U.S. patent application number 14/992552 was filed with the patent office on 2016-11-24 for circuit protection structure and electronic device.
This patent application is currently assigned to Xiaomi Inc.. The applicant listed for this patent is Xiaomi Inc.. Invention is credited to Hui LI, Chunli XU, Dawei YANG, Dan ZHU.
Application Number | 20160344444 14/992552 |
Document ID | / |
Family ID | 53814880 |
Filed Date | 2016-11-24 |
United States Patent
Application |
20160344444 |
Kind Code |
A1 |
YANG; Dawei ; et
al. |
November 24, 2016 |
CIRCUIT PROTECTION STRUCTURE AND ELECTRONIC DEVICE
Abstract
A circuit protection structure and a device including the same
are provided. The circuit protection structure includes: a printed
circuit board (PCB) motherboard, a middle frame connected to the
PCB motherboard, and a conductive adhesive layer. The PCB
motherboard is disposed in a portable electronic device. The PCB
motherboard has a circuit unit mounted thereon and a grounded
wireframe surrounding a periphery of the circuit unit where the
circuit unit contacts the PCB motherboard. The middle frame
includes a conductive housing at least partially covering the PCB
motherboard the conductive housing having a cavity to enclose the
circuit unit. The conductive adhesive layer is disposed between the
grounded wireframe and the conductive housing for electrical
connection between the grounded wireframe and the conductive
housing.
Inventors: |
YANG; Dawei; (Beijing,
CN) ; LI; Hui; (Beijing, CN) ; ZHU; Dan;
(Beijing, CN) ; XU; Chunli; (Beijing, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Xiaomi Inc. |
Beijing |
|
CN |
|
|
Assignee: |
Xiaomi Inc.
Beijing
CN
|
Family ID: |
53814880 |
Appl. No.: |
14/992552 |
Filed: |
January 11, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 9/0064 20130101;
H05K 7/1417 20130101; H04M 1/0277 20130101; H05K 9/0024
20130101 |
International
Class: |
H04B 3/28 20060101
H04B003/28; H05K 7/14 20060101 H05K007/14; H05K 9/00 20060101
H05K009/00; H04M 1/02 20060101 H04M001/02 |
Foreign Application Data
Date |
Code |
Application Number |
May 21, 2015 |
CN |
201510263801.1 |
Claims
1. A circuit protection structure, comprising: a printed circuit
board (PCB) motherboard disposed in a portable electronic device,
having mounted thereon a circuit unit and a grounded wireframe
surrounding a periphery of the circuit unit where the circuit unit
contacts the PCB motherboard; a middle frame connected to the PCB
motherboard, the middle frame comprising a conductive housing at
least partially covering the PCB motherboard the conductive housing
having a cavity to enclose the circuit unit; and a conductive
adhesive layer, disposed between the grounded wireframe and the
conductive housing, the conductive adhesive layer configured to
provide an electrical connection between the grounded wireframe and
the conductive housing.
2. The circuit protection structure of claim 1, wherein the
conductive adhesive layer overleaps with the grounded
wireframe.
3. The circuit protection structure of claim 1, wherein the
conductive adhesive layer overlaps with an outer edge of the
conductive housing.
4. The circuit protection structure of claim 3, wherein the
conductive adhesive layer comprises a first conductive foam gasket,
wherein opposite sides of the first conductive foam gasket are
respectively adhered to the conductive housing and the grounded
wireframe.
5. The circuit protection structure of claim 3, wherein the
conductive adhesive layer comprises a first conductive silicon gel,
wherein opposite sides of the first conductive silicon gel are
respectively adhered to the conductive housing and the grounded
wireframe.
6. The circuit protection structure of claim 3, wherein the
conductive adhesive layer comprises a second conductive foam gasket
and a second conductive silicon gel that are attached with each
other, wherein the second conductive foam gasket is adhered to the
conductive housing, and the second conductive silicon gel is
adhered to the grounded wireframe.
7. The circuit protection structure of claim 3, wherein the
conductive adhesive layer comprises a third conductive foam gasket
and a third conductive silicon gel that are attached with each
other, and wherein the third conductive foam gasket is adhered to
the grounded wireframe, and the third conductive silicon gel is
adhered to the conductive housing.
8. The circuit protection structure of claim 1, wherein the
grounded wireframe has a wire width of no more than 5 mm.
