U.S. patent application number 14/742721 was filed with the patent office on 2016-09-08 for substrate structure.
The applicant listed for this patent is General Interface Solution Limited, Interface Optoelectronics (ShenZhen) Co., Ltd.. Invention is credited to Shih-Chieh HUANG.
Application Number | 20160262252 14/742721 |
Document ID | / |
Family ID | 53346502 |
Filed Date | 2016-09-08 |
United States Patent
Application |
20160262252 |
Kind Code |
A1 |
HUANG; Shih-Chieh |
September 8, 2016 |
SUBSTRATE STRUCTURE
Abstract
A substrate structure includes a substrate, a buffer layer, and
a protecting layer. The substrate includes a side surface. The
buffer layer is disposed between the side surface of the substrate
and the protecting layer, and the hardness of the protecting layer
is greater than the hardness of the buffer layer.
Inventors: |
HUANG; Shih-Chieh;
(Guangdong, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Interface Optoelectronics (ShenZhen) Co., Ltd.
General Interface Solution Limited |
Shenzhen
Miaoli County |
|
CN
TW |
|
|
Family ID: |
53346502 |
Appl. No.: |
14/742721 |
Filed: |
June 18, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 1/02 20130101; G06F
2203/04103 20130101; H05K 1/0306 20130101; H05K 2201/09154
20130101; H05K 3/28 20130101; H05K 2201/09145 20130101; G06F 3/041
20130101 |
International
Class: |
H05K 1/02 20060101
H05K001/02 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 5, 2015 |
CN |
201510099000.6 |
Claims
1. A substrate structure, comprising: a substrate comprising a top
surface, a bottom surface and a side surface disposed between the
top surface and the bottom surface, and the substrate further
comprising two strengthened layers on the top surface and the
bottom surface of the substrate respectively; a buffer layer; and a
protecting layer, wherein the buffer layer is disposed between the
side surface and the protecting layer, and a hardness of the
protecting layer is greater than a hardness of the buffer
layer.
2. The substrate structure of claim 1, further comprising an inner
protecting layer disposed between the side surface and the buffer
layer, wherein a hardness of the inner protecting layer is greater
than the hardness of the buffer layer.
3. The substrate structure of claim 2, wherein the hardness of the
protecting layer is greater than the hardness of the inner
protecting layer.
4. The substrate structure of claim 1, wherein a thickness of the
protecting layer is in a range from about 10 micrometers to about
100 micrometers.
5. The substrate structure of claim 1, wherein a thickness of the
buffer layer is in a range from about 30 micrometers to about 200
micrometers.
6. The substrate structure of claim 1, wherein the hardness of the
protecting layer is in a range from about 85 Shore D to about 95
Shore D, and the hardness of the buffer layer is in a range from
about 30 Shore D to about 80 Shore D.
7. The substrate structure of claim 1, wherein the substrate is a
one-glass-solution touch screen.
8. The substrate structure of claim 1, wherein the substrate
comprises at least one surface and at least one connective round
surface, the surface is perpendicular to the side surface, and the
connective round surface is disposed between the surface and the
side surface for connecting the surface and the side surface,
wherein the buffer layer covers the connective round surface and
the side surface.
9. The substrate structure of claim 1, wherein the substrate
comprises at least one surface and at least one connective oblique
surface, the surface is perpendicular to the side surface, and the
connective oblique surface is disposed between the surface and the
side surface for connecting the surface and the side surface, and
wherein the buffer layer covers the connective oblique surface and
the side surface, and the protective layer fully covers the buffer
layer.
10. (canceled)
Description
RELATED APPLICATIONS
[0001] This application claims priority to Chinese Application
Serial Number 201510099000.6, filed Mar. 5, 2015, which is herein
incorporated by reference.
BACKGROUND
[0002] 1. Field of Invention
[0003] The present invention relates to a substrate structure.
[0004] 2. Description of Related Art
[0005] In the field of touch panels and display panels, a wide
range of substrates is often designed to carry various elements.
After the substrates are assembled to form relevant actual
products, it is often possible for the actual products to receive
serious damage from being hit on the edges. For example, a fall of
the product may result in a strike upon the edge. Since the edge of
the substrate has a small area to accept the force, a small impact
can still cause a great stress, and therefore it is easy to create
a crack after such a strike. In long term, the crack may become
larger and bring some problems in the practical operation of the
relevant products.
