U.S. patent application number 14/978471 was filed with the patent office on 2016-11-03 for mask frame assembly for thin layer deposition, method of manufacturing the same, and method of manufacturing display apparatus by using the mask frame assembly.
The applicant listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Sangshin LEE, Kookchol PARK.
Application Number | 20160322571 14/978471 |
Document ID | / |
Family ID | 57205293 |
Filed Date | 2016-11-03 |
United States Patent
Application |
20160322571 |
Kind Code |
A1 |
LEE; Sangshin ; et
al. |
November 3, 2016 |
MASK FRAME ASSEMBLY FOR THIN LAYER DEPOSITION, METHOD OF
MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING DISPLAY
APPARATUS BY USING THE MASK FRAME ASSEMBLY
Abstract
A mask frame assembly through which a deposition material to be
deposited on a substrate passes, the mask frame assembly includes a
frame including an opening, and a mask having first and second ends
in a length direction thereof coupled to the frame, in which the
mask includes a main body part having a first thickness and
including a pattern part, the pattern part including pattern holes
through which the deposition material passes and a support part
having a second thickness greater than the first thickness and
extending away from first and second ends of the main body
part.
Inventors: |
LEE; Sangshin; (Yongin-si,
KR) ; PARK; Kookchol; (Yongin-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin-si |
|
KR |
|
|
Family ID: |
57205293 |
Appl. No.: |
14/978471 |
Filed: |
December 22, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/56 20130101;
H01L 51/0011 20130101; C23C 16/042 20130101 |
International
Class: |
H01L 51/00 20060101
H01L051/00; C23C 16/04 20060101 C23C016/04; H01L 51/56 20060101
H01L051/56 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 28, 2015 |
KR |
10-2015-0059774 |
Claims
1. A mask frame assembly through which a deposition material to be
deposited on a substrate passes, the mask frame assembly
comprising: a frame comprising an opening; and a mask having first
and second ends in a length direction thereof coupled to the frame,
wherein the mask comprises: a main body part having a first
thickness and comprising a pattern part, the pattern part
comprising pattern holes through which the deposition material
passes; and a support part having a second thickness greater than
the first thickness and extending away from first and second ends
of the main body part.
2. The mask frame assembly of claim 1, wherein: at least one first
alignment key is formed at corners of the main body part; at least
one second alignment key is formed at corners of the support part;
and the at least one first alignment key and the at least one
second alignment key are aligned to correspond to each other in the
length direction of the mask.
3. The mask frame assembly of claim 1, further comprising a step
part disposed between the main body part and the support part.
4. The mask frame assembly of claim 3, wherein the step part has a
third thickness that is greater than the first thickness and less
than the second thickness.
5. The mask frame assembly of claim 1, wherein the first thickness
is in a range of about 5 .mu.m to about 20 .mu.m.
6. The mask frame assembly of claim 1, wherein the second thickness
is in a range of about 25 .mu.m to about 100 .mu.m.
7. The mask frame assembly of claim 1, wherein a surface of the
mask facing the substrate is planar.
8. A method of manufacturing a mask frame assembly, the method
comprising: preparing a main body part having a first thickness and
comprising a pattern part, the pattern part comprising pattern
holes through which a deposition material passes; preparing a
support part having a second thickness that is greater than the
first thickness; arranging the support part at both ends of the
main body part; and coupling the main body part and the support
part to each other.
9. The method of claim 8, wherein a width of the main body part
substantially corresponds to a width of the support part.
10. The method of claim 9, wherein: at least one first alignment
key is formed at corners of the main body part; at least one second
alignment key is formed at corners of the support part; and the at
least one first alignment key and the at least one second alignment
key are aligned to correspond to each other in a length direction
of a mask, in arranging the support part at both ends of the main
body part.
11. The method of claim 10, further comprising forming a step part
between the main body part and the support part, wherein: the step
part has a third thickness greater than the first thickness and
less than the second thickness; at least one third alignment key is
formed at corners of the step part; and the at least one third
alignment key is aligned to the at least one first alignment key
and the at least one second alignment key to correspond to each
other in the length direction of the mask.
12. The method of claim 8, further comprising cutting portions of
the support part such that the width of the support part
substantially corresponds to the width of the main body part, after
arranging the support part at both ends of the main body part, when
a width of the support part is greater than a width of the main
body part.
13. The method of claim 12, wherein cutting the portions of the
support part comprises spraying a high-pressure water jet to the
support part.
14. The method of claim 12, wherein cutting the portions of the
support part comprises irradiating a laser to the support part.
