U.S. patent application number 15/074885 was filed with the patent office on 2016-07-14 for transistor, semiconductor device and method of manufacturing the same.
This patent application is currently assigned to SK hynix Inc.. The applicant listed for this patent is SK hynix Inc.. Invention is credited to Jin Ho BIN, Soo Jin KIM, Ki Hong LEE, Seung Ho PYI.
Application Number | 20160204025 15/074885 |
Document ID | / |
Family ID | 53798828 |
Filed Date | 2016-07-14 |
United States Patent
Application |
20160204025 |
Kind Code |
A1 |
LEE; Ki Hong ; et
al. |
July 14, 2016 |
TRANSISTOR, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE
SAME
Abstract
A semiconductor device including a central region, side regions
located in both sides of the central region, and conductive layers
including a first barrier pattern formed in the central region, a
material pattern formed in the first barrier pattern and having an
etch selectivity with respect to the first barrier pattern, and a
second barrier pattern formed in the material pattern; and
insulating layers alternately stacked with the conductive
layers.
Inventors: |
LEE; Ki Hong; (Gyeonggi-do,
KR) ; BIN; Jin Ho; (Seoul, KR) ; KIM; Soo
Jin; (Seoul, KR) ; PYI; Seung Ho;
(Gyeonggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SK hynix Inc. |
Gyeonggi-do |
|
KR |
|
|
Assignee: |
SK hynix Inc.
|
Family ID: |
53798828 |
Appl. No.: |
15/074885 |
Filed: |
March 18, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14324953 |
Jul 7, 2014 |
9324824 |
|
|
15074885 |
|
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Current U.S.
Class: |
438/627 |
Current CPC
Class: |
H01L 29/40114 20190801;
H01L 29/66833 20130101; H01L 21/76879 20130101; H01L 21/76847
20130101; H01L 29/4991 20130101; H01L 27/11556 20130101; H01L
29/4941 20130101; H01L 29/0649 20130101; H01L 29/495 20130101; H01L
27/11582 20130101; H01L 29/40117 20190801; H01L 29/7828 20130101;
H01L 29/66825 20130101 |
International
Class: |
H01L 21/768 20060101
H01L021/768 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 14, 2014 |
KR |
10-2014-0017372 |
Claims
1-20. (canceled)
21. A method of manufacturing a semiconductor device, comprising:
alternately forming first material layers and second material
layers; forming a slit passing through the first material layers
and the second material layers; forming first openings by removing
the first material layers through the slit; forming a first barrier
layer in the first openings; forming a material layer having an
etch selectivity with respect to the first barrier layer in the
first openings in which the first barrier layer is formed; forming
a second barrier layer in the first openings in which the material
layer is formed; forming second openings by removing the first
barrier layer, the material layer and the second barrier layer
formed in side regions of the first openings through the slit; and
forming conductive patterns in the second openings.
22. The method of claim 21, further comprising: forming third
barrier patterns in the second openings before forming the
conductive patterns.
23. The method of claim 21, wherein the forming of the second
openings includes: partially etching the second barrier layer to
expose the material layer; forming a material pattern by partially
etching the exposed material layer; and forming a first barrier
pattern surrounding the material pattern, and a second barrier
pattern located in the material pattern by partially etching the
first barrier layer and the second barrier layer.
24. The method of claim 23, wherein the forming of the first
barrier pattern and the second barrier pattern includes partially
etching the first barrier layer and the second barrier layer using
a dry etching process.
25. The method of claim 23, wherein the forming of the first
barrier pattern and the second barrier pattern includes: forming
the first barrier pattern and a groove in the material pattern by
etching the second barrier layer and a portion of the first barrier
layer using a wet etching process; forming a fourth barrier layer
in the second opening to fill the groove; and forming a fourth
barrier pattern in the groove by dry etching the fourth barrier
layer.
26. The method of claim 23, wherein the forming of the first
barrier pattern and the second barrier pattern includes forming the
first barrier pattern and a groove in the material pattern by
etching the second barrier layer and a portion of the first barrier
layer using a wet etching process.
27. The method of claim 26, further comprising: forming a third
barrier layer filling the groove and surrounding the conductive
pattern before forming the conductive patterns.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application claims priority to Korean patent
application number 10-2014-0017372, filed on Feb. 14, 2014 the
entire disclosure of which is incorporated herein in its entirety
by reference.
BACKGROUND
[0002] 1. Field of Invention
[0003] Various exemplary embodiments of the present invention
relate generally to a transistor, a semiconductor device and a
method of manufacturing the same, and more particularly, to a
transistor having a 3-dimensional structure, a semiconductor device
and a method of manufacturing the same.
[0004] 2. Description of Related Art
[0005] Nonvolatile memory devices are memory devices that retain
stored data even when their power supplies are interrupted. Since
the degree of integration of a 2-dimensional nonvolatile memory
device configured to form a memory cell in a single-layer on a
substrate has reached a limit, a 3-dimensional nonvolatile memory
device that vertically stacks memory cells on the substrate has
been proposed.
[0006] The 3-dimensional nonvolatile memory device includes
interlayer insulating layers and gate electrodes, which are
alternately stacked, channel layers passing there through, and
memory cells stacked along the channel layers. During the
manufacturing process of the 3-dimensional nonvolatile memory
device, after alternately stacking a plurality of oxide layers and
a plurality of nitride layers, the stacked gate electrodes are
formed by replacing the plurality of nitride layers with a
plurality of conductive layers.