9. An electronic device, comprising a housing and at least one
circuit protection structure installed within the housing, wherein
the circuit protection structure comprises: a printed circuit board
(PCB) motherboard disposed in the housing, having mounted thereon a
circuit unit and a grounded wireframe surrounding a periphery of
the circuit unit where the circuit unit contacts the PCB
motherboard; a middle frame connected to the PCB motherboard, the
middle frame comprising a conductive housing at least partially
covering the PCB motherboard, the conductive housing having a
cavity to accommodate the circuit unit; and a conductive adhesive
layer, disposed between the grounded wireframe and the conductive
housing, the conductive adhesive layer configured to provide an
electrical connection between the grounded wireframe and the
conductive housing.
10. The electronic device of claim 9, wherein the conductive
adhesive layer overlaps with the grounded wireframe.
11. The electronic device of claim 9, wherein the conductive
adhesive layer overlaps with an outer edge of the conductive
housing.
12. The electronic device of claim 11, wherein the conductive
adhesive layer comprises a first conductive foam gasket, wherein
opposite sides of the first conductive foam gasket are respectively
adhered to the conductive housing and the grounded wireframe.
13. The electronic device of claim 11, wherein the conductive
adhesive layer comprises a first conductive silicon gel, wherein
opposite sides of the first conductive silicon gel are respectively
adhered to the conductive housing and the grounded wireframe.
14. The electronic device of claim 11, wherein the conductive
adhesive layer comprises a second conductive foam gasket and a
second conductive silicon gel that are attached with each other,
wherein the second conductive foam gasket is adhered to the
conductive housing, and the second conductive silicon gel is
adhered to the grounded wireframe.
15. The electronic device of claim 11, wherein the conductive
adhesive layer comprises a third conductive foam gasket and a third
conductive silicon gel that are attached with each other, and
wherein the third conductive foam gasket is adhered to the grounded
wireframe, and the third conductive silicon gel is adhered to the
conductive housing.
16. The electronic device of claim 9, wherein the grounded
wireframe has a wire width of no more than 5 mm.
17. A smartphone, comprising: a printed circuit board (PCB)
motherboard, having mounted thereon a first plurality of circuit
units and a first grounded wireframe surrounding a first periphery
of the first plurality of circuit units, the first plurality of
circuit units including a mobile processor and memory connected to
the mobile processor; a middle frame connected to the PCB
motherboard, the middle frame comprising a conductive housing at
least partially covering the PCB motherboard, the conductive
housing having a cavity to accommodate the first plurality of
circuit units; and a conductive adhesive layer, disposed between
the grounded wireframe and the conductive housing, the conductive
adhesive layer configured to provide an electrical connection
between the grounded wireframe and the conductive housing.
18. The smartphone of claim 17, wherein the conductive adhesive
layer comprises a first conductive foam gasket, wherein opposite
sides of the first conductive foam gasket are respectively adhered
to the conductive housing and the grounded wireframe.
19. The smartphone of claim 17, wherein the PCB motherboard further
comprising a second plurality of circuit units and a second
grounded wireframe surrounding a second periphery of the second
plurality of circuit units; and wherein the first grounded
wireframe and the second grounded wireframe share at least a
portion of a straight common grounded wireframe.
20. The smartphone of claim 17, wherein the conductive housing
comprises a heat dissipation unit inside the conductive housing,
the heat dissipation unit configured to at least partially touch
the mobile processor and dissipate heat generated from the mobile
processor.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is based upon and claims priority to
Chinese Patent Application No. 201510263801.1, filed May 21, 2015,
the entire contents of which are incorporated herein by
reference.
TECHNICAL FIELD
[0002] The present disclosure generally relates to the technical
field of communication circuits, and more particularly, to a
circuit structure for shielding electromagnetic radiations and an
electronic device.
BACKGROUND
[0003] Generally, "noise" in a circuit refers to the redundant
signals causing purity distortion to the desired signal. The noise
is spread in two ways: conduction and radiation. Generally, the
conductive noise is spread from one place to another through a
conductor, such as a wire, a printed circuit, a metallic housing of
a device, a metallic frame of a device, or components in the
circuit, etc. The radiation noise is generally spread from one
place to another through air or other dielectric mediums. Further,
the conductive noise may be transformed into the radiation noise
(i.e., the electromagnetic radiation) when meeting an adaptive
antenna.
[0004] Several effective methods for reducing noise include
shielding, filtering, grounding wire design and overall layout. The
conductive noise is generally filtered out by means of traditional
circuit technique, and the radiative noise is minimized by means of
shielding. The conductive noise may be dealt by means of adding
filtering circuit as desired, because the position where the
conductive noise exists in the system is commonly already known.