15. The method of claim 8, further comprising forming a step part
having a third thickness by half-etching an end portion of the
support part adjacent to the main body part, after coupling the
main body part and the support part to each other, wherein the
third thickness is greater than the first thickness and less than
the second thickness.
16. The method of claim 8, further comprising forming a step part
having a third thickness that is greater than the first thickness
and less than the second thickness, wherein the step part is
arranged between the main body part and the support part, in
arranging the support part at both ends of the main body part.
17. The method of claim 16, wherein the main body part and the
support part are coupled to each other through the step part, in
coupling the main body part and the support part to each other.
18. The method of claim 8, wherein the main body part and the
support part are welded together by irradiating a laser to a
contacting surface between the main body part and the support part,
in coupling the main body part and the support part to each
other.
19. The method of claim 17, wherein the main body part and the
support part are respectively welded to both ends of the step part
by irradiating a laser to a first contacting surface between the
main body part and the step part and a second contacting surface
between the support part and the step part, in coupling the main
body part and the support part to each other.
20. A method of manufacturing a display apparatus that comprises a
substrate, a first electrode, a second electrode facing the first
electrode, and an organic layer disposed between the first
electrode and the second electrode, the method comprising:
depositing the organic layer or the second electrode by using a
mask frame assembly, wherein: the mask frame assembly comprises a
frame and a mask coupled to the frame by coupling first and second
ends of the mask in a length direction of the mask to first and
second ends of the frame; the frame comprises an opening; and the
mask comprises: a main body part having a first thickness and
comprises a pattern part, the pattern part comprising pattern holes
through which a deposition material passes; and a support part
having a second thickness greater than the first thickness and
extending away from first and second ends of the main body part.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority from and the benefit of
Korean Patent Application No. 10-2015-0059774, filed on Apr. 28,
2015, which is hereby incorporated by reference for all purposes as
if fully set forth herein.
BACKGROUND
[0002] 1. Field
[0003] Exemplary embodiments relate to a mask frame assembly, a
method of manufacturing the same, and a method of manufacturing a
display apparatus using the mask frame assembly.
[0004] 2. Discussion of the Background
[0005] In flat panel display apparatuses, an organic light-emitting
display apparatus may generally be a self-luminous display
apparatus. The organic light-emitting display apparatus may be
driven at a low voltage and has a wide viewing angle and high
contrast In addition, the organic light-emitting display apparatus
may have a fast response time, be lightweight, and have a slim
profile. As such, the organic light-emitting display apparatus may
be considered as a next-generation display apparatus.
[0006] Light-emitting devices may be classified into inorganic
light-emitting devices and organic light-emitting devices,
according to materials forming an emission layer. The organic
light-emitting devices have been actively researched recently, due
to their higher luminance and faster response times, as compared to
inorganic light-emitting devices, and their capabilities to
implement full colors.
[0007] Organic layers and/or electrodes of organic light-emitting
display apparatuses may be formed by vacuum deposition. However, as
a resolution of organic light-emitting display apparatuses
increases, a width of an open slit of a mask used in a deposition
process and the distribution of the open slit may be decreased. As
such, to manufacture a high-resolution organic light-emitting
display apparatus, a shadow effect may need to be reduced or
prevented from occurring. Accordingly, a deposition process may be
performed when a substrate and a mask are closely adhered to each
other.
[0008] The above information disclosed in this Background section
is only for enhancement of understanding of the background of the
inventive concept, and, therefore, it may contain information that
does not form the prior art that is already known in this country
to a person of ordinary skill in the art.
SUMMARY
[0009] Exemplary embodiments provide a mask frame assembly, a
method of manufacturing the same, and a method of manufacturing a
display apparatus using the mask frame assembly.
[0010] Additional aspects will be set forth in the detailed
description which follows and, in part, will be apparent from the
description, or may be learned by practice of the inventive
concept.
[0011] An exemplary embodiment discloses a mask frame assembly
through which a deposition material to be deposited on a substrate
passes, the mask frame assembly including a frame including an
opening, and a mask having first and second ends in a length
direction thereof coupled to the frame, in which the mask includes
a main body part having a first thickness and including a pattern
part, the pattern part including pattern holes through which the
deposition material passes, and a support part having a second
thickness greater than the first thickness and extending away from
first and second ends of the main body parts.