SUMMARY
[0006] The present invention provides a substrate structure
including a buffer layer and a protecting layer. The buffer layer
absorbs the external shock for reducing the external force exerted
on the substrate. The protecting layer protects the shell of the
substrate and the buffer layer from peeling or being damaged due to
the external shock. In this way, when getting hit by the external
force, the substrate can be protected from being destroyed by the
buffer layer and the protecting layer.
[0007] One aspect of the present invention provides a substrate
structure, including a substrate, a buffer layer, and a protecting
layer. The substrate includes a side surface. The buffer layer is
disposed between the side surface and the protecting layer, and the
hardness of the protecting layer is greater than the hardness of
the buffer layer.
[0008] In one or more embodiments of the present invention, the
substrate structure further includes an inner protecting layer
disposed between the side surface and the buffer layer, and a
hardness of the inner protecting layer is greater than the hardness
of the buffer layer.
[0009] In one or more embodiments of the present invention, the
hardness of the protecting layer is greater than the hardness of
the inner protecting layer.
[0010] In one or more embodiments of the present invention, a
thickness of the protecting layer is in a range from about 10
micrometers to about 100 micrometers.
[0011] In one or more embodiments of the present invention, a
thickness of the buffer layer is in a range from about 30
micrometers to about 200 micrometers.
[0012] In one or more embodiments of the present invention, the
hardness of the protecting layer is in a range from about 85 Shore
D to about 95 Shore D, and the hardness of the buffer layer is in a
range from about 30 Shore D to about 80 Shore D.
[0013] In one or more embodiments of the present invention, the
substrate is a one-glass-solution touch screen.
[0014] In one or more embodiments of the present invention, the
substrate includes at least one surface and at least one connective
round surface, the surface is perpendicular to the side surface,
and the connective round surface is disposed between the surface
and the side surface for connecting the surface and the side
surface, in which the buffer layer covers the connective round
surface and the side surface.
[0015] In one or more embodiments of the present invention, the
substrate includes at least one surface and at least one connective
oblique surface, the surface is perpendicular to the side surface,
and the connective oblique surface is disposed between the surface
and the side surface for connecting the surface and the side
surface, in which the buffer layer covers the connective oblique
surface and the side surface, and the protective layer fully covers
the buffer layer.
[0016] In one or more embodiments of the present invention, the
substrate includes two strengthened layers on a top surface and a
bottom surface of the substrate respectively.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The invention can be more fully understood by reading the
following detailed description of the embodiment, with reference
made to the accompanying drawings as follows:
[0018] FIG. 1 is a cross-sectional view of the substrate structure
according to one embodiment of the present invention;
[0019] FIG. 2 is a cross-sectional view of the substrate structure
according to another embodiment of the present invention;
[0020] FIG. 3 is a cross-sectional view of the substrate structure
according to another embodiment of the present invention; and
[0021] FIG. 4 is a cross-sectional view of the substrate structure
according to another embodiment of the present invention.
DETAILED DESCRIPTION
[0022] The following embodiments are disclosed with accompanying
diagrams for detailed description. For illustration clarity, many
details of practice are explained in the following descriptions.
However, it should be understood that these details of practice do
not intend to limit the present invention. That is, these details
of practice are not necessary in parts of embodiments of the
present invention. Furthermore, for simplifying the drawings, some
of the conventional structures and elements are shown with
schematic illustrations.
[0023] FIG. 1 is a cross-sectional view of the substrate structure
100 according to one embodiment of the present invention. The
substrate structure 100 includes a substrate 110, a buffer layer
120, and a protecting layer 130. The substrate 110 includes a side
surface 112. The buffer layer 120 is disposed between the side
surface 112 and the protecting layer 130, and the hardness of the
protecting layer 130 is greater than the hardness of the buffer
layer 120.
[0024] In this embodiment, the substrate 110 includes at least one
surface 114 and at least one connective round surface 116, the
surface 114 is perpendicular to the side surface 112, and the
connective round surface 116 is disposed between the surface 114
and the side surface 112 for connecting the surface 114 and the
side surface 112. The connective round surface 116 can be formed by
plural steps in the processing of the substrate, such as cutting,
computer numerical control (CNC) processing, edge polishing,
hydrofluoric acid etching, re-strengthening, etc. Herein, the size
and curvature of the connective round surface 116 can be designed
in accordance with the requirements of actual situation.
