U.S. patent application number 14/957794 was filed with the patent office on 2016-07-28 for heat sink module and siphon heat sink thereof.
The applicant listed for this patent is COOLER MASTER CO., LTD.. Invention is credited to Chia-Chun CHENG.
Application Number | 20160216041 14/957794 |
Document ID | / |
Family ID | 55358901 |
Filed Date | 2016-07-28 |
United States Patent
Application |
20160216041 |
Kind Code |
A1 |
CHENG; Chia-Chun |
July 28, 2016 |
HEAT SINK MODULE AND SIPHON HEAT SINK THEREOF
Abstract
A heat sink module and its siphon heat sink includes a
transverse pipe member, a tilt pipe member, a first vertical pipe,
second vertical pipes, fins, and a working fluid. The tilt pipe
member having a low section and a high section is installed at the
top of the transverse pipe member. Both ends of the first vertical
pipe are coupled and communicated to the transverse pipe member and
the low section respectively. Both ends of each second vertical
pipe are coupled and communicated to the transverse pipe member and
the high section respectively. The transverse pipe member, tilt
pipe member, first vertical pipe and second vertical pipes jointly
form a return pipeline. Each fin is coupled to the second vertical
pipe. The working fluid is filled in the return pipeline.
Therefore, the effects of separating gas and liquid channels and
improving the heat dissipating efficiency can be achieved.
Inventors: |
CHENG; Chia-Chun; (NEW
TAIPEI CITY, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
COOLER MASTER CO., LTD. |
New Taipei City |
|
TW |
|
|
Family ID: |
55358901 |
Appl. No.: |
14/957794 |
Filed: |
December 3, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28D 15/0266 20130101;
F28D 15/0275 20130101; G06F 1/20 20130101; H01L 2924/0002 20130101;
H01L 23/3672 20130101; H01L 23/467 20130101; F28D 15/025 20130101;
H01L 2924/00 20130101; H01L 2924/0002 20130101; H01L 23/473
20130101 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 28, 2015 |
CN |
201510043528.1 |
Claims
1. A siphon heat sink, comprising: a transverse pipe member; a tilt
pipe member, installed at the top of the transverse pipe member,
and having a low section and a high section higher than the low
section; a first vertical pipe, with both ends coupled and
communicated to the transverse pipe member and the low section
respectively; a plurality of second vertical pipes, each with both
ends coupled and communicated to the transverse pipe member and the
high section respectively, such that the transverse pipe member,
the tilt pipe, the first vertical pipe and the second vertical
pipes jointly forming a return pipeline; and a plurality of fins,
coupled to the second vertical pipes.
2. The heat sink module according to claim 1, wherein the first
vertical pipe has a diameter greater than the diameter of each
second vertical pipe.
3. The heat sink module according to claim 2, wherein the
transverse pipe member includes a first joint and a transverse pipe
communicated with each other, and the tilt pipe member includes a
second joint and a tilt pipe communicated with each other, and the
tilt pipe gradually tilts upward in a direction away from the
second joint, so that the low section is formed at the second
joint, and the high section is formed at the tilt pipe, and both
ends of the first vertical pipe are coupled and communicated to the
first joint and the second joint respectively, and both ends of
each second vertical pipe are coupled and communicated to the
transverse pipe and the tilt pipe respectively.
4. The heat sink module according to claim 3, wherein the
transverse pipe, the high section, and the tilt pipe come with a
quantity of two each, and the two transverse pipes are coupled to
both ends of the first joint respectively, and the two tilt pipes
are coupled to both ends of the second joint respectively.
5. The heat sink module according to claim 3, wherein the first
joint and the transverse pipe are configured linearly with respect
to each other.
6. The heat sink module according to claim 3, wherein the
transverse pipe tilts gradually upward in a direction away from the
first joint.
7. The heat sink module according to claim 3, wherein the
transverse pipe tilts gradually downward in a direction away from
the first joint.
8. A heat sink module, applied to a heat generating component,
comprising: a casing, having a through opening, and a first channel
and a second channel communicated with each other, and respectively
and parallelly arranged at upper and lower rows, and the heat
generating component being contained in the first channel; a fan,
installed at the second channel, and having an air outlet; and a
siphon heat sink, comprising: a transverse pipe member; a tilt pipe
member, installed at the top of the transverse pipe member, and
having a low section and a high section higher than the low
section; a first vertical pipe, with both ends coupled and
communicated to the transverse pipe member and the low section
respectively; a plurality of second vertical pipes, each with both
ends coupled and communicated to the transverse pipe member and the
high section respectively, such that the transverse pipe member,
the tilt pipe member, the first vertical pipe and the second
vertical pipes jointly forming a return pipeline; and a plurality
of fins, coupled to the second vertical pipes, wherein the
transverse pipe member being configured to be corresponsive to the
air outlet, and the first vertical pipe and the second vertical
pipes passed and installed into the through opening, and the tilt
pipe member being exposed from the through opening.