[0012] An exemplary embodiment also discloses a method of
manufacturing a mask frame assembly including preparing a main body
part having a first thickness and including a pattern part, the
pattern part including pattern holes through which a deposition
material passes, preparing a support part having a second thickness
that is greater than the first thickness, arranging the support
part at both ends of the main body part, and coupling the main body
part and the support part to each other.
[0013] An exemplary embodiment further discloses a method of
manufacturing a display apparatus that includes a substrate, a
first electrode, a second electrode facing the first electrode, and
an organic layer disposed between the first electrode and the
second electrode, the method including depositing the organic layer
or the second electrode by using a mask frame assembly, in which
the mask frame assembly includes a frame and a mask coupled to the
frame by coupling first and second ends of the mask in a length
direction of the mask to first and second ends of the frame, the
frame includes an opening, and the mask includes a main body part
having a first thickness and includes a pattern part, the pattern
part including pattern holes through which the deposition material
passes, and a support part having a second thickness greater than
the first thickness and extending away from first and second ends
of the main body part.
[0014] The foregoing general description and the following detailed
description are exemplary and explanatory and are intended to
provide further explanation of the claimed subject matter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings, which are included to provide a
further understanding of the inventive concept, and are
incorporated in and constitute a part of this specification,
illustrate exemplary embodiments of the inventive concept, and,
together with the description, serve to explain principles of the
inventive concept.
[0016] FIG. 1 is a schematic exploded view of a mask frame assembly
according to an exemplary embodiment.
[0017] FIG. 2 is a plan view of an upper portion of the mask of
FIG. 1.
[0018] FIG. 3 is a side view of the mask of FIG. 2.
[0019] FIG. 4 is a plan view of a mask according an exemplary
embodiment.
[0020] FIG. 5 is a side view of the mask of FIG. 4,
[0021] FIG. 6 is a flowchart illustrating a method of manufacturing
the mask frame assembly of FIG. 1.
[0022] FIG. 7 is a flowchart illustrating a method of manufacturing
a mask frame assembly of FIG. 4.
[0023] FIG. 8 is a flowchart illustrating a method of manufacturing
the mask frame assembly of FIG. 7.
[0024] FIG. 9 is a view of a display apparatus manufactured by
using the mask frame assembly illustrated in FIG. 1 or FIG. 4.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
[0025] In the following description, for the purposes of
explanation, numerous specific details are set forth in order o
provide a thorough understanding of various exemplary embodiments.
It is apparent, however, that various exemplary embodiments may be
practiced without these specific details or with one or more
equivalent arrangements. In other instances, well-known structures
and devices are shown in block diagram form in order to avoid
unnecessarily obscuring various exemplary embodiments.
[0026] In the accompanying figures, the size and relative sizes of
layers, films, panels, regions, etc., may be exaggerated for
clarity and descriptive purposes. Also, like reference numerals
denote like elements.
[0027] When an element or layer is referred to as being "on,"
"connected to," or "coupled to" another element or layer, it may be
directly on, connected to, or coupled to the other element or layer
or intervening elements or layers may be present. When, however, an
element or layer is referred to as being "directly on," "directly
connected to," or "directly coupled to" another element or layer,
there are no intervening elements or layers present. For the
purposes of this disclosure, "at least one of X, Y, and Z" and "at
least one selected from the group consisting of X, Y, and Z" may be
construed as X only, Y only, Z only, or any combination of two or
more of X, Y, and Z, such as, for instance, XYZ, XYY, YZ, and ZZ.
Like numbers refer to like elements throughout. As used herein, the
term "and/or" includes any and all combinations of one or more of
the associated listed items.
[0028] Although the terms first, second, etc. may be used herein to
describe various elements, components, regions, layers, and/or
sections, these elements, components, regions, layers, and/or
sections should not be limited by these terms. These terms are used
to distinguish one element, component, region, layer, and/or
section from another element, component, region, layer, and/or
section. Thus, a first element, component, region, layer, and/or
section discussed below could be termed a second element,
component, region, layer, and/or section without departing from the
teachings of the present disclosure.
[0029] Spatially relative terms, such as "beneath," "below,"
"lower," "above," "upper," and the like, may be used herein for
descriptive purposes, and, thereby, to describe one element or
feature's relationship to another element(s) or feature(s) as
illustrated in the drawings. Spatially relative terms are intended
to encompass different orientations of an apparatus in use,
operation, and/or manufacture in addition to the orientation
depicted in the drawings. For example, if the apparatus in the
drawings is turned over, elements described as "below" or "beneath"
other elements or features would then be oriented "above" the other
elements or features. Thus, the exemplary term "below" can
encompass both an orientation of above and Furthermore, the
apparatus may be otherwise oriented (e.g., rotated 90 degrees or at
other orientations and, as such, the spatially relative descriptors
used herein interpreted accordingly.
