U.S. patent application number 14/889260 was filed with the patent office on 2016-12-01 for thermal sink systems for cooling a mold assembly.
This patent application is currently assigned to Halliburton Energy Services, Inc.. The applicant listed for this patent is HALLIBURTON ENERGY SEVICES, INC.. Invention is credited to Grant O. Cook, III, Clayton Arthur Ownby, Cristopher Charles Propes, Jeffrey G. Thomas.
Application Number | 20160346835 14/889260 |
Document ID | / |
Family ID | 56092126 |
Filed Date | 2016-12-01 |
United States Patent
Application |
20160346835 |
Kind Code |
A1 |
Ownby; Clayton Arthur ; et
al. |
December 1, 2016 |
THERMAL SINK SYSTEMS FOR COOLING A MOLD ASSEMBLY
Abstract
An example thermal sink system includes a quench plate having an
upper surface for receiving a mold assembly to be cooled. A thermal
fluid is in thermal communication with the mold assembly via
conduction through the quench plate. The quench plate prevents the
thermal fluid from contacting the mold assembly.
Inventors: |
Ownby; Clayton Arthur;
(Houston, TX) ; Cook, III; Grant O.; (Spring,
TX) ; Thomas; Jeffrey G.; (Magnolia, TX) ;
Propes; Cristopher Charles; (Montgomey, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HALLIBURTON ENERGY SEVICES, INC. |
Houston |
TX |
US |
|
|
Assignee: |
Halliburton Energy Services,
Inc.
Houston
TX
|
Family ID: |
56092126 |
Appl. No.: |
14/889260 |
Filed: |
December 2, 2014 |
PCT Filed: |
December 2, 2014 |
PCT NO: |
PCT/US14/68026 |
371 Date: |
November 5, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C22C 29/06 20130101;
B22F 2999/00 20130101; B22D 27/045 20130101; F28F 13/02 20130101;
B22D 27/04 20130101; F27B 5/00 20130101; B22D 30/00 20130101; F28F
13/12 20130101; F27D 15/02 20130101; F28F 25/06 20130101; C22C
1/1068 20130101; F28D 15/00 20130101; B22F 7/06 20130101; B22F 3/26
20130101; B22F 3/14 20130101; B22F 2999/00 20130101; B22F 2203/11
20130101 |
International
Class: |
B22D 30/00 20060101
B22D030/00; F28F 25/06 20060101 F28F025/06; F28F 13/02 20060101
F28F013/02; F28F 13/12 20060101 F28F013/12; B22D 27/04 20060101
B22D027/04; F28D 15/00 20060101 F28D015/00 |
Claims
1. A thermal sink system, comprising: a quench plate having an
upper surface for receiving a mold assembly to be cooled; and a
thermal fluid in thermal communication with the mold assembly via
conduction through the quench plate, wherein the quench plate
interposes the thermal fluid and the mold assembly and thereby
prevents the thermal fluid from contacting the mold assembly.
2. The thermal sink system of claim 1, wherein the thermal fluid is
a fluid selected from the group consisting of water, steam, an oil,
a coolant, a gas, a molten metal, a molten metal alloy, a fluidized
bed, and a molten salt.
3. The thermal sink system of claim 1, further comprising: a table
having a shoulder that receives and supports the quench plate; and
a fluid reservoir arranged below the quench plate.
4. The thermal sink system of claim 3, wherein the quench plate
sealingly engages the table.
5. The thermal sink system of claim 1, further comprising one or
more nozzles arranged to eject the thermal fluid such that the
thermal fluid impinges on a bottom surface of the quench plate.
6. The thermal sink system of claim 1, wherein the quench plate is
arched such that a thickness of the quench plate is greater at an
outer periphery as compared to a thickness of the quench plate at a
center location.
7. The thermal sink system of claim 1, further comprising one or
more grooves defined in a bottom surface of the quench plate.
8. The thermal sink system of claim 7, further comprising one or
more nozzles arranged to eject the thermal fluid into the one or
more grooves.
9. The thermal sink system of claim 1, further comprising one or
more heat-exchanging features defined in a bottom surface of the
quench plate.
10. The thermal sink system of claim 1, further comprising one or
more flow channels defined in the quench plate for circulating the
thermal fluid.
11. The thermal sink system of claim 10, wherein the one or more
flow channels comprise a plurality of branches extending from a
common inlet.
12. The thermal sink system of claim 10, wherein the one or more
flow channels comprise a single, spiraling flow channel.
13. The thermal sink system of claim 1, wherein the quench plate
defines an aperture and includes an insert receivable into the
aperture.
14. The thermal sink system of claim 13, wherein the insert
comprises a thermally conductive material selected from the group
consisting of a ceramic, a metal, alumina, graphite, and any
combination thereof.
15. The thermal sink system of claim 13, wherein the insert and the
quench plate are made of dissimilar materials.
16. The thermal sink system of claim 1, further comprising a
backstop to locate the mold assembly at a desired location on the
upper surface of the quench plate.
17. The thermal sink system of claim 16, wherein the backstop is at
least one of two or more pegs protruding from the upper surface of
the quench plate, one or more blocks protruding from the upper
surface of the quench plate, an arcuate block member protruding
from the upper surface of the quench plate, an elongate member, and
an arcuate member.
18. The thermal sink system of claim 1, further comprising an
insulation enclosure that rests on the upper surface of the quench
plate and provides an interior for receiving the mold assembly, the
quench plate further preventing vapor generated by the thermal
fluid from migrating into the interior of the insulation
enclosure.
19. A method of cooling a mold assembly, comprising: positioning
the mold assembly on an upper surface of a quench plate; placing a
thermal fluid in thermal communication with the mold assembly via
conduction through the quench plate; and preventing the thermal
fluid from contacting the mold assembly with the quench plate.
20. The method of claim 19, further comprising: positioning an
insulation enclosure over the mold assembly such that the mold
assembly is received into an interior of the insulation enclosure
and the insulation enclosure rests on the upper surface of the
quench plate; and preventing vapor generated by the thermal fluid
from migrating into the interior of the insulation enclosure with
the quench plate.
21. The method of claim 19, wherein placing the thermal fluid in
thermal communication with the mold assembly comprises ejecting the
thermal fluid from one or more nozzles such that the thermal fluid
impinges on a bottom surface of the quench plate.
22. The method of claim 21, wherein the bottom surface of the
quench plate defines one or more grooves, the method further
comprising ejecting the thermal fluid from the one or more nozzles
into the one or more grooves.
23. The method of claim 21, wherein the bottom surface of the
quench plate defines one or more heat-exchanging features, the
method further comprising placing at least one of the thermal fluid
and a fluid reservoir in thermal communication with the mold
assembly via conduction through the quench plate.
24. The method of claim 21, wherein ejecting the thermal fluid from
the one or more nozzles comprises at least one of: reducing a vapor
boundary layer at the bottom surface of the quench plate; and
promoting turbulent flow at the bottom surface of the quench
plate.
25. The method of claim 19, wherein placing the thermal fluid in
thermal communication with the mold assembly comprises circulating
the thermal fluid through one or more flow channels defined in the
quench plate.