However, the radiative noise is hard to be dealt with, for it is
usually pervading within the whole system. In order to deal with
the radiative noise, a shielding conductive cover may commonly be
added to control the radiative noise of the system.
SUMMARY
[0005] According to a first aspect of the present disclosure, there
is provided a circuit protection structure. The circuit protection
structure includes: a printed circuit board (PCB) motherboard, a
middle frame connected to the PCB motherboard, and a conductive
adhesive layer. The PCB motherboard is disposed in a portable
electronic device. The PCB motherboard has a circuit unit mounted
thereon and a grounded wireframe surrounding a periphery of the
circuit unit where the circuit unit contacts the PCB motherboard.
The middle frame includes a conductive housing at least partially
covering the PCB motherboard the conductive housing having a cavity
to enclose the circuit unit. The conductive adhesive layer is
disposed between the grounded wireframe and the conductive housing
for electrical connection between the grounded wireframe and the
conductive housing.
[0006] According to a second aspect of the present disclosure,
there is provided an electronic device. The device includes a
housing and at least one circuit protection structure installed
within the housing. The circuit protection structure includes: a
PCB motherboard, a middle frame connected to the PCB motherboard,
and a conductive adhesive layer. The PCB motherboard is disposed in
the housing. The PCB motherboard has a circuit unit mounted thereon
and a grounded wireframe surrounding a periphery of the circuit
unit where the circuit unit contacts the PCB motherboard. The
middle frame includes a conductive housing at least partially
covering the PCB motherboard the conductive housing having a cavity
to enclose the circuit unit. The conductive adhesive layer is
disposed between the grounded wireframe and the conductive housing
for electrical connection between the grounded wireframe and the
conductive housing.
[0007] According to a third aspect of the present disclosure, there
is provided a smartphone. The smartphone includes a PCB
motherboard, a middle frame connected to the PCB motherboard, and a
conductive adhesive layer. The PCB motherboard has mounted thereon
a first plurality of circuit units and a first grounded wireframe
surrounding a first periphery of the first plurality of circuit
units. The first plurality of circuit units include a mobile
processor and memory connected to the mobile processor. The middle
frame includes a conductive housing at least partially covering the
PCB motherboard, the conductive housing having a cavity to
accommodate the first plurality of circuit unit. The conductive
adhesive layer is disposed between the grounded wireframe and the
conductive housing, where the conductive adhesive layer is
configured to provide an electrical connection between the grounded
wireframe and the conductive housing.
[0008] It is to be understood that both the foregoing general
description and the following detailed description are exemplary
and explanatory only and are not restrictive of the disclosure, as
claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is an illustrative view showing the partial structure
of the circuit protection structure according to the present
disclosure in an angle;
[0010] FIG. 2 is an illustrative view showing the structure of the
circuit protection structure according to the present disclosure in
another angle;
[0011] FIG. 3 is an illustrative explosive view showing the
structure of the circuit protection structure according to an
embodiment of the present disclosure;
[0012] FIG. 4 is an illustrative explosive view showing the
structure of the circuit protection structure according to another
embodiment of the present disclosure;
[0013] FIG. 5 is an illustrative explosive view showing the
structure of the circuit protection structure according to another
embodiment of the present disclosure;
[0014] FIG. 6 is an illustrative explosive view showing the
structure of the circuit protection structure according to another
embodiment of the present disclosure; and
[0015] FIG. 7 is an illustrative explosive view showing the
structure of the circuit protection structure according to another
embodiment of the present disclosure.
DETAILED DESCRIPTION
[0016] Detailed description will be made to the present disclosure
with reference to the specific implements illustrated by the
accompanying drawings. However, the present disclosure is not
intended to be limited to the implements. The protection scope of
the present disclosure covers any modifications made by those
skilled in the art concerning structure, methods or functions
according to these implements.
[0017] The circuit unit in the present disclosure is protected by
forming a structure of Faraday's cage by means of the combination
of the conductive housing, the conductive adhesive layer, and the
grounded wireframe on the PCB, for the purpose of shielding
electromagnetic radiation so as to eliminate or reduce the
electromagnetic radiative interference on the circuit unit, without
increasing weight and size of the product caused by additional
shielding conductive cover, and thus improving competitiveness of
the product.
