U.S. patent application number 15/073578 was filed with the patent office on 2016-07-14 for flexible display apparatus and manufacturing method thereof.
The applicant listed for this patent is E Ink Holdings Inc.. Invention is credited to Lih-Hsiung Chan.
Application Number | 20160205781 15/073578 |
Document ID | / |
Family ID | 56368527 |
Filed Date | 2016-07-14 |
United States Patent
Application |
20160205781 |
Kind Code |
A1 |
Chan; Lih-Hsiung |
July 14, 2016 |
FLEXIBLE DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
Abstract
A flexible display apparatus including a flexible display panel,
a flexible circuit board, a driving chip, and a sealing layer is
provided. The flexible display panel has a display area and a
bonding area located outside the display area. The flexible circuit
board is disposed in the bonding area of the flexible display
panel. The driving chip is disposed on the flexible circuit board.
The sealing layer encapsulates a periphery of the flexible display
panel and extendedly covers the bonding area and a portion of the
flexible circuit board.
Inventors: |
Chan; Lih-Hsiung; (Hsinchu,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
E Ink Holdings Inc. |
Hsinchu |
|
TW |
|
|
Family ID: |
56368527 |
Appl. No.: |
15/073578 |
Filed: |
March 17, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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13950303 |
Jul 25, 2013 |
9326388 |
|
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15073578 |
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Current U.S.
Class: |
361/749 ;
156/247 |
Current CPC
Class: |
G02F 1/13452 20130101;
H05K 2201/10136 20130101; G02F 1/1345 20130101; H05K 2201/10977
20130101; H05K 1/028 20130101; H05K 1/181 20130101; H05K 3/323
20130101; H05K 3/305 20130101; H05K 1/189 20130101 |
International
Class: |
H05K 1/18 20060101
H05K001/18; H05K 3/30 20060101 H05K003/30; H05K 1/02 20060101
H05K001/02 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 26, 2012 |
TW |
101144165 |
Claims
1. A flexible display apparatus, comprising: a flexible display
panel having a display area and a bonding area located outside the
display area; a flexible circuit board disposed in the bonding area
of the flexible display panel; a driving chip disposed on the
flexible circuit board; and a sealing layer encapsulating a
periphery of the flexible display panel and extendedly covering the
bonding area and a portion of the flexible circuit board.
2. The flexible display apparatus as recited in claim 1, further
comprising: an anisotropic conductive film disposed between the
flexible circuit board and the bonding area of the flexible display
panel, wherein the flexible circuit board is electrically connected
to the flexible display panel via the anisotropic conductive
film.
3. The flexible display apparatus as recited in claim 2, wherein
the anisotropic conductive film comprising: an adhesive; and a
plurality of conductive particles distributed in the adhesive,
wherein a diameter of each of the conductive particles ranges from
1 nm to 5 nm.
4. The flexible display apparatus as recited in claim 1, wherein a
location of the driving chip does not overlap with a location of
the flexible display panel.
5. The flexible display apparatus as recited in claim 1, further
comprising: an external circuit connected to the flexible circuit
board, wherein the flexible display panel is electrically connected
to the external circuit via the flexible circuit board.
6. The flexible display apparatus as recited in claim 1, further
comprising: a protective layer disposed on a bottom surface of the
flexible display panel and covering the bottom surface.
7. The flexible display apparatus as recited in claim 1, further
comprising: a protective layer disposed on a top surface of the
flexible display panel, and the sealing layer covering the flexible
circuit board and the protective layer.
8. A flexible display apparatus, comprising: a flexible display
panel having a display area and a bonding area located outside the
display area; a flexible circuit board disposed in the bonding area
of the flexible display panel; a driving chip disposed on the
flexible circuit board; and a hot-melt protective layer covering
the display area and the bonding area of the flexible display panel
and a portion of the flexible circuit board.
9. The flexible display apparatus as recited in claim 8, further
comprising: an anisotropic conductive film disposed between the
flexible circuit board and the bonding area of the flexible display
panel, wherein the flexible circuit board is electrically connected
to the flexible display panel via the anisotropic conductive
film.
