U.S. patent application number 14/912698 was filed with the patent office on 2016-08-11 for plating apparatus and sensing device using same.
This patent application is currently assigned to WASEDA University. The applicant listed for this patent is WASEDA UNIVERSITY, YAMAMOTO-MS CO., LTD.. Invention is credited to Takayuki HOMMA, Kimiko Koiwa, Mikiko Saito, Tomoyuki YAMAMOTO, Wataru Yamamoto, Masahiro YANAGISAWA.
Application Number | 20160230285 14/912698 |
Document ID | / |
Family ID | 52483474 |
Filed Date | 2016-08-11 |
United States Patent
Application |
20160230285 |
Kind Code |
A1 |
Yamamoto; Wataru ; et
al. |
August 11, 2016 |
PLATING APPARATUS AND SENSING DEVICE USING SAME
Abstract
A plating apparatus (1) includes: a holding member (2) that
holds a plated object (W); a spacer (4) that is stacked on the
holding member (2) via a first seal member (3) in an annular shape
surrounding the plated object (W), and has a through portion (45)
from which the plated object (W) is exposed and which stores a
plating solution; and an anode member (6) that is stacked on the
spacer (4) via a second seal member (3) in an annular shape
surrounding the through portion (45), and has an anode layer (62)
arranged to face the plated object (W) which is exposed from the
through portion (45).
Inventors: |
Yamamoto; Wataru; (Tokyo,
JP) ; Koiwa; Kimiko; (Tokyo, JP) ; HOMMA;
Takayuki; (Tokyo, JP) ; YANAGISAWA; Masahiro;
(Tokyo, JP) ; Saito; Mikiko; (Tokyo, JP) ;
YAMAMOTO; Tomoyuki; (Tokyo, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
YAMAMOTO-MS CO., LTD.
WASEDA UNIVERSITY |
Tokyo
Tokyo |
|
JP
JP |
|
|
Assignee: |
WASEDA University
Tokyo
JP
YAMAMOTO-MS CO., LTD.
Tokyo
JP
|
Family ID: |
52483474 |
Appl. No.: |
14/912698 |
Filed: |
July 31, 2014 |
PCT Filed: |
July 31, 2014 |
PCT NO: |
PCT/JP2014/070252 |
371 Date: |
February 18, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C23C 18/163 20130101;
C25D 17/12 20130101; C23C 18/1683 20130101; C25D 17/004 20130101;
C25D 17/06 20130101; C25D 21/12 20130101; C25D 17/001 20130101;
C25D 17/002 20130101; C25D 17/008 20130101; C25D 17/10 20130101;
C23C 18/1619 20130101 |
International
Class: |
C23C 18/16 20060101
C23C018/16; C25D 17/00 20060101 C25D017/00; C25D 17/10 20060101
C25D017/10; C25D 21/12 20060101 C25D021/12 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 19, 2013 |
JP |
2013-169504 |
Claims
1. A plating apparatus comprising: a holding member that holds a
plated object specified as a cathode; a spacer that is stacked on
the holding member via a first seal member in an annular shape
surrounding the plated object, and has a through portion from which
the plated object is exposed and which stores a plating solution;
and an anode member that is stacked on the spacer via a second seal
member in an annular shape surrounding the through portion, and has
an anode layer arranged to face the plated object which is exposed
from the through portion.
2. The plating apparatus according to claim 1, wherein the spacer
includes a spacer body made of an insulator and an anode-side
conductive layer arranged on a face, which faces the anode member,
of the spacer body, the anode member includes an anode member body
made of an insulator and an anode layer specified as the anode
arranged on a face, which faces the spacer, of the anode member
body, the anode-side conductive layer is connected inside the
second seal member to the anode layer, and the anode-side
conductive layer is connected outside the second seal member to a
power supply.
3. The plating apparatus according to claim 2, wherein the anode
member body includes a light transmissive window for observing the
plated object exposed from the through portion, and the anode layer
is formed around the window.
4. The plating apparatus according to claim 3, wherein the window
has a thickness smaller than that of other portions of the anode
member body.
5. The plating apparatus according to claim 3, wherein a thickness
t1 of the window is in a range of 0.05 mm.ltoreq.t1.ltoreq.2
mm.
6. The plating apparatus according to claim 3, wherein the anode
member body has a tapered portion around the window which declines
toward the window.
7. The plating apparatus according to claim 1, wherein a thickness
t2 of the spacer is in a range of 0.05 mm.ltoreq.t2.ltoreq.1
mm.
8. The plating apparatus according to claim 2, wherein the spacer
includes a cathode-side conductive layer arranged on a face, which
faces the holding member, of the spacer body, the cathode-side
conductive layer is connected inside the first seal member to the
plated object, and the cathode-side conductive layer is connected
outside the first seal member to the power supply.
9. The plating apparatus according to claim 2, wherein the spacer
includes a reference electrode conductive layer insulated from the
anode-side conductive layer on a face, which faces the anode
member, of the spacer body, the anode member includes a reference
electrode layer insulated from the anode layer on a face, which
faces the spacer, of the anode member body, the reference electrode
conductive layer is connected inside the second seal member to the
reference electrode layer, and the reference electrode conductive
layer is connected outside the second seal member to the measuring
device.
10. The plating apparatus according to claim 1, wherein the holding
member or the anode member includes a plating solution supply
passage through which a plating solution is supplied to the through
portion, and the holding member or the anode member includes a
plating solution discharge passage through which the plating
solution is discharged from the through portion.
11. The plating apparatus according to claim 8, wherein the plating
solution is an electroless plating solution, and a measuring device
instead of the power supply is connected to measure the electric
potential across the anode and the cathode.
