U.S. patent application number 15/014927 was filed with the patent office on 2016-08-11 for fixing device and heater used in fixing device.
The applicant listed for this patent is CANON KABUSHIKI KAISHA. Invention is credited to Kenji Takagi.
Application Number | 20160234882 15/014927 |
Document ID | / |
Family ID | 56567305 |
Filed Date | 2016-08-11 |
United States Patent
Application |
20160234882 |
Kind Code |
A1 |
Takagi; Kenji |
August 11, 2016 |
FIXING DEVICE AND HEATER USED IN FIXING DEVICE
Abstract
A heater used in a fixing device includes a substrate, a first
heat generation resistor, a second heat generation resistor with a
gap to the first heat generation resistor in the longitudinal
direction, a first conductive pattern, a second conductive pattern,
and the third conductive pattern, wherein a width of at least one
of the first and second heat generation resistors in the transverse
direction in a first area adjacent to the gap is smaller than the
width in a second area, arranged adjacent to the first area,
farther from the gap in the longitudinal direction than the first
area.
Inventors: |
Takagi; Kenji; (Odawara-shi,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CANON KABUSHIKI KAISHA |
Tokyo |
|
JP |
|
|
Family ID: |
56567305 |
Appl. No.: |
15/014927 |
Filed: |
February 3, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G03G 15/2053 20130101;
H05B 2203/02 20130101; H05B 3/22 20130101; G03G 2215/2035 20130101;
G03G 15/2042 20130101 |
International
Class: |
H05B 3/22 20060101
H05B003/22 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 6, 2015 |
JP |
2015-022676 |
Claims
1. A heater used in a fixing device, comprising: an elongated
substrate; a first heat generation resistor formed on the
substrate; a second heat generation resistor formed on the
substrate next to the first heat generation resistor in a
longitudinal direction of the substrate, the first heat generation
and the second heat generation being arranged with a gap
therebetween in the longitudinal direction; a first conductive
pattern connected, along the longitudinal direction, to each one
end of the first and second heat generation resistors in a
transverse direction of the substrate; a second conductive pattern
formed in an area of the substrate on a side opposite to the first
conductive pattern in the transverse direction across the first
heat generation resistor and connected to the first heat generation
resistor along the longitudinal direction, the second conductive
pattern not being connected to the second heat generation resistor;
and a third conductive pattern formed in an area of the substrate
on a side opposite to the first conductive pattern in the
transverse direction across the second heat generation resistor and
connected to the second heat generation resistor along the
longitudinal direction, the third conductive pattern not being
connected to the second conductive pattern or the first heat
generation resistor, wherein a width of at least one of the first
and second heat generation resistors in the transverse direction in
a first area adjacent to the gap is smaller than the width in a
second area, arranged adjacent to the first area, farther from the
gap in the longitudinal direction than the first area.
2. The heater according to claim 1, wherein the first heat
generation resistor includes an area in which the width of the
first heat generation resistor in the transverse direction
increases from an end toward a center portion of the substrate in
the longitudinal direction.
3. The heater according to claim 1, wherein the first heat
generation resistor is arranged in a center portion of the
substrate in the longitudinal direction, and the second heat
generation resistor is arranged on an end portion of the substrate
in the longitudinal direction.
4. The heater according to claim 1, wherein the first conductive
pattern is arranged on an end portion of the substrate in the
transverse direction.
5. The heater according to claim 1, wherein the first and second
heat generation resistors have a positive temperature
characteristic.
6. A heater used in a fixing device, comprising: a elongated
substrate; a center conductive pattern formed on a center portion
of the substrate in a longitudinal direction; an end conductive
pattern formed on an end of the substrate in the longitudinal
direction, the center conductive pattern and the end conductive
pattern being arranged with a gap therebetween in the longitudinal
direction; two center heat generation resistors formed to sandwich
the center conductive pattern therebetween in a transverse
direction of the substrate, each of the center heat generation
resistors being connected to the center conductive pattern along
the longitudinal direction; two end heat generation resistors
formed to sandwich the end conductive pattern therebetween in the
transverse direction, each of the end heat generation resistors
being connected to the end conductive pattern along the
longitudinal direction; and common conductive patterns connected to
both the center heat generation resistors and the end heat
generation resistors at one end and the other end of the substrate
in the transverse direction, respectively, each of the common
conductive patterns being connected to the center heat generation
resistors and the end heat generation resistors along the
longitudinal direction, wherein a width of at least one of the
center heat generation resistors and the end heat generation
resistors in the transverse direction in a first area adjacent to
the gap is smaller than the width in a second area, arranged
adjacent to the first area, farther from the gap in the
longitudinal direction than the first area.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a fixing device included in
an image forming apparatus such as an electrophotographic copying
machine and printer, and a heater used in the fixing device.
[0003] 2. Description of the Related Art
[0004] As a fixing device included in an image forming apparatus
such as a copying machine and a laser beam printer, one using a
film is known. Such a fixing device typically includes a
cylindrical film, a plate-shaped heater which makes contact with an
inner surface of the film, and a pressure member which forms a nip
portion with the heater via the film. The fixing device performs
fixing processing at the nip portion while conveying and heating a
recording material having a toner image formed thereon to fix the
toner image to the recording material.
[0005] The fixing device uses a film having a low heat capacity.
The fixing device thus has an advantage of a short warm-up time,
which contributes to reduced first print out time (FPOT) of the
image forming apparatus. However, if small-sized sheets are
continuously printed, a phenomenon in which an area of the nip
portion where the recording materials do not pass rises in
temperature, or a temperature rise of a non-sheet passing are, is
likely to occur.
[0006] As a technique for suppressing the temperature rise of the
non-sheet passing area, there is known a heater including a
substrate on which a heat generation resistor having a positive
resistance-temperature characteristic (positive temperature
coefficient (PTC) characteristic) is formed. If a current is
applied to a heat generation resistor having a high PTC
characteristic in a conveyance direction of a recording material,
the resistance of a sheet non-passing portion that rises in
temperature increases. This can reduce the current flowing through
the heat generation resistor and then reduce the amount of heat
generation in the sheet non-passing portion, thereby suppressing
the temperature rise of the non-sheet passing area.
[0007] The heat generation resistor is made of a paste material.
Since paste materials having a high PTC characteristic have low
sheet resistance, the amount of heat generation needed for the
heater used in the fixing device may be difficult to obtain.