10. The flexible display apparatus as recited in claim 9, wherein
the anisotropic conductive film comprising: an adhesive; and a
plurality of conductive particles distributed in the adhesive,
wherein a diameter of each of the conductive particles ranges from
1 nm to 5 nm.
11. The flexible display apparatus as recited in claim 8, wherein a
location of the driving chip does not overlap with a location of
the flexible display panel.
12. The flexible display apparatus as recited in claim 8, further
comprising: an external circuit connected to the flexible circuit
board, wherein the flexible display panel is electrically connected
to the external circuit via the flexible circuit board.
13. The flexible display apparatus as recited in claim 8, further
comprising: a protective layer disposed on a bottom surface of the
flexible display panel and covering the bottom surface.
14. The flexible display apparatus as recited in claim 13, wherein
a material of the protective layer comprising polyethylene
terephthalate.
15. The flexible display apparatus as recited in claim 8, wherein a
material of the hot-melt protective layer comprises polyethylene
terephthalate mixed with a hot-melt material, a weight percentage
of the hot-melt material is 30% to 60%, and the hot-melt material
comprises Polyurethane or Ethylene-Vinyl Acetate.
16. A manufacturing method of a flexible display apparatus,
comprising: providing a substrate; forming a flexible display panel
on the substrate, wherein the flexible display panel has a display
area and a bonding area located outside the display area; bonding a
driving chip on the bonding area of the flexible display panel via
at least one flexible circuit board; forming a hot-melt protective
layer on the display area and the bonding area of the flexible
display panel and a portion of the flexible circuit board;
performing a heating step to soften the hot-melt protective layer;
and separating the flexible display panel from the substrate.
17. The manufacturing method of the flexible display apparatus as
recited in claim 16, wherein the step of forming the flexible
display panel on the substrate comprises: forming an adhesive layer
on the substrate; and forming the flexible display panel on the
substrate, wherein the flexible display panel is adhered to the
substrate via the adhesive layer.
18. The manufacturing method of the flexible display apparatus as
recited in claim 16, wherein the driving chip is disposed on the
flexible circuit board, and a location of the driving chip does not
overlap with a location of the flexible display panel.
19. The manufacturing method of the flexible display apparatus as
recited in claim 16, wherein the flexible circuit board is bonded
to the bonding area of the flexible display panel via an
anisotropic conductive film.
20. The manufacturing method of the flexible display apparatus as
recited in claim 16, further comprising: after separating the
flexible display panel from the substrate, bonding an external
circuit to the flexible circuit board, wherein the flexible display
panel is electrically connected to the external circuit via the
flexible circuit board.
21. The manufacturing method of the flexible display apparatus as
recited in claim 16, wherein a temperature of the heating step is
between 70.degree. C. and 140.degree. C.
22. The manufacturing method of the flexible display apparatus as
recited in claim 16, further comprising: after separating the
flexible display panel from the substrate, bonding a protective
layer to a bottom surface of the flexible display panel.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation-in-part application of
and claims the priority benefit of a prior application Ser. No.
13/950,303, filed on Jul. 25, 2013, now allowed. The prior
application Ser. No. 13/950,303 claims the priority benefit of
Taiwan application Ser. No. 101144165, filed on Nov. 26, 2012. The
entirety of each of the above-mentioned patent applications is
hereby incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a display apparatus and a
manufacturing method thereof, and more particularly to a flexible
display apparatus and a manufacturing method thereof.
[0004] 2. Description of Related Art
[0005] With rapid development of display technologies, conventional
cathode ray tube (CRT) displays have been gradually replaced by
flat panel displays (FPD). In comparison with the FPD formed by a
rigid substrate (e.g. a glass substrate), a flexible display in
which an active device is formed on a flexible substrate has been
developed according to recent researches because the flexible
substrate (e.g. a plastic substrate or a metal thin plate) is
characterized by flexibility and impact endurance.
