U.S. patent application number 15/043800 was filed with the patent office on 2016-11-17 for three dimensional substrate for hearing assistance devices.
The applicant listed for this patent is Starkey Laboratories, Inc.. Invention is credited to Michael Helgeson, Beau Jay Polinske, Jeffrey Paul Solum, David Tourtelotte.
Application Number | 20160337767 15/043800 |
Document ID | / |
Family ID | 42060920 |
Filed Date | 2016-11-17 |
United States Patent
Application |
20160337767 |
Kind Code |
A1 |
Helgeson; Michael ; et
al. |
November 17, 2016 |
THREE DIMENSIONAL SUBSTRATE FOR HEARING ASSISTANCE DEVICES
Abstract
A hearing assistance device for a user comprising a housing, a
three dimensional electronic substrate disposed in the housing, the
substrate adapted to conform to a battery of the hearing assistance
device and hearing assistance electronics mounted to the
substrate.
Inventors: |
Helgeson; Michael; (New
Richmond, WI) ; Solum; Jeffrey Paul; (Greenwood,
MN) ; Tourtelotte; David; (Eden Prairie, MN) ;
Polinske; Beau Jay; (Minneapolis, MN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Starkey Laboratories, Inc. |
Eden Prairie |
MN |
US |
|
|
Family ID: |
42060920 |
Appl. No.: |
15/043800 |
Filed: |
February 15, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14287334 |
May 27, 2014 |
9264826 |
|
|
15043800 |
|
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|
|
12340591 |
Dec 19, 2008 |
8737658 |
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14287334 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H04R 2225/61 20130101;
H05K 1/189 20130101; H04R 25/602 20130101; H04R 25/65 20130101;
H04R 25/60 20130101; H04R 2225/025 20130101; H04R 25/604 20130101;
H04R 2225/023 20130101; H04R 25/652 20130101; H05K 2201/056
20130101; H04R 25/658 20130101; H04R 2225/021 20130101; H04R 25/554
20130101; H04R 25/654 20130101; H04R 2225/77 20130101; H05K
2201/10037 20130101 |
International
Class: |
H04R 25/00 20060101
H04R025/00 |
Claims
1. A hearing assistance device for a user, device comprising: a
housing; a battery disposed in the housing; a substrate disposed in
the housing, the substrate adapted to conform around the battery;
and hearing assistance electronics mounted to the substrate.
2. The device of claim 1, wherein the substrate structurally forms
a battery compartment.
3. The device of claim 2, further comprising an antenna connected
to the hearing assistance electronics.
4. The device of claim 2, further comprising an antenna integrated
with the substrate.
5. The device of claim 2, further comprising a moisture resistant
seal for preventing moisture ingress into the housing.
6. The device of claim 1, further comprising a battery compartment,
and wherein the substrate includes electrical contacts adapted to
mechanically contact the battery in the battery compartment.
7. The device of claim 6, further comprising an antenna connected
to the hearing assistance electronics.
8. The device of claim 6, further comprising an antenna integrated
with the substrate.
9. The device of claim 6, further comprising a moisture resistant
seal for preventing moisture ingress into the housing.
10. The device of claim 1, further comprising a battery compartment
and including battery contacts coupled to the battery compartment,
wherein the substrate is adapted to electrically connect with the
battery contacts.
11. The device of claim 10, further comprising an antenna connected
to the hearing assistance electronics.
12. The device of claim 10, further comprising an antenna
integrated with the substrate.
13. The device of claim 10, further comprising a moisture resistant
seal for preventing moisture ingress into the housing.
14. The device of claim 1, wherein the housing is a behind-the-ear
housing.
15. The device of claim 1 wherein the housing is an in-the-ear
housing.
16. The device of claim 1, wherein the housing is an in-the-canal
housing.
17. The device of claim 1, wherein the housing is a
receiver-in-the-canal housing
18. The device of claim 1, wherein the substrate is adapted to be
folded to conform to the battery compartment.
19. The device of claim 1, further comprising a microphone
electrically connected to the substrate.
20. The device of claim 1, further comprising a speaker
electrically connected to the substrate.