Japanese Patent Application Laid-Open No. 2012-189808 discusses a
heater that includes a plurality of longitudinally-divided
conductive patterns connected to a heat generation resistor along a
longitudinal direction. Such a heater can provide a total
resistance needed for the heater used in the fixing device while
using a paste material having a low sheet resistance.
[0008] However, the heater discussed in Japanese Patent Application
Laid-Open No. 2012-189808 has a problem that the amount of heat
generation drops locally in an area corresponding to a gap between
the conductive patterns of the heater, possibly causing temperature
variations of the heater in the longitudinal direction.
SUMMARY OF THE INVENTION
[0009] According to an aspect of the present invention, a heater
used in a fixing device includes an elongated substrate, a first
heat generation resistor formed on the substrate, and a second heat
generation resistor formed on the substrate, next to the first heat
generation resistor in a longitudinal direction of the substrate,
the first heat generation and the second heat generation being
arranged with a gap therebetween in the longitudinal direction. The
heater further includes a first conductive pattern connected, along
the longitudinal direction, to each one end of the first and second
heat generation resistors in a transverse direction of the
substrate, a second conductive pattern formed in an area of the
substrate on a side opposite to the first conductive pattern in the
transverse direction across the first heat generation resistor and
connected to the first heat generation resistor along the
longitudinal direction, the second conductive pattern not being
connected to the second heat generation resistor, and a third
conductive pattern formed in an area of the substrate on a side
opposite to the first conductive pattern in the transverse
direction across the second heat generation resistor and connected
to the second heat generation resistor along the longitudinal
direction, the third conductive pattern not being connected to the
second conductive pattern or the first heat generation resistor,
wherein a width of at least one of the first and second heat
generation resistors in the transverse direction in a first area
adjacent to the gap is smaller than the width in a second area,
arranged adjacent to the first area, farther from the gap in the
longitudinal direction than the first area.
[0010] Further features of the present invention will become
apparent from the following description of exemplary embodiments
with reference to the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a schematic sectional view of an image forming
apparatus according to a first exemplary embodiment.
[0012] FIG. 2 is a schematic sectional view of a fixing device
according to the first exemplary embodiment.
[0013] FIG. 3 is a schematic diagram illustrating a cross section
of a heater according to the first exemplary embodiment.
[0014] FIGS. 4A, 4B, and 4C are diagrams illustrating a schematic
configuration of the heater according to the first exemplary
embodiment.
[0015] FIGS. 5A, 5B, and 5C are diagrams illustrating a schematic
configuration of a heater according to a comparative example of the
first exemplary embodiment.
[0016] FIG. 6 is a diagram illustrating a schematic configuration
of a heater according to a first modification of the first
exemplary embodiment.
[0017] FIGS. 7A and 7B are diagrams illustrating a schematic
configuration of a heater according to a second modification of the
first exemplary embodiment.
[0018] FIGS. 8A, 8B, and 8C are diagrams illustrating a schematic
configuration of a heater according to a second exemplary
embodiment.
[0019] FIGS. 9A, 9B, and 9C are diagrams illustrating a schematic
configuration of a heater according to a third exemplary
embodiment.
[0020] FIGS. 10A and 10B are diagrams illustrating a schematic
configuration of a heater according to a modification of the third
exemplary embodiment.
[0021] FIGS. 11A, 11B, and 11C are diagrams illustrating a
schematic configuration of a heater according to a fourth exemplary
embodiment.
[0022] FIG. 12 is a flowchart illustrating switching of heat
generation segments of the heater according to the fourth exemplary
embodiment.
[0023] FIGS. 13A and 13B are enlarged views of the heater according
to the fourth exemplary embodiment.
[0024] FIG. 14 is an enlarged view of a heater according to a
comparative example of the fourth exemplary embodiment.
DESCRIPTION OF THE EMBODIMENTS
[0025] Various exemplary embodiments, features, and aspects of the
invention will be described in detail below with reference to the
drawings.
[0026] In the following description, a first exemplary embodiment
will be described. FIG. 1 is a schematic configuration diagram
illustrating a laser beam printer (hereinafter, referred to as a
printer) as an image forming apparatus according to the first
exemplary embodiment. A photosensitive drum 1 is driven to rotate
in the direction of the arrow. A surface of the photosensitive drum
1 is uniformly charged by a charging roller 2 serving as a charging
device. The photosensitive drum 1 is then subjected to scanning
exposure by a laser scanner 3 using a laser beam L which is ON/OFF
controlled according to image information, whereby an electrostatic
latent image is formed. A developing device 4 develops a toner
image on the photosensitive drum 1 by causing toner to adhere to
the electrostatic latent image. Subsequently, at a transfer nip
portion, which is a pressure contact portion between a transfer
roller 5 and the photosensitive drum 1, the toner image formed on
the photosensitive drum 1 is transferred to a recording material P,
i.e., a material to be heated, conveyed from a sheet feed cassette
6 at a predetermined timing. At that time, a top sensor 8 detects a
leading edge of the recording material P conveyed by a conveyance
roller 9 to adjust timing so that an image forming position of the
toner image on the photosensitive drum 1 coincides with a write
start position on the leading edge of the recording material P. The
recording material P conveyed to the transfer nip portion at a
predetermined timing is pinched and conveyed by the photosensitive
drum 1 and the transfer roller 5 with a constant pressure. The
recording material P to which the toner image is transferred is
conveyed to a fixing device 7. The fixing device 7 heats and fixes
the toner image to the recording material P. The recording material
P is then discharged onto a discharge tray.
[0027] Next, the fixing device 7 according to the present exemplary
embodiment will be described. FIG. 2 is a sectional view of the
fixing device 7. The fixing device 7 includes a cylindrical film
11, a heater 12 which makes contact with an inner surface of the
film 11, and a pressure roller 20 which forms a fixing nip portion
N with the heater 12 via the film 11.
[0028] The film 11 serving as a fixing member includes a base layer
and a release layer which is formed on the external surface of the
base layer. The base layer is made of a heat resistant resin such
as polyimide, polyamide-imide, and polyetheretherketone (PEEK). In
the present exemplary embodiment, a 65-.mu.m-thick heat resistant
resin of polyimide is used. The release layer is formed with a
coating of any one or a mixture of heat resistant resins having
favorable releasability. Examples include fluorine resins such as
polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), and
fluorinated ethylene propylene (FEP), and silicone resins. In the
present exemplary embodiment, as the release layer, a
15-.mu.m-thick coating of fluorine resin of PFA is used. The film
11 of the present exemplary embodiment has a longitudinal length of
240 mm, which is intended to allow passing of a sheet of up to
Letter size (216 mm in width), and an outer diameter of 24 mm.