26. The method of claim 19, wherein the quench plate defines an
aperture and includes an insert receivable into the aperture, the
method further comprising placing the thermal fluid in thermal
communication with the mold assembly via conduction through the
insert as received in the aperture of the quench plate.
27. The method of claim 19, wherein positioning the mold assembly
on the upper surface of the quench plate comprises locating the
mold assembly at a desired location on the upper surface of the
quench plate with a backstop, wherein the backstop is at least one
of two or more pegs protruding from the upper surface of the quench
plate, one or more blocks protruding from the upper surface of the
quench plate, an arcuate block member protruding from the upper
surface of the quench plate, an elongate member, and an arcuate
member.
Description
BACKGROUND
[0001] Rotary drill bits are often used to drill wellbores. One
type of rotary drill bit is a fixed-cutter drill bit that has a bit
body comprising matrix and reinforcement materials, i.e., a "matrix
drill bit" as referred to herein. Matrix drill bits are typically
manufactured by placing powder material into a mold and
infiltrating the powder material with a binder material, such as a
metallic alloy. The various features of the resulting matrix drill
bit, such as blades, cutter pockets, and/or fluid-flow passageways,
may be provided by shaping the mold cavity and/or by positioning
temporary displacement materials within interior portions of the
mold cavity. A preformed bit blank (or steel mandrel) may be placed
within the mold cavity to provide reinforcement for the matrix bit
body and to allow attachment of the resulting matrix drill bit with
a drill string. A quantity of matrix reinforcement material
(typically in powder form) may then be placed within the mold
cavity with a quantity of the binder material.
[0002] The mold is then placed within a furnace and heated to a
desired temperature to allow the binder (e.g., metallic alloy) to
liquefy and infiltrate the matrix reinforcement material. The
furnace typically maintains a desired temperature until the
infiltration process is deemed complete, such as when a specific
location in the bit reaches a certain temperature. Once the
designated process time or temperature has been reached, the mold
is then removed from the furnace and begins to rapidly lose heat to
its surrounding environment via heat transfer, such as radiation
and/or convection in all directions.
[0003] This heat loss continues to a large extent until the mold is
moved and placed on a cooling or quench plate and an insulation
enclosure or "hot hat" is lowered around the mold. The insulation
enclosure drastically reduces the rate of heat loss from the top
and sides of the mold while heat is drawn from the bottom of the
mold through the cooling plate. This controlled cooling of the mold
and the infiltrated matrix bit contained therein can facilitate
axial solidification dominating radial solidification, which is
loosely termed directional solidification. As the molten material
of the infiltrated matrix bit cools, there is a tendency for
shrinkage that could result in voids forming within the bit body
unless the molten material is able to continuously backfill such
voids. In some cases, for instance, one or more intermediate
regions within the bit body may solidify prior to adjacent regions
and thereby stop the flow of molten material to locations where
shrinkage porosity is developing. In other cases, shrinkage
porosity may result in poor metallurgical bonding at the interface
between the bit blank and the molten materials, which can result in
the formation of cracks within the bit body that can be difficult
or impossible to inspect.
[0004] While the mold is positioned on the quench plate, water is
often ejected out of one or more nozzles provided in the quench
plate to impinge upon the bottom of the mold and thereby promote
directional solidification. As it contacts the heated mold,
however, the water can generate a significant amount of steam or
vapor that often enters the insulation enclosure and increases heat
transfer from the upper section of the mold, possibly by wetting
the insulation (thereby increasing its conductivity) or by creating
or enhancing convective currents inside the insulation enclosure.
This additional cooling can produce multiple solidification fronts,
which could result in blank bond-line cracking, apex cracking,
binder-rich zones, bevel cracking, and cracking between
nozzles.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] The following figures are included to illustrate certain
aspects of the present disclosure, and should not be viewed as
exclusive embodiments. The subject matter disclosed is capable of
considerable modifications, alterations, combinations, and
equivalents in form and function, without departing from the scope
of this disclosure.
[0006] FIG. 1 is a perspective view of an exemplary fixed-cutter
drill bit that may be fabricated in accordance with the principles
of the present disclosure.
[0007] FIG. 2 is a cross-sectional view of the drill bit of FIG.
1.
[0008] FIG. 3 is a cross-sectional side view of an exemplary mold
assembly for use in forming the drill bit of FIG. 1.
[0009] FIGS. 4A-4C are progressive schematic diagrams of an
exemplary method of fabricating a drill bit.
[0010] FIGS. 5A-5C are partial cross-sectional side views of
exemplary thermal sink systems used to cool the mold assembly of
FIG. 3.
[0011] FIG. 6 is a partial cross-sectional side view of another
exemplary thermal sink system used to cool the mold assembly of
FIG. 3.
[0012] FIGS. 7A-7C depict exemplary flow channel designs that may
be employed in a quench plate.
[0013] FIGS. 8A and 8B are partial cross-sectional side views of
additional exemplary thermal sink systems used to cool the mold
assembly of FIG. 3.
[0014] FIG. 9 is an isometric view of an exemplary quench
plate.
DETAILED DESCRIPTION
[0015] The present disclosure relates to downhole tool
manufacturing and, more particularly, to thermal sink systems
having impermeable quench plates that prevent the influx of steam
or vapor during cooling of infiltrated downhole tools.
[0016] The embodiments described herein provide thermal sink
systems that may be used to help cool a mold assembly following an
infiltration process for an infiltrated downhole tool. The thermal
sink systems described herein include a quench plate configured to
prevent the mold assembly from being exposed to a thermal fluid
that is used to help cool the mold assembly through the quench
plate. The thermal fluid may either impinge upon the bottom of the
quench plate or flow through one or more flow channels defined
through the quench plate to exchange thermal energy with the mold
assembly across or through the quench plate via thermal conduction.
The impermeable quench plate may prevent any vapor that may be
generated from the thermal fluid from escaping into an insulation
enclosure placed about the mold assembly and resting on the quench
plate. In some cases, the quench plate may include an insert made
of a thermally conductive material that accelerates heat transfer
between the mold assembly and the thermal fluid through the quench
plate.
[0017] FIG. 1 illustrates a perspective view of an example
fixed-cutter drill bit 100 that may be fabricated in accordance
with the principles of the present disclosure. It should be noted
that, while FIG. 1 depicts a fixed-cutter drill bit 100, the
principles of the present disclosure are equally applicable to any
type of downhole tool that may be formed or otherwise manufactured
through an infiltration process. For example, suitable infiltrated
downhole tools that may be manufactured in accordance with the
present disclosure include, but are not limited to, oilfield drill
bits or cutting tools (e.g., fixed-angle drill bits, roller-cone
drill bits, coring drill bits, bi-center drill bits, impregnated
drill bits, reamers, stabilizers, hole openers, cutters, cutting
elements), non-retrievable drilling components, aluminum drill bit
bodies associated with casing drilling of wellbores, drill-string
stabilizers, cones for roller-cone drill bits, models for forging
dies used to fabricate support arms for roller-cone drill bits,
arms for fixed reamers, arms for expandable reamers, internal
components associated with expandable reamers, sleeves attached to
an uphole end of a rotary drill bit, rotary steering tools,
logging-while-drilling tools, measurement-while-drilling tools,
side-wall coring tools, fishing spears, washover tools, rotors,
stators and/or housings for downhole drilling motors, blades and
housings for downhole turbines, and other downhole tools having
complex configurations and/or asymmetric geometries associated with
forming a wellbore.
