U.S. patent application number 15/099712 was filed with the patent office on 2016-11-03 for display structure and manufacturing method of display device.
This patent application is currently assigned to EverDisplay Optonics (Shanghai) Limited. The applicant listed for this patent is EverDisplay Optonics (Shanghai) Limited. Invention is credited to Pinghung CHEN, Yiming CHEN, CHIENLIN WU.
Application Number | 20160322603 15/099712 |
Document ID | / |
Family ID | 56008466 |
Filed Date | 2016-11-03 |
United States Patent
Application |
20160322603 |
Kind Code |
A1 |
WU; CHIENLIN ; et
al. |
November 3, 2016 |
DISPLAY STRUCTURE AND MANUFACTURING METHOD OF DISPLAY DEVICE
Abstract
The invention provides a display structure and manufacturing
method of a display device, and relates to the field of display
device technology. By forming a complex encapsulation film with the
function of buffering and water-and-oxygen barrier on a display
module directly, and attaching the cover on the complex
encapsulation film, so as to ensure the sealing effect of the
display module, and to efficiently prevent the display screen from
breaking caused by the stress concentration generated by impact of
external forces, thus the probability of breaking of display screen
can be reduced effectively, and the structural strength of the
display device as a whole is greatly improved.
Inventors: |
WU; CHIENLIN; (Shanghai,
CN) ; CHEN; Yiming; (Shanghai, CN) ; CHEN;
Pinghung; (Shanghai, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
EverDisplay Optonics (Shanghai) Limited |
Shanghai |
|
CN |
|
|
Assignee: |
EverDisplay Optonics (Shanghai)
Limited
Shanghai
CN
|
Family ID: |
56008466 |
Appl. No.: |
15/099712 |
Filed: |
April 15, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62154866 |
Apr 30, 2015 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/323 20130101;
H01L 27/3281 20130101; H01L 51/5237 20130101; H01L 2251/301
20130101; H01L 51/5262 20130101; H01L 51/0096 20130101; H01L 51/524
20130101; H01L 51/5253 20130101; H01L 51/56 20130101; H01L 2251/558
20130101; H01L 27/3244 20130101; H01L 2227/323 20130101; H01L
51/0035 20130101; H01L 2251/303 20130101; H01L 51/0034 20130101;
H01L 27/3262 20130101; H01L 27/3246 20130101; H01L 51/004 20130101;
H01L 29/78672 20130101; H01L 51/5256 20130101 |
International
Class: |
H01L 51/52 20060101
H01L051/52; H01L 51/00 20060101 H01L051/00; H01L 51/56 20060101
H01L051/56; H01L 27/32 20060101 H01L027/32 |
Claims
1. A display structure, comprising: a rigid substrate, having a
driving circuit therein; a display module disposed on the rigid
substrate and connected to the driving circuit to be able to be
driven by the driving circuit; a complex encapsulation film, fully
covering the display module on the rigid substrate to seal the
display module, wherein the complex encapsulation film comprises a
combination of organic and inorganic layers; and a cover, attached
on the complex encapsulation film.
2. The display structure of claim 1, further comprising an optical
film disposed between the cover and the complex encapsulation film,
such that the cover is attached with a portion of top surface of
the complex encapsulation film through the optical film, wherein
the portion of top surface of the complex encapsulation film is
substantially parallel to the cover or the rigid substrate.
3. The display structure of claim 2, wherein the cover comprises a
touch panel and a cover glass, and the touch panel is stacked with
the cover glass, and the optical film is attached on the touch
panel.
4. The display structure of claim 1, wherein the rigid substrate is
a glass based substrate.
5. The display structure of claim 1, wherein, the display module
has a light emitting surface configured to emit light, and a
backlight surface opposite to the light emitting surface; and the
backlight surface of the display module is attached on surface of
the rigid substrate, and the complex encapsulation film covers the
light emitting surface of the display module.
6. The display structure of claim 1, wherein the combined organic
and inorganic layers of the complex encapsulation film are all made
of transparent materiel.
7. The display structure of claim 6, wherein in the complex
encapsulation film comprises a water-and-oxygen barrier layer and a
buffering layer, and the water-and-oxygen barrier layer is stacked
with the buffering layer.
8. The display structure of claim 7, wherein the water-and-oxygen
barrier layer and/or the buffering layer are/is composite layer
film.