[0029] A film guide 13 serves as a guide member when the film 11
rotates. The film 11 is loosely fitted to the film guide 13. In the
present exemplary embodiment, the film guide 13 also has a role of
supporting a surface of the heater 12, opposite to the surface
where the heater 12 makes contact with the film 11. The film guide
13 is made of a heat resistant resin such as a liquid crystal
polymer, phenol resin, polyphenylene sulfide (PPS), and PEEK.
[0030] The pressure roller 20 serving as a pressure member includes
a core 21 and an elastic layer 22 which is formed on the external
surface of the core 21. The core 21 is made of a material such as
steel use stainless (SUS), steel use machinability (SUM), and
aluminum (Al). The elastic layer 22 is made of a heat resistant
rubber such as silicon rubber and fluorine-containing rubber, or a
foamed article of silicone rubber. A release layer made of a
material such as PFA, PTFE, and FEP may be formed on the external
surface of the elastic layer 22. The pressure roller 20 of the
present exemplary embodiment has an outer diameter of 25 mm. The
elastic layer 22 is made of a 3.5-mm-thick silicone rubber. The
elastic layer 22 has a longitudinal length of 230 mm. The film 11,
the heater 12, and the film guide 13 are unitized into a film unit
10.
[0031] The pressure roller 20 is pressed by a pressure means (not
illustrated) toward the foregoing film unit 10 at both longitudinal
ends. Driving force is transmitted from a driving source (not
illustrated) to a gear (not illustrated) arranged on a longitudinal
end of the core 21, whereby the pressure roller 20 is rotated. The
film 11 is rotated by frictional force received from the pressure
roller 20 at the fixing nip portion N in accordance with the
rotation of the pressure roller 20.
[0032] Next, control of the heater 12 will be described with
reference to FIG. 2. A main thermistor 14a serving as a temperature
detection member is arranged at a center portion of the heater 12
in the longitudinal direction. Power supplied to the heater 12 is
controlled so that the detected temperature of the main thermistor
14a coincides with a target temperature. Details of the power
control on the heater 12 will be described. An output signal of the
main thermistor 14a is input to a control unit 52. The control unit
52 includes a central processing unit (CPU) and memories such as a
read-only memory (ROM) and a random access memory (RAM). Based on
the input signal, the control unit 52 controls a current flowing
through the heater 12 via a triac 50. The current flowing through
the heater 12 is controlled by turning on/off an
alternating-current (AC) voltage by the triac 50. A sub thermistor
14b is arranged on the surface of the heater 12, opposite to the
surface where the heater 12 makes contact with the film 11. The sub
thermistor 14b is arranged at a position corresponding to an end of
an A4-sized recording material P when the recording material P is
longitudinally conveyed. The sub thermistor 14b has a role of
monitoring a temperature rise of a non-sheet passing area.
[0033] A configuration of the heater 12 according to the present
exemplary embodiment will be described with reference to FIGS. 3
and 4A. FIG. 3 is a cross-sectional view of the heater 12. FIG. 4A
is a schematic diagram illustrating the surface of the heater 12 on
the side where the heater 12 does not make contact with the inner
surface of the film 11 in the present exemplary embodiment. The
heater 12 includes a long, narrow substrate 100 and a heat
generation resistor 500a formed along a longitudinal direction of
the substrate 100. The heat generation resistor 500a is divided in
two, i.e., a first heat generation resistor 500a-1 and a second
heat generation resistor 500a-2 with a gap portion D therebetween
in the longitudinal direction. Conductive patterns 501a (501a-1,
501a-2, and 501a-3) connected to the heat generation resistor 500a
along the longitudinal direction are formed on the substrate 100,
with the heat generation resistor 500a therebetween in a transverse
direction.
[0034] The conductive pattern 501a-1 (second conductive pattern) is
connected, along the longitudinal direction, to one transverse end
of the heat generation resistor 500a-1. The conductive pattern
501a-2 (third conductive pattern) is connected, along the
longitudinal direction, to one transverse end of the heat
generation resistor 500a-2 on the same side as the conductive
pattern 501a-1 is, with a gap D from the conductive pattern 501a-1.
The conductive pattern 501a-3 (first conductive pattern) is
connected, along the longitudinal direction, to transverse ends of
the heat generation resistor 500a-1 and the heat generation
resistor 500a-2 on the side opposite from where the conductive
pattern 501a-1 is. The conductive pattern 501a-3 is arranged to
overlap with both the conductive patterns 501a-1 and 501a-2 in the
longitudinal direction. In other words, the heat generation
resistors 500a-1 and 500a-2 are electrically connected in series by
the conductive patterns 501a.
[0035] If a voltage is applied between electrical contact portions
502a and 502b, a current flows through each of the heat generation
resistors 500a-1 and 500a-2 in the transverse direction (conveyance
direction of the recording material P) and the heat generation
resistors 500a-1 and 500a-2 generate heat. In the present exemplary
embodiment, the gap portion D has a width of 0.7 mm.
[0036] The substrate 100 is made of a ceramic material such as
Al.sub.2O.sub.3 (aluminum oxide) and AlN (aluminum nitride). In the
present exemplary embodiment, the substrate 100 is made of
Al.sub.2O.sub.3 with a size of 10 mm in width, 270 mm in
longitudinal length, and 1 mm in thickness. The heat generation
resistor 500a is made of components including a conducting agent
mainly containing RuO.sub.2 (ruthenium oxide), and glass. Other
than the heat generation resistor 500a, the conductive patterns
501a and the electrical contact portions 502a and 502b are formed
on the substrate 100 by screen printing with a thickness of
approximately 10 .mu.m. The heat generation resistor 500a used in
the present exemplary embodiment has a sheet resistance of
500.OMEGA./.quadrature. and a PTC characteristic (positive
resistance-temperature characteristic) with a temperature
coefficient of resistance (hereinafter, referred to as TCR) of 1400
ppm/.degree. C. The value of the sheet resistance is for a
thickness of 10 .mu.m.