[0018] As illustrated in FIG. 1, the fixed-cutter drill bit 100
(hereafter "the drill bit 100") may include or otherwise define a
plurality of cutter blades 102 arranged along the circumference of
a bit head 104. The bit head 104 is connected to a shank 106 to
form a bit body 108. The shank 106 may be connected to the bit head
104 by welding, brazing, or other fusion methods, such as using
submerged arc or metal inert gas arc welding that results in the
formation of a weld 110 around a weld groove 112. The shank 106 may
further include or otherwise be connected to a threaded pin
114.
[0019] In the depicted example, the drill bit 100 includes five
cutter blades 102, in which multiple recesses or pockets 116 are
formed. Cutting elements 118 may be fixedly installed within each
pocket 116. This can be done, for example, by brazing each cutting
element 118 into a corresponding pocket 116. As the drill bit 100
is rotated in use, the cutting elements 118 engage the rock and
underlying earthen materials, to dig, scrape or grind away the
material of the formation being penetrated.
[0020] During drilling operations, drilling fluid or "mud" can be
pumped downhole through a drill string (not shown) coupled to the
drill bit 100 at the threaded pin 114. The drilling fluid
circulates through and out of the drill bit 100 at one or more
nozzles 120 positioned in nozzle openings 122 defined in the bit
head 104. Junk slots 124 are formed between each adjacent pair of
cutter blades 102. Cuttings, downhole debris, formation fluids,
drilling fluid, etc., may pass through the junk slots 124 and
circulate back to the well surface within an annulus formed between
exterior portions of the drill string and the inner wall of the
wellbore being drilled.
[0021] FIG. 2 is a cross-sectional side view of the drill bit 100
of FIG. 1.
[0022] Similar numerals from FIG. 1 that are used in FIG. 2 refer
to similar components that are not described again. As illustrated,
the shank 106 may be securely attached to a metal blank (or
mandrel) 202 at the weld 110 and the metal blank 202 extends into
the bit body 108. The shank 106 and the metal blank 202 are
generally cylindrical structures that define corresponding fluid
cavities 204a and 204b, respectively, in fluid communication with
each other. The fluid cavity 204b of the metal blank 202 may
further extend longitudinally into the bit body 108. At least one
flow passageway (shown as two flow passageways 206a and 206b) may
extend from the fluid cavity 204b to exterior portions of the bit
body 108. The nozzle openings 122 may be defined at the ends of the
flow passageways 206a and 206b at the exterior portions of the bit
body 108. The pockets 116 are formed in the bit body 108 and are
shaped or otherwise configured to receive the cutting elements 118
(FIG. 1).
[0023] FIG. 3 is a cross-sectional side view of a mold assembly 300
that may be used to form the drill bit 100 of FIGS. 1 and 2. While
the mold assembly 300 is shown and discussed as being used to help
fabricate the drill bit 100, those skilled in the art will readily
appreciate that mold assembly 300 and its several variations
described herein may be used to help fabricate any of the
infiltrated downhole tools mentioned above, without departing from
the scope of the disclosure. As illustrated, the mold assembly 300
may include several components such as a mold 302, a gauge ring
304, and a funnel 306. In some embodiments, the funnel 306 may be
operatively coupled to the mold 302 via the gauge ring 304, such as
by corresponding threaded engagements, as illustrated. In other
embodiments, the gauge ring 304 may be omitted from the mold
assembly 300 and the funnel 306 may instead be operatively coupled
directly to the mold 302, such as via a corresponding threaded
engagement, without departing from the scope of the disclosure.
[0024] In some embodiments, as illustrated, the mold assembly 300
may further include a binder bowl 308 and a cap 310 placed above
the funnel 306. The mold 302, the gauge ring 304, the funnel 306,
the binder bowl 308, and the cap 310 may each be made of or
otherwise comprise graphite or alumina (Al.sub.2O.sub.3), for
example, or other suitable materials. An infiltration chamber 312
may be defined or otherwise provided within the mold assembly 300.
Materials, such as consolidated sand or graphite, may be positioned
within the mold assembly 300 at desired locations to form various
features of the drill bit 100 (FIGS. 1 and 2). For example,
consolidated sand legs 314a and 314b may be positioned to
correspond with desired locations and configurations of the flow
passageways 206a,b (FIG. 2) and their respective nozzle openings
122 (FIGS. 1 and 2). Moreover, a cylindrically-shaped consolidated
central displacement 316 may be placed on the legs 314a,b. The
number of legs 314a,b extending from the central displacement 316
will depend upon the desired number of flow passageways and
corresponding nozzle openings 122 in the drill bit 100.
[0025] After the desired materials, including the central
displacement 316 and the legs 314a,b, have been installed within
the mold assembly 300, matrix reinforcement materials 318 may then
be placed within the mold assembly 300. For some applications, two
or more different types of matrix reinforcement materials 318 may
be deposited in the mold assembly 300. Suitable matrix
reinforcement materials 318 include, but are not limited to,
tungsten carbide, monotungsten carbide (WC), ditungsten carbide
(W.sub.2C), macrocrystalline tungsten carbide, other metal
carbides, metal borides, metal oxides, metal nitrides, natural and
synthetic diamond, and polycrystalline diamond (PCD). Examples of
other metal carbides may include, but are not limited to, titanium
carbide and tantalum carbide, and various mixtures of such
materials may also be used.
[0026] The metal blank 202 may be supported at least partially by
the matrix reinforcement materials 318 within the infiltration
chamber 312. More particularly, after a sufficient volume of the
matrix reinforcement materials 318 has been added to the mold
assembly 300, the metal blank 202 may then be placed within mold
assembly 300. The metal blank 202 may include an inside diameter
320 that is greater than an outside diameter 322 of the central
displacement 316, and various fixtures (not expressly shown) may be
used to position the metal blank 202 within the mold assembly 300
at a desired location. The matrix reinforcement materials 318 may
then be filled to a desired level within the infiltration chamber
312.
[0027] Binder material 324 may then be placed on top of the matrix
reinforcement materials 318, the metal blank 202, and the central
displacement 316. Various types of binder materials 324 may be used
and include, but are not limited to, metallic alloys of copper
(Cu), nickel (Ni), manganese (Mn), lead (Pb), tin (Sn), cobalt
(Co), phosphorous (P), and silver (Ag). Various mixtures of such
metallic alloys may also be used as the binder material 324. In
some embodiments, the binder material 324 may be covered with a
flux layer (not expressly shown). The amount of binder material 324
and optional flux material added to the infiltration chamber 312
should be at least enough to infiltrate the matrix reinforcement
materials 318 during the infiltration process. In some instances,
some or all of the binder material 324 may be placed in the binder
bowl 308, which may be used to distribute the binder material 324
into the infiltration chamber 312 via various conduits 326 that
extend therethrough. The cap 310 (if used) may then be placed over
the mold assembly 300, thereby readying the mold assembly 300 for
heating.