9. The display structure of claim 7, wherein the water-and-oxygen
barrier layer and/or the buffering layer are/is a single layer
film.
10. A method of manufacturing a display device, comprising:
providing a rigid substrate with a driving circuit formed therein;
forming a display module on the rigid substrate to electronically
connected to the driving circuit; forming a complex encapsulation
film to fully cover the display module to seal the display module
on the rigid substrate; and providing a cover on the complex
encapsulation film; wherein the complex encapsulation film layer
comprises at least a water-and-oxygen barrier layer and a buffering
layer, and the water-and-oxygen barrier layer is stacked with the
buffering layer.
11. The method of claim 10, after the complex encapsulation film
forming step further comprising: forming an optical film on a
portion of surface of the complex encapsulation film, wherein the
portion of surface of the complex encapsulation film is
substantially parallel to the rigid substrate.
12. The method of claim 11, wherein the step of providing the cover
on the complex encapsulation film comprises: providing the cover to
be attached to the optical film, such that the cover is connected
to the complex encapsulation film through the optical film.
13. The method of claim 10, wherein the cover comprises a touch
panel and a cover glass, and the touch panel is stacked with the
cover glass.
14. The method of claim 10, wherein the display module has a light
emitting surface configured to emit light, and a backlight surface
opposite to the light emitting surface; and the backlight surface
of the display module is attached on the surface of the rigid
substrate, and the complex encapsulation film covers the light
emitting surface of the display module.
15. The method of claim 10, wherein the water-and-oxygen barrier
layer and the buffering layer are made of transparent material.
16. The method of claim 15, wherein the water-and-oxygen barrier
layer and/or the buffering layer are/is composite layer film.
17. The method of claim 10, wherein the water-and-oxygen barrier
layer is an organic layer, an inorganic layer or an
organic/inorganic stacking layer.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims priority to and the benefit
of US Provisional Application No. 62/154,866, filed on Apr. 30,
2015, the entire content of which is incorporated herein by
reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to the field of display device
technology, more particularly, to a display structure and
manufacturing method of a display device.
[0004] 2. Description of the Related Art
[0005] The display screen is an important element of the display
device, the structural strength thereof may directly effect how the
entire display device is affected by the external force.
Especially, with respect to the current mobile devices (such as
smart phone, tablet etc.), the display screen thereof functions as
the main interface of users operation, and would directly determine
whether the entire device is able to be operated.
[0006] In the conventional methods of manufacturing display
screens, two glass substrates are configured to fix and encapsulate
display components; since the relative motion of the two glass
substrate is limited when the display screen is suffered from the
external force caused by falling down and so on, while the glass
substrate itself is easy to be broken and has a weak capability to
resist against the external force, therefore the entire
manufactured display screen is easy to be broken due to inner
stress and other factors when operating, even the encapsulation
failure or glass breaking may happen, thus it greatly reduces the
structural strength of the device as a whole.
[0007] FIG. 1 is structure diagram of a conventional display
screen. As shown in FIG. 1, a light emitting component 12 is
configured on a glass substrate 11, and an encapsulation glass 14
is covered on the above-mentioned glass substrate 11 by an
encapsulation material 13, so as to encapsulate the above-mentioned
light emitting component 12 into a sealed cavity. In addition, an
optical film 15, a cover glass 16 and other components are attached
on the above-mentioned encapsulation glass 14 successively. Since
the above-mentioned glass substrate 11 and the encapsulation glass
14 are fixed and attached through the encapsulation material 13,
when the display screen is suffered from the external force caused
by falling down and other motion, the display screen is easy to be
broken (and even crush) due to the aggregating of inner stress,
thus the entire device structure may be damaged.
SUMMARY OF THE INVENTION
[0008] To solve the above-mentioned technical problem, this
invention provides a display structure capable of being used in a
display device, and the display structure comprising:
[0009] a rigid substrate, having a driving circuit therein;
[0010] a display module disposed on the surface of the rigid
substrate and connected to the driving circuit to be able to be
driven by the driving circuit;
[0011] a complex encapsulation film fully covering the display
module on the rigid substrate to seal the display module, wherein
the complex encapsulation film comprises a combination of organic
and inorganic layers; and
[0012] a cover attached on the complex encapsulation film.