[0030] The terminology used herein is for the purpose of describing
particular embodiments and is not intended to be limiting. As used
herein, the singular forms, "a," "an," and "the" are intended to
include the plural forms as well, unless the context clearly
indicates otherwise. Moreover, the terms "comprises," "comprising,"
"includes," and/or "including," when used in this specification,
specify the presence of stated features, integers, steps,
operations, elements, components, and/or groups thereof but do not
preclude the presence or addition of one or more other features,
integers, steps, operations, elements, components, and/or groups
thereof.
[0031] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
disclosure is a part. Terms, such as those defined in commonly used
dictionaries, should be interpreted as having a meaning that is
consistent with their meaning in the context of the relevant art
and will not be interpreted in an idealized or overly formal sense,
unless expressly so defined herein.
[0032] FIG. 1 is a schematic exploded view of a mask frame assembly
according to an exemplary embodiment. FIG. 2 is a plan view of an
upper portion of the mask of FIG. 1. FIG. 3 is a side view of the
mask of FIG. 2.
[0033] Referring to FIG. 1, a mask frame assembly 10 may include a
frame 100 having an opening 105 and masks 200. Both ends of the
masks 200 are coupled to the frame 100 in a length direction of the
masks 200 (x-axis direction).
[0034] The frame 100 may have a quadrangle shape including the
opening 105 in the middle of the frame 100. The frame includes a
first support part 101 and a second support part 102 disposed apart
from and in parallel to each other in the x-axis direction, and a
third support part 103 and a fourth support part 104 disposed apart
from and in parallel to each other in a y-axis direction.
[0035] The first support part 101 and the second support part 102
may be connected to the third support part 103 and the fourth
support part 104, and form an outer frame of the mask frame
assembly 10. The opening 105 may be formed in various shapes, such
as a circular shape, an oval shape, or a polygonal shape. The frame
100 may be formed of a metal, a synthetic resin, or the like.
[0036] The third support part 103 and the fourth support part 104
may be disposed in parallel to the masks 200. Since the masks 200
extend in the length direction of the third support part 103 and
the fourth support part 104 (the x-axis direction) and are coupled
to the frame 100, the frame 100 may be formed of a material with
high rigidity or having elasticity.
[0037] The masks 200 may have a stick shape, and each mask 200 may
include a main body part 210 and a support part 220. The main body
part 210 may have a first thickness T1 of about 5 .mu.m to about 20
.mu.m (see FIG. 3) and include pattern parts 211 disposed apart
from each other in the length direction of the masks 200, i.e., the
x-axis direction. Each of the patter parts 211 may include pattern
holes 212. During a deposition process, a deposition material
passing through the pattern holes 212 may be deposited on a
substrate (not shown), so as to define a deposition region on the
substrate.
[0038] The masks 200 may be magnetic thin films and include nickel
or nickel alloy. For example, the masks 200 may be formed of
nickel-cobalt alloy, which may be easy to form a micro-pattern
therein and have excellent surface roughness.
[0039] The masks 200 may be formed by etching. More particularly, a
photoresist layer may be formed on a thin film by using a
photoresist to have the same pattern as the pattern holes 212, or a
film having the same pattern as the pattern holes ay be attached to
a thin film, and then the thin film may be etched. The masks 200
may also be manufactured by electro-forming or electroless
plating.
[0040] In FIGS. 1 and 2, the main body part 210 includes five
pattern parts 211 spaced apart from each other and twenty-five
pattern holes formed in each of the pattern parts 211. It is noted
that the number and arrangement of the pattern parts 211, and the
number of the pattern holes 212, may vary. In addition, the pattern
holes 212 are illustrated as a masking pattern having a dot shape,
however, the number, a position, and a shape of the pattern holes
212 may vary without departing from the inventive concept. For
example, the pattern parts 211 may be a masking pattern that are
entirely opened, having a stripe shape, etc. Hereinafter, the main
body part 210 of the mask 200 will be illustrated as including five
pattern parts 211 with twenty-five pattern holes 212 formed in each
pattern parts 211.
[0041] According to an exemplary embodiment, the masks 200 may be
formed as a single large member to cover the entire opening 105 of
the frame 100. Hereinafter, the masks 200 having a stick shape, as
illustrate-d in FIG. 1, will be described in detail.