[0006] Generally speaking, if an active device is to be formed on a
flexible substrate, the flexible substrate is often adhered to the
rigid substrate, and then a series of transistor manufacturing
process (a scan line, data line, pixel unit, storage capacitor,
gate insulation layer, protection layer, and etc.) can be performed
to form a flexible display panel. Thereafter, a driving chip (e.g.
a scan driving chip and a data driving chip) is disposed on a trace
layer in a periphery area of the flexible display panel by chip on
glass (COG) bonding technique to be electrically connected to the
driving chip and the flexible display panel. After all the
processes are completely performed, the flexible display panel is
removed from the rigid substrate.
[0007] However, since a pin of the driving chip has rigidity and is
not flexible, when removing the flexible display panel from the
rigid substrate, the pin of the driving chip is likely to be broken
or the trace layer in the periphery area of the flexible display
panel is likely to have a broken line or a break, causing a defect
in the panel or reducing the reliability of the flexible
display.
SUMMARY OF THE INVENTION
[0008] The invention provides a flexible display apparatus having a
better reliability.
[0009] The invention provides a manufacturing method of a flexible
display apparatus for manufacturing the aforementioned flexible
display apparatus.
[0010] The invention provides a flexible display apparatus,
including a flexible display panel, a flexible circuit board, a
driving chip, and a sealing layer. The flexible display panel has a
display area and a bonding area located outside the display area.
The flexible circuit board is disposed in the bonding area of the
flexible display panel. The driving chip is disposed on the
flexible circuit board. The sealing layer encapsulates a periphery
of the flexible display panel and extendedly covers the bonding
area and a portion of the flexible circuit board.
[0011] In one embodiment of the invention, the flexible display
apparatus further includes an anisotropic conductive film disposed
between the flexible circuit board and the bonding area of the
flexible display panel, wherein the flexible circuit board is
electrically connected to the flexible display panel via the
anisotropic conductive film.
[0012] In one embodiment of the invention, the anisotropic
conductive film includes an adhesive and a plurality of conductive
particles. The conductive particles are distributed in the
adhesive, wherein a diameter of each of the conductive particles
ranges from 1 nm to 5 nm.
[0013] In an embodiment of the invention, a location of the driving
chip does not overlap with a location of the flexible display
panel.
[0014] In an embodiment of the invention, the flexible display
apparatus further includes an external circuit connected to the
flexible circuit board; the flexible display panel is electrically
connected to the external circuit via the flexible circuit
board.
[0015] In an embodiment of the invention, the flexible display
apparatus further includes a protective layer disposed on a bottom
surface of the flexible display panel and covering the bottom
surface.
[0016] In an embodiment of the invention, the flexible display
apparatus further includes a protective layer disposed on a top
surface of the flexible display panel, and the sealing layer
covering the flexible circuit board and the protective layer.
[0017] The invention further provides a flexible display apparatus,
including a flexible display panel, a flexible circuit board, a
driving chip, and a hot-melt protective layer. The flexible display
panel has a display area and a bonding area located outside the
display area. The flexible circuit board is disposed in the bonding
area of the flexible display panel. The driving chip is disposed on
the flexible circuit board. The hot-melt protective layer covers
the display area and the bonding area of the flexible display panel
and a portion of the flexible circuit board.
[0018] In an embodiment of the invention, the flexible display
apparatus further includes an anisotropic conductive film disposed
between the flexible circuit board and the bonding area of the
flexible display panel, wherein the flexible circuit board is
electrically connected to the flexible display panel via the
anisotropic conductive film.
[0019] In an embodiment of the invention, the anisotropic
conductive film includes an adhesive and a plurality of conductive
particles. The conductive particles are distributed in the
adhesive, wherein a diameter of each of the conductive particles
ranges from 1 nm to 5 nm.
[0020] In an embodiment of the invention, a location of the driving
chip does not overlap with a location of the flexible display
panel.
[0021] In an embodiment of the invention, the flexible display
apparatus further includes an external circuit connected to the
flexible circuit board, wherein the flexible display panel is
electrically connected to the external circuit via the flexible
circuit board.
[0022] In an embodiment of the invention, the flexible display
apparatus further includes a protective layer disposed on a bottom
surface of the flexible display panel and covering the bottom
surface.