Description
PRIORITY APPLICATION
[0001] This application is a continuation of and clams the benefit
of priority to U.S. patent application Ser. No. 12/340,591, filed
Dec. 19, 2008, now issued as U.S. Pat. No. 8,737,658, which
application is incorporated herein by reference in its
entirety.
FIELD
[0002] The present subject matter relates to hearing assistance
devices and more particularly to three dimensional substrates for
hearing assistance devices.
BACKGROUND
[0003] Hearing assistance device manufacturers, including hearing
aid manufacturers, have adopted thick film hybrid technologies that
build up layers of flat substrates with semiconductor die and
passive electronic components attached to each substrate using
either surface mount, flip-chip, or wire-bond technologies that
interconnect the various die. Conductors such as wires or flex
circuits are attached to pads on the hybrid module after the hybrid
module is assembled and tested. The conductors connect various
electro-mechanical, electro-acoustical and electro-chemical devices
to the active electronics within the hybrid. Connection points may
be provided for a battery, receiver/speaker, switch, volume
control, microphones, programming interface, external audio
interface and wireless electronics including an antenna. Recent
advances, such as the addition of wireless technology, have
stressed designers' ability to accommodate additional advances
using expanded hybrid circuits because of size limitations within a
device housing. Growing the hybrid to add features, functions and
new interfaces, increases the overall size and complexity of a
hearing instrument. Expanding the current hybrid may not be a
viable option since the hybrid circuit is made up of finite layers
of rectangular plains. The larger, complex circuits compete with
most manufacturer's goal of small and easy to use hearing
assistance devices.
SUMMARY
[0004] The above-mentioned problems and others not expressly
discussed herein are addressed by the present subject matter and
will be understood by reading and studying this specification. The
present subject matter relates to a hearing assistance device for a
user comprising a housing, a substrate disposed in the housing, the
substrate adapted to conform around a battery of the hearing
assistance device, and hearing assistance electronics mounted to
the substrate. Various embodiments include, but are not limited to,
embodiments where the substrate is adapted to structurally receive
the battery, embodiments where the substrate is adapted to conform
around a battery compartment, and embodiments where the substrate
is adapted to connect to contacts integral to a battery
compartment. Various designs include, but are not limited to,
subtrates with integral antennae. The embodiments include a variety
of hearing assistance device applications and housings, such as an
in-the-canal hearing aid, an in-the-ear hearing aid, a
completely-in-the-canal hearing aid, a behind-the-ear hearing aid,
and a receiver-in-the-canal hearing aid.
[0005] This Summary is an overview of some of the teachings of the
present application and not intended to be an exclusive or
exhaustive treatment of the present subject matter. Further details
about the present subject matter are found in the detailed
description and appended claims. The scope of the present invention
is defined by the appended claims and their legal equivalents.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 shows a three dimensional (3D) substrate and hearing
assistance electronics according to one embodiment of the present
subject matter.
[0007] FIG. 2 shows a 3D substrate according to one embodiment of
the present subject matter.
[0008] FIG. 3 shows a hearing assistance device with a 3D substrate
according to one embodiment of the present subject matter.
[0009] FIGS. 4A-C show various views of a partially assembled 3D
substrate according to one embodiment of the present subject
matter.
[0010] FIG. 5 shows an assembled 3D substrate installed in a
hearing aid faceplate according to one embodiment of the present
subject matter.
DETAILED DESCRIPTION
[0011] The following detailed description of the present subject
matter relates to the accompanying drawings which show, by way of
illustration, specific aspects and embodiments in which the present
subject matter may be practiced. These embodiments are described in
sufficient detail to enable those skilled in the art to practice
the present subject matter. References to "an", "one", or "various"
embodiments in this disclosure are not necessarily to the same
embodiment, and such references contemplate more than one
embodiment. The following detailed description is, therefore, not
to be taken in a limiting sense, and the scope is defined only by
the appended claims, along with the full scope of legal equivalents
to which such claims are entitled.