[0018] The terms in the present disclosure is used merely for the
purpose of description of the particular embodiments, rather than
intends to limit the present disclosure. Unless otherwise shown
clearly in the context, the singular words "a", "said" and "the"
used in the present disclosure and the appended claims also intend
to include the plural. It shall also be appreciated that the term
"and/or" used herein refers to and includes any or all possible
combinations of one or more relevant listed items.
[0019] It shall be appreciated, although various of information in
the present disclosure may be described by the terms "first",
"second" and so on, these information is not limited by the terms.
These terms are used merely for distinguishing information of the
same type from each other. For example, the first information may
also be referred as the second information without departing from
the scope of the present disclosure. Similarly, the second
information may also be referred as the first information. The word
"if" used herein may be explained as "when . . . " or "while" or
"response on confirmation", depending on the context.
[0020] Reference throughout this specification to "one embodiment,"
"an embodiment," "exemplary embodiment," or the like in the
singular or plural means that one or more particular features,
structures, or characteristics described in connection with an
embodiment is included in at least one embodiment of the present
disclosure. Thus, the appearances of the phrases "in one
embodiment" or "in an embodiment," "in an exemplary embodiment," or
the like in the singular or plural in various places throughout
this specification are not necessarily all referring to the same
embodiment. Furthermore, the particular features, structures, or
characteristics in one or more embodiments may include combined in
any suitable manner.
[0021] As illustrated in FIGS. 1 and 2, FIG. 1 is an illustrative
view showing the partial structure of the circuit protection
structure according to the present disclosure in an angle; and FIG.
2 is an illustrative view showing the structure of the circuit
protection structure according to the present disclosure in another
angle. The circuit protection structure of the present disclosure
may include a Printed Circuit Board (PCB) motherboard 11 and a
middle frame 16 connected to the PCB motherboard 11. The
combination of PCB motherboard 11 and the middle frame 16 provides
an enclosing encapsulation for the circuit unit 111 disposed on the
PCB ( ) motherboard 11 by means of the principle of the Faraday's
cage, so as to shield the outside environment electromagnetic
radiation, preventing the electromagnetic radiation from
interfering the circuit unit 111. Wherein the circuit unit 111 may
be a CPU unit, an audio circuit unit, a video circuit unit, and so
on.
[0022] In particular, according to the first aspect of the present
disclosure, the circuit protection structure of the present
disclosure may include: a PCB 11, a grounded wireframe 12, a
conductive housing 14 and a conductive adhesive layer 13. Wherein
the PCB 11 has thereon a circuit unit 111 and a grounded wireframe
12 surrounding a periphery of the circuit unit 111. The grounded
wireframe 12 is formed on the PCB 11 and forms a part of the
printed circuit on the PCB 11. The grounded wireframe 12 may either
be connected with the main grounding line on the PCB 11, or
connected directly with the earth. In an embodiment of the present
disclosure, the grounded wireframe 12 has a wire width of no more
than 5 mm, and preferably, the grounded wireframe 12 has a width of
about 2 mm.
[0023] Furthermore, the grounded wireframe 12 is an enclosing
structure located on the periphery of the circuit unit 111. In
addition, the conductive housing 14 has a receiving cavity for
receiving the circuit unit 111. The receiving cavity has a depth
(i.e. the size of the conductive housing 14 in the direction of
assembling to the circuit unit 111) no less than the height of the
highest component in the circuit unit 111. Preferably, in order
that the electronic device comprising the circuit protection
structure can have a thinner dimension, the receiving cavity may
have a depth equal to or slightly more than the height of the
highest component in the circuit unit 111.
[0024] Furthermore, the conductive housing 14 of the present
disclosure is sealed on the grounded wireframe 12 by a conductive
adhesive layer 13. Of course, the conductive housing 14 may be
further secured later by a bolt or etc. The conductive adhesive
layer 13 is disposed between the grounded wireframe 12 and the
conductive housing 14 for electrical connection between the
grounded wireframe 12 and the conductive housing 14, such that
protection circuit structure may form a structure of Faraday's
cage, keeping the circuit unit 111 from electromagnetic radiation.
Optionally, the conductive adhesive layer 13 and the grounded
wireframe 12 of the present disclosure may overlap with each other.
Furthermore, the conductive adhesive layer 13 may overlap with the
outer edges of the conductive housing 14. The portion of side
surface of the conductive housing 14 that contacts with the
conductive adhesive layer 13 has the same shape and size as that of
the grounded wireframe 12. This arrangement results in an optimal
line transmission for the conductive adhesive layer 13 and the
grounded wireframe 14, preventing disordered line connection caused
by over-wide conductive adhesive layer 13 coming into connection
with other lines on the PCB 11, or influenced electrical signal
transmission caused by over-narrow conductive adhesive layer
13.