[0023] In an embodiment of the invention, a material of the
protective layer includes polyethylene terephthalate (PET).
[0024] In an embodiment of the invention, a material of the
hot-melt protective layer includes polyethylene terephthalate mixed
with a hot-melt material, a weight percentage of the hot-melt
material is 30% to 60%, and the hot-melt material includes
Polyurethane (PU) or Ethylene-Vinyl Acetate (EVA).
[0025] The invention further provides a manufacturing method of a
flexible display apparatus, including steps of providing a
substrate, forming a flexible display panel on the substrate,
wherein the flexible display panel has a display area and a bonding
area located outside the display area, bonding a driving chip on
the bonding area of the flexible display panel via at least one
flexible circuit board, forming a hot-melt protective layer on the
display area and the bonding area of the flexible display panel and
a portion of the flexible circuit board, performing a heating step
to soften the hot-melt protective layer, and separating the
flexible display panel from the substrate.
[0026] In an embodiment of the invention, the step of forming the
flexible display panel on the substrate includes forming an
adhesive layer on the substrate, and forming the flexible display
panel on the substrate, wherein the flexible display panel is
adhered to the substrate via the adhesive layer.
[0027] In an embodiment of the invention, the driving chip is
disposed on the flexible circuit board, and a location of the
driving chip does not overlap with a location of the flexible
display panel.
[0028] In an embodiment of the invention, the flexible circuit
board is bonded to the bonding area of the flexible display panel
via an anisotropic conductive film.
[0029] In an embodiment of the invention, the manufacturing method
of the flexible display apparatus further includes bonding an
external circuit to the flexible circuit board after separating the
flexible display panel from rigid substrate, wherein the flexible
display panel is electrically connected to the external circuit via
the flexible circuit board.
[0030] In an embodiment of the invention, a temperature of the
heating step is between 70.degree. C. and 140.degree. C.
[0031] In an embodiment of the invention, the manufacturing method
of the flexible display apparatus further includes bonding a
protective layer to a bottom surface of the flexible display panel
after separating the flexible display panel from the substrate.
[0032] Based on the above, since the flexible display apparatus in
the embodiments of the invention adopts a chip on film (COF)
technique that allows the driving chip to be disposed on the
flexible display panel, the driving chip disposed on the flexible
circuit board is not bended easily (the flexible circuit board is
the one bended by stress). Therefore, the situation in which the
pin of a conventional driving chip is broken may be avoided. In
addition, since the flexible display apparatus in the embodiments
of the invention has a sealing layer or a hot-melt protective
layer, when separating the flexible display panel from the rigid
substrate, the sealing layer or the hot-melt protective layer may
reinforce a structure strength between the flexible display panel
and the flexible circuit board so as to further enhance an overall
structural reliability of the flexible display apparatus.
[0033] In order to make the aforementioned features and advantages
of the invention more comprehensible, embodiments accompanying
figures are described in detail below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0034] The accompanying drawings are included to provide further
understanding, and are incorporated in and constitute a part of
this specification. The drawings illustrate exemplary embodiments
and, together with the description, serve to explain the principles
of the invention.
[0035] FIG. 1A illustrates a schematic cross-sectional view of a
flexible display apparatus in an embodiment of the invention.
[0036] FIG. 1B illustrates a schematic top view of the flexible
display apparatus in FIG. 1A.
[0037] FIG. 2 illustrates a schematic cross-sectional view of a
flexible display apparatus in another embodiment of the
invention.
[0038] FIG. 3 illustrates a schematic cross-sectional view of a
flexible display apparatus in another embodiment of the
invention.
[0039] FIG. 4 illustrates a schematic cross-sectional view of a
flexible display apparatus in another embodiment of the
invention.
[0040] FIG. 5 illustrates a schematic top view of a flexible
display apparatus in another embodiment of the invention.
[0041] FIG. 6 illustrates a schematic top view of a flexible
display apparatus in another embodiment of the invention.
[0042] FIG. 7A illustrates a schematic cross-sectional view of a
flexible display apparatus in an embodiment of the invention.