[0013] As a preferred embodiment, the display structure further
comprises an optical film disposed between the cover and the
complex encapsulation film, such that the cover is attached with a
portion of top surface of the complex encapsulation film through
the optical film, wherein the portion of top surface of the complex
encapsulation film is substantially parallel to the cover or the
rigid substrate.
[0014] As a preferred embodiment, in the above-mentioned display
structure:
[0015] the cover comprises a touch panel and a cover glass, and the
touch panel is stacked with the cover glass, and the optical film
is attached on the touch panel.
[0016] As a preferred embodiment, in the above-mentioned display
structure:
[0017] the rigid substrate is a glass based substrate.
[0018] As a preferred embodiment, in the above-mentioned display
structure:
[0019] the display module has a light emitting surface configured
to emit light, and a backlight surface opposite to the light
emitting surface; and
[0020] the backlight surface of the display module is attached on
the surface of the rigid substrate, and the complex encapsulation
film covers the light emitting surface of the display module.
[0021] As a preferred embodiment, the combined organic and
inorganic layers of the complex encapsulation film are all made of
transparent materiel.
[0022] As a preferred embodiment, in the above-mentioned complex
encapsulation film comprises a water-and-oxygen barrier layer and a
buffering layer, and the water-and-oxygen barrier layer is stacked
with the buffering layer.
[0023] As a preferred embodiment, in the above-mentioned display
structure:
[0024] the water-and-oxygen barrier layer and/or the buffering
layer are/is composite layer film.
[0025] As a preferred embodiment, in the above-mentioned display
structure:
[0026] the water-and-oxygen barrier layer and/or the buffering
layer are/is single layer film.
[0027] As a preferred embodiment, in the above-mentioned display
structure:
[0028] The invention further provides a manufacturing method of a
display device, capable of manufacturing a display structure of any
of the above-mentioned display structures, which comprising:
[0029] providing a rigid substrate with a driving circuit
therein;
[0030] forming a display module on the rigid substrate,
electronically connected to the driving circuit;
[0031] forming a complex encapsulation film to fully cover an
exposed surface of the display module to seal the display module on
the rigid substratee; and
[0032] providing a cover on the complex encapsulation film;
wherein
[0033] the complex encapsulation film comprises at least a
water-and-oxygen barrier layer and a buffering layer, and the
water-and-oxygen barrier layer is stacked with the buffering
layer.
[0034] As a preferred embodiment, in the above-mentioned
manufacturing method:
[0035] the cover comprises a touch panel and a cover glass, and the
touch panel is stacked with the cover glass.
[0036] As a preferred embodiment, in the above-mentioned
manufacturing method:
[0037] the display module have a light emitting surface configured
to emit light, and a backlight surface opposite to the light
emitting surface; and
[0038] the backlight surface of the display module is attached on
the surface of the rigid substrate, and the complex encapsulation
film covers the light emitting surface of the display module.
[0039] As a preferred embodiment, in the above-mentioned
manufacturing method:
[0040] the water-and-oxygen barrier layer and the buffering layer
are both made of transparent material.
[0041] As a preferred embodiment, in the above-mentioned
manufacturing method:
[0042] the water-and-oxygen barrier layer and/or the buffering
layer are/is composite layer film.
[0043] As a preferred embodiment, in the above-mentioned
manufacturing method:
[0044] the water-and-oxygen barrier layer is an organic layer, an
inorganic layer or an organic/inorganic stacking layer.
[0045] The above technical solution has the following advantages or
beneficial effects:
[0046] The technical solution of this invention is to directly form
an complex encapsulation film with the function of buffering and
water-and-oxygen barrier on a display module; and to attach the
cover on the complex encapsulation film, so as to ensure the
sealing effect of the display module, and to efficiently prevent
the display screen from breaking caused by the stress concentration
generated by impact of external forces; therefore, the probability
of breaking of the display screen can be reduced effectively, and
the structural strength of the display device as a whole is greatly
improved.
BRIEF DESCRIPTIONS OF THE DRAWINGS
[0047] The accompanying drawings, together with the specification,
illustrate exemplary embodiments of the present disclosure, and,
together with the description, serve to explain the principles of
the present invention.
[0048] FIG. 1 is a structural diagram for a general display
screen;
[0049] FIGS. 2 to 6 are procedure diagrams of manufacturing a
display screen of embodiments of the invention.