[0007] However, there is a concern that the process of replacing
the nitride layers with the conductive layers is quite difficult.
Particularly in the process of replacing the nitride layers with
the conductive layers, reactive gases remain in stacked materials.
The surrounding layers may be damaged by the remaining reactive
gases, and thus the characteristics of the memory device may be
degraded.
SUMMARY
[0008] Exemplary embodiments of the present invention are directed
to a transistor, a semiconductor device and a method of
manufacturing the same in which the characteristics of a memory
device are enhanced.
[0009] According to an embodiment of the present invention, a
semiconductor device includes: conductive layers each having a
central region and side regions located in both sides of the
central region, the conductive layers each including a first
barrier pattern formed in the central region, a material pattern,
which is formed in the first barrier pattern and has an etch
selectivity with respect to the first barrier pattern, and a second
barrier pattern formed in the material' pattern; and insulating
layers alternately stacked with the conductive layers.
[0010] Another embodiment of the present invention provides a
transistor including: a channel layer; a gate electrode including a
first barrier pattern surrounding a sidewall of the channel layer,
a material pattern, which is formed in the first barrier pattern
and has an etch selectivity with respect to the first barrier
pattern and a second barrier pattern formed in the material
pattern, wherein the gate electrode includes a conductive pattern
formed only in a side region of one side with respect to the
channel layer; and a dielectric layer interposed between the
channel layer and the gate electrode.
[0011] Yet another embodiment of the present invention provides a
method of manufacturing a semiconductor device including:
alternately forming first material layers and second material
layers; forming a slit passing through the first material layers
and the second material layers; forming first openings by removing
the first material layers through the slit; forming a first barrier
layer in the first openings; forming a material layer having an
etch selectivity with respect to the first barrier layer in the
first openings in which the first barrier layer is formed; forming
a second barrier layer in the first openings in which the material
layer is formed; forming second openings by removing the first
barrier layer, the material layer and the second barrier layer
formed in side regions of the first openings through the slit; and
forming conductive patterns in the second openings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The above and other features and advantages of the present
invention will become more apparent to those of ordinary skill in
the art by describing in detail exemplary embodiments thereof with
reference to the attached drawings in which:
[0013] FIGS. 1A to 1C are views illustrating a structure of a
semiconductor device according to an embodiment of the present
invention;
[0014] FIGS. 2A to 2C are views illustrating a structure of a
semiconductor device according to an embodiment of the present
invention;
[0015] FIGS. 3A to 3C are views illustrating a structure of a
semiconductor device according to an embodiment of the present
invention;
[0016] FIG. 4 is a cross-sectional view illustrating a structure of
a semiconductor device according to an embodiment of the present
invention;
[0017] FIGS. 5A to 5F are cross-sectional views illustrating a
method of manufacturing a semiconductor device according to an
embodiment of the present invention;
[0018] FIGS. 6A to 6E are cross-sectional views illustrating a
method of manufacturing a semiconductor device according to an
embodiment of the present invention;
[0019] FIGS. 7A and 7B are cross-sectional views illustrating a
method of manufacturing a semiconductor device according to an
embodiment of the present invention;
[0020] FIG. 8 is a block diagram illustrating a configuration of a
memory system according to an embodiment of the present
invention;
[0021] FIG. 9 is a block diagram illustrating a configuration of a
memory system accord ng to an embodiment of the present
invention;
[0022] FIG. 10 is a block diagram illustrating a configuration of a
computing system according to an embodiment of the present
invention; and
[0023] FIG. 11 is a block diagram illustrating a computing system
according to an embodiment of the present invention.
DETAILED DESCRIPTION
[0024] Hereinafter, preferred embodiments of the present invention
will be described. In the drawings elements and regions are not
drawn to scale, and their sizes and thicknesses may be exaggerated
for clarity. In the description of the present invention known
configurations that are not central to the principles of the
present invention may be omitted. Throughout the drawings and
corresponding description, the same components are denoted by the
same reference numerals.
[0025] In presenting a specific example in a drawing or description
having two or more layers in a multi-layer structure, the relative
positioning relationship of such layers or the sequence of
arranging the layers as shown reflects a particular implementation
for the described or illustrated example and a different relative
positioning relationship or sequence of arranging the layers may be
possible. In addition, a described or illustrated example of a
multi-layer structure may not reflect all layers present in that
particular multilayer structure (e.g., one or more additional
layers may be present between two illustrated layers). As a
specific example, when a first layer in a described or illustrated
multi-layer structure is referred to as being "on" or "over" a
second layer or "on" or "over" a substrate, the first layer may be
directly formed on the second layer or the substrate but may also
represent a structure where one or more other intermediate layers
may exist between the first layer and the second layer or the
substrate.
[0026] Furthermore, `connected/coupled` represents that one
component is directly coupled to another component or indirectly
coupled through another component. In this specification, a
singular form may include a plural form as long as it is not
specifically mentioned. Furthermore, `include/comprise` or
`including/comprising` used in the specification represents that
one or more components, steps, operations, and elements exist or
are added.