[0043] FIG. 7B illustrates a schematic top view of the flexible
display apparatus in FIG. 7A.
[0044] FIGS. 8A to 8E illustrate a schematic cross-sectional view
of a manufacturing method of a flexible display apparatus in an
embodiment of the invention.
[0045] FIG. 9 illustrates a schematic cross-sectional view of a
flexible display apparatus in another embodiment of the
invention.
[0046] FIG. 10 illustrates a schematic top view of a flexible
display apparatus in another embodiment of the invention.
[0047] FIG. 11 illustrates a schematic top view of a flexible
display apparatus in another embodiment of the invention.
DESCRIPTION OF EMBODIMENTS
[0048] FIG. 1A illustrates a schematic cross-sectional view of a
flexible display apparatus in an embodiment of the invention. FIG.
1B illustrates a schematic top view of the flexible display
apparatus in FIG. 1A. With reference to both to FIGS. 1A and 1B, a
flexible display apparatus 100a in the embodiment includes a
flexible display panel 120, at least one driving chip 130, at least
one flexible circuit boards 140, and a sealing layer 160. The
flexible display panel 120 has a display area 121 and the bonding
area 123 located outside the display area 121. The flexible circuit
boards 140 are disposed in the bonding area 123 of the flexible
display panel 120. The driving chips 130 are disposed on the
flexible circuit boards 140. The sealing layer 160 encapsulates a
periphery of the flexible display panel 120 and extendedly covers
the bonding area 123 and a portion of the flexible circuit boards
140.
[0049] More specifically, the flexible display panel 120 in the
embodiment may be a flexible low-temperature polysilicon
thin-film-transistor liquid crystal display panel, a flexible
amorphous-Silicon thin-film-transistor liquid crystal display
panel, a flexible polycrystalline silicon thin-film-transistor
liquid crystal display panel, a flexible electrophoretic display
panel, or a flexible organic electroluminescent display panel,
however, the invention is not limited thereto.
[0050] With reference to FIGS. 1A and 1B again, the driving chips
130 of the present embodiment are respectively disposed on the
flexible circuit board 140, and the flexible circuit boards 140 are
bonded to the bonding area 123 of the flexible display panel 120
via an anisotropic conductive film 150. In other words, the
anisotropic conductive film 150 is disposed between the flexible
circuit board 140 and the bonding area 123 of the flexible display
panel 120, wherein the flexible circuit board 140 is electrically
connected to the flexible display panel 120 via the anisotropic
conductive film 150. Specifically, locations of the driving chips
130 in the embodiment do not overlap with a location of the
flexible display panel 120. The anisotropic conductive film 150
includes an adhesive 152 and a plurality of conductive particles
154. The conductive particles 154 are distributed in the adhesive
152, wherein a diameter of each of the conductive particles 154
ranges from 1 nm to 5 nm. In the embodiment, the driving chips 130
are, for example, signal line driving chip or scan line driving
chip, however, the invention is not limited thereto.
[0051] Since the driving chips 130 of the flexible display
apparatus 100a in the embodiment are disposed on the flexible
display panel 120 via the flexible circuit boards 140 (i.e. the
chip on film (COF) technique), the driving chips 130 disposed on
the flexible circuit boards 140 are not bended easily (the flexible
circuit boards 140 are the one bended by stress). Therefore, the
situation in which the pin of a conventional driving chip is broken
may be avoided. In addition, since the flexible display apparatus
100a in the embodiment has the sealing layer 160, wherein the
sealing layer 160 encapsulates the periphery of the flexible
display panel 120 and extendedly covers the bonding area 123 and
the flexible circuit boards 140, the sealing layer 160 may
reinforce a structure strength between the flexible display panel
120 and the flexible circuit boards 140 so as to further enhance an
overall structural reliability of the flexible display apparatus
100a. In brief, the flexible display apparatus 100a in the
embodiment has a higher structural reliability.
[0052] It needs to be indicated that the reference numbers and a
part of the content referred in the previous embodiments are
recited in the following embodiments, wherein the same reference
numbers are used to represent the same or similar devices, and the
description of the same technical content is omitted. Please refer
to the previous embodiments for the omitted description. The same
description is not repeated in the following embodiments.