[0028] Referring now to FIGS. 4A-4C, with continued reference to
FIG. 3, illustrated are schematic diagrams that sequentially
illustrate an example method of heating and cooling the mold
assembly 300 of FIG. 3, in accordance with the principles of the
present disclosure. In FIG. 4A, the mold assembly 300 is depicted
as being positioned within a furnace 402. The temperature of the
mold assembly 300 and its contents are elevated within the furnace
402 until the binder material 324 liquefies and is able to
infiltrate the matrix reinforcement materials 318. Once a specific
location in the mold assembly 300 reaches a certain temperature in
the furnace 402, or the mold assembly 300 is otherwise maintained
at a particular temperature for a predetermined amount of time, the
mold assembly 300 is then removed from the furnace 402 and
immediately begins to lose heat by radiating thermal energy to its
surroundings while heat is also convected away by cooler air
outside the furnace 402.
[0029] As depicted in FIG. 4B, the mold assembly 300 may be
transported to and set down upon a thermal sink 404. The radiative
and convective heat losses from the mold assembly 300 to the
environment continue until an insulation enclosure 406 is lowered
around the mold assembly 300. The insulation enclosure 406 may be a
rigid shell or structure used to insulate the mold assembly 300 and
thereby slow the cooling process. In some cases, the insulation
enclosure 406 may include a hook 408 attached to a top surface
thereof. The hook 408 may provide an attachment location whereby
the insulation enclosure 406 may be grasped and/or otherwise
attached to for transport. For instance, a chain or wire 410 may be
coupled to the hook 408 to lift and move the insulation enclosure
406, as illustrated.
[0030] The insulation enclosure 406 may include an outer frame 412,
an inner frame 414, and insulation material 416 arranged between
the outer and inner frames 412, 414. In some embodiments, both the
outer frame 412 and the inner frame 414 may be made of rolled steel
and shaped (i.e., bent, welded, etc.) into the general shape,
design, and/or configuration of the insulation enclosure 406. In
other embodiments, the inner frame 414 may be a metal wire mesh
that holds the insulation material 416 between the outer frame 412
and the inner frame 414. The insulation material 416 may be
selected from a variety of insulative materials. In at least one
embodiment, the insulation material 416 may be a ceramic fiber
blanket, such as INSWOOL.RTM. or the like.
[0031] As depicted in FIG. 4C, the insulation enclosure 406 may
enclose the mold assembly 300 such that thermal energy radiating
from the mold assembly 300 is dramatically reduced from the top and
sides of the mold assembly 300 and is instead directed
substantially downward and otherwise toward/into the thermal sink
404 or back towards the mold assembly 300. With the insulation
enclosure 406 positioned over the mold assembly 300 and the thermal
sink 404 in operation, the majority of the thermal energy is
transferred through the bottom 418 of the mold assembly 300 and
into the thermal sink 404. This controlled cooling of the mold
assembly 300 and its contents allows an operator to regulate or
control the thermal profile of the mold assembly 300 to a certain
extent and may help facilitate directional solidification of the
molten contents within the mold assembly 300, where axial
solidification of the molten contents dominates radial
solidification. Within the mold assembly 300, the face of the drill
bit (i.e., the end of the drill bit that includes the cutters) may
be positioned at the bottom 418 of the mold assembly 300 and
otherwise adjacent the thermal sink 404 while the shank 106 (FIG.
1) may be positioned adjacent the top of the mold assembly 300. As
a result, the drill bit 100 (FIGS. 1 and 2) may be cooled axially
upward, from the cutters 118 (FIG. 1) toward the shank 106 (FIG.
1). Such directional solidification (from the bottom up) may prove
advantageous in reducing the occurrence of voids due to shrinkage
porosity, cracks at the interface between the metal blank 202
(FIGS. 2 and 3) and the molten materials, and nozzle cracks.
[0032] The thermal sink 404 may comprise a system that includes a
quench plate designed to circulate a fluid (e.g., water) at a
reduced temperature relative to the mold assembly 300 (i.e., at or
near ambient) to draw thermal energy from the mold assembly 300 and
into the circulating fluid, and thereby reduce the temperature of
the mold assembly 300. The circulating fluid contacts the bottom
418 of the mold assembly 300 and, as a result, vapor may be
generated and escape into the interior of the insulation enclosure
406 and thereby increase the heat transfer from the upper portions
of the mold assembly 300. As used herein, the term "vapor" refers
to any gasified liquid including, but not limited to, water vapor
in the form of steam. This additional cooling can produce unwanted
solidification fronts within the mold assembly 300, which could
result in defects caused by lack of thermal control. The
embodiments of the present disclosure describe several concepts for
reducing or eliminating the influx of vapor into the interior of
the insulation enclosure 406.
[0033] Referring now to FIGS. 5A-5C, illustrated are partial
cross-sectional side views of exemplary thermal sink systems 500
that may be used to cool the mold assembly 300, according to one or
more embodiments. More particularly, FIG. 5A depicts a first
thermal sink system 500a, FIG. 5B depicts a second thermal sink
system 500b, and FIG. 5C depicts a third thermal sink system 500c.
Each thermal sink system 500a-c may be similar in some respects to
the thermal sink 404 described above with reference to FIGS. 4B and
4C. As illustrated, each thermal sink system 500a-c may include a
quench plate 502, a table 504 that supports the quench plate 502,
and a fluid reservoir 506 disposed below the quench plate 502. The
table 504 may provide or otherwise define one or more shoulders 508
configured to receive and support the quench plate 502 above the
fluid reservoir 506.
[0034] The mold assembly 300 may be positioned on the quench plate
502 such that the bottom 418 is in direct contact with the upper
surface of the quench plate 502, and the insulation enclosure 406
may be disposed about the mold assembly 300 and rest on the quench
plate 502. A gap 510 may be defined between the table 504 and the
quench plate 502. In some embodiments, the quench plate 502 may
exhibit a generally square shape, and the gap 510 may also be
square to accommodate the shape of the quench plate 502. In other
embodiments, however, the quench plate 502 may exhibit other
shapes, such as circular, ovoid, or other polygonal shapes (e.g.,
rectangular, etc.).