[0027] FIGS. 1A to 1C are views illustrating a structure of a
semiconductor device according to an embodiment of the present
invention. FIG. 1A is a perspective view of a conductive layer,
FIG. 1B is a cross-sectional view taken along line A-A' of FIG. 1A,
and FIG. 1C is a perspective view of a transistor.
[0028] As illustrated in FIG. 1A, conductive layer 10 of the
semiconductor device according to an embodiment of the present
invention includes a first barrier pattern 11, a material pattern
12, a second barrier pattern 13, a third barrier pattern 14, and a
conductive pattern 15.
[0029] The conductive layer 10 may include a central region CR and
side regions SR defined at both sides of the central region R. The
conductive layer 10 may include the first barrier pattern 11 formed
in the central region CR the material pattern 12 formed in the
first barrier pattern 11, and the second barrier pattern 13 formed
in the material pattern 12. For example, the central region CR of
the conductive layer 10 may have a structure in which the first
barrier pattern 11, the material pattern 12, the second barrier
pattern 13, the material pattern 12 and the first barrier pattern
11 are sequentially stacked.
[0030] The conductive layer 10 may further include the third
barrier pattern 14 formed in the side region SR and the conductive
pattern 15 formed in the third barrier pattern 14. For example, the
third barrier pattern 14 is formed to surround the conductive
pattern 15 in a C shape.
[0031] The material pattern 12 is formed of a material having an
etch selectivity with respect to the first barrier pattern 11, and
may include a non-conductive material. For example, the material
pattern 12 may include at least one of an oxide, a nitride, silicon
oxide, silicon nitride, poly-silicon, germanium, silicon germanium,
etc. The first, second and third barrier patterns 11, 13 and 14 may
include a conductive material such as titanium (Ti), titanium
nitride (TIN), tantalum (Ta), tantalum nitride (TaN), etc. Further,
the conductive pattern 15 may include a metallic material such as
tungsten (W), tungsten nitride (WN.sub.x), etc.
[0032] In this drawing, one conductive layer 10 is illustrated.
However, the semiconductor device may include a plurality of
conductive layers, which are stacked, and a plurality of insulating
layers that are interposed between the stacked conductive layers
10. For example, the conductive layers 10 may be stacked in a step
shape so that pad portions are defined at ends thereof. Further the
conductive layer 10 may be a gate electrode of the transistor.
[0033] The semiconductor device according to the embodiment of the
present invention may further include at least one semiconductor
pattern 16 passing through the conductive layer 10. The
semiconductor patterns 16 are arranged in a first direction I-I'
and in a second direction crossing the first direction I-I', and
the semiconductor patterns 16 arranged in the second direction
II-II' constitute one column. In this case, the conductive layer 10
surrounds at least one column.
[0034] The semiconductor pattern 16 may pass through the central
region CR of the conductive layer 10, or may pass through a
boundary of the central region CR and the side region R. Further,
the semiconductor pattern 16 may have a hollow center, a solid
center, or a combination thereof. The semiconductor pattern 16 may
be a channel layer of a transistor.
[0035] The semiconductor device according to the embodiment of the
present invention may further include a dielectric layer 17
interposed between the semiconductor pattern 16 and the conductive
layer 10. The dielectric layer 17 may be a gate insulating layer of
a select transistor, or a multi-layer dielectric layer of a memory
cell transistor. For example, the multi-layer dielectric layer may
include one or more of a tunnel insulating layer, a data storage
layer, and a charge blocking layer. Further, the data storage layer
may include a charge trap layer such as a nitride layer, etc., a
poly-silicon, a phase change material, a nano-dot, etc.
[0036] For reference, although not shown in this drawing, an air
gap may be formed in the second barrier pattern 13. Further, the
third barrier pattern 14 may be omitted.
[0037] As illustrated in FIG. 1B, in the cross-section taken along
line A-A', the first barrier pattern 11 is formed along a sidewall
of the semiconductor pattern 16. Thus, the first barrier pattern 11
may have a `C` shaped cross-section to surround the sidewall of the
semiconductor pattern 16 and the material pattern 12. The material
pattern 12 may be formed along an inner surface of the first
barrier pattern 11 and may have a `C` shaped cross-section. The
second barrier pattern 13 may fill a groove of the material pattern
12, and may be interposed between the material pattern 12 and the
third barrier pattern 14. For reference, the second barrier pattern
13 and the third barrier pattern 14 may be connected to each other
as one integral layer. This will be described below with reference
to FIGS. 7A and 7B.
[0038] As illustrated in FIG. 1C, a transistor Tr includes a
channel layer CH, a gate electrode G surrounding a sidewall of the
channel layer CH, and a dielectric layer D interposed between the
channel layer CH and the gate electrode G. The channel layer CH may
be the above-described semiconductor pattern 16, and the gate
electrode G may be the above-described conductive layer 10, and the
dielectric layer D may be the above-described dielectric layer
17.
[0039] The gate electrode G includes the first barrier pattern 11
surrounding a sidewall of the channel layer CH, the material
pattern 12 formed in the first barrier pattern 11, and the second
barrier pattern 13 formed in the material pattern 12. Further, the
gate electrode G may include the third barrier pattern 14 formed in
a side region SR1 of one side S1 with respect to the channel layer
CH, and the conductive pattern 15 formed in the third barrier
pattern 14. For example, the gate electrode G includes the third
barrier pattern 14 and the conductive pattern 15 only in the side
region SR1 of the one side S1, and includes the first barrier
pattern 11, the material pattern 12, and the second barrier pattern
13 in all of the central region CR and a side region SR2 in the
other side S2. Therefore, the gate electrode G may have an
asymmetric structure, in which the one side S1 and the other side
S2 with respect to the channel layer CH are different from each
other.