12. A sensing device having the plating apparatus according to
claim 2, wherein the anode-side conductive layer is constituted
with a plurality of anode-side conductive layers insulated from one
another, the anode layer is constituted with the same number of
anode layers insulated from one another as the anode-side
conductive layers, and portions of anode layer, which is exposed
from the through portion are respectively modified with reaction
groups different from one another.
Description
TECHNICAL FIELD
[0001] The present invention relates to a plating apparatus for
applying electrolytic plating or electroless plating on the face of
a plated object, and a sensing device using the same.
BACKGROUND ART
[0002] In recent years, a plating technology has been applied to
various technical fields such as a semiconductor wiring technique.
Further, in order to determine plating conditions at the time of
producing plated products, plating tests may be performed before
starting the production, such as with a small-sized plating
apparatus.
[0003] For example, Patent Document 1 discloses an electroplating
testing apparatus including: a tank which has at least a bottom
plate and a side plate, and is injected with a plating solution;
and a cathode and anode plates which are horizontally placed so as
to face each other in the plating solution in the tank, wherein one
of the cathode and anode plates as a plated object is placed below
the other, an opening is formed in the side plate of the tank for
inserting the cathode and anode plates respectively into the tank,
and a shield plate is detachably arranged in the tank for shielding
the opening. The side plate of the tank includes a plurality of
grooves for retaining at least one of the cathode and anode plates
in a horizontal state, so as to allow adjusting the gap between the
cathode and anode plates.
PRIOR ART DOCUMENTS
Patent Documents
[0004] Patent Document 1: Japanese Patent Application Publication
No. 2006-299367 (claims 1-3, FIG. 1)
SUMMARY OF THE INVENTION
Problems to be Solved by the Invention
[0005] However, the plating apparatus described in Patent. Document
1 needs to have the opening and the grooves in the side plate of
the tank as well as the tank for accommodating the cathode and
anode plates, causing the structure to be larger in size and to be
complex, and a manufacturing cost and a material cost to increase
accordingly. Therefore, a simpler and more compact plating
apparatus has been required.
[0006] Moreover, in the research and development of a plated object
in recent years, a plating apparatus has been required that allows
for observing production process of a plated object during plating,
such as with a high performance microscope (e.g. Raman
microscope).
[0007] The present invention has been made in view of the above
problems, and provides, as a primary subject, a plating apparatus
that is simpler and can be easily made smaller in size than before
and a sensing device using the same.
[0008] Further, the present invention provides, as a secondary
subject, a plating apparatus that allows for observing a production
process of a plated object.
Means to Solve the Problems
[0009] To solve the problems above, a plating apparatus according
to the present invention includes: a holding member (2) that holds
a plated object (W) specified as a cathode; a spacer (4) that is
stacked on the holding member (2) via a first seal member (3) in an
annular shape surrounding the plated object (W), and has a through
portion (45) from which the plated object (W) is exposed and which
stores a plating solution; and an anode member (6) that is stacked
on the spacer (4) via a second seal member (5) in an annular shape
surrounding the through portion (45), and has an anode layer (62)
arranged to face the plated object (W) which is exposed from the
through portion (45).
[0010] According to the structure, a plating apparatus (1) can be
easily formed by simply stacking the holding member (2) to hold the
plated object (W), the spacer (4) having the through portion (45)
to store the plating solution and the anode member (6) having an
anode via the first and second seal members (3, 5). Therefore, the
plating apparatus (1) can be simpler and smaller in size as
compared with the plating apparatus described in Patent Document 1,
for example, because the tank having a complex structure is not
necessary. Further, in the present invention, a distance between
the cathode and the anode can be easily adjusted by exchanging the
spacer (4) with one having different thickness.
[0011] Further, the spacer (4) includes a spacer body (41) made of
an insulator and an anode-side conductive layer (43) arranged on a
face, which faces the anode member (6), of the spacer body (41),
the anode member (6) includes an anode member body (61) made of an
insulator and an anode layer (62) specified as the anode arranged
on a face, which faces the spacer (4), of the anode member body
(61), the anode-side conductive layer (43) is connected inside the
second seal member (5) to the anode layer (62), and the anode-side
conductive layer (43) is connected outside the second seal member
(5) to a power supply (PW).
[0012] According to the structure, the anode-side conductive layer
43 is connected inside the second seal member (5) to the anode
layer (62), and the anode-side conductive layer (43) is connected
outside the second seal member (5) to the power supply (PW),
allowing for supplying electricity to the anode layer (62) while
maintaining between the spacer (4) and the anode member (6) in
watertight.
[0013] Further, the anode member body (61) preferably includes a
light transmissive window (64) for observing the plated object (W)
exposed from the through portion (45), and the anode layer (62) is
preferably formed around the window (64).
[0014] The structure allows for observing the plating itself
produced on the plated object (W), via the window (64) during
plating.
[0015] Furthermore, the window (64) preferably has a thickness (t1)
smaller than that of other portions of the anode member body
(61).
[0016] This structure allows for, for example, arranging a
microscope used for observation closer to the cathode.
Consequently, the plated object (W) during plating can be suitably
observed.
[0017] Moreover, the thickness (t1) of the window (64) is
preferably in a range of 0.05 mm.ltoreq.t1.ltoreq.2 mm.
[0018] Since the structure allows for suitably restraining
refraction and scattering of light which is transmitted through the
window (64), the plated object (W) during plating can be suitably
observed in a state where the influence caused by the window (64)
is reduced.