[0042] The support part 220 may extend outwardly from both ends of
the main body part 210 in the x-axis direction. The support part
220 may have a second thickness T2 of about 25 82 m to 100 .mu.m,
which may be greater than the first thickness T1 of the main body
part 210 (see FIG. 3). The support part 220 may include a welding
part 221 through which the masks 200 may be coupled to the frame
100. Each of the masks 200 may include a pair of welding parts, as
illustrated in FIG. 1, or multiple welding parts to increase
coupling stability between the masks 200 and the frame 100.
[0043] Each of the masks 200 is coupled to the frame 100 via the
support part 220. Referring to FIGS. 1 to 3, an upper surface of
each masks 200 may be formed to be parallel to a substrate, on
which a deposition material is deposited during a deposition
process.
[0044] The masks 200 may be manufactured by using a
photolithography process. A photoresist that has a pattern
corresponding to the pattern holes 212 is coated on a base material
of the masks 200, and exposing and developing processes are
performed thereon, to form the pattern holes 212 through which a
deposition material may pass.
[0045] For a display apparatus with high resolution, a size of each
pattern holes 212 may be formed small in size. As such, the first
thickness T1 of the main body part 210 of each masks 200, where the
pattern holes 212 are formed, may be formed small, so that the
pattern holes 212 may be shaped precisely. When the thickness of
the main body part 210 is less than 20 .mu.m, the masks 200 may be
transformed or damaged while the masks are extended and then welded
to the frame 100, which may degrade the quality of welding.
[0046] According to an exemplary embodiment, the mask frame
assembly 10 may include the mask 200, which includes the support
part 220 having a second thickness T2 that is greater than the
first thickness T1 of the main body part 210. The support part 220
of the mask 200 may be a portion of the mask 200 that is directly
coupled to the frame 100 by welding. As such, in order to display
in high resolution, the first thickness T1 of the main body part
210, where the pattern holes 212 are formed, may be formed small,
and the second thickness T2 of the support part 220, through which
the mask 200 is coupled to the frame 100, may be formed greater
than the first thickness T1 of the main body part 210. Accordingly,
the quality of welding the mask 200 to the frame 100 may be
improved.
[0047] According to an exemplary embodiment, the main body part 210
and the support part 220 of the mask 200 may be independently
formed of different materials and then coupled to each other, by
irradiating a laser on a surface where the main body part 210 and
the support part 220 contact each other.
[0048] At least one first alignment key 230 may be formed in
corners of the main body part 210, and at least one second
alignment key 240 may be formed in corners of the support part 220,
to easily align the main body part 210 with the support part 220 in
the x axis direction. The first alignment key 230 and the second
alignment key 240 may be aligned in the length direction of the
mask 200, i.e., the x-axis direction, to correspond to each other,
and the main body part 210 and the support part 220 may be
precisely aligned to each other by monitoring positions of the
first alignment key 230 and the second alignment key 240.
[0049] Although, in FIGS. 1 and 2, the first alignment key 230 and
the second alignment key 240 are illustrated to be formed on the
upper surface of the mask 200 facing the substrate during a
deposition process, the first alignment key 230 and the second
alignment key 240 may be formed on a surface of the mask 200
contacting the frame 100, which is an opposite surface to the upper
surface of the mask 200. Alternatively, the first and second
alignment keys 230 and 240 may be formed to pass through the
support part 220. As such, shapes and positions of the first
alignment key 230 and the second alignment key 240 may be formed in
various shapes and at any positions, to easily align the main body
part 210 with the support part 220 during a coupling process.
[0050] FIG. 4 is a plan view of a mask according an exemplary
embodiment. FIG. 5 is a side view of the mask of FIG. 4,
[0051] The mask 300 according to an exemplary embodiment may
include a main body part 310, a support part 320, a first alignment
key 330, a second alignment key 340, a step part 350, pattern parts
311, and pattern holes 312. Operations and components of the mask
300 may be substantially the same as those of the mask 200
described with reference to FIGS. 1 to 3, and thus, duplicated
description thereof will be omitted.
[0052] Referring to FIGS. 4 and 5, the step part 350 may have a
third thickness T3, which is greater than a first thickness T1 of
the main body part 310 and less than a second thickness T2 of the
support part 320. The step part 350 may be formed between the main
body part 310 and the support part 320. The step part 350 may
reduce the difference between the thicknesses of the main body part
310 and the support part 320.