[0037] A protective layer 101 illustrated in FIG. 3 is formed on
the surface of the heater 12 where the heater 12 makes contact with
the film 11. The protective layer 101 reduces wear of the film 11.
A protective layer 102 is formed on the heat generation resistor
500a of the heater 12. The protective layers 101 and 102 each are a
65-.mu.m-thick glass coating layer for ensuring wear resistance and
pressure resistance.
[0038] Next, a characteristic configuration of the heater 12
according to the present exemplary embodiment will be described.
The heat generation resistors 500a-1 and 500a-2 each have a width
V1 in the transverse direction in each of areas H1 (first areas)
adjacent to the gap portion D. The width V1 is configured to be
smaller than a width V2 in each of areas H2 (second areas) that is
farther from the gap portion D than the area H1 is, and adjacent to
the area H1. In the present exemplary embodiment, V1 is 0.86 mm, V2
is 1.0 mm, and a longitudinal length of the area H1 is 2.5 mm.
[0039] An effect of the present exemplary embodiment will be
described with reference to FIGS. 4B and 4C. FIG. 4B illustrates a
longitudinal distribution of the amount of heat generation by the
heater 12 used in the present exemplary embodiment. The gap portion
D where the heat generation resistor 500a is not arranged does not
generate heat. The amount of heat generation per unit length of the
area H1 (high heat generation portion G) in each of the heat
generation resistors 500a-1 and 500a-2 is 30% greater than that of
the area H2. The reason is that the areas H1 have a resistance
lower than that of the area H2 in the transverse direction.
[0040] FIG. 4C illustrates a measurement result of the surface
temperature of the film 11 in the longitudinal direction when the
fixing device 7 using the heater 12 according to the present
exemplary embodiment is left to reach room temperature and then
activated to perform fixing processing on one sheet of recording
material P. The longitudinal temperature distribution on the
surface of the film 11 is almost uniform. The average temperature
in an area not corresponding to the gap portion D was 160.degree.
C. The amount of temperature drop .DELTA.T1 in an area
corresponding to the gap portion D was 3.3.degree. C. The amount of
temperature drop .DELTA.T1 in the area of the film 11 corresponding
to the gap portion D is suppressed to be small because the heat in
the areas H1 where the amount of heat generation is large flows
into the gap portion D so that the temperature drop is suppressed
in the gap portion D. In other words, temperature variation of the
heater 12 in the longitudinal direction is suppressed by the heater
12 itself. Fixability in the case of using the heater 12 according
to the present exemplary embodiment was evaluated by printing a
whole-surface solid image, i.e., an image such that toner is
applied to an entire surface of a recording material P. The image
printed on a recording material P was evaluated under an evaluation
condition in which the fixing device 7 is activated immediately
after having been left to reach room temperature. As a result, the
occurrence of a fixing failure was not observed in any area of the
recording material P, including the gap portion D.
[0041] A configuration of a heater according to a comparative
example of the present exemplary embodiment will be described with
reference to FIGS. 5A to 5C. A difference between the configuration
of the heater of the comparative example and that of the heater 12
of the present exemplary embodiment is that, as illustrated in FIG.
5A, the heat generation resistor 500a of the heater according to
the comparative example has the same width V2 in the area H1 as in
the area H2, and the high heat generation portions G are not
formed. FIG. 5B illustrates a longitudinal distribution of the
amount of heat generation of the heater according to the
comparative example. The area of the gap portion D where there is
no heat generation resistor does not generate heat. In the areas
other than the gap portion D, the amount of heat generation is
uniform in the longitudinal direction. FIG. 5C illustrates a
distribution of the surface temperature of the film 11 in the case
of using the heater of the comparative example, measured under the
same condition as with the heater 12 according to the present
exemplary embodiment. The temperature distribution on the surface
of the film 11 drops significantly in the position corresponding to
the gap portion D. The amount of temperature drop .DELTA.T1 of the
film 11 in the position corresponding to the gap portion D with
respect to the average temperature value of 160.degree. C. in the
areas other than the gap portion D was 12.3.degree. C. When a
whole-surface solid image was printed, a fixing failure of
approximately 2.0 mm in width occurred in the area corresponding to
the gap portion D.
[0042] As described above, the heater 12 according to the present
exemplary embodiment includes a plurality of longitudinally-divided
conductive patterns connected to a heat generation resistor, which
enables suppression of temperature variation in the longitudinal
direction.
[0043] Next, first and second modifications of the present
exemplary embodiment will be described with reference to FIG. 6 and
FIGS. 7A and 7B, respectively. FIG. 6 illustrates the first
modification. As compared to the configuration of the present
exemplary embodiment, the first modification has a configuration in
such a manner that the heat generation resistor is intermittently
arranged in a thinned-out pattern and the resulting heat generation
resistors are connected to the conductive patterns 501a in
parallel. Reducing the area of the heat generation resistor allows
the use of a paste material having a low sheet resistance in the
heat generation resistor and the selection of a heat generation
resistor with a higher PTC characteristic. Each of the heat
generation resistors connected in parallel is arranged obliquely
with respect to the transverse direction so that the amount of heat
generation becomes uniform in the longitudinal direction. The width
of the heat generation resistor near the gap portion D is made
greater than in other heat generation blocks (K2>K1) so that
high heat generation portions G can be provided.
[0044] FIG. 7A illustrates a heater according to the second
modification of the present exemplary embodiment. The heater of the
second modification includes a first heat generation segment
including a heat generation resistor 500a (500a-1 and 500a-2) and
conductive patterns 501a (501a-1, 501a-2, and 501a-3). The heater
of the second modification further includes a second heat
generation segment including a heat generation resistor 500b
(500b-1 and 500b-2) and conductive patterns 501b (501b-1, 501b-2,
and 501b-3). The first and second heat generation segments are
arranged next to each other in the transverse direction of the
substrate 100. The heat generation resistors 500a and 500b can be
independently supplied with power and controlled by using triacs 50
and 51 connected thereto, respectively. The way the heat generation
resistor is divided and the way the conductive patterns are
connected to the heat generation resistor in each of the first and
second heat generation segments are similar to the configuration of
the heater 12 illustrated in FIG. 4A. A description thereof will
thus be omitted.