[0012] In various embodiments, the 3D substrate defines a battery
compartment for a hearing assistance device and provides structural
rigidity to support a battery or other power source, such as a
super capacitor for example. In some embodiments, the 3D substrate
is formed from a flexible substrate with contacts which is wrapped
around a battery compartment (for example, a battery drawer
assembly designed to mechanically hold the battery). In such
designs, the contacts can be arranged for direct connection to the
battery or other power source. In some embodiments, the battery
compartment includes battery contacts which are rigidly mounted to
the compartment. In such designs, the 3D substrate wraps around the
battery compartment and makes contact with the battery contacts of
the battery compartment. In some embodiments, a gasket is used to
form a water resistant or moisture resistant seal for the battery
compartment. Other seals, including, but not limited to, glues and
rubber or polymer seals may be employed to form water resistant or
moisture resistant seals without departing from the scope of the
present subject matter. The 3D substrate can be used with a variety
of hearing assistance device housings including, but not limited
to, behind-the-ear, in-the-ear, on-the-ear, in-the-canal and
completely-in-the-canal housings, as well as housings used for
receiver-in-the-canal and cochlear implant applications. Other
variations are possible without departing from the scope of the
present subject matter.
[0013] FIG. 1 shows a three dimensional (3D) substrate 100 and
hearing assistance electronics 101 according to one embodiment of
the present subject matter. The 3D substrate includes contours that
form internal housing surfaces of a hearing assistance device. The
illustrated embodiment shows a 3D substrate 100 that conforms to a
battery for a hearing assistance device. The 3D substrate 100
provides surfaces for mounting electronics 101 in areas, such as
around a battery, where mounting a flat, thick film substrate and
attached electronics are not possible. Examples of electronics
mounted to the 3D substrate include, but are not limited to, active
electronics, passive electronics, digital electronics, analog
electronics or combinations thereof.
[0014] In various embodiments, a standard 3D substrate is used for
custom, physically fitted hearing assistance devices. The 3D shape
of the substrate is developed from digital imaging data of multiple
custom hearing assistance devices such that a standard 3D substrate
takes into account extreme space restrictions of a population of
custom, physically fitted hearing assistance devices. Although the
standard 3D substrate may not accommodate every custom, physically
fitted hearing assistance device, it reduces the custom electronic
assembly of at least a portion of the demand, thus reducing cost
and, in turn, increasing access to custom fitted devices.
[0015] FIG. 2 shows a 3D substrate 210 according to one embodiment
of the present subject matter. The 3D substrate 210 includes
integrated conductive elements 211 for connecting electronic
components 212 to the substrate and interconnecting the electronic
components. The integrated conductive elements provide, among other
things, interconnection of components, isolation of circuits, and
shielding and grounding planes to improve performance. The
integrated conductive elements 211 include, but not limited to,
traces, mounting pads and wire bonding pads. The conductive
elements 211 are integrated with the substrate using methods
including printing and plating. Other methods of integrating
conductive elements with the 3D substrate are possible without
departing from the scope of the present subject matter. In various
embodiments, the substrate includes areas for mounting and
connecting other electro-mechanical, electro-chemical and accessory
devices including, but not limited to, receivers, wiring harnesses
for remote receivers such as a receiver for wearing in an ear
canal, microphones, switches, interface connectors, antennas,
battery contacts or combinations thereof.
[0016] Electronic components of the hearing assistance device are
mounted to and distributed about the 3D substrate. The technology
allows more efficient use of the interior space of the hearing
assistance device. In various embodiments, a 3D substrate provides
mounting surfaces and interconnections for multiple features of a
hearing assistance device. Upon assembly, only the electronics
supporting the features ordered for that device are mounted and
connected. In some embodiments, the 3D substrate only provides
mounting areas for limited features. In some embodiments, allowing
only limited features provides additional volume within the housing
of the hearing assistance device to provide other features or
expand existing features. For example, a 3D substrate may not
provide space for wireless electronics, but accommodates additional
memory. In some embodiments, the 3D substrate is used with flexible
circuit technology. For example, a flexible circuit substrate 213
is used to mount and interconnect electronics 212, such as an ASIC
die. The flexible circuit 213 is then mounted and connected to the
3D substrate 210 for interconnection to other hearing assistance
electronics 212.