[0040] FIGS. 2A to 2C are views, illustrating a structure of a
semiconductor device according to an embodiment of the present
invention. FIG. 2A is a perspective view of a conductive layer,
FIG. 2B is a cross-sectional view taken along line A-A' of FIG. 2A,
and FIG. 2C is a perspective view of a transistor. Hereinafter,
repeated descriptions will be omitted.
[0041] As illustrated in FIGS. 2A and 2B, a conductive layer 20 of
the semiconductor device according to an embodiment of the present
invention includes a first barrier pattern 21, a material pattern
22, a second barrier pattern 23, a third barrier pattern 24, a
conductive pattern 2, an air gap AG1. The semiconductor device may
forth er include a semiconductor pattern 26 and a dielectric layer
27 passing through the conductive layer 20.
[0042] The air gap AG1 may be an empty space located in a portion
of a central region CR of the conductive layer 20. For example, the
air gap AG1 is located in a core region C defined between the
semiconductor patterns 26 within the central region CR. When the
first barrier pattern 21 is formed using a deposition process, the
first barrier pattern 21 is formed by flowing reactive gases
through a cut portion such as a slit (not shown) etc. Therefore,
before the first barrier pattern 21 is deposited on the core region
C located in a farthest portion from a flowing path of the reactive
gases (see arrows), a space between the semiconductor patterns 26
is fully filled with the first barrier pattern 21, and the flowing
path of the reactive gases may be blocked. In this case, the
reactive gases no longer flow into the core region C, and it
remains an empty space. That the air gap AG1 is formed.
[0043] As illustrated in FIG. 2C, the transistor Tr includes a
channel layer CH, a gate electrode G surrounding a sidewall of the
channel layer CH, and a dielectric layer D interposed between the
channel layer CH and the gate electrode G. The channel layer CH may
be the above-described semiconductor pattern 26, the gate electrode
G may be the above-described conductive layer 20, and the
dielectric layer D may be the above-described dielectric layer
27.
[0044] The gate electrode G may have a structure in which one side
S1 and the other side S2 with respect to the channel layer CH are
different from each other. For example, the one side S1 of the gate
electrode G includes the first barrier pattern 21, the material
pattern 22 and the second barrier pattern 23 formed in the central
region CR, and includes the third barrier pattern 24 and the
conductive pattern 25 in a side region SR1. In the other side S2,
the gate electrode G includes the first barrier pattern 21 and the
air gap AG1 formed in the first barrier pattern 21 in both of the
central region CR and a side region SR2.
[0045] FIGS. 3A to 3C are views illustrating a structure of a
semiconductor device according to an embodiment of the present
invention. FIG. 3A is a perspective view of a conductive layer,
FIG. 3B is a cross-sectional view taken along line A-A' of FIG. 3A
and FIG. 3C is a perspective view of a transistor. Hereinafter
repeated descriptions will be omitted.
[0046] As illustrated in FIGS. 3A and B, a conductive layer 30 of
the semiconductor device according to an embodiment of the present
invention includes a first barrier pattern 31, a material pattern
32, a second barrier pattern 33, a third barrier pattern 34, a
conductive pattern 35, and an air gap AG2. The conductive layer 30
may further include a semiconductor pattern 36 and a dielectric
layer 37.
[0047] The area of the air gap AG2 may be changed depending on a
distance W between the semiconductor patterns 36. For example, in a
deposition process of the material pattern 32 after forming the
first barrier pattern 31, a space between the semiconductor
patterns 36 is fully filled. In this case, the air gap AG2 is
formed in the material pattern 32 of a core region C, and has a
smaller area than that in the embodiment described with reference
to FIGS. 2A to 2C.
[0048] As illustrated in FIG. 3C, the transistor Tr includes a
channel layer CH, a gate electrode G surrounding a sidewall of the
channel layer CH, and a dielectric layer D interposed between the
channel layer CH and the gate electrode G. The channel layer CH may
be the above-described semiconductor pattern 36, and the gate
electrode G may be the above-described conductive layer 30, and the
dielectric layer D may be the above-described dielectric layer
37.
[0049] The gate electrode G may have a structure in which one side
S1 and the other side S2 with respect to the channel layer CH are
different from each other. For example the one side S1 of the gate
electrode G includes the first barrier pattern 31, the material
pattern 32 and the second barrier pattern 33 formed in a central
region CR, and includes' the third barrier pattern 34 and the
conductive pattern 35 in a side region SR1. The other side S2 of
the gate electrode G includes the first barrier pattern 31, the
material pattern 32 in the first barrier pattern 31 and the air gap
AG2 formed in the material pattern 32 in all of the central region
CR and a side region SR2.
[0050] FIG. 4 is a cross-sectional view showing a structure of a
semiconductor device according to an embodiment of the present
invention.
[0051] As illustrated in FIG. 4, the semiconductor device according
to an embodiment of the present invention includes a plurality of
transistors Tr1 to Tr3 stacked along a channel layer CH. The
channel layer CH is formed in a shape having a large aspect ratio.