[0045] In the second modification, the heat generation resistors
500a-1 and 500a-2 each have a width V1a in each of first areas H1
adjacent to a gap portion D therebetween. The width V1a is
configured to be smaller than a width V2a in each of second areas
H2 that is farther from the gap portion D than the first area H1
is, and adjacent to the first area H1. In the second modification,
the heat generation resistors 500b-1 and 500b-2 each have a width
V1b in each of first areas H1 adjacent to a gap portion D
therebetween. The width V1b is configured to be greater than a
width V2b in each of second areas H2 that is farther from the gap
portion D than the first area H1 is, and adjacent to the first area
H1. In the second modification, the gap portion D between the heat
generation resistors 500a-1 and 500a-2 and the gap portion D
between the heat generation resistors 500b-1 and 500b-2 are
arranged in the same longitudinal position. Further, in the second
modification, a gap D between the conductive patterns 501a-1 and
501a-2 and a gap D between the conductive patterns 501b-1 and
501b-2 are arranged in the same longitudinal position.
[0046] The heater illustrated in FIG. 7A differs from that of the
first exemplary embodiment in including areas where the transverse
width of the heat generation resistor 500a decreases from a
longitudinal end toward a center portion of the substrate 100
(areas H3 to H1). Another difference from the first exemplary
embodiment lies in including areas where the transverse width of
the heat generation resistor 500b increases from a longitudinal end
toward a center portion of the substrate 100 (areas H3 to H1).
[0047] In the first heat generation segment, the amount of heat
generation is greater in the center portion than at the
longitudinal ends. In the second heat generation segment, the
amount of heat generation is greater at the longitudinal ends than
in the center portion. Such first and second heat generation
segments can be independently controlled and combined to form a
heat generation distribution according to the size (width) of a
recording material P and suppress a temperature rise of a non-sheet
passing area.
[0048] As described above, according to the second modification,
the heater includes a plurality of heat generation segments, each
of which includes a plurality of longitudinally-divided conductive
patterns connected to a heat generation resistor, arranged in the
transverse direction. Even with such a heater, temperature
variation in the longitudinal direction can be suppressed.
[0049] In the present exemplary embodiment and the modifications,
the heat generation resistor is divided into two. However, the
number of division may be greater than two. Further, in the present
exemplary embodiment, the high heat generation portions G are
provided in the adjacent areas longitudinally on both sides of the
gap portion D between the divided heat generation resistors.
However, a high heat generation portion may be provided in either
one of the adjacent areas. The high heat generation portions G
according to the present exemplary embodiment and the modifications
are configured to increase the amount of heat generation using the
heat generation resistor having the reduced transverse width.
However, the heat generation resistor may have another
configuration such as an increased thickness. In the present
exemplary embodiment and the modifications, the heat generation
resistors is longitudinally divided according to the dividing
position of the conductive pattern. However, the heat generation
resistor may not be longitudinally divided, and only the conductive
pattern may be divided. That is because, in the heater including
divided conductive patterns, a current does not flow through the
gap between the divided conductive patterns, thereby decreasing the
amount of heat generation therein, even if the heat generation is
continuously arranged without being divided. The configurations of
the present exemplary embodiment and the modifications are thus
applicable.
[0050] A second exemplary embodiment of the present invention will
be described. The present exemplary embodiment differs from the
first exemplary embodiment only in the pattern of the heater 12. A
description of configurations similar to those of the first
exemplary embodiment other than the pattern of the heater 12 will
thus be omitted. FIG. 8A is a schematic plan view of a surface of
the heater 12 according to the present exemplary embodiment,
opposite to the surface where the heater 12 makes contact with the
film 11. The heater 12 according to the present exemplary
embodiment includes a first heat generation segment including a
heat generation resistor 500a and conductive patterns 501a (501a-1
and 501a-2) on the substrate 100. The heater 12 further includes a
second heat generation segment including a heat generation resistor
500b (500b-1 and 500b-2) and conductive patterns 501b (501b-1,
501b-2, and 501b-3) on the substrate 100. Power supplied to the
first and second heat generation segments can be independently
controlled by using the triacs 50 and 51, respectively.
[0051] The first heat generation segment will be described. The
heat generation resistor 500a and each of the conductive patterns
501a-1 and 501a-2 are not divided in the longitudinal direction.
The conductive pattern 501a-1 is connected, along the longitudinal
direction, to one end of the heat generation resistor 500a. The
conductive pattern 501a-2 is connected, along the longitudinal
direction, to a transverse end of the heat generation resistor 500a
opposite from where the conductive pattern 501a-1 is. If a voltage
is applied between electrodes 502a and 502c, a current flows
through the heat generation resistor 500a in the transverse
direction (conveyance direction of a recording material P) and the
heat generation resistor 500a generates heat.
[0052] The second heat generation segment will be described. The
conductive pattern 501b-1 (second conductive pattern) is connected,
along the longitudinal direction, to one transverse end of the heat
generation resistor 500b-1. The conductive pattern 501b-2 (third
conductive pattern) is connected, along the longitudinal direction,
to the transverse end of the heat generation resistor 500b-2 on the
same side as the conductive pattern 501b-1 is, with a gap portion D
from the conductive pattern 501b-1. The conductive patterns 501b-3
(first conductive pattern) is connected, along the longitudinal
direction, to transverse ends of the heat generation resistor
500b-1 and the heat generation resistor 500b-2 on the side opposite
from where the conductive pattern 501b-1 is. When seen in the
conveyance direction of a recording material P, the conductive
pattern 501b-3 is arranged to overlap with both the conductive
patterns 501b-1 and 501b-2 in the longitudinal direction. In other
words, the heat generation resistors 500b-1 and 500b-2 are
electrically connected in series by the conductive patterns 501b.
If a voltage is applied between an electrical contact portion 502b
and the electrical contact portion 502c, a current flows through
each of the heat generation resistors 500b-1 and 500b-2 in the
transverse direction (conveyance direction of a recording material
P) and the heat generation resistors 500b-1 and 500b-2 generate
heat.
[0053] In the present exemplary embodiment, the heat generation
resistor 500a has a width V1a in the transverse direction in an
area (first area) overlapping with the gap portion D between the
heat generation resistors 500b-1 and 500b-2 in the longitudinal
direction. The width V1a is smaller than a width V2a in each of
areas (second areas) not overlapping with the gap portion D. The
width V1a of the first area of the heat generation resistor 500a in
the transverse direction is 0.4 mm. The width V2a of the second
area is 1.0 mm. The first area has a longitudinal length of 0.7 mm.