[0025] In one or more embodiments of the present invention, the
substrate 110 can be a touch glass or a thin film transistor (TFT)
glass. Especially, the substrate can be a one-glass-solution (OGS)
touch screen. Through one glass, the OGS touch screen achieves dual
effects simultaneously, which are to protect the glass, and to
sense the touch.
[0026] The substrate structure 100 can optionally include
strengthened layers 150, an electrode layer 140, and a
light-shielding layer 180. The substrate 110 includes a surface 115
disposed opposite the surface 114. By a strengthening process, the
strengthened layers 150 is disposed on the surface 114 and the
surface 115 of the substrate 110 to enhance the hardness of the
substrate 110. In one or more embodiments of the present invention,
the strengthened layers 150 can fully cover the surface 114 and the
surface 115 of the substrate 110, and prevent the surface 114 and
the surface 115 from being exposed.
[0027] After forming the strengthened layers 150, the
light-shielding layer 180 can be formed on one of the strengthened
layers 150. Then, the electrode layer 140 is formed on a side of
the light-shielding layer 180 opposite the substrate 110. It is
noted that neither the electrode layer 140 nor the light-shielding
layer 180 are necessary configurations, and the substrate 110 can
be an ordinary glass without the configuration of electrodes.
[0028] In one or more embodiments of the present invention, the
hardness of the protecting layer 130 is in a range from about 85
Shore D to about 95 Shore D, and the hardness of the buffer layer
120 is in a range from about 30 Shore D to about 80 Shore D. In
addition, the surface 132 of the protecting layer 130 is configured
with a surface hardness greater than a pencil hardness of 3H.
[0029] In the configuration of materials, the materials of the
protecting layer 130 can be epoxy gels, and the materials of the
buffer layer 120 can be acrylic gels. Both the protecting layer 130
and the buffer layer 120 can be formed by applying the material on
the side surface 112 and the connective round surface 116 with the
use of sprays or dispensers. Of course, it is fine to spray plural
substrates at the same time, thereby reaching the purposes of mass
production.
[0030] In one or more embodiments of the present invention, a
thickness of the protecting layer 130 is in a range from about 10
micrometers to about 100 micrometers. A thickness of the buffer
layer 120 is in a range from about 30 micrometers to about 200
micrometers. Though the sum thickness of the protecting layer 130
and the buffer layer 120 is in a range from about 40 micrometers to
about 300 micrometers, ideally, the sum thickness of the protecting
layer 130 and the buffer layer 120 is in a range from about 40
micrometers to about 250 micrometers. It should be understood that,
the diagrams provided by the present invention are only used to
schematically illustrate the concepts of the embodiments of the
present invention. The relative size depicted in the diagrams, such
as thickness, length, etc. should not be used to limit the scope of
the present invention.
[0031] In this embodiment, the buffer layer 120 covers the side
surface 112 and the connective round surface 116, and the
protecting layer 130 fully covers the buffer layer 120 and prevents
the buffer layer 120 from being exposed. In other words, the side
surface 112 and the connective round surface 116 are at least
protected by dual layers, the buffer layer 120 and the protecting
layer 130. The buffer layer 120 is substantially limited between
the protecting layer 130 and the connective round surface 116, and
between the protecting layer 130 and the side surface 112.
[0032] Ideally, the strengthened layers 150 can be connected with
the buffer layer 120 and the protecting layer 130, and therefore a
consecutive strengthened structure is formed on the surface 114,
the side surface 112, and the connective round surface 116 of the
substrate 110. In this way, the substrate 110 is totally surrounded
and wrapped by the strengthened structure. However, it should not
limit the scope of the present invention. The strengthened layers
150 can be disconnected from the buffer layer 120 and the
protecting layer 130.
[0033] In this embodiment, the surface 114, the side surface 112,
and the connective round surface 116 of the substrate 110 are
effective surrounded and protected by the strengthened layers 150,
the buffer layer 120, and the protecting layer 130, and therefore
are prevented from the direct strike.
[0034] Generally, when the substrate 110 is hit, since the side
surface 112 and the connective round surface 116 has a small area
to accept the external shock, damage easily occurs due to huge
pressures. In this embodiment, for the shock on the side surface,
the dual-layer protection of the buffer layer 120 and the
protecting layer 130 can reduce the force impacted on the side
surface 112 and the connective round surface 116.