9. The heat sink module according to claim 8, wherein the first
vertical pipe has a diameter greater than the diameter of each
second vertical pipe.
10. The heat sink module according to claim 9, wherein the
transverse pipe member includes a first joint and a transverse pipe
communicated with each other, and the tilt pipe member includes a
second joint and a tilt pipe communicated with each other, and the
tilt pipe tilts gradually upward in a direction away from the
second joint, so that the low section is formed at the second
joint, and the high section is formed at the tilt pipe, and both
ends of the first vertical pipe are coupled and communicated to the
first joint and the second joint respectively, and both ends of
each second vertical pipes are coupled and communicated to the
transverse pipe and the tilt pipe respectively.
11. The heat sink module according to claim 10, wherein the
transverse pipe, the high section, and the tilt pipe come with a
quantity of two each, and the two transverse pipes are coupled to
both ends of the first joint respectively, and the two tilt pipes
are coupled to both ends of the second joint respectively.
12. The heat sink module according to claim 10, wherein the first
joint and the transverse pipe are configured linearly with respect
to each other.
13. The heat sink module according to claim 10, wherein the
transverse pipe tilts gradually upward in a direction away from the
first joint.
14. The heat sink module according to claim 10, wherein the
transverse pipe tilts gradually downward in a direction away from
the first joint.
15. The heat sink module according to claim 8, wherein the
transverse pipe member, a part of the first vertical pipe, and a
part of the second vertical pipes jointly define a heating surface,
and the heating surface is tilted with respect to the air
outlet.
16. The heat sink module according to claim 8, wherein the casing
contains a partition plate installed therein, and the first channel
and the second channel are separated and disposed at the upper and
lower sides of the partition plate respectively, and a first vent
and a second vent communicated with the first channel and the
second channel respectively are formed between the casing and the
partition plate.
Description
FIELD OF THE INVENTION
[0001] The technical field relates to a heat sink, more
particularly to a heat sink module and its siphon heat sink.
BACKGROUND OF THE INVENTION
[0002] As science and technology advance, the computation speed of
electronic components such as a central processing unit (CPU), a
graphics processing unit (GPU), a north bridge chip or a random
access memory (RAM) becomes increasingly faster, and the heat
dissipation problem of the electronic component becomes more
serious.
[0003] To enhance the heat dissipating efficiency, a siphon heat
sink as shown in FIG. 1 is developed and available in the market,
and the siphon heat sink comprises an upper transverse pipe C1, a
lower transverse pipe C2, a plurality of vertical pipes C3, a
plurality of fins C4 and a working fluid C6, wherein both ends of
each vertical pipe C3 are coupled and communicated to the upper
transverse pipe C1 and the lower transverse pipe C2 respectively,
and the upper transverse pipe C1, the lower transverse pipe C2 and
the plurality of vertical pipes C3 jointly form a return pipeline
C5, and the fin C4 is coupled to the vertical pipe C3, and the
working fluid C6 is filled in the return pipeline C5. The siphon
heat sink is installed at a heat source, and the working fluid C6
achieves a cooling effect by the principle of a heated and
vaporized gas flowing upward and a condensed and liquefied liquid
flowing downward.
[0004] However, the aforementioned siphon heat sink still has the
following drawbacks. Since the process for the gas-phase working
fluid C6 to flow upward and the liquid-phase working fluid C6 to
flow downward is achieved by the vertical pipe C3, therefore the
content contained in the vertical pipe C3 may conflict with the
gas-phase working fluid C6 flowing upward and the liquid-phase
working fluid C6 flowing downward. Even worse, the gas-phase and
liquid-phase working fluids C6 may conflict with each other clog
the vertical pipe C3, and lower the heat dissipating efficiency of
the siphon heat sink.
[0005] In view of the aforementioned drawbacks of the prior art,
the discloser of this disclosure based on years of experience in
the industry to conduct extensive researches and experiments and
finally provided a feasible solution to overcome the drawbacks of
the prior art effectively.