The amount of heat generation per unit length of the first area is
20% greater than that of the second area. The heat generation
resistor 500b has a sheet resistance of 500.OMEGA./.quadrature.,
and has a PTC characteristic with TCR of 1400 ppm/.degree. C. The
heat generation resistor 500a has a sheet resistance of
3000.OMEGA./.quadrature., and PTC characteristic with TCR of 500
ppm/.degree. C. The first heat generation resistor 500a is provided
with a high heat generation portion G to suppress a drop in the
amount of heat generation in the gap portion D of the second heat
generation segment. Thus, the total amount of heat generation of
the first heat generation segment is smaller than that of the
second heat generation segment. The heat generation resistor 500a
is thus made of a resistive paste material having a higher sheet
resistance and lower TCR than those of the heat generation resistor
500b.
[0054] FIG. 8B illustrates a longitudinal distribution of the
amount of heat generation by the heater 12 according to the present
exemplary embodiment. The gap portion D of the second heat
generation segment does not generate heat. The amount of heat
generation of the first heat generation segment in the first area
(H1) overlapping with the gap portion D is greater than in the
other areas, whereby a high heat generation portion G is
configured.
[0055] FIG. 8C illustrates a longitudinal distribution of the
surface temperature of the film 11 measured by a method similar to
that of the first exemplary embodiment. The longitudinal
distribution of the surface temperature of the film 11 is almost
uniform. The average temperature in the areas of the film 11 not
corresponding to the gap portion D was 160.degree. C. The amount of
temperature drop .DELTA.T1 in the area corresponding to the gap
portion D was 3.1.degree. C. A whole-surface solid image was
printed by using the heater of the present exemplary embodiment
under the same condition as in the first exemplary embodiment. As a
result, the occurrence of a fixing failure was not observed in any
of the areas of the recording material P, including the gap portion
D.
[0056] As described above, the heater 12 of the present exemplary
embodiment includes a plurality of longitudinally divided
conductive patterns connected to a heat generation resistor, which
enables suppression of temperature variation in the longitudinal
direction.
[0057] The high heat generation portion G according to the present
exemplary embodiment is configured to increase the amount of heat
generation by reducing the transverse width of the heat generation
resistor 500a. However, the heat generation resistor 500a may have
another configuration such as an increased thickness. In the
present exemplary embodiment, the heat generation resistor 500b is
longitudinally divided according to the dividing position and the
width of the conductive patterns 501b. However, the heat generation
resistor 500b may be configured to not be longitudinally divided,
and only the conductive patterns 501b may be divided.
[0058] A third exemplary embodiment of the present invention will
be described. The present exemplary embodiment differs from the
first exemplary embodiment only in the pattern of the heater 12. A
description of configurations similar to those of the first
exemplary embodiment other than the pattern of the heater 12 will
thus be omitted.
[0059] The heater 12 according to the present exemplary embodiment
has a similar configuration to that of the second modification of
the first exemplary embodiment illustrated in FIG. 7A except in the
aspects described below. A description of the similar configuration
will be omitted. FIG. 9A is a schematic diagram illustrating a
surface of the heater 12 according to the present exemplary
embodiment, opposite from the surface where the heater 12 makes
contact with the inner surface of the film 11.
[0060] A first difference between the configuration of the present
exemplary embodiment and that of the second modification of the
first exemplary embodiment is that a gap D1 of the heat generation
resistor 500a in the first heat generation segment and a gap D2 of
the heat generation resistor 500b in the second heat generation
segment do not overlap in the longitudinal direction.
[0061] A second difference lies in the configuration that a high
heat generation portion G is formed in a first area of the heat
generation resistor 500a-1 where the heat generation resistor
500a-1 overlaps with the gap portion D2 in the longitudinal
direction. Suppose that a second area of the heat generation
resistor 500a-1 is an area that is farther from the gap portion D2
in the longitudinal direction than the first area is, and adjoins
the first area. The first area of the heat generation resistor 500a
has a width (Via) smaller than the width (V2a) of the second area.
In the present exemplary embodiment, the first area adjoins the gap
portion D1.
[0062] A third difference lies in the configuration that a high
heat generation portion G is formed in a third area of the heat
generation resistor 500b-2 where the heat generation resistor
500b-2 overlaps with the gap portion D1 in the longitudinal
direction. Suppose that a fourth area is an area that is farther
from the gap portion D1 in the longitudinal direction than the
third area is, and adjoins the third area. The third area of the
heat generation resistor 500b has a width (V1b) smaller than the
width (V2b) of the fourth area. In the present exemplary
embodiment, the third area adjoins the gap portion D2. In the
present exemplary embodiment, the first and third areas have a
longitudinal width of 0.7 mm. V1a is 0.7 mm. V2a is 1.0 mm. V1b is
1.1 mm. V2b is 1.5 mm. The amount of heat generation per unit
length in the longitudinal direction of the first area of the heat
generation resistor 500a is 25% greater than that of the second
area. The amount of heat generation per unit length in the
longitudinal direction of the third area of the heat generation
resistor 500b is 20% greater than that of the fourth area.
[0063] FIG. 9B illustrates a longitudinal heat generation
distribution of the heater 12, showing the effect of the heater 12
according to the present exemplary embodiment. FIG. 9C illustrates
a longitudinal distribution of the surface temperature of the film
11. The experiment condition is the same as in the first exemplary
embodiment. As can be seen in FIG. 9B, the gap portion D1 of the
first heat generation segment and the gap portion D2 of the second
heat generation segment do not generate heat. The high heat
generation portion G of the first heat generation segment overlaps
with the gap portion D2 in the longitudinal direction, and the high
heat generation portion G of the second heat generation segment
overlaps with the gap portion D1. Consequently, as illustrated in
FIG. 9C, the amounts of temperature drop .DELTA.T1 in the areas of
the film 11 corresponding to the gap portions D1 and D2 were
1.1.degree. C. with respect to an average temperature of
160.degree. C. in the areas not corresponding to the gap portions
D1 and D2. A whole-surface solid image was printed by using the
heater 12 according to the present exemplary embodiment under the
same condition as in the first exemplary embodiment. As a result,
the occurrence of a fixing failure was not observed in any of the
areas of the recording material P, including the gap portions D1
and D2.
