated by integrated circuits mounted on memory
modules 252 may be transferred to heat sinks 254, and from heat
sinks 254 to fluid flowing in fluid microchannels 304. Such
transfers of heat may reduce the temperatures of hard drives 258,
power source 262, and/or the integrated circuits mounted on memory
modules 252.
[0092] Fluid may also flow from fluid channels 302, through quick
disconnect fluid fitting 292 of support member 220 and quick
disconnect fluid fitting 192 of cold plate assembly 182, through a
fluid channel of bracket 190a, and through fluid channels 310 of
cold plate 184b. The fluid may then flow through the various fluid
channels 310 and fluid microchannels 312 of cold plate 184b as
shown by the arrows depicted in FIG. 3A. Fluid may flow from fluid
channels 310 of cold plate 184b, through a fluid channel of bracket
190b, and into fluid channels 310 of cold plate 184a. The fluid may
then flow through the various fluid channels 310 and fluid
microchannels 312 of cold plate 184a as shown by the arrows
depicted in FIG. 3A. As fluid flows through fluid microchannels
312, heat generated by processors 198 may be transferred to the
fluid. Such transfers of heat may reduce the temperatures of
processors 198.
[0093] Fluid may also flow from fluid channels 310 of cold plate
184a, through quick disconnect fluid fitting 194, through fluid
conduit 268, and into fluid conduit 108 of umbilical 106.
[0094] From fluid conduit 108 of umbilical 106, fluid may flow
through fluid conduit 514 of cooling unit 104 and into fluid
channels and/or conduits of radiator 510. As fluid flows through
radiator 510, heat present in the fluid may be transferred to media
(e.g., air or other fluid) flowing proximate to radiator 510 (e.g.,
air blown from fan 506, through radiator 510 and to the exterior of
cooling unit 104). Such transfers of heat may reduce the
temperature of the fluid. Thus, ultimately, heat generated by
processors 233, hard drives 258, power source 262, processors 198,
integrated circuits mounted to memory modules 252, 282, and/or
other information handling resources may be transferred to media
(e.g., air) proximate to cooling unit 104.
[0095] FIGS. 6A-6E illustrate fluidic coupling of cold plates 184
with quick disconnect fluid fitting 292 and fluid conduit 268,
electrical coupling of expansion cards 196 to motherboard 232, and
thermal coupling of components of expansion cards 196 to cold
plates 184, in accordance with embodiments of the present
disclosure.
[0096] As shown in FIGS. 6A-6E, support member 210 may have coupled
thereto one or more guides 602. Each guides 602 may be any system,
device or apparatus configured to couple a corresponding bracket
190a, 190b, or 190c to support member 210 such that cold plate
assembly 182 may slide relative to support member 210. While cold
plate assembly is in a first position (e.g., an "up" or "out"
position), one or more expansion cards 196 may be mechanically
coupled to corresponding cold plates 184a or 184b via screws 606
and/or other suitable means (e.g., fasteners, adhesives). The
mechanical coupling of an expansion card 196 to a corresponding
cold plate 184a, 184b, may cause contact between components of the
expansion card 196 (e.g., a processor 198) and a surface of the
corresponding cold plate 184a, 184b, such that such components may
be thermally coupled to fluidic channels 310 and/or fluidic
microchannels 312 of the corresponding cold plate 184a, 184b, as
previously described in this disclosure.
[0097] In certain embodiments of the present disclosure, one or
more of quick disconnect fluid fittings 192, 194, and 292 may be
"dripless" such that the quick disconnect fluid fittings 192 and
292 do not release fluid when not engaged to each other, and quick
disconnect fluid fitting 194 does not release fluid when not
engaged to fluid conduit 268. Accordingly, cold plate assembly 182
may be placed in the first position (e.g., the "up" or "out"
position), without requiring draining and/or flushing of fluid in
system 100, or without requiring recharging of the fluid in system
100 after quick disconnect fluid fittings 192, 194, and 292 are
re-engaged, as described below.