SUMMARY OF THE INVENTION
[0006] It is a primary objective of this disclosure to provide a
heat sink module and a siphon heat sink thereof, and the principle
of a liquid-phase working fluid flowing to a low position and a
gas-phase working fluid flowing to a high position is used, so that
the liquid-phase working fluid naturally flows towards a first
vertical pipe and a gas-phase working fluid naturally flows towards
a second vertical pipe, so as to achieve the effects of separating
gas and liquid channels, preventing the gas-phase and liquid-phase
working fluids from conflicting with each other or clogging the
pipeline, and improving the heat dissipating efficiency of a siphon
heat sink.
[0007] To achieve the aforementioned and other objectives, this
disclosure provides a siphon heat sink, comprising: a transverse
pipe member; a tilt pipe member, installed at the top of the
transverse pipe member, and having a low section and a high section
higher than the low section; a first vertical pipe, with both ends
coupled and communicated to the transverse pipe member and the low
section respectively; a plurality of second vertical pipes, with
both ends coupled and communicated to the transverse pipe member
and the high section respectively, such that the transverse pipe
member, the tilt pipe member, the first vertical pipe and the
second vertical pipes jointly forming a return pipeline; and a
plurality of fins, coupled to the second vertical pipes.
[0008] To achieve the aforementioned and other objectives, this
disclosure further provides a heat sink module applied to a heat
generating component, and the heat sink module comprises: a casing,
having a through opening, a first channel and a second channel
communicated with each other and arranged in upper and lower rows
respectively, and the heat generating component being contained in
the first channel; a fan, installed at the second channel, and
having an air outlet; and a siphon heat sink, comprising a
transverse pipe member, a tilt pipe member, a first vertical pipe,
a plurality of second vertical pipes, a plurality of fins and a
working fluid, and the tilt pipe being installed at the top of the
transverse pipe member, and the tilt pipe member having a low
section and a high section higher than the low section, and both
ends of the first vertical pipe being coupled and communicated to
the transverse pipe member and the low section respectively, and
both ends of each second vertical pipe being coupled and
communicated to the transverse pipe member and the high section
respectively, and the transverse pipe member, the tilt pipe member,
the first vertical pipe and the second vertical pipes jointly
forming a return pipeline, and each fin being coupled to the second
vertical pipes, and the working fluid being filled in the return
pipeline, and the transverse pipe member being configured to be
corresponsive to the air outlet, and the first vertical pipe and
the second vertical pipes passed and installed into the through
opening, and the tilt pipe member being exposed from the through
opening.
[0009] This disclosure has the following effects:
[0010] 1. The first vertical pipe has a diameter greater than the
diameter of each second vertical pipe, so that the liquid-phase
working fluid flows to the first vertical pipe easily and the
gas-phase working fluid flows to the second vertical pipe
naturally, so as to improve the effect of separating the gas and
liquid channels.
[0011] 2. The transverse pipe member, a part of the first vertical
pipes, and a part of the second vertical pipes jointly define the
heating surface, and the heating surface is tilted with respect to
the air outlet, so as to increase the surface area of the heating
surface and improve the heat dissipating efficiency of the heat
sink module.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a perspective view of a conventional siphon heat
sink;
[0013] FIG. 2 is a perspective view of a siphon heat sink in
accordance with a first preferred embodiment of this
disclosure;
[0014] FIG. 3 is a perspective view of a siphon heat sink in
accordance with a second preferred embodiment of this
disclosure;
[0015] FIG. 4 is a perspective view of a siphon heat sink in
accordance with a fourth preferred embodiment of this disclosure;
and
[0016] FIG. 5 is a perspective view of a heat sink module of this
disclosure.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0017] The technical contents of this disclosure will become
apparent with the detailed description of preferred embodiments
accompanied with the illustration of related drawings as follows.
It is intended that the embodiments and figures disclosed herein
are to be considered illustrative rather than restrictive.
[0018] With reference to FIGS. 2 to 5 for a heat sink module and a
siphon heat sink thereof in accordance with this disclosure, the
siphon heat sink 10 comprises a transverse pipe member 1, a tilt
pipe member 2, a first vertical pipe 3, a plurality of second
vertical pipes 4, a plurality of fins 5; and the heat sink module
100 comprises a casing 20, a fan 30, and the siphon heat sink
10.
[0019] In FIG. 5, the heat sink module 100 is applied to a heat
generating component 200, and the heat generating component 200 is
a computing device or an information processing device of an
electronic component such as a Central Processing Unit (CPU), a
Graphics Processing Unit (GPU), a north bridge chip, a random
access memory (RAM), or any device that generates heat.