[0064] In the present exemplary embodiment, the temperature drop in
the gap portion D1 of the first heat generation segment is
compensated by the high heat generation portion G of the second
heat generation segment. The temperature drop in the gap portion D2
of the second heat generation segment is compensated by the high
heat generation portion G of the first heat generation segment.
[0065] As described above, the heater 12 according to the present
exemplary embodiment includes a plurality of longitudinally-divided
conductive patterns connected to a heat generation resistor, which
enables suppression of temperature variation in the longitudinal
direction.
[0066] In the present exemplary embodiment, the heat generation
resistor of each heat generation segment includes a high heat
generation portion G only on one side of the gap portion in the
longitudinal direction. However, as a modification of the present
exemplary embodiment illustrated in FIGS. 10A and 10B, high heat
generation portions G may be provided on both sides of the gap
portion.
[0067] In the present exemplary embodiment, the high heat
generation portion G is configured to increase the amount of heat
generation by reducing the transverse width of the heat generation
resistor. However, the heat generation resistor may have another
configuration of an increased thickness. In the present exemplary
embodiment, the heat generation resistors are longitudinally
divided according to the dividing positions of the conductive
patterns. However, the heat generation resistors may be configured
to not be longitudinally divided, and only the conductive patterns
may be divided.
[0068] A fourth exemplary embodiment of the present invention will
be described. The present exemplary embodiment differs from the
first exemplary embodiment only in the pattern of the heater 12. A
description of configurations similar to those of the first
exemplary embodiment other than the pattern of the heater 12 will
thus be omitted. FIG. 11A is a schematic diagram illustrating a
surface of the heater 12 according to the present exemplary
embodiment, opposite from the surface where the heater 12 makes
contact with the inner surface of the film 11. The heater 12
according to the present exemplary embodiment includes three
divided conductive patterns 501c in the center of the substrate 100
in the transverse direction. The conductive patterns 501c include a
conductive pattern 501c-1 (center conductive pattern, second
conductive pattern), a conductive pattern 501c-2 (end conductive
pattern, third conductive pattern), and a conductive pattern 501c-3
(end conductive pattern). The conductive patterns 501c-1 and 501c-2
have a gap D3 therebetween. The conductive patterns 501c-1 and
501c-3 have a gap D4 therebetween. The heater 12 according to the
present exemplary embodiment further includes a heat generation
resistor 500a-1 (first heat generation resistor, center heat
generation resistor) and a heat generation resistor 500b-1 (center
heat generation resistor), which are connected to the conductive
pattern 501c-1 along the longitudinal direction while being
respectively arranged on each side of the conductive pattern 501c-1
in the transverse direction. The heater 12 according to the present
exemplary embodiment further includes a heat generation resistor
500a-2 (second heat generation resistor, end heat generation
resistor) and a heat generation resistor 500b-2 (end heat
generation resistor), which are connected to the conductive pattern
501c-2 along the longitudinal direction while being respectively
arranged on each side of the conductive pattern 501c-2 in the
transverse direction. The heater 12 according to the present
exemplary embodiment further includes a heat generation resistor
500a-3 (third heat generation resistor) and a heat generation
resistor 500b-3, which are connected to the conductive pattern
501c-3 along the longitudinal direction while being respectively
arranged on each side of the conductive pattern 501c-3 in the
transverse direction.
[0069] The heat generation resistors 500a-1 and 500a-2 have the gap
D3 therebetween. The heat generation resistors 500a-1 and 500a-3
have the gap D4 therebetween. The heat generation resistors 500b-1
and 500b-2 also have the gap D3 therebetween. The heat generation
resistors 500b-1 and 500b-3 also have the gap D4 therebetween.
[0070] The heater 12 according to the present exemplary embodiment
includes a conductive pattern 501a (first conductive pattern,
common conductive pattern). The conductive pattern 501a is
connected to the heat generation resistors 500a (500a-1, 500a-2,
and 500a-3) along the longitudinal direction so that the heat
generation resistors 500a lie between the conductive pattern 501a
and the conductive patterns 501c (501c-1, 501c-2, and 501c-3) in
the transverse direction. The heater 12 according to the present
exemplary embodiment further includes a conductive pattern 501b
(common conductive pattern). The conductive pattern 501b is
connected to the heat generation resistors 500b (500b-1, 500b-2,
and 500b-3) along the longitudinal direction so that the heat
generation resistors 500b lie between the conductive pattern 501b
and the conductive patterns 501c (501c-1, 501c-2, and 501c-3) in
the transverse direction. The conductive patterns 501a and 501b are
not longitudinally divided. The heat generation resistors and the
conductive patterns of the heater 12 described above are formed
symmetrically with respect to a center line X-X' of the substrate
100.
[0071] The conductive pattern 501c-1 is provided with an electrode
504. The conductive patterns 501c-2 and 501c-3 are each provided
with an electrode 505. The conductive patterns 501a and 501b are
provided with electrodes 502. If a voltage is applied between each
of the electrodes 502 and the electrode 504, currents flow through
the heat generation resistors 500a-1 and 500b-1 in the transverse
direction and the heat generation resistors 500a-1 and 500b-1
generate heat. Such a portion will hereinafter be referred to as a
center heat generation segment. If a voltage is applied between
each of the electrodes 502 and each of the electrodes 505, currents
flow through the heat generation resistors 500a-2 and 500b-2 and
the heat generation resistors 500a-3 and 500b-3 in the transverse
direction and the heat generation resistors 500a-2 and 500b-2 and
the heat generation resistors 500a-3 and 500b-3 generate heat. Such
portions will hereinafter be referred to as end heat generation
segments. Power can be independently supplied to the center heat
generation segment and the end heat generation segments via triacs
50 and 51, respectively. The heat generation area of the center
heat generation segment has a longitudinal length of 158 mm which
corresponds to an A5 size (149 mm.times.210 mm), i.e., a regular
size of a recording material P. The heat generation areas including
the center heat generation segment and the end heat generation
segments have a total longitudinal length of 225 mm which
corresponds to an A4 size (210 mm.times.297 mm), i.e., a regular
size of a recording material P.