DETAILED DESCRIPTION
[0050] The present invention will now be described more fully
hereinafter with reference to the accompanying drawings, in which
exemplary embodiments of the invention are shown. This invention
may, however, be embodied in many different forms and should not be
construed as limited to the embodiments set forth herein. Rather,
these embodiments are provided so that this disclosure will be
thorough and complete, and will fully convey the scope of the
invention to those skilled in the art. Like reference numerals
refer to like elements throughout.
[0051] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the invention. As used herein, the singular forms "a", "an" and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises" and/or "comprising," or "includes"
and/or "including" or "has" and/or "having" when used herein,
specify the presence of stated features, regions, integers, steps,
operations, elements, and/or components, but do not preclude the
presence or addition of one or more other features, regions,
integers, steps, operations, elements, components, and/or groups
thereof.
[0052] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
invention belongs. It will be further understood that terms, such
as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and the present
disclosure, and will not be interpreted in an idealized or overly
formal sense unless expressly so defined herein.
[0053] As used herein, "around", "about" or "approximately" shall
generally mean within 20 percent, preferably within 10 percent, and
more preferably within 5 percent of a given value or range.
Numerical quantities given herein are approximate, meaning that the
term "around", "about" or "approximately" can be inferred if not
expressly stated.
[0054] As used herein, the term "plurality" means a number greater
than one.
[0055] Hereinafter, certain exemplary embodiments according to the
present disclosure will be described with reference to the
accompanying drawings.
[0056] This invention provides a display structure and
manufacturing method of a display device, and is mainly to
encapsulate a display module (such as OLED) disposed on a rigid
substrate surface through the technology of Thinning Film
Encapsulation, that is to say, to encapsulate the display module by
forming a complex encapsulation film capable of buffering and
water-and-oxygen barrier, and to form a display structure by
attaching the cover on the complex encapsulation film, so as to
ensure the sealing effect of the display module, and to efficiently
prevent the display screen from breaking, smashing and other
defects caused by the stress concentration generated by impact of
external forces; therefore, the structural strength of the display
device as a whole is greatly improved.
[0057] Hereinafter, certain exemplary embodiments according to the
present disclosure will be described with reference to the
accompanying drawings.
Embodiment 1
[0058] FIGS. 2 to 6 are procedure diagrams of manufacturing a
display screen of embodiments of the invention. As shown in FIGS. 2
to 6, the invention provides a method of manufacturing a display
device, which comprising:
[0059] first, providing a rigid substrate 21, which comprises a
front surface configured to form a display device (the upper
surface shown in FIG. 2) and a back surface (the lower surface
shown in FIG. 2) opposite to the front surface: preferably, a glass
substrate may be selected as the rigid substrate 21; and a driving
circuit used to drive the subsequently formed display module to
emit light, such as circuit components and the relevant structure
etc., is configured on/inside the rigid substrate 21.
[0060] Second, forming a display module 22 on the above-mentioned
front surface of the rigid substrate 21 shown in FIG. 2, and
connecting the display module 22 with the above-mentioned driving
circuit (not shown), so as to use the driving circuit to drive the
display module 22 to work; and the display module 22 has a light
emitting surface configured to emit light, and a backlight surface
opposite to the light emitting surface; in addition, the display
module 22 may be an OLED module or other types of light-emitting
module.
[0061] Third, forming a complex encapsulation film 23 capable of
buffering and water-and-oxygen barrier by thin-film encapsulation
process; namely, the complex encapsulation film 23 is transparent
and fully covers the above-mentioned display module 22 (i.e. the
upper surface and the side wall shown in FIG. 3) to seal the
display module on the rigid substrate, so as to enable the light
emitted from the display module 22 to pass through the complex
encapsulation film 23 and display image; meanwhile, the complex
encapsulation film 23 also covers the exposed front surface of the
rigid substrate 21 adjacent to the display module 22, the complex
encapsulation film 23 fully covers the display module 22 on the
front surface of the rigid substrate 21, so as to seal and
encapsulate the display module 22 together with the above-mentioned
rigid substrate 21, so that the corrosion of the display module 22
caused by external water and oxygen can be prevented efficiently,
and the damage to the display module 22 from the external impact
force can be buffered; forming an optical film 24 on a portion of
surface of the complex encapsulation film 23, wherein the portion
of surface of the complex encapsulation film 23 is substantially
parallel to the rigid substrate 21.