[0053] FIG. 2 illustrates a schematic cross-sectional view of a
flexible display apparatus in another embodiment of the invention.
With reference to both FIGS. 1A and 2, a flexible display apparatus
100b in FIG. 2 is similar to the flexible display apparatus 100a in
FIG. 1A, while the main difference therebetween lies in that the
flexible display apparatus 100b in the embodiment further includes
a protective layer 180 disposed on a top surface 122 of the
flexible display panel 120 for protecting the top surface 122 of
the flexible display panel 120. Herein, the sealing layer 160
covers the flexible circuit board 140 and a portion of the
protective layer 180. A material of the protective layer 180
includes polyethylene terephthalate (PET).
[0054] FIG. 3 illustrates a schematic cross-sectional view of a
flexible display apparatus in another embodiment of the invention.
With reference to both FIGS. 1A and 3, a flexible display apparatus
100c in FIG. 3 is similar to the flexible display apparatus 100a in
FIG. 1A, while the main difference therebetween lies in that the
flexible display apparatus 100c in the embodiment further includes
a protective layer 190 disposed on a bottom surface 124 of the
flexible display panel 120 and covering the bottom surface 124 for
strengthening the stability of the flexible display panel 120 and
providing waterproof function. A material of the protective layer
190 includes polyethylene terephthalate (PET).
[0055] FIG. 4 illustrates a schematic cross-sectional view of a
flexible display apparatus in another embodiment of the invention.
With reference to both FIGS. 1A and 4, a flexible display apparatus
100d in FIG. 4 is similar to the flexible display apparatus 100a in
FIG. 1A, while the main difference therebetween lies in that the
flexible display apparatus 100d in the embodiment further includes
a protective layer 180 disposed on a top surface 122 of the
flexible display panel 120 for protecting the top surface 122 of
the flexible display panel 120, and a protective layer 190 disposed
on a bottom surface 124 of the flexible display panel 120 for
strengthening the stability of the flexible display panel 120 and
providing waterproof function. Herein, the sealing layer 160 covers
the flexible circuit board 140 and a portion of the protective
layer 180, and the protective layer 190 completely covers the
bottom surface 124. A material of the protective layer 180 and a
material of the protective layer 190 include polyethylene
terephthalate (PET).
[0056] FIG. 5 illustrates a schematic top view of a flexible
display apparatus in another embodiment of the invention. With
reference to both FIGS. 1B and 5, a flexible display apparatus 100e
in FIG. 5 is similar to the flexible display apparatus 100a in FIG.
1 B, while the main difference therebetween lies in that the
flexible display apparatus 100e in the embodiment further includes
an external circuit 170, wherein the external circuit 170 is
connected to a portion of the flexible circuit boards 140 and the
flexible display panel 120 is electrically connected to the
external circuit 170 via the flexible circuit boards 140. In the
embodiment, the external circuit 170 is, for example, a flexible
printed circuit (FPC) board, but the invention is not limited
thereto.
[0057] It should be mentioned that the invention provides no
limitation to the shape structure and disposition of the external
circuit 170. Although the specific shape of the external circuit
170 referred in the embodiment is in a rectangle and is
electrically connected only to the portion of the flexible circuit
boards 140, in other embodiments, please refer to FIG. 6, a shape
of the external circuit 175 of the flexible display apparatus 100f
may also be in an L shape and the external circuit 175 is
electrically connected to the whole flexible circuit boards 140,
which is also an adoptable technical solution in the invention and
does not depart from the scope to be protected in the
invention.
[0058] FIG. 7A illustrates a schematic cross-sectional view of a
flexible display apparatus in an embodiment of the invention. FIG.