[0072] A control for switching the heat generation segments of the
heater 12 in the fixing device 7 according to the present exemplary
embodiment will be described with reference to the flowchart of
FIG. 12. In step S900, the image forming apparatus receives a print
job. In step S901, the control unit 52 determines whether the width
of a recording material P to be used for printing is less than or
equal to 149 mm. If the width is less than or equal to 149 mm (YES
in step S901), then in step S902a, the control unit 52 supplies
power to only the center heat generation segment. If the width
exceeds 149 mm (NO in step S901), then in step S902b, the control
unit 52 supplies power to both the center heat generation segment
and the end heat generation segments. If the print job is ended
(YES in step S903), then in step S904, the image forming apparatus
ends the print operation. In such a manner, the control unit 52
performs a switching control on the heat generation segments, which
enables suppression of a temperature rise of a non-sheet passing
area. The configuration of the heater 12 according to the present
exemplary embodiment accepts the A4 size, and thus can reduce a
temperature rise of the non-sheet passing area of the A5 size.
[0073] Next, a characteristic configuration of the present
exemplary embodiment will be described with reference to FIG. 13A.
FIG. 13A is an enlarged view illustrating only a half of the heater
12 according to the present exemplary embodiment illustrated in
FIG. 11A on one side of the longitudinal center where there is the
gap portion D3. The other half on the side of the longitudinal
center where there is the gap portion D4 has a pattern symmetrical
to that illustrated in FIG. 13A with respect to the center of the
heater 12. A description thereof will thus be omitted.
[0074] The areas adjacent to the gap portion D3 in the longitudinal
direction will be referred to as first areas (H1). The areas that
are farther from the gap portion D3 in the longitudinal direction
than the first areas are and adjoin the first areas will be
referred to as second areas (H2). The heat generation resistors
500a-1 and 500a-2 have a width V1a in the transverse direction in
the first areas (H1). The width V1a is smaller than the width V2a
of the heat generation resistors 500a-1 and 500a-2 in the
transverse direction in the second areas (H2). Similarly, the heat
generation resistors 500b-1 and 500b-2 have a width V1b in the
transverse direction in the first areas (H1). The width V1b is
smaller than the width V2b of the heat generation resistors 500b-1
and 500b-2 in the transverse direction in the second areas (H2). In
such a manner, the widths of the heat generation resistors are
reduced to lower the resistances, whereby high heat generation
portions G are formed locally near the gap portion D3. At least
either one of the first areas of the heat generation resistors
500a-1 and 500a-2 may have the transverse width V1a smaller than
the transverse width V2b of the second areas.
[0075] FIG. 11B illustrates a longitudinal heat generation
distribution of the heater 12, showing the effect of the heater 12
of the present exemplary embodiment. FIG. 11C illustrates a
longitudinal distribution of the surface temperature of the film
11. The experiment condition is the same as in the first exemplary
embodiment. As can be seen in FIG. 11B, the areas of the heater 12
corresponding to the gap portions D3 and D4 do not generate heat.
The amount of heat generation in the first areas (H1) provided on
both longitudinal sides of the respective gap portions D3 and D4 is
greater than that in the second areas (H2), whereby the high heat
generation portions G are configured. As can be seen in FIG. 11C,
the amounts of temperature drop .DELTA.T1.sub.L and .DELTA.T1.sub.R
in the areas of the film 11 corresponding to the respective gap
portions D3 and D4 were 3.4.degree. C. with respect to an average
temperature of 160.degree. C. in the areas not corresponding to the
gap portions D3 and D4. A whole-surface solid image was printed by
using the heater of the present exemplary embodiment under the same
condition as in the first exemplary embodiment. As a result, the
occurrence of a fixing failure was not observed in any of the areas
of the recording material P, including the areas corresponding to
the gap portions D3 and D4.
[0076] It can be seen that with such a configuration, a drop in the
amount of heat generation in the gap portions D3 and D4 of the
heater 12 is compensated by the high heat generation portions G
configured in the first areas, whereby temperature variation in the
longitudinal direction of the heater 12 is suppressed.
[0077] FIG. 14 illustrates an enlarged view of a half of a heater
12 on one side of the longitudinal center, as a comparative
example. Unlike the heater 12 illustrated in FIG. 11A, the heater
12 of the comparative example includes no high heat generation
portion G in the first portions (H1). In the heater 12 of the
comparative example, the heat generation resistors 500a-1 and
500a-2 have the same width V2b in the first areas (H1) and the
second areas (H2). The heat generation resistors 500b-1 and 500b-2
have the same width V2b in the first areas (H1) and the second
areas (H2).
[0078] The same experiment as that of the present exemplary
embodiment was performed by using the heater 12 of the comparative
example to measure the amounts of temperature drop .DELTA.T1.sub.L
and .DELTA.T1.sub.R in the areas of the film 11 corresponding to
the gap portions D3 and D4, respectively. The measurements were
12.0.degree. C. with respect to an average temperature of
160.degree. C. in the areas not corresponding to the gap portions
D3 and D4. A whole-surface solid image was printed by using the
heater 12 of the comparative example under the same condition as in
the present exemplary embodiment. As a result, fixing failures of
approximately 2 mm in width occurred in the positions corresponding
to the gap portions D3 and D4. The reason for the occurrence of the
fixing failures is considered to be that the heater 12 of the
comparative example is not able to compensate a drop in the amount
of heat generation in the gap portions D3 and D4.
[0079] As described above, the heater 12 according to the present
exemplary embodiment includes a plurality of longitudinally-divided
conductive patterns connected to heat generation resistors, which
enables suppression of temperature variation in the longitudinal
direction.
[0080] The high heat generation portions G according to the present
exemplary embodiment are configured to increase the amount of heat
generation by reducing the widths of the heat generation resistors
in the transverse direction. However, the heat generation resistors
may have another configuration such as an increased thickness. In
the present exemplary embodiment, the heat generation resistors are
longitudinally divided according to the dividing positions of the
conductive patterns. However, as illustrated in FIG. 13B, the heat
generation resistors may be configured to not be longitudinally
divided, and only the conductive patterns may be divided. Even in
such a case, the configuration of the present exemplary embodiment
is effective.
[0081] While the present invention has been described with
reference to exemplary embodiments, it is to be understood that the
invention is not limited to the disclosed exemplary embodiments.
The scope of the following claims is to be accorded the broadest
interpretation so as to encompass all such modifications and
equivalent structures and functions.
[0082] This application claims the benefit of Japanese Patent
Application No. 2015-022676, filed Feb. 6, 2015, which is hereby
incorporated by reference herein in its entirety.
* * * * *