[0019] Still moreover, the anode member body (61) preferably has a
tapered portion (64a) around the window (W) which declines toward
the window (64).
[0020] According to the structure, the anode member body (61) has
the tapered portion (64a) around the window (64) that declines
toward the window (64), which prevents the microscope (M) from
contacting the anode member (6), for example, when the microscope
(M) is used for observing the plated object (W).
[0021] Still moreover, the thickness (t2) of the spacer (4) is
preferably in a range of 0.05 mm.ltoreq.t2.ltoreq.1 mm.
[0022] According to the structure, the thickness (depth) of the
plating solution stored in the through portion (45) is small, to
allow for observing the plated object (W) even if the plating
solution is colored. Further, by shortening the distance between
electrodes remarkably, a steep diffusion gradient of ion
concentration can be obtained.
[0023] Still moreover, the spacer (4) preferably includes a
cathode-side conductive layer (42) arranged on a face, which faces
the holding member (2), of the spacer body (41), the cathode-side
conductive layer (42) is connected inside the first seal member (3)
to the plated object (W), and the cathode-side conductive layer
(42) is connected outside the first seal member (3) to the power
supply (PW).
[0024] The structure allows for supplying electricity to the plated
object (W) while maintains between the spacer (4) and the holding
member (2) in watertight.
[0025] Still moreover, the spacer (4) preferably includes a
reference electrode conductive layer (44) insulated from the
anode-side conductive layer (43) on a face, which faces the anode
member (6), of the spacer body (41), and the anode member (6)
preferably includes a reference electrode layer (63) insulated from
the anode layer (62) on a face, which faces the spacer (4), of the
anode member body (61), the reference electrode conductive layer
(44) is connected inside the second seal member (5) to the
reference electrode layer (63), and the reference electrode
conductive layer (44) is connected outside the second seal member
(5) to the measuring device.
[0026] According to the structure, the electric potential of the
anode can be measured using the the reference electrode layer (63)
while the spacer (4) and the anode member (6) can be maintained in
watertight.
[0027] Still moreover, the holding member (2) or the anode member
(6) preferably includes a plating solution supply passage (27)
through which a plating solution is supplied to the through portion
(45), and the holding member (2) or the anode member (6) preferably
includes a plating solution discharge passage (26) through which
the plating solution is discharged from the through portion
(45).
[0028] The structure allows the plating solution in the through
portion (45) to be suitably maintained by supplying the solution
from the plating solution supply passage (27) to the through
portion (45) and discharging it from the through portion (45) to
the plating solution discharge passage (28).
[0029] Still moreover, in a case where the plating solution is an
electroless plating solution, a measuring device instead of the
power supply (PW) is preferably connected to measure the electric
potential across the anode and the cathode.
[0030] The structure allows the plating apparatus (1) according to
the present invention to apply the electroless plating and to
measure the electric potential across the anode and the
cathode.
[0031] Still moreover, the present invention provides a sensing
device using the above-described plating apparatus (1), wherein the
anode-side conductive layer (43) is constituted with a plurality of
anode--side conductive layers (43B) insulated from one another, the
anode layer (62) is constituted with the same number of anode
layers (62B) insulated from one another as the anode-side
conductive layers (43B), and portions (62Bb) of anode layers (62B)
exposed from the through portion (45) are respectively modified
with reaction groups different from one another.
[0032] The structure allows the plating apparatus (1) to be used as
a sensing device, for example, by modifying different reaction
groups to the plurality of anode layers (62B).
EFFECT OF THE INVENTION
[0033] The present invention can provide a plating apparatus which
is simpler and can be easily made smaller in size than before, and
a sensing device using the same. Further, the present invention can
provide a plating apparatus that allows for observing a production
process of a plated object.
BRIEF DESCRIPTION OF THE DRAWINGS
[0034] FIG. 1 is a perspective view of a plating apparatus
according to a first embodiment;
[0035] FIG. 2 is an exploded perspective view of the plating
apparatus according to the first embodiment;
[0036] FIG. 3 is an exploded cross-sectional view taken along a
III-III line in FIG. 1;
[0037] FIG. 4 is an exploded cross-sectional view taken along a
IV-IV line in FIG. 1;
[0038] FIG. 5 is an assembled cross-sectional view taken along the
III-III line in FIG. 1;
[0039] FIG. 6A is a plan view of a holding member and FIG. 6B is a
cross-sectional view taken along a VIb-VIb line in FIG. 6A;
[0040] FIG. 7A is a plan view of a spacer and FIG. 7B is a bottom
view of the spacer;
[0041] FIG. 8A is a plan view of an anode member, FIG. 8B is a
cross-sectional view taken along a VIIIb-VIIIb line in FIG. 8B, and
FIG. 8C is a bottom view of the anode member;
[0042] FIG. 9 is an exploded cross-sectional view of a plating
apparatus according to a second embodiment;
[0043] FIG. 10 is a plan view of the spacer in a sensing device
using the plating apparatus; and
[0044] FIG. 11 is a bottom view of an anode member in the sensing
device using the plating apparatus.
EMBODIMENTS OF THE INVENTION
[0045] Next, a first embodiment of the present invention will be
described in detail with reference to the accompanying drawings. In
the first embodiment, a description will be given of an exemplary
case of applying electrolytic plating on a plated object W. It is
noted that a direction will be indicated in the description based
on the "front-back", "up-down" and "right-left" directions shown by
arrows in FIG. 1.
[0046] A plating apparatus 1 according to the first embodiment is a
thin plating apparatus formed in a simple stacked structure. The
plating apparatus 1 has an advantage to allow for observing a
production of a plated object and a reaction at a solid/liquid
interface during plating, for example, using a special microscope
such as a Raman microscope.