[0020] In FIGS. 2 to 4, the transverse pipe member 1 includes a
first joint 11 and one or two transverse pipes 12 communicated with
each other. In the first to third preferred embodiments, the
quantity of transverse pipes 12 is equal to two, and the two
transverse pipes 12 are coupled to both ends of the first joint 11
respectively.
[0021] In FIGS. 2 to 4, the tilt pipe member 2 is installed at the
top of the transverse pipe member 1, and the tilt pipe member 2 has
a low section 21 and one or two high sections 22 higher than the
low section 21.
[0022] Specifically, the tilt pipe member 2 includes a second joint
23 and one or two tilt pipes 24 communicated with one another, and
the tilt pipe 24 tilts gradually upward in a direction away from
the second joint 23, so that the low section 21 is formed at the
second joint 23, and the high section 22 is formed at the tilt pipe
24. In the first to third preferred embodiments, the quantity of
tilt pipes 24 is equal to two, and the two tilt pipes 24 are
coupled to both ends of the second joint 23 respectively.
[0023] In FIGS. 2 to 4, both ends of the first vertical pipe 3 are
coupled and communicated to the transverse pipe member 1 and the
low section 21 respectively. Specifically, both ends of the first
vertical pipe 3 are coupled and communicated to the first joint 11
and the second joint 23 respectively.
[0024] In FIGS. 2 to 4, both ends of each second vertical pipe 4
are coupled and communicated to the transverse pipe member 1 and
the high section 22 respectively, and the transverse pipe member 1,
the tilt pipe member 2, the first vertical pipe 3 and the plurality
of second vertical pipes 4 jointly form a return pipeline p.
[0025] Specifically, the second vertical pipes 4 are arranged apart
and parallel to one another, and both ends of each second vertical
pipe 4 are coupled and communicated to the transverse pipe 12 and
the tilt pipe 24 respectively. In addition, the first vertical pipe
3 has a diameter a greater than the diameter b of each second
vertical pipe 4.
[0026] With reference to FIG. 2 for a siphon heat sink 10 in
accordance with the first preferred embodiment of this disclosure,
the first joint 11 and the transverse pipe 12 of the first
preferred embodiment are configured linearly with respect to each
other. With reference to FIG. 3 for a siphon heat sink 10 in
accordance with the second preferred embodiment of this disclosure,
the transverse pipe 12 of the second preferred embodiment tilts
gradually upward in a direction away from the first joint 11. With
reference to FIG. 4 for a siphon heat sink 10 in accordance with
the third preferred embodiment of this disclosure, the transverse
pipe 12 of the third preferred embodiment gradually tilts downward
in a direction away from the first joint 11. Therefore, the
configuration relation between the first joint 11 and the
transverse pipe 12 may refer to the aforementioned three preferred
embodiments and implemented with any one of them depending on the
actual situation.
[0027] In FIGS. 2 to 4, the plurality of fins 5 is coupled to each
second vertical pipe 4. In FIG. 2, a working fluid 6 is filled in a
return pipeline p, and the working fluid 6 is a cooling medium
selected form the group consisting of pure water, methanol,
acetone, and R134A.
[0028] In FIG. 5, the casing 20 has a through opening 201 and
includes a first channel 202 and a second channel 203 disposed
therein, communicated with one another, and respectively and
parallelly arranged at upper and lower rows, and the heat
generating component 200 is contained in the first channel 202.
[0029] Further, the casing 20 has a partition plate 204 installed
therein, and the first channel 202 and the second channel 203 are
separated and disposed on upper and lower sides of the partition
plate 204 respectively, and a first vent 205 and a second vent 206
communicated with the first channel 202 and the second channel 203
respectively are formed between the casing 20 and the partition
plate 204.
[0030] In FIG. 5, the fan 30 is installed at the second channel
203, and the fan 30 has an air outlet 301. The transverse pipe
member 1 is configured to be corresponsive to the air outlet 301,
and the first vertical pipe 3 and each second vertical pipe 4 are
passed and installed in the through opening 201, and the tilt pipe
member 2 is exposed from the through opening 201.
[0031] In addition, the transverse pipe member 1, a part of the
first vertical pipes 3, and a part of the second vertical pipes 4
jointly define a heating surface s1, and the heating surface s1 is
tilted with respect to the air outlet 301.
[0032] In addition, the tilt pipe member 2 exposed from the through
opening 201, a part of the first vertical pipes 3 and a part of the
second vertical pipes 4 jointly define a cooling surface s2, and
the cooling surface s2 is exposed to the outside to provide a
cooling effect.