[0062] Preferably, the thickness of the above-mentioned complex
encapsulation film 23 is larger than the thickness of the display
module 22, and the top of the complex encapsulation film 23 is
shown as a horizontal plane by planarization process, so as to
attach the sequent optical film with the cover and other
components.
[0063] Preferably, as shown in FIG. 4, the above-mentioned complex
encapsulation film 23 may comprises a combination of organic and
inorganic layers, and at least includes a water-and-oxygen barrier
layer and a buffering layer, and the water-and-oxygen barrier layer
is stacked with the buffering layer, and each thin film layer can
seal the display module 22 on the front surface of the rigid
substrate 21 separately; it is sure that the complex encapsulation
film 23 may be a single layer structure capable of buffering and
water-and-oxygen barrier, and the specific configuration depends on
the requirements of the practical process.
[0064] As shown in FIG. 4, in the specific manufacturing process,
the procedure of manufacturing a complex encapsulation film 23 with
a combination of organic and inorganic layers, is to form a first
film layer 231 to cover the above-mentioned display module 22 and
the rigid substrate 21, remove the redundant film layer structure,
and then form a second film layer 232 to cover the above-mentioned
first film layer 231 and the exposed surface of rigid substrate 21,
repeat the above-mentioned manufacturing process of film layer
multiple times, so as to form an complex encapsulation film 23 with
a combination of organic and inorganic layers finally (i.e. as
shown in FIG. 4, the display module 23 may comprises a first film
layer 231, a second film layer 232, a third film layer 233, a
fourth film layer 234, a fifth film layer 235 and a sixth film
layer 236; it is sure that the skilled person in the art can add a
new film layer structure or reduce a part of the film layer
structure in accordance with the requirements of process, so as to
make the formed complex encapsulation film 23 capable of buffering
and water-and-oxygen barrier).
[0065] Preferably, the buffering layer and water-and-oxygen barrier
layer of the above-mentioned complex encapsulation film 23 can be
configured as composite film layer; a thin film layer of a single
film layer can also be used; the buffering layer covers the
water-and-oxygen layer and the display module 23, and the buffering
layer and the water-and-oxygen barrier layer may be configured
alternatively, such as the first film layer 231, the third film
layer 233 and the fifth film layer 235 may be buffering layer, and
the second film layer 232, the fourth film layer 234 and the sixth
film layer 236 can be water-and-oxygen barrier layer; to achieve
the best capability of buffering and water-and-oxygen barrier, the
outermost layer (such as the sixth film layer 236) and the
innermost layer (such as the first film layer 231) of the complex
encapsulation film 23 are all configured as buffering layers, so as
to efficiently protect the display module 22 and buffer the maximum
external impact force; meanwhile, the middle film layer(s) (such as
the second layer 232 to the fifth layer 235) is configured to be
water-and-oxygen barrier layer, so as to ensure the sealing
property of the display module 22.
[0066] In the end, continuing the encapsulation process, attaching
the optical film 24 and cover 25 to the top surface of the complex
encapsulation film 23 successively (i.e. the upper surface shown in
Figures), forming the display device structure (shown in FIG. 5) on
the basis of the complex encapsulation film 23 with the single
layer structure (shown in FIG. 3), or forming the display device
structure (shown in FIG. 6) on the basis of the complex
encapsulation film 23 with the combination of organic and inorganic
layers (shown in FIG. 4); the above-mentioned cover 25 may
comprises a touch panel and a cover glass, and the touch panel is
stacked with the cover glass; as the display module 22 may be fully
covered by the complex encapsulation film 23 capable of buffering
and water-and-oxygen barrier, the damage of the external impact
force generated by the encapsulation process to the display module
22 can be efficiently avoided, meanwhile the structural strength of
the encapsulated and manufactured display device as a whole is
improved efficiently.