[0047] As shown in FIGS. 1 and 2, the plating apparatus 1 is an
apparatus for plating the plated object W, and includes as main
components a holding member 2a, a first seal member 3, a spacer 4,
a second seal member 5 and an anode member 6, in order from the
bottom. Further, the plating apparatus 1 includes a cathode-side
conducting member 7 and an insulating member 8 below the holding
member 2. Still further, the plating apparatus 1 includes an
anode-side conducting member 9 above the anode member 6.
[0048] As shown in FIG. 2, the plated object W is an object on
which plating is applied, and is formed of a thin plate member
having a square shape, for example, in a plan view. The plated
object W is not particularly limited to, and can be various
electronic components such as a circuit board, a semiconductor chip
and a device package. Also, the plated object W can be a test piece
such as made of a mere metal plate. As shown in FIG. 3, in the
first embodiment, the plated object W includes an insulating
substrate W1 and a plated layer W2 that is stacked on the
insulating substrate W1. The plated layer W2 is connected to the
negative pole of a power supply PW to function as a cathode.
[0049] As shown in FIGS. 1 to 6B (in particular FIGS. 6A, 6B), the
holding member 2 is a member for holding the plated object W. The
holding member 2 is formed with, for example, an insulator such as
PEEK resin (Poly Ether Ether Ketone). The holding member 2 includes
a rectangular bottom wall 21 in a plan view and a sidewall 22
extending upward from four sides of the bottom wall 21. As shown in
FIGS. 1 and 2, a space surrounded by the side wall 22 accommodates
the plated object W, the first seal member 3, the spacer 4, the
second seal member 5, and the anode member 6.
[0050] A recess 23 for mounting the plated object W is formed in
the central portion of the upper face of the bottom wall 21.
Further, a concave groove 24 in an annular shape for mounting the
first seal member 3 is formed on the upper face of the bottom wall
21 so as to surround the recess 23.
[0051] Further, the bottom wall 21 includes, outside the concave
groove 24, a plurality of probe insertion holes 25 (eight in the
first embodiment) for inserting probes P described later.
[0052] Still further, the bottom wall 21 includes a plating
solution supply passage 27 which supplies the plating solution
through a through portion 45 of the spacer 4 described later, and a
plating solution discharge passage 28 which discharges the plating
solution through the through portion 45. In the first embodiment,
an opening 27a at the inlet side of the plating solution supply
passage 27 is formed at the distal end of a cylinder 27c protruding
from the right side of the bottom wall 21, and an opening 27b at
the outlet side of the plating solution supply passage 27 is formed
on the upper face of the bottom wall 21 and inside the annular
concave groove 24 on the front side of the recess 23. Also, an
opening 28a at the inlet side of the plating solution discharge
passage 28 is formed on the upper face of the bottom wall 21 and
inside the annular concave groove 24 on the back side of the recess
23, and an opening 28b at the outlet side of the plating solution
discharge passage 28 is formed at the distal end of a cylinder 28c
protruding from the left side of the bottom wall 21. The cylinders
27c, 28c are covered with caps 27d, 28d, respectively. The caps
27d, 28d prevent plating solution flow pipes (not shown) connected
to the cylinders 27c, 28c from falling off.
[0053] As shown in FIGS. 2 to 5, the first seal member 3 is an
elastic member which seals between the holding member 2 and the
spacer 4 and is constituted by an O-ring having an annular shape,
for example, in a plan view. The first seal member 3 is mounted in
the concave groove 24 of the bottom wall 21. The first seal member
3 is arranged to surround the plated object W. Also, the first seal
member 3 is arranged to surround the through portion 45 of the
spacer 4 (described later).
[0054] As shown in FIGS. 2 to 5 and 7A, 7B (in particular FIGS, 7A,
7B), the spacer 4 is a member which maintains the distance between
the plated object W and an anode (described later) at a
predetermined distance. In the first embodiment, the spacer 4 is
formed of a thin plate member having a square shape, for example,
in a plan view. The spacer 4 includes a. spacer body 41 made of an
insulator, a cathode-side conductive layer 42 arranged on the face,
which faces the holding member 2, of the spacer body 41, an
anode-side conductive layer 43 and a reference electrode
conductive, layer 44 arranged on the face, which faces the anode
member 6, of the spacer body 41, and the through portion 45 formed
through at the central portion of the spacer 4.
[0055] The spacer body 41 is a portion which insulates the
cathode-side conductive layer 42 from the anode-side conductive
layer 43, and is formed of, for example, an insulator such as
borosilicate glass.
[0056] The cathode-side conductive layer 42 is a conductive layer
which supplies electricity to the plated object W, and is formed
of, for example, a metal material such as platinum. The
cathode-side conductive layer 42 is formed by the technique such as
sputtering or vacuum evaporation. The cathode-side conductive layer
42 is connected inside the first seal member 3 to the plated object
W, and is connected outside the first seal member 3 to the negative
pole of the power supply PW via the probes P and the cathode-side
conducting member 7 (see FIGS. 1 and 5).
[0057] The anode-side conductive layer 43 is a conductive layer
which supplies electricity to an anode layer 62 (described later),
and is formed of, for example, a metal material such as platinum.
The anode-side conductive layer 43 is formed by the technique such
as sputtering or vacuum evaporation. The anode-side conductive
layer 43 is connected inside the second seal member 5 to the anode
layer 62 (described later), and is connected outside the second
seal member 5 to the positive pole of the power supply PW via the
probes P and the anode-side conducting member 9 (see FIGS. 1 and
5).