7B illustrates a schematic top view of the flexible display
apparatus in FIG. 7A. With reference to both FIGS. 7A and 7B, a
flexible display apparatus 200a in FIGS. 7A and 7B is similar to
the flexible display apparatus 100a in FIGS. 1A and 1B, while the
main difference therebetween lies in that the flexible display
apparatus 200a in the embodiment uses a hot-melt protective layer
210 instead of the sealing layer 160. In more detail, the hot-melt
protective layer 210 in the present embodiment covers the display
area 121 and the bonding area 123 of the flexible display panel 120
and a portion of the flexible circuit board 140. Herein, a material
of the hot-melt protective layer 210 includes polyethylene
terephthalate mixed with a hot-melt material, a weight percentage
of the hot-melt material is 30% to 60%, and the hot-melt material
includes Polyurethane (PU) or Ethylene-Vinyl Acetate (EVA).
[0059] A method of manufacturing the flexible display apparatus
200a in the present embodiment is described as follows. FIGS. 8A to
8E illustrate a schematic cross-sectional view of a manufacturing
method of a flexible display apparatus in an embodiment of the
invention. As indicated in FIG. 8A, according to the manufacturing
method of the flexible display apparatus 200a in the embodiment,
first of all, a rigid substrate 110 is provided, wherein the rigid
substrate 110 is, for example, a glass substrate or a substrate
formed of other appropriate materials for being used as a
supporter.
[0060] Next, please refer to both FIGS. 7B and 8A. A flexible
display panel 120 is formed on the rigid substrate 110, wherein the
flexible display panel 120 has a display area 121 and a bonding
area 123 located outside the display area 121. In the embodiment, a
shape of the bonding area 123 of the flexible display panel 120 is,
for example, in an L shape, however, the invention is not limited
thereto.
[0061] More specifically, before the flexible display panel 120 is
formed on the rigid substrate 110, an adhesive layer 115 is formed
on the rigid substrate 110, and the flexible display panel 120 in
the embodiment is adhered to the rigid substrate 110 via the
adhesive layer 115. In the embodiment, the flexible display panel
120 may be a flexible low-temperature polysilicon
thin-film-transistor liquid crystal display panel, a flexible
amorphous-Silicon thin-film-transistor liquid crystal display
panel, a flexible polycrystalline silicon thin-film-transistor
liquid crystal display panel, a flexible electrophoretic display
panel, or a flexible organic electroluminescent display panel,
however, the invention is not limited thereto.
[0062] With reference to both FIGS. 7B and 8B, at least one driving
chip 130 (a plurality of driving chips are schematically
illustrated in FIG. 7B) is bonded to the bonding area 123 of the
flexible display panel 120 via at least one flexible circuit board
140 (a plurality of flexible circuit boards are schematically
illustrated in FIG. 7B). In the embodiment, the driving chips 130
are respectively disposed on the flexible circuit board 140, and
the flexible circuit boards 140 are bonded to the bonding area 123
of the flexible display panel 120 via an anisotropic conductive
film 150. The anisotropic conductive film 150 in the present
embodiment includes an adhesive 152 and a plurality of conductive
particles 154. The conductive particles 154 are distributed in the
adhesive 152, wherein a diameter of each of the conductive
particles 154 ranges from 1 nm to 5 nm. Specifically, locations of
the driving chips 130 in the embodiment do not overlap with a
location of the flexible display panel 120. In the embodiment, the
driving chips 130 are, for example, signal line driving chip or
scan line driving chip, however, the invention is not limited
thereto.
[0063] With reference to both FIGS. 7B and 8C, a hot-melt
protective layer 210 is formed on the display area 121 and the
bonding area 123 of the flexible display panel 120 and a portion of
the flexible circuit board 140. Herein, a material of the hot-melt
protective layer 210 includes polyethylene terephthalate (PET)
mixed with a hot-melt material, a weight percentage of the hot-melt
material is 30% to 60%, and the hot-melt material includes
Polyurethane (PU) or Ethylene-Vinyl Acetate (EVA).
[0064] With reference to both FIGS. 7B and 8D, a heating step is
perfoiined to soften the hot-melt protective layer 210, so that the
hot-melt protective layer 210 adheres to a top surface 122 of the
flexible display panel 120 and a portion of the flexible circuit
board 140. Herein, a temperature of the heating step is between
70.degree. C. and 140.degree. C., and a duration of the heating
step is between 1 minute and 30 minutes.