[0053] The support part 320 may have the second thickness T2, which
is about 1.25 times to about 20 times greater than the first
thickness T1 of the main body part 310. When the second thickness
T2 of the support part 320 is formed to be about 20 times greater
than the first thickness T1 of the main body part 310, the step
part 350 having the third thickness T3, which may be greater than
the first thickness T1 and less than the second thickness T2, may
be disposed between the main body part 310 and the support part
320, to prevent rigidity degradation of the mask 300 from a large
thickness difference between the main body part 310 and the support
part 320.
[0054] FIG. 6 is a flowchart illustrating a method of manufacturing
the mask frame assembly 10 of FIG. 1. Referring to FIG. 6, the mask
frame assembly 10 according to an exemplary embodiment may be
manufactured as described below.
[0055] First, the main body part 210 having the first thickness T1
and including the pattern parts 211, which include the pattern
holes 212 through which a deposition material passes, is prepared.
(S601). Next, the support part 220 having the second thickness T2
that is greater than the first thickness T1 of the main body part
210 is prepared (S602). The main body part 210 and the support part
220 may be formed to have substantially the same width. Then, the
support parts 220 are respectively arranged at both ends of the
main body part 210 (S603). Next, a laser is irradiated to a surface
where the main body part 210 and the support part 220 contact each
other, to weld the support part 220 to the main body part 210
(S604). As a result, the mask 200 is manufactured, and both ends of
the mask 200 are coupled to the frame 100 to manufacture the mask
frame assembly 10 (S605).
[0056] At least one first alignment key 230 may be formed at
corners of the main body part 210, and at least one second
alignment key 240 may be formed at corners of the support part 220.
The first alignment key 230 and the second alignment key 240 may be
aligned with each other in the length direction of the mask 200 to
correspond to each other, during arranging the support parts at
both ends of the main body part 210 (S603), such that the main body
part 210 and the support part 220 may be welded precisely to each
other, during welding the support part 220 to the main body part
210 (S604).
[0057] The support part 220 may have a width greater than a width
of the main body part 210. In this case, portions of the support
part 220 may be cut off in a cutting process, after the main body
part 210 and the support part 220 are arranged on the frame 100
(S603), so that the width of the main body part 210 substantially
corresponds to the width of the support part 220. The cutting
process of the support part 220 may include a water jet method, in
which a high-pressure water jet is sprayed to the support part 220,
or a general laser cutting method, in which a laser is irradiated
to a surface of the support part 220 that is to be cut.
[0058] FIG. 7 is a flowchart illustrating a method of manufacturing
the mask frame assembly of FIG. 4. FIG. 8 is a flowchart
illustrating a method of manufacturing the mask frame assembly of
FIG. 7. Referring to FIG. 7, the mask 300 illustrated with
reference to FIG. 4 may be manufactured as described below.
[0059] The method of manufacturing the mask 300, including
preparing the main body part 310 having a first thickness T1
(S701), preparing the support part 320 having a second thickness T2
(S702), arranging the main body part 310 and the support part 320
(S703) together, coupling the main body part 310 and the support
part 320 (S704) together, and coupling the mask 300 and the frame
100 (S706) together, are substantially the same as the method of
manufacturing the mask frame assembly 10 illustrated with reference
to FIG. 6, and thus, duplicative descriptions thereof will not be
omitted.
[0060] The mask 300 of FIG. 4 further includes the step part 350,
in comparison to the mask 200 of FIGS. 1 to 3. After the coupling
of the main body part 310 and the support part 320 together (S704),
the step part 350 may be formed by half-etching predetermined
regions of both ends of the support part 320 adjacent to the main
body part 310, such that the third thickness T3 of the step part
may be greater than the first thickness T1 of the main body part
310 and less than the second thickness T2 of the support part 320
(S705).
[0061] Referring to FIG. 8, the step part 350 may be formed as a
separate member independently from the main body part 310 and the
support part 320, instead of half-etching the predetermined regions
of both ends of the support part 320.
[0062] More particularly, the main body part 310 having the first
thickness T1 and the support part 320 having the second thickness
T2 are prepared (S801 and S802). The step part 350 having the third
thickness T3 that is greater than the first thickness Ti and less
than the o second thickness T2 is prepared (S803). Then, when the
support parts 320 are arranged respectively at both ends of the
main body part 310, the step part 350 is arranged therebetween
(S804). The main body part 310, the step part 350, and the support
part 320 are sequentially coupled to each other to manufacture the
mask 300 (S805). Here, a laser may be irradiated to a surface where
the main body part 310 and the step part 350 contact each other,
and a surface where the step part 350 and the support part 320
contact each other, to be coupled with each other.