[0035] To be specific, the surface 132 of the protecting layer 130
with a higher hardness accepts the shock, and disperses the shock
from a dot to an area to distract the intensity. Then, the buffer
layer 120 deforms to absorb the shock from the protecting layer 130
to reduce the intensity of the shock. The final force exerted on
the side surface 112 and the connective round surface 116 has been
distracted and reduced, and therefore the impact force greatly
decreases.
[0036] Herein, since the surface 132 of the protective layer 130
has the higher surface hardness, therefore the surface 132 has an
anti-scratch effect. Also, the protective layer 130 with the high
hardness can protect the buffer layer 120 from being scratched or
peeling and thereto being destroyed due to external collision.
[0037] Though the composite structure of dual layers are introduces
herein, it should not limit the scope of the present invention. In
some embodiment, plural buffer layers 120 and protective layers 130
can be configured in the substrate structure with an adequate stack
sequence, and the substrate structure can also reach the effect of
reducing the impact force.
[0038] FIG. 2 is a cross-sectional view of the substrate structure
100 according to another embodiment of the present invention. This
embodiment is similar to the embodiment of FIG. 1, and the
difference is that: in this embodiment, the substrate structure 100
further includes an inner protecting layer 160 disposed between the
side surface 112 and the buffer layer 120. The hardness of the
protecting layer 130 is greater than or equal to the hardness of
the inner protecting layer 160, and a hardness of the inner
protecting layer 160 is greater than the hardness of the buffer
layer 120.
[0039] In this embodiment, the inner protecting layer 160 covers
the side surface 112 and the connective round surface 116, and the
buffer layer 120 fully covers the inner protecting layer 160,
preventing the inner protecting layer 160 from being exposed. Then,
the protecting layer 130 also fully covers the buffer layer 120,
preventing the buffer layer 120 from being exposed. In other words,
the side surface 112 and the connective round surface 116 are
protected by at least three layers, which are inner protecting
layer 160, buffer layer 120, and the protecting layer 130. The
inner protecting layer 160 is substantially limited between the
buffer layer 120 and the connective round surface 116, and between
the buffer layer 120 and the side surface 112. The buffer layer 120
is substantially limited between the protecting layer 130 and the
inner protecting layer 160.
[0040] In this embodiment, the protecting layer 130 and the inner
protecting layer 160 can be made of the same materials. On the
other hand, the protecting layer 130 and the inner protecting layer
160 can be made of different materials having high hardness, in
which the materials of the protecting layer 130 have high surface
hardness. Ideally, a thickness of the inner protecting layer 160 is
in a range from about 20 micrometers to about 100 micrometers, and
a sum thickness of inner protecting layer 160, the protecting layer
130, and the buffer layer 120 is preferably in a range from about
40 micrometers to about 200 micrometers. Other configurations of
the hardness and thickness of the buffer layer 120 and the
protecting layer 130 of this embodiment are substantially the same
as the embodiment of FIG. 1, and therefore not repeated herein.
[0041] In this embodiment, through the three-layer protection of
the buffer layer 120, the protecting layer 130, and the inner
protecting layer 160, the side surface 112 and the connective round
surface 116 are prevented from being hit directly. To be specific,
the surface 132 of the protecting layer 130 with the higher surface
hardness accepts the shock, and disperses the shock from a dot to
an area to distract the intensity. Next, the buffer layer 120
deforms to absorb the impact to reduce the intensity of the shock.
Then, the inner protecting layer 160 with a higher hardness
disperses the shock. The final force exerted on the side surface
112 and the connective round surface 116 has been distracted,
reduced, and distracted again, and therefore the impact force has
been greatly decreased.
[0042] Herein, since the surface 132 of the protective layer 130
has the higher surface hardness, the surface 132 has an
anti-scratch effect. The protective layer 130 with the high
hardness can protect the buffer layer 120 from peeling and being
destroyed due to external collision, and the inner protective layer
160 with the high hardness can protect the substrate 110 from
peeling and being destroyed due to external collision.
[0043] Other details of this embodiment are substantially the same
as the embodiment of FIG. 1, and thereto not repeated herein.