[0025] As shown in FIGS. 1-3, in the present disclosure, the
conductive adhesive layer 13 is a first conductive foam gasket 131.
The opposite sides of the first conductive foam gasket 131 are
respectively adhered to the conductive housing 14 and the grounded
wireframe 12. Wherein the opposite sides of the first conductive
foam gasket 131 both include a conductive double-sided adhesive,
such that the first conductive foam gasket 131 may bond the
conductive housing 14 and the grounded wireframe 12 together and
achieve electrical connection. In the embodiments, the closed
structure of Faraday's cage is formed by one side of the first
conductive foam gasket 131 being bonded to the grounded wireframe
12, and the other side of the first conductive foam gasket 131
being bonded to the conductive housing 14. What is more, by using
the conductive foam gasket having the properties of good conductive
and elasticity, the minor gaps between the conductive housing 14
and the PCB 11 may be filled effectively, such that the conductive
housing 14 and the PCB 11 may contact completely with each other,
so as to solve the problem that the shielding may be weaken due to
the incomplete contact between the conductive housing 14 and the
PCB 11, which incomplete contact may be caused by deformation of
the PCB 11 during installation of the PCB 11.
[0026] As shown in FIGS. 1, 2, and 4, in the present disclosure,
the conductive adhesive layer 13 is a first conductive silicon gel
132. The opposite sides of the first conductive silicon gel 132 are
respectively adhered to the conductive housing 14 and the grounded
wireframe 12, such that the conductive housing 14 and the grounded
wireframe 12 may be bonded together and achieve electrical
connection by the first conductive silicon gel 132. In the
embodiments, the closed structure of Faraday's cage is formed by
the first conductive silicon gel 132 being bonded respectively to
the conductive housing 14 and the grounded wireframe 12, such that
the conductive housing 14 and the PCB 11 may contact completely
with each other, so as to solve the problem that the shielding may
be weaken due to the incomplete contact between the conductive
housing 14 and the PCB 11, which incomplete contact may be caused
by deformation of the PCB 11 during installation of the PCB 11.
[0027] As shown in FIGS. 1, 2, and 5, in the present disclosure,
the conductive adhesive layer 13 may include a second conductive
foam gasket 133 and a second conductive silicon gel 134 that are
attached with each other. The second conductive foam gasket 133 is
adhered to the conductive housing 14, and the second conductive
silicon gel 134 is adhered to the grounded wireframe 12. In the
embodiments, the closed structure of Faraday's cage is formed by
one side of the second conductive foam gasket 133 being bonded to
the second conductive silicon gel 134, the other side of the second
conductive foam gasket 133 being bonded to the conductive housing
14, and the other side, which is departed from the side bonded to
the second conductive foam gasket 133, of the second conductive
silicon gel 134 being bonded to the grounded wireframe 12. Also, by
using the conductive foam gasket having the properties of good
conductive and elasticity, the minor gaps between the conductive
housing 14 and the PCB 11 existed after electrical connection may
be filled effectively, such that the conductive housing 14 and the
PCB 11 may contact completely with each other, so as to solve the
problem that the shielding may be weaken due to the incomplete
contact between the conductive housing 14 and the PCB 11, which
incomplete contact may be caused by deformation of the PCB 11
during installation of the PCB 11.
[0028] As shown in FIGS. 1, 2, and 6, in the present disclosure,
the conductive adhesive layer 13 may include a third conductive
foam gasket 135 and a third conductive silicon gel 136 that are
attached with each other. Wherein the third conductive foam gasket
135 is adhered to grounded wireframe 12, and the third conductive
silicon gel 136 is adhered to conductive housing 14. In the
embodiments, the closed structure of Faraday's cage is formed by
one side of third conductive foam gasket 135 being bonded to the
third conductive silicon gel 136, the other side of the third
conductive foam gasket 135 being bonded to the grounded wireframe
12, and the other side, which is departed from the side bonded to
the third conductive foam gasket 135, of the third conductive
silicon gel 136 being bonded to the conductive housing 14. Also, by
using the conductive foam gasket having the properties of good
conductive and elasticity, the minor gaps between the conductive
housing 14 and the PCB 11 existed after electrical connection may
be filled effectively, such that the conductive housing 14 and the
PCB 11 may contact completely with each other, so as to solve the
problem that the shielding may be weaken due to the incomplete
contact between the conductive housing 14 and the PCB 11, which
incomplete contact may be caused by deformation of the PCB 11
during installation of the PCB 11.