[0098] In operation, cold plate assembly 182 may be slidably
coupled to support member 210 (e.g., via brackets 190a-190c and
guides 602) such that cold plate assembly 182 may be slid between
the first position (e.g., the "up" or "out" position) described
above and depicted in FIGS. 6B and 6C, to a second position (e.g.,
a "down" or "in" position) depicted in FIGS. 6D and 6E, and vice
versa. Brackets 190a and 190c may have pins 604 or other suitable
component configured to lock and/or temporarily fix cold plate
assembly 182 in either of the first position or second position.
For example, pins 604 may be spring loaded pins that engage with a
corresponding portion of a guide 602 to lock or temporarily fix
cold plate assembly 182 in either of the first position or second
position until such time that a user of system 100 may actuate such
pins to unlock the cold plate assembly to allow movement from the
first position to the second position, or vice versa.
[0099] When slid from the first position to the second position,
cold plate assembly 182 may be aligned and configured such that
quick disconnect fluid fitting 192 may engage quick disconnect
fluid fitting 292, and quick disconnect fluid fitting 194 may
engage fluid conduit 268, thus completing the fluidic path
throughout system 100. In addition, when one or more expansion
cards 196 are mechanically coupled to cold plate assembly 182, such
expansion cards 196 may be aligned and configured such that
expansion cards 196 electrically engage with corresponding
expansion slots 235 on motherboard 232.
[0100] Thus, the sliding cold plate assembly 182 may advantageously
allow for addition and/or removal of expansion cards 196 without
requiring removal of cold plates 184a, 184b or the drainage,
flushing or recharge of fluid in system 100. Notably, cold plate
assembly 182 may be engaged in the second position (e.g., the
"down" or "in" position) to complete the fluidic path throughout
system 100 regardless of the number of expansion cards 196 used, or
regardless of the presence of expansion cards 196.
[0101] Although the description above discusses the ultimate
transfer of heat from processors 233, hard drives 258, power source
262, processors 198, and integrated circuits mounted to memory
modules 252, 282, systems and methods similar to those disclosed
above may be used to cool information handling resources other than
those discussed above.
[0102] Using the methods and systems disclosed herein, problems
associated with traditional approaches to cooling information
handling resources may be reduced or eliminated. For example,
methods and systems disclosed herein may provide a technique for
cooling information handling resources within an information
handling system without the need for mechanical fans in the
information handling system or without transferring heat generated
by such information handling resources to air immediately proximate
to the information handling system.
[0103] The methods and systems disclosed herein also allow for
cooling of information handling resources in information handling
systems of various configurations. For example, the methods and
systems disclosed herein provide for cooling a processor and other
information handling resources mounted to a motherboard, as well
cooling of off-motherboard information handling resources with
surfaces substantially parallel to that of the surface of the
motherboard (e.g., processors 198 of expansion cards 196), and with
surfaces substantially perpendicular to that of the surface of the
motherboard (e.g., integrated circuits mounted to memory modules
252, 282). It is noted that while the various embodiments discussed
above contemplate the cooling of memory modules with components
having surfaces perpendicular to a surface of a motherboard,
methods and systems identical or similar to those disclosed above
may be used to provide for cooling of other information handling
resources with surfaces perpendicular to that of a motherboard
(e.g., expansion cards) and/or to provide for cooling of memory
modules with component surfaces in other positions relative to the
surface of the motherboard. It is also noted that while the various
embodiments discussed above contemplate the cooling of expansion
cards with component surfaces parallel to a surface of a
motherboard, methods and systems identical or similar to those
disclosed above may be used to provide for cooling of other
information handling resources with surfaces parallel to that of a
motherboard (e.g., memory modules) and/or to provide for cooling of
expansion cards with component surfaces in other positions relative
to the surface of the motherboard.
[0104] In addition, the methods and systems disclosed herein
further provide for structural elements (e.g., support members 220
and 270) that provide structural support for an information
handling system and its various components as well as a housing for
fluidic channels used to convey the fluid used to cool the various
components.
[0105] Although the present disclosure has been described in
detail, it should be understood that various changes,
substitutions, and alterations can be made hereto without departing
from the spirit and the scope of the disclosure as defined by the
appended claims.
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