[0063] At least one third alignment key (not illustrated) may be
formed in corners of the step part 350, in addition to the first
alignment key 330 of the main body part 310 and the second
alignment key 340 of the support part 320, such that the step part
350, the main body part 310, and the support part 320 may be easily
aligned in the x axis direction. The first alignment key 330, the
second alignment key 340, and the third alignment key (not
illustrated) may be aligned in the length direction of the mask
300, to correspond to each other, and the main body part 310, the
support part 320, and the step part 350 may be precisely aligned to
each other by monitoring positions of the first alignment key 330,
the second alignment key 340, and the third alignment key (not
illustrated).
[0064] FIG, 9 illustrates a view of a display apparatus
manufactured by using the mask frame assembly illustrated in FIG. 1
or FIG. 4.
[0065] Referring to FIG. 9, a display apparatus 400 may include a
substrate 410 and a display portion (not shown). The display
apparatus 400 may include a thin-film encapsulation layer E or an
encapsulation substrate (not shown) disposed on an upper portion of
the display portion. The encapsulation substrate may be generally
used in a display apparatus, and thus, detailed descriptions
thereof will be omitted. Hereinafter, the display apparatus 400
including the thin-film encapsulation layer E will be described in
detail.
[0066] The display portion may be formed on the substrate 410. The
display portion may include a thin-film transistor TFT, a
passivation layer 470 formed to cover the thin-film transistor TFT,
and an organic light-emitting device 480 disposed on the
passivation layer 470.
[0067] The substrate 410 may be formed of a glass material.
Alternatively, the substrate 410 may include a plastic material, a
metallic material, such as stainless steel (SUS) or titanium (Ti),
or polyimide (PI). Hereinafter, the substrate 410 formed of a glass
material will be described in detail.
[0068] A buffer layer 420 formed of an organic compound and/or an
organic compound may be further formed on the substrate 410. The
buffer layer 420 may be formed of silicon oxide (SiO.sub.X)
(wherein, X.gtoreq.1) or silicon nitride (SiN.sub.X) (wherein,
X.gtoreq.1).
[0069] An active layer 430 arranged in a predetermined pattern may
be formed on the buffer layer 420, and a gate insulating layer 440
may be disposed on the active layer 430. The active layer 430 may
include a source region 431, a drain region 433, and a channel
region 432 between the source region 431 and the drain region
433.
[0070] The active layer 430 may include various materials. The
active layer 430 may include an inorganic semiconductor material
such as amorphous silicon crystalline silicon. Alternatively, the
active layer 430 may include an oxide semiconductor or an organic
semiconductor material. Hereinafter, the active layer 430 including
amorphous silicon will be described in detail.
[0071] An amorphous silicon layer may be formed on the buffer layer
420, and the amorphous silicon layer may be crystallized to form a
polycrystalline silicon layer. The polycrystalline silicon layer
may then be patterned to form the active layer 430. The source
region 431 and the drain region 433 of the active layer 430 may be
doped with impurities depending on a type of a thin-film transistor
TFT, for example, a driving thin-film transistor (not shown), a
switching thin-film transistor (not shown), or the like.
[0072] A gate electrode 450 corresponding to the active layer 430
and an interlayer insulating layer 460 burying the gate electrode
450 ma be formed on an upper surface of the gate insulating layer
440.
[0073] Contact holes H1 may be formed in the interlayer insulating
layer 460 and the gate insulating layer 440. A source electrode 471
and a drain electrode 472 may be formed on the interlayer
insulating layer 460, so that the source electrode 471 and the
drain electrode 472 respectively contact the source region 431 and
the drain region 433 of the active layer 430 through the contact
holes H1.
[0074] The thin-film transistor TFT may be formed in the above
process, and the passivation layer 470 may be formed on the thin
film transistor TFT. A pixel electrode 481 of the organic
light-emitting device 480 may be formed on the passivation layer
470. The pixel electrode 481 may contact the drain electrode 472 of
the thin-film transistor TFT through a via hole H2 formed in the
passivation layer 470. The passivation layer 470 may include an
inorganic material and/or an organic material and formed as a
monolayer or multiple layers. The passivation layer 470 may be
formed as a planarization layer to make an upper surface thereof
even, regardless of unevenness of a lower layer, or be formed to
have an uneven upper surface along with the unevenness of the lower
layer. The passivation layer 470 may be formed as a transparent
insulating layer to exhibit a resonance effect.