[0029] Furthermore, according to a second aspect of the present
disclosure, there is provided an electronic device, comprising a
housing and at least one circuit protection structure installed
within the housing, the circuit protection structure being the
circuit protection structure according to any one of the
above-mentioned embodiments. In particular, the circuit protection
structure may include: a printed circuit board PCB 11, a grounded
wireframe 12, a conductive housing 14, and a conductive adhesive
layer 13 disposed between the grounded wireframe 12 and the
conductive housing 14 for electrical connection between the
grounded wireframe 12 and the conductive housing 14. Wherein the
PCB 11 has thereon a circuit unit 111 and a grounded wireframe 12
surrounding a periphery of the circuit unit 111. Preferably, the
conductive adhesive layer 13 overlaps with the orthographic
projection of the grounded wireframe 12 projecting on the PCB 11,
i.e., the conductive adhesive layer overlaps with the grounded
wireframe. In the embodiments, the conductive adhesive layer 13
uses the same material and structure as that used in the conductive
adhesive layer 13 of the above-mentioned circuit protection unit
111, which will not be repeated here.
[0030] FIG. 7 is an illustrative explosive view showing the
structure 800 of the circuit protection structure according to
another embodiment of the present disclosure. The structure 800 may
be a part of a smartphone that includes a printed circuit board
(PCB) motherboard 810. The PCB motherboard 810 includes circuit
units mounted thereon. For example, a first plurality of circuit
units include a mobile processor 821 and memory 822 connected to
the mobile processor 821. A first grounded wireframe 814 surrounds
the first periphery of the first plurality of circuit units 821 and
822. The structure 800 further include a middle frame 850 connected
to the PCB motherboard 810. The middle frame 850 may include a
conductive housing 854 at least partially covering the PCB
motherboard, where the conductive housing includes a cavity to
accommodate the first plurality of circuit units 821 and 822. The
shape of the circuit units and conductive housing are for
illustration only and do not limit the claim scope. The conductive
housing 854 may include a heat dissipation unit 855 inside the
conductive housing 854, where the heat dissipation unit 855 is
configured to at least partially touch the mobile processor 821 and
dissipate heat generated from the mobile processor 821.
[0031] The structure 800 may include a conductive adhesive layer as
shown in FIGS. 3-6. The conductive adhesive layer may be disposed
between the grounded wireframe and the conductive housing, where
the conductive adhesive layer is configured to provide an
electrical connection between the grounded wireframe and the
conductive housing.
[0032] The conductive adhesive layer may include a first conductive
foam gasket, where opposite sides of the first conductive foam
gasket are respectively adhered to the conductive housing and the
grounded wireframe. The PCB motherboard 810 may further include a
second plurality of circuit units 826 and a second grounded
wireframe 816 surrounding a second periphery of the second
plurality of circuit units 826. The first grounded wireframe 814
and the second grounded wireframe 816 may share at least a portion
of a straight common grounded wireframe 830. The middle frame 850
includes a second conductive housing 856 configured to cover the
second plurality of circuit units 826 on the PCB motherboard 810.
The middle frame 850 includes a third conductive housing 852
configured to cover the third plurality of circuit units 824
surrounded by the third grounded wireframe 812.
[0033] The circuit unit in the present disclosure is protected by
forming a structure of Faraday's cage by means of the combination
of the conductive housing, the conductive adhesive layer, and the
grounded wireframe, for the purpose of shielding electromagnetic
radiation so as to eliminate or reduce the electromagnetic
radiative interference on the circuit unit, without increasing
weight and size of the product caused by additional shielding
conductive cover, and thus improving competitiveness of the
product.
[0034] Other embodiments of the invention will be apparent to those
skilled in the art from consideration of the specification and
practice of the invention disclosed here. This application is
intended to cover any variations, uses, or adaptations of the
invention following the general principles thereof and including
such departures from the present disclosure as come within known or
customary practice in the art. It is intended that the
specification and embodiments be considered as exemplary only, with
a true scope and spirit of the invention being indicated by the
following claims.
[0035] It will be appreciated that the present invention is not
limited to the exact structure that has been described above and
illustrated in the accompanying drawings, and that various
modifications and changes can be made without departing from the
scope thereof. It is intended that the scope of the invention
should only be limited by the appended claims.
* * * * *