Embodiment 2
[0067] On the basis of the above-mentioned embodiment 1, as shown
in FIGS. 5 to 6, the invention further provides a display structure
which can be used to form various kinds of display devices, and the
above-mentioned display structure comprising:
[0068] a rigid substrate 21, having a front surface (i.e. the upper
surface shown in FIGS. 5 and 6) for configuring a device and a
lower surface (i.e. the lower surface shown in FIGS. 5 and 6)
opposite to the upper surface; the rigid substrate 21 may be made
of a glass based substrate, and a driving circuit, which is
configured to drive the display module to emit light, may be
configured on/inside the substrate 21.
[0069] A display module 22, disposed on the front surface of the
above-mentioned rigid substrate 21 and partially covering a part of
the front surface of the rigid substrate 21, and connected with the
above-mentioned driving circuit so as to use the driving circuit to
drive the display module 22 to work; the display module 22 has a
light-emitting surface for emitting light (i.e. the upper surface
shown in FIGS. 5 and 6) and a backlight surface (i.e. the lower
surface shown in FIGS. 5 and 6) opposite to the light-emitting
surface; in other word, the above-mentioned backlight surface of
the display module 22 is attached to the front surface of the rigid
substrate 21.
[0070] Preferably, the above-mentioned display module 22 may be an
OLED module, or may be other types of light-emitting module.
[0071] A complex encapsulation film 23, fully covering the
above-mentioned light-emitting surface of the display module 22,
the side wall of the display module 22, and the exposed front
surface of the surface 21 adjacent to the display module 22, so as
to seal the display module 22 on the front surface of the rigid
substrate 21; the complex encapsulation film 23 may have the
barrier properties of water and oxygen and the buffering property,
so as to seal the display module 22 and be able to efficiently
buffer the damage from external impact force to the display module
22; the complex encapsulation film comprises a combination of
organic and inorganic layers.
[0072] Preferably, the complex encapsulation film 23 may be made
from transparent material, so that the light emitted from the
display module 22 can be emitted there-through; meanwhile, the
complex encapsulation film 23 may be a single layer film structure
or a combination of organic and inorganic layers.
[0073] Preferably, if the complex encapsulation film 23 is a
combination of organic and inorganic layers, the complex
encapsulation film 23 may comprises a water-and-oxygen barrier
layer and a buffering layer, and the water-and-oxygen barrier layer
is stacked with the buffering layer, and the water-and-oxygen
barrier layer and/or the buffering layer may be a single layer film
and/or a composite layer film.
[0074] Preferably, each water-and-oxygen barrier layer can seal the
display module 22 individually, meanwhile each buffering layer can
cover the display module 22 on the front surface of the rigid
substrate 21, so as to effectively prevent the display module 22
from the damage caused by external impact force.
[0075] Preferably, the water-and-oxygen barrier layer may be an
organic layer, an inorganic layer or an organic/inorganic stacking
layer.
[0076] A cover 25 is attached on the above-mentioned complex
encapsulation film 23 through the optical film 24; and the cover 25
further comprises a touch panel, a cover glass and so on, and the
touch panel is stacked with the cover glass.
[0077] Preferably, the above-mentioned optical film 24 is attached
on the touch panel and the cover glass successively, so as to
attach the above-mentioned cover 25 onto the complex encapsulation
film 23.
[0078] It is noted that the structure provided by the embodiment
can be manufactured via the method disclosed in embodiment 1,
therefore the manufacturing process, the film layer material, the
relationship between the film layers, and the other technical
features discloses in embodiment 1 can all be applied to the
structure of this embodiment, and is not to be repeated herein.
[0079] In summery, the display structure and manufacturing method
of the display device of the embodiments of the invention is to
utilize the complex encapsulation film formed by thin-film
encapsulation process to encapsulate the display module on the
rigid substrate directly, and the complex encapsulation film is
capable of buffering and water-and-oxygen barrier, so as to ensure
the sealing effect of the display module, and efficiently buffer
the outer impact force in the subsequently encapsulation process,
meanwhile the formed display device structure is able to
efficiently buffer the outer impact force caused by falling,
bumping and so on, so as to greatly reduce the possibility of
screen breaking, screen crashing and other defects caused by stress
concentration generated by impact of external forces, and improves
the structural strength of the display device as a whole to
efficiently improve the performance and yield of manufacturing the
display device.
[0080] The foregoing is only the preferred embodiments of the
invention, not thus limiting embodiments and scope of the
invention, those skilled in the art should be able to realize that
the schemes obtained from the content of specification and figures
of the invention are within the scope of the invention.
* * * * *