[0035] The quench plate 502 may be configured to prevent exposure
of the mold assembly 300 to a thermal fluid 512 used to help cool
the mold assembly 300. The thermal fluid 512 may be any suitable
fluid or gas including, but not limited to, water, steam, an oil, a
coolant (e.g., glycols), a gas (e.g., air, carbon dioxide, argon,
helium, oxygen, nitrogen), a molten metal, a molten metal alloy, a
fluidized bed, or a molten salt. Suitable molten metals or metal
alloys used for the thermal fluid 512 may include Pb, Bi, Pb--Bi,
K, Na, Na--K, Ga, In, Sn, Li, Zn, or any alloys thereof. Suitable
molten salts used for the thermal fluid 512 include alkali fluoride
salts (e.g., LiF--KF, LiF--NaF--KF, LiF--RbF, LiF--NaF--RbF),
BeF.sub.2 salts (e.g., LiF--BeF.sub.2, NaF--BeF.sub.2,
LiF--NaF--BeF.sub.2), ZrF.sub.4 salts (e.g., KF--ZrF.sub.4,
NaF--ZrF.sub.4, NaF--KF--ZrF.sub.4, LiF--ZrF.sub.4,
LiF--NaF--ZrF.sub.4, RbF--ZrF.sub.4), chloride-based salts (e.g.,
LiCl--KCl, KCl--MgCl.sub.2, NaCl--MgCl.sub.2,
LiCl--KCl--MgCl.sub.2, KCl--NaCl--MgCl.sub.2), fluoroborate-based
salts (e.g., NaF--NaBF.sub.4, KF--KBF.sub.4, RbF--RbBF.sub.4), or
nitrate-based salts (e.g., NaNO.sub.3--KNO.sub.3,
Ca(NO.sub.3).sub.2--NaNO.sub.3--KNO.sub.3,
LiNO.sub.3--NaNO.sub.3--KNO.sub.3), and any alloys thereof.
[0036] One or more nozzles 514 may be positioned within the fluid
reservoir 506 and otherwise configured to eject the thermal fluid
512 such that it impinges on a bottom surface 516 of the quench
plate 502. The quench plate 502 may be impermeable to the thermal
fluid 512 and otherwise prevent the thermal fluid 512 from coming
into direct contact with the mold assembly 300. Instead, the
thermal fluid 512 may thermally communicate with the mold assembly
300 across or through the quench plate 502 via thermal conduction
and subsequently flow into the fluid reservoir 506 for recycling or
disposal. As used herein, the term "thermally communicate," or any
variation thereof, refers to the ability to exchange thermal energy
between the thermal fluid 512 and the mold assembly 300 and/or its
contents, even across the quench plate 502.
[0037] Any vapor that may be generated from contacting the thermal
fluid 512 on the bottom surface 516 of the quench plate may either
condense into the fluid reservoir 506 or migrate along the bottom
surface 516 of the quench plate 502 until eventually locating the
gap 510 and escaping into the surrounding environment outside of
the insulation enclosure 406. In some embodiments, however, the
quench plate 502 may sealingly engage and otherwise form a seal
against the shoulder 508 and thereby prevent the efflux of vapor
into the surrounding environment. In such embodiments, a
pressure-release line (not shown) may be included to relieve any
built-up pressure in the fluid reservoir 506 caused by the
vapor.
[0038] The insulation enclosure 406 may prevent any escaping vapor
from entering the interior 518 of the insulation enclosure 406 and,
upon contacting the cooler air of the surrounding environment, some
of the vapor may condense and flow back into the fluid reservoir
506 via the gap 510. Furthermore, the interior 518 may be sealed
off using an appropriate member between the quench plate 502 and
insulation enclosure 406. In such embodiments, the interior 518 may
be evacuated to provide a vacuum (and thermal insulation) between
the insulation enclosure 406 and the mold assembly 300.
Alternatively, the interior 518 may be filled with a controlled
atmosphere by flowing in a gas, such as argon or helium, at an
elevated temperature to promote directional solidification of the
contents of the mold assembly 300 by insulating the upper portions
of mold assembly 300 while its bottom portion is cooled via the
quench plate 502.
[0039] The quench plate 502 may be made of a variety of materials
that help facilitate thermal energy transfer from the mold assembly
300 to the thermal fluid 512. Suitable materials for the quench
plate 502 include, but are not limited to, a ceramic (e.g., oxides,
carbides, borides, nitrides, silicides), a metal (e.g., steel,
stainless steel, nickel, tungsten, titanium or alloys thereof),
alumina, graphite, diamond, graphene, and any combination thereof.
FIGS. 5A-5C depict various exemplary designs and configurations of
the quench plate 502 that may be employed to help cool the mold
assembly 300 while simultaneously isolating the mold assembly 300
from the thermal fluid 512 and any vapor generated therefrom.
[0040] In FIG. 5A, for example, the quench plate 502 may comprise a
monolithic slab or block of material having a generally uniform
thickness. As illustrated, a single nozzle 514 may be positioned
within the fluid reservoir 506 and otherwise configured to eject
the thermal fluid 512 such that it impinges on the bottom surface
516 at or near the center of the quench plate 502. As will be
appreciated, more than one nozzle 514 may be employed, without
departing from the scope of the disclosure.
[0041] In FIG. 5B, the quench plate 502 is depicted as an arched
member and otherwise narrowing toward its center. More
particularly, the thickness of the quench plate 502 may be greater
at its outer periphery as compared to the center. As will be
appreciated, this configuration provides less mass at or near the
center of the quench plate 502, thereby allowing for quicker heat
conduction through the reduced-mass sections. FIG. 5B also
illustrates a plurality of nozzles 514 (three shown) configured to
eject the thermal fluid 512 such that it impinges on the bottom
surface 516 across a larger area as compared to the single nozzle
514 of FIG. 5A. In another embodiment, the bottom surface 516 may
be designed in conjunction with the nozzles 514 to facilitate
attachment of a cooling film to the bottom surface 516, eliminate a
vapor boundary layer at the bottom surface 516, and/or promote
turbulent flow at the interface between the quench plate 502 and
the thermal fluid 512.
[0042] In FIG. 5C, the quench plate 502 may provide one or more
grooves 520 (three shown) defined into the bottom surface 516
thereof. The grooves 520 may prove advantageous in providing local
zones in the quench plate 502 that provide less mass and thereby
allow for quicker heat conduction through the quench plate 502 at
those areas. Alternatively, or in addition thereto, the grooves 520
may facilitate attached fluid flow along the bottom surface 516,
thereby enhancing the heat-transfer rate. As illustrated, the
thermal sink system 500c may include a nozzle 514 (three shown)
aligned with each groove 520 to eject the thermal fluid 512 into
the grooves 520 and thereby provide for locally increased heat
transfer. Each nozzle 514 may be oriented at a specific angle with
respect to the bottom surface 516, such as perpendicular
(90.degree., as shown), 60.degree., 45.degree., 30.degree.,
0.degree., or any orientation within the 0-90.degree. range to
optimize fluid flow and heat transfer via the quench plate 502
along bottom surface 516.
[0043] The quench plate 502 design of FIG. 5C may function as a
type of heat exchanger, with the thicker portions of the quench
plate 502 between the grooves 520 simulating or otherwise serving
as at type of heat-exchanging fins. As will be appreciated, various
designs and configurations of the grooves 520 may be integrated
into the quench plate 520 as heat-exchanging features that include,
but are not limited to, protruding knobs, fins, cylinders, coils,
tubes, bundled tubes, concentric tubes, plates, corrugated plates,
strips, shells, baffles, channels, micro-channels, finned coils,
finned plates, finned strips, louvered fins, wavy fins, pin fins,
and the like, or any combination thereof to make the bottom surface
516 of the quench plate 502 operate as a heat exchanger.