Therefore, a width of the channel layer CH is decreased (W1>W2),
and a distance between the channel layers CH is increased
(W3<W4) toward a lower portion of the channel layer CH.
Therefore, a gate electrode of the transistor Tr formed in an upper
portion and a gate electrode of the transistor Tr formed in a lower
portion may have different structures from each other.
[0052] For example, a first transistor Tr1 formed in a lowermost
portion may have the structure described with reference to FIGS. 1A
to 1C. A second transistor Tr2 formed on an upper portion of the
first transistor Tr1 may have the structure described with
reference to FIGS. 2A to 2C. Further, a third transistor Tr3 formed
on an upper portion of the second transistor Tr2 may have the
structure described with reference to FIGS. 3A to 3C. For
reference, a stacking sequence of the first, second and third
transistors Tr1 to Tr3 may be changed depending on the distance of
the channel layers CH, the shape of the channel layers CH,
deposition conditions, etc.
[0053] FIGS. 5A to 5F are cross-sectional views for describing a
method of manufacturing a semiconductor device according to an
embodiment of the present invention.
[0054] As illustrated in FIG. 5A, a plurality of first material
layers 51 and a plurality of second material layers 52 are
alternately formed. The first material layers 51 may be provided to
form gate electrodes of a select transistor, a memory cell
transistor, etc., and the second material layers 52 may be provided
to form an insulating layer in which the stacked gate electrodes
are electrically separated.
[0055] The first material layers 51 may be formed of a material
having a high etch selectivity with respect to the second material
layers 52. As an example, the first material layers 51 may be
formed of a sacrificial layer including a nitride, and the second
material layers 52 may be formed of an insulating layer including
an oxide. As another example, the first material layers 51 may be
formed of a first sacrificial layer including a nitride and the
second material layers 52 may be formed of a second sacrificial
layer including an oxide.
[0056] A semiconductor pattern 53 passing through the first and
second material layers 51 and 52 is formed. For example, after
forming a hole H passing through the first and second material
layers 51 and 52, the semiconductor pattern 53 is formed in the
hole H. The semiconductor pattern 53 may have a hollow center, a
solid center, or a combination thereof. The hollow center may be
filled with an insulating layer. Further, before forming the
semiconductor pattern 53, a dielectric layer (not shown) may be
formed in the hole H.
[0057] A slit SL passing through the first and second material
layers 51 and 52 is formed. For example, the slit SL is formed to a
depth to which the first material layers 51 are all exposed.
[0058] As illustrated in FIG. 5B, first openings OP1 are formed by
removing the first material layers 51 exposed through the slit SL.
A first barrier layer 54 is formed in the first openings OP1. The
first barrier layer 54 may be formed along the first openings OP
and an inner surface of the slit SL. For example the first barrier
layer 54 includes titanium nitride (TiN).
[0059] A material layer 55 having an etch selectivity with respect
to the first barrier layer 54 is formed in the first openings OP1
in which the first barrier layer 54 is formed. The material layer
55 may be formed along the first openings OP1 and the inner surface
of the slit SL. For example, the material layer 55 includes an
oxide.
[0060] A second barrier layer 56 is formed in the first openings
OP1 in which the material layer 55 is formed. The second barrier
layer 56 may be formed along the first openings OP1 and the inner
surface of the slit SL. Further, the second barrier layer 56 may be
formed to a thickness in which the first openings OP1 are filled,
and a seam (see dotted line) may be formed in the second barrier
layer 56. For example, the second barrier layer 56 includes
titanium nitride (TIN).
[0061] The first barrier layer 54, the material layer 55 and the
second barrier layer 56 may be formed to the same thickness, or
different thicknesses from one another. For example, the
thicknesses of the first barrier layer 54, the material layer 55
and the second barrier layer 56 may be decided by considering a
width of the first opening OP1, etching rates of each layer
depending on the conditions of the following etching processes, a
distance between the semiconductor patterns 53, etc.
[0062] For reference, although not shown in this drawing, an air
gap may be formed in the first barrier layer 54 the material layer
55 or the second barrier layer 56 depending on the distance between
the semiconductor patterns 53.
[0063] As illustrated in FIG. 5C, the second barrier layer 56 is
partially etched to expose the material layer 55. For example,
using a dry etching process, the second barrier layer 56 is
selectively etched. When the dry etching process is used, even when
the second barrier layer 56 includes the seam, a thickness with
which the second barrier layer 56 is etched may be easily
adjusted.
[0064] As illustrated in FIG. 5D, a material pattern 55A is formed
by partially etching the exposed material layer 55. For example,
the material layer 55 is selectively etched using a wet etching
process.
[0065] As illustrated in FIG. 5E, a first barrier pattern 54A and a
second barrier pattern 56A are formed by partially etching the
first barrier layer 54 and the second barrier layer 56. For
example, the first and second barrier layers 54 and 56 are
selectively etched using the dry etching process. The degree to
which the first and second barrier layers 54 and 56 are etched may
be adjusted according to the conditions of the etching process. For
example, the first and second barrier layers 54 and 56 are etched
such that the material pattern 55 protrudes from the first and
second barrier layers 54 and 56.
[0066] Thus, a second opening OP2 is formed by removing the first
barrier layer 54, the material layer 55 and the second barrier
layer 56 formed in a side region SR of the first opening OP.