[0058] The reference electrode conductive layer 44 is a conductive
layer which is electrically connected to a reference electrode
layer 63 (described later), and is formed of, for example, a metal
material such as platinum. The reference electrode conductive layer
44 is formed by the technique such as sputtering or vacuum
evaporation. Portions without the conductive layer are provided at
both sides of the reference electrode conductive layer 44 (more
specifically, between the the reference electrode conductive layer
44 and the anode-side conductive layer 43) and are insulated from
the anode-side conductive layer 43. The reference electrode
conductive layer 44 is connected inside the second seal member 5 to
the reference electrode layer 63 (described later), and is
connected outside the second seal member 5 to a measuring device
(not shown) via the probes P (described later).
[0059] The through portion 45 is an opening from which a portion of
the plated object W is exposed and which stores the plating
solution, and is formed through in the up-down. direction
substantially at the central portion of the spacer 4. The through
portion 45 is formed substantially in an elongated diamond shape in
a plan view where the length in the front-back direction is longer
than that in the right-left direction. The opening 27b at the
outlet side of the plating solution supply passage 27 is exposed in
the vicinity of the end portion at the front side of the through
portion 45 (see FIG. 2). Also, the opening 28a at the inlet side of
the plating solution discharge passage 28 is exposed in the
vicinity of the end portion at the back side of the through portion
45 (see FIG. 2). Thus, the plating solution which has flowed from
the opening 27b into the through portion 45 flows from the front to
the back inside the through portion 45 to finally flow out from the
opening 28a.
[0060] The thickness t2 of the spacer 4 is not particularly limited
to, but is preferable in the range of 0.05 mm.ltoreq.t2.ltoreq.1
mm, and is more preferable in the range of 0.10
mm.ltoreq.t2.ltoreq.0.20 mm. In the first embodiment, the spacer 4
is formed to have the thickness t2 of approximately 0.10 mm. Making
the thickness t2 of the spacer 4 very thin allows for observing the
plated object W through a window 64 (described later), even when
the plating solution is not so transparent.
[0061] It is noted that a plurality of different spacers 4 having a
different thickness t2 may be prepared in advance to be exchanged
depending on applications. For example, if the plating solution is
very transparent, a spacer 4 having a relatively thicker thickness
t2 can be used. In the first embodiment, the spacer 4 having an
extremely thin thickness t2 of about 0.10 mm allows for observing
the reaction at the solid/liquid interface in more detail.
[0062] As shown in FIGS. 2 to 5, the second seal member 5 is a
resilient member for sealing between the spacer 4 and the anode
member 6, and is formed of an O-ring having an annular shape, for
example, in a plan view. The second seal member 5 is mounted in a
concave groove 65 formed in the lower face of the anode member 6.
The second seal member 5 is arranged to surround the through
portion 45 of the spacer 4. Further, the second seal member 5 is
arranged to surround the window 64 of the anode member 6.
[0063] As shown in FIGS. 1 to 5 and 8A to 8C (in particular, FIGS.
8A to 8C), the anode member 6 mainly includes: an anode member body
61; the anode layer 62 and the reference electrode layer 63
provided on the face, which faces the holding member 2, of the
anode member body 61; the window 64 formed in the central portion
of the anode member body 61; and the concave groove 65 formed in
the face, which faces the holding member 2, of the anode member
body 61. The anode member 6 covers the through portion 45 of the
spacer 4 from above.
[0064] The anode member body 61 is a plate-like member having a
rectangular shape in a plan view. The anode member body 61 is made
of an insulating material, such as transparent (light transmissive)
quartz glass.
[0065] The anode layer 62 is an anode portion which is electrically
connected to the positive pole of the power supply PW, and is
formed between the window 64 and the concave groove 65 described
later on the face, which faces the holding member 2, of the anode
member body 61. That is, the anode layer 62 is formed around the
window 64. The anode layer 62 is, for example, formed of a metal
material such as platinum. The anode layer 62 is formed by the
technique such as sputtering or vacuum evaporation. The anode layer
62 is connected inside the second seal member 5 to the anode-side
conductive layer 43.
[0066] The reference electrode layer 63 is a portion to be a
reference electrode which is electrically connected to the
measuring device (not shown). The reference electrode layer 63 is
arranged at a position facing the reference electrode conductive
layer 44. The reference electrode layer 63 is, for example, formed
of a metal material such as platinum. The reference electrode layer
63 is formed by the technique such as sputtering or vacuum
evaporation. Portions without the conductive layer are provided at
both sides of the reference electrode layer 63 (more specifically,
between the reference electrode layer 63 and the anode-side layer
62) and are insulated from the anode-side layer 62. The reference
electrode layer 63 is connected inside the second seal member 5 to
the reference electrode conductive layer 44. The reference
electrode layer 63 allows for measuring electric potential of the
anode (anode layer 62) as a working electrode.
[0067] The window 64 is a transparent observation window for
observing (or monitoring) the plated object W. The window 64 is
arranged at the central portion of the anode member body 61, and
formed in a circular shape in a plan view. The window 64 is formed
of quartz glass which is the same material as, for instance, the
anode member body 61. The thickness t1 of the window 64 is thinner
than that of other portions of the anode member body 61 (for
example, the outer peripheral portion of the anode member body 61).
The thickness t1 of the window 64 is preferably in the range of
0.05.ltoreq.mm t1.ltoreq.2 mm, and even more preferably in the
range of 0.10 mm.ltoreq.t1.ltoreq.0.20 mm. In the first embodiment,
the window 64 is formed to have the thickness t1 of approximately
0.13 mm. Making the thickness t1 extremely thin allows for, when
the plated object is observed with a microscope, reducing
refraction and scattering of light transmitted through the window
64, to allow for observing the plated object precisely.