Alternatively, such heat-exchanging features may be integrated in
other locations on the bottom surface 516 of a quench plate 502 to
enhance heat transfer between the quench plate 502 and the fluid
reservoir 506.
[0044] Referring now to FIG. 6, with continued reference to FIGS.
5A-5C, illustrated is a partial cross-sectional side view of
another exemplary thermal sink system 600 that may be used to cool
the mold assembly 300, according to one or more embodiments. The
thermal sink system 600 may be similar in some respects to the
thermal sink systems 500a-c of FIGS. 5A-5C, respectively, and
therefore may be best understood with reference thereto, where like
numerals represent like components not described again in detail.
As illustrated, the thermal sink system 600 may include the quench
plate 502, the table 504 that supports the quench plate 502, and
the fluid reservoir 506 disposed below the quench plate 502.
Moreover, the mold assembly 300 may be positioned on the quench
plate 502 and the insulation enclosure 406 may be disposed about
the mold assembly 300 and rest on the quench plate 502.
[0045] Unlike the thermal sink systems 500a-c of FIGS. 5A-5C,
however, the thermal sink system 600 may include one or more flow
channels 602 defined within and otherwise through the quench plate
502. As illustrated, the flow channel 602 may extend between an
inlet 604a and an outlet 604b, and a nozzle 514 or other type of
piping or conduit may be configured to provide the thermal fluid
512 into the flow channel 602 via the inlet 604a. In operation, the
thermal fluid 512 may be provided to the inlet 604a and flowed into
the flow channel 602 and subsequently exit the flow channel 602 at
the outlet 604b where it flows into the fluid reservoir 506 for
recycling or disposal. While circulating through the flow channel
602, the thermal fluid 512 may thermally communicate (i.e.,
exchange thermal energy) with the mold assembly 300 across or
through the quench plate 502 via thermal conduction.
[0046] The flow channel 602 may prove advantageous in allowing the
thermal fluid 512 to thermally communicate with the mold assembly
300 through the quench plate 502 while simultaneously preventing
the thermal fluid 512 from coming into direct contact with the mold
assembly 300. Any vapor that may be generated as the thermal fluid
512 circulates through the flow channel 602 may either condense
into the fluid reservoir 506 or migrate along the bottom surface
516 of the quench plate 502 until eventually locating the gap 510
and escaping into the surrounding environment outside of the
insulation enclosure 406.
[0047] The flow channel 602 defined in the quench plate 502 may
exhibit various configurations and designs while isolating the mold
assembly 300 from contact with the thermal fluid 512 or vapor
generated therefrom. FIGS. 7A-7C, for example, show at least three
exemplary designs for the flow channel 602 that may be employed in
the quench plate 502 to provide enhanced or more controlled thermal
profiles for the mold assembly 300. In FIG. 7A, the flow channel
602 may provide a plurality of branches 702 that extend from a
common and/or centralized inlet 604a. Each of the branches 702 may
be fed thermal fluid 512 from the central inlet 604a and may
terminate in a corresponding outlet 604b.
[0048] In FIG. 7B, the flow channel 602 is depicted as comprising a
plurality of flow channels shown as flow channels 602a, 602b, and
602c. Each flow channel 602a-c may be configured to circulate the
thermal fluid 512 between an inlet 604a and an outlet 604b. In the
illustrated embodiment, the flow channels 602a-c each form a
generally angled or triangular flow pathway. It will be
appreciated, however, that other designs or configurations of the
flow channels 602a-c may alternatively be employed, without
departing from the scope of the disclosure. Moreover, while only
three flow channels 602a-c are depicted in FIG. 7B (six if the full
quench plate 502 were shown past the centerline), it will be
appreciated that more or less than three flow channels 502a-c may
be employed.
[0049] In FIG. 7C, the flow channel 602 is depicted as a single
flow channel 602 that is spiraled or coiled within the quench plate
502. As illustrated, the flow channel 602 may include the inlet
604a located at or near the center of the quench plate 502, and the
outlet 604b located adjacent the outer periphery of the quench
plate 502. It will be appreciated that several other designs for
the flow channel 602 may be possible and are contemplated as being
within the scope of the present disclosure.
[0050] Referring now to FIGS. 8A and 8B, illustrated are partial
cross-sectional side views of other exemplary thermal sink systems
800 that may be used to cool the mold assembly 300, according to
one or more embodiments. More particularly, FIG. 8A depicts a first
thermal sink system 800a, and FIG. 8B depicts a second thermal sink
system 800b. The thermal sink systems 800a,b may be similar in some
respects to the thermal sink systems 500a-c and 600 of FIGS. 5A-5C
and 6, respectively, and therefore may be best understood with
reference thereto, where like numerals represent like components
not described again in detail. As illustrated, each thermal sink
system 800a,b may include the quench plate 502, the table 504 that
supports the quench plate 502, and the fluid reservoir 506 disposed
below the quench plate 502. Moreover, the mold assembly 300 may be
positioned on the quench plate 502 and the insulation enclosure 406
may be disposed about the mold assembly 300 and rest on the quench
plate 502.
[0051] Unlike the thermal sink systems 500a-c and 600 of FIGS.
5A-5C and 6, however, the quench plate 502 of the thermal sink
systems 800a,b may comprise a multi-component structure. More
particularly, the quench plate 502 may define an aperture 802
configured to receive and seat an insert 804 that forms part of the
quench plate 502. In some embodiments, as illustrated, the aperture
802 may provide a radial shoulder 806 configured to support the
insert 804 within the aperture 802 as the quench plate 502 is
supported by the table 504 at the shoulder 508. In other
embodiments, the aperture 802 may receive the insert 804 via a
threaded engagement or the insert 804 may be secured within the
aperture 802 using one or more mechanical fasteners (e.g., screws,
bolts, snap rings, pins, etc.). The use of a compression fitting
may be necessary in some cases to provide a complete seal along the
interface between the insert 804 and the quench plate 502.
Additionally, an appropriate sealing material or device (e.g.,
O-ring, etc.) may be positioned between the insert 804 and quench
plate 502 to further prevent the thermal fluid 512 or vapor from
entering the interior 518. In at least one embodiment, the insert
804 may be permanently bonded to the quench plate 502 using an
appropriate method, such as brazing or welding. Moreover, in some
embodiments, as illustrated, the aperture 802 may be defined at or
near the center of the quench plate 502. In other embodiments,
however, the aperture 802 may alternatively be defined off-center,
without departing from the scope of the disclosure.
[0052] The insert 804 may be made of a variety of materials
configured to provide different thermal properties (e.g., thermal
conductivity) intended to produce different thermal profiles in the
mold assembly 300 during the cooling process. Suitable materials
for the insert 804 include, but are not limited to, a ceramic
(e.g., oxides, carbides, borides, nitrides, silicides), a metal
(e.g., steel, stainless steel, nickel, copper, tungsten, titanium
or alloys thereof), alumina, graphite, and any combination thereof.