Further, the first barrier pattern 54A, the material pattern 55A
and the second barrier pattern 56A are formed in a central region
CR of the first opening OP1.
[0067] As illustrated in FIG. 5F, a conductive pattern 58 is formed
in the second opening OP2. Before forming the conductive pattern
58, a third barrier pattern 57 may be formed in the second opening
OP2. When the material pattern 55A protrudes from the first and
second barrier patterns 54A and 56A, the third barrier pattern 57
is formed to surround a protruding area of the material pattern
55A. That is, a portion of the material pattern 55A may be embedded
into the third barrier pattern 57 by protruding from the first
barrier pattern 54A or the second barrier pattern 56A.
[0068] Thus, a conductive layer is formed in which the first
barrier pattern 54A, the material pattern 55A and the second
barrier pattern 56A are included in the central region CR, and the
third barrier pattern 57 and the conductive pattern 58 are included
in the side region SR.
[0069] For reference, although not shown n this drawing, when the
first material layers 51 are first sacrificial layers and the
second material layers 52 are second sacrificial layers, a process
of replacing the second material layers 52 with insulating layers
may be additionally performed. For example, after forming openings
by removing the second material layers 52 through the slit SL,
insulating layers are formed in the openings.
[0070] FIGS. 6A to 6E are cross-sectional views illustrating a
method of manufacturing a semiconductor device according to an
embodiment of the present invention. Hereinafter, repeated
descriptions will be omitted.
[0071] As illustrated in FIG. 6A a semiconductor pattern 63 second
material layers 62 stacked to surround the semiconductor pattern 63
first openings OP1 defined between the stacked second material
layers 62, and a first barrier layer 64, a material pattern 65A and
a second barrier layer 66, which are located in the first openings
OP1 are formed. For example, these intermediate results may be
formed using the process described with reference to FIGS. 5A to
5D.
[0072] As illustrated in FIG. 6B, a second opening OP2 is formed by
etching the first barrier layer 64 and the second barrier layer 66.
The first barrier layer 64 and the second barrier layer 66 may be
etched using the wet etching process, and etching rates of the
first barrier layer 64 and the second barrier layer 66 may be the
same or different from each other depending on materials and shapes
of the first barrier layer 64 and the second barrier layer 66. For
example, when a seam is included in the second barrier layer 66,
since an etchant flows into the seam of the inside of the second
barrier layer 66, the second barrier layer 66 may be etched at a
higher rate than the first barrier layer 64. Therefore, the first
barrier pattern 64A is formed in the first opening OP1, and the
second barrier layer 66 may be entirely removed. Further, when the
second barrier layer 66 is entirely removed, a groove G is formed
inside the material pattern 65A.
[0073] As illustrated in FIG. 6C, a third barrier layer 66' is
formed in the second opening OP2 to fill the groove G in the
material pattern 65A. The third barrier layer 66' may fill the
groove G, and may be formed along an inner surface of the second
opening OP2. The third barrier layer 66' may be formed of the same
material as the second barrier layer 66.
[0074] As illustrated in FIG. 6D, a third barrier pattern 66'A is
formed by etching the third barrier layer 66'. For example, the
third barrier layer 66' is etched using the dry etching process. In
this case, the first barrier pattern 64A may also be partially
etched.
[0075] As illustrated in FIG. 6E, a fourth barrier pattern 67 and a
conductive pattern 68 are formed in the second opening OP2. It is
also possible to omit the fourth barrier pattern 67, and to form
only the conductive pattern 68.
[0076] Thus, a conductive layer is formed in which the first
barrier pattern 64A, the material pattern 65A and the third barrier
pattern 66''A are included in a central region CR, and the fourth
barrier pattern 67 and the conductive pattern 68 are included in a
side region SR.
[0077] FIGS. 7A and 7B are cross-sectional views for illustrating a
method of manufacturing a semiconductor device according to an
embodiment of the present invention. Hereinafter, repeated
descriptions will be omitted.
[0078] As illustrated in FIG. 7A, a semiconductor pattern 73, and
second material layers 72, a first barrier pattern 74A, a material
pattern 75A and a second opening OP2 stacked to surround the
semiconductor pattern 73 are formed. For example, these
intermediate results may be formed using the process described with
reference to FIGS. 6A and 66.
[0079] As illustrated in FIG. 76, a third barrier pattern 77 is
formed in the second opening OP2 to fill a groove of the material
pattern 75A. A conductive pattern 78 is formed in the second
opening OP2 in which the third barrier pattern 77 is formed. It is
also possible to omit the third barrier pattern 77, and to form
only the conductive pattern 78.
[0080] Thus, a conductive layer is formed in which the first
barrier pattern 74A and the material pattern 75A are included in a
central region CR, and the third barrier pattern 77 and the
conductive pattern 78 are included in a side region SR.
[0081] FIG. 8 is a block diagram illustrating a configuration of a
memory system according to an embodiment of the present
invention.
[0082] As illustrated in FIG. 8, a memory system 1000 according to
the embodiment of the present invention includes a memory device
1200 and a controller 1100.