[0075] After forming the pixel electrode 481 on the passivation
layer 470, a pixel-defining layer 490 including an organic material
and/or an inorganic material may be formed, so as to cover the
pixel electrode 481 and the passivation layer 470. A portion of the
pixel electrode 481 may be exposed through the pixel-defining layer
490. An intermediate layer 482 and an opposite electrode 483 may be
formed on at least part of the pixel electrode 481.
[0076] The pixel electrode 481 may serve as an anode electrode and
the opposite electrode 483 may serve as a cathode electrode, or
vice versa. The pixel electrode 481 and the opposite electrode 483
may be insulated from each other by the intermediate layer 482.
Voltages with different polarities may be applied to the
intermediate layer 482, such that an organic emission layer emit
light.
[0077] The intermediate layer 482 may include the organic emission
layer. Alternatively, the intermediate layer 482 may include the
organic emission layer and may further include at least one
selected from a hole injection layer (HIL), a hole transport layer
(HTL), an electron transport layer (ETL), and an electron injection
layer (EIL).
[0078] According to an exemplary embodiment, one unit pixel may
include sub-pixels R, G, and B, in which the sub-pixels R, G, and B
may emit lights of various colors. Alternatively, one unit pixel
may include sub-pixels emitting red, green, blue, and white
light.
[0079] The thin-film encapsulation layer E may include inorganic
layers, or include an inorganic layer and an organic layer. The
organic layer of the thin-film encapsulation layer may include a
polymer, and may be formed as a monolayer or a stack form,
including at least of polyethylene terephthalate, polyimide,
polycarbonate, epoxy, polyethylene and polyacrylate.
Furthermore,the organic layer may be formed of polyacrylate, and in
detail, may include a polymer of a monomer composition including a
diacrylate-group monomer and a triacrylate-group monomer. A
monoacrylate-group monomer may be further included in the monomer
composition. In addition, a photo-initiator, such as thermoplastic
polyolefin (TPO), may be further included in the monomer
composition.
[0080] The inorganic layer of the thin-film encapsulation layer E
may be a monolayer or a stack layer including a metal oxide or a
metal nitride. The inorganic layer may include at least one of
silicon nitride (SiN.sub.X), aluminum oxide (Al.sub.2O.sub.3),
silicon oxide (SiO.sub.2), and titanium oxide (TiO.sub.2). The
uppermost layer of the thin-film encapsulation layer E, which is
exposed to the is outside, may be formed of an inorganic layer to
prevent infiltration of humidity toward the organic light-emitting
device OLED.
[0081] The thin-film encapsulation layer E may include at least one
sandwich structure, in which at least one organic layer is disposed
between at least two inorganic layers, or at least one inorganic
layer is disposed between at least two organic layers.
Alternatively, the thin-film encapsulation layer E may include a
sandwich structure, in which at least one organic layer is disposed
between at least two inorganic layers, and a sandwich structure, in
which at least one inorganic layer is inserted between at least two
organic layers.
[0082] The thin-film encapsulation layer E may include a first
inorganic layer, a first organic layer, a second inorganic layer, a
second organic layer, and a third inorganic layer, sequentially
disposed on an upper surface of the organic light-emitting device
OLED. Alternatively, the thin-film encapsulation layer E may
include a first inorganic layer, a first organic layer, a second
inorganic layer, a second organic layer, a third inorganic layer, a
third organic layer, and a fourth inorganic layer, sequentially
disposed on the upper surface of the organic light-emitting device
OLED.
[0083] A halogenated metal layer including lithium fluoride (LiF)
may be additionally included between the organic light-emitting
device OLED and the first inorganic layer. The halogenated metal
layer may prevent the organic light-emitting device OLED from being
damaged, when the first inorganic layer is formed by using a
sputtering method.
[0084] The first organic layer may be formed to have a smaller area
than the second inorganic layer, and the second inorganic layer may
also be formed to have a smaller area than the third inorganic
layer.
[0085] Thus, in an exemplary embodiment of the present inventive
concept, a portion of a mask through which a deposition material
passes, is formed to have a small thickness, and other portions of
the mask that are coupled to a frame is formed to have a larger
thickness, such that welding the mask to the frame may be performed
stably, so that a display apparatus with high resolution may be
manufactured.
[0086] Although certain exemplary embodiments and implementations
have been described herein, other embodiments and modifications
will be apparent from this description. Accordingly, the inventive
concept is not limited to such exemplary embodiments, but rather to
the broader scope of the presented claims and various obvious
modifications and equivalent arrangements.
* * * * *