[0033] With reference to FIG. 2 for the assembly of a siphon heat
sink 10 of this disclosure, the tilt pipe member 2 is installed at
the top of the transverse pipe member 1, and the tilt pipe member 2
has a low section 21 and a high section 22 higher than the low
section 21. Both ends of the first vertical pipe 3 are coupled and
communicated to the transverse pipe member 1 and the low section 21
respectively. Both ends of each second vertical pipe 4 are coupled
and communicated to the transverse pipe member 1 and the high
section 22 respectively. The transverse pipe member 1, the tilt
pipe member 2, the first vertical pipe 3 and the plurality of
second vertical pipes 4 jointly form a return pipeline p. The fin 5
is coupled to the second vertical pipe 4. The working fluid 6 is
filled in the return pipeline p.
[0034] In FIG. 2, after the working fluid 6 is condensed, the
liquid-phase working fluid 6 flows towards a low position to the
low section 21, so that the liquid-phase working fluid 6 naturally
flows towards the first vertical pipe 3, and after the working
fluid 6 is heated to form a gas-phase working fluid 6, and the
liquid-phase working fluid 6 flows towards the first vertical pipe
3, so that the gas-phase working fluid 6 naturally flows towards
the second vertical pipe 4 to achieve the effects of separating gas
and liquid channels, preventing the gas-phase and liquid-phase
working fluids 6 from conflicting with each other or clogging the
pipeline, so as to improve the heat dissipating efficiency of the
siphon heat sink 10.
[0035] In addition, the first vertical pipe 3 has a diameter a
greater than the diameter b of each second vertical pipe 4, so that
the liquid-phase working fluid 6 flows towards the first vertical
pipe 3 with a larger diameter a more easily, and flows to the
second vertical pipe 4 with a smaller diameter b less easily. Since
the second vertical pipe 4 does not have the liquid-phase working
fluid 6, the resistance in the pipe is low, and the gas-phase
working fluid 6 naturally flows towards the second vertical pipe 4
to achieve the effect of improving the effect of separating the gas
and liquid channels.
[0036] In FIG. 3, the transverse pipe 12 tilts gradually upward in
a direction away from the first joint 11, so that the transverse
pipe 12 can guide the gas-phase working fluid 6 to flow towards the
second vertical pipe 4 naturally to improve the effect of
separating the gas and liquid channels.
[0037] With reference to FIGS. 2 and 5 for an assembly of a heat
sink module 100 of this disclosure, the casing 20 has a through
opening 201 and contains a first channel 202 and a second channel
203 communicated with each other and arranged respectively and
parallelly at upper and lower rows, and the heat generating
component 200 is contained in the first channel 202. The fan 30 is
installed at the second channel 203, and the fan 30 has an air
outlet 301. The transverse pipe member 1 is configured to be
corresponsive to the air outlet 301. The first vertical pipe 3 and
each second vertical pipe 4 are passed and installed in the through
opening 201. The tilt pipe member 2 is exposed from the through
opening 201.
[0038] Therefore, the heat of the heat generating component 200 is
guided to the air outlet 301 and blown out by the fan 30, and the
heat is transferred to the transverse pipe member 1, and the
working fluid 6 inside the transverse pipe member 1 is heated into
a gas-phase working fluid 6, and the gas-phase working fluid 6
flows from each second vertical pipe 4 to the tilt pipe member 2.
Since the tilt pipe member 2 is exposed from the through opening
201, and the tilt pipe member 2 is exposed to the outside,
therefore the working fluid 6 of the tilt pipe member 2 can be
condensed into a liquid phase, and the liquid-phase working fluid 6
returns to the transverse pipe member 1 from the first vertical
pipe 3 to form a return pipeline p.
[0039] In FIG. 5, the transverse pipe member 1, a part of the first
vertical pipes 3, and a part of the second vertical pipes 4 jointly
define a heating surface s1, and the heating surface s1 is tilted
with respect to the air outlet 301 to increase the surface area of
the heating surface s1, so as to improve the heat dissipating
efficiency of the heat sink module 100.
[0040] In summation of the description above, the heat sink module
and its siphon heat sink in accordance with this disclosure are
novel and inventive and comply with patent application
requirements, and thus this disclosure is filed for patent
application.
[0041] While this disclosure has been described by means of
specific embodiments, numerous modifications and variations could
be made thereto by those skilled in the art without departing from
the scope and spirit of this disclosure set forth in the
claims.
* * * * *