[0083] The memory device 1200 is used to store various types of
data such as text, graphics, software code, etc. The memory device
1200 may be a nonvolatile memory, and may include the structure
described with reference to FIGS. 1A to 7B. Further, the memory
device 1200 is configured to define a central region and side
regions located in both sides of the central region, and to include
conductive layers including a first barrier pattern formed in the
central region, a material pattern formed in the first: barrier
pattern and having an etch selectivity with respect to the first
barrier pattern, and a second barrier pattern formed in the
material pattern, and insulating layers alternately stacked with
the conductive layers. Since a structure and a manufacturing method
of the memory device 1200 are the same as described above, detailed
descriptions will be omitted.
[0084] The controller 1100 is connected to a host and the memory
device 1200, and is configured to access the memory device 1200 in
response to a request from the host. For example, the controller
1100 is configured to control read, write, erase, and perform
background operations of the memory device 1200.
[0085] The controller 1100 includes a random access memory (RAM)
1110, a central processing unit (CPU) 1120, a host interface 1130,
an error correction code (ECC) circuit 1140, a memory interface
1150, etc.
[0086] The RAM 1110 may be used as an operation memory of the CPU
1120, a cache memory between the memory device 1200 and the host, a
buffer memory between the memory device 1200 and the host, and so
on. For reference, the RAM 1110 may be replaced with a static RAM
(SRAM), a read only memory (ROM), etc.
[0087] The CPU 1120 is configured to control overall operations of
the controller 1100. For example, the CPU 1120 is configured to
operate firmware such as a Flash Translation Layer (FTL) stored in
the RAM 1110.
[0088] The host interface 1130 is configured to perform interfacing
with the host. For example, the controller 1100 communicates with
the host through at least one of various interface protocols such
as a Universal Serial Bus (USB) protocol, a MultiMediaCard (MMC)
protocol a Peripheral Component. Interconnect (PCI) protocol, a
PCI-Express (PCI-E) protocol, an Advanced Technology Attachment
(ATA) protocol, a Serial-ATA protocol, a Parallel-ATA protocol, a
Small Computer System Interface (SCSI) protocol an Enhanced Small
Disk Interface (ESDI) protocol, an Integrated Drive Electronics
(IDE) protocol, a private protocol, and so on.
[0089] The ECC circuit 1140 is configured to detect and correct
errors in data read from the memory device 1200 using the ECC.
[0090] The memory interface 1150 is configured to perform
interfacing with the memory device 1200. For example, the memory
interface 1150 includes a NAND interface or a NOR interface.
[0091] For reference, the controller 1100 may further include a
buffer memory (not shown) in order to temporarily store data. The
buffer memory may be used to temporarily store data delivered
externally through the host interface 1130, or to temporarily store
data delivered from the memory device 1200 through the memory
interface 1150. The controller 1100 may further include a ROM to
store code data for interfacing with the host.
[0092] According to an embodiment of the present invention, since
the memory system 1000 includes the memory device 1200 having an
improved degree of integration, the degree of integration of the
memory system 1000 may also be improved.
[0093] FIG. 9 is a block diagram illustrating a configuration of a
memory system according to an embodiment of the present invention.
Hereinafter, repeated descriptions will be omitted.
[0094] As illustrated in FIG. 9, a memory system 1000 according to
the embodiment of the present invention includes a memory device
1200' and a controller 1100. Further, the controller 1100 includes
a RAM 1110, a CPU 1120, a host interface 1130, an ECC circuit 1140,
a memory interface 1150, and so on.
[0095] The memory device 1200' may be a nonvolatile memory, and may
include the memory string described with reference to FIGS. 1A to
7B. Further, the memory device 1200' is configured to define a
central region and side regions located in both sides of the
central region, and to include conductive layers including a first
barrier pattern formed in the central region, a material pattern
formed in the first barrier pattern and having an etch selectivity
with respect to the first barrier pattern, and a second barrier
pattern formed in the material pattern, and insulating layers
alternately stacked with the conductive layers. Since the structure
and manufacturing method of the memory device 1200' are the same as
described above, detailed descriptions will be omitted.
[0096] Further, the memory device 1200' may be a multi-chip package
configured of a plurality of the memory chips. The plurality of
memory chips are divided into a plurality of groups, and the
plurality of groups are configured to communicate with the
controller 1100 through first to k.sup.th channels CH1 to CHk. The
memory chips belonging to one group are configured to communicate
with the controller 1100 through a common channel. For reference,
the memory system 1000' may be transformed to connect one channel
to one memory chip.
[0097] According to the embodiment of the present invention, since
the memory system 1000f includes the memory device 1200' having an
improved degree of integration, the degree of integration of the
memory system 1000' may also be improved. Particularly, by
configuring the memory device 1200' as a multi-chip package, data
storage capacity of the memory system 1000' may be increased and
driving speed may be improved.
[0098] FIG. 10 is a block diagram showing a configuration of a
computing system according to an embodiment of the present
invention. Hereinafter, the repeated descriptions will be
omitted.
[0099] As illustrated in FIG. 10, according to the embodiment of
the present invention, a computer system 2000 includes a memory
device 2100, a CPU 2200, a RAM 2300, a user interface 2400, a power
supply 2500, a system bus 2600, and so on.