[0044] FIG. 3 is a cross-sectional view of the substrate structure
100 according to another embodiment of the present invention. This
embodiment is similar to the embodiment of FIG. 1, and the
difference is that: in this embodiment, the substrate 110 includes
a connective oblique surface 118 instead of the connective round
surface 116 (referring to FIG. 1). The connective oblique surface
118 is disposed between the surface 114 and the side surface 112
for connecting the surface 114 and the side surface 112.
[0045] In this embodiment, the buffer layer 120 covers the side
surface 112 and the connective oblique surface 118, and the
protecting layer 130 fully covers the buffer layer 120, preventing
the buffering layer 120 from being exposed. In other words, the
side surface 112 and the connective oblique surface 118 are at
least protected by dual layers, the buffer layer 120 and the
protecting layer 130. The buffer layer 120 is substantially limited
between the protecting layer 130 and the connective oblique surface
118, and between protecting layer 130 and the side surface 112.
[0046] In this embodiment, the connective oblique surface 118 can
be formed by plural steps in the processing of the substrate, such
as cutting, computer numerical control (CNC) processing, etc. The
size and slope of the connective oblique surface 118 can be
designed in accordance with the requirements of actual situation.
Comparing to the connective round surface 116 (referring to FIG.
1), the connective oblique surface 118 can be fabricated without
the steps of polishing and etching, and therefore the steps in the
processing of the substrate can be simplified.
[0047] Furthermore, the configuration of the connective oblique
surface 118 can affect the shapes of the buffer layer 120 and the
protecting layer 130. As illustrated previously, the protecting
layer 130 and the buffer layer 120 can be formed on the side
surface 112 and the connective round surface 116 by spraying or
dispensing, and therefore the shapes of the buffer layer 120 and
the protecting layer 130 are influenced by the connective oblique
surface 118 and the side surface 112. In this way, how the buffer
layer 120 and the protecting layer 130 accept the impact force is
influenced. For example, the tilt angle of the connective oblique
surface 118 can be designed to be larger, and the buffer layer 120
and the protecting layer 130 at the connective oblique surface 118
can be designed to be thicker, thereby enhancing the ability of the
connective oblique surface 118 to withstand the shock.
[0048] Other details of this embodiment are substantially the same
as the embodiment of FIG. 1, and thereto not repeated herein.
[0049] FIG. 4 is a cross-sectional view of the substrate structure
100 according to another embodiment of the present invention. This
embodiment is similar to the embodiment of FIG. 1, and the
difference is that: in this embodiment, the surface 114 and the
side surface 112 are connected directly, and the substrate 110 does
not include the connective round surface 116 (referring to FIG.
1).
[0050] In this embodiment, the buffer layer 120 covers the side
surface 112, and the protecting layer 130 fully covers the buffer
layer 120, preventing the buffer layer 120 from being exposed. In
other words, the side surface 112 is at least protected by dual
layers, the buffer layer 120 and the protecting layer 130. The
buffer layer 120 is substantially limited between the protecting
layer 130 and the side surface 112.
[0051] Comparing to the previous embodiments, since the substrate
structure 100 of this embodiment is configured with neither the
connective round surface 116 (referring to FIG. 1) nor the
connective oblique surface 118 (referring to FIG. 3), the plural
steps in the fabrication process can be simplified. Moreover, since
the buffer layer 120 and the protecting layer 130 are only attached
to the side surface 112, the buffer layer 120 and the protecting
layer 130 can be designed to include a uniform thickness and shape.
Comparing to the previous embodiments, the configuration of this
embodiment can minify the volume occupied by the buffer layer 120
and the protecting layer 130, and therefore the substrate structure
100 can be applied to panel structures with limited space.
[0052] Other details of this embodiment are substantially the same
as the embodiment of FIG. 1, and thereto not repeated herein.
[0053] The present invention provides a substrate structure
including a buffer layer and a protecting layer. The buffer layer
absorbs the external shock for reducing the external force exerted
on the substrate. The protecting layer protects the shell of the
substrate and the buffer layer from peeling or being damaged due to
the external shock. In this way, when getting hit by an external
force, the substrate can be protected from being destroyed by the
buffer layer and the protecting layer.
[0054] Although the present invention has been disclosed in the
above embodiments, but it should not be used to limit the present
invention. It will be apparent to those skilled in the art that
various modifications and variations can be made to the present
invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the scope
of present invention is defined in the following claims.
* * * * *