In some embodiments, the insert 804 and the quench plate 502 may be
made of the same material. In other embodiments, however, the
insert 804 and the quench plate 502 may be made of dissimilar
materials. The material of the insert 804 may prove advantageous in
quickly drawing heat out of the mold assembly 300 during operation
whereas the material of the quench plate 502 may prove advantageous
in retaining heat in the insulation enclosure 406 and/or the
interior 518, thereby promoting directional solidification of the
mold assembly 300 and its contents.
[0053] As illustrated, the insert 804 in FIG. 8A is smaller than
the insert 804 of FIG. 8B. In FIG. 8A, one nozzle 514 is depicted
as ejecting the thermal fluid 512 such that it impinges on the
bottom surface 516 of the quench plate 502 and, more particularly,
on a bottom or underside 808 of the insert 804. In FIG. 8B, a
plurality of nozzles 514 (four shown) are depicted as ejecting the
thermal fluid 512 such that it impinges on the underside 808 of the
insert 804. As the thermal fluid 512 contacts the insert 804,
thermal energy may be transferred from the mold assembly 300,
through the insert 804, and to the thermal fluid 512.
[0054] Referring now to FIG. 9, with continued reference to the
prior figures, illustrated is an isometric view of an exemplary
quench plate 900, according to one or more embodiments. The quench
plate 900 may be similar in some respects to the quench plate 502
described above, and therefore able to prevent exposure of the mold
assembly 300 (FIGS. 5A-5C, 6, 8A-8B) to the thermal fluid 512
(FIGS. 5A-5C, 6, 8A-8B) that is used to cool the mold assembly 300
and any resulting vapor generated by the thermal fluid 512. In the
illustrated embodiment, the quench plate 900 may include one or
more backstops 902 (shown as backstops 902a, 902b, and 902c) to
assist in accurate and repeatable locating of the mold assembly 300
during the transfer process from the furnace 402 (FIG. 4A) to the
quench plate 900.
[0055] Three imaginary mold base diameters 904 are depicted on the
quench plate 900 as 904a, 904b, and 904c. Each mold base diameter
904a-c corresponds generally to a size of the bottom 418 (FIGS.
5A-5C, 6, 8A-8B) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B),
and each mold base diameter 904a-c provides a different design or
type of backstop 902 configured to receive and center the mold
assembly 300 on the quench plate 900. More particularly, the first
and smallest mold base diameter 904a illustrates a first backstop
902a design, the second mold base diameter 904b illustrates a
second backstop 902b design, and the third and largest mold base
diameter 904c illustrates a third backstop 902c design.
[0056] The first backstop 902a may include or otherwise provide two
or more pegs 906 (three shown) positioned at predetermined
locations about the circumference of the first mold base diameter
904a and otherwise protruding from the upper surface of the quench
plate 900. The pegs 906 may be configured to receive the bottom 418
(FIGS. 5A-5C, 6, 8A-8B) of the mold assembly 300 (FIGS. 5A-5C, 6,
8A-8B) as the mold assembly 300 is moved in the direction A toward
the pegs 906. The pegs 906 may be spaced from each other about the
circumference of the first mold base diameter 904a such that the
mold assembly 300 is received by the pegs 906 and simultaneously
concentrically located on the quench plate 900 around the center
908.
[0057] While three pegs 906 are shown, it will be appreciated that
more or less (i.e., two) than three pegs 906 can be employed,
without departing from the scope of the disclosure. In some
embodiments, one or more of the pegs 906 may be inserted into
corresponding apertures defined on the upper surface of the quench
plate 900. In other embodiments, one or more of the pegs 906 may be
threaded into such apertures. In yet other embodiments, one or more
of the pegs 906 may penetrate the quench plate 900 and may be
secured to the quench plate 900 on its underside, such as through
the use of a nut and water-tight washer combination.
[0058] The second backstop 902b may include or otherwise provide
two or more blocks 910 (three shown) positioned about the
circumference of the second mold base diameter 904b and otherwise
protruding from the upper surface of the quench plate 900. Similar
to the pegs 906, the blocks 910 may be configured to receive the
bottom 418 (FIGS. 5A-5C, 6, 8A-8B) of the mold assembly 300 (FIGS.
5A-5C, 6, 8A-8B) as the mold assembly 300 is moved in the direction
A toward the blocks 910. The blocks 910 may be spaced from each
other about the circumference of the second mold base diameter 904b
such that the mold 300 is received by the blocks 910 and
simultaneously located on the quench plate 900 at the center 908.
While three blocks 910 are shown, it will be appreciated that more
or less (i.e., two) than three blocks 910 can be employed, without
departing from the scope of the disclosure. In other embodiments,
the blocks 910 may be combined into a single arcuate member
configured to receive and locate the mold assembly 300 at the
center 908. In some embodiments, one or more of the blocks 910 may
be inserted into corresponding polygonal apertures defined on the
upper surface of the quench plate 900. In other embodiments, one or
more of the blocks 910 may be secured to the upper surface of the
quench plate 900 using one or more mechanical fasteners, such as
screws or bolts that thread into the upper surface of the quench
plate 900.
[0059] The third backstop 902c may include an elongate member 912
positioned on the third mold base diameter 904c. While shown in
FIG. 9 as generally straight, in at least one embodiment, the
elongate member 912 may be curved or otherwise arcuate in shape. In
some embodiments, the elongate member 912 may be anchored to the
quench plate 900 using one or more mechanical fasteners 914 (one
shown in exploded view), such as bolts, screws, pegs, snap rings,
etc. In other embodiments, the elongate member 912 may be anchored
to the table 504 (FIGS. 5A-5C, 6, 8A-8B) using the same type of
mechanical fasteners 916 (one shown in exploded view). The elongate
member 912 may be configured to receive the bottom 418 (FIGS.
5A-5C, 6, 8A-8B) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B)
as the mold assembly 300 is moved in the direction A toward the
elongate member 912. Once the mold assembly 300 is located on the
quench plate 900 around the center 908, the elongate member 912 may
be removed or otherwise movable, such as via an actuation member,
to accommodate the insulation enclosure 406 (FIGS. 5A-5C, 6, 8A-8B)
being lowered onto the upper surface of the quench plate 900. In
other embodiments, however, the elongate member 912 may be a
recessable member, either via an actuation member or with a curved
top surface so that the vertical force from the insulation
enclosure 406 may force the elongate member 912 to lower.
[0060] As will be appreciated, any of the backstops 902a-c
described above may be employed at any of the mold base diameters
904a-c and in any combination, if desired. Moreover, it will be
appreciated that the various embodiments described and illustrated
herein may be combined in any combination, in keeping within the
scope of this disclosure. Indeed, variations in the size and
configuration of any of the thermal sink systems described herein
may be implemented in any of the embodiments, as generally
described herein, without departing from the scope of the
disclosure.
[0061] Embodiments disclosed herein include:
[0062] A. A thermal sink system that includes a quench plate having
an upper surface for receiving a mold assembly to be cooled, and a
thermal fluid in thermal communication with the mold assembly via
conduction through the quench plate, wherein the quench plate
interposes the thermal fluid and the mold assembly and thereby
prevents the thermal fluid from contacting the mold assembly.