[0017] In various embodiments, the hearing assistance device
includes a 3D substrate and wireless communication electronics. An
antenna for transmitting, receiving or transmitting and receiving
data with the wireless electronics is integrated with the 3D
substrate. In some embodiments, the antenna is integrated along a
perimeter area of the substrate or where there is sufficient room.
In some embodiments, the integrated antenna follows the contours of
the 3D substrate. In some embodiments, the antenna is inserted in a
groove on a faceplate mounting surface to provide mounting
stability and rigidity to the 3D folded substrate.
[0018] FIG. 3 shows a hearing assistance device with a 3D substrate
according to one embodiment of the present subject matter. The
hearing assistance device 320 includes a shell 321, faceplate 322,
3D substrate 323 and a battery door assembly 324, The 3D substrate
323 defines a battery well 325 and an area for mounting a
microphone 326 and providing access to a microphone port 327 in the
battery door assembly 324. The 3D substrate 323 includes hearing
assistance electronics 328 mounted to the 3D substrate 323. A
microphone 326 is mounted to the substrate 323 and electrically
connected to the hearing assistance electronics 328. Conductive
elements, including traces and bonding pads, are integrated with
the 3D substrate 323 to interconnect the hearing electronics 328
and the microphone 326. In various embodiments, the 3D substrate
includes integrated battery contacts for connecting a battery to
the hearing assistance electronics.
[0019] During assembly, the 3D substrate 323 extends into the
hearing assistance device shell 321 through an opening in the
faceplate 322. In various embodiments, the substrate 323 includes a
lip 329 that attaches to and seals the opening in the faceplate
322. The faceplate 322 is attached to the hearing assistance device
shell 321. In some embodiments, the lip 329 provides a watertight
seal for a waterproof hearing assistance device 320. In various
embodiments, the 3D substrate is rigid. In some embodiments, a
gasket is used to form a water resistant or moisture resistant seal
for the battery compartment. Other seals, including, but not
limited to, glues and rubber or polymer seals may be employed to
form water resistant or moisture resistant seals without departing
from the scope of the present subject matter.
[0020] In the illustrated embodiment, a speaker 330 is connected to
the 3D substrate 323. The speaker is positioned at or near a
speaker opening 331 in the shell 321 to play sounds to a user's
ear. In some embodiments, the speaker 330, or receiver in the case
of a hearing aid, is mounted and electrically connected to the 3D
substrate 323 and the hearing assistance electronics 328. In
various embodiments, a programming port is electrically connected
to the hearing electronics mounted on the 3D substrate. In some
embodiments, the programming port is mounted to the 3D substrate.
It is understood that other electronic components mounted to and/or
connected to the 3D substrate are possible without departing from
the present subject matter. Examples of other electronic components
include, but are not limited to, switches, visual indicators,
volume controls, mode selectors or combinations thereof. The 3D
substrate can be used with a variety of hearing assistance device
housings including, but not limited to, behind-the-ear, in-the-ear,
on-the-ear, in-the-canal and completely-in-the-canal housings, as
well as housings used for receiver-in-the-canal and cochlear
implant applications.
[0021] FIGS. 4A-C show various views of a partially assembled 3D
substrate 440 according to one embodiment of the present subject
matter. FIG. 4A shows a plan view of the component or exterior side
of the 3D substrate. FIG. 4C shows the interior side of the 3D
substrate. FIG. 4B shows a side view of the substantially flat
partially assembled 3D substrate. The 3D substrate includes various
electrical components 442 assembled to a foldable substrate 441 and
form at least a portion of the hearing assistance electronics for a
hearing assistance device. The electronic components 442 include
both active and passive components interconnected using conductive
traces integrated with the foldable substrate 441. Upon further
assembly, the substrate 441 is folded into a 3-dimensional shape.
Various slots 443 and tabs 444 are engaged to add structural
integrity to the 3D substrate 440 and to maintain the folded shape.