[0068] A tapered portion 64a in a truncated cone shape is arranged
around the window 64, the portion 64a declining toward. the window
64. When the microscope is set on the window 64, the tapered
portion 64a reduces interference between the microscope and the
anode member body 61. In other words, the tapered portion 64a
around the window 64 allows a larger microscope in size to be
arranged closer to the window 64.
[0069] The concave groove 65 is an annular groove for mounting the
second seal member 5 and is formed on the lower face of the anode
member body 61. The concave groove 65 is formed to surround the
window 64. The concave groove 65 reduces the positional
displacement of the second seal member 5 and has a function to
facilitate the anode layer 62 to contact the anode-side conductive
layer 43.
[0070] Further, the anode member 6 includes a plurality of probe
insertion holes 66 (eight in the first embodiment) outside the
concave groove 65 for inserting the probes P (described later). One
of the probe insertion holes 66A is formed at a position
corresponding to the reference electrode conductive layer 44 (see
FIG. 7A).
[0071] As shown in FIGS. 1 to 5, the cathode-side conducting member
7 is a member which supplies a current to the plated object W as a
cathode. The cathode-side conducting member 7 is made of a metal
plate having a rectangular shape in a plan view and is stacked on
the lower side of the holding member 2. The cathode-side conducting
member 7 has a plurality of probe mount holes 71 through which
respective probes P are mounted. Further, the cathode-side
conducting member 7 is connected to the negative pole of the power
supply PW (not shown) via a protrusion 72 protruding on the left
side face. Thus, the negative pole of the power supply PW is
electrically connected to the plated object W via the cathode-side
conducting member 7, the probes P and the cathode-side conductive
layer 42.
[0072] The insulating member 8 is a member which insulates the
cathode-side conducting member 7 from a face (for example, the
floor) on which the plating apparatus 1 is placed. The insulating
member 8 is made of an insulating material such as PEEK resin (Poly
Ether Ether Ketone). The insulating member 8 is made of a plate
member having a square shape in a plan view and covers the lower
face of the cathode-side conducting member 7.
[0073] The anode-side conducting member 9 is a member which
supplies a current to the anode layer 62. The anode-side conducting
member 9 is made of a metal plate having an annular shape in a plan
view and is stacked on the upper side of the anode member 6. The
anode-side conducting member 9 has an opening 91 at the center
through which the window 64 is exposed. The anode-side conducting
member 9 has a plurality of probe mount holes 92 through which the
respective probes P are mounted. Further, the anode-side conducting
member 9 is connected to the positive pole of the power supply PW
(not shown) via a protrusion 93 protruding from the front side
face. Thus, the positive pole of the power supply PW is
electrically connected to the anode layer 62 via the anode-side
conducting member 9, the probes P and the anode-side conductive
layer 43.
[0074] The Probes P are metal members which electrically connect
the cathode-side conducting member 7 with the cathode-side
conductive layer 42, and, the anode-side conducting member 9 with
the anode-side conductive layer 43, respectively. As shown in FIG.
3, each probe P includes a cylinder Pi having a bottomed
cylindrical shape and a piston P2 which is provided retractably in
the cylinder P1. The cylinders P1 are fitted into the probe mount
holes 71, 92 and are inserted into the probe insertion holes 25,
66, in a state that the pistons P2 are directed to the cathode-side
conductive layer 42 or the anode-side conductive layer 43. The
piston P2 is biased in the protruding direction by a spring (not
shown) accommodated in the cylinder P1 to be in contact with the
cathode-side conductive layer 42 or the anode-side conductive layer
43.
[0075] It is noted that, though not shown, one of the eight probes
P on the anode side arranged at a position corresponding to the
reference electrode conductive layer 44 has a cylinder P1
surrounded with an insulator to be insulated from the anode-side
conducting member 9. The probe P corresponding to the reference
electrode conductive layer 44 is connected to the measuring device
(not shown), and its piston P2 is in contact with the reference
electrode conductive layer 44. The reference electrode conductive
layer 44 is connected inside the second seal member 5 to the
reference electrode layer 63. Accordingly, electric potential of
the reference electrode layer 63 can be measured with the measuring
device.
[0076] As shown in FIG. 4, the holding member 2, the spacer 4, the
anode member 6, the cathode-side conducting member 7, the
insulating member 8 and the anode-side conducting member 9 have a
plurality of bolt insertion holes 26, 46, 67, 73, 81, 94 (eight in
the first embodiment, except for the anode-side conducting member 9
which has only four holes 94) for inserting bolts B (see FIG. 1)
which fasten the respective members in a stacked state. Female
screws are formed on the inner peripheral face of the bolt
insertion holes 81 in the insulation member 8 for screwing with the
bolts B (see FIG. 1).
[0077] The plating apparatus 1 according to the first embodiment is
basically formed as described above. Next, usage and advantageous
effects of the plating apparatus 1 will be described with reference
to FIGS. 1 to 8C (especially FIG. 5).
[0078] As shown in FIG. 5, the plating apparatus 1 according to the
first embodiment includes the holding member 2 which holds the
plated object W, the spacer 4 having the through portion 45, and
the anode member 6 having the anode layer 62, all of which being
stacked via the first seal member 3 and the second seal member 5.