[0063] B. A method of cooling a mold assembly that includes
positioning the mold assembly on an upper surface of a quench
plate, placing a thermal fluid in thermal communication with the
mold assembly via conduction through the quench plate, and
preventing the thermal fluid from contacting the mold assembly with
the quench plate.
[0064] Each of embodiments A and B may have one or more of the
following additional elements in any combination: Element 1:
wherein the thermal fluid is a fluid selected from the group
consisting of water, steam, an oil, a coolant, a gas, a molten
metal, a molten metal alloy, a fluidized bed, and a molten salt.
Element 2: further comprising a table having a shoulder that
receives and supports the quench plate, and a fluid reservoir
arranged below the quench plate. Element 3: wherein the quench
plate sealingly engages the table. Element 4: further comprising
one or more nozzles arranged to eject the thermal fluid such that
the thermal fluid impinges on a bottom surface of the quench plate.
Element 5: wherein the quench plate is arched such that a thickness
of the quench plate is greater at an outer periphery as compared to
a thickness of the quench plate at a center location. Element 6:
further comprising one or more grooves defined in a bottom surface
of the quench plate. Element 7: further comprising one or more
nozzles arranged to eject the thermal fluid into the one or more
grooves. Element 8: further comprising one or more heat-exchanging
features defined in a bottom surface of the quench plate. Element
9: further comprising one or more flow channels defined in the
quench plate for circulating the thermal fluid. Element 10: wherein
the one or more flow channels comprise a plurality of branches
extending from a common inlet. Element 11: wherein the one or more
flow channels comprise a single, spiraling flow channel. Element
12: wherein the quench plate defines an aperture and includes an
insert receivable into the aperture. Element 13: wherein the insert
comprises a thermally conductive material selected from the group
consisting of a ceramic, a metal, alumina, graphite, and any
combination thereof. Element 14: wherein the insert and the quench
plate are made of dissimilar materials. Element 15: further
comprising a backstop to locate the mold assembly at a desired
location on the upper surface of the quench plate. Element 16:
wherein the backstop is at least one of two or more pegs protruding
from the upper surface of the quench plate, one or more blocks
protruding from the upper surface of the quench plate, an arcuate
block member protruding from the upper surface of the quench plate,
an elongate member, and an arcuate member. Element 17: further
comprising an insulation enclosure that rests on the upper surface
of the quench plate and provides an interior for receiving the mold
assembly, the quench plate further preventing vapor generated by
the thermal fluid from migrating into the interior of the
insulation enclosure.
[0065] Element 18: further comprising positioning an insulation
enclosure over the mold assembly such that the mold assembly is
received into an interior of the insulation enclosure and the
insulation enclosure rests on the upper surface of the quench
plate, and preventing vapor generated by the thermal fluid from
migrating into the interior of the insulation enclosure with the
quench plate. Element 19: wherein placing the thermal fluid in
thermal communication with the mold assembly comprises ejecting the
thermal fluid from one or more nozzles such that the thermal fluid
impinges on a bottom surface of the quench plate. Element 20:
wherein the bottom surface of the quench plate defines one or more
grooves, the method further comprising ejecting the thermal fluid
from the one or more nozzles into the one or more grooves. Element
21: wherein the bottom surface of the quench plate defines one or
more heat-exchanging features, the method further comprising
placing at least one of the thermal fluid and a fluid reservoir in
thermal communication with the mold assembly via conduction through
the quench plate. Element 22: wherein ejecting the thermal fluid
from the one or more nozzles comprises at least one of reducing a
vapor boundary layer at the bottom surface of the quench plate, and
promoting turbulent flow at the bottom surface of the quench plate.
Element 23: wherein placing the thermal fluid in thermal
communication with the mold assembly comprises circulating the
thermal fluid through one or more flow channels defined in the
quench plate. Element 24: wherein the quench plate defines an
aperture and includes an insert receivable into the aperture, the
method further comprising placing the thermal fluid in thermal
communication with the mold assembly via conduction through the
insert as received in the aperture of the quench plate. Element 25:
wherein positioning the mold assembly on the upper surface of the
quench plate comprises locating the mold assembly at a desired
location on the upper surface of the quench plate with a backstop,
wherein the backstop is at least one of two or more pegs protruding
from the upper surface of the quench plate, one or more blocks
protruding from the upper surface of the quench plate, an arcuate
block member protruding from the upper surface of the quench plate,
an elongate member, and an arcuate member.
[0066] By way of non-limiting example, exemplary combinations
applicable to A, B, and C include: Element 2 with Element 3;
Element 6 with Element 7; Element 9 with Element 10; Element 9 with
Element 11; Element 12 with Element 13; Element 12 with Element 14;
Element 15 with Element 16; Element 19 with Element 20; Element 19
with Element 21; and Element 19 with Element 22.
[0067] Therefore, the disclosed systems and methods are well
adapted to attain the ends and advantages mentioned as well as
those that are inherent therein. The particular embodiments
disclosed above are illustrative only, as the teachings of the
present disclosure may be modified and practiced in different but
equivalent manners apparent to those skilled in the art having the
benefit of the teachings herein. Furthermore, no limitations are
intended to the details of construction or design herein shown,
other than as described in the claims below. It is therefore
evident that the particular illustrative embodiments disclosed
above may be altered, combined, or modified and all such variations
are considered within the scope of the present disclosure. The
systems and methods illustratively disclosed herein may suitably be
practiced in the absence of any element that is not specifically
disclosed herein and/or any optional element disclosed herein.
While compositions and methods are described in terms of
"comprising," "containing," or "including" various components or
steps, the compositions and methods can also "consist essentially
of" or "consist of" the various components and steps. All numbers
and ranges disclosed above may vary by some amount. Whenever a
numerical range with a lower limit and an upper limit is disclosed,
any number and any included range falling within the range is
specifically disclosed. In particular, every range of values (of
the form, "from about a to about b," or, equivalently, "from
approximately a to b," or, equivalently, "from approximately a-b")
disclosed herein is to be understood to set forth every number and
range encompassed within the broader range of values. Also, the
terms in the claims have their plain, ordinary meaning unless
otherwise explicitly and clearly defined by the patentee. Moreover,
the indefinite articles "a" or "an," as used in the claims, are
defined herein to mean one or more than one of the element that it
introduces. If there is any conflict in the usages of a word or
term in this specification and one or more patent or other
documents that may be incorporated herein by reference, the
definitions that are consistent with this specification should be
adopted.
[0068] As used herein, the phrase "at least one of" preceding a
series of items, with the terms "and" or "or" to separate any of
the items, modifies the list as a whole, rather than each member of
the list (i.e., each item). The phrase "at least one of" allows a
meaning that includes at least one of any one of the items, and/or
at least one of any combination of the items, and/or at least one
of each of the items. By way of example, the phrases "at least one
of A, B, and C" or "at least one of A, B, or C" each refer to only
A, only B, or only C; any combination of A, B, and C; and/or at
least one of each of A, B, and C.
* * * * *