U.S. patent application number 15/242356 was filed with the patent office on 2016-12-08 for color modulated led-based illumination.
The applicant listed for this patent is Xicato, Inc.. Invention is credited to Gerard Harbers, Bary Mark Loveridge.
Application Number | 20160359563 15/242356 |
Document ID | / |
Family ID | 53483121 |
Filed Date | 2016-12-08 |
United States Patent
Application |
20160359563 |
Kind Code |
A1 |
Harbers; Gerard ; et
al. |
December 8, 2016 |
COLOR MODULATED LED-BASED ILLUMINATION
Abstract
An LED based illumination device transmits information by
receiving an amount of digital data and modulating a color of light
emitted from the LED based illumination device based on the digital
data. The luminous flux of the emitted light remains approximately
constant while the color of light varies. A receiver may receive
the emitted light and demodulate a signal indicative of the color
of emitted light to determine the digital data. The color of the
light may be modulated by varying current provided to different
LEDs, where the different LEDs cause different color of light to be
emitted from the LED based illumination device.
Inventors: |
Harbers; Gerard; (Sunnyvale,
CA) ; Loveridge; Bary Mark; (San Jose, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Xicato, Inc. |
San Jose |
CA |
US |
|
|
Family ID: |
53483121 |
Appl. No.: |
15/242356 |
Filed: |
August 19, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14578240 |
Dec 19, 2014 |
9425896 |
|
|
15242356 |
|
|
|
|
61922608 |
Dec 31, 2013 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05B 45/20 20200101;
H05B 45/37 20200101; H04B 10/116 20130101; H05B 47/19 20200101;
H05B 45/22 20200101; H05B 45/00 20200101 |
International
Class: |
H04B 10/116 20060101
H04B010/116; H05B 37/02 20060101 H05B037/02; H05B 33/08 20060101
H05B033/08 |
Claims
1. A method of receiving information from an LED based illumination
device, comprising: receiving an amount of light emitted from the
LED based illumination device, wherein a luminous flux of the
amount of light emitted from the LED based illumination device
remains approximately constant while a color of light varies;
determining a signal indicative of the color of the received light;
and demodulating the signal indicative of the color of the received
light to determine the digital data received from the LED based
illumination device.
2. The method of claim 1, wherein the receiving of the amount of
light emitted from the LED based illumination device involves a
color sensing device.
3. The method of claim 2, wherein the color sensing device is any
of a Complementary Metal-Oxide Semiconductor (CMOS) device, a
Charge-Coupled Device (CCD) device, and a filtered photodiode.
4. The method of claim 1, wherein the demodulating the signal
indicative of the color of the received light involves any of
amplitude demodulation, frequency demodulation, pulse width
demodulation, and phase demodulation.
5. The method of claim 1, wherein the color of the light received
from the LED based illumination device varies at a frequency less
than 2,000 hertz.
6. The method of claim 1, wherein the color of the light received
from the LED based illumination device varies along lines of
constant Correlated Color Temperature (CCT) in a CIE 1931 color
space.
7. The method of claim 1, wherein a Correlated Color Temperature
(CCT) of the light received from the LED based illumination device
varies in a CIE 1931 color space.
8. An LED based illumination device comprising: a first LED
configured to receive a first current, wherein light emitted from
the first LED enters a color conversion cavity, and wherein a first
light emitted from the LED based illumination device based on the
light emitted from the first LED is a first colored light; a second
LED configured to receive a second current, wherein light emitted
from the second LED enters the color conversion cavity, and wherein
a second light emitted from the LED based illumination device based
on the light emitted from the second LED is a second colored light;
and a modulator configured to receive an amount of digital data and
modulate the first current and the second current such that a
luminous flux of the light emitted from the LED based illumination
device remains approximately constant and a combined color of light
emitted from the LED based illumination device varies based on the
digital data.
9. The LED based illumination device of claim 8, wherein the
modulating of the first and second currents involves any of
amplitude modulation, frequency modulation, pulse width modulation,
and phase modulation.
10. The LED based illumination device of claim 8, wherein the color
of the light emitted from the LED based illumination device varies
at a frequency less than 2,000 hertz.
11. The LED based illumination device of claim 8, wherein the color
of the light emitted from the LED based illumination device varies
along lines of constant Correlated Color Temperature (CCT) in a CIE
1931 color space.
12. The LED based illumination device of claim 8, wherein a
Correlated Color Temperature (CCT) of the light emitted from the
LED based illumination device varies in a CIE 1931 color space.
13. The LED based illumination device of claim 8, wherein a color
point of the light emitted from the LED based illumination device
varies within a degree of departure .DELTA.xy of 0.010 from a
nominal color point in a CIE 1931 xy diagram.
14. The LED based illumination device of claim 8, wherein the light
emitted from the first LED preferentially illuminates a first
wavelength converting material that is physically separated from a
light emitting surface of the first LED, and wherein the light
emitted from the second LED preferentially illuminates a second
wavelength converting material that is physically separated from a
light emitting surface of the second LED.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of and claims priority to
U.S. application Ser. No. 14/578,240, filed Dec. 19, 2014, which
claims priority under 35 USC .sctn.119 to U.S. Provisional
Application No. 61/922,608, filed Dec. 31, 2013, both of which are
incorporated by reference herein in their entireties.
TECHNICAL FIELD
[0002] The described embodiments relate to illumination modules
that include Light Emitting Diodes (LEDs).
BACKGROUND
[0003] The use of light emitting diodes in general lighting is
still limited due to limitations in light output level or flux
generated by the illumination devices. Illumination devices that
use LEDs also typically suffer from poor color quality
characterized by color point instability. The color point
instability varies over time as well as from part to part. Poor
color quality is also characterized by poor color rendering, which
is due to the spectrum produced by the LED light sources having
bands with no or little power. Further, illumination devices that
use LEDs typically have spatial and/or angular variations in the
color. Additionally, illumination devices that use LEDs are
expensive due to, among other things, the necessity of required
color control electronics and/or sensors to maintain the color
point of the light source or using only a small selection of
produced LEDs that meet the color and/or flux requirements for the
application.
[0004] Consequently, improvements to illumination device that uses
light emitting diodes as the light source are desired.
SUMMARY
[0005] An LED based illumination device transmits information by
receiving an amount of digital data and modulating a color of light
emitted from the LED based illumination device based on the digital
data. The luminous flux of the emitted light remains approximately
constant while the color of light varies. A receiver may receive
the emitted light and demodulate a signal indicative of the color
of emitted light to determine the digital data. The color of the
light may be modulated by varying current provided to different
LEDs, where the different LEDs cause different color of light to be
emitted from the LED based illumination device.
[0006] In one implementation, a method of transmitting information
from an LED based illumination device includes receiving an amount
of digital data; and modulating a color of light emitted from the
LED based illumination device based on the digital data such that a
luminous flux of the light emitted from the LED based illumination
device remains approximately constant while the color of light
varies.
[0007] In one implementation, a method of receiving information
from an LED based illumination device includes receiving an amount
of light emitted from the LED based illumination device, wherein a
luminous flux of the amount of light emitted from the LED based
illumination device remains approximately constant while a color of
light varies; determining a signal indicative of the color of the
received light; and demodulating the signal indicative of the color
of the received light to determine the digital data received from
the LED based illumination device.
[0008] In one implementation, an LED based illumination device
includes a first LED configured to receive a first current, wherein
light emitted from the first LED enters a color conversion cavity,
and wherein a first light emitted from the LED based illumination
device based on the light emitted from the first LED is a first
colored light; a second LED configured to receive a second current,
wherein light emitted from the second LED enters the color
conversion cavity, and wherein a second light emitted from the LED
based illumination device based on the light emitted from the
second LED is a second colored light; and a modulator configured to
receive an amount of digital data and modulate the first current
and the second current such that a luminous flux of the light
emitted from the LED based illumination device remains
approximately constant and a combined color of light emitted from
the LED based illumination device varies based on the digital
data.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The accompanying drawings, where like numerals indicate like
components, illustrate embodiments of the invention.
[0010] FIGS. 1, 2, and 3 illustrate exemplary luminaires, including
an illumination device, reflector, and light fixture.
[0011] FIG. 4 shows an exploded view illustrating components of LED
based illumination device as depicted in FIG. 2.
[0012] FIG. 5 is illustrative of an LED based light engine that may
be used in the LED based illumination device.