Thus, while the plated object W faces the anode layer 62 via the
through portion 45, the through portion 45 is closed in watertight
so that the plating solution can be stored. Therefore, the plating
apparatus 1 can be formed easily by simply stacking the respective
members. A tank having a complex structure is not necessary
compared with, for example, the plating apparatus described in
Patent Document 1, and this allows the plating apparatus 1 to be
simplified and reduced in size. Further, the plating apparatus 1
according to the first embodiment may have a plurality of spacers 4
having a different thickness t2 prepared in advance, so that the
distance between the plated object W and the anode layer 62 can be
adjusted easily by exchanging the spacers depending on plating
conditions and test conditions.
[0079] Further, the plating apparatus 1 according to the first
embodiment includes the anode-side conductive layer 43 connected
inside the second seal member 5 to the anode layer 62 and the
anode-side conductive layer 43 connected outside the second seal
member 5 to the positive pole of the power supply PW via the probes
P and the anode-side conducting member 9, allowing for supplying
electricity to the anode layer 62 while maintaining between the
spacer 4 and the anode member 6 in watertight.
[0080] Further, the anode member body 61 includes the window 64
having a light transmitting property for observing the plated
object W which is exposed from the through portion 45, and the
anode layer 62 is formed around the window 64. Therefore, as shown
in FIG. 5, the plated object W during plating can be observed (or
monitored) through the window 64, such as a Raman microscope M.
[0081] Still further, in the first embodiment, the thickness t1 of
the window 64 set to be very thin, for example, to 0.13 mm can
suitably reduce the refraction and scattering of light transmitted
through the window 64 to allow for improving observation accuracy
with the Raman microscope M.
[0082] Yet further, the anode member 6 includes a tapered portion
64a and the anode-side conducting member 9 includes the opening 91,
to allow the Raman microscope M to be arranged close to the window
64, such as with the anode member 6 and the anode-side conducting
member 9 being prevented from interfering with the Raman microscope
M.
[0083] In addition, in the first embodiment, the thickness t2 of
the spacers 4 is set to be very thin, for example, to 0.10 mm.
Therefore, the thickness (depth) of the plating solution stored in
the through portion 45 is reduced, to allow for observing the
plated object W, even if, for example, the plating solution is
colored. Further, in the first embodiment, the thickness t2 of the
spacer 4 is set to be extremely thin, approximately 0.10 mm, to
allow for observing the reaction at the solid/liquid interface in
more detail.
[0084] Besides, the plating apparatus 1 according to the first
embodiment includes the cathode-side conductive layer 42 connected
inside the first seal member 3 to the plated object W and the
cathode-side conductive layer 42 connected outside the first seal
member 3 to the power supply PW via the probes B, to allow for
supplying electricity to the plated object W while maintaining
between the spacer 4 and the holding member 2 in watertight.
[0085] Moreover, since the holding member 2 includes the plating
solution supply passage 27 which supplies the plating solution to
the through portion 45 and the plating solution discharge passage
28 which discharges the plating solution from the through portion
45, the plating solution is supplied through the plating solution
supply passage 27 to the through portion 45 and is discharged from
the through portion 45 through the plating solution discharge
passage 28, to allow the plating solution in the through portion 45
to be maintained. in a suitable condition.
[0086] Next, a plating apparatus 1A according to a second
embodiment will be described with reference to FIG. 9. In the
description, the same components as those in the first. embodiment
are denoted by the same reference numerals, and detailed
descriptions thereof will be omitted.
[0087] As shown in FIG. 9, the plating apparatus 1A according to
the second embodiment is mainly different from the plating
apparatus of the first embodiment described above in that the
probes P directly contact the lower face of a plated object WA and
a spacer 4A does not have the cathode-side conductive layer 42.
[0088] The plated object WA used in the plating apparatus 1A
according to the second embodiment is a member of which lower face
(back face), which faces the holding member 2A, is electrically
connected to the upper face (front face) which is to be applied
with plating, and is formed of a simple metal plate, for
example.
[0089] The holding member 2A includes an annular concave groove 23a
in the bottom face of the recess 23 on which the plated object WA
is mounted. Further, probe insertion holes 23b into which the
probes P are inserted are formed through inside the concave groove
23a in the bottom face of the recess 23. It is noted that probe
mount holes 74 to be fitted with the probes P are formed through in
the cathode-side conducting member 7 at positions corresponding to
the probe insertion holes 23b.
[0090] A third seal member 10 is arranged between the holding
member 2A and the plated object WA. The third seal member 10 is
mounted along the concave groove 23a. The third seal member 10 can
maintain between the holding member 2A and the plated object WA in
watertight, to prevent the plating solution from leaking through
the probe insertion holes 23b and the probe mount holes 74.
[0091] A spacer 4A includes the spacer body 41 and the anode-side
conductive layer 43, but does not include the cathode-side
conductive layer 42 (see FIG. 3). This is because the probes P are
in direct contact with the lower face of the plated object WA.
[0092] In the plating apparatus 1A according to the second
embodiment, the probes P are in direct contact with the lower face
of the plated object WA and the cathode-side conductive layer 42 of
the spacer 4A is eliminated, to allow for simplifying the structure
of the plating apparatus 1.
[0093] The present embodiment has been described in detail with
reference to the drawings as above, but the present invention is
not limited thereto and can be appropriately modified without
departing from the spirit of the present invention.
[0094] For example, in the first embodiment, the window 64 is
arranged in the anode member 6, but the present invention is not
limited thereto, and when the observation is not conducted with the
microscope, the window 64 may not be arranged.