The 3D substrate includes various contact areas for connecting to
other hearing assistance device components including but not
limited to, microphones 445, speaker 446, telecoil 447, battery
448, an external programmer interface 449, controls 451, 452 such
as switches and dials or combinations thereof. Methods of
connecting components to the contact areas of the substrate
include, but are not limited to, solder, compression connections,
direct contact and combinations thereof. It is understood that
other methods for connecting components to the contact areas of the
substrate are possible without departing from the scope of the
present subject matter. In various embodiments, the substrate
includes an antenna 450 for wireless communications. In one
embodiment, the antenna 450 is integrated along a perimeter area of
the substrate.
[0022] In various embodiments, the substrate 441 is made of a
flexible material including, but not limited to, Liquid Crystal
polymer (LCP), polyphtalamide (PPA), Teflon, thin plated plastic or
combinations thereof. In some embodiments, the substrate is in a
rigid 3D form using plated plastic or ceramic. In various
embodiments, the substrate is fabricated in an flat, arrayed format
using traditional injection molding processes. After the arrayed
parts are molded, conductive traces are integrated with the
substrate. In one embodiment, forming the conductive traces
includes metalizing the parts with a conductive layer, such as
copper, applied to one or more of the substrate surfaces. The
desired conductive pattern is then laser cut into the
metallization. A chemical process is used to etch away undesired
metalized regions. Desired metalized areas are plated. Plating
materials include, but are not limited to, nickel, gold or a
combination thereof. The arrays are separated into individual
parts. Electronics are assembled onto the individual parts and the
parts are tested. Having the substrate in a flat configuration, as
opposed to a 3D form, allows for more efficient assembly of the
electronics to the substrate and also simplifies subsequent
testing. In various embodiments, one or more electronic components
may be added and tested before the arrayed parts are separated. It
is understood that other materials and processes for forming and
assembling the substrate are possible without departing from the
scope of the present subject matter.
[0023] FIG. 5 shows an assembled 3D substrate 570 installed in a
hearing aid faceplate 571 according to one embodiment of the
present subject matter. The 3D substrate 570 is folded to define a
battery cavity within an opening in the hearing aid faceplate 571.
The shape of the folded substrate is retained using mated slots and
tabs 572. The substrate includes hearing assistance electronics 573
distributed about at least the exterior of the defined battery
cavity in areas normally not conducive to placement of electronics.
The 3D substrate includes contact pads 574 for connecting to a
microphone 575 inserted through the opening in the hearing aid
faceplate 571. In various embodiments, the 3D substrate includes
contact pads for electrically connecting other electronic
components to the hearing assistance electronics including, but not
limited to, a speaker, wiring harnesses, switches, visual
indicators, volume controls, mode selectors or combinations
thereof. The 3D substrate includes contact pads 576 for
electrically connecting a battery 577 with the hearing aid
electronics 573 using direct contact. In various embodiments, the
3D substrate 570 includes wireless electronics for wireless RF or
inductive communications. The wireless electronics connect to an
antenna 578 integrated with the 3D substrate. The antenna 578 is
inserted in a groove on the faceplate mounting surface to provide
mounting stability and rigidity to the 3D folded substrate. In some
embodiments, the flex antenna loop floats so that it fills the
inside shape of the shell and can maximize aperture using
variations in the shape of each shell. In various embodiments, the
antenna includes conductive traces integrated with the faceplate
and connected to the wireless electronics of the 3D substrate.
[0024] The 3D substrate can be used with a variety of hearing
assistance device housings including, but not limited to,
behind-the-ear, in-the-ear, on-the-ear, in-the-canal and
completely-in-the-canal housings, as well as housings used for
receiver-in-the-canal and cochlear implant applications. Use of a
3D substrate provides opportunities to make more efficient use of
space inside of a hearing assistance device. In some examples, use
of a 3D substrate takes advantage of traditionally unusable space
within a hearing assistance device housing for additional
electronics that in turn can provide increased processing power,
additional features, additional memory or combinations thereof.
[0025] This application is intended to cover adaptations and
variations of the present subject matter. It is to be understood
that the above description is intended to be illustrative, and not
restrictive. The scope of the present subject matter should be
determined with reference to the appended claim, along with the
full scope of legal equivalents to which the claims are
entitled.
* * * * *