[0013] FIG. 6 illustrates an exploded view of components of LED
based illumination device in another embodiment.
[0014] FIGS. 7A and 7B illustrate perspective, cross-sectional
views of LED based illumination device as depicted in FIG. 1.
[0015] FIG. 8 illustrates a plot of simulated relative power
fractions necessary to achieve a range of Correlated Color
Temperatures (CCTs) for light emitted from an LED based
illumination device.
[0016] FIG. 9 is illustrative of a cross-sectional, side view of an
LED based illumination device in one embodiment.
[0017] FIG. 10 is illustrative of a top view of LED based
illumination device depicted in FIG. 9.
[0018] FIG. 11 is illustrative of a top view of an LED based
illumination device divided into five zones.
[0019] FIGS. 12A and 12B illustrate an exemplary traces of the flux
generated by LED based illumination device based on light generated
from LEDs in different zones.
[0020] FIG. 13 illustrates a range of color points achievable by
the LED based illumination device depicted in FIGS. 9 and 10.
[0021] FIG. 14 is a diagram illustrative of an electronic interface
module (EIM) including color modulation functionality in one
embodiment.
[0022] FIG. 15 is a diagram illustrating a room populated with LED
based illumination modules.
[0023] FIG. 16 illustrates a receiver that includes a color sensor
configured to receive an amount of light generated by an LED based
illumination device communicating digital information by color
modulation.
[0024] FIGS. 17 and 18 illustrate a cross-sectional view and top
view of an LED based illumination device in another embodiment.
DETAILED DESCRIPTION
[0025] Reference will now be made in detail to background examples
and some embodiments of the invention, examples of which are
illustrated in the accompanying drawings.
[0026] FIGS. 1, 2, and 3 illustrate three exemplary luminaires,
respectively all labeled 150A, 150B, and 150C (sometimes
collectively or generally referred to as luminaire 150). The
luminaire 150A illustrated in FIG. 1 includes an illumination
device 100A with a rectangular form factor. The luminaire 150B
illustrated in FIG. 2 includes an illumination device 100B with a
circular form factor. The luminaire 150C illustrated in FIG. 3
includes an illumination device 100C integrated into a retrofit
lamp device. These examples are for illustrative purposes. Examples
of illumination modules of general polygonal and elliptical shapes
may also be contemplated. Luminaire 150 includes illumination
device 100, reflector 125, and light fixture 120. FIG. 1
illustrates luminaire 150A with an LED based illumination device
100A, reflector 125A, and light fixture 120A. FIG. 2 illustrates
luminaire 150B with an LED based illumination device 100B,
reflector 125B, and light fixture 120B. FIG. 3 illustrates
luminaire 150C with an LED based illumination device 100C,
reflector 125C, and light fixture 120C. For the sake of simplicity,
LED based illumination modules 100A, 100B, and 100C may be
collectively referred to as illumination device 100, reflectors
1250A, 125B, and 125C may be collectively referred to as reflector
125, and light fixtures 120A, 120B, and 120C may be collectively
referred to as light fixture 120. As illustrated in FIG. 3, the LED
based illumination device 100 includes LEDs 102. As depicted, light
fixture 120 includes a heat sink capability, and therefore may be
sometimes referred to as heat sink 120. However, light fixture 120
may include other structural and decorative elements (not shown).
Reflector 125 is mounted to illumination device 100 to collimate or
deflect light emitted from illumination device 100. The reflector
125 may be made from a thermally conductive material, such as a
material that includes aluminum or copper and may be thermally
coupled to illumination device 100. Heat flows by conduction
through illumination device 100 and the thermally conductive
reflector 125. Heat also flows via thermal convection over the
reflector 125. Reflector 125 may be a compound parabolic
concentrator, where the concentrator is constructed of or coated
with a highly reflecting material. Optical elements, such as a
diffuser or reflector 125 may be removably coupled to illumination
device 100, e.g., by means of threads, a clamp, a twist-lock
mechanism, or other appropriate arrangement. As illustrated in FIG.
3, the reflector 125 may include sidewalls 126 and a window 127
that are optionally coated, e.g., with a wavelength converting
material, diffusing material or any other desired material.
[0027] As depicted in FIGS. 1, 2, and 3, illumination device 100 is
mounted to heat sink 120. Heat sink 120 may be made from a
thermally conductive material, such as a material that includes
aluminum or copper and may be thermally coupled to illumination
device 100. Heat flows by conduction through illumination device
100 and the thermally conductive heat sink 120. Heat also flows via
thermal convection over heat sink 120. Illumination device 100 may
be attached to heat sink 120 by way of screw threads to clamp the
illumination device 100 to the heat sink 120. To facilitate easy
removal and replacement of illumination device 100, illumination
device 100 may be removably coupled to heat sink 120, e.g., by
means of a clamp mechanism, a twist-lock mechanism, or other
appropriate arrangement. Illumination device 100 includes at least
one thermally conductive surface that is thermally coupled to heat
sink 120, e.g., directly or using thermal grease, thermal tape,
thermal pads, or thermal epoxy. For adequate cooling of the LEDs, a
thermal contact area of at least 50 square millimeters, but
preferably 100 square millimeters should be used per one watt of
electrical energy flow into the LEDs on the board. For example, in
the case when 20 LEDs are used, a 1000 to 2000 square millimeter
heatsink contact area should be used. Using a larger heat sink 120
may permit the LEDs 102 to be driven at higher power, and also
allows for different heat sink designs. For example, some designs
may exhibit a cooling capacity that is less dependent on the
orientation of the heat sink. In addition, fans or other solutions
for forced cooling may be used to remove the heat from the device.
The bottom heat sink may include an aperture so that electrical
connections can be made to the illumination device 100.
[0028] FIG. 4 shows an exploded view illustrating components of LED
based illumination device 100 as depicted in FIG. 2. It should be
understood that as defined herein an LED based illumination device
is not an LED, but is an LED light source or fixture or component
part of an LED light source or fixture. LED based illumination
device 100 includes an LED based light engine 160 configured to
generate an amount of light. LED based light engine 160 is coupled
to a mounting base 101 to promote heat extraction from LED based
light engine 160. Optionally, an electronic interface module (EIM)
122 is shaped to fit around mounting base 101. LED based light
engine 160 and mounting base 101 are enclosed between a lower
mounting plate 111 and an upper housing 110. An optional reflector
retainer (not shown) is coupled to upper housing 110. The reflector
retainer is configured to facilitate attachment of different
reflectors to the LED based illumination device 100.
[0029] FIG. 5 is illustrative of LED based light engine 160 in one
embodiment. LED based light engine 160 includes one or more LED die
or packaged LEDs and a mounting board to which LED die or packaged
LEDs are attached. In addition, LED based light engine 160 includes
one or more transmissive elements (e.g., windows or sidewalls)
coated or impregnated with one or more wavelength converting
materials to achieve light emission at a desired color point.
[0030] As illustrated in FIG. 5, LED based light engine 160
includes a number of LEDs 102A-F (collectively referred to as LEDs
102) mounted to mounting board 164 in a chip on board (COB)
configuration. The spaces between each LED are filled with a
reflective material 176 (e.g., a white silicone material). In
addition, a dam of reflective material 175 surrounds the LEDs 102
and supports transmissive element 174, sometimes referred to as
transmissive plate 174. The space between LEDs 102 and transmissive
plate 174 is filled with an encapsulating material 177 (e.g.,
silicone) to promote light extraction from LEDs 102 and to separate
LEDs 102 from the environment. In the depicted embodiment, the dam
of reflective material 175 is both the thermally conductive
structure that conducts heat from transmissive plate 174 to LED
mounting board 164 and the optically reflective structure that
reflects incident light from LEDs 102 toward transmissive plate
174.
[0031] LEDs 102 can emit different or the same color light, either
by direct emission or by phosphor conversion, e.g., where phosphor
layers are applied to the LEDs as part of the LED package. The
illumination device 100 may use any combination of colored LEDs
102, such as red, green, blue, ultraviolet, amber, or cyan, or the
LEDs 102 may all produce the same color light. Some or all of the
LEDs 102 may produce white light. In addition, the LEDs 102 may
emit polarized light or non-polarized light and LED based
illumination device 100 may use any combination of polarized or
non-polarized LEDs. In some embodiments, LEDs 102 emit either blue
or UV light because of the efficiency of LEDs emitting in these
wavelength ranges. The light emitted from the illumination device
100 has a desired color when LEDs 102 are used in combination with
wavelength converting materials on transmissive plate 174, for
example. By tuning the chemical and/or physical (such as thickness
and concentration) properties of the wavelength converting
materials and the geometric properties of the coatings on the
surface of transmissive plate 174, specific color properties of
light output by LED based illumination device 100 may be specified,
e.g., color point, color temperature, and color rendering index
(CRI).