[0100] The memory device 2100 stores data provided through the user
interface 2400, data processed by the CPU 2200, etc. The memory
device 2100 is electrically connected to the CPU 2200, the RAM
2300, the user interface 2400, the power supply 2500, and so on
through the system bus 2600. For example, the memory device 2100
may be connected to the system bus 2600 through a controller (not
shown) or may be directly connected to the system bus 2600. When
the memory device 2100 is directly connected to the system bus
2600, a function of the controller may be performed by the CPU
2200, the RAM 2300, and so on.
[0101] The memory device 2100 may be a nonvolatile memory, and may
include the memory string described with reference to FIGS. 1A to
7B. Further, the memory device 2100 is configured to define a
central region and side regions located in both sides of the
central region, and to include conductive layers including a first
barrier pattern formed in the central region a material pattern
formed in the first barrier pattern and having an etch selectivity
with respect to the first barrier pattern, and a second barrier
pattern formed in the material pattern, and insulating layers
alternately stacked with the conductive layers. Since the structure
and manufacturing method of the memory device 2100 are the same as
described above, detailed descriptions will be omitted.
[0102] Further, the memory device 2100 may be a multi-chip package
having a plurality of the memory chips as described with reference
to FIG. 9.
[0103] The computer system 2000 having such a configuration may be
a computer, an ultra mobile PC (UMPC) a workstation, a net-book, a
personal digital assistant (PDA), a portable computer, a web
tablet, a wireless phone, a mobile phone, a smartphone, an e-book,
a portable multimedia player (PMP), a portable game console, a
navigation device, a black box, a digital camera, a 3-dimensional
television, a digital audio recorder, a digital audio player, a
digital picture recorder, a digital picture player, a digital video
recorder, a digital video player, a device for wirelessly sending
and receiving information, at least one of various electronic
devices configuring a home network, at least one of various
electronic devices configuring a computer network, at least one of
various electronic devices configuring a telematics network, an
RFID device, etc.
[0104] According to the embodiment of the present invention since
the memory system 2000 includes the memory device 2100 having an
improved degree of integration, data storage capacity of the memory
system 2000 may be improved.
[0105] FIG. 11 is a block diagram showing a computing system
according to an embodiment of the present invention.
[0106] As illustrated in FIG. 11, according to the embodiment of
the present invention, a computing system 3000 includes a software
layer having an operating system 3200, an application 3100, a file
system 3300, a translation layer 3400, etc. Further, the computing
system 3000 includes a hardware layer such as a memory device 3500,
etc.
[0107] The operating system 3200 manages software resources and
hardware resources of the computing system 3000, and may control
program execution by the CPU. The application 3100 may be various
application programs executed in the computing system 3000, and may
be a utility executed by the operating system 3200.
[0108] The file system 3300 is a logical structure to manage data,
files, etc., in the computer system 3000 that organizes files or
data stored in the memory device 3500 according to rules. The file
system 3300 may be determined by the operating system 3200 used in
the computer system 3000. For example, when the operating system
3200 is Microsoft Windows, the file system 3300 may be File
Allocation Table (FAT), NT File System (NTFS), etc. Further, when
the operating system 3200 is Unix/Linux, the file system 3300 may
be the extended file system (ext), the Unix file system (UFS), a
journaling file system etc.
[0109] In FIG. 11, the operating system 3200, the application 3100
and a file system 3300 are shown as separate blocks, but the
application 3100 and the file system 3300 may be included in the
operating system 3200.
[0110] A translation layer 3400 translates an address into an
appropriate type for the memory device 3500 in response to a
request from the file system 3300. For example, the translation
layer 3400 translates a logical address created by the file system
3300 into a physical address of the memory device 3500. Mapping
information of the logical address and the physical address may be
stored in an address translation table. For example, the
translation layer 3400 may be an FTL, a Universal Flash Storage
link layer (ULL), etc.
[0111] The memory device 3500 may be a nonvolatile memory, and may
include the memory string described with reference to FIGS. 1A to
7B. Further, the memory device 3500 is configured to define a
central region and side regions located in both sides of the
central region, and to include conductive layers including a first
barrier pattern formed in the central region, a material' pattern
formed in the first barrier pattern and having an etch selectivity
with respect to the first barrier pattern, and a second barrier
pattern formed in the material pattern, and insulating layers
alternately stacked with the conductive layers. Since the structure
and manufacturing method of the memory device 3500 are the same as
described above, detailed descriptions will be omitted.
[0112] The computer system 3000 having this configuration may be
separated by an operating system layer implemented in the upper
level region and a controller layer implemented in the lower level
region. The application 3100, the operating system 3200 and the
file system 3300 may be included in the operating system layer, and
may be driven by an operating memory of the computer system 3000.
The translation layer 3400 may be included in the operating system
layer or in the controller layer.
[0113] According to the embodiment of the present invention, since
the computing system 3000 includes the memory device 3500 having an
improved degree of integration, data storage capacity of the
computing system 3000 may be improved.
[0114] According to an embodiment of the present invention, the
degree of difficulty in manufacturing a transistor and a
semiconductor device may be lowered, and damage to surrounding
layers in the manufacturing process thereof may be prevented.
Therefore, the characteristics of the transistor and the
semiconductor device may be enhanced.
[0115] While the invention has been described in detail through
detailed embodiments, it should be noted that the above-described
embodiments are to be used merely for descriptive purposes and are
not limitations on the invention. It should be understood by those
skilled in the art that various changes, substitutions and
alterations may be made without departing from the scope of the
invention as defined by the following claims.
* * * * *