[0065] Finally, with reference to both FIGS. 7B and 8E, the
flexible display panel 120 is separated from the rigid substrate
110 to form a flexible display apparatus 200a, which is the final
step of completing manufacturing the flexible display apparatus
200a.
[0066] Since the flexible display apparatus 200a in the present
embodiments adopts a chip on film (COF) technique that allows the
driving chip 130 to be disposed on the flexible display panel 120,
when separating the flexible display panel 120 from the rigid
substrate 110, the driving chip 130 disposed on the flexible
circuit board 140 is not bended easily (the flexible circuit board
140 is the one bended by stress). Therefore, the situation in which
the pin of a conventional driving chip is broken may be avoided. In
addition, since the flexible display apparatus 200a in the
embodiments of the invention has a hot-melt protective layer 210,
wherein the hot-melt protective layer 210 completely covers the
display area 121 and the bonding area 123 of the flexible display
panel 120 and extendedly covers a portion of the flexible circuit
board 140, when separating the flexible display panel 120 from the
rigid substrate 110, the hot-melt protective layer 210 may
reinforce a structure strength between the flexible display panel
120 and the flexible circuit board 140 so as to further enhance an
overall structural reliability of the flexible display apparatus
200a.
[0067] FIG. 9 illustrates a schematic cross-sectional view of a
flexible display apparatus in another embodiment of the invention.
With reference to both FIGS. 7A and 9, a flexible display apparatus
200b in FIG. 9 is similar to the flexible display apparatus 200a in
FIG. 7A, while the main difference therebetween lies in that the
flexible display apparatus 200b in the embodiment further includes
a protective layer 220 disposed on a bottom surface 124 of the
flexible display panel 120 and covering the bottom surface 124 for
strengthening the stability of the flexible display panel 120 and
providing waterproof function. A material of the protective layer
220 includes polyethylene terephthalate (PET).
[0068] FIG. 10 illustrates a schematic top view of a flexible
display apparatus in another embodiment of the invention. With
reference to both FIGS. 7B and 10, a flexible display apparatus
200c in FIG. 10 is similar to the flexible display apparatus 200a
in FIG. 7B, while the main difference therebetween lies in that the
flexible display apparatus 200c in the embodiment further includes
an external circuit 170, wherein the external circuit 170 is
connected to a portion of the flexible circuit boards 140 and the
flexible display panel 120 is electrically connected to the
external circuit 170 via the flexible circuit boards 140. In the
embodiment, the external circuit 170 is, for example, a flexible
printed circuit (FPC) board, but the invention is not limited
thereto.
[0069] It should be mentioned that the invention provides no
limitation to the shape structure and disposition of the external
circuit 170. Although the specific shape of the external circuit
170 referred in the embodiment is in a rectangle and is
electrically connected only to the portion of the flexible circuit
boards 140, in other embodiments, please refer to FIG. 11, a shape
of the external circuit 175 of the flexible display apparatus 200d
may also be in an L shape and the external circuit 175 is
electrically connected to the whole flexible circuit boards 140,
which is also an adoptable technical solution in the invention and
does not depart from the scope to be protected in the
invention.
[0070] To sum up, since the flexible display apparatus in the
embodiments of the invention adopts a chip on film (COF) technique
that allows the driving chip to be disposed on the flexible display
panel, the driving chip disposed on the flexible circuit board is
not bended easily (the flexible circuit board is the one bended by
stress). Therefore, the situation in which the pin of a
conventional driving chip is broken may be avoided. In addition,
since the flexible display apparatus in the embodiments of the
invention has a sealing layer or a hot-melt protective layer, when
separating the flexible display panel from the rigid substrate, the
sealing layer or the hot-melt protective layer may reinforce a
structure strength between the flexible display panel and the
flexible circuit board so as to further enhance an overall
structural reliability of the flexible display apparatus.
[0071] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
disclosed embodiments without departing from the scope or spirit of
the invention. In view of the foregoing, it is intended that the
disclosure cover modifications and variations of this specification
provided they fall within the scope of the following claims and
their equivalents.
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