[0032] For purposes of this patent document, a wavelength
converting material is any single chemical compound or mixture of
different chemical compounds that performs a color conversion
function, e.g., absorbs an amount of light of one peak wavelength,
and in response, emits an amount of light at another peak
wavelength.
[0033] By way of example, phosphors may be chosen from the set
denoted by the following chemical formulas: Y3Al5O12:Ce, (also
known as YAG:Ce, or simply YAG) (Y,Gd)3Al5O12:Ce, CaS:Eu, SrS:Eu,
SrGa2S4:Eu, Ca3(Sc,Mg)2Si3O12:Ce, Ca3Sc2Si3O12:Ce, Ca3Sc2O4:Ce,
Ba3Si6O12N2:Eu, (Sr,Ca)AlSiN3:Eu, CaAlSiN3:Eu, CaAlSi(ON)3:Eu,
Ba2SiO4:Eu, Sr2SiO4:Eu, Ca2SiO4:Eu, CaSc2O4:Ce, CaSi2O2N2:Eu,
SrSi2O2N2:Eu, BaSi2O2N2:Eu, Ca5(PO4)3Cl:Eu, Ba5(PO4)3Cl:Eu,
Cs2CaP2O7, Cs2SrP2O7, Lu3Al5O12:Ce, Ca8Mg(SiO4)4Cl2:Eu,
Sr8Mg(SiO4)4Cl2:Eu, La3Si6N11:Ce, Y3Ga5O12:Ce, Gd3Ga5O12:Ce,
Tb3Al5O12:Ce, Tb3Ga5O12:Ce, and Lu3Ga5O12:Ce.
[0034] In one example, the adjustment of color point of the
illumination device may be accomplished by adding or removing
wavelength converting material from transmissive plate 174. In one
embodiment a red emitting phosphor 181 such as an alkaline earth
oxy silicon nitride covers a portion of transmissive plate 174, and
a yellow emitting phosphor 180 such as a YAG phosphor covers
another portion of transmissive plate 174.
[0035] In some embodiments, the phosphors are mixed in a suitable
solvent medium with a binder and, optionally, a surfactant and a
plasticizer. The resulting mixture is deposited by any of spraying,
screen printing, blade coating, jetting, or other suitable means.
By choosing the shape and height of the transmissive plate 174, and
selecting which portions of transmissive plate 174 will be covered
with a particular phosphor or not, and by optimization of the layer
thickness and concentration of a phosphor layer on the surfaces,
the color point of the light emitted from the device can be tuned
as desired.
[0036] In one example, a single type of wavelength converting
material may be patterned on a portion of transmissive plate 174.
By way of example, a red emitting phosphor 181 may be patterned on
different areas of the transmissive plate 174 and a yellow emitting
phosphor 180 may be patterned on other areas of transmissive plate
174. In some examples, the areas may be physically separated from
one another. In some other examples, the areas may be adjacent to
one another. The coverage and/or concentrations of the phosphors
may be varied to produce different color temperatures. It should be
understood that the coverage area of the red and/or the
concentrations of the red and yellow phosphors will need to vary to
produce the desired color temperatures if the light produced by the
LEDs 102 varies. The color performance of the LEDs 102, red
phosphor and the yellow phosphor may be measured and modified by
any of adding or removing phosphor material based on performance so
that the final assembled product produces the desired color
temperature.
[0037] Transmissive plate 174 may be constructed from a suitable
optically transmissive material (e.g., sapphire, quartz, alumina,
crown glass, polycarbonate, and other plastics). Transmissive plate
174 is spaced above the light emitting surface of LEDs 102 by a
clearance distance. In some embodiments, this is desirable to allow
clearance for wire bond connections from the LED package submount
to the active area of the LED. In some embodiments, a clearance of
one millimeter or less is desirable to allow clearance for wire
bond connections. In some other embodiments, a clearance of two
hundred microns or less is desirable to enhance light extraction
from the LEDs 102.
[0038] In some other embodiments, the clearance distance may be
determined by the size of the LED 102. For example, the size of the
LED 102 may be characterized by the length dimension of any side of
a single, square shaped active die area. In some other examples,
the size of the LED 102 may be characterized by the length
dimension of any side of a rectangular shaped active die area. Some
LEDs 102 include many active die areas (e.g., LED arrays). In these
examples, the size of the LED 102 may be characterized by either
the size of any individual die or by the size of the entire array.
In some embodiments, the clearance should be less than the size of
the LED 102. In some embodiments, the clearance should be less than
twenty percent of the size of the LED 102. In some embodiments, the
clearance should be less than five percent of the size of the LED.
As the clearance is reduced, light extraction efficiency may be
improved, but output beam uniformity may also degrade.
[0039] In some other embodiments, it is desirable to attach
transmissive plate 174 directly to the surface of the LED 102. In
this manner, the direct thermal contact between transmissive plate
174 and LEDs 102 promotes heat dissipation from LEDs 102. In some
other embodiments, the space between mounting board 164 and
transmissive plate 174 may be filled with a solid encapsulate
material. By way of example, silicone may be used to fill the
space. In some other embodiments, the space may be filled with a
fluid to promote heat extraction from LEDs 102.
[0040] In the embodiment illustrated in FIG. 5, the surface of
patterned transmissive plate 174 facing LEDs 102 is coupled to LEDs
102 by an amount of flexible, optically translucent encapsulating
material 177. By way of non-limiting example, the flexible,
optically translucent encapsulating material 177 may include an
adhesive, an optically clear silicone, a silicone loaded with
reflective particles (e.g., titanium dioxide (TiO2), zinc oxide
(ZnO), and barium sulfate (BaSO4) particles, or a combination of
these materials), a silicone loaded with a wavelength converting
material (e.g., phosphor particles), a sintered PTFE material, etc.
Such material may be applied to couple transmissive plate 174 to
LEDs 102 in any of the embodiments described herein.
[0041] In some embodiments, multiple, stacked transmissive layers
or plates are employed. Each transmissive plate includes different
wavelength converting materials. For example, a transmissive plate
including a wavelength converting material may be placed over
another transmissive plate including a different wavelength
converting material. In this manner, the color point of light
emitted from LED based illumination device 100 may be tuned by
replacing the different transmissive plates independently to
achieve a desired color point. In some embodiments, the different
transmissive plates may be placed in contact with each other to
promote light extraction. In some other embodiments, the different
transmissive plates may be separated by a distance to promote
cooling of the transmissive layers. For example, airflow may by
introduced through the space to cool the transmissive layers.
[0042] The mounting board 164 provides electrical connections to
the attached LEDs 102 to a power supply (not shown). In one
embodiment, the LEDs 102 are packaged LEDs, such as the Luxeon
Rebel manufactured by Philips Lumileds Lighting. Other types of
packaged LEDs may also be used, such as those manufactured by OSRAM
(Ostar package), Luminus Devices (USA), Cree (USA), Nichia (Japan),
or Tridonic (Austria). As defined herein, a packaged LED is an
assembly of one or more LED die that contains electrical
connections, such as wire bond connections or stud bumps, and
possibly includes an optical element and thermal, mechanical, and
electrical interfaces. The LEDs 102 may include a lens over the LED
chips. Alternatively, LEDs without a lens may be used. LEDs without
lenses may include protective layers, which may include phosphors.
The phosphors can be applied as a dispersion in a binder, or
applied as a separate plate. Each LED 102 includes at least one LED
chip or die, which may be mounted on a submount. The LED chip
typically has a size about 1 mm by 1 mm by 0.5 mm, but these
dimensions may vary. In some embodiments, the LEDs 102 may include
multiple chips. The multiple chips can emit light of similar or
different colors, e.g., red, green, and blue. The LEDs 102 may emit
polarized light or non-polarized light and LED based illumination
device 100 may use any combination of polarized or non-polarized
LEDs. In some embodiments, LEDs 102 emit either blue or UV light
because of the efficiency of LEDs emitting in these wavelength
ranges. In addition, different phosphor layers may be applied on
different chips on the same submount. The submount may be ceramic
or other appropriate material. The submount typically includes
electrical contact pads on a bottom surface that are coupled to
contacts on the mounting board 164. Alternatively, electrical bond
wires may be used to electrically connect the chips to a mounting
board. Along with electrical contact pads, the LEDs 102 may include
thermal contact areas on the bottom surface of the submount through
which heat generated by the LED chips can be extracted. The thermal
contact areas are coupled to heat spreading layers on the mounting
board 164. Heat spreading layers may be disposed on any of the top,
bottom, or intermediate layers of mounting board 164. Heat
spreading layers may be connected by vias that connect any of the
top, bottom, and intermediate heat spreading layers.