[0095] Further, in the first embodiment, the anode member body 61
and the window 64 are made of the same material (for example,
quartz glass), but the present invention is not limited thereto,
and for example, the anode member 61 may be formed with a material
different from that of the window 64. In this case, the window 64
may be formed with a light transmissive material and the anode
member body 61 may he formed with an opaque material.
[0096] Still further, in the first embodiment, the reference
electrode layer 63 is arranged on the lower face of the anode
member body 61 and the reference electrode conductive layer 44 is
arranged on the face, which faces the anode member 6 of the spacer
4, but the present invention is not limited thereto, and the
reference electrode layer 63 and the reference electrode conductive
layer 44 may be omitted.
[0097] Yet further, in the first embodiment, the plating solution
supply passage 27 and the plating solution discharge passage 28 are
formed in the holding member 2, but the present invention is not
limited thereto, and for example, the plating solution supply
passage 27 and the plating solution discharge passage 28 may be
formed in the anode member 6. In addition, one of the the plating
solution supply passage 27 and the plating solution discharge
passage 28 may be formed in one of the holding member 2 and the
anode member 6, and the other of the plating solution supply
passage 27 and the plating liquid discharge passage 28 may be
formed in the other of the holding member 2 and the anode member 6.
In a case where exchange (circulation) of the plating solution is
not necessary, the plating solution supply passage 27 and the
plating solution discharge passage 28 may be omitted.
[0098] In addition, in the first embodiment, the electrolytic
plating is applied by connecting the cathode-side conducting member
7 and the anode-side conducting member 9 to the power supply PW,
respectively, but the present invention is not limited thereto, and
the cathode-side conducting member 7 and the anode-side conducting
member 9 may be connected to the measuring device (not shown) in
place of the power supply PW and an electroless plating solution
may be supplied as a plating solution to the through portion 45.
This allows the plating apparatus 1 to perform the electroless
plating, and allows the measuring device to measure the electric
potential of the plated object W and the anode layer 62 during the
electroless plating.
[0099] Next, a sensing device using the above-described plating
apparatus will be described with reference to FIGS. 10 and 11.
[0100] FIG. 10 is a plan view of a spacer in the sensing device
using the plating apparatus. FIG. 11 is a bottom view of an anode
member in the sensing device using the plating apparatus.
[0101] Since the sensing device includes the same members as those
in the first embodiment except an anode-side conductive layer 43B
of a spacer 4B and an anode layer 62B of an anode member 6B, the
anode-side conductive layer 43B and the anode layer 62B will be
mainly described in the following description, and the other
members will not be described.
[0102] As shown in FIG. 10, the spacer 4B includes a plurality of
anode-side conductive layers 43B (eight in this modification) which
are radially arranged on a face which faces the anode member 6B.
Each anode-side conductive layer 43B is insulated from one another.
The outer end 43Ba of each anode-side conductive layer 43B is
arranged at a position corresponding to the probe insertion hole 66
of the anode member 6. Further, the inner end 43Bb of each
anode-side conductive layer 43B is extended to the periphery of the
through portion 45.
[0103] As shown in FIG. 11, the anode member 6B includes a
plurality of anode layers 62B (eight in this modification) which
are radially arranged on a face which faces the spacer 4B. Each
anode layer 62B is insulated from one another. Each anode layer 62B
is arranged at a position corresponding to the anode-side
conductive layer 43B. The outer end 62Ba of each anode layer 62B is
extended to the inner periphery of the concave groove 65, and is in
contact with the anode-side conductive layer 43B once it is
assembled. Further, the inner end 62Bb of each anode layer 62B is
extended to the outer periphery of the window 64 and is exposed
from the through portion 45.
[0104] The inner ends 62Bb of anode layers 62B are modified with
eight types of reactive groups, respectively, which are different
from one another. The Reactive groups are substances which react to
potential substances contained in a reagent supplied to the through
portion 45 (see FIG. 2) of the sensing device. An example of the
reagent includes liquid containing an electrolyte (e.g. blood,
etc.). In addition, an example of reactive group includes a
self-assembled monolayer (SAM) with a specific binding receptor.
For example, the inner end 62Bb of each anode layer 62B is modified
with a self-assembled monolayer (SAM) to react with a substance
having a metal ion to be sensed or a functional group to be sensed.
For example, the inner end 62Bb of each anode layer 62B is
modified. with aminopropyltriethoxysilane (3-aminopropyltriethoxy
silane) to react with Pd ions.
[0105] The probes P are respectively inserted in the probe
insertion holes 66 of the anode member 6B. The probes P are
insulated from one another and are connected to the measuring
device (not shown).
[0106] Such a sensing device can detect a substance contained in
the reagent by measuring the change in the electrical potential of
the anode layer 62B with the measuring device at the time of
reaction between the reactive group modifying the inner end 62Bb of
the anode layer 62B and the substances contained in the reagent.
For example, the sensing device can be connected to an
electrochemical measuring device with the cathode being used as a
reference electrode, to allow for checking the variation in the
surface electric potential in a two-electrode mode. In addition, it
is also possible to measure in a three-electrode mode in which the
cathode is set as a counter electrode and one of the eight cathodes
is used as the reference electrode.
EXPLANATION OF REFERENCES
[0107] 1: plating apparatus 2: holding member 27: plating solution
supply passage 28: plating solution discharge channel 3: first seal
member 4: spacer 41: spacer body 42: cathode-side conductive layer
43: anode-side conductive layer 44: reference electrode conductive
layer 45: through portion 5: second seal member 6: anode member 61:
anode member body 62: anode layer 63: reference electrode layer 64:
window 7: cathode-side conducting member 8: insulating member 9:
anode-side conducting member P: probe PW: power supply W: plated
object
* * * * *