[0043] In some embodiments, the mounting board 164 conducts heat
generated by the LEDs 102 to the sides of the mounting board 164
and the bottom of the mounting board 164. In one example, the
bottom of mounting board 164 may be thermally coupled to a heat
sink 120 (shown in FIGS. 1-3) via mounting base 101. In other
examples, mounting board 164 may be directly coupled to a heat
sink, or a lighting fixture and/or other mechanisms to dissipate
the heat, such as a fan. In some embodiments, the mounting board
164 conducts heat to a heat sink thermally coupled to the top of
the mounting board 164. Mounting board 164 may be an FR4 board,
e.g., that is 0.5 mm thick, with relatively thick copper layers,
e.g., 30 .mu.m to 100 .mu.m, on the top and bottom surfaces that
serve as thermal contact areas. In other examples, the mounting
board 164 may be a metal core printed circuit board (PCB) or a
ceramic submount with appropriate electrical connections. Other
types of boards may be used, such as those made of alumina
(aluminum oxide in ceramic form), or aluminum nitride (also in
ceramic form).
[0044] Mounting board 164 includes electrical pads to which the
electrical pads on the LEDs 102 are connected. The electrical pads
are electrically connected by a metal, e.g., copper, trace to a
contact, to which a wire, bridge or other external electrical
source is connected. In some embodiments, the electrical pads may
be vias through the mounting board 164 and the electrical
connection is made on the opposite side, i.e., the bottom, of the
board. Mounting board 164, as illustrated, is rectangular in
dimension. LEDs 102 mounted to mounting board 164 may be arranged
in different configurations on rectangular mounting board 164. In
one example LEDs 102 are aligned in rows extending in the length
dimension and in columns extending in the width dimension of
mounting board 164. In another example, LEDs 102 are arranged in a
hexagonally closely packed structure. In such an arrangement each
LED is equidistant from each of its immediate neighbors. Such an
arrangement is desirable to increase the uniformity and efficiency
of emitted light.
[0045] FIG. 6 illustrates an exploded view of components of LED
based illumination device 100 in another embodiment. LED based
illumination device 100 includes one or more LED die or packaged
LEDs and a mounting board to which LED die or packaged LEDs are
attached. In one embodiment, the LEDs 102 are packaged LEDs, such
as the Luxeon Rebel manufactured by Philips Lumileds Lighting.
Other types of packaged LEDs may also be used, such as those
manufactured by OSRAM (Oslon package), Luminus Devices (USA), Cree
(USA), Nichia (Japan), or Tridonic (Austria). Mounting board 104 is
attached to mounting base 101 and secured in position by mounting
board retaining ring 103. Together, mounting board 104 populated by
LEDs 102 and mounting board retaining ring 103 comprise light
source sub-assembly 115. Light source sub-assembly 115 is operable
to convert electrical energy into light using LEDs 102. The light
emitted from light source sub-assembly 115 is directed to light
conversion sub-assembly 116 for color mixing and color conversion.
Light conversion sub-assembly 116 includes cavity body 105 and an
output port, which is illustrated as, but is not limited to, an
output window 108. Light conversion sub-assembly 116 may include a
bottom reflector 106 and sidewall 107, which may optionally be
formed from inserts. Output window 108, if used as the output port,
is fixed to the top of cavity body 105. In some embodiments, output
window 108 may be fixed to cavity body 105 by an adhesive. To
promote heat dissipation from the output window to cavity body 105,
a thermally conductive adhesive is desirable. The adhesive should
reliably withstand the temperature present at the interface of the
output window 108 and cavity body 105. Furthermore, it is
preferable that the adhesive either reflect or transmit as much
incident light as possible, rather than absorbing light emitted
from output window 108. In one example, the combination of heat
tolerance, thermal conductivity, and optical properties of one of
several adhesives manufactured by Dow Corning (USA) (e.g., Dow
Corning model number SE4420, SE4422, SE4486, 1-4173, or SE9210),
provides suitable performance. However, other thermally conductive
adhesives may also be considered.
[0046] Either the interior sidewalls of cavity body 105 or sidewall
insert 107, when optionally placed inside cavity body 105, is
reflective so that light from LEDs 102, as well as any wavelength
converted light, is reflected within the cavity 162 until it is
transmitted through the output port, e.g., output window 108 when
mounted over light source sub-assembly 115. Bottom reflector insert
106 may optionally be placed over mounting board 104. Bottom
reflector insert 106 includes holes such that the light emitting
portion of each LED 102 is not blocked by bottom reflector insert
106. Sidewall insert 107 may optionally be placed inside cavity
body 105 such that the interior surfaces of sidewall insert 107
direct light from the LEDs 102 to the output window when cavity
body 105 is mounted over light source sub-assembly 115. Although as
depicted, the interior sidewalls of cavity body 105 are rectangular
in shape as viewed from the top of illumination device 100, other
shapes may be contemplated (e.g., clover shaped or polygonal). In
addition, the interior sidewalls of cavity body 105 may taper or
curve outward from mounting board 104 to output window 108, rather
than perpendicular to output window 108 as depicted.
[0047] Bottom reflector insert 106 and sidewall insert 107 may be
highly reflective so that light reflecting downward in the cavity
162 is reflected back generally towards the output port, e.g.,
output window 108. Additionally, inserts 106 and 107 may have a
high thermal conductivity, such that it acts as an additional heat
spreader. By way of example, the inserts 106 and 107 may be made
with a highly thermally conductive material, such as an aluminum
based material that is processed to make the material highly
reflective and durable. By way of example, a material referred to
as Miro.RTM., manufactured by Alanod, a German company, may be
used. High reflectivity may be achieved by polishing the aluminum,
or by covering the inside surface of inserts 106 and 107 with one
or more reflective coatings. Inserts 106 and 107 might
alternatively be made from a highly reflective thin material, such
as Vikuiti.TM. ESR, as sold by 3M (USA), Lumirror.TM. E60L
manufactured by Toray (Japan), or microcrystalline polyethylene
terephthalate (MCPET) such as that manufactured by Furukawa
Electric Co. Ltd. (Japan). In other examples, inserts 106 and 107
may be made from a polytetrafluoroethylene PTFE material. In some
examples inserts 106 and 107 may be made from a PTFE material of
one to two millimeters thick, as sold by W.L. Gore (USA) and
Berghof (Germany). In yet other embodiments, inserts 106 and 107
may be constructed from a PTFE material backed by a thin reflective
layer such as a metallic layer or a non-metallic layer such as ESR,
E60L, or MCPET. Also, highly diffuse reflective coatings can be
applied to any of sidewall insert 107, bottom reflector insert 106,
output window 108, cavity body 105, and mounting board 104. Such
coatings may include titanium dioxide (TiO2), zinc oxide (ZnO), and
barium sulfate (BaSO4) particles, or a combination of these
materials.
[0048] FIGS. 7A and 7B illustrate perspective, cross-sectional
views of LED based illumination device 100 as depicted in FIG. 1.
In this embodiment, the sidewall insert 107, output window 108, and
bottom reflector insert 106 disposed on mounting board 104 define a
color conversion cavity 162 in the LED based illumination device
100. A portion of light from the LEDs 102 is reflected within color
conversion cavity 162 until it exits through output window 108.
Reflecting the light within the cavity 162 prior to exiting the
output window 108 has the effect of mixing the light and providing
a more uniform distribution of the light that is emitted from the
LED based illumination device 100. In addition, as light reflects
within the cavity 162 prior to exiting the output window 108, an
amount of light is color converted by interaction with a wavelength
converting material included in the cavity 162.
[0049] Portions of cavity 162, such as the bottom reflector insert
106, sidewall insert 107, cavity body 105, output window 108, and
other components placed inside the cavity (not shown) may be coated
with or include a wavelength converting material. FIG. 7B
illustrates portions of the sidewall insert 107 coated with a
wavelength converting material. Furthermore, different components
of cavity 162 may be coated with the same or a different wavelength
converting material.
[0050] In one aspect, digital data is transmitted from an LED based
illumination module by modulating the color of light emitted from
the LED based illumination module, where the digital data is
encoded in the modulation of the color of light. The modulation of
the color of emitted light is performed such that the luminous flux
of the light emitted from the LED based illumination module remains
approximately constant while the color of the emitted light varies.
In some examples, digital data is transmitted from an LED based
illumination module by modulating the color of light emitted from
the LED based illumination module while the luminous flux of the
light emitted from the LED based illumination module varies by less
than 10%. In some other examples, the luminous flux of the light
emitted from the LED based illumination module varies by less than
5%. In some other examples, the luminous flux of the light emitted
from the LED based illumination module varies by less than 1%.
[0051] In some embodiments, changes in the color of light emitted
from an LED based illumination device 100 may be achieved by
employing LEDs with different emission characteristics (e.g.,
different colored LEDs). By controlling the relative flux emitted
from different zones of LEDs (e.g., by independently controlling
current supplied to LEDs having different emission
characteristics), changes in color may be achieved while
maintaining the overall flux level approximately constant. In one
embodiment, one zone of LEDs may include one or more red, orange,
yellow, or green-emitting LEDs, while another zone of LEDs includes
only blue-emitting LEDs. In another embodiment, one zone of LEDs
may include one or more ultraviolet-emitting LEDs, while another
zone of LEDs includes only blue-emitting LEDs. The aforementioned
embodiments are provided by way of non-limiting example, as many
other combinations of different LEDs may be contemplated to realize
a modulated color output.
[0052] In some other embodiments, changes in the color of light
emitted from an LED based illumination device 100 may be achieved
by employing LEDs with similar emission characteristics (e.g., all
blue emitting LEDs), or different emission characteristics, that
preferentially illuminate different color converting surfaces. By
controlling the relative flux emitted from different zones of LEDs
(e.g., by independently controlling current supplied to LEDs in
different zones), changes in color may be achieved while
maintaining the overall flux level approximately constant.
[0053] FIG. 8 illustrates a plot of simulated relative power
fractions necessary to achieve a range of Correlated Color
Temperatures (CCTs) for light emitted from an LED based
illumination device 100. The relative power fractions describe the
relative contribution of three different light emitting elements
within LED based illumination device 100: an array of blue emitting
LEDs, an amount of green emitting phosphor (model BG201A
manufactured by Mitsubishi, Japan), and an amount of red emitting
phosphor (model BR102D manufactured by Mitsubishi, Japan). As
illustrated in FIG. 8, as relative contributions from red, green,
and blue emitting elements are changed, different colored emission
from LED based illumination device 100 can be achieved.
[0054] As depicted in FIGS. 1-7B, light generated by LEDs 102 is
generally emitted into a color conversion cavity such as color
conversion cavity 162 depicted in FIG. 7A. However, various
embodiments are introduced herein to preferentially direct light
emitted from specific LEDs 102 to specific interior surface areas
of LED based illumination device 100. In this manner, LED based
illumination device 100 includes preferentially stimulated color
converting surface areas. Light emitted by certain LEDs 102 is
preferentially directed to an interior surface area of color
conversion cavity 162 that includes a first wavelength converting
material and light emitted from certain other LEDs 102 is
preferentially directed to another interior surface area of color
conversion cavity 162 that includes a second wavelength converting
material. In this manner control over the color of light emitted
from LED based illumination device 100 is achieved by controlling
the light emitted from LEDs that preferentially illuminate
different wavelength conversion materials.
[0055] FIG. 9 is illustrative of a cross-sectional, side view of an
LED based illumination device 100 in one embodiment. As
illustrated, LED based illumination device 100 includes a plurality
of LEDs 102A-102D, a sidewall 107 and an output window 108.
Sidewall 107 includes a reflective layer 171 and a color converting
layer 172. Color converting layer 172 includes a wavelength
converting material (e.g., a red-emitting phosphor material).
Output window 108 includes a transmissive layer 134 and a color
converting layer 135. Color converting layer 135 includes a
wavelength converting material with a different color conversion
property than the wavelength converting material included in
sidewall 107 (e.g., a yellow-emitting phosphor material). Color
conversion cavity 162 is formed by the interior surfaces of the LED
based illumination device 100 including the interior surface of
sidewall 107 and the interior surface of output window 108.
[0056] The LEDs 102A-102D of LED based illumination device 100 emit
light directly into color conversion cavity 162. Light is mixed and
color converted within color conversion cavity 162 and the
resulting combined light 141 is emitted by LED based illumination
device 100.
[0057] Independently controllable current sources supply current to
LEDs 102 in different preferential zones. In the example depicted
in FIG. 9, a two-channel driver 182 supplies current 185 to LEDs
102C and 102D located in preferential zone 2. Similarly,
two-channel driver 182 supplies current 184 to LEDs 102A and 102B
located in preferential zone 1. By separately controlling the
current supplied to LEDs located in different preferential zones,
the color of combined light 141 output by LED based illumination
module may be adjusted over a broad range of Correlated Color
Temperatures (CCTs).
[0058] In the embodiment depicted in FIG. 9, LEDs 102 are located
in different zones that preferentially illuminate different color
converting surfaces of color conversion cavity 162. For example, as
illustrated, LEDs 102A and 102B are located in zone 1. Light
emitted from LEDs 102A and 102B located in zone 1 preferentially
illuminates sidewall 107 because LEDs 102A and 102B are positioned
in close proximity to sidewall 107. In some embodiments, more than
fifty percent of the light output by LEDs 102A and 102B is directed
to sidewall 107. In some other embodiments, more than seventy five
percent of the light output by LEDs 102A and 102B is directed to
sidewall 107. In some other embodiments, more than ninety percent
of the light output by LEDs 102A and 102B is directed to sidewall
107.
[0059] As illustrated, LEDs 102C and 102D are located in zone 2.
Light emitted from LEDs 102C and 102D in zone 2 is directed toward
output window 108. In some embodiments, more than fifty percent of
the light output by LEDs 102C and 102D is directed to output window
108. In some other embodiments, more than seventy five percent of
the light output by LEDs 102C and 102D is directed to output window
108. In some other embodiments, more than ninety percent of the
light output by LEDs 102C and 102D is directed to output window
108.
[0060] In one embodiment, light emitted from LEDs located in
preferential zone 1 is directed to sidewall 107 that may include a
red-emitting phosphor material, whereas light emitted from LEDs
located in preferential zone 2 is directed to output window 108
that may include a green-emitting phosphor material and a
red-emitting phosphor material. By adjusting the current 184
supplied to LEDs located in zone 1 relative to the current 185
supplied to LEDs located in zone 2, the amount of red light
relative to green light included in combined light 141 may be
adjusted. In addition, the amount of blue light relative to red
light is also reduced because the a larger amount of the blue light
emitted from LEDs 102 interacts with the red phosphor material of
color converting layer 172 before interacting with the green and
red phosphor materials of color converting layer 135. In this
manner, the probability that a blue photon emitted by LEDs 102 is
converted to a red photon is increased as current 184 is increased
relative to current 185. Thus, control of currents 184 and 185 may
be used to tune the CCT of light emitted from LED based
illumination device 100 in accordance with the proportions
indicated in FIG. 8.
[0061] In some embodiments, LEDs 102A and 102B in zone 1 may be
selected with emission properties that interact efficiently with
the wavelength converting material included in sidewall 107. For
example, the emission spectrum of LEDs 102A and 102B in zone 1 and
the wavelength converting material in sidewall 107 may be selected
such that the emission spectrum of the LEDs and the absorption
spectrum of the wavelength converting material are closely matched.
This ensures highly efficient color conversion (e.g., conversion to
red light). Similarly, LEDs 102C and 102D in zone 2 may be selected
with emission properties that interact efficiently with the
wavelength converting material included in output window 108. For
example, the emission spectrum of LEDs 102C and 102D in zone 2 and
the wavelength converting material in output window 108 may be
selected such that the emission spectrum of the LEDs and the
absorption spectrum of the wavelength converting material are
closely matched. This ensures highly efficient color conversion
(e.g., conversion to red and green light).
[0062] Furthermore, employing different zones of LEDs that each
preferentially illuminates a different color converting surface
minimizes the occurrence of an inefficient, two-step color
conversion process. By way of example, a photon 138 generated by an
LED (e.g., blue, violet, ultraviolet, etc.) from zone 2 is directed
to color converting layer 135. Photon 138 interacts with a
wavelength converting material in color converting layer 135 and is
converted to a Lambertian emission of color converted light (e.g.,
green light). By minimizing the content of red-emitting phosphor in
color converting layer 135, the probability is increased that the
back reflected red and green light will be reflected once again
toward the output window 108 without absorption by another
wavelength converting material. Similarly, a photon 137 generated
by an LED (e.g., blue, violet, ultraviolet, etc.) from zone 1 is
directed to color converting layer 172. Photon 137 interacts with a
wavelength converting material in color converting layer 172 and is
converted to a Lambertian emission of color converted light (e.g.,
red light). By minimizing the content of green-emitting phosphor in
color converting layer 172, the probability is increased that the
back reflected red light will be reflected once again toward the
output window 108 without reabsorption.
[0063] In another embodiment, LEDs 102 positioned in zone 2 of FIG.
8 are ultraviolet emitting LEDs, while LEDs 102 positioned in zone
1 of FIG. 8 are blue emitting LEDs. Color converting layer 172
includes any of a yellow-emitting phosphor and a green-emitting
phosphor. Color converting layer 135 includes a red-emitting
phosphor. The yellow and/or green emitting phosphors included in
sidewall 107 are selected to have narrowband absorption spectra
centered near the emission spectrum of the blue LEDs of zone 1, but
far away from the emission spectrum of the ultraviolet LEDs of zone
2. In this manner, light emitted from LEDs in zone 2 is
preferentially directed to output window 108, and undergoes
conversion to red light. In addition, any amount of light emitted
from the ultraviolet LEDs that illuminates sidewall 107 results in
very little color conversion because of the insensitivity of these
phosphors to ultraviolet light. In this manner, the contribution of
light emitted from LEDs in zone 2 to combined light 141 is almost
entirely red light. In this manner, the amount of red light
contribution to combined light 141 can be influenced by current
supplied to LEDs in zone 2. Light emitted from blue LEDs positioned
in zone 1 is preferentially directed to sidewall 107 and results in
conversion to green and/or yellow light. In this manner, the
contribution of light emitted from LEDs in zone 1 to combined light
141 is a combination of blue and yellow and/or green light. Thus,
the amount of blue and yellow and/or green light contribution to
combined light 141 can be influenced by current supplied to LEDs in
zone 1.
[0064] FIG. 10 is illustrative of a top view of LED based
illumination device 100 depicted in FIG. 9. Section A depicted in
FIG. 10 is the cross-sectional view depicted in FIG. 9. As
depicted, in this embodiment, LED based illumination device 100 is
circular in shape as illustrated in the exemplary configurations
depicted in FIG. 2 and FIG. 3. In this embodiment, LED based
illumination device 100 is divided into annular zones (e.g., zone 1
and zone 2) that include different groups of LEDs 102. As
illustrated, zones 1 and zones 2 are separated and defined by their
relative proximity to sidewall 107. Although, LED based
illumination device 100, as depicted in FIGS. 9 and 10, is circular
in shape, other shapes may be contemplated. For example, LED based
illumination device 100 may be polygonal in shape. In other
embodiments, LED based illumination device 100 may be any other
closed shape (e.g., elliptical, etc.). Similarly, other shapes may
be contemplated for any zones of LED based illumination device
100.
[0065] As depicted in FIG. 10, LED based illumination device 100 is
divided into two zones. However, more zones may be contemplated.
For example, as depicted in FIG. 11, LED based illumination device
100 is divided into five zones. Zones 1-4 subdivide sidewall 107
into a number of distinct color converting surfaces. In this manner
light emitted from LEDs 1021 and 102J in zone 1 is preferentially
directed to color converting surface 221 of sidewall 107, light
emitted from LEDs 102B and 102E in zone 2 is preferentially
directed to color converting surface 220 of sidewall 107, light
emitted from LEDs 102F and 102G in zone 3 is preferentially
directed to color converting surface 223 of sidewall 107, and light
emitted from LEDs 102A and 102H in zone 4 is preferentially
directed to color converting surface 222 of sidewall 107. The five
zone configuration depicted in FIG. 11 is provided by way of
example. However, many other numbers and combinations of zones may
be contemplated.
[0066] In one embodiment, color converting surface zones 221 and
223 in zones 1 and 3, respectively may include a densely packed
yellow and/or green emitting phosphor, while color converting
surfaces 220 and 222 in zones 2 and 4, respectively, may include a
sparsely packed yellow and/or green emitting phosphor. In this
manner, blue light emitted from LEDs in zones 1 and 3 may be almost
completely converted to yellow and/or green light, while blue light
emitted from LEDs in zones 2 and 4 may only be partially converted
to yellow and/or green light. In this manner, the amount of blue
light contribution to combined light 141 may be controlled by
independently controlling the current supplied to LEDs in zones 1
and 3 and to LEDs in zones 2 and 4. More specifically, if a
relatively large contribution of blue light to combined light 141
is desired, a large current may be supplied to LEDs in zones 2 and
4, while a current supplied to LEDs in zones 1 and 3 is minimized.
However, if relatively small contribution of blue light is desired,
only a limited current may be supplied to LEDs in zones 2 and 4,
while a large current is supplied to LEDs in zones 1 and 3. In this
manner, the relative contributions of blue light and yellow and/or
green light to combined light 141 may be independently controlled.
This may be useful to modulate the light output generated by LED
based illumination device 100 to transmit information from LED
based illumination device 100.
[0067] The aforementioned embodiments are provided by way of
non-limiting example. Many other combinations of different zones of
independently controlled LEDs preferentially illuminating different
color converting surface areas may be contemplated to modulate the
light output generated by LED based illumination device 100 to
transmit information.
[0068] In one embodiment, depicted in FIG. 9, an LED based
illumination device 100 includes a modulator 183 that receives a
nominal current command signal 191, i.sub.1, and a nominal current
command signal 192, i.sub.2. Under nominal operating conditions,
command signals 191 and 192 would be received by driver 182, and
driver 182 would supply current 184 to LEDs in zone 1 and current
185 to LEDs in zone 2, based on current command signals 191 and
192, respectively.
[0069] In another aspect, modulator 183 receives an amount of data
190 to be transmitted from LED based illumination device 100 and
modulates current command signals 191 and 192 to change the color
of light emitted from LED based illumination device 100 based the
data to be transmitted, where the digital data is encoded in the
modulation of the color of light emitted from LED based
illumination device 100.
[0070] In the depicted embodiment, modulator 183 generates a
modulated current command signal 193, i.sub.1', based on current
command signal 191 and generates a modulated current command signal
194, i.sub.2', based on current command signal 192 such that the
change in flux induced by the modulated current command signal 193
is offset by the change in flux induced by the modulated current
command signal 194. In this manner, the luminous flux generated by
LED based illumination device 100 remains unchanged despite
variations in color caused by changes in current supplied to LEDs
in zones 1 and 2.
[0071] FIG. 12A illustrates an exemplary trace 195 of the flux
generated by LED based illumination device 100 based on light
generated from LEDs in zone 1. As illustrated in FIG. 12A, the flux
varies about a nominal flux (e.g., the flux associated with nominal
current, i.sub.1). In the depicted example, the flux level resides
in one of two states, depending on time. In one state, the flux
level is greater than the nominal value by an amount, .DELTA., and
in the second state, the flux level is less than the nominal value
by the same amount, .DELTA..
[0072] Similarly, FIG. 12B illustrates an exemplary trace 196 of
the flux generated by LED based illumination device 100 based on
light generated from LEDs in zone 2. As illustrated in FIG. 12B,
the flux varies about a nominal flux (e.g., the flux associated
with nominal current, i.sub.2). In the depicted example, the flux
level resides in one of two states, depending on time. In one
state, the flux level is greater than the nominal value by an
amount, .DELTA., and in the second state, the flux level is less
than the nominal value by the same amount, .DELTA..
[0073] Modulator 183 generates modulated current command signals
193 and 194 such that the flux generated by LED based illumination
device 100 remains approximately constant. Thus, at the moment that
the flux generated by LEDs in zone 1 transitions from a high state
to a low state, the flux generated by LEDs in zone 2 transitions
from a low state to a high state. Since the difference in flux
between both transitions is the same, their effects offset, and LED
based illumination device 100 continues to emit light at the
nominal flux level.
[0074] Meanwhile, however, the color generated by LED based
illumination device 100 changes based on the state of LEDs in zone
1 and the state of LEDs in zone 2.
[0075] FIG. 13 illustrates a range of color points achievable by
the LED based illumination device 100 depicted in FIGS. 9 and 10,
with respect to a Planckian locus 241. When a current is supplied
to LEDs in zone 1, and no current is supplied to LEDs in zone 2,
light 141 emitted from LED based illumination device 100 has a
color point 243 illustrated in FIG. 13. When a current is supplied
to LEDs in zone 2, and no current is supplied to LEDs in zone 1,
light 141 emitted from LED based illumination device 100 has a
color point 242 illustrated in FIG. 13.
[0076] By adjusting the currents supplied to LEDs located in zones
1 and 2, the light 141 emitted from LED based illumination device
100 can be tuned to any color point along the line 245 connecting
color points 242 and 243. In this manner, the light 141 emitted
from LED based illumination device 100 can be modulated to change
color between color points 242 and 243 based on the relative
current supplied to LEDs in zones 1 and 2. By way of example, color
point 244 corresponds to the color of light emitted from LED based
illumination device 100 at the nominal supply currents, i.sub.1 and
i.sub.2. As the current values are modulated, the color point of
light emitted from LED based illumination device 100 varies along
the line 245.
[0077] Modulator 183 may be configured to modulate the color of
light generated by LED based illumination device 100 to transmit
digital data using any suitable modulation scheme. By way of
non-limiting example, amplitude modulation, frequency modulation,
pulse width modulation, phase modulation, etc., may be
contemplated. Additionally, more complex modulation schemes, such
as quadrature amplitude modulation (QAM) may be contemplated with a
second line 247 that is approximately orthogonal to line 245 in
FIG. 13, e.g., produced using additional zones that cause light 141
emitted from the LED based illumination device 100 to be tuned to
any color point between points 248 and 249 using appropriate supply
currents to zones 1 and 2 and the additional zones. The selected
modulation scheme is applied subject to the constraint that the
flux generated by LED based illumination device 100 should be
maintained at an approximately constant level during a particular
data transmission interval.
[0078] In an illuminated environment populated by humans, it is
desireable to maintain a constant flux level to avoid disturbing
people within view of the illumination light. Studies have shown
that humans can be sensitive to rapidly changing flux levels. In
some cases, sensitivity to flux levels changing with a frequency up
to 2,000 hz have been observed. In extreme cases, this sensitivity
leads to physical sickness. Thus, in situations where it is
desireable to communicate digital data via visible light at
frequencies below 2,000 hertz, it may be preferable to modulate the
color of light generated by the illumination device, rather than
flux.
[0079] FIG. 14 is a diagram illustrative of an electronic interface
module (EIM) 122 including color modulation functionality in one
embodiment. As depicted in FIG. 14, bus 14 is communicatively
coupled to elements of EIM 122 (e.g., memory 10, processor 13, and
modulator 15 such that digital data may be communicated among these
elements over bus 14. As depicted in FIG. 14, EIM 122 is coupled to
LED circuits 30A and 30B. Light 40A emitted from LED circuit 30A
results in different colored light emitted from an LED based
illumination device 100 that includes LED circuits 30A and 30B than
light 40B emitted from LED circuit 30B.
[0080] EIM 122 is configured to generate a significant amount of
data useful to characterize its operation, the surrounding
environment, and prospects for future operation. In one example,
EIM 122 is configured to store a serial number in memory 11 that
individually identifies the illumination device 100 to which EIM
122 is a part. In one example, memory 11 is an erasable
programmable read-only memory (EPROM). A serial number that
identifies illumination device 100 is programmed into EPROM 11
during manufacture. Other examples of information generated by EIM
122 include accumulated elapsed time of illumination device 100,
LED failure, occupancy sensed by an occupancy sensor, flux sensed
by an on-board flux sensor, temperature sensed by a temperature
sensor, and a power failure condition.
[0081] EIM also includes a power converter 16 configured to receive
power signals 23. Power converter 16 operates to perform power
conversion to generate electrical signals to drive LED circuits 30A
and 30B. In some embodiments, power converter 16 operates in a
current control mode to supply a controlled amount of current to
LED circuits within a predefined voltage range. In some
embodiments, power converter 16 is a direct current to direct
current (DC-DC) power converter. In these embodiments, power
signals 23 may have a nominal voltage of 48 volts. Power signals 23
are stepped down in voltage by DC-DC power converter 16 to voltage
levels that meet the voltage requirements of each LED circuit
coupled to DC-DC converter 16.
[0082] In some other embodiments, power converter 16 is an
alternating current to direct current (AC-DC) power converter. In
yet other embodiments, power converter 16 is an alternating current
to alternating current (AC-AC) power converter. In embodiments
employing AC-AC power converter 16, LEDs generate light from AC
electrical signals. In the embodiment depicted in FIG. 14, power
converter 16 includes two channels. Each channel of power converter
16 supplies electrical power to one LED circuit of series connected
LEDs. In one embodiment power converter 16 operates in a constant
current mode. This is particularly useful where LEDs are
electrically connected in series. In some other embodiments, power
converter 16 may operate as a constant voltage source. This may be
particularly useful where LEDs are electrically connected in
parallel.
[0083] As depicted, power converter 16 is coupled to modulator 15.
Digital messages 20 are generated by operation of processor 13 and
communicated to modulator 15 over bus 14. In one example, processor
13 reads the serial number stored in memory 11, and communicates
the serial number to modulator 15. Modulator 15 generates modulated
current command signals 21 and 22 based on the digital signals 20,
and communicates the signals to power converter 16. In one
embodiment, modulator 15 includes a memory 12 storing instructions
that when executed by processor 13, or a processor on board
modulator 15, cause the modulator 15 to generate modulated current
command signals 21 and 22 as described herein.
[0084] Power converter 16 adjusts the current communicated to LED
circuits 30A and 30B in response to the modulated current command
signals 21 and 22. In this manner, power converter 16 modulates the
current communicated to coupled LED circuits 30A and 30B in
response to the received modulated current command signals 21 and
22. The serial number is communicated from EIM 122 by modulating
the color output from the LED based illumination device. In some
embodiments, power converter 16 is operable to receive digital data
directly. In these embodiments, the functionality of modulator 15
is integrated with power converter 16.
[0085] FIG. 15 is a diagram illustrating a room 300 populated with
LED based illumination modules 100.sub.1-100.sub.8, which may be
installed in a luminaire 150 (not shown in FIG. 15). In another
aspect, a receiving device 200 receives an amount of light emitted
from one or more LED based illumination devices, determines a
signal indicative of the color of the received light, and
demodulates the signal to determine digital data transmitted by the
LED based illumination device.
[0086] As depicted in FIG. 16, receiver 200 includes a color sensor
204 configured to receive an amount of light 420 generated by an
LED based illumination device 100 communicating digital information
by color modulation. Color sensor 204 generates a signal 206
indicative of changes in color of received light 420. Bus 203 is
communicatively coupled to elements of receiver 200 (e.g., memory
202, processor 201, network transceiver 210, and color sensor 204
such that digital data may be communicated among these elements
over bus 203. Processor 201 executes instructions stored in memory
205 to demodulate the color signal 206 and decode the digital
message communicated by the LED based illumination device. The
digital message may be stored in memory 202. The digital message
207 may also be communicated to a lighting information server 302
via network transceiver 210. Receiver 200 also includes a network
transceiver 210 configured as the network interface between
receiver 200 and the network 250 operating in accordance with an
internet protocol. In one example, a digital communications packet
211 including digital message 207 is assembled by network
transceiver 210 and communicated from receiver 200 to lighting
information server 302 over network 250.
[0087] As depicted in FIG. 16, receiver 200 is communicatively
coupled to lighting information server 302. In some examples, a
communications link is established between lighting information
server 302 and receiver 200 over the network 250. In some examples,
the communication link is established over a local area network
with controlled access to the internet. In some other examples, the
communication link is established over a wireless network. In
general, receiver 200 is coupled to a network operating in
accordance with the internet protocol (IP). In some embodiments,
the internet protocol is internet protocol version six (IPv6). In
this manner, the advantages of scale (e.g., security, cost, speed,
etc.) of an IP based network are leveraged to some extent in the
lighting information system.
[0088] In general, any change in color generated by an LED based
illumination device 100 may be employed to communicate information.
However, in some examples, LED based illumination device 100 may be
configured to modulate color along a line of constant CCT in a CIE
1931 color space. In this manner, information is communicated from
an LED based illumination device based on changes in visible light
emitted from the module without varying flux and without varying
color temperature.
[0089] The aforementioned embodiments are provided by way of
example. Many other combinations of different zones of
independently controlled LEDs preferentially illuminating different
color converting surface areas may be contemplated to a achieve
data communication via color modulation.
[0090] By way of non-limiting example, FIG. 18 illustrates a top
view of the LED based illumination device 100 in another
embodiment. FIG. 17 depicts a cross-sectional view of LED based
illumination device 100 along section line, C, depicted in FIG. 18.
As illustrated in FIG. 17, wavelength converting materials 191A and
191B cover a portion of transmissive plate 174 and are
preferentially illuminated by LEDs in zone 1. Wavelength converting
materials 192A and 192B cover another portion of transmissive plate
174 and are preferentially illuminated by LEDs in zone 2. LEDs in
zone 3, preferentially illuminate other wavelength converting
materials present in different areas of transmissive plate 174 (not
shown).
[0091] In some embodiments, components of color conversion cavity
162 may be constructed from or include a PTFE material. In some
examples the component may include a PTFE layer backed by a
reflective layer such as a polished metallic layer. The PTFE
material may be formed from sintered PTFE particles. In some
embodiments, portions of any of the interior facing surfaces of
color converting cavity 162 may be constructed from a PTFE
material. In some embodiments, the PTFE material may be coated with
a wavelength converting material. In other embodiments, a
wavelength converting material may be mixed with the PTFE
material.
[0092] In other embodiments, components of color conversion cavity
162 may be constructed from or include a reflective, ceramic
material, such as ceramic material produced by CerFlex
International (The Netherlands). In some embodiments, portions of
any of the interior facing surfaces of color converting cavity 162
may be constructed from a ceramic material. In some embodiments,
the ceramic material may be coated with a wavelength converting
material.
[0093] In other embodiments, components of color conversion cavity
162 may be constructed from or include a reflective, metallic
material, such as aluminum or Miro.RTM. produced by Alanod
(Germany). In some embodiments, portions of any of the interior
facing surfaces of color converting cavity 162 may be constructed
from a reflective, metallic material. In some embodiments, the
reflective, metallic material may be coated with a wavelength
converting material.
[0094] In other embodiments, (components of color conversion cavity
162 may be constructed from or include a reflective, plastic
material, such as Vikuiti.TM. ESR, as sold by 3M (USA),
Lumirror.TM. E60L manufactured by Toray (Japan), or
microcrystalline polyethylene terephthalate (MCPET) such as that
manufactured by Furukawa Electric Co. Ltd. (Japan). In some
embodiments, portions of any of the interior facing surfaces of
color converting cavity 162 may be constructed from a reflective,
plastic material. In some embodiments, the reflective, plastic
material may be coated with a wavelength converting material.
[0095] Cavity 162 may be filled with a non-solid material, such as
air or an inert gas, so that the LEDs 102 emits light into the
non-solid material. By way of example, the cavity may be
hermetically sealed and Argon gas used to fill the cavity.
Alternatively, Nitrogen may be used. In other embodiments, cavity
162 may be filled with a solid encapsulate material. By way of
example, silicone may be used to fill the cavity. In some other
embodiments, color converting cavity 162 may be filled with a fluid
to promote heat extraction from LEDs 102. In some embodiments,
wavelength converting material may be included in the fluid to
achieve color conversion throughout the volume of color converting
cavity 162.
[0096] The PTFE material is less reflective than other materials
that may be used to construct or include in components of color
conversion cavity 162 such as Miro.RTM. produced by Alanod. In one
example, the blue light output of an LED based illumination device
100 constructed with uncoated Miro.RTM. sidewall insert 107 was
compared to the same module constructed with an uncoated PTFE
sidewall insert 107 constructed from sintered PTFE material
manufactured by Berghof (Germany). Blue light output from
illumination device 100 was decreased 7% by use of a PTFE sidewall
insert. Similarly, blue light output from illumination device 100
was decreased 5% compared to uncoated Miro.RTM. sidewall insert 107
by use of an uncoated PTFE sidewall insert 107 constructed from
sintered PTFE material manufactured by W.L. Gore (USA). Light
extraction from the illumination device 100 is directly related to
the reflectivity inside the cavity 162, and thus, the inferior
reflectivity of the PTFE material, compared to other available
reflective materials, would lead away from using the PTFE material
in the cavity 162. Nevertheless, the inventors have determined that
when the PTFE material is coated with phosphor, the PTFE material
unexpectedly produces an increase in luminous output compared to
other more reflective materials, such as Miro.RTM., with a similar
phosphor coating. In another example, the white light output of an
illumination device 100 targeting a correlated color temperature
(CCT) of 4,000 Kelvin constructed with phosphor coated Miro.RTM.
sidewall insert 107 was compared to the same module constructed
with a phosphor coated PTFE sidewall insert 107 constructed from
sintered PTFE material manufactured by Berghof (Germany). White
light output from illumination device 100 was increased 7% by use
of a phosphor coated PTFE sidewall insert compared to phosphor
coated Miro.RTM.. Similarly, white light output from illumination
device 100 was increased 14% compared to phosphor coated Miro.RTM.
sidewall insert 107 by use of a PTFE sidewall insert 107
constructed from sintered PTFE material manufactured by W.L. Gore
(USA). In another example, the white light output of an
illumination device 100 targeting a correlated color temperature
(CCT) of 3,000 Kelvin constructed with phosphor coated Miro.RTM.
sidewall insert 107 was compared to the same module constructed
with a phosphor coated PTFE sidewall insert 107 constructed from
sintered PTFE material manufactured by Berghof (Germany). White
light output from illumination device 100 was increased 10% by use
of a phosphor coated PTFE sidewall insert compared to phosphor
coated Miro.RTM.. Similarly, white light output from illumination
device 100 was increased 12% compared to phosphor coated Miro.RTM.
sidewall insert 107 by use of a PTFE sidewall insert 107
constructed from sintered PTFE material manufactured by W.L. Gore
(USA).
[0097] Thus, it has been discovered that, despite being less
reflective, it is desirable to construct phosphor covered portions
of the light mixing cavity 162 from a PTFE material. Moreover, the
inventors have also discovered that phosphor coated PTFE material
has greater durability when exposed to the heat from LEDs, e.g., in
a light mixing cavity 162, compared to other more reflective
materials, such as Miro.RTM., with a similar phosphor coating.
[0098] Although certain specific embodiments are described above
for instructional purposes, the teachings of this patent document
have general applicability and are not limited to the specific
embodiments described above. For example, any component of color
conversion cavity 162 may be patterned with phosphor. Both the
pattern itself and the phosphor composition may vary. In one
embodiment, the illumination device may include different types of
phosphors that are located at different areas of a light mixing
cavity 162. For example, a red phosphor may be located on either or
both of the insert 107 and the bottom reflector insert 106 and
yellow and green phosphors may be located on the top or bottom
surfaces of the output window 108 or embedded within the output
window 108. In one embodiment, different types of phosphors, e.g.,
red and green, may be located on different areas on the sidewalls
107. For example, one type of phosphor may be patterned on the
output window 108 at a first area, e.g., in stripes, spots, or
other patterns, while another type of phosphor is located on a
different second area of the output window 108. If desired,
additional phosphors may be used and located in different areas in
the cavity 162. Additionally, if desired, only a single type of
wavelength converting material may be used and patterned in the
cavity 162, e.g., on the sidewalls. In another example, cavity body
105 is used to clamp mounting board 104 directly to mounting base
101 without the use of mounting board retaining ring 103. In other
examples mounting base 101 and heat sink 120 may be a single
component. In another example, LED based illumination device 100 is
depicted in FIGS. 1-3 as a part of a luminaire 150. As illustrated
in FIG. 3, LED based illumination device 100 may be a part of a
replacement lamp or retrofit lamp. But, in another embodiment, LED
based illumination device 100 may be shaped as a replacement lamp
or retrofit lamp and be considered as such. Accordingly, various
modifications, adaptations, and combinations of various features of
the described embodiments can be practiced without departing from
the scope of the invention